TWI580089B - Barrier functional film and manufaturing thereof, environmental sensitive element, and display apparatus - Google Patents

Description

阻障功能膜及其製作方法、環境敏感電子元件及顯 示裝置 Barrier functional film and its manufacturing method, environmentally sensitive electronic components and display Display device

本揭露是有關於一種功能膜及其製作方法、環境敏感電子元件以及顯示裝置，且特別是有關於一種阻障功能膜及其製作方法、環境敏感電子元件以及顯示裝置。 The present disclosure relates to a functional film and a method of fabricating the same, an environmentally sensitive electronic component, and a display device, and more particularly to a barrier functional film and a method of fabricating the same, an environmentally sensitive electronic component, and a display device.

可撓性環境敏感電子元件或顯示裝置相較於一般硬質環境敏感電子元件或顯示裝置的應用更為廣泛，其可捲曲、方便攜帶、符合安全性、產品應用廣，但較不耐高溫、阻水阻氧氣性較差、耐化學藥品性較差及熱膨脹係數大。一般而言，可撓性環境敏感電子元件或顯示裝置的可撓性基板可用來承載電子元件及/或用來作為蓋板(cover)以對電子元件進行封裝，由於可撓性基板無法完全阻隔水氣及氧氣的穿透，因此水氣及氧氣的滲入將加速可撓性基板上的電子元件老化，進而導致電子元件的壽命減短，無法符合市場的需求。 Flexible environment sensitive electronic components or display devices are more widely used than general hard environment sensitive electronic components or display devices. They can be crimped, portable, safe, and widely used, but less resistant to high temperatures and resistance. Water resistance is poor, chemical resistance is poor, and thermal expansion coefficient is large. In general, flexible environmentally sensitive electronic components or flexible substrates of display devices can be used to carry electronic components and/or as a cover to package electronic components, since the flexible substrate cannot be completely blocked. The penetration of moisture and oxygen, so the infiltration of moisture and oxygen will accelerate the aging of electronic components on the flexible substrate, which in turn leads to a shortened life of the electronic components and cannot meet the market demand.

本揭露提供一種阻障功能膜及其製作方法，以提供良好的水氣及氧氣的阻隔能力。 The present disclosure provides a barrier functional film and a method of fabricating the same to provide good moisture and oxygen barrier properties.

本揭露另提供一種環境敏感電子元件以及顯示裝置，用以改善環境敏感電子元件阻隔水氣及氧氣的能力，其中環境敏感電子元件例如是有機電子元件，如有機發光二極體(Organic Light Emitting Diode)、有機太陽能電池(Organic Solar Cell)、有機感光元件(Organic Photo-Sensitive Device)等等。 The present disclosure further provides an environmentally sensitive electronic component and a display device for improving the ability of environmentally sensitive electronic components to block moisture and oxygen, such as organic electronic components, such as an organic light emitting diode (Organic Light Emitting Diode). ), Organic Solar Cell, Organic Photo-Sensitive Device, and the like.

本揭露提出一種阻障功能膜，其包括基板、至少一側壁阻障結構、離型膜以及膠材。側壁阻障結構位於基板上。離型膜配置於基板上方，其中側壁阻障結構位於基板與離型膜之間。膠材包覆側壁阻障結構並且位於基板與離型膜之間。 The present disclosure provides a barrier functional film comprising a substrate, at least one sidewall barrier structure, a release film, and a glue. The sidewall barrier structure is on the substrate. The release film is disposed above the substrate, wherein the sidewall barrier structure is located between the substrate and the release film. The glue coats the sidewall barrier structure and is located between the substrate and the release film.

本揭露提出一種阻障功能膜的製作方法，其包括下述方法。於基板上形成至少一側壁阻障結構。於離型膜上形成膠材。透過膠材將離型膜貼附於基板上，其中膠材包覆側壁阻障結構並且位於基板與該離型膜之間。 The present disclosure proposes a method for fabricating a barrier functional film comprising the following method. At least one sidewall barrier structure is formed on the substrate. A glue is formed on the release film. The release film is attached to the substrate through a rubber material, wherein the rubber material covers the sidewall barrier structure and is located between the substrate and the release film.

本揭露提出一種環境敏感電子元件，其包括第一基板、至少一第一側壁阻障結構、環境敏感電子元件背板以及第一膠材。第一側壁阻障結構位於第一基板上。第一基板配置於環境敏感電子元件背板上方，且第一側壁阻障結構位於第一基板與環境敏感電子元件背板之間。第一膠材配置於第一基板與環境敏感電 子元件背板之間，且第一膠材包覆第一側壁阻障結構，其中第一基板與第一側壁阻障結構透過第一膠材貼合於環境敏感電子元件背板上。 The present disclosure provides an environmentally sensitive electronic component including a first substrate, at least a first sidewall barrier structure, an environmentally sensitive electronic component backplate, and a first adhesive. The first sidewall barrier structure is on the first substrate. The first substrate is disposed above the environmentally sensitive electronic component backplane, and the first sidewall barrier structure is located between the first substrate and the environmentally sensitive electronic component backplane. The first adhesive material is disposed on the first substrate and the environment sensitive electricity The first component is coated with the first sidewall barrier structure, and the first substrate and the first sidewall barrier structure are adhered to the environmentally sensitive electronic component backplane through the first adhesive.

本揭露提出一種顯示裝置，其包括環境敏感電子元件、第二基板、至少一第二側壁阻障結構以及第二膠材。第二側壁阻障結構位於第二基板上，且第二側壁阻障結構位於環境敏感電子元件與第二基板之間。第二膠材配置於第二基板與環境敏感電子元件之間，且第二膠材包覆第二側壁阻障結構，其中第二基板與第二側壁阻障結構透過第二膠材貼合於環境敏感電子元件上。 The present disclosure provides a display device including an environmentally sensitive electronic component, a second substrate, at least a second sidewall barrier structure, and a second adhesive. The second sidewall barrier structure is on the second substrate, and the second sidewall barrier structure is located between the environmentally sensitive electronic component and the second substrate. The second adhesive material is disposed between the second substrate and the environmentally sensitive electronic component, and the second adhesive material is coated with the second sidewall barrier structure, wherein the second substrate and the second sidewall barrier structure are adhered to the second adhesive material through the second adhesive material Environmentally sensitive electronic components.

基於上述，本揭露的阻障功能膜具有接合於基板及離型膜之間的膠材，且側壁阻障結構配置於基板上上，其中側壁阻障結構位於基板及離型膜之間。此外，本揭露的環境敏感電子元件及顯示裝置具有接合於兩基板之間的膠材，其中側壁阻障結構配置於兩基板之間並且至少部分側壁阻障結構圍繞環境敏感電子元件背板，其中側壁阻障結構由膠材所包覆。換言之，本揭露的阻障功能、環境敏感電子元件及顯示裝置具有良好的阻隔水氣與氧氣的能力且易於量產。 Based on the above, the barrier functional film of the present disclosure has a glue material bonded between the substrate and the release film, and the sidewall barrier structure is disposed on the substrate, wherein the sidewall barrier structure is located between the substrate and the release film. In addition, the environmentally sensitive electronic component and the display device of the present disclosure have a glue material bonded between the two substrates, wherein the sidewall barrier structure is disposed between the two substrates and at least a portion of the sidewall barrier structure surrounds the environmentally sensitive electronic component backplane, wherein The sidewall barrier structure is covered by a rubber material. In other words, the barrier function, the environmentally sensitive electronic component and the display device of the present disclosure have a good ability to block moisture and oxygen and are easy to mass-produce.

為讓本揭露能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 In order to make the disclosure more apparent, the following embodiments are described in detail with reference to the accompanying drawings.

10、10a‧‧‧吸濕材 10, 10a‧‧‧Hydraulic materials

20‧‧‧散熱輔助材料 20‧‧‧Solution aids

30‧‧‧抗電磁干擾材料 30‧‧‧Anti-electromagnetic interference materials

100A~100R‧‧‧阻障功能膜 100A~100R‧‧‧Disability function film

110‧‧‧基板 110‧‧‧Substrate

110a、210a‧‧‧可撓性基板 110a, 210a‧‧‧flexible substrate

110b、210b‧‧‧阻障層 110b, 210b‧‧‧ barrier layer

120‧‧‧側壁阻障結構 120‧‧‧ sidewall barrier structure

130‧‧‧離型膜 130‧‧‧ release film

140、140a、240a‧‧‧膠材 140, 140a, 240a‧‧‧ glue

200A~200R‧‧‧環境敏感電子元件 200A~200R‧‧‧Environmentally sensitive electronic components

210‧‧‧第一基板 210‧‧‧First substrate

220‧‧‧第一側壁阻障結構 220‧‧‧First sidewall barrier structure

230‧‧‧環境敏感電子元件背板 230‧‧‧Environmentally sensitive electronic component backplane

230a‧‧‧可撓性基材 230a‧‧‧Flexible substrate

230b‧‧‧環境敏感電子元件單元 230b‧‧‧Environmentally sensitive electronic component unit

232b‧‧‧主動元件 232b‧‧‧Active components

234b‧‧‧電路導線 234b‧‧‧Circuit wire

240‧‧‧第一膠材 240‧‧‧First glue

300‧‧‧顯式裝置 300‧‧‧ Explicit device

310‧‧‧第二基板 310‧‧‧second substrate

320‧‧‧第二側壁阻障結構 320‧‧‧Second sidewall barrier structure

340‧‧‧第二膠材 340‧‧‧Second rubber

CAR‧‧‧可撓性載板 CAR‧‧‧Flexible carrier board

CF‧‧‧彩色濾光層 CF‧‧‧ color filter layer

DIS‧‧‧顯示面板 DIS‧‧‧ display panel

L‧‧‧光線 L‧‧‧Light

LID‧‧‧蓋板部 LID‧‧‧ Cover Department

PA‧‧‧光阻層圖案 PA‧‧‧ photoresist layer pattern

PC‧‧‧光罩 PC‧‧‧Photo Mask

POL‧‧‧四分之一波長補償膜加偏光膜 POL‧‧‧ quarter-wave compensation film plus polarizing film

PR‧‧‧光阻層 PR‧‧‧ photoresist layer

TP‧‧‧觸控層 TP‧‧‧ touch layer

圖1A為本揭露第一實施例的阻障功能膜的剖面示意圖。 1A is a schematic cross-sectional view showing a barrier functional film according to a first embodiment of the present disclosure.

圖1B為圖1A的阻障功能膜的上視圖。 FIG. 1B is a top view of the barrier functional film of FIG. 1A.

圖2是本揭露第二實施例的阻障功能膜的剖面示意圖。 2 is a schematic cross-sectional view showing a barrier functional film of a second embodiment of the present disclosure.

圖3A是本揭露第三實施例的阻障功能膜的剖面示意圖。 3A is a schematic cross-sectional view showing a barrier function film according to a third embodiment of the present disclosure.

圖3B是本揭露第四實施例的阻障功能膜的剖面示意圖。 3B is a schematic cross-sectional view of a barrier functional film according to a fourth embodiment of the present disclosure.

圖4A是本揭露第五實施例的阻障功能膜的剖面示意圖。 4A is a schematic cross-sectional view showing a barrier functional film according to a fifth embodiment of the present disclosure.

圖4B是本揭露第六實施例的阻障功能膜的剖面示意圖。 4B is a schematic cross-sectional view of a barrier functional film according to a sixth embodiment of the present disclosure.

圖5A是本揭露第七實施例的阻障功能膜的剖面示意圖。 FIG. 5A is a schematic cross-sectional view showing a barrier function film according to a seventh embodiment of the present disclosure.

圖5B是本揭露第八實施例的阻障功能膜的剖面示意圖。 FIG. 5B is a schematic cross-sectional view showing a barrier function film according to an eighth embodiment of the present disclosure.

圖5C是本揭露第九實施例的阻障功能膜的剖面示意圖。 5C is a schematic cross-sectional view showing a barrier function film according to a ninth embodiment of the present disclosure.

圖5D是本揭露第十實施例的阻障功能膜的剖面示意圖。 5D is a schematic cross-sectional view of a barrier functional film according to a tenth embodiment of the present disclosure.

圖6A是本揭露第十一實施例的阻障功能膜的剖面示意圖。 Fig. 6A is a cross-sectional view showing a barrier functional film of an eleventh embodiment of the present disclosure.

圖6B是本揭露第十二實施例的阻障功能膜的剖面示意圖。 6B is a schematic cross-sectional view showing a barrier functional film according to a twelfth embodiment of the present disclosure.

圖6C是本揭露第十三實施例的阻障功能膜的剖面示意圖。 6C is a cross-sectional view showing a barrier functional film of a thirteenth embodiment of the present disclosure.

圖6D是本揭露第十四實施例的阻障功能膜的剖面示意圖。 6D is a schematic cross-sectional view showing a barrier functional film of the fourteenth embodiment of the present disclosure.

圖7A是本揭露第十五實施例的阻障功能膜的剖面示意圖。 7A is a schematic cross-sectional view showing a barrier functional film of a fifteenth embodiment of the present disclosure.

圖7B是本揭露第十六實施例的阻障功能膜的剖面示意圖。 7B is a schematic cross-sectional view showing a barrier functional film of a sixteenth embodiment of the present disclosure.

圖7C是本揭露第十七實施例的阻障功能膜的剖面示意圖。 Fig. 7C is a cross-sectional view showing the barrier functional film of the seventeenth embodiment of the present disclosure.

圖7D是本揭露第十八實施例的阻障功能膜的剖面示意圖。 7D is a schematic cross-sectional view showing a barrier functional film of an eighteenth embodiment of the present disclosure.

圖8A-1至圖8D是本揭露的阻障功能膜的製作方法的剖面示意圖。 8A-1 to 8D are schematic cross-sectional views showing a method of fabricating the barrier functional film of the present disclosure.

圖9為本揭露第一實施例的環境敏感電子元件的剖面示意 圖。 FIG. 9 is a schematic cross-sectional view of an environmentally sensitive electronic component according to a first embodiment of the present disclosure Figure.

圖10是本揭露第二實施例的環境敏感電子元件的剖面示意圖。 Figure 10 is a cross-sectional view of an environmentally sensitive electronic component of a second embodiment of the present disclosure.

圖11A是本揭露第三實施例的環境敏感電子元件的剖面示意圖。 11A is a cross-sectional view of an environmentally sensitive electronic component of a third embodiment of the present disclosure.

圖11B是本揭露第四實施例的環境敏感電子元件的剖面示意圖。 11B is a cross-sectional view of an environmentally sensitive electronic component of a fourth embodiment of the present disclosure.

圖12A是本揭露第五實施例的環境敏感電子元件的剖面示意圖。 12A is a cross-sectional view of an environmentally sensitive electronic component of a fifth embodiment of the present disclosure.

圖12B是本揭露第六實施例的環境敏感電子元件的剖面示意圖。 12B is a cross-sectional view of an environmentally sensitive electronic component of a sixth embodiment of the present disclosure.

