TWI584702B - 製作具有形成於ｌｃｐ焊料遮罩上的薄膜電阻器之電子裝置的方法及相關裝置 - Google Patents

製作具有形成於ｌｃｐ焊料遮罩上的薄膜電阻器之電子裝置的方法及相關裝置 Download PDF

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TWI584702B
TWI584702B TW104131013A TW104131013A TWI584702B TW I584702 B TWI584702 B TW I584702B TW 104131013 A TW104131013 A TW 104131013A TW 104131013 A TW104131013 A TW 104131013A TW I584702 B TWI584702 B TW I584702B
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substrate
thin film
lcp
solder
film resistor
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路易斯 喬瑟夫 二世 倫狄克
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賀利實公司
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Description

製作具有形成於LCP焊料遮罩上的薄膜電阻器之電子裝置的方法及相關裝置
本發明係關於電子裝置製造之領域，且更特定言之，係關於製作包含液晶聚合物焊料遮罩之電子裝置的方法及相關裝置。
特別期望能將行動無線通信裝置之大小減小至例如較薄的外觀尺寸。減小裝置之大小通常需要基板及耦接至基板之組件較薄。此外，亦可期望例如藉由提供較簡單之製造過程而降低製造成本。舉例而言，降低基板製造成本之一個方法可包含使用雙面可撓性基板及焊料遮罩或上覆層(coverlay)，作為與多層可撓性基板及上覆層相比之較低廉選項。
此外，與高成本問題驅動的非密封封裝之需要有關的在汽車工業中增多使用相對高頻雷達裝置(例如，停車感測器、備用感測器、盲點感測器，等)亦可能增加對於輕質、低成本、能進行高頻封裝及基板材料之需要。舉例而言，液晶聚合物(LCP)可認為係一種此類材料。
較薄組件之使用可能通常需要使用較高百分比之裸晶粒及/或覆晶組件(舉例而言)。因此，將彼等組件安裝至基板而不增大製造成本可能愈加成為問題。具有厚度縮小之主動及被動組件之超薄可撓性電路因此可用以解決此問題。薄膜被動裝置(例如薄膜電阻器)通常可使用達數十年。然而，薄膜被動裝置通常必須嵌入於多層印刷電路板(PCB)內，其對於例如某些可撓性電路可能係不可能的。
用於可撓性電路之現有上覆層材料通常需要基於黏著劑之接合，其包含在襯墊周圍所開設的相對大孔隙以用於可撓性電路與電子總成之間的後續電氣互連。除了保護撓性電路上之下伏部分之外，此等上覆層材料因此通常允許添加極少(若存在)額外功能性。因此，需要包含額外裝置功能性之額外製造方法。
一種製作電子裝置之方法可包含：在一基板上形成可包含複數個焊接墊之至少一個電路層；及形成其中具有複數個遮罩開口的至少一個液晶聚合物(LCP)焊料遮罩。所述方法亦可包含：在所述LCP焊料遮罩上形成至少一個薄膜電阻器；及將所述至少一個LCP焊料遮罩耦接至所述基板，以使得所述至少一個薄膜電阻器耦接至所述至少一個電路層且使得所述複數個焊接墊與所述複數個遮罩開口對準。因此，電子裝置之厚度可得以減小，同時維持功能性及穩健性。
所述至少一個LCP焊料遮罩可耦接至所述基板，以使得所述至少一個薄膜電阻器包夾於(例如)所述至少一個LCP焊料遮罩與所述基板之間。形成所述至少一個電 路層可包含形成藉由所述基板之對置表面承載之複數個電路層，且形成所述至少一個LCP焊料遮罩可包含形成複數個LCP焊料遮罩。形成所述至少一個薄膜電阻器可包含在所述複數個LCP焊料遮罩中之每一者上形成至少一個薄膜電阻器，且所述複數個LCP焊料遮罩中之每一者可耦接至(例如)所述基板之所述對置表面。每一LCP焊料遮罩可耦接至所述基板之所述表面中之一各別者以使得所述複數個薄膜電阻器包夾於所述複數個LCP焊料遮罩與所述基板之間。
所述至少一個薄膜電阻器可藉由例如濺鍍而形成於所述LCP焊料遮罩上。所述方法可進一步包含將一電路組件附接至所述複數個焊接墊中之對應焊接墊。
所述方法可進一步包含形成穿過所述基板之至少一個導電通孔。所述基板可包含(例如)LCP基板。所述基板可包含可撓性印刷電路板(PCB)。
一裝置態樣係針對一種電子裝置，其可包含一基板及至少一個電路層，所述至少一個電路層包含藉由所述基板承載之複數個焊接墊。所述電子裝置亦包含其中具有複數個遮罩開口之至少一個液晶聚合物(LCP)焊料遮罩及藉由所述LCP焊料遮罩承載之至少一個薄膜電阻器。所述至少一個LCP焊料遮罩可在無黏接層之情況下直接耦接至所述基板，以使得所述至少一個薄膜電阻器直接耦接至所述至少一個電路層且使得所述複數個焊接墊與所述複數個遮罩開口對準。
20‧‧‧電子裝置
21a‧‧‧電路層
21b‧‧‧電路層
