TWI572063B - Light emitting diode package structure - Google Patents

Description

發光二極體封裝結構Light emitting diode package structure

本發明是有關於一種封裝結構，且特別是有關於一種發光二極體封裝結構。The present invention relates to a package structure, and more particularly to a light emitting diode package structure.

隨著光電技術的進步，用以取代傳統白熾燈泡及螢光燈管的新世代光源─發光二極體（Light-emitting diode, LED）─之技術逐漸成熟。由於發光二極體具有低功率消耗、體積小、非熱致發光、環保等優點，因此其應用領域逐漸地被推廣。With the advancement of optoelectronic technology, the technology of replacing the traditional incandescent bulbs and fluorescent tubes, the new generation of light-emitting diodes (LEDs), has matured. Since the light-emitting diode has the advantages of low power consumption, small volume, non-thermography, environmental protection, etc., its application field is gradually being promoted.

在習知的發光二極體封裝結構中，發光二極體是配置在封裝載體，而螢光膠體包覆發光二極體，且封裝膠體包覆螢光膠體與封裝載體。由於發光二極體具有特定的出光角度，因此發光二極體所發出的光線會以特定的角度入射至螢光膠體與封裝膠體中。如此一來，發光二極體封裝結構其發光角度有限，無法具有較大的出光角度。In a conventional LED package structure, the LED is disposed on the package carrier, and the phosphor colloid encapsulates the LED, and the encapsulant encapsulates the phosphor colloid and the package carrier. Since the light-emitting diode has a specific light-emitting angle, the light emitted by the light-emitting diode is incident on the phosphor colloid and the encapsulant at a specific angle. As a result, the LED package structure has a limited illumination angle and cannot have a large exit angle.

本發明提供一種發光二極體封裝結構，其可增加發光單元的出光角度範圍及出光亮度。The invention provides a light emitting diode package structure, which can increase the light exit angle range and the light exit brightness of the light emitting unit.

本發明的發光二極體封裝結構包括封裝載體、設置於封裝載體上的導光件、發光單元以及封裝材料層。導光件具有一第一表面及一第二表面，適於發出光束的發光單元設置在導光件的第一表面上。封裝材料層設置在封裝載體上並封裝發光單元及導光件。封裝材料層直接自發光單元取出光束的第一部分，以及自導光件的第二表面取出光束的第二部分。The LED package structure of the present invention comprises a package carrier, a light guide disposed on the package carrier, a light emitting unit, and a layer of encapsulating material. The light guiding member has a first surface and a second surface, and the light emitting unit adapted to emit a light beam is disposed on the first surface of the light guiding member. The encapsulating material layer is disposed on the package carrier and encapsulates the light emitting unit and the light guiding member. The encapsulating material layer directly extracts the first portion of the beam from the illumination unit and the second portion of the beam from the second surface of the light guide.

本發明的發光二極體封裝結構包括導光件、發光單元以及封裝發光單元及導光件的封裝材料層。導光件具有第一表面及第二表面，且發光單元設置在導光件的第一表面上。發光單元適於發出一光束，且光束的至少一部分經由導光件的第一表面射入並經第二表面射出。The LED package structure of the present invention comprises a light guide, a light emitting unit, and an encapsulating material layer encapsulating the light emitting unit and the light guiding member. The light guiding member has a first surface and a second surface, and the light emitting unit is disposed on the first surface of the light guiding member. The illumination unit is adapted to emit a light beam, and at least a portion of the light beam is incident through the first surface of the light guide and exits through the second surface.

在本發明的一實施例中，上述的發光二極體封裝結構更包括一反射層，且導光件配置於反射層與發光單元之間。In an embodiment of the invention, the LED package further includes a reflective layer, and the light guide is disposed between the reflective layer and the light emitting unit.

在本發明的一實施例中，上述的封裝材料層包括一波長轉換層。In an embodiment of the invention, the encapsulating material layer comprises a wavelength conversion layer.