圖13A是本揭露第七實施例的環境敏感電子元件的剖面示意圖。 13A is a cross-sectional view of an environmentally sensitive electronic component of a seventh embodiment of the present disclosure.

圖13B是本揭露第八實施例的環境敏感電子元件的剖面示意圖。 13B is a cross-sectional view of an environmentally sensitive electronic component of an eighth embodiment of the present disclosure.

圖13C是本揭露第九實施例的環境敏感電子元件的剖面示意圖。 13C is a cross-sectional view of an environmentally sensitive electronic component of a ninth embodiment of the present disclosure.

圖13D是本揭露第十實施例的環境敏感電子元件的剖面示意圖。 13D is a cross-sectional view of an environmentally sensitive electronic component of a tenth embodiment of the present disclosure.

圖14A是本揭露第十一實施例的環境敏感電子元件的剖面示意圖。 Figure 14A is a cross-sectional view showing an environmentally sensitive electronic component of an eleventh embodiment of the present disclosure.

圖14B是本揭露第十二實施例的環境敏感電子元件的剖面示 意圖。 14B is a cross-sectional view of an environmentally sensitive electronic component of a twelfth embodiment of the present disclosure. intention.

圖14C是本揭露第十三實施例的環境敏感電子元件的剖面示意圖。 Figure 14C is a cross-sectional view showing the environmentally sensitive electronic component of the thirteenth embodiment of the present disclosure.

圖14D是本揭露第十四實施例的環境敏感電子元件的剖面示意圖。 Figure 14D is a cross-sectional view of an environmentally sensitive electronic component of a fourteenth embodiment of the present disclosure.

圖15A是本揭露第十五實施例的環境敏感電子元件的剖面示意圖。 15A is a cross-sectional view of an environmentally sensitive electronic component of a fifteenth embodiment of the present disclosure.

圖15B是本揭露第十六實施例的環境敏感電子元件的剖面示意圖。 Figure 15B is a cross-sectional view showing the environmentally sensitive electronic component of the sixteenth embodiment of the present disclosure.

圖15C是本揭露第十七實施例的環境敏感電子元件的剖面示意圖。 Figure 15C is a cross-sectional view showing the environmentally sensitive electronic component of the seventeenth embodiment of the present disclosure.

圖15D是本揭露第十八實施例的環境敏感電子元件的剖面示意圖。 Figure 15D is a cross-sectional view showing an environmentally sensitive electronic component of the eighteenth embodiment of the present disclosure.

圖16是本揭露一實施例的顯示裝置的剖面示意圖。 FIG. 16 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

圖1A為本揭露第一實施例的阻障功能膜的剖面示意圖。圖1B為圖1A的阻障功能膜的上視圖。請參考圖1A，本實施例的阻障功能膜100A包括基板110、至少一側壁阻障結構120、離形膜130以及膠材140。側壁阻障結構120位於基板110上。離型膜130配置於基板110上方，其中側壁阻障結構120位於基板110與離型膜130之間。膠材140包覆側壁阻障結構120並且位於 基板110與離型膜130之間。一般而言，功能阻障層100A的離形膜130是可以經由適當的施力，而自膠材140撕除。 1A is a schematic cross-sectional view showing a barrier functional film according to a first embodiment of the present disclosure. FIG. 1B is a top view of the barrier functional film of FIG. 1A. Referring to FIG. 1A , the barrier function film 100A of the present embodiment includes a substrate 110 , at least one sidewall barrier structure 120 , a release film 130 , and a glue 140 . The sidewall barrier structure 120 is located on the substrate 110. The release film 130 is disposed above the substrate 110 , wherein the sidewall barrier structure 120 is located between the substrate 110 and the release film 130 . The glue 140 covers the sidewall barrier structure 120 and is located The substrate 110 is separated from the release film 130. In general, the release film 130 of the functional barrier layer 100A can be torn from the adhesive 140 via a suitable application force.

在本實施例中，基板110例如是金屬基板或玻璃基板，基板110上可進一步配置吸濕材10，其中吸濕材10位於基板110與膠材140之間並且被側壁阻障結構120所環繞。一般而言，吸濕材10例如是貼附型吸濕材(tape getter)，亦可以是蒸發型吸濕材(evaporation getter)，可用於吸收水氣及氧氣。詳細而言，如圖1B所示，本實施例的吸濕材10，例如是底面積為矩形的貼附型吸濕材(tape getter)，當然，在其他未繪示的實施例中，吸濕材10亦可以是底面積為其他不同型態多邊形的片狀吸濕材，又或者是底面積為圓形、橢圓形的片狀吸濕材，本揭露在此並不加以限制。 In this embodiment, the substrate 110 is, for example, a metal substrate or a glass substrate, and the moisture absorbing material 10 may be further disposed on the substrate 110, wherein the moisture absorbing material 10 is located between the substrate 110 and the rubber material 140 and surrounded by the sidewall barrier structure 120. . In general, the absorbent material 10 is, for example, a tape-type getter, or an evaporation getter, which can be used to absorb moisture and oxygen. Specifically, as shown in FIG. 1B, the moisture absorbing material 10 of the present embodiment is, for example, a tape-type absorbing material having a rectangular bottom area. Of course, in other embodiments not shown, suction The wet material 10 may also be a sheet-like absorbent material having a bottom surface area of other different types of polygonal shapes, or a sheet-shaped absorbent material having a circular or elliptical bottom surface. The disclosure is not limited herein.

此外，阻障功能膜100A更進一步具有散熱輔助材料20，其中散熱輔助材料20亦例如是以粒子的型態分佈於膠材140內。一般而言，散熱輔助材料20例如是鑽石、類鑽石、銅、銀、金、鋁、鉑、陶瓷材料或其氧化物的高散熱係數材料，可用以將熱導出。另一方面，阻障功能膜100A亦可具有抗電磁干擾材料30，其中抗電磁干擾材料30例如是以粒子的型態分佈於膠材140內。一般而言，抗電磁干擾材料30例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。 In addition, the barrier function film 100A further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is also distributed in the glue material 140, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the barrier functional film 100A may also have an anti-electromagnetic interference material 30, wherein the anti-electromagnetic interference material 30 is distributed, for example, in the form of particles in the glue 140. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

如圖1A及圖1B所示，本實施例的側壁阻障結構120例如是連續且封閉的環狀結構，其中側壁阻障結構120垂直於基板 110的截面例如是梯形。在其他未繪示的實施例中，此截面亦可以是矩形或其他不同型態的多邊形，又或者是圓形或橢圓形，本揭露在此並不加以限制。一般而言，側壁阻障結構120例如是透過曝光、顯影與蝕刻處理等製作方法，或者是在金屬基板上以蝕刻方式製作，而於基板110上形成此連續且封閉的環狀結構。此外，在其他未繪示的實施例中，側壁阻障結構120亦可為非封閉的結構。 As shown in FIG. 1A and FIG. 1B, the sidewall barrier structure 120 of the present embodiment is, for example, a continuous and closed annular structure, wherein the sidewall barrier structure 120 is perpendicular to the substrate. The section of 110 is, for example, a trapezoid. In other embodiments not shown, the cross section may also be a rectangle or other different type of polygon, or a circular or elliptical shape, which is not limited herein. In general, the sidewall barrier structure 120 is formed by, for example, exposure, development, and etching processes, or is formed by etching on a metal substrate, and the continuous and closed annular structure is formed on the substrate 110. In addition, in other embodiments not shown, the sidewall barrier structure 120 may also be a non-closed structure.

另一方面，離型膜130例如是聚乙烯對苯二甲酸酯(polyethylene terephthalate,PET)或含矽(silicone)的化合物，離型膜130貼附於膠材140上，以避免膠材140外露而被外界雜質所污染，其中離型膜130可經由適當施力而與膠材140分離。一般而言，膠材140例如是具有一定穿透率的光學膠材，當然本實施例亦可採用具有光學反射特性的光學膠材，或者具有半穿透半反射特性的光學膠材。具體而言，膠材140例如是環氧樹脂(epoxy)、丙烯酸化合物(acrylic compound)或矽膠(silicone)等材質所構成。在本實施例中，膠材140的材質例如是能夠透過加熱、光線照射等方式而被固化(curing)的材質，換言之，膠材140的材質例如是尚未被加熱、光線照射等方式而被固化(curing)的材質。 On the other hand, the release film 130 is, for example, a polyethylene terephthalate (PET) or a silicon-containing compound, and the release film 130 is attached to the adhesive 140 to avoid the adhesive 140. Exposed and contaminated by external impurities, wherein the release film 130 can be separated from the glue 140 by appropriate application of force. In general, the glue material 140 is, for example, an optical glue material having a certain transmittance. Of course, the embodiment may also adopt an optical glue material having optical reflection characteristics or an optical glue material having semi-transparent and semi-reflective properties. Specifically, the adhesive material 140 is made of, for example, an epoxy resin, an acrylic compound, or a silicone. In the present embodiment, the material of the rubber material 140 is, for example, a material that can be cured by heating, light irradiation, or the like. In other words, the material of the rubber material 140 is cured without being heated or irradiated with light, for example. (curing) material.

雖然上述實施例的阻障功能膜100A的基板110例如是金屬基板或玻璃基板，且吸濕材10例如是底面積為矩形的貼附型吸濕材(tape getter)配置於基板110上。然而，在其他的實施例中， 可達到阻隔水氣與氧氣之能力的不同結構設計或配置，仍屬於本揭露可採用的技術方案，不脫離本揭露所欲保護的範圍。以下將列舉多個不同的實施例來分別說明阻障功能膜100B至100R的設計。 The substrate 110 of the barrier functional film 100A of the above embodiment is, for example, a metal substrate or a glass substrate, and the moisture absorbing material 10 is disposed on the substrate 110, for example, a tape-type getter having a rectangular bottom surface. However, in other embodiments, Different structural designs or configurations that can achieve the ability to block moisture and oxygen are still within the scope of the present disclosure, without departing from the scope of the present disclosure. A plurality of different embodiments will be enumerated below to separately illustrate the design of the barrier functional films 100B to 100R.

圖2是本揭露第二實施例的阻障功能膜的剖面示意圖。 請參考圖2，圖2的阻障功能膜100B與圖1A的阻障功能膜100A相似，其不同之處在於：圖2的阻障功能膜100B的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 2 is a schematic cross-sectional view showing a barrier functional film of a second embodiment of the present disclosure. Referring to FIG. 2, the barrier function film 100B of FIG. 2 is similar to the barrier function film 100A of FIG. 1A, except that the moisture absorbing material 10a of the barrier function film 100B of FIG. 2 is, for example, in the form of particles. Distributed within the gel material 140, in general, the moisture absorbing material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖3A是本揭露第三實施例的阻障功能膜的剖面示意 圖。圖3B是本揭露第四實施例的阻障功能膜的剖面示意圖。請參考圖3A，圖3A的阻障功能膜100C與圖1A的阻障功能膜100A相似，其不同之處在於：圖3A的阻障功能膜100C的基板110可進一步包括可撓性基板110a以及阻障層110b，其中可撓性基板110a的材質可為聚亞醯胺(PI)，亦可以是聚乙烯對苯二甲酸酯(polyethylene terephthalate,PET)、聚間苯二甲酸乙二酯(polyethylene naphthalate,PEN)、聚醚石風(Polyethersulfone,PES)、聚甲基丙烯酸甲酯(polymethyl methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)或金屬箔(metal foil)。 3A is a schematic cross-sectional view showing a barrier functional film according to a third embodiment of the present disclosure. Figure. 3B is a schematic cross-sectional view of a barrier functional film according to a fourth embodiment of the present disclosure. Referring to FIG. 3A, the barrier function film 100C of FIG. 3A is similar to the barrier function film 100A of FIG. 1A, except that the substrate 110 of the barrier function film 100C of FIG. 3A may further include a flexible substrate 110a and The barrier layer 110b, wherein the material of the flexible substrate 110a may be polyamidamine (PI), polyethylene terephthalate (PET) or polyethylene isophthalate (polyethylene terephthalate). Polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (PC) or metal foil.

另一方面，阻障層110b配置於可撓性基板110a上，其 中阻障層110b例如是單層或多層無機材，例如是矽氧化合物(SiO_x)、矽氮化合物(SiN_x)、矽氮氧化合物(SiN_xO_y)或氧化鋁 (Al₂O₃)等，亦可以是無機與有機混合材，例如是碳矽(Si-C)聚合物等，又或者是有機與無機多層堆疊層，其中有機材例如是壓克力(Acrylic)、環氧樹脂(Epoxy)或聚亞芳香基醚(Parylene)系列等材料。一般而言，無機材可利用化學氣相沉積(CVD)或濺鍍(Sputter)等製作方法而形成於可撓性基板110a上。無機與有機混合材可利用化學氣相沉積(CVD)製作方法而形成於可撓性基板110a上。有機材可利用化學氣相沉積(CVD)、噴灑(Spray)或塗佈(Coating)等製作方法而形成可撓性基板110a上。 On the other hand, the barrier layer 110b is disposed on the flexible substrate 110a, wherein the barrier layer 110b is, for example, a single layer or a plurality of layers of inorganic materials, such as a silicon oxide compound (SiO _x ), a nitrogen compound (SiN _x ), or a germanium. Nitrogen oxides (SiN _x O _y ) or alumina (Al ₂ O ₃ ), etc., may also be inorganic and organic mixed materials, such as carbon germanium (Si-C) polymers, or organic and inorganic multilayer stacks. The layer, wherein the organic material is, for example, a material such as Acrylic, Epoxy or Parylene. In general, the inorganic material can be formed on the flexible substrate 110a by a manufacturing method such as chemical vapor deposition (CVD) or sputtering. The inorganic and organic mixed materials can be formed on the flexible substrate 110a by a chemical vapor deposition (CVD) fabrication method. The organic material can be formed on the flexible substrate 110a by a production method such as chemical vapor deposition (CVD), spraying, or coating.

簡言之，本實施例的阻障層110b例如是單層膜層的阻障結構，可用以阻隔外界水氣與氧氣，在其他實施例中，阻障層110b亦可以是兩層以上的膜層所構成的阻障結構，本揭露在此並不加以限制。 In short, the barrier layer 110b of the present embodiment is, for example, a barrier structure of a single-layer film layer, which can be used to block external moisture and oxygen. In other embodiments, the barrier layer 110b can also be a film of two or more layers. The barrier structure formed by the layer is not limited herein.

