TWI586852B - A substrate plating jig and a plating device for plating the jig with the substrate - Google Patents
A substrate plating jig and a plating device for plating the jig with the substrate Download PDFInfo
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- TWI586852B TWI586852B TW102108660A TW102108660A TWI586852B TW I586852 B TWI586852 B TW I586852B TW 102108660 A TW102108660 A TW 102108660A TW 102108660 A TW102108660 A TW 102108660A TW I586852 B TWI586852 B TW I586852B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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Description
本發明是關於一種被使用於基板的鍍敷處理的鍍敷治具及鍍敷裝置，尤其是關於一種用以將鍍敷膜形成在設於半導體晶圓等的被鍍敷處理面的微細之配線用溝或孔洞、光阻開口部，或是將用以將半導體晶片與基板作電性連接的凸塊(突起狀電極)形成於半導體晶圓的被鍍敷處理面的鍍敷治具及利用該鍍敷治具的鍍敷裝置。 The present invention relates to a plating jig and a plating apparatus used for plating treatment of a substrate, and more particularly to a fine method for forming a plating film on a surface to be plated which is provided on a semiconductor wafer or the like. a wiring trench or a hole, a photoresist opening portion, or a plating jig for forming a bump (projecting electrode) for electrically connecting the semiconductor wafer and the substrate to the plated surface of the semiconductor wafer and A plating apparatus using the plating fixture.
一般而言，電解鍍敷法是大致區分為噴流方式或杯狀方式、及浸漬方式；該噴流方式或杯狀方式是將半導體晶圓等基板的被鍍敷處理面作成朝下(face down)而水平地置放，而由下噴起鍍敷液施以鍍敷，該浸漬方式是將基板垂直地豎立在鍍敷槽之中，由鍍敷槽之下部注入鍍敷液，而一面溢流一面將基板浸漬於鍍敷液中施以鍍敷。其中，在浸漬方式的電解鍍敷法中，將基板垂直地豎立以進行鍍敷，乃為了容易地進行去掉產生在基板的被鍍敷處理面上的氣泡，及為了微粒等不容易附著於基板的被鍍敷處理面上。如此地，依照將基板垂直地豎立以進行鍍敷的 電解鍍敷法，可將因進行高速鍍敷時的激烈還原反應所致之氣泡容易地脫泡，因此適於高速鍍敷。 In general, the electrolytic plating method is roughly classified into a jet flow method, a cup method, and a immersion method in which a plated surface of a substrate such as a semiconductor wafer is formed face down. And horizontally placed, and plating is performed by spraying the plating solution downward. The immersion method is to vertically erect the substrate in the plating tank, and the plating solution is injected from the lower portion of the plating tank while overflowing. The substrate is immersed in a plating solution and plated. In the electrolytic plating method of the immersion method, the substrate is vertically erected for plating, in order to easily remove bubbles generated on the surface to be plated of the substrate, and to easily adhere to the substrate for particles or the like. The surface to be plated. As such, the substrate is vertically erected for plating The electrolytic plating method can easily defoam bubbles due to the intense reduction reaction at the time of high-speed plating, and is therefore suitable for high-speed plating.
可是，在採用上述以往的浸漬方式的電解鍍敷裝置是具備基板保持具；該基板保持具是將半導體晶圓等基板予以密封其外周端面與背面並露出表面(被鍍敷處理面)且裝卸自如地保持，並將該基板保持具按每一基板浸漬於鍍敷液中，以進行基板的被鍍敷處理面之鍍敷。 However, the electrolytic plating apparatus using the above-described conventional immersion method includes a substrate holder that seals the outer peripheral end surface and the back surface of the substrate such as a semiconductor wafer and exposes the surface (plated surface to be plated). The substrate holder is held freely, and the substrate holder is immersed in the plating solution for each substrate to perform plating of the substrate to be plated.
然而，在採用此種以往的浸漬方式的電解鍍敷法，將基板垂直地豎立在鍍敷槽之鍍敷液中的狀態下進行浸漬，並使得鍍敷液由鍍敷槽之下部朝著上方向流動之故，因而所注入的鍍敷液，是成為經常地由基板的被鍍敷處理面的下部朝著上部被供給，而在基板的被鍍敷處理面的上部與下部會產生鍍敷液之流速不勻，會有因應於基板的被鍍敷處理面之部位，於鍍敷之膜厚產生微妙的差異的問題。又，電流密度之不勻也會成為鍍敷不均勻性的原因。 However, in the electrolytic plating method using such a conventional immersion method, the substrate is immersed vertically in the plating solution of the plating bath, and the plating solution is directed upward from the lower portion of the plating tank. Since the direction of the flow of the plating liquid is always supplied from the lower portion of the substrate to be plated surface to the upper portion, plating is formed on the upper and lower portions of the substrate to be plated surface. The flow rate of the liquid is not uniform, and there is a problem that the thickness of the plating film is subtly different depending on the portion of the substrate to be plated. Moreover, the unevenness of the current density also causes plating unevenness.
於是，為了解決此些問題，使半導體晶圓等的基板保持具藉由驅動手段在鍍敷槽內旋轉，以解決鍍敷液的流速不勻或是電流密度之不勻而能夠提高鍍敷膜厚均勻性的鍍敷方法及鍍敷裝置被揭示於專利文獻1及專利文獻2。 Therefore, in order to solve such problems, the substrate holder such as a semiconductor wafer can be rotated in the plating tank by the driving means to solve the unevenness of the flow rate of the plating solution or the unevenness of the current density, thereby improving the plating film. A plating method and a plating apparatus for thickness uniformity are disclosed in Patent Document 1 and Patent Document 2.