22a‧‧‧焊接墊
22b‧‧‧焊接墊
23‧‧‧基板
24a‧‧‧LCP焊料遮罩
24b‧‧‧LCP焊料遮罩
25a‧‧‧遮罩開口
25b‧‧‧遮罩開口
26a‧‧‧薄膜電阻器
26b‧‧‧薄膜電阻器
32‧‧‧導電通孔
33‧‧‧電路組件
34‧‧‧焊料
50‧‧‧流程圖
52~66‧‧‧區塊
120‧‧‧電子裝置
121‧‧‧電路層
122‧‧‧焊接墊
123‧‧‧基板
124‧‧‧焊料遮罩
125‧‧‧遮罩開口
126‧‧‧薄膜電阻器
132‧‧‧導電通孔
133‧‧‧電路組件
134‧‧‧焊料
141‧‧‧黏接層
142‧‧‧開口
143‧‧‧接合膜層
圖1為根據先前技術之電子裝置之部分的分解圖示意圖。
圖2為圖1之電子裝置的一部分之經組裝示意圖。
圖3為根據先前技術之電子裝置之部分的分解圖示意圖。
圖4為圖3之電子裝置的一部分之經組裝示意圖。
圖5為製作圖4中之電子裝置的方法之流程圖。
現將在下文中參考附圖更全面地描述本發明，其中展示本發明之較佳實施例。然而，本發明可以許多不同形式實施且不應解釋為限制本文中所闡述之實施例。相反地，此等實施例係為使本揭示是詳盡且完整的，且將把本發明的範疇完整地傳達給本領域中熟習此項技術者。相同編號始終指代相同元件。
首先參考圖1及圖2，現在描述根據先前技術方法製作之電子裝置120。各自包含焊接墊122之電路層121藉由基板123承載。導電通孔132延伸穿過基板123且將焊接墊122耦接於基板之對置表面上。黏接層141藉由基板123承載且其中具有開口142。其中具有遮罩開口125之焊料遮罩124或上覆層藉由黏接層141承載。遮罩開口125與黏接層開口142對準。
電路層121各自包含藉由基板123承載、耦接至對應焊接墊122之薄膜電阻器126。每一薄膜電阻器126通常形成於(例如)銅基板上，且在多層層疊期間耦接在包含銅基板之對應電路層121內。因為非常期望能保護或嵌入每一薄膜電阻器126，因此例如呈接合膜層143形式之另一黏接層形成或耦接於每一薄膜電阻器上。換言之，非常期望能嵌入每一薄膜電阻器126。在此情況下，接合膜層143包夾於鄰近 基板123(或更特定言之，鄰近電路層121)之間。電路組件133(例如)使用焊料134耦接至對應焊接墊122。
關於圖1及圖2描述之先前技術方法的缺點為，其使用多個層以達成薄膜電阻器126之所要保護或嵌入，例如，黏接層141、接合膜層143及兩個基板123。因此，此等層增大電子裝置120之總體大小。
首先參考圖3及圖4，及開始於區塊52處的圖5中之流程圖50，其描述製作電子裝置20之方法。所述方法包含，在區塊54處，形成穿過基板23之導電通孔32。在區塊56處，所述方法亦包含在基板23之對置表面上形成各自包含焊接墊22a、22b之一對電路層21a、21b。基板23可為(例如)液晶聚合物(LCP)基板。基板23可替代或另外為一可撓性印刷電路板(PCB)。當然，基板23可為(例如)另一類型之基板。
所述方法亦包含形成各自中具有遮罩開口25a、25b或孔隙之一對LCP焊料遮罩24a、24b或上覆層(區塊58)。可根據本領域中熟習此項技術者將瞭解的數個技術中的任一者形成LCP焊料遮罩24a、24b。此外，儘管說明了一對LCP焊料遮罩24a、24b，但將瞭解，可使用任何數目個LCP焊料遮罩。
在區塊60處，所述方法亦包含在LCP焊料遮罩24a、24b中之每一者上形成薄膜電阻器26a、26b。除了其他材料(例如SiCr、TaN、NiCrAlSi等)之外，每一薄膜電阻器26a、26b可包含鎳及鉻，例如鎳鉻合金。應瞭解，儘管說明兩個薄膜電阻器26a、26b，但可在LCP焊料遮罩24a、24b 中之每一者上形成任何數目個薄膜電阻器。每一薄膜電阻器26a、26b可藉由(例如)濺鍍而形成於各別LCP焊料遮罩24a、24b上。當然，每一薄膜電阻器26a、26b可藉由本領域中熟習此項技術者將瞭解的不同或其他技術而形成於LCP焊料遮罩24a、24b上。
所述方法進一步包含，在區塊62處，將所述對LCP焊料遮罩24a、24b中之每一者耦接至基板23之對置表面，以使得每一薄膜電阻器26a、26b耦接至所述對電路層21a、21b中之一各別者且使得焊接墊22a、22b中之每一者與各別遮罩開口25a、25b對準。更特定言之，每一LCP焊料遮罩24a、24b耦接至基板23之表面中之一各別者，以使得薄膜電阻器26a、26b包夾於LCP焊料遮罩與基板之間。換言之，LCP焊料遮罩24a、24b直接耦接至基板23且無黏接層介於其間。
在區塊64處，所述方法亦包含將電路組件33附接至對應焊接墊22a。電路組件可為(例如)積體電路(IC)。電路組件33可為本領域中熟習此項技術者將瞭解的另一類型之電路組件。電路組件可利用焊料34(例如焊球)而耦接至各別焊接墊22a。所述方法在區塊66處結束。
實際上，相對於先前技術電子裝置120，電子裝置20之厚度顯著減小，此係因為電子裝置包含一個而非兩個基板23及電路層21，不包含接合膜層143，且不包含黏接層141。因此，在LCP焊料遮罩24上形成薄膜電阻器26可認為係在直接於LCP焊料遮罩上形成薄膜電阻器時使得LCP焊料遮罩24起作用。
