TWI576591B - Probe card assembling structure, assembling method thereof, and method of taking broken probe out therefrom - Google Patents
Probe card assembling structure, assembling method thereof, and method of taking broken probe out therefrom Download PDFInfo
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- TWI576591B TWI576591B TW105103573A TW105103573A TWI576591B TW I576591 B TWI576591 B TW I576591B TW 105103573 A TW105103573 A TW 105103573A TW 105103573 A TW105103573 A TW 105103573A TW I576591 B TWI576591 B TW I576591B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Description
本發明相關於一種探針卡組裝結構與其組裝方法、以及由該探針卡組裝結構取出斷針的方法，特別是有關一種不需要中介軟片層的探針卡組裝結構與其組裝方法、以及由該探針卡組裝結構取出斷針的方法。 The invention relates to a probe card assembly structure and a method for assembling the same, and a method for removing a broken needle from the probe card assembly structure, in particular to a probe card assembly structure and an assembly method thereof, which do not require an intervening film layer, and The probe card assembly structure takes out the method of breaking the needle.
在對電子元件(例如IC或MEMS)進行測試時，通常需要一探針卡來傳遞訊號而進行電性測試。探針卡內具有數量眾多且細小的探針，這些探針往往依照測試的電子元件的種類與設計而在探針卡中有不同的排列。因此，在進行測試之前，需要依照測試的電子元件的種類與設計所需要的排列，以人工將眾(例如百根、千根、萬根、甚至幾十萬根)多的細小探針依照一固定的排列***或殖入而組裝一探針卡。這樣的一個以人工進 行的植針作業需要耗費大量的時間與人力，所以只要有少數的錯誤(例如植針位置錯誤、探針相接觸等)，就會導致探針卡的組裝失敗，而需要重頭再來，因此，如何避免人為疏忽導致植針錯誤以及確保植針的正確性是非常重要的課題，特別是在所殖入的探針為彎曲型探針時，因為探針彎曲而使得探針兩端在探針卡的位置是彼此錯位的，而容易因作業者錯看、分心、失神、或是手部顫抖等人為疏失而導致植針錯誤，如何避免人為疏忽導致植針錯誤以及確保植針的正確性更為重要。 When testing electronic components (such as ICs or MEMS), a probe card is usually required to transmit signals for electrical testing. There are a large number of tiny probes in the probe card, which are often arranged differently in the probe card depending on the type and design of the electronic components being tested. Therefore, before the test, it is necessary to follow the type of the electronic components tested and the arrangement required by the design, and manually arrange a small probe (for example, one hundred, one thousand, ten thousand, or even hundreds of thousands). A probe card is assembled by inserting or implanting a fixed array. Such one is manually The needle-planting operation requires a lot of time and labor, so if there are a few errors (such as incorrect needle placement, probe contact, etc.), the assembly of the probe card will fail, and it will need to be repeated. How to avoid human negligence leading to needle errors and ensuring the correctness of needle implantation is a very important issue, especially when the probe to be implanted is a curved probe, because the probe is bent and the probe is probed at both ends. The position of the needle card is misplaced with each other, and it is easy to cause needle errors due to operator misunderstanding, distraction, disappointment, or hand tremors. How to avoid human negligence leads to needle errors and ensure correct needle placement. Sex is more important.
參照第一A圖與第一B圖，其為習知以彎曲型探針組裝探針卡的流程圖，而分別展示各個步驟中的探針卡狀態。首先，參照第一A圖，先將兩隔板(spacer)20豎立而組裝於一下導板14，並且在下導板14上方、兩隔板20之間設置組裝一中介軟片層16(例如Mylar)。接著，將探針18經由中介軟片層16上的孔洞17***下導板14的孔洞15中，並使探針18的針頭突出下導板14，而將探針18固定於下導板14與中介軟片層16之間。然後，參照第一B圖，可以由第一A圖所示探針18的穿過中介軟片層16與下導板14的狀況看出，中介軟片層16上的孔洞17與下導板14的孔洞15是彼此錯位的，意即兩者的位置並非垂直成一直線。然後，參照第一B圖，將一上導板12蓋在中介軟片層16以及中介軟片層16的上方，而組裝成一探針卡。由於中介軟片層16上的孔洞17與下導板14的孔洞15是彼此錯位的，所以在第一A圖所示步驟中，除了將探針18固定於下導板14與中介軟片層16之間之外，更將探針18的另一端(即尾 端或非針頭之一端)固定排列成與上導板12上的孔洞13相同的排列與分佈。因此，當將上導板12蓋上的時候，探針18的另一端(即尾端或非針頭之一端)會直接對準上導板12上的孔洞13，並由上導板12上的孔洞穿過而露出。 Referring to the first A diagram and the first B diagram, which are conventional flowcharts for assembling a probe card with a curved probe, the state of the probe card in each step is separately shown. First, referring to the first A diagram, two spacers 20 are first erected to be assembled to the lower guide 14, and an intermediate film layer 16 (for example, Mylar) is disposed between the lower spacers 14 and between the two spacers 20. . Next, the probe 18 is inserted into the hole 15 of the lower guide 14 via the hole 17 in the intermediate film layer 16, and the needle of the probe 18 is protruded from the lower guide 14 to fix the probe 18 to the lower guide 14 and Between the intermediate film layers 16. Then, referring to the first B-picture, the hole 17 and the lower guide 14 on the intermediate film layer 16 can be seen from the condition of the probe 18 shown in the first A-picture passing through the intermediate film layer 16 and the lower guide plate 14. The holes 15 are misaligned with each other, meaning that the positions of the two are not perpendicular to each other. Then, referring to the first B diagram, an upper guide 12 is placed over the intermediate film layer 16 and the intermediate film layer 16, and assembled into a probe card. Since the holes 17 in the intermediate film layer 16 and the holes 15 of the lower guide 14 are offset from each other, in the step shown in FIG. A, in addition to fixing the probe 18 to the lower guide 14 and the intermediate film layer 16, In addition to the other end of the probe 18 The ends or ends of the non-needles are fixedly arranged in the same arrangement and distribution as the holes 13 in the upper guide 12. Therefore, when the upper guide 12 is covered, the other end of the probe 18 (i.e., the end or the end of the non-needle) is directly aligned with the hole 13 in the upper guide 12 and is supported by the upper guide 12. The hole passes through and is exposed.
此一習知探針卡的組裝方法，雖然藉由下導板14與中介軟片層16而固定探針18，但是由於中介軟片層16的價格昂貴，而不同的電子元件種類因測試時所需要的探針排列不同，所以需要不同的中介軟片層16，而造成測試成本的增加。由於探針18不但細小且數量眾多，所以中介軟片層16上的孔洞17與下導板14上的孔洞15不但細小且密集，在植針時作業者僅能藉由肉眼去辨別中介軟片層16上那一個孔洞17是對應下導板14上的那一個孔洞15(即植針的位置)，而將探針18通過中介軟片層16上的孔洞17穿入下導板14上對應的孔洞15，所以很容易因作業者的人為疏失(例如眼花、分心、失神、或是手部顫抖等等)而導致探針18誤植到錯誤的位置(錯誤的中介軟片層16孔洞或錯誤的下導板14孔洞)，造成植針失敗。下導板14大多為陶瓷材質所製作而成，其上孔洞15係且以機械方式於鑽出，所以下導板14是不透光(或是不透明)，而中介軟片層16大多是以半透明材質製作而成的，且其上孔洞17以雷射方式鑽出，所以下導板14是不透光(或是不透明)，使得作業者無法清楚地目視觀察與確認探針的植針位置是否正確，更增加了作業者以肉眼進行植針作業的困難度與風險，以及增加確保植針正確的困 難度，因此，導致植針與探針卡組裝的成功率與探大幅地下降，而造成測試效率的低下。 In the conventional method of assembling the probe card, although the probe 18 is fixed by the lower guide 14 and the intermediate film layer 16, the price of the intermediate film layer 16 is expensive, and different types of electronic components are required for testing. The probes are arranged differently, so different interposer layers 16 are required, resulting in an increase in testing costs. Since the probe 18 is not only small and numerous, the holes 17 in the intermediate film layer 16 and the holes 15 in the lower guide 14 are not only small and dense, but the operator can only distinguish the intermediate film layer 16 by the naked eye. The upper hole 17 corresponds to the hole 15 (i.e., the position of the needle) on the lower guide 14, and the probe 18 is inserted through the hole 17 in the intermediate film layer 16 into the corresponding hole 15 in the lower guide 14. , so it is easy to cause the probe 18 to be mistakenly implanted into the wrong position due to the operator's human error (such as vertigo, distraction, disappointment, or hand tremor, etc.) (wrong media layer 16 hole or wrong guide) Plate 14 holes), causing the needle to fail. The lower guide plate 14 is mostly made of a ceramic material, and the upper hole 15 is mechanically drilled, and the lower guide 14 is opaque (or opaque), and the intermediate film layer 16 is mostly half. The transparent material is made, and the upper hole 17 is laser-drilled, and the lower guide 14 is opaque (or opaque), so that the operator cannot clearly visually observe and confirm the needle position of the probe. Whether it is correct or not, it increases the difficulty and risk of the operator performing the needle implantation operation with the naked eye, and increases the difficulty of ensuring the correct needle placement. Difficulty, therefore, the success rate of the needle and probe card assembly is greatly reduced, resulting in low test efficiency.