然而，如專利文獻1所示以由設於鍍敷槽之外部的驅動手段貫通鍍敷槽側壁的形式，使得軸被連接於基板保持具者，會使貫通部的密封處理成為問題。於是， 被揭示於專利文獻1的方法，是在貫通部並未施以密封處理，而將軸與鍍敷槽側壁作成非接觸，並由其中間有鍍敷液流出的方式所構成，惟依此些構成，必須改良鍍敷槽。又，專利文獻2者，因以預定之角度設有驅動軸，因此雖未貫通鍍敷槽之側壁，惟為了將陽極板作成與被鍍敷物對向而設置成預定角度，或是沿著軸之角度形成鍍敷槽之底部等，鍍敷槽本身之改良成為仍然必需者。 However, as shown in Patent Document 1, the driving means provided outside the plating tank penetrates the side wall of the plating tank, so that the shaft is connected to the substrate holder, and the sealing treatment of the penetration portion becomes a problem. then, The method disclosed in Patent Document 1 is such that the shaft is not in contact with the side wall of the plating tank in the penetration portion, and the plating liquid flows out from the middle of the plating tank, but In the configuration, it is necessary to improve the plating tank. Further, in Patent Document 2, since the drive shaft is provided at a predetermined angle, the side wall of the plating tank is not penetrated, but the anode plate is formed at a predetermined angle to face the object to be plated, or along the axis. The angle forms the bottom of the plating tank, etc., and the improvement of the plating tank itself is still necessary.
專利文獻1：日本特開2004-300462號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-300462
專利文獻2：日本特開2002-327291號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2002-327291
因此，本發明是克服有關於以往的鍍敷裝置的缺點，提供一種具有基板保持具之旋轉驅動手段，而不施以對於鍍敷槽之改良就簡單地能夠裝卸自如於鍍敷槽的鍍敷治具及利用該鍍敷治具的鍍敷裝置作為其課題者。 Therefore, the present invention overcomes the disadvantages of the conventional plating apparatus and provides a rotary driving means having a substrate holder, and is capable of easily detachably plating the plating tank without applying an improvement to the plating tank. A jig and a plating apparatus using the plating jig are considered as subjects.
本發明是解決上述課題者，為一種鍍敷治具，其特徵為：具有：支撐部、及基板保持具；該支撐部是形成為能夠掛設於鍍敷槽之側壁，該基板保持具是垂直旋轉自如地被保持於該支撐 部，該鍍敷治具具備上述基板保持具的旋轉手段。 The present invention is directed to a plating fixture characterized by comprising: a support portion and a substrate holder; the support portion is formed to be hangable on a side wall of the plating tank, and the substrate holder is Vertically rotatably held on the support In the plating tool, the plating fixture includes the rotation means of the substrate holder.
又本發明是一種鍍敷裝置，其特徵為：將上述鍍敷治具掛設於鍍敷槽之側壁，並在上述基板保持具和與該基板保持具對向設置的陽極板之間，設置朝著橫方向往返移動的葉片。 Further, the present invention is a plating apparatus characterized in that the plating fixture is hung on a side wall of a plating tank, and is disposed between the substrate holder and an anode plate disposed opposite to the substrate holder. A blade that moves back and forth in a lateral direction.
依照本發明的鍍敷治具，僅掛設於鍍敷槽之側壁就能夠容易地安裝於鍍敷裝置，作為基板保持具之旋轉驅動手段利用鍍敷液流，或是，將驅動部之動力經由旋轉軸或齒輪構件而被傳遞到基板保持具者，都不需要改良鍍敷槽者。 The plating jig according to the present invention can be easily attached to the plating apparatus only by being hung on the side wall of the plating tank, and can be used as a rotary driving means of the substrate holder by the plating liquid flow or by the power of the driving part. Anyone who is transferred to the substrate holder via the rotating shaft or the gear member does not need to improve the plating tank.
又，在安裝本發明的鍍敷治具的鍍敷裝置，於基板保持具與陽極板之間設置攪拌用葉片者，是藉由治具之旋轉加上葉片之攪拌，因能夠將沿著基板的被鍍敷處理面的鍍敷液流作成均等，因此能夠形成更均勻之膜厚的鍍敷膜。 Further, in the plating apparatus to which the plating jig of the present invention is attached, the stirring blade is provided between the substrate holder and the anode plate, and the blade is stirred by the rotation of the jig, so that the substrate can be placed along the substrate. Since the plating liquid flow on the plated surface is made uniform, it is possible to form a plating film having a more uniform film thickness.
還有，在安裝本發明的鍍敷治具的鍍敷裝置，於基板保持具下方的鍍敷槽之底部設置鍍敷液噴出口者，是在基板保持具之左右對於鍍敷液流的強度設置差異，就能夠更有效率地發生旋轉力。 Further, in the plating apparatus to which the plating jig of the present invention is mounted, the plating liquid discharge port is provided at the bottom of the plating tank below the substrate holder, and the strength of the plating liquid flow is left and right of the substrate holder. By setting the difference, the rotational force can be generated more efficiently.
