TWI570360B - Lighting device - Google Patents
Lighting device Download PDFInfo
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- TWI570360B TWI570360B TW101124195A TW101124195A TWI570360B TW I570360 B TWI570360 B TW I570360B TW 101124195 A TW101124195 A TW 101124195A TW 101124195 A TW101124195 A TW 101124195A TW I570360 B TWI570360 B TW I570360B
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 147
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
本發明係關於一種例如用於液晶顯示器等顯示裝置中之照明裝置。本申請案係以2011年7月5日在日本提出申請之日本專利申請案編號特願2011-149291為基礎而主張優先權,並藉由參照該申請案而引用於本申請案中。
於液晶顯示器中,使用自背後跨及前面而照射液晶面板之背光光源。近年來,隨著液晶顯示器之大型化、薄型化、輕量化、長壽命化等,且,自利用亮滅控制實現之動畫特性改善之觀點出發,於基板上配設複數個發光二極體(LED:Light Emitting Diode)而進行面發光之發光裝置備受注目。於此種發光裝置中,為了出射白光,主要使用如下2種方法。
第1方法係藉由配設分別發出R、G、B之3色光之LED並同時將其等點亮,而使3色光合成從而獲得白光。而且,第2方法係例如藉由含螢光體之樹脂而包圍藍色LED,從而將藍光色轉換成白光。由含螢光體之樹脂來包圍該藍色LED之構造體被稱為“白色LED”。
然而,第1方法中,因需要R、G、B之3色LED,故成本較高。又,於上述第2方法中,因對LED之微小面積灌注螢光體,故當使其含有螢光體時難以無不均地均勻形成。
因此,近年來,作為代替第2方法之第3方法,使用
藉由片材基材來夾入含螢光體之樹脂而成者、或將含螢光體之樹脂加工成片狀之含螢光體之片材,並藉由藍色LED來進行色轉換之方法備受注目(例如,參照專利文獻1、2)。又,亦提出有藉由2片玻璃板而夾入含螢光體之樹脂等的構造(例如,參照專利文獻3)。
如此般使藍色LED與含螢光體之樹脂不接觸地配置之構造被稱為“非接觸式螢光體構造”。又,該“非接觸式螢光體構造”不僅可用作液晶顯示器用背光光源,而且亦可用作照明用光源。於照明用光源之情形時,含螢光體之樹脂不僅可如上所述為平面之片狀,而且亦可具有杯型形狀等立體之形狀。
通常,光源之最大且恆久的課題係提高發光效率。於使用有LED之背光光源或照明用光源之情形時,較理想的是:(1)提高藍色LED元件自身之效率(將電子或電洞轉換成光之量子效率);(2)提高螢光體之發光效率(自LED產生之光之波長轉換效率);(3)使自LED或螢光體放出之光於光源內部之任意部位儘可能無損失,而提高向外部出射之效率。
然後,於藉由含螢光體之樹脂來包圍LED之“白色LED”之情形時,因LED晶片與螢光體相互接觸或接近,故於LED發光時同時放出之熱容易傳遞至螢光體,使得螢光體之溫度上升。若螢光體溫度上升,則螢光體波長轉換效率下降。此現象被稱為“溫度淬滅(temperature quenching)”。圖17中表示Y3AlO12:Ce(YAG)螢光體之螢
光體溫度淬滅之測定資料。
另一方面,於使用上述專利文獻1、2等中所示之第3方法的“非接觸式螢光體構造”之情形時,因LED與含螢光體之樹脂不接觸地配置,故於LED發光時同時放出之熱不易傳遞至螢光體,因而螢光體之溫度不易上升。因此,螢光體波長轉換效率之下降小於“白色LED”。此係“非接觸式螢光體構造”之優點之一。作為先前技術之專利文獻1、2由於可應用此優點,故可謂是非常理想之技術。
