TWI584105B - Memory module and manufacturing method thereof - Google Patents
Memory module and manufacturing method thereof Download PDFInfo
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- TWI584105B TWI584105B TW105100705A TW105100705A TWI584105B TW I584105 B TWI584105 B TW I584105B TW 105100705 A TW105100705 A TW 105100705A TW 105100705 A TW105100705 A TW 105100705A TW I584105 B TWI584105 B TW I584105B
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- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 127
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 34
- 229910052737 gold Inorganic materials 0.000 claims description 34
- 239000010931 gold Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 210000004508 polar body Anatomy 0.000 claims 1
- 230000000007 visual effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000001747 exhibiting effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/32—Monitoring with visual or acoustical indication of the functioning of the machine
- G06F11/324—Display of status information
- G06F11/325—Display of status information by lamps or LED's
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Description
本發明係有關於一種記憶體模組及其製造方法，尤其是在基板上貼附不透光且具有多個開孔或鏤空標記的遮光膜，並將發光二極體配置在相對應開孔中，使得發光二極體的光線可經開孔而射出或照射到鏤空標記而顯示特定的亮光圖案、文字或線條，進而表現出光線明暗色彩的不同變化，同時展現出整體記憶體模組的文字光影、影像光影之明亮變化，改善並增強視覺效應。 The invention relates to a memory module and a manufacturing method thereof, in particular to attaching a light-shielding film which is opaque and has a plurality of openings or hollow marks on a substrate, and arranging the light-emitting diodes in corresponding openings The light of the light-emitting diode can be emitted through the aperture or illuminated to the hollow mark to display a specific light pattern, text or line, thereby exhibiting different changes of the light and dark color, and exhibiting the overall memory module. Bright changes in text, light and shadow, improve and enhance visual effects.
在印刷電路板(PCB)及相關的電子業界，所使用的電路模組一般是包括電路基板、電路裝置，其中電路裝置經導電線路連接至電性插排，並在電路裝置及電性插排間的導電線路上設置多個發光二極體，使得發光二極體可在導電線路導通或不導通下而控制亮暗變化，提供標示或顯示目前電路模組的操作狀態。不過，發光二極體在無任何遮蔽物下容易使光線直射到眼睛，導致刺眼或不舒適。 In printed circuit boards (PCBs) and related electronics industries, the circuit modules generally used include circuit boards and circuit devices, wherein the circuit devices are connected to the electrical strips via conductive lines, and in the circuit devices and electrical strips. A plurality of light emitting diodes are disposed on the conductive lines, so that the light emitting diodes can control the light and dark changes when the conductive lines are turned on or off, and provide an indication or display the operating state of the current circuit module. However, the light-emitting diodes tend to direct light to the eyes without any obstruction, resulting in glare or discomfort.
為解決上述問題，在習用技術的M508053專利中，揭露一種電路模組，包括基板、至少一發光二極體、至少半透明之導光體，其中基板具有PCI-E插排，而PCI-E插排可用以電性插接至PCI-E插槽，而發光二極體是配置於基板中相對於PCI-E插排之一側，並電性連接至PCI-E插排，尤其導光體是至少覆蓋該至少一發光二極體。因此，發光二極體之光線可經導光體的折射與吸收後產生較為柔和與均勻的發射光，能避免發光二極體之光線直射眼睛而傷害視力。 In order to solve the above problem, in a conventional M508053 patent, a circuit module is disclosed, comprising a substrate, at least one light emitting diode, and at least a translucent light guide body, wherein the substrate has a PCI-E strip, and the PCI-E The socket can be electrically connected to the PCI-E slot, and the LED is disposed on one side of the substrate relative to the PCI-E strip, and is electrically connected to the PCI-E strip, especially the light guide. The body covers at least the at least one light emitting diode. Therefore, the light of the light-emitting diode can be softened and uniformly emitted by the light-refractive and absorbing light, and the light of the light-emitting diode can be prevented from directly hitting the eye and damaging the eyesight.