1‧‧‧鍍敷裝置 1‧‧‧ plating device
2‧‧‧鍍敷治具 2‧‧‧ plating fixture
10‧‧‧鍍敷槽 10‧‧‧ plating tank
11‧‧‧側壁 11‧‧‧ side wall
12‧‧‧噴出口 12‧‧‧Spray outlet
20‧‧‧溢流槽 20‧‧‧Overflow trough
30‧‧‧基板保持具 30‧‧‧Substrate holder
31‧‧‧保持構件 31‧‧‧ Keeping components
32‧‧‧密封構件 32‧‧‧ Sealing members
33‧‧‧外框構件 33‧‧‧Frame components
34‧‧‧軸部 34‧‧‧Axis
35‧‧‧固定螺栓 35‧‧‧ fixing bolt
36‧‧‧固定螺栓 36‧‧‧ fixing bolts
37‧‧‧固定螺栓 37‧‧‧ fixing bolts
40‧‧‧支撐部 40‧‧‧Support
41‧‧‧孔部 41‧‧‧ Hole Department
50‧‧‧陽極板 50‧‧‧Anode plate
60‧‧‧葉片 60‧‧‧ leaves
70‧‧‧電源 70‧‧‧Power supply
71‧‧‧通電路徑 71‧‧‧Power path
80‧‧‧配管 80‧‧‧Pipe
81‧‧‧泵 81‧‧‧ pump
82‧‧‧過濾器 82‧‧‧Filter
90‧‧‧驅動部 90‧‧‧ Drive Department
91‧‧‧軸 91‧‧‧Axis
92‧‧‧安裝部 92‧‧‧Installation Department
93‧‧‧齒輪 93‧‧‧ Gears
94‧‧‧齒輪部 94‧‧‧ Gear Department
95‧‧‧外框構件 95‧‧‧Frame components
311‧‧‧基部 311‧‧‧ base
312‧‧‧基板裝載面 312‧‧‧Substrate loading surface
313‧‧‧孔部 313‧‧‧ Hole Department
314‧‧‧第1通電構件 314‧‧‧1st energized component
321‧‧‧開口部 321‧‧‧ openings
322‧‧‧密封襯墊 322‧‧‧ Sealing gasket
323‧‧‧第2通電構件 323‧‧‧2nd electrification member
324‧‧‧突出接點 324‧‧‧ prominent joints
331‧‧‧連結部 331‧‧‧Connecting Department
332‧‧‧翼部 332‧‧‧wing
333‧‧‧翼部 333‧‧‧wing
334‧‧‧凹部 334‧‧‧ recess
W‧‧‧基板 W‧‧‧Substrate
第1圖是本發明的鍍敷治具的分解立體圖。 Fig. 1 is an exploded perspective view of a plating fixture of the present invention.
第2圖是安裝本發明的鍍敷治具的鍍敷裝置的概略構成圖。 Fig. 2 is a schematic configuration diagram of a plating apparatus to which the plating jig of the present invention is attached.
第3圖(a)是本發明的鍍敷治具的外框構件的側視圖。 Fig. 3(a) is a side view of the outer frame member of the plating jig of the present invention.
第3圖(b)是本發明的鍍敷治具的外框構件的前視圖。 Fig. 3(b) is a front view of the outer frame member of the plating jig of the present invention.
第4圖(a)是本發明的鍍敷治具的外框構件的側視圖。 Fig. 4(a) is a side view of the outer frame member of the plating jig of the present invention.
第4圖(b)是本發明的鍍敷治具的外框構件的前視圖。 Fig. 4(b) is a front view of the outer frame member of the plating jig of the present invention.
第5圖(a)是本發明的鍍敷治具的外框構件的側視圖。 Fig. 5(a) is a side view of the outer frame member of the plating jig of the present invention.
第5圖(b)是本發明的鍍敷治具的外框構件的前視圖。 Fig. 5(b) is a front view of the outer frame member of the plating jig of the present invention.
第6圖(a)是表示本發明的鍍敷治具的外框構件之翼部的不相同形態的圖式。 Fig. 6(a) is a view showing a different aspect of the wing portion of the outer frame member of the plating jig of the present invention.
第6圖(b)是表示本發明的鍍敷治具的外框構件之翼部的不相同形態的圖式。 Fig. 6(b) is a view showing a different aspect of the wing portion of the outer frame member of the plating jig of the present invention.
第7圖是安裝本發明的鍍敷治具的鍍敷裝置的概略構成圖。 Fig. 7 is a schematic configuration diagram of a plating apparatus to which the plating jig of the present invention is attached.
第8圖是安裝本發明的鍍敷治具的鍍敷裝置的概略構成圖。 Fig. 8 is a schematic configuration diagram of a plating apparatus to which the plating jig of the present invention is attached.
第9圖是本發明的鍍敷治具的基板保持具的局部擴大斷面圖。 Fig. 9 is a partially enlarged sectional view showing the substrate holder of the plating jig of the present invention.
以下，將本發明的鍍敷治具及利用該鍍敷治具的鍍敷裝置的實施形態，依據圖式具體地說明。又，本發明是對於此些實施形態並沒有受到任何限制者。 Hereinafter, embodiments of the plating jig of the present invention and a plating apparatus using the plating jig will be specifically described based on the drawings. Further, the present invention is not limited to these embodiments.
