TWI551938B - Image pickup module and electronic apparatus - Google Patents

Image pickup module and electronic apparatus Download PDF

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TWI551938B
TWI551938B TW103104921A TW103104921A TWI551938B TW I551938 B TWI551938 B TW I551938B TW 103104921 A TW103104921 A TW 103104921A TW 103104921 A TW103104921 A TW 103104921A TW I551938 B TWI551938 B TW I551938B
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unit
light
light emitting
frame
emitting unit
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TW103104921A
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TW201531787A (en
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薛全欽
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奇景光電股份有限公司
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Description

攝相模組及電子裝置 Photographic module and electronic device

本發明是有關於一種攝相模組及電子裝置。 The invention relates to a camera module and an electronic device.

隨著科技的進步,越來越多電子產品具有多功能、小型化、高精度的設計。在我們生活中,攝影、拍照功能對於電子裝置(例如是攝像系統、手持式裝置、醫療偵查裝置)來說已經是不可或缺的功能,其中為了得到良好的影像品質,上述這些電子產品除了裝有攝影模組或拍照模組外都還會伴隨裝有閃光燈模組來在攝影、拍照時提供額外的光源。 With the advancement of technology, more and more electronic products are designed with versatility, miniaturization and high precision. In our lives, photography and camera functions are already indispensable for electronic devices (such as camera systems, handheld devices, medical detection devices). In order to obtain good image quality, these electronic products are not included. There are also flash modules installed in the camera module or camera module to provide additional light source for photography and photographing.

由於現在的攝影模組或拍照模組的組裝和閃光燈模組的組裝都是分開進行,伴隨著小型化需求的提昇,在要求高精度的同時,往往也提高了製作成本和組裝時間。不僅如此,由於攝影模組或拍照模組及閃光燈模組同時需要佔用系統的組裝空間,因此也阻礙了上述這些電子產品小型化的設計。 Since the assembly of the current photography module or the camera module and the assembly of the flash module are performed separately, the demand for miniaturization is increased, and the manufacturing cost and the assembly time are often increased while requiring high precision. Moreover, since the camera module or the camera module and the flash module simultaneously occupy the assembly space of the system, the design of miniaturization of these electronic products is also hindered.

本發明提供一種攝像模組,其可將攝像單元及發光單元整合在一起。 The invention provides a camera module, which can integrate an image capturing unit and a light emitting unit.

本發明提供一種電子裝置,其具有將攝像單元與發光單元整合在一起的攝像模組。 The invention provides an electronic device having an image capturing module that integrates an image capturing unit and a light emitting unit.

本發明提供一種攝像模組,包括攝像單元、發光單元以及框架,發光單元適於發出一光束,框架固定攝像單元及發光單元。框架具有一入光孔以及一出光孔,入光孔位於攝像單元的前方,其中攝像單元經由入光孔拍攝外界的景物,出光孔位於發光單元的前方,其中來自發光單元的光束經由出光孔傳遞至該外界。 The invention provides a camera module, which comprises an image capturing unit, a light emitting unit and a frame. The light emitting unit is adapted to emit a light beam, and the frame fixes the image capturing unit and the light emitting unit. The frame has a light entrance hole and a light exit hole, and the light entrance hole is located in front of the image capturing unit. The image capturing unit captures an external scene through the light entrance hole, and the light exit hole is located in front of the light emitting unit, wherein the light beam from the light emitting unit is transmitted through the light exit hole. To the outside world.

本發明提供一種電子裝置包括電路板、一處理單元以及一攝像模組。處理單元電性連接至電路板,攝像模組包括一攝像單元、一發光單元以及一框架。發光單元適於發出一光束,攝像單元及發光單元電性連接電路板,框架固定攝像單元及發光單元。框架包括一入光孔以及一出光孔,入光孔位於攝像單元的前方,其中攝像單元經由入光孔拍攝外界的景物,而出光孔位於發光單元的前方,來自發光單元的光束經由出光孔傳遞至外界。 The invention provides an electronic device comprising a circuit board, a processing unit and a camera module. The processing unit is electrically connected to the circuit board, and the camera module includes an image capturing unit, a light emitting unit, and a frame. The light emitting unit is adapted to emit a light beam, and the image capturing unit and the light emitting unit are electrically connected to the circuit board, and the frame fixes the image capturing unit and the light emitting unit. The frame includes a light entrance hole and a light exit hole. The light entrance hole is located in front of the image capturing unit. The image capturing unit captures an external scene through the light entrance hole, and the light exit hole is located in front of the light emitting unit, and the light beam from the light emitting unit is transmitted through the light exit hole. To the outside world.

