TWI566306B - A peeling device and a method for manufacturing the electronic component - Google Patents
A peeling device and a method for manufacturing the electronic component Download PDFInfo
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Description
本發明係關於一種將基板與補強板剝離之剝離裝置及電子元件之製造方法。 The present invention relates to a peeling device for peeling a substrate from a reinforcing plate and a method of manufacturing the electronic component.
隨著顯示面板、太陽電池、薄膜二次電池等電子元件之薄型化、輕量化,而期望用於電子元件之基板之薄板化。若基板變薄,則基板之操作性變差,因此難以於基板上形成電子元件用之功能層(例如薄膜電晶體、彩色濾光片)。 In order to reduce the thickness and weight of electronic components such as display panels, solar cells, and thin film secondary batteries, it is desirable to use a thin plate for electronic substrates. When the substrate is thinned, the handleability of the substrate is deteriorated, so that it is difficult to form a functional layer (for example, a thin film transistor or a color filter) for an electronic component on the substrate.
因此,提出有於以補強板補強之基板上形成功能層之後,將基板與補強板剝離之方法(例如參照專利文獻1)。基板與補強板之剝離係於將刀片***於基板之主面與補強板之主面之界面之一端後,以自一端側向另一端側依序剝離界面之方式使基板及補強板中之至少一者彎曲變形而進行。 Therefore, there has been proposed a method of separating a substrate from a reinforcing plate after forming a functional layer on a substrate reinforced with a reinforcing plate (see, for example, Patent Document 1). The peeling of the substrate and the reinforcing plate is performed by inserting the blade into one end of the interface between the main surface of the substrate and the main surface of the reinforcing plate, and sequentially peeling the interface from the one end side to the other end side to at least one of the substrate and the reinforcing plate. One is bent and deformed.
自先前以來,為調整刀片之***位置而使用相機。相機同時拍攝刀片之刃尖之位置與界面之位置,並將拍攝之圖像資料供給至圖像處理部。圖像處理部對自相機供給之圖像資料進行圖像處理,而檢測刀片之刃尖與界面之相對位置。 Since the beginning, the camera has been used to adjust the insertion position of the blade. The camera simultaneously captures the position of the blade tip and the position of the interface, and supplies the captured image data to the image processing section. The image processing unit performs image processing on the image data supplied from the camera, and detects the relative position of the blade edge and the interface.
[專利文獻1]國際公開第2010/090147號 [Patent Document 1] International Publication No. 2010/090147
然而,存在難以直接檢測界面之位置之情形。例如,可列舉於功能層之形成時基板之端面及補強板之端面被塗佈之情形、或補強板中包含之樹脂層於基板之端面露出之情形等界面之位置不清晰之情形。又,於在基板之端面或補強板之端面存在龜裂之情形時,有弄錯界面之位置而檢測之虞。因此,存在刀片之***位置之精度變差之情況。 However, there are cases where it is difficult to directly detect the position of the interface. For example, the position of the interface such as the end surface of the substrate and the end surface of the reinforcing plate when the functional layer is formed, or the case where the resin layer included in the reinforcing plate is exposed on the end surface of the substrate may be unclear. Further, when there is a crack in the end surface of the substrate or the end surface of the reinforcing plate, the position of the interface is mistaken and detected. Therefore, there is a case where the accuracy of the insertion position of the blade is deteriorated.
本發明係鑒於上述問題而完成者,其目的在於提供一種可精度佳地將刀片***於界面之剝離裝置及電子元件之製造方法。 The present invention has been made in view of the above problems, and an object thereof is to provide a peeling device and a method of manufacturing an electronic component which can insert a blade into an interface with high precision.
為解決上述問題,本發明之一態樣之剝離裝置係將基板與貼附於該基板之補強板剝離者,且包括:刀片,其***於上述基板與上述補強板之第1主面之界面;調整部,其係於該刀片之***前,調整相對於上述界面而垂直之方向之上述刀片之刃尖與上述界面之間隔;位置檢測部,其檢測相對於上述界面而垂直之方向之上述刀片之刃尖與上述補強板之與上述第1主面為相反側之第2主面的相對位置;板厚檢測部,其檢測上述補強板之板厚;及調整處理部,其基於上述位置檢測部之檢測結果與上述板厚檢測部之檢測結果而使上述調整部動作。 In order to solve the above problems, a peeling apparatus according to an aspect of the present invention is characterized in that a substrate is peeled off from a reinforcing plate attached to the substrate, and includes a blade inserted into an interface between the substrate and a first main surface of the reinforcing plate. And an adjustment portion that adjusts a distance between a blade edge of the blade and a direction perpendicular to the interface before the insertion of the blade; and a position detecting unit that detects the direction perpendicular to the interface a position of a blade edge of the blade and a second main surface of the reinforcing plate opposite to the first main surface; a plate thickness detecting portion detecting a thickness of the reinforcing plate; and an adjustment processing portion based on the position The detection result of the detection unit and the detection result of the plate thickness detecting unit operate the adjustment unit.
本發明之剝離裝置中,較佳為,上述位置檢測部包括:攝像部,其拍攝上述刀片之刃尖之位置及上述補強板之上述第2主面之位置;圖像處理部,其對藉由該攝像部而拍攝之圖像進行圖像處理;及算出部,其基於該圖像處理部之圖像處理結果而算出上述相對位置。 In the peeling device of the present invention, preferably, the position detecting unit includes: an image capturing unit that captures a position of a blade edge of the blade and a position of the second main surface of the reinforcing plate; and an image processing unit The image captured by the imaging unit performs image processing, and the calculation unit calculates the relative position based on the image processing result of the image processing unit.
上述位置檢測部較佳為進而包括攝像處理部,該攝像處理部係 藉由上述調整部使上述刀片及上述補強板相對於上述攝像部進行相對移動,並藉由上述攝像部分別拍攝上述刀片之刃尖之位置與上述補強板之上述第2主面之位置。 Preferably, the position detecting unit further includes an imaging processing unit that is an imaging processing unit The blade and the reinforcing plate are relatively moved relative to the imaging unit by the adjustment unit, and the position of the blade edge of the blade and the position of the second main surface of the reinforcing plate are respectively captured by the imaging unit.
較佳為,上述位置檢測部進而包括監視部,該監視部係監視上述刀片之刃尖之位置之拍攝時與上述補強板之上述第2主面之位置之拍攝時之間的上述刀片相對於上述攝像部之相對位置之變化、及/或上述補強板相對於上述攝像部之相對位置之變化,上述算出部基於上述監視部之監視結果與上述圖像處理部之圖像處理結果而算出上述相對位置。 Preferably, the position detecting unit further includes a monitoring unit that monitors the blade between the time when the position of the blade edge of the blade is captured and the position of the second main surface of the reinforcing plate relative to The calculation unit calculates the change in the relative position of the imaging unit and/or the change in the relative position of the reinforcing plate with respect to the imaging unit, and the calculation unit calculates the result based on the monitoring result of the monitoring unit and the image processing result of the image processing unit. relative position.
上述剝離裝置較佳為進而包括刀片用光源,該刀片用光源係於上述刀片之刃尖之位置之拍攝時,向上述刀片之刃尖照射光,於上述刀片之刃尖之位置之拍攝時,上述刀片之刃尖配置於上述刀片用光源與上述攝像部之間。 Preferably, the peeling device further includes a light source for the blade, wherein when the light source for the blade is attached to the edge of the blade, the tip of the blade is irradiated with light at a position of the blade edge of the blade. The blade tip of the blade is disposed between the blade light source and the imaging unit.
本發明之剝離裝置中,較佳為,上述補強板具有透光性,上述板厚檢測部藉由分光干涉法檢測上述補強板之板厚。 In the peeling device of the present invention, preferably, the reinforcing plate has light transmissivity, and the plate thickness detecting portion detects a thickness of the reinforcing plate by a spectroscopic interference method.
又,本發明之另一態樣之電子元件之製造方法包括於以補強板補強之基板上形成功能層之步驟、及將形成有上述功能層之上述基板與上述補強板剝離之步驟,且包含於將刀片***於上述基板與上述補強板之第1主面之界面之前調整相對於上述界面而垂直之方向之上述刀片之刃尖與上述界面之間隔之調整步驟,該調整步驟包括:位置檢測步驟,對相對於上述界面而垂直之方向之上述刀片之刃尖與上述補強板之與上述第1主面為相反側之第2主面的相對位置進行檢測;板厚檢測步驟,對上述補強板之板厚進行檢測;及 調整處理步驟,基於上述位置檢測步驟中檢測出之上述相對位置、及上述板厚檢測步驟中檢測出之上述補強板之板厚而調整上述間隔。 Moreover, a method of manufacturing an electronic component according to another aspect of the present invention includes the steps of forming a functional layer on a substrate reinforced by a reinforcing plate, and separating the substrate on which the functional layer is formed from the reinforcing plate, and including And a step of adjusting an interval between the blade edge of the blade and the interface in a direction perpendicular to the interface before inserting the blade into the interface between the substrate and the first main surface of the reinforcing plate, the adjusting step comprising: detecting the position a step of detecting a relative position of a blade edge of the blade perpendicular to the interface and a second principal surface of the reinforcing plate opposite to the first main surface; and a plate thickness detecting step for reinforcing the blade The thickness of the board is tested; and The adjustment processing step adjusts the interval based on the relative position detected in the position detecting step and the thickness of the reinforcing plate detected in the thickness detecting step.
本發明之電子元件之製造方法中,上述位置檢測步驟中,較佳為對藉由拍攝上述刀片之刃尖之位置及上述補強板之上述第2主面之位置之攝像部而拍攝之圖像進行圖像處理,而算出上述相對位置。 In the method of manufacturing an electronic component of the present invention, in the position detecting step, an image captured by an imaging unit that captures a position of a blade edge of the blade and a position of the second main surface of the reinforcing plate is preferable. The image processing is performed to calculate the relative position.
上述位置檢測步驟中,較佳為使上述刀片及上述補強板相對於上述攝像部進行相對移動,並藉由上述攝像部分別拍攝上述刀片之刃尖之位置與上述補強板之上述第2主面之位置。 Preferably, in the position detecting step, the blade and the reinforcing plate are relatively moved with respect to the imaging unit, and the position of the blade edge of the blade and the second main surface of the reinforcing plate are respectively captured by the imaging unit. The location.
上述位置檢測步驟中,較佳為,基於上述刀片之刃尖之位置之拍攝時與上述補強板之上述第2主面之位置之拍攝時之間的上述刀片相對於上述攝像部之相對位置之變化、及/或上述補強板相對於上述攝像部之相對位置之變化、與圖像處理之結果而算出上述相對位置。 In the position detecting step, it is preferable that the relative position of the blade with respect to the imaging portion is between the imaging position of the blade tip and the position of the second main surface of the reinforcing plate. The change and/or the change in the relative position of the reinforcing plate with respect to the imaging unit and the result of the image processing are used to calculate the relative position.
於上述刀片之刃尖之位置之拍攝時,上述刀片之刃尖較佳為配置於向上述刀片之刃尖照射光之刀片用光源與上述攝像部之間。 Preferably, the blade tip of the blade is disposed between the blade light source that emits light toward the blade tip of the blade and the imaging portion at the position of the blade tip.
本發明之電子元件之製造方法中,較佳為,上述補強板具有透光性,上述板厚檢測步驟中,藉由分光干涉法檢測上述補強板之板厚。 In the method of manufacturing an electronic component of the present invention, it is preferable that the reinforcing plate has translucency, and in the step of detecting the thickness, the plate thickness of the reinforcing plate is detected by a spectroscopic interference method.
根據本發明,提供一種可精度佳地將刀片***於界面之剝離裝置及電子元件之製造方法。 According to the present invention, there is provided a peeling device and a method of manufacturing an electronic component which can insert a blade into an interface with high precision.