然而，上述習用技術的缺點在於需配置特定結構的導光體，使得整體構造複雜而不利於設計、生產、組裝，而且導光體會額外增加材料成本，嚴重影響產業的利用性，所以普及率始終無法提高。 However, the above-mentioned conventional technology has the disadvantage that the light guide body of a specific structure needs to be configured, so that the overall structure is complicated and is not advantageous for design, production, assembly, and the light guide body additionally increases the material cost, which seriously affects the utilization of the industry, so the popularity rate is always Can't improve.
因此，非常需要一種創新的記憶體模組及其製造方法，提供簡易的遮光方式，利用不透光且具有多個開孔或鏤空標記的遮光膜貼附到具有V型切口的基板上，且將發光二極體配置在相對應開孔中以使得發光二極體的光線可經開孔而射出或照射到鏤空標記而顯示特定的亮光圖案、文字或線條，藉以表現出光線明暗色彩的不同變化而展現出整體記憶體模組的文字光影、影像光影之明亮變化，改善、增強視覺效應而解決上述習用技術的所有問題。 Therefore, there is a great need for an innovative memory module and a method of fabricating the same that provides a simple light-shielding method for attaching to a substrate having a V-shaped slit using a light-shielding film that is opaque and has a plurality of openings or hollow marks, and Configuring the light-emitting diodes in the corresponding openings so that the light of the light-emitting diodes can be emitted through the openings or illuminated to the hollow marks to display a specific light pattern, text or lines, thereby showing the difference in light and dark colors. The change reveals the text light and shadow of the overall memory module, the bright change of the image light and shadow, and improves and enhances the visual effect to solve all the problems of the above-mentioned conventional technology.
本發明之主要目的在於提供一種記憶體模組，主要包括基板、至少一記憶體、遮光膜以及至少一發光二極體。基板具透光性及電氣絕緣性並包含電氣線路，而且基板的上部邊緣具有切口，再者，基板的下部邊緣具有金手指，連接至電氣線路，其中金手指可用以插設至外部裝置的插槽。 The main object of the present invention is to provide a memory module, which mainly comprises a substrate, at least one memory, a light shielding film and at least one light emitting diode. The substrate is translucent and electrically insulating and includes an electrical circuit, and the upper edge of the substrate has a slit. Further, the lower edge of the substrate has a gold finger connected to the electrical circuit, wherein the gold finger can be inserted into the external device. groove.
遮光膜為不透光性，可由銅箔藉另一蝕刻處理構成，並設置於基板上，並靠近上部邊緣，而且遮光膜具有切口及至少一開孔，其中遮光膜的切口是對應於基板的切口，而開孔是配置成靠近基板的上部邊緣而排列。 The light shielding film is opaque, can be formed by a copper foil by another etching process, and is disposed on the substrate and close to the upper edge, and the light shielding film has a slit and at least one opening, wherein the slit of the light shielding film corresponds to the substrate The slits are arranged to be arranged close to the upper edge of the substrate.
記憶體是設置於基板上且靠近金手指，並連接至電氣線路。此外，發光二極體設置於基板上並連接至電氣線路，而且每個發光二極體是位於遮光膜的相對應開孔。因此，發光二極體的發射光可經由開孔而朝外射出，並沿著基板的上部邊緣形成特定的亮光圖案、文字或線條，表現光線明暗色彩的不同變化，同時展現出整體記憶體模組的文字光影、影像光影之明亮變化，可改善並增強視覺效應。 The memory is placed on the substrate and close to the gold finger and connected to the electrical circuit. In addition, the light emitting diodes are disposed on the substrate and connected to the electrical circuit, and each of the light emitting diodes is located at a corresponding opening of the light shielding film. Therefore, the emitted light of the light emitting diode can be emitted outward through the opening, and a specific bright pattern, text or line is formed along the upper edge of the substrate, which exhibits different changes of the light and dark color, and exhibits the overall memory model. Groups of text, light and shadow, bright changes in light and shadow, can improve and enhance visual effects.
上述的遮光膜也可配置成具有至少一鏤空標記，如藉另一蝕刻處理而形成，且不具有任何開孔，同時發光二極體是設置在基板上且與遮光膜位於不同側部表面上，以如遮光膜位於基板的正面，而發光二極體位於基板的背面，使得發光二極體可朝遮光膜的鏤空標記發射光線而顯示。 The light shielding film may also be configured to have at least one hollow mark, such as formed by another etching process, and without any openings, while the light emitting diodes are disposed on the substrate and on different side surfaces of the light shielding film. For example, the light shielding film is located on the front surface of the substrate, and the light emitting diode is located on the back surface of the substrate, so that the light emitting diode can be displayed by emitting light toward the hollow mark of the light shielding film.
