TWI578462B - An anti-sticking heat sink - Google Patents
An anti-sticking heat sink Download PDFInfo
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- TWI578462B TWI578462B TW104100994A TW104100994A TWI578462B TW I578462 B TWI578462 B TW I578462B TW 104100994 A TW104100994 A TW 104100994A TW 104100994 A TW104100994 A TW 104100994A TW I578462 B TWI578462 B TW I578462B
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Description
本發明是有關於一種散熱片，特別是指一種防止真空沾黏的防沾黏散熱片。 The invention relates to a heat sink, in particular to an anti-stick heat sink for preventing vacuum adhesion.
隨著半導體製程的持續進步，現有之半導體晶片除了效能逐漸提升之外，其體積也逐步縮小，例如：智慧型手機及平板電腦的厚度朝著輕薄化的方向製造，因此產品內的各個元件也必須將厚度減少，才能放置在該產品內有限的空間中。 As the semiconductor process continues to advance, the existing semiconductor wafers have gradually reduced in size in addition to their efficiencies. For example, the thickness of smart phones and tablets is being thinned, so the components in the products are also The thickness must be reduced to be placed in a limited space within the product.
而由於半導體晶片運算效率加快，而晶片中所產生的熱量也必須依靠散熱片將熱量導出，當散熱片製造商將散熱片沖壓成型後，會將散熱片以上下堆疊之方式運送至晶片封裝廠進行封裝作業，而封裝廠會以機械手臂夾取或吸取的方式，將散熱片一片一片由上取出黏貼於晶片及基板上。 Since the efficiency of the semiconductor wafer is accelerated, the heat generated in the wafer must also be transferred to the heat by the heat sink. When the heat sink manufacturer stamps the heat sink, the heat sink is stacked on the wafer package factory. The packaging operation is performed, and the packaging factory removes the heat sink pieces one by one from the wafer and the substrate by means of mechanical arm clamping or suction.
參閱圖1，為複數以層疊方式堆疊的散熱片10，當利用一真空吸嘴11由最上層的散熱片10開始取料時，最上層之散熱片10會與下層的散熱片10會因相同的表面使一縫隙12產生真空吸力，使下層的散熱片10一起被帶上來，導致搬移該散熱片10時發生真空沾黏的狀況。 Referring to FIG. 1, a plurality of heat sinks 10 stacked in a stacked manner are used. When a vacuum suction nozzle 11 is used to take a material from the uppermost heat sink 10, the heat sink 10 of the uppermost layer will be the same as the heat sink 10 of the lower layer. The surface causes a gap 12 to generate a vacuum suction force, so that the lower heat sink 10 is brought together, resulting in a vacuum sticking condition when the heat sink 10 is moved.
因此，如何排除搬移上方的散熱片時發生下方的散熱片被彼此間縫隙所產生的真空吸力而彼此沾黏在一起，導致在半導體封裝的產品發生問題。如何達成快速且確實的搬移單一片散熱片進行使用，便成為相關技技術人員亟需努力的目標。 Therefore, how to eliminate the occurrence of the heat sink in the upper side of the heat sink when the heat sink is removed by the vacuum suction generated by the gap between them, causes a problem in the product of the semiconductor package. How to achieve a quick and accurate removal of a single piece of heat sink for use has become an urgent need of the skilled artisan.
有鑑於此，本發明之目的是提供一種防沾黏散熱片，包含一主體單元，及一防沾黏單元。該主體單元包括一具有一第一上表面及一第一下表面的第一主體。 In view of the above, an object of the present invention is to provide an anti-stick heat sink comprising a body unit and an anti-sticking unit. The body unit includes a first body having a first upper surface and a first lower surface.
該防沾黏單元包括複數突伸於該第一下表面上之第一防沾凸垣，當複數散熱片層疊在一起時，該相鄰之主體單元藉由該第一防沾凸垣彼此間隔一段距離。 The anti-adhesion unit includes a plurality of first anti-stick protrusions protruding from the first lower surface, and when the plurality of fins are stacked together, the adjacent body units are spaced apart from each other by the first anti-stick tab A distance.
本發明的又一技術手段，是在於該第一下表面概成方形，且該複數第一防沾凸垣是分別設置於該第一下表面之四個邊上。 Another technical means of the present invention is that the first lower surface is square, and the plurality of first anti-stick projections are respectively disposed on four sides of the first lower surface.
