TWI562263B - - Google Patents
Info
- Publication number
- TWI562263B TWI562263B TW103125855A TW103125855A TWI562263B TW I562263 B TWI562263 B TW I562263B TW 103125855 A TW103125855 A TW 103125855A TW 103125855 A TW103125855 A TW 103125855A TW I562263 B TWI562263 B TW I562263B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013166600A JP6341641B2 (en) | 2013-08-09 | 2013-08-09 | Die bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201521138A TW201521138A (en) | 2015-06-01 |
| TWI562263B true TWI562263B (en) | 2016-12-11 |
Family
ID=52502785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103125855A TW201521138A (en) | 2013-08-09 | 2014-07-29 | Collet and die bonder |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6341641B2 (en) |
| KR (1) | KR101666276B1 (en) |
| CN (1) | CN104347435B (en) |
| TW (1) | TW201521138A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900575B (en) * | 2015-06-23 | 2018-11-20 | 上海航天电子通讯设备研究所 | Chip positioning fixture, manufacturing method and the chip conveyer method of Vacuum Eutectic weldering |
| JP6705668B2 (en) * | 2016-03-11 | 2020-06-03 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
| CN107403755A (en) * | 2016-05-19 | 2017-11-28 | 胡川 | Chip manufacture method |
| WO2018146880A1 (en) * | 2017-02-09 | 2018-08-16 | ボンドテック株式会社 | Component mounting system, resin shaping device, component mounting method, and resin shaping method |
| JP6846958B2 (en) * | 2017-03-09 | 2021-03-24 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| JP7033878B2 (en) * | 2017-10-16 | 2022-03-11 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment |
| CN109616430B (en) * | 2018-11-13 | 2020-10-30 | 武汉电信器件有限公司 | Chip mounting identification system and method |
| CN109891569B (en) * | 2019-01-29 | 2024-04-02 | 京东方科技集团股份有限公司 | Element pickup device, and preparation method and application method thereof |
| TWI748763B (en) * | 2020-11-23 | 2021-12-01 | 鴻勁精密股份有限公司 | Picking assembly and operating apparatus using the same |
| CN112735982B9 (en) * | 2020-12-30 | 2021-10-08 | 江苏新智达新能源设备有限公司 | Crystal taking and crystal fixing device for blue film of wafer |
| CN112846521B (en) * | 2020-12-31 | 2024-03-12 | 大族激光科技产业集团股份有限公司 | Clamp and laser marking system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060094387A (en) * | 2005-02-24 | 2006-08-29 | 삼성테크윈 주식회사 | Apparatus for separating chip |
| US20110308738A1 (en) * | 2010-06-17 | 2011-12-22 | Hiroshi Maki | Die bonder, pickup method, and pickup device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732190B2 (en) * | 1990-10-12 | 1995-04-10 | 同和鉱業株式会社 | Semiconductor pellet pickup method |
| JP4140190B2 (en) * | 2000-11-22 | 2008-08-27 | 松下電器産業株式会社 | Electronic component mounting method |
| KR100769111B1 (en) * | 2006-03-13 | 2007-10-22 | 캐논 머시너리 가부시키가이샤 | Collet, die bonder, and chip pick-up method |
| JP2009200377A (en) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | Die bonding device |
| JP5065969B2 (en) | 2008-03-31 | 2012-11-07 | 株式会社日立ハイテクインスツルメンツ | Component mounting equipment |
| JP5989313B2 (en) * | 2011-09-15 | 2016-09-07 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| JP5814713B2 (en) * | 2011-09-16 | 2015-11-17 | ファスフォードテクノロジ株式会社 | Die bonder and die bonding method |
-
2013
- 2013-08-09 JP JP2013166600A patent/JP6341641B2/en active Active
-
2014
- 2014-07-29 TW TW103125855A patent/TW201521138A/en unknown
- 2014-08-05 KR KR1020140100346A patent/KR101666276B1/en active IP Right Grant
- 2014-08-08 CN CN201410389939.1A patent/CN104347435B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060094387A (en) * | 2005-02-24 | 2006-08-29 | 삼성테크윈 주식회사 | Apparatus for separating chip |
| US20110308738A1 (en) * | 2010-06-17 | 2011-12-22 | Hiroshi Maki | Die bonder, pickup method, and pickup device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015035548A (en) | 2015-02-19 |
| CN104347435B (en) | 2018-09-11 |
| KR101666276B1 (en) | 2016-10-13 |
| CN104347435A (en) | 2015-02-11 |
| JP6341641B2 (en) | 2018-06-13 |
| KR20150018405A (en) | 2015-02-23 |
| TW201521138A (en) | 2015-06-01 |