再者，這樣的探針卡組裝結構與探針卡組裝方法需要以一個上導板12覆蓋於中介軟片層16之上，所以在發現探針卡內有探針需要調整或更換時，往往需要先打開上導板12，但是移動上導板12時，探針18往往會被上導板12所帶動而移動，導致探針18的位置變動與錯亂。這個時候往往需要將原本已經完成植針的探針18一根一根抽出，而重新進行植針，而造成測試的停擺與延宕。其次，使用者在往往會因為疏忽而打開、碰撞、或是移動到上導板，也會導致同樣的情形發生，而需要將探針全部抽出，而重新進行植針。另外，由於上導板12大多為陶瓷材質所製作而成，其上孔洞13係且以機械方式於鑽出，所以上導板12是不透光(或是不透明)，作業者並無法直接透過上導板12而觀察到探針卡內的探針分佈狀況，而無法直接觀察到探針卡內的探針是否有位移、斷針、以及相接觸等問題發生，往往需要打開上導板才能進行檢視，而打開上導板又會有導致探針位移與錯亂的風險，而增加檢視探針卡內部狀況的困難。 Moreover, such a probe card assembly structure and a probe card assembly method need to be covered on the intermediate film layer 16 by an upper guide 12, so when it is found that a probe in the probe card needs to be adjusted or replaced, it is often required. The upper guide 12 is first opened, but when the upper guide 12 is moved, the probe 18 is often moved by the upper guide 12 to cause the position and variation of the probe 18 to be changed. At this time, it is often necessary to take out the probes 18 which have already completed the implantation of the needles one by one, and then re-inject the needles, causing the test to stop and delay. Secondly, the user often inadvertently opens, collides, or moves to the upper guide plate, which also causes the same situation to occur, and the probe needs to be completely withdrawn, and the needle is re-planted. In addition, since the upper guide plate 12 is mostly made of ceramic material, the upper hole 13 is mechanically drilled, so the upper guide plate 12 is opaque (or opaque), and the operator cannot directly pass through. The upper guide plate 12 observes the distribution of the probes in the probe card, and it is impossible to directly observe whether the probes in the probe card have displacement, broken needles, and contact problems, etc., and it is often necessary to open the upper guide plate. Viewing, and opening the upper guide plate, there is a risk of displacement and confusion of the probe, and it is difficult to view the internal condition of the probe card.
有鑑於此，亟需要一種探針卡組裝結構與探針卡組裝方法，可以不需要任何中介軟片層，且可以降低植針與組裝探針卡的困難度，更可以避免在進行探針調整或更換時造成探針位置變動與錯亂，從而降低測成本與增加測試效率。 In view of this, there is a need for a probe card assembly structure and a probe card assembly method, which does not require any intermediate film layer, and can reduce the difficulty of implanting a needle and assembling a probe card, and can avoid probe adjustment or When the replacement causes the probe position to change and be disordered, thereby reducing the measurement cost and increasing the test efficiency.
本發明之一目的為提供一種不需要任何中介軟片層的探針卡組裝結構，其可以直接清楚地觀察與檢視到探針卡組裝結構的內部狀況，而降低植針、組裝探針卡、以及探針調整與更換的困難度與風險，從而降低測成本與增加測試效率。 It is an object of the present invention to provide a probe card assembly structure that does not require any intermediate film layer, which can directly observe and view the internal condition of the probe card assembly structure, reduce the needle, assemble the probe card, and The difficulty and risk of probe adjustment and replacement, thereby reducing the cost of testing and increasing the efficiency of testing.
本發明之另一目的為提供一種探針卡組裝方法，不但不需要使用任何中介軟片層，更可直接以目視清楚地確認植針的位置與正確性，而降低植針與組裝探針卡的困難度，從而提升植針與組裝探針卡的成功率，以及降低測成本與增加測試效率。 Another object of the present invention is to provide a method for assembling a probe card, which not only does not require the use of any intervening film layer, but also directly confirms the position and correctness of the implant needle by visually clearing, and reduces the needle placement and assembly of the probe card. Difficulty, which increases the success rate of implanting and assembling probe cards, as well as reducing measurement costs and increasing test efficiency.
本發明之又一目的為提供一種由探針卡組裝結構中取出斷針的方法或是調整與更換探針的方法，可以不需要打開上導板，而避免因移動上導板而帶動探針所造成的探針位置變動與錯亂，從而降低探針調整與更換的困難度與風險，並且降低測成本與增加測試效率。 It is still another object of the present invention to provide a method for removing a broken needle from a probe card assembly structure or a method of adjusting and replacing a probe, which can eliminate the need to open the upper guide plate and avoid driving the probe by moving the upper guide plate. The resulting probe position changes and confusion, thereby reducing the difficulty and risk of probe adjustment and replacement, and reducing the cost of testing and increasing the efficiency of testing.
根據本發明之一目的，本發明提供一種探針卡組裝結構。此探針卡組裝結構包含一透明上導板、一下導板、以及複數個探針。透明上導板為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，且其上具有複數個第一貫孔。下導板平行設置於透明下導板下方，下導板上具有複數個第二貫 孔，其中，每一第二貫孔皆對應一第一貫孔。每一探針皆穿設一第一貫孔及對應該第一貫孔的第二貫孔，而將該等探針固定於上導板與下導板之間。藉此，作業者可以直接以透明上導板與下導板固定探針，並可以直接透過透明上導板而清楚地目視、觀察、檢視、以及確認探針組裝結構內的探針的狀況與排列分佈，所以可以有效地降低植針、組裝探針卡、以及探針調整與更換的困難度與風險，而提升植針、組裝探針卡、以及探針調整與更換的成功率，從而降低測成本與增加測試效率。 According to one aspect of the present invention, the present invention provides a probe card assembly structure. The probe card assembly structure includes a transparent upper guide, a lower guide, and a plurality of probes. The transparent upper guide plate is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, and has a plurality of first through holes thereon. The lower guide plate is disposed in parallel below the transparent lower guide plate, and the lower guide plate has a plurality of second passes The hole, wherein each of the second through holes corresponds to a first through hole. Each of the probes is provided with a first through hole and a second through hole corresponding to the first through hole, and the probes are fixed between the upper guide plate and the lower guide plate. Thereby, the operator can directly fix the probe with the transparent upper guide plate and the lower guide plate, and can directly visually observe, observe, inspect, and confirm the condition of the probe in the probe assembly structure through the transparent upper guide plate. Arrangement and distribution, so it can effectively reduce the difficulty and risk of needle implantation, assembly of probe cards, and probe adjustment and replacement, and improve the success rate of needle implantation, probe card assembly, and probe adjustment and replacement, thereby reducing Measure costs and increase test efficiency.
