TWI583829B - An electrochemical processing device for measuring and an electrochemical processing method - Google Patents
An electrochemical processing device for measuring and an electrochemical processing method Download PDFInfo
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Description
本發明係有關於一種電化學加工，尤指一種可量測工件之電化學加工裝置及電化學加工方法。 The invention relates to an electrochemical process, in particular to an electrochemical processing device and an electrochemical machining method capable of measuring a workpiece.
電化學加工為非傳統加工方法，此加工方法係將金屬工件作為，而電極作為陰極，且電解液位於金屬工件與電極之間，電化學加工是以陽極溶解原理對工件進行加工。於進行電化學加工的過程中，可能有部分解離生成物殘留於工件之表面或電極表面附著雜物，如此即會影響電化學加工之品質。此外，當需要在工件形成不同輪廓下，輪廓之大小與形狀之不同會造成電場與電解液流場變化，如此會影響到電化學加工的移除量。上述原因皆會影響加工後之工件的品質。基於上述原因，一般進行電化學加工之過程會取下工件，並量測工件，之後再重新定位至電化學加工裝置接續進行加工，如此即會耗費時間而降低效率。，而電極作為陰極，且電解液位於金屬工件與電極之間，電化學加工是以陽極溶解原理對工件進行加工。於進行電化學加工的過程中，可能有部分解離生成物殘留於工件之表面或電極表面附著雜物，如此即會影響電化學加工之品質。此外，當需要在工件形成不同輪廓下，輪廓之大小與形狀之不同會造成電場與電解液流場變化，如此會影響到電化學加工的移除量。上述原因皆會影響加工後之工件的品質。基於上述原因，一般進行電化學加工之過程會取下工件，並 量測工件，之後再重新定位至電化學加工裝置接續進行加工，如此即會耗費時間而降低效率。 Electrochemical machining is a non-traditional processing method in which a metal workpiece is used as a cathode, and an electrode is used as a cathode, and an electrolyte is located between the metal workpiece and the electrode, and electrochemical machining processes the workpiece by the anode dissolution principle. During the electrochemical processing, some dissociated products may remain on the surface of the workpiece or the surface of the electrode may be attached with impurities, which may affect the quality of electrochemical processing. In addition, when it is required to form different contours of the workpiece, the difference in size and shape of the contour causes a change in the electric field and the electrolyte flow field, which affects the removal amount of the electrochemical processing. All of the above factors will affect the quality of the workpiece after processing. For the above reasons, in general, the process of electrochemical machining removes the workpiece and measures the workpiece, and then repositions it to the electrochemical processing device for subsequent processing, which takes time and reduces efficiency. The electrode is used as a cathode, and the electrolyte is located between the metal workpiece and the electrode, and the electrochemical processing is to process the workpiece by the anode dissolution principle. During the electrochemical processing, some dissociated products may remain on the surface of the workpiece or the surface of the electrode may be attached with impurities, which may affect the quality of electrochemical processing. In addition, when it is required to form different contours of the workpiece, the difference in size and shape of the contour causes a change in the electric field and the electrolyte flow field, which affects the removal amount of the electrochemical processing. All of the above factors will affect the quality of the workpiece after processing. For the above reasons, generally the process of electrochemical machining will remove the workpiece, and The workpiece is measured and then repositioned to the electrochemical processing unit for subsequent processing, which takes time and reduces efficiency.
本發明之一目的，在於提供一種具量測之電化學加工裝置以及電化學加工方法，其可量測工件，而依據工件之狀態控制電化學加工。 It is an object of the present invention to provide an electrochemical processing apparatus and an electrochemical processing method which are capable of measuring a workpiece and controlling electrochemical machining in accordance with the state of the workpiece.
本發明之一目的，在於提供一種具量測之電化學加工裝置以及電化學加工方法，其可在進行電化學加工前與後分別量測工件，以得知工件進行此次電化學加工後之加工狀態，並依據此加工狀態控制之後進行之電化學加工，以補償先前電化學加工之誤差。 An object of the present invention is to provide a measuring electrochemical processing device and an electrochemical processing method, which can respectively measure a workpiece before and after electrochemical machining to know that the workpiece is subjected to the electrochemical processing. The processing state, and the electrochemical processing performed after the processing state is controlled to compensate for the error of the previous electrochemical machining.
本發明之一目的，在於提供一種具量測之電化學加工裝置以及電化學加工方法，其可以量測工件之壁面狀態，以控制目前欲進行之電化學加工。 It is an object of the present invention to provide an electrochemical processing apparatus and an electrochemical processing method that can measure the wall state of a workpiece to control the electrochemical processing currently to be performed.
本發明提供一種具量測之電化學加工裝置，其包含一電化學加工模組、一量測模組與一控制模組。電化學加工模組對工件進行電化學加工，量測模組量測工件，以產生一量測資訊，控制模組依據量測資訊控制電化學加工模組。 The invention provides a measuring electrochemical processing device comprising an electrochemical processing module, a measuring module and a control module. The electrochemical machining module performs electrochemical machining on the workpiece, and the measurement module measures the workpiece to generate a measurement information, and the control module controls the electrochemical processing module according to the measurement information.
