TWI564096B - Method for manufacturing improved modified temperature plate - Google Patents
Method for manufacturing improved modified temperature plate Download PDFInfo
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- TWI564096B TWI564096B TW104129879A TW104129879A TWI564096B TW I564096 B TWI564096 B TW I564096B TW 104129879 A TW104129879 A TW 104129879A TW 104129879 A TW104129879 A TW 104129879A TW I564096 B TWI564096 B TW I564096B
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Description
本發明為一種均溫板，係指一種改良式均溫板的製造方法。The invention relates to a temperature equalizing plate, which refers to a method for manufacturing an improved temperature equalizing plate.
現有之均溫板為一種散熱元件，其為利用密閉於該均溫板容槽內的液體重覆進行吸熱蒸發及放熱凝結，從而達到熱傳導及熱擴散的功能，現有之均溫板已應用在電子產品中並針對易發熱的元件進行散熱，透過均溫板的使用可取代以往常用的散熱片，且均溫板的散熱效果更佳。The existing uniform temperature plate is a kind of heat dissipating component, which is characterized in that it absorbs heat and evaporates and exothermicly condenses by liquid liquid sealed in the cavity of the temperature equalizing plate, thereby achieving the functions of heat conduction and heat diffusion, and the existing uniform temperature plate has been applied to In electronic products, heat is dissipated for components that are prone to heat. The use of a uniform temperature plate can replace the conventional heat sink, and the heat dissipation effect of the temperature equalization plate is better.
現有之均溫板具有一殼體、一毛細結構及一填充抽氣通道，該殼體具有一內部空間，該毛細結構成形在該殼體的內側壁面上用以傳遞凝結的液體，該填充抽氣通道成形在該殼體的外側且連通該殼體的內部空間，現有均溫板需經過填入液體、殼體內部抽氣及密封等製程，殼體密封時，需穿入一桿體於該填充抽氣通道中，再經由機具沖壓該填充抽氣通道與該桿體，使該部分之桿體與填充抽氣通道產生變形並利用焊接方式使桿體與通道密封，最後切除突伸在填充抽氣通道外的桿體並以焊接方式密封桿體完成均溫板的製作。The conventional temperature equalizing plate has a casing, a capillary structure and a filling and exhausting passage, and the casing has an inner space formed on the inner wall surface of the casing for conveying the condensed liquid, and the filling is pumped The air passage is formed on the outer side of the casing and communicates with the inner space of the casing. The existing uniform temperature plate needs to be filled with liquid, and the inside of the casing is pumped and sealed. When the casing is sealed, a rod body needs to be inserted into the casing. In the filling and exhausting passage, the filling and exhausting passage and the rod body are punched by the implement, so that the rod body and the filling and exhausting passage are deformed and the rod body and the passage are sealed by welding, and finally the protruding protrusion is protruded The rod body outside the pumping passage is filled and the rod body is sealed by welding to complete the production of the temperature equalizing plate.
然而，現有之均溫板的後續密封製程較為繁複，因此需耗費較多的加工時間及人力成本，且製作效率低下。However, the subsequent sealing process of the existing uniform temperature plate is complicated, so it requires a lot of processing time and labor cost, and the production efficiency is low.
有鑑於前述的現有均溫板的密封製程繁複及製作效率低下之缺點，本發明提供一種改良式均溫板，以簡化均溫板的密封製程而達到提升製作效率及節省時間人力之目的。In view of the above-mentioned shortcomings of the conventional uniform temperature plate sealing process and the low production efficiency, the present invention provides an improved temperature equalizing plate, which simplifies the sealing process of the uniform temperature plate to achieve the purpose of improving the production efficiency and saving time and manpower.
本發明解決現有技術問題所提出的改良式均溫板的製造方法，其包含： 成形殼體：殼體包含有一第一殼板、一第二殼板、一通道及一毛細結構組；第一殼板橫向突出有一第一裁切部；第二殼板橫向突出有一第二裁切部，第二殼板的內側面凹設有一容槽；通道成形在第一殼板及第二殼板的內側面之間，通道的內端相通地延伸至容槽，通道的外端延伸至第一裁切部及第二裁切部，並與外界相通；毛細結構組成形於殼體內；將第一殼板及第二殼板以其內側面相結合而形成殼體； 灌入液體：將液體自該殼體的通道灌入，使該液體流入殼體內並接觸該毛細結構組； 殼體抽氣：抽取殼體內的氣體； 捏合熱封殼體通道：用沖壓機具捏合通道，並使用焊接方式以密封該通道；以及 切除兩裁切部：將殼體上的第一裁切部及第二裁切部一同切除，並使殼體上留下部份的通道。The present invention solves the problem of the prior art to improve the method of manufacturing a uniform temperature plate, comprising: forming a casing: the casing comprises a first shell plate, a second shell plate, a passage and a capillary structure group; a first cutting portion is laterally protruded from the shell plate; a second cutting portion is laterally protruded from the second shell plate; a recess is formed in the inner side surface of the second shell plate; and the passage is formed in the first shell plate and the second shell plate Between the inner side surfaces, the inner end of the passage extends to the receiving groove, the outer end of the passage extends to the first cutting portion and the second cutting portion, and communicates with the outside; the capillary structure is formed in the housing; The shell plate and the second shell plate are combined with the inner side surface thereof to form a casing; pouring liquid: pouring liquid from the passage of the casing, allowing the liquid to flow into the casing and contacting the capillary structure group; Extracting gas in the casing; kneading the heat-sealing casing passage: kneading the passage with a punching machine, and welding the passage to seal the passage; and cutting the two cutting portions: cutting the first cutting portion and the second cutting portion on the casing The part is cut together and leaves the part on the shell Channel.