在本發明的一實施例中，上述的封裝材料層更包括一封裝膠體，且封裝膠體覆蓋封裝載體及波長轉換層。In an embodiment of the invention, the encapsulating material layer further comprises an encapsulant, and the encapsulant covers the package carrier and the wavelength conversion layer.

在本發明的一實施例中，上述的導光件的第二表面包括一粗糙表面。In an embodiment of the invention, the second surface of the light guide member includes a rough surface.

在本發明的一實施例中，上述的導光件更包括一反射介面，用以將射入導光件的至少部分光束反射至第二表面。In an embodiment of the invention, the light guiding member further includes a reflective interface for reflecting at least a portion of the light beam incident on the light guiding member to the second surface.

在本發明的一實施例中，上述的波長轉換層覆蓋發光單元。In an embodiment of the invention, the wavelength conversion layer covers the light emitting unit.

在本發明的一實施例中，上述的粗糙表面為一周期性之圖案化表面。In an embodiment of the invention, the rough surface is a periodic patterned surface.

基於上述，由於本發明的發光二極體封裝結構具有導光件，其中導光組件的水平投影面積大於發光單元的水平投影面積。因此，發光單元所發出的光束的一部分可藉由導光組件的導光效果，而增大發光單元的出光角度範圍。如此一來，本發明的發光二極體封裝結構可具有較廣的出光角度且可提高其的出光亮度。Based on the above, since the light emitting diode package structure of the present invention has a light guiding member, the horizontal projected area of the light guiding unit is larger than the horizontal projected area of the light emitting unit. Therefore, a part of the light beam emitted by the light emitting unit can increase the light exiting angle range of the light emitting unit by the light guiding effect of the light guiding component. In this way, the light emitting diode package structure of the present invention can have a wider light exit angle and can improve the light exiting brightness thereof.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

圖1繪示為本發明的一實施例的一種發光二極體封裝結構的剖面示意圖。請參考圖1，在本實施例中，發光二極體封裝結構100a包括一封裝載體110a、一導光組件120a以及一發光單元130a。導光組件120a配置於封裝載體110a上。發光單元130a配置於導光組件120a相對遠離封裝載體110a的一上表面121a上。導光組件120a的水平投影面積大於發光單元130a的水平投影面積。發光單元130a適於發出一光束L1，且光束的一部分L1’進入導光組件120a，並自導光組件120a的上表面121a射出，光束L1’與上表面121a的法線方向N1具有一夾角α1，而夾角α1介於0度至75度之間。FIG. 1 is a cross-sectional view showing a light emitting diode package structure according to an embodiment of the invention. Referring to FIG. 1, in the embodiment, the LED package structure 100a includes a package carrier 110a, a light guiding component 120a, and a light emitting unit 130a. The light guiding component 120a is disposed on the package carrier 110a. The light emitting unit 130a is disposed on an upper surface 121a of the light guiding component 120a relatively away from the package carrier 110a. The horizontal projected area of the light guiding component 120a is larger than the horizontal projected area of the light emitting unit 130a. The light emitting unit 130a is adapted to emit a light beam L1, and a portion L1' of the light beam enters the light guiding component 120a and is emitted from the upper surface 121a of the light guiding component 120a. The light beam L1' has an angle α1 with the normal direction N1 of the upper surface 121a. And the angle α1 is between 0 and 75 degrees.

