TWI562190B - - Google Patents
Info
- Publication number
- TWI562190B TWI562190B TW104124838A TW104124838A TWI562190B TW I562190 B TWI562190 B TW I562190B TW 104124838 A TW104124838 A TW 104124838A TW 104124838 A TW104124838 A TW 104124838A TW I562190 B TWI562190 B TW I562190B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104124838A TW201705183A (en) | 2015-07-31 | 2015-07-31 | Very-high-frequency (VHF) plasma simulation device and VHF plasma characteristic measurement method reducing time, space and condition errors by disposing plasma measurement probes at four diagonal points and a central position of the parallel plate electrodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104124838A TW201705183A (en) | 2015-07-31 | 2015-07-31 | Very-high-frequency (VHF) plasma simulation device and VHF plasma characteristic measurement method reducing time, space and condition errors by disposing plasma measurement probes at four diagonal points and a central position of the parallel plate electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI562190B true TWI562190B (en) | 2016-12-11 |
| TW201705183A TW201705183A (en) | 2017-02-01 |
Family
ID=58227337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104124838A TW201705183A (en) | 2015-07-31 | 2015-07-31 | Very-high-frequency (VHF) plasma simulation device and VHF plasma characteristic measurement method reducing time, space and condition errors by disposing plasma measurement probes at four diagonal points and a central position of the parallel plate electrodes |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201705183A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5451784A (en) * | 1994-10-31 | 1995-09-19 | Applied Materials, Inc. | Composite diagnostic wafer for semiconductor wafer processing systems |
| TWI342898B (en) * | 2003-08-14 | 2011-06-01 | Advanced Energy Ind Inc | Sensor array for measuring plasma characteristics in plasma processing environments |
| TW201202685A (en) * | 2003-04-24 | 2012-01-16 | Tokyo Electron Ltd | Method and apparatus for measuring electron density of plasma and plasma processing apparatus |
| TW201220392A (en) * | 2010-10-05 | 2012-05-16 | Skyworks Solutions Inc | Apparatus and methods for electrical measurements in a plasma etcher |
| TWI466158B (en) * | 2009-07-03 | 2014-12-21 | Univ Lunghwa Sci & Technology | Plasma measurement device, plasma system, and method for measuring plasma characteristics |
-
2015
- 2015-07-31 TW TW104124838A patent/TW201705183A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5451784A (en) * | 1994-10-31 | 1995-09-19 | Applied Materials, Inc. | Composite diagnostic wafer for semiconductor wafer processing systems |
| TW201202685A (en) * | 2003-04-24 | 2012-01-16 | Tokyo Electron Ltd | Method and apparatus for measuring electron density of plasma and plasma processing apparatus |
| TWI342898B (en) * | 2003-08-14 | 2011-06-01 | Advanced Energy Ind Inc | Sensor array for measuring plasma characteristics in plasma processing environments |
| TWI466158B (en) * | 2009-07-03 | 2014-12-21 | Univ Lunghwa Sci & Technology | Plasma measurement device, plasma system, and method for measuring plasma characteristics |
| TW201220392A (en) * | 2010-10-05 | 2012-05-16 | Skyworks Solutions Inc | Apparatus and methods for electrical measurements in a plasma etcher |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201705183A (en) | 2017-02-01 |