TWI587502B

TWI587502B - Environmental sensitive electronic device package

Info

Publication number: TWI587502B
Application number: TW105135445A
Authority: TW
Inventors: 陳光榮; 何家充
Original assignee: 財團法人工業技術研究院
Priority date: 2012-10-31
Filing date: 2013-05-17
Publication date: 2017-06-11
Also published as: TWI569437B; TW201705470A; TW201417264A

Description

環境敏感電子元件封裝體Environmentally sensitive electronic component package

本揭露是有關於一種封裝體，且特別是有關於一種環境敏感電子元件封裝體。The present disclosure relates to a package, and more particularly to an environmentally sensitive electronic component package.

隨著科技的進步，輕薄、省電以及高畫質顯示的資訊產品已成為現代人不可或缺的隨身配備，其中無論是智慧型手機（smart phone）、平板電腦（Tablet PC）或是電視(Television)等資訊產品，均需要顯示器以作為使用者介面，且在輕、薄、高畫質、以及低耗電的考量下，有機發光顯示器（organic light-emitting display）逐漸廣為採用。With the advancement of technology, information products that are light, power-saving and high-definition display have become indispensable for modern people, whether it is a smart phone, a tablet PC or a TV ( Information products such as Television) require a display as a user interface, and the organic light-emitting display is widely used in consideration of lightness, thinness, high image quality, and low power consumption.

然而，有機發光顯示器對濕氣具有極高的敏感度，一旦有水氣接觸到內部的有機發光元件，將會造成陰極處氧化與有機化合物界面剝離的現象，進而造成顯示品質的下滑，亦會使機發光元件加速老化而縮減顯示器的壽命。另一方面，大顯示尺寸的有機發光顯示器已逐漸成為當前資訊產品發展的主要趨勢，當有機發光元件的數量越多或面積越大時，其發熱的問題亦趨於嚴重。簡言之，有機發光顯示器的阻絕水與氧氣的能力及其散熱性一直是亟待解決的問題。However, the organic light-emitting display has extremely high sensitivity to moisture. Once the water vapor contacts the internal organic light-emitting element, the interface between the oxidation and the organic compound at the cathode will be peeled off, which may cause a decline in display quality. The illuminating element is accelerated to age and the life of the display is reduced. On the other hand, organic light-emitting displays with large display sizes have gradually become the main trend in the development of current information products. When the number of organic light-emitting elements is larger or the area is larger, the problem of heat generation tends to be serious. In short, the ability of organic light-emitting displays to block water and oxygen and their heat dissipation has been an urgent problem to be solved.

本揭露實施例提供一種環境敏感電子元件封裝體，可用以改善環境敏感電子元件因受潮或過熱而致壽命減短的問題。Embodiments of the present disclosure provide an environmentally sensitive electronic component package that can be used to improve the life expectancy of environmentally sensitive electronic components due to moisture or overheating.

本揭露實施例提出一種環境敏感電子元件封裝體，其包括第一基板、第二基板、環境敏感電子元件、至少一第一側壁阻障結構、第一散熱層、第一散熱結構以及第一填充層。第二基板配置於第一基板上方。環境敏感電子元件配置於第一基板上，且位於第一基板與第二基板之間。第一側壁阻障結構配置於第二基板上，且位於第一基板與第二基板之間，其中第一側壁阻阻障結構位於環境敏感電子元件的至少一側。第一散熱層配置於第二基板上，且位於第一基板與第二基板之間，其中第一散熱層包覆第二基板與第一側壁阻障結構。第一散熱結構配置於第一基板上，且位於第一基板與第二基板之間，其中第一散熱結構環繞第一側壁阻障結構。第一填充層位於第一基板與第二基板之間，且包覆第一側壁阻障結構以及環境敏感電子元件，其中第一散熱結構與第二基板上的第一散熱層接合。The embodiment of the present disclosure provides an environmentally sensitive electronic component package including a first substrate, a second substrate, environmentally sensitive electronic components, at least one first sidewall barrier structure, a first heat dissipation layer, a first heat dissipation structure, and a first filling Floor. The second substrate is disposed above the first substrate. The environmentally sensitive electronic component is disposed on the first substrate and located between the first substrate and the second substrate. The first sidewall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first sidewall barrier structure is located on at least one side of the environmentally sensitive electronic component. The first heat dissipation layer is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first heat dissipation layer covers the second substrate and the first sidewall barrier structure. The first heat dissipation structure is disposed on the first substrate and located between the first substrate and the second substrate, wherein the first heat dissipation structure surrounds the first sidewall barrier structure. The first filling layer is located between the first substrate and the second substrate, and covers the first sidewall barrier structure and the environmentally sensitive electronic component, wherein the first heat dissipation structure is bonded to the first heat dissipation layer on the second substrate.

基於上述，由於本揭露的環境敏感電子元件封裝體具有環繞環境敏感電子元件的側壁阻障結構並且配置於任兩基板之間，因此本揭露的環境敏感電子元件封裝體具有良好的阻隔水氣與氧氣的能力。此外，本揭露的環境敏感電子元件封裝體更具有散熱突出的結構或導熱材料，其中散熱突出配置於基板上並且朝向環境敏感電子元件延伸，且導熱材料分佈於填充層內，亦或是構成散熱層，因此本揭露的環境敏感電子元件封裝體同時具有良好的散熱能力，以有效延長環境敏感電子元件的壽命。Based on the above, since the environmentally sensitive electronic component package of the present disclosure has a sidewall barrier structure surrounding the environmentally sensitive electronic component and is disposed between any two substrates, the environmentally sensitive electronic component package of the present disclosure has a good barrier against moisture and The ability of oxygen. In addition, the environmentally sensitive electronic component package of the present disclosure further has a heat dissipating protruding structure or a heat conductive material, wherein the heat dissipating protrusion is disposed on the substrate and extends toward the environmentally sensitive electronic component, and the heat conducting material is distributed in the filling layer or constitutes heat dissipation. The layer, therefore, the environmentally sensitive electronic component package disclosed herein has good heat dissipation capability to effectively extend the life of environmentally sensitive electronic components.

為讓本揭露能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the disclosure more apparent, the following embodiments are described in detail with reference to the accompanying drawings.

圖1A是本揭露一實施例的環境敏感電子元件封裝體的剖面示意圖。圖1B是圖1A的環境敏感電子元件封裝體的底視圖。請參考圖1A，在本實施例中，環境敏感電子元件封裝體100A包括第一基板110、第二基板120、環境敏感電子元件130、至少一第一側壁阻障結構SWB、至少一散熱突出140以及第一填充層150。第二基板120配置於第一基板110上方。環境敏感電子元件130配置於第一基板110上，且位於第一基板110與第二基板120之間。第一側壁阻障結構SWB配置於第二基板120上，且位於第一基板110與第二基板120之間，其中第一側壁阻障結構SWB位於環境敏感電子元件130的至少一側。散熱突出140位於第二基板120上，且朝向第一基板110延伸。第一填充層150位於第一基板110與第二基板120之間，且包覆環境敏感電子元件130、側壁阻障結構140以及散熱突出140。1A is a cross-sectional view of an environmentally sensitive electronic component package in accordance with an embodiment of the present disclosure. FIG. 1B is a bottom view of the environmentally sensitive electronic component package of FIG. 1A. Referring to FIG. 1A , in the embodiment, the environment-sensitive electronic component package 100A includes a first substrate 110 , a second substrate 120 , environmentally sensitive electronic components 130 , at least one first sidewall barrier structure SWB , and at least one heat dissipation protrusion 140 . And a first filling layer 150. The second substrate 120 is disposed above the first substrate 110. The environmentally sensitive electronic component 130 is disposed on the first substrate 110 and located between the first substrate 110 and the second substrate 120. The first sidewall barrier structure SWB is disposed on the second substrate 120 and located between the first substrate 110 and the second substrate 120 , wherein the first sidewall barrier structure SWB is located on at least one side of the environmentally sensitive electronic component 130 . The heat dissipation protrusion 140 is located on the second substrate 120 and extends toward the first substrate 110. The first filling layer 150 is located between the first substrate 110 and the second substrate 120 and encapsulates the environmentally sensitive electronic component 130 , the sidewall barrier structure 140 , and the heat dissipation protrusion 140 .

在本實施例中，第一基板110例如是可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI）或金屬箔（metal foil）。此外，環境敏感電子元件裝體100A可進一步包括功能性薄膜（未繪示），其中功能性薄膜例如是配置於第一基板110上，且位於第一基板110與環境敏感電子元件130之間。一般而言，功能性薄膜可以是觸控面板（touch panel），觸控面板例如是表面式電容觸控面板、數位矩陣式觸控面板（例如投射式電容觸控）或類比矩陣式觸控面板。當然，功能性薄膜亦可以是彩色濾光片（color filter）或電泳顯示器（EPD）。簡言之，本揭露的環境敏感電子元件封裝體可具有觸控功能。In this embodiment, the first substrate 110 is, for example, a flexible substrate, wherein the material of the flexible substrate is polyethylene terephthalate (PET) or polyethylene isophthalate ( Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polytheneamine (PI) or metal foil Foil). In addition, the environmentally sensitive electronic component package 100A may further include a functional film (not shown), wherein the functional film is disposed on the first substrate 110 and located between the first substrate 110 and the environmentally sensitive electronic component 130. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

另一方面，在本實施例中，第二基板120例如是金屬基板，第二基板120可為具有較佳的導熱與散熱特性的可撓性金屬基板。當然，第二基板120亦可以是與第一基板110相同或相似的可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI），本揭露在此並不加以限制。On the other hand, in the present embodiment, the second substrate 120 is, for example, a metal substrate, and the second substrate 120 may be a flexible metal substrate having better heat conduction and heat dissipation characteristics. Of course, the second substrate 120 may also be the same or similar flexible substrate as the first substrate 110, wherein the flexible substrate may be made of polyethylene terephthalate (PET) or poly(biophenylene). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyamidamine (PI) The disclosure is not limited herein.

另外，環境敏感電子元件130例如是主動式環境敏感電子顯示元件或被動式環境敏感電子顯示元件，其中主動式環境敏感電子顯示元件例如是一主動型矩陣有機發光二極體(Active Matrix Organic Light Emitting Diode, AM-OLED)或者是主動型矩陣電泳顯示器(Active Matrix Electro Phoretic Display, AM-EPD)，俗稱電子紙，或者是主動型矩陣液晶顯示器(Active Matrix Liquid Crystal Display, AM-LCD)，或者是主動型矩陣藍相液晶顯示器(Active Matrix Blue Phase Liquid Crystal Display)。被動式環境敏感電子顯示元件則例如是被動驅動式有機電激發光元件陣列基板(Passive Matrix OLED, PM-OLED)或者是超扭轉向列型液晶顯示器(Super Twisted Nematic Liquid Crystal Display, STN-LCD)。In addition, the environmentally sensitive electronic component 130 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic electroluminescent device array substrate (Passive Matrix OLED, PM-OLED) or a super Twisted Nematic Liquid Crystal Display (STN-LCD).

此外，如圖1A所示，在本實施例中，第一側壁阻障結構SWB位於第二基板120上並且朝向第一基板110延伸，其中第一側壁阻障結構SWB垂直於第一基板110的截面例如是梯形，當然，此截面亦可以是矩形、其他不同型態多邊形、圓形或橢圓形。一般而言，第一側壁阻障結構SWB的材質可包括金屬材料，而金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，且第一側壁阻障結構SWB例如是藉由黃光微影蝕刻、壓印或精密車床等製程形成於第二基板120上。在本實施例中，第一側壁阻障結構SWB與第二基板120例如是相同材質所構成，當然，在其他未繪示的實施例中，第一側壁阻障結構SWB與第二基板120亦可以是不相同材質所構成，本揭露在此並不加以限制。In addition, as shown in FIG. 1A , in the embodiment, the first sidewall barrier structure SWB is located on the second substrate 120 and extends toward the first substrate 110 , wherein the first sidewall barrier structure SWB is perpendicular to the first substrate 110 . The cross section is, for example, a trapezoid, of course, the cross section may also be rectangular, other different types of polygons, circles or ellipses. In general, the material of the first sidewall barrier structure SWB may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the first The sidewall barrier structure SWB is formed on the second substrate 120 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. In this embodiment, the first sidewall barrier structure SWB and the second substrate 120 are made of the same material, for example, in other embodiments not shown, the first sidewall barrier structure SWB and the second substrate 120 are also It may be composed of different materials, and the disclosure is not limited herein.