1‧‧‧積層板 1‧‧‧ laminate
2‧‧‧基板 2‧‧‧Substrate
2A‧‧‧基板 2A‧‧‧Substrate
2B‧‧‧基板 2B‧‧‧Substrate
3‧‧‧補強板 3‧‧‧ reinforcing plate
3A‧‧‧補強板 3A‧‧‧ reinforcing plate
3B‧‧‧補強板 3B‧‧‧ reinforcing plate
3Aa‧‧‧第2主面 3Aa‧‧‧2nd main face
3Ab‧‧‧第1主面 3Ab‧‧‧1st main face
3Ba‧‧‧第1主面 3Ba‧‧‧1st main face
3Bb‧‧‧第2主面 3Bb‧‧‧2nd main face
3AP‧‧‧圖像 3AP‧‧‧ image
3AaP‧‧‧圖像 3AaP‧‧‧ image
3BP‧‧‧圖像 3BP‧‧‧ image
3BbP‧‧‧圖像 3BbP‧‧‧ image
4‧‧‧支撐板 4‧‧‧Support board
4A‧‧‧支撐板 4A‧‧‧Support board
4B‧‧‧支撐板 4B‧‧‧ support plate
5‧‧‧樹脂層 5‧‧‧ resin layer
5A‧‧‧樹脂層 5A‧‧‧ resin layer
5B‧‧‧樹脂層 5B‧‧‧ resin layer
6‧‧‧積層體 6‧‧‧Layer
6a‧‧‧上表面 6a‧‧‧Upper surface
6b‧‧‧下表面 6b‧‧‧lower surface
7‧‧‧液晶層(功能層) 7‧‧‧Liquid layer (functional layer)
8A‧‧‧界面 8A‧‧‧ interface
8B‧‧‧界面 8B‧‧‧ interface
10‧‧‧剝離裝置 10‧‧‧ peeling device
11A‧‧‧可撓性板(支撐體) 11A‧‧‧Flexible board (support)
11B‧‧‧可撓性板(支撐體) 11B‧‧‧Flexible board (support)
11AP‧‧‧圖像 11AP‧‧‧ Images
11BP‧‧‧圖像 11BP‧‧‧ image
12A‧‧‧可動體 12A‧‧‧ movable body
12B‧‧‧可動體 12B‧‧‧ movable body
14A‧‧‧貫通孔 14A‧‧‧through hole
14B‧‧‧貫通孔 14B‧‧‧through hole
15A‧‧‧由攝像部拍攝之部分 15A‧‧‧Photographed by the camera department
15B‧‧‧由攝像部拍攝之部分 15B‧‧‧Photographed by the camera department
15AP‧‧‧圖像 15AP‧‧‧ image
15BP‧‧‧圖像 15BP‧‧‧ image
20‧‧‧刀片 20‧‧‧blade
20a‧‧‧刃尖 20a‧‧‧Edge
20aP‧‧‧圖像 20aP‧‧‧ image
20P‧‧‧圖像 20P‧‧‧ image
30‧‧‧刀片移動部 30‧‧‧ Blade Moving Department
31‧‧‧水平驅動用馬達 31‧‧‧Horizontal drive motor
31a‧‧‧馬達本體部 31a‧‧‧Motor body
31b‧‧‧編碼器部 31b‧‧‧Encoder Division
32‧‧‧鉛直驅動用馬達 32‧‧‧Digital drive motor
32a‧‧‧馬達本體部 32a‧‧‧Motor body
32b‧‧‧編碼器部 32b‧‧‧Encoder Division
33‧‧‧滾珠螺桿 33‧‧‧Rolling screw
34‧‧‧水平可動體 34‧‧‧ horizontal movable body
35‧‧‧馬達支撐構件 35‧‧‧Motor support members
36‧‧‧滾珠螺桿 36‧‧‧Rolling screw
37‧‧‧鉛直可動體 37‧‧‧Vertical movable body
38‧‧‧刀片支撐構件 38‧‧‧ Blade support members
40‧‧‧積層體移動部 40‧‧‧Layered body movement
41‧‧‧積層體用馬達 41‧‧‧Layered motor
41a‧‧‧馬達本體部 41a‧‧‧Motor body
41b‧‧‧編碼器部 41b‧‧‧Encoder Department
42‧‧‧滾珠螺桿 42‧‧‧Ball screw
51‧‧‧攝像部 51‧‧‧Photography Department
52‧‧‧圖像處理部 52‧‧‧Image Processing Department
53‧‧‧刀片用光源 53‧‧‧Light source for blades
54‧‧‧可撓性板用光源(支撐體用光源) 54‧‧‧Light source for flexible board (light source for support)
55‧‧‧半鏡面 55‧‧‧Half mirror
60A‧‧‧板厚檢測部 60A‧‧‧Sheet thickness detection department
60B‧‧‧板厚檢測部 60B‧‧‧Sheet thickness detection department
80‧‧‧控制部 80‧‧‧Control Department
81‧‧‧算出部 81‧‧‧ Calculation Department
82‧‧‧攝像處理部 82‧‧‧Video Processing Department
83‧‧‧監視部 83‧‧‧Monitor
84‧‧‧調整處理部 84‧‧‧Adjustment Processing Department
DA‧‧‧板厚 DA‧‧‧ plate thickness
DB‧‧‧板厚 DB‧‧‧ plate thickness
Fr‧‧‧框架 Fr‧‧ frame
GA‧‧‧距離 GA‧‧‧Distance
GAP‧‧‧距離 GAP‧‧‧ distance
GB‧‧‧距離 GB‧‧‧ distance
GBP‧‧‧距離 GBP‧‧‧Distance
LA‧‧‧距離 LA‧‧‧Distance
LB‧‧‧距離 LB‧‧‧ distance
MA‧‧‧移動距離 MA‧‧‧Moving distance
MB‧‧‧移動距離 MB‧‧‧Moving distance
WA‧‧‧間隔 WA‧‧ ‧ interval
WB‧‧‧間隔 WB‧‧ ‧ interval
圖1係表示用於本發明之一實施形態之電子元件之製造步驟之積層板的剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated board used in a manufacturing step of an electronic component according to an embodiment of the present invention.
圖2係表示於本發明之一實施形態之電子元件之製造步驟之中途 製作之積層體的剖面圖。 Figure 2 is a view showing the middle of the manufacturing steps of the electronic component according to an embodiment of the present invention; A cross-sectional view of the fabricated laminate.
圖3係表示本發明之一實施形態之剝離裝置之要部之剖面圖且為圖4之III-III剖面圖。 Fig. 3 is a cross-sectional view showing a principal part of a peeling apparatus according to an embodiment of the present invention, and is a sectional view taken along line III-III of Fig. 4;
圖4係表示本發明之一實施形態之剝離裝置之要部的平面圖。 Fig. 4 is a plan view showing essential parts of a peeling device according to an embodiment of the present invention.
圖5(a)及5(b)係表示剝離裝置之剝離動作之剖面圖(1)。 5(a) and 5(b) are cross-sectional views (1) showing the peeling operation of the peeling device.
圖6(a)及6(b)係表示剝離裝置之剝離動作之剖面圖(2)。 6(a) and 6(b) are cross-sectional views (2) showing the peeling operation of the peeling device.
圖7(a)及7(b)係表示利用攝像部之拍攝時之剝離裝置之狀態的圖(1)。 7(a) and 7(b) are diagrams (1) showing the state of the peeling device at the time of shooting by the imaging unit.
圖8(a)及8(b)係表示藉由攝像部拍攝之圖像之圖(1)。 8(a) and 8(b) are diagrams (1) showing images taken by the imaging unit.
圖9(a)及9(b)係表示利用攝像部之拍攝時之剝離裝置之狀態的圖(2)。 9(a) and 9(b) are diagrams (2) showing the state of the peeling device at the time of shooting by the imaging unit.
圖10(a)及10(b)係表示藉由攝像部拍攝之圖像之圖(2)。 10(a) and 10(b) are diagrams (2) showing an image taken by the imaging unit.
圖11係表示利用攝像部之拍攝時之剝離裝置之狀態的圖(3)。 Fig. 11 is a view (3) showing a state of the peeling device at the time of shooting by the image pickup unit.
圖12係表示利用攝像部之攝像時之剝離裝置之狀態的圖(4)。 Fig. 12 is a view (4) showing a state of a peeling device at the time of imaging by an imaging unit.
圖13係表示自圖12之狀態進行之剝離裝置之剝離動作的剖面圖。 Fig. 13 is a cross-sectional view showing the peeling operation of the peeling device from the state of Fig. 12.
以下,參照圖式對用以實施本發明之形態進行說明。各圖式中,對於相同或對應之構成標附相同或對應之符號,從而省略說明。 Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or corresponding reference numerals are given to the same or corresponding components, and the description is omitted.
本實施形態之電子元件之製造方法為應對用於電子元件之基板之薄板化,而包括於以補強板補強之基板上形成功能層之步驟及將形成有功能層之基板與補強板剝離之步驟。補強板不成為電子元件之一部分。 The method for manufacturing an electronic component according to the present embodiment is a step of forming a functional layer on a substrate reinforced by a reinforcing plate and a step of peeling off the substrate on which the functional layer is formed and the reinforcing plate in response to thinning of the substrate for the electronic component. . The reinforcing plate does not become part of the electronic component.
此處,所謂電子元件係指顯示面板、太陽電池、薄膜二次電池等電子零件。顯示面板包括液晶面板(LCD)(Liquid Crystal Display,液晶顯示器)、電漿面板(PDP)(Plasma Display Panel,電漿顯示器)、 有機EL(electroluminescence,電致發光)面板(OLED)(Organic Light Emitting Diode,有機發光二極體)。 Here, the electronic component refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. The display panel includes a liquid crystal display (LCD), a plasma display panel (PDP), and a plasma display panel. Organic EL (electroluminescence) panel (OLED) (Organic Light Emitting Diode).
圖1係表示用於本發明之一實施形態之電子元件之製造步驟之積層板的剖面圖。積層板1包括基板2及補強基板2之補強板3。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated board used in a manufacturing step of an electronic component according to an embodiment of the present invention. The laminated board 1 includes a substrate 2 and a reinforcing plate 3 of the reinforcing substrate 2.
於基板2上於電子元件之製造步驟之中途形成特定之功能層(例如導電層)。 A specific functional layer (for example, a conductive layer) is formed on the substrate 2 in the middle of the manufacturing process of the electronic component.
基板2例如為玻璃基板、陶瓷基板、樹脂基板、金屬基板或半導體基板等。其等中,玻璃基板之耐化學品性、耐透濕性優異,且線膨脹係數較小,故而較佳。線膨脹係數越小,高溫下形成之功能層之圖案於冷卻時越不易偏移。 The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. The smaller the coefficient of linear expansion, the less the pattern of the functional layer formed at a high temperature is less likely to shift upon cooling.
作為玻璃基板之玻璃,並無特別限定,可列舉例如無鹼玻璃、硼矽酸玻璃、鹼石灰玻璃、高矽玻璃、其他之以氧化矽為主要成分之氧化物系玻璃等。作為氧化物系玻璃,較佳為利用氧化物換算而得之氧化矽之含量為40~90質量%之玻璃。 The glass of the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda lime glass, sorghum glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.
作為玻璃基板之玻璃,較佳為採用適合電子元件之種類或其製造步驟之玻璃。例如,液晶面板用之玻璃基板較佳為包含實質上不含有鹼金屬成分之玻璃(無鹼玻璃)。如此,玻璃基板之玻璃基於適用之電子元件之種類及其製造步驟而適當選擇。 As the glass of the glass substrate, it is preferable to use a glass suitable for the kind of the electronic component or the manufacturing step thereof. For example, the glass substrate for a liquid crystal panel preferably contains glass (alkali-free glass) which does not substantially contain an alkali metal component. As such, the glass of the glass substrate is appropriately selected based on the type of electronic component to be used and the manufacturing steps thereof.
樹脂基板之樹脂可為結晶性樹脂,亦可為非晶性樹脂,並無特別限定。 The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.
作為結晶性樹脂,可列舉例如作為熱塑性樹脂之聚醯胺、聚縮醛、聚對苯二甲酸丁二酯、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯或間規聚苯乙烯等,熱硬化性樹脂中可列舉聚苯硫醚、聚醚醚酮、液晶聚合物、氟樹脂或聚醚腈等。 The crystalline resin may, for example, be a polyamide resin, a polyacetal, a polybutylene terephthalate, a polyethylene terephthalate, a polyethylene naphthalate or a syndiotactic polyphenylene as a thermoplastic resin. Examples of the thermosetting resin such as ethylene include polyphenylene sulfide, polyether ether ketone, liquid crystal polymer, fluororesin or polyether nitrile.
作為非晶性樹脂,可列舉例如作為熱塑性樹脂之聚碳酸酯、改性聚苯醚、聚環己烯或聚降烯系樹脂等,熱硬化性樹脂中可列舉聚碸、聚醚碸、聚芳酯、聚醯胺醯亞胺、聚醚醯亞胺或熱塑性聚醯亞胺。 Examples of the amorphous resin include polycarbonate, modified polyphenylene ether, polycyclohexene or polycondensation as a thermoplastic resin. Examples of the thermosetting resin include an olefin resin, a polyether oxime, a polyarylate, a polyamidoximine, a polyether quinone, or a thermoplastic polyimide.
作為樹脂基板之樹脂,特佳為非晶性且熱塑性之樹脂。 As the resin of the resin substrate, a resin which is amorphous and thermoplastic is particularly preferable.
基板2之厚度係根據基板2之種類而設定。例如,於玻璃基板之情形時,為了電子元件之輕量化、薄板化,較佳為0.7 mm以下,更佳為0.3 mm以下,進而佳為0.1 mm以下。於0.3 mm以下之情形時,可對玻璃基板賦予良好之撓性。於0.1 mm以下之情形時,可將玻璃基板捲取為捲筒狀。又,就容易進行玻璃基板之製造、容易進行玻璃基板之操作等理由而言,玻璃基板之厚度較佳為0.03 mm以上。 The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, in order to reduce the weight and thickness of the electronic component, it is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less. When it is 0.3 mm or less, good flexibility can be imparted to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. Moreover, the thickness of the glass substrate is preferably 0.03 mm or more for the reason that the production of the glass substrate is easy and the operation of the glass substrate is easy.