第1圖是本發明的鍍敷治具的分解立體圖，第2圖是安裝本發明的鍍敷治具的鍍敷裝置的概略構成圖。圖中，1是表示塗敷裝置，2是表示鍍敷治具，10是表示鍍敷槽，11是表示側壁，12是表示噴出口，20是表示溢流槽，30是表示基板保持具，31是表示保持構件，32是表示密封構件，33是表示外框構件，34是表示軸部，35是表示固定螺栓，36是表示固定螺栓，37是表示固定螺栓，40是表示支撐部，41是表示孔部，50是表示陽極板，60是表示葉片，70是表示電源，71是表示通電路徑，80是表示配管，81是泵，82是表示過濾器，311是表示基部，312是表示基板裝載面，313是表示孔部，314是表示第1通電構件，321是表示開口部，331是表示連結部，332是表示翼部，W是表示基板。 Fig. 1 is an exploded perspective view of a plating fixture of the present invention, and Fig. 2 is a schematic configuration diagram of a plating apparatus to which a plating fixture of the present invention is attached. In the drawings, 1 denotes a coating device, 2 denotes a plating fixture, 10 denotes a plating tank, 11 denotes a side wall, 12 denotes a discharge port, 20 denotes an overflow tank, and 30 denotes a substrate holder. 31 denotes a holding member, 32 denotes a sealing member, 33 denotes an outer frame member, 34 denotes a shaft portion, 35 denotes a fixing bolt, 36 denotes a fixing bolt, 37 denotes a fixing bolt, and 40 denotes a supporting portion, 41 It is a hole part, 50 is an anode plate, 60 is a blade, 70 is a power source, 71 is a power supply path, 80 is a pipe, 81 is a pump, 82 is a filter, 311 is a base, and 312 is a The substrate loading surface 313 is a hole portion, 314 is a first current-carrying member, 321 is an opening portion, 331 is a connecting portion, 332 is a wing portion, and W is a substrate.
如圖式所示地，本發明的塗敷治具2是由支撐部40、及基板保持具30所構成；該支撐部40是形成為能夠掛設於鍍敷槽之側壁，該基板保持具30是旋轉自如地設置於支撐部40。針對於各部之詳細，利用第1圖來加以說明。支撐部40是以能夠掛設於鍍敷槽之側壁上端的方式，上部形成為鉤狀的柱狀構件，在其下部貫穿有能夠***軸部34的孔部41。經由軸部34，圓板狀基板 保持具30朝著垂直方向能夠旋轉地被保持在該孔部41。 As shown in the figure, the coating jig 2 of the present invention is composed of a support portion 40 and a substrate holder 30; the support portion 40 is formed to be hangable on a side wall of a plating tank, and the substrate holder 30 is rotatably provided on the support portion 40. The details of each part will be described using FIG. The support portion 40 is a columnar member having a hook shape in the upper portion so as to be hooked to the upper end of the side wall of the plating tank, and a hole portion 41 through which the shaft portion 34 can be inserted is inserted in the lower portion. Through the shaft portion 34, the disk-shaped substrate The holder 30 is rotatably held in the hole portion 41 in the vertical direction.
基板保持具30，是由：保持構件31、密封構件32、外框構件33、軸部34、及固定螺栓35、36、37所構成。此些之中，保持構件31是於形成為圓板狀的基部311之上面，凸設有直徑比基部311還要小的基板裝載面312。該基板裝載面312是被形成為與被鍍敷處理的基板W大致同一形狀、大小。又，在基板裝載面312之周圍的基部311上，凸設有複數之第1通電構件314。還有，在基板裝載面312之中央，貫穿有能夠插通軸部34的孔部313。 The substrate holder 30 is composed of a holding member 31, a sealing member 32, an outer frame member 33, a shaft portion 34, and fixing bolts 35, 36, and 37. Among these, the holding member 31 is formed on the upper surface of the base portion 311 which is formed in a disk shape, and has a substrate loading surface 312 which is smaller in diameter than the base portion 311. The substrate loading surface 312 is formed to have substantially the same shape and size as the substrate W to be plated. Further, a plurality of first energizing members 314 are protruded from the base portion 311 around the substrate loading surface 312. Further, a hole portion 313 through which the shaft portion 34 can be inserted is inserted in the center of the substrate loading surface 312.
密封構件32是形成為具有與保持構件31大致同一直徑的環狀，其開口部321是形成為比基板W之外徑稍小的內徑。還有，在與保持構件31對向的面，設有環狀之密封襯墊322及第2通電構件323(在第1圖中未予圖示)，在裝配基板保持具30時，則與保持構件31一起夾持基板W，密封基部311上的第1通電構件314，而且對基板W進行通電。 The sealing member 32 is formed in an annular shape having substantially the same diameter as the holding member 31, and the opening portion 321 is formed to have an inner diameter slightly smaller than the outer diameter of the substrate W. Further, an annular sealing pad 322 and a second electric conducting member 323 (not shown in FIG. 1) are provided on a surface facing the holding member 31, and when the substrate holder 30 is mounted, The holding member 31 sandwiches the substrate W together, seals the first current-carrying member 314 on the base portion 311, and energizes the substrate W.
外框構件33是由形成為半環狀的左右兩個構件所構成。該外框構件33是斷面形狀大致呈匚字形狀，在裝配基板保持具30時，被嵌裝於保持構件31與密封構件32之外周緣。具體而言，於保持構件31與密封構件32之外周緣由左右安裝兩個外框構件33，而在上下之連結部331藉由螺栓等被結合固定。又，第1圖者，是於外 框構件33之外周面突設有複數翼部332，惟如下述地，若使用其他的旋轉手段時，並不需要該翼部332。 The outer frame member 33 is composed of two left and right members formed in a semi-annular shape. The outer frame member 33 has a substantially U-shaped cross section, and is fitted to the outer periphery of the holding member 31 and the sealing member 32 when the substrate holder 30 is mounted. Specifically, the outer frame member 33 and the outer periphery of the sealing member 32 are attached to the left and right sides of the outer frame member 33, and the upper and lower connecting portions 331 are coupled and fixed by bolts or the like. Also, the first picture is outside A plurality of wing portions 332 are protruded from the outer peripheral surface of the frame member 33. However, if other rotation means are used as described below, the wing portions 332 are not required.