另一方面，如圖1B所示，在本實施例中，第一側壁阻障結構SWB例如是環繞環境敏感電子元件130的連續且封閉的環狀結構，用以阻隔來自外界的水氣與氧氣，其中第一側壁阻障結構SWB環繞散熱突出140。在此必須說明的是，如圖1A所示，本實施例的散熱突出140與第二基板120例如是相同材質所構成，其中散熱突出140例如透過由黃光微影蝕刻、壓印、噴砂或精密車床等製程並且以陣列排列的方式形成於第二基板120上，且第二基板120與散熱突出140的材質主要為金屬材料，其中金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料。On the other hand, as shown in FIG. 1B, in the present embodiment, the first sidewall barrier structure SWB is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 130 for blocking moisture and oxygen from the outside. The first sidewall barrier structure SWB surrounds the heat dissipation protrusion 140. It should be noted that, as shown in FIG. 1A, the heat dissipation protrusion 140 of the present embodiment is formed of the same material as the second substrate 120, for example, the heat dissipation protrusion 140 is etched, embossed, sandblasted or precision lathe by yellow light micro-image. The process is formed on the second substrate 120 in an array, and the material of the second substrate 120 and the heat dissipation protrusion 140 is mainly a metal material, wherein the metal material is, for example, iron, aluminum, copper, magnesium, chromium, gold, silver. A metal such as molybdenum or titanium or an alloy thereof.

更進一步而言，在其他未繪示的實施例中，散熱突出140與第二基板120亦可以是不相同材質所構成，其中第二基板120的材質例如是金屬材料，且金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，則散熱突出140的材質主要為無機材料，其中無機材料例如是矽化物、鋁化物、鑽石、類鑽石等。散熱突出140可透過化學氣相沉積、濺鍍、噴塗由等製程並且以陣列排列的方式形成於第二基板120上。Further, in other embodiments not shown, the heat dissipation protrusions 140 and the second substrate 120 may also be made of different materials, wherein the material of the second substrate 120 is, for example, a metal material, and the metal material is, for example, iron. , aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium and other metals or alloy materials thereof, the material of the heat dissipation protrusion 140 is mainly inorganic materials, wherein the inorganic materials are, for example, telluride, aluminide, diamond, diamond-like, etc. . The heat dissipation protrusions 140 may be formed on the second substrate 120 by chemical vapor deposition, sputtering, spraying, or the like and arranged in an array.

詳細而言，如圖1A以及1B所示，在本實施例中，散熱突出140的數量例如是多個並且陣列排列第二基板120上的一區域A，其中區域A的面積與環境敏感電子元件130的尺寸大致上相同。當然，區域A的面積可視產品的設計需求而進行調整，換言之，區域A的面積可以是等於、大於或小於環境敏感電子元件130的尺寸。也因此，環境敏感電子元件130所發出的熱能可經由填充層150傳遞至散熱突出140，之後，進一步由散熱突出140傳導至第二基板120而逸散至外界。In detail, as shown in FIGS. 1A and 1B, in the present embodiment, the number of heat dissipation protrusions 140 is, for example, a plurality and arrays of an area A on the second substrate 120, wherein the area of the area A and the environmentally sensitive electronic components The dimensions of 130 are substantially the same. Of course, the area of the area A can be adjusted according to the design requirements of the product. In other words, the area of the area A can be equal to, larger or smaller than the size of the environmentally sensitive electronic component 130. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 130 can be transferred to the heat dissipation protrusion 140 via the filling layer 150, and then further radiated to the second substrate 120 by the heat dissipation protrusion 140 to escape to the outside.

簡言之，本揭露的散熱突出可有效提升熱傳導與散熱的效率。此外，在本實施例中，散熱突出140的底面積例如是圓形，當然，在其他未繪示的實施例中，散熱突出140的底面積亦可以是三角形、其他不同型態多邊形或橢圓形，本揭露在此並不加以限制。In short, the heat dissipation of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation. In addition, in this embodiment, the bottom area of the heat dissipation protrusion 140 is, for example, a circle. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 140 may also be a triangle, other different types of polygons or ovals. The disclosure is not limited herein.

另外，第一填充層150例如是膠材透過紫光固化或熱固化所形成。膠材的材質例如是壓克力樹脂（acrylic）或環氧樹脂（expoxy）。在本實施例中，第一填充層150在未固化前的型態例如是液態式(liquid type)膠材或膠膜式(sheet type)膠材。進一步而言，第一填充層150可進一步包括導熱材料10，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon）並且以奈米級粒子分佈於第一填充層150之中，可有效提升熱傳導的效率。In addition, the first filling layer 150 is formed, for example, by a solidification or thermal curing of a rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the type of the first filling layer 150 before uncured is, for example, a liquid type rubber material or a sheet type rubber material. Further, the first filling layer 150 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and distributed in a first filling layer 150 as a nano-sized particle. It can effectively improve the efficiency of heat transfer.

另一方面，本實施例的環境敏感電子元件封裝體100A更包括一電路導線DC，其中電路導線DC配置於第一基板110上，且位於第一基板110與第二基板120之間。電路導線DC與環境敏感電子元件130電性連接，其中電路導線DC可用以接收一輸入訊號，並轉換此輸入訊號而產生一輸出訊號，其中輸出訊號例如是顯示控制訊號。電路導線DC輸出顯示控制訊號，以控制環境敏感電子元件130。On the other hand, the environmentally sensitive electronic component package 100A of the present embodiment further includes a circuit lead DC, wherein the circuit lead DC is disposed on the first substrate 110 and located between the first substrate 110 and the second substrate 120. The circuit lead DC is electrically connected to the environmentally sensitive electronic component 130. The circuit lead DC can be used to receive an input signal and convert the input signal to generate an output signal, wherein the output signal is, for example, a display control signal. The circuit lead DC output displays a control signal to control the environmentally sensitive electronic component 130.

以下將舉出另一實施例來說明環境敏感電子元件封裝體100B的設計，其中相同或相似元件具有相同或相似標號，且相同或相似元件具有相同或相似特徵，在此不一一贅述。Another embodiment will be described below to illustrate the design of the environmentally sensitive electronic component package 100B, wherein the same or similar elements have the same or similar reference numerals, and the same or similar elements have the same or similar features, which are not described herein.

圖2A是本揭露另一實施例的環境敏感電子元件封裝體。圖2B是圖2A的環境敏感電子元件封裝體的底視圖。如圖2A及圖2B所示，圖2A的環境敏感電子元件封裝體100B與圖1A的環境敏感電子元件封裝體100A相似，其不同之處在於：圖2A的環境敏感電子元件封裝體100B的散熱突出140a的底面積例如是方形，當然，在其他未繪示的實施例中，散熱突出140a的底面積亦可以是三角形、其他不同型態多邊形或橢圓形，本揭露在此並不加以限制。2A is an environmentally sensitive electronic component package of another embodiment of the present disclosure. 2B is a bottom view of the environmentally sensitive electronic component package of FIG. 2A. As shown in FIG. 2A and FIG. 2B, the environmentally sensitive electronic component package 100B of FIG. 2A is similar to the environmentally sensitive electronic component package 100A of FIG. 1A, except that the heat dissipation of the environmentally sensitive electronic component package 100B of FIG. 2A is achieved. The bottom area of the protrusion 140a is, for example, a square shape. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 140a may also be a triangle, other different types of polygons or ovals, and the disclosure is not limited herein.

詳細而言，散熱突出140a的數量例如是多個並且陣列排列於第二基板120上的一區域B，其中區域B的面積與環境敏感電子元件130的尺寸大致上相同。當然，區域B的面積可視產品的設計需求而進行調整，換言之，區域B的面積可是等於、大於或小於環境敏感電子元件130的尺寸。也因此，環境敏感電子元件130所發出的熱能可經由第一填充層150傳遞至散熱突出140a，之後，進一步由散熱突出140a傳導至第二基板120而逸散至外界。簡言之，本揭露的散熱突出140a可有效提升熱傳導與散熱的效率。In detail, the number of heat dissipation protrusions 140a is, for example, a plurality and arrayed on a region B on the second substrate 120, wherein the area of the region B is substantially the same as the size of the environmentally sensitive electronic component 130. Of course, the area of the area B can be adjusted according to the design requirements of the product. In other words, the area of the area B can be equal to, larger than, or smaller than the size of the environmentally sensitive electronic component 130. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 130 can be transmitted to the heat dissipation protrusion 140a via the first filling layer 150, and then further transmitted to the second substrate 120 by the heat dissipation protrusion 140a to be dissipated to the outside. In short, the heat dissipation protrusion 140a of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation.

圖3A是本揭露另一實施例的環境敏感電子元件封裝體的剖面示意圖。圖3B是圖3A的環境敏感電子元件封裝體的第三基板的上視圖。請參考圖3A，環境敏感電子元件封裝體200A包括第一基板210、第二基板220、環境敏感電子元件230、第一填充層240、第三基板250、至少一側壁阻障結構SWB1、至少一散熱突出260以及第二填充層270。第二基板220配置於第一基板210上方。環境敏感電子元件230配置於第一基板210上，且位於第一基板210與第二基板220之間。第一填充層240位於第一基板210與第二基板220之間，且包覆環境敏感電子元件230。第三基板250配置於第一基板210下方，其中第一基板210位於第二基板220與第三基板250之間。側壁阻障結構SWB1配置於第三基板250上，且位於第一基板210與第三基板250之間，其中側壁阻障結構SWB1位於環境敏感電子元件230的至少一側。散熱突出260位於第三基板250上，且朝向第一基板210延伸。第二填充層270位於第一基板210與第三基板250之間，且包覆側壁阻障結構SWB1以及散熱突出260。3A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to another embodiment of the present disclosure. 3B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 3A. Referring to FIG. 3A , the environmentally sensitive electronic component package 200A includes a first substrate 210 , a second substrate 220 , environmentally sensitive electronic components 230 , a first filling layer 240 , a third substrate 250 , and at least one sidewall barrier structure SWB1 . The heat dissipation protrusion 260 and the second filling layer 270. The second substrate 220 is disposed above the first substrate 210. The environmentally sensitive electronic component 230 is disposed on the first substrate 210 and located between the first substrate 210 and the second substrate 220. The first filling layer 240 is located between the first substrate 210 and the second substrate 220 and encapsulates the environmentally sensitive electronic component 230. The third substrate 250 is disposed under the first substrate 210 , wherein the first substrate 210 is located between the second substrate 220 and the third substrate 250 . The sidewall barrier structure SWB1 is disposed on the third substrate 250 and located between the first substrate 210 and the third substrate 250 , wherein the sidewall barrier structure SWB1 is located on at least one side of the environmentally sensitive electronic component 230 . The heat dissipation protrusion 260 is located on the third substrate 250 and extends toward the first substrate 210. The second filling layer 270 is located between the first substrate 210 and the third substrate 250 and covers the sidewall barrier structure SWB1 and the heat dissipation protrusion 260.

在本實施例中，第一基板210以及第二基板220例如是可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI）或金屬箔（metal foil）。此外，環境敏感電子元件裝體200A可進一步包括功能性薄膜（未繪示），其中功能性薄膜例如是配置於第二基板220上，且位於第一基板210與第二基板220之間。一般而言，功能性薄膜可以是觸控面板（touch panel），觸控面板例如是表面式電容觸控面板、數位矩陣式觸控面板（例如投射式電容觸控）或類比矩陣式觸控面板。當然，功能性薄膜亦可以是彩色濾光片（color filter）或電泳顯示器（EPD）。簡言之，本揭露的環境敏感電子元件封裝體可具有觸控功能。In this embodiment, the first substrate 210 and the second substrate 220 are, for example, flexible substrates, wherein the flexible substrate may be made of polyethylene terephthalate (PET) or poly(diphenylene). Polyethylene naphthalate (PEN), Polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polytheneamine (PI) Or metal foil. In addition, the environmentally sensitive electronic component package 200A may further include a functional film (not shown), wherein the functional film is disposed on the second substrate 220 and located between the first substrate 210 and the second substrate 220. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

另外，環境敏感電子元件230例如是主動式環境敏感電子顯示元件或被動式環境敏感電子顯示元件，其中主動式環境敏感電子顯示元件例如是一主動型矩陣有機發光二極體(Active Matrix Organic Light Emitting Diode, AM-OLED)或者是主動型矩陣電泳顯示器(Active Matrix Electro Phoretic Display, AM-EPD)，俗稱電子紙，或者是主動型矩陣液晶顯示器(Active Matrix Liquid Crystal Display, AM-LCD)，或者是主動型矩陣藍相液晶顯示器(Active Matrix Blue Phase Liquid Crystal Display)。被動式環境敏感電子顯示元件則例如是被動驅動式有機電激發光元件陣列基板(Passive Matrix OLED, PM-OLED)或者是超扭轉向列型液晶顯示器(Super Twisted Nematic Liquid Crystal Display, STN-LCD)。In addition, the environmentally sensitive electronic component 230 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic electroluminescent device array substrate (Passive Matrix OLED, PM-OLED) or a super Twisted Nematic Liquid Crystal Display (STN-LCD).

另一方面，第一填充層240例如是膠材透過紫光固化或熱固化所形成。膠材的材質例如是壓克力樹脂（acrylic）或環氧樹脂（expoxy）。在本實施例中，第一填充層240未固化前的型態例如是液態式(liquid type)膠材或膠膜式(sheet type)膠材。進一步而言，第一填充層240可進一步包括導熱材料10，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon）並且以奈米級粒子分佈於第一填充層240之中，可有效提升熱傳導的效率。On the other hand, the first filling layer 240 is formed, for example, by a solidification or thermal curing of a rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the type before the first filling layer 240 is uncured is, for example, a liquid type rubber material or a sheet type rubber material. Further, the first filling layer 240 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and distributed in a first filling layer 240 as a nano-sized particle. It can effectively improve the efficiency of heat transfer.