請參考圖3B，圖3B的阻障功能膜100D與圖3A的阻障功能膜100C相似，其不同之處在於：圖3B的阻障功能膜100D的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Referring to FIG. 3B, the barrier function film 100D of FIG. 3B is similar to the barrier function film 100C of FIG. 3A, except that the moisture absorbing material 10a of the barrier function film 100D of FIG. 3B is, for example, in the form of particles. Distributed within the gel material 140, in general, the moisture absorbing material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖4A是本揭露第五實施例的阻障功能膜的剖面示意圖。圖4B是本揭露第六實施例的阻障功能膜的剖面示意圖。請參考圖4A，圖4A的阻障功能膜100E與圖3A的阻障功能膜100C相似，其不同之處在於：圖4A的阻障功能膜100E更具有四分之一波長補償膜加偏光膜POL，其中四分之一波長補償膜加偏光膜POL配置於可撓性基板110a上，且四分之一波長補償膜加偏光膜 POL與阻障層110b分別位於可撓性基板110a兩對側。一般而言，四分之一波長補償膜加偏光膜POL，其中補償膜例如是指對於特定的波長(λ)而延遲了具有其波長(λ)的四分之一大小的相位差薄膜。 4A is a schematic cross-sectional view showing a barrier functional film according to a fifth embodiment of the present disclosure. 4B is a schematic cross-sectional view of a barrier functional film according to a sixth embodiment of the present disclosure. Referring to FIG. 4A, the barrier function film 100E of FIG. 4A is similar to the barrier function film 100C of FIG. 3A, except that the barrier function film 100E of FIG. 4A further has a quarter-wave compensation film and a polarizing film. POL, wherein the quarter-wavelength compensation film plus polarizing film POL is disposed on the flexible substrate 110a, and the quarter-wavelength compensation film is provided with a polarizing film The POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a. In general, the quarter-wavelength compensation film is provided with a polarizing film POL, wherein the compensation film is, for example, a retardation film having a quarter-length whose wavelength (λ) is delayed for a specific wavelength (λ).

請參考圖4B，圖4B的阻障功能膜100F與圖4A的阻障功能膜100E相似，其不同之處在於：圖4B的阻障功能膜100F的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Referring to FIG. 4B, the barrier function film 100F of FIG. 4B is similar to the barrier function film 100E of FIG. 4A, except that the moisture absorbing material 10a of the barrier function film 100F of FIG. 4B is, for example, in the form of particles. Distributed within the gel material 140, in general, the moisture absorbing material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖5A是本揭露第七實施例的阻障功能膜的剖面示意圖。圖5B是本揭露第八實施例的阻障功能膜的剖面示意圖。圖5C是本揭露第九實施例的阻障功能膜的剖面示意圖。圖5D是本揭露第十實施例的阻障功能膜的剖面示意圖。請參考圖5A，圖5A的阻障功能膜100G與圖3A的阻障功能膜100C相似，其不同之處在於：圖5A的阻障功能膜100G更具有觸控層TP，其中觸控層TP配置於可撓性基板110a上，且觸控層TP與膠材140分別位於阻障層110b的兩對側。詳細而言，本實施例的觸控層TP位於可撓性基板110a與阻障層110b之間。此外，阻障功能膜100G進一步具有一可撓性載板CAR，其中可撓性載板CAR例如是透過光學膠(未繪示)貼合於可撓性基板110a上，因此可撓性載板CAR可經由適當施力而與可撓性基板110a分離。 FIG. 5A is a schematic cross-sectional view showing a barrier function film according to a seventh embodiment of the present disclosure. FIG. 5B is a schematic cross-sectional view showing a barrier function film according to an eighth embodiment of the present disclosure. 5C is a schematic cross-sectional view showing a barrier function film according to a ninth embodiment of the present disclosure. 5D is a schematic cross-sectional view of a barrier functional film according to a tenth embodiment of the present disclosure. Referring to FIG. 5A, the barrier function film 100G of FIG. 5A is similar to the barrier function film 100C of FIG. 3A, and the difference is that the barrier function film 100G of FIG. 5A further has a touch layer TP, wherein the touch layer TP The touch layer TP and the glue material 140 are respectively disposed on the opposite sides of the barrier layer 110b. In detail, the touch layer TP of the embodiment is located between the flexible substrate 110a and the barrier layer 110b. In addition, the barrier function film 100G further has a flexible carrier CAR, wherein the flexible carrier CAR is adhered to the flexible substrate 110a through an optical adhesive (not shown), for example, the flexible carrier The CAR can be separated from the flexible substrate 110a by a suitable biasing force.

請參考圖5B，圖5B的阻障功能膜100H與圖5A的阻障功能膜100G相似，其不同之處在於：圖5B的阻障功能膜100H的觸控層TP例如是透過膠材140a貼合於可撓性基板110a的外表 面，而可撓性載板CAR例如是透過光學膠(未繪示)貼合於觸控層TP上，其中觸控層TP與膠材140分別位於可撓性基板110a的兩對側，且觸控層TP位於可撓性載板CAR與膠材140a之間。 Referring to FIG. 5B, the barrier function film 100H of FIG. 5B is similar to the barrier function film 100G of FIG. 5A, and the difference is that the touch layer TP of the barrier function film 100H of FIG. 5B is affixed, for example, through the adhesive 140a. Fitted to the exterior of the flexible substrate 110a For example, the flexible carrier CAR is attached to the touch layer TP through an optical adhesive (not shown), wherein the touch layer TP and the adhesive 140 are respectively located on opposite sides of the flexible substrate 110a, and The touch layer TP is located between the flexible carrier CAR and the glue 140a.

請參考圖5C，圖5C的阻障功能膜100I與圖5A的阻障 功能膜100G相似，其不同之處在於：圖5C的阻障功能膜100I的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 5C, the barrier functional film 100I of FIG. 5C and the barrier of FIG. 5A. The functional film 100G is similar in that the moisture absorbing material 10a of the barrier function film 100I of FIG. 5C is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

請參考圖5D，圖5D的阻障功能膜100J與圖5B的阻障 功能膜100H相似，其不同之處在於：圖5D的阻障功能膜100J的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 5D, the barrier functional film 100J of FIG. 5D and the barrier of FIG. 5B. The functional film 100H is similar in that the moisture absorbing material 10a of the barrier function film 100J of FIG. 5D is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

圖6A是本揭露第十一實施例的阻障功能膜的剖面示意 圖。圖6B是本揭露第十二實施例的阻障功能膜的剖面示意圖。圖6C是本揭露第十三實施例的阻障功能膜的剖面示意圖。圖6D是本揭露第十四實施例的阻障功能膜的剖面示意圖。請參考圖6A，圖6A的阻障功能膜100K與圖5A的阻障功能膜100G相似，其不同之處在於：圖6A的阻障功能膜100K的可撓性基板110a上配置有四分之一波長補償膜加偏光膜POL，取代了阻障功能膜100G的可撓性載板CAR，其中四分之一波長補償膜加偏光膜POL與阻障層110b分別位於可撓性基板110a兩對側。一般而言，四分之一波長補償膜加偏光膜POL，其中補償膜例如是指對於特定的波長(λ)而延遲了具有其波長(λ)的四分之一大小的相位差薄膜。 6A is a schematic cross-sectional view showing a barrier function film of an eleventh embodiment of the present disclosure; Figure. 6B is a schematic cross-sectional view showing a barrier functional film according to a twelfth embodiment of the present disclosure. 6C is a cross-sectional view showing a barrier functional film of a thirteenth embodiment of the present disclosure. 6D is a schematic cross-sectional view showing a barrier functional film of the fourteenth embodiment of the present disclosure. Referring to FIG. 6A, the barrier function film 100K of FIG. 6A is similar to the barrier function film 100G of FIG. 5A, except that the flexible substrate 110a of the barrier function film 100K of FIG. 6A is arranged with a quarter. A wavelength compensation film plus polarizing film POL replaces the flexible carrier CAR of the barrier functional film 100G, wherein the quarter-wavelength compensation film plus polarizing film POL and the barrier layer 110b are respectively located on the flexible substrate 110a. side. In general, the quarter-wavelength compensation film is provided with a polarizing film POL, wherein the compensation film is, for example, a retardation film having a quarter-length whose wavelength (λ) is delayed for a specific wavelength (λ).

請參考圖6B，圖6B的阻障功能膜100L與圖6A的阻障 功能膜100K相似，其不同之處在於：圖6B的阻障功能膜100L的觸控層TP例如是透過膠材140a貼合於可撓性基板110a的外表面，而四分之一波長補償膜加偏光膜POL配置於觸控層TP上，其中觸控層TP與膠材140分別位於可撓性基板110a的兩對側，且觸控層TP位於四分之一波長補償膜加偏光膜POL與膠材140a之間。一般而言，四分之一波長補償膜加偏光膜POL，其中補償膜例如是指對於特定的波長(λ)而延遲了具有其波長(λ)的四分之一大小的相位差薄膜。 Please refer to FIG. 6B, the barrier functional film 100L of FIG. 6B and the barrier of FIG. 6A. The functional film 100K is similar in that the touch layer TP of the barrier function film 100L of FIG. 6B is adhered to the outer surface of the flexible substrate 110a through the adhesive 140a, for example, and the quarter-wavelength compensation film is attached. The polarizing film POL is disposed on the touch layer TP, wherein the touch layer TP and the glue 140 are respectively located on two opposite sides of the flexible substrate 110a, and the touch layer TP is located in the quarter-wave compensation film and the polarizing film POL. Between the glue 140a. In general, the quarter-wavelength compensation film is provided with a polarizing film POL, wherein the compensation film is, for example, a retardation film having a quarter-length whose wavelength (λ) is delayed for a specific wavelength (λ).

請參考圖6C，圖6C的阻障功能膜100M與圖6A的阻障 功能膜100K相似，其不同之處在於：圖6C的阻障功能膜100M的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 6C, the barrier functional film 100M of FIG. 6C and the barrier of FIG. 6A. The functional film 100K is similar in that the moisture absorbing material 10a of the barrier function film 100M of FIG. 6C is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

請參考圖6D，圖6D的阻障功能膜100N與圖6B的阻障 功能膜100L相似，其不同之處在於：圖6D的阻障功能膜100N的吸濕材10a例如是以粒子的型態分佈於膠材140內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 6D, the barrier functional film 100N of FIG. 6D and the barrier of FIG. 6B. The functional film 100L is similar in that the moisture absorbing material 10a of the barrier function film 100N of FIG. 6D is distributed, for example, in the form of particles in the rubber material 140. Generally, the moisture absorbing material 10a is, for example, transparent or An opaque absorbent that absorbs moisture and oxygen.

圖7A是本揭露第十五實施例的阻障功能膜的剖面示意 圖。圖7B是本揭露第十六實施例的阻障功能膜的剖面示意圖。圖7C是本揭露第十七實施例的阻障功能膜的剖面示意圖。圖7D是本揭露第十八實施例的阻障功能膜的剖面示意圖。請參考圖7A，圖7A的阻障功能膜100O與圖5A的阻障功能膜100G相似，其不 同之處在於：圖7A的阻障功能膜100O更具有彩色濾光層CF，其中彩色濾光層CF配置於觸控層TP與可撓性基板110a之間，且彩色濾光層CF與阻障層110b位於觸控層TP的兩對側。 7A is a schematic cross-sectional view showing a barrier functional film of a fifteenth embodiment of the present disclosure; Figure. 7B is a schematic cross-sectional view showing a barrier functional film of a sixteenth embodiment of the present disclosure. Fig. 7C is a cross-sectional view showing the barrier functional film of the seventeenth embodiment of the present disclosure. 7D is a schematic cross-sectional view showing a barrier functional film of an eighteenth embodiment of the present disclosure. Referring to FIG. 7A, the barrier function film 100O of FIG. 7A is similar to the barrier function film 100G of FIG. 5A, which is not The same is to say that the barrier function film 100O of FIG. 7A further has a color filter layer CF, wherein the color filter layer CF is disposed between the touch layer TP and the flexible substrate 110a, and the color filter layer CF and the resistor The barrier layer 110b is located on two opposite sides of the touch layer TP.

請參考圖7B，圖7B的阻障功能膜100P與圖5B的阻障 功能膜100H相似，其不同之處在於：圖7B的阻障功能膜100P更具有彩色濾光層CF，且彩色濾光層CF、觸控層TP與阻障層110b位於可撓性基板110a的兩對側。 Please refer to FIG. 7B, the barrier functional film 100P of FIG. 7B and the barrier of FIG. 5B. The function film 100H is similar, and the difference is that the barrier function film 100P of FIG. 7B further has a color filter layer CF, and the color filter layer CF, the touch layer TP and the barrier layer 110b are located on the flexible substrate 110a. Two opposite sides.

請參考圖7C，圖7C的阻障功能膜100Q與圖5C的阻障 功能膜100I相似，其不同之處在於：圖7C的阻障功能膜100Q更具有彩色濾光層CF，其中彩色濾光層CF配置於觸控層TP與可撓性基板110a之間，且彩色濾光層CF與阻障層110b位於觸控層TP的兩對側。 Please refer to FIG. 7C, the barrier functional film 100Q of FIG. 7C and the barrier of FIG. 5C. The function film 100I is similar, and the difference is that the barrier function film 100Q of FIG. 7C further has a color filter layer CF, wherein the color filter layer CF is disposed between the touch layer TP and the flexible substrate 110a, and the color The filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP.

請參考圖7D，圖7D的阻障功能膜100R與圖5D的阻障功能膜100J相似，其不同之處在於：圖7D的阻障功能膜100R更具有彩色濾光層CF，其中彩色濾光層位於觸控層TP與可撓性載板之間，且彩色濾光層CF、觸控層TP與阻障層110b位於可撓性基板110a的兩對側。 Referring to FIG. 7D, the barrier function film 100R of FIG. 7D is similar to the barrier function film 100J of FIG. 5D, and the difference is that the barrier function film 100R of FIG. 7D further has a color filter layer CF, wherein the color filter is colored. The layer is located between the touch layer TP and the flexible carrier, and the color filter layer CF, the touch layer TP and the barrier layer 110b are located on opposite sides of the flexible substrate 110a.

以上僅介紹本揭露部分實施例的阻障功能膜100A至100R，並未介紹本揭露的阻障功能膜的製作方法。對此，以下將以圖1A的環境敏感電子元件封裝體100A為例，並配合圖8A-1至圖8D對阻障功能膜的製作方法進行詳細的說明。 Only the barrier functional films 100A to 100R of some embodiments of the present disclosure are described above, and the method for fabricating the barrier functional film of the present disclosure is not described. In this regard, the environmentally sensitive electronic component package 100A of FIG. 1A will be taken as an example, and the method for fabricating the barrier functional film will be described in detail with reference to FIGS. 8A-1 to 8D.