本發明另提供一種具量測之電化學加工方法，其包含量測工件，並產生量測資訊，且依據量測資訊決定加工參數，以依據加工參數對工件進行電化學加工。 The invention further provides an electrochemical processing method with measurement, which comprises measuring a workpiece and generating measurement information, and determining a processing parameter according to the measurement information, so as to electrochemically process the workpiece according to the processing parameter.
1‧‧‧電化學加工裝置 1‧‧‧Electrochemical processing equipment
11‧‧‧電化學加工模組 11‧‧‧Electrochemical processing module
13‧‧‧量測模組 13‧‧‧Measurement module
131‧‧‧量測單元 131‧‧‧Measurement unit
133‧‧‧第一量測單元 133‧‧‧First measuring unit
135‧‧‧第二量測單元 135‧‧‧Second measurement unit
15‧‧‧控制模組 15‧‧‧Control Module
151‧‧‧資訊儲存單元 151‧‧‧Information storage unit
153‧‧‧運算單元 153‧‧‧ arithmetic unit
155‧‧‧資料庫 155‧‧‧Database
157‧‧‧訊號處理單元 157‧‧‧Signal Processing Unit
17‧‧‧移行模組 17‧‧‧Transition module
2‧‧‧工件 2‧‧‧Workpiece
21‧‧‧遮罩層 21‧‧‧ mask layer
23‧‧‧斜壁 23‧‧‧ sloping wall
25‧‧‧直壁 25‧‧‧ Straight wall
第一圖：其係為本發明之具量測之電化學加工裝置之第一實施例之示意圖； 第二圖：其係為本發明之具量測之電化學加工裝置之控制模組之第一實施例之方塊圖；第三A圖至第三F圖：其係為本發明之具量測之電化學加工裝置之第一實施例之作動示意圖；第四圖：其係為本發明之具量測之電化學加工裝置之控制模組之第二實施例之方塊圖；第五圖：其係為本發明之具量測之電化學加工裝置之第二實施例之示意圖；第六A圖：其係為本發明之具量測之電化學加工裝置之第三實施例之示意圖；第六B圖：其係為本發明之具量測之電化學加工裝置之第三實施例之側視圖；第六C圖：其係為第六B圖之A區域的放大圖；第六D圖：其係為第六B圖之A區域的放大圖；以及第七圖：其係為本發明之具量測之電化學加工方法之一實施例之流程圖。 The first figure is a schematic view of a first embodiment of an electrochemical processing device with a measurement according to the present invention; 2 is a block diagram of a first embodiment of a control module for an electrochemical processing device of the present invention; and FIGS. 3A to 3F are drawings of the present invention. A schematic diagram of the operation of the first embodiment of the electrochemical processing apparatus; FIG. 4 is a block diagram of a second embodiment of the control module of the electrochemical processing apparatus of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6 is a schematic view showing a third embodiment of an electrochemical processing apparatus having a measurement according to the present invention; Figure B is a side view of a third embodiment of the electrochemical processing apparatus of the present invention; Figure 6C is an enlarged view of the area A of the sixth panel B; It is an enlarged view of the A region of the sixth B diagram; and a seventh diagram: it is a flow chart of one embodiment of the electrochemical processing method with the measurement of the present invention.
為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明，說明如後：請參閱第一圖與第二圖，其係為本發明之具量測之電化學加工裝置之第一實施例之示意圖與控制模組之一實施例之方塊圖。本實施例係以電化學掃描加工進行以下說明，但並不限制本發明僅用於電化學掃描加工，本發明也可以用於其他類型之電化學加工方 式。如圖所示，本實施例之具量測之電化學加工裝置1包含一電化學加工模組11、一量測模組13與一控制模組15。於本發明之一實施例中，控制模組15可為一電腦、一微處理晶片或者其它具資訊運算處理之電子裝置。 For a better understanding and understanding of the features and the efficacies of the present invention, the preferred embodiments and the detailed description are as follows: see the first and second figures, It is a block diagram of an embodiment of a schematic diagram and a control module of a first embodiment of the electrochemical processing apparatus of the present invention. This embodiment is described below by electrochemical scanning processing, but the invention is not limited to electrochemical scanning processing alone, and the invention can also be applied to other types of electrochemical processing. formula. As shown in the figure, the electrochemical processing device 1 of the present embodiment includes an electrochemical processing module 11, a measuring module 13 and a control module 15. In an embodiment of the invention, the control module 15 can be a computer, a micro-processing chip or other electronic device with information processing.
電化學加工模組11用於對一工件2進行電化學加工。電化學加工模組11係依據至少一加工參數進行電化學加工。於本發明之一實施例中，加工參數可包含加工電壓、加工電流、電化學加工模組11之進給速度等。量測模組13用於量測工件2，以得知工件2之表面狀態，並產生一量測資訊。控制模組15用於依據量測資訊控制電化學加工模組11。於本實施例中，控制模組15係決定加工參數，即依據工件2之表面狀態決定加工參數而控制電化學加工模組11。如此，電化學加工裝置1能夠於進行當次電化學加工前，能夠得知工件2之狀態，以決定當次進行電化學加工之加工參數，即控制當次進行之電化學加工，進而提升電化學加工之加工精度。 The electrochemical machining module 11 is used for electrochemical machining of a workpiece 2. The electrochemical machining module 11 performs electrochemical machining in accordance with at least one processing parameter. In an embodiment of the invention, the processing parameters may include a machining voltage, a machining current, a feed rate of the electrochemical machining module 11, and the like. The measuring module 13 is used for measuring the workpiece 2 to know the surface state of the workpiece 2 and generate a measurement information. The control module 15 is configured to control the electrochemical machining module 11 according to the measurement information. In the present embodiment, the control module 15 determines the machining parameters, that is, controls the electrochemical machining module 11 according to the surface state of the workpiece 2 to determine the machining parameters. In this way, the electrochemical processing apparatus 1 can know the state of the workpiece 2 before performing the electrochemical processing to determine the processing parameters of the current electrochemical processing, that is, control the electrochemical processing performed at the time, thereby improving the electrification. Learning processing precision.