本發明的再一技術手段，是在於該第一下表面概成方形，且該複數第一防沾凸垣是分別設置於該第一下表面之四個角落上。 According to still another aspect of the present invention, the first lower surface is formed in a square shape, and the plurality of first anti-stick projections are respectively disposed on the four corners of the first lower surface.
本發明之另一技術手段，是在於該主體單元更包括一設置於該第一主體中並貫穿該第一上表面與該第一下表面之通孔。 Another technical means of the present invention is that the main body unit further includes a through hole disposed in the first body and extending through the first upper surface and the first lower surface.
本發明的又一技術手段，是在於該第一防沾凸垣是於該第一下表面上沿著該通孔外圍框圍成圈。 According to still another aspect of the present invention, the first anti-smear tab is looped along the peripheral frame of the through hole on the first lower surface.
本發明的再一技術手段，是在於該主體單元更包括一設置於該第一主體上並具有一第二上表面及一第二下表面的第二主體，該第一主體及該第二主體之外緣相互切齊。 According to still another aspect of the present invention, the main body unit further includes a second body disposed on the first body and having a second upper surface and a second lower surface, the first body and the second body The outer edges are aligned with each other.
本發明的另一技術手段，是在於該防沾黏單元更包括複數突伸於該第二下表面上之第二防沾凸垣，該主體單元更包括一連接該第一主體之第一上表面及該第二主體之第二下表面的連接層。 Another technical means of the present invention is that the anti-sticking unit further comprises a plurality of second anti-stick projections protruding from the second lower surface, the main body unit further comprising a first upper body connected to the first main body a connecting layer of the surface and the second lower surface of the second body.
本發明的又一技術手段，是在於該主體單元更包括一設置於該第一主體上方並具有一第二上表面及一第二下表面的第二主體，及一連接於該第一主體及該第二 主體之連接段，該第二主體下表面之面積不大於該通孔，且該連接段是分別連接該第二主體之外周緣及該第一主體之通孔周緣。 Another technical means of the present invention is that the main body unit further includes a second body disposed above the first body and having a second upper surface and a second lower surface, and a first body and a first body The second The connecting portion of the main body, the area of the lower surface of the second body is not larger than the through hole, and the connecting portion is respectively connected to the outer periphery of the second body and the periphery of the through hole of the first body.
本發明的再一技術手段，是在於該第一主體之厚度小於0.3mm。 Still another technical means of the present invention is that the thickness of the first body is less than 0.3 mm.
本發明的另一技術手段，是在於該第一防沾凸垣概成L型。 Another technical means of the present invention is that the first anti-sticking projection is formed into an L-shape.
本發明之有益功效在於該主體單元設置有突伸於該第一下表面上之第一防沾凸垣，使該複數散熱片層疊在一起時，上下相鄰之主體單元藉由該第一防沾凸垣彼此間隔一段距離，使其縫隙中的空氣與外界的空氣產生流通而不會產生真空吸力，以於半導體封裝過程中不會產生真空沾黏的狀況，能夠吸取單一散熱片並黏貼於半導體晶片上。 The utility model has the beneficial effects that the main body unit is provided with a first anti-sticking protrusion protruding from the first lower surface, and when the plurality of fins are stacked together, the main unit adjacent to the upper and lower sides is protected by the first The gravitational ridges are spaced apart from each other to allow the air in the gap to circulate with the outside air without generating vacuum suction, so that vacuum adhesion is not generated during the semiconductor packaging process, and a single heat sink can be sucked and adhered to On a semiconductor wafer.