圖8A-1至圖8D是本揭露的阻障功能膜的製作方法的剖 面示意圖。請參考圖8A-1至圖8A-5，首先於基板110上形成至少一側壁阻障結構120，其中基板110例如是金屬基板或玻璃基板。更詳細而言，如圖8A-1所示，於基板110上形成至少一側壁阻障結構120的方法是先於基板110上形成一光阻層PR。接著，如圖8A-2所示，設置一光罩PC於光阻層PR的上方，藉由投射光線L通過光罩PC，以使光阻層PR曝光而達到圖案轉移(pattern transfer)。接著，如圖8A-3所示，將曝光後的光阻層PR進行顯影，使光阻層PR所要轉移的光阻層圖案PA顯現出來。接著，如圖8A-4所示，依據基板110上的光阻層圖案PA進行蝕刻處理，一般而言，例如是透過濕式蝕刻的方式以去除基板110上預定厚度的部份材料。之後，如圖8A-5所示，移除光阻層圖案PA以形成側壁阻障結構120，至此側壁阻障結構120的製作已大致完成。如圖1B所示，本實施例的側壁阻障結構120例如是連續且封閉的環狀結構，另外，如圖8A-5所示，其中側壁阻障結構120垂直於基板110的截面例如是梯形，亦可以是矩形或其他不同型態的多邊形，又或者是圓形或橢圓形，本揭露在此並不加以限制。 8A-1 to 8D are cross-sectional views showing a method of fabricating the barrier functional film of the present disclosure. Schematic diagram. Referring to FIG. 8A-1 to FIG. 8A-5, at least one sidewall barrier structure 120 is first formed on the substrate 110, wherein the substrate 110 is, for example, a metal substrate or a glass substrate. In more detail, as shown in FIG. 8A-1, the method of forming at least one sidewall barrier structure 120 on the substrate 110 is to form a photoresist layer PR on the substrate 110. Next, as shown in FIG. 8A-2, a mask PC is disposed above the photoresist layer PR, and the light is transmitted through the mask PC by the projection light L to expose the photoresist layer PR to achieve pattern transfer. Next, as shown in FIG. 8A-3, the exposed photoresist layer PR is developed to cause the photoresist layer pattern PA to be transferred by the photoresist layer PR to appear. Next, as shown in FIG. 8A-4, an etching process is performed in accordance with the photoresist layer pattern PA on the substrate 110. Generally, for example, a portion of the material of a predetermined thickness on the substrate 110 is removed by wet etching. Thereafter, as shown in FIGS. 8A-5, the photoresist layer pattern PA is removed to form the sidewall barrier structure 120, and the fabrication of the sidewall barrier structure 120 has been substantially completed. As shown in FIG. 1B, the sidewall barrier structure 120 of the present embodiment is, for example, a continuous and closed annular structure. In addition, as shown in FIG. 8A-5, a cross section of the sidewall barrier structure 120 perpendicular to the substrate 110 is, for example, a trapezoid. It may also be a rectangle or a different type of polygon, or a circle or an ellipse, and the disclosure is not limited herein.

接著，如圖8B所示，於一離型膜130上形成一膠材140，一般而言，離型膜130例如是聚乙烯對苯二甲酸酯(polyethylene terephthalate,PET)或含矽(silicone)的化合物，而膠材140則例如是具有一定穿透率的光學膠材，當然本實施例亦可採用具有光學反射特性的光學膠材，或者具有半穿透半反射特性的光學膠 材。具體而言，膠材140例如是環氧樹脂(epoxy)、丙烯酸化合物(acrylic compound)或矽膠(silicone)等材質所構成。在本實施例中，膠材140的材質例如是能夠透過加熱、光線照射等方式而被固化(curing)的材質，換言之，膠材140的材質例如是尚未被加熱、光線照射等方式而被固化(curing)的材質。 Next, as shown in FIG. 8B, a glue material 140 is formed on a release film 130. Generally, the release film 130 is, for example, polyethylene terephthalate (PET) or germanium (silicone). The compound 140, for example, is an optical glue having a certain transmittance. Of course, this embodiment can also use an optical glue having optical reflection characteristics or an optical glue having semi-transparent and semi-reflective properties. material. Specifically, the adhesive material 140 is made of, for example, an epoxy resin, an acrylic compound, or a silicone. In the present embodiment, the material of the rubber material 140 is, for example, a material that can be cured by heating, light irradiation, or the like. In other words, the material of the rubber material 140 is cured without being heated or irradiated with light, for example. (curing) material.

此外，膠材140更進一步具有散熱輔助材料20，其中散熱輔助材料20例如是以粒子的型態分佈於膠材140內。一般而言，散熱輔助材料20例如是鑽石、類鑽石、銅、銀、金、鋁、鉑、陶瓷材料或其氧化物的高散熱係數材料，可用以將熱導出。另一方面，膠材140亦可具有抗電磁干擾材料30，其中抗電磁干擾材料30例如是以粒子的型態分佈於膠材140內。一般而言，抗電磁干擾材料30例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。 In addition, the glue material 140 further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is distributed in the glue material 140, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the glue material 140 may also have an electromagnetic interference resistant material 30, wherein the electromagnetic interference resistant material 30 is distributed, for example, in the form of particles in the glue material 140. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

接著，如圖8C所示，在透過膠材140將離型膜130貼附於基板110上，其中膠材140包覆側壁阻障結構120並且位於基板100與離型膜130之間的製作方法之前，先於基板110上形成一吸濕材10，其中吸濕材10位於基板110與膠材140之間，且吸濕材10被側壁阻障結構120所環繞。一般而言，吸濕材10例如是貼附型吸濕材(tape getter)，亦可以是蒸發型吸濕材(evaporation getter)，可用於吸收水氣及氧氣。詳細而言，如圖1B所示，本實施例的吸濕材10例如是底面積為矩形的貼附型吸濕材(tape getter)，當然，在其他未繪示的實施例中，吸濕材10亦可以是底 面積為其他不同型態多邊形的片狀吸濕材，又或者是底面積為圓形、橢圓形的片狀吸濕材，本揭露在此並不加以限制。 Next, as shown in FIG. 8C , the release film 130 is adhered to the substrate 110 through the adhesive material 140 , wherein the adhesive material 140 covers the sidewall barrier structure 120 and is disposed between the substrate 100 and the release film 130 . Previously, a moisture absorbing material 10 was formed on the substrate 110, wherein the moisture absorbing material 10 was located between the substrate 110 and the rubber material 140, and the moisture absorbing material 10 was surrounded by the sidewall barrier structure 120. In general, the absorbent material 10 is, for example, a tape-type getter, or an evaporation getter, which can be used to absorb moisture and oxygen. Specifically, as shown in FIG. 1B, the moisture absorbing material 10 of the present embodiment is, for example, a tape-type absorbing material having a rectangular bottom area, and of course, in other embodiments not shown, moisture absorbing. Material 10 can also be the bottom The sheet-like absorbent material having an area of other different types of polygons or a sheet-shaped absorbent material having a circular or elliptical bottom surface is not limited herein.

之後，請參考圖8D，透過膠材140將離型膜130貼附於 基板110上，其中膠材140包覆側壁阻障結構120並且位於基板110與離型膜130之間。一般而言，將離型膜130壓合於基板110後，可以是透過滾輪或框壓的方式使基板110的側壁阻障結構120透過膠材140與離型膜130緊密接觸。至此，阻障功能膜100A的製作方法已大致完成。 Thereafter, referring to FIG. 8D, the release film 130 is attached to the adhesive film 140 through the adhesive 140. On the substrate 110, the glue 140 covers the sidewall barrier structure 120 and is located between the substrate 110 and the release film 130. Generally, after the release film 130 is pressed against the substrate 110, the sidewall barrier structure 120 of the substrate 110 may be in close contact with the release film 130 through the adhesive 140 by means of a roller or a frame. Thus far, the manufacturing method of the barrier functional film 100A has been substantially completed.

另外，本揭露並不限定於基板110上形成吸濕材10的配 置方式及製作方法，也就是說，在不脫離本揭露的精神及所欲保護範圍的情況下，當可實施其他潤飾及調整，以達到吸收水氧的技術功效。舉例而言，如圖2A所示，本揭露的膠材140內亦可進一步配置有吸濕材10a，其中吸濕材10a例如是以粒子的型態分佈於膠材140內，且可經由相似於阻障功能膜100A的製作方法，進而得到阻障功能膜100B。 In addition, the disclosure is not limited to the formation of the moisture absorbing material 10 on the substrate 110. The manner and method of manufacture, that is, the other refinements and adjustments can be implemented to achieve the technical effect of absorbing water and oxygen without departing from the spirit and scope of the present disclosure. For example, as shown in FIG. 2A, the adhesive material 140 of the present disclosure may further be provided with a moisture absorbing material 10a, wherein the moisture absorbing material 10a is distributed in the rubber material 140, for example, in the form of particles, and may be similar. In the method of producing the barrier functional film 100A, the barrier functional film 100B is further obtained.

上述各實施例的阻障功能膜的製作方法及結構大致上相 同或相似。對此，以下將針對阻障功能膜100C至100R與阻障功能膜100A的製作方法之間的差異進行說明，其中相同元件所具有的相同特徵不再一一贅述。 The manufacturing method and structure of the barrier functional film of each of the above embodiments are substantially the same Same or similar. In this regard, the difference between the barrier functional films 100C to 100R and the method of fabricating the barrier functional film 100A will be described below, and the same features of the same components will not be described again.

請參考圖3A，圖3A的阻障功能膜100C的製作方法與上 述阻障功能膜100A的製作方法大致上相同，其不同之處在於：圖3A的阻障功能膜100C的基板100可進一步包括可撓性基板110a 以及阻障層110b，其中阻障層110b例如是單層或多層無機材，例如是矽氧化合物(SiO_x)、矽氮化合物(SiN_x)、矽氮氧化合物(SiN_xO_y)或氧化鋁(Al₂O₃)等。此外，阻障層110b亦可以是無機與有機混合材，例如是Si-C聚合物等，又或者是有機與無機多層堆疊層，其中有機材例如是壓克力(Acrylic)、環氧樹脂(Epoxy)或聚亞芳香基醚(Parylene)系列等材料。一般而言，無機材可利用化學氣相沉積(CVD)或濺鍍(Sputter)等製作方法而形成於可撓性基板110a上。無機與有機混合材可利用化學氣相沉積(CVD)製作方法而形成於可撓性基板110a上。有機材可利用化學氣相沉積(CVD)、噴灑(Spray)或塗佈(Coating)等製作方法而形成可撓性基板110a上。藉由上述材料及製作方法形成於可撓性基板110a上的阻障層110b，可用以阻隔外界水氣或氧氣。 Referring to FIG. 3A, the method for fabricating the barrier function film 100C of FIG. 3A is substantially the same as the method for fabricating the barrier function film 100A, and the difference is that the substrate 100 of the barrier function film 100C of FIG. 3A may further include the flexible substrate 110a and the barrier layer 110b, wherein the barrier layer 110b, for example, single or multiple layer inorganic material, for example, silicon oxides (SiO _x), silicon nitrogen compound (SiN _x), silicon oxynitride (SiN _x O _y ) or alumina (Al ₂ O ₃ ) or the like. In addition, the barrier layer 110b may also be an inorganic and organic mixed material, such as a Si-C polymer or the like, or an organic and inorganic multilayer stacked layer, wherein the organic material is, for example, Acrylic, epoxy resin ( Epoxy) or polyarylene ether (Parylene) series and other materials. In general, the inorganic material can be formed on the flexible substrate 110a by a manufacturing method such as chemical vapor deposition (CVD) or sputtering. The inorganic and organic mixed materials can be formed on the flexible substrate 110a by a chemical vapor deposition (CVD) fabrication method. The organic material can be formed on the flexible substrate 110a by a production method such as chemical vapor deposition (CVD), spraying, or coating. The barrier layer 110b formed on the flexible substrate 110a by the above materials and manufacturing methods can be used to block external moisture or oxygen.

簡言之，形成於可撓性基板110a上的阻障層110b例如 是單層膜層的阻障結構，可用以阻隔外界水氣與氧氣，當然，阻障層110b亦可以是兩層以上的膜層所構成的阻障結構，本揭露在此並不加以限制。 In short, the barrier layer 110b formed on the flexible substrate 110a is, for example The barrier structure of the single-layer film layer can be used to block the external moisture and oxygen. Of course, the barrier layer 110b can also be a barrier structure composed of two or more layers. The disclosure is not limited herein.

請參考圖3B，圖3B的阻障功能膜100D的製作方法與圖 3A的阻障功能膜100C的製作方法大致相同，其不同之處在於：圖3B的阻障功能膜100D的膠材140內配置有吸濕材10a，更具體而言，吸濕材10a例如是以粒子的型態分佈於膠材140內，可用以吸收水氣或氧氣。 Please refer to FIG. 3B , the manufacturing method and the diagram of the barrier functional film 100D of FIG. 3B . The method for producing the barrier functional film 100C of 3A is substantially the same, except that the absorbent member 10a is disposed in the adhesive material 140 of the barrier functional film 100D of FIG. 3B, and more specifically, the absorbent member 10a is, for example, It is distributed in the form of particles in the glue 140 to absorb moisture or oxygen.

請參考圖4A，圖4A的阻障功能膜100E與3A的阻障功 能膜100C的製作方法大致相同，其不同之處在於：圖4A的阻障功能膜100E進一步於可撓性基板上形成四分之一波長補償膜加偏光膜POL，其中四分之一波長補償膜加偏光膜POL與阻障層110b分別位於該可撓性基板110a兩對側。 Please refer to FIG. 4A, the barrier function of the barrier functional films 100E and 3A of FIG. 4A. The method for fabricating the energy film 100C is substantially the same, except that the barrier function film 100E of FIG. 4A further forms a quarter-wavelength compensation film plus a polarizing film POL on the flexible substrate, wherein the quarter-wavelength compensation The film-plus polarizing film POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a.

請參考圖4B，圖4B的阻障功能膜100F與3B的阻障功 能膜100D的製作方法大致相同，其不同之處在於：圖4B的阻障功能膜100F進一步於可撓性基板上形成四分之一波長補償膜加偏光膜POL，其中四分之一波長補償膜加偏光膜POL與阻障層110b分別位於該可撓性基板110a兩對側。 Please refer to FIG. 4B, the barrier function of the barrier functional films 100F and 3B of FIG. 4B. The method for fabricating the energy film 100D is substantially the same, except that the barrier function film 100F of FIG. 4B further forms a quarter-wavelength compensation film plus a polarizing film POL on the flexible substrate, wherein the quarter-wavelength compensation The film-plus polarizing film POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a.

請參考圖5A，圖5A的阻障功能膜100G與圖3A的阻障 功能膜100C的製作方法大致相同，其不同之處在於：將阻障層110b貼合於可撓性基板110a上方之前，進一步於可撓性基板110a上形成一觸控層TP，其中觸控層TP與膠材140分別位於阻障層110b的兩對側。接著，進一步於可撓性基板110a形成一可撓性載板CAR，其中可撓性載板CAR例如是透過光學膠(未繪示)貼合於可撓性基板110a上，因此可撓性載板CAR可經由適當施力而與可撓性基板110a分離。 Please refer to FIG. 5A, the barrier functional film 100G of FIG. 5A and the barrier of FIG. 3A. The method for fabricating the functional film 100C is substantially the same, except that before the barrier layer 110b is attached to the flexible substrate 110a, a touch layer TP is further formed on the flexible substrate 110a, wherein the touch layer The TP and the glue 140 are respectively located on opposite sides of the barrier layer 110b. Then, a flexible carrier CAR is further formed on the flexible substrate 110a. The flexible carrier CAR is bonded to the flexible substrate 110a via an optical adhesive (not shown), for example. The plate CAR can be separated from the flexible substrate 110a by a suitable biasing force.