補強板3若密接於基板2,則於進行剝離操作之前補強基板2。補強板3係於功能層之形成後,於電子元件之製造步驟之中途自基板2剝離,不成為電子元件之一部分。 When the reinforcing plate 3 is in close contact with the substrate 2, the substrate 2 is reinforced before the peeling operation. After the formation of the functional layer, the reinforcing plate 3 is peeled off from the substrate 2 in the middle of the manufacturing process of the electronic component, and does not become a part of the electronic component.
補強板3為抑制因溫度變化所致之翹曲或剝離,較佳為與基板2之線膨脹係數差之絕對值較小者。於基板2為玻璃基板之情形時,補強板3較佳為包含玻璃板者。該玻璃板之玻璃較佳為與玻璃基板之玻璃為相同種類。 The reinforcing plate 3 is for suppressing warpage or peeling due to temperature change, and is preferably one in which the absolute value of the difference in linear expansion coefficient from the substrate 2 is small. In the case where the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of the glass plate is preferably of the same type as the glass of the glass substrate.
補強板3包括支撐板4及形成於支撐板4上之樹脂層5。藉由作用於樹脂層5與基板2之間之凡得瓦力等,而使樹脂層5與基板2可剝離地結合。 The reinforcing plate 3 includes a support plate 4 and a resin layer 5 formed on the support plate 4. The resin layer 5 and the substrate 2 are detachably bonded by acting on the van der Waals force or the like between the resin layer 5 and the substrate 2.
再者,本實施形態之補強板3可包含支撐板4及樹脂層5,亦可僅由支撐板4構成。藉由作用於支撐板4與基板2之間之凡得瓦力等,使支撐板4與基板2可剝離地結合。為了使作為支撐板4之玻璃板與作為基板2之玻璃基板不於高溫下接著,亦可於支撐板4之表面形成無機薄 膜。又,亦可藉由於支撐板4之表面設置表面粗糙度不同之區域等,而於支撐板4與基板2之界面設置結合力不同之區域。 Further, the reinforcing plate 3 of the present embodiment may include the support plate 4 and the resin layer 5, or may be constituted only by the support plate 4. The support plate 4 and the substrate 2 are releasably joined by acting on the van der Waals force or the like between the support plate 4 and the substrate 2. In order to prevent the glass plate as the support plate 4 from being adhered to the glass substrate as the substrate 2 at a high temperature, an inorganic thin film may be formed on the surface of the support plate 4. membrane. Further, by providing a region having a different surface roughness or the like on the surface of the support plate 4, a region having a different bonding force may be provided at the interface between the support plate 4 and the substrate 2.
又,本實施形態之補強板3包括支撐板4及樹脂層5,支撐板4亦可為複數個。同樣地,樹脂層5亦可為複數層。 Further, the reinforcing plate 3 of the present embodiment includes the support plate 4 and the resin layer 5, and the support plate 4 may be plural. Similarly, the resin layer 5 may also be a plurality of layers.
支撐板4係經由樹脂層5而支撐並補強基板2。支撐板4係防止電子元件之製造步驟中之基板2之變形、擦傷、破損等。 The support plate 4 supports and reinforces the substrate 2 via the resin layer 5 . The support plate 4 prevents deformation, scratches, breakage, and the like of the substrate 2 in the manufacturing steps of the electronic component.
支撐板4例如可為玻璃板、陶瓷板、樹脂板、半導體板或金屬板等。支撐板4之種類係根據電子元件之種類或基板2之種類等而選定。若支撐板4與基板2為相同種類,則因溫度變化所致之翹曲或剝離得以降低。 The support plate 4 may be, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, a metal plate, or the like. The type of the support plate 4 is selected depending on the type of the electronic component, the type of the substrate 2, and the like. If the support plate 4 and the substrate 2 are of the same kind, warping or peeling due to temperature change is reduced.
支撐板4與基板2之平均線膨脹係數之差(絕對值)係根據基板2之尺寸形狀等而適當設定,較佳為例如35×10-7/℃以下。此處,所謂「平均線膨脹係數」,係指50~300℃之溫度範圍下之平均線膨脹係數(JIS R 3102:1995)。 The difference (absolute value) between the average linear expansion coefficients of the support plate 4 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, and is preferably, for example, 35 × 10 -7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R 3102: 1995).
支撐板4之厚度例如為0.7 mm以下。又,為補強基板2,支撐板4之厚度較佳為0.4 mm以上。支撐板4之厚度可厚於基板2,亦可薄於基板2。 The thickness of the support plate 4 is, for example, 0.7 mm or less. Further, in order to reinforce the substrate 2, the thickness of the support plate 4 is preferably 0.4 mm or more. The thickness of the support plate 4 may be thicker than the substrate 2 or thinner than the substrate 2.
支撐板4之外形尺寸較佳為以支撐板4可支撐樹脂層5之整體之方式,如圖1所示般與樹脂層5之外形尺寸相同或大於樹脂層5之外形尺寸。 The outer shape of the support plate 4 is preferably such that the support plate 4 can support the entirety of the resin layer 5, as shown in FIG. 1, with the outer shape of the resin layer 5 being the same size or larger than the outer shape of the resin layer 5.
樹脂層5若密接於基板2,則於進行剝離操作之前可防止基板2之位置偏移。樹脂層5藉由剝離操作而容易地自基板2剝離。藉由容易地剝離基板2,可防止基板2之破損,又,可防止於意料外之位置(樹脂層5與支撐板4之間)之剝離。 When the resin layer 5 is in close contact with the substrate 2, the positional deviation of the substrate 2 can be prevented before the peeling operation. The resin layer 5 is easily peeled off from the substrate 2 by a peeling operation. By easily peeling off the substrate 2, damage of the substrate 2 can be prevented, and peeling of the unexpected position (between the resin layer 5 and the support plate 4) can be prevented.
樹脂層5係以與支撐板4之結合力較與基板2之結合力相對變高之方式形成。藉此,於進行剝離操作時,可防止積層板1於意料外之位置(樹脂層5與支撐板4之間)剝離。 The resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2. Thereby, it is possible to prevent the laminated board 1 from being peeled off at an unexpected position (between the resin layer 5 and the support plate 4) at the time of performing the peeling operation.
樹脂層5之樹脂並無特別限定。例如,作為樹脂層5之樹脂,可列舉丙烯酸系樹脂、聚烯烴樹脂、聚胺基甲酸酯樹脂、聚醯亞胺樹脂、聚矽氧樹脂、聚醯亞胺聚矽氧樹脂等。亦可混合幾種樹脂而使用。其中,就耐熱性或剝離性之觀點而言,較佳為聚矽氧樹脂、聚醯亞胺聚矽氧樹脂。 The resin of the resin layer 5 is not particularly limited. For example, examples of the resin of the resin layer 5 include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxyn resin, and a polyimide resin. It can also be used by mixing several resins. Among them, from the viewpoint of heat resistance or peelability, a polydecene oxide resin or a polyamidene polyimide resin is preferable.
樹脂層5之厚度並無特別限定,較佳為1~50 μm,更佳為4~20 μm。藉由將樹脂層5之厚度設為1 μm以上,於在樹脂層5與基板2之間混入有氣泡或異物之情形時,樹脂層5可以吸收氣泡或異物之厚度之方式變形。另一方面,若樹脂層5之厚度為50 μm以下,則可縮短樹脂層5之形成時間,進而不會多餘地使用樹脂層5之樹脂,因此較為經濟。 The thickness of the resin layer 5 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 5 is 1 μm or more, when a bubble or a foreign matter is mixed between the resin layer 5 and the substrate 2, the resin layer 5 can be deformed so as to absorb the thickness of bubbles or foreign matter. On the other hand, when the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 is not excessively used, which is economical.
樹脂層5之外形尺寸較佳為以樹脂層5可密接基板2之整體之方式,如圖1所示般與基板2之外形尺寸相同或大於基板2之外形尺寸。 The outer shape of the resin layer 5 is preferably such that the resin layer 5 can be closely adhered to the entirety of the substrate 2, and the outer shape of the substrate 2 is the same as or larger than the outer shape of the substrate 2 as shown in FIG.
再者,樹脂層5亦可包含2層以上。於此情形時,「樹脂層之厚度」係指所有樹脂層之合計之厚度。 Further, the resin layer 5 may also contain two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all the resin layers.
又,於樹脂層5包含2層以上之情形時,形成各層之樹脂之種類亦可不同。 Moreover, when the resin layer 5 contains two or more layers, the kind of the resin which forms each layer may differ.
圖2係表示於本發明之一實施形態之電子元件之製造步驟之中途製作之積層體的剖面圖。 Fig. 2 is a cross-sectional view showing a laminate produced in the middle of the manufacturing process of the electronic component according to the embodiment of the present invention.
積層體6係於積層板1之基板2上形成導電層等功能層而成。功能層之種類係根據電子元件之種類而選擇。複數層功能層亦可依序積層於基板2上。作為功能層之形成方法,可使用一般之方法,例如可使 用CVD(Chemical Vapor Deposition,化學氣相沈積)法或PVD(Physical Vapor Deposition,物理氣相沈積)法等蒸鍍法、濺鍍法等。功能層係以光微影法或蝕刻法形成為特定之圖案。 The laminated body 6 is formed by forming a functional layer such as a conductive layer on the substrate 2 of the laminated board 1. The type of functional layer is selected according to the type of electronic component. The plurality of functional layers may also be sequentially laminated on the substrate 2. As a method of forming the functional layer, a general method can be used, for example, A vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method, a sputtering method, or the like is used. The functional layer is formed into a specific pattern by photolithography or etching.
例如,積層體6依序包括補強板3A、基板2A、液晶層7、基板2B及補強板3B。該積層體6係於LCD之製造步驟之中途製作者。於一基板2A上之液晶層7側之面形成有未圖示之薄膜電晶體(TFT,Thin Film Transistor),於另一基板2B上之液晶層7側之面形成有未圖示之彩色濾光片(CF,Color Filter)。 For example, the laminated body 6 includes the reinforcing plate 3A, the substrate 2A, the liquid crystal layer 7, the substrate 2B, and the reinforcing plate 3B in this order. This laminated body 6 is produced by a maker in the middle of the manufacturing process of an LCD. A thin film transistor (TFT) (not shown) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, and a color filter (not shown) is formed on the surface of the other substrate 2B on the liquid crystal layer 7 side. Light film (CF, Color Filter).
於剝離補強板3A、3B之後,安裝偏光板、背光源等,獲得作為製品之LCD。於補強板3A、3B之剝離中使用下述之剝離裝置。 After the reinforcing plates 3A and 3B are peeled off, a polarizing plate, a backlight, and the like are mounted to obtain an LCD as a product. The following peeling device was used for the peeling of the reinforcing plates 3A and 3B.
再者,本實施形態中,補強板3A、3B之剝離係於液晶層7之形成後進行,亦可於TFT或CF之形成後、且液晶層7之形成前進行。 Further, in the present embodiment, the peeling of the reinforcing plates 3A and 3B is performed after the formation of the liquid crystal layer 7, and may be performed after the formation of the TFT or CF and before the formation of the liquid crystal layer 7.
圖3係表示本發明之一實施形態之剝離裝置之要部的剖面圖且為圖4之III-III剖面圖。圖4係表示本發明之一實施形態之剝離裝置之要部的平面圖。圖5及圖6係表示剝離裝置之剝離動作之剖面圖。圖5(a)係表示將刀片***於基板2A與補強板3A之界面8A之狀態,圖5(b)係表示使基板2A及補強板3A相互向相反方向彎曲變形之狀態。圖6(a)係表示將刀片***於基板2B與補強板3B之界面8B之狀態,圖6(b)係表示使基板2B及補強板3B相互向相反方向彎曲變形之狀態。 Fig. 3 is a cross-sectional view showing a principal part of a peeling apparatus according to an embodiment of the present invention, and is a sectional view taken along line III-III of Fig. 4; Fig. 4 is a plan view showing essential parts of a peeling device according to an embodiment of the present invention. 5 and 6 are cross-sectional views showing the peeling operation of the peeling device. Fig. 5(a) shows a state in which the blade is inserted into the interface 8A between the substrate 2A and the reinforcing plate 3A, and Fig. 5(b) shows a state in which the substrate 2A and the reinforcing plate 3A are bent and deformed in opposite directions. Fig. 6(a) shows a state in which the blade is inserted into the interface 8B between the substrate 2B and the reinforcing plate 3B, and Fig. 6(b) shows a state in which the substrate 2B and the reinforcing plate 3B are bent and deformed in opposite directions.