於本發明之一實施例中，量測模組13是量測本身與工件2之表面間的相對距離，所以量測資訊為相對距離資訊。如第三B圖所示，若量測模組13以正向於工件2之角度量測工件2，此相對距離資訊為相對深度資訊。量測模組13可為探針式或者光學式量測模組。此外，電化學加工裝置1更包含一移行模組17。電化學加工模組11與量測模組13依據加工路徑而前後依序設置於移行模組17，使電化學加工模組11之加工路徑與量測模組13之量測路徑位於相同路徑上且相同運動模式。於本實施例中，加工路徑為X方向路徑。又，電化學加工模組11與量測模組13位於同水平高度，即位 於同一XY平面而為同一座標系。上述同運動模式與同座標系的設置方式，可以降低後續依據量測資訊決定加工參數的運算複雜度。然而，並非限定本發明之電化學加工模組11與量測模組13必定要位於同一座標系。 In one embodiment of the present invention, the measurement module 13 measures the relative distance between itself and the surface of the workpiece 2, so the measurement information is relative distance information. As shown in FIG. B, if the measurement module 13 measures the workpiece 2 at an angle toward the workpiece 2, the relative distance information is relative depth information. The measuring module 13 can be a probe type or an optical measuring module. In addition, the electrochemical processing device 1 further includes a transition module 17 . The electrochemical processing module 11 and the measuring module 13 are disposed in the routing module 17 in sequence according to the processing path, so that the processing path of the electrochemical processing module 11 and the measuring path of the measuring module 13 are located on the same path. And the same sport mode. In this embodiment, the processing path is an X-direction path. Moreover, the electrochemical processing module 11 and the measuring module 13 are at the same level, that is, the position It is the same coordinate system in the same XY plane. The above-mentioned same motion mode and the setting method of the same coordinate system can reduce the computational complexity of determining the processing parameters according to the measurement information. However, the electrochemical processing module 11 and the measurement module 13 of the present invention are not necessarily limited to the same coordinate system.
如第二圖所示，控制模組15更包含一資訊儲存單元151、一運算單元153與一資料庫155。資訊儲存單元151用於儲存量測模組13之量測資訊與移行模組17之一移動資訊，即電化學加工模組11之移動資訊，量測資訊與移動資訊相對應。資料庫155用於儲存參考資訊，參考資訊包含複數筆參考加工參數與複數筆對照資訊，該些筆參考加工參數是分別對應於該些筆對照資訊，該些筆對照資訊對應於工件2之各種狀態。運算單元153讀取資訊儲存單元151之量測資訊與資料庫155之參考資訊，而依據量測資訊參考對照資訊，以可獲知對應之參考加工參數，以決定欲進行電化學加工的加工參數，如此即依據工件2之狀態決定加工參數。此外，運算單元153更可依據移動資訊與量測資訊參考對照資訊而決定加工參數。 As shown in the second figure, the control module 15 further includes an information storage unit 151, an operation unit 153, and a database 155. The information storage unit 151 is configured to store the measurement information of the measurement module 13 and one of the movement information of the migration module 17, that is, the movement information of the electrochemical processing module 11, and the measurement information corresponds to the movement information. The database 155 is configured to store reference information, and the reference information includes a plurality of reference processing parameters and a plurality of comparison information, wherein the reference processing parameters respectively correspond to the plurality of pen comparison information, and the pen comparison information corresponds to each of the workpiece 2 status. The operation unit 153 reads the measurement information of the information storage unit 151 and the reference information of the database 155, and refers to the comparison information according to the measurement information to obtain the corresponding reference processing parameters to determine the processing parameters to be electrochemically processed. In this way, the processing parameters are determined according to the state of the workpiece 2. In addition, the operation unit 153 can further determine the processing parameters according to the movement information and the measurement information with reference to the comparison information.
承接上述，運算單元153提供加工參數至電化學加工模組11，或者運算單元153依據加工參數控制電化學加工模組11。資料庫155的參考加工參數是預先依據工件2之各種狀態與各種加工條件以及欲成形之輪廓，經過電化學加工試驗或者模擬計算而得知，以用於作為決定加工參數的參考依據。 In response to the above, the arithmetic unit 153 supplies the processing parameters to the electrochemical machining module 11, or the arithmetic unit 153 controls the electrochemical machining module 11 according to the processing parameters. The reference processing parameters of the database 155 are known in advance according to various states of the workpiece 2 and various processing conditions and contours to be formed, and are known through electrochemical machining tests or simulation calculations as a reference for determining processing parameters.