3‧‧‧基板單元 3‧‧‧Substrate unit
31‧‧‧基板 31‧‧‧Substrate
32‧‧‧晶片 32‧‧‧ wafer
4‧‧‧主體單元 4‧‧‧Main unit
41‧‧‧第一主體 41‧‧‧ first subject
411‧‧‧第一上表面 411‧‧‧ first upper surface
412‧‧‧第一下表面 412‧‧‧First lower surface
42‧‧‧通孔 42‧‧‧through hole
43‧‧‧第二主體 43‧‧‧Second subject
431‧‧‧第二上表面 431‧‧‧Second upper surface
432‧‧‧第二下表面 432‧‧‧Second lower surface
44‧‧‧連接層 44‧‧‧Connection layer
45‧‧‧連接段 45‧‧‧Connection section
5‧‧‧防沾黏單元 5‧‧‧Anti-sticking unit
51‧‧‧第一防沾凸垣 51‧‧‧First anti-stick crown
52‧‧‧第二防沾凸垣 52‧‧‧Second anti-stick
圖1是一裝置示意圖，說明現有搬移散熱片的態樣；圖2是一裝置示意圖，說明本發明防沾黏散熱片之一第一較佳實施例；圖3是一剖視示意圖，說明該第一較佳實施例之剖面態樣；圖4是一使用示意圖，說明搬移該第一較佳實施例的態樣；圖5是一裝置示意圖，說明該第一較佳實施例之使用態樣；圖6是一裝置示意圖，說明本發明防沾黏散熱片之一第二較佳實施例；圖7是一剖視示意圖，說明該第二較佳實施例之剖面態樣； 圖8是一裝置示意圖，說明本發明防沾黏散熱片之一第三較佳實施例；圖9是一使用示意圖，說明本發明防沾黏散熱片之一第四較佳實施例的使用態樣；圖10是一裝置示意圖，說明本發明防沾黏散熱片之一第五較佳實施例；圖11是一側視示意圖，說明該第二較佳實施例之側視態樣；及圖12是一使用示意圖，說明該第五較佳實施例之使用態樣。 1 is a schematic view showing a state of a conventional heat sink; FIG. 2 is a schematic view showing a first preferred embodiment of the heat-resistant heat sink of the present invention; and FIG. 3 is a cross-sectional view showing the FIG. 4 is a schematic view showing the movement of the first preferred embodiment; FIG. 5 is a schematic view showing the use of the first preferred embodiment. Figure 6 is a schematic view showing a second preferred embodiment of the anti-adhesion heat sink of the present invention; Figure 7 is a cross-sectional view showing the cross-sectional aspect of the second preferred embodiment; Figure 8 is a schematic view showing a third preferred embodiment of the anti-adhesive heat sink of the present invention; and Figure 9 is a schematic view showing the use state of a fourth preferred embodiment of the anti-adhesion heat sink of the present invention. Figure 10 is a schematic view showing a fifth preferred embodiment of the anti-adhesive heat sink of the present invention; Figure 11 is a side elevational view showing the side view of the second preferred embodiment; 12 is a schematic diagram showing the use of the fifth preferred embodiment.
有關於本發明之相關申請專利特色與技術內容，在以下配合參考圖式之五個較佳實施例的詳細說明中，將可清楚的呈現。 The details of the related patents and the technical contents of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings.
在進行詳細說明前應注意的是，類似的元件是以相同的編號來作表示。並且，說明書內容所提及半導體封裝製程可用於覆晶封裝技術(Flip Chip Package,FC)、銲球陣列封裝技術(Plastic Ball Grid Array Package,PBGA)、球閘陣列封裝(Ball Grid Array,BGA)、四方扁平封裝(Quad Flat Package,QFP)、四方扁平無引腳封裝(Quad Flat No-lead Package,QFN)，及晶片級封裝(Chip Scale Package,CSP)。 It should be noted that, before the detailed description, similar elements are denoted by the same reference numerals. Moreover, the semiconductor packaging process mentioned in the specification can be used for Flip Chip Package (FC), Plastic Ball Grid Array Package (PBGA), Ball Grid Array (BGA). , Quad Flat Package (QFP), Quad Flat No-lead Package (QFN), and Chip Scale Package (CSP).
參閱圖2、3、4，為本發明防沾黏散熱片之第一較佳實施例，適用於黏貼於一基板單元上3，該基板單元3包括一基板31，及一設置於該基板31上方之晶片32，該防沾黏散熱片可將該晶片32所產生的熱量傳導致外界，並包含一主體單元4，及一防沾黏單元5。 2, 3, and 4, a first preferred embodiment of the anti-adhesion heat sink of the present invention is applied to a substrate unit 3, the substrate unit 3 includes a substrate 31, and a substrate 31 is disposed on the substrate 31. The upper wafer 32, the anti-adhesive heat sink can transfer the heat generated by the wafer 32 to the outside, and includes a main body unit 4 and an anti-sticking unit 5.
