TWI555861B - Evaporation equipment - Google Patents
Evaporation equipment Download PDFInfo
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- TWI555861B TWI555861B TW103113324A TW103113324A TWI555861B TW I555861 B TWI555861 B TW I555861B TW 103113324 A TW103113324 A TW 103113324A TW 103113324 A TW103113324 A TW 103113324A TW I555861 B TWI555861 B TW I555861B
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本發明係關於一種蒸鍍設備，詳而言之，是一種可使含有多種蒸鍍材料之粉末同時汽化的蒸鍍設備。 The present invention relates to an evaporation apparatus, and more particularly to an evaporation apparatus capable of simultaneously vaporizing a powder containing a plurality of vapor deposition materials.
蒸鍍是目前在業界經常使用的一種鍍膜方法，可用在金屬材料上鍍膜，還可用在樹脂、玻璃的材料上，甚至連紙質材料也可使用蒸鍍的方法來鍍膜。因此，蒸鍍被廣泛運用於光學薄膜、絕緣膜、手機螢幕、食品包裝材料等物品的表面處理。 Evaporation is a coating method commonly used in the industry. It can be used for coating on metal materials, and can also be used on materials such as resin and glass. Even paper materials can be coated by evaporation. Therefore, vapor deposition is widely used for surface treatment of articles such as optical films, insulating films, mobile phone screens, and food packaging materials.
蒸鍍的進行主要是在提供有真空環境的腔室中進行，將蒸鍍材料擺在坩鍋中加熱直至汽化昇華，而逐漸地均勻附著於待鍍物的表面上以形成一層薄膜。腔室所提供的真空環境是藉由真空幫浦所達成，可避免蒸鍍材料的汽化分子在到達待鍍物鍍面前與其它氣體分子發生反應，而影響待鍍物鍍膜的蒸鍍結果。 The vapor deposition is carried out mainly in a chamber provided with a vacuum environment, and the vapor deposition material is heated in a crucible until vaporization sublimation, and gradually adheres uniformly to the surface of the object to be plated to form a film. The vacuum environment provided by the chamber is achieved by the vacuum pump, which can prevent the vaporization molecules of the vapor deposition material from reacting with other gas molecules before reaching the plating of the object to be plated, thereby affecting the vapor deposition result of the plating film to be plated.
目前的蒸鍍機台，通常單次只能使用一種蒸鍍材料來對待鍍物進行鍍膜，主要原因是每種蒸鍍材料的汽化溫度不盡相同，若在坩鍋上放入多種蒸鍍材料，很有可能會發生蒸鍍材料汽化不均的問題，亦即，坩鍋上的蒸鍍材料有可能某些發生汽化某些仍維持固態，導致待鍍物鍍膜的組成材料成分很難維持一致，使待鍍物表面各區域的鍍膜效果不一，而使待鍍物的蒸鍍結果不佳。 At present, the evaporation machine usually only uses one evaporation material to coat the plating material in a single time. The main reason is that the vaporization temperature of each evaporation material is not the same. If various evaporation materials are placed on the crucible. It is very likely that the vaporization material will be vaporized unevenly, that is, the vapor deposition material on the crucible may be vaporized and some remain solid, which makes it difficult to maintain the composition of the material to be plated. The coating effect of each area on the surface of the object to be plated is different, and the vapor deposition result of the object to be plated is not good.
此外，坩鍋上各種蒸鍍材料的擺放位置若不同，也會對各種蒸鍍材料鍍上待鍍物表面的位置造成影響，亦即，每種蒸鍍材料只能鍍到待鍍物上與其擺放位置相鄰近的局部區域上，如此亦會對待鍍物的蒸鍍造成不佳的結果，而降低待鍍物的價值。 In addition, if the placement positions of various vapor deposition materials on the crucible are different, the position of the various evaporation materials to be plated on the surface to be plated may be affected, that is, each evaporation material may only be plated on the object to be plated. In the local area adjacent to the placement position, this also causes poor results in the evaporation of the plating material, and reduces the value of the object to be plated.
因此，如何設計一種蒸鍍設備，將多種蒸鍍材料均勻鍍上待鍍物，是現在業界所迫切需求解決的議題。 Therefore, how to design an evaporation device and uniformly plate a plurality of vapor deposition materials to be plated is an urgent problem to be solved in the industry.