更具體來說，在本實施例中，封裝載體110a例如是一導線架或一電路板，其具有反射的特性。導光組件120a為一透光平板或一透光膠體，透光平板例如但不限於藍寶石片，透光膠體板例如但不限於矽膠。發光單元130a包括一基板132、一第一型半導體層134、一發光層136以及一第二型半導體層138，其中第一型半導體層134、發光層136以及第二型半導體層138依序配置於基板132上。此處，發光單元130a例如是一水平式發光二極體，但並不以此為限。特別是，發光單元130a所發出光束的一部分L1’進入導光組件120a，且被封裝載體110a反射而自導光組件120a的上表面121a射出。較佳地，導光組件120a的水平投影面積為發光單元130a的水平投影面積的1.1倍至5倍。需說明的是，若水平投影面積的比值小於1.1倍，則導光組件120a的光導的效果不佳，無法有效擴大發光單元130a的出光角度；或水平投影面積的比值大於5倍，則導光組件120a不易固定於封裝載體110a上。More specifically, in the present embodiment, the package carrier 110a is, for example, a lead frame or a circuit board having a reflective property. The light guiding component 120a is a light transmissive plate or a light transmissive plate, such as but not limited to a sapphire plate, such as but not limited to silicone. The light emitting unit 130a includes a substrate 132, a first type semiconductor layer 134, a light emitting layer 136, and a second type semiconductor layer 138. The first type semiconductor layer 134, the light emitting layer 136, and the second type semiconductor layer 138 are sequentially disposed. On the substrate 132. Here, the light emitting unit 130a is, for example, a horizontal light emitting diode, but is not limited thereto. Specifically, a portion L1' of the light beam emitted from the light emitting unit 130a enters the light guiding member 120a, and is reflected by the package carrier 110a to be emitted from the upper surface 121a of the light guiding member 120a. Preferably, the horizontal projection area of the light guiding component 120a is 1.1 to 5 times the horizontal projection area of the light emitting unit 130a. It should be noted that if the ratio of the horizontal projection area is less than 1.1 times, the light guide of the light guiding component 120a is not effective, and the light extraction angle of the light emitting unit 130a cannot be effectively expanded; or the ratio of the horizontal projection area is greater than 5 times, the light guiding is performed. The assembly 120a is not easily fixed to the package carrier 110a.

請再參考圖1，在本實施例中，導光組件120a的外型輪廓和發光單元130a的基板132的外形輪廓略同，藉此可等效的擴大發光單元130a每一面向的出光角度，可以避免光度不均的問題產生。再者，本實施例的導光組件120a的厚度為發光單元130a的基板132的厚度的0.1倍至2倍。若厚度的比值小於0.1倍，則導光組件120a的光導的效果不佳，無法擴大發光單元130a的出光角度；若厚度的比值大於2倍，則導光組件120a內會產生熱蓄積的現象，導致發光二極體封裝結構100a升溫而壽命減短。此外，本實施例的導光組件120a的折射率小於或等於發光單元130a的基板132的折射率。Referring to FIG. 1 again, in the embodiment, the outline of the light guiding component 120a and the outer shape of the substrate 132 of the light emitting unit 130a are slightly the same, thereby equivalently expanding the light exit angle of each surface of the light emitting unit 130a. The problem of uneven luminosity can be avoided. Furthermore, the thickness of the light guiding member 120a of the present embodiment is 0.1 to 2 times the thickness of the substrate 132 of the light emitting unit 130a. If the ratio of the thickness is less than 0.1 times, the light guide of the light guiding unit 120a is not effective, and the light exiting angle of the light emitting unit 130a cannot be enlarged. If the ratio of the thickness is more than 2 times, heat accumulation occurs in the light guiding unit 120a. The light-emitting diode package structure 100a is heated and the life is shortened. In addition, the refractive index of the light guiding component 120a of the present embodiment is less than or equal to the refractive index of the substrate 132 of the light emitting unit 130a.