請一併參閱第三A圖至第三F圖，其係為本發明之具量測之電化學加工裝置之第一實施例之作動示意圖。如圖所示，於本實施例中，係利用電化學加工裝置1對工件2進行電化學掃描加工，以形成 如第一圖所示之多個不同輪廓，所以工件2之表面預先形成有一遮罩層21，以遮蔽工件2之非加工表面。於本發明之一實施例中，電化學加工模組11於進行第一掃描道次電化學加工時，可依據預定加工參數對工件2進行加工。 Please refer to FIG. 3A to FIG. 3F together, which is a schematic diagram of the operation of the first embodiment of the electrochemical processing device of the present invention. As shown in the figure, in the present embodiment, the workpiece 2 is electrochemically scanned by the electrochemical processing device 1 to form As shown in the first figure, a plurality of different contours are formed, so that the surface of the workpiece 2 is previously formed with a mask layer 21 to shield the non-machined surface of the workpiece 2. In an embodiment of the present invention, the electrochemical machining module 11 can process the workpiece 2 according to predetermined processing parameters during the first scanning pass electrochemical machining.
如第三A圖所示，移行模組17帶動電化學加工模組11移動，而對工件2進行加工，隨後如第三B圖所示，量測模組13量測加工後之工件2，以產生量測資訊，如此即可得知加工後之工件2的狀態。 之後，如第三C圖所示，移行模組17返回水平(X方向)之起始位置，並往下(Z方向)移動而進給電化學加工模組11之電極(圖未示)，以進行第二掃描道次電化學加工。於本發明之另一實施例中，電化學加工模組11完成目前進行之掃描道次電化學加工而移行模組17返回時，量測模組13才量測加工後之工件2，並非先前所述於移行模組17之加工路徑上隨即量測工件2。 As shown in FIG. 3A, the travel module 17 drives the electrochemical machining module 11 to move, and the workpiece 2 is processed. Then, as shown in FIG. 3B, the measuring module 13 measures the processed workpiece 2, In order to generate the measurement information, the state of the workpiece 2 after processing can be known. Thereafter, as shown in FIG. 3C, the transition module 17 returns to the starting position of the horizontal (X direction), and moves downward (Z direction) to feed the electrodes of the electrochemical machining module 11 (not shown) to A second scan pass electrochemical process is performed. In another embodiment of the present invention, the electrochemical processing module 11 performs the current scanning electrochemical processing and the migration module 17 returns. The measurement module 13 measures the processed workpiece 2, not the previous one. The workpiece 2 is then measured on the processing path of the transition module 17.
承接上述，移行模組17之移動資訊與量測模組13之量測資訊會傳送至控制模組15。控制模組15之運算單元153依據完成第一掃描道次電化學加工所獲得之量測資訊決定第二掃描道次電化學加工之加工參數，即控制第二掃描道次電化學加工。於本發明之一實施例中，資料庫15之對照資訊包含工件2完成第一掃描道次電化學加工之各種狀態，而參考加工參數則對應對照資訊，例如完成第一掃描道次後工件2與量測模組13之相對深度為第一數值，則對應第一參考加工參數，若相對深度為第二數值則對應第二參考加工參數。運算單元153依據量測資訊與資料庫155之對照資訊即可得知對應之參考加工參數，而依據參考加工參數決定第二掃描道次電化學加工之加工參數。 In response to the above, the movement information of the migration module 17 and the measurement information of the measurement module 13 are transmitted to the control module 15. The operation unit 153 of the control module 15 determines the processing parameters of the second scanning pass electrochemical machining according to the measurement information obtained by performing the first scanning pass electrochemical machining, that is, controls the second scanning pass electrochemical machining. In an embodiment of the present invention, the comparison information of the database 15 includes various states in which the workpiece 2 completes the first scanning pass electrochemical processing, and the reference processing parameters correspond to the comparison information, for example, the workpiece 2 is completed after the first scanning pass is completed. The relative depth to the measurement module 13 is a first value, corresponding to the first reference processing parameter, and if the relative depth is the second value, the second reference processing parameter is corresponding. The operation unit 153 can obtain the corresponding reference processing parameters according to the comparison information of the measurement information and the data library 155, and determine the processing parameters of the second scanning pass electrochemical machining according to the reference processing parameters.
接著，如第三D至三F圖所示，移行模組17依據加工路徑移動，而帶動電化學加工模組11進行第二掃描道次電化學加工，量測模組13則隨後量測工件2，移行模組17於完成第二掃描道次電化學加工後隨即返回。如同上述，控制模組15依據完成第二掃描道次電化學加工所獲得之量測資訊與資料庫155之參考加工參數決定第三掃描道次電化學加工之加工參數。如此反覆進行前述加工動作即可完成如第一圖所示之工件2。 Then, as shown in the third D to the third F, the transition module 17 moves according to the processing path, and drives the electrochemical machining module 11 to perform the second scanning pass electrochemical machining, and the measuring module 13 then measures the workpiece. 2. The transition module 17 returns immediately after completing the second scanning pass electrochemical machining. As described above, the control module 15 determines the processing parameters of the third scanning pass electrochemical machining based on the measurement information obtained by performing the second scanning pass electrochemical machining and the reference processing parameters of the data bank 155. The workpiece 2 as shown in the first figure can be completed by repeating the above-described processing operations.
