TWI561600B - - Google Patents
Info
- Publication number
- TWI561600B TWI561600B TW102127913A TW102127913A TWI561600B TW I561600 B TWI561600 B TW I561600B TW 102127913 A TW102127913 A TW 102127913A TW 102127913 A TW102127913 A TW 102127913A TW I561600 B TWI561600 B TW I561600B
- Authority
- TW
- Taiwan
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29075—Plural core members
- H01L2224/2908—Plural core members being stacked
- H01L2224/29082—Two-layer arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L24/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wood Science & Technology (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012173448 | 2012-08-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201422745A TW201422745A (zh) | 2014-06-16 |
TWI561600B true TWI561600B (zh) | 2016-12-11 |
Family
ID=50028120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102127913A TW201422745A (zh) | 2012-08-03 | 2013-08-02 | 異向性導電膜及其製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9585247B2 (zh) |
JP (1) | JP6056700B2 (zh) |
KR (1) | KR101741340B1 (zh) |
CN (1) | CN104508064B (zh) |
HK (1) | HK1205176A1 (zh) |
TW (1) | TW201422745A (zh) |
WO (1) | WO2014021457A1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015149126A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
KR102450569B1 (ko) * | 2014-02-04 | 2022-10-04 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그 제조 방법 |
JP6233069B2 (ja) * | 2014-02-04 | 2017-11-22 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP6237288B2 (ja) * | 2014-02-04 | 2017-11-29 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP6409281B2 (ja) * | 2014-02-04 | 2018-10-24 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP6269114B2 (ja) * | 2014-02-04 | 2018-01-31 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP6661969B2 (ja) * | 2014-10-28 | 2020-03-11 | デクセリアルズ株式会社 | 異方性導電フィルム及び接続構造体 |
TWI781710B (zh) * | 2014-10-28 | 2022-10-21 | 日商迪睿合股份有限公司 | 異向性導電膜、其製造方法及連接構造體 |
CN106318244A (zh) * | 2015-07-02 | 2017-01-11 | 玮锋科技股份有限公司 | 核层技术异方性导电胶膜 |
JP6776609B2 (ja) * | 2016-02-22 | 2020-10-28 | デクセリアルズ株式会社 | 異方性導電フィルム |
WO2017191772A1 (ja) * | 2016-05-05 | 2017-11-09 | デクセリアルズ株式会社 | フィラー配置フィルム |
KR20190051996A (ko) * | 2016-08-23 | 2019-05-15 | 유니버시티 오브 매사추세츠 | 중합 조성물, 이의 제조 방법 및 이를 포함하는 물품 |
JP7062389B2 (ja) * | 2017-08-23 | 2022-05-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
WO2019050012A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2019050011A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2019050005A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 接着剤フィルム収容セット及びその製造方法 |
JPWO2020184583A1 (zh) * | 2019-03-13 | 2020-09-17 | ||
KR20210141535A (ko) | 2019-03-13 | 2021-11-23 | 쇼와덴코머티리얼즈가부시끼가이샤 | 회로 접속용 접착제 필름 및 그 제조 방법, 회로 접속 구조체의 제조 방법, 및, 접착제 필름 수용 세트 |
JP7480772B2 (ja) | 2019-03-13 | 2024-05-10 | 株式会社レゾナック | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
JP2020073404A (ja) * | 2019-09-30 | 2020-05-14 | 日立化成株式会社 | 異方導電フィルム用リール及び異方導電フィルム巻 |
KR20230034223A (ko) * | 2020-07-07 | 2023-03-09 | 레조낙 가부시끼가이샤 | 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법 |
WO2022059647A1 (ja) * | 2020-09-15 | 2022-03-24 | 昭和電工マテリアルズ株式会社 | 回路接続用接着剤フィルム及びその製造方法、並びに、回路接続構造体の製造方法 |
JPWO2023074474A1 (zh) * | 2021-10-29 | 2023-05-04 | ||
JP2024025090A (ja) * | 2022-08-10 | 2024-02-26 | 株式会社レゾナック | 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法 |
Citations (2)
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JP2003286457A (ja) * | 2002-03-28 | 2003-10-10 | Asahi Kasei Corp | 異方導電性接着シートおよびその製造方法 |
CN101601171A (zh) * | 2007-07-03 | 2009-12-09 | 索尼化学&信息部件株式会社 | 各向异性导电膜和其制造方法以及接合体 |
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JPH03107888A (ja) * | 1989-09-21 | 1991-05-08 | Sharp Corp | 回路基板の接続構造 |
KR930007065B1 (ko) | 1991-01-30 | 1993-07-26 | 삼성전자 주식회사 | 전자카메라시스템에 있어서 재생시 화면편집장치 |
JPH04366630A (ja) * | 1991-06-13 | 1992-12-18 | Sharp Corp | 異方性導電接着テープ |
JPH0512176A (ja) | 1991-07-03 | 1993-01-22 | Nec Corp | 情報処理システム |
JP4032439B2 (ja) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
JP3678547B2 (ja) | 1997-07-24 | 2005-08-03 | ソニーケミカル株式会社 | 多層異方導電性接着剤およびその製造方法 |
JPH11135567A (ja) * | 1997-10-30 | 1999-05-21 | Toshiba Corp | 異方性導電膜、半導体装置の製造方法 |
AU2327400A (en) * | 1999-02-08 | 2000-08-25 | Hitachi Chemical Co. Ltd. | Adhesive, electrode-connecting structure, and method of connecting electrodes |
JP2000348538A (ja) * | 1999-06-04 | 2000-12-15 | Tomoegawa Paper Co Ltd | 異方性導電フィルムおよびその製造方法 |
JP2003049152A (ja) * | 2001-08-02 | 2003-02-21 | Hitachi Chem Co Ltd | 回路接続用接着剤及びそれを用いた接続方法、接続構造体 |
JP4366630B2 (ja) | 2003-06-06 | 2009-11-18 | 靜甲株式会社 | 物品集積搬送カートン充填システム |
JP4822322B2 (ja) * | 2003-12-04 | 2011-11-24 | 旭化成イーマテリアルズ株式会社 | 異方導電性接着シートの製造方法 |
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- 2013-08-02 CN CN201380041047.6A patent/CN104508064B/zh active Active
- 2013-08-02 TW TW102127913A patent/TW201422745A/zh unknown
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- 2013-08-02 JP JP2013161328A patent/JP6056700B2/ja active Active
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2015
- 2015-06-24 HK HK15105981.3A patent/HK1205176A1/zh unknown
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KR20150039743A (ko) | 2015-04-13 |
TW201422745A (zh) | 2014-06-16 |
KR101741340B1 (ko) | 2017-05-29 |
CN104508064A (zh) | 2015-04-08 |
WO2014021457A1 (ja) | 2014-02-06 |
JP6056700B2 (ja) | 2017-01-11 |
HK1205176A1 (zh) | 2015-12-11 |
US20150271918A1 (en) | 2015-09-24 |
JP2014043574A (ja) | 2014-03-13 |
CN104508064B (zh) | 2016-10-12 |
US9585247B2 (en) | 2017-02-28 |