本發明的裝置態樣係指電子裝置20，其包含基板23及包含藉由基板承載的複數個焊接墊22a、22b之至少一個電路層21a、21b。電子裝置20亦包含其中具有複數個遮罩開口25a、25b之至少一個液晶聚合物(LCP)焊料遮罩24a、24b及藉由LCP焊料遮罩承載之至少一個薄膜電阻器26a、26b。所述至少一個LCP焊料遮罩24a、24b亦在無黏接層的情況下直接耦接至基板23，以使得所述至少一個薄膜電阻器26a、26b直接耦接至至少一個電路層21a、21b且使得所述複數個焊接墊22a、22b與所述複數個遮罩開口25a、25b對準。
本領域中熟習此項技術者將瞭解，藉由本文所述的方法製作之電子裝置20可尤其有利於超薄電子基板，諸如使用於非常期望能薄型化的行動電話及平板電腦中之基板。實際上，本文所述的方法提供無黏著劑接合機制，其支援增大LCP焊料遮罩24a、24b或上覆層之功能性。舉例而言，藉由本文所述的方法製作之電子裝置20可達成近厄米性(near hermiticity)、相對高抗張強度及耐磨性，其可用來保護下伏薄膜電阻器免受損壞同時提供電阻器值之穩定性，例如通常在25歐姆每平方(OPS)至150 OPS之範圍內。亦可導致密度增大的信號投送及3D整合，以及增大的寬頻介電性質，其通常在曝露於濕氣之後並不改變。相對於熱膨脹係數(CTE)，根據本文所述的方法製作之電子裝置可與最常見積體電路晶粒材料相對相容，且可通常在(例如)人體內係化學惰性及生物相容性的。
具有LCP焊料遮罩之電子裝置及相關方法的進一步詳情可見於美國專利第8,693,203號及第8,472,207號以 及美國專利申請公開案第2012/0182702號中，所有各案讓渡給本申請案之受讓人、具有共同發明人，且所有各案之全文特此以引用之方式併入。
得益於前述描述及相關聯圖式中呈現的教示之熟習此項技術者將想到許多修改及本發明之其他實施例。因此，應理解，本發明不限於所揭示之特定實施例，且修改及實施例意欲包含在所附申請專利範圍之範疇內。
20‧‧‧電子裝置
21a‧‧‧電路層
21b‧‧‧電路層
22a‧‧‧焊接墊
22b‧‧‧焊接墊
23‧‧‧基板
24a‧‧‧LCP焊料遮罩
24b‧‧‧LCP焊料遮罩
25a‧‧‧遮罩開口
25b‧‧‧遮罩開口
26a‧‧‧薄膜電阻器
26b‧‧‧薄膜電阻器
32‧‧‧導電通孔

Claims (9)

  1. 一種製作一電子裝置之方法，其包括：在一基板上形成包括複數個焊接墊(solder pads)之至少一個電路層，該基板具有相對的(opposing)第一及第二主表面；形成複數個液晶聚合物(LCP)焊料遮罩(solder mask)，該等LCP焊料遮罩之各者由該基板之該第一及第二主表面之各別一者所承載，且該等LCP焊料遮罩之各者均具有相對的第一及第二主表面及複數個遮罩開口於其中，該複數個遮罩開口延伸於該LCP焊料遮罩的該第一及第二主表面之間；直接在該複數個LCP焊料遮罩之至少一者之該第一主表面上形成至少一個薄膜電阻器；及將該複數個LCP焊料遮罩耦接至該基板，以使得該至少一個薄膜電阻器耦接至該至少一個電路層且使得該複數個焊接墊與該複數個遮罩開口對準。
  2. 如申請專利範圍第1項所述的方法，其中該複數個LCP焊料遮罩之至少一者耦接至該基板，以使得該至少一個薄膜電阻器包夾(sandwiched)於該複數個LCP焊料遮罩之至少一個與該基板之間。
  3. 如申請專利範圍第1項所述的方法，其中形成該至少一個薄膜電阻器包括在該複數個LCP焊料遮罩中之每一者上形成至少一個薄膜電阻器。
  4. 如申請專利範圍第3項所述的方法，其中每一LCP焊料遮罩耦接至該基板之該第一及第二主表面中之該各別一 者，以使得該複數個薄膜電阻器包夾於該複數個LCP焊料遮罩與該基板之間。
  5. 如申請專利範圍第1項所述的方法，其中該至少一個薄膜電阻器係藉由濺鍍而形成於該至少一個LCP焊料遮罩上。
  6. 如申請專利範圍第1項所述的方法，其進一步包括將一電路組件附接至該複數個焊接墊中之對應焊接墊。
  7. 如申請專利範圍第1項所述的方法，其進一步包括形成穿過該基板之至少一個導電通孔(conductive via)。
  8. 如申請專利範圍第1項所述的方法，其中該基板包括一LCP基板。
  9. 如申請專利範圍第1項所述的方法，其中該基板包括一可撓性印刷電路板(PCB)。
TW104131013A 2014-09-19 2015-09-18 製作具有形成於ｌｃｐ焊料遮罩上的薄膜電阻器之電子裝置的方法及相關裝置 TWI584702B (zh)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10276465B2 (en) * 2016-09-29 2019-04-30 Mediatek Inc. Semiconductor package assembly
CN111029326B (zh) * 2018-10-09 2022-04-26 西安邮电大学 基于lcp工艺的凸点互连结构
CN110400741B (zh) * 2019-07-25 2022-05-27 上海航天电子通讯设备研究所 一种lcp柔性基板无源阻容元件的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040108937A1 (en) * 2002-12-04 2004-06-10 Craig Ernsberger Ball grid array resistor network