此外，於本發明之另一實施例中，運算單元153依據完成第一與第二掃描道次電化學加工所獲得之量測資訊決定第三掃描道次電化學加工之加工參數，即運算單元153比較第一與第二掃描道次電化學加工所獲得之量測資訊，而得知加工資訊，其表示完成第二掃描道次電化學加工之加工量。資料庫155之對照資訊包含完成第二掃描道次電化學加工後之各種加工量，而參考加工參數則對應參考資訊，例如完成第二掃描道次後之加工量為第一數值，則對應第一參考加工參數，若加工量為第二數值則對應第二參考加工參數。換言之，運算單元153依據目前進行掃描道次之電化學加工前之量測資訊與進行後之量測資訊產生加工資訊，並依據加工資訊與該些筆參考加工參數決定加工參數。由此可知，於進行第一掃描道次電化學加工前，移行模組17可以帶動量測模組13移動，量測模組13先行量測工件2，之後依據進行加工前之量測資訊與完成第一掃描道次電化學加工之量測資訊決定第二掃描道次電化學加工之加工參數。 In addition, in another embodiment of the present invention, the operation unit 153 determines processing parameters of the third scanning pass electrochemical machining according to the measurement information obtained by performing the first and second scanning pass electrochemical processing, that is, the arithmetic unit 153 compares the measurement information obtained by the first and second scanning passes electrochemical processing, and knows the processing information, which indicates the processing amount of the second scanning pass electrochemical machining. The comparison information of the database 155 includes various processing quantities after the second scanning pass electrochemical machining is completed, and the reference processing parameters correspond to the reference information, for example, the processing amount after the completion of the second scanning pass is the first value, corresponding to the first A reference processing parameter, if the processing amount is the second value, corresponds to the second reference processing parameter. In other words, the operation unit 153 generates processing information according to the measurement information before the electrochemical processing of the scanning pass and the measured information after the current scanning, and determines the processing parameters according to the processing information and the reference processing parameters. Therefore, before the first scanning pass electrochemical machining, the migration module 17 can drive the measurement module 13 to move, and the measurement module 13 measures the workpiece 2 first, and then according to the measurement information before processing. The measurement information of the first scanning pass electrochemical machining determines the processing parameters of the second scanning pass electrochemical machining.
由上述說明可知，本發明之電化學加工裝置1可在電化學加工後量測工件2，以得知進行此次電化學加工後之加工狀態，並依據 此加工狀態決定之後進行電化學加工的加工參數，以補償先前電化學加工之誤差。 It can be seen from the above description that the electrochemical processing device 1 of the present invention can measure the workpiece 2 after electrochemical machining to know the processing state after the electrochemical machining, and according to This processing state determines the processing parameters that are then electrochemically processed to compensate for previous electrochemical processing errors.
請參閱第四圖，其係為本發明之具量測之電化學加工裝置之控制模組之第二實施例之方塊圖。本實施例之控制模組15更包含一訊號處理單元157，其耦接量測模組13與移行模組17，並接收量測資訊與移動資訊，且依據量測資訊與移動資訊產生一輪廓資訊，輪廓資訊可儲存於資訊儲存單元151，運算單元153進而依據輪廓資訊與資料庫155之該些筆參考加工參數決定加工參數。於第一圖實施例中，量測模組13包含一量測單元131，其所產生之量測資訊為一維資訊。訊號處理單元157耦合移動資訊與量測資訊，即可建立出工件2之輪廓。於本實施例中，輪廓資訊為一二維資訊，由於輪廓資訊是依據量測模組13與工件2之相對關係所建立，所以輪廓資訊為相對位置資訊，且資料庫155之對照資訊則對應輪廓資訊之型態而建立。同於先前實施例所述，運算單元153可依據目前進行之掃描道次電化學加工前之輪廓資訊與進行後之輪廓資訊決定加工參數。 Please refer to the fourth figure, which is a block diagram of a second embodiment of the control module of the electrochemical processing device of the present invention. The control module 15 of the embodiment further includes a signal processing unit 157 coupled to the measurement module 13 and the transition module 17 and receiving measurement information and movement information, and generating a contour according to the measurement information and the movement information. The information and the contour information may be stored in the information storage unit 151, and the operation unit 153 further determines the processing parameters according to the contour information and the pen reference processing parameters of the database 155. In the first embodiment, the measurement module 13 includes a measurement unit 131, and the measurement information generated is one-dimensional information. The signal processing unit 157 couples the movement information and the measurement information to establish the contour of the workpiece 2. In this embodiment, the contour information is a two-dimensional information. Since the contour information is established according to the relative relationship between the measurement module 13 and the workpiece 2, the contour information is relative position information, and the comparison information of the database 155 corresponds to The type of profile information is established. As described in the previous embodiment, the operation unit 153 can determine the processing parameters according to the contour information before the electrochemical scanning process and the contour information after the current scanning.