本發明之優點在於，藉由使用一體成型的通道並利用沖壓機具捏合及焊接方式密封通道，最後再直接將該通道外的兩裁切部連帶部分的金屬材料一同切除，如此遺留下來的金屬材料仍封閉遺留下來的通道而可使殼體形成密封狀態，同時該改良式均溫板的外周緣亦可呈現平齊，本發明利用用沖壓機具捏合殼體通道並配合焊接方式以密封該殼體通道，以此取代以往一桿體置入通道內並加熱焊接的方式，以達到提升製作效率及節省時間人力之目的。The invention has the advantages that the channel is sealed by using an integrally formed channel and by means of kneading and welding by means of a press machine, and finally the metal material of the two portions of the cut portion outside the channel is directly cut off together, so that the left metal material is left behind. The remaining passage is still closed to form a sealed state, and the outer circumference of the improved temperature equalizing plate can also be flush. The present invention utilizes a press machine to knead the casing passage and welds the casing to seal the casing. The channel replaces the way in which a rod is placed in the channel and is heated and welded to achieve the purpose of improving production efficiency and saving time and manpower.
以第一配合圖式及本發明之較佳實施例，進一步闡述本發明為達成預定發明目的所採取之技術手段。The technical means employed by the present invention for achieving the intended purpose of the invention are further described in the first mode and the preferred embodiment of the invention.
請參閱圖1、圖2及圖8所示，本發明之改良式均溫板的製造方法之第一實施例包含有以下步驟：成形殼體S1、灌入液體S2、殼體抽氣S3、捏合熱封殼體通道S4及裁切兩裁切部S5。Referring to FIG. 1 , FIG. 2 and FIG. 8 , the first embodiment of the method for manufacturing the improved temperature equalizing plate of the present invention comprises the following steps: forming the casing S1 , filling the liquid S 2 , and pumping the casing S 3 , The heat seal housing passage S4 is kneaded and the two cut portions S5 are cut.
於成形殼體S1步驟中所形成之殼體包含有一第一殼板10、一第二殼板20、一毛細結構組及一通道40。The housing formed in the step of forming the housing S1 includes a first shell 10, a second shell 20, a capillary structure and a passage 40.
請參閱圖2及圖3所示，前述之第一殼板10為一矩形且設有一第一裁切部11，該第一裁切部11橫向突伸成形在該第一殼板10的外壁面上。Referring to FIG. 2 and FIG. 3 , the first shell plate 10 is rectangular and is provided with a first cutting portion 11 , and the first cutting portion 11 is laterally protruded and formed outside the first shell plate 10 . On the wall.
前述之第二殼板20為一矩形，且設有一容槽21及一第二裁切部22，該容槽21成形在該第二殼板20的內側面上，該第二裁切部22橫向突伸成形在第二殼板20的外環壁面上。The second cover plate 20 is a rectangular shape, and is provided with a receiving groove 21 and a second cutting portion 22 formed on the inner side surface of the second cover plate 20, the second cutting portion 22 The lateral projection is formed on the outer ring wall surface of the second shell 20.
前述之毛細結構組成形於該殼體內且包含一第一毛細結構31及一第二毛細結構32，該第一毛細結構31成形在該第一殼板10的內側面上，且該第一毛細結構31的面積及位置與該第二殼板20的容槽21的底面的面積及位置相對應，該第二毛細結構32成形在該第二殼板20之容槽21的內壁面，且具體來說係成形於容槽21的底面及環壁面，於較佳實施例中，該第一毛細結構31及該第二毛細結構32為金屬網、金屬粉末燒結或表面蝕刻所形成之孔洞；於其他實施例中，該毛細結構組亦可只包含一第一毛細結構31或一第二毛細結構32；如此本發明之殼體可以視是否設有第一毛細結構31或一第二毛細結構32而以該第一殼板10或該第二殼板20接觸待散熱之熱源。The capillary structure is formed in the housing and includes a first capillary structure 31 and a second capillary structure 32. The first capillary structure 31 is formed on the inner side surface of the first shell 10, and the first capillary The area and position of the structure 31 correspond to the area and position of the bottom surface of the recess 21 of the second shell 20, and the second capillary structure 32 is formed on the inner wall surface of the recess 21 of the second shell 20, and In the preferred embodiment, the first capillary structure 31 and the second capillary structure 32 are holes formed by metal mesh, metal powder sintering or surface etching; In other embodiments, the capillary structure group may also include only a first capillary structure 31 or a second capillary structure 32; thus, the housing of the present invention may be viewed whether a first capillary structure 31 or a second capillary structure 32 is provided. The first shell 10 or the second shell 20 contacts the heat source to be dissipated.
前述之通道40成形在該第二殼板20與該第一殼板10之間，該通道40凹設在該第二裁切部22的內側面及第二殼板20的內側面上；該通道40的內端相通地延伸至第二殼板20的容槽21，該通道40的外端延伸至該第一裁切部11及該第二裁切部22的邊緣處並與外界相通。The passage 40 is formed between the second shell 20 and the first shell 10, and the passage 40 is recessed on the inner side surface of the second cutting portion 22 and the inner side surface of the second shell 20; The inner end of the passage 40 extends to the receiving groove 21 of the second shell 20, and the outer end of the passage 40 extends to the edge of the first cutting portion 11 and the second cutting portion 22 and communicates with the outside.
請參閱圖1、圖4、圖5及圖7所示，本發明之改良式均溫板於製作過程中，首先於成形殼體步驟S1接合該第一殼板10及該第二殼板20以形成完整之殼體，接著於灌入液體步驟S2將液體60自該通道40灌入該殼體中，使該液體60流入位於該第二殼板20的的容槽21以及該第一殼板10之間，該液體60可接觸兩毛細結構31、32，該兩毛細結構31、32為提供散熱液體40的吸附回流功能，然後殼體抽氣步驟S3以一抽氣設備(圖中未示)對於該殼體的內部進行抽氣，待抽氣完成後，採取捏合熱封殼體通道步驟S4以外部沖壓工具捏合並配合焊接以密封該殼體通道，使該殼體的內部形成密封狀態，於實際應中，該焊接方法為使用雷射焊接、超音波焊接、高週波焊接或鎢極惰性氣體保護焊接，最後於裁切兩裁切部步驟S5以一裁切刀具切除突伸在該殼體外的第一裁切部11、第二裁切部22以及部分的焊接層50，則該殼體的外周緣呈現平齊，本發明之改良式均溫板利用以外部沖壓工具捏合並配合焊接以密閉該殼體，取代以一桿體置入殼體通道內並焊接並加熱焊接的方式，以達到提升製作效率及節省時間人力之目的。Referring to FIG. 1 , FIG. 4 , FIG. 5 and FIG. 7 , in the manufacturing process, the improved temperature equalizing plate is first joined to the first shell plate 10 and the second shell plate 20 in the forming shell step S1 . To form a complete casing, the liquid 60 is then poured into the casing from the passage 40 in the liquid filling step S2, so that the liquid 60 flows into the receiving groove 21 of the second casing 20 and the first casing. Between the plates 10, the liquid 60 can contact the two capillary structures 31, 32 for providing an adsorption recirculation function of the heat-dissipating liquid 40, and then the casing pumping step S3 is performed by a pumping device (not shown) The inside of the casing is evacuated, and after the pumping is completed, the heat sealing casing passage is taken to step S4, and the external punching tool is kneaded and welded to seal the casing passage to seal the inside of the casing. State, in actual application, the welding method is to use laser welding, ultrasonic welding, high frequency welding or tungsten inert gas protection welding, and finally in the cutting two cutting part step S5 with a cutting tool cut out a first cutting portion 11 , a second cutting portion 22 and a portion outside the housing The welding layer 50, the outer circumference of the casing is flush, and the improved temperature equalizing plate of the present invention is sealed by external pressing tools to seal the casing instead of being placed into the casing passage by a rod body. Welding and heating the welding method to achieve the purpose of improving production efficiency and saving time and manpower.
請參閱圖6及圖7所示，本創作之製造方法之第二實施例與第一實施例大致相同，但第二實施例在成形殼體S1步驟中，該第一殼板及該第二殼板70均為五邊形，且該第一殼板及該第二殼板70的其中四邊依序相垂直，剩餘之一邊為斜向設置，該第一裁切部及第二裁切部72分別成形在該第一殼板及第二殼板70的斜向邊上。Referring to FIG. 6 and FIG. 7, the second embodiment of the manufacturing method of the present invention is substantially the same as the first embodiment, but in the second embodiment, in the step of forming the casing S1, the first shell and the second The shell plates 70 are all pentagonal, and the four sides of the first shell plate and the second shell plate 70 are sequentially perpendicular to each other, and the remaining one side is obliquely disposed, and the first cutting portion and the second cutting portion are disposed. 72 are formed on the oblique sides of the first and second shell plates 70, respectively.
在其他實施例中，於「成形殼體」S1步驟中，該殼體之通道40亦可凹設成形在該第一裁切部11的內側面及第一殼板10的內側面上，或者是同時凹設成形在該兩裁切部11、22的內側面及兩殼板10、20的內側面上，如此皆可達成本發明的創作目的。In other embodiments, in the step of forming the housing S1, the passage 40 of the housing may be recessed and formed on the inner side surface of the first cutting portion 11 and the inner side surface of the first shell 10, or At the same time, it is concavely formed on the inner side surfaces of the two cutting portions 11, 22 and the inner side surfaces of the two shell plates 10, 20, so that the purpose of the invention can be achieved.
以上所述僅是本發明的較佳實施例而已，並非對本發明做任何形式上的限制，雖然本發明已以較佳實施例揭露如上，然而並非用以限定本發明，任何熟悉本專業的技術人員，在不脫離本發明技術方案的範圍內，當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例，但凡是未脫離本發明技術方案的內容，依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾，均仍屬於本發明技術方案的範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments.
10‧‧‧第一殼板
11‧‧‧第一裁切部
20‧‧‧第二殼板
21‧‧‧容槽
22‧‧‧第二裁切部
31‧‧‧第一毛細結構
32‧‧‧第二毛細結構
40‧‧‧通道
50‧‧‧焊接層
60‧‧‧散熱液體
70‧‧‧第二殼板
71‧‧‧容槽
72‧‧‧第二裁切部
80‧‧‧通道10‧‧‧First shell
11‧‧‧First Cutting Department
20‧‧‧Second shell
21‧‧‧ 容容
22‧‧‧ Second Cutting Department
31‧‧‧First capillary structure
32‧‧‧Second capillary structure
40‧‧‧ channel
50‧‧‧welding layer
60‧‧‧heating liquid
70‧‧‧Second shell
71‧‧‧ 容容
72‧‧‧Second cutting department
80‧‧‧ channel
圖1為本發明第一實施例的外觀立體圖。 圖2為本發明第一實施例的元件分解圖。 圖3為本發明第一實施例經熱封後的正視剖面圖。 圖4為本發明第一實施例經裁切後的正視剖面圖。 圖5為本發明第一實施例經裁切後的外觀立體圖 圖6為本發明第二實施例的俯視圖。 圖7為本發明第二實施例經裁切後的俯視圖。 圖8為本發明的製作流程方塊圖。Fig. 1 is a perspective view showing the appearance of a first embodiment of the present invention. Figure 2 is an exploded view of the first embodiment of the present invention. Figure 3 is a front cross-sectional view of the first embodiment of the present invention after heat sealing. Figure 4 is a front cross-sectional view of the first embodiment of the present invention after cutting. Fig. 5 is a perspective view showing the appearance of the first embodiment of the present invention. Fig. 6 is a plan view showing a second embodiment of the present invention. Figure 7 is a plan view of a second embodiment of the present invention after being cut. Figure 8 is a block diagram of the manufacturing process of the present invention.
10‧‧‧第一殼板 10‧‧‧First shell
11‧‧‧第一裁切部 11‧‧‧First Cutting Department
20‧‧‧第二殼板 20‧‧‧Second shell
21‧‧‧容槽 21‧‧‧ 容容
22‧‧‧第二裁切部 22‧‧‧Second Cutting Department
40‧‧‧通道 40‧‧‧ channel
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| CN101298129B (en) * | 2007-04-30 | 2010-06-09 | 三芳化学工业股份有限公司 | Combined adsorption gasket for fixing substrate and manufacturing method thereof |
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| TWM501091U (en) * | 2014-12-05 | 2015-05-11 | Asia Vital Components Co Ltd | Structure of support for temperature-equalisation plate |
-
2015
- 2015-09-10 TW TW104129879A patent/TWI564096B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101298129B (en) * | 2007-04-30 | 2010-06-09 | 三芳化学工业股份有限公司 | Combined adsorption gasket for fixing substrate and manufacturing method thereof |
| TWM421486U (en) * | 2011-08-29 | 2012-01-21 | Asia Vital Components Co Ltd | Structure of uniform temperature plate |
| TWM501091U (en) * | 2014-12-05 | 2015-05-11 | Asia Vital Components Co Ltd | Structure of support for temperature-equalisation plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
| CN114485236A (en) * | 2020-10-27 | 2022-05-13 | 昆山巨仲电子有限公司 | Temperature equalizing plate structure and capillary layer structure thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201709999A (en) | 2017-03-16 |
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