本發明之另一目的在於提供一種記憶體模組的製造方法，首先，對具透光性及電氣絕緣性基板上的銅箔進行蝕刻處理而形成電氣線路 以及金手指，其中金手指是用以插設至外部裝置的插槽，並連接至電氣線路，而且基板的上部邊緣具有切口。接著備製遮光膜，其中遮光膜為不透光性，並具有切口以及至少一開孔，而且開孔是配置成靠近切口。 Another object of the present invention is to provide a method for manufacturing a memory module. First, an etching process is performed on a copper foil on a light-transmitting and electrically insulating substrate to form an electrical circuit. And a gold finger, wherein the gold finger is a slot for inserting into an external device and is connected to the electrical circuit, and the upper edge of the substrate has a slit. A light-shielding film is then prepared, wherein the light-shielding film is opaque and has a slit and at least one opening, and the opening is disposed adjacent to the slit.
然後，將該遮光膜貼附到基板上，使得遮光膜是設置於基板上且靠近上部邊緣，且遮光膜的切口是對應於基板的切口，再將至少一記憶體設置於基板上且靠近金手指，並連接至電氣線路。最後，將至少一發光二極體設置於遮光膜的相對應開孔內，其中發光二極體可經由金手指獲得來自外部裝置的電力而點亮發光，或是由基板上連接至電氣線路的電子元件提供電力而點亮發光。 Then, the light shielding film is attached to the substrate such that the light shielding film is disposed on the substrate and close to the upper edge, and the slit of the light shielding film is a slit corresponding to the substrate, and then at least one memory is disposed on the substrate and close to the gold Finger and connect to the electrical circuit. Finally, at least one light-emitting diode is disposed in a corresponding opening of the light-shielding film, wherein the light-emitting diode can obtain power from the external device via the gold finger to illuminate the light, or is connected to the electrical circuit by the substrate. The electronic components provide power to illuminate the light.
上述的遮光膜可備置成具有至少一鏤空標記而不具有任何開孔，且發光二極體是設置在基板上且與遮光膜位於不同側部表面上，以使得發光二極體可朝遮光膜的鏤空標記發射光線而顯示。 The light shielding film may be disposed to have at least one hollow mark without any opening, and the light emitting diode is disposed on the substrate and on the different side surfaces of the light shielding film, so that the light emitting diode can face the light shielding film The hollow mark emits light and is displayed.
由於整體結構簡單，且遮光膜為不透光並具有多個開孔或鏤空標記，所以配置在相對應開孔中的發光二極體可經開孔而射出光線，或是光照射到鏤空標記，因而顯示特定的亮光圖案、文字或線條，藉以展現出整體記憶體模組的文字光影、影像光影之明亮變化，增強視覺效應。 Since the overall structure is simple, and the light shielding film is opaque and has a plurality of openings or hollow marks, the light emitting diodes disposed in the corresponding openings can emit light through the openings, or the light is irradiated to the hollow mark. Therefore, a specific light pattern, a character or a line is displayed, thereby displaying the text light and shadow of the overall memory module, the bright change of the image light and shadow, and enhancing the visual effect.
10‧‧‧記憶體模組 10‧‧‧ memory module
11‧‧‧基板 11‧‧‧Substrate
11A‧‧‧切口 11A‧‧‧Incision
13‧‧‧記憶體 13‧‧‧ memory
15‧‧‧遮光膜 15‧‧‧Shade film
17‧‧‧發光二極體 17‧‧‧Lighting diode
18‧‧‧金手指 18‧‧‧ Gold Finger
19‧‧‧電子元件 19‧‧‧Electronic components
20‧‧‧記憶體模組 20‧‧‧ memory module
21‧‧‧基板 21‧‧‧Substrate
21A‧‧‧切口 21A‧‧‧ incision
23‧‧‧記憶體 23‧‧‧ memory
25‧‧‧遮光膜 25‧‧‧Shade film
25B‧‧‧鏤空標記 25B‧‧‧ hollow mark
27‧‧‧發光二極體 27‧‧‧Lighting diode
28‧‧‧金手指 28‧‧‧Gold Fingers
29‧‧‧電子元件 29‧‧‧Electronic components
S10~S18‧‧‧步驟 S10~S18‧‧‧Steps
S20~S28‧‧‧步驟 S20~S28‧‧‧Steps
第一圖顯示依據本發明第一實施例記憶體模組的示意圖。 The first figure shows a schematic diagram of a memory module in accordance with a first embodiment of the present invention.