請一併參閱第五圖，其係為本發明之具量測之電化學加工裝置之第二實施例之示意圖。如圖所示，本實施例之量測模組13包含複數個量測單元131，該些個量測單元131呈列排列，而分別偵測工件2之不同位置，如此量測模組13產生之量測資訊包含每一量測單元131與工件2之表面不同位置間的相對距離資訊，所以此量測資訊為一二維資訊，第四圖實施例之控制模組15依據此量測資訊與電化學加工模組11之移動資訊所產生之輪廓資訊即為一三維資訊。 Please refer to FIG. 5, which is a schematic diagram of a second embodiment of the electrochemical processing apparatus of the present invention. As shown in the figure, the measurement module 13 of the present embodiment includes a plurality of measurement units 131 arranged in a row to detect different positions of the workpiece 2, such that the measurement module 13 generates The measurement information includes the relative distance information between the different positions of each measuring unit 131 and the surface of the workpiece 2, so the measurement information is a two-dimensional information, and the control module 15 of the fourth embodiment is based on the measurement information. The contour information generated by the movement information of the electrochemical machining module 11 is a three-dimensional information.
請參閱第六A與六B圖，其係為本發明之具量測之電化學加工裝置之第三實施例之示意圖與側視圖。如圖所示，本實施例之量測模組13包含一第一量測單元133與一第二量測單元135。第二量測單元135相鄰於第一量測單元133，而位於第一量測單元133之後方，第一量測單元133以一第一量測角度量測工件2，而第二量測單元135以一第二量測角度量測工件2，兩者之量測角度不相同。於本實施例中，第一量測單元133以垂直於工件2之角度量測工件2，第二量測單元135以側向於工件2之角度量測工件2，如此第二量測單元135可以量測工件2之壁面狀態，而控制模組15可依據量測資訊控制下一掃描道次電化學加工，即決定下一掃描道次電化學加工之加工參數，如此可提高電化學加工的品質。上述之壁面狀態包括工件2之側壁狀態與底壁狀態，但不侷限於此，其取決於量測單元之量測角度。 Please refer to Figures 6A and 6B, which are schematic and side views of a third embodiment of the electrochemical processing apparatus of the present invention. As shown in the figure, the measurement module 13 of the embodiment includes a first measurement unit 133 and a second measurement unit 135. The second measuring unit 135 is adjacent to the first measuring unit 133 and located behind the first measuring unit 133. The first measuring unit 133 measures the workpiece 2 at a first measuring angle, and the second measuring unit The unit 135 measures the workpiece 2 at a second measuring angle, and the measured angles of the two are different. In the present embodiment, the first measuring unit 133 measures the workpiece 2 at an angle perpendicular to the workpiece 2, and the second measuring unit 135 measures the workpiece 2 at an angle lateral to the workpiece 2, such that the second measuring unit 135 The wall state of the workpiece 2 can be measured, and the control module 15 can control the electrochemical processing of the next scanning pass according to the measurement information, that is, determine the processing parameters of the electrochemical processing of the next scanning pass, thereby improving the electrochemical processing. quality. The above wall state includes the side wall state and the bottom wall state of the workpiece 2, but is not limited thereto, which depends on the measuring angle of the measuring unit.
同理，使用更多量測單元而以不同量測角度量測工件2，更可提高量測精度，例如增設一第三量測單元(圖未示)，其位於第一量測單元133之前方，而以一第三量測角度量測工件2，此第三量測角度鏡射於第二量測角度，即第二量測單元135係可量測工件2於正X方向之壁面，而第三量測單元可以量測工件2於負X方向之壁面。 Similarly, using more measuring units to measure the workpiece 2 at different measuring angles, the measuring accuracy can be improved, for example, a third measuring unit (not shown) is added, which is located before the first measuring unit 133. And measuring the workpiece 2 with a third measuring angle, the third measuring angle mirror is incident on the second measuring angle, that is, the second measuring unit 135 can measure the wall surface of the workpiece 2 in the positive X direction. The third measuring unit can measure the wall surface of the workpiece 2 in the negative X direction.
承接上述，第一量測單元133產生的資訊為第一資訊，而第二量測單元135產生之資訊為第二資訊。控制模組15於處理第一資訊與第二資訊時，係會判斷第一資訊之變化，進而依據第二資訊判斷工件2之壁面的狀態。於本發明之一實施例中，控制模組15判斷第一量測單元133量測兩相鄰位置而產生之兩筆第一資訊的差 異大於預定之一門檻時，則會依據第二量測單元135量測此區域所產生之第二資訊判斷工件2之壁面的狀態。 The information generated by the first measurement unit 133 is the first information, and the information generated by the second measurement unit 135 is the second information. When the first information and the second information are processed, the control module 15 determines the change of the first information, and determines the state of the wall surface of the workpiece 2 according to the second information. In an embodiment of the present invention, the control module 15 determines that the first measurement unit 133 measures the difference between the two first information generated by the two adjacent positions. When the difference is greater than a predetermined threshold, the second measurement unit 135 measures the second information generated by the area to determine the state of the wall surface of the workpiece 2.