由於本實施例的發光二極體封裝結構100a具有導光組件120a，其中導光組件120a的水平投影面積大於發光單元130a的水平投影面積。也就是說，配置於導光組件120a上的發光單元130a並未完全覆蓋住導光組件120a的上表面121a，而是暴露出導光組件120a的部分上表面121a。因此，發光單元130a所發出的光束的一部分L1’可藉由導光組件120a的導光而使其從未被發光單元130a所覆蓋住的上表面121a射出且與上表面121a的法線方向N1之夾角α1介於0度至75度之間，進而可有效增大發光單元130a的出光角度範圍。如此一來，本實施例的發光二極體封裝結構100a可具有較廣的出光角度且可提高其的出光亮度。Since the light emitting diode package structure 100a of the present embodiment has the light guiding component 120a, the horizontal projected area of the light guiding component 120a is larger than the horizontal projected area of the light emitting unit 130a. That is, the light emitting unit 130a disposed on the light guiding component 120a does not completely cover the upper surface 121a of the light guiding component 120a, but exposes a portion of the upper surface 121a of the light guiding component 120a. Therefore, a portion L1' of the light beam emitted by the light emitting unit 130a can be emitted from the upper surface 121a not covered by the light emitting unit 130a by the light guiding of the light guiding unit 120a and with the normal direction N1 of the upper surface 121a. The angle α1 is between 0 and 75 degrees, which can effectively increase the range of the light exiting angle of the light emitting unit 130a. In this way, the LED package structure 100a of the present embodiment can have a wider light exit angle and can improve the light exiting brightness thereof.

在此必須說明的是，下述實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

圖2繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。請參考圖2，本實施例的發光二極體封裝結構100b與圖1的發光二極體封裝結構100a相似，惟二者主要差異之處在於：本實施例的導光組件120b的上表面121b為一粗糙表面，其中此粗糙表面的中心線平均粗糙度介於100奈米至3000 奈米之間。較佳地，粗糙表面121b為一周期性之圖案化表面。2 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. Referring to FIG. 2, the LED package structure 100b of the present embodiment is similar to the LED package structure 100a of FIG. 1, but the main difference is that the upper surface 121b of the light guide component 120b of the embodiment is It is a rough surface in which the center line average roughness of this rough surface is between 100 nm and 3000 nm. Preferably, the rough surface 121b is a periodic patterned surface.

由於本實施例的導光組件120b的上表面121b為粗糙表面，因此導光組件120b除了具有導光的效果之外，其亦具有散射的效果，可將發光單元130a進入導光組件120b內的光束散射出去，進而增大發光單元130a的出光角度範圍。如此一來，本實施例的發光二極體封裝結構100b可具有較廣的出光角度且可提高其的出光亮度。Since the upper surface 121b of the light guiding component 120b of the present embodiment is a rough surface, the light guiding component 120b has a scattering effect in addition to the light guiding effect, and the light emitting unit 130a can enter the light guiding component 120b. The light beam is scattered out, thereby increasing the range of the light exiting angle of the light emitting unit 130a. In this way, the LED package structure 100b of the present embodiment can have a wider light-emitting angle and can improve the light-emitting brightness thereof.

圖3繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。請參考圖3，本實施例的發光二極體封裝結構100c與圖1的發光二極體封裝結構100a相似，惟二者主要差異之處在於：本實施例的導光組件120c是由一透光單元122c以及一反射層124c所組成。反射層124c配置於透光單元122c與封裝載體110a之間，而透光單元122c具有上表面121c。此處，透光單元122c例如是為一透光平板或一透光膠體，較佳地，透光單元122c為一藍寶石片，而反射層124c例如是一布拉格反射鏡或一金屬材料層。如圖3所示，當發光單元130a發出光束L2時，光束的一部分L2’會進入導光組件120c的透光單元122c，且被反射層124c反射而自透光單元122c的上表面121c射出。光束L2’與上表面121c的法線方向N2具有一夾角α2，而夾角α2介於0度至75度之間。3 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. Referring to FIG. 3, the LED package structure 100c of the present embodiment is similar to the LED package structure 100a of FIG. 1, but the main difference between the two is that the light guide component 120c of the embodiment is transparent. The light unit 122c and a reflective layer 124c are composed. The reflective layer 124c is disposed between the light transmitting unit 122c and the package carrier 110a, and the light transmitting unit 122c has an upper surface 121c. Here, the light transmitting unit 122c is, for example, a light transmitting plate or a light transmitting gel. Preferably, the light transmitting unit 122c is a sapphire sheet, and the reflecting layer 124c is, for example, a Bragg mirror or a metal material layer. As shown in Fig. 3, when the light emitting unit 130a emits the light beam L2, a portion L2' of the light beam enters the light transmitting unit 122c of the light guiding unit 120c, and is reflected by the reflecting layer 124c to be emitted from the upper surface 121c of the light transmitting unit 122c. The light beam L2' has an angle α2 with the normal direction N2 of the upper surface 121c, and the angle α2 is between 0 and 75 degrees.