基板保持具30對於支撐部40的安裝，是於保持構件31之孔部313與支撐部40之孔部41插通具有螺絲部的軸部34，將固定螺栓35、36、37各別螺合於軸部34的螺絲部分而加以固定。這時候，露出於鍍敷液中的固定螺栓36是在固定後施以包覆而進行密封較理想。又，固定螺栓37是同樣地露出於塗敷液中，惟如第1圖所示地，於支撐部40之背面設置能夠埋設固定螺栓37之深度的凹部，而將開口部以氯乙烯板或膠帶等施以掩蔽較理想。又，針對於以軸部34露出一部分於鍍敷液中的部分也藉由特弗龍(teflon：註冊商標)或是環氧系樹脂等施以包覆較理想。 The mounting of the substrate holder 30 to the support portion 40 is such that the hole portion 313 of the holding member 31 and the hole portion 41 of the support portion 40 are inserted into the shaft portion 34 having the screw portion, and the fixing bolts 35, 36, 37 are respectively screwed. The screw portion of the shaft portion 34 is fixed. At this time, it is preferable that the fixing bolts 36 exposed in the plating liquid are sealed after being fixed and sealed. Further, the fixing bolts 37 are similarly exposed to the coating liquid. However, as shown in Fig. 1, a recessed portion having a depth at which the fixing bolts 37 can be embedded is provided on the back surface of the support portion 40, and the opening portion is made of a vinyl chloride sheet or It is desirable to apply masking or the like. In addition, it is preferable that the portion exposed to the plating solution by the shaft portion 34 is coated with Teflon (trademark) or an epoxy resin.
又，基板保持具30對於支撐部40之不相同的安裝方法是如下所述。首先，將支撐部40從正面能夠左右兩半地分割形成，而在其內部設置能夠埋設軸部34或是固定螺栓37的凹部。又，將事先安裝有固定螺栓37的軸部34，配置於被分割的支撐部40的左右任一方之構件的凹部，且對照另一方的支撐部40之構件加以固定，就完成基板保持具30對於支撐部40的安裝。依照此安裝方法，能夠將軸部34的全體長度作成較短，而且如上所述地，不必將支撐部40背側的開口部作成密封。 Further, the mounting method of the substrate holder 30 for the support portion 40 is as follows. First, the support portion 40 is formed by being divided into right and left halves from the front surface, and a recess portion into which the shaft portion 34 or the fixing bolt 37 can be embedded is provided inside. Moreover, the shaft portion 34 to which the fixing bolt 37 is attached in advance is disposed in the concave portion of the member of the right and left of the divided support portion 40, and is fixed to the member of the other support portion 40 to complete the substrate holder 30. For the mounting of the support portion 40. According to this mounting method, the entire length of the shaft portion 34 can be made short, and as described above, it is not necessary to seal the opening portion on the back side of the support portion 40.
以下，針對於通電至基板W的方法加以說明。由外部電源70被埋設於支撐部40，或是由背面拉入 的通電路徑71，是經由饋電刷(未予圖示)等而被通電至軸部34。軸部34是由：鈦材、磷青銅材、純銅材等導電性原材料所形成，同樣地被通電至以導電性原材料所形成的固定螺栓35。又，由固定保持構件31的固定螺栓35、36，經由被埋設於保持構件31內的通電路徑(未予圖示)，被通電至第1通電構件314。 Hereinafter, a method of applying electricity to the substrate W will be described. The external power source 70 is embedded in the support portion 40 or pulled in from the back side. The energization path 71 is energized to the shaft portion 34 via a feed brush (not shown) or the like. The shaft portion 34 is formed of a conductive material such as a titanium material, a phosphor bronze material, or a pure copper material, and is similarly energized to a fixing bolt 35 formed of a conductive material. Moreover, the fixing bolts 35 and 36 of the fixed holding member 31 are energized to the first energizing member 314 via an energizing path (not shown) embedded in the holding member 31.
第9圖是夾持基板W而在裝配基板保持具30的狀態下表示通電形態的局部擴大圖。如圖所示地，在密封構件32之與保持構件31對向的面，設有環狀之密封襯墊322及第2通電構件323。密封襯墊322是斷面形狀形成為上下邊的長度不相同的大致呈匚字形狀，第2通電構件323是被形成為平板之圓板形狀，在其內周緣，突設有複數突出接點324。又，在裝配基板保持具30時，第2通電構件323的平板部為與基部311上的第1通電構件314接觸，而且突出接點324為與基板W的被鍍敷面接觸。藉此，從第1通電構件314經由第2通電構件323能夠進行通電至基板W。又，依照以上的通電方法，因藉由密封襯墊322，第1通電構件314及第2通電構件323是不會露出於鍍敷液中而能夠確實地進行通電至基板W，故較理想，惟本發明的鍍敷治具的通電方法是並不被限定於此者。 Fig. 9 is a partially enlarged view showing a state in which the substrate W is sandwiched and the substrate holder 30 is mounted. As shown in the figure, an annular seal gasket 322 and a second electric conduction member 323 are provided on a surface of the seal member 32 opposed to the holding member 31. The sealing gasket 322 has a substantially U-shaped cross-sectional shape in which the lengths of the upper and lower sides are different, and the second electric conducting member 323 is formed into a circular plate shape of a flat plate, and a plurality of protruding joints are protruded from the inner peripheral edge thereof. 324. Moreover, when the substrate holder 30 is mounted, the flat plate portion of the second electric conduction member 323 comes into contact with the first electric conduction member 314 on the base portion 311, and the protruding contact portion 324 comes into contact with the plated surface of the substrate W. Thereby, the first energization member 314 can be energized to the substrate W via the second energization member 323. In addition, it is preferable that the first conducting member 314 and the second conducting member 323 are not exposed to the plating liquid and can be reliably supplied to the substrate W by the sealing pad 322. However, the method of energizing the plating fixture of the present invention is not limited thereto.