請參考圖5B，圖5B的阻障功能膜100H與圖5A的阻障 功能膜100G的製作方法大致相同，其不同之處在於：圖5B的阻障功能膜100H的觸控層TP是形成於可撓性基板110a的外表面，詳細而言，觸控層TP例如是透過膠材140a貼合於可撓性基板110a。接著，可撓性載板CAR例如是透過光學膠(未繪示)貼合 於觸控層TP上，其中觸控層TP與膠材140分別位於可撓性基板110a的兩對側，且觸控層TP位於可撓性載板CAR與膠材140a之間。 Please refer to FIG. 5B, the barrier functional film 100H of FIG. 5B and the barrier of FIG. 5A. The method for fabricating the functional film 100G is substantially the same, except that the touch layer TP of the barrier function film 100H of FIG. 5B is formed on the outer surface of the flexible substrate 110a. In detail, the touch layer TP is, for example, The adhesive substrate 140a is bonded to the flexible substrate 110a. Then, the flexible carrier CAR is adhered, for example, through an optical adhesive (not shown). The touch layer TP and the adhesive material 140 are respectively located on opposite sides of the flexible substrate 110a, and the touch layer TP is located between the flexible carrier CAR and the adhesive material 140a.

請參考圖5C，圖5C的阻障功能膜100I與圖5A的阻障 功能膜100G的製作方法大致相同，其不同之處在於：圖5C的阻障功能膜100I的膠材140內配置有吸濕材10a，更具體而言，吸濕材10a例如是以粒子的型態分佈於膠材140內，可用以吸收水氣或氧氣。 Please refer to FIG. 5C, the barrier functional film 100I of FIG. 5C and the barrier of FIG. 5A. The method for producing the functional film 100G is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100I of FIG. 5C, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

請參考圖5D，圖5D的阻障功能膜100J與圖5B的阻障 功能膜100H的製作方法大致相同，其不同之處在於：圖5D的阻障功能膜100J的膠材140內配置有吸濕材10a，更具體而言，吸濕材10a例如是以粒子的型態分佈於膠材140內，可用以吸收水氣或氧氣。 Please refer to FIG. 5D, the barrier functional film 100J of FIG. 5D and the barrier of FIG. 5B. The method for producing the functional film 100H is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100J of FIG. 5D, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

請參考圖6A，圖6A的阻障功能膜100K與圖5A的阻障 功能膜100G的製作方法大致相同，其不同之處在於：圖6A的阻障功能膜100K是於可撓性基板110a上形成四分之一波長補償膜加偏光膜POL，取代了阻障功能膜100G的可撓性載板CAR，其中四分之一波長補償膜加偏光膜POL與阻障層110b分別位於可撓性基板110a兩對側。 Please refer to FIG. 6A, the barrier functional film 100K of FIG. 6A and the barrier of FIG. 5A. The functional film 100G is manufactured in substantially the same manner, and the difference is that the barrier function film 100K of FIG. 6A forms a quarter-wavelength compensation film and a polarizing film POL on the flexible substrate 110a, replacing the barrier function film. The 100G flexible carrier CAR, wherein the quarter-wavelength compensation film-plus-polarization film POL and the barrier layer 110b are respectively located on opposite sides of the flexible substrate 110a.

請參考圖6B，圖6B的阻障功能膜100L與圖5B的阻障 功能膜100H的製作方法大致相同，其不同之處在於：圖6B的阻障功能膜100LR進一步於觸控層TP上形成四分之一波長補償膜 加偏光膜POL，取代了阻障功能膜100H的可撓性載板CAR，其中觸控層TP與膠材140分別位於可撓性基板110a的兩對側，且觸控層TP位於四分之一波長補償膜加偏光膜POL與膠材140a之間。 Please refer to FIG. 6B, the barrier functional film 100L of FIG. 6B and the barrier of FIG. 5B. The functional film 100H is manufactured in substantially the same manner, and the difference is that the barrier function film 100LR of FIG. 6B further forms a quarter-wave compensation film on the touch layer TP. The polarizing film POL is replaced with the flexible carrier CAR of the barrier function film 100H. The touch layer TP and the adhesive material 140 are respectively located on two opposite sides of the flexible substrate 110a, and the touch layer TP is located at four quarters. A wavelength compensation film is added between the polarizing film POL and the adhesive material 140a.

請參考圖6C，圖6C的阻障功能膜100M與圖6A的阻障 功能膜100K的製作方法大致相同，其不同之處在於：圖6C的阻障功能膜100M的膠材140內配置有吸濕材10a，更具體而言，吸濕材10a例如是以粒子的型態分佈於膠材140內，可用以吸收水氣或氧氣。 Please refer to FIG. 6C, the barrier functional film 100M of FIG. 6C and the barrier of FIG. 6A. The method for producing the functional film 100K is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100M of FIG. 6C, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

請參考圖6D，圖6D的阻障功能膜100N與圖6B的阻障 功能膜100L的製作方法大致相同，其不同之處在於：圖6D的阻障功能膜100N的膠材140內配置有吸濕材10a，更具體而言，吸濕材10a例如是以粒子的型態分佈於膠材140內，可用以吸收水氣或氧氣。 Please refer to FIG. 6D, the barrier functional film 100N of FIG. 6D and the barrier of FIG. 6B. The method for producing the functional film 100L is substantially the same, and the difference is that the moisture absorbing material 10a is disposed in the rubber material 140 of the barrier function film 100N of FIG. 6D, and more specifically, the moisture absorbing material 10a is, for example, a particle type. The state is distributed within the glue 140 and can be used to absorb moisture or oxygen.

請參考圖7A，圖7A的阻障功能膜100O與圖5A的阻障 功能膜100G的製作方法大致相同，其不同之處在於：首先於可撓性基板110a上製作彩色濾光層CF，再進一步於彩色濾光層CF上製作觸控層TP，其中彩色濾光層CF配置於可撓性基板110a與觸控層TP之間，且彩色濾光層CF與阻障層110b位於觸控層TP的兩對側。 Please refer to FIG. 7A, the barrier functional film 100O of FIG. 7A and the barrier of FIG. 5A. The method for fabricating the functional film 100G is substantially the same, except that the color filter layer CF is first formed on the flexible substrate 110a, and the touch layer TP is further formed on the color filter layer CF, wherein the color filter layer is formed. The CF is disposed between the flexible substrate 110a and the touch layer TP, and the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP.

請參考圖7B，圖7B的阻障功能膜100P與圖5B的阻障 功能膜100H的製作方法大致相同，其不同之處在於：首先於觸控 層TP上製作彩色濾光層CF，其中彩色濾光層CF與阻障層110b位於觸控層TP的兩對側。接著，可撓性載板CAR例如是透過光學膠(未繪示)貼合於觸控層TP上，其中可撓性載板CAR與觸控層TP位於彩色濾光層CF的兩對側。 Please refer to FIG. 7B, the barrier functional film 100P of FIG. 7B and the barrier of FIG. 5B. The manufacturing method of the functional film 100H is substantially the same, and the difference is that the touch is first A color filter layer CF is formed on the layer TP, wherein the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP. Then, the flexible carrier CAR is attached to the touch layer TP through an optical adhesive (not shown), wherein the flexible carrier CAR and the touch layer TP are located on opposite sides of the color filter layer CF.

請參考圖7C，圖7C的阻障功能膜100Q與圖5C的阻障 功能膜100I的製作方法大致相同，其不同之處在於：首先於觸控層TP上製作彩色濾光層CF，再進一步於彩色濾光層CF上製作可撓性基板110a，其中彩色濾光層CF配置於可撓性基板110a與觸控層TP之間，且彩色濾光層CF與阻障層110b位於觸控層TP的兩對側。 Please refer to FIG. 7C, the barrier functional film 100Q of FIG. 7C and the barrier of FIG. 5C. The method for fabricating the functional film 100I is substantially the same, except that the color filter layer CF is first formed on the touch layer TP, and then the flexible substrate 110a is further formed on the color filter layer CF, wherein the color filter layer is formed. The CF is disposed between the flexible substrate 110a and the touch layer TP, and the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP.

請參考圖7D，圖7D的阻障功能膜100R與圖5D的阻障 功能膜100J的製作方法大致相同，其不同之處在於：首先於觸控層TP上製作彩色濾光層CF，且彩色濾光層CF與阻障層110b位於觸控層TP的兩對側。接著，可撓性載板CAR例如是透過光學膠(未繪示)貼合於彩色濾光層CF上，其中可撓性載板CAR與觸控層TP位於彩色濾光層CF的兩對側。 Please refer to FIG. 7D, the barrier functional film 100R of FIG. 7D and the barrier of FIG. 5D. The method for fabricating the functional film 100J is substantially the same, except that the color filter layer CF is first formed on the touch layer TP, and the color filter layer CF and the barrier layer 110b are located on opposite sides of the touch layer TP. Then, the flexible carrier CAR is attached to the color filter layer CF through an optical adhesive (not shown), wherein the flexible carrier CAR and the touch layer TP are located on opposite sides of the color filter layer CF. .

圖9是本揭露第一實施例的環境敏感電子元件的剖面示 意圖。請參考圖9，本實施例的環境敏感電子元件200A包括第一基板210、至少一第一側壁阻障結構220、環境敏感電子元件背板230以及第一膠材240。第一側壁阻障結構220位於第一基板210上。第一基板210配置於環境敏感電子元件背板230上方，且第一側壁阻障結構220位於第一基板210與環境敏感電子元件背板 230之間。第一膠材240配置於第一基板210與環境敏感電子元件背板230之間，且第一膠材240包覆第一側壁阻障結構220，其中第一基板210與第一側壁阻障結構220透過第一膠材240貼合於環境敏感電子元件背板230上。 9 is a cross-sectional view of an environmentally sensitive electronic component of the first embodiment of the present disclosure intention. Referring to FIG. 9 , the environmentally sensitive electronic component 200A of the present embodiment includes a first substrate 210 , at least one first sidewall barrier structure 220 , an environmentally sensitive electronic component backplate 230 , and a first adhesive 240 . The first sidewall barrier structure 220 is located on the first substrate 210. The first substrate 210 is disposed above the environmentally sensitive electronic component backplane 230, and the first sidewall barrier structure 220 is located on the first substrate 210 and the environmentally sensitive electronic component backplane Between 230. The first adhesive material 240 is disposed between the first substrate 210 and the environmentally sensitive electronic component back plate 230 , and the first adhesive material 240 covers the first sidewall barrier structure 220 , wherein the first substrate 210 and the first sidewall barrier structure 220 is attached to the environmentally sensitive electronic component backplate 230 through the first adhesive 240.

進一步而言，本實例的環境敏感電子元件200A例如是在 撕除圖1A的阻障功能膜100A的離型膜130後，透過膠材140將基板110以及側壁阻障結構120貼合於環境敏感電子元件背板230上所形成。一般而言，將基板110壓合於環境敏感電子元件背板230之後，可以是透過滾輪、下壓平頭、軟墊下壓或其他外力的方式使基板110的側壁阻障結構120透過膠材140與環境敏感電子元件背板230緊密接觸。在此必須說明的是，在基板110透過膠材140壓合於環境敏感電子元件背板230上方之後，基板110即形成為第一基板210並且側壁阻障結構120即形成為第一側壁阻障結構220。之後，膠材140固化(例如熱固化、紫外光固化等)以形成第一膠材240，藉此第一基板210及第一側壁阻障結構220透過此第一膠材240與環境敏感電子元件背板230穩固地接合。 Further, the environmentally sensitive electronic component 200A of the present example is, for example, After the release film 130 of the barrier function film 100A of FIG. 1A is peeled off, the substrate 110 and the sidewall barrier structure 120 are bonded to the environmentally sensitive electronic component back plate 230 through the adhesive 140. Generally, after the substrate 110 is pressed against the environmentally sensitive electronic component back plate 230, the sidewall barrier structure 120 of the substrate 110 may be transmitted through the adhesive 140 by means of a roller, a flat pressing, a cushioning, or other external force. In close contact with the environmentally sensitive electronic component backplate 230. It should be noted that after the substrate 110 is pressed over the environmentally sensitive electronic component back plate 230 through the adhesive 140, the substrate 110 is formed as the first substrate 210 and the sidewall barrier structure 120 is formed as the first sidewall barrier. Structure 220. Thereafter, the rubber material 140 is cured (eg, heat curing, ultraviolet curing, etc.) to form the first rubber 240, whereby the first substrate 210 and the first sidewall barrier structure 220 pass through the first adhesive 240 and environmentally sensitive electronic components. The backing plate 230 is firmly joined.

在本實施例中，環境敏感電子元件背板230可包括可撓 性基材230a以及多個環境敏感電子元件單元230b，其中環境敏感電子元件單元230b排列於該可撓性基材230a上。詳細而言，可撓性基材230a例如是聚亞醯胺(PI)所構成，亦可以是其他的可撓性材料所構成。另一方面，各個環境敏感電子元件單元230b包括主動元件232b以及電路與導線234b，且電路導線234b與主動 元件232b電性連接。在本實施例中，主動元件232b例如是主動式環境敏感電子顯示元件，其中主動式環境敏感電子顯示元件例如是一主動型矩陣有機發光二極體(Active Matrix Organic Light Emitting Diode,AM-OLED)或者是主動型矩陣電泳顯示器(Active Matrix Electro Phoretic Display,AM-EPD)，俗稱電子紙，或者是主動型矩陣液晶顯示器(Active Matrix Liquid Crystal Display,AM-LCD)，或者是主動型矩陣藍相液晶顯示器(Active Matrix Blue Phase Liquid Crystal Display)。 In this embodiment, the environmentally sensitive electronic component backplate 230 can include a flexible The substrate 230a and the plurality of environmentally sensitive electronic component units 230b, wherein the environmentally sensitive electronic component unit 230b is arranged on the flexible substrate 230a. Specifically, the flexible substrate 230a is made of, for example, polyamine (PI), and may be made of another flexible material. On the other hand, each environmentally sensitive electronic component unit 230b includes an active component 232b and a circuit and a wire 234b, and the circuit conductor 234b is active. Element 232b is electrically connected. In this embodiment, the active component 232b is, for example, an active environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an Active Matrix Organic Light Emitting Diode (AM-OLED). Or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active matrix blue phase liquid crystal Active Matrix Blue Phase Liquid Crystal Display.

一般而言，主動元件232b為顯示器中的主要顯示區域，其 中包含薄膜電晶體(TFT)(未繪示)，且薄膜電晶體可以是非晶矽薄膜電晶體(a-Si TFT)與金屬氧化物薄膜電晶體(metal oxide TFT)或多晶矽薄膜電晶體(p-Si TFT)。此外，多晶矽薄膜電晶體(p-Si TFT)可進一步包括低溫多晶矽薄膜電晶體(low-temperature p-Si TFT)以及高溫多晶矽薄膜電晶體(high-temperature p-Si TFT)、連續晶粒矽薄膜電晶體(Continuous Grain Silicon TFT,CGS TFT)或超晶粒矽薄膜電晶體(Super Grain Silicon TFT,SGS TFT)等等。 In general, active component 232b is the primary display area in the display, A thin film transistor (TFT) (not shown) is included, and the thin film transistor may be an amorphous germanium thin film transistor (a-Si TFT) and a metal oxide thin film transistor or a polycrystalline germanium thin film transistor (p) -Si TFT). In addition, the polycrystalline germanium thin film transistor (p-Si TFT) may further include a low-temperature p-Si TFT and a high-temperature p-Si TFT, a continuous grain germanium film. Continuous Grain Silicon TFT (CGS TFT) or Super Grain Silicon TFT (SGS TFT) or the like.