接續上述，第三基板250例如是金屬基板，第三基板250可為具有較佳的導熱與散熱特性的可撓性金屬基板。當然，第三基板250亦可以是與第一基板210相同或相似的可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI），本揭露在此並不加以限制。Following the above, the third substrate 250 is, for example, a metal substrate, and the third substrate 250 may be a flexible metal substrate having better heat conduction and heat dissipation characteristics. The third substrate 250 may be a flexible substrate that is the same as or similar to the first substrate 210. The material of the flexible substrate may be polyethylene terephthalate (PET) or poly(biophenylene). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyamidamine (PI) The disclosure is not limited herein.

此外，如圖3A所示，在本實施例中，側壁阻障結構SWB1位於第三基板250上並且朝向第一基板210延伸，其中側壁阻障結構SWB1垂直於第一基板210的截面例如是梯形，當然，此截面亦可以是矩形、其他不同型態多邊型、圓形或橢圓形。一般而言，側壁阻障結構SWB1的材質可包括金屬材料，而金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，且側壁阻障結構SWB1例如是藉由黃光微影蝕刻、壓印或或精密車床等製程形成於第三基板250上。值得一提的是，側壁阻障結構SWB1與第三基板250可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。In addition, as shown in FIG. 3A , in the embodiment, the sidewall barrier structure SWB1 is located on the third substrate 250 and extends toward the first substrate 210 , wherein a cross section of the sidewall barrier structure SWB1 perpendicular to the first substrate 210 is, for example, a trapezoid. Of course, the cross section can also be rectangular, other different types of polygonal, circular or elliptical. In general, the material of the sidewall barrier structure SWB1 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the sidewall barrier structure The SWB1 is formed on the third substrate 250 by, for example, a process such as yellow photolithography etching, imprinting, or a precision lathe. It is to be noted that the sidewall barrier structure SWB1 and the third substrate 250 may be made of the same material or different materials, and the disclosure is not limited herein.

另一方面，如圖3B所示，在本實施例中，側壁阻障結構SWB1例如是環繞環境敏感電子元件230的連續且封閉的環狀結構，用以阻隔來自外界的水氣與氧氣，其中側壁阻障結構SWB1環繞散熱突出260。一般而言，散熱突出260例如透過由黃光微影蝕刻、壓印、噴砂或精密車床等製程並且以陣列排列的方式形成於第三基板250上，其中散熱突出260的材質主要可包括金屬材料或其他高導熱材料，金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，亦可為多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合，又或者是無機材料或有機與無機混合材料，例如矽化物、鋁化物、鑽石、類鑽石等。散熱突出260與第三基板250可以是相同材質或不同材質所構成。On the other hand, as shown in FIG. 3B, in the present embodiment, the sidewall barrier structure SWB1 is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 230 for blocking moisture and oxygen from the outside, wherein The sidewall barrier structure SWB1 surrounds the heat dissipation protrusion 260. Generally, the heat dissipating protrusions 260 are formed on the third substrate 250 by a process such as lithography, imprinting, sand blasting, or precision lathe, and are arranged in an array. The material of the heat dissipating protrusions 260 may mainly include metal materials or other materials. High thermal conductivity material, such as metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium or alloy materials thereof, or a multilayer metal stack such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium The combination is either an inorganic material or an organic and inorganic mixed material such as a telluride, an aluminide, a diamond, a diamond-like, or the like. The heat dissipation protrusion 260 and the third substrate 250 may be made of the same material or different materials.

詳細而言，如圖3A以及3B所示，在本實施例中，散熱突出260的數量例如是多個並且陣列排列於第三基板250上的一區域C，其中區域C的面積與環境敏感電子元件230的尺寸大致上相同。當然，區域C的面積可視產品的設計需求而進行調整，換言之，區域C的面積可以是等於、大於或小於環境敏感電子元件230的尺寸。也因此，環境敏感電子元件230所發出的熱能可經由第二填充層270傳遞至散熱突出260，之後，進一步由散熱突出260傳導至第三基板250而逸散至外界。In detail, as shown in FIGS. 3A and 3B, in the present embodiment, the number of heat dissipation protrusions 260 is, for example, a plurality and arrayed on a region C on the third substrate 250, wherein the area of the region C is environmentally sensitive. The dimensions of element 230 are substantially the same. Of course, the area of the area C can be adjusted depending on the design requirements of the product. In other words, the area of the area C can be equal to, larger than, or smaller than the size of the environmentally sensitive electronic component 230. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 230 can be transferred to the heat dissipation protrusion 260 via the second filling layer 270, and then further radiated to the third substrate 250 by the heat dissipation protrusion 260 to be dissipated to the outside.

簡言之，本揭露的散熱突出可有效提升熱傳導與散熱的效率。此外，在本實施例中，散熱突出260的底面積例如是圓形，當然，在其他未繪示的實施例中，散熱突出260的底面積亦可以是三角形、方形、矩形、其他不同型態多邊形或橢圓形，本揭露在此並不加以限制。In short, the heat dissipation of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation. In addition, in the embodiment, the bottom surface area of the heat dissipation protrusion 260 is, for example, a circle. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 260 may also be a triangle, a square, a rectangle, or other different types. Polygon or ellipse, the disclosure is not limited herein.

另外，第二填充層270例如是膠材透過紫光固化或熱固化所形成。膠材的材質例如是壓克力樹脂（acrylic）或環氧樹脂（expoxy）。在本實施例中，第二填充層270未固化前的型態例如是液態式(liquid type)膠材或膠膜式(sheet type)膠材。進一步而言，第二填充層270可進一步包括導熱材料10，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon）並且以奈米級粒子分佈於第二填充層270之中，可有效提升導傳導與散熱的效率。In addition, the second filling layer 270 is formed, for example, by a solidification or thermal curing of the rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the type before the second filling layer 270 is uncured is, for example, a liquid type rubber material or a sheet type rubber material. Further, the second filling layer 270 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, diamond like carbon, and distributed in a second filling layer 270 with nano-sized particles. In the middle, it can effectively improve the efficiency of conduction and heat dissipation.

另一方面，本實施例的環境敏感電子元件封裝體200A更包括一電路導線DC，其中電路導線DC配置於第一基板210上，且位於第一基板210與第二基板220之間。電路導線DC與環境敏感電子元件230電性連接，其中電路導線DC可用以接收一輸入訊號，並轉換此輸入訊號而產生一輸出訊號，其中輸出訊號例如是顯示控制訊號。電路導線DC輸出顯示控制訊號，以控制環境敏感電子元件230。On the other hand, the environmentally sensitive electronic component package 200A of the present embodiment further includes a circuit lead DC, wherein the circuit lead DC is disposed on the first substrate 210 and located between the first substrate 210 and the second substrate 220. The circuit lead DC is electrically connected to the environmentally sensitive electronic component 230. The circuit lead DC can be used to receive an input signal and convert the input signal to generate an output signal, wherein the output signal is, for example, a display control signal. The circuit lead DC output displays a control signal to control the environmentally sensitive electronic component 230.

圖4A是本揭露又一實施例的環境敏感電子元件封裝體的剖面示意圖。圖4B是圖4A的環境敏感電子元件封裝體的底視圖。圖4C是圖4A的環境敏感電子元件封裝體的第三基板的上視圖。圖4D是圖4C的第三基板與殼體接合的上視示意圖。圖4E是圖4A的環境敏感電子元件封裝體的第三基板的另一上視圖。圖4F是圖4E的第三基板與殼體接合的上視示意圖。請參考圖4A，環境敏感電子元件封裝體300A包括第一基板310、第二基板320、環境敏感電子元件330、至少一第一側壁阻障結構SWB2、第一散熱層340、第一散熱結構350以及第一填充層360。第二基板320配置於第一基板310上方。環境敏感電子元件330配置於第一基板310上，且位於第一基板310與第二基板320之間。第一側壁阻障結構SWB2配置於第二基板320上，且位於第一基板310與第二基板320之間，其中第一側壁阻阻障結構SWB2位於環境敏感電子元件330的至少一側。第一散熱層340配置於第二基板320上，且位於第一基板310與第二基板320之間，其中第一散熱層340包覆第二基板320與第一側壁阻障結構SWB2。第一散熱結構350配置於第一基板310上，且位於第一基板310與第二基板320之間，其中第一散熱結構350環繞第一側壁阻障結構SWB2。第一填充層360位於第一基板310與第二基板320之間，且包覆第一側壁阻障結構SWB2以及環境敏感電子元件330，其中第一散熱結構350是與第二基板320上的第一散熱層340直接接合。4A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 4B is a bottom view of the environmentally sensitive electronic component package of FIG. 4A. 4C is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A. 4D is a top plan view of the third substrate of FIG. 4C joined to the housing. 4E is another top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A. 4F is a top plan view of the third substrate of FIG. 4E joined to the housing. Referring to FIG. 4A , the environmentally sensitive electronic component package 300A includes a first substrate 310 , a second substrate 320 , environmentally sensitive electronic components 330 , at least one first sidewall barrier structure SWB2 , a first heat dissipation layer 340 , and a first heat dissipation structure 350 . And a first filling layer 360. The second substrate 320 is disposed above the first substrate 310. The environmentally sensitive electronic component 330 is disposed on the first substrate 310 and located between the first substrate 310 and the second substrate 320. The first sidewall barrier structure SWB2 is disposed on the second substrate 320 and located between the first substrate 310 and the second substrate 320 , wherein the first sidewall barrier structure SWB2 is located on at least one side of the environmentally sensitive electronic component 330 . The first heat dissipation layer 340 is disposed on the second substrate 320 and located between the first substrate 310 and the second substrate 320 , wherein the first heat dissipation layer 340 covers the second substrate 320 and the first sidewall barrier structure SWB2 . The first heat dissipation structure 350 is disposed on the first substrate 310 and located between the first substrate 310 and the second substrate 320 , wherein the first heat dissipation structure 350 surrounds the first sidewall barrier structure SWB2 . The first filling layer 360 is disposed between the first substrate 310 and the second substrate 320 and covers the first sidewall barrier structure SWB2 and the environmentally sensitive electronic component 330. The first heat dissipation structure 350 is the same as the second substrate 320. A heat dissipation layer 340 is directly joined.

此外，第一散熱結構350進一步與環境敏感電子元件封裝體300A的殼體CASE接合，換言之，環境敏感電子元件330所產生的熱能可經由第一散熱層340傳導至第一散熱結構350，接著，經由第一散熱結構350傳導至環境敏感電子元件封裝體300A的殼體CASE，最後熱能可由殼體CASE向外導出。In addition, the first heat dissipation structure 350 is further coupled to the housing CASE of the environmentally sensitive electronic component package 300A. In other words, the thermal energy generated by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation structure 350 via the first heat dissipation layer 340, and then, Conducted to the housing CASE of the environmentally sensitive electronic component package 300A via the first heat dissipation structure 350, and finally the thermal energy can be outwardly led out by the housing CASE.

在本實施例中，第一基板310以及第二基板320例如是可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI）或金屬箔（metal foil）。此外，環境敏感電子元件裝體300A可進一步包括功能性薄膜（未繪示），其中功能性薄膜例如是配置於第二基板320上，且位於第一基板310與第二基板320之間。一般而言，功能性薄膜可以是觸控面板（touch panel），觸控面板例如是表面式電容觸控面板、數位矩陣式觸控面板（例如投射式電容觸控）或類比矩陣式觸控面板。當然，功能性薄膜亦可以是彩色濾光片（color filter）或電泳顯示器（EPD）。簡言之，本揭露的環境敏感電子元件封裝體可具有觸控功能。In this embodiment, the first substrate 310 and the second substrate 320 are, for example, flexible substrates, wherein the material of the flexible substrate may be polyethylene terephthalate (PET) or poly(diphenylene). Polyethylene naphthalate (PEN), Polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polytheneamine (PI) Or metal foil. In addition, the environmentally sensitive electronic component package 300A may further include a functional film (not shown), wherein the functional film is disposed on the second substrate 320 and located between the first substrate 310 and the second substrate 320. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

另外，環境敏感電子元件330例如是主動式環境敏感電子顯示元件或被動式環境敏感電子顯示元件，其中主動式環境敏感電子顯示元件例如是一主動型矩陣有機發光二極體(Active Matrix Organic Light Emitting Diode, AM-OLED)或者是主動型矩陣電泳顯示器(Active Matrix Electro Phoretic Display, AM-EPD)，俗稱電子紙，或者是主動型矩陣液晶顯示器(Active Matrix Liquid Crystal Display, AM-LCD)，或者是主動型矩陣藍相液晶顯示器(Active Matrix Blue Phase Liquid Crystal Display)。被動式環境敏感電子顯示元件則例如是被動驅動式有機電激發光元件陣列基板(Passive Matrix OLED, PM-OLED)或者是超扭轉向列型液晶顯示器(Super Twisted Nematic Liquid Crystal Display, STN-LCD)。In addition, the environmentally sensitive electronic component 330 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic electroluminescent device array substrate (Passive Matrix OLED, PM-OLED) or a super Twisted Nematic Liquid Crystal Display (STN-LCD).