本發明提供一種蒸鍍設備，包括：蒸鍍室；材料供給裝置，係穿設於該蒸鍍室並填充有包含多種蒸鍍材料之粉末，該材料供給裝置包括：油壓推進機構，包含一油壓缸、一滑動於該油壓缸內中空的推進桿、一穿設於該推進桿的調整桿、及一位於該推進桿內與該調整桿螺接之止擋塊，當油料進入該油壓缸中時可藉油壓力推動該推進桿，進而推擠該材料供給裝置內的蒸鍍材料粉末，以提供能量使該蒸鍍材料粉末自該材料供給裝置噴出，其中，旋轉該調整桿可調整該止擋塊相對該調整桿的位置，藉以調節該推進桿的推進行程；蒸鍍材料載具，係容置於該蒸鍍室中，用於承載自該材料供給裝置噴出之蒸鍍材料粉末；以及待鍍物載具，係容置於該蒸鍍室中且相對於該待鍍物載具，用於承載一待鍍物，其中，於該蒸鍍室中執行蒸鍍程序時，需將該蒸鍍材料載具加熱至一預設溫度，該預設溫度需高於蒸鍍材料粉末中所有蒸鍍材料的汽化溫度，俾使蒸鍍材料粉末的各種蒸鍍材料在同一時間汽化，而均勻地蒸鍍於該待鍍物的鍍面上。 The present invention provides an evaporation apparatus comprising: an evaporation chamber; a material supply device is disposed in the evaporation chamber and filled with a powder comprising a plurality of vapor deposition materials, the material supply device comprising: a hydraulic propulsion mechanism, comprising a hydraulic cylinder, a push rod that slides in the hydraulic cylinder, an adjusting rod that is disposed on the propeller rod, and a stop block that is screwed into the propeller rod and is connected to the adjusting rod, when the oil enters the In the hydraulic cylinder, the push rod can be pushed by the oil pressure, and then the vapor deposition material powder in the material supply device is pushed to provide energy to eject the vapor deposition material powder from the material supply device, wherein the adjustment rod is rotated Adjusting the position of the stop block relative to the adjusting rod, thereby adjusting the advancement stroke of the push rod; the vapor deposition material carrier is disposed in the vapor deposition chamber for carrying the evaporation from the material supply device a material powder; and a material to be plated, disposed in the vapor deposition chamber and relative to the material to be plated, for carrying a material to be plated, wherein when the evaporation process is performed in the evaporation chamber , the evaporation material carrier is required Heating to a preset temperature, which is higher than the vaporization temperature of all the evaporation materials in the vapor deposition material powder, so that various vapor deposition materials of the evaporation material powder are vaporized at the same time, and uniformly evaporated on the The plating surface of the object to be plated.
本發明之蒸鍍設備進一步包括一角度調整裝置，而該材料供給裝置還包括一與該油壓推進機構連通之噴嘴，其中，該角度調整裝置穿設於該蒸鍍室並抵接該噴嘴，用於調整該噴嘴相對於該蒸鍍材料載具之角度。 The vapor deposition apparatus of the present invention further includes an angle adjusting device, and the material supply device further includes a nozzle communicating with the hydraulic propelling mechanism, wherein the angle adjusting device is disposed in the vapor deposition chamber and abuts the nozzle. Used to adjust the angle of the nozzle relative to the vapor deposition material carrier.
本發明之蒸鍍設備之待鍍物載具還包括相互連接之一轉軸及一用於承載該待鍍物之承載板，其中，該轉軸旋轉可帶動該承載板旋轉，以使該待鍍物旋轉而進行蒸鍍程序。 The object to be plated of the vapor deposition apparatus of the present invention further includes a rotating shaft connected to each other and a carrier plate for carrying the object to be plated, wherein the rotation of the rotating shaft can rotate the carrier plate to make the object to be plated The evaporation process is performed by rotating.
相較於先前技術，本發明蒸鍍設備的材料供給裝置內所填充之蒸鍍材料粉末係包含多種材質不同且均勻混合的材料，在蒸鍍進行時，需將蒸鍍材料載具加熱到大於蒸鍍材料粉末中所有蒸鍍材料汽化溫度的溫度，故使蒸鍍材料載具上的蒸鍍材料粉末的所有蒸鍍材料在同一時間汽化，而可利用粉末閃蒸方式，將各種蒸鍍材料均勻鍍上待鍍物的鍍面，而待鍍物又可藉由轉軸旋轉而自轉，使得在待鍍物的鍍面上能形成成分均勻的鍍膜。此外，角度調整機構可調整噴嘴相對於蒸鍍材料載具之角度，使自噴嘴射出的蒸鍍材料粉末能落於該蒸鍍材料載具的適當位置。 Compared with the prior art, the vapor deposition material powder filled in the material supply device of the vapor deposition device of the present invention comprises a plurality of materials which are different in material and uniformly mixed, and the evaporation material carrier needs to be heated to be larger than when the vapor deposition is performed. The temperature of the vaporization temperature of all the vapor deposition materials in the vapor deposition material powder, so that all the vapor deposition materials of the vapor deposition material powder on the vapor deposition material carrier are vaporized at the same time, and various vapor deposition materials can be obtained by powder flashing. The plated surface of the object to be plated is uniformly plated, and the object to be plated can be rotated by the rotation of the rotating shaft, so that a uniform coating film can be formed on the plated surface of the object to be plated. Further, the angle adjusting mechanism can adjust the angle of the nozzle with respect to the vapor deposition material carrier so that the vapor deposition material powder emitted from the nozzle can fall at an appropriate position of the vapor deposition material carrier.