舉例說明，請一併參閱第六C圖，其係為第六B圖之A區域的放大圖。如圖所示，工件2具有一斜壁23與一直壁25。以下係說明如何判斷工件2之壁面的狀態。第一量測單元133分別量測工件2之兩相鄰位置P11與P12而產生兩筆第一資訊，由於位置P11為工件2之底部，而位置P12為遮罩層21之表面，所以第一量測單元133量測位置P12所產生之第一資訊明顯會小於對應位置P11的第一資訊，兩者差異大，且兩者變小之差異大於預定之門檻，此表示位置P11之後可能為工件2之側壁。此時，控制模組15則會依據第二量測單元135量測此區域所產生之第二資訊，例如相鄰於位置P11之位置P21以及之後各位置P22-P25所對應之第二資訊，而判斷工件2之壁面狀態。 For example, please refer to the sixth C diagram, which is an enlarged view of the A area of the sixth B diagram. As shown, the workpiece 2 has a slanted wall 23 and a straight wall 25. The following describes how to judge the state of the wall surface of the workpiece 2. The first measuring unit 133 respectively measures two adjacent positions P11 and P12 of the workpiece 2 to generate two pieces of first information. Since the position P11 is the bottom of the workpiece 2, and the position P12 is the surface of the mask layer 21, the first The first information generated by the measuring unit 133 measuring position P12 is obviously smaller than the first information of the corresponding position P11, and the difference between the two is large, and the difference between the two is larger than the predetermined threshold, which may be the workpiece after the position P11. 2 side walls. At this time, the control module 15 measures the second information generated by the area according to the second measuring unit 135, for example, the position P21 adjacent to the position P11 and the second information corresponding to the subsequent positions P22-P25. The wall state of the workpiece 2 is judged.
另外，當兩相鄰位置對應之兩個第二資訊差異大時，即依據第一量測單元133之第一資訊判斷工件2之狀態。如第六C圖所示，第二量測單元135量測位於遮蔽層21之位置P26後所產生之第二資訊會明顯小於位置P25對應之第二資訊，當兩者變小之差異大於預定之門檻時，控制模組15則依據第一量測單元133量測相鄰於位置P26之位置P12以及之後各位置P13所產生之第一資訊接續判斷工件2之狀態。上述之兩門檻是可預先依據欲形成於工件2之輪廓，經過試驗或者模擬計算而得知。 In addition, when the two second information differences corresponding to the two adjacent positions are large, the state of the workpiece 2 is determined according to the first information of the first measuring unit 133. As shown in FIG. C, the second measurement unit 135 measures the second information generated after the position P26 of the shielding layer 21 is significantly smaller than the second information corresponding to the position P25. When the difference between the two is smaller than the predetermined When the threshold is reached, the control module 15 determines the state of the workpiece 2 based on the first information generated by the first measurement unit 133 adjacent to the position P12 of the position P26 and the subsequent positions P13. The above two thresholds can be determined in advance according to the contour to be formed on the workpiece 2, through trial or simulation calculation.
判斷壁面之狀態的說明如下，由於第二量測單元135之量測角度為已知，且第二量測單元135所得之第二資訊表示第二量測單元135與量測位置之距離，如此當壁面並非為直壁時，可以藉由三 角函數之餘弦函數得知第二量測單元135與壁面間之相對深度資訊。舉例說明，若第二量測單元135量測位置P21之量測角度為θ1，且經量測所產生之第二資訊為斜邊，如此經由餘弦函數即可得知第二量測單元135相對於位置P21時的高度(深度)H21。同理，可以依據對應於位置P22與P23的第二資訊求得第二量測單元135相對於位置P22與P23的高度H22與H23，如此即可得知工件2之深度變化，而建構出壁面之輪廓為非直壁的斜壁23。若第二量測單元135之量測間距小且量測位置多，建構出之輪廓的解析度越高，此方式也可以判斷出曲壁，而並非僅能判斷斜壁。 The description of the state of the wall is as follows. Since the measurement angle of the second measurement unit 135 is known, and the second information obtained by the second measurement unit 135 indicates the distance between the second measurement unit 135 and the measurement position, When the wall surface is not a straight wall, the relative depth information between the second measuring unit 135 and the wall surface can be known by the cosine function of the trigonometric function. For example, if the measurement angle of the measurement position P21 of the second measurement unit 135 is θ 1 and the second information generated by the measurement is a hypotenuse, the second measurement unit 135 can be known via the cosine function. The height (depth) H21 with respect to the position P21. Similarly, the heights H22 and H23 of the second measuring unit 135 relative to the positions P22 and P23 can be obtained according to the second information corresponding to the positions P22 and P23, so that the depth change of the workpiece 2 can be known, and the wall surface can be constructed. The outline is a non-straight wall inclined wall 23. If the measuring distance of the second measuring unit 135 is small and the measuring position is large, the higher the resolution of the constructed contour, the way the curved wall can be judged, and not only the inclined wall can be judged.
由第六C圖可知，由於第二量測單元135並非以垂直於工件2之角度量測工件2，因此第二量測單元135當下所在之位置與量測工件2之位置是有一固定水平距離，即控制模組15所求得之相對深度資訊並非為第二量測單元135當下所在位置與工件2間之深度，因此控制模組15可依據此固定水平距離而補償，如此即可建構出工件2之壁面的輪廓。 As can be seen from the sixth C diagram, since the second measuring unit 135 does not measure the workpiece 2 at an angle perpendicular to the workpiece 2, the position of the second measuring unit 135 and the position of the measuring workpiece 2 have a fixed horizontal distance. That is, the relative depth information obtained by the control module 15 is not the depth between the current position of the second measuring unit 135 and the workpiece 2, so the control module 15 can compensate according to the fixed horizontal distance, so that the control module 15 can be constructed. The contour of the wall of the workpiece 2.