[專利文獻1]日本特開2009-283438號公報
[專利文獻2]日本特開2010-171342號公報
[專利文獻3]日本特開2007-23267號公報
然而,專利文獻1~3中記載之所謂“非接觸式螢光體構造”中,將上述(3)中之光向外部出射之效率並不充分。又,“非接觸式螢光體構造”因LED與含螢光體之構造體係相隔,故裝置之薄型化較為困難。
本發明係鑒於如上之實際情況而完成者,其目的在於提供一種可提高將光向外部出射之效率且可薄型化之照明裝置。
為了解決上述課題,本發明之照明裝置具備:由凸型表面形狀之透明樹脂包含藍色發光元件之發光構造體、二維地配置有上述發光構造體之基板、與上述基板相隔地配置且含有自上述藍色發光元件之藍光獲得白光的粉末狀螢光體的螢光體片。
又,本發明之顯示裝置中,上述照明裝置配置於影像顯示面板。
本發明中,藉由透明樹脂之凸型表面形狀,可使因透明樹脂之全反射所致的藍光之光束縛(optical confinement)得到緩和,從而提高將藍光向外部出射之效率。進而,藉由因透明樹脂之凸型表面形狀而實現的光放射分佈之寬廣化、及因含有粉末狀螢光體的螢光體片而產生之光散射效果,而可縮小基板與螢光體片之相隔距離,從而可使所謂“非接觸式螢光體構造”之裝置薄型化。
以下,一面參照圖式一面按照下述順序對本發明之實施形態進行詳細說明。
1.照明裝置之構成例
2.實施例
<1.照明裝置之構成例>
圖1係表示本發明之一實施形態之照明裝置之概略剖面圖。如圖1所示,照明裝置具備:由凸型表面形狀之透明樹脂包含藍色發光元件之發光構造體11、二維地配置有發光構造體11之基板12、使藍色發光元件之藍光擴散之擴散板13、與基板12相隔地配置且含有自藍色發光元件之藍光獲得白光的粉末狀螢光體的螢光體片14、及光學膜15。
基板12與螢光體片14相隔約10~50mm左右而配置,照明裝置構成所謂“非接觸式螢光體構造”。基板12與螢光體片14之間隙係藉由複數個支持柱或反射板來保持,且
以支持柱或反射板於四方包圍基板12與螢光體片14所成之空間的方式設置。
發光構造體11構成具有例如InGaN系之藍色LED(Light Emitting Diode)晶片作為藍色發光元件的所謂“LED封裝”。
圖2係表示發光構造體11之構成例之概略剖面圖。該發光構造體11具備基材111、作為藍色發光元件之藍色LED晶片112、及透明樹脂113。於基材111之端部以透明樹脂113成為凸型表面形狀之方式設置有側壁。
透明樹脂111之凸型剖面為透鏡形狀,且其曲面較佳為滿足如下條件:基材111上之藍色LED晶片112搭載面之寬度之半值(自基材111之中心至內壁之距離)a與曲率半徑r之比r/a為4.0以下,更佳為1.7以下。藉由使r/a為4.0以下,可使因透明樹脂113之全反射所致之藍光之光束縛得到緩和,從而提高將藍光向外部出射之效率。又,因獲得寬廣之光放射分佈,故可使所謂之“非接觸式螢光體構造”薄型化。
又,基材111端部之內壁之高度b為藍色LED晶片112之厚度以上,透明樹脂113之高度d大於內壁之高度b。再者,亦可不形成基材111端部之側壁,但此時,於使用最為普及之透明樹脂形成方法即灌注法之情形時,難以使r/a為1.7以下,必需進行使用模具之透明樹脂成型等方法。
構成照明裝置之基板12由利用有苯酚、環氧、聚醯亞胺、聚酯、雙馬來醯亞胺三嗪、烯丙基化聚苯醚等樹脂之
玻璃布基材構成。於基板12上,以特定間距等間隔地且與螢光體片14之整個面對應地二維配置有發光構造體11。又,亦可視需要對基板12上之發光構造體11之搭載面實施反射處理。
擴散板13係將來自發光構造體11之放射光以無法看到光源之形狀之程度廣範圍地擴散。作為擴散板13,使用總透光率為20%以上、80%以下者。
螢光體片14含有自藍色發光元件之藍光獲得白光的粉末狀螢光體。螢光體之粉末係使用平均粒徑為數μm~數十μm者。藉此,可提高螢光體片14之光散射效應。