該主體單元4包括一具有一第一上表面411及一第一下表面412的第一主體41，該第一下表面412概 成方形。該防沾黏單元5包括複數突伸於該第一下表面412上之第一防沾凸垣51，當複數防沾黏散熱片層疊在一起時，該相鄰之主體單元4藉由該第一防沾凸垣51彼此間隔一段距離，以使該複數防沾黏散熱片彼此間不會產生真空吸力。 The main body unit 4 includes a first body 41 having a first upper surface 411 and a first lower surface 412. The first lower surface 412 is substantially Into a square. The anti-sticking unit 5 includes a plurality of first anti-stick tabs 51 protruding from the first lower surface 412. When the plurality of anti-adhesion fins are stacked together, the adjacent main unit 4 is The anti-stick tabs 51 are spaced apart from one another such that the plurality of anti-stick fins do not create vacuum suction between each other.
圖式中切線a-a為該第一較佳實施例之剖面線，且該第一主體41為薄片型散熱片(Lid)，而該第一防沾凸垣51突伸於該第一下表面412上，較佳地，該主體單元4可使用洋白銅的材質來製造，而該防沾黏單元5使用環氧樹脂(Epoxy)的材質，並以塗佈的技術將其塗佈於該第一下表面412上，實際實施時，該主體單元4之材質也可以使用銅、鋁、不鏽鋼等金屬導熱材質所製造。此外，該防沾黏單元5也可以是製造散熱片時，在沖壓模具上設計出該防沾黏單元5的形狀，當以沖壓方式製造散熱片時，同時於該主體單元4上形成該防沾黏單元5，不應以此為限。 The tangential line aa in the figure is a section line of the first preferred embodiment, and the first body 41 is a sheet-type heat sink (Lid), and the first anti-sticking protrusion 51 protrudes from the first lower surface 412. Preferably, the main body unit 4 can be made of a material of a white copper, and the anti-adhesion unit 5 is made of an epoxy resin (Epoxy) and coated on the first by a coating technique. On the lower surface 412, the material of the main body unit 4 can also be made of a metal heat conductive material such as copper, aluminum or stainless steel. In addition, the anti-adhesion unit 5 may also be configured to shape the anti-adhesion unit 5 on the stamping die when the heat sink is manufactured. When the heat sink is manufactured by stamping, the anti-sticking unit is formed on the main body unit 4 at the same time. Sticking unit 5 should not be limited to this.
在此，值得說明的是，由於目前行動通訊裝及平板電腦都朝著輕薄化的方向來進行，以至於半導體業者在有限的容置空間裡必須塞入許多電子零件，導致半導體元件必須越做越薄。 Here, it is worth noting that since mobile communication devices and tablet computers are moving in a lighter and thinner direction, semiconductor manufacturers must insert many electronic components in a limited space, resulting in semiconductor components must be made. The thinner.
早期，半導體元件(包含散熱片)的總厚度約在0.35mm~0.5mm，而目前半導體之技術可將總厚度下降至2.3~3.0mm，不僅將該基板及該晶片的厚度減少，位於晶片上方之散熱片之厚度也由早期的0.2mm~0.3mm進步到0.1mm~0.2mm，甚至利用較高的沖壓技術可做到0.03~0.06mm左右，但是其越薄的散熱片製作的成本越高。 In the early days, the total thickness of semiconductor components (including heat sinks) was about 0.35mm~0.5mm, and the current semiconductor technology can reduce the total thickness to 2.3~3.0mm, which not only reduces the thickness of the substrate and the wafer, but also lies above the wafer. The thickness of the heat sink has also been improved from the early 0.2mm~0.3mm to 0.1mm~0.2mm, and even 0.03~0.06mm can be achieved by using the higher stamping technology, but the thinner the heat sink is, the higher the cost is. .
由上所述說明可知，目前其散熱片之厚度因為產品需求的關係及製程技術的進步可以做到非常的薄，但是，其散熱片的重量也因為厚度減少的因素而越來越輕，導致目前較薄散熱片以層疊的方式堆疊時，相鄰在一 起的散熱片彼此之間的縫隙所產生的真空吸力，在搬移上方散熱片時會與下方的散熱片產生沾黏，導致封裝製程上的錯誤。 As can be seen from the above description, the thickness of the heat sink can be very thin due to the demand of the product and the advancement of the process technology, but the weight of the heat sink is also becoming lighter due to the thickness reduction factor, resulting in When thinner heat sinks are stacked in a stacked manner, they are adjacent to each other. The vacuum suction generated by the gap between the heat sinks may cause adhesion to the lower heat sink when the upper heat sink is moved, resulting in an error in the packaging process.