第二圖顯示依據本發明第二實施例記憶體模組的正面示意圖。 The second figure shows a front view of a memory module in accordance with a second embodiment of the present invention.
第三圖顯示依據本發明第二實施例記憶體模組的背面示意圖。 The third figure shows a schematic view of the back side of a memory module in accordance with a second embodiment of the present invention.
第四圖顯示依據本發明第三實施例記憶體模組的製造方法的操作流程示意圖。 The fourth figure shows an operational flow chart of a method of manufacturing a memory module in accordance with a third embodiment of the present invention.
第五圖顯示依據本發明第四實施例記憶體模組的製造方法的操作流程示意圖。 Fig. 5 is a flow chart showing the operation of the method of manufacturing the memory module in accordance with the fourth embodiment of the present invention.
以下配合圖示及元件符號對本發明之實施方式做更詳細的說明，俾使熟習該項技藝者在研讀本說明書後能據以實施。 The embodiments of the present invention will be described in more detail below with reference to the drawings and the reference numerals, which can be implemented by those skilled in the art after having studied this specification.
參閱第一圖，本發明第一實施例記憶體模組的示意圖。如第一圖所示，本發明第一實施例的記憶體模組10主要包括基板11、至少一記憶體13、遮光膜15以及至少一發光二極體17，其中基板11具透光性及電氣絕緣性並包含電氣線路(圖中未顯示)，遮光膜15是由銅箔構成並為不透光性，且設置於基板11上而靠近基板11的上部邊緣，記憶體13及發光二極體17是設置於該基板11上並連接至電氣線路。 Referring to the first figure, a schematic diagram of a memory module according to a first embodiment of the present invention. As shown in the first figure, the memory module 10 of the first embodiment of the present invention mainly includes a substrate 11, at least one memory 13, a light shielding film 15, and at least one light emitting diode 17, wherein the substrate 11 has light transmittance and Electrically insulating and including electrical wiring (not shown), the light shielding film 15 is made of copper foil and is opaque, and is disposed on the substrate 11 near the upper edge of the substrate 11, the memory 13 and the light emitting diode The body 17 is disposed on the substrate 11 and connected to an electrical circuit.
具體而言，基板11的上部邊緣具有切口11A，比如V型切口，且遮光膜15也具有切口，並配置成是對應於基板11的切口11A，而較佳的，遮光膜15未完全遮蓋到基板11的整個上部邊緣，而是基板11的上部邊緣具有未被遮光膜15遮蓋的邊緣區域，且該邊緣區域具有預設寬度，不過並未用以限定本發明的範圍，因此另一方式是，遮光膜15也可完全遮蓋基板11的整個上部邊緣。 Specifically, the upper edge of the substrate 11 has a slit 11A, such as a V-shaped slit, and the light shielding film 15 also has a slit and is configured to correspond to the slit 11A of the substrate 11, and preferably, the light shielding film 15 is not completely covered. The entire upper edge of the substrate 11, but the upper edge of the substrate 11 has an edge region that is not covered by the light shielding film 15, and the edge region has a predetermined width, but is not intended to limit the scope of the present invention, and thus another manner is The light shielding film 15 can also completely cover the entire upper edge of the substrate 11.
此外，基板11的下部邊緣具有金手指18，是連接至電氣線路，其中金手指18可用以插設至外部裝置的插槽，形成電氣連接，而記憶體13是設置於靠近基板11的金手指18，並與遮光膜15相互隔離開。 In addition, the lower edge of the substrate 11 has a gold finger 18 connected to an electrical circuit, wherein the gold finger 18 can be inserted into a slot of the external device to form an electrical connection, and the memory 13 is a gold finger disposed near the substrate 11. 18, and is separated from the light shielding film 15 from each other.