圖3A及圖3B係表示螢光體片14之構成例之圖。圖3A所示之螢光體片14中,例如由PET(聚對苯二甲酸乙二酯)等構成之一對透明基材142a、142b夾持著含有螢光體之螢光體層141。又,其等係由密封膜143a、143b自其兩面積層而成。藉此,可進一步防止水分朝螢光體層141侵入。
圖3A所示之單層型之發光體片材14可藉由在透明基材142a上形成螢光體層141並於其上積層另一透明基材142b而製造。而且,藉由利用密封膜143a、143b來夾持螢光體片14並對其整體進行熱壓接,可製造螢光體片14。
又,亦可設為如圖3B所示隔著透明隔片144而針對每個螢光體設置螢光體層141a、141b的構成。藉此,於使用複數個螢光體之情形時,可抑制不欲進行之反應,從而可延長螢光體片之壽命。
螢光體層141係由含有粉末狀螢光體之樹脂組成物成膜而成者。作為螢光體,可使用硫化物系螢光體、氧化物系螢光體或其等之混合系螢光體。
作為硫化物系螢光體,可列舉:藉由藍色激發光之照射而具有波長620~660nm之紅色螢光峰值之硫化物系螢光體,較佳為CaS:Eu、SrS:Eu;或藉由藍色激發光之照射而具有波長530~550nm之綠色螢光峰值之硫化物系螢光體,較佳為SrGa2S4:Eu。再者,於螢光體材料之記載中,「:」之前係表示母體,之後係表示活化劑。
作為氧化物系螢光體,可列舉藉由藍色激發光之照射而發出波長590~620nm之紅色螢光之氧化物系螢光體,較佳為(BaSr)3SiO5:Eu、(BaSr)2SiO4:Eu等。
再者,除硫化物系螢光體及氧化物螢光體以外之其他螢光體亦可以與下述樹脂組成物組合使用,例如可列舉(YGd)2(AlGa)5O12:Ce、賽隆螢光體等。
當於圖3A所示之單層型之發光體片材14中使用上述螢光體之混合物作為螢光體之情形時,為了使螢光體片發出白色光,較佳為使用藉由藍色激發光之照射而發出波長620~660nm之紅色螢光的硫化物系螢光體或藉由藍色激發光之照射而發出波長590~620nm之紅色螢光之氧化物系螢光體、與藉由藍色激發光之照射而發出波長530~550nm之綠色螢光之硫化物系螢光體的混合螢光體。特佳之組合係發出紅色螢光之CaS:Eu或(BaSr)3SiO5:Eu、與發出綠色螢光之SrGa2S4:Eu的混合螢光體。
又,當於圖3B所示之2層型之發光體片材14中使用上述螢光體作為螢光體之情形時,較佳為使用含有藉由藍色激發光之照射而發出波長620~660nm之紅色螢光之硫化物系螢光體或藉由藍色激發光之照射而發出波長590~620nm之紅色螢光之氧化物系螢光體的螢光體層、及含有藉由藍色激發光之照射而發出波長530~550nm之綠色螢光之硫化物系螢光體的螢光體層。特佳之組合係含有發出紅色螢光之CaS:Eu或(BaSr)3SiO5:Eu之螢光體層、及含有發出綠色螢光之SrGa2S4:Eu之螢光體層。
於形成螢光體層之樹脂組成物中,較佳為含有選自聚烯烴共聚物成分及光硬化性(甲基)丙烯酸樹脂成分中之任一樹脂成分。
作為聚烯烴共聚物,可列舉苯乙烯系共聚物或其氫化物。作為此種苯乙烯系共聚物或其氫化物,可較佳地列舉苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物或其氫化物、苯乙烯-乙烯-丙烯嵌段共聚物或其氫化物。其中,就透明性或氣體阻隔性方面而言,可特佳地使用苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物之氫化物。藉由使之含有此種聚烯烴共聚物成分,可獲得優異之耐光性及較低之吸水性。
作為光硬化型丙烯酸酯樹脂成分,可列舉(甲基)丙烯酸胺酯、(甲基)丙烯酸聚酯、(甲基)丙烯酸環氧酯等,其中,就光硬化後之耐熱性之觀點而言,可較佳地使用(甲基)丙烯酸胺酯。藉由使之含有此種光硬化型(甲基)丙烯酸酯樹脂成分,可獲得優異之耐光性及較低之吸水性。