根據本發明之另一目的，本發明提供一種探針卡組裝方法。此探針卡組裝方法包含下列步驟：(1)提供一透明上導板與一下導板，其中，透明上導板平行設置於下導板上方，透明上導板具有複數個第一貫孔，下導板具有複數個第二貫孔，每一第一貫孔皆對應一第二貫孔；以及(2)提供數個探針，並將每一探針經由一第一貫孔與一第二貫孔穿過透明上導板與下導板，而將該等探針固定於透明上導板與下導板之間。由於透明上導板為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，所以作業者可以直接以透明上導板與下導板固定探針，並可以直接透過透明上導板而清楚地目視、觀察、與確認探針組裝結構內的探針分佈狀態才。藉此，不需要如同習知探 針卡組裝方法一樣，先以任何中介軟片層先行將探針固定於下導板上，才能將上導板與下導板組裝，而是可以直接先組裝透明上導板與下導板，再進行植針，而將探針直接固定於透明上導板與下導板之間，並且直接以目視即可以檢視與確認探針是否正確地植針探針卡內部。因此，可以降低植針與組裝探針卡的困難度，從而提升植針與組裝探針卡的成功率，以及降低低測成本與增加測試效率。 According to another object of the present invention, the present invention provides a probe card assembly method. The probe card assembly method comprises the following steps: (1) providing a transparent upper guide plate and a lower guide plate, wherein the transparent upper guide plate is disposed in parallel above the lower guide plate, and the transparent upper guide plate has a plurality of first through holes. The lower guide plate has a plurality of second through holes, each of the first through holes corresponding to a second through hole; and (2) providing a plurality of probes, and each probe is connected to the first through the first through holes The two through holes pass through the transparent upper guide plate and the lower guide plate, and the probes are fixed between the transparent upper guide plate and the lower guide plate. Since the transparent upper guide plate is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, the operator can directly fix the probe with the transparent upper guide plate and the lower guide plate, and can directly pass through the transparent plate. The upper guide is used to clearly visualize, observe, and confirm the probe distribution state within the probe assembly structure. Therefore, it is not necessary to be like a probe. In the same way as the needle card assembly method, the probe is first fixed to the lower guide plate by any intermediate film layer, so that the upper guide plate and the lower guide plate can be assembled, but the transparent upper guide plate and the lower guide plate can be assembled first, and then The needle is implanted, and the probe is directly fixed between the transparent upper guide and the lower guide, and the inside of the probe card can be directly visually inspected and confirmed by the probe. Therefore, the difficulty of implanting the needle and assembling the probe card can be reduced, thereby improving the success rate of the implanted needle and assembling the probe card, as well as reducing the low measurement cost and increasing the test efficiency.
根據本發明之又一目的，本發明提供一種將斷針由探針卡組裝結構取出的方法。此將斷針由探針卡組裝結構取出的方法包含下列步驟：(1)提供一由一透明上導板、一下導板、以及複數個探針所組成的探針卡組裝結構，其中，透明上導板具有複數個第一貫孔，下導板具有複數個第二貫孔，且每一第一貫孔皆對應一第二貫孔，並且透明上導板具有至少一維修孔，維修孔設置於透明上導板上未具有第一貫孔的區域；以及(2)經由此維修孔將該探針卡組裝結構中取出。由於透明上導板由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，所以作業者可以透過透明上導板目視而清楚地得知探針卡組裝結構內的斷針所在的位置與周邊環境，而可以輕易地經由維修孔伸入工具而取出斷針，或是將斷針由維修孔倒出，而不需要打 開上導板。藉此，可以避免因移動上導板而帶動探針所造成的探針位置變動與錯亂，從而降低探針調整與更換的困難度與風險，並降低測成本與增加測試效率。 In accordance with still another object of the present invention, the present invention provides a method of removing a broken needle from a probe card assembly structure. The method for removing the broken needle from the probe card assembly structure comprises the following steps: (1) providing a probe card assembly structure consisting of a transparent upper guide plate, a lower guide plate, and a plurality of probes, wherein The upper guide plate has a plurality of first through holes, the lower guide plate has a plurality of second through holes, and each of the first through holes corresponds to a second through hole, and the transparent upper guide plate has at least one service hole, the maintenance hole An area on the transparent upper guide that does not have the first through hole; and (2) the removal of the probe card assembly structure through the service hole. Since the transparent upper guide plate is composed of a flat plate composed of a wear-resistant, high-hardness, and low thermal expansion coefficient transparent material, the operator can clearly see through the transparent upper guide plate that the broken needle in the probe card assembly structure is located. Position and surrounding environment, and can easily take out the broken needle through the service hole into the tool, or pour the broken needle out of the repair hole, without the need to play Open the guide. Thereby, the position change and disorder of the probe caused by the moving of the upper guide plate can be avoided, thereby reducing the difficulty and risk of adjusting and replacing the probe, reducing the test cost and increasing the test efficiency.
因此，本發明提供了一種探針卡組裝結構、探針卡組裝方法、以及將斷針由探針卡組裝結構取出的方法，不但可以不需要任何中介軟片層，且透過透明上導板直接目視觀察與檢視探針卡組裝結構內部的探針狀況與排列分佈，而有助於可以降低植針與組裝探針卡的困難度，更可以避免在進行探針調整或更換時造成探針位置變動與錯亂，進而降低探針調整與更換的困難度與風險，並且降低測成本與增加測試效率。 Therefore, the present invention provides a probe card assembly structure, a probe card assembly method, and a method for removing a broken needle from a probe card assembly structure, which can not only require any intermediate film layer, but also directly visualize through the transparent upper guide plate. Observing and inspecting the condition and arrangement of the probes inside the probe card assembly structure can help reduce the difficulty of implanting the needle and assembling the probe card, and avoid the position change of the probe when the probe is adjusted or replaced. And the confusion, thereby reducing the difficulty and risk of probe adjustment and replacement, and reducing the cost of testing and increasing the efficiency of testing.
10‧‧‧習知探針卡 10‧‧‧Professional probe card
12‧‧‧上導板 12‧‧‧Upper guide
13‧‧‧孔洞 13‧‧‧ hole
14‧‧‧下導板 14‧‧‧Lower guide
15‧‧‧孔洞 15‧‧‧ holes
16‧‧‧中介軟片層 16‧‧‧Intermediate film layer
17‧‧‧孔洞 17‧‧‧ hole
18‧‧‧探針 18‧‧‧ probe
20‧‧‧隔板 20‧‧‧Baffle
100、100A、100B、100C‧‧‧探針卡組裝結構 100, 100A, 100B, 100C‧‧‧ probe card assembly structure
102‧‧‧透明上導板 102‧‧‧Transparent upper guide
104‧‧‧下導板 104‧‧‧ lower guide
106‧‧‧探針 106‧‧‧Probe
106A‧‧‧探針 106A‧‧‧Probe
106’‧‧‧斷針 106’‧‧‧ broken needle
108‧‧‧隔板 108‧‧‧Baffle
110‧‧‧基板 110‧‧‧Substrate
112‧‧‧電路板 112‧‧‧Circuit board
114‧‧‧維修孔 114‧‧‧Maintenance hole
116‧‧‧工具 116‧‧‧ Tools
1021‧‧‧第一貫孔 1021‧‧‧ first through hole
1041‧‧‧第二貫孔 1041‧‧‧second through hole
200‧‧‧探針固定機構 200‧‧‧Probe fixing mechanism
第一A圖至第一B圖為習知探針卡組裝方法之流程圖。 The first A to the first B are flowcharts of a conventional probe card assembly method.
第二A圖為本發明之一實施例之探針卡組裝結構之示意圖。 FIG. 2A is a schematic view showing the assembly structure of the probe card according to an embodiment of the present invention.
第二B圖為本發明之另一實施例之探針卡組裝結構之示意圖。 FIG. 2B is a schematic view showing the assembly structure of the probe card according to another embodiment of the present invention.
第三A圖至第三C圖為本發明之一實施例之探針卡組裝方法之流程圖。 3A to 3C are flowcharts showing a method of assembling a probe card according to an embodiment of the present invention.
第四A圖至第四D圖為本發明之另一實施例之探針卡組裝方法之流程圖。 4A to 4D are flowcharts showing a method of assembling a probe card according to another embodiment of the present invention.
第五A圖至第五E圖為本發明之多個實施例之將斷針由探針卡組裝結構取出的方法之流程圖。 5A through 5E are flow diagrams of a method of removing a broken needle from a probe card assembly structure in accordance with various embodiments of the present invention.
本發明的一些實施例詳細描述如下。然而，除了該詳細描述外，本發明還可以廣泛地在其他的實施例施行。亦即，本發明的範圍不受已提出之實施例的限制，而以本發明提出之申請專利範圍為準。其次，當本發明之實施例圖示中的各元件或步驟以單一元件或步驟描述說明時，不應以此作為有限定的認知，即如下之說明未特別強調數目上的限制時本發明之精神與應用範圍可推及多數個元件或結構並存的結構與方法上。再者，在本說明書中，各元件之不同部分並沒有完全依照尺寸繪圖，某些尺度與其他相關尺度相比或有被誇張或是簡化，以提供更清楚的描述以增進對本發明的理解。而本發明所沿用的現有技藝，在此僅做重點式的引用，以助本發明的闡述。 Some embodiments of the invention are described in detail below. However, the present invention may be widely practiced in other embodiments in addition to the detailed description. That is, the scope of the present invention is not limited by the embodiments of the present invention, and the scope of the patent application proposed by the present invention shall prevail. In the following, when the elements or steps in the embodiments of the present invention are described in a single element or step description, the present invention should not be construed as limiting, that is, the following description does not particularly emphasize the numerical limitation. The spirit and scope of application can be derived from the structure and method in which many components or structures coexist. In addition, in the present specification, the various parts of the elements are not drawn in full accordance with the dimensions, and some dimensions may be exaggerated or simplified compared to other related dimensions to provide a clearer description to enhance the understanding of the present invention. The prior art of the present invention, which is used in the prior art, is only referred to herein by reference.