1‧‧‧蒸鍍室 1‧‧‧vaporation chamber
11‧‧‧第一通孔 11‧‧‧ first through hole
12‧‧‧第二通孔 12‧‧‧Second through hole
13‧‧‧顯示螢幕 13‧‧‧ Display screen
2‧‧‧材料供給裝置 2‧‧‧Material supply device
21‧‧‧油壓推進機構 21‧‧‧Hydraulic propulsion mechanism
211‧‧‧油壓缸 211‧‧‧Hydraulic cylinder
2111‧‧‧第一油口 2111‧‧‧ first port
2112‧‧‧第二油口 2112‧‧‧second port
212‧‧‧推進桿 212‧‧‧Feed rod
2121‧‧‧主體 2121‧‧‧ Subject
2122‧‧‧抵靠部 2122‧‧‧Abutment
2123‧‧‧推進部 2123‧‧‧Promotion Department
2124‧‧‧導引槽 2124‧‧‧ guiding slot
2125‧‧‧凹槽 2125‧‧‧ Groove
2126‧‧‧凸柱 2126‧‧‧Bump
213‧‧‧調整桿 213‧‧‧ adjustment rod
2131‧‧‧容置槽 2131‧‧‧ accommodating slots
2132‧‧‧外螺牙 2132‧‧‧ External thread
214‧‧‧止擋塊 214‧‧‧stop block
2141‧‧‧導引柱 2141‧‧‧ Guide column
2142‧‧‧內螺牙 2142‧‧‧ internal thread
22‧‧‧噴嘴 22‧‧‧Nozzles
23‧‧‧漏斗 23‧‧‧ funnel
3‧‧‧角度調整裝置 3‧‧‧ Angle adjustment device
31‧‧‧主桿 31‧‧‧ main pole
32‧‧‧連接銷 32‧‧‧Connected pins
33‧‧‧下限位擋片 33‧‧‧low limit block
34‧‧‧上限為擋片 34‧‧‧ upper limit is the blank
35‧‧‧驅動器 35‧‧‧ drive
4‧‧‧蒸鍍材料粉末 4‧‧‧Deposition material powder
5‧‧‧蒸鍍材料載具 5‧‧‧Vaporescent material carrier
6‧‧‧待鍍物載具 6‧‧‧The object to be plated
61‧‧‧承載板 61‧‧‧Loading board
62‧‧‧轉軸 62‧‧‧ shaft
7‧‧‧待鍍物 7‧‧‧The object to be plated
A‧‧‧方向 A‧‧‧ direction
D1‧‧‧終端位置 D1‧‧‧ Terminal location
D2‧‧‧初始位置 D2‧‧‧ initial position
H‧‧‧推進行程 H‧‧‧Advance itinerary
[圖1]係本發明蒸鍍設備一實施型態的示意圖。 Fig. 1 is a schematic view showing an embodiment of the vapor deposition apparatus of the present invention.
[圖2]係圖1所示蒸鍍設備局部剖面的示意圖。 Fig. 2 is a schematic view showing a partial cross section of the vapor deposition apparatus shown in Fig. 1.
[圖3]係圖2所示A區域的放大示圖。 FIG. 3 is an enlarged view of a region A shown in FIG. 2. FIG.
[圖4]係圖2所示B區域的放大示圖。 Fig. 4 is an enlarged view showing a region B shown in Fig. 2.
[圖5]係本發明蒸鍍設備的材料供給裝置將所裝填的蒸鍍材料粉末噴至蒸鍍材料載具上的示意圖。 Fig. 5 is a schematic view showing a material supply device of the vapor deposition device of the present invention in which a deposited vapor deposition material powder is sprayed onto a vapor deposition material carrier.
[圖6]係本發明蒸鍍設備的可調節行程的油壓推進機構的示意圖。 Fig. 6 is a schematic view showing a hydraulic stroke propelling mechanism of an adjustable stroke of the vapor deposition apparatus of the present invention.
[圖7]係本發明蒸鍍設備的油壓推進機構的推進桿返回初始位置的狀態示意圖。 Fig. 7 is a view showing a state in which the pusher lever of the hydraulic propelling mechanism of the vapor deposition device of the present invention returns to the initial position.