又,作為樹脂成分,於使用聚烯烴共聚物成分之情形時,較佳為使之含有順丁烯二酸酐成分。若使之含有順丁烯二酸酐成分,則藉由順丁烯二酸酐成分之游離之羧基而捕捉侵入至樹脂組成物中之水分,其結果,可防止因水分而引起之螢光體之變質。又,藉由含有聚烯烴共聚物成分及順丁烯二酸酐成分,可提高螢光體片14之光擴射效應。
該(c)順丁烯二酸酐成分可添加(外添)作為與聚烯烴共聚物成分不同之獨立成分,亦可以使之與烯烴共聚物成分接枝聚合之方式添加(內添)。於內添之情形時,成膜用樹脂組成物中含有順丁烯二酸酐改質聚烯烴共聚物。再者,就可進一步抑制成膜用樹脂組成物之黃變之方面而言,與內添相比外添較佳。
又,於樹脂組成物中,可於無損本發明之效果之範圍內,視需要地摻合其他透光性樹脂、著色顏料、溶劑等。
構成照明裝置之光學膜15例如由用以提高液晶顯示裝置之視認性之反射型偏光膜、透鏡膜、擴散膜等構成。此處,透鏡膜係於一面上排列形成有微小透鏡的光學膜,且係用以提高擴散光之正面方向之指向性並提高亮度者。
根據此種構成之照明裝置,可藉由發光構造體11之透明樹脂113之凸型表面形狀,而使因透明樹脂113之全反射所致的藍光之光束縛得到緩和,從而提高將藍光向外部出射之效率。進而,可藉由利用發光構造體11實現的光放射分佈之寬廣化、及利用螢光體片14實現之光散射效應,而縮小基板與螢光體片之相隔距離,從而可使所謂“非接觸
式螢光體構造”之裝置薄型化。又,藉由將本實施形態中之照明裝置配置於例如成為液晶顯示裝置之顯示畫面的液晶面板,可使液晶顯示裝置薄型化。
再者,當然,本發明並非僅限定於上述實施形態,而可於不脫離本發明之主旨之範圍內加以各種更新。例如,於上述實施形態中,雖表示了將照明裝置應用於顯示裝置用背光光源之例,但亦可應用於照明用光源中。於應用在照明用光源中之情形時無需光學膜15,又,含螢光體之樹脂不僅可為平面之片狀,亦可具有杯型形狀等立體之形狀。
[實施例]
<2.實施例>
以下,舉出實施例對本發明進行具體說明。再者,本發明並不限定於該等實施例。
<LED封裝之凸型表面形狀之評價>
使用與圖2所示之發光構造體構造相同的藍色LED封裝及白色LED封裝來評價凸型表面形狀。兩個封裝中,自基材111之中心至內壁之距離a均為2.15mm、內壁之高度b均為0.85mm。使用甲基聚矽氧樹脂作為透明樹脂113,於白色LED封裝中使甲基聚矽氧樹脂含有YAG螢光體。YAG螢光體之含量係以各白色LED封裝之色度大致為(x,y)=(0.338,0.400)之方式進行調整。各LED封裝之凸型表面形狀之評價係使用採用積分球之總光束量測定器來測定總放射量(單位W)作為發光強度。
表1中表示對應於藍色LED封裝之樹脂形狀的相對發
光強度之測定結果。又,表2中表示對應於白色LED封裝之樹脂形狀的相對發光強度之測定結果。樹脂形狀係以接觸於基材上之透明樹脂之寬度之半值a與曲率半徑r之比r/a來表示。相對發光強度係作為與未由透明樹脂包含LED晶片之狀態、即LED晶片露出之狀態下強度對應之相對值而表示。
又,圖4A、圖4B、圖5A、圖5B、圖6A及圖6B中分別表示藍色LED封裝(r/a=∞、2.78、1.46)之XY分佈及角度分佈的放射角度分佈。又,圖7A及圖7B中表示白色LED封裝(r/a=∞)之XY分佈及角度分佈之放射角度分佈。圖4A、圖4B所示之r/a為∞之藍色LED封裝、及圖7A、圖7B所示之r/a為∞之白色LED封裝表示出:於垂直方向(0°)及水平方向(90°)均為大致相同之光度(cd:燭光),且放射角度分佈亦大致相同之展寬。
又,如圖4B、圖5B及圖6B所示,藍色LED封裝中,隨著r/a以∞、2.78、1.46之方式變小,水平方向(90°)之光度變大,放射角度分佈之展寬變大。
又,如表1所示,藍色LED封裝中,r/a越小(透明樹脂越凸起),相對發光強度越提高。例如,r/a為4.0以下之藍色LED封裝之相對發光強度高於r/a為∞之平面(平坦)之藍色LED封裝。又,r/a為1.7以下之藍色LED封裝之相對發光強度為1.2以上。另一方面,如表2所示,白色LED封裝中,r/a越小(透明樹脂越凸起),相對發光強度越減少。