參照第二A圖，其為實施例之探針卡組裝結構100之示意圖。探針卡組裝結構100包含一透明上導板102、一下導板 104、以及數根探針106。透明上導板102平行設置於下導板104的上方，而透明上導板102與下導板104之間設置有分隔與支撐透明上導板102與下導板104的兩隔板(spacer)108，而將透明上導板102與下導板104組合成一可以固定探針106的探針固定機構。透明上導板102為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，且其上具有數個第一貫孔1021，第一貫孔1021係以雷射貫穿透明上導板102而形成的喇叭狀貫孔。在本實施例中，下導板104為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，其上具有數個第二貫孔1041，其同樣是以雷射貫穿下導板104而形成的喇叭狀貫孔，但是不以此為限。在本發明其他實施例中，下導板也可以是以耐磨、高硬度、且低熱膨脹係數的不透明材料所組成的平板，其上也具有數個第二貫孔，但是以機械方式鑽出的貫孔。每一第二貫孔1041皆對應一個第一貫孔1021，而供同一探針穿設。 Referring to Figure 2A, which is a schematic illustration of the probe card assembly structure 100 of the embodiment. The probe card assembly structure 100 includes a transparent upper guide plate 102 and a lower guide plate. 104, and a plurality of probes 106. The transparent upper guiding plate 102 is disposed in parallel above the lower guiding plate 104, and two spacers separating and supporting the transparent upper guiding plate 102 and the lower guiding plate 104 are disposed between the transparent upper guiding plate 102 and the lower guiding plate 104. 108, and the transparent upper guide 102 and the lower guide 104 are combined into a probe fixing mechanism that can fix the probe 106. The transparent upper guiding plate 102 is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, and has a plurality of first through holes 1021 thereon, and the first through holes 1021 are transparent through the laser. A flared through hole formed by the upper guide plate 102. In this embodiment, the lower guide plate 104 is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, and has a plurality of second through holes 1041 thereon, which are also penetrated by lasers. The flared through hole formed by the lower guide 104 is not limited thereto. In other embodiments of the present invention, the lower guide plate may also be a flat plate composed of an opaque material having high wear resistance, high hardness, and low thermal expansion coefficient, and also has a plurality of second through holes thereon, but is mechanically drilled. Through hole. Each of the second through holes 1041 corresponds to one first through hole 1021, and is provided for the same probe.
每一探針106皆經由第一貫孔1021穿過透明上導板102，並經由與該第一貫孔1021對應的第二貫孔1041穿過下導板104，而將探針106的針頭(即探針106的一端)穿過下導板104而暴露於外，並且將探針106的另一端(即非為針頭的一端)透明 暴露於透明上導板102外。藉此，將探針106固定於透明上導板102與下導板104之間，意即被固定於透明上導板102、下導板104、以及隔板108所組合成的探針固定機構中，使得探針106可以依照所測試的電子元件種類在探針卡組裝結構100內形成不同的排列。如同第二A圖所示，在探針卡組裝結構100內的探針106為一彎曲型探針(例如cobra探針等等)，所以透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041並非以上下垂直成一直線的方式排列，而是以一錯位的方式透明上導板102與下導板104上，但是並不以此為限。在本發明其他實施例中，依照電子元件種類與測試需求，也可以使用直線型探針、或是彈簧探針(例如pogo探針等等)，並將透明上導板上的第一貫孔與下導板上的第二貫孔改以上下垂直成一直線的方式排列。 Each probe 106 passes through the transparent upper guide plate 102 via the first through hole 1021 and passes through the lower guide plate 104 via the second through hole 1041 corresponding to the first through hole 1021, and the needle of the probe 106 is inserted. (ie, one end of the probe 106) is exposed to the outside through the lower guide 104, and the other end of the probe 106 (ie, the end that is not the needle) is transparent. It is exposed to the outside of the transparent upper guide plate 102. Thereby, the probe 106 is fixed between the transparent upper guide plate 102 and the lower guide plate 104, that is, the probe fixing mechanism which is fixed to the transparent upper guide plate 102, the lower guide plate 104, and the partition plate 108. The probes 106 are configured to form different arrangements within the probe card assembly structure 100 in accordance with the type of electronic component being tested. As shown in FIG. 2A, the probe 106 in the probe card assembly structure 100 is a curved probe (such as a cobra probe or the like), so the first through hole 1021 on the transparent upper guide plate 102 is lower. The second through holes 1041 of the guide plate 104 are not vertically aligned in a straight line, but are transparent to the upper and lower guide plates 102 and 104, but are not limited thereto. In other embodiments of the present invention, depending on the type of electronic component and the test requirements, a linear probe, or a spring probe (such as a pogo probe, etc.) may be used, and the first through hole on the transparent upper guide plate may be used. Arranged in such a manner that the second through holes on the lower guide plate are vertically aligned with the upper and lower sides.
另外，探針卡組裝結構100更包含一基板110與一電路板112。基板110與電路板112皆設置於透明上導板102上，基板110設置於電路板112與透明上導板102之間。基板110以一面與探針106伸出透明上導板102的部分相接觸而電性連接，而以另一面上設置於錫球與電路板112上的電路(圖中未示) 相接觸而電性連接，使得探針經由基板110而與電路板112電路連接，而做為測試訊號傳遞路徑。 In addition, the probe card assembly structure 100 further includes a substrate 110 and a circuit board 112. The substrate 110 and the circuit board 112 are disposed on the transparent upper conductive plate 102. The substrate 110 is disposed between the circuit board 112 and the transparent upper conductive plate 102. The substrate 110 is electrically connected to a portion of the probe 106 that protrudes from the transparent upper guide 102, and is disposed on the other surface of the solder ball and the circuit board 112 (not shown). The contacts are electrically connected such that the probes are electrically connected to the circuit board 112 via the substrate 110 as a test signal transmission path.
在第二A圖所示之探針卡組裝結構100中，由於透明上導板102與下導板104皆是透明的，所以無論是在組裝探針卡組裝結構100、將探針106植入組裝探針卡組裝結構100(或透明上導板102與下導板104)、檢視探針卡組裝結構100內的探針106狀態與排列、以及調整或更換探針106，作業者的目光都可以透過透明上導板102與下導板104，而讓作業者直接且清楚地觀察到探針卡組裝結構100的內部情形。藉此，在進行植針作業時，作業者可以輕易地將探針106穿入透明上導板102與下導板104中，而不需要中介軟片層，所以可以減少植針與組裝探針組裝結構的困難度與風險，並省下中介軟片層所需的成本，從而增加針與組裝探針組裝結構的成功，從而降低測成本與增加測試效率。由於作業者可以以目視方式直接且清楚地觀察到探針卡組裝結構100的內部情形，所以有助於作業者觀察到探針卡組裝結構100內部的異常情況(例如斷針、探針歪斜、探針相接觸等等)，而可以即時處理這些異常情況，避免影響測試良率與效率，並且有助於發現探針卡組裝結構100內部的異常所在位置而進行處理(例如探針調整、斷針取出、以及探針更 換等等)，從而探針調整與更換的成功率，避免測試因探針卡組裝結構100內部的異常情況而造成測試不正確與延宕，進而降低測成本與增加測試效率。雖然在本實施例中，透明上導板102與下導板104皆是透明的，所以可以達成上述功效，但是並不以此為限。在本發明其他實施例中，可以採取僅有透明上導板為透明，而下導板104為不透明此一設計，仍然可以達到上述功效，而同樣屬於本發明之範疇。 In the probe card assembly structure 100 shown in FIG. 2A, since the transparent upper guide plate 102 and the lower guide plate 104 are both transparent, the probe card assembly structure 100 is assembled, and the probe 106 is implanted. Assembling the probe card assembly structure 100 (or the transparent upper guide plate 102 and the lower guide plate 104), inspecting the state and arrangement of the probes 106 in the probe card assembly structure 100, and adjusting or replacing the probes 106, the operator's eyes are all The transparent upper guide plate 102 and the lower guide plate 104 can be passed through, so that the operator can directly and clearly observe the internal condition of the probe card assembly structure 100. Thereby, the operator can easily insert the probe 106 into the transparent upper guide plate 102 and the lower guide plate 104 during the needle implantation operation, without the need for the intermediate layer, so that the implant needle and the assembled probe assembly can be reduced. The difficulty and risk of the structure, and the cost of the intermediate film layer, thereby increasing the success of the needle and assembly probe assembly structure, thereby reducing the cost of testing and increasing the test efficiency. Since the operator can directly and clearly observe the internal condition of the probe card assembly structure 100 in a visual manner, it is helpful for the operator to observe an abnormal situation inside the probe card assembly structure 100 (for example, a broken needle, a probe skew, The probes are in contact with each other, etc., and these abnormal conditions can be handled immediately, to avoid affecting the test yield and efficiency, and to help find the abnormal position inside the probe card assembly structure 100 for processing (for example, probe adjustment, break Needle removal, and probe more Change, etc., so that the success rate of probe adjustment and replacement, to avoid testing due to abnormal conditions inside the probe card assembly structure 100 caused by incorrect testing and delay, thereby reducing the cost of testing and increasing test efficiency. Although the transparent upper guide plate 102 and the lower guide plate 104 are both transparent in this embodiment, the above effects can be achieved, but are not limited thereto. In other embodiments of the present invention, it is possible to adopt a design in which only the transparent upper guide plate is transparent, and the lower guide plate 104 is opaque, and the above effects can still be achieved, and are also within the scope of the present invention.