以下，針對於基板保持具30的旋轉手段加以說明。作為本發明的鍍敷治具2的基板保持具30的旋轉手段，能夠採用於外框構件之外周面設置翼部或是凹部能 利用鍍敷液流者，及藉由驅動部進行旋轉的方法。第3圖(a)及第3圖(b)是於外框構件33的外周面突設翼部332者。如圖所示地，本實施形態者，是將被形成為複數矩形形狀的翼部332等間隔地設置於外框構件33的外周面。該翼部332是由外周面豎立成大致垂直的方式被突出，而且設置成側面觀看翼部成為水平。如此地，於外框構件33的外周面設置翼部者，是藉由鍍敷液流踫到此翼部332而產生旋轉力，藉此，成為能夠旋轉基板保持具30。 Hereinafter, the means for rotating the substrate holder 30 will be described. The rotation means of the substrate holder 30 of the plating jig 2 of the present invention can be provided with a wing portion or a concave portion on the outer peripheral surface of the outer frame member. A method of using a plating liquid flow and rotating by a driving portion. 3(a) and 3(b) show the wing portion 332 protruding from the outer peripheral surface of the outer frame member 33. As shown in the figure, in the present embodiment, the wing portions 332 formed in a plurality of rectangular shapes are provided at equal intervals on the outer circumferential surface of the outer frame member 33. The wing portion 332 is protruded in such a manner that the outer peripheral surface is erected substantially vertically, and is disposed such that the wing portion is horizontally viewed. As described above, when the wing portion is provided on the outer circumferential surface of the outer frame member 33, the plating fluid flows to the wing portion 332 to generate a rotational force, whereby the substrate holder 30 can be rotated.
第4圖(a)及第4圖(b)是表示不相同形態的翼部333。如圖所示地，翼部333是大致垂直地豎立於外框構件33之外周面的方式被突出，惟翼並不是水平，是從前方至後方朝下傾斜地給予角度而被設置。如此地，藉由於翼部333給予角度，能夠更有效果地捕捉來自前方的鍍敷液流。又，如第6圖(a)及第6圖(b)所示地，並不是將翼部形成為矩形形狀，而是形成為大致呈匚字形狀或是大致呈V字形狀者，能夠更容易捕捉鍍敷液流。 Fig. 4 (a) and Fig. 4 (b) show wing portions 333 of different shapes. As shown in the figure, the wing portion 333 is protruded in such a manner as to stand substantially perpendicularly on the outer peripheral surface of the outer frame member 33, and the wing is not horizontal, and is provided at an angle obliquely downward from the front to the rear. In this way, by the angle given by the wing portion 333, the flow of the plating liquid from the front can be more effectively captured. Further, as shown in Fig. 6 (a) and Fig. 6 (b), the wing portion is not formed in a rectangular shape but is formed in a substantially U shape or a substantially V shape. Easy to capture the plating flow.
第5圖(a)及第5圖(b)是於外框構件33之外周面凹設有凹部334者。如圖所示地，在本實施形態，是將複數矩形的凹部334等間隔地設置於外框構件33之外周面。如此地，於外周面設置凹部334，使得凹部是與翼部同樣地捕捉鍍敷液流而產生旋轉力，藉此，能夠旋轉基板保持具30。 Figs. 5(a) and 5(b) show the concave portion 334 recessed on the outer peripheral surface of the outer frame member 33. As shown in the figure, in the present embodiment, the plurality of rectangular recessed portions 334 are provided at equal intervals on the outer peripheral surface of the outer frame member 33. In this manner, the concave portion 334 is provided on the outer peripheral surface such that the concave portion captures the plating liquid flow in the same manner as the wing portion to generate a rotational force, whereby the substrate holder 30 can be rotated.
第7圖是藉由驅動部來旋轉基板保持具30的第1形態。如圖所示地，從電動馬達等驅動部90經由軸 91，使得旋轉力被傳遞至安裝於軸部34的齒輪93。齒輪34是將軸91的旋轉力變換成軸部34的旋轉而進行傳遞。藉此，使得旋轉基板保持具30的情形成為可能。又，驅動部90是直接設於支撐部40也可以，或是作成由安裝部92能夠拆卸，而在鍍敷槽外另外設置支撐部也可以。還有，旋轉力從驅動部90傳遞至軸部34，是如本實施形態地，除了組合軸與齒輪之外，組合複數齒輪構件，或是皮帶所為之傳遞也可以。 Fig. 7 is a first embodiment in which the substrate holder 30 is rotated by the driving unit. As shown in the figure, from the drive unit 90 such as an electric motor via the shaft 91, the rotational force is transmitted to the gear 93 mounted to the shaft portion 34. The gear 34 transmits the rotation force of the shaft 91 into the rotation of the shaft portion 34. Thereby, it is possible to rotate the substrate holder 30. Further, the drive unit 90 may be provided directly on the support portion 40 or may be detachable from the attachment portion 92, and a support portion may be additionally provided outside the plating groove. Further, the rotational force is transmitted from the driving unit 90 to the shaft portion 34. In the present embodiment, in addition to the combination of the shaft and the gear, a plurality of gear members may be combined or the belt may be transferred.