如圖4A所示，在本實施例中，第一側壁阻障結構SWB2位於第二基板320上並且朝向第一基板310延伸，其中第一側壁阻障結構SWB2垂直於第一基板310的截面例如是梯形，當然，此截面亦可以是矩形、其他不同型態多邊型、圓形或橢圓形。一般而言，第一側壁阻障結構SWB2的材質可包括金屬材料，而金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，且第一側壁阻障結構SWB2例如是藉由黃光微影蝕刻、壓印或精密車床等製程形成於第二基板320上。值得一提的是，第一側壁阻障結構SWB2與第二基板320可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。As shown in FIG. 4A, in the present embodiment, the first sidewall barrier structure SWB2 is located on the second substrate 320 and extends toward the first substrate 310, wherein the first sidewall barrier structure SWB2 is perpendicular to the cross section of the first substrate 310, for example. It is trapezoidal. Of course, this section can also be rectangular, other different types of polygonal, circular or elliptical. In general, the material of the first sidewall barrier structure SWB2 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the first The sidewall barrier structure SWB2 is formed on the second substrate 320 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. It is to be noted that the first sidewall barrier structure SWB2 and the second substrate 320 may be made of the same material or different materials, and the disclosure is not limited herein.

另一方面，請參考圖4B，為清楚表示第一側壁阻障結構SWB2的主要特徵，在此並未繪示包覆第二基板320與第一側壁阻障結構SWB2的第一散熱層340，其中本實施例的第一側壁阻障結構SWB2例如是環繞環境敏感電子元件330的連續且封閉的環狀結構，用以阻隔來自外界的水氣與氧氣。詳細而言，在本實施例中，包覆第一側壁阻障結構SWB2的第一散熱層340主要為導熱材料10所構成，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon），且第一散熱層340例如是前述導熱材料10透過化學氣相沉積法、噴塗法等製程形成於第一側壁阻障結構SWB2上，其中。第一散熱層340亦可包括抗電磁干擾材質，一般而言，抗電磁干擾材料例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。On the other hand, referring to FIG. 4B, in order to clearly show the main features of the first sidewall barrier structure SWB2, the first heat dissipation layer 340 covering the second substrate 320 and the first sidewall barrier structure SWB2 is not illustrated. The first sidewall barrier structure SWB2 of the present embodiment is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 330 for blocking moisture and oxygen from the outside. In detail, in the embodiment, the first heat dissipation layer 340 covering the first sidewall barrier structure SWB2 is mainly composed of a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond-like carbon (diamond). The first heat dissipation layer 340 is formed on the first sidewall barrier structure SWB2 by a process such as chemical vapor deposition or spray coating, for example. The first heat dissipation layer 340 may also include an anti-electromagnetic interference material. Generally, the anti-electromagnetic interference material such as gold, silver, copper, carbon or lead may be used to attenuate the electromagnetic effect.

此外，包覆第一側壁阻障結構SWB2的第一散熱層340亦可以是由金屬材料或高導熱材料所構成，其中金屬材料或高導熱材料例如為單層金屬如鋁、鉬、鈦等，或者是多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合。一般而言，第一散熱層340例如是前述金屬材料或高導熱材可透過化學氣相沉積法、薄膜蒸鍍法、薄膜濺鍍法等製程形成於第一側壁阻障結構SWB2上。In addition, the first heat dissipation layer 340 covering the first sidewall barrier structure SWB2 may also be composed of a metal material or a highly thermally conductive material, for example, a single layer of metal such as aluminum, molybdenum, titanium, or the like. Or a combination of multilayer metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. Generally, the first heat dissipation layer 340 is formed on the first sidewall barrier structure SWB2 by a process such as a chemical vapor deposition method, a thin film evaporation method, or a thin film sputtering method, for example, the foregoing metal material or high thermal conductive material.

如圖4C至圖4F所示，第一散熱結構350可以是連續環狀結構或者非連續環狀結構，且具有避開電路導線DC的設計，其中第一散熱結構350是與第一散熱層340直接接合。此外，第一散熱結構350進一步與環境敏感電子元件封裝體300A的殼體CASE接合，換言之，環境敏感電子元件330所產生的熱能可經由第一散熱層340傳導至第一散熱結構350，接著，經由第一散熱結構350傳導至環境敏感電子元件封裝體300A的殼體CASE，最後熱能可由殼體CASE向外導出。As shown in FIG. 4C to FIG. 4F , the first heat dissipation structure 350 may be a continuous annular structure or a discontinuous annular structure, and has a design that avoids the circuit wire DC, wherein the first heat dissipation structure 350 is the first heat dissipation layer 340 . Direct bonding. In addition, the first heat dissipation structure 350 is further coupled to the housing CASE of the environmentally sensitive electronic component package 300A. In other words, the thermal energy generated by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation structure 350 via the first heat dissipation layer 340, and then, Conducted to the housing CASE of the environmentally sensitive electronic component package 300A via the first heat dissipation structure 350, and finally the thermal energy can be outwardly led out by the housing CASE.

進一步詳言之，如圖4A所示，第一散熱結構350可包括第一導熱材350a與第一導熱點350b，其中第一導熱材350a的材質主要可包括金屬材料或其他高導熱材料例如為金屬導熱膠材、導熱膠帶等。另外，第一導熱點350b的材質主要可包括金屬材料，其中金屬材料例如為單層金屬如鋁、鉬、鈦等，或者多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合。第一散熱結構350例如是透過化學氣相沉積法、薄膜蒸鍍法、薄膜濺鍍法等製程形成於第一基板310之上。更進一步詳言之，第一導熱點350b可利用主動元件利如薄膜電晶體（TFT）製程中的金屬導線製程同時製作，且第一導熱材350a與第一導熱點350b可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。In further detail, as shown in FIG. 4A, the first heat dissipation structure 350 may include a first heat conduction material 350a and a first heat conduction point 350b, wherein the material of the first heat conduction material 350a may mainly include a metal material or other high heat conductive material, for example Metal thermal conductive adhesive, thermal tape, etc. In addition, the material of the first thermal conduction point 350b may mainly include a metal material such as a single layer metal such as aluminum, molybdenum, titanium, or the like, or a combination of a plurality of metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. The first heat dissipation structure 350 is formed on the first substrate 310 by, for example, a chemical vapor deposition method, a thin film evaporation method, or a thin film sputtering method. More specifically, the first thermal conduction point 350b can be fabricated simultaneously using an active component such as a metal wire process in a thin film transistor (TFT) process, and the first thermal conductive material 350a and the first thermal conduction point 350b can be the same material or not. The same material is constructed, and the disclosure is not limited herein.

在本實施例中，第一填充層360例如是膠材透過紫光固化或熱固化所形成。膠材的材質例如是壓克力樹脂（acrylic）或環氧樹脂（expoxy），其中第一填充層360未固化前的型態例如是液態式(liquid type)膠材或膠膜式(sheet type)膠材。進一步而言，第一填充層360可進一步包括導熱材料10，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon）並且以奈米級粒子分佈於第一填充層360之中，可有效提升熱傳導的效率。In the present embodiment, the first filling layer 360 is formed, for example, by a solidification or thermal curing of the glue. The material of the rubber material is, for example, acrylic or epoxy, and the type before the first filling layer 360 is uncured is, for example, a liquid type adhesive or a sheet type. ) glue. Further, the first filling layer 360 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and distributed in a first filling layer 360 as a nano-sized particle. It can effectively improve the efficiency of heat transfer.

此外，如圖4A所示，在本實施例中，第一基板310與第二基板320裝設於殼體CASE內，且第二基板320配置於殼體CASE上。一般而言，殼體CASE的材質主要可包括金屬材料或其他高導熱材料，其中殼體CASE與散熱結構350接觸，換言之，環境敏感電子元件330發出的熱能可經由第一填充層360傳導到第一散熱層340，其中第一散熱層340與第一散熱結構350連接。因此，熱能可進一步自第一散熱結構350傳導至殼體CASE而將熱能導出環境敏感電子元件330之外，以降低熱能對環境敏感電子元件330壽命的影響。In addition, as shown in FIG. 4A, in the embodiment, the first substrate 310 and the second substrate 320 are disposed in the casing CASE, and the second substrate 320 is disposed on the casing CASE. In general, the material of the casing CASE may mainly include a metal material or other high thermal conductive material, wherein the casing CASE is in contact with the heat dissipation structure 350, in other words, the thermal energy emitted by the environmentally sensitive electronic component 330 may be conducted to the first through the first filling layer 360. A heat dissipation layer 340, wherein the first heat dissipation layer 340 is connected to the first heat dissipation structure 350. Thus, thermal energy can be further conducted from the first heat dissipation structure 350 to the housing CASE to direct thermal energy out of the environmentally sensitive electronic component 330 to reduce the effect of thermal energy on the life of the environmentally sensitive electronic component 330.

在本實施例中，環境敏感電子元件封裝體300A例如是頂面發光（top emission）或底面發光（bottom emission）的設計。當然，在其他未繪示的實施例中，環境敏感電子元件封裝體300A的殼體CASE亦可進一步設計有雙面出光口，據此光線可同時自頂面及底面輸出，從而達到雙面發光（dual emission）的效果。In the present embodiment, the environmentally sensitive electronic component package 300A is, for example, a top emission or a bottom emission design. Of course, in other embodiments not shown, the housing CASE of the environmentally sensitive electronic component package 300A can be further designed with a double-sided light exit port, whereby light can be simultaneously output from the top surface and the bottom surface to achieve double-sided illumination. (dual emission) effect.

以下將舉出其他實施例來說明環境敏感電子元件封裝體300B及300C的設計，其中相同或相似元件具有相同或相似標號，且相同或相似元件具有相同或相似特徵，在此不一一贅述。Other embodiments are described below to illustrate the design of environmentally sensitive electronic component packages 300B and 300C, wherein the same or similar elements have the same or similar reference numerals, and the same or similar elements have the same or similar features, and are not described herein.

圖5A是本揭露又一實施例的環境敏感電子元件封裝體。圖5B是圖5A的環境敏感電子元件封裝體的第三基板的上視圖。如圖5A所示，圖5A的環境敏感電子元件封裝體300B與圖4A的環境敏感電子元件封裝體300A相似，其不同之處在於：圖5A的環境敏感電子元件封裝體300B不具有殼體CASE，其中環境敏感電子元件封裝體300B進一步包括第三基板370、第二側壁阻障結構SWB3以及第二填充層380。第三基板370配置於第一基板310下方，其中第一基板310位於第二基板320與第三基板370。之間。第二側壁阻障結構SWB3配置於第三基板370上，且位於第一基板310與第三基板370之間。第二填充層380位於第一基板310與第三基板320之間，其中第二填充層380包覆第二側壁阻障結構SWB3，且第三基板370透過第二填充層380與第一基板310貼合。FIG. 5A is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 5B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 5A. As shown in FIG. 5A, the environmentally sensitive electronic component package 300B of FIG. 5A is similar to the environmentally sensitive electronic component package 300A of FIG. 4A, except that the environmentally sensitive electronic component package 300B of FIG. 5A does not have a housing CASE. The environmentally sensitive electronic component package 300B further includes a third substrate 370, a second sidewall barrier structure SWB3, and a second filling layer 380. The third substrate 370 is disposed under the first substrate 310 , wherein the first substrate 310 is located on the second substrate 320 and the third substrate 370 . between. The second sidewall barrier structure SWB3 is disposed on the third substrate 370 and located between the first substrate 310 and the third substrate 370. The second filling layer 380 is disposed between the first substrate 310 and the third substrate 320 , wherein the second filling layer 380 covers the second sidewall blocking structure SWB3 , and the third substrate 370 passes through the second filling layer 380 and the first substrate 310 . fit.

在本實施例中，第三基板370例如是金屬基板，第三基板370可為具有較佳的導熱與散熱特性的可撓性金屬基板。當然，第三基板370亦可以是與第一基板310相同或相似的可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI），本揭露在此並不加以限制。In this embodiment, the third substrate 370 is, for example, a metal substrate, and the third substrate 370 can be a flexible metal substrate having better heat conduction and heat dissipation characteristics. Of course, the third substrate 370 may also be the same or similar flexible substrate as the first substrate 310, wherein the flexible substrate may be made of polyethylene terephthalate (PET) or poly(biophenylene). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyamidamine (PI) The disclosure is not limited herein.