參照第二B圖，其為本發明之另一實施例之探針卡組裝結構100A之示意圖。探針卡組裝結構100A與第二A圖所示之探針卡組裝結構100具有類似的結構，兩者同樣由透明上導板102、下導板104、以及探針106所組成，這些結構組成已經於前文詳述，於此不再贅述。探針卡組裝結構100A與第二A圖所示之探針卡組裝結構100之間的差異在於，探針卡組裝結構100A在透明上導板102上設置有一貫通透明上導板102的維修孔114，用以進行探針的調整、更換、以及移除，其中，維修孔114設置於透明上導板102上未設置有第一貫孔1021的區域。當作業者透過透明上導板102或下導板104以肉眼觀察到探針卡組裝結構100內部的異常情況(例如斷針、探針歪斜、探針相接觸等等)，而需要進行異常處理(例如探針調整、斷針取 出、以及探針更換等等)時，作業者可以使用工具(例如鑷子、吸頭等等)或是不使用工具而進行上述異常處理。雖然，在第二B圖所示之實施例中，透明上導板102僅設置一維修孔114，但並不以此為限，而是可以依照需求增加維修孔的數量(例如2個、3個、或更多)。另外，雖然在第二B圖所示之實施例中，維修孔114是設置於透明上導板102上，但是並不以此為限，在本發明其他實施例中，也可以改將維修孔設置於下導板上。 Referring to FIG. 2B, it is a schematic diagram of a probe card assembly structure 100A according to another embodiment of the present invention. The probe card assembly structure 100A has a similar structure to the probe card assembly structure 100 shown in FIG. 2A, and the two are also composed of a transparent upper guide plate 102, a lower guide plate 104, and a probe 106. It has been described in detail above and will not be described here. The difference between the probe card assembly structure 100A and the probe card assembly structure 100 shown in FIG. 2A is that the probe card assembly structure 100A is provided with a maintenance hole penetrating the transparent upper guide plate 102 on the transparent upper guide plate 102. 114, for adjusting, replacing, and removing the probe, wherein the maintenance hole 114 is disposed on a region of the transparent upper guide plate 102 where the first through hole 1021 is not disposed. When an operator visually observes an abnormal condition inside the probe card assembly structure 100 through the transparent upper guide 102 or the lower guide 104 (for example, a broken needle, a probe skew, a probe contact, etc.), an abnormal treatment is required. (eg probe adjustment, broken needle The operator can use the tool (such as tweezers, tips, etc.) or the tool to perform the above exception processing without the use of tools. In the embodiment shown in FIG. 2B, the transparent upper guide plate 102 is only provided with a service hole 114, but it is not limited thereto, and the number of maintenance holes can be increased according to requirements (for example, 2, 3) , or more). In addition, although in the embodiment shown in FIG. 2B, the service hole 114 is disposed on the transparent upper guide plate 102, it is not limited thereto. In other embodiments of the present invention, the maintenance hole may also be modified. Set on the lower guide.
再者，本發明更提供一種探針卡組裝方法，可以組裝出第二A圖與第二B圖所示的探針卡組裝結構。第三A圖至第三C圖為本發明之一實施例之探針卡組裝方法之流程圖。首先，參照第三A圖，先提供一透明上導板102與一下導板104，再進行一導板組裝步驟，以兩隔板108做為透明上導板102與下導板104之間的分隔與支撐，而將透明上導板102平行設置於下導板104上方，即透明上導板102與下導板104是彼此平行且彼此分隔的，以組成一可以固定探針的探針固定機構200。透明上導板102為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，使得作業者可以以肉眼透過透明上導板102而看到探針固定機構200內部，並且透明上導板102上具有數個第一貫孔1021，第一貫孔1021係以雷射貫穿透明上導板102 而形成的喇叭狀貫孔。在本實施例中，下導板104為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，其上具有數個第二貫孔1041，其同樣是以雷射貫穿下導板104而形成的喇叭狀貫孔，但是不以此為限。在本發明其他實施例中，下導板也可以是以耐磨、高硬度、且低熱膨脹係數的不透明材料所組成的平板，其上也具有數個第二貫孔，但是以機械方式鑽出的貫孔。每一第二貫孔1041皆對應一個第一貫孔1021，而供同一探針穿設。另外，在探針固定機構200中，透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041是呈現一錯位排列，即每一第一貫孔1021與其所對應的第二貫孔1041並不以垂直排列成一直線的方式排列。 Furthermore, the present invention further provides a probe card assembly method, which can assemble the probe card assembly structure shown in FIG. 2A and FIG. 3A to 3C are flowcharts showing a method of assembling a probe card according to an embodiment of the present invention. First, referring to FIG. 3A, a transparent upper guide plate 102 and a lower guide plate 104 are first provided, and then a guide plate assembly step is performed, with the two partition plates 108 as the transparent upper guide plate 102 and the lower guide plate 104. Separating and supporting, the transparent upper guiding plate 102 is disposed in parallel above the lower guiding plate 104, that is, the transparent upper guiding plate 102 and the lower guiding plate 104 are parallel to each other and separated from each other to form a probe fixing for fixing the probe. Agency 200. The transparent upper guide plate 102 is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, so that the operator can see the inside of the probe fixing mechanism 200 through the transparent upper guide plate 102 with the naked eye, and The transparent upper guide plate 102 has a plurality of first through holes 1021, and the first through holes 1021 are lasered through the transparent upper guide plate 102. The flared through hole is formed. In this embodiment, the lower guide plate 104 is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, and has a plurality of second through holes 1041 thereon, which are also penetrated by lasers. The flared through hole formed by the lower guide 104 is not limited thereto. In other embodiments of the present invention, the lower guide plate may also be a flat plate composed of an opaque material having high wear resistance, high hardness, and low thermal expansion coefficient, and also has a plurality of second through holes thereon, but is mechanically drilled. Through hole. Each of the second through holes 1041 corresponds to one first through hole 1021, and is provided for the same probe. In addition, in the probe fixing mechanism 200, the first through hole 1021 on the transparent upper guide plate 102 and the second through hole 1041 on the lower guide plate 104 are arranged in a misalignment arrangement, that is, each first through hole 1021 and the same The corresponding second through holes 1041 are not arranged in a vertical alignment.