剝離裝置10如圖5(a)所示般,將刀片20***於基板2A與補強板3A之下表面(第1主面)3Ab之界面8A之一端。其後,剝離裝置10如圖5(b)所示般,以自一端側朝向另一端側依序剝離界面8A之方式,使基板2A及補強板3A中之至少一者(圖中為兩者)彎曲變形。 As shown in Fig. 5 (a), the peeling device 10 inserts the blade 20 at one end of the interface 8A between the substrate 2A and the lower surface (first main surface) 3Ab of the reinforcing plate 3A. Then, as shown in FIG. 5( b ), the peeling device 10 causes at least one of the substrate 2A and the reinforcing plate 3A so as to sequentially peel the interface 8A from the one end side toward the other end side (both in the figure) ) Bending deformation.
又,剝離裝置10如圖6(a)所示般,將刀片20***於基板2B與補強板3B之上表面(第1主面)3Ba之界面8B之一端。其後,剝離裝置10如圖 6(b)所示般,以自一端側朝向另一端側依序剝離界面8B之方式,使基板2B及補強板3B中之至少一者(圖中為兩者)彎曲變形。 Further, as shown in FIG. 6(a), the peeling device 10 inserts the blade 20 at one end of the interface 8B of the upper surface (first main surface) 3Ba of the substrate 2B and the reinforcing plate 3B. Thereafter, the stripping device 10 is as shown As shown in FIG. 6(b), at least one of the substrate 2B and the reinforcing plate 3B (both in the drawing) is bent and deformed so that the interface 8B is sequentially peeled from the one end side toward the other end side.
剝離裝置10亦可包含如下噴嘴,該噴嘴係於將刀片20***於界面8A、8B時,朝向刀片20之***位置噴射流體(例如壓縮空氣)。刀片20之***位置可如圖4所示般為積層體6之角部。 The stripping device 10 can also include a nozzle that ejects fluid (e.g., compressed air) toward the insertion position of the blade 20 when the blade 20 is inserted into the interfaces 8A, 8B. The insertion position of the blade 20 can be the corner portion of the laminated body 6 as shown in FIG.
如此,剝離裝置10自積層體6剝離補強板3A、3B。再者,本實施形態中,於自積層體6剝離上側之補強板3A後剝離下側之補強板3B,亦可於剝離下側之補強板3B後剝離上側之補強板3A。以下,對剝離裝置10之各構成進行說明。 In this manner, the peeling device 10 peels the reinforcing plates 3A and 3B from the laminated body 6. In the present embodiment, after the reinforcing plate 3A on the upper side is peeled off from the laminated body 6, the reinforcing plate 3B on the lower side is peeled off, and the reinforcing plate 3A on the lower side may be peeled off after the reinforcing plate 3B on the lower side is peeled off. Hereinafter, each configuration of the peeling device 10 will be described.
如圖3所示,剝離裝置10包括:可撓性板11B,其支撐積層體6之下表面(第1主面)6b;可撓性板11A,其支撐積層體6之上表面(第2主面)6a;複數個可動體12A、12B,其等固定於可撓性板11A、11B上;及刀片20。 As shown in FIG. 3, the peeling device 10 includes a flexible plate 11B that supports the lower surface (first main surface) 6b of the laminated body 6, and a flexible plate 11A that supports the upper surface of the laminated body 6 (second The main surface 6a; the plurality of movable bodies 12A, 12B, which are fixed to the flexible plates 11A, 11B; and the blade 20.
可撓性板11A、11B真空吸附積層體6。再者,亦可取代真空吸附而為靜電吸附或磁吸附。於可撓性板11A、11B上固定有複數個可動體12A、12B。 The flexible sheets 11A and 11B vacuum-adsorb the laminated body 6. Further, it may be electrostatic adsorption or magnetic adsorption instead of vacuum adsorption. A plurality of movable bodies 12A and 12B are fixed to the flexible boards 11A and 11B.
複數個可動體12A、12B係如圖4所示般隔開間隔而二維地配置,且可相對於框架Fr移動地構成。複數個可動體12A、12B藉由馬達等驅動。藉由使複數個可動體12A、12B以特定之順序移動,可撓性板11A11B彎曲變形。 The plurality of movable bodies 12A and 12B are two-dimensionally arranged at intervals as shown in FIG. 4, and are configured to be movable with respect to the frame Fr. The plurality of movable bodies 12A, 12B are driven by a motor or the like. The flexible plate 11A11B is bent and deformed by moving the plurality of movable bodies 12A and 12B in a specific order.
刀片20係以於***於基板2A、2B與補強板3A、3B之界面8A、8B時彈性變形之方式,具有例如50~600 μm之厚度。刀片20之刃尖20a相對於界面8A、8B平行地配置,例如水平地配置。 The blade 20 has a thickness of, for example, 50 to 600 μm so as to be elastically deformed when inserted into the interfaces 8A and 8B of the substrates 2A and 2B and the reinforcing plates 3A and 3B. The blade tip 20a of the blade 20 is disposed in parallel with respect to the interfaces 8A, 8B, for example, horizontally.
剝離裝置10為使刀片20相對於以可撓性板11A、11B支撐之積層體6進行相對移動,如圖3所示,進而包括刀片移動部30及積層體移動部40。 The peeling device 10 relatively moves the blade 20 with respect to the laminated body 6 supported by the flexible plates 11A and 11B, and further includes a blade moving portion 30 and a laminated body moving portion 40 as shown in Fig. 3 .
刀片移動部30包括:水平驅動用馬達31,其使刀片20相對於框架Fr於水平方向移動;及鉛直驅動用馬達32,其使刀片20相對於框架Fr於鉛直方向移動。 The blade moving portion 30 includes a horizontal drive motor 31 that moves the blade 20 in the horizontal direction with respect to the frame Fr, and a vertical drive motor 32 that moves the blade 20 in the vertical direction with respect to the frame Fr.
水平驅動用馬達31可為伺服馬達,包括可正反旋轉之馬達本體部31a、及檢測馬達本體部31a之旋轉量及旋轉方向之編碼器部31b等。馬達本體部31a係經由將馬達本體部31a之旋轉運動轉換為直線運動之滾珠螺桿33,而與水平可動體34連結。若馬達本體部31a旋轉,則水平可動體34於水平方向移動。馬達本體部31a係以水平可動體34之位置成為目標位置之方式,基於編碼器部31b之檢測結果而進行反饋控制。 The horizontal drive motor 31 may be a servo motor, and includes a motor main body portion 31a that can rotate forward and backward, an encoder portion 31b that detects a rotation amount and a rotation direction of the motor main portion 31a, and the like. The motor main body portion 31a is coupled to the horizontal movable body 34 via a ball screw 33 that converts the rotational motion of the motor main portion 31a into a linear motion. When the motor main body portion 31a rotates, the horizontal movable body 34 moves in the horizontal direction. The motor main body portion 31a performs feedback control based on the detection result of the encoder portion 31b so that the position of the horizontal movable body 34 becomes the target position.
鉛直驅動用馬達32係以固定於水平可動體34之馬達支撐構件35支撐。鉛直驅動用馬達32可為伺服馬達,包括可正反旋轉之馬達本體部32a、及檢測馬達本體部32a之旋轉量及旋轉方向之編碼器部32b等。馬達本體部32a係經由將馬達本體部32a之旋轉運動轉換為直線運動之滾珠螺桿36,而與鉛直可動體37連結。若馬達本體部32a旋轉,則鉛直可動體37於鉛直方向移動。馬達本體部32a係以鉛直可動體37之位置成為目標位置之方式,基於編碼器部32b之檢測結果而進行反饋控制。 The vertical drive motor 32 is supported by a motor support member 35 that is fixed to the horizontal movable body 34. The vertical drive motor 32 may be a servo motor, and includes a motor main body portion 32a that can rotate forward and backward, and an encoder portion 32b that detects the amount of rotation and the direction of rotation of the motor main portion 32a. The motor main body portion 32a is coupled to the vertical movable body 37 via a ball screw 36 that converts the rotational motion of the motor main portion 32a into a linear motion. When the motor main body portion 32a rotates, the vertical movable body 37 moves in the vertical direction. The motor main body portion 32a performs feedback control based on the detection result of the encoder portion 32b so that the position of the vertical movable body 37 becomes the target position.
鉛直可動體37支撐刀片支撐構件38。刀片支撐構件38係支撐刀片20之構件,且以螺栓等緊固於鉛直可動體37。 The vertical movable body 37 supports the blade support member 38. The blade supporting member 38 supports the member of the blade 20 and is fastened to the vertical movable body 37 with a bolt or the like.
積層體移動部40包括使以可撓性板11A、11B支撐之積層體6相對於框架Fr於鉛直方向移動之積層體用馬達41。積層體用馬達41可為伺服馬達,包括可正反旋轉之馬達本體部41a、及檢測馬達本體部41a之旋轉量及旋轉方向之編碼器部41b等。馬達本體部41a係經由將馬達本體部41a之旋轉運動轉換為直線運動之滾珠螺桿42及可動體12B,而與可撓性板11B連結。若馬達本體部41a旋轉,則以可撓性板11A、11B 支撐之積層體6於鉛直方向移動。馬達本體部41a係以積層體6之位置成為目標位置之方式,基於編碼器部41b之檢測結果而進行反饋控制。 The laminated body moving unit 40 includes a laminated body motor 41 that moves the laminated body 6 supported by the flexible plates 11A and 11B in the vertical direction with respect to the frame Fr. The laminated body motor 41 can be a servo motor, and includes a motor main body portion 41a that can rotate forward and backward, and an encoder portion 41b that detects the amount of rotation and the direction of rotation of the motor main portion 41a. The motor main body portion 41a is coupled to the flexible plate 11B via the ball screw 42 and the movable body 12B that convert the rotational motion of the motor main body portion 41a into a linear motion. If the motor body portion 41a is rotated, the flexible plates 11A, 11B are used. The laminated body 6 of the support moves in the vertical direction. The motor main body portion 41a performs feedback control based on the detection result of the encoder portion 41b so that the position of the laminated body 6 becomes the target position.
藉由刀片移動部30及積層體移動部40構成調整刀片20之***位置之調整部。調整部係於刀片20之***前,調整相對於界面8A、8B而垂直之方向(例如鉛直方向)上之刀片20之刃尖20a與界面8A、8B之間隔WA、WB(參照圖3、圖9(b))。界面8A係基板2A與補強板3A之下表面(第1主面)3Ab之分界面。界面8B係基板2B與補強板3B之上表面(第1主面)3Ba之分界面。 The blade moving portion 30 and the laminated body moving portion 40 constitute an adjusting portion for adjusting the insertion position of the blade 20. The adjustment portion adjusts the intervals WA, WB between the blade edge 20a of the blade 20 and the interfaces 8A, 8B in the direction perpendicular to the interfaces 8A, 8B (for example, the vertical direction) before the insertion of the blade 20 (refer to FIG. 3, FIG. 9(b)). The interface between the interface 8A-based substrate 2A and the lower surface (first main surface) 3Ab of the reinforcing plate 3A. The interface between the interface 8B-based substrate 2B and the upper surface (first main surface) 3Ba of the reinforcing plate 3B.
如圖3所示,刀片20之刃尖20a與界面8A之間隔WA係根據補強板3A之上表面(第2主面)3Aa相對於刀片20之刃尖20a之相對位置(距離LA及上下關係)、及補強板3A之板厚DA而算出。同樣地,如圖9(b)所示,刀片20之刃尖20a與界面8B之間隔WB係根據補強板3B之下表面(第2主面)3Bb相對於刀片20之刃尖20a之相對位置(距離LB及上下關係)、及補強板3B之板厚DB而算出。 As shown in FIG. 3, the distance WA between the blade edge 20a of the blade 20 and the interface 8A is based on the relative position (distance LA and the upper and lower relationship) of the upper surface (second main surface) 3Aa of the reinforcing plate 3A with respect to the blade tip 20a of the blade 20. ) and the plate thickness DA of the reinforcing plate 3A is calculated. Similarly, as shown in Fig. 9(b), the interval WB between the blade edge 20a of the blade 20 and the interface 8B is based on the relative position of the lower surface (second main surface) 3Bb of the reinforcing plate 3B with respect to the blade tip 20a of the blade 20. (The distance LB and the vertical relationship) and the plate thickness DB of the reinforcing plate 3B are calculated.
剝離裝置10為檢測補強板3A、3B之第2主面3Aa、3Bb相對於刀片20之刃尖20a之相對位置(距離LA、距離LB等),進而包括攝像部51、圖像處理部52、刀片用光源53及可撓性板用光源54。 The peeling device 10 detects the relative positions (distance LA, distance LB, and the like) of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B with respect to the blade tip 20a of the blade 20, and further includes an imaging unit 51 and an image processing unit 52. The blade light source 53 and the flexible plate light source 54.