CN100438723C (zh) * 2003-11-05 2008-11-26 三星电机株式会社 制造具有嵌入电阻的印刷电路板的方法
US20100289132A1 (en) * 2009-05-13 2010-11-18 Shih-Fu Huang Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package
US20120182702A1 (en) * 2011-01-14 2012-07-19 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask and related devices

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761860A (en) * 1970-05-20 1973-09-25 Alps Electric Co Ltd Printed circuit resistor
JP2616515B2 (ja) * 1991-06-26 1997-06-04 日本電気株式会社 厚膜抵抗体，厚膜印刷配線基板およびその製造方法ならびに厚膜混成集積回路
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
US6239482B1 (en) * 1999-06-21 2001-05-29 General Electric Company Integrated circuit package including window frame
US6242282B1 (en) * 1999-10-04 2001-06-05 General Electric Company Circuit chip package and fabrication method
KR20020030903A (ko) 2000-10-18 2002-04-26 윤종용 사선형 퓨즈를 가진 반도체 장치
DE10295940B4 (de) * 2001-01-31 2013-04-04 Sony Corp. Verfahren zur Herstellung einer Halbleitereinrichtung mit einem plattenförmigen Schaltungsblock
US6531206B2 (en) * 2001-02-07 2003-03-11 3M Innovative Properties Company Microstructured surface film assembly for liquid acquisition and transport
TW518616B (en) * 2001-06-01 2003-01-21 Phoenix Prec Technology Corp Method of manufacturing multi-layer circuit board with embedded passive device
KR100463434B1 (ko) * 2001-12-04 2004-12-23 삼성전기주식회사 매립된 레지스터를 갖는 인쇄회로기판 및 이의 제조방법
TWI266568B (en) * 2004-03-08 2006-11-11 Brain Power Co Method for manufacturing embedded thin film resistor on printed circuit board
KR20060111962A (ko) 2005-04-26 2006-10-31 삼성전자주식회사 반도체 기판 보관 장치 및 이를 구비하는 반도체 기판 가공설비
US7202552B2 (en) 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
WO2007047627A2 (en) * 2005-10-14 2007-04-26 Georgia Tech Research Corporation Process development and optimization of embedded thin film resistor on body
US9000869B2 (en) * 2007-08-14 2015-04-07 Wemtec, Inc. Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
KR100867148B1 (ko) * 2007-09-28 2008-11-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5376930B2 (ja) * 2008-12-19 2013-12-25 キヤノン株式会社 液体吐出ヘッドの製造方法