進一步說明，在早期因為製造技術的關係使散熱片之厚度較厚且重量夠重，當該散熱片層疊時，從上方吸取最頂端之散熱片，其下方之散熱片會因為重量可以抵銷縫隙中所產生之真空吸力而與上方之散熱片分離，在搬移時相鄰的散熱片並不會遭到真空吸力的影響而導致發生沾黏的狀況。但隨著該散熱片變薄且重量變輕的因素下，半導體封裝廠從層疊的散熱片頂端吸取散熱片時，其下方相鄰之散熱片會因為重量太輕，而導致重量無法抵銷其真空吸力而發生沾黏的情況。 Further, in the early stage, due to the manufacturing technology, the thickness of the heat sink is thick and the weight is heavy. When the heat sink is laminated, the heat sink of the topmost end is sucked from above, and the heat sink below it can offset the gap due to the weight. The vacuum suction generated by the vacuum is separated from the upper heat sink, and the adjacent heat sink is not affected by the vacuum suction force during the moving, resulting in sticking. However, as the heat sink is thinner and lighter, the semiconductor package factory draws the heat sink from the top of the stacked heat sink, and the adjacent heat sink below the weight may be too light, so that the weight cannot be offset. Vacuum suction causes sticking.
本發明人經由測試得知，該第一主體41之厚度小於0.3mm時，該彼此上下相鄰的第一主體41會因為其縫劑中所產生的真空吸力導致發生真空沾黏的狀況，所以本發明防沾黏散熱片於該第一主體41下方設置了複數第一防沾凸垣51使彼此相鄰之第一主體41的縫隙中有空氣流通，消除真空吸力以排除沾黏的狀況，較佳地，該複數第一防沾凸垣51之厚度約0.01mm~0.03mm，即可達到防止相鄰的第一主體41之間產生真空沾黏功效，且可分別設置於該第一下表面412之四個邊的中間點上，其實際實施時，該第一防沾凸垣51之厚度必須配合該第一主體41的面積及厚度來決定塗佈的厚度，不應以此為限。 The inventors have found through test that when the thickness of the first body 41 is less than 0.3 mm, the first body 41 adjacent to each other in the upper and lower sides may be vacuum-sticked due to the vacuum suction generated in the liquid. The anti-sticking heat sink of the present invention is provided with a plurality of first anti-sticking protrusions 51 under the first main body 41 so that air is circulated in the gaps of the first main bodies 41 adjacent to each other, and the vacuum suction force is eliminated to eliminate the sticking condition. Preferably, the thickness of the plurality of first anti-sticking protrusions 51 is about 0.01 mm to 0.03 mm, so as to prevent vacuum adhesion between the adjacent first main bodies 41, and can be respectively disposed under the first At the intermediate point of the four sides of the surface 412, in practice, the thickness of the first anti-sticking protrusion 51 must match the area and thickness of the first body 41 to determine the thickness of the coating, and should not be limited thereto. .
配合參閱圖5，為該第一較佳實施例黏貼於該晶片32上，以將該晶片32所產生的熱量傳導至外界，較佳地，該第一下表面412的面積與該晶片相同，且該防沾黏單元5使用環氧樹脂材料與黏著該基板單元3所使用的黏著劑材料相同時，本發明防沾黏散熱片黏貼於該基板單元3上，該第一防沾凸垣51可與其黏著劑緊緊黏貼在一起，配合該防沾黏單元5使用塗佈的技術裝設於該主體單 元4上，使該主體單元4黏貼於該基板單元後不易脫落。並且，塗佈上該防沾黏單元5之散熱片也有助於辨識正反面，有助於半導體封裝作業不會發生貼錯面的狀況。 Referring to FIG. 5, the first preferred embodiment is adhered to the wafer 32 to conduct heat generated by the wafer 32 to the outside. Preferably, the first lower surface 412 has the same area as the wafer. When the anti-sticking unit 5 is made of the epoxy resin material and the adhesive material used for bonding the substrate unit 3, the anti-adhesion heat sink of the present invention is adhered to the substrate unit 3, and the first anti-sticking protrusion 51 is attached. It can be closely adhered to the adhesive, and the anti-sticking unit 5 is attached to the main body using the coating technology. In the element 4, the main unit 4 is not easily peeled off after being adhered to the substrate unit. Moreover, the heat sink coated with the anti-sticking unit 5 also helps to identify the front and back surfaces, and contributes to the situation in which the semiconductor package operation does not occur.