第8圖是藉由驅動部來旋轉基板保持具30的第2形態。如圖所示地，在基板保持具30之上部設有齒輪部94，在基板保持具30之外框構件設有與齒輪部94之齒輪相同節距的齒輪95。還有，旋轉力從驅動部90被傳遞的齒輪部94，是將旋轉力傳遞至外框構件的齒輪95，藉此，使得旋轉基板保持具30的情形成為可能。還有，旋轉力從驅動部90傳遞至齒輪部94，是如第1形態地，組合軸與齒輪也可以，或是，組合複數齒輪構件，或是由皮帶所為之傳遞也可以。 Fig. 8 is a second embodiment in which the substrate holder 30 is rotated by the driving unit. As shown in the figure, a gear portion 94 is provided on the upper portion of the substrate holder 30, and a frame member having the same pitch as the gear of the gear portion 94 is provided in the frame member outside the substrate holder 30. Further, the gear portion 94, to which the rotational force is transmitted from the driving portion 90, is a gear 95 that transmits the rotational force to the outer frame member, thereby making it possible to rotate the substrate holder 30. Further, the rotational force is transmitted from the driving unit 90 to the gear portion 94. The first embodiment may be a combination of a shaft and a gear, or a plurality of gear members may be combined or transmitted by a belt.
又，針對於基板保持具30的旋轉手段，並不被限定於將翼部或是凹部設置於上述的外框構件33之外周面而利用鍍敷液流者，及藉由驅動部來進行旋轉的方法的任一者，而互相地組合此些者也可以。亦即，將翼部或是凹部設置於外框構件33之外周面，又，藉由外部的驅動部賦予旋轉力也可以。如此地，藉由兩種類之不相同的旋轉力，成為使旋轉更穩定，能夠抑制耗電。 Further, the means for rotating the substrate holder 30 is not limited to the case where the wing portion or the recessed portion is provided on the outer peripheral surface of the outer frame member 33, and the plating liquid flows, and the driving portion rotates. Any of the methods, and combining them with each other is also possible. In other words, the wing portion or the recessed portion may be provided on the outer peripheral surface of the outer frame member 33, and the external driving portion may be provided with a rotational force. As described above, the rotation force is made more stable by the two types of different rotational forces, and power consumption can be suppressed.
以下，針對於利用本發明的鍍敷治具2的鍍敷裝置加以說明。第2圖是安裝本發明的鍍敷治具2的鍍敷裝置1的概略構成圖。如圖所示地，本發明的鍍敷裝置1是具備：鍍敷槽10、及設於鍍敷槽10之外周的溢流槽20，在鍍敷槽10之側壁11安裝有鍍敷治具2，而在鍍敷槽10內使得陽極板50設置於與被保持於基板保持具30的基板W的被鍍敷面對向的位置。又，在陽極板50與基板保持具30之間，如本實施形態地，設置葉片60也可以。該葉片60是藉由對於基板W的被鍍敷處理面平行地進行往返移動，能夠將沿著基板的被鍍敷處理面的鍍敷液流作成均等之故，因而與具有旋轉手段的基板保持具30相輔相成，能夠形成更均勻之膜厚的鍍敷膜，較理想。 Hereinafter, a plating apparatus using the plating jig 2 of the present invention will be described. Fig. 2 is a schematic configuration diagram of a plating apparatus 1 to which the plating jig 2 of the present invention is attached. As shown in the figure, the plating apparatus 1 of the present invention includes a plating tank 10 and an overflow tank 20 provided on the outer circumference of the plating tank 10, and a plating fixture is attached to the side wall 11 of the plating tank 10. 2, the anode plate 50 is placed in the plating tank 10 at a position facing the plated surface of the substrate W held by the substrate holder 30. Further, between the anode plate 50 and the substrate holder 30, the blade 60 may be provided as in the present embodiment. The blade 60 is reciprocally moved in parallel with the surface to be plated of the substrate W, so that the flow of the plating liquid along the surface to be plated of the substrate can be made uniform, and thus the substrate having the rotating means can be held. It is preferable to have a 30-phase complementary phase to form a more uniform film thickness.
又，在鍍敷槽10之底部設有配管80所連接的噴出口12，而將鍍敷液從該噴出口12供應至鍍敷槽10內。還有，在表示於第1圖及第3圖至第6圖的外框構件之外周面設置翼部或是凹部，利用鍍敷液流的形態的治具時，將噴出口12設置於鍍敷液流有效將旋轉力傳遞至外框構件33之翼部或是凹部的位置較理想。具體而言，基板保持具30之下方，配置於與基板保持具30成為平行的方向較理想。此時，在基板保持具30之左右使得鍍敷液流的強度不相同的方式，藉由將噴出口12作成在單一側，或是將來自噴出口12的噴出量設置成左右有差異，能夠更有效率地發生旋轉力，故較理想。 Further, a discharge port 12 to which the pipe 80 is connected is provided at the bottom of the plating tank 10, and the plating liquid is supplied from the discharge port 12 to the plating tank 10. In addition, when the outer peripheral member of the outer frame member shown in FIG. 1 and FIG. 3 to FIG. 6 is provided with a wing portion or a concave portion, and the jig for the flow of the plating liquid is used, the discharge port 12 is plated. It is preferable that the dressing flow is effective to transmit the rotational force to the wing portion or the concave portion of the outer frame member 33. Specifically, it is preferably disposed below the substrate holder 30 in a direction parallel to the substrate holder 30. In this case, in the case where the strength of the plating liquid flow is different between the left and right sides of the substrate holder 30, the discharge port 12 can be formed on a single side, or the discharge amount from the discharge port 12 can be set to be different from left to right. It is ideal because the rotational force occurs efficiently.