[圖8]係本發明蒸鍍設備的可調節行程的油壓推進機構的推進桿推進的狀態示意圖。 Fig. 8 is a view showing a state of propulsion rod propulsion of an oil pressure propelling mechanism of an adjustable stroke of the vapor deposition apparatus of the present invention.
以下內容將搭配圖式，藉由特定的具體實施例說明本發明之技術內容，熟悉此技術之人士可由本說明書所揭示之內容輕易地了解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用。本說明書中的各項細節亦可基於不同觀點與應用，在不背離本發明之精神下，進行各種修飾與變更。尤其是，於圖式中各個元件的比例關係及相對位置僅具示範性用途，並非代表本發明實施的實際狀況。 The other aspects of the present invention will be readily understood by those skilled in the art from this disclosure. The invention may also be embodied or applied by other different embodiments. The details of the present invention can be variously modified and changed without departing from the spirit and scope of the invention. In particular, the relative relationship and relative positions of the various elements in the drawings are for illustrative purposes only and are not representative of actual implementation of the invention.
請參閱圖1、2和5，本發明之蒸鍍設備主要包括一蒸鍍室1、一材料供給裝置2、一蒸鍍材料載具5及一待鍍物載具6，亦可包括一角度調整裝置3，但不以此為限。 Referring to Figures 1, 2 and 5, the vapor deposition apparatus of the present invention mainly comprises an evaporation chamber 1, a material supply device 2, an evaporation material carrier 5, and a to-be-plated carrier 6, which may also include an angle. The device 3 is adjusted, but not limited thereto.
蒸鍍室1包括一第一通孔11、一第二通孔12和一顯示螢幕13，該蒸鍍室1係與一真空系統(未繪示)相連接以提供真空環境而執行真空蒸鍍，通常，該顯示螢幕13可顯示蒸鍍室1內目前的溫度、壓力、真空度等蒸鍍操作條件。該材料供給裝置2和該角度調整裝置3的前端主要部位，分別通過該第一通孔11和該第二通孔12而進入該蒸鍍室1，須說明的是，在該蒸鍍室1中，該材料供給 裝置2和該角度調整裝置3穿設後，該第一通孔11與該材料供給裝置2之間和該第二通孔12與該角度調整裝置3之間的縫隙，需利用不透氣的填充材料封住，以避免外界氣體經由上述縫隙進入該蒸鍍室1而破壞該蒸鍍室1的真空環境。 The vapor deposition chamber 1 includes a first through hole 11, a second through hole 12 and a display screen 13. The vapor deposition chamber 1 is connected to a vacuum system (not shown) to provide a vacuum environment and perform vacuum evaporation. Generally, the display screen 13 can display the current vapor deposition operating conditions such as temperature, pressure, and vacuum in the vapor deposition chamber 1. The material supply device 2 and the front end main portion of the angle adjusting device 3 respectively enter the vapor deposition chamber 1 through the first through hole 11 and the second through hole 12, and it should be noted that in the vapor deposition chamber 1 Medium, the material supply After the device 2 and the angle adjusting device 3 are disposed, the gap between the first through hole 11 and the material supply device 2 and between the second through hole 12 and the angle adjusting device 3 needs to be filled with airtightness. The material is sealed to prevent the outside air from entering the vapor deposition chamber 1 through the slit to break the vacuum environment of the vapor deposition chamber 1.
材料供給裝置2的前端主要部位係穿設於該蒸鍍室1，可填充由多種蒸鍍材料混合而成之粉末4，該材料供給裝置2包括一油壓推進機構21、一噴嘴22、及一與該噴嘴22連通之漏斗23，其中，該漏斗23用於供填充所述蒸鍍材料粉末4，並提供引導而使所填充的蒸鍍材料粉末4順利進入該材料供給裝置2內部，該油壓推進機構21具有推進桿212，以對該材料供給裝置2內部的蒸鍍材料粉末4提供推力，而藉由該噴嘴22將該蒸鍍材料粉末4噴射至該蒸鍍材料載具5上的適當位置。須說明的是，由於蒸鍍時該蒸鍍室1需為真空狀態，惟填充該蒸鍍材料粉末4時需先破壞該蒸鍍室1內部的真空狀態方能達成，該蒸鍍室1內部真空破壞的次數過於頻繁會造成操作不便且耗時，故本發明於該材料供給裝置2上設計該漏斗23以對該蒸鍍材料粉末4提供額外的填充空間，而增加該蒸鍍室1單次可填充該蒸鍍材料粉末4的量，且該漏斗23的內壁面可提供引導而作為引導面，以順利引導該蒸鍍材料粉末4進入該材料供給裝置2內部中。 The main portion of the front end of the material supply device 2 is disposed in the vapor deposition chamber 1 and can be filled with a powder 4 mixed by a plurality of vapor deposition materials. The material supply device 2 includes a hydraulic propulsion mechanism 21, a nozzle 22, and a funnel 23 communicating with the nozzle 22, wherein the funnel 23 is used for filling the vapor deposition material powder 4 and providing guidance for smoothly filling the filled vapor deposition material powder 4 into the material supply device 2, which The hydraulic propulsion mechanism 21 has a push rod 212 for supplying thrust to the vapor deposition material powder 4 inside the material supply device 2, and the vapor deposition material powder 4 is sprayed onto the vapor deposition material carrier 5 by the nozzle 22. The proper location. It should be noted that, since the vapor deposition chamber 1 needs to be in a vacuum state during vapor deposition, it is only necessary to destroy the vacuum state inside the vapor deposition chamber 1 when the vapor deposition material powder 4 is filled, and the inside of the vapor deposition chamber 1 is completed. If the number of times of vacuum destruction is too frequent, the operation is inconvenient and time consuming, so the present invention designs the funnel 23 on the material supply device 2 to provide an additional filling space for the evaporation material powder 4, and increases the evaporation chamber 1 The amount of the vapor deposition material powder 4 may be filled, and the inner wall surface of the funnel 23 may provide guidance as a guide surface to smoothly guide the vapor deposition material powder 4 into the interior of the material supply device 2.