參閱圖6、7，為本發明防沾黏散熱片之第二較佳實施例，該第二較佳實施例與該第一較佳實施例大致相同，相同之處於此不再贅述，不同之處在於，該主體單元4更包括一設置於該第一主體41中並貫穿該第一上表面411與該第一下表面412之通孔42，使該第一主體41配合該通孔42形成一環型散熱片(ring)，該第一防沾凸垣51於該第一下表面412上沿著該通孔42外圍框圍成圈。 Referring to Figures 6 and 7, a second preferred embodiment of the anti-adhesion heat sink of the present invention is substantially the same as the first preferred embodiment, and the same is not described herein again. The main body unit 4 further includes a through hole 42 disposed in the first body 41 and penetrating the first upper surface 411 and the first lower surface 412, so that the first body 41 is formed with the through hole 42. A ring-shaped heat sink is disposed on the first lower surface 412 along the peripheral frame of the through hole 42.
圖式中切線b-b為該第二較佳實施例的剖面線，在搬移層疊的第一主體41時，其彼此相鄰第一主體41間縫隙中的空氣可藉由該第一防沾凸垣51及該通孔42與外界流通，使彼此相鄰之第一主體41間不會產生真空吸力而沾黏在一起。較佳地，該第一主體41及該通孔42之厚度不大於該晶片32，當該第一主體41黏貼於該基板31上時，該通孔42可以容置該晶片32，實際實施時，其厚度必須配合半導體製程的條件來選擇，不應以此為限。 The tangential line bb in the drawing is a section line of the second preferred embodiment. When the stacked first body 41 is moved, the air in the gap between the first bodies 41 adjacent to each other can be passed by the first anti-stick embossing The through hole 42 and the through hole 42 are circulated to the outside, so that the first main bodies 41 adjacent to each other do not generate vacuum suction force and stick together. Preferably, the thickness of the first body 41 and the through hole 42 is not greater than the thickness of the wafer 32. When the first body 41 is adhered to the substrate 31, the through hole 42 can accommodate the wafer 32. The thickness must be selected in accordance with the conditions of the semiconductor process, and should not be limited to this.
參閱圖8，為本發明防沾黏散熱片之第三較佳實施例，該第三較佳實施例與該第二較佳實施例大致相同，相同之處於此不再贅述，不同之處在於，該主體單元4更包括一設置於該第一主體41上並具有一第二上表面431及一第二下表面432的第二主體43，該第一、二主體41、43之外緣相互切齊，且該第一主體41及該第二主體43為相同材質一體成型。 Referring to FIG. 8 , a third preferred embodiment of the anti-adhesion heat sink of the present invention is substantially the same as the second preferred embodiment. The main body unit 4 further includes a second body 43 disposed on the first body 41 and having a second upper surface 431 and a second lower surface 432. The outer edges of the first and second bodies 41 and 43 are mutually The first body 41 and the second body 43 are integrally formed of the same material.
此外，設置於該第一下表面412上之複數第一防沾凸垣51可將該上層主體單元4之第一下表面412與該下層主體單元4之第二上表面431間隔一段距離，使彼此相鄰的主體單元4間的縫隙不會產生真空吸力而沾黏在一起。 In addition, the plurality of first anti-smear tabs 51 disposed on the first lower surface 412 can distance the first lower surface 412 of the upper layer main unit 4 from the second upper surface 431 of the lower layer main unit 4 by a distance. The gaps between the main body units 4 adjacent to each other do not cause vacuum suction and stick together.
當該第三較佳實施例與該基板單元3黏貼時，該第一下表面412與該基板31貼黏在一起，而該第二下表面432可藉由導熱材質與該晶片32黏貼在一起，可幫助該晶片32運行時所產生的熱量發散出去，達到散熱的效果。 When the third preferred embodiment is adhered to the substrate unit 3, the first lower surface 412 is adhered to the substrate 31, and the second lower surface 432 is adhered to the wafer 32 by a heat conductive material. It can help the heat generated by the operation of the wafer 32 to be dissipated to achieve the heat dissipation effect.