此外，第二側壁阻障結構SWB3位於第三基板370上並且朝向第一基板310延伸，其中第二側壁阻障結構SWB3垂直於第一基板310的截面例如是梯形，當然，此截面亦可以是矩形、其他不同型態多邊型、圓形或橢圓形。一般而言，第二側壁阻障結構SWB3的材質可包括金屬材料，而金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，且第二側壁阻障結構SWB3例如是藉由黃光微影蝕刻、壓印或精密車床等製程形成於第三基板370上。第二側壁阻障結構SWB3與第三基板370可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。In addition, the second sidewall barrier structure SWB3 is located on the third substrate 370 and extends toward the first substrate 310. The cross section of the second sidewall barrier structure SWB3 perpendicular to the first substrate 310 is, for example, a trapezoid. Rectangular, other different types of polygonal, circular or elliptical. In general, the material of the second sidewall barrier structure SWB3 may include a metal material, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and a second material. The sidewall barrier structure SWB3 is formed on the third substrate 370 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. The second sidewall barrier structure SWB3 and the third substrate 370 may be made of the same material or different materials, and the disclosure is not limited herein.

第二填充層380例如是膠材透過紫光固化或熱固化所形成。膠材的材質例如是壓克力樹脂（acrylic）或環氧樹脂（expoxy）。在本實施例中，第二填充層380未固化前的型態例如是液態式(liquid type)膠材或膠膜式(sheet type)膠材。進一步而言，第二填充層380可進一步包括導熱材料10，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon）並且以奈米級粒子分佈於第二填充層380之中，可有效提升熱傳導的效率。此外，環境敏感電子元件330發出的熱可經由第一基板310傳導至第二填充層，並進一步自第二填充層傳遞至第二側壁阻障結構SWB3及第三基板370而逸散至外界，亦可經由第一散熱層340傳導至散熱結構350將熱能導出。The second filling layer 380 is formed, for example, by a solidification or thermal curing of the rubber. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the type before the second filling layer 380 is uncured is, for example, a liquid type rubber material or a sheet type rubber material. Further, the second filling layer 380 may further include a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, diamond like carbon, and distributed in a second filling layer 380 as nano-sized particles. It can effectively improve the efficiency of heat transfer. In addition, the heat emitted by the environmentally sensitive electronic component 330 can be conducted to the second filling layer via the first substrate 310, and further transferred from the second filling layer to the second sidewall blocking structure SWB3 and the third substrate 370 to escape to the outside. Thermal energy can also be conducted through the first heat dissipation layer 340 to the heat dissipation structure 350.

如圖5B所示，在本實施例中，第二側壁阻障結構SWB3例如是連續且封閉的環狀結構，用以阻隔來自外界的水氣與氧氣。As shown in FIG. 5B, in the present embodiment, the second sidewall barrier structure SWB3 is, for example, a continuous and closed annular structure for blocking moisture and oxygen from the outside.

圖6是本揭露又一實施例的環境敏感電子元件封裝體。如圖6所示，圖6的環境敏感電子元件封裝體300C與圖5A的環境敏感電子元件封裝體300B相似，其不同之處在於：圖6的環境敏感電子元件封裝體300C更包括第二散熱層342、第二散熱結構352以及殼體CASE1。第二散熱層342配置於第三基板370上，且位於第一基板310與第三基板370之間，其中第二散熱層342包覆第三基板370與第二側壁阻障結構SWB3。第二散熱結構352配置於第一基板310上，且位於第一基板310與第三基板370之間，其中第二散熱結構352環繞第二側壁阻障結構SWB3，第二散熱結構352與第一基板310上的第二散熱層342接合。第一基板310、第二基板320與第三基板370裝設於殼體CASE1內。FIG. 6 is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. As shown in FIG. 6, the environmentally sensitive electronic component package 300C of FIG. 6 is similar to the environmentally sensitive electronic component package 300B of FIG. 5A, except that the environmentally sensitive electronic component package 300C of FIG. 6 further includes a second heat dissipation. Layer 342, second heat dissipation structure 352, and housing CASE1. The second heat dissipation layer 342 is disposed on the third substrate 370 and located between the first substrate 310 and the third substrate 370 , wherein the second heat dissipation layer 342 covers the third substrate 370 and the second sidewall barrier structure SWB3 . The second heat dissipation structure 352 is disposed on the first substrate 310 and located between the first substrate 310 and the third substrate 370 , wherein the second heat dissipation structure 352 surrounds the second sidewall barrier structure SWB3 , and the second heat dissipation structure 352 and the first The second heat dissipation layer 342 on the substrate 310 is bonded. The first substrate 310, the second substrate 320, and the third substrate 370 are mounted in the casing CASE1.

詳細而言，在本實施例中，包覆第二側壁阻障結構SWB3的第二散熱層342主要為導熱材料10所構成，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon），且第二散熱層342例如是前述導熱材料10透過化學氣相沉積法、噴塗法等製程形成於第二側壁阻障結構SWB3上。第二散熱層342亦可包括抗電磁干擾材質，一般而言，抗電磁干擾材料例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。In detail, in the embodiment, the second heat dissipation layer 342 covering the second sidewall barrier structure SWB3 is mainly composed of a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond-like carbon (diamond). The second heat dissipation layer 342 is formed on the second sidewall barrier structure SWB3 by a process such as a chemical vapor deposition method or a spray coating method. The second heat dissipation layer 342 may also include an anti-electromagnetic interference material. Generally, the anti-electromagnetic interference material such as gold, silver, copper, carbon or lead may be used to attenuate the electromagnetic effect.

此外，包覆第二側壁阻障結構SWB3的第二散熱層342亦可以是由金屬材料或高導熱材料所構成，其中金屬材料或高導熱材料例如為單層金屬如鋁、鉬、鈦等，或者是多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合。一般而言，第二散熱層342例如是前述金屬材料或高導熱材可透過化學氣相沉積法、薄膜蒸鍍法、薄膜濺鍍法等製程形成於第二側壁阻障結構SWB3上。In addition, the second heat dissipation layer 342 covering the second sidewall barrier structure SWB3 may also be composed of a metal material or a highly thermally conductive material, such as a single layer of metal such as aluminum, molybdenum, titanium, or the like. Or a combination of multilayer metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. In general, the second heat dissipation layer 342 is formed on the second sidewall barrier structure SWB3 by a process such as chemical vapor deposition, thin film evaporation, or thin film sputtering, for example, the foregoing metal material or high thermal conductive material.

另一方面，第二散熱結構352例如是連續環狀結構或者非連續環狀結構，且具有避開電路導線DC的設計，其中第二散熱結構352是與第二散熱層342直接接合，換言之，第二散熱結構352與圖4A至圖4E所繪示的結構大致上相同或相似。此外，第二散熱結構352進一步與環境敏感電子元件封裝體300C的殼體CASE1接合，也因此，環境敏感電子元件330所產生的熱能可經由第一散熱層340傳導至第一散熱結構350，再經由散熱結構傳導至環境敏感電子元件封裝體300C的殼體CASE1，最後熱能可由殼體CASE1向外導出。On the other hand, the second heat dissipation structure 352 is, for example, a continuous ring structure or a discontinuous ring structure, and has a design that avoids the circuit wire DC, wherein the second heat dissipation structure 352 is directly engaged with the second heat dissipation layer 342, in other words, The second heat dissipation structure 352 is substantially the same as or similar to the structure illustrated in FIGS. 4A-4E. In addition, the second heat dissipation structure 352 is further coupled to the housing CASE1 of the environmentally sensitive electronic component package 300C. Therefore, the thermal energy generated by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation structure 350 via the first heat dissipation layer 340. The heat is transferred to the housing CASE1 of the environmentally sensitive electronic component package 300C via the heat dissipation structure, and finally the thermal energy can be outwardly led out by the housing CASE1.

進一步詳言之，如圖6所示，第二散熱結構352包括第二導熱材352a與第二導熱點352b，其中第二導熱材352a的材質主要可包括金屬材料或其他高導熱材料例如為金屬導熱膠材、導熱膠帶等。另外，第二導熱點352b的材質主要可包括金屬材料，其中金屬材料例如為單層金屬如鋁、鉬、鈦等，或者多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合。第二散熱結構352例如是透過化學氣相沉積法、薄膜蒸鍍法、薄膜濺鍍法等製程形成於第一基板310之上。更進一步詳言之，第二導熱點352b可利用主動元件利如薄膜電晶體（TFT）製程中的金屬導線製程同時製作，且第二導熱材352a與第二導熱點352b可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。In further detail, as shown in FIG. 6, the second heat dissipation structure 352 includes a second heat conduction material 352a and a second heat conduction point 352b, wherein the material of the second heat conduction material 352a may mainly include a metal material or other high heat conductive material such as metal. Thermal adhesive, thermal tape, etc. In addition, the material of the second heat conduction point 352b may mainly include a metal material, for example, a single layer metal such as aluminum, molybdenum, titanium, or the like, or a combination of a plurality of metal layers such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. The second heat dissipation structure 352 is formed on the first substrate 310 by a process such as chemical vapor deposition, thin film evaporation, or thin film sputtering. In more detail, the second thermal conductive spot 352b can be fabricated simultaneously using a metal wire process in a thin film transistor (TFT) process, and the second thermal conductive material 352a and the second thermal conductive spot 352b can be the same material or not. The same material is constructed, and the disclosure is not limited herein.

在本實施例中，第一基板310、第二基板320及第三基板370例如是被殼體CASE所環繞，其中第一基板310進一步抵接殼體CASE1的內表面，且殼體CASE1與第一散熱結構350以及第二散熱結構352接觸。換言之，環境敏感電子元件330發出的熱能可經由第一填充層360傳導到第一散熱層340，其中第一散熱層340與第一散熱結構350連接。因此，熱能可進一步自第一散熱結構350傳導至殼體CASE1而將熱能導出環境敏感電子元件330之外，以降低熱能對環境敏感電子元件330壽命的影響。In this embodiment, the first substrate 310, the second substrate 320, and the third substrate 370 are surrounded by the casing CASE, for example, wherein the first substrate 310 further abuts the inner surface of the casing CASE1, and the casing CASE1 and the A heat dissipation structure 350 and a second heat dissipation structure 352 are in contact. In other words, the thermal energy emitted by the environmentally sensitive electronic component 330 can be conducted to the first heat dissipation layer 340 via the first filling layer 360 , wherein the first heat dissipation layer 340 is coupled to the first heat dissipation structure 350 . Thus, thermal energy can be further conducted from the first heat dissipation structure 350 to the housing CASE1 to direct thermal energy out of the environmentally sensitive electronic component 330 to reduce the effect of thermal energy on the life of the environmentally sensitive electronic component 330.

另外，環境敏感電子元件330發出的熱能亦可經由第一基板310傳導到第二填充層380，再進一步自第二填充層380傳導至第二散熱層342，其中第二散熱層342與第二散熱結構352連接。因此，熱能可進一步自第二散熱結構352傳導至殼體CASE1而將熱能導出。當然，第二散熱結構352更可直接經由第一基板310傳導至第二散熱結構352，其中第二散熱結構352抵接殼體CASE1，也因此，熱能可自第二散熱結構352傳導至殼體CASE1而將熱能導出。當然，環境敏感電子元件330發出的熱能更可傳導至第一基板310，並自第一基板310傳導至殼體CASE1而將熱能導出。In addition, the thermal energy emitted by the environmentally sensitive electronic component 330 can also be conducted to the second filling layer 380 via the first substrate 310, and further transmitted from the second filling layer 380 to the second heat dissipation layer 342, wherein the second heat dissipation layer 342 and the second layer The heat dissipation structure 352 is connected. Therefore, thermal energy can be further conducted from the second heat dissipation structure 352 to the housing CASE1 to derive thermal energy. Of course, the second heat dissipation structure 352 can be directly conducted to the second heat dissipation structure 352 via the first substrate 310, wherein the second heat dissipation structure 352 abuts the housing CASE1, and thus, thermal energy can be conducted from the second heat dissipation structure 352 to the housing. CASE1 derives thermal energy. Of course, the thermal energy emitted by the environmentally sensitive electronic component 330 can be conducted to the first substrate 310 and conducted from the first substrate 310 to the casing CASE1 to conduct thermal energy.

在本實施例中，環境敏感電子元件封裝體300C例如是雙面發光（dual emission）的設計。也就是說，環境敏感電子元件封裝體300C的殼體CASE1進一步設計有上、下出光口，據此光線可同時自頂面及底面輸出，從而達到雙面發光（dual emission）的效果。In the present embodiment, the environmentally sensitive electronic component package 300C is, for example, a design of dual emission. That is to say, the casing CASE1 of the environmentally sensitive electronic component package 300C is further designed with upper and lower exit ports, whereby light can be simultaneously output from the top surface and the bottom surface, thereby achieving the effect of dual emission.