配合參閱圖3，該油壓推進機構21包括一油壓缸211、一滑動於該油壓缸211內之中空的推進桿212、一同時穿設於該油壓缸211和該推進桿212之調整桿213、及一位於該推進桿212中與該調整桿213螺接之止擋塊214，所述的螺接係例如為該調整桿213利用外螺牙2132且該止擋塊214利用對應的內螺牙2142來相互螺合。於該油壓推進機構21的推進狀態中，令油料進入該油壓缸211中以推動該推進桿212，進而推擠該材料供給裝置2內部的蒸鍍材料粉末4而提供動能，使該蒸鍍材料粉末4自該噴嘴22噴射至該蒸鍍材料載具5上。 Referring to FIG. 3 , the hydraulic propulsion mechanism 21 includes a hydraulic cylinder 211 , a hollow propeller rod 212 sliding in the hydraulic cylinder 211 , and a hydraulic cylinder 211 and the propulsion rod 212 . The adjusting rod 213 and a stopping block 214 which is screwed to the adjusting rod 213 in the pushing rod 212, for example, the adjusting rod 213 uses the external thread 2132 and the stopping block 214 utilizes the corresponding The internal threads 2142 are screwed together. In the propulsion state of the hydraulic propulsion mechanism 21, the oil enters the hydraulic cylinder 211 to push the propulsion rod 212, thereby pushing the vapor deposition material powder 4 inside the material supply device 2 to provide kinetic energy, so that the steam is supplied. The plating material powder 4 is ejected from the nozzle 22 onto the vapor deposition material carrier 5.
此外，應說明的是，該油壓推進機構21還包括與該油壓缸211內部油料無接觸的推擠件，該推進桿212可藉由所述的推擠件推擠該蒸鍍材料粉末4，以避免該推進桿212與該蒸鍍材料粉末4的直接接觸，而免除推進桿212外表面殘留的油料污染該蒸鍍材料粉末4。該調整桿213的旋轉操作，是可使該止擋塊214相對該調整桿213移動而改變位置，進而重新定義該推進桿212的推進行程H(容後說明)。 In addition, it should be noted that the hydraulic propulsion mechanism 21 further includes a pushing member that is not in contact with the oil inside the hydraulic cylinder 211, and the propelling rod 212 can push the vapor deposition material powder by the pushing member. 4, in order to avoid direct contact of the push rod 212 with the vapor deposition material powder 4, the oil remaining on the outer surface of the push rod 212 is prevented from contaminating the vapor deposition material powder 4. The rotation of the adjustment lever 213 is such that the stop block 214 is moved relative to the adjustment lever 213 to change the position, thereby re-defining the advancement stroke H of the push rod 212 (described later).