如此,藉由使透明樹脂之表面形狀為凸型,而使自LED
封裝放射之光之展寬擴大、使相對發光強度提高的效果可謂是藍色LED封裝特有之現象。藍色LED封裝中因無透明樹脂內之螢光體之反射,故藉由使透明樹脂之表面形狀為凸型而可提高將光向外部出射之效率。
<LED封裝之構造之評價>
分別製作圖8~圖10所示之實施例、參照例、及比較例之照明裝置,評價照明裝置之明亮度。再者,對於與圖1所示之照明裝置相同之構成附注相同之符號,此處省略說明。
[實施例之照明裝置之構成]
圖8所示之實施例之照明裝置係與圖1同樣地具備:由凸型表面形狀之透明樹脂包含藍色發光元件之發光構造體11、二維地配置有發光構造體11之基板12、使藍色發光元件之藍光擴散之擴散板13、及含有自藍色發光元件之藍光獲得白光的粉末狀螢光體且與基板12相隔地配置之螢光體片14。
使用由r/a為1.46之凸型表面形狀之透明樹脂包含的藍色LED封裝作為發光構造體11。使用甲基聚矽氧樹脂作為透明樹脂。於基板12上以30mm×30mm之間距配置40個(8×5)該藍色LED封裝。作為擴散板13,使用厚度為1.5mm、尺寸為A4、總透光率為65%者。將基板12與擴散板13之距離設為12mm,於擴散板13上配置螢光體片。
螢光體片14係以如下方式作成。首先,藉由將甲苯100質量份、氫化苯乙烯-乙烯-丁烯-苯乙烯嵌段(氫化
SEBS)共聚物(Septon 9527,Kuraray(股份有限公司))40質量份、順丁烯二酸酐0.5質量份均勻地混合,並使平均粒徑6μm之SrGa2S4:Eu(硫化物螢光體)2質量份均勻地分散於所獲得之混合物中,而調整綠色螢光體片形成用樹脂組成物。
使用平均粒徑9μm之CaS:Eu(硫化物螢光體)代替上述平均粒徑6μm之SrGa2S4:Eu(硫化物螢光體),除此以外,進行與上述相同之操作,調整紅色螢光體片形成用樹脂組成物。
其次,於25μm之聚對苯二甲酸乙二酯膜(T11,Toray(股份有限公司))以乾燥厚度為27μm之方式塗佈綠色螢光體片形成用樹脂組成物,且進行乾燥處理(100℃、5分鐘),形成綠色螢光體樹脂層。
接著,於綠色螢光體樹脂層上,積層厚度38μm之透明隔片(聚對苯二甲酸乙二酯膜,A4300,東洋紡(股份有限公司)),於該透明隔片上,以乾燥厚度為27μm之方式塗佈紅色螢光體片形成用樹脂組成物,且進行乾燥處理(100℃、5分鐘),形成紅色螢光體樹脂層。
接著,積層厚度25μm之聚對苯二甲酸乙二酯膜(T11,Toray(股份有限公司)),並進行熱壓接(100℃、0.2MPa),作成相當於圖3B之螢光體片。
[參照例之照明裝置之構成]
圖9所示之參照例之照明裝置中,使用由r/a為∞之平面表面形狀透明樹脂包含的藍色LED封裝作為發光構造
體11,除此以外,設為與圖8所示之實施例之照明裝置相同之構成。
[比較例之照明裝置之構成]
圖10所示之比較例之照明裝置中使用由r/a為∞之平面表面形狀透明樹脂包含的白色LED封裝作為發光構造體11,且未配置螢光體片14,除此以外,設為與圖8所示之實施例之照明裝置相同之構成。於白色LED封裝中,採用使甲基聚矽氧樹脂含有YAG螢光體之透明樹脂。
[裝置構成之亮度評價]
圖11中表示實施例、參照例、及比較例之LED輸入電流-亮度特性。於輸入電流If為75mA時,實施例相對於比較例可使亮度提高26%。又,於輸入電流If為150mA時,實施例相對於比較例可使亮度提高33%。又,實施例相對於使用由平面表面形狀透明樹脂包含之藍色LED封裝之參照例亦可使亮度提高。輸入電流If為150mA時之亮度提高之比率大於75mA時之原因係由於隨著比較例之輸入電流If之增大而產生的因白色LED封裝之發熱所致之發光體效率損失大於相隔地配置有藍色LED封裝與螢光體片的實施例中之“非接觸式螢光體構造”。
<照明裝置之薄型化之評價>