圖7A是本揭露更一實施例的環境敏感電子元件封裝體。圖7B是圖7A的環境敏感電子元件封裝體的上視圖。請參考圖7A，環境敏感電子元件封裝體400A包括第一基板410、第二基板420、環境敏感電子元件430、至少一第一側壁阻障結構SWB4、至少一散熱突出440、第一填充層450、第三基板460、至少一第二側壁阻障結構SWB5、散熱層470、散熱結構480以及第二填充層490。第二基板420配置於第一基板410上方。環境敏感電子元件430配置於第一基板410上，且位於第一基板410與第二基板420之間。第一側壁阻障結構SWB4配置於第二基板420上，且位於第一基板410與第二基板420之間，其中第一側壁阻障結構SWB4位於環境敏感電子元件430的至少一側。散熱突出440位於第二基板420上，且朝向第一基板410延伸。第一填充層450位於第一基板410與第二基板420之間，第一基板410透過第一填充層450與第二基板420貼合，其中第一填充層450包覆環境敏感電子元件430、散熱突出440以及第一側壁阻障結構SWB4。第三基板460配置於第一基板410下方，其中第一基板410位於第二基板420與第三基板460之間。第二側壁阻障結構SWB5配置於第三基板460上，且位於第一基板410與第三基板460之間。散熱層470配置於第三基板460上，且位於第一基板410與第三基板460之間，其中散熱層470包覆第三基板460與第二側壁阻障結構SWB5。散熱結構480配置於第一基板410上，且位於第一基板410與第三基板460之間，其中散熱結構480環繞第二側壁阻障結構SWB5，且散熱結構480與第三基板460上的散熱層470接合。第二填充層490位於第一基板410與第三基板460之間，第一基板410透過第二填充層490與第三基板460貼合，其中第二填充層490包覆第二側壁阻障結構SWB5。7A is an environmentally sensitive electronic component package of a further embodiment of the present disclosure. Figure 7B is a top view of the environmentally sensitive electronic component package of Figure 7A. Referring to FIG. 7A , the environmentally sensitive electronic component package 400A includes a first substrate 410 , a second substrate 420 , environmentally sensitive electronic components 430 , at least one first sidewall barrier structure SWB4 , at least one heat dissipation protrusion 440 , and a first filling layer 450 . The third substrate 460, the at least one second sidewall barrier structure SWB5, the heat dissipation layer 470, the heat dissipation structure 480, and the second filling layer 490. The second substrate 420 is disposed above the first substrate 410. The environmentally sensitive electronic component 430 is disposed on the first substrate 410 and located between the first substrate 410 and the second substrate 420. The first sidewall barrier structure SWB4 is disposed on the second substrate 420 and located between the first substrate 410 and the second substrate 420 , wherein the first sidewall barrier structure SWB4 is located on at least one side of the environmentally sensitive electronic component 430 . The heat dissipation protrusion 440 is located on the second substrate 420 and extends toward the first substrate 410. The first filling layer 450 is disposed between the first substrate 410 and the second substrate 420. The first substrate 410 is bonded to the second substrate 420 through the first filling layer 450. The first filling layer 450 is coated with the environmentally sensitive electronic component 430. The heat dissipation protrusion 440 and the first sidewall barrier structure SWB4. The third substrate 460 is disposed under the first substrate 410 , wherein the first substrate 410 is located between the second substrate 420 and the third substrate 460 . The second sidewall barrier structure SWB5 is disposed on the third substrate 460 and located between the first substrate 410 and the third substrate 460. The heat dissipation layer 470 is disposed on the third substrate 460 and located between the first substrate 410 and the third substrate 460 , wherein the heat dissipation layer 470 covers the third substrate 460 and the second sidewall barrier structure SWB5 . The heat dissipation structure 480 is disposed on the first substrate 410 and located between the first substrate 410 and the third substrate 460, wherein the heat dissipation structure 480 surrounds the second sidewall barrier structure SWB5, and the heat dissipation structure 480 and the heat dissipation on the third substrate 460 Layer 470 is joined. The second filling layer 490 is disposed between the first substrate 410 and the third substrate 460. The first substrate 410 is bonded to the third substrate 460 through the second filling layer 490, wherein the second filling layer 490 covers the second sidewall blocking structure. SWB5.

在本實施例中，第一基板410例如是可撓玻璃膜片，同時具備了可撓性基板的的撓曲能力以及硬質基板的特性。當然，第一基板410亦可以是其他不同型態的可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI）或金屬箔（metal foil）。此外，環境敏感電子元件封裝體400A可進一步包括功能性薄膜（未繪示），其中功能性薄膜例如是配置於第一基板410上，且位於第一基板410與環境敏感電子元件430之間。一般而言，功能性薄膜可以是觸控面板（touch panel），觸控面板例如是表面式電容觸控面板、數位矩陣式觸控面板（例如投射式電容觸控）或類比矩陣式觸控面板。當然，功能性薄膜亦可以是彩色濾光片（color filter）或電泳顯示器（EPD）。簡言之，本揭露的環境敏感電子元件封裝體可具有觸控功能。In the present embodiment, the first substrate 410 is, for example, a flexible glass film, and has the flexibility of the flexible substrate and the characteristics of the rigid substrate. Of course, the first substrate 410 may also be a flexible substrate of other different types, wherein the material of the flexible substrate may be polyethylene terephthalate (PET) or polyethylene isophthalate. Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polytheneamine (PI) or metal foil (metal foil). In addition, the environmentally sensitive electronic component package 400A may further include a functional film (not shown), wherein the functional film is disposed on the first substrate 410 and located between the first substrate 410 and the environmentally sensitive electronic component 430. In general, the functional film may be a touch panel, such as a surface capacitive touch panel, a digital matrix touch panel (such as a projected capacitive touch) or an analog matrix touch panel. . Of course, the functional film can also be a color filter or an electrophoretic display (EPD). In short, the environmentally sensitive electronic component package of the present disclosure may have a touch function.

另一方面，在本實施例中，第二基板420例如是金屬基板，第二基板420可為具有較佳的導熱與散熱特性的可撓性金屬基板。當然，第二基板420亦可以是與第一基板410相同或相似的可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI），本揭露在此並不加以限制。On the other hand, in the embodiment, the second substrate 420 is, for example, a metal substrate, and the second substrate 420 may be a flexible metal substrate having better heat conduction and heat dissipation characteristics. The second substrate 420 may be the same or similar flexible substrate as the first substrate 410. The material of the flexible substrate may be polyethylene terephthalate (PET) or poly(biophenylene). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyamidamine (PI) The disclosure is not limited herein.

另外，環境敏感電子元件430例如是主動式環境敏感電子顯示元件或被動式環境敏感電子顯示元件，其中主動式環境敏感電子顯示元件例如是一主動型矩陣有機發光二極體(Active Matrix Organic Light Emitting Diode, AM-OLED)或者是主動型矩陣電泳顯示器(Active Matrix Electro Phoretic Display, AM-EPD)，俗稱電子紙，或者是主動型矩陣液晶顯示器(Active Matrix Liquid Crystal Display, AM-LCD)，或者是主動型矩陣藍相液晶顯示器(Active Matrix Blue Phase Liquid Crystal Display)。被動式環境敏感電子顯示元件則例如是被動驅動式有機電激發光元件陣列基板(Passive Matrix OLED, PM-OLED)或者是超扭轉向列型液晶顯示器(Super Twisted Nematic Liquid Crystal Display, STN-LCD)。In addition, the environmentally sensitive electronic component 430 is, for example, an active environmentally sensitive electronic display component or a passive environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode). , AM-OLED) or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active Active Matrix Blue Phase Liquid Crystal Display. The passive environmentally sensitive electronic display component is, for example, a passively driven organic electroluminescent device array substrate (Passive Matrix OLED, PM-OLED) or a super Twisted Nematic Liquid Crystal Display (STN-LCD).

此外，如圖7A所示，在本實施例中，第一側壁阻障結構SWB4位於第二基板420上並且朝向第一基板410延伸，其中第一側壁阻障結構SWB4垂直於第一基板410的截面例如是梯形，當然，此截面亦可以是矩形、其他不同型態多邊形、圓形或橢圓形。一般而言，第一側壁阻障結構SWB4的材質可包括金屬材料，而金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，且第一側壁阻障結構SWB4例如是藉由黃光微影蝕刻、壓印或精密車床等製程形成於第二基板420上。在本實施例中，第一側壁阻障結構SWB4與第二基板420例如是相同材質所構成，當然，在其他未繪示的實施例中，第一側壁阻障結構SWB4與第二基板420亦可以是不相同材質所構成，本揭露在此並不加以限制。In addition, as shown in FIG. 7A , in the embodiment, the first sidewall barrier structure SWB4 is located on the second substrate 420 and extends toward the first substrate 410 , wherein the first sidewall barrier structure SWB4 is perpendicular to the first substrate 410 . The cross section is, for example, a trapezoid, of course, the cross section may also be rectangular, other different types of polygons, circles or ellipses. In general, the material of the first sidewall barrier structure SWB4 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the first The sidewall barrier structure SWB4 is formed on the second substrate 420 by, for example, a yellow photolithography etching, an imprinting, or a precision lathe. In this embodiment, the first sidewall barrier structure SWB4 and the second substrate 420 are made of the same material, for example, in other embodiments not shown, the first sidewall barrier structure SWB4 and the second substrate 420 are also It may be composed of different materials, and the disclosure is not limited herein.

另一方面，如圖7B所示，在本實施例中，第一側壁阻障結構SWB4例如是環繞環境敏感電子元件430的連續且封閉的環狀結構，用以阻隔來自外界的水氣與氧氣，其中第一側壁阻障結構SWB4環繞散熱突出440。在此必須說明的是，如圖7A所示，本實施例的散熱突出440與第二基板420例如是相同材質所構成，其中散熱突出440例如透過由黃光微影蝕刻、壓印、噴砂或精密車床等製程並且以陣列排列的方式形成於第二基板420上，且第二基板420與散熱突出440的材質主要為金屬材料，其中金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料。On the other hand, as shown in FIG. 7B, in the present embodiment, the first sidewall barrier structure SWB4 is, for example, a continuous and closed annular structure surrounding the environmentally sensitive electronic component 430 for blocking moisture and oxygen from the outside. The first sidewall barrier structure SWB4 surrounds the heat dissipation protrusion 440. It should be noted that, as shown in FIG. 7A, the heat dissipation protrusion 440 of the present embodiment and the second substrate 420 are made of the same material, for example, the heat dissipation protrusion 440 is etched, for example, by yellow light lithography, embossing, sand blasting, or a precision lathe. The process is formed on the second substrate 420 in an array, and the material of the second substrate 420 and the heat dissipation protrusion 440 is mainly a metal material, wherein the metal material is, for example, iron, aluminum, copper, magnesium, chromium, gold, silver. A metal such as molybdenum or titanium or an alloy thereof.

更進一步而言，在其他未繪示的實施例中，散熱突出440與第二基板420亦可以是不相同材質所構成，其中第二基板420的材質例如是金屬材料，且金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，則散熱突出440的材質主要為無機材料，其中無機材料例如是矽化物、鋁化物、鑽石、類鑽石等。散熱突出440可透過化學氣相沉積、濺鍍、噴塗由等製程並且以陣列排列的方式形成於第二基板420上。Further, in other embodiments, the heat dissipation protrusions 440 and the second substrate 420 may be made of different materials, wherein the material of the second substrate 420 is, for example, a metal material, and the metal material is, for example, iron. , aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium and other metals or alloy materials thereof, the material of the heat dissipation protrusion 440 is mainly inorganic materials, wherein the inorganic materials are, for example, telluride, aluminide, diamond, diamond-like, etc. . The heat dissipation protrusions 440 can be formed on the second substrate 420 by chemical vapor deposition, sputtering, spraying, etc., and arranged in an array.

詳細而言，如圖7A以及7B所示，在本實施例中，散熱突出440的數量例如是多個並且陣列排列第二基板420上的一區域D，其中區域D的面積與環境敏感電子元件430的尺寸大致上相同。當然，區域D的面積可視產品的設計需求而進行調整，換言之，區域D的面積可以是等於、大於或小於環境敏感電子元件430的尺寸。也因此，環境敏感電子元件430所發出的熱能可經由第一填充層450傳遞至散熱突出440，之後，進一步由散熱突出440傳導至第二基板420而逸散至外界。In detail, as shown in FIGS. 7A and 7B, in the present embodiment, the number of heat dissipation protrusions 440 is, for example, a plurality and arrays of a region D on the second substrate 420, wherein the area of the region D and the environmentally sensitive electronic components The dimensions of 430 are substantially the same. Of course, the area of the area D can be adjusted according to the design requirements of the product. In other words, the area of the area D can be equal to, larger or smaller than the size of the environmentally sensitive electronic component 430. Therefore, the thermal energy emitted by the environmentally sensitive electronic component 430 can be transferred to the heat dissipation protrusion 440 via the first filling layer 450, and then further radiated to the second substrate 420 by the heat dissipation protrusion 440 to escape to the outside.

簡言之，本揭露的散熱突出可有效提升熱傳導與散熱的效率。此外，在本實施例中，散熱突出440的底面積例如是方形，當然，在其他未繪示的實施例中，散熱突出440的底面積亦可以是三角形、其他不同型態多邊形、圓形或橢圓形，本揭露在此並不加以限制。In short, the heat dissipation of the present disclosure can effectively improve the efficiency of heat conduction and heat dissipation. In addition, in this embodiment, the bottom area of the heat dissipation protrusion 440 is, for example, a square shape. Of course, in other embodiments not shown, the bottom surface area of the heat dissipation protrusion 440 may also be a triangle, other different types of polygons, circles, or Oval, the disclosure is not limited herein.