參閱圖9，為本發明防沾黏散熱片之第四較佳實施例，該第四較佳實施例與該第三較佳實施例大致相同，相同之處於此不再贅述，不同之處在於，該第一主體41與該第二主體43間隔一段距離，該主體單元4更包括一連接該第一主體41之第一上表面411及該第二主體43之第二下表面432的連接層44，該防沾黏單元5更包括複數突伸於該第二下表面432上之第二防沾凸垣52。 Referring to FIG. 9 , a fourth preferred embodiment of the anti-adhesion heat sink of the present invention is substantially the same as the third preferred embodiment. The first body 41 is spaced apart from the second body 43. The body unit 4 further includes a connecting layer connecting the first upper surface 411 of the first body 41 and the second lower surface 432 of the second body 43. 44. The anti-sticking unit 5 further includes a plurality of second anti-sticking protrusions 52 protruding from the second lower surface 432.
該複數第二防沾凸垣52與該第一防沾凸垣51形狀及材質相同，分散的設置於該第二下表面432的之四個邊上，當該複數第二主體43層疊在一起時，該相鄰之第二主體43藉由該第二防沾凸垣52彼此間隔一段距離，以使該複數第二主體43層疊時彼此間不會產生真空吸力而沾黏在一起。 The plurality of second anti-sticking protrusions 52 are identical in shape and material to the first anti-sticking protrusions 51, and are disposed on four sides of the second lower surface 432, and the plurality of second main bodies 43 are stacked together. The adjacent second main bodies 43 are spaced apart from each other by the second anti-sticking protrusions 52 such that the plurality of second main bodies 43 are laminated together without generating vacuum suction force.
接著，該連接層44與黏貼散熱片及該基板單元3的黏著劑相同材質，將該第一主體41及該第二主體43黏貼在一起，且該連接層44與該第二防沾凸垣52都具有環氧樹脂的材料，在黏貼時可增加彼此間的黏貼力。最後，該第一防沾凸垣51可使彼此相鄰的主體單元4(包含該第一主體41、該連接層44，及該第二主體43)彼此間不會產生真空吸力而沾黏在一起。 Then, the connecting layer 44 is adhered to the same material as the adhesive of the heat sink and the substrate unit 3, and the first body 41 and the second body 43 are adhered together, and the connecting layer 44 and the second anti-sticking tab are attached. 52 have epoxy resin materials, which can increase the adhesion between each other when pasting. Finally, the first anti-sticking protrusion 51 can cause the main body unit 4 adjacent to each other (including the first main body 41, the connecting layer 44, and the second main body 43) to adhere to each other without generating vacuum suction force. together.
參閱圖10、11、12，為本發明防沾黏散熱片之第五較佳實施例，該第五較佳實施例與該第二較佳實施例大致相同，相同之處於此不再贅述，不同之處在於，該主體單元4更包括一設置於該第一主體41上方並具有一第二上表面431及一第二下表面432的第二主體43，及一與 該第一、二主體41、43連接之連接段45，該第二主體43下表面之面積不大於該通孔42，且該連接段45是分別連接該第二主體43之外周緣及該第一主體41之通孔42周緣。 10, 11, and 12 are the fifth preferred embodiment of the anti-adhesion heat sink of the present invention. The fifth preferred embodiment is substantially the same as the second preferred embodiment. The main body unit 4 further includes a second body 43 disposed above the first body 41 and having a second upper surface 431 and a second lower surface 432, and a The connecting portion 45 to which the first and second bodies 41 and 43 are connected, the area of the lower surface of the second body 43 is not larger than the through hole 42 , and the connecting portion 45 is respectively connected to the outer periphery of the second body 43 and the first portion The periphery of the through hole 42 of a body 41.
其中，該第一主體41、該第二主體43，及該連接段45之材質相同且一體成型，並且該主體單元4中之第一下表面412形狀概成方形。該複數第一防沾凸垣51是分別以塗佈的方式將環氧樹脂設置於該第一下表面412之四個角落上，且該第一防沾凸垣51之表面形狀概成L型。當該複數第五較佳實施例層疊在一起時，該第一防沾凸垣51可使相鄰之主體單元4間隔一段距離，使相鄰之縫隙不會產生真空吸力而發生沾黏的情況。 The first body 41, the second body 43, and the connecting portion 45 are made of the same material and integrally formed, and the first lower surface 412 of the main body unit 4 has a square shape. The plurality of first anti-sticking protrusions 51 are respectively disposed on the four corners of the first lower surface 412 by coating, and the surface shape of the first anti-sticking protrusion 51 is L-shaped. . When the plurality of fifth preferred embodiments are stacked together, the first anti-sticking projection 51 can be spaced apart from the adjacent main body unit 4 so that the adjacent slits do not generate vacuum suction and stick. .