更進一步而言，遮光膜15具有至少一開孔，是配置成靠近基板11的上部邊緣而排列，同時每個發光二極體17是位於相對應的開孔內。例如，開孔是沿著V型切口而排列，且記憶體13是設置於基板11的同一側部表面上，或設置於基板11的相對面的二側部表面上，亦即正面及背面。因此，發光二極體17的發射光可經由開孔而朝外射出，並沿著基板11的上部邊緣形成特定的亮光圖案、文字或線條，進而表現出光線明暗色彩的不同變化，同時展現出整體記憶體模組10的文字光影、影像光影之明亮變化，改善並增強視覺效應。 Furthermore, the light shielding film 15 has at least one opening which is arranged close to the upper edge of the substrate 11 while each of the light emitting diodes 17 is located in the corresponding opening. For example, the openings are arranged along the V-shaped slits, and the memory 13 is provided on the same side surface of the substrate 11, or on the two side surfaces of the opposite faces of the substrate 11, that is, the front side and the back side. Therefore, the emitted light of the light-emitting diode 17 can be emitted outward through the opening, and a specific bright pattern, a character or a line is formed along the upper edge of the substrate 11, thereby exhibiting different changes in light and dark colors, and exhibiting The brightness of the text memory and the light and shadow of the overall memory module 10 improve and enhance the visual effect.
更加具體而言，發光二極體17是經由金手指18而獲得來自外部裝置(圖中未喜訕)的電力而點亮發光，或是由基板11上連接至電氣線路的電子元件19提供電力而點亮發光，其中電子元件19可為電子開關或電子控制器。 More specifically, the light-emitting diode 17 is powered by the gold finger 18 to obtain electric power from an external device (not shown), or is powered by the electronic component 19 connected to the electric circuit on the substrate 11. The illumination is illuminated, wherein the electronic component 19 can be an electronic switch or an electronic controller.
參考第二圖及第三圖，分別為本發明第二實施例記憶體模組20的正面及背面示意圖。如第二圖及第三圖所示，第二實施例的記憶體模組20是類似於第一實施例，並包括基板21、至少一記憶體23、遮光膜25以及至少一發光二極體27，其中基板21具透光性及電氣絕緣性並包含電氣線路(圖中未顯示)，遮光膜25是由銅箔構成並為不透光性，且設置於基板21的正面上且靠近基板21的上部邊緣，而記憶體23是設置於基板21上並連接至電氣線路，尤其，發光二極體27是設置於基板21的背面上並連接至電氣線路。 Referring to the second and third figures, the front and back sides of the memory module 20 of the second embodiment of the present invention are respectively shown. As shown in the second and third figures, the memory module 20 of the second embodiment is similar to the first embodiment, and includes a substrate 21, at least one memory 23, a light shielding film 25, and at least one light emitting diode. 27, wherein the substrate 21 is translucent and electrically insulating and includes an electrical circuit (not shown). The light shielding film 25 is made of a copper foil and is opaque, and is disposed on the front surface of the substrate 21 and adjacent to the substrate. The upper edge of the 21, and the memory 23 is disposed on the substrate 21 and connected to the electrical circuit. In particular, the light-emitting diode 27 is disposed on the back surface of the substrate 21 and connected to the electrical circuit.