另外，第一填充層450例如是膠材透過紫光固化或熱固化所形成。膠材的材質例如是壓克力樹脂（acrylic）或環氧樹脂（expoxy）。在本實施例中，第一填充層450未固化前的型態例如是液態式(liquid type)膠材或膠膜式(sheet type)膠材。進一而言，第一填充層450進一步包括導熱材料10，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon）並且以奈米級粒子分佈於第一填充層450之中，可有效提升熱傳導的效率。In addition, the first filling layer 450 is formed, for example, by a solidification or thermal curing of a rubber material. The material of the rubber material is, for example, acrylic or epoxy. In the present embodiment, the pre-cured form of the first filling layer 450 is, for example, a liquid type rubber material or a sheet type rubber material. Further, the first filling layer 450 further includes a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, a diamond like carbon, and is distributed in the first filling layer 450 as a nano-sized particle. Can effectively improve the efficiency of heat transfer.

另一方面，本實施例的環境敏感電子元件封裝體400A更包括一電路導線DC，其中電路導線DC配置於第一基板410上，且位於第一基板410與第二基板420之間。電路導線DC與環境敏感電子元件430電性連接，其中電路導線DC可用以接收一輸入訊號，並轉換此輸入訊號而產生一輸出訊號，其中輸出訊號例如是顯示控制訊號。電路導線DC輸出顯示控制訊號，以控制環境敏感電子元件430。On the other hand, the environmentally sensitive electronic component package 400A of the present embodiment further includes a circuit lead DC, wherein the circuit lead DC is disposed on the first substrate 410 and located between the first substrate 410 and the second substrate 420. The circuit lead DC is electrically connected to the environmentally sensitive electronic component 430. The circuit lead DC is operable to receive an input signal and convert the input signal to generate an output signal, wherein the output signal is, for example, a display control signal. The circuit lead DC output displays a control signal to control the environmentally sensitive electronic component 430.

接續上述，第三基板460例如是金屬基板，第三基板460可為具有較佳的導熱與散熱特性的可撓性金屬基板。當然，第三基板460亦可以是與第一基板410相同或相似的可撓性基板，其中可撓性基板的材質可為聚乙烯對苯二甲酸酯（polyethylene terephthalate, PET）、聚間苯二甲酸乙二酯（polyethylene naphthalate, PEN）、聚醚石風（Polyethersulfone, PES）、聚甲基丙烯酸甲酯（polymethyl methacrylate, PMMA）、聚碳酸酯（Polycarbonate, PC）、聚亞醯胺（PI），本揭露在此並不加以限制。Following the above, the third substrate 460 is, for example, a metal substrate, and the third substrate 460 can be a flexible metal substrate having better heat conduction and heat dissipation characteristics. The third substrate 460 may also be the same or similar flexible substrate as the first substrate 410. The material of the flexible substrate may be polyethylene terephthalate (PET) or poly(biophenylene). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyamidamine (PI) The disclosure is not limited herein.

此外，如圖7A所示，在本實施例中，第二側壁阻障結構SWB5位於第三基板460上並且朝向第一基板410延伸，其中第二側壁阻障結構SWB5垂直於第一基板410的截面例如是梯形，當然，此截面亦可以是矩形、其他不同型態多邊型、圓形或橢圓形。一般而言，第二側壁阻障結構SWB5的材質可包括金屬材料，而金屬材料例如是鐵、鋁、銅、鎂、鉻、金、銀、鉬、鈦等金屬或其合金材料，且第二側壁阻障結構SWB5例如是藉由黃光微影蝕刻、壓印或或精密車床等製程形成於第三基板460上。值得一提的是，第二側壁阻障結構SWB5與第三基板460可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。In addition, as shown in FIG. 7A , in the embodiment, the second sidewall barrier structure SWB5 is located on the third substrate 460 and extends toward the first substrate 410 , wherein the second sidewall barrier structure SWB5 is perpendicular to the first substrate 410 . The cross section is, for example, a trapezoid. Of course, the cross section may also be rectangular, other different types of polygonal, circular or elliptical. In general, the material of the second sidewall barrier structure SWB5 may include a metal material, and the metal material is, for example, a metal such as iron, aluminum, copper, magnesium, chromium, gold, silver, molybdenum, titanium, or an alloy thereof, and the second The sidewall barrier structure SWB5 is formed on the third substrate 460 by, for example, a process such as yellow photolithography etching, imprinting, or a precision lathe. It is to be noted that the second sidewall barrier structure SWB5 and the third substrate 460 may be made of the same material or different materials, and the disclosure is not limited herein.

詳細而言，在本實施例中，包覆第二側壁阻障結構SWB5的散熱層470主要為導熱材料10所構成，其中導熱材料10例如是人工鑽石、類鑽石、類鑽碳（diamond like carbon），且散熱層470例如是前述導熱材料10透過化學氣相沉積法、噴塗法等製程形成於第二側壁阻障結構SWB5上。散熱層470亦可包括抗電磁干擾材質，一般而言，抗電磁干擾材料例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。In detail, in the embodiment, the heat dissipation layer 470 covering the second sidewall barrier structure SWB5 is mainly composed of a heat conductive material 10, wherein the heat conductive material 10 is, for example, an artificial diamond, a diamond-like diamond, or a diamond-like carbon (diamond like carbon). And the heat dissipation layer 470 is formed on the second sidewall barrier structure SWB5 by a process such as a chemical vapor deposition method or a spray coating method, for example. The heat dissipation layer 470 may also include an anti-electromagnetic interference material. Generally, the anti-electromagnetic interference material such as gold, silver, copper, carbon or lead may be used to attenuate the electromagnetic effect.

此外，包覆第二側壁阻障結構SWB5的散熱層470亦可以是由金屬材料或高導熱材料所構成，其中金屬材料或高導熱材料例如為單層金屬如鋁、鉬、鈦等，或者是多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合。一般而言，散熱層470例如是前述金屬材料或高導熱材可透過化學氣相沉積法、薄膜蒸鍍法、薄膜濺鍍法等製程形成於第二側壁阻障結構SWB5上。In addition, the heat dissipation layer 470 covering the second sidewall barrier structure SWB5 may also be composed of a metal material or a highly thermally conductive material, such as a single layer of metal such as aluminum, molybdenum, titanium, etc., or A multilayer metal stack such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. Generally, the heat dissipation layer 470 is formed on the second sidewall barrier structure SWB5 by a process such as a chemical vapor deposition method, a thin film evaporation method, or a thin film sputtering method, for example, the foregoing metal material or high thermal conductive material.

另一方面，散熱結構480例如是連續環狀結構，其中散熱結構480是與散熱層470直接接合。此外，散熱結構480進一步與殼體CASE2接合，也因此，環境敏感電子元件430所產生的熱能可經由散熱層470傳導至散熱結構480，再經由散熱結構480傳導至殼體CASE2，最後熱能由殼體CASE2向外導出。On the other hand, the heat dissipation structure 480 is, for example, a continuous annular structure in which the heat dissipation structure 480 is directly bonded to the heat dissipation layer 470. In addition, the heat dissipation structure 480 is further coupled to the housing CASE2. Therefore, the thermal energy generated by the environmentally sensitive electronic component 430 can be conducted to the heat dissipation structure 480 via the heat dissipation layer 470, and then transmitted to the housing CASE2 via the heat dissipation structure 480, and finally the thermal energy is provided by the housing. The body CASE2 is exported outward.

進一步詳言之，如圖7A所示，散熱結構480包括導熱材480a與導熱點480b，其中導熱材480a的材質主要可包括金屬材料或其他高導熱材料例如為金屬導熱膠材、導熱膠帶等。另外，導熱點480b的材質主要可包括金屬材料，其中金屬材料例如為單層金屬如鋁、鉬、鈦等，或者多層金屬堆疊如鉬/鋁/鉬或鈦/鋁/鈦等組合。散熱結構480例如是透過化學氣相沉積法、薄膜蒸鍍法、薄膜濺鍍法等製程形成於第一基板410之上。更進一步詳言之，導熱點480b可利用主動元件利如薄膜電晶體（TFT）製程中的金屬導線製程同時製作，且導熱材480a與導熱點480b可以是相同材質或不相同材質所構成，本揭露在此並不加以限制。In further detail, as shown in FIG. 7A, the heat dissipation structure 480 includes a heat conductive material 480a and a heat conduction point 480b. The material of the heat conductive material 480a may mainly include a metal material or other high heat conductive material such as a metal heat conductive adhesive material, a thermal conductive tape, or the like. In addition, the material of the thermal conductive spot 480b may mainly include a metal material such as a single layer metal such as aluminum, molybdenum, titanium, or the like, or a combination of a plurality of metal stacks such as molybdenum/aluminum/molybdenum or titanium/aluminum/titanium. The heat dissipation structure 480 is formed on the first substrate 410 by, for example, a chemical vapor deposition method, a thin film deposition method, or a thin film sputtering method. More specifically, the thermal conductive spot 480b can be fabricated simultaneously using an active component such as a metal wire process in a thin film transistor (TFT) process, and the thermal conductive material 480a and the thermal conductive spot 480b can be made of the same material or different materials. The disclosure is not limited here.

在本實施例中，第一基板410、第二基板420及第三基板460裝設於殼體CASE2內，詳細而言，第一基板410、第二基板420及第三基板460例如是被殼體CASE2所環繞，其中第一基板410進一步抵接殼體CASE2的內表面。換言之，環境敏感電子元件430發出的熱能可經由第一基板傳導至殼體CASE2而將熱能導出，以降低熱能對環境敏感電子元件430壽命的影響。In this embodiment, the first substrate 410, the second substrate 420, and the third substrate 460 are disposed in the casing CASE2. In detail, the first substrate 410, the second substrate 420, and the third substrate 460 are, for example, shells. The body CASE2 is surrounded, wherein the first substrate 410 further abuts the inner surface of the casing CASE2. In other words, the thermal energy emitted by the environmentally sensitive electronic component 430 can be conducted to the housing CASE2 via the first substrate to direct thermal energy to reduce the effect of thermal energy on the life of the environmentally sensitive electronic component 430.

在本實施例中，環境敏感電子元件封裝體400A例如是底面發光（bottom emission）的設計，亦例如是頂面發光（top emission）的設計，本揭露在此並不加以限制。當然，在其他未繪示的實施例中，環境敏感電子元件封裝體400A的殼體CASE亦可進一步配置有雙面出光口，據此光線可同時自頂面及底面輸出，從而達到雙面發光（dual emission）的效果。In the present embodiment, the environmentally sensitive electronic component package 400A is, for example, a bottom emission design, and is also a top emission design, which is not limited herein. Of course, in other embodiments not shown, the housing CASE of the environmentally sensitive electronic component package 400A may be further configured with a double-sided light exit port, whereby the light can be simultaneously outputted from the top surface and the bottom surface to achieve double-sided illumination. (dual emission) effect.

綜上所述，由於本揭露的環境敏感電子元件封裝體具有環繞環境敏感電子元件的側壁阻障結構並且配置於任兩基板之間，因此本揭露的環境敏感電子元件封裝體具有良好的阻隔水氣與氧氣的能力。此外，本揭露的環境敏感電子元件封裝體更具有散熱突出的結構或導熱材料，其中散熱突出配置於基板上並且朝向環境敏感電子元件延伸，而導熱材料是以奈米級粒子分佈於填充層或散熱層，因此本揭露的環境敏感電子元件封裝體同時具有良好的散熱能力，以有效延長環境敏感電子元件的壽命。In summary, since the environmentally sensitive electronic component package of the present disclosure has a sidewall barrier structure surrounding the environmentally sensitive electronic component and is disposed between any two substrates, the environmentally sensitive electronic component package of the present disclosure has good barrier water. Gas and oxygen capacity. In addition, the environmentally sensitive electronic component package of the present disclosure further has a heat dissipating protruding structure or a heat conductive material, wherein the heat dissipating protrusion is disposed on the substrate and extends toward the environmentally sensitive electronic component, and the heat conducting material is distributed on the filling layer by nanometer particles or The heat dissipation layer, therefore, the environmentally sensitive electronic component package disclosed herein has good heat dissipation capability to effectively extend the life of environmentally sensitive electronic components.