角度調整裝置3穿設於該蒸鍍室1並銷接於該噴嘴22，包括一主桿31、一分別連接該主桿31與該噴嘴22之連接銷32(如圖4所示)、一提供該主桿31作動之驅動器35，其中，該驅動器35可驅動該主桿31上下移動，進而調整該噴嘴22相對於該蒸鍍材料載具5之角度，以對該蒸鍍材料載具5的適當位置提供蒸鍍材料粉末4。該角度調整裝置3還包括一位於該主桿31上方部位的下限位擋片33和一位於該主桿31下方部位的上限位擋片34，該下限位擋片33用於阻止該主桿31持續的向下移動，該上限位擋片34用於阻止該主桿持續的向上移動，是以，該下限位擋片33及該上限位擋片34可用於定義出該主桿31之移動行程，亦即，可定義出該噴嘴22的角度調整範圍。 The angle adjusting device 3 is disposed in the vapor deposition chamber 1 and is pinned to the nozzle 22, and includes a main rod 31, and a connecting pin 32 (shown in FIG. 4) connecting the main rod 31 and the nozzle 22, respectively. The driver 35 for driving the main rod 31 is provided, wherein the driver 35 can drive the main rod 31 to move up and down, thereby adjusting the angle of the nozzle 22 relative to the vapor deposition material carrier 5 to the vapor deposition material carrier 5 The vapor deposition material powder 4 is provided at a suitable position. The angle adjusting device 3 further includes a lower limit block 33 located above the main rod 31 and an upper limit block 34 located below the main rod 31. The lower limit block 33 is used to block the main rod 31. Continuous downward movement, the upper limit block 34 is used to prevent the upward movement of the main rod, so that the lower limit block 33 and the upper limit block 34 can be used to define the movement stroke of the main rod 31. That is, the angle adjustment range of the nozzle 22 can be defined.
蒸鍍材料載具5設置於該蒸鍍室1中，用於承載自該材料供給裝置2噴出之蒸鍍材料粉末4，該蒸鍍材料粉末4可被在蒸鍍材料載具5上加熱而汽化。該蒸鍍材料載具5例如坩堝(crucible)，該蒸鍍材料粉末4例如鋁、亞鉛、金、銀、白金、鎳等金屬材料、或SiO2、TiO2、ZrO2、MgF2等氧化物與氟化物。 The vapor deposition material carrier 5 is disposed in the vapor deposition chamber 1 for carrying the vapor deposition material powder 4 ejected from the material supply device 2, and the vapor deposition material powder 4 can be heated on the vapor deposition material carrier 5 Vaporization. The vapor deposition material carrier 5 is, for example, crucible, and the vapor deposition material powder 4 is a metal material such as aluminum, lead, gold, silver, platinum, or nickel, or an oxide or fluoride such as SiO 2 , TiO 2 , ZrO 2 , or MgF 2 . .
待鍍物載具6係設置於該蒸鍍室1中相對於該蒸鍍材料載具5的位置，可包括一承載板61及一轉軸62，其中，該承載板61用於承載一待鍍物7，該 轉軸62可旋轉帶動該承載板61旋轉，以使該待鍍物7跟著旋轉，使該蒸鍍材料載具5上之蒸鍍材料粉末4的汽化分子能均勻地鍍到該待鍍物7各部位的鍍面上。 The substrate to be plated 6 is disposed in the vapor deposition chamber 1 relative to the position of the vapor deposition material carrier 5, and may include a carrier plate 61 and a rotating shaft 62, wherein the carrier plate 61 is used to carry a plate to be plated. Matter 7, this The rotating shaft 62 can rotate to rotate the carrier plate 61, so that the object to be plated 7 is rotated, so that the vaporized molecules of the vapor-deposited material powder 4 on the vapor-deposited material carrier 5 can be uniformly plated to the object to be plated 7. The plating surface of the part.
於圖1至圖5所示之實施例中，於該蒸鍍室1中執行真空蒸鍍時，需該將蒸鍍材料載具5加熱至一預設溫度，以汽化所承載的蒸鍍材料粉末4。於本發明中，該預設溫度需高於該粉末4中的所有蒸鍍材料的汽化溫度，俾使該粉末4中所包含的各種蒸鍍材料於同一時間汽化，而使各種蒸鍍材料的汽化分子都能均勻地鍍於該待鍍物7各部位的鍍面上。 In the embodiment shown in FIG. 1 to FIG. 5, when vacuum evaporation is performed in the vapor deposition chamber 1, the evaporation material carrier 5 is heated to a preset temperature to vaporize the carried evaporation material. Powder 4. In the present invention, the preset temperature is required to be higher than the vaporization temperature of all the vapor deposition materials in the powder 4, so that the various vapor deposition materials contained in the powder 4 are vaporized at the same time to make various vapor deposition materials. The vaporized molecules can be uniformly plated on the plating surface of each portion of the object to be plated 7.
配合參閱圖6，進一步說明該推進桿212。該推進桿212包括一主體2121、一抵靠部2122及一推進部2123。該主體2121具有一沿該推進桿212滑動的方向A延伸之導引槽2124，而相應地該止擋塊214具有一滑動於該導引槽2124中之導引柱2141。於旋轉該調整桿213時會帶動該止擋塊214，惟該止擋塊214的導引柱2141又卡在該導引槽2124中，故該止擋塊214不會隨該調整桿213旋轉，而是會沿著該導引槽2124在該方向A上位移，藉此調整該止擋塊214在該調整桿213上的位置，進而調整該推進桿212的推進行程。 The push rod 212 is further described with reference to FIG. The push rod 212 includes a main body 2121, an abutting portion 2122 and a pushing portion 2123. The main body 2121 has a guiding groove 2124 extending in a direction A in which the pushing rod 212 slides. Accordingly, the stopping block 214 has a guiding post 2141 slidably in the guiding groove 2124. When the adjusting rod 213 is rotated, the stopping block 214 is driven, but the guiding post 2141 of the stopping block 214 is locked in the guiding groove 2124, so the stopping block 214 does not rotate with the adjusting rod 213. Instead, the guide groove 2124 is displaced in the direction A, thereby adjusting the position of the stop block 214 on the adjustment rod 213, thereby adjusting the advancement stroke of the push rod 212.