US8472207B2 (en) * 2011-01-14 2013-06-25 Harris Corporation Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
US8693203B2 (en) * 2011-01-14 2014-04-08 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
US8867219B2 (en) * 2011-01-14 2014-10-21 Harris Corporation Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
KR101298189B1 (ko) 2011-05-11 2013-08-20 에스케이하이닉스 주식회사 상변화 메모리 소자 및 그 제조 방법
US8687369B2 (en) 2012-02-20 2014-04-01 Apple Inc. Apparatus for creating resistive pathways
US20130249073A1 (en) * 2012-03-22 2013-09-26 Hsin Hung Chen Integrated circuit packaging system with support structure and method of manufacture thereof
US8877558B2 (en) * 2013-02-07 2014-11-04 Harris Corporation Method for making electronic device with liquid crystal polymer and related devices
US8828503B1 (en) * 2013-02-28 2014-09-09 Eastman Kodak Company Making multi-layer micro-wire structure
US20150085456A1 (en) * 2013-03-05 2015-03-26 Ronald Steven Cok Imprinted multi-level micro-wire circuit structure
US9277642B2 (en) * 2013-03-05 2016-03-01 Eastman Kodak Company Imprinted bi-layer micro-structure method
US20140308435A1 (en) * 2013-04-15 2014-10-16 Mitchell Stewart Burberry Hybrid single-side touch screen method
US8895429B2 (en) * 2013-03-05 2014-11-25 Eastman Kodak Company Micro-channel structure with variable depths
KR20150002492A (ko) * 2013-06-28 2015-01-07 쿄세라 서킷 솔루션즈 가부시키가이샤 배선 기판
US9293438B2 (en) * 2013-07-03 2016-03-22 Harris Corporation Method for making electronic device with cover layer with openings and related devices
US20150013901A1 (en) * 2013-07-11 2015-01-15 Hsio Technologies, Llc Matrix defined electrical circuit structure
US9161456B1 (en) * 2014-09-03 2015-10-13 Eastman Kodak Company Making imprinted micro-wire rib structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040108937A1 (en) * 2002-12-04 2004-06-10 Craig Ernsberger Ball grid array resistor network
CN100438723C (zh) * 2003-11-05 2008-11-26 三星电机株式会社 制造具有嵌入电阻的印刷电路板的方法
US20100289132A1 (en) * 2009-05-13 2010-11-18 Shih-Fu Huang Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package
US20120182702A1 (en) * 2011-01-14 2012-07-19 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask and related devices

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