此外，本實施例的發光二極體封裝結構100c可選擇性地更包括一透光罩140，其中透光罩140配置於封裝載體110a上且遮蓋導光組件120c與發光單元130a。此處，透光罩140的材質例如是一透光膠體、一玻璃或一摻雜有螢光物質的透明膠體。需說明的是，當透光罩140的材質為透光膠體或玻璃時，整體發光二極體封裝結構100c的出光顏色為單一色光。特別是，本實施例的透光罩140與封裝載體110a之間存在有一空氣間隙A，但並不以此為限。In addition, the light emitting diode package structure 100c of the present embodiment can further include a light transmissive cover 140, wherein the light transmissive cover 140 is disposed on the package carrier 110a and covers the light guide assembly 120c and the light emitting unit 130a. Here, the material of the transparent cover 140 is, for example, a transparent colloid, a glass or a transparent colloid doped with a fluorescent substance. It should be noted that when the material of the transparent cover 140 is a light-transmitting colloid or glass, the light-emitting color of the overall light-emitting diode package structure 100c is a single color light. In particular, an air gap A exists between the light transmissive cover 140 and the package carrier 110a of the present embodiment, but is not limited thereto.

圖4繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。請參考圖4，本實施例的發光二極體封裝結構100d與圖3的發光二極體封裝結構100c相似，惟二者主要差異之處在於：本實施例的發光二極體封裝結構100d更包括一波長轉換層150以及一封裝膠體160。詳細來說，波長轉換層150配置於封裝載體160上且包覆發光單元130a與導光組件120c。封裝膠體160配置於封裝載體110a上且包覆波長轉換層150與封裝載體110a，其中導光組件120c的水平投影面積小於封裝膠體160的水平投影面積。也就是說，導光組件120c的水平投影面積會大於發光單元130a的水平投影面積，但會小於封裝膠體160的水平投影面積。換言之，封裝膠體160會將導光組件120c完全包覆。4 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. Referring to FIG. 4, the LED package structure 100d of the present embodiment is similar to the LED package structure 100c of FIG. 3, but the main difference is that the LED package structure 100d of the embodiment is more A wavelength conversion layer 150 and an encapsulant 160 are included. In detail, the wavelength conversion layer 150 is disposed on the package carrier 160 and encloses the light emitting unit 130a and the light guiding component 120c. The encapsulant 160 is disposed on the package carrier 110a and covers the wavelength conversion layer 150 and the package carrier 110a. The horizontal projection area of the light guide component 120c is smaller than the horizontal projection area of the package colloid 160. That is, the horizontal projected area of the light guiding component 120c may be larger than the horizontal projected area of the light emitting unit 130a, but may be smaller than the horizontal projected area of the encapsulant 160. In other words, the encapsulant 160 will completely enclose the light guiding component 120c.