另外，該推進部2123具有一凹槽2125及一自該凹槽凸伸的凸柱2126，而該調整桿213具有一對應容置該凸柱2126之容置槽2131，該調整桿213可利用該容置槽2131容置該凸柱2126而插設於該推進部2123上，藉此對該調整桿213提供支撐，而避免該調整桿213的一端懸空於該推進桿212中，以減少調整桿213發生懸空變形的機會。 In addition, the pushing portion 2123 has a recess 2125 and a protruding post 2126 protruding from the recess, and the adjusting rod 213 has a receiving slot 2131 corresponding to the protruding post 2126. The adjusting rod 213 can be utilized. The receiving slot 2131 receives the protruding post 2126 and is inserted into the pushing portion 2123, thereby providing support for the adjusting rod 213, and avoiding one end of the adjusting rod 213 being suspended in the pushing rod 212 to reduce the adjustment. The rod 213 has a chance to undergo a dangling deformation.
配合參閱圖7和8，該油壓缸211包括一第一油口2111和一第二油口2112，當油料自該第一油口2111進入該油壓缸211時，該推進桿212被油料推動以使抵靠部2122自一初始位置D2滑動至一終端位置D1，當抵靠部2122至一終 端位置D1時，會受到該止擋塊214的止擋而停止滑動，是以，該止擋塊214可定義出該推進桿212的推進行程。反之，當油料自該第二油口2112進入該油壓缸211時，該推進桿212被推動以自該終端位置D1回復至該初始位置D2，此時，會在噴嘴22內部形成空間而供漏斗23中的蒸鍍材料粉末4流入。須說明的是，該終端位置D1即是該抵靠部2122抵靠至該止擋塊214的位置，初始位置D2與該終端位置D1之間的距離即為前述油壓缸211的推進行程H，因此，該調整桿213能調整該止檔塊214在該調整桿213上的位置，藉此調節該推進桿212的推進行程H。 Referring to FIGS. 7 and 8, the hydraulic cylinder 211 includes a first oil port 2111 and a second oil port 2112. When the oil enters the hydraulic cylinder 211 from the first port 2111, the push rod 212 is oiled. Pushing to abut the abutting portion 2122 from an initial position D2 to a terminal position D1, when the abutting portion 2122 to the end When the end position D1 is received, the stop of the stop block 214 is stopped to stop sliding, so that the stop block 214 can define the advancement stroke of the push rod 212. On the contrary, when the oil enters the hydraulic cylinder 211 from the second port 2112, the push rod 212 is pushed to return from the end position D1 to the initial position D2, at which time a space is formed inside the nozzle 22 for supply. The vapor deposition material powder 4 in the funnel 23 flows in. It should be noted that the terminal position D1 is the position at which the abutting portion 2122 abuts against the stop block 214, and the distance between the initial position D2 and the terminal position D1 is the advancement stroke H of the hydraulic cylinder 211. Therefore, the adjusting rod 213 can adjust the position of the stop block 214 on the adjusting rod 213, thereby adjusting the pushing stroke H of the pushing rod 212.
另外，應說明的是，本發明蒸鍍設備的材料供給裝置中，用於對蒸鍍材料粉末提供推擠力的推進機構，非以本發明圖中所示的油壓推進機構為限，仍可選用以電動馬達或氣壓能量形式的推進機構，以促使材料供給裝置中的蒸鍍材料粉末能夠分階段地自噴嘴向蒸鍍材料載具噴出。 In addition, it should be noted that, in the material supply device of the vapor deposition device of the present invention, the propulsion mechanism for providing the pressing force to the vapor deposition material powder is not limited to the hydraulic propulsion mechanism shown in the drawing of the present invention. A propulsion mechanism in the form of an electric motor or pneumatic energy may be selected to cause the vapor deposition material powder in the material supply device to be ejected from the nozzle to the vapor deposition material carrier in stages.
