TWI562312B - Chip-on-film package structure - Google Patents
Chip-on-film package structureInfo
- Publication number
- TWI562312B TWI562312B TW103110877A TW103110877A TWI562312B TW I562312 B TWI562312 B TW I562312B TW 103110877 A TW103110877 A TW 103110877A TW 103110877 A TW103110877 A TW 103110877A TW I562312 B TWI562312 B TW I562312B
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- package structure
- film package
- film
- package
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103110877A TWI562312B (en) | 2014-03-24 | 2014-03-24 | Chip-on-film package structure |
CN201410319830.0A CN104952830A (en) | 2014-03-24 | 2014-07-07 | Thin Film Flip Chip Packaging Structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103110877A TWI562312B (en) | 2014-03-24 | 2014-03-24 | Chip-on-film package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201537713A TW201537713A (en) | 2015-10-01 |
TWI562312B true TWI562312B (en) | 2016-12-11 |
Family
ID=54167385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103110877A TWI562312B (en) | 2014-03-24 | 2014-03-24 | Chip-on-film package structure |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104952830A (en) |
TW (1) | TWI562312B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170192453A1 (en) * | 2015-12-30 | 2017-07-06 | Novatek Microelectronics Corp. | Wearable device with a chip on film package structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200822303A (en) * | 2006-11-07 | 2008-05-16 | Chipmos Technologies Inc | Substrate for chip on film packages |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590336A (en) * | 1991-09-30 | 1993-04-09 | Mitsubishi Electric Corp | Tape carrier package |
KR960001345B1 (en) * | 1992-08-28 | 1996-01-26 | 금성일렉트론주식회사 | Glass lead mounting style semiconductor device |
KR100384437B1 (en) * | 1995-02-28 | 2003-08-21 | 텍사스 인스트루먼츠 인코포레이티드 | Semiconductor device and assembly method thereof |
JP4056424B2 (en) * | 2003-05-16 | 2008-03-05 | シャープ株式会社 | Manufacturing method of semiconductor device |
JP2005109377A (en) * | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Semiconductor device and manufacturing method therefor |
JP2005175205A (en) * | 2003-12-11 | 2005-06-30 | Shinko Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
CN100539110C (en) * | 2007-01-22 | 2009-09-09 | 南茂科技股份有限公司 | Preventing that film from subsiding forms the thin-film flip-chip packaging construction of filler bubble |
TW201121006A (en) * | 2009-12-03 | 2011-06-16 | Hannstar Display Corp | Connection structure for chip-on-glass driver IC and connection method therefor |
-
2014
- 2014-03-24 TW TW103110877A patent/TWI562312B/en active
- 2014-07-07 CN CN201410319830.0A patent/CN104952830A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200822303A (en) * | 2006-11-07 | 2008-05-16 | Chipmos Technologies Inc | Substrate for chip on film packages |
Also Published As
Publication number | Publication date |
---|---|
TW201537713A (en) | 2015-10-01 |
CN104952830A (en) | 2015-09-30 |
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