如圖4所示，當發光單元130a發出光束L3時，光束的一部分L3’會進入導光組件120c的透光單元122c，且被反射層124c反射而自透光單元122c的上表面121c射出。接著，由透光單元122c的上表面121c射出的光束的一部分L3’會激發波長轉換層150中的螢光物質（未繪示）而產生激發光L4’，其中光束L3’與上表面121c的法線方向N3具有一夾角α3，而夾角α3介於0度至75度之間。另一方面，光束L3亦可以直接與波長轉換層150中的螢光物質（未繪示）而產生激發光L4。也就是說，波長轉換層150可將發光單元130a所發出的特定波長光束L3、L3’（如藍光）轉換為另一特定波長的光束L4、L4’（如黃光）。發光單元130a未與波長轉換150的螢光物質所反應的光束（未繪示）會與激發光L4、L4’於封裝膠體160內進行混光，進而產生一混合光，如白光。As shown in Fig. 4, when the light emitting unit 130a emits the light beam L3, a portion L3' of the light beam enters the light transmitting unit 122c of the light guiding unit 120c, and is reflected by the reflecting layer 124c to be emitted from the upper surface 121c of the light transmitting unit 122c. Then, a portion L3' of the light beam emitted from the upper surface 121c of the light transmitting unit 122c excites a fluorescent substance (not shown) in the wavelength conversion layer 150 to generate excitation light L4', wherein the light beam L3' and the upper surface 121c The normal direction N3 has an angle α3, and the angle α3 is between 0 and 75 degrees. On the other hand, the light beam L3 can also directly generate the excitation light L4 with the fluorescent substance (not shown) in the wavelength conversion layer 150. That is, the wavelength conversion layer 150 can convert the specific wavelength light beams L3, L3' (e.g., blue light) emitted by the light emitting unit 130a into light beams L4, L4' (e.g., yellow light) of another specific wavelength. The light beam (not shown) of the light-emitting unit 130a that is not reacted with the fluorescent material of the wavelength conversion 150 is mixed with the excitation light L4, L4' in the encapsulant 160 to generate a mixed light such as white light.

圖5繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。請參考圖5，本實施例的發光二極體封裝結構100e與圖4的發光二極體封裝結構100d相似，惟二者主要差異之處在於：本實施例的封裝載體110e具有一凹槽112e，而發光單元130a與導光組件120c位於凹槽112e內。如圖5所示，波長轉換層150完全填滿凹槽112e並完全包覆發光單元130a與導光組件120c，其中波長轉換層150與凹槽112e的表面113e實質上切齊，但並不以此為限，而封裝膠體160直接覆蓋凹槽112e的表面113e與波長轉換層150。FIG. 5 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. Referring to FIG. 5, the LED package structure 100e of the present embodiment is similar to the LED package structure 100d of FIG. 4, but the main difference is that the package carrier 110e of the embodiment has a recess 112e. The light emitting unit 130a and the light guiding component 120c are located in the recess 112e. As shown in FIG. 5, the wavelength conversion layer 150 completely fills the recess 112e and completely encloses the light emitting unit 130a and the light guiding component 120c, wherein the wavelength converting layer 150 is substantially aligned with the surface 113e of the recess 112e, but does not To this end, the encapsulant 160 directly covers the surface 113e of the recess 112e and the wavelength conversion layer 150.

圖6繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。請參考圖6，本實施例的發光二極體封裝結構100f與圖4的發光二極體封裝結構100d相似，惟二者主要差異之處在於：本實施例的發光單元130f具體化為一覆晶式發光二極體。6 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. Referring to FIG. 6, the LED package structure 100f of the present embodiment is similar to the LED package structure 100d of FIG. 4, but the main difference is that the light-emitting unit 130f of the embodiment is embodied as a cover. Crystal light emitting diode.

此外，於其他未繪示的實施例中，為了更進一步增加出光角度與出光亮度，亦可選用於如前述實施例所提及之具有粗糙表面的導光組件120b（請參考圖2），本領域的技術人員當可參照前述實施例的說明，依據實際需求，而選用前述構件，以達到所需的技術效果。In addition, in other embodiments not shown, in order to further increase the light exit angle and the light exit brightness, the light guide assembly 120b having a rough surface as mentioned in the foregoing embodiment may be selected (refer to FIG. 2). Those skilled in the art can refer to the description of the foregoing embodiments, and select the foregoing components according to actual needs to achieve the desired technical effects.