在本發明的一實施例中,攝像模組更包括一反射單元,配置於出光孔的內壁上。 In an embodiment of the invention, the camera module further includes a reflecting unit disposed on the inner wall of the light exit hole.

在本發明的一實施例中,出光孔的孔徑自鄰近發光單元的一側往遠離發光單元的方向逐漸增加。 In an embodiment of the invention, the aperture of the light exit aperture gradually increases from a side of the adjacent light emitting unit to a direction away from the light emitting unit.

在本發明的一實施例中,反射單元為反射鍍膜或反射片。 In an embodiment of the invention, the reflective unit is a reflective coating or a reflective sheet.

在本發明的一實施例中,發光單元包括多個發光元件, 且出光孔位於這些發光元件前方。 In an embodiment of the invention, the light emitting unit includes a plurality of light emitting elements, And the light exit holes are located in front of the light emitting elements.

在本發明的一實施例中,攝像單元包括一透鏡組及一影像感測單元,來自外界的景物的光依序經由入光孔及透鏡組而傳遞至影像感測單元。 In an embodiment of the invention, the image capturing unit includes a lens group and an image sensing unit, and the light from the outside scene is sequentially transmitted to the image sensing unit via the light entrance hole and the lens group.

在本發明的一實施例中,發光單元包括一承載器以及一發光元件。發光元件配置於承載器上,框架直接接觸承載器及透鏡組。 In an embodiment of the invention, the light unit includes a carrier and a light emitting element. The light emitting element is disposed on the carrier, and the frame directly contacts the carrier and the lens group.

在本發明的一實施例中,攝像模組更包括一電路板,其中框架、發光單元及攝像單元配置於電路板上,其中發光單元及攝像單元電性連接電路板。 In an embodiment of the invention, the camera module further includes a circuit board, wherein the frame, the light emitting unit and the image capturing unit are disposed on the circuit board, wherein the light emitting unit and the image capturing unit are electrically connected to the circuit board.

在本發明的一實施例中,電路板為一主機板或一可撓式印刷電路板。 In an embodiment of the invention, the circuit board is a motherboard or a flexible printed circuit board.

在本發明的一實施例中,框架為一體成型框架,框架覆蓋發光單元的邊緣部分及攝像單元的邊緣部分,且暴露出發光單元的中央部分及攝像單元的中央部分。 In an embodiment of the invention, the frame is an integrally formed frame that covers an edge portion of the light emitting unit and an edge portion of the image pickup unit, and exposes a central portion of the light emitting unit and a central portion of the image pickup unit.

在本發明的一實施例中,電子裝置更包括一可撓式印刷電路板,其配置於框架下,發光單元及攝像單元透過可撓式印刷電路板電性連接電路板。 In an embodiment of the invention, the electronic device further includes a flexible printed circuit board disposed under the frame, and the light emitting unit and the image capturing unit are electrically connected to the circuit board through the flexible printed circuit board.

在本發明的一實施例中,電子裝置更包括一揚聲器、一麥克風以及一無線訊號收發模組。揚聲器、麥克風以及無線訊號收發模組電性連接至處理單元。 In an embodiment of the invention, the electronic device further includes a speaker, a microphone, and a wireless signal transceiving module. The speaker, the microphone, and the wireless signal transceiver module are electrically connected to the processing unit.

基於上述,本發明的實施例中攝像模組中的框架可以同 時固定發光單元及攝像單元,因此可以將發光單元與攝像單元整合在一起,藉以減少攝像模組的體積,同時也降低了組裝攝像模組所需的時間及成本。本發明的實施例中電子裝置藉由將發光單元及攝像單元合併且固定的攝像模組來提昇組裝時的精度並減少組裝所需的體積及時間。 Based on the above, the frame in the camera module in the embodiment of the present invention may be the same When the light-emitting unit and the camera unit are fixed, the light-emitting unit and the camera unit can be integrated to reduce the volume of the camera module, and the time and cost required for assembling the camera module are also reduced. In the embodiment of the present invention, the electronic device combines the illumination unit and the imaging unit and fixes the camera module to improve the accuracy during assembly and reduce the volume and time required for assembly.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