此外，第一膠材240更進一步具有散熱輔助材料20，其中散熱輔助材料20例如是以粒子的型態分佈於第一膠材240內。一般而言，散熱輔助材料20例如是鑽石、類鑽石、銅、銀、金、鋁、鉑、陶瓷材料或其氧化物的高散熱係數材料，可用以將熱導出。另一方面，第一膠材240亦可具有抗電磁干擾材料30，其中抗電磁干擾材料30例如是以粒子的型態分佈於第一膠材240內。 一般而言，抗電磁干擾材料30例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。 In addition, the first rubber 240 further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is distributed in the first rubber material 240, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the first adhesive 240 may also have an anti-electromagnetic interference material 30, wherein the anti-electromagnetic interference material 30 is distributed in the first adhesive 240, for example, in the form of particles. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

雖然上述實施例的環境敏感電子元件200A例如是離型膜130撕除後的阻障功能膜100A與環境敏感電子元件背板230結合後所形成。然而，在其他的實施例中，阻障功能膜100B至100R與環境敏感電子元件背板230的結合，亦可達到阻隔水氣與氧氣之能力的不同結構設計或配置，仍屬於本揭露可採用的技術方案，不脫離本揭露所欲保護的範圍。以下將列舉多個不同的實施例來分別說明環境敏感電子元件200B至200R的設計。 Although the environmentally sensitive electronic component 200A of the above embodiment is formed, for example, the barrier functional film 100A after the release film 130 is removed is bonded to the environmentally sensitive electronic component back plate 230. However, in other embodiments, the combination of the barrier functional films 100B to 100R and the environmentally sensitive electronic component backplate 230 can also achieve different structural designs or configurations for blocking the moisture and oxygen. The technical solution does not depart from the scope of the disclosure. A number of different embodiments will be enumerated below to illustrate the design of environmentally sensitive electronic components 200B through 200R, respectively.

圖10是本揭露第二實施例的環境敏感電子元件的剖面示意圖。請參考圖10，圖10的環境敏感電子元件200B與圖9的環境敏感電子元件200A相似，其不同之處在於：圖10的環境敏感電子元件板200B的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Figure 10 is a cross-sectional view of an environmentally sensitive electronic component of a second embodiment of the present disclosure. Referring to FIG. 10, the environmentally sensitive electronic component 200B of FIG. 10 is similar to the environmentally sensitive electronic component 200A of FIG. 9, except that the moisture absorbing material 10a of the environmentally sensitive electronic component board 200B of FIG. 10 is, for example, of a particle type. The state is distributed within the first rubber 240. Generally, the absorbent material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖11A是本揭露第三實施例的環境敏感電子元件的剖面示意圖。圖11B是本揭露第四實施例的環境敏感電子元件的剖面示意圖。請參考圖11A，圖11A的環境敏感電子元件200C與圖9的環境敏感電子元件200A相似，其不同之處在於：圖11A的環境敏感電子元件200的第一基板210可進一步包括可撓性基板210a以及阻障層210b，其中可撓性基板210a的材質可為聚亞醯胺(PI)，亦可以是聚乙烯對苯二甲酸酯(polyethylene terephthalate, PET)、聚間苯二甲酸乙二酯(polyethylene naphthalate,PEN)、聚醚石風(Polyethersulfone,PES)、聚甲基丙烯酸甲酯(polymethyl methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)或金屬箔(metal foil)。 11A is a cross-sectional view of an environmentally sensitive electronic component of a third embodiment of the present disclosure. 11B is a cross-sectional view of an environmentally sensitive electronic component of a fourth embodiment of the present disclosure. Referring to FIG. 11A, the environmentally sensitive electronic component 200C of FIG. 11A is similar to the environmentally sensitive electronic component 200A of FIG. 9 except that the first substrate 210 of the environmentally sensitive electronic component 200 of FIG. 11A may further include a flexible substrate. 210a and the barrier layer 210b, wherein the material of the flexible substrate 210a may be polyamidamine (PI) or polyethylene terephthalate (polyethylene terephthalate). PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC) or Metal foil.

另一方面，阻障層210b配置於可撓性基板210a上，其 中阻障層210b例如是單層或多層無機材，例如是矽氧化合物(SiO_x)、矽氮化合物(SiN_x)、矽氮氧化合物(SiN_xO_y)或氧化鋁(Al₂O₃)等。此外，阻障層210亦可以是無機與有機混合材，例如是碳矽(Si-C)聚合物等，又或者是有機與無機多層堆疊層，其中有機材例如是壓克力(Acrylic)、環氧樹脂(Epoxy)或聚亞芳香基醚(Parylene)系列等材料，無機材可利用化學氣相沉積(CVD)或濺鍍(Sputter)等製作方法而形成，無機與有機混合材可利用化學氣相沉積(CVD)製作方法而形成，有機材可利用化學氣相沉積(CVD)、噴灑(Spray)或塗佈(Coating)等製作方法而形成，可用以阻隔外界水氣與氧氣。 On the other hand, the barrier layer 210b is disposed on the flexible substrate 210a, wherein the barrier layer 210b is, for example, a single layer or a plurality of layers of inorganic materials, such as a silicon oxide compound (SiO _x ), a nitrogen compound (SiN _x ), or a germanium. Nitrogen oxide (SiN _x O _y ) or alumina (Al ₂ O ₃ ). In addition, the barrier layer 210 may also be an inorganic and organic mixed material, such as a carbon germanium (Si-C) polymer or the like, or an organic and inorganic multilayer stacked layer, wherein the organic material is, for example, Acrylic. Materials such as epoxy resin (Epoxy) or polyarylene ether (Parylene) series, inorganic materials can be formed by chemical vapor deposition (CVD) or sputtering (Sputter), and inorganic and organic mixed materials can be chemically used. Formed by a vapor deposition (CVD) fabrication method, the organic material can be formed by a method such as chemical vapor deposition (CVD), spraying, or coating, which can be used to block external moisture and oxygen.

請參考圖11B，圖11B的環境敏感電子元件200D與圖 11A的環境敏感電子元件200C相似，其不同之處在於：圖11B的環境敏感電子元件200D的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 11B, the environmentally sensitive electronic component 200D and the diagram of FIG. 11B. The environmentally sensitive electronic component 200C of 11A is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200D of FIG. 11B is distributed, for example, in the form of particles in the first adhesive 240, in general, moisture absorption. The material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖12A是本揭露第五實施例的環境敏感電子元件的剖面示意圖。圖12B是本揭露第六實施例的環境敏感電子元件的剖面 示意圖。請參考圖12A，圖12A的環境敏感電子元件200E與圖11A的環境敏感電子元件200C相似，其不同之處在於：圖12A的環境敏感電子元件200E更具有四分之一波長補償膜加偏光膜POL，其中四分之一波長補償膜加偏光膜POL配置於可撓性基板210a上，且四分之一波長補償膜加偏光膜POL與阻障層210b分別位於可撓性基板210a兩對側。一般而言，四分之一波長補償膜加偏光膜POL其中補償膜例如是指對於特定的波長(λ)而延遲了具有其波長(λ)的四分之一大小的相位差薄膜。 12A is a cross-sectional view of an environmentally sensitive electronic component of a fifth embodiment of the present disclosure. 12B is a cross section of an environmentally sensitive electronic component according to a sixth embodiment of the present disclosure. schematic diagram. Referring to FIG. 12A, the environmentally sensitive electronic component 200E of FIG. 12A is similar to the environmentally sensitive electronic component 200C of FIG. 11A, except that the environmentally sensitive electronic component 200E of FIG. 12A further has a quarter-wave compensation film and a polarizing film. POL, wherein the quarter-wavelength compensation film plus polarizing film POL is disposed on the flexible substrate 210a, and the quarter-wavelength compensation film-plus polarizing film POL and the barrier layer 210b are respectively located on opposite sides of the flexible substrate 210a. . In general, the quarter-wavelength compensation film plus polarizing film POL in which the compensation film is, for example, means that a retardation film having a quarter of its wavelength (λ) is delayed for a specific wavelength (λ).

請參考圖12B，圖12B的環境敏感電子元件200F與圖12A 的環境敏感電子元件200E相似，其不同之處在於：圖12B的環境敏感電子元件200F的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 12B, the environmentally sensitive electronic component 200F of FIG. 12B and FIG. 12A. The environmentally sensitive electronic component 200E is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200F of FIG. 12B is distributed, for example, in the form of particles in the first adhesive 240. Generally, the absorbent material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖13A是本揭露第七實施例的環境敏感電子元件的剖面 示意圖。圖13B是本揭露第八實施例的環境敏感電子元件的剖面示意圖。圖13C是本揭露第九實施例的環境敏感電子元件的剖面示意圖。圖13D是本揭露第十實施例的環境敏感電子元件的剖面示意圖。請參考圖13A，圖13A的環境敏感電子元件200G與圖11A的環境敏感電子元件200C相似，其不同之處在於：圖13A的環境敏感電子元件200G更具有觸控層TP，其中觸控層TP配置於可撓性基板210a上，且觸控層TP與第一膠材240分別位於阻障層210b的兩對側。具體而言，本實例的環境敏感電子元件200G 例如是在撕除阻障功能膜100G的離型膜130後，透過膠材140將基板110以及側壁阻障結構120貼合於環境敏感電子元件背板230上並且進一步撕除可撓性載板CAR後所形成。在此必須說明的是，將基板110壓合於環境敏感電子元件背板230之後，基板110即形成為第一基板210並且側壁阻障結構120即形成為第一側壁阻障結構220。之後，膠材140固化(例如熱固化、紫外光固化等)以形成第一膠材240，藉此第一基板210及第一側壁阻障結構220透過此第一膠材240與環境敏感電子元件背板230穩固地接合。 13A is a cross section of an environmentally sensitive electronic component of a seventh embodiment of the present disclosure. schematic diagram. 13B is a cross-sectional view of an environmentally sensitive electronic component of an eighth embodiment of the present disclosure. 13C is a cross-sectional view of an environmentally sensitive electronic component of a ninth embodiment of the present disclosure. 13D is a cross-sectional view of an environmentally sensitive electronic component of a tenth embodiment of the present disclosure. Referring to FIG. 13A, the environmentally sensitive electronic component 200G of FIG. 13A is similar to the environmentally sensitive electronic component 200C of FIG. 11A, except that the environmentally sensitive electronic component 200G of FIG. 13A further has a touch layer TP, wherein the touch layer TP The touch layer TP and the first adhesive 240 are respectively disposed on opposite sides of the barrier layer 210b. Specifically, the environmentally sensitive electronic component 200G of the present example For example, after the release film 130 of the barrier functional film 100G is peeled off, the substrate 110 and the sidewall barrier structure 120 are attached to the environmentally sensitive electronic component back plate 230 through the adhesive 140 and the flexible carrier is further removed. Formed after CAR. It should be noted that after the substrate 110 is pressed against the environmentally sensitive electronic component back plate 230 , the substrate 110 is formed as the first substrate 210 and the sidewall barrier structure 120 is formed as the first sidewall barrier structure 220 . Thereafter, the rubber material 140 is cured (eg, heat curing, ultraviolet curing, etc.) to form the first rubber 240, whereby the first substrate 210 and the first sidewall barrier structure 220 pass through the first adhesive 240 and environmentally sensitive electronic components. The backing plate 230 is firmly joined.

請參考圖13B，圖13B的環境敏感電子元件200H與圖 13A的環境敏感電子元件200G相似，其不同之處在於：圖13B的環境敏感電子元件200H的觸控層TP例如是透過膠材240a貼合於可撓性基板210a的外表面，其中觸控層TP與第一膠材240分別位於可撓性基板210a的兩對側。 Please refer to FIG. 13B, the environmentally sensitive electronic component 200H and the diagram of FIG. 13B. The environmentally sensitive electronic component 200G of the 13A is similar, and the difference is that the touch layer TP of the environmentally sensitive electronic component 200H of FIG. 13B is adhered to the outer surface of the flexible substrate 210a through the adhesive 240a, wherein the touch layer is The TP and the first glue 240 are respectively located on opposite sides of the flexible substrate 210a.

請參考圖13C，圖13C的環境敏感電子元件200I與圖13A 的環境敏感電子元件200G相似，其不同之處在於：圖13C的環境敏感電子元件200I的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 13C, the environmentally sensitive electronic component 200I of FIG. 13C and FIG. 13A. The environmentally sensitive electronic component 200G is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200I of FIG. 13C is distributed, for example, in the form of particles in the first adhesive 240. Generally, the absorbent material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

請參考圖13D，圖13D的環境敏感電子元件200J與圖13B 的環境敏感電子元件200H相似，其不同之處在於：圖13D的環境敏感電子元件200J的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕 材，可用於吸收水氣及氧氣。 Please refer to FIG. 13D, the environmentally sensitive electronic component 200J of FIG. 13D and FIG. 13B. The environmentally sensitive electronic component 200H is similar in that the moisture absorbing material 10a of the environmentally sensitive electronic component 200J of FIG. 13D is distributed, for example, in the form of particles in the first adhesive 240. Generally, the absorbent material 10a is, for example, transparent or opaque moisture absorption Material that can be used to absorb moisture and oxygen.

圖14A是本揭露第十一實施例的環境敏感電子元件的剖 面示意圖。圖14B是本揭露第十二實施例的環境敏感電子元件的剖面示意圖。圖14C是本揭露第十三實施例的環境敏感電子元件的剖面示意圖。圖14D是本揭露第十四實施例的環境敏感電子元件的剖面示意圖。請參考圖14A，圖14A的環境敏感電子元件200K與圖13A的環境敏感電子元件200G相似，其不同之處在於：圖6A的環境敏感電子元件200K的可撓性基板210a上配置有四分之一波長補償膜加偏光膜POL，其中四分之一波長補償膜加偏光膜POL與阻障層210b分別位於可撓性基板210a兩對側。 14A is a cross-sectional view of an environmentally sensitive electronic component of an eleventh embodiment of the present disclosure. Schematic diagram. 14B is a cross-sectional view of an environmentally sensitive electronic component of a twelfth embodiment of the present disclosure. Figure 14C is a cross-sectional view showing the environmentally sensitive electronic component of the thirteenth embodiment of the present disclosure. Figure 14D is a cross-sectional view of an environmentally sensitive electronic component of a fourteenth embodiment of the present disclosure. Referring to FIG. 14A, the environmentally sensitive electronic component 200K of FIG. 14A is similar to the environmentally sensitive electronic component 200G of FIG. 13A, except that the flexible substrate 210a of the environmentally sensitive electronic component 200K of FIG. 6A is disposed with a quarter. A wavelength compensation film is provided with a polarizing film POL, wherein the quarter-wavelength compensation film-plus polarizing film POL and the barrier layer 210b are respectively located on opposite sides of the flexible substrate 210a.