請參閱第六D圖，此圖用於說明本發明判斷壁面為直壁的方式。 當壁面為直壁25時，以第二量測單元135所在之位置與量測位於直壁25之位置P24、P25所建構出之兩個三角形是相似三角形，如此由於角度θ2為量測角度之互補角度，所以角度θ2為已知，且第二量測單元135所產生之第二資訊為為斜邊，如此可以藉由三角函數之正弦函數得知第二量測單元135與量測之位置之相對深度資訊。如此即可得知工件2之直壁25深度，而建構出直壁25之輪廓。 Please refer to the sixth D diagram for explaining the manner in which the present invention judges that the wall surface is a straight wall. When the wall surface is the straight wall 25, the two triangles constructed by the position of the second measuring unit 135 and the positions P24 and P25 located at the straight wall 25 are similar triangles, so that the angle θ 2 is the measuring angle. The complementary angle, so the angle θ 2 is known, and the second information generated by the second measuring unit 135 is a hypotenuse, so that the second measuring unit 135 and the measurement can be known by the sine function of the trigonometric function. Relative depth information of the location. Thus, the depth of the straight wall 25 of the workpiece 2 can be known, and the contour of the straight wall 25 can be constructed.
此外，由於第二量測單元135所產生之第二資訊相當於三角形之 斜邊，所以可藉由判斷兩相鄰位置對應之兩筆第二資訊的比例是否位於預定之一比例範圍，而判斷出工件2之壁面是否為直壁25，以決定運用餘弦函數或者正弦函數得知壁面之狀態。於本發明之一實施例中，上述處理第一資訊與第二資訊為訊號處理單元157，以產生輪廓資訊。 In addition, since the second information generated by the second measurement unit 135 is equivalent to a triangle The hypotenuse, so it can be determined whether the wall surface of the workpiece 2 is a straight wall 25 by determining whether the ratio of the two pieces of second information corresponding to the two adjacent positions is within a predetermined ratio range, thereby determining whether to use a cosine function or a sine function. Know the state of the wall. In an embodiment of the present invention, the processing the first information and the second information into the signal processing unit 157 to generate contour information.
請一併參閱第七圖，其係為本發明之具量測之電化學加工方法之一實施例之流程圖。如圖所示，本發明之電化學加工方法進行步驟S1，量測工件2，並產生量測資訊，接續進行步驟S3，依據量測資訊決定加工參數，並如步驟S5所示，依據加工參數對工件2進行電化學加工。此外，更可在工件2被加工後，量測工件2，而產生第二量測資訊，並依據前次產生之第一量測資訊與第二量測資訊產生加工資訊，且依據加工資訊決定加工參數。另外，本發明之電化學加工方法更可依據量測資訊與電極之移動資訊產生輪廓資訊，再進而依據輪廓資訊決定加工參數。 Please refer to the seventh figure, which is a flow chart of an embodiment of the electrochemical processing method of the present invention. As shown in the figure, the electrochemical processing method of the present invention performs step S1, measures the workpiece 2, and generates measurement information, and then proceeds to step S3 to determine processing parameters according to the measurement information, and according to the processing parameters, as shown in step S5. The workpiece 2 is electrochemically processed. In addition, after the workpiece 2 is processed, the workpiece 2 is measured, and the second measurement information is generated, and the processing information is generated according to the first measurement information and the second measurement information generated last time, and is determined according to the processing information. Processing parameters. In addition, the electrochemical processing method of the present invention can generate contour information based on the measurement information and the movement information of the electrodes, and then determine the processing parameters according to the contour information.
綜合上述，本發明之電化學加工裝置與方法可量測工件，以得知工件之狀態，進而依據工件之狀態控制電化學加工，且可補償前次進行電化學加工之誤差，如此可提高電化學加工的品質。此外，由於量測工件時可不需要卸下工件，所以工件只需定位一次，如此可以減少完成加工工件的時間。 In summary, the electrochemical processing apparatus and method of the present invention can measure a workpiece to know the state of the workpiece, and then control the electrochemical processing according to the state of the workpiece, and can compensate for the error of the previous electrochemical processing, thereby improving the electrochemicalization. Learn the quality of processing. In addition, since it is not necessary to remove the workpiece when measuring the workpiece, the workpiece only needs to be positioned once, which can reduce the time required to complete the machining of the workpiece.
由上述可知，本發明確實已經達於突破性之結構，而具有改良之發明內容，同時又能夠達到產業上利用性與進步性，當符合專利法之規定，爰依法提出發明專利申請，懇請 鈞局審查委員授予合法專利權，至為感禱。 As can be seen from the above, the present invention has indeed achieved a breakthrough structure, and has improved invention content, and at the same time, can achieve industrial utilization and progress. When complying with the provisions of the Patent Law, the invention patent application is filed according to law. The Board of Review examiners granted legal patent rights and was praying.
1‧‧‧電化學加工裝置 1‧‧‧Electrochemical processing equipment
11‧‧‧電化學加工模組 11‧‧‧Electrochemical processing module
13‧‧‧量測模組 13‧‧‧Measurement module
15‧‧‧控制模組 15‧‧‧Control Module
151‧‧‧資訊儲存單元 151‧‧‧Information storage unit
153‧‧‧運算單元 153‧‧‧ arithmetic unit
155‧‧‧資料庫 155‧‧‧Database
17‧‧‧移行模組 17‧‧‧Transition module
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