此外，基板21的上部邊緣具有切口21A，而遮光膜25也具有切口，是對應於基板21的切口21A。具體而言，遮光膜25還具有至少一鏤空標記25B，且鏤空標記25B可為圖案、文字或線條，而在第二圖及第三圖中是以文字”V-color”當作實例以方便解釋本發明的特點而已，並非用以限定本發明的範圍。所以第二實施例與第一實施例的差異點在於第二實施例的遮光膜25具有鏤空標記25B而非第一實施例中遮光膜15的開孔，使得發光二極體27所發射的光線是朝向遮光膜25的鏤空標記25B而顯示。再者，第二實施例的遮光膜25及發光二極體27是限定成分別設置於基板21的正面及背面上而非同一面上，第二實施例的其餘技術特徵是相同於第一實施例，因而以下不再贅述。 Further, the upper edge of the substrate 21 has a slit 21A, and the light shielding film 25 also has a slit which is a slit 21A corresponding to the substrate 21. Specifically, the light shielding film 25 further has at least one hollow mark 25B, and the hollow mark 25B can be a pattern, a character or a line, and in the second figure and the third figure, the text "V-color" is taken as an example for convenience. The features of the invention are to be construed as not limiting the scope of the invention. Therefore, the difference between the second embodiment and the first embodiment is that the light shielding film 25 of the second embodiment has the hollowed-out mark 25B instead of the opening of the light-shielding film 15 in the first embodiment, so that the light emitted from the light-emitting diode 27 is emitted. It is displayed toward the hollow mark 25B of the light shielding film 25. Furthermore, the light shielding film 25 and the light emitting diode 27 of the second embodiment are defined to be respectively disposed on the front surface and the back surface of the substrate 21 instead of the same surface. The remaining technical features of the second embodiment are the same as the first embodiment. For example, it will not be described below.
此外，為進一步改善顯示鏤空標記25B的視覺效應，可將發光二極體27是設置成靠近相對於鏤空標記25B的下方邊緣，因此，發光二極體27的發射光可由下往上而朝向鏤空標記25B。 In addition, in order to further improve the visual effect of displaying the hollow mark 25B, the light emitting diode 27 can be disposed close to the lower edge with respect to the hollow mark 25B, and therefore, the light emitted from the light emitting diode 27 can be turned from the bottom to the top. Mark 25B.
進一步參考第四圖，依據本發明第三實施例記憶體模組的製造方法的操作流程示意圖，其中第三實施例記憶體模組的製造方法主要是包括步驟S10、S12、S14、S16、S18，係用製作第一圖的記憶體模組10。 With reference to the fourth embodiment, a schematic diagram of an operation flow of a method for manufacturing a memory module according to a third embodiment of the present invention, wherein the method for manufacturing the memory module of the third embodiment mainly includes steps S10, S12, S14, S16, and S18. The memory module 10 of the first figure is used.
具體而言，在第三實施例製造方法的步驟S10中，主要是針對透光性及電氣絕緣性的基板上的銅箔進行蝕刻處理，使得銅箔形成電氣線路以及金手指，其中金手指可是用以插設至外部裝置的插槽，並係連接至電氣線路，尤其是，基板的上部邊緣具有切口，比如V型切口。 Specifically, in step S10 of the manufacturing method of the third embodiment, the copper foil on the transparent and electrically insulating substrate is mainly subjected to an etching treatment, so that the copper foil forms an electric circuit and a gold finger, wherein the gold finger is A slot for insertion into an external device and is connected to an electrical circuit, and in particular, the upper edge of the substrate has a slit, such as a V-shaped slit.
接著進行步驟S12，備製遮光膜，其中遮光膜是由銅箔構成 並為不透光性，且可藉另一蝕刻處理而具有切口以及至少一開孔，尤其開孔是配置成靠近切口。較佳的，遮光膜的開孔是沿著V型切口而排列。然後在步驟S14中，將遮光膜貼附到基板上，其中遮光膜是設置成靠近基板的上部邊緣，以使得遮光膜的切口是對應於該基板的切口。較佳的，遮光膜可未完全遮蓋到基板的上部邊緣，而使得基板的上部邊緣露出具有預設寬度的特定邊緣區域。不過遮光膜也可視實際需要而完全遮蓋基板的上部邊緣。 Next, proceeding to step S12, preparing a light shielding film, wherein the light shielding film is composed of copper foil It is opaque and can have a slit and at least one opening by another etching process, and in particular, the opening is disposed close to the slit. Preferably, the openings of the light shielding film are arranged along the V-shaped slit. Then, in step S14, a light shielding film is attached to the substrate, wherein the light shielding film is disposed close to the upper edge of the substrate such that the slit of the light shielding film is a slit corresponding to the substrate. Preferably, the light shielding film may not completely cover the upper edge of the substrate such that the upper edge of the substrate exposes a specific edge region having a predetermined width. However, the light shielding film can completely cover the upper edge of the substrate as needed.