請參考圖14B，圖14B的環境敏感電子元件200L與圖 14A的環境敏感電子元件200K相似，其不同之處在於：圖14B的環境敏感電子元件200L的觸控層TP例如是透過膠材240a貼合於可撓性基板210a的外表面，而四分之一波長補償膜加偏光膜POL配置於觸控層TP上，其中觸控層TP與第一膠材240分別位於可撓性基板210a的兩對側，且觸控層TP位於四分之一波長補償膜加偏光膜POL與膠材240a之間。 Please refer to FIG. 14B, the environmentally sensitive electronic component 200L and the diagram of FIG. 14B. The environmentally sensitive electronic component 200K of the 14A is similar, except that the touch layer TP of the environmentally sensitive electronic component 200L of FIG. 14B is adhered to the outer surface of the flexible substrate 210a through the adhesive 240a, for example, and is divided into four quarters. A wavelength compensation film and a polarizing film POL are disposed on the touch layer TP, wherein the touch layer TP and the first glue 240 are respectively located on opposite sides of the flexible substrate 210a, and the touch layer TP is located at a quarter wavelength. The compensation film is provided between the polarizing film POL and the adhesive material 240a.

請參考圖14C，圖14C的環境敏感電子元件200M與圖 14A的環境敏感電子元件200K相似，其不同之處在於：圖14C的環境敏感電子元件200M的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 14C, the environmentally sensitive electronic component 200M and the diagram of FIG. 14C. The environmentally sensitive electronic component 200K of 14A is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200M of FIG. 14C is distributed, for example, in the form of particles in the first adhesive 240, in general, moisture absorption. The material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

請參考圖14D，圖14D的環境敏感電子元件200N與圖 14B的環境敏感電子元件200L相似，其不同之處在於：圖14D的環境敏感電子元件200N的吸濕材10a例如是以粒子的型態分佈於第一膠材240內，一般而言，吸濕材10a例如是透明或不透明吸濕材，可用於吸收水氣及氧氣。 Please refer to FIG. 14D, the environmentally sensitive electronic component 200N and the diagram of FIG. 14D. The environmentally sensitive electronic component 200L of 14B is similar, except that the moisture absorbing material 10a of the environmentally sensitive electronic component 200N of FIG. 14D is distributed, for example, in the form of particles in the first adhesive 240, in general, moisture absorption. The material 10a is, for example, a transparent or opaque absorbent material that can be used to absorb moisture and oxygen.

圖15A是本揭露第十五實施例的環境敏感電子元件的剖 面示意圖。圖15B是本揭露第十六實施例的環境敏感電子元件的剖面示意圖。圖15C是本揭露第十七實施例的環境敏感電子元件的剖面示意圖。圖15D是本揭露第十八實施例的環境敏感電子元件的剖面示意圖。請參考圖15A，圖15A的環境敏感電子元件200O與圖13A的環境敏感電子元件200G相似，其不同之處在於：圖15A的環境敏感電子元件200O更具有彩色濾光層CF，其中彩色濾光層CF配置於觸控層TP上，且彩色濾光層CF與阻障層210b位於觸控層TP的兩對側。 15A is a cross-sectional view of an environmentally sensitive electronic component of a fifteenth embodiment of the present disclosure. Schematic diagram. Figure 15B is a cross-sectional view showing the environmentally sensitive electronic component of the sixteenth embodiment of the present disclosure. Figure 15C is a cross-sectional view showing the environmentally sensitive electronic component of the seventeenth embodiment of the present disclosure. Figure 15D is a cross-sectional view showing an environmentally sensitive electronic component of the eighteenth embodiment of the present disclosure. Referring to FIG. 15A, the environmentally sensitive electronic component 200O of FIG. 15A is similar to the environmentally sensitive electronic component 200G of FIG. 13A, except that the environmentally sensitive electronic component 200O of FIG. 15A further has a color filter layer CF, wherein the color filter is colored. The layer CF is disposed on the touch layer TP, and the color filter layer CF and the barrier layer 210b are located on opposite sides of the touch layer TP.

請參考圖15B，圖15B的環境敏感電子元件200P與圖13B 的環境敏感電子元件200H相似，其不同之處在於：圖15B的環境敏感電子元件200P更具有彩色濾光層CF，其中彩色濾光層CF配置於觸控層TP上，且彩色濾光層CF與阻障層210b位於觸控層TP的兩對側。 Please refer to FIG. 15B, the environmentally sensitive electronic component 200P of FIG. 15B and FIG. 13B. The environmentally sensitive electronic component 200H is similar in that the environmentally sensitive electronic component 200P of FIG. 15B further has a color filter layer CF, wherein the color filter layer CF is disposed on the touch layer TP, and the color filter layer CF The barrier layer 210b is located on opposite sides of the touch layer TP.

請參考圖15C，圖15C的環境敏感電子元件200Q與圖 13C的環境敏感電子元件200I相似，其不同之處在於：圖15C的環境敏感電子元件200Q更具有彩色濾光層CF，其中彩色濾光層 CF配置於觸控層TP上，且彩色濾光層CF與阻障層210b位於觸控層TP的兩對側。 Please refer to FIG. 15C, the environmentally sensitive electronic component 200Q and FIG. 15C. The environmentally sensitive electronic component 200I of the 13C is similar, except that the environmentally sensitive electronic component 200Q of FIG. 15C further has a color filter layer CF, wherein the color filter layer The CF is disposed on the touch layer TP, and the color filter layer CF and the barrier layer 210b are located on opposite sides of the touch layer TP.

請參考圖15D，圖15D的環境敏感電子元件200R與圖13D的環境敏感電子元件200J相似，其不同之處在於：圖15D的環境敏感電子元件200R更具有彩色濾光層CF，其中彩色濾光層CF配置於觸控層TP上，且彩色濾光層CF與阻障層210b位於觸控層TP的兩對側。 Referring to FIG. 15D, the environmentally sensitive electronic component 200R of FIG. 15D is similar to the environmentally sensitive electronic component 200J of FIG. 13D, except that the environmentally sensitive electronic component 200R of FIG. 15D further has a color filter layer CF, wherein the color filter is colored. The layer CF is disposed on the touch layer TP, and the color filter layer CF and the barrier layer 210b are located on opposite sides of the touch layer TP.

圖16是本揭露一實施例的顯示裝置的剖面示意圖。請參 考圖16，本實施例的顯示裝置300至少包括顯示面板DIS、第二基板310、至少一第二側壁阻障結構320以及第二膠材340。第二基板310配置於顯示面板DIS的一側。第二側壁阻障結構320位於第二基板310上，且第二側壁阻障結構320位於顯示面板DIS與第二基板310之間。第二膠材340配置於第二基板310與顯示面板DIS之間，且第二膠材340包覆第二側壁阻障結構320，其中第二基板310與第二側壁阻障結構320透過第二膠材340貼合於顯示面板DIS上。 FIG. 16 is a cross-sectional view of a display device according to an embodiment of the present disclosure. Please refer to The display device 300 of the present embodiment includes at least a display panel DIS, a second substrate 310, at least one second sidewall barrier structure 320, and a second adhesive 340. The second substrate 310 is disposed on one side of the display panel DIS. The second sidewall barrier structure 320 is located on the second substrate 310 , and the second sidewall barrier structure 320 is located between the display panel DIS and the second substrate 310 . The second adhesive material 340 is disposed between the second substrate 310 and the display panel DIS, and the second adhesive material 340 covers the second sidewall barrier structure 320, wherein the second substrate 310 and the second sidewall barrier structure 320 pass through the second The glue 340 is attached to the display panel DIS.

在此必須說明的是，顯示面板DIS例如是圖9至圖15的 環境敏感電子元件200A至200R的其中之一，也因此，顯示面板DIS至少包括了第一基板210、至少一第一側壁阻障結構220、環境敏感電子元件背板230以及第一膠材240。第一側壁阻障結構220位於第一基板210上。第一基板210配置於環境敏感電子元件背板230上方，且第一側壁阻障結構220位於第一基板210與環 境敏感電子元件背板230之間。第一膠材240配置於第一基板210與環境敏感電子元件背板230之間，且第一膠材240包覆第一側壁阻障結構220，其中第一基板210與第一側壁阻障結構220透過第一膠材240貼合於環境敏感電子元件背板230上。 It must be noted here that the display panel DIS is, for example, the ones of FIGS. 9 to 15 . One of the environmentally sensitive electronic components 200A to 200R, and thus, the display panel DIS includes at least a first substrate 210, at least one first sidewall barrier structure 220, an environmentally sensitive electronic component backplate 230, and a first adhesive 240. The first sidewall barrier structure 220 is located on the first substrate 210. The first substrate 210 is disposed above the environmentally sensitive electronic component back plate 230, and the first sidewall barrier structure 220 is located on the first substrate 210 and the ring Between the sensitive electronic components backplane 230. The first adhesive material 240 is disposed between the first substrate 210 and the environmentally sensitive electronic component back plate 230 , and the first adhesive material 240 covers the first sidewall barrier structure 220 , wherein the first substrate 210 and the first sidewall barrier structure 220 is attached to the environmentally sensitive electronic component backplate 230 through the first adhesive 240.

另一方面，第二基板310、至少一第二側壁阻障結構320 以及第二膠材340構成一蓋板部LID。可以理解的是，蓋板部LID例如是阻障功能膜100A至100K的其中之一在撕除離型膜130後，透過膠材140貼合於環境敏感電子元件背板230的另一側，並且例如透過滾輪、下壓平頭、軟墊下壓或其他外力的方式使基板110的側壁阻障結構120透過膠材140與環境敏感電子元件背板230緊密接觸所形成。詳細而言，將基板110壓合於環境敏感電子元件背板230之後，基板110即形成為第二基板310並且側壁阻障結構120即形成為第二側壁阻障結構320。之後，膠材140固化(例如熱固化、紫外光固化等)以形成第二膠材340，藉此第二基板310及第二側壁阻障結構320透過此第二膠材340(亦即蓋板部LID)與環境敏感電子元件背板230穩固地接合。 On the other hand, the second substrate 310 and the at least one second sidewall barrier structure 320 And the second rubber 340 constitutes a cover portion LID. It can be understood that the cover portion LID is, for example, one of the barrier function films 100A to 100K, after being peeled off the release film 130, is adhered to the other side of the environmentally sensitive electronic component back plate 230 through the adhesive 140. And the sidewall barrier structure 120 of the substrate 110 is formed in close contact with the environmentally sensitive electronic component backplate 230 through the adhesive material 140, for example, by a roller, a flat pressing head, a cushioning pressure, or other external force. In detail, after the substrate 110 is pressed against the environmentally sensitive electronic component back plate 230 , the substrate 110 is formed as the second substrate 310 and the sidewall barrier structure 120 is formed as the second sidewall barrier structure 320 . Thereafter, the adhesive material 140 is cured (eg, heat cured, UV cured, etc.) to form a second adhesive 340, whereby the second substrate 310 and the second sidewall barrier structure 320 pass through the second adhesive 340 (ie, the cover) The portion LID) is firmly engaged with the environmentally sensitive electronic component backplate 230.

在本實施例中，環境敏感電子元件背板230可包括可撓性基材230a以及環境敏感電子元件單元230b，其中環境敏感電子元件單元230b排列於該可撓性基材230a上。詳細而言，可撓性基材230a例如是聚亞醯胺(PI)所構成，亦可以是其他可撓性材料所構成。另一方面，環境敏感電子元件單元230b包括主動元件232b以及電路與導線234b，且電路導線234b與該主動元件232b 電性連接。在本實施例中，主動元件232b例如是主動式環境敏感電子顯示元件，其中主動式環境敏感電子顯示元件例如是一主動型矩陣有機發光二極體(Active Matrix Organic Light Emitting Diode,AM-OLED)或者是主動型矩陣電泳顯示器(Active Matrix Electro Phoretic Display,AM-EPD)，俗稱電子紙，或者是主動型矩陣液晶顯示器(Active Matrix Liquid Crystal Display,AM-LCD)，或者是主動型矩陣藍相液晶顯示器(Active Matrix Blue Phase Liquid Crystal Display)。 In the present embodiment, the environmentally sensitive electronic component backplate 230 can include a flexible substrate 230a and an environmentally sensitive electronic component unit 230b, wherein the environmentally sensitive electronic component unit 230b is disposed on the flexible substrate 230a. Specifically, the flexible substrate 230a is made of, for example, polyamine (PI), and may be made of another flexible material. On the other hand, the environmentally sensitive electronic component unit 230b includes an active component 232b and a circuit and a wire 234b, and the circuit conductor 234b and the active component 232b Electrical connection. In this embodiment, the active component 232b is, for example, an active environmentally sensitive electronic display component, wherein the active environmentally sensitive electronic display component is, for example, an Active Matrix Organic Light Emitting Diode (AM-OLED). Or Active Matrix Electro Phoretic Display (AM-EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or active matrix blue phase liquid crystal Active Matrix Blue Phase Liquid Crystal Display.

一般而言，主動元件232b為顯示器中的主要顯示區域，其中包含薄膜電晶體(TFT)(未繪示)，且薄膜電晶體可以是非晶矽薄膜電晶體(a-Si TFT)與金屬氧化物薄膜電晶體(metal oxide TFT)或多晶矽薄膜電晶體(p-Si TFT)。此外，多晶矽薄膜電晶體(p-Si TFT)可進一步包括低溫多晶矽薄膜電晶體(low-temperature p-Si TFT)以及高溫多晶矽薄膜電晶體(high-temperature p-Si TFT)、連續晶粒矽薄膜電晶體(Continuous Grain Silicon TFT,CGS TFT)或超晶粒矽薄膜電晶體(Super Grain Silicon TFT,SGS FT)等等。 In general, the active component 232b is a main display area in the display, including a thin film transistor (TFT) (not shown), and the thin film transistor may be an amorphous germanium thin film transistor (a-Si TFT) and a metal oxide. A metal oxide TFT or a polycrystalline germanium thin film transistor (p-Si TFT). In addition, the polycrystalline germanium thin film transistor (p-Si TFT) may further include a low-temperature p-Si TFT and a high-temperature p-Si TFT, a continuous grain germanium film. Continuous Grain Silicon TFT (CGS TFT) or Super Grain Silicon TFT (SGS FT) and the like.

