TWI563342B - Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring board - Google Patents
Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring boardInfo
- Publication number
- TWI563342B TWI563342B TW100125622A TW100125622A TWI563342B TW I563342 B TWI563342 B TW I563342B TW 100125622 A TW100125622 A TW 100125622A TW 100125622 A TW100125622 A TW 100125622A TW I563342 B TWI563342 B TW I563342B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- print wiring
- resist pattern
- resin compound
- forming resist
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/0285—Silver salts, e.g. a latent silver salt image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010173082 | 2010-07-30 | ||
JP2011136640A JP6022749B2 (en) | 2010-07-30 | 2011-06-20 | Photosensitive resin composition, photosensitive element, method for producing resist pattern, method for producing lead frame, and method for producing printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201214041A TW201214041A (en) | 2012-04-01 |
TWI563342B true TWI563342B (en) | 2016-12-21 |
Family
ID=45903090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100125622A TWI563342B (en) | 2010-07-30 | 2011-07-20 | Photosensitive resin compound, photosensitive element, method for forming resist pattern, method for producing print wiring board, and print wiring board |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6022749B2 (en) |
KR (1) | KR101885928B1 (en) |
TW (1) | TWI563342B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5948539B2 (en) * | 2012-01-27 | 2016-07-06 | 旭化成株式会社 | Photosensitive resin composition |
JP5993582B2 (en) * | 2012-02-28 | 2016-09-14 | 第一工業製薬株式会社 | Reactive composition comprising alkylene oxide-modified dipentaerythritol acrylate |
KR102171606B1 (en) * | 2012-11-20 | 2020-10-29 | 쇼와덴코머티리얼즈가부시끼가이샤 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
JP6120560B2 (en) * | 2012-12-26 | 2017-04-26 | 第一工業製薬株式会社 | Color filter, black matrix, or curable resin composition for circuit formation |
JP6432511B2 (en) * | 2013-07-23 | 2018-12-05 | 日立化成株式会社 | Photosensitive resin composition for projection exposure, photosensitive element, resist pattern forming method, printed wiring board manufacturing method, and lead frame manufacturing method |
KR20160131084A (en) * | 2014-05-21 | 2016-11-15 | 아사히 가세이 가부시키가이샤 | Photosensitive resin composition and method for forming circuit pattern |
TWI620017B (en) | 2015-04-08 | 2018-04-01 | Asahi Chemical Ind | Photosensitive resin composition |
JPWO2017130427A1 (en) * | 2016-01-28 | 2018-12-20 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, resist pattern forming method, and touch panel manufacturing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008116751A (en) * | 2006-11-06 | 2008-05-22 | Asahi Kasei Electronics Co Ltd | Photosensitive resin composition and laminate |
TW200910008A (en) * | 2007-05-11 | 2009-03-01 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4651534B2 (en) * | 2005-07-14 | 2011-03-16 | 富士フイルム株式会社 | Pattern forming material, pattern forming apparatus and permanent pattern forming method |
JP2007178459A (en) * | 2005-12-26 | 2007-07-12 | Fujifilm Corp | Pattern-forming material, pattern-forming device, and pattern forming method |
JP2007197390A (en) * | 2006-01-27 | 2007-08-09 | Fujifilm Corp | Oxime derivative, photosensitive composition, pattern-forming material, photosensitive laminate, pattern-forming device and method for forming pattern |
TW200745749A (en) * | 2006-02-21 | 2007-12-16 | Hitachi Chemical Co Ltd | Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel |
KR101289569B1 (en) * | 2006-12-19 | 2013-07-24 | 히타치가세이가부시끼가이샤 | Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board |
JP5252963B2 (en) * | 2007-04-17 | 2013-07-31 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition and laminate |
JP2010122381A (en) * | 2008-11-18 | 2010-06-03 | Hitachi Chem Co Ltd | Black photosensitive resin composition, method for producing black matrix, method for producing color filter, and color filter |
JP2010152345A (en) * | 2008-11-25 | 2010-07-08 | Asahi Kasei E-Materials Corp | Photosensitive resin composition and its use |
-
2011
- 2011-06-20 JP JP2011136640A patent/JP6022749B2/en active Active
- 2011-07-20 TW TW100125622A patent/TWI563342B/en active
- 2011-07-29 KR KR1020110075595A patent/KR101885928B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008116751A (en) * | 2006-11-06 | 2008-05-22 | Asahi Kasei Electronics Co Ltd | Photosensitive resin composition and laminate |
TW200910008A (en) * | 2007-05-11 | 2009-03-01 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JP2012048202A (en) | 2012-03-08 |
KR20120022586A (en) | 2012-03-12 |
TW201214041A (en) | 2012-04-01 |
JP6022749B2 (en) | 2016-11-09 |
KR101885928B1 (en) | 2018-08-06 |
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