綜上所述，由於本發明的發光二極體封裝結構具有導光組件，其中導光組件的水平投影面積大於發光單元的水平投影面積。因此，發光單元所發出的光束的一部分可藉由導光組件的導光效果，而增大發光單元的出光角度範圍。如此一來，本發明的發光二極體封裝結構可具有較廣的出光角度且可提高其的出光亮度。In summary, the light emitting diode package structure of the present invention has a light guiding component, wherein the horizontal projection area of the light guiding component is larger than the horizontal projected area of the light emitting unit. Therefore, a part of the light beam emitted by the light emitting unit can increase the light exiting angle range of the light emitting unit by the light guiding effect of the light guiding component. In this way, the light emitting diode package structure of the present invention can have a wider light exit angle and can improve the light exiting brightness thereof.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100a、100b、100c、100d、100e、100f‧‧‧發光二極體封裝結構
110a、110e‧‧‧封裝載體
112e‧‧‧凹槽
113e‧‧‧表面
120a、120b、120c‧‧‧導光組件
121a、121b、121c‧‧‧上表面
122c‧‧‧透光單元
124c‧‧‧反射層100a, 100b, 100c, 100d, 100e, 100f‧‧‧ light emitting diode package structure
110a, 110e‧‧‧ package carrier
112e‧‧‧ Groove
113e‧‧‧ surface
120a, 120b, 120c‧‧‧ light guide components
121a, 121b, 121c‧‧‧ upper surface
122c‧‧‧Lighting unit
124c‧‧‧reflective layer

130a、130f‧‧‧發光單元 130a, 130f‧‧‧Lighting unit

132‧‧‧基板 132‧‧‧Substrate

134‧‧‧第一型半導體層 134‧‧‧First type semiconductor layer

136‧‧‧發光層 136‧‧‧Lighting layer

138‧‧‧第二型半導體層 138‧‧‧Second type semiconductor layer

140‧‧‧透光罩 140‧‧‧Transparent cover

150‧‧‧波長轉換層 150‧‧‧wavelength conversion layer

160‧‧‧封裝膠體 160‧‧‧Package colloid

A‧‧‧空氣間隙 A‧‧‧air gap

L1、L2、L3‧‧‧光束 L1, L2, L3‧‧‧ beams

L1’、L2’、L3’‧‧‧光束的一部分 Part of the L1’, L2’, L3’ ‧ ‧ beams

L4、L4’‧‧‧激發光 L4, L4'‧‧‧ excitation light

N1、N2、N3‧‧‧法向方向 N1, N2, N3‧‧‧ normal direction

α 1、α 2、α 3‧‧‧夾角1 1, α 2, α 3‧‧‧ angle

圖1繪示為本發明的一實施例的一種發光二極體封裝結構的剖面示意圖。 圖2繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。 圖3繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。 圖4繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。 圖5繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。 圖6繪示為本發明的另一實施例的一種發光二極體封裝結構的剖面示意圖。FIG. 1 is a cross-sectional view showing a light emitting diode package structure according to an embodiment of the invention. 2 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. 3 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. 4 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. FIG. 5 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention. 6 is a cross-sectional view showing a light emitting diode package structure according to another embodiment of the present invention.

100a‧‧‧發光二極體封裝結構 100a‧‧‧Light Emitting Diode Structure

110a‧‧‧封裝載體 110a‧‧‧Package carrier

120a‧‧‧導光組件 120a‧‧‧Light guiding components

121a‧‧‧上表面 121a‧‧‧ upper surface

130a‧‧‧發光單元 130a‧‧‧Lighting unit

132‧‧‧基板 132‧‧‧Substrate

134‧‧‧第一型半導體層 134‧‧‧First type semiconductor layer

136‧‧‧發光層 136‧‧‧Lighting layer

138‧‧‧第二型半導體層 138‧‧‧Second type semiconductor layer

L1‧‧‧光束 L1‧‧‧ Beam

L1’‧‧‧光束的一部分 Part of the L1’‧‧‧ beam

N1‧‧‧法向方向 N1‧‧‧ normal direction

α 1‧‧‧夾角 1 1‧‧‧ angle

Claims (10)