接著,使用圖9所示之參照例之照明裝置、及圖10所示之比較例之照明裝置,對於與基板12與擴散板13之距離相對應的亮斑進行評價。LED係以32mm×32mm之間距配置於基板12上。
圖12A~圖12D及圖13A~圖13D係分別於參照例及比較例之照明裝置中將基板12與擴散板13之距離設為37mm、34mm、29mm、24mm時之影像。
於圖12C所示之基板12與擴散板13之距離為29mm之情形時,亮斑較小,於圖13C所示之基板12與擴散板13之距離為29mm之情形時,亮斑較大。即,可知:使用有藍色LED封裝及螢光體片之照明裝置相較使用有含有螢光體之白色LED封裝之照明裝置,可實現薄型化。
又,圖14及圖15係分別表示參照例之照明裝置配置有螢光體片14之情形時、及未配置螢光體片14之情形時的照明裝置之發光面之相對亮度的曲線。又,圖16係表示參照例之照明裝置配置有螢光體片14之情形時及未配置螢光體片14之情形時的LED圖案之亮斑(%)之曲線。再者,相對亮度係將亮度最亮之部分設為1時之值。又,LED圖案之亮斑(%)係如下式般根據最大強度(Top強度)與最低強度(Bottom強度)而計算。
亮斑(%)=(Top強度-Bottom強度)/平均強度
根據圖14~圖16可知:於將發光面之亮斑設為2%以下之情形時,於未配置螢光體片14之照明裝置中,必需將基板12與擴散板13之距離(光學厚度)設定為34mm以上,但於配置有螢光體片14之照明裝置中,亦可將基板12與擴散板13之距離(光學厚度)設定為24mm,本實施例中之螢光體片之光散射效應較大。
根據以上結果可知:可藉由透明樹脂之凸型表面形
狀,來提高將藍光向外部出射之效率。又,可知:可藉由因透明樹脂之凸型表面形狀而實現的光放射分佈之寬廣化、及因含有粉末狀螢光體之螢光體片而產生之光散射效應,縮小基板與螢光體片之相隔距離,從而可使所謂“非接觸式螢光體構造”之裝置薄型化。
11‧‧‧發光構造體
12‧‧‧基板
13‧‧‧擴散板
14‧‧‧螢光體片
15‧‧‧光學膜
111‧‧‧基材
112‧‧‧LED晶片
113‧‧‧透明樹脂
141‧‧‧螢光體層
141a、141b‧‧‧螢光體層
142‧‧‧透明基材
142a、142b‧‧‧透明基材
143‧‧‧密封膜
143a、143b‧‧‧密封膜
144‧‧‧透明隔片
a‧‧‧透明樹脂之寬度之半值
b‧‧‧高度
d‧‧‧高度
r‧‧‧曲率半徑
圖1係表示本發明之一實施形態之照明裝置之概略剖面圖。
圖2係表示發光構造體之構成例之概略剖面圖。
圖3A係表示單層型之發光體片材螢光體片之構成例之圖,圖3B係表示2層型之發光體片材螢光體片之構成例之圖。
圖4A係表示藍色LED封裝(r/a=∞)之放射角度分佈(XY分佈)之曲線,圖4B係表示藍色LED封裝(r/a=∞)之放射角度分佈(角度分佈)之曲線。
圖5A係表示藍色LED封裝(r/a=2.78)之放射角度分佈(XY分佈)之曲線,圖5B係表示藍色LED封裝(r/a=2.78)之放射角度分佈(角度分佈)之曲線。
圖6A係表示藍色LED封裝(r/a=1.46)之放射角度分佈(XY分佈)之曲線,圖6B係表示藍色LED封裝(r/a=1.46)之放射角度分佈(角度分佈)之曲線。
圖7A係表示白色LED封裝(r/a=∞)之放射角度分佈(XY分佈)之曲線,圖7B係表示白色LED封裝(r/a=∞)之放射角度分佈(角度分佈)之曲線。
圖8係表示實施例之照明裝置之構成之概略剖面圖。
圖9係表示參照例之照明裝置之構成之概略剖面圖。
圖10係表示比較例之照明裝置之構成之概略剖面圖。
圖11係表示LED輸入電流-亮度特性之曲線。
圖12A係於參照例之照明裝置中,將基板與擴散板之距離設為37mm時之影像;圖12B係於參照例之照明裝置中,將基板與擴散板之距離設為34mm時之影像;圖12C係於參照例之照明裝置中,將基板與擴散板之距離設為29mm時之影像;及圖12D係於參照例之照明裝置中,將基板與擴散板之距離設為24mm時之影像。