攝像部51包括CCD(Charge Coupled Device,電荷耦合器件)相機或CMOS(Complementary Metal Oxide Semiconductor,互補金屬氧半導體)相機等相機。攝像部51相對於框架Fr而固定。攝像部51拍攝刀片20之刃尖20a之位置及補強板3A、3B之第2主面3Aa、3Bb之位置,並將所拍攝之圖像資料供給至圖像處理部52。攝像部51可分別拍攝刀片20之刃尖20a之位置與補強板3A、3B之第2主面3Aa、3Bb之位置。從而利用圖像處理之位置檢測之精度提高。 The imaging unit 51 includes a camera such as a CCD (Charge Coupled Device) camera or a CMOS (Complementary Metal Oxide Semiconductor) camera. The imaging unit 51 is fixed to the frame Fr. The imaging unit 51 captures the position of the blade edge 20a of the blade 20 and the positions of the second principal faces 3Aa and 3Bb of the reinforcing plates 3A and 3B, and supplies the captured image data to the image processing unit 52. The imaging unit 51 can image the position of the blade edge 20a of the blade 20 and the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B, respectively. Thereby, the accuracy of position detection by image processing is improved.
圖像處理部52包括包含CPU(Central Processing Unit,中央處理 單元)、ROM(Read OnLy Memory,唯讀記憶體)及RAM(Random Access Memory,隨機存取記憶體)等記憶媒體等之電腦。圖像處理部52對自攝像部51供給之圖像進行圖像處理,檢測刀片20之刃尖20a相對於攝像部51之相對位置、及補強板3A、3B之第2主面3Aa、3Bb相對於攝像部51之相對位置。作為圖像處理之方法,例如有使用微分濾光片之方法等。於使用微分濾光片之方法中,檢測像素之亮度(亮度)等急遽地變化之位置,檢測圖像中之刀片20之刃尖20a之位置及圖像中之補強板3A、3B之第2主面3Aa、3Bb之位置。圖像處理部52將圖像處理之結果供給至控制部80。 The image processing unit 52 includes a CPU (Central Processing Unit). A computer such as a unit), a ROM (Read OnLy Memory), and a RAM (Random Access Memory). The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the blade edge 20a of the blade 20 with respect to the imaging unit 51 and the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B. The relative position of the imaging unit 51. As a method of image processing, for example, there is a method of using a differential filter or the like. In the method of using the differential filter, the position where the brightness (brightness) of the pixel is sharply changed, the position of the blade tip 20a of the blade 20 in the detection image, and the second of the reinforcing plates 3A, 3B in the image are detected. The position of the main faces 3Aa, 3Bb. The image processing unit 52 supplies the result of the image processing to the control unit 80.
刀片用光源53係於藉由攝像部51拍攝刀片20之刃尖20a之位置時,向刀片20之刃尖20a照射光。此時,如圖4所示,刀片20之刃尖20a可配置於攝像部51與刀片用光源53之間。 When the blade light source 53 is positioned at the position of the blade edge 20a of the blade 20 by the imaging unit 51, the blade tip 20a is irradiated with light. At this time, as shown in FIG. 4, the blade edge 20a of the blade 20 can be disposed between the imaging unit 51 and the blade light source 53.
可撓性板用光源54係於藉由攝像部51拍攝補強板3A、3B之第2主面3Aa、3Bb之位置時,向可撓性板11A、11B照射光。來自可撓性板用光源54之光於設置於作為攝像部51之相機之光軸之中途的半鏡面55反射,與相機之光軸同軸地照亮可撓性板11A、11B。 When the light source 54 for the flexible board is used to image the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B by the imaging unit 51, the flexible plates 11A and 11B are irradiated with light. The light from the flexible plate light source 54 is reflected by the half mirror surface 55 provided in the middle of the optical axis of the camera as the imaging unit 51, and illuminates the flexible plates 11A and 11B coaxially with the optical axis of the camera.
再者,本實施形態之可撓性板用光源54之照明方式為同軸照明,但只要來自可撓性板用光源54之光於可撓性板11A、11B反射併入射至攝像部51,則可為多種多樣。例如,亦可為以包圍相機之光軸之方式配置之環狀照明、與相機分別設置之外部照明等。 In addition, the illumination method of the flexible plate light source 54 of the present embodiment is coaxial illumination, but if the light from the flexible plate light source 54 is reflected by the flexible plates 11A and 11B and is incident on the imaging unit 51, Can be varied. For example, it may be an annular illumination arranged to surround the optical axis of the camera, an external illumination separately provided from the camera, or the like.
剝離裝置10進而包括檢測補強板3A、3B之板厚DA、DB(參照圖3及圖9(b))之板厚檢測部60A、60B(參照圖3)。板厚檢測部60A、60B例如藉由分光干涉法檢測具有透光性之補強板3A、3B之板厚DA、DB。 The peeling device 10 further includes plate thickness detecting portions 60A and 60B (see FIG. 3) that detect the plate thicknesses DA and DB (see FIGS. 3 and 9(b)) of the reinforcing plates 3A and 3B. The plate thickness detecting units 60A and 60B detect the plate thicknesses DA and DB of the light-transmitting reinforcing plates 3A and 3B by, for example, a spectroscopic interference method.
板厚檢測部60A自光源向積層體6之上表面6a(即上側之補強板3A之上表面3Aa)照射檢驗光,以分光器對在積層體6反射之干涉光進行分光,並以受光器接收分光之光,分析受光波形而算出上側之補強板 3A之板厚DA。檢驗光具有特定寬度之波長,受光波形之分析中,分析相對於波長之強度之變化。於上側之可撓性板11A形成有使檢驗光及干涉光通過之貫通孔14A。 The plate thickness detecting portion 60A irradiates the inspection light from the light source to the upper surface 6a of the laminated body 6 (i.e., the upper surface 3Aa of the reinforcing plate 3A on the upper side), and splits the interference light reflected by the laminated body 6 by the spectroscope, and uses the light receiver. Receiving the split light, analyzing the received light waveform and calculating the upper reinforcing plate 3A board thickness DA. The test light has a wavelength of a specific width, and in the analysis of the received light waveform, the change in intensity with respect to the wavelength is analyzed. The upper flexible plate 11A is formed with a through hole 14A through which the inspection light and the interference light pass.
同樣地,板厚檢測部60B自光源向積層體6之下表面6b(即下側之補強板3B之下表面3Bb)照射檢驗光,以分光器對在積層體6反射之干涉光進行分光,並以受光器接收分光之光,分析受光波形而算出下側之補強板3B之板厚DB。檢驗光具有特定之寬度之波長,受光波形之分析中,分析相對於波長之強度之變化。於下側之可撓性板11B形成有使檢驗光及干涉光通過之貫通孔14B。 Similarly, the plate thickness detecting portion 60B irradiates the inspection light from the light source toward the lower surface 6b of the laminated body 6 (i.e., the lower surface 3Bb of the reinforcing plate 3B on the lower side), and splits the interference light reflected by the laminated body 6 by the spectroscope. The light receiving beam is received by the light receiver, and the light receiving waveform is analyzed to calculate the thickness DB of the reinforcing plate 3B on the lower side. The test light has a wavelength of a specific width, and in the analysis of the received light waveform, the change in intensity with respect to the wavelength is analyzed. The flexible plate 11B on the lower side is formed with a through hole 14B through which the inspection light and the interference light pass.
分光干涉法係用於補強板3A、3B中包含之樹脂層5A、5B之折射率與基板2A、2B之折射率不同之情形。再者,於補強板3A、3B僅由支撐板4A、4B(參照圖2)構成之情形時,且支撐板4A、4B之折射率與基板2A、2B之折射率之差不同之情形時,使用分光干涉法。分光干涉法中,於基板2A、2B與補強板3A、3B之界面8A、8B,只要折射率變化即可。 The spectroscopic interference method is used in the case where the refractive indices of the resin layers 5A and 5B included in the reinforcing plates 3A and 3B are different from those of the substrates 2A and 2B. Further, when the reinforcing plates 3A and 3B are composed only of the supporting plates 4A and 4B (see FIG. 2), and the difference between the refractive indices of the supporting plates 4A and 4B and the refractive indices of the substrates 2A and 2B is different, Use spectroscopic interference. In the spectroscopic interference method, the interfaces 8A and 8B of the substrates 2A and 2B and the reinforcing plates 3A and 3B may be changed in refractive index.
再者,亦可使用三角測量法取代分光干涉法。三角測量法中,使用具有特定波長之檢驗光檢測補強板3A、3B之板厚DA、DB。三角測量法中無需分光器,因此成本較低。另一方面,分光干涉法之板厚之檢測精度佳。 Furthermore, triangulation can also be used instead of spectroscopic interference. In the triangulation method, the plate thicknesses DA and DB of the reinforcing plates 3A and 3B are detected using the inspection light having a specific wavelength. There is no need for a beam splitter in triangulation, so the cost is lower. On the other hand, the detection accuracy of the plate thickness of the spectroscopic interference method is good.
剝離裝置10包括控制剝離裝置10之各種動作之控制部80。控制部80包括包含CPU、ROM及RAM等記憶媒體等之電腦。藉由使CPU執行記錄於記錄媒體中之程式,而控制剝離裝置10之各種動作。控制部80包括算出部81、攝像處理部82、監視部83、調整處理部84。 The peeling device 10 includes a control unit 80 that controls various operations of the peeling device 10. The control unit 80 includes a computer including a memory medium such as a CPU, a ROM, and a RAM. The various actions of the stripping device 10 are controlled by causing the CPU to execute a program recorded in the recording medium. The control unit 80 includes a calculation unit 81, an imaging processing unit 82, a monitoring unit 83, and an adjustment processing unit 84.
再者,算出部81、攝像處理部82、監視部83、攝像部51、及圖像處理部52等構成位置檢測部。位置檢測部詳細為如下所述,檢測相對於界面8A、8B而垂直之方向(例如鉛直方向)上之補強板3A、3B之 第2主面3Aa、3Bb相對於刀片20之刃尖20a之相對位置(距離LA、LB等)。 Further, the calculation unit 81, the imaging processing unit 82, the monitoring unit 83, the imaging unit 51, and the image processing unit 52 constitute a position detecting unit. The position detecting unit detects the reinforcing plates 3A and 3B in the vertical direction (for example, the vertical direction) with respect to the interfaces 8A and 8B in detail as follows. The relative position (distance LA, LB, etc.) of the second main faces 3Aa, 3Bb with respect to the blade tip 20a of the blade 20.
其次,對上述構成之剝離裝置10之動作進行說明。剝離裝置10之各種動作係於控制裝置70之控制下進行。 Next, the operation of the peeling device 10 having the above configuration will be described. The various actions of the stripping device 10 are performed under the control of the control device 70.
積層體6水平地載置於可撓性板11B上。若可撓性板11B真空吸附積層體6之下表面6b,則可撓性板11A按壓於積層體6之上表面6a,真空吸附積層體6之上表面6a。此時,可撓性板11A、11B成為平板狀,板厚檢測部60A、60B檢測補強板3A、3B之板厚DA、DB。板厚檢測部60A、60B將檢測結果供給至調整處理部84。 The laminated body 6 is horizontally placed on the flexible board 11B. When the flexible plate 11B vacuum-adsorbs the lower surface 6b of the laminated body 6, the flexible plate 11A is pressed against the upper surface 6a of the laminated body 6, and the upper surface 6a of the laminated body 6 is vacuum-adsorbed. At this time, the flexible plates 11A and 11B are formed into a flat plate shape, and the plate thickness detecting portions 60A and 60B detect the plate thicknesses DA and DB of the reinforcing plates 3A and 3B. The plate thickness detecting units 60A and 60B supply the detection result to the adjustment processing unit 84.
繼而,攝像處理部82藉由刀片移動部30及積層體移動部40而使積層體6及刀片20相對於攝像部51進行相對移動,藉由攝像部51分別拍攝刀片20之刃尖20a之位置與上側之補強板3A之上表面3Aa之位置。 Then, the imaging processing unit 82 relatively moves the laminated body 6 and the blade 20 with respect to the imaging unit 51 by the blade moving unit 30 and the laminated body moving unit 40, and the imaging unit 51 respectively captures the position of the blade tip 20a of the blade 20. The position of the upper surface 3Aa with the reinforcing plate 3A on the upper side.
圖7係表示藉由攝像部之攝像時之剝離裝置之狀態的圖。圖7(a)係表示刀片20之刃尖位置之拍攝時的剝離裝置之狀態,圖7(b)係表示上側之補強板3A之上表面位置之拍攝時的剝離裝置之狀態。圖8係表示藉由攝像部拍攝之圖像之圖。圖8(a)模式性地表示拍攝刀片20之刃尖位置之圖像,圖8(b)模式性地表示拍攝上側之補強板3A之上表面位置之圖像。圖8中,將像素之亮度較低之部分以斜線之陰影表示。 Fig. 7 is a view showing a state of a peeling device at the time of image pickup by an image pickup unit. Fig. 7(a) shows the state of the peeling device at the time of photographing the blade edge position of the blade 20, and Fig. 7(b) shows the state of the peeling device at the time of photographing the upper surface position of the upper reinforcing plate 3A. Fig. 8 is a view showing an image taken by an imaging unit. Fig. 8(a) schematically shows an image of the blade edge position of the imaging blade 20, and Fig. 8(b) schematically shows an image of the upper surface position of the reinforcing plate 3A on the upper side. In Fig. 8, the portion where the luminance of the pixel is low is indicated by the hatching of the oblique line.
例如,攝像處理部82如圖7(a)所示般藉由攝像部51拍攝刀片20之刃尖20a之位置。刀片20之刃尖20a配置於向刃尖20a照射光之刀片用光源53與攝像部51之間。因此,如圖8(a)所示,刀片20之周邊之圖像亮於刀片20之圖像20P,因此表示刀片20之刃尖20a之位置之圖像20aP變得明確。藉由攝像部51拍攝之圖像供給至圖像處理部52。圖像處理部52對自攝像部51供給之圖像進行圖像處理,檢測刀片20之刃尖20a相對於攝像部51之相對位置。圖像處理部52將圖像處理之結果供給至 算出部81。 For example, the imaging processing unit 82 captures the position of the blade edge 20a of the blade 20 by the imaging unit 51 as shown in Fig. 7(a). The blade edge 20a of the blade 20 is disposed between the blade light source 53 that irradiates the blade tip 20a with the imaging unit 51. Therefore, as shown in Fig. 8(a), the image of the periphery of the blade 20 is brighter than the image 20P of the blade 20, so that the image 20aP indicating the position of the blade tip 20a of the blade 20 becomes clear. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the blade edge 20a of the blade 20 with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to The calculation unit 81.
繼而,攝像處理部82如圖7(b)所示般藉由刀片移動部30而使刀片20相對於攝像部51下降至待機位置為止。其間,監視部83監視刀片20相對於攝像部51之相對位置之變化。相對位置之變化除刀片20之移動距離MA(參照圖7(b))以外,包含刀片20之移動方向。監視部83使用例如鉛直驅動用馬達32之編碼器部32b進行監視。監視部83將監視結果供給至算出部81。又,攝像處理部82藉由積層體移動部40而使積層體6相對於攝像部51下降至特定位置為止。 Then, as shown in FIG. 7(b), the imaging processing unit 82 lowers the blade 20 to the standby position with respect to the imaging unit 51 by the blade moving unit 30. In the meantime, the monitoring unit 83 monitors the change in the relative position of the blade 20 with respect to the imaging unit 51. The change in the relative position includes the moving direction of the blade 20 except for the moving distance MA of the blade 20 (refer to FIG. 7(b)). The monitoring unit 83 performs monitoring using, for example, the encoder unit 32b of the vertical drive motor 32. The monitoring unit 83 supplies the monitoring result to the calculation unit 81. Further, the imaging processing unit 82 lowers the laminated body 6 to the specific position with respect to the imaging unit 51 by the laminated body moving unit 40.
其後,攝像處理部82藉由攝像部51拍攝上側之補強板3A之上表面3Aa之位置。此時,上側之可撓性板11A之端部於藉由攝像部51拍攝之部分15A將來自可撓性板用光源54之光向攝像部51反射。因此,如圖8(b)所示,可撓性板11A之圖像11AP亮於補強板3A之圖像3AP,因此表示補強板3A之上表面3Aa之位置之圖像3AaP變得明確。為提高光反射率,上述部分15A可包含反射膜(例如白色塗料之膜)。上述部分15A之圖像15AP變得更明亮。藉由攝像部51拍攝之圖像供給至圖像處理部52。圖像處理部52對自攝像部51供給之圖像進行圖像處理,檢測補強板3A之上表面3Aa相對於攝像部51之相對位置。圖像處理部52將圖像處理之結果供給至算出部81。 Thereafter, the imaging processing unit 82 captures the position of the upper surface 3Aa of the upper reinforcing plate 3A by the imaging unit 51. At this time, the end portion of the upper flexible plate 11A reflects the light from the flexible plate light source 54 toward the imaging unit 51 at the portion 15A imaged by the imaging unit 51. Therefore, as shown in Fig. 8(b), the image 11AP of the flexible plate 11A is brighter than the image 3AP of the reinforcing plate 3A, so that the image 3AaP indicating the position of the upper surface 3Aa of the reinforcing plate 3A becomes clear. In order to increase the light reflectance, the above portion 15A may include a reflective film (for example, a film of white paint). The image 15AP of the above portion 15A becomes brighter. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the upper surface 3Aa of the reinforcing plate 3A with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to the calculation unit 81.
算出部81基於圖像處理部52之圖像處理之結果,而算出圖7(a)所示之刀片20之刃尖20a與圖7(b)所示之補強板3A之上表面3Aa之鉛直方向上的相對位置。相對位置除距離GA(參照圖7(b))以外,還包含上下關係。距離GA係根據圖像中之距離GAP(參照圖8(b))與比例常數之積而算出。比例常數係預先藉由試驗等而決定,記憶於控制部80之記憶媒體中。 The calculation unit 81 calculates the vertical direction of the blade tip 20a of the blade 20 shown in Fig. 7(a) and the upper surface 3Aa of the reinforcing plate 3A shown in Fig. 7(b) based on the result of the image processing by the image processing unit 52. The relative position in the direction. The relative position includes a vertical relationship in addition to the distance GA (see FIG. 7(b)). The distance GA is calculated from the product of the distance GAP (see FIG. 8(b)) in the image and the proportional constant. The proportionality constant is determined in advance by a test or the like, and is stored in the memory medium of the control unit 80.
算出部81基於利用圖像處理部52之圖像處理之結果的算出結果與監視部83之監視結果,而算出刀片20之刃尖20a與上側之補強板3A 之上表面3Aa之鉛直方向上的相對位置。相對位置除距離LA(參照圖7(b))以外,還包含上下關係。例如,圖7(b)中,刀片20之刃尖20a位於較補強板3A之上表面3Aa靠下方。補強板3A之上表面3Aa與下表面3Ab之間之距離與補強板3A之板厚DA相等。 The calculation unit 81 calculates the blade edge 20a of the blade 20 and the reinforcing plate 3A on the upper side based on the calculation result of the image processing by the image processing unit 52 and the monitoring result of the monitoring unit 83. The relative position of the upper surface 3Aa in the vertical direction. The relative position includes a vertical relationship in addition to the distance LA (see FIG. 7(b)). For example, in Fig. 7(b), the blade tip 20a of the blade 20 is located below the upper surface 3Aa of the reinforcing plate 3A. The distance between the upper surface 3Aa and the lower surface 3Ab of the reinforcing plate 3A is equal to the plate thickness DA of the reinforcing plate 3A.
調整處理部84基於算出部81之算出結果與板厚檢測部60A之檢測結果,而算出刀片20之刃尖20a與界面8A之間之鉛直方向上的間隔WA(參照圖7(b))。繼而,調整處理部84使調整間隔WA之調整部(例如刀片移動部30)動作,將間隔WA調整為約0(零)。 The adjustment processing unit 84 calculates the interval WA in the vertical direction between the blade edge 20a of the blade 20 and the interface 8A based on the calculation result of the calculation unit 81 and the detection result of the plate thickness detecting unit 60A (see FIG. 7(b)). Then, the adjustment processing unit 84 operates the adjustment unit (for example, the blade moving unit 30) of the adjustment interval WA to adjust the interval WA to about 0 (zero).
其後,控制部80藉由刀片移動部30使刀片20水平地移動,如圖5(a)所示般***於基板2A與補強板3A之界面8A之一端。其結果為,於界面8A形成剝離之起點。 Thereafter, the control unit 80 horizontally moves the blade 20 by the blade moving unit 30, and is inserted into one end of the interface 8A between the substrate 2A and the reinforcing plate 3A as shown in Fig. 5(a). As a result, the starting point of the peeling is formed at the interface 8A.
如此,本實施形態中,刀片20之刃尖20a與界面8A之間之鉛直方向上的間隔WA,根據補強板3A之上表面3Aa相對於刀片20之刃尖20a之相對位置(距離LA及上下關係)與補強板3A之板厚DA而算出。因此,於難以直接檢測界面8A之位置之情形時,可精度佳地檢測界面8A之位置,從而可精度佳地將刀片20***於界面8A。 As described above, in the present embodiment, the distance WA between the blade edge 20a of the blade 20 and the interface 8A in the vertical direction is based on the relative position of the upper surface 3Aa of the reinforcing plate 3A with respect to the blade tip 20a of the blade 20 (distance LA and up and down) The relationship is calculated with the plate thickness DA of the reinforcing plate 3A. Therefore, when it is difficult to directly detect the position of the interface 8A, the position of the interface 8A can be accurately detected, so that the blade 20 can be inserted into the interface 8A with high precision.
其後,控制部80如圖5(b)所示般以自一端側向另一端側依序剝離基板2A與補強板3A之界面8A之方式,使複數個可動體12A、12B以特定順序相對於框架Fr而移動,使可撓性板11A、11B彎曲變形。 Then, as shown in FIG. 5(b), the control unit 80 sequentially peels the plurality of movable bodies 12A and 12B in a specific order so as to peel the interface 8A between the substrate 2A and the reinforcing plate 3A from the one end side toward the other end side. The frame Fr is moved to bend and deform the flexible plates 11A and 11B.
基板2A與補強板3A之剝離完成後,控制部80解除利用可撓性板11A之真空吸附。其後,自可撓性板11A卸除補強板3A。繼而,可撓性板11A按壓於基板2A並吸附基板2A之上表面。此時,可撓性板11A、11B成為平板狀。 After the peeling of the substrate 2A and the reinforcing plate 3A is completed, the control unit 80 releases the vacuum suction by the flexible plate 11A. Thereafter, the reinforcing plate 3A is removed from the flexible board 11A. Then, the flexible board 11A is pressed against the substrate 2A and adsorbs the upper surface of the substrate 2A. At this time, the flexible plates 11A and 11B have a flat shape.
繼而,攝像處理部82藉由刀片移動部30及積層體移動部40而使補強板3B及刀片20相對於攝像部51進行相對移動,藉由攝像部51分別拍攝刀片20之刃尖20a之位置與下側之補強板3B之下表面3Bb之位 置。 Then, the imaging processing unit 82 relatively moves the reinforcing plate 3B and the blade 20 with respect to the imaging unit 51 by the blade moving unit 30 and the laminated body moving unit 40, and the imaging unit 51 respectively captures the position of the blade tip 20a of the blade 20. With the lower surface of the reinforcing plate 3B below the surface 3Bb Set.
圖9係表示利用攝像部之攝像時之剝離裝置之狀態的圖。圖9(a)係表示刀片20之刃尖位置之拍攝時之剝離裝置之狀態,圖9(b)表示下側之補強板3B之下表面位置之拍攝時之剝離裝置之狀態。圖10係表示藉由攝像部拍攝之圖像的圖。圖10(a)模式性地表示拍攝刀片20之刃尖位置之圖像,圖10(b)模式性地表示拍攝下側之補強板3B之下表面位置之圖像。圖10中,將像素之亮度較低之部分以斜線之陰影表示。 FIG. 9 is a view showing a state of a peeling device at the time of imaging by an imaging unit. Fig. 9(a) shows the state of the peeling device at the time of photographing the blade edge position of the blade 20, and Fig. 9(b) shows the state of the peeling device at the time of photographing the lower surface position of the lower reinforcing plate 3B. Fig. 10 is a view showing an image taken by an imaging unit. Fig. 10(a) schematically shows an image of the blade edge position of the imaging blade 20, and Fig. 10(b) schematically shows an image of the lower surface position of the reinforcing plate 3B on the lower side. In Fig. 10, the portion where the luminance of the pixel is low is indicated by the hatching of the oblique line.
例如,攝像處理部82如圖9(a)所示般藉由攝像部51拍攝刀片20之刃尖20a之位置。刀片20之刃尖20a配置於向刃尖20a照射光之刀片用光源53與攝像部51之間。因此,如圖9(a)所示,刀片20之周邊之圖像亮於刀片20之圖像20P,因此表示刀片20之刃尖20a之位置之圖像20aP變得明確。為提高光反射率,上述部分15B可包含反射膜(例如白色塗料之膜)。上述部分15B之圖像15BP變得更明亮。藉由攝像部51拍攝之圖像供給至圖像處理部52。圖像處理部52對自攝像部51供給之圖像進行圖像處理,檢測刀片20之刃尖20a相對於攝像部51之相對位置。圖像處理部52將圖像處理之結果供給至算出部81。 For example, the imaging processing unit 82 captures the position of the blade edge 20a of the blade 20 by the imaging unit 51 as shown in FIG. 9(a). The blade edge 20a of the blade 20 is disposed between the blade light source 53 that irradiates the blade tip 20a with the imaging unit 51. Therefore, as shown in Fig. 9(a), the image of the periphery of the blade 20 is brighter than the image 20P of the blade 20, so that the image 20aP indicating the position of the blade tip 20a of the blade 20 becomes clear. In order to increase the light reflectance, the above portion 15B may include a reflective film (for example, a film of white paint). The image 15BP of the above portion 15B becomes brighter. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the blade edge 20a of the blade 20 with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to the calculation unit 81.
繼而,攝像處理部82如圖9(b)所示般藉由刀片移動部30使刀片20相對於攝像部51下降至待機位置為止。其間,監視部83監視刀片20相對於攝像部51之相對位置之變化。相對位置之變化除刀片20之移動距離MB(參照圖9(b))以外,還包含刀片20之移動方向。監視部83使用例如鉛直驅動用馬達32之編碼器部32b進行監視。監視部83將監視結果供給至算出部81。又,攝像處理部82藉由積層體移動部40使補強板3B相對於攝像部51上升至特定位置為止。 Then, as shown in FIG. 9(b), the imaging processing unit 82 lowers the blade 20 to the standby position with respect to the imaging unit 51 by the blade moving unit 30. In the meantime, the monitoring unit 83 monitors the change in the relative position of the blade 20 with respect to the imaging unit 51. The change in the relative position includes the moving direction of the blade 20 in addition to the moving distance MB of the blade 20 (refer to FIG. 9(b)). The monitoring unit 83 performs monitoring using, for example, the encoder unit 32b of the vertical drive motor 32. The monitoring unit 83 supplies the monitoring result to the calculation unit 81. Further, the imaging processing unit 82 raises the reinforcing plate 3B to the specific position with respect to the imaging unit 51 by the laminated body moving unit 40.
其後,攝像處理部82藉由攝像部51拍攝下側之補強板3B之下表面3Bb之位置。此時,下側之可撓性板11B之端部於藉由攝像部51拍 攝之部分15B將來自可撓性板用光源54之光向攝像部51反射。因此,如圖10(b)所示,可撓性板11B之圖像11BP亮於補強板3B之圖像3BP,因此表示補強板3B之下表面3Bb之位置之圖像3BbP變得明確。藉由攝像部51拍攝之圖像供給至圖像處理部52。圖像處理部52對自攝像部51供給之圖像進行圖像處理,檢測補強板3B之下表面3Bb相對於攝像部51之相對位置。圖像處理部52將圖像處理之結果供給至算出部81。 Thereafter, the imaging processing unit 82 captures the position of the lower surface 3Bb of the lower reinforcing plate 3B by the imaging unit 51. At this time, the end of the lower flexible plate 11B is taken by the imaging unit 51. The portion 15B that has taken the light reflects the light from the flexible plate light source 54 toward the imaging unit 51. Therefore, as shown in Fig. 10 (b), the image 11BP of the flexible plate 11B is brighter than the image 3BP of the reinforcing plate 3B, so that the image 3BbP indicating the position of the lower surface 3Bb of the reinforcing plate 3B becomes clear. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the lower surface 3Bb of the reinforcing plate 3B with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to the calculation unit 81.
算出部81基於圖像處理部52之圖像處理之結果,而算出圖9(a)所示之刀片20之刃尖20a與圖9(b)所示之補強板3B之下表面3Bb之鉛直方向上的相對位置。相對位置除距離GB(參照圖9(b))以外,還包含上下關係。距離GB係根據圖像中之距離GBP(參照圖10(b))與比例常數之積而算出。比例常數預先藉由試驗等而決定,記憶於控制部80之記憶媒體中。 The calculation unit 81 calculates the vertical direction of the blade tip 20a of the blade 20 shown in Fig. 9(a) and the lower surface 3Bb of the reinforcing plate 3B shown in Fig. 9(b) based on the result of the image processing by the image processing unit 52. The relative position in the direction. The relative position includes a vertical relationship in addition to the distance GB (see FIG. 9(b)). The distance GB is calculated from the product of the distance GBP (see FIG. 10(b)) in the image and the proportionality constant. The proportionality constant is determined in advance by a test or the like, and is stored in the memory medium of the control unit 80.
算出部81基於利用圖像處理部52之圖像處理之結果的算出結果與監視部83之監視結果,而算出刀片20之刃尖20a與下側之補強板3B之下表面3Bb之鉛直方向上的相對位置。相對位置除距離LB(參照圖9(b))以外,還包含上下關係。例如,圖9(b)中,刀片20之刃尖20a位於較補強板3B之下表面3Bb靠下方。補強板3B之下表面3Bb與上表面3Ba之間之距離與補強板3B之板厚DB相等。 The calculation unit 81 calculates the vertical direction of the blade tip 20a and the lower surface 3Bb of the lower reinforcing plate 3B based on the calculation result of the image processing by the image processing unit 52 and the monitoring result of the monitoring unit 83. Relative position. The relative position includes a vertical relationship in addition to the distance LB (see FIG. 9(b)). For example, in Fig. 9(b), the blade tip 20a of the blade 20 is located below the lower surface 3Bb of the reinforcing plate 3B. The distance between the lower surface 3Bb of the reinforcing plate 3B and the upper surface 3Ba is equal to the plate thickness DB of the reinforcing plate 3B.
調整處理部84基於算出部81之算出結果與板厚檢測部60B之檢測結果,而算出刀片20之刃尖20a與界面8B之間之鉛直方向上的間隔WB(參照圖9(b))。繼而,調整處理部84使調整間隔WB之調整部(例如刀片移動部30)動作,將間隔WB調整為約0(零)。 The adjustment processing unit 84 calculates the interval WB in the vertical direction between the blade edge 20a of the blade 20 and the interface 8B based on the calculation result of the calculation unit 81 and the detection result of the plate thickness detecting unit 60B (see FIG. 9(b)). Then, the adjustment processing unit 84 operates the adjustment unit (for example, the blade moving unit 30) of the adjustment interval WB, and adjusts the interval WB to about 0 (zero).
其後,控制部80藉由刀片移動部30而使刀片20水平地移動,如圖6(a)所示般***於基板2B與補強板3B之界面8B之一端。其結果為,於界面8B形成剝離之起點。 Thereafter, the control unit 80 horizontally moves the blade 20 by the blade moving unit 30, and is inserted into one end of the interface 8B between the substrate 2B and the reinforcing plate 3B as shown in Fig. 6(a). As a result, the starting point of the peeling is formed at the interface 8B.
如此,本實施形態中,刀片20之刃尖20a與界面8B之間之鉛直方 向的間隔WB,係根據補強板3B之下表面3Bb相對於刀片20之刃尖20a之相對位置(距離LB及上限關係)與補強板3B之板厚DB而算出。因此,於難以直接檢測界面8B之位置之情形時,可精度佳地檢測界面8B之位置,從而可精度佳地將刀片20***於界面8B。 Thus, in the present embodiment, the vertical direction between the blade edge 20a of the blade 20 and the interface 8B. The interval WB of the direction is calculated based on the relative position (distance LB and the upper limit relationship) of the lower surface 3Bb of the reinforcing plate 3B with respect to the blade edge 20a of the blade 20 and the plate thickness DB of the reinforcing plate 3B. Therefore, when it is difficult to directly detect the position of the interface 8B, the position of the interface 8B can be accurately detected, so that the blade 20 can be inserted into the interface 8B with high precision.
其後,控制部80如圖6(b)所示般以自一端側向另一端側依序剝離基板2B與補強板3B之界面8B之方式,使複數個可動體12A、12B以特定之順序相對於框架Fr移動,使可撓性板11A、11B彎曲變形。 Then, as shown in FIG. 6(b), the control unit 80 sequentially peels the plurality of movable bodies 12A and 12B in a specific order so that the interface 8B between the substrate 2B and the reinforcing plate 3B is sequentially peeled from one end side to the other end side. The flexible plates 11A and 11B are bent and deformed with respect to the movement of the frame Fr.
基板2B與補強板3B之剝離完成後,控制部80解除利用可撓性板11A、11B之真空吸附。其後,自可撓性板11B卸除補強板3B,自可撓性板11A卸除基板2A。 After the peeling of the substrate 2B and the reinforcing plate 3B is completed, the control unit 80 releases the vacuum suction by the flexible plates 11A and 11B. Thereafter, the reinforcing plate 3B is removed from the flexible plate 11B, and the substrate 2A is removed from the flexible plate 11A.
如此,自積層體6剝離補強板3A、3B後,組入背光源等,從而獲得作為製品之LCD。 In this manner, the reinforcing sheets 3A and 3B are peeled off from the laminated body 6, and then incorporated into a backlight or the like to obtain an LCD as a product.
再者,本實施形態之剝離裝置10係於LCD之製造步驟中使用,但本發明並不限定於此,可於其他電子元件之製造步驟中使用。 Further, the peeling device 10 of the present embodiment is used in the manufacturing process of the LCD, but the present invention is not limited thereto, and can be used in the manufacturing steps of other electronic components.
以上,對本發明之一實施形態進行了說明,但本發明並不限制於上述實施形態。可於技術方案之範圍中記載之本發明之要旨之範圍內進行各種變形、變更。 Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. Various changes and modifications can be made without departing from the spirit and scope of the invention.
例如,上述實施形態之剝離裝置10中,於刀片20之***前,界面8A、8B水平地配置,但界面8A、8B亦可鉛直地配置,界面8A、8B亦可相對於水平面而傾斜。 For example, in the peeling device 10 of the above embodiment, the interfaces 8A and 8B are horizontally arranged before the insertion of the blade 20, but the interfaces 8A and 8B may be arranged vertically, and the interfaces 8A and 8B may be inclined with respect to the horizontal plane.
又,上述實施形態中,為精度佳地檢測補強板3A、3B之第2主面3Aa、3Bb之位置,於可撓性板12A、12B之端部中藉由攝像部51拍攝之部分15A形成有光反射膜(例如白色塗料之膜),亦可形成光吸收膜(例如黑色塗料之膜)。光反射膜與光吸收膜可根據補強板3A、3B之側面之狀態而分別使用。例如圖11所示,於補強板3B之側面之角部被倒角之情形時,入射至補強板3B之側面之光不向攝像部51反射,藉由 攝像部51拍攝之補強板3B之圖像變暗,因此為使可撓性板11B之圖像變亮而使用光反射膜。作為補強板3B之圖像變暗之情形,除補強板3B之側面之角部被倒角之情形以外,可列舉補強板3B之側面受損而導致光散射之情形。另一方面,於補強板3B之側面為平坦面且未被倒角之情形時,入射至補強板3B之側面之光向攝像部51反射,藉由攝像部51拍攝之補強板3B之圖像變亮,因此為使可撓性板11B之圖像變暗而使用光吸收膜。 Further, in the above-described embodiment, the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B are accurately detected, and the portions 15A of the flexible plates 12A and 12B which are imaged by the imaging unit 51 are formed at the end portions of the flexible plates 12A and 12B. There is a light reflecting film (for example, a film of a white paint), and a light absorbing film (for example, a film of a black paint) can also be formed. The light reflecting film and the light absorbing film can be used depending on the state of the side faces of the reinforcing plates 3A and 3B, respectively. For example, as shown in FIG. 11, when the corner portion of the side surface of the reinforcing plate 3B is chamfered, the light incident on the side surface of the reinforcing plate 3B is not reflected by the imaging portion 51. Since the image of the reinforcing plate 3B imaged by the imaging unit 51 is dark, the light reflecting film is used to brighten the image of the flexible plate 11B. In the case where the image of the reinforcing plate 3B is darkened, in addition to the case where the corner portion of the side surface of the reinforcing plate 3B is chamfered, the side surface of the reinforcing plate 3B is damaged to cause light scattering. On the other hand, when the side surface of the reinforcing plate 3B is a flat surface and is not chamfered, the light incident on the side surface of the reinforcing plate 3B is reflected by the imaging unit 51, and the image of the reinforcing plate 3B imaged by the imaging unit 51 is obtained. Since it is brightened, a light absorbing film is used in order to darken the image of the flexible board 11B.
又,上述實施形態中,於檢測補強板3A之第2主面3Aa之位置時,於補強板3A之第2主面3Aa上載置有可撓性板11A,亦可如圖12所示般載置。於此情形時,補強板3A之第2主面3Aa之一部分配置於向補強板3A照射光之刀片用光源53與攝像部51之間。因此,補強板3A之周邊之圖像亮於補強板3A之圖像,因此補強板3A之第2主面3Aa之位置變得明確。於此情形時,如圖13所示,於補強板3A之第2主面3Aa上載置可撓性板11A前,可將刀片20***於補強板3A與基板2A之界面8A之間。其後,於***有刀片20之狀態下,使可撓性板11A下降,如圖5(a)所示般以可撓性板11A吸附補強板3A之第2主面3Aa。繼而,如圖5(b)所示,以自一端側向另一端側依序剝離界面8A之方式,使基板2A及補強板3A中之至少一者(圖中為兩者)彎曲變形。 Further, in the above embodiment, when the position of the second main surface 3Aa of the reinforcing plate 3A is detected, the flexible plate 11A is placed on the second main surface 3Aa of the reinforcing plate 3A, and as shown in FIG. Set. In this case, one of the second main faces 3Aa of the reinforcing plate 3A is disposed between the blade light source 53 that irradiates light to the reinforcing plate 3A and the imaging unit 51. Therefore, since the image of the periphery of the reinforcing plate 3A is brighter than the image of the reinforcing plate 3A, the position of the second main surface 3Aa of the reinforcing plate 3A becomes clear. In this case, as shown in FIG. 13, the blade 20 can be inserted between the reinforcing plate 3A and the interface 8A of the substrate 2A before the flexible plate 11A is placed on the second main surface 3Aa of the reinforcing plate 3A. Then, the flexible board 11A is lowered in a state in which the blade 20 is inserted, and the second main surface 3Aa of the reinforcing plate 3A is sucked by the flexible board 11A as shown in Fig. 5(a). Then, as shown in FIG. 5(b), at least one of the substrate 2A and the reinforcing plate 3A (both in the drawing) is bent and deformed so that the interface 8A is sequentially peeled from one end side to the other end side.
又,上述實施形態之剝離裝置10中,為檢測補強板3A、3B之第2主面3Aa、3Bb之位置而使用攝像部51,亦可使用例如雷射位移計等非接觸式之位置感測器、針盤量軌等接觸式之位置感測器或積層體用馬達41之編碼器部41b。 Further, in the peeling device 10 of the above-described embodiment, the imaging unit 51 is used to detect the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B, and non-contact position sensing such as a laser displacement meter can be used. A contact position sensor such as a needle or a measuring wheel or an encoder portion 41b of the laminated body motor 41.
又,上述實施形態之剝離裝置10藉由監視部83監視拍攝刀片時與拍攝補強板時之間的刀片20相對於攝像部51之相對位置之變化,於相對位置之變化由擋板等預先決定之情形時,亦可不藉由監視部83監視。 Further, in the peeling device 10 of the above-described embodiment, the monitoring unit 83 monitors the change in the relative position of the blade 20 with respect to the imaging unit 51 between the time of capturing the blade and the time of capturing the reinforcing plate, and the change in the relative position is determined in advance by the shutter or the like. In this case, it is not necessary to monitor by the monitoring unit 83.
又,上述實施形態之攝像處理部82係於藉由攝像部51拍攝刀片20之刃尖20a之位置後,拍攝補強板3A之上表面3Aa之位置,但拍攝之順序並無限制。例如,攝像處理部82亦可於拍攝補強板3A之上表面3Aa之位置後拍攝刀片20之刃尖20a之位置,於此情形時,監視部83監視補強板3A相對於攝像部51之相對位置之變化。監視部83例如使用積層體用馬達41之編碼器部41b進行監視。又,攝像處理部82亦可同時拍攝兩者之位置,於此情形時,位置檢測部包括算出部81、攝像部51及圖像處理部52。 Further, the imaging processing unit 82 of the above-described embodiment captures the position of the upper surface 3Aa of the reinforcing plate 3A by the position of the blade edge 20a of the blade 20 by the imaging unit 51, but the order of imaging is not limited. For example, the imaging processing unit 82 may photograph the position of the blade edge 20a of the blade 20 after capturing the position of the upper surface 3Aa of the reinforcing plate 3A. In this case, the monitoring unit 83 monitors the relative position of the reinforcing plate 3A with respect to the imaging portion 51. Change. The monitoring unit 83 monitors using, for example, the encoder unit 41b of the laminated body motor 41. Further, the imaging processing unit 82 can simultaneously capture the position of both, and in this case, the position detecting unit includes the calculation unit 81, the imaging unit 51, and the image processing unit 52.
又,上述實施形態之剝離裝置10係於藉由板厚檢測部60A、60B檢測補強板3A、3B之板厚後,藉由位置檢測部檢測補強板3A、3B之第2主面3Aa、3Bb相對於刀片20之刃尖20a之相對位置,但順序可相反,亦可同時。 Further, in the peeling apparatus 10 of the above-described embodiment, the thicknesses of the reinforcing plates 3A and 3B are detected by the plate thickness detecting units 60A and 60B, and the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B are detected by the position detecting unit. Relative to the position of the blade tip 20a of the blade 20, but the order may be reversed or simultaneously.
又,上述實施形態之剝離裝置10分別包括作為圖像處理部52之電腦與作為控制部80之電腦,但控制部80亦可實現圖像處理部52之功能。 Further, the peeling device 10 of the above embodiment includes a computer as the image processing unit 52 and a computer as the control unit 80. However, the control unit 80 can also function as the image processing unit 52.
又,上述實施形態之剝離裝置10係於自一端側起剝離界面8A、8B直至另一端側為止時,使可撓性板11A、11B兩者彎曲變形,亦可僅使任一者彎曲變形。於此情形時,亦可使用彎曲變形困難之剛性板取代另一可撓性板。 Further, in the peeling device 10 of the above-described embodiment, when the interfaces 8A and 8B are peeled from the one end side to the other end side, both of the flexible plates 11A and 11B are bent and deformed, and only one of them may be bent and deformed. In this case, it is also possible to use a rigid plate which is difficult to bend and deform to replace another flexible plate.
又,上述實施形態之剝離裝置10為剝離界面8A、8B兩者之裝置,亦可為僅剝離任一者(例如僅界面8A)之裝置。 Further, the peeling device 10 of the above embodiment is a device that peels off both interfaces 8A and 8B, and may be a device that peels only one of them (for example, only the interface 8A).
本申請案係基於2012年1月19日申請之日本專利申請案2012-009347者,其內容作為參照被引入本文。 The present application is based on Japanese Patent Application No. 2012-009347, filed Jan.
2A‧‧‧基板 2A‧‧‧Substrate
2B‧‧‧基板 2B‧‧‧Substrate
3A‧‧‧補強板 3A‧‧‧ reinforcing plate
3B‧‧‧補強板 3B‧‧‧ reinforcing plate
3Ab‧‧‧第1主面 3Ab‧‧‧1st main face
6‧‧‧積層體 6‧‧‧Layer
6a‧‧‧上表面 6a‧‧‧Upper surface
6b‧‧‧下表面 6b‧‧‧lower surface
7‧‧‧液晶層(功能層) 7‧‧‧Liquid layer (functional layer)
8A‧‧‧界面 8A‧‧‧ interface
11A‧‧‧可撓性板(支撐體) 11A‧‧‧Flexible board (support)
11B‧‧‧可撓性板(支撐體) 11B‧‧‧Flexible board (support)
12A‧‧‧可動體 12A‧‧‧ movable body
12B‧‧‧可動體 12B‧‧‧ movable body
14A‧‧‧貫通孔 14A‧‧‧through hole
14B‧‧‧貫通孔 14B‧‧‧through hole
15A‧‧‧由攝像部拍攝之部分 15A‧‧‧Photographed by the camera department
15B‧‧‧由攝像部拍攝之部分 15B‧‧‧Photographed by the camera department
20‧‧‧刀片 20‧‧‧blade
30‧‧‧刀片移動部 30‧‧‧ Blade Moving Department
31‧‧‧水平驅動用馬達 31‧‧‧Horizontal drive motor
31a‧‧‧馬達本體部 31a‧‧‧Motor body
31b‧‧‧編碼器部 31b‧‧‧Encoder Division
32‧‧‧鉛直驅動用馬達 32‧‧‧Digital drive motor
32a‧‧‧馬達本體部 32a‧‧‧Motor body
32b‧‧‧編碼器部 32b‧‧‧Encoder Division
33‧‧‧滾珠螺桿 33‧‧‧Rolling screw
34‧‧‧水平可動體 34‧‧‧ horizontal movable body
35‧‧‧馬達支撐構件 35‧‧‧Motor support members
36‧‧‧滾珠螺桿 36‧‧‧Rolling screw
37‧‧‧鉛直可動體 37‧‧‧Vertical movable body
38‧‧‧刀片支撐構件 38‧‧‧ Blade support members
40‧‧‧積層體移動部 40‧‧‧Layered body movement
41‧‧‧積層體用馬達 41‧‧‧Layered motor
41a‧‧‧馬達本體部 41a‧‧‧Motor body
41b‧‧‧編碼器部 41b‧‧‧Encoder Department
42‧‧‧滾珠螺桿 42‧‧‧Ball screw
51‧‧‧攝像部 51‧‧‧Photography Department
52‧‧‧圖像處理部 52‧‧‧Image Processing Department
54‧‧‧可撓性板用光源(支撐體用光源) 54‧‧‧Light source for flexible board (light source for support)
55‧‧‧半鏡面 55‧‧‧Half mirror
60A‧‧‧板厚檢測部 60A‧‧‧Sheet thickness detection department
60B‧‧‧板厚檢測部 60B‧‧‧Sheet thickness detection department
80‧‧‧控制部 80‧‧‧Control Department
81‧‧‧算出部 81‧‧‧ Calculation Department
82‧‧‧攝像處理部 82‧‧‧Video Processing Department
83‧‧‧監視部 83‧‧‧Monitor
84‧‧‧調整處理部 84‧‧‧Adjustment Processing Department
DA‧‧‧板厚 DA‧‧‧ plate thickness
Fr‧‧‧框架 Fr‧‧ frame
LA‧‧‧距離 LA‧‧‧Distance
WA‧‧‧間隔 WA‧‧ ‧ interval
Claims (14)
Applications Claiming Priority (1)
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JP2012009347A JP5807554B2 (en) | 2012-01-19 | 2012-01-19 | Peeling apparatus and electronic device manufacturing method |
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TW201334090A TW201334090A (en) | 2013-08-16 |
TWI566306B true TWI566306B (en) | 2017-01-11 |
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TW102102127A TWI566306B (en) | 2012-01-19 | 2013-01-18 | A peeling device and a method for manufacturing the electronic component |
Country Status (4)
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JP (1) | JP5807554B2 (en) |
KR (1) | KR101960103B1 (en) |
CN (1) | CN103219263B (en) |
TW (1) | TWI566306B (en) |
Cited By (1)
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TWI680703B (en) * | 2017-07-20 | 2019-12-21 | 日商倍科有限公司 | Reinforcing board attachment device |
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JP6269954B2 (en) * | 2014-07-11 | 2018-01-31 | 旭硝子株式会社 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
JP6558646B2 (en) * | 2014-10-29 | 2019-08-14 | Agc株式会社 | Substrate adsorption device, substrate bonding apparatus and method, and electronic device manufacturing method |
WO2016104122A1 (en) * | 2014-12-26 | 2016-06-30 | 旭硝子株式会社 | Method for creating separation start portion for layered bodies, device for creating separation start portion, and electronic device manufacturing method |
JP6345611B2 (en) * | 2015-02-04 | 2018-06-20 | 東京エレクトロン株式会社 | Peeling apparatus, peeling system, peeling method, program, and information storage medium |
JP6436389B2 (en) * | 2015-02-18 | 2018-12-12 | Agc株式会社 | Peel start part creating apparatus, peel start part creating method, and electronic device manufacturing method |
JP6450620B2 (en) * | 2015-03-26 | 2019-01-09 | 東京応化工業株式会社 | Substrate peeling apparatus and substrate peeling method |
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JP6519951B2 (en) * | 2015-07-24 | 2019-05-29 | 日本電気硝子株式会社 | METHOD FOR MANUFACTURING GLASS FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE INCLUDING GLASS FILM |
JP6064015B2 (en) * | 2015-10-14 | 2017-01-18 | 東京エレクトロン株式会社 | Peeling device, peeling system and peeling method |
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CN110690158B (en) * | 2019-09-25 | 2022-03-22 | 云谷(固安)科技有限公司 | Stripping device and stripping method |
KR102220348B1 (en) * | 2019-11-26 | 2021-02-25 | 세메스 주식회사 | Wafer debonding apparatus |
CN111613555A (en) * | 2020-05-22 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Separation device and separation method |
CN112297586B (en) * | 2020-10-14 | 2023-07-28 | 河北光兴半导体技术有限公司 | Method for separating laminated glass assembly for display panel |
JP7266344B1 (en) | 2022-10-11 | 2023-04-28 | 不二越機械工業株式会社 | Peeling device and peeling method |
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Publication number | Publication date |
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TW201334090A (en) | 2013-08-16 |
JP2013147325A (en) | 2013-08-01 |
CN103219263B (en) | 2017-04-26 |
KR20130085385A (en) | 2013-07-29 |
JP5807554B2 (en) | 2015-11-10 |
CN103219263A (en) | 2013-07-24 |
KR101960103B1 (en) | 2019-03-19 |
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