一種發光二極體封裝結構，包括：一封裝載體；一導光件，設置於該封裝載體上，該導光件具有一第一表面及一第二表面；一發光單元，適於發出一光束，該發光元件設置在該導光件的該第一表面上；以及一封裝材料層，設置在該封裝載體上並封裝該發光單元及該導光件，該封裝材料層直接自該發光單元取出該光束的一第一部分，以及自該導光件的該第二表面取出該光束的一第二部分。 A light emitting diode package structure comprising: a package carrier; a light guide member disposed on the package carrier, the light guide member having a first surface and a second surface; and an illumination unit adapted to emit a light beam The illuminating element is disposed on the first surface of the light guiding member; and a layer of encapsulating material is disposed on the package carrier and encapsulating the illuminating unit and the light guiding member, and the encapsulating material layer is directly taken out from the illuminating unit a first portion of the beam and a second portion of the beam from the second surface of the light guide. 如申請專利範圍第1項所述的發光二極體封裝結構，更包括一反射層，該導光件配置於該反射層與該發光單元之間。 The light emitting diode package structure of claim 1, further comprising a reflective layer disposed between the reflective layer and the light emitting unit. 如申請專利範圍第1項所述的發光二極體封裝結構，其中該封裝材料層包括一波長轉換層。 The light emitting diode package structure of claim 1, wherein the encapsulating material layer comprises a wavelength conversion layer. 如申請專利範圍第3項所述的發光二極體封裝結構，其中該封裝材料層更包括一封裝膠體，該封裝膠體覆蓋該封裝載體及該波長轉換層。 The light emitting diode package structure of claim 3, wherein the packaging material layer further comprises an encapsulant covering the package carrier and the wavelength conversion layer. 如申請專利範圍第1項所述的發光二極體封裝結構，其中該導光件的該第二表面包括一粗糙表面。 The light emitting diode package structure of claim 1, wherein the second surface of the light guiding member comprises a rough surface. 一種發光二極體封裝結構，包括：一導光件，具有一第一表面及一第二表面；一發光單元，設置在該導光件的該第一表面上，該發光單元 適於發出一光束；以及一封裝材料層，封裝該發光單元及該導光件，其中該光束的至少一部分經由該導光件的該第一表面射入並到達該第二表面，其中該導光件的面積大於該發光單元的面積。 A light emitting diode package structure includes: a light guiding member having a first surface and a second surface; and a light emitting unit disposed on the first surface of the light guiding member, the light emitting unit Suitable for emitting a light beam; and a layer of encapsulating material encapsulating the light emitting unit and the light guiding member, wherein at least a portion of the light beam is incident through the first surface of the light guiding member and reaches the second surface, wherein the guiding The area of the light member is larger than the area of the light emitting unit. 如申請專利範圍第6項所述的發光二極體封裝結構，其中導光件更包括一反射介面，用以將射入該導光件的至少部分該光束反射至該第二表面。 The light emitting diode package structure of claim 6, wherein the light guiding member further comprises a reflective interface for reflecting at least a portion of the light beam incident on the light guiding member to the second surface. 如申請專利範圍第6項所述的發光二極體封裝結構，更包括一波長轉換層，覆蓋該發光單元。 The light emitting diode package structure of claim 6, further comprising a wavelength conversion layer covering the light emitting unit. 如申請專利範圍第6項所述的發光二極體封裝結構，其中該導光件的該第二表面包括一粗糙表面。 The light emitting diode package structure of claim 6, wherein the second surface of the light guiding member comprises a rough surface. 如申請專利範圍第9項所述的發光二極體封裝結構，其中該粗糙表面為一周期性之圖案化表面。The light emitting diode package structure of claim 9, wherein the rough surface is a periodic patterned surface.