圖13A係於比較例之照明裝置中,將基板與擴散板之距離設為37mm時之影像;圖13B係於比較例之照明裝置中,將基板與擴散板之距離設為34mm時之影像;圖13C係於比較例之照明裝置中,將基板與擴散板之距離設為29mm時之影像;圖13D係於比較例之照明裝置中,將基板與擴散板之距離設為24mm時之影像。
圖14係表示於參照例之照明裝置配置有螢光體片之情形時的照明裝置之發光面之相對亮度之曲線。
圖15係表示於參照例之照明裝置未配置螢光體片之情形時的照明裝置之發光面之相對亮度之曲線。
圖16係表示於參照例之照明裝置配置有螢光體片之情形及未配置螢光體片之情形時的LED圖案之亮斑(%)之曲線。
圖17係表示Y3AlO12:Ce(YAG)螢光體之螢光體溫度淬
滅之測定資料的曲線。
11‧‧‧發光構造體
12‧‧‧基板
13‧‧‧擴散板
14‧‧‧螢光體片
15‧‧‧光學膜
Claims (7)
- 一種照明裝置,其具備:由凸型表面形狀之透明樹脂包含藍色發光元件之發光構造體、二維地配置有該發光構造體之基板、及與該基板相隔地配置且含有自該藍色發光元件之藍光獲得白光之粉末狀螢光體的螢光體片;且該發光構造體於基材上搭載有該藍色發光元件;接觸於該基材上之透明樹脂之寬度的半值a與曲率半徑r之比r/a為4.0以下。
- 如申請專利範圍第1項之照明裝置,其中,該發光構造體於基材上搭載有該藍色發光元件;接觸於該基材上之透明樹脂之寬度的半值a與曲率半徑r之比r/a為1.7以下。
- 如申請專利範圍第1或2項之照明裝置,其中,該螢光體片具有螢光體層,該螢光體層係由選自由硫化物系螢光體、氧化物系螢光體或其等之混合系螢光體組成之群中之至少1種螢光體、以及含有選自聚烯烴共聚物成分及光硬化性(甲基)丙烯酸樹脂成分中之任一成分之樹脂組成物成膜而成。
- 如申請專利範圍第3項之照明裝置,其中,具有由樹脂組成物成膜而成之螢光體層,該樹脂組成物中,選擇聚烯烴共聚物成分並進一步含有順丁烯二酸酐成分作為該樹脂成分。
- 如申請專利範圍第3項之照明裝置,其中,該螢光體片係由一對透明基材夾持該螢光體層,且藉由密封膜自兩面積層而成。
- 如申請專利範圍第3項之照明裝置,其中,於該基板與該螢光體片之間具備擴散板。
- 一種顯示裝置,其係將申請專利範圍第1至6項中任一項之照明裝置配置於影像顯示面板。
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- 2012-07-05 KR KR1020147001153A patent/KR101955188B1/ko active IP Right Grant
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JP2013016692A (ja) | 2013-01-24 |
EP2731153A4 (en) | 2015-04-01 |
KR20140037935A (ko) | 2014-03-27 |
KR101955188B1 (ko) | 2019-03-08 |
EP2731153B1 (en) | 2018-05-30 |
CN110265533A (zh) | 2019-09-20 |
US20140029238A1 (en) | 2014-01-30 |
TW201305501A (zh) | 2013-02-01 |
JP5373859B2 (ja) | 2013-12-18 |
US10415793B2 (en) | 2019-09-17 |
CN103650184A (zh) | 2014-03-19 |
EP2731153A1 (en) | 2014-05-14 |
CN110265532A (zh) | 2019-09-20 |
WO2013005792A1 (ja) | 2013-01-10 |
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