此外，第二膠材340更進一步具有散熱輔助材料20，其中散熱輔助材料20例如是以粒子的型態分佈於第二膠材340內。一般而言，散熱輔助材料20例如是鑽石、類鑽石、銅、銀、金、鋁、鉑、陶瓷材料或其氧化物的高散熱係數材料，可用以將熱導出。另一方面，第二膠材340亦可具有抗電磁干擾材料30，其中抗電磁干擾材料30例如是以粒子的型態分佈於第二膠材340內。 一般而言，抗電磁干擾材料30例如是金、銀、銅、碳或鉛等，可用以減弱電磁的效應。 In addition, the second adhesive 340 further has a heat dissipation auxiliary material 20, wherein the heat dissipation auxiliary material 20 is distributed in the second glue 340, for example, in the form of particles. In general, the heat dissipating auxiliary material 20 is, for example, a high heat dissipation coefficient material of diamond, diamond-like, copper, silver, gold, aluminum, platinum, ceramic material or an oxide thereof, which can be used to derive heat. On the other hand, the second adhesive 340 may also have an anti-electromagnetic interference material 30, wherein the anti-electromagnetic interference material 30 is distributed in the second adhesive 340, for example, in the form of particles. In general, the electromagnetic interference resistant material 30 is, for example, gold, silver, copper, carbon or lead, etc., which can be used to attenuate the effects of electromagnetics.

簡言之，本揭露的顯示裝置300可以是上述實施例的任一環境敏感電子元件200A至200R與撕除離型膜130後的任一阻障功能膜100A至100R的組合，其中第二阻障結構320可以是幾乎貼近顯式面板DIS的可撓性基材230a，亦或是嵌入顯式面板DIS的可撓性基材230a，用以阻隔外界水氣以及氧氣。具體而言，貼合於任一環境敏感電子元件200A至200R的蓋板部LID可作為透光蓋板，亦可作為不透光蓋板，換言之，本揭露的顯示裝置可以是雙面發光的顯示裝置，亦可以是單面發光的顯示裝置。此外，本揭露的顯示裝置更可以是具有觸控功能的顯示裝置，且進一步具有吸濕、散熱以及抗電磁效應等功效 In short, the display device 300 of the present disclosure may be a combination of any of the environmentally sensitive electronic components 200A to 200R of the above embodiment and any of the barrier functional films 100A to 100R after the release film 130 is removed, wherein the second resistance The barrier structure 320 can be a flexible substrate 230a that is nearly in close proximity to the display panel DIS, or a flexible substrate 230a embedded in the display panel DIS to block external moisture and oxygen. Specifically, the cover portion LID attached to any of the environmentally sensitive electronic components 200A to 200R can be used as a transparent cover or as an opaque cover. In other words, the display device of the present disclosure can be double-sided. The display device may also be a display device that emits light on one side. In addition, the display device of the present disclosure may further be a display device with a touch function, and further has the functions of moisture absorption, heat dissipation, and anti-electromagnetic effect.

綜上所述，本揭露的阻障功能膜具有接合於基板及離型膜之間的膠材，且基板上具有側壁阻障結構，其中側壁阻障結構位於基板及離型膜之間。此外，本揭露的環境敏感電子元件及顯示裝置具有接合於兩基板之間的膠材，其中側壁阻障結構配置於兩基板之間並且至少部分側壁阻障結構圍繞環境敏感電子元件單元的主動元件，其中側壁阻障結構由膠材所包覆。換言之，本揭露的阻障功能、環境敏感電子元件及顯示裝置不但具有良好的阻隔水氣與氧氣的能力，且易於量產。 In summary, the barrier functional film of the present disclosure has a rubber material bonded between the substrate and the release film, and has a sidewall barrier structure on the substrate, wherein the sidewall barrier structure is located between the substrate and the release film. In addition, the environmentally sensitive electronic component and display device of the present disclosure have a glue material bonded between the two substrates, wherein the sidewall barrier structure is disposed between the two substrates and at least a portion of the sidewall barrier structure surrounds the active component of the environmentally sensitive electronic component unit Wherein the sidewall barrier structure is covered by a rubber material. In other words, the barrier function, the environmentally sensitive electronic component and the display device of the present disclosure not only have good ability to block moisture and oxygen, but also are easy to mass-produce.

此外，由於本揭露具有配置於基板上的吸濕材，亦或是分佈於膠材內的吸濕材，且膠材具有散熱輔助材以及抗電磁干擾 材料。換言之，本揭露的側壁阻障功能膜、環境敏感電子元件及顯示裝置更具有吸收水氧、散熱以及減弱電磁效應等功效，從而有效延長電子元件的壽命。 In addition, the present disclosure has a moisture absorbing material disposed on the substrate, or a moisture absorbing material distributed in the rubber material, and the rubber material has a heat dissipation auxiliary material and anti-electromagnetic interference. material. In other words, the sidewall barrier functional film, the environmentally sensitive electronic component and the display device of the present disclosure have the functions of absorbing water oxygen, dissipating heat, and attenuating electromagnetic effects, thereby effectively extending the life of the electronic component.

雖然本揭露已以實施例揭露如上，然其並非用以限定本揭露，任何所屬技術領域中具有通常知識者，在不脫離本揭露的精神和範圍內，當可作些許的更動與潤飾，故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

10‧‧‧吸濕材 10‧‧‧Hydraulic materials

20‧‧‧散熱輔助材料 20‧‧‧Solution aids

30‧‧‧抗電磁干擾材料 30‧‧‧Anti-electromagnetic interference materials

100A‧‧‧阻障功能膜 100A‧‧‧Disability function film

110‧‧‧基板 110‧‧‧Substrate

120‧‧‧側壁阻障結構 120‧‧‧ sidewall barrier structure

130‧‧‧離型膜 130‧‧‧ release film

140‧‧‧膠材 140‧‧‧Stained materials

Claims (25)

一種阻障功能膜，包括：一基板，具有一中央區與位於該中央區周圍的一外圍區；至少一側壁阻障結構，位於該基板上，且僅位於該外圍區內；一離型膜，配置於該基板上方，其中該側壁阻障結構位於該基板與該離型膜之間；以及一膠材，包覆該側壁阻障結構並且位於該基板與該離型膜之間，該離型膜與該膠材直接接觸。 A barrier functional film comprising: a substrate having a central region and a peripheral region located around the central region; at least one sidewall barrier structure on the substrate and located only in the peripheral region; a release film And disposed on the substrate, wherein the sidewall barrier structure is located between the substrate and the release film; and a rubber material covering the sidewall barrier structure and located between the substrate and the release film, the separation The film is in direct contact with the glue. 如申請專利範圍第1項所述的阻障功能膜，更包括一吸濕材，其中該吸濕材配置於該基板上，位於該基板與該膠材之間，且該吸濕材被該側壁阻障結構所環繞。 The barrier function film of claim 1, further comprising a moisture absorbing material, wherein the moisture absorbing material is disposed on the substrate between the substrate and the rubber material, and the moisture absorbing material is Surrounded by a sidewall barrier structure. 如申請專利範圍第1項所述的阻障功能膜，更包括一吸濕材，其中該吸濕材分佈於該膠材內。 The barrier function film of claim 1, further comprising a moisture absorbing material, wherein the moisture absorbing material is distributed in the rubber material. 如申請專利範圍第1項所述的阻障功能膜，更包括一散熱輔助材料，其中該散熱輔助材料分佈於該膠材內。 The barrier function film of claim 1, further comprising a heat dissipation auxiliary material, wherein the heat dissipation auxiliary material is distributed in the glue material. 如申請專利範圍第1項所述的阻障功能膜，更包括一抗電磁干擾材料，其中該抗電磁干擾材料分佈於該膠材內。 The barrier function film according to claim 1, further comprising an anti-electromagnetic interference material, wherein the anti-electromagnetic interference material is distributed in the glue. 如申請專利範圍第1項所述的阻障功能膜，其中該基板包括金屬基板或玻璃基板。 The barrier functional film according to claim 1, wherein the substrate comprises a metal substrate or a glass substrate. 如申請專利範圍第1項所述的阻障功能膜，其中該基板包括：可撓性基板；以及 至少一阻障層，配置於該可撓性基板上。 The barrier functional film of claim 1, wherein the substrate comprises: a flexible substrate; At least one barrier layer is disposed on the flexible substrate. 如申請專利範圍第7項所述的阻障功能膜，更包括一四分之一波長補償膜加偏光膜，該四分之一波長補償膜加偏光膜配置於該可撓性基板上，且該四分之一波長補償膜加偏光膜與該阻障層分別位於該可撓性基板兩對側。 The barrier function film according to claim 7, further comprising a quarter-wave compensation film and a polarizing film, wherein the quarter-wave compensation film and the polarizing film are disposed on the flexible substrate, and The quarter-wavelength compensation film-plus-polarization film and the barrier layer are respectively located on opposite sides of the flexible substrate. 如申請專利範圍第7項所述的阻障功能膜，更包括一觸控層，其中該觸控層配置於該可撓性基板上，且該觸控層與該膠材分別位於該阻障層的兩對側。 The barrier function film of claim 7, further comprising a touch layer, wherein the touch layer is disposed on the flexible substrate, and the touch layer and the glue are respectively located in the barrier layer Two opposite sides of the layer. 如申請專利範圍第9項所述的阻障功能膜，更包括一彩色濾光層，其中該彩色濾光層配置於該觸控層上，且該彩色濾光層與該阻障層位於該觸控層的兩對側。 The barrier function film of claim 9, further comprising a color filter layer, wherein the color filter layer is disposed on the touch layer, and the color filter layer and the barrier layer are located Two opposite sides of the touch layer. 如申請專利範圍第1項所述的阻障功能膜，其中該側壁阻障結構包括連續且封閉的環狀結構。 The barrier functional film of claim 1, wherein the sidewall barrier structure comprises a continuous and closed annular structure. 如申請專利範圍第1項所述的阻障功能膜，其中該側壁阻障結構的截面包括矩形、梯形、多邊形、圓形或橢圓形，且該截面垂直於該基板。 The barrier functional film according to claim 1, wherein the cross section of the sidewall barrier structure comprises a rectangle, a trapezoid, a polygon, a circle or an ellipse, and the section is perpendicular to the substrate. 一種阻障功能膜的製作方法，包括：於一基板上形成至少一側壁阻障結構，其中該基板具有一中央區與位於該中央區周圍的一外圍區，且該側壁阻障結構僅位於該外圍區內；於一離型膜上形成一膠材，且該離型膜與該膠材直接接觸；以及 透過該膠材將該離型膜貼附於該基板上，其中該膠材包覆該側壁阻障結構並且位於該基板與該離型膜之間。 A method for fabricating a barrier functional film, comprising: forming at least one sidewall barrier structure on a substrate, wherein the substrate has a central region and a peripheral region located around the central region, and the sidewall barrier structure is located only a peripheral material; a glue is formed on a release film, and the release film is in direct contact with the glue; The release film is attached to the substrate through the glue, wherein the glue covers the sidewall barrier structure and is located between the substrate and the release film. 如申請專利範圍第13項所述的阻障功能膜的製作方法，其中於該基板上形成該側壁阻障結構的方法包括：於該基板上塗佈一光阻層；於該光阻層上進行曝光、顯影與蝕刻處理；以及移除該光阻層以形成該側壁阻障結構。 The method for fabricating a barrier functional film according to claim 13 , wherein the method for forming the sidewall barrier structure on the substrate comprises: coating a photoresist layer on the substrate; and forming the photoresist layer on the photoresist layer Exposure, development, and etching processes are performed; and the photoresist layer is removed to form the sidewall barrier structure. 如申請專利範圍第13項所述的阻障功能膜的製作方法，更包括：於該基板上形成一吸濕材，其中吸濕材位於該基板與該膠材之間，且該吸濕材被該側壁阻障結構所環繞。 The method for fabricating a barrier function film according to claim 13 , further comprising: forming a moisture absorbing material on the substrate, wherein the moisture absorbing material is located between the substrate and the glue material, and the moisture absorbing material Surrounded by the sidewall barrier structure. 如申請專利範圍第13項所述的阻障功能膜的製作方法，更包括一吸濕材，其中該吸濕劑分佈於該膠材內。 The method for fabricating a barrier functional film according to claim 13, further comprising a moisture absorbing material, wherein the moisture absorbent is distributed in the rubber material. 如申請專利範圍第13項所述的阻障功能膜的製作方法，更包括一散熱輔助材料，其中該散熱輔助材料分佈於該膠材內。 The method for fabricating a barrier functional film according to claim 13 , further comprising a heat dissipation auxiliary material, wherein the heat dissipation auxiliary material is distributed in the rubber material. 如申請專利範圍第13項所述的阻障功能膜的製作方法，更包括一抗電磁干擾材料，其中該抗電磁干擾材料分佈於該膠材內。 The method for fabricating a barrier functional film according to claim 13 further includes an anti-electromagnetic interference material, wherein the anti-electromagnetic interference material is distributed in the rubber material. 如申請專利範圍第13項所述的阻障功能膜的製作方法，其中該基板包括金屬基板或玻璃基板。 The method for producing a barrier functional film according to claim 13, wherein the substrate comprises a metal substrate or a glass substrate. 如申請專利範圍第13項所述的阻障功能膜的製作方法，其中該基板包括： 可撓性基板；以及於該可撓性基板上形成之至少一阻障層。 The method for fabricating a barrier functional film according to claim 13, wherein the substrate comprises: a flexible substrate; and at least one barrier layer formed on the flexible substrate. 如申請專利範圍第20項所述的阻障功能膜的製作方法，更包括：於該可撓性基板上形成一四分之一波長補償膜加偏光膜，其中該四分之一波長補償膜加偏光膜與該阻障層分別位於該可撓性基板兩對側。 The method for fabricating a barrier functional film according to claim 20, further comprising: forming a quarter-wavelength compensation film and a polarizing film on the flexible substrate, wherein the quarter-wavelength compensation film The polarizing film and the barrier layer are respectively located on opposite sides of the flexible substrate. 如申請專利範圍第20項所述的阻障功能膜的製作方法，更包括：於該可撓性基板上形成一觸控層，其中該觸控層與該膠材分別位於該阻障層的兩對側。 The method for fabricating a barrier function film according to claim 20, further comprising: forming a touch layer on the flexible substrate, wherein the touch layer and the glue are respectively located in the barrier layer; Two opposite sides. 如申請專利範圍第22項所述的阻障功能膜的製作方法，更包括：於該觸控層上形成一彩色濾光層，其中該彩色濾光層與該阻障層位於該觸控層的兩對側。 The method for fabricating a barrier functional film according to claim 22, further comprising: forming a color filter layer on the touch layer, wherein the color filter layer and the barrier layer are located on the touch layer Two opposite sides. 如申請專利範圍第13項所述的阻障功能膜的製作方法，其中該側壁阻障結構包括連續且封閉的環狀結構。 The method for fabricating a barrier functional film according to claim 13, wherein the sidewall barrier structure comprises a continuous and closed annular structure. 如申請專利範圍第13項所述的阻障功能膜的製作方法，其中該側壁阻障結構的截面包括矩形、梯形、多邊形、圓形或橢圓形，且該截面垂直於該基板。 The method for fabricating a barrier functional film according to claim 13, wherein the cross section of the sidewall barrier structure comprises a rectangle, a trapezoid, a polygon, a circle or an ellipse, and the section is perpendicular to the substrate.