進行步驟S16，將至少一記憶體設置於基板上且靠近金手指，並連接至電氣線路，其中記憶體可設置於基板的同一側部表面上，或設置於基板的相對面的二側部表面上，亦即正面及背面。最後，步驟S18將每個發光二極體設置於遮光膜的相對應開孔內，其中發光二極體可經由金手指獲得來自外部裝置的電力而點亮發光，或是由基板上連接至電氣線路的電子元件提供電力而點亮發光。 In step S16, at least one memory is disposed on the substrate and adjacent to the gold finger, and is connected to the electrical circuit, wherein the memory may be disposed on the same side surface of the substrate, or disposed on the opposite side surfaces of the opposite side of the substrate. Upper, that is, front and back. Finally, in step S18, each of the light-emitting diodes is disposed in a corresponding opening of the light-shielding film, wherein the light-emitting diode can obtain electric power from the external device via the gold finger to illuminate the light, or be connected to the electrical device from the substrate. The electronic components of the line provide power to illuminate the light.
此外，再參考第五圖，依據本發明第四實施例記憶體模組的製造方法的操作流程示意圖，其中第四實施例記憶體模組的製造方法是類似於上述第三實施例的製造方法，包括步驟S20、S22、S24、S26、S28，用以製作第二圖的記憶體模組20，係分別類似於上述第三實施例的步驟S10、S12、S14、S16、S18，其主要差異點在於第四實施例的步驟S22所備製的遮光膜以及步驟S28的發光二極體配置方式，因而以下只說明步驟S22、S28，而步驟S20、S24、S26的處理內容不再贅述。 5 is a schematic diagram of an operation flow of a method for manufacturing a memory module according to a fourth embodiment of the present invention, wherein the method for manufacturing the memory module of the fourth embodiment is similar to the manufacturing method of the third embodiment described above. The steps S20, S22, S24, S26, and S28 are used to create the memory module 20 of the second figure, which are similar to the steps S10, S12, S14, S16, and S18 of the third embodiment, respectively, and the main differences thereof. The light-shielding film prepared in step S22 of the fourth embodiment and the light-emitting diode arrangement mode of step S28 are described. Therefore, only steps S22 and S28 will be described below, and the processing contents of steps S20, S24, and S26 will not be described again.
在步驟S22中，備製不透光性的遮光膜，且遮光膜具有切口以及至少一鏤空標記，比如可藉另一蝕刻處理而形成，其中遮光膜的切口是對應於基板的切口，尤其是鏤空標記可為圖案、文字或線條。此外，步驟S28將至少一發光二極體設置於基板上，並連接至電氣線路，其中發光二極體與遮光膜是位在基板的二不同側部表面上，比如遮光膜位在基板的正面，而發光二極體是位於基板的背面，使得發光二極體所發射的光線可朝鏤空標記而顯示。 In step S22, an opaque light-shielding film is prepared, and the light-shielding film has a slit and at least one hollow mark, which may be formed by another etching process, wherein the slit of the light-shielding film is a slit corresponding to the substrate, especially The cutout mark can be a pattern, a text, or a line. In addition, in step S28, at least one light emitting diode is disposed on the substrate and connected to the electrical circuit, wherein the light emitting diode and the light shielding film are located on two different side surfaces of the substrate, such as the light shielding film is located on the front side of the substrate. And the light emitting diode is located on the back side of the substrate, so that the light emitted by the light emitting diode can be displayed toward the hollow mark.
還可進一步將發光二極體設置成靠近相對於鏤空標記的下方邊緣，使得發光二極體的發射光可由下往上而朝向鏤空標記，進而改善 鏤空標記的顯示效應。 The light emitting diode can be further disposed close to the lower edge relative to the hollow mark, so that the emitted light of the light emitting diode can be marked from the bottom to the hollow, thereby improving The display effect of the hollow mark.