2‧‧‧鍍敷治具 2‧‧‧ plating fixture
31‧‧‧保持構件 31‧‧‧ Keeping components
32‧‧‧密封構件 32‧‧‧ Sealing members
33‧‧‧外框構件 33‧‧‧Frame components
34‧‧‧軸部 34‧‧‧Axis
35‧‧‧固定螺栓 35‧‧‧ fixing bolt
36‧‧‧固定螺栓 36‧‧‧ fixing bolts
37‧‧‧固定螺栓 37‧‧‧ fixing bolts
40‧‧‧支撐部 40‧‧‧Support
311‧‧‧基部 311‧‧‧ base
312‧‧‧基板裝載面 312‧‧‧Substrate loading surface
313‧‧‧孔部 313‧‧‧ Hole Department
314‧‧‧第1通電構件 314‧‧‧1st energized component
321‧‧‧開口部 321‧‧‧ openings
331‧‧‧連結部 331‧‧‧Connecting Department
332‧‧‧翼部 332‧‧‧wing
W‧‧‧基板 W‧‧‧Substrate
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/060655 WO2013157129A1 (en) | 2012-04-20 | 2012-04-20 | Substrate plating jig and plating device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201348528A TW201348528A (en) | 2013-12-01 |
| TWI586852B true TWI586852B (en) | 2017-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102108660A TWI586852B (en) | 2012-04-20 | 2013-03-12 | A substrate plating jig and a plating device for plating the jig with the substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150068890A1 (en) |
| JP (1) | JP5981534B2 (en) |
| CN (1) | CN104220648B (en) |
| TW (1) | TWI586852B (en) |
| WO (1) | WO2013157129A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6472693B2 (en) | 2015-03-24 | 2019-02-20 | 株式会社荏原製作所 | Substrate processing equipment |
| JP6596372B2 (en) * | 2016-03-22 | 2019-10-23 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
| JP6709727B2 (en) * | 2016-12-14 | 2020-06-17 | 株式会社荏原製作所 | Electrolytic plating equipment |
| WO2019204512A1 (en) * | 2018-04-20 | 2019-10-24 | Applied Materials, Inc. | Seal apparatus for an electroplating system |
| JP7085968B2 (en) * | 2018-11-15 | 2022-06-17 | 株式会社荏原製作所 | Board holder, plating equipment and board plating method |
| JP7256027B2 (en) * | 2019-02-20 | 2023-04-11 | 株式会社荏原製作所 | Substrate holder and plating apparatus equipped with the substrate holder |
| EP3821060A1 (en) | 2019-02-21 | 2021-05-19 | Markus Hacksteiner | Assembly for electrically contacting a microchip substrate |
| CN211479988U (en) * | 2019-10-14 | 2020-09-11 | Pyxis Cf私人有限公司 | Wet processing equipment |
| JP7354020B2 (en) * | 2020-03-04 | 2023-10-02 | 株式会社荏原製作所 | Plating equipment and resistors |
| CN111705355A (en) * | 2020-07-02 | 2020-09-25 | 上海戴丰科技有限公司 | Vertical rotary electroplating jig for wafer and electroplating device |
| JP6899041B1 (en) * | 2020-12-21 | 2021-07-07 | 株式会社荏原製作所 | Plating equipment and plating solution stirring method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201211320A (en) * | 2010-09-06 | 2012-03-16 | Grand Plastic Technology Co Ltd | Wafer clamping apparatus with vertical haning arm for plating |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU7403694A (en) * | 1994-07-19 | 1996-02-16 | American Plating Systems, Inc. | Electrolytic plating apparatus and method |
| US5670034A (en) * | 1995-07-11 | 1997-09-23 | American Plating Systems | Reciprocating anode electrolytic plating apparatus and method |
| JP2000239898A (en) * | 1999-02-22 | 2000-09-05 | Ebara Corp | Plating device |
| JP3629396B2 (en) * | 2000-03-07 | 2005-03-16 | 株式会社荏原製作所 | Substrate plating jig |
| JP2002327291A (en) * | 2001-04-26 | 2002-11-15 | Yamamoto Mekki Shikenki:Kk | Electroplating device |
| JP2002363794A (en) * | 2001-06-01 | 2002-12-18 | Ebara Corp | Substrate holder and plating device |
| US20040028837A1 (en) * | 2002-06-28 | 2004-02-12 | Tokyo Electron Limited | Method and apparatus for plasma processing |
| JP2004300462A (en) * | 2003-03-28 | 2004-10-28 | Ebara Corp | Plating method and plating apparatus |
| JP5184308B2 (en) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | Plating apparatus and plating method |
-
2012
- 2012-04-20 US US14/394,806 patent/US20150068890A1/en not_active Abandoned
- 2012-04-20 JP JP2014511052A patent/JP5981534B2/en not_active Expired - Fee Related
- 2012-04-20 WO PCT/JP2012/060655 patent/WO2013157129A1/en active Application Filing
- 2012-04-20 CN CN201280072382.8A patent/CN104220648B/en not_active Expired - Fee Related
-
2013
- 2013-03-12 TW TW102108660A patent/TWI586852B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201211320A (en) * | 2010-09-06 | 2012-03-16 | Grand Plastic Technology Co Ltd | Wafer clamping apparatus with vertical haning arm for plating |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104220648B (en) | 2017-09-05 |
| WO2013157129A1 (en) | 2013-10-24 |
| JP5981534B2 (en) | 2016-08-31 |
| CN104220648A (en) | 2014-12-17 |
| TW201348528A (en) | 2013-12-01 |
| JPWO2013157129A1 (en) | 2015-12-21 |
| US20150068890A1 (en) | 2015-03-12 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |