TWI559827B - Flexible electronic module and manufacturing method thereof - Google Patents
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Description
本發明是有關於一種電子模組及其製造方法,且特別是有關於一種可撓式電子模組及其製造方法。The invention relates to an electronic module and a manufacturing method thereof, and in particular to a flexible electronic module and a manufacturing method thereof.
傳統的電子產品為了達到電性品質的穩定性及導電線路的可靠度及耐用性,通常是將電子元件製作於硬質載板上,如此能避免電子產品因形變而使導電線路的品質受到影響或甚至使導電線路斷裂或晶片毀損。然而,將電子元件製作於硬質載板上將使電子產品的應用性大大地受到了限制。舉例而言,面積過大的電子產品將難以隨身攜帶,亦難以讓使用者穿戴,且亦不便收藏。此外,這種電子產品亦難以做到緊貼於人類、動植物或機械結構之具有彎曲表面的部分。In order to achieve the stability of electrical quality and the reliability and durability of conductive circuits, traditional electronic products usually make electronic components on rigid carrier boards, so as to avoid the influence of electronic products on the quality of conductive circuits due to deformation or Even the conductive line is broken or the wafer is damaged. However, the fabrication of electronic components on a rigid carrier will greatly limit the applicability of electronic products. For example, an oversized electronic product will be difficult to carry around, and it will be difficult for the user to wear it, and it is also inconvenient to collect. In addition, such electronic products are also difficult to adhere to a curved surface of a human, animal or plant or mechanical structure.
隨著製程技術的進步,一些可撓式電子產品被發展出來。然而,這些可撓式電子產品在形變上仍有一定的限制,例如其雖為可彎曲、可彎摺,但仍無法伸縮,使得這類可撓式電子產品在應用上仍有一些限制。With the advancement of process technology, some flexible electronic products have been developed. However, these flexible electronic products still have certain limitations in deformation. For example, although they are bendable and bendable, they still cannot be stretched, and there are still some limitations in the application of such flexible electronic products.
本發明實施例提供一種可撓式電子模組,其能夠隨使用需求伸縮。Embodiments of the present invention provide a flexible electronic module that can be expanded and contracted according to usage requirements.
本發明實施例提供一種可撓式電子模組的製造方法,其可製造出能夠伸縮的可撓式電子模組。Embodiments of the present invention provide a method of manufacturing a flexible electronic module, which can manufacture a flexible electronic module capable of stretching and contracting.
本發明的一實施例的可撓式電子模組包括一圖案化軟性基板、一可伸縮材料層及至少一電子元件。圖案化軟性基板包括至少一分佈區域,且可伸縮材料層連接分佈區域。電子元件配置於圖案化軟性基板與可伸縮材料層的至少其中之一上。此至少一電子元件包括一可拉伸導線。A flexible electronic module according to an embodiment of the invention includes a patterned flexible substrate, a layer of stretchable material, and at least one electronic component. The patterned flexible substrate includes at least one distribution region, and the layer of expandable material connects the distribution regions. The electronic component is disposed on at least one of the patterned flexible substrate and the layer of the stretchable material. The at least one electronic component includes a stretchable wire.
在本發明的一實施例中,圖案化軟性基板的楊氏係數與可伸縮材料層的楊氏係數的比值大於或等於10。In an embodiment of the invention, the ratio of the Young's modulus of the patterned flexible substrate to the Young's modulus of the layer of the stretchable material is greater than or equal to 10.
在本發明的一實施例中,至少部分分佈區域為彼此分離的多個島狀結構。In an embodiment of the invention, the at least partially distributed regions are a plurality of island-like structures separated from each other.
在本發明的一實施例中,至少部分分佈區域為多個凸出結構,圖案化軟性基板在相鄰的二凸出結構間具有一凹陷,且相鄰的二凸出結構藉由凹陷的底部相連。In an embodiment of the invention, at least a portion of the distribution region is a plurality of protruding structures, the patterned flexible substrate has a recess between adjacent two protruding structures, and the adjacent two protruding structures are formed by the bottom of the recess Connected.
在本發明的一實施例中,可撓式電子模組更包括一覆蓋層,其中圖案化軟性基板配置於可伸縮材料層與覆蓋層之間,且覆蓋層的材料為可伸縮材料。In an embodiment of the invention, the flexible electronic module further includes a cover layer, wherein the patterned flexible substrate is disposed between the layer of the stretchable material and the cover layer, and the material of the cover layer is a stretchable material.
在本發明的一實施例中,可撓式電子模組更包括一離型層,配置於圖案化軟性基板上。In an embodiment of the invention, the flexible electronic module further includes a release layer disposed on the patterned flexible substrate.
在本發明的一實施例中,離型層更配置於可伸縮材料層上。In an embodiment of the invention, the release layer is disposed on the layer of stretchable material.
在本發明的一實施例中,可伸縮材料層對圖案化軟性基板的附著力大於圖案化軟性基板對離型層的附著力。In an embodiment of the invention, the adhesion of the stretchable material layer to the patterned flexible substrate is greater than the adhesion of the patterned flexible substrate to the release layer.
在本發明的一實施例中,至少一電子元件包括多個第一電極,可伸縮材料層分佈於這些第一電極之間,且圖案化軟性基板、可伸縮材料層及至少一電子元件形成一可撓式電路板。In an embodiment of the invention, at least one electronic component includes a plurality of first electrodes, a layer of a stretchable material is disposed between the first electrodes, and the patterned flexible substrate, the layer of the stretchable material, and the at least one electronic component form a Flexible circuit board.
在本發明的一實施例中,可撓式電子模組更包括一可撓式電子裝置,其包括多個第二電極,這些第二電極透過一異方性導電膜分別與這些第一電極電性連接,或分別透過多個異方性導電膜分別與這些第一電極電性連接。In an embodiment of the invention, the flexible electronic module further includes a flexible electronic device including a plurality of second electrodes, wherein the second electrodes are electrically connected to the first electrodes through an anisotropic conductive film The first electrode is electrically connected to each other through a plurality of anisotropic conductive films.
在本發明的一實施例中,可撓式電子裝置包括另一圖案化軟性基板及另一可伸縮材料層。此另一圖案化軟性基板包括至少另一分佈區域,其中這些第二電極配置於另一分佈區域上。此另一可伸縮材料層連接這些分佈區域,且配置於這些第二電極之間。In an embodiment of the invention, the flexible electronic device includes another patterned flexible substrate and another layer of stretchable material. The other patterned flexible substrate includes at least another distribution region, wherein the second electrodes are disposed on another distribution region. This further layer of stretchable material joins these distribution regions and is disposed between these second electrodes.
本發明的一實施例的可撓式電子模組的製造方法包括:形成一軟性基板;圖案化軟性基板,以形成至少一分佈區域;形成連接分佈區域的一可伸縮材料層;以及在軟性基板與可伸縮材料層的至少其中之一上形成至少一電子元件。A method of manufacturing a flexible electronic module according to an embodiment of the present invention includes: forming a flexible substrate; patterning the flexible substrate to form at least one distribution region; forming a layer of a stretchable material connecting the distribution regions; and forming a flexible substrate Forming at least one electronic component on at least one of the layers of the stretchable material.
在本發明的一實施例中,在軟性基板與可伸縮材料層的至少其中之一上形成至少一電子元件包括:在圖案化前的軟性基板上形成一導電層;以及圖案化導電層,以形成至少一電子元件。In an embodiment of the invention, forming at least one electronic component on at least one of the flexible substrate and the stretchable material layer comprises: forming a conductive layer on the flexible substrate before patterning; and patterning the conductive layer to At least one electronic component is formed.
在本發明的一實施例中,圖案化軟性基板包括:在軟性基板上形成包覆電子元件的一圖案化遮罩層;以及以圖案化遮罩層作為阻擋層而蝕刻、刨除或壓印軟性基板被圖案化遮罩層所曝露出的部分,以形成分佈區域。In an embodiment of the invention, the patterned flexible substrate comprises: forming a patterned mask layer covering the electronic component on the flexible substrate; and etching, removing or stamping the soft layer with the patterned mask layer as a barrier layer The substrate is patterned to expose portions of the mask layer to form a distribution region.
在本發明的一實施例中,形成連接分佈區域的可伸縮材料層包括:在軟性基板上形成可伸縮材料層,並使可伸縮材料層填充於分佈區域的間隙中,且使可伸縮材料層包覆電子元件。In an embodiment of the invention, forming the layer of the stretchable material connecting the distribution regions comprises: forming a layer of the stretchable material on the flexible substrate, filling the layer of the stretchable material in the gap of the distribution region, and making the layer of the stretchable material Cover electronic components.
在本發明的一實施例中,在軟性基板與可伸縮材料層的至少其中之一上形成至少一電子元件包括:在可伸縮材料層上形成一導電層;以及圖案化導電層,以形成至少一電子元件。In an embodiment of the invention, forming at least one electronic component on at least one of the flexible substrate and the stretchable material layer comprises: forming a conductive layer on the stretchable material layer; and patterning the conductive layer to form at least An electronic component.
在本發明的一實施例中,可撓式電子模組的製造方法更包括:利用一凸塊膜具壓印可伸縮材料層,以使可伸縮材料層形成圖案。In an embodiment of the invention, the manufacturing method of the flexible electronic module further comprises: stamping the layer of the stretchable material with a bump film to form a pattern of the stretchable material layer.
在本發明的一實施例中,可撓式電子模組的製造方法更包括:在形成軟性基板之前,在一硬質載板上形成一離型層,其中形成軟性基板包括在離型層上形成軟性基板,且離型層對軟性基板的附著力大於離型層對硬質載板的附著力。In an embodiment of the invention, the manufacturing method of the flexible electronic module further comprises: forming a release layer on a rigid carrier before forming the flexible substrate, wherein forming the flexible substrate comprises forming on the release layer The flexible substrate, and the adhesion of the release layer to the flexible substrate is greater than the adhesion of the release layer to the rigid carrier.
在本發明的一實施例中,軟性基板包覆離型層的邊緣,且可撓式電子模組的製造方法更包括:切除軟性基板包覆離型層的邊緣的部分,並使硬質載板與離型層分離。In an embodiment of the invention, the flexible substrate covers the edge of the release layer, and the manufacturing method of the flexible electronic module further comprises: cutting off the edge of the flexible substrate covering the edge of the release layer, and making the rigid carrier Separated from the release layer.
在本發明的一實施例中,可伸縮材料層對軟性基板的附著力大於軟性基板對離型層的附著力。In an embodiment of the invention, the adhesion of the stretchable material layer to the flexible substrate is greater than the adhesion of the flexible substrate to the release layer.
在本發明的一實施例中,可撓式電子模組的製造方法更包括:在離型層上形成一修飾層,其中軟性基板是形成於修飾層上,且修飾層配置於軟性基板與離型層之間,以提升離型層與軟性基板之間的附著力。In an embodiment of the invention, the method for manufacturing the flexible electronic module further comprises: forming a finishing layer on the release layer, wherein the flexible substrate is formed on the modifying layer, and the modifying layer is disposed on the flexible substrate and away from Between the layers to enhance the adhesion between the release layer and the flexible substrate.
在本發明的一實施例中,可撓式電子模組的製造方法更包括:在形成軟性基板之前,在一硬質載板上形成一犧牲層,其中形成軟性基板包括在犧牲層上形成軟性基板;以及在圖案化軟性基板、形成可伸縮材料及形成電子元件之後,利用雷射照射犧牲層,以使軟性基板與硬質載板分離。In an embodiment of the invention, the manufacturing method of the flexible electronic module further comprises: forming a sacrificial layer on a hard carrier before forming the flexible substrate, wherein forming the flexible substrate comprises forming a flexible substrate on the sacrificial layer And after patterning the flexible substrate, forming the stretchable material, and forming the electronic component, the sacrificial layer is irradiated with a laser to separate the flexible substrate from the hard carrier.
在本發明的一實施例中,軟性基板的楊氏係數與可伸縮材料層的楊氏係數的比值大於或等於10。In an embodiment of the invention, the ratio of the Young's modulus of the flexible substrate to the Young's modulus of the layer of the stretchable material is greater than or equal to 10.
在本發明的一實施例中,可撓式電子模組的製造方法更包括:在圖案化後的軟性基板上形成一覆蓋層,其中軟性基板配置於可伸縮材料層與覆蓋層之間,且覆蓋層的材料為可伸縮材料。In an embodiment of the present invention, the method for manufacturing the flexible electronic module further includes: forming a cover layer on the patterned flexible substrate, wherein the flexible substrate is disposed between the stretchable material layer and the cover layer, and The material of the cover layer is a stretchable material.
在本發明的實施例的可撓式電子模組中,由於可伸縮材料層連接分佈區域,因此可撓式電子模組可具有隨著使用需求伸縮的效果,進而增加可撓式電子模組的應用性。在本發明的實施例的可撓式電子模組的製造方法中,由於形成了連接分佈區域的可伸縮材料層,因此可製造出能夠伸縮的可撓式電子模組。In the flexible electronic module of the embodiment of the present invention, since the stretchable material layer is connected to the distribution area, the flexible electronic module can have the effect of expanding and contracting according to the use requirement, thereby increasing the flexible electronic module. Application. In the method of manufacturing a flexible electronic module according to the embodiment of the present invention, since the stretchable material layer that connects the distribution regions is formed, a flexible electronic module capable of stretching and contracting can be manufactured.
為讓本發明內容能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the present invention more apparent, the following detailed description of the embodiments and the accompanying drawings are set forth below.
圖1為本發明的一實施例的可撓式電子模組的剖面示意圖。請參照圖1,本實施例的可撓式電子模組100包括一圖案化軟性基板110、一可伸縮材料層120及至少一電子元件130(在圖1中是以多個電子元件130為例)。圖案化軟性基板110包括至少一分佈區域112(在圖1中是以多個分佈區域112為例),且可伸縮材料層120連接分佈區域112。電子元件130配置於圖案化軟性基板110與可伸縮材料層120的至少其中之一上,而圖1是以電子元件130配置於圖案化軟性基板110上為例。1 is a cross-sectional view of a flexible electronic module in accordance with an embodiment of the present invention. Referring to FIG. 1 , the flexible electronic module 100 of the present embodiment includes a patterned flexible substrate 110 , a stretchable material layer 120 , and at least one electronic component 130 (in FIG. 1 , a plurality of electronic components 130 are taken as an example). ). The patterned flexible substrate 110 includes at least one distribution region 112 (exemplified by a plurality of distribution regions 112 in FIG. 1), and the stretchable material layer 120 is connected to the distribution region 112. The electronic component 130 is disposed on at least one of the patterned flexible substrate 110 and the stretchable material layer 120, and FIG. 1 is an example in which the electronic component 130 is disposed on the patterned flexible substrate 110.
在本實施例中,圖案化軟性基板110的楊氏係數與可伸縮材料層120的楊氏係數的比值大於或等於10。在一實施例中,圖案化軟性基板110的楊氏係數與可伸縮材料層120的楊氏係數的比值大於或等於50。或者,在一實施例中,圖案化軟性基板110的楊氏係數與可伸縮材料層120的楊氏係數的比值大於或等於100。在本實施例中,圖案化軟性基板110的材質可為聚醯亞胺(polyimide, PI)、聚甲基丙烯酸甲酯(polymethylmethacrylate, PMMA)、聚碳酸酯(polycarbonate, PC)、聚醚碸(polyethersulfone, PES)、聚醯胺(polyamide, PA)、聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)、聚醚醚酮(polyetheretherketone, PEEK)、聚萘二甲酸乙二醇酯(polyethylene naphthalate, PEN)、聚乙烯亞胺(polyethylenimine, PEI)或其組合。可伸縮材料層120的材質可以是聚氨酯(polyurethane, PU)、聚二甲基矽氧烷(polydimethylsiloxane, PDMS)、壓克力(acrylic)、含醚(ether)系列的聚合物、聚烯(polyolefin)或其組合。In the present embodiment, the ratio of the Young's modulus of the patterned flexible substrate 110 to the Young's modulus of the stretchable material layer 120 is greater than or equal to 10. In one embodiment, the ratio of the Young's modulus of the patterned flexible substrate 110 to the Young's modulus of the layer of expandable material 120 is greater than or equal to 50. Alternatively, in an embodiment, the ratio of the Young's modulus of the patterned flexible substrate 110 to the Young's modulus of the layer of expandable material 120 is greater than or equal to 100. In this embodiment, the material of the patterned flexible substrate 110 may be polyimide (PI), polymethylmethacrylate (PMMA), polycarbonate (PC), polyether ( Polyethersulfone, PES), polyamide (PA), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate , PEN), polyethylenimine (PEI) or a combination thereof. The material of the stretchable material layer 120 may be polyurethane (PU), polydimethylsiloxane (PDMS), acrylic, ether-containing polymer, polyolefin. ) or a combination thereof.
在本實施例中,電子元件130可包括導線、電極、電阻、電感、電容、電晶體、二極體、開關元件、放大器、處理器、控制器、薄膜電晶體、觸控元件、壓力感測元件、微機電元件、回饋元件、光學元件、顯示器或其他適當的電子元件,本發明不以此為限。In this embodiment, the electronic component 130 may include a wire, an electrode, a resistor, an inductor, a capacitor, a transistor, a diode, a switching element, an amplifier, a processor, a controller, a thin film transistor, a touch element, and a pressure sensing. The components, microelectromechanical components, feedback components, optical components, displays or other suitable electronic components are not limited in this regard.
在本實施例中,至少部分分佈區域112為彼此分離的多個島狀結構。以圖1為例,這些分佈區域112分別為多個彼此分離的島狀結構,而可伸縮材料層120連接這些島狀結構。In the present embodiment, at least a portion of the distribution regions 112 are a plurality of island-like structures separated from each other. Taking FIG. 1 as an example, the distribution regions 112 are respectively a plurality of island structures separated from each other, and the stretchable material layer 120 connects the island structures.
在本實施例的可撓式電子模組100中,由於可伸縮材料層120連接這些分佈區域112,因此可撓式電子模組100可具有隨著使用需求伸縮的效果,進而增加可撓式電子模組100的應用性。舉例而言,藉由可伸縮材料層120在相鄰兩分佈區域112之間的部分的伸縮效果,相鄰兩分佈區域112的間距可以改變,進而增加可撓式電子模組100的應用性。In the flexible electronic module 100 of the present embodiment, since the flexible material layer 120 is connected to the distribution regions 112, the flexible electronic module 100 can have the effect of expanding and contracting according to the use requirement, thereby increasing the flexible electronic device. The applicability of the module 100. For example, by the stretching effect of the portion of the stretchable material layer 120 between the adjacent two distribution regions 112, the spacing between the adjacent two distribution regions 112 can be changed, thereby increasing the applicability of the flexible electronic module 100.
圖2A至圖2I為圖1的可撓式電子模組的九種變化實施例的剖面示意圖。這九種變化實施例與圖1的可撓式電子模組類似,而其主要差異如下所述。請先參照圖2A,在本實施例之可撓式電子模組100a中,至少部分分佈區域112a為多個凸出結構。舉例而言,在圖2A中,圖案化軟性基板110a的這些分佈區域112a分別為多個凸出結構。圖案化軟性基板110a在相鄰的二凸出結構(即分佈區域112a)間具有一凹陷113,且相鄰的二凸出結構藉由凹陷113的底部114相連。2A to 2I are schematic cross-sectional views showing nine modified embodiments of the flexible electronic module of FIG. 1. These nine variations are similar to the flexible electronic module of Figure 1, with the main differences being as follows. Referring to FIG. 2A, in the flexible electronic module 100a of the embodiment, at least a part of the distribution area 112a is a plurality of protruding structures. For example, in FIG. 2A, the distributed regions 112a of the patterned flexible substrate 110a are respectively a plurality of protruding structures. The patterned flexible substrate 110a has a recess 113 between adjacent two protruding structures (i.e., the distributed region 112a), and the adjacent two protruding structures are connected by the bottom portion 114 of the recess 113.
在本實施例的可撓式電子模組100a中,由於相鄰兩分佈區域112a藉由凹陷113的底部114來連接,因此可撓式電子模組100a的抗拉強度較強,但仍可在一定程度及方向上被拉伸。In the flexible electronic module 100a of the present embodiment, since the adjacent two distribution regions 112a are connected by the bottom portion 114 of the recess 113, the flexural electronic module 100a has a strong tensile strength, but can still be Stretched to a certain extent and direction.
請再參照圖2B,本實施例的可撓式電子模組100b更包括一離型層140,配置於圖案化軟性基板110上。在本實施例中,離型層140更配置於可伸縮材料層120上。此外,在本實施例中,可伸縮材料層120對圖案化軟性基板110的附著力大於圖案化軟性基板110對離型層140的附著力。離型層140的材料例如為結晶矽酸鹽(crystalline silicate)、芳香性聚亞醯胺(係由二胺與二酸酐共聚而成)、二胺係4,4'-二胺基二苯醚、3,4'-二胺基二苯醚、對苯二胺、2,2'-二(三氟甲基)二胺基聯苯或上述之組合,且二酸酐係均苯四甲酸二酐、聯苯四羧酸二酐、4,4'-(六氟異丙烯)二酞酸酐或上述之組合。Referring to FIG. 2B , the flexible electronic module 100b of the present embodiment further includes a release layer 140 disposed on the patterned flexible substrate 110 . In the present embodiment, the release layer 140 is disposed on the stretchable material layer 120. In addition, in the present embodiment, the adhesion of the stretchable material layer 120 to the patterned flexible substrate 110 is greater than the adhesion of the patterned flexible substrate 110 to the release layer 140. The material of the release layer 140 is, for example, a crystalline silicate, an aromatic polyamine (formed by copolymerization of a diamine and a dianhydride), and a diamine 4,4'-diaminodiphenyl ether. , 3,4'-diaminodiphenyl ether, p-phenylenediamine, 2,2'-bis(trifluoromethyl)diaminobiphenyl or a combination thereof, and the dianhydride is pyromellitic dianhydride And biphenyltetracarboxylic dianhydride, 4,4'-(hexafluoroisopropene) diacetic anhydride or a combination thereof.
此外,在本實施例中,電子元件130配置於可伸縮材料層120上。另外,在本實施例中,圖案化軟性基板110的分佈區域112b亦可以具有較小的寬度。Further, in the present embodiment, the electronic component 130 is disposed on the stretchable material layer 120. In addition, in the embodiment, the distribution area 112b of the patterned flexible substrate 110 may also have a small width.
請參照圖2C,在本實施例之可撓式電子模組100c中,在一實施例中,電子元件130c可為可感測拉伸程度的電子元件,其配置於可伸縮材料層120上,且位於可伸縮材料層120之位於相鄰兩分佈區域112之間的部分上。如此一來,電子元件130c便能夠感測可伸縮材料層120的伸縮程度。Referring to FIG. 2C , in the flexible electronic module 100 c of the embodiment, in an embodiment, the electronic component 130 c can be an electronic component capable of sensing the degree of stretching, and is disposed on the layer 1 of the stretchable material. And located on a portion of the layer of expandable material 120 between the adjacent two distribution regions 112. In this way, the electronic component 130c can sense the degree of expansion and contraction of the stretchable material layer 120.
請參照圖2D,在本實施例之可撓式電子模組100d中,可伸縮材料層120的表面可具有圖案,例如具有凹陷122。此外,部分的電子元件130配置於可伸縮材料層120上,而另一部分的電子元件130配置於圖案化軟性基板110上。另外,在本實施例中,部分的分佈區域112e與112c彼此分離成多個島狀結構,而部分的分佈區域112c與112d形成藉由凹陷113的底部114相連的凸出結構。Referring to FIG. 2D, in the flexible electronic module 100d of the present embodiment, the surface of the stretchable material layer 120 may have a pattern, for example, having a recess 122. In addition, part of the electronic component 130 is disposed on the stretchable material layer 120, and another portion of the electronic component 130 is disposed on the patterned flexible substrate 110. Further, in the present embodiment, the partial distribution regions 112e and 112c are separated from each other into a plurality of island-like structures, and the partial distribution regions 112c and 112d form a convex structure connected by the bottom portion 114 of the recess 113.
請參照圖2E,在本實施例之可撓式電子模組100e中,部分的分佈區域112f的厚度可較另一部分的分佈區域112e薄。在一實施例中,分佈區域112f可為製程中所殘留下來的部分。Referring to FIG. 2E, in the flexible electronic module 100e of the embodiment, the thickness of the partial distribution area 112f may be thinner than the distribution area 112e of the other part. In an embodiment, the distribution area 112f may be a portion remaining in the process.
請參照圖2F,在本實施例之可撓式電子模組100f中,可伸縮材料層120可填充於圖案化軟性基板110a之相鄰兩分佈區域112之間的凹陷113,而不覆蓋分佈區域112。Referring to FIG. 2F, in the flexible electronic module 100f of the embodiment, the stretchable material layer 120 can be filled in the recess 113 between the adjacent two distribution regions 112 of the patterned flexible substrate 110a without covering the distribution area. 112.
請參照圖2G,在本實施例之可撓式電子模組100g中,電子元件130配置於圖案化軟性基板110a的配置面111上,而相鄰兩分佈區域112之間的凹陷113的開口朝向遠離配置面111的方向。Referring to FIG. 2G, in the flexible electronic module 100g of the present embodiment, the electronic component 130 is disposed on the disposition surface 111 of the patterned flexible substrate 110a, and the opening of the recess 113 between the adjacent two distribution regions 112 is oriented. Keep away from the direction of the configuration surface 111.
請參照圖2H,在本實施例之可撓式電子模組100h中,離型層140配置於圖案化軟性基板110a的下表面,且配置於相鄰兩分佈區域112之間的凹陷113的底部114的下表面上。Referring to FIG. 2H, in the flexible electronic module 100h of the present embodiment, the release layer 140 is disposed on the lower surface of the patterned flexible substrate 110a and disposed at the bottom of the recess 113 between the adjacent two distribution regions 112. On the lower surface of 114.
請參照圖2I,本實施例之可撓式電子模組100i更包括一覆蓋層150,其中圖案化軟性基板110配置於可伸縮材料層120與覆蓋層150之間,且覆蓋層150的材料為可伸縮材料。覆蓋層150與可伸縮材料層120可為相同的可伸縮材料或不同的可伸縮材料。The flexible electronic module 100i of the present embodiment further includes a cover layer 150, wherein the patterned flexible substrate 110 is disposed between the stretchable material layer 120 and the cover layer 150, and the cover layer 150 is made of a material Retractable material. The cover layer 150 and the stretchable material layer 120 may be the same stretchable material or different stretchable materials.
圖3A至圖3E為本發明之另五個實施例之可撓式電子模組的圖案化軟性基板及可伸縮材料層的上視示意圖。圖3A至圖3E的可撓式電子模組與圖1及圖2A至圖2I的可撓式電子模組類似,其剖面圖可類似於圖2A至圖2I,而其圖案化軟性基板110及可伸縮材料層120的上視圖則可如圖3A至圖3E所繪示。3A-3E are top views of a patterned flexible substrate and a layer of a stretchable material of a flexible electronic module according to another embodiment of the present invention. The flexible electronic module of FIG. 3A to FIG. 3E is similar to the flexible electronic module of FIGS. 1 and 2A to 2I, and the cross-sectional view thereof can be similar to that of FIG. 2A to FIG. 2I, and the patterned flexible substrate 110 and The top view of the layer of expandable material 120 can then be depicted in Figures 3A-3E.
請參照圖3A至圖3E,在可撓式電子模組100j、100k、100l、100m及100n中,至少部分的分佈區域112呈網狀結構,且可伸縮材料層120填充於此網狀結構的間隙中。舉例而言,在可撓式電子模組100j、100k及100l中,所有的分佈區域112呈網狀結構,而在可撓式電子模組100m及100n中,部分的分佈區域112呈網狀結構,而另一部分的分佈區域112m呈島狀結構。此外,呈網狀結構的分佈區域112可以相連成一個網(如圖3A與圖3D),或分開成多段(如圖3B、圖3C與圖3E)。Referring to FIG. 3A to FIG. 3E , in the flexible electronic modules 100 j , 100 k , 100 l , 100 m , and 100 n , at least a part of the distribution area 112 has a mesh structure, and the retractable material layer 120 is filled in the mesh structure. In the gap. For example, in the flexible electronic modules 100j, 100k, and 1001, all of the distributed regions 112 have a mesh structure, and in the flexible electronic modules 100m and 100n, a portion of the distributed regions 112 have a mesh structure. And another part of the distribution area 112m has an island structure. Further, the distribution regions 112 in the form of a mesh structure may be connected into one mesh (as shown in FIGS. 3A and 3D) or divided into a plurality of segments (as shown in FIGS. 3B, 3C, and 3E).
圖4A至圖4D為本發明之另四個實施例之可撓式電子模組的剖面示意圖。圖4A至圖4D的可撓式電子模組類似於圖1及圖2A至圖2I之可撓式電子模組,而其主要差異如下所述。請參照圖4A與圖4B,在可撓式電子模組100o與100p中,分佈區域112可呈島狀結構,而可伸縮材料層120填充於相鄰兩島狀結構的間隙中,且不覆蓋分佈區域。請參照圖4C,在可撓式電子模組100q中,可伸縮材料層120填充於相鄰兩厚度較厚的分佈區域112e之間,且不覆蓋分佈區域112e。此外,可伸縮材料120包覆厚度較薄的分佈區域112f。4A-4D are schematic cross-sectional views of a flexible electronic module according to another embodiment of the present invention. The flexible electronic module of FIGS. 4A-4D is similar to the flexible electronic module of FIG. 1 and FIG. 2A to FIG. 2I, and the main differences are as follows. Referring to FIG. 4A and FIG. 4B, in the flexible electronic modules 100o and 100p, the distribution area 112 may have an island structure, and the retractable material layer 120 is filled in the gap between adjacent island structures, and is not covered. distribution area. Referring to FIG. 4C, in the flexible electronic module 100q, the stretchable material layer 120 is filled between the adjacent two thickly distributed regions 112e and does not cover the distributed region 112e. Further, the stretchable material 120 covers the thinned distribution area 112f.
請參照圖4D,本實施例之可撓式電子模組100r與圖4A之可撓式電子模組100o類似,而兩者的差異在於可撓式電子模組100r更包括離型層140,配置於圖案化軟性基板110與可伸縮材料層120上。圖4D之離型層140亦可配置於圖4A至圖4C之圖案化軟性基板110與可伸縮材料層120的下表面上。Referring to FIG. 4D, the flexible electronic module 100r of the present embodiment is similar to the flexible electronic module 100o of FIG. 4A, and the difference between the two is that the flexible electronic module 100r further includes the release layer 140. On the patterned flexible substrate 110 and the stretchable material layer 120. The release layer 140 of FIG. 4D may also be disposed on the lower surface of the patterned flexible substrate 110 and the stretchable material layer 120 of FIGS. 4A-4C.
圖5A為本發明之另一實施例之可撓式電子模組的上視示意圖,而圖5B為圖5A之可撓式電子模組沿著I-I線的剖面示意圖。請參照圖5A與圖5B,本實施例之可撓式電子模組100s與圖1之可撓式電子模組100類似,而兩者的主要差異如下所述。在本實施例之可撓式電子模組100s中,這些電子元件130包括多個觸控感測電極130s,配置於圖案化軟性基板110上。在本實施例中,這些電子元件130還包括多個導線130r與多個接合墊130q,其中這些導線130r分別將這些觸控感測電極130s電性連接至這些接合墊130q,而這些接合墊130q可電性連接至外部之可撓式印刷電路板。如此一來,可撓式電子模組100s即可成為一可拉伸的觸控薄膜。在本實施例中,導線130r與接合墊130q的材質可為金屬,而觸控感測電極130s的材質可為金屬或具有導電性的金屬氧化物。此外,導線130r、接合墊130q與觸控感測電極130s皆屬於電子元件130。FIG. 5A is a top view of a flexible electronic module according to another embodiment of the present invention, and FIG. 5B is a cross-sectional view of the flexible electronic module of FIG. 5A along line I-I. Referring to FIG. 5A and FIG. 5B , the flexible electronic module 100 s of the present embodiment is similar to the flexible electronic module 100 of FIG. 1 , and the main differences between the two are as follows. In the flexible electronic module 100s of the present embodiment, the electronic components 130 include a plurality of touch sensing electrodes 130s disposed on the patterned flexible substrate 110. In this embodiment, the electronic component 130 further includes a plurality of wires 130r and a plurality of bonding pads 130q, wherein the wires 130r electrically connect the touch sensing electrodes 130s to the bonding pads 130q, and the bonding pads 130q Electrically connectable to an external flexible printed circuit board. In this way, the flexible electronic module 100s can be a stretchable touch film. In this embodiment, the material of the wire 130r and the bonding pad 130q may be metal, and the material of the touch sensing electrode 130s may be metal or a metal oxide having conductivity. In addition, the wire 130r, the bonding pad 130q and the touch sensing electrode 130s belong to the electronic component 130.
圖6為本發明之又一實施例之可撓式電子模組的上視示意圖。請參照圖6,本實施例之可撓式電子模組100t與圖5A的可撓式電子模組100s類似,而兩者的差異如下所述。在本實施例之可撓式電子模組100t中,這些電子元件130包括多個可拉伸導線130t,且可拉伸導線130t以之字形延伸。這些可拉伸導線130t分別將這些觸控感測電極130s電性連接至這些接合墊130q。6 is a top plan view of a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 6, the flexible electronic module 100t of the present embodiment is similar to the flexible electronic module 100s of FIG. 5A, and the difference between the two is as follows. In the flexible electronic module 100t of the present embodiment, the electronic components 130 include a plurality of stretchable wires 130t, and the stretchable wires 130t extend in a zigzag shape. The stretchable wires 130t electrically connect the touch sensing electrodes 130s to the bonding pads 130q, respectively.
此外,在本實施例中,這些觸控感測電極130s分別配置於各自的分佈區域 112t1上,接合墊130q配置於一分佈區域112t2上,而可拉伸導線130t分別配置於各自的分佈區域112t3上,其中分佈區域112t3連接分佈區域112t1與分佈區域112t2,且分佈區域112t3隨著可接伸導線130t延伸。In addition, in the present embodiment, the touch sensing electrodes 130s are respectively disposed on the respective distribution regions 112t1, the bonding pads 130q are disposed on a distribution region 112t2, and the stretchable wires 130t are respectively disposed in the respective distribution regions 112t3. Upper, wherein the distribution area 112t3 connects the distribution area 112t1 and the distribution area 112t2, and the distribution area 112t3 extends with the extendable wire 130t.
在圖5A中,可撓式電子模組100s的拉伸方向可為圖面的橫向。然而,在圖6中,由於可撓式電子模組100t採用了可拉伸導線130t,因此可撓式電子模組100t在圖面的橫向與縱向皆可被拉伸。In FIG. 5A, the stretching direction of the flexible electronic module 100s may be the lateral direction of the drawing. However, in FIG. 6, since the flexible electronic module 100t employs the stretchable wire 130t, the flexible electronic module 100t can be stretched both in the lateral direction and the longitudinal direction of the drawing.
圖7A至圖7G為繪示本發明之一實施例之可撓式電子模組的製造方法的流程之剖面示意圖。請參照圖7A至圖7G,本實施例之可撓式電子模組的製造方法可用以製造上述各實施例之可撓式電子模組100及100a~100t,而以下以製造可撓式電子模組100為例進行說明。本實施例之可撓式電子模組的製造方法包括下列步驟。首先,請參照圖7A,形成一軟性基板110’。在本實施例中,在形成軟性基板110’之前,在一硬質載板50上形成離型層140,其中形成軟性基板110’的步驟包括在離型層140上形成軟性基板110’,且離型層140對軟性基板110’的附著力大於離型層140對硬質載板50的附著力。硬質載板50的材質例如為玻璃、陶瓷、金屬、矽或其他適當的剛性材質。7A to 7G are schematic cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to an embodiment of the present invention. Referring to FIG. 7A to FIG. 7G, the manufacturing method of the flexible electronic module of the present embodiment can be used to manufacture the flexible electronic modules 100 and 100a-100t of the above embodiments, and the following is to manufacture a flexible electronic module. Group 100 is described as an example. The manufacturing method of the flexible electronic module of this embodiment includes the following steps. First, referring to Fig. 7A, a flexible substrate 110' is formed. In the present embodiment, before forming the flexible substrate 110', the release layer 140 is formed on a hard carrier 50, wherein the step of forming the flexible substrate 110' includes forming a flexible substrate 110' on the release layer 140, and The adhesion of the patterned layer 140 to the flexible substrate 110' is greater than the adhesion of the release layer 140 to the rigid carrier 50. The material of the rigid carrier 50 is, for example, glass, ceramic, metal, tantalum or other suitable rigid material.
然後,圖案化軟性基板110’,以形成至少一分佈區域112(如圖7E所繪示)。此外,形成連接分佈區域112的一可伸縮材料層120(如圖7G所繪示),再者,在軟性基板110’與可伸縮材料層120的至少其中之一上形成至少一電子元件130(如圖7C所繪示)。在本實施例中,軟性基板110’的楊氏係數與可伸縮材料層120的楊氏係數的比值大於或等於10。在一實施例中,軟性基板110’的楊氏係數與可伸縮材料層120的楊氏係數的比值大於或等於50。或者,在一實施例中,軟性基板110’的楊氏係數與可伸縮材料層120的楊氏係數的比值大於或等於100。The flexible substrate 110' is then patterned to form at least one distribution region 112 (as shown in Figure 7E). In addition, a stretchable material layer 120 (shown in FIG. 7G) connecting the distribution regions 112 is formed, and at least one electronic component 130 is formed on at least one of the flexible substrate 110' and the stretchable material layer 120 ( As shown in Figure 7C). In the present embodiment, the ratio of the Young's modulus of the flexible substrate 110' to the Young's modulus of the stretchable material layer 120 is greater than or equal to 10. In one embodiment, the ratio of the Young's modulus of the flexible substrate 110' to the Young's modulus of the layer of expandable material 120 is greater than or equal to 50. Alternatively, in one embodiment, the ratio of the Young's modulus of the flexible substrate 110' to the Young's modulus of the layer of expandable material 120 is greater than or equal to 100.
具體而言,在本實施例中,請先參照圖7B,先在圖案化前的軟性基板110’上形成一導電層130’。然後,請參照圖7C,圖案化導電層130’,以形成至少一電子元件130。舉例而言,可藉由微影製程(photolithography)來圖案化導電層130’,以形成這些電子元件130。Specifically, in the present embodiment, referring to Fig. 7B, a conductive layer 130' is first formed on the flexible substrate 110' before patterning. Then, referring to FIG. 7C, the conductive layer 130' is patterned to form at least one electronic component 130. For example, conductive layer 130' can be patterned by photolithography to form these electronic components 130.
然後,請參照圖7D,在軟性基板110’上形成包覆電子元件130的一圖案化遮罩層60。接著,請參照圖7E,以圖案化遮罩層60作為阻擋層而蝕刻、刨除或壓印軟性基板110’被圖案化遮罩層60所曝露出的部分,以形成分佈區域112。當蝕刻軟性基板110’ 被圖案化遮罩層60所曝露出的部分時,圖案化遮罩層60即為一蝕刻阻擋層,其可抵抗蝕刻劑的侵蝕。此外,上述蝕刻包括乾式蝕刻或溼式蝕刻。Then, referring to FIG. 7D, a patterned mask layer 60 covering the electronic component 130 is formed on the flexible substrate 110'. Next, referring to FIG. 7E, the portion of the flexible substrate 110' exposed by the patterned mask layer 60 is etched, chipped, or stamped with the patterned mask layer 60 as a barrier layer to form the distribution region 112. When the portion of the flexible substrate 110' that is exposed by the patterned mask layer 60 is etched, the patterned mask layer 60 is an etch barrier that resists erosion by the etchant. Further, the above etching includes dry etching or wet etching.
之後,如圖7F所繪示,去除圖案化遮罩層60,例如以乾蝕刻或溼蝕刻方法去除圖案化遮罩層60。在本實施例中,圖案化遮罩層的材質例如為金屬。然而,在其他實施例中,亦可以不去除圖案化遮罩層60,而直接進行下一個步驟。接著,如圖7G所繪示,在軟性基板110’上形成可伸縮材料層120,並使可伸縮材料層120填充於分佈區域112的間隙115中,且使可伸縮材料層120包覆電子元件130。在本實施例中,當軟性基板110’形成於離型層140上時(如圖7A),軟性基板110’包覆離型層140的邊緣142。而在圖7G的步驟中,切除軟性基板110’包覆離型層140的邊緣142的部分(例如沿著圖7F的虛線L的位置切開),並使硬質載板50與離型層140分離。在本實施例中,由於離型層140對軟性基板110’的附著力大於離型層140對硬質載板50的附著力,因此當切除軟性基板110’包覆離型層140的邊緣142的部分時,硬質載板50便可容易地從離型層140上剝離。硬質載板50剝離後,剩餘的部分即可成為可撓式電子模組。或者,由於可伸縮材料層120對軟性基板110’的附著力大於軟性基板110’對離型層140的附著力,因此可進一步將離型層140從軟性基板110’剝離,而剩下的部分即成為如圖1之可撓式電子模組100。如此一來,即可形成能夠伸縮的可撓式電子模組100。Thereafter, as illustrated in FIG. 7F, the patterned mask layer 60 is removed, for example, by a dry etch or wet etch process to remove the patterned mask layer 60. In this embodiment, the material of the patterned mask layer is, for example, a metal. However, in other embodiments, the patterned mask layer 60 may not be removed, but the next step may be performed directly. Next, as shown in FIG. 7G, a stretchable material layer 120 is formed on the flexible substrate 110', and the stretchable material layer 120 is filled in the gap 115 of the distribution region 112, and the expandable material layer 120 is coated with the electronic component. 130. In the present embodiment, when the flexible substrate 110' is formed on the release layer 140 (Fig. 7A), the flexible substrate 110' covers the edge 142 of the release layer 140. In the step of FIG. 7G, the portion of the flexible substrate 110' that covers the edge 142 of the release layer 140 is removed (eg, cut along the position of the broken line L of FIG. 7F), and the hard carrier 50 is separated from the release layer 140. . In the present embodiment, since the adhesion of the release layer 140 to the flexible substrate 110' is greater than the adhesion of the release layer 140 to the rigid carrier 50, when the flexible substrate 110' is removed, the edge 142 of the release layer 140 is covered. In some cases, the rigid carrier 50 can be easily peeled off from the release layer 140. After the rigid carrier 50 is peeled off, the remaining portion can be a flexible electronic module. Alternatively, since the adhesion of the stretchable material layer 120 to the flexible substrate 110' is greater than the adhesion of the flexible substrate 110' to the release layer 140, the release layer 140 can be further peeled off from the flexible substrate 110', and the remaining portion That is, the flexible electronic module 100 of FIG. 1 is obtained. In this way, the flexible electronic module 100 capable of stretching and contracting can be formed.
圖8A與圖8B繪示本發明之另一實施例之可撓式電子模組的製造方法的其中兩個步驟。請參照圖8A與圖8B,本實施例之可撓式電子模組的製造方法類似於圖7A至圖7G之可撓式電子模組的製造方法,而兩者的差異如下所述。在本實施例之可撓式電子模組的製造方法中,如圖8A所繪示,在離型層140上形成一修飾層70,其中軟性基板110’是形成於修飾層70上,且修飾層70配置於軟性基板110’與離型層140之間,以提升離型層140與軟性基板110’之間的附著力。在本實施例中,修飾層70可包覆離型層140的邊緣142。在本實施例中,修飾層70的材質例如為氮化矽或氧化矽。8A and 8B illustrate two steps in a method of fabricating a flexible electronic module according to another embodiment of the present invention. Referring to FIG. 8A and FIG. 8B , the manufacturing method of the flexible electronic module of the present embodiment is similar to the manufacturing method of the flexible electronic module of FIGS. 7A to 7G , and the differences between the two are as follows. In the manufacturing method of the flexible electronic module of the embodiment, as shown in FIG. 8A, a modification layer 70 is formed on the release layer 140, wherein the flexible substrate 110' is formed on the modification layer 70, and is modified. The layer 70 is disposed between the flexible substrate 110' and the release layer 140 to enhance the adhesion between the release layer 140 and the flexible substrate 110'. In the present embodiment, the finishing layer 70 can coat the edge 142 of the release layer 140. In the present embodiment, the material of the modification layer 70 is, for example, tantalum nitride or hafnium oxide.
接著,本實施例之可撓式電子模組的製造方法即進行類似於圖7B至圖7F的步驟,在此不再重述。然後,如圖8B所繪示,切除修飾層70之包覆離型層140的邊緣142的部分後,即可使硬質載板50剝離,而剩餘的結構即形成可撓式電子模組。此外,亦可再將離型層140從修飾層70上剝離,而剩餘的結構亦為可撓式電子模組。Then, the manufacturing method of the flexible electronic module of the present embodiment performs steps similar to those of FIG. 7B to FIG. 7F, and will not be repeated herein. Then, as shown in FIG. 8B, after the portion of the edge 142 of the decorative layer 70 covering the release layer 140 is cut off, the rigid carrier 50 can be peeled off, and the remaining structure forms a flexible electronic module. In addition, the release layer 140 can be peeled off from the modification layer 70, and the remaining structure is also a flexible electronic module.
圖9A與圖9B繪示本發明之又一實施例之可撓式電子模組的製造方法的其中兩個步驟。請參照圖9A與圖9B,本實施例之可撓式電子模組的製造方法類似於圖7A至圖7G之可撓式電子模組的製造方法,而兩者的差異如下所述。在本實施例中,在形成軟性基板110’之前,在硬質載板上形成一犧牲層80,其中形成軟性基板110’包括在犧牲層80上形成軟性基板110’。換言之,本實施例是以犧牲層80來取代圖7A中的離型層140。9A and 9B illustrate two steps of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 9A and FIG. 9B , the manufacturing method of the flexible electronic module of the present embodiment is similar to the manufacturing method of the flexible electronic module of FIGS. 7A to 7G , and the difference between the two is as follows. In the present embodiment, a sacrificial layer 80 is formed on the hard carrier before forming the flexible substrate 110', wherein forming the flexible substrate 110' includes forming the flexible substrate 110' on the sacrificial layer 80. In other words, this embodiment replaces the release layer 140 of FIG. 7A with a sacrificial layer 80.
接著,進行如圖7B至圖7F的步驟。然後,如圖9B所繪示,在圖案化軟性基板110’、形成可伸縮材料120及形成電子元件130之後,利用雷射照射犧牲層80,例如是使雷射經由硬質載板50照射犧牲層80,以使軟性基板110’與硬質載板50分離。換言之,犧牲層80所採用的材質可在犧牲層80被雷射照射時,軟性基板110’與硬質載板50得以分離。如此一來,在硬質載板50在使用雷射剝離法剝離後,剩下的結構即可形成可被拉伸的可撓式電子模組。在本實施例中,犧牲層80的材質例如為聚苯乙烯磺酸鈉(PSS (poly(styrene sulfonate)))、聚乙烯亞胺(PEI (poly(ethylene imine)))、聚丙烯酸(PAA (poly(allyl amine)))、聚二甲基二烯丙基氯化銨(PDDA (poly(diallyldimethylammonium chloride)))、聚(N-異丙基丙烯醯胺)(PNIPAM(poly(N-isopropyl acrylamide))、幾丁聚醣(CS(Chitosan))、聚甲基丙烯酸(PMA(poly(methacrylic acid)))、聚乙烯磺酸(PVS(poly(vinyl sulfonic acid))),聚丙烯酸(PAA(poly(amic acid)))或聚羥基脂肪酸(PAH(poly(allylamine))),其在水溶液中離子化且被施加正電荷,或者犧牲層80的材質可包括聚苯乙烯磺酸鈉(NaPSS(Sodium poly(styrene sulfonate)))及聚乙烯磺酸(PVS(poly(vinly sulfonic acid)))其中之一或其中至少兩者的組合。 Next, the steps of FIGS. 7B to 7F are performed. Then, as shown in FIG. 9B, after the flexible substrate 110' is patterned, the stretchable material 120 is formed, and the electronic component 130 is formed, the sacrificial layer 80 is irradiated with a laser, for example, the laser is irradiated to the sacrificial layer via the hard carrier 50. 80, in order to separate the flexible substrate 110' from the rigid carrier 50. In other words, the material used for the sacrificial layer 80 can be separated from the hard carrier 50 when the sacrificial layer 80 is irradiated with laser light. In this way, after the rigid carrier 50 is peeled off by the laser lift-off method, the remaining structure can form a flexible electronic module that can be stretched. In this embodiment, the material of the sacrificial layer 80 is, for example, polystyrene sulfonate (PSS), polyethylenimine (PEI), polyacrylic acid (PAA (PAA (poly(styrene sulfonate))). Poly(allyl amine)), poly(diallyldimethylammonium chloride), poly(N-isopropylacrylamide) (PNIPAM(poly(N-isopropyl acrylamide)) )), chitosan (CS (Chitosan)), poly(methacrylic acid) (PMA), poly(vinyl sulfonic acid), polyacrylic acid (PAA) Poly(amic acid))) or polyhydroxyl fatty acid (PAH (poly(allylamine))), which is ionized in an aqueous solution and applied with a positive charge, or the material of the sacrificial layer 80 may include sodium polystyrene sulfonate (NaPSS ( Sodium poly (styrene sulfonate)) and polyvinyl sulfonic acid (PVS), or a combination of at least two of them.
圖10A至圖10E為繪示本發明之再一實施例之可撓式電子模組的製造方法的流程的剖面示意圖。請參照圖10A與圖10E,本實施例之可撓式電子模組的製造方法類似於圖7A至圖7G之可撓式電子模組的製造方法,而兩者的差異如下所述。在本實施例中,如圖10A所繪示,在硬質基板50上形成離型層140後,在離型層140上形成軟性基板110’,並將其圖案化,其中圖案化的方式可以是上述之蝕刻、刨除或壓印。然後,在軟性基板110’上形成可伸縮材料層120,並使可伸縮材料層120填充於相鄰的分佈區域112之間的間隙。然後,在可伸縮材料層120上形成導電層130’。接著,如圖10B所繪示,圖案化導電層130’,以形成至少一電子元件130。之後,如圖10C所繪示,利用一凸塊膜具90壓印可伸縮材料層120,以使可伸縮材料層120形成圖案。壓印後的可伸縮材料層120如圖10D所繪示。 10A to 10E are cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 10A and FIG. 10E , the manufacturing method of the flexible electronic module of the present embodiment is similar to the manufacturing method of the flexible electronic module of FIGS. 7A to 7G , and the difference between the two is as follows. In this embodiment, as shown in FIG. 10A, after the release layer 140 is formed on the rigid substrate 50, the flexible substrate 110' is formed on the release layer 140 and patterned, wherein the patterning manner may be Etching, chipping or embossing as described above. Then, the stretchable material layer 120 is formed on the flexible substrate 110', and the stretchable material layer 120 is filled in the gap between the adjacent distributed regions 112. Then, a conductive layer 130' is formed on the stretchable material layer 120. Next, as shown in FIG. 10B, the conductive layer 130' is patterned to form at least one electronic component 130. Thereafter, as shown in FIG. 10C, the stretchable material layer 120 is embossed with a bump film 90 to pattern the stretchable material layer 120. The embossed layer of expandable material 120 is depicted in Figure 10D.
然後,如圖10E所繪示,切割軟性基板110’之包覆離型 層140的邊緣142的部分,以使硬質載板50從離型層140上剝離,而剩餘的結構即成為可被拉伸的可撓式電子模組。 Then, as shown in FIG. 10E, the cladding of the flexible substrate 110' is cut off. The portion of the edge 142 of the layer 140 is such that the rigid carrier 50 is peeled from the release layer 140, and the remaining structure becomes a flexible electronic module that can be stretched.
請參照圖7G與圖2I,在一實施例中,在剝除如圖7G所繪示的離型層140後,可如圖2I在圖案化後的軟性基板(即圖案化軟性基板110)上形成一覆蓋層150,其中圖案化軟性基板110配置於可伸縮材料層120與覆蓋層150之間,且覆蓋層150的材料為可伸縮材料。覆蓋層150可減少圖案化軟性基板110可能從可伸縮材料層120剝離的現象。 Referring to FIG. 7G and FIG. 2I, in an embodiment, after the release layer 140 as shown in FIG. 7G is stripped, the patterned flexible substrate (ie, the patterned flexible substrate 110) may be as shown in FIG. A cover layer 150 is formed, wherein the patterned flexible substrate 110 is disposed between the stretchable material layer 120 and the cover layer 150, and the cover layer 150 is made of a stretchable material. The cover layer 150 can reduce the phenomenon that the patterned flexible substrate 110 may be peeled off from the stretchable material layer 120.
圖11為本發明之另一實施例之可撓式電子模組的剖面示意圖。請參照圖11,本實施例之可撓式電子模組100u與圖4A的可撓式電子模組100o類似,而兩者的差異如下所述。在本實施例之可撓式電子模組100u中,電子元件130包括多個第一電極130u,可伸縮材料層120分佈於這些第一電極130u之間,且圖案化軟性基板110、可伸縮材料層120及電子元件130形成一可撓式電路板(flexible printed circuit,FPC)。 FIG. 11 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention. Referring to FIG. 11, the flexible electronic module 100u of the present embodiment is similar to the flexible electronic module 100o of FIG. 4A, and the difference between the two is as follows. In the flexible electronic module 100u of the embodiment, the electronic component 130 includes a plurality of first electrodes 130u, and the stretchable material layer 120 is distributed between the first electrodes 130u, and the flexible substrate 110 and the stretchable material are patterned. The layer 120 and the electronic component 130 form a flexible printed circuit (FPC).
在本實施例中,可撓式電子模組100u更包括一可撓式電子裝置200,其包括多個第二電極230,該些第二電極230透過一異方性導電膜300分別與該些第一電極130u電性連接。 In this embodiment, the flexible electronic module 100u further includes a flexible electronic device 200 including a plurality of second electrodes 230, and the second electrodes 230 are respectively transmitted through an anisotropic conductive film 300. The first electrode 130u is electrically connected.
如此一來,當可撓式電子裝置200受到壓力P或張力T而使第二電極230產生位移時,由於可伸縮材料層120分佈於這些第一電極130u之間,因此這些第一電極130u可以有相應的位移。這樣的話,便可以確保第一電極130u與第二電極230之間的 電性連接狀態。 In this way, when the flexible electronic device 200 is subjected to the pressure P or the tension T to cause the second electrode 230 to be displaced, since the stretchable material layer 120 is distributed between the first electrodes 130u, the first electrodes 130u can be There is a corresponding displacement. In this way, it is ensured between the first electrode 130u and the second electrode 230. Electrical connection status.
圖12為本發明之又一實施例之可撓式電子模組的剖面示意圖。請參照圖12,本實施例之可撓式電子模組100v與圖11的可撓式電子模組100u類似,而兩者的差異如下所述。在本實施例之可撓式電子模組100v中,這些第二電極230分別透過多個異方性導電膜300v分別與這些第一電極130u電性連接,而這些異方性導電膜300v可以是多個分開的異方性導電膜300v。可撓式電子模組100v可達到類似於可撓式電子模組100u的上述功效,在此不再重述。 FIG. 12 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 12, the flexible electronic module 100v of the present embodiment is similar to the flexible electronic module 100u of FIG. 11, and the differences between the two are as follows. In the flexible electronic module 100v of the present embodiment, the second electrodes 230 are respectively electrically connected to the first electrodes 130u through the plurality of anisotropic conductive films 300v, and the anisotropic conductive films 300v may be A plurality of separate anisotropic conductive films 300v. The flexible electronic module 100v can achieve the above-mentioned effects similar to the flexible electronic module 100u, and will not be repeated here.
圖13為本發明之再一實施例之可撓式電子模組的剖面示意圖。請參照圖13,本實施例之可撓式電子模組100w與圖11的可撓式電子模組100u類似,而兩者的差異如下所述。在本實施例之可撓式電子模組100w中,可撓式電子裝置200w包括另一圖案化軟性基板210及另一可伸縮材料層220。圖案化軟性基板210與可伸縮材料層220的實施方式可以是上述各種實施例中之圖案化軟性基板110與可伸縮材料層120的實施方式。具體而言,圖案化軟性基板210包括至少一分佈區域212(圖13中是以多個分佈區域212為例),其中這些第二電極230配置於分佈區域212上。可伸縮材料層220連接這些分佈區域212,且配置於這些第二電極230之間。 FIG. 13 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. Referring to FIG. 13, the flexible electronic module 100w of the present embodiment is similar to the flexible electronic module 100u of FIG. 11, and the difference between the two is as follows. In the flexible electronic module 100w of the present embodiment, the flexible electronic device 200w includes another patterned flexible substrate 210 and another stretchable material layer 220. The embodiment of the patterned flexible substrate 210 and the stretchable material layer 220 may be an embodiment of the patterned flexible substrate 110 and the stretchable material layer 120 in the various embodiments described above. Specifically, the patterned flexible substrate 210 includes at least one distribution region 212 (exemplified by a plurality of distribution regions 212 in FIG. 13 ), wherein the second electrodes 230 are disposed on the distribution region 212 . The layer of expandable material 220 connects the distribution regions 212 and is disposed between the second electrodes 230.
本實施例之可撓式電子模組100w所能達到的功效與上述可撓式電子模組100u所能達到的功效類似,即當可撓式電子裝 置200w受到壓力P或張力T時,可伸縮材料層220與可伸縮材料層120可使第一電極130u與第二電極230的位移較具彈性,進而確保第一電極130u的位移與第二電極230的位移一致,並確保第一電極130u與第二電極230之間的電性連接狀態。 The efficiencies of the flexible electronic module 100w of the present embodiment are similar to those of the flexible electronic module 100u, that is, when the flexible electronic device is installed. When the 200W is subjected to the pressure P or the tension T, the stretchable material layer 220 and the stretchable material layer 120 can make the displacement of the first electrode 130u and the second electrode 230 more elastic, thereby ensuring the displacement of the first electrode 130u and the second electrode. The displacement of 230 is uniform, and the electrical connection state between the first electrode 130u and the second electrode 230 is ensured.
圖14為本發明之另一實施例之可撓式電子模組的剖面示意圖。請參照圖14,本實施例之可撓式電子模組100x與圖13的可撓式電子模組100w類似,而兩者的差異如下所述。在本實施例之可撓式電子模組100x中,這些第二電極230分別透過多個異方性導電膜300v分別與這些第一電極130u電性連接,而這些異方性導電膜300v可以是多個分開的異方性導電膜300v。 FIG. 14 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention. Referring to FIG. 14, the flexible electronic module 100x of the present embodiment is similar to the flexible electronic module 100w of FIG. 13, and the difference between the two is as follows. In the flexible electronic module 100x of the present embodiment, the second electrodes 230 are respectively electrically connected to the first electrodes 130u through the plurality of anisotropic conductive films 300v, and the anisotropic conductive films 300v may be A plurality of separate anisotropic conductive films 300v.
綜上所述,在本發明的實施例的可撓式電子模組中,由於可伸縮材料層連接分佈區域,因此可撓式電子模組可具有隨著使用需求伸縮的效果,進而增加可撓式電子模組的應用性。在本發明的實施例的可撓式電子模組的製造方法中,由於形成了連接分佈區域的可伸縮材料層,因此可製造出能夠伸縮的可撓式電子模組。 In summary, in the flexible electronic module of the embodiment of the present invention, since the stretchable material layer is connected to the distribution area, the flexible electronic module can have the effect of expanding and contracting according to the use requirement, thereby increasing the flexibility. The application of electronic modules. In the method of manufacturing a flexible electronic module according to the embodiment of the present invention, since the stretchable material layer that connects the distribution regions is formed, a flexible electronic module capable of stretching and contracting can be manufactured.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
50‧‧‧硬質載板 50‧‧‧hard carrier
60‧‧‧圖案化遮罩層 60‧‧‧ patterned mask layer
70‧‧‧修飾層 70‧‧‧Retouching layer
80‧‧‧犧牲層 80‧‧‧ sacrificial layer
90‧‧‧凸塊膜具 90‧‧‧Bump film
100、100a、100b、100c、100d、100e、100f、100g、100h、100i、100j、100k、100l、100m、100n、100o、100p、100q、100r、100s、100t、100u、100v、100w、100x‧‧‧可撓式電子模組 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j, 100k, 100l, 100m, 100n, 100o, 100p, 100q, 100r, 100s, 100t, 100u, 100v, 100w, 100x‧ ‧‧Flexible electronic module
110、110a‧‧‧圖案化軟性基板 110, 110a‧‧‧ patterned flexible substrate
110’‧‧‧軟性基板 110'‧‧‧Soft substrate
111‧‧‧配置面 111‧‧‧Configuration surface
112、112a、112b、112c、112d、112e、112f、112t1、112t2、112t3‧‧‧分佈區域 112, 112a, 112b, 112c, 112d, 112e, 112f, 112t1, 112t2, 112t3‧‧‧ distribution area
113、122‧‧‧凹陷 113, 122‧‧‧ dent
114‧‧‧底部 114‧‧‧ bottom
115‧‧‧間隙 115‧‧‧ gap
120‧‧‧可伸縮材料層 120‧‧‧Stretchable material layer
130、130c‧‧‧電子元件 130, 130c‧‧‧ electronic components
130’‧‧‧導電層 130’‧‧‧ Conductive layer
130q‧‧‧接合墊 130q‧‧‧ joint pad
130r‧‧‧導線 130r‧‧‧Wire
130s‧‧‧觸控感測電極 130s‧‧‧Touch sensing electrode
130t‧‧‧可拉伸導線 130t‧‧‧stretchable wire
130u‧‧‧第一電極 130u‧‧‧first electrode
140‧‧‧離型層 140‧‧‧ release layer
142‧‧‧邊緣 142‧‧‧ edge
150‧‧‧覆蓋層 150‧‧‧ Coverage
200、200w‧‧‧可撓式電子裝置 200, 200w‧‧‧flexible electronic devices
210‧‧‧圖案化軟性基板 210‧‧‧ patterned soft substrate
212‧‧‧分佈區域 212‧‧‧Distributed area
220‧‧‧可伸縮材料層 220‧‧‧Stretchable material layer
230‧‧‧第二電極 230‧‧‧second electrode
300、300v‧‧‧異方性導電膜 300, 300v‧‧‧ anisotropic conductive film
L‧‧‧虛線 L‧‧‧ dotted line
P‧‧‧壓力 P‧‧‧ pressure
T‧‧‧張力 T‧‧‧ Tension
圖1為本發明的一實施例的可撓式電子模組的剖面示意圖。 圖2A至圖2I為圖1的可撓式電子模組的九種變化實施例的剖面示意圖。 圖3A至圖3E為本發明之另五個實施例之可撓式電子模組的圖案化軟性基板及可伸縮材料層的上視示意圖。 圖4A至圖4D為本發明之另四個實施例之可撓式電子模組的剖面示意圖。 圖5A為本發明之另一實施例之可撓式電子模組的上視示意圖。 圖5B為圖5A之可撓式電子模組沿著I-I線的剖面示意圖。 圖6為本發明之又一實施例之可撓式電子模組的上視示意圖。 圖7A至圖7G為繪示本發明之一實施例之可撓式電子模組的製造方法的流程之剖面示意圖。 圖8A與圖8B繪示本發明之另一實施例之可撓式電子模組的製造方法的其中兩個步驟。 圖9A與圖9B繪示本發明之又一實施例之可撓式電子模組的製造方法的其中兩個步驟。 圖10A至圖10E為繪示本發明之再一實施例之可撓式電子模組的製造方法的流程的剖面示意圖。 圖11為本發明之另一實施例之可撓式電子模組的剖面示意圖。 圖12為本發明之又一實施例之可撓式電子模組的剖面示意圖。 圖13為本發明之再一實施例之可撓式電子模組的剖面示意圖。 圖14為本發明之另一實施例之可撓式電子模組的剖面示意圖。1 is a cross-sectional view of a flexible electronic module in accordance with an embodiment of the present invention. 2A to 2I are schematic cross-sectional views showing nine modified embodiments of the flexible electronic module of FIG. 1. 3A-3E are top views of a patterned flexible substrate and a layer of a stretchable material of a flexible electronic module according to another embodiment of the present invention. 4A-4D are schematic cross-sectional views of a flexible electronic module according to another embodiment of the present invention. FIG. 5A is a top view of a flexible electronic module according to another embodiment of the present invention. 5B is a cross-sectional view of the flexible electronic module of FIG. 5A taken along line I-I. 6 is a top plan view of a flexible electronic module according to still another embodiment of the present invention. 7A to 7G are schematic cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to an embodiment of the present invention. 8A and 8B illustrate two steps in a method of fabricating a flexible electronic module according to another embodiment of the present invention. 9A and 9B illustrate two steps of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. 10A to 10E are cross-sectional views showing the flow of a method of manufacturing a flexible electronic module according to still another embodiment of the present invention. FIG. 11 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention. FIG. 12 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. FIG. 13 is a cross-sectional view of a flexible electronic module according to still another embodiment of the present invention. FIG. 14 is a cross-sectional view of a flexible electronic module according to another embodiment of the present invention.
100:可撓式電子模組 110:圖案化軟性基板 112:分佈區域 120:可伸縮材料層 130:電子元件100: Flexible electronic module 110: patterned flexible substrate 112: distribution area 120: layer of expandable material 130: electronic component
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