當本發明之防沾黏散熱片黏貼於該基板單元3時，該第一、二主體41、43、該連接段45，及該基板31相配合，將該晶片32框圍保護起來，該晶片32所產生的熱量可藉由該第二主體43傳導至外界。 When the anti-adhesive heat sink of the present invention is adhered to the substrate unit 3, the first and second bodies 41, 43 and the connecting portion 45 cooperate with the substrate 31 to protect the wafer 32. The heat generated by 32 can be conducted to the outside by the second body 43.
由上述說明可知，本發明防沾黏散熱片確實具有以下優點： As can be seen from the above description, the anti-adhesive heat sink of the present invention does have the following advantages:
一、避免產生沾黏 First, avoid sticking
當該複數防沾黏散熱片層疊在一起時，設置於該每一主體單元4之第一下表面412之複數第一防沾凸垣51可將該下層主體單元4間隔一段距離，使得彼此相鄰的縫隙間不會產生真空吸力而沾黏在一起。 When the plurality of anti-sticking heat sinks are stacked together, the plurality of first anti-sticking protrusions 51 disposed on the first lower surface 412 of each of the main body units 4 may space the lower layer main body unit 4 at a distance so as to be mutually The adjacent gaps do not create vacuum suction and stick together.
二、增加產品良率 Second, increase product yield
承上所述，該防沾單元5可防止產生真空吸力而使相鄰的主體單元4彼此不沾黏，即可以減少半導體封裝製程中黏貼散熱片時發生錯誤，不僅可以增加生產速度，也可以增加產品的良率。 As described above, the anti-sticking unit 5 can prevent the vacuum suction from being generated and the adjacent main body units 4 from sticking to each other, that is, the error in the adhesion of the heat sink in the semiconductor packaging process can be reduced, and the production speed can be increased. Increase the yield of the product.
三、增加黏著力 Third, increase adhesion
該防沾單元5與黏著該基板單元3所使用的黏著劑材料相同，當本發明防沾黏散熱片黏貼於該基板單元3上時，該防沾單元5可與該黏著劑緊緊黏貼在一起，使該主體單元4黏貼於該基板單元3上，不易脫落。 The anti-sticking unit 5 is the same as the adhesive material used for adhering the substrate unit 3. When the anti-sticking heat-dissipating fin of the present invention is adhered to the substrate unit 3, the anti-sticking unit 5 can be closely adhered to the adhesive. Together, the main unit 4 is adhered to the substrate unit 3, and is not easily peeled off.
綜上所述，本發明於該主體單元4設置有突伸於該第一下表面412上之第一防沾凸垣51，使該複數防沾黏散熱片層疊在一起時，該相鄰之主體單元4分別藉由該第一防沾凸垣51彼此間隔一段距離，使其縫隙中不會產生真空吸力而發生沾黏，用於半導體封裝製程中快速且吸取單一散熱片黏貼於該基板單元3上，故確實能夠達到本發明之目的。 In summary, the main unit 4 is provided with a first anti-sticking protrusion 51 protruding from the first lower surface 412, so that when the plurality of anti-adhesive fins are stacked together, the adjacent one is adjacent. The main body unit 4 is separated from each other by the first anti-sticking protrusions 51, so that no vacuum suction is generated in the gap, and the adhesive is applied to the substrate unit for fast and suctioning a single heat sink to be adhered to the substrate unit. 3, it is indeed possible to achieve the object of the present invention.
惟以上所述者，僅為本發明之五個較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the five preferred embodiments of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes made by the scope of the invention and the description of the invention are Modifications are still within the scope of the invention.
4‧‧‧主體單元 4‧‧‧Main unit
41‧‧‧第一主體 41‧‧‧ first subject
51‧‧‧第一防沾凸垣 51‧‧‧First anti-stick crown
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| TW200419742A (en) * | 2003-03-27 | 2004-10-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with embedded heat spreader abstract of the disclosure |
| TW201431015A (en) * | 2013-01-22 | 2014-08-01 | Uunup Technology Co Ltd | A heat sink for semiconductor wafer device |
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| TW200419742A (en) * | 2003-03-27 | 2004-10-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with embedded heat spreader abstract of the disclosure |
| TW201431015A (en) * | 2013-01-22 | 2014-08-01 | Uunup Technology Co Ltd | A heat sink for semiconductor wafer device |
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