接著，參照第三B圖，提供數根探針106，探針106為一彎曲型探針(例如cobra探針等等)，接著，先將每一探針106經由一第一貫孔1021穿過透明上導板102，而進入探針固定機構200中，並透過透明上導板102以目視方式觀察與確認該探針106所欲穿過的第二貫孔1041，即檢視與確認每一第一貫孔1021所對應的第二貫孔1041的位置，而再將探針106透過對應的第二貫孔1041，而穿入下導板104，進而將這些探針106依照所需的排列固定於透明上導板102與該下導板104之間。由 於透明上導板102與下導板104皆為透明的，所以在進行上述植針步驟時，可以清楚地看到探針固定機構200內部狀況，並且確認欲穿刺的第一貫孔1021與第二貫孔1041，所以有助於植針的進行。此時每一探針106的兩端分別穿出透明上導板102與下導板104之外，即每一探針106的一端(即針頭部分)穿過下導板104而暴露於下導板104外，每一探針106的另一端(即非為針頭的一端)穿過透明上導板102而暴露於透明上導板102外。 Next, referring to the third B diagram, a plurality of probes 106 are provided, the probes 106 are a curved probe (such as a cobra probe, etc.), and then each probe 106 is first worn through a first through hole 1021. Passing through the transparent upper guide plate 102, entering the probe fixing mechanism 200, and visually observing and confirming the second through hole 1041 through which the probe 106 is to pass through the transparent upper guide plate 102, that is, inspecting and confirming each The position of the second through hole 1041 corresponding to the first hole 1021 is passed through the corresponding second through hole 1041, and penetrates into the lower guide 104, thereby arranging the probes 106 according to the desired arrangement. It is fixed between the transparent upper guide plate 102 and the lower guide plate 104. by The transparent upper guide plate 102 and the lower guide plate 104 are both transparent. Therefore, when performing the above-mentioned needle implantation step, the internal condition of the probe fixing mechanism 200 can be clearly seen, and the first through hole 1021 and the first hole to be punctured are confirmed. Two through holes 1041, so it helps the needle to proceed. At this time, both ends of each probe 106 are respectively passed out of the transparent upper guide plate 102 and the lower guide plate 104, that is, one end of each probe 106 (ie, the needle portion) passes through the lower guide plate 104 and is exposed to the lower guide. Outside the plate 104, the other end of each probe 106 (i.e., the end that is not the needle) is exposed through the transparent upper guide 102 to the outside of the transparent upper guide 102.
然後，參照第三C圖，將一基板110固定於透明上導板102上，使基板110與探針106穿出透明上導板102的部分接觸而電性連接。接著，將一電路板112固定於基板110上，而將基板110固定於電路板112與透明上導板102之間，使電路板112上的電路(圖中未示)與基板110上的錫球接觸而電性連接，而組裝成一探針卡組裝結構100。基板110與電路板112可以藉由銲錫而固定於透明上導板102上，也可以螺絲鎖固於透明上導板102上，或採取其他方式固定於透明上導板102上。 Then, referring to the third C diagram, a substrate 110 is fixed on the transparent upper guide plate 102, and the substrate 110 is electrically connected to the portion of the probe 106 that passes through the transparent upper guide plate 102. Next, a circuit board 112 is fixed on the substrate 110, and the substrate 110 is fixed between the circuit board 112 and the transparent upper conductive board 102, so that the circuit on the circuit board 112 (not shown) and the tin on the substrate 110 The balls are electrically connected to each other and assembled into a probe card assembly structure 100. The substrate 110 and the circuit board 112 may be fixed to the transparent upper guide plate 102 by soldering, or may be screwed to the transparent upper guide plate 102, or may be fixed to the transparent upper guide plate 102 by other means.
在本發明之探針卡組裝方法中，由於透明上導板102與下導板104皆是透明的，或是僅有透明上導板102為透明的，所以既使透明上導板102上的第一貫孔1021與下導板104上的 第二貫孔1041是錯位排列的，作業者可以單獨透過透明上導板102，或透過透明上導板102與下導板104兩者，而直接以目視觀察到探針固定機構200的情況，找到每一第一貫孔1021所對應的第二貫孔1041，而有助於將每一探針106穿過第一貫孔1021與其所對應的第二貫孔1041。因此，在進行植針與探針卡組裝時，作業者可以輕易地將探針106穿入透明上導板102與下導板104中，而不需要中介軟片層，所以可以減少植針與組裝探針組裝結構的困難度與風險，並省下中介軟片層所需的成本，從而增加針與組裝探針組裝結構的成功，從而降低測成本與增加測試效率。 In the probe card assembly method of the present invention, since the transparent upper guide plate 102 and the lower guide plate 104 are both transparent, or only the transparent upper guide plate 102 is transparent, even on the transparent upper guide plate 102 The first constant hole 1021 and the lower guide plate 104 The second through holes 1041 are arranged in a misaligned manner, and the operator can directly observe the probe fixing mechanism 200 directly through the transparent upper guide plate 102 or through both the transparent upper guide plate 102 and the lower guide plate 104. The second through hole 1041 corresponding to each of the first through holes 1021 is found to facilitate passing each of the probes 106 through the first through hole 1021 and the corresponding second through hole 1041. Therefore, when implanting the needle and the probe card, the operator can easily insert the probe 106 into the transparent upper guide 102 and the lower guide 104 without the need for an intermediate layer, so that the needle can be reduced and assembled. The difficulty and risk of the probe assembly structure, and the cost of the intermediate film layer is saved, thereby increasing the success of the needle and assembly probe assembly structure, thereby reducing the measurement cost and increasing the test efficiency.
雖然，第三A圖至第三C圖所示之探針卡組裝方法是用於採用彎曲型探針(例如cobra探針等等)的探針卡組裝結構，但是本發明之探針組裝方法也可以適用於採用直線型探針與彈簧探針(例如pogo探針)的探針卡組裝結構。第四A圖至第四D圖為本發明之另一實施例之採用直線型探針或彈簧探針的探針卡組裝方法之流程圖。首先，參照第四A圖，先提供一透明上導板102與一下導板104，並以兩隔板108、透明上導板102、以及下導板104組裝成一可以固定探針的探針固定機構200，此一步驟與前述第三A圖所示之步驟大致相同，所以於此不再贅 述。照第四A圖所示之步驟與前述第三A圖所示之步驟的不同之處在於，透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041是以上下垂直成一直線的方式排列於探針固定機構200中，而非錯位排列。另外，由於本實施例所採用的直線型探針或彈簧探針，所以透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041可以如同第四A圖所示採取直線型的貫孔設計，但並不以此為限，而是在本發明其他實施例中，也可仍舊採取喇叭狀的貫孔設計。接著，參照第四B圖，提供數根探針106A，探針106A為一直線型探針與彈簧探針(例如pogo探針)，接著，將每一探針106A穿過透明上導板102上的一第一貫孔1021以及與其所對應的下導板104的第二貫孔1041，此一步驟與前述第三B圖所示之步驟大致相同，所以於此不再贅述。在第四B圖所示之步驟中，由於透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041是以上下垂直成一直線的方式排列，使得作業者只要將探針106A垂直向下穿過第一貫孔1021，並繼續垂直向下移動即可以穿過對應的第二貫孔1041，且由於透明上導板102與下導板104皆為透明的，所以在進行上述植針步驟時，可以清楚地看到探針固定機構200內部狀況，並且確認欲穿刺的第一貫孔1021與第二貫孔 1041，而有助於植針的進行。因此，相較於前述第三B圖所示之步驟，第四B圖所示之步驟(植針步驟)對於作業者來說更為簡單。 Although the probe card assembly method shown in FIGS. 3A to 3C is a probe card assembly structure using a curved probe (for example, a cobra probe or the like), the probe assembly method of the present invention It can also be applied to a probe card assembly structure using a linear probe and a spring probe (for example, a pogo probe). 4A to 4D are flowcharts showing a method of assembling a probe card using a linear probe or a spring probe according to another embodiment of the present invention. First, referring to FIG. 4A, a transparent upper guiding plate 102 and a lower guiding plate 104 are first provided, and two spacers 108, a transparent upper guiding plate 102, and a lower guiding plate 104 are assembled to fix a probe for fixing the probe. The mechanism 200, this step is substantially the same as the step shown in the third A picture above, so this is no longer the case. Said. The step shown in FIG. 4A is different from the step shown in FIG. 3A in that the first through hole 1021 on the transparent upper guide plate 102 and the second through hole 1041 on the lower guide plate 104 are The above vertical alignment is arranged in a straight line in the probe fixing mechanism 200 instead of being misaligned. In addition, due to the linear probe or the spring probe used in the embodiment, the first through hole 1021 on the transparent upper guide plate 102 and the second through hole 1041 on the lower guide plate 104 can be as shown in FIG. It is shown that the through-hole design of the straight type is adopted, but it is not limited thereto, but in other embodiments of the present invention, the through-hole design of the trumpet shape may still be adopted. Next, referring to FIG. 4B, a plurality of probes 106A are provided. The probes 106A are linear probes and spring probes (for example, pogo probes). Then, each probe 106A is passed through the transparent upper guide plate 102. The first through hole 1021 and the second through hole 1041 of the lower guide 104 corresponding thereto are substantially the same as the steps shown in the third B, and therefore will not be described again. In the step shown in FIG. 4B, since the first through hole 1021 on the transparent upper guide plate 102 and the second through hole 1041 on the lower guide plate 104 are vertically aligned in a straight line, the operator only needs to Passing the probe 106A vertically downward through the first through hole 1021 and continuing to move vertically downwards can pass through the corresponding second through hole 1041, and since both the transparent upper guide plate 102 and the lower guide plate 104 are transparent, Therefore, when performing the above-mentioned needle implantation step, the internal condition of the probe fixing mechanism 200 can be clearly seen, and the first through hole 1021 and the second through hole to be punctured are confirmed. 1041, and help the needle to proceed. Therefore, the step (the needle step) shown in the fourth B diagram is simpler for the operator than the step shown in the aforementioned third panel B.
然後，參照第四C圖，當所使用的探針為非彈簧探針的直線型探針，將透明上導板102橫向移動一段距離，而使得透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041由原先的上下垂直排列成一直線變為錯位排列，而迫使已經固定於探針固定機構200的直線型探針106A都朝同一方向彎曲。藉此，避免在使用探針卡組裝結構進行測試時，探針卡組裝結構內的探針因受壓朝向不同的方向彎曲所導致探針相接觸而短路的現象產生。雖然在本實施例是藉由橫向移動透明上導板102而使透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041轉變為錯位排列，但是並不以此為限。在本發明其他實施例中，也可以藉由橫向移動透明下導板，或是同時橫向移動橫向移動透明上導板與下導板，而使透明上導板102上的第一貫孔1021與下導板104上的第二貫孔1041轉變為錯位排列。接者，參照第四D圖，將一基板110固定於透明上導板102上，使基板110與探針106A穿出透明上導板102的部分接觸而電性連接。接著，將一電路板112固定於基板110上， 而將基板110固定於電路板112與透明上導板102之間，使電路板112上的電路(圖中未示)與基板110上的錫球接觸而電性連接，而組裝成一探針卡組裝結構100B。基板110與電路板112可以藉由銲錫而固定於透明上導板102上，也可以螺絲鎖固於透明上導板102上，或採取其他方式固定於透明上導板102上。然而，當所採用的直線型探針為彈簧探針時，在完成第四B圖所示之結構而將探針106A植入探針固定機構200中後，則直接進行第四D圖所示之步驟，而不需要進行第四C圖所示之錯位步驟。 Then, referring to the fourth C diagram, when the probe used is a linear probe which is not a spring probe, the transparent upper guide plate 102 is laterally moved by a distance, so that the first through hole 1021 on the transparent upper guide plate 102 is made. The second through holes 1041 on the lower guide plate 104 are arranged in a straight line from the original vertical line to be misaligned, and the linear probes 106A that have been fixed to the probe fixing mechanism 200 are forced to bend in the same direction. Thereby, it is avoided that when the probe card assembly structure is used for testing, the probes in the probe card assembly structure are short-circuited due to the contact of the probes due to the bending of the probes in different directions. Although the first through hole 1021 on the transparent upper guide plate 102 and the second through hole 1041 on the lower guide plate 104 are converted into a misaligned arrangement by laterally moving the transparent upper guide plate 102, the present invention does not This is limited. In other embodiments of the present invention, the first through hole 1021 on the transparent upper guide plate 102 may also be moved by laterally moving the transparent lower guide plate or laterally moving the transparent upper guide plate and the lower guide plate laterally. The second through holes 1041 on the lower guide 104 are converted into a misaligned arrangement. Referring to FIG. 4D, a substrate 110 is fixed on the transparent upper guide plate 102, and the substrate 110 is electrically connected to a portion of the probe 106A that passes through the transparent upper guide plate 102. Next, a circuit board 112 is fixed on the substrate 110. The substrate 110 is fixed between the circuit board 112 and the transparent upper conductive plate 102, and the circuit (not shown) on the circuit board 112 is electrically connected to the solder ball on the substrate 110 to be assembled into a probe card. The structure 100B is assembled. The substrate 110 and the circuit board 112 may be fixed to the transparent upper guide plate 102 by soldering, or may be screwed to the transparent upper guide plate 102, or may be fixed to the transparent upper guide plate 102 by other means. However, when the linear probe used is a spring probe, after the probe 106A is implanted into the probe fixing mechanism 200 after completing the structure shown in FIG. 4B, the fourth D diagram is directly performed. The steps are not required to perform the dislocation step shown in the fourth C diagram.
另外，本發明更提供一種將斷針由探針卡組裝結構取出的方法。第五A圖至第五E圖為本發明之多個實施例之將斷針由探針卡組裝結構取出的方法之流程圖。首先，參照第五A圖，提供一由一透明上導板102、一下導板104、以及複數根探針106所組成的探針卡組裝結構(或探針固定機構)100C。透明上導板102為一由一耐磨、高硬度、且低熱膨脹係數的透明材料所組成的平板，且其上具有數個第一貫孔1021，第一貫孔1021係以雷射貫穿透明上導板102而形成的喇叭狀貫孔，並且在透明上導板102上設置有一貫穿透明上導板102的維修孔114。在本實施例中，下導板104為一由一耐磨、高硬度、且低熱膨脹 係數的透明材料所組成的平板，其上具有數個第二貫孔1041，其同樣是以雷射貫穿下導板104而形成的喇叭狀貫孔，但是不以此為限。在本發明其他實施例中，下導板也可以是以耐磨、高硬度、且低熱膨脹係數的不透明材料所組成的平板，其上也具有數個第二貫孔，但是以機械方式鑽出的貫孔。每一第二貫孔1041皆對應一個第一貫孔1021，而供同一探針穿設。第五A圖所示之探針卡組裝結構100C與第二B圖所示之探針卡組裝結構100A大致相同，並已經於前文詳述其組成與特徵，所以於此不再贅述。 In addition, the present invention further provides a method of removing a broken needle from a probe card assembly structure. 5A through 5E are flow diagrams of a method of removing a broken needle from a probe card assembly structure in accordance with various embodiments of the present invention. First, referring to FIG. 5A, a probe card assembly structure (or probe fixing mechanism) 100C composed of a transparent upper guide 102, a lower guide 104, and a plurality of probes 106 is provided. The transparent upper guiding plate 102 is a flat plate composed of a transparent material with high wear resistance, high hardness and low thermal expansion coefficient, and has a plurality of first through holes 1021 thereon, and the first through holes 1021 are transparent through the laser. A flared through hole is formed in the upper guide plate 102, and a maintenance hole 114 penetrating the transparent upper guide plate 102 is disposed on the transparent upper guide plate 102. In this embodiment, the lower guide plate 104 is made of a wear-resistant, high-hardness, and low thermal expansion. A plate composed of a transparent material having a plurality of second through holes 1041 is also formed as a flared through hole formed by a laser penetrating through the lower guide plate 104, but is not limited thereto. In other embodiments of the present invention, the lower guide plate may also be a flat plate composed of an opaque material having high wear resistance, high hardness, and low thermal expansion coefficient, and also has a plurality of second through holes thereon, but is mechanically drilled. Through hole. Each of the second through holes 1041 corresponds to one first through hole 1021, and is provided for the same probe. The probe card assembly structure 100C shown in FIG. 5A is substantially the same as the probe card assembly structure 100A shown in FIG. 2B, and its composition and features have been described in detail above, and thus will not be described herein.
接著，參照第五B圖，將一工具116(例如鑷子、吸頭、或其他拾取工具)經由維修孔114伸入探針卡組裝結構(或探針固定機構)100C中，而直接將斷針106’由維修孔114取出。由於透明上導板102與下導板104皆是透明的(或僅透明上導板102為透明的)，所以作業者不但可以透過透明上導板102與下導板104(或僅透過透明上導板102)，而直接觀察到斷針106’所在的位置與周邊狀況，以及探針卡組裝結構(或探針固定機構)100C的內部情形，更可以觀察工具116在探針卡組裝結構(或探針固定機構)100C內的移動狀況，從而避免工具116在移動時接觸、碰撞、甚至破壞探針卡組裝結構(或探針固定機構)100C內其他探針 106，將斷針106’由維修孔114取出。因此，不需要打開透明上導板102即可以將斷針取出，而避免了因打開透明上導板102造成的探針卡組裝結構(或探針固定機構)100C內其他探針106位移的風險，從而降低斷針取出的困難度與風險，並降低測成本與增加測試效率。 Next, referring to FIG. 5B, a tool 116 (for example, a tweezers, a tip, or other picking tool) is inserted into the probe card assembly structure (or probe fixing mechanism) 100C via the maintenance hole 114, and the needle is directly broken. 106' is taken out of the service hole 114. Since both the transparent upper guide plate 102 and the lower guide plate 104 are transparent (or only the transparent upper guide plate 102 is transparent), the operator can pass through the transparent upper guide plate 102 and the lower guide plate 104 (or only through the transparent plate). The guide plate 102) directly observes the position and surrounding condition of the broken needle 106', and the internal condition of the probe card assembly structure (or the probe fixing mechanism) 100C, and can further observe the probe 116 in the probe card assembly structure ( Or the movement of the probe fixing mechanism 100C, thereby preventing the tool 116 from contacting, colliding, or even destroying other probes in the probe card assembly structure (or probe fixing mechanism) 100C while moving. 106, the broken needle 106' is taken out of the service hole 114. Therefore, the broken needle can be taken out without opening the transparent upper guide plate 102, and the risk of displacement of the other probes 106 in the probe card assembly structure (or the probe fixing mechanism) 100C caused by opening the transparent upper guide plate 102 is avoided. , thereby reducing the difficulty and risk of needle removal, and reducing the cost of testing and increasing the efficiency of testing.
然而，在第五A圖所示之步驟後，本發明之將斷針由探針卡組裝結構取出的方法也可以採取其他方式將斷針106’由探針卡組裝結構(或探針固定機構)100C中取出。參照第五C圖，在提供探針卡組裝結構(或探針固定機構)100C(第五A圖所示步驟)之後，接著，擠壓斷針106’使其通過第一貫孔1021與第二貫孔1041而落入探針卡組裝結構(或探針固定機構)100C內部，而解除斷針106’的固定，使斷針106’不再受到透明上導板102與下導板104所固定。然後，可以一工具116(例如鑷子、吸頭、或其他拾取工具)經由維修孔114伸入探針卡組裝結構(或探針固定機構)100C中，而將已經解除固定而落入探針卡組裝結構(或探針固定機構)100C內部的斷針106’由維修孔114取出(如第五D圖所示)。或者，翻轉探針卡組裝結構(或探針固定機構)100C，使得透明上導板102與其上維修孔114朝下，並晃動探針卡組裝結構(或探針固定機構)100C使已經解除固定的斷針106’移動 至維修孔114，而讓斷針106’而維修孔114掉出(如第五E圖所示)。 However, after the step shown in FIG. A, the method of removing the broken needle from the probe card assembly structure of the present invention may also adopt other methods to assemble the broken needle 106' from the probe card assembly structure (or the probe fixing mechanism). ) Take out in 100C. Referring to FIG. 5C, after providing the probe card assembly structure (or probe fixing mechanism) 100C (step shown in FIG. A), next, the broken needle 106' is pressed through the first through hole 1021 and the first The two through holes 1041 fall into the inside of the probe card assembly structure (or the probe fixing mechanism) 100C, and the fixing of the broken needles 106' is released, so that the broken needles 106' are no longer received by the transparent upper guide plate 102 and the lower guide plate 104. fixed. Then, a tool 116 (such as a tweezers, a tip, or other pick-up tool) can be inserted into the probe card assembly structure (or probe fixing mechanism) 100C via the maintenance hole 114, and will have been unfixed and dropped into the probe card. The broken needle 106' inside the assembled structure (or probe fixing mechanism) 100C is taken out by the service hole 114 (as shown in FIG. 5D). Alternatively, flip the probe card assembly structure (or probe fixing mechanism) 100C such that the transparent upper guide plate 102 and the upper service hole 114 face downward, and shake the probe card assembly structure (or probe fixing mechanism) 100C so that the fixing has been released. Broken needle 106' moving To the service hole 114, the break pin 106' is caused and the service hole 114 is dropped (as shown in Fig. 5E).
另外，在藉由上述任一方法將斷針取出之後，由於透明上導板102與下導板104皆是透明的(或僅透明上導板102為透明的)，所以作業者可以肉眼透過透明上導板102與下導板104(或僅透過透明上導板102)觀察探針卡組裝結構(或探針固定機構)100C的內部情形，而將一新探針植入探針卡組裝結構(或探針固定機構)100C，即將一新探針經由透明上導板102的第一貫孔1021穿入探針卡組裝結構(或探針固定機構)100C的內部，並穿入下導板14的第二貫孔1041，以取代被取出的斷針106’，而不需要打開或移動透明上導板102。藉由上述方法，可以不需要打開或移動透明上導板102，即可以由探針卡組裝結構(或探針固定機構)中取出斷針與更換探針，而避免了因打開透明上導板造成的探針卡組裝結構(或探針固定機構)內其他探針位移與錯亂的風險，從而降低取出斷針與更換探針的困難度與風險，提高取出斷針與更換探針的成功率，進而降低測成本與增加測試效率。 In addition, after the broken needle is taken out by any of the above methods, since the transparent upper guide plate 102 and the lower guide plate 104 are both transparent (or only the transparent upper guide plate 102 is transparent), the operator can transparently pass through the naked eye. The upper guide plate 102 and the lower guide plate 104 (or only through the transparent upper guide plate 102) observe the internal condition of the probe card assembly structure (or the probe fixing mechanism) 100C, and a new probe is implanted into the probe card assembly structure. (or probe fixing mechanism) 100C, that is, a new probe is inserted into the inside of the probe card assembly structure (or probe fixing mechanism) 100C through the first through hole 1021 of the transparent upper guide plate 102, and penetrates into the lower guide plate. The second through hole 1041 of the 14 is substituted for the broken needle 106' that is taken out without opening or moving the transparent upper guide 102. By the above method, it is not necessary to open or move the transparent upper guide plate 102, that is, the needle breakage and the replacement probe can be taken out from the probe card assembly structure (or the probe fixing mechanism), and the transparent upper guide plate is avoided. The risk of displacement and disorder of other probes in the probe card assembly structure (or probe fixing mechanism), thereby reducing the difficulty and risk of taking out the broken needle and replacing the probe, and improving the success rate of taking out the broken needle and replacing the probe. , thereby reducing the cost of testing and increasing test efficiency.
有鑑於上述實施例，探針卡組裝結構、探針卡組裝方法、以及將斷針由探針卡組裝結構取出的方法，不但可以不需 要任何中介軟片層，且透過透明上導板直接目視觀察與檢視探針卡組裝結構內部的探針狀況與排列分佈，而有助於可以降低植針與組裝探針卡的困難度，更可以避免在進行斷針取出、探針調整或更換時造成探針位置變動與錯亂，進而降低測成本與增加測試效率。 In view of the above embodiments, the probe card assembly structure, the probe card assembly method, and the method for removing the broken needle from the probe card assembly structure may not only be unnecessary It is necessary to directly view and analyze the condition and arrangement of the probe inside the probe card assembly structure through the transparent upper guide plate, which helps to reduce the difficulty of implanting the needle and assembling the probe card, and Avoid probe position changes and confusion during needle removal, probe adjustment or replacement, thereby reducing measurement costs and increasing test efficiency.
100‧‧‧探針卡組裝結構 100‧‧‧Probe card assembly structure
102‧‧‧透明上導板 102‧‧‧Transparent upper guide
104‧‧‧下導板 104‧‧‧ lower guide
106‧‧‧探針 106‧‧‧Probe
108‧‧‧隔板 108‧‧‧Baffle
110‧‧‧基板 110‧‧‧Substrate
112‧‧‧電路板 112‧‧‧Circuit board
116‧‧‧工具 116‧‧‧ Tools
1021‧‧‧第一貫孔 1021‧‧‧ first through hole
1041‧‧‧第二貫孔 1041‧‧‧second through hole
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| TW105103573A TWI576591B (en) | 2016-02-03 | 2016-02-03 | Probe card assembling structure, assembling method thereof, and method of taking broken probe out therefrom |
| CN201610082036.8A CN107037243A (en) | 2016-02-03 | 2016-02-05 | Probe card assembling structure, assembling method thereof and method for taking out broken pins |
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| TW105103573A TWI576591B (en) | 2016-02-03 | 2016-02-03 | Probe card assembling structure, assembling method thereof, and method of taking broken probe out therefrom |
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| CN112305394B (en) * | 2020-11-06 | 2021-04-27 | 法特迪精密科技（苏州）有限公司 | Probe socket piece and probe assembly |
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| TW201728907A (en) | 2017-08-16 |
| CN107037243A (en) | 2017-08-11 |
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