綜上所述，本發明蒸鍍設備之材料供給裝置填充有包含多種不同材質且均勻混合的蒸鍍材料粉末，且蒸鍍材料載具被加熱至一預設溫度，該預設溫度需高於所有填充的蒸鍍材料粉末的汽化溫度，藉以使所有蒸鍍材料粉末在同一時間汽化，以利用粉末閃蒸方式，將各種蒸鍍材料的汽化分子均勻鍍上待鍍物的鍍面。 In summary, the material supply device of the vapor deposition apparatus of the present invention is filled with an evaporation material powder containing a plurality of different materials and uniformly mixed, and the evaporation material carrier is heated to a preset temperature, which is higher than the preset temperature. The vaporization temperature of all the vapor-deposited material powders is such that all of the vapor-deposited material powders are vaporized at the same time to uniformly plate the vaporized molecules of the various vapor-deposited materials onto the plating surface of the object to be plated by the powder flashing method.
此外，本發明蒸鍍設備之材料供給裝置還設計有噴嘴以及可對填充於其中的蒸鍍材料粉末施加推力的推進機構，而提供動能使材料供給裝置內部的蒸鍍材料粉末能經由噴嘴向蒸鍍材料載具的適當位置噴射。再者，本發明蒸鍍設備還包括可調整材料供給裝置噴嘴角度之角度調整機構，藉以調整該噴嘴的噴射角度，以對該蒸鍍材料載具的適當位置提供蒸鍍材料粉末。 Further, the material supply device of the vapor deposition apparatus of the present invention is further provided with a nozzle and an advancement mechanism capable of applying a thrust to the vapor deposition material powder filled therein, and the vapor deposition material powder provided inside the kinetic material supply device can be steamed through the nozzle. Spraying the appropriate position of the plating material carrier. Furthermore, the vapor deposition apparatus of the present invention further includes an angle adjustment mechanism that adjusts the nozzle angle of the material supply device, thereby adjusting the spray angle of the nozzle to provide the vapor deposition material powder at an appropriate position of the vapor deposition material carrier.
1‧‧‧蒸鍍室 1‧‧‧vaporation chamber
11‧‧‧第一通孔 11‧‧‧ first through hole
12‧‧‧第二通孔 12‧‧‧Second through hole
2‧‧‧材料供給裝置 2‧‧‧Material supply device
21‧‧‧油壓推進機構 21‧‧‧Hydraulic propulsion mechanism
22‧‧‧噴嘴 22‧‧‧Nozzles
23‧‧‧漏斗 23‧‧‧ funnel
4‧‧‧蒸鍍材料粉末 4‧‧‧Deposition material powder
5‧‧‧蒸鍍材料載具 5‧‧‧Vaporescent material carrier
6‧‧‧待鍍物載具 6‧‧‧The object to be plated
7‧‧‧待鍍物 7‧‧‧The object to be plated
Claims (10)
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| TW103113324A TWI555861B (en) | 2014-04-11 | 2014-04-11 | Evaporation equipment |
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| TW103113324A TWI555861B (en) | 2014-04-11 | 2014-04-11 | Evaporation equipment |
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| TW201538761A TW201538761A (en) | 2015-10-16 |
| TWI555861B true TWI555861B (en) | 2016-11-01 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5514350A (en) * | 1994-04-22 | 1996-05-07 | Rutgers, The State University Of New Jersey | Apparatus for making nanostructured ceramic powders and whiskers |
| US6818043B1 (en) * | 2003-01-23 | 2004-11-16 | Electric Power Research Institute, Inc. | Vapor-phase contaminant removal by injection of fine sorbent slurries |
| US20050150759A1 (en) * | 2002-03-23 | 2005-07-14 | Chang Isaac T.H. | Powder and coating formation method and apparatus |
| TWI324185B (en) * | 2005-01-21 | 2010-05-01 | Mitsubishi Heavy Ind Ltd | Vacuum vapor deposition apparatus |
| US8440018B2 (en) * | 2008-05-23 | 2013-05-14 | Jusung Engineering Co., Ltd. | Apparatus for supplying source and apparatus for deposition thin film having the same |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5514350A (en) * | 1994-04-22 | 1996-05-07 | Rutgers, The State University Of New Jersey | Apparatus for making nanostructured ceramic powders and whiskers |
| US20050150759A1 (en) * | 2002-03-23 | 2005-07-14 | Chang Isaac T.H. | Powder and coating formation method and apparatus |
| US6818043B1 (en) * | 2003-01-23 | 2004-11-16 | Electric Power Research Institute, Inc. | Vapor-phase contaminant removal by injection of fine sorbent slurries |
| TWI324185B (en) * | 2005-01-21 | 2010-05-01 | Mitsubishi Heavy Ind Ltd | Vacuum vapor deposition apparatus |
| US8440018B2 (en) * | 2008-05-23 | 2013-05-14 | Jusung Engineering Co., Ltd. | Apparatus for supplying source and apparatus for deposition thin film having the same |
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