雖然本揭露已以實施例說明如上，然其並非用以限定本揭露，任何所屬技術領域中具有通常知識者，在不脫離本揭露的精神和範圍內，當可作些許的更動與潤飾，故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。The present disclosure has been described above by way of example only, and is not intended to limit the scope of the disclosure, and the invention may be modified and modified without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

10‧‧‧導熱材料
100A、100B、200A‧‧‧環境敏感電子元件封裝體
300A、300B、300C、400A‧‧‧環境敏感電子元件封裝體
110、210、310、410‧‧‧第一基板
120、220、320、420‧‧‧第二基板
130、230、330、430‧‧‧環境敏感電子元件
140、140a、260、440‧‧‧散熱突出
150‧‧‧第一填充層
240、360、450‧‧‧第一填充層
250、370、460‧‧‧第三基板
270、380、490‧‧‧第二填充層
340‧‧‧第一散熱層
342‧‧‧第二散熱層
350‧‧‧第一散熱結構
352‧‧‧第二散熱結構
350a‧‧‧第一導熱材
350b‧‧‧第一導熱點
352a‧‧‧第二導熱材
352b‧‧‧第二導熱點
470‧‧‧散熱層
480‧‧‧散熱結構
480a‧‧‧導熱材
480b‧‧‧導熱點
A~D‧‧‧區域
CASE、CASE1、CASE2‧‧‧殼體
DC‧‧‧電路導線
SWB、SWB4‧‧‧第一側壁阻障結構
SWB1‧‧‧側壁阻障結構
SWB2‧‧‧第一側壁阻障結構
SWB3、SWB5‧‧‧第二側壁阻障結構10‧‧‧thermal materials
100A, 100B, 200A‧‧‧Environmentally sensitive electronic component package
300A, 300B, 300C, 400A‧‧‧ Environmentally sensitive electronic component packages
110, 210, 310, 410‧‧‧ first substrate
120, 220, 320, 420‧‧‧ second substrate
130, 230, 330, 430‧‧‧ Environmentally sensitive electronic components
140, 140a, 260, 440‧‧ ‧ heat dissipation
150‧‧‧First filling layer
240, 360, 450‧‧‧ first filling layer
250, 370, 460‧‧‧ third substrate
270, 380, 490‧‧‧ second filling layer
340‧‧‧First heat sink
342‧‧‧Second heat dissipation layer
350‧‧‧First heat dissipation structure
352‧‧‧Second heat dissipation structure
350a‧‧‧First heat conductive material
350b‧‧‧First thermal point
352a‧‧‧Second thermal material
352b‧‧‧second thermal point
470‧‧‧heat layer
480‧‧‧heat dissipation structure
480a‧‧‧heat material
480b‧‧‧thermal point
A~D‧‧‧Area
CASE, CASE1, CASE2‧‧‧ shell
DC‧‧‧ circuit wire
SWB, SWB4‧‧‧ first sidewall barrier structure
SWB1‧‧‧ sidewall barrier structure
SWB2‧‧‧First sidewall barrier structure
SWB3, SWB5‧‧‧ second sidewall barrier structure

圖1A是本揭露一實施例的環境敏感電子元件封裝體的剖面示意圖。圖1B是圖1A的環境敏感電子元件封裝體的底視圖。圖2A是本揭露另一實施例的環境敏感電子元件封裝體。圖2B是圖2A的環境敏感電子元件封裝體的底視圖。圖3A是本揭露另一實施例的環境敏感電子元件封裝體的剖面示意圖。圖3B是圖3A的環境敏感電子元件封裝體的第三基板的上視圖。圖4A是本揭露又一實施例的環境敏感電子元件封裝體的剖面示意圖。圖4B是圖4A的環境敏感電子元件封裝體的底視圖。圖4C是圖4A的環境敏感電子元件封裝體的第三基板的上視圖。圖4D是圖4C的第三基板與殼體接合的上視示意圖。圖4E是圖4A的環境敏感電子元件封裝體的第三基板的另一上視圖。圖4F是圖4E的第三基板與殼體接合的上視示意圖。圖5A是本揭露又一實施例的環境敏感電子元件封裝體。圖5B是圖5A的環境敏感電子元件封裝體的第三基板的上視圖。圖6是本揭露又一實施例的環境敏感電子元件封裝體。圖7A是本揭露更一實施例的環境敏感電子元件封裝體。圖7B是圖7A的環境敏感電子元件封裝體的上視圖。1A is a cross-sectional view of an environmentally sensitive electronic component package in accordance with an embodiment of the present disclosure. FIG. 1B is a bottom view of the environmentally sensitive electronic component package of FIG. 1A. 2A is an environmentally sensitive electronic component package of another embodiment of the present disclosure. 2B is a bottom view of the environmentally sensitive electronic component package of FIG. 2A. 3A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to another embodiment of the present disclosure. 3B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 3A. 4A is a schematic cross-sectional view of an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 4B is a bottom view of the environmentally sensitive electronic component package of FIG. 4A. 4C is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A. 4D is a top plan view of the third substrate of FIG. 4C joined to the housing. 4E is another top view of the third substrate of the environmentally sensitive electronic component package of FIG. 4A. 4F is a top plan view of the third substrate of FIG. 4E joined to the housing. FIG. 5A is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 5B is a top view of the third substrate of the environmentally sensitive electronic component package of FIG. 5A. FIG. 6 is an environmentally sensitive electronic component package according to still another embodiment of the present disclosure. 7A is an environmentally sensitive electronic component package of a further embodiment of the present disclosure. Figure 7B is a top view of the environmentally sensitive electronic component package of Figure 7A.

10‧‧‧導熱材料 10‧‧‧thermal materials

300A‧‧‧環境敏感電子元件封裝體 300A‧‧‧Environmentally sensitive electronic component package

310‧‧‧第一基板 310‧‧‧First substrate

320‧‧‧第二基板 320‧‧‧second substrate

330‧‧‧環境敏感電子元件 330‧‧‧Environmentally sensitive electronic components

340‧‧‧第一散熱層 340‧‧‧First heat sink

350‧‧‧第一散熱結構 350‧‧‧First heat dissipation structure

350a‧‧‧第一導熱材 350a‧‧‧First heat conductive material

350b‧‧‧第一導熱點 350b‧‧‧First thermal point

360‧‧‧第一填充層 360‧‧‧First filling layer

CASE‧‧‧殼體 CASE‧‧‧shell

DC‧‧‧電路導線 DC‧‧‧ circuit wire

SWB2‧‧‧第一側壁阻障結構 SWB2‧‧‧First sidewall barrier structure

Claims

一種環境敏感電子元件封裝體，包括：一第一基板；一第二基板，配置於該第一基板上方；一環境敏感電子元件，配置於該第一基板上，且位於該第一基板與該第二基板之間；至少一第一側壁阻障結構，配置於該第二基板上，且位於該第一基板與該第二基板之間，其中該第一側壁阻障結構位於該環境敏感電子元件的至少一側；一第一散熱層，配置於該第二基板上，且位於該第一基板與該第二基板之間，其中該第一散熱層包覆該第二基板與該第一側壁阻障結構；一第一散熱結構，配置於該第一基板上，且位於該第一基板與該第二基板之間，其中該第一散熱結構環繞該第一側壁阻障結構；以及一第一填充層，位於該第一基板與該第二基板之間，且包覆該第一側壁阻障結構以及環境敏感電子元件，其中該第一散熱結構與該第二基板上的第一散熱層接合。An environmentally sensitive electronic component package includes: a first substrate; a second substrate disposed above the first substrate; an environmentally sensitive electronic component disposed on the first substrate and located on the first substrate and the Between the second substrate; at least one first sidewall barrier structure disposed on the second substrate and located between the first substrate and the second substrate, wherein the first sidewall barrier structure is located in the environmentally sensitive electron At least one side of the component; a first heat dissipation layer disposed on the second substrate and located between the first substrate and the second substrate, wherein the first heat dissipation layer covers the second substrate and the first a sidewall blocking structure; a first heat dissipation structure disposed on the first substrate and located between the first substrate and the second substrate, wherein the first heat dissipation structure surrounds the first sidewall barrier structure; a first filling layer between the first substrate and the second substrate, and covering the first sidewall barrier structure and the environment sensitive electronic component, wherein the first heat dissipation structure and the first heat dissipation on the second substrate Lay Hehe.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，其中該第一側壁阻障結構包括連續且封閉的環狀結構。The environmentally sensitive electronic component package of claim 1, wherein the first sidewall barrier structure comprises a continuous and closed annular structure.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，其中該第一側壁阻障結構的截面包括梯形、矩形、多邊形、圓形或橢圓形，且該截面垂直於該第一基板。The environmentally sensitive electronic component package of claim 1, wherein the first sidewall barrier structure comprises a trapezoidal, rectangular, polygonal, circular or elliptical cross section, and the cross section is perpendicular to the first substrate.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，其中該第一散熱層為導熱材料。The environmentally sensitive electronic component package of claim 1, wherein the first heat dissipation layer is a heat conductive material.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，其中該第一散熱結構包括連續環狀結構。The environmentally sensitive electronic component package of claim 1, wherein the first heat dissipation structure comprises a continuous annular structure.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，其中該第一散熱結構包括不連續環狀結構。The environmentally sensitive electronic component package of claim 1, wherein the first heat dissipation structure comprises a discontinuous annular structure.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，其中該第一填充層具有導熱材料。The environmentally sensitive electronic component package of claim 1, wherein the first filling layer has a thermally conductive material.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，更包括一殼體，其中該第一基板與該第二基板裝設於該殼體內，且該第二基板配置於該殼體上。The environmentally sensitive electronic component package of claim 1, further comprising a casing, wherein the first substrate and the second substrate are disposed in the casing, and the second substrate is disposed in the casing on.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，更包括一電路導線，其中該電路導線配置於該第一基板上，且位於該第一基板與第二基板之間，以電性連接該環境敏感電子元件。The environmentally sensitive electronic component package of claim 1, further comprising a circuit wire, wherein the circuit wire is disposed on the first substrate and located between the first substrate and the second substrate to be electrically Sexually connect the environmentally sensitive electronic components.

如申請專利範圍第1項所述的環境敏感電子元件封裝體，更包括：一第三基板，配置於該第一基板下方，其中該第一基板位於該第二基板與該第三基板之間；至少一第二側壁阻障結構，配置於該第三基板上，且位於該第一基板與該第三基板之間；以及一第二填充層，位於該第一基板與該第三基板之間，其中該第二填充層包覆該第二側壁阻障結構，且該第三基板透過該第二填充層與該第一基板貼合。The environmentally sensitive electronic component package of claim 1, further comprising: a third substrate disposed under the first substrate, wherein the first substrate is located between the second substrate and the third substrate At least one second sidewall barrier structure disposed on the third substrate and located between the first substrate and the third substrate; and a second filling layer located on the first substrate and the third substrate The second filling layer covers the second sidewall barrier structure, and the third substrate is bonded to the first substrate through the second filling layer.

如申請專利範圍第10項所述的環境敏感電子元件封裝體，其中該第二側壁阻障結構的截面包括梯形、矩形、多邊形、圓形或橢圓形，且該截面垂直於該第一基板。The environmentally sensitive electronic component package of claim 10, wherein the cross section of the second sidewall barrier structure comprises a trapezoidal shape, a rectangular shape, a polygonal shape, a circular shape or an elliptical shape, and the cross section is perpendicular to the first substrate.

如申請專利範圍第10項所述的環境敏感電子元件封裝體，其中在該第二側壁阻障結構包括連續且封閉的環狀結構。The environmentally sensitive electronic component package of claim 10, wherein the second sidewall barrier structure comprises a continuous and closed annular structure.

如申請專利範圍第10項所述的環境敏感電子元件封裝體，其中該第二填充層具有導熱材料。The environmentally sensitive electronic component package of claim 10, wherein the second filling layer has a thermally conductive material.

如申請專利範圍第10項所述的環境敏感電子元件封裝體，更包括：一第二散熱層，配置於該第三基板上，且位於該第一基板與該第三基板之間，其中該第二散熱層包覆該第三基板與該第二側壁阻障結構；一第二散熱結構，配置於該第一基板上，且位於該第一基板與該第三基板之間，其中該第二散熱結構環繞該第二側壁阻障結構，該第二散熱結構與該第一基板上的該第二散熱層接合；以及一殼體，其中該第一基板、第二基板以及該第三基板裝設於該殼體內。The environmentally sensitive electronic component package of claim 10, further comprising: a second heat dissipation layer disposed on the third substrate and located between the first substrate and the third substrate, wherein the The second heat dissipation layer covers the third substrate and the second sidewall barrier structure; a second heat dissipation structure is disposed on the first substrate and located between the first substrate and the third substrate, wherein the first heat dissipation layer is disposed between the first substrate and the third substrate a second heat dissipation structure surrounding the second sidewall barrier structure, the second heat dissipation structure being bonded to the second heat dissipation layer on the first substrate; and a housing, wherein the first substrate, the second substrate, and the third substrate Installed in the housing.

如申請專利範圍第14項所述的環境敏感電子元件封裝體，其中該第二散熱結構包括連續環狀結構。The environmentally sensitive electronic component package of claim 14, wherein the second heat dissipation structure comprises a continuous annular structure.

如申請專利範圍第14項所述的環境敏感電子元件封裝體，其中該第二散熱結構包括不連續環狀結構。The environmentally sensitive electronic component package of claim 14, wherein the second heat dissipation structure comprises a discontinuous annular structure.

如申請專利範圍第14項所述的環境敏感電子元件封裝體，其中該第二散熱層為導熱材料。The environmentally sensitive electronic component package of claim 14, wherein the second heat dissipation layer is a heat conductive material.