d1‧‧‧方向 D1‧‧‧ direction

I1I1、I2I2‧‧‧切面線 I 1 I 1 , I 2 I 2 ‧‧‧face line

L1、L2、L3‧‧‧光束 L 1 , L 2 , L 3 ‧‧‧ beams

100A、100B、100C、530‧‧‧攝像模組 100A, 100B, 100C, 530‧‧‧ camera module

110、532‧‧‧攝像單元 110, 532‧‧‧ camera unit

112‧‧‧透鏡組 112‧‧‧ lens group

112A、112B、112C‧‧‧透鏡 112A, 112B, 112C‧‧ lens

114‧‧‧影像感測單元 114‧‧‧Image sensing unit

120、220、534‧‧‧發光單元 120, 220, 534‧‧‧Lighting unit

122‧‧‧承載器 122‧‧‧Carrier

124、224A、224B、224C‧‧‧發光元件 124, 224A, 224B, 224C‧‧‧Lighting elements

130‧‧‧框架 130‧‧‧Frame

132‧‧‧入光孔 132‧‧‧Into the light hole

134‧‧‧出光孔 134‧‧‧Lighting hole

140‧‧‧反射單元 140‧‧‧Reflective unit

150、510‧‧‧電路板 150, 510‧‧‧ circuit board

152‧‧‧可撓式印刷電路板 152‧‧‧Flexible printed circuit boards

154‧‧‧連接端 154‧‧‧Connecting end

500‧‧‧電子裝置 500‧‧‧Electronic devices

520‧‧‧處理單元 520‧‧‧Processing unit

540‧‧‧揚聲器 540‧‧‧Speaker

550‧‧‧麥克風 550‧‧‧ microphone

560‧‧‧無線訊號收發模組 560‧‧‧Wireless Signal Transceiver Module

570‧‧‧使用者介面模組 570‧‧‧User interface module

580‧‧‧螢幕 580‧‧‧ screen

圖1A是本發明的一實施例中攝像模組的立體圖。 1A is a perspective view of a camera module in accordance with an embodiment of the present invention.

圖1B是根據圖1A中切面線I1I1的截面圖 Figure 1B is a cross-sectional view taken along line I 1 I 1 of Figure 1A

圖2A是本發明的第一實施例中攝像模組的立體圖。 2A is a perspective view of a camera module in the first embodiment of the present invention.

圖2B是根據圖2A中切面線I2I2的截面圖。 Figure 2B is a cross-sectional view taken along line I 2 I 2 of Figure 2A.

圖3是本發明的另一實施例中攝像模組的立體圖。 3 is a perspective view of a camera module in another embodiment of the present invention.

圖4是本發明的另一實施例中攝像模組的俯視圖。 4 is a top plan view of a camera module in another embodiment of the present invention.

圖5是本發明的另一實施例中電子裝置的方塊圖。 Figure 5 is a block diagram of an electronic device in another embodiment of the present invention.

圖1A是本發明的一實施例中攝像模組的立體圖,圖1B是根據圖1A中切面線I1I1的截面圖。請參照圖1A及圖1B,在本實施例中,攝像模組100A包括攝像單元110、發光單元120以及 框架130,其中框架130固定攝像單元110及發光單元120,且框架130包括入光孔132及出光孔134。請參照圖1B,在本實施例中,入光孔132位於攝像單元110的前方,而攝像單元110經由入光孔132來拍攝外界的景物。更詳細來說,例如光束L1是來自外界景物的光束,光束L1經由入光孔132進入攝像單元110,進而讓攝像單元110拍攝上述的外界之景物。再參照圖1B,在本實施例中,出光孔134位於發光單元120的前方,而發光單元120適於發出光束,其包括例如是光束L2,光束L2自發光單元120發出再經由出光孔134傳遞至外界。在本實施例中,藉由框架130將攝像單元110及發光單元120固定,使上述元件整合為一個攝像模組100A,而藉由這樣的設計,可以不用以分離的方式各自組裝攝像單元110及發光單元120,同時也減少了攝像單元110及發光單元120各自模組化所需的體積和成本。另一方面,框架130也同時使攝像單元110及發光單元120之間的距離固定,減少了攝像單元110和發光單元120之間相對位置、相對角度的自由度,因此在組裝時會具有較高的精確度。 1A is a perspective view of a camera module in accordance with an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line I 1 I 1 of FIG. 1A. Referring to FIG. 1A and FIG. 1B , in the embodiment, the camera module 100A includes an image capturing unit 110 , