TWI575426B - Touch panels - Google Patents
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- TWI575426B TWI575426B TW105115129A TW105115129A TWI575426B TW I575426 B TWI575426 B TW I575426B TW 105115129 A TW105115129 A TW 105115129A TW 105115129 A TW105115129 A TW 105115129A TW I575426 B TWI575426 B TW I575426B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Description
本發明係有關於觸控面板技術，特別有關於觸控面板的架橋結構材料。 The invention relates to a touch panel technology, in particular to a bridging structure material of a touch panel.
近年來，觸控面板已經廣泛地應用在各種電子產品中，例如手機、可攜式電腦以及掌上型電腦等，觸控面板通常與顯示面板結合成為電子產品的輸入/輸出介面。 In recent years, touch panels have been widely used in various electronic products, such as mobile phones, portable computers, and palm-sized computers. Touch panels are often combined with display panels to become input/output interfaces for electronic products.
在習知技術中，觸控面板通常包含多個互相連接的導電單元與多個互相分開的導電單元排列成觸控陣列，還包含架橋線將這些互相分開的導電單元電性連接在一起，以提供觸控感測功能。 In the prior art, the touch panel generally includes a plurality of interconnected conductive units and a plurality of mutually separated conductive units arranged in a touch array, and a bridge line electrically connects the mutually separated conductive units to each other. Provides touch sensing.
傳統的架橋線通常由鉬/鋁/鉬組成，為了保證架橋線的電性連接功能，其厚度需達到至少4200Å或更厚，當架橋線的厚度較厚時，在觸控面板的製程中將會產生對架橋線蝕刻不完全的現象，並且使觸控面板存在整體厚度增加、表面平整度降低等問題，進而影響觸控面板的良率。此外，鉬/鋁/鉬製成的架橋線亮度較高，導致觸控面板的架橋線容易被用戶看到，即有可視性的問題，進而影響觸控面板的外觀。 The traditional bridging line is usually composed of molybdenum/aluminum/molybdenum. In order to ensure the electrical connection function of the bridging line, the thickness needs to be at least 4200 Å or more. When the thickness of the bridging line is thick, it will be in the process of the touch panel. The phenomenon that the bridge line is incompletely etched is generated, and the touch panel has problems such as an increase in overall thickness and a decrease in surface flatness, thereby affecting the yield of the touch panel. In addition, the bridging line made of molybdenum/aluminum/molybdenum has a high brightness, which causes the bridging line of the touch panel to be easily seen by the user, that is, there is a problem of visibility, which in turn affects the appearance of the touch panel.
另一種傳統的架橋結構的材料(例如：銦錫氧化物) 電阻率較大，且架橋結構的寬度通常不大，因此需要厚度較大的架橋結構以保證觸控電極的靈敏度，然而，當架橋結構厚度增加時，會存在蝕刻不完全、觸控面板整體厚度增加、觸控面板平整度低等問題，進而降低觸控面板的製造良率，且當架橋結構的厚度增加後，還會產生觸控面板的可視問題。 Another traditional bridging material (eg indium tin oxide) The resistivity is large, and the width of the bridging structure is usually not large. Therefore, a bridging structure with a large thickness is required to ensure the sensitivity of the touch electrode. However, when the thickness of the bridging structure is increased, the etching may be incomplete and the overall thickness of the touch panel may be present. Increased, low flatness of the touch panel, etc., thereby reducing the manufacturing yield of the touch panel, and when the thickness of the bridging structure is increased, the visual problem of the touch panel is also generated.
本揭示提供觸控面板的架橋結構之材料選擇，利用本揭示之架橋結構的材料，可使得觸控面板的架橋結構在達到低阻抗的同時具有較薄的厚度，而在觸控面板的製程中，對較薄的架橋結構較不易產生蝕刻不完全的問題，並且可以讓架橋結構的亮度降低，避免架橋結構可視性的問題，達到良率高及外觀佳的觸控面板。 The disclosure provides material selection of the bridging structure of the touch panel, and the bridging structure of the touch panel can make the bridging structure of the touch panel have a thin thickness while achieving low impedance, and in the process of the touch panel. For the thinner bridging structure, the problem of incomplete etching is less likely to occur, and the brightness of the bridging structure can be reduced, the visibility of the bridging structure can be avoided, and the touch panel with high yield and good appearance can be achieved.
本揭示的一些實施例提供觸控面板，具有觸控面，包括：第一軸向觸控電極與第二軸向觸控電極絕緣地交錯設置於基板上，其中第一軸向觸控電極包含複數個第一導電單元經由連接部互相連接，第二軸向觸控電極包含複數個互相分開的第二導電單元，及架橋結構電性連接這些第二導電單元，其中架橋結構包括：金屬層及第一透明導電層，且第一透明導電層相較於金屬層更靠近觸控面。 Some embodiments of the present disclosure provide a touch panel having a touch surface, including: the first axial touch electrode and the second axial touch electrode are alternately disposed on the substrate, wherein the first axial touch electrode includes The plurality of first conductive units are connected to each other via a connecting portion, the second axial touch electrode includes a plurality of second conductive units that are separated from each other, and the bridging structure electrically connects the second conductive units, wherein the bridging structure comprises: a metal layer and The first transparent conductive layer, and the first transparent conductive layer is closer to the touch surface than the metal layer.
100、200‧‧‧觸控面板 100,200‧‧‧ touch panel
101‧‧‧基板 101‧‧‧Substrate
101a、120a‧‧‧觸控面 101a, 120a‧‧‧ touch surface
101b‧‧‧內側面 101b‧‧‧ inside
102b‧‧‧連接部 102b‧‧‧Connecting Department
103a‧‧‧第二導電單元 103a‧‧‧Second conductive unit
104‧‧‧架橋結構 104‧‧‧Bridge structure
104a‧‧‧金屬層 104a‧‧‧metal layer
104b‧‧‧第一透明導電層 104b‧‧‧First transparent conductive layer
104c‧‧‧第二透明導電層 104c‧‧‧Second transparent conductive layer
105‧‧‧絕緣塊 105‧‧‧Insulation block
106‧‧‧保護層 106‧‧‧Protective layer
106a‧‧‧表面 106a‧‧‧Surface
110‧‧‧顯示元件 110‧‧‧Display components
120‧‧‧保護蓋板 120‧‧‧Protection cover
第1A圖顯示依據本揭示的一些實施例的觸控面板的平面示意圖。 FIG. 1A shows a schematic plan view of a touch panel in accordance with some embodiments of the present disclosure.
第1B圖顯示第1A圖之剖面線A-A’的一些實施例的局部 剖面示意圖。 Figure 1B shows a portion of some embodiments of section line A-A' of Figure 1A. Schematic diagram of the section.
第1C圖顯示第1A圖之剖面線A-A’的一些其他實施例的局部剖面示意圖。 Fig. 1C is a partial cross-sectional view showing some other embodiments of the section line A-A' of Fig. 1A.
第1D圖顯示第1A圖之剖面線A-A’的一些其他實施例的局部剖面示意圖。 Fig. 1D is a partial cross-sectional view showing some other embodiments of the section line A-A' of Fig. 1A.
第2A-2C圖顯示本揭示一些其他實施例的觸控面板的局部剖面示意圖。 2A-2C are partial cross-sectional views showing a touch panel of some other embodiments of the present disclosure.
請參照第1A圖，其顯示出依據本揭示的一些實施例的觸控面板100的平面示意圖。觸控面板100包含基板101。在一些實施例中，基板101的材質可包含玻璃、聚對苯二甲酸乙二酯(polyethylene terephthalate，PET)或聚亞醯胺(polyimide，PI)。 Please refer to FIG. 1A , which shows a schematic plan view of a touch panel 100 according to some embodiments of the present disclosure. The touch panel 100 includes a substrate 101. In some embodiments, the material of the substrate 101 may include glass, polyethylene terephthalate (PET) or polyimide (PI).
在一些實施例中，觸控面板100包含複數條第一軸向觸控電極102與複數條第二軸向觸控電極103互相絕緣地交錯設置於基板101上，其中第一軸向觸控電極102包含複數個沿著第一方向(例如：X軸方向)延伸的第一導電單元102a，第一導電單元102a經由第一軸向觸控電極102的連接部102b互相連接，第二軸向觸控電極103包含複數個沿著第二方向(例如：Y軸方向)延伸的第二導電單元103a，第二方向垂直於第一方向，第二導電單元103a互相分開，相鄰的兩個第二導電單元103a分別設置在連接部102b的兩側，並藉由架橋結構104互相連接。 In some embodiments, the touch panel 100 includes a plurality of first axial touch electrodes 102 and a plurality of second axial touch electrodes 103 interposed in a staggered manner on the substrate 101, wherein the first axial touch electrodes The 102 includes a plurality of first conductive units 102a extending along a first direction (eg, an X-axis direction), and the first conductive units 102a are connected to each other via a connecting portion 102b of the first axial touch electrodes 102, and the second axial contact The control electrode 103 includes a plurality of second conductive units 103a extending along a second direction (for example, a Y-axis direction), the second direction is perpendicular to the first direction, the second conductive units 103a are separated from each other, and the adjacent two are second The conductive units 103a are respectively disposed on both sides of the connecting portion 102b, and are connected to each other by the bridge structure 104.
在一些實施例中，第一軸向觸控電極102可為接收 電極，第二軸向觸控電極103則為驅動電極。在另一些實施例中，第一軸向觸控電極102可為驅動電極，第二軸向觸控電極103則為接收電極。第一軸向觸控電極102與第二軸向觸控電極103的材質可包含透明導電材料，例如銦錫氧化物(indium tin oxide,ITO)、銦鋅氧化物(indium zinc oxide,IZO)、摻氟氧化錫(fluorine doped tin oxide,FTO)、摻鋁氧化鋅(aluminum doped zinc oxide,AZO)、摻鎵氧化鋅(gallium doped zinc oxide,GZO)，或者其他透光導電材料，例如金屬網格(metal mesh)、奈米銀線(si1ver nano-wire，SNW)等。 In some embodiments, the first axial touch electrode 102 can be received The electrode, the second axial touch electrode 103 is a drive electrode. In other embodiments, the first axial touch electrode 102 can be a driving electrode, and the second axial touch electrode 103 is a receiving electrode. The material of the first axial touch electrode 102 and the second axial touch electrode 103 may include a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), Fluorine doped tin oxide (FTO), aluminum doped zinc oxide (AZO), gallium doped zinc oxide (GZO), or other light-transmitting conductive materials, such as metal mesh (metal mesh), nano silver wire (si1ver nano-wire, SNW), etc.
架橋結構104設置在互相分開的第二導電單元103a之間，以電性連接第二導電單元103a，並且在第一軸向觸控電極102的連接部102b與架橋結構104之間設置絕緣塊105，使連接部102b與架橋結構104透過絕緣塊105形成電性隔絕，以提供第一軸向觸控電極102與第二軸向觸控電極103之間的電性隔絕。在一些實施例中，絕緣塊105的材質可包含無機材料(例如，氧化矽、氮化矽、氮氧化矽或前述之組合)，有機材料(例如，環氧樹脂、聚醯亞胺樹脂(polyimide)、苯環丁烯(butylcyclobutene，BCB)、聚對二甲苯(parylene)、萘聚合物(polynaphthalenes)、氟碳化物(fluorocarbons)、丙烯酸酯(acrylates))或其他適合的絕緣材料。 The bridging structure 104 is disposed between the second conductive units 103a separated from each other to electrically connect the second conductive unit 103a, and an insulating block 105 is disposed between the connecting portion 102b of the first axial touch electrode 102 and the bridging structure 104. The connecting portion 102b and the bridging structure 104 are electrically isolated from the insulating block 105 to provide electrical isolation between the first axial touch electrode 102 and the second axial touch electrode 103. In some embodiments, the material of the insulating block 105 may include an inorganic material (for example, tantalum oxide, tantalum nitride, niobium oxynitride or a combination thereof), an organic material (for example, an epoxy resin, a polyimide resin (polyimide). ), butylcyclobutene (BCB), parylene, polynaphthalenes, fluorocarbons, acrylates, or other suitable insulating materials.
請參照第1B圖，其顯示沿著第1A圖之剖面線A-A’，觸控面板100的一些實施例的局部剖面示意圖，觸控面板100包含基板101，基板101具有觸控面101a及與觸控面101a相對的另一內側面101b，第一軸向觸控電極102及其連接部 102b與第二導電單元103a形成於基板101的內側面101b上，絕緣塊105形成於連接部102b上並包覆連接部102b，架橋結構104位於絕緣塊105上方，依據本揭示的一些實施例，架橋結構104包含金屬層104a及第一透明導電層104b，其中第一透明導電層104b相較於金屬層104a更靠近觸控面101a，可降低金屬層104a的反射，因此當使用者由觸控面101a觀看觸控面板100時，使架橋結構104的亮度降低，避免架橋結構104可視性的問題。 Referring to FIG. 1B , a partial cross-sectional view of a touch panel 100 includes a substrate 101 having a touch surface 101 a and a cross-sectional view taken along a line A-A′ of FIG. 1A . The other inner side surface 101b opposite to the touch surface 101a, the first axial touch electrode 102 and the connecting portion thereof 102b and the second conductive unit 103a are formed on the inner side surface 101b of the substrate 101. The insulating block 105 is formed on the connecting portion 102b and covers the connecting portion 102b. The bridging structure 104 is located above the insulating block 105. According to some embodiments of the present disclosure, The bridging structure 104 includes a metal layer 104a and a first transparent conductive layer 104b. The first transparent conductive layer 104b is closer to the touch surface 101a than the metal layer 104a, so that the reflection of the metal layer 104a can be reduced. When the surface 101a views the touch panel 100, the brightness of the bridge structure 104 is lowered, and the problem of visibility of the bridge structure 104 is avoided.
請參照表1，其顯示架橋結構104對於不同的光線入射面(即從第一透明導電層104b側入射與從金屬層104a側入射)產生的L亮度空間數據表，當光線從金屬層104a側入射時，架橋結構104的L*值為68.4077，當光線從第一透明導電層104b側入射面時，架橋結構104的L*值為50.0068。由此可見，當光線先進入第一透明導電層104b再通過金屬層104a時，所反射的光線亮度較暗(L*值較小)，因此，當第一透明導電層104b相較於金屬層104a更靠近觸控面101a時，第一透明導電層104b具有降低金屬層104a的反射的功效，證明架橋結構104的亮度可降低，進而避免架橋結構104可視性的問題。 Please refer to Table 1, which shows the L luminance spatial data table generated by the bridging structure 104 for different light incident surfaces (ie, incident from the first transparent conductive layer 104b side and from the metal layer 104a side) when the light is from the metal layer 104a side. When incident, the L* value of the bridging structure 104 is 68.4077, and when the light is incident from the side of the first transparent conductive layer 104b, the L* value of the bridging structure 104 is 50.0068. It can be seen that when the light first enters the first transparent conductive layer 104b and then passes through the metal layer 104a, the reflected light is darker in brightness (L* value is smaller), and therefore, when the first transparent conductive layer 104b is compared with the metal layer When the 104a is closer to the touch surface 101a, the first transparent conductive layer 104b has the effect of reducing the reflection of the metal layer 104a, which proves that the brightness of the bridge structure 104 can be reduced, thereby avoiding the problem of the visibility of the bridge structure 104.
在一些實施例中，金屬層104a由電阻率在20℃時介於1.6×10-7Ω˙m至5.3×10-8Ω˙m之間的材質形成，金屬層104a 的材質可包含銅、銀、金、鋁、鎢及其合金，且金屬層104a的厚度範圍可在約10奈米與約50奈米之間，即可產生低阻抗的架橋結構104。 In some embodiments, the metal layer 104a is formed of a material having a resistivity of between 1.6×10 -7 Ω ̇m and 5.3×10 -8 Ω ̇m at 20 ° C, and the material of the metal layer 104 a may include copper, Silver, gold, aluminum, tungsten, and alloys thereof, and the thickness of the metal layer 104a can range between about 10 nanometers and about 50 nanometers to produce a low impedance bridge structure 104.
相較於傳統的架橋結構的材料(例如：銦錫氧化物或鉬/鋁/鉬)，依據本揭示的實施例，由於形成架橋結構104的金屬層104a的電阻率相較於傳統架橋結構的材料更低，因此在架橋結構104的金屬層104a與傳統架橋結構具有相同的阻抗(例如：約0.3Ω)的情況下，且金屬層104a與傳統架橋結構具有相同的長度時，金屬層104a相較於傳統架橋結構具有更薄的厚度(例如：約100Å-500Å)，使得架橋結構104的整體膜厚降低，因此架橋結構104的蝕刻製程較不易發生蝕刻不完全的問題，進而提升觸控面板100的製造良率。同時，當架橋結構104的膜厚降低後會具有較佳的光線穿透率，藉此可避免架橋結構104的可視性問題，並且當觸控面板100與顯示面板組合時，顯示面板發出的光線穿透架橋結構的穿透率較高，可產生較佳的顯示效果。 Compared to the materials of the conventional bridging structure (for example, indium tin oxide or molybdenum/aluminum/molybdenum), according to the embodiment of the present disclosure, since the resistivity of the metal layer 104a forming the bridging structure 104 is higher than that of the conventional bridging structure The material is lower, so when the metal layer 104a of the bridging structure 104 has the same impedance (for example, about 0.3 Ω) as the conventional bridging structure, and the metal layer 104a has the same length as the conventional bridging structure, the metal layer 104a phase Compared with the traditional bridging structure, the thinner thickness (for example, about 100 Å to 500 Å) reduces the overall film thickness of the bridging structure 104. Therefore, the etching process of the bridging structure 104 is less prone to incomplete etching, thereby improving the touch panel. 100 manufacturing yield. At the same time, when the film thickness of the bridge structure 104 is lowered, the light transmittance is better, thereby avoiding the visibility problem of the bridge structure 104, and when the touch panel 100 is combined with the display panel, the light emitted by the display panel The penetrating bridging structure has a higher penetration rate and can produce a better display effect.
再者，當架橋結構104的金屬層104a在達到更低阻抗約0.15Ω的情況下，相較於架橋結構的阻抗為0.3Ω時，金屬層104a的厚度通常需增加一倍以上，而依據本揭示的一些實施例，在架橋結構具有相同阻抗的情況下，金屬層104a的厚度(例如：約200Å-1000Å)相較於傳統的架橋結構的材料(例如：鉬/鋁/鉬)的厚度(例如：約8400Å)降低許多，因此本揭示的實施例提供的架橋結構104的優點就更趨明顯。 Furthermore, when the metal layer 104a of the bridge structure 104 reaches a lower impedance of about 0.15 Ω, the thickness of the metal layer 104a is usually more than doubled compared to the impedance of the bridge structure of 0.3 Ω. In some embodiments disclosed, the thickness of the metal layer 104a (eg, about 200 Å to 1000 Å) is greater than the thickness of a conventional bridging structure material (eg, molybdenum/aluminum/molybdenum) in the case where the bridging structure has the same impedance ( For example: about 8400 Å) is much lower, so the advantages of the bridge structure 104 provided by the embodiments of the present disclosure are more apparent.
如第1A圖所示，觸控面板100更包含周邊線路 107，周邊線路107電性連接第一軸向觸控電極102與第二軸向觸控電極103至接墊108。其材質可包含金屬網格、奈米銀線或透明導電材料，例如銦錫氧化物、銦鋅氧化物、摻氟氧化錫、摻鋁氧化鋅、摻鎵氧化鋅等。在一些實施例中，周邊線路107和接墊108可與金屬層104a一起形成，即周邊線路107與接墊108的材質與厚度可相同於金屬層104a，且在同一步製程中一次形成。減少觸控面板100的製作步驟、節省材料、提高良率。在另一些實施例中，周邊線路107和接墊108還可與架橋結構104一起形成。 As shown in FIG. 1A, the touch panel 100 further includes a peripheral line. 107. The peripheral line 107 electrically connects the first axial touch electrode 102 and the second axial touch electrode 103 to the pad 108. The material may include a metal mesh, a nano silver wire or a transparent conductive material such as indium tin oxide, indium zinc oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, and the like. In some embodiments, the perimeter lines 107 and pads 108 may be formed with the metal layer 104a, that is, the perimeter lines 107 and pads 108 may be the same material and thickness as the metal layer 104a and formed once in the same process. The manufacturing steps of the touch panel 100 are reduced, materials are saved, and yield is improved. In other embodiments, perimeter line 107 and pads 108 may also be formed with bridge structure 104.
依據本揭示的實施例，架橋結構104的第一透明導電層104b與第一軸向觸控電極102與第二軸向觸控電極103具有相同或相近的折射率，使得架橋結構104在觸控面板100上的視覺顏色與第一軸向觸控電極102及第二軸向觸控電極103的視覺顏色接近。在一些實施例中，形成第一透明導電層104b的材料之折射率範圍可在約1.6至約2.2，第一透明導電層104b的材質可包含銦鋅氧化物、摻氟氧化錫、摻鋁氧化鋅或摻鎵氧化鋅，且第一透明導電層104b的厚度範圍可在約20奈米與約50奈米之間。 According to the embodiment of the present disclosure, the first transparent conductive layer 104b of the bridge structure 104 and the first axial touch electrode 102 and the second axial touch electrode 103 have the same or similar refractive index, so that the bridge structure 104 is in touch. The visual color on the panel 100 is close to the visual color of the first axial touch electrode 102 and the second axial touch electrode 103. In some embodiments, the material forming the first transparent conductive layer 104b may have a refractive index ranging from about 1.6 to about 2.2, and the material of the first transparent conductive layer 104b may include indium zinc oxide, fluorine-doped tin oxide, and aluminum doped oxidation. Zinc or gallium-doped zinc oxide, and the thickness of the first transparent conductive layer 104b may range between about 20 nanometers and about 50 nanometers.
此外，觸控面板100還包含保護層106，保護層106設置於基板101上，全面性地覆蓋第一軸向觸控電極102(包含第一導電單元102a、連接部102b)、第二軸向觸控電極103(包含第二導電單元103a)、架橋結構104(包含金屬層104a、第一透明導電層104b)及絕緣塊105。在一些實施例中，保護層106的材質可包含無機材料(例如，氧化矽、氮化矽、氮氧化矽或前述 之組合)、有機材料(例如，環氧樹脂、聚醯亞胺樹脂、苯環丁烯、聚對二甲苯、萘聚合物、氟碳化物、丙烯酸酯)或其他適合的材料。 In addition, the touch panel 100 further includes a protective layer 106 disposed on the substrate 101 to cover the first axial touch electrode 102 (including the first conductive unit 102a and the connecting portion 102b) and the second axial direction. The touch electrode 103 (including the second conductive unit 103a), the bridge structure 104 (including the metal layer 104a, the first transparent conductive layer 104b), and the insulating block 105. In some embodiments, the material of the protective layer 106 may comprise an inorganic material (eg, hafnium oxide, tantalum nitride, hafnium oxynitride or the foregoing Combinations), organic materials (eg, epoxy, polyimine resin, benzocyclobutene, parylene, naphthalene polymer, fluorocarbon, acrylate) or other suitable materials.
在一些實施例中，觸控面板100的基板101為保護蓋板，且觸控面板100還包含顯示元件110，顯示元件110接合於保護層106下方。顯示元件110可包含液晶顯示元件(Liquid Crystal Display，LCD)或主動矩陣有機發光二極體(Active-matrix organic light-emitting diode,AMOLED)顯示元件。 In some embodiments, the substrate 101 of the touch panel 100 is a protective cover, and the touch panel 100 further includes a display element 110 , and the display element 110 is bonded under the protective layer 106 . The display element 110 may include a liquid crystal display (LCD) or an active-matrix organic light-emitting diode (AMOLED) display element.
請參照第1C圖，其顯示沿著第1A圖之剖面線A-A’，觸控面板100的一些其他實施例的局部剖面示意圖，其中相同於第1B圖中的部件係使用相同的標號表示並省略其說明。 Please refer to FIG. 1C, which shows a partial cross-sectional view of some other embodiments of the touch panel 100 along the section line A-A' of FIG. 1A, wherein the same components as those in FIG. 1B are denoted by the same reference numerals. The description is omitted.
第1C圖中的觸控面板100之結構類似於第1B圖中的觸控面板100之結構，差異處在於觸控面板100的架橋結構104還包含第二透明導電層104c，使得金屬層104a設置於第一透明導電層104b與第二透明導電層104c之間。在一些實施例中，第二透明導電層104c的材質及厚度可相同於第一透明導電層104b。在一些其他實施例中，第二透明導電層104c的材質及厚度可不同於第一透明導電層104b。根據本揭示的一些實施例，架橋結構104包含的第二透明導電層104c可以在觸控面板100的製造過程中保護金屬層104a不被氧化，或者可增加架橋結構104與第二導電單元103a之間的附著力。 The structure of the touch panel 100 in FIG. 1C is similar to the structure of the touch panel 100 in FIG. 1B . The difference is that the bridging structure 104 of the touch panel 100 further includes a second transparent conductive layer 104c such that the metal layer 104a is disposed. Between the first transparent conductive layer 104b and the second transparent conductive layer 104c. In some embodiments, the second transparent conductive layer 104c may have the same material and thickness as the first transparent conductive layer 104b. In some other embodiments, the second transparent conductive layer 104c may have a different material and thickness than the first transparent conductive layer 104b. According to some embodiments of the present disclosure, the second transparent conductive layer 104c included in the bridge structure 104 may protect the metal layer 104a from being oxidized during the manufacturing process of the touch panel 100, or may increase the bridge structure 104 and the second conductive unit 103a. Adhesion between.
請參照第1D圖，其顯示沿著第1A圖之剖面線 A-A’，觸控面板100的一些其他實施例的局部剖面示意圖，其中相同於第1B圖中的部件係使用相同的標號表示並省略其說明。 Please refer to Figure 1D, which shows the section line along Figure 1A. A-A' is a partial cross-sectional view of some other embodiments of the touch panel 100, wherein the same components as those in the first panel are denoted by the same reference numerals and the description thereof will be omitted.
第1D圖中的觸控面板100之結構類似於第1B圖中的觸控面板100之結構，差異處在於觸控面板100的基板101係作為承載第一軸向觸控電極102與第二軸向觸控電極103的基板，且觸控面板100還包含保護蓋板120設置於保護層106上，在此實施例中，觸控面板100的觸控面120a位於保護蓋板120上，並且顯示元件110接合於基板101遠離觸控面120a的一側。 The structure of the touch panel 100 in FIG. 1D is similar to the structure of the touch panel 100 in FIG. 1B . The difference is that the substrate 101 of the touch panel 100 functions as the first axial touch electrode 102 and the second axis. The touch panel 120 is disposed on the protective layer 106. In this embodiment, the touch surface 120a of the touch panel 100 is disposed on the protective cover 120 and displayed. The component 110 is bonded to a side of the substrate 101 away from the touch surface 120a.
關於觸控面板100的製造方法，如第1B所示，在一些實施例中，提供基板101，基板101具有觸控面101a及與其相對的另一內側表面101b，可透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)、微影製程及蝕刻製程(例如，乾蝕刻製程、濕蝕刻製程、電漿蝕刻製程、反應性離子蝕刻製程或其他適合的製程)，或以塗佈與圖案化製程，形成第一軸向觸控電極102(包含第一導電單元102a、連接部102b)與第二軸向觸控電極103(包含第二導電單元103a)於基板101上，然後可透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)、微影製程及蝕刻製程(例如，乾蝕刻製程、濕蝕刻製程、電漿蝕刻製程、反應性離子蝕刻製程或其他適合的製程)，或以塗佈與圖案化製程，形成絕緣塊105於連接部102b上，且絕緣塊105包覆連接部102b。 Regarding the manufacturing method of the touch panel 100, as shown in FIG. 1B, in some embodiments, the substrate 101 is provided. The substrate 101 has a touch surface 101a and another inner surface 101b opposite thereto, and is transparent to a deposition process (for example, physical Vapor deposition process, chemical vapor deposition process or other suitable process), lithography process and etching process (eg, dry etching process, wet etching process, plasma etching process, reactive ion etching process or other suitable process) Or forming a first axial touch electrode 102 (including the first conductive unit 102a, the connecting portion 102b) and the second axial touch electrode 103 (including the second conductive unit 103a) on the substrate by a coating and patterning process 101, then through a deposition process (eg, physical vapor deposition process, chemical vapor deposition process or other suitable process), lithography process and etching process (eg, dry etching process, wet etching process, plasma etching process) The reactive ion etching process or other suitable process, or the coating and patterning process, forms the insulating block 105 on the connecting portion 102b, and the insulating block 105 covers the connecting portion 102b.
接著，可透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)、微影製程及蝕刻製程 (例如，乾蝕刻製程、濕蝕刻製程、電漿蝕刻製程、反應性離子蝕刻製程或其他適合的製程)，或以塗佈與圖案化製程，形成架橋結構104(包含金屬層104a、第一透明導電層104b)於絕緣塊105上，架橋結構104電性連接第二導電單元103a，其中第一透明導電層104b相較於金屬層104a更靠近觸控面101a。由於架橋結構104的金屬層104a在達到低阻抗約0.15Ω的情況下具有較薄的厚度(約200Å-1000Å)，因此在蝕刻製程中較不易發生蝕刻不完全的問題，達到良率高的觸控面板。 Then, through a deposition process (for example, physical vapor deposition process, chemical vapor deposition process or other suitable process), lithography process and etching process (for example, dry etching process, wet etching process, plasma etching process, reactive ion etching process or other suitable process), or coating and patterning process to form bridging structure 104 (including metal layer 104a, first transparent) The conductive layer 104b is on the insulating block 105. The bridging structure 104 is electrically connected to the second conductive unit 103a, wherein the first transparent conductive layer 104b is closer to the touch surface 101a than the metal layer 104a. Since the metal layer 104a of the bridge structure 104 has a relatively thin thickness (about 200 Å to 1000 Å) with a low impedance of about 0.15 Ω, the problem of incomplete etching is less likely to occur in the etching process, and a high yield touch is achieved. Control panel.
接著，可透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)或塗佈製程形成保護層106於基板101上，全面性地覆蓋第一軸向觸控電極102(包含第一導電單元102a、連接部102b)、第二軸向觸控電極103(包含第二導電單元103a)、架橋結構104(包含金屬層104a、第一透明導電層104b)及絕緣塊105。 Then, the protective layer 106 can be formed on the substrate 101 through a deposition process (for example, a physical vapor deposition process, a chemical vapor deposition process, or other suitable process) or a coating process to comprehensively cover the first axial touch electrode. 102 (including first conductive unit 102a, connecting portion 102b), second axial touch electrode 103 (including second conductive unit 103a), bridging structure 104 (including metal layer 104a, first transparent conductive layer 104b) and insulating block 105.
接著，可透過光學透明膠(Optical Clear Adhesive，OCA)或光學透明樹脂(Optical Clear Resin，OCR)將顯示元件110貼合於保護層106遠離觸控面101a的一側，完成觸控面板100。 Then, the display panel 110 is bonded to the side of the protective layer 106 away from the touch surface 101a through an optical clear adhesive (OCA) or an optical transparent resin (OCR) to complete the touch panel 100.
關於如第1C所示之觸控面板100的製造方法，其中相同於第1B圖的觸控面板100的製造方法將省略其說明。 Regarding the method of manufacturing the touch panel 100 as shown in FIG. 1C, the description of the method of manufacturing the touch panel 100 similar to that of FIG. 1B will be omitted.
第1C圖的觸控面板100之製造方法類似於第1B圖的觸控面板100之製造方法，差異處在於形成觸控面板100的架橋結構104時，還包含形成第二透明導電層104c覆蓋金屬層104a，使得金屬層104a介於第一透明導電層104b與第二透明導 電層104c之間，第二透明導電層104c的形成可以保護金屬層104a避免其在製程當中被氧化。 The manufacturing method of the touch panel 100 of FIG. 1C is similar to the manufacturing method of the touch panel 100 of FIG. 1B . The difference is that when the bridging structure 104 of the touch panel 100 is formed, the second transparent conductive layer 104c is formed to cover the metal. Layer 104a such that metal layer 104a is interposed between first transparent conductive layer 104b and second transparent conductive layer Between the electrical layers 104c, the formation of the second transparent conductive layer 104c can protect the metal layer 104a from oxidation during the process.
關於如第1D所示之觸控面板100的製造方法，其中相同於第1B圖的觸控面板100的製造方法將省略其說明。 Regarding the manufacturing method of the touch panel 100 as shown in FIG. 1D, the description of the manufacturing method of the touch panel 100 similar to FIG. 1B will be omitted.
第1D圖的觸控面板100之製造方法類似於第1B圖的觸控面板100之製造方法，差異處在於形成保護層106之後，透過光學透明膠或光學透明樹脂(第1D圖未繪出)將保護蓋板120貼合於保護層106上，使得觸控面板100的觸控面120a位於保護蓋板120上，並透過另一光學透明膠或光學透明樹脂(未繪出)將顯示元件110貼合於基板101遠離觸控面120a的一側，在此實施例中，觸控面板100的基板101係作為第一軸向觸控電極102與第二軸向觸控電極103的承載基板。 The manufacturing method of the touch panel 100 of FIG. 1D is similar to the manufacturing method of the touch panel 100 of FIG. 1B . The difference is that after the protective layer 106 is formed, the optical transparent adhesive or the optical transparent resin is transmitted (not shown in FIG. 1D ). The protective cover 120 is attached to the protective layer 106 such that the touch surface 120a of the touch panel 100 is located on the protective cover 120, and the display element 110 is transmitted through another optically transparent adhesive or optically transparent resin (not shown). In the embodiment, the substrate 101 of the touch panel 100 serves as a carrier substrate for the first axial touch electrode 102 and the second axial touch electrode 103.
請參照第2A圖，其顯示依據本揭示一些其他實施例之觸控面板200的局部剖面示意圖，其中相同於第1B圖中的部件係使用相同的標號表示並省略其說明。 Referring to FIG. 2A, a partial cross-sectional view of a touch panel 200 according to some other embodiments of the present disclosure is shown, wherein components that are the same as those in FIG. 1B are denoted by the same reference numerals and the description thereof is omitted.
第2A圖中的觸控面板200之結構類似於第1B圖中的觸控面板100之結構，基板101具有觸控面101a及與觸控面101a相對的內側面101b，差異處在於觸控面板200的架橋結構104(包括金屬層104a及第一透明導電層104b)先形成於基板101的內側面101b上，絕緣塊105位於架橋結構104上，且第一軸向觸控電極102的連接部102b位於絕緣塊105上，也就是說，觸控面板200的架橋結構104先形成於基板101上，再形成第一軸向觸控電極102與第二軸向觸控電極103。此外，觸控面板200的架橋結構104中的第一透明導電層104b相較於金屬層104a更靠 近觸控面101a。 The structure of the touch panel 200 in FIG. 2A is similar to the structure of the touch panel 100 in FIG. 1B. The substrate 101 has a touch surface 101a and an inner side surface 101b opposite to the touch surface 101a. The difference lies in the touch panel. The bridging structure 104 of the 200 (including the metal layer 104a and the first transparent conductive layer 104b) is first formed on the inner side surface 101b of the substrate 101, the insulating block 105 is located on the bridging structure 104, and the connecting portion of the first axial touch electrode 102 The bridging structure 104 of the touch panel 200 is first formed on the substrate 101, and then the first axial touch electrode 102 and the second axial touch electrode 103 are formed. In addition, the first transparent conductive layer 104b in the bridging structure 104 of the touch panel 200 is further leaner than the metal layer 104a. Near the touch surface 101a.
請參照第2B圖，其顯示依據本揭示一些其他實施例的觸控面板200的剖面示意圖，其中相同於第2A圖中的部件係使用相同的標號表示並省略其說明。 Referring to FIG. 2B, a cross-sectional view of the touch panel 200 according to some other embodiments of the present disclosure is shown, wherein the same components as those in FIG. 2A are denoted by the same reference numerals and the description thereof is omitted.
第2B圖中的觸控面板200之結構類似於第2A圖中的觸控面板200之結構，差異處在於第2B圖的觸控面板200還包含第二透明導電層104c覆蓋金屬層104a，使得金屬層104a介於第一透明導電層104b與第二透明導電層104c之間。在一些實施例中，第二透明導電層104c的材質及厚度可相同於第一透明導電層104b。在一些其他實施例中，第二透明導電層104c的材質及厚度可不同於第一透明導電層104b，第二透明導電層104c可在觸控面板200的製程中保護金屬層104a，避免金屬層104a發生氧化。 The structure of the touch panel 200 in FIG. 2B is similar to the structure of the touch panel 200 in FIG. 2A. The difference is that the touch panel 200 of FIG. 2B further includes a second transparent conductive layer 104c covering the metal layer 104a. The metal layer 104a is interposed between the first transparent conductive layer 104b and the second transparent conductive layer 104c. In some embodiments, the second transparent conductive layer 104c may have the same material and thickness as the first transparent conductive layer 104b. In some other embodiments, the second transparent conductive layer 104c may be different in material and thickness from the first transparent conductive layer 104b, and the second transparent conductive layer 104c may protect the metal layer 104a in the process of the touch panel 200 to avoid the metal layer. Oxidation occurs in 104a.
請參照第2C圖，其顯示依據本揭示一些其他實施例的局部剖面示意圖，其中相同於第2A圖中的部件係使用相同的標號表示並省略其說明。 Referring to FIG. 2C, there is shown a partial cross-sectional view of some other embodiments in accordance with the present disclosure, wherein components that are the same as in FIG. 2A are denoted by the same reference numerals and the description thereof is omitted.
第2C圖中的觸控面板200之結構類似於第2A圖中的觸控面板200之結構，差異處在於第2C圖的觸控面板200的基板101係作為第一軸向觸控電極102與第二軸向觸控電極103的承載基板，且觸控面板200還包含保護蓋板120設置於保護層106上，觸控面板200的觸控面120a位於保護蓋板120上，以及顯示元件110接合於基板101遠離觸控面120a的一側。 The structure of the touch panel 200 in FIG. 2C is similar to the structure of the touch panel 200 in FIG. 2A . The difference is that the substrate 101 of the touch panel 200 of FIG. 2C serves as the first axial touch electrode 102 and The touch panel 120 further includes a protective cover 120 disposed on the protective layer 106, the touch surface 120a of the touch panel 200 is located on the protective cover 120, and the display component 110 Bonded to the side of the substrate 101 away from the touch surface 120a.
關於如第2A所示之觸控面板200的製造方法，其中相同於第1B圖中的製造方法將省略其說明。 Regarding the manufacturing method of the touch panel 200 as shown in FIG. 2A, the description thereof will be omitted in the same manner as the manufacturing method in FIG. 1B.
第2A圖中的觸控面板200之製造方法類似於第1B圖中的觸控面板100之製造方法，差異處在於觸控面板200透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)、微影製程及蝕刻製程(例如，乾蝕刻製程、濕蝕刻製程、電漿蝕刻製程、反應性離子蝕刻製程或其他適合的製程)或以塗佈與圖案化製程，形成架橋結構104(包含金屬層104a、第一透明導電層104b)於基板101之與觸控面101a相反的另一內側表面101b上，架橋結構104電性連接第二導電單元103a，並且架橋結構104的第一透明導電層104b相較於金屬層104a更靠近觸控面101a，然後可透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)、微影製程及蝕刻製程(例如，乾蝕刻製程、濕蝕刻製程、電漿蝕刻製程、反應性離子蝕刻製程或其他適合的製程)或以塗佈與圖案化製程，形成絕緣塊105於架橋結構104上。依據本揭示的實施例，架橋結構104的金屬層104a在達到低阻抗約0.15Ω時具有較薄的厚度，因此在蝕刻製程中較不易造成蝕刻不完全的問題，達到良率高的觸控面板。 The manufacturing method of the touch panel 200 in FIG. 2A is similar to the manufacturing method of the touch panel 100 in FIG. 1B . The difference is that the touch panel 200 passes through a deposition process (eg, physical vapor deposition process, chemical vapor deposition). Process or other suitable process), lithography process and etching process (eg, dry etch process, wet etch process, plasma etch process, reactive ion etch process, or other suitable process) or coating and patterning process, Forming the bridging structure 104 (including the metal layer 104a, the first transparent conductive layer 104b) on the other inner surface 101b of the substrate 101 opposite to the touch surface 101a, the bridging structure 104 is electrically connected to the second conductive unit 103a, and the bridging structure The first transparent conductive layer 104b of the 104 is closer to the touch surface 101a than the metal layer 104a, and then can pass through a deposition process (for example, a physical vapor deposition process, a chemical vapor deposition process, or other suitable process), a lithography process. And etching processes (eg, dry etching processes, wet etching processes, plasma etching processes, reactive ion etching processes, or other suitable processes) or coating and patterning processes, The insulating block 105 is formed on the bridging structure 104. According to the embodiment of the present disclosure, the metal layer 104a of the bridging structure 104 has a thin thickness when the low impedance is about 0.15 Ω, so that the etching process is less likely to cause incomplete etching, and the touch panel with high yield is achieved. .
接著，可透過沉積製程(例如，物理氣相沈積製程、化學氣相沈積製程或其他適合的製程)、微影製程及蝕刻製程(例如，乾蝕刻製程、濕蝕刻製程、電漿蝕刻製程、反應性離子蝕刻製程或其他適合的製程)或以塗佈與圖案化製程，形成第一軸向觸控電極102(包含第一導電單元102a及連接部102b)與第二軸向觸控電極103(包含第二導電單元103a)於基板101上，其中第一軸向觸控電極102的連接部102b形成於絕緣塊105 上，並且架橋結構104電性連接第二導電單元103a。 Then, through a deposition process (eg, physical vapor deposition process, chemical vapor deposition process or other suitable process), lithography process and etching process (eg, dry etching process, wet etching process, plasma etching process, reaction) Forming a first axial touch electrode 102 (including the first conductive unit 102a and the connecting portion 102b) and the second axial touch electrode 103 (for a plasma etching process or other suitable process) or by a coating and patterning process The second conductive unit 103a is included on the substrate 101, wherein the connecting portion 102b of the first axial touch electrode 102 is formed on the insulating block 105. The bridge structure 104 is electrically connected to the second conductive unit 103a.
關於如第2B所示之觸控面板200的製造方法，其中相同於第2A圖中的觸控面板200的製造方法將省略其說明。 Regarding the manufacturing method of the touch panel 200 as shown in FIG. 2B, the description of the manufacturing method of the touch panel 200 in the same manner as in FIG. 2A will be omitted.
第2B圖中的觸控面板200之製造方法類似於第2A圖中的觸控面板200之製造方法，差異處在於形成觸控面板200的架橋結構104時，還包含形成第二透明導電層104c包覆金屬層104a，使得金屬層104a介於第一透明導電層104b與第二透明導電層104c之間。 The manufacturing method of the touch panel 200 in FIG. 2B is similar to the manufacturing method of the touch panel 200 in FIG. 2A . The difference is that when the bridging structure 104 of the touch panel 200 is formed, the second transparent conductive layer 104c is further formed. The metal layer 104a is covered such that the metal layer 104a is interposed between the first transparent conductive layer 104b and the second transparent conductive layer 104c.
關於如第2C所示之觸控面板200的製造方法，其中相同於第2A圖中的觸控面板200的製造方法將省略其說明。 The manufacturing method of the touch panel 200 as shown in FIG. 2C will be omitted from the manufacturing method of the touch panel 200 in FIG. 2A.
第2C圖中的觸控面板200之製造方法類似於第2A圖中的觸控面板200之製造方法，差異處在於形成保護層106之後，透過光學透明膠或光學透明樹脂(未繪出)將保護蓋板120貼合於保護層106上，在此實施例中，觸控面板200的觸控面120a位於保護蓋板120上，並透過另一光學透明膠或光學透明樹脂將顯示元件110貼合於基板101遠離觸控面120a的一側，在此實施例中，觸控面板200的基板101係作為第一軸向觸控電極102與第二軸向觸控電極103的承載基板。 The manufacturing method of the touch panel 200 in FIG. 2C is similar to the manufacturing method of the touch panel 200 in FIG. 2A . The difference is that after the protective layer 106 is formed, it is transmitted through an optical transparent adhesive or an optically transparent resin (not shown). The protective cover 120 is attached to the protective layer 106. In this embodiment, the touch surface 120a of the touch panel 200 is located on the protective cover 120, and the display element 110 is pasted through another optically transparent adhesive or optically transparent resin. In the embodiment, the substrate 101 of the touch panel 200 serves as a carrier substrate for the first axial touch electrode 102 and the second axial touch electrode 103.
根據本揭示的一些實施例，由於架橋結構包含由電阻率低於傳統架橋結構的材料所製成的金屬層及第一透明導電層，因此可在達到低阻抗的同時降低整體架橋結構的厚度，使架橋結構具有較薄的厚度，又避免架橋結構的可視性問題。 According to some embodiments of the present disclosure, since the bridging structure includes a metal layer made of a material having a lower resistivity than the conventional bridging structure and the first transparent conductive layer, the thickness of the overall bridging structure can be reduced while achieving low impedance. The bridging structure has a thin thickness and avoids the visibility of the bridging structure.
此外，架橋結構還包含第一透明導電層，相較於 金屬層，第一透明導電層設置在更靠近觸控面(也是使用者的觀看面)的位置，藉此可降低金屬層的反射，使整體架橋結構的亮度降低，使其相較於傳統鉬/鋁/鉬製成的架橋線可避免架橋結構於觸控面板發生可視性問題，達到外觀佳的觸控面板。 In addition, the bridging structure also includes a first transparent conductive layer, as compared to a metal layer, the first transparent conductive layer is disposed closer to the touch surface (also the viewing surface of the user), thereby reducing the reflection of the metal layer and reducing the brightness of the overall bridge structure, compared to the conventional molybdenum The bridge wire made of aluminum/molybdenum can avoid the visibility problem of the bridge structure on the touch panel and achieve a good appearance of the touch panel.
依據本揭示的實施例，觸控面板的架橋結構在達到低阻抗的同時，整體厚度也降低，藉此可改善觸控面板的架橋結構在製程中對架橋結構蝕刻不完全的現象，進而提升觸控面板的製造良率。此外，當架橋結構的金屬層在達到低阻抗約0.15Ω的情況下，金屬層的厚度相較於傳統的架橋結構的材料的厚度降低更多，因此本揭示的實施例提供的架橋結構的優點就更趨明顯。 According to the embodiment of the present disclosure, the bridging structure of the touch panel reduces the overall thickness while achieving low impedance, thereby improving the incomplete etching of the bridging structure in the bridging structure of the touch panel, thereby improving the touch. The manufacturing yield of the control panel. In addition, when the metal layer of the bridge structure reaches a low impedance of about 0.15 Ω, the thickness of the metal layer is more reduced than the thickness of the material of the conventional bridge structure, and therefore the advantages of the bridge structure provided by the embodiments of the present disclosure It is more obvious.
本揭示的實施例可以應用於使用架橋結構連接觸控電極之分開的導電單元的任何類型的觸控顯示裝置，例如觸控面板形成在顯示元件外(如第1B-1D圖及2A-2C圖所示)或觸控面板形成在顯示元件的彩色濾光片(color filter,CF)上。此外，第一軸向觸控電極與第二軸向觸控電極的圖案設計並不限定於上述圖式中的型態。 The embodiments of the present disclosure can be applied to any type of touch display device that uses a bridging structure to connect separate conductive units of a touch electrode. For example, the touch panel is formed outside the display element (eg, 1B-1D and 2A-2C). The touch panel or the touch panel is formed on a color filter (CF) of the display element. In addition, the pattern design of the first axial touch electrode and the second axial touch electrode is not limited to the type in the above figure.
雖然本發明已以具體之較佳實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可更動與組合上述各種實施例。 Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and it is possible to change and combine the above without departing from the spirit and scope of the invention. Various embodiments.
100‧‧‧觸控面板 100‧‧‧ touch panel
101‧‧‧基板 101‧‧‧Substrate
101a‧‧‧觸控面 101a‧‧‧ touch surface
102b‧‧‧連接部 102b‧‧‧Connecting Department
103a‧‧‧第二導電單元 103a‧‧‧Second conductive unit
104‧‧‧架橋結構 104‧‧‧Bridge structure
104a‧‧‧金屬層 104a‧‧‧metal layer
104b‧‧‧第一透明導電層 104b‧‧‧First transparent conductive layer
105‧‧‧絕緣塊 105‧‧‧Insulation block
106‧‧‧保護層 106‧‧‧Protective layer
106a‧‧‧表面 106a‧‧‧Surface
110‧‧‧顯示元件 110‧‧‧Display components
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106919278A (en) * | 2015-12-28 | 2017-07-04 | 宸鸿科技(厦门)有限公司 | Contact panel |
| EP3553641A4 (en) * | 2016-12-12 | 2020-06-24 | Alps Alpine Co., Ltd. | Capacitance-type sensor and device |
| CN109388294B (en) | 2017-08-11 | 2021-01-22 | 京东方科技集团股份有限公司 | Touch panel, manufacturing method thereof and touch display device |
| CN109426373A (en) | 2017-08-21 | 2019-03-05 | 京东方科技集团股份有限公司 | Touch panel and preparation method thereof, touch control display apparatus |
| CN107783699B (en) * | 2017-10-16 | 2021-05-04 | 业成科技（成都）有限公司 | Touch panel structure and manufacturing method thereof |
| TWI761988B (en) * | 2020-10-14 | 2022-04-21 | 大陸商宸美（廈門）光電有限公司 | Touch module |
| US11379085B2 (en) | 2020-11-02 | 2022-07-05 | Tpk Advanced Solutions Inc. | Touch module |
| US11513646B2 (en) | 2021-03-02 | 2022-11-29 | Tpk Advanced Solutions Inc. | Electronic device |
| CN115836272A (en) * | 2021-05-24 | 2023-03-21 | 京东方科技集团股份有限公司 | Thin film sensor and preparation method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201201082A (en) * | 2010-06-21 | 2012-01-01 | Tpk Touch Solutions Xiamen Inc | Capacitive touch panel and method for reducing the visibility of its metal trace |
| TWM425333U (en) * | 2011-11-08 | 2012-03-21 | Emerging Display Tech Corp | Capacitive touch panel with enhanced structural strength |
| TW201229842A (en) * | 2011-01-11 | 2012-07-16 | Hong-Da Liu | Touch-type inductive device and conductive electrode structure |
| CN103186272A (en) * | 2011-12-29 | 2013-07-03 | 宸鸿科技(厦门)有限公司 | Touch-control panel and manufacturing method thereof |
| US20130277195A1 (en) * | 2012-04-18 | 2013-10-24 | Industrial Technology Research Institute | Touch sensor |
| TWM488682U (en) * | 2014-02-27 | 2014-10-21 | Tpk Touch Solutions Xiamen Inc | The structure of the electrodes of a touch panel and the touch panel using the same |
| TW201443757A (en) * | 2013-05-13 | 2014-11-16 | Wintek Corp | Touch panel |
| TW201447685A (en) * | 2013-05-08 | 2014-12-16 | Gunze Kk | Touch panel, display apparatus, and electronic equipment |
| US20150016070A1 (en) * | 2013-07-10 | 2015-01-15 | Industrial Technology Research Institute | Conductive structure and device with the conductive structure as electrode |
| TWM495535U (en) * | 2014-05-22 | 2015-02-11 | Rtr Tech Technology Co Ltd | Touch structure |
| TWM527126U (en) * | 2015-12-28 | 2016-08-11 | 宸鴻科技（廈門）有限公司 | Touch panels |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4553002B2 (en) * | 2007-12-05 | 2010-09-29 | ソニー株式会社 | Display device |
| CN101581843A (en) * | 2008-05-13 | 2009-11-18 | 奇信电子股份有限公司 | Touch control signal transmitting circuit for touching and controlling display |
| TWI447476B (en) * | 2010-05-04 | 2014-08-01 | Wei Chuan Chen | Manufacturing method of touch panel |
| CN202584059U (en) * | 2011-12-31 | 2012-12-05 | 宸鸿科技(厦门)有限公司 | Touch panel |
| TWM486092U (en) * | 2014-02-13 | 2014-09-11 | Rtr Tech Technology Co Ltd | Touch panel |
| CN205451006U (en) * | 2015-12-28 | 2016-08-10 | 宸鸭科技（厦门）有限公司 | Touch panel |
-
2015
- 2015-12-28 CN CN201510998872.6A patent/CN106919278A/en active Pending
-
2016
- 2016-05-17 TW TW105207129U patent/TWM527126U/en unknown
- 2016-05-17 TW TW105115129A patent/TWI575426B/en active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201201082A (en) * | 2010-06-21 | 2012-01-01 | Tpk Touch Solutions Xiamen Inc | Capacitive touch panel and method for reducing the visibility of its metal trace |
| TW201229842A (en) * | 2011-01-11 | 2012-07-16 | Hong-Da Liu | Touch-type inductive device and conductive electrode structure |
| TWM425333U (en) * | 2011-11-08 | 2012-03-21 | Emerging Display Tech Corp | Capacitive touch panel with enhanced structural strength |
| CN103186272A (en) * | 2011-12-29 | 2013-07-03 | 宸鸿科技(厦门)有限公司 | Touch-control panel and manufacturing method thereof |
| US20130277195A1 (en) * | 2012-04-18 | 2013-10-24 | Industrial Technology Research Institute | Touch sensor |
| TW201447685A (en) * | 2013-05-08 | 2014-12-16 | Gunze Kk | Touch panel, display apparatus, and electronic equipment |
| TW201443757A (en) * | 2013-05-13 | 2014-11-16 | Wintek Corp | Touch panel |
| US20150016070A1 (en) * | 2013-07-10 | 2015-01-15 | Industrial Technology Research Institute | Conductive structure and device with the conductive structure as electrode |
| TWM488682U (en) * | 2014-02-27 | 2014-10-21 | Tpk Touch Solutions Xiamen Inc | The structure of the electrodes of a touch panel and the touch panel using the same |
| TWM495535U (en) * | 2014-05-22 | 2015-02-11 | Rtr Tech Technology Co Ltd | Touch structure |
| TWM527126U (en) * | 2015-12-28 | 2016-08-11 | 宸鴻科技（廈門）有限公司 | Touch panels |
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