綜上所述，本發明的主要特點在於不需使用任何導光元件或遮光元件，而是使用具遮光功能的遮光膜，尤其是利用不透光且具有多個開孔或鏤空標記的遮光膜貼附到具有V型切口的基板上，且將發光二極體配置在相對應開孔中以使得發光二極體的光線可經開孔而射出或照射到鏤空標記而顯示特定的亮光圖案、文字或線條，藉以表現出光線明暗色彩的不同變化，使得整體記憶體模組展現出文字光影、影像光影之明亮變化。所以本發明記憶體模組的整體結構簡單，易於生產、組裝，同時不僅解決發光二極體會刺眼的缺點，也改善整體的視覺效應。 In summary, the main feature of the present invention is that it is not necessary to use any light guiding element or light blocking element, but a light shielding film having a light shielding function, in particular, a light shielding film which is opaque and has a plurality of openings or hollow marks. Attaching to the substrate having the V-shaped slit, and arranging the light-emitting diodes in the corresponding openings so that the light of the light-emitting diode can be emitted through the opening or irradiated to the hollow mark to display a specific bright pattern, Text or lines, in order to show the different changes in the light and dark colors, so that the overall memory module exhibits bright changes in text, light and shadow. Therefore, the memory module of the present invention has a simple overall structure, is easy to produce and assemble, and not only solves the shortcomings of the illuminating diode, but also improves the overall visual effect.
本發明的另一特點在於遮光膜是由銅箔構成，且開孔或鏤空標記可利用蝕刻處理而達成，不須開發特定的處理技術，所以可靠度相當高，並相當具有產業利用性。 Another feature of the present invention is that the light-shielding film is made of a copper foil, and the opening or hollowing mark can be achieved by an etching process, and it is not necessary to develop a specific processing technique, so the reliability is relatively high, and it is quite industrially usable.
由於本發明的技術內並未見於已公開的刊物、期刊、雜誌、媒體、展覽場，因而具有新穎性，且能突破目前的技術瓶頸而具體實施，確實具有進步性。此外，本發明能解決習用技術的問題，改善整體使用效率，而能達到具產業利用性的價值。 Since the technology of the present invention is not found in published publications, periodicals, magazines, media, exhibition venues, and thus is novel, and can be implemented by breaking through the current technical bottlenecks, it is indeed progressive. In addition, the present invention can solve the problems of the conventional technology, improve the overall use efficiency, and can achieve the value of industrial utilization.
以上所述者僅為用以解釋本發明之較佳實施例，並非企圖據以對本發明做任何形式上之限制，是以，凡有在相同之發明精神下所作有關本發明之任何修飾或變更，皆仍應包括在本發明意圖保護之範疇。 The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.
10‧‧‧記憶體模組 10‧‧‧ memory module
11‧‧‧基板 11‧‧‧Substrate
11A‧‧‧切口 11A‧‧‧Incision
13‧‧‧記憶體 13‧‧‧ memory
15‧‧‧遮光膜 15‧‧‧Shade film
17‧‧‧發光二極體 17‧‧‧Lighting diode
18‧‧‧金手指 18‧‧‧ Gold Finger
19‧‧‧電子元件 19‧‧‧Electronic components
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| JP2010129501A (en) * | 2008-12-01 | 2010-06-10 | Toshiba Lighting & Technology Corp | Illumination device and luminaire |
| CN101997194B (en) * | 2009-08-11 | 2013-11-13 | 冯林 | Memory protection device and computer |
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2016
- 2016-01-11 TW TW105100705A patent/TWI584105B/en not_active IP Right Cessation
- 2016-03-31 KR KR1020160039057A patent/KR101852254B1/en active IP Right Grant
- 2016-04-04 US US15/090,294 patent/US10098230B2/en active Active
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| TW581993B (en) * | 1999-02-15 | 2004-04-01 | Micro Displays Inc | Method for assembling a tiled, flat-panel microdisplay array |
| TWI490592B (en) * | 2009-04-27 | 2015-07-01 | Hitachi Displays Ltd | Liquid crystal display device |
| TW201543066A (en) * | 2014-03-19 | 2015-11-16 | Hoya Candeo Optronics Corp | Optical element |
| TWM508053U (en) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | Electric circuit module |
Also Published As
| Publication number | Publication date |
|---|---|
| US10098230B2 (en) | 2018-10-09 |
| US20170202086A1 (en) | 2017-07-13 |
| KR20170083940A (en) | 2017-07-19 |
| KR101852254B1 (en) | 2018-04-25 |
| TW201725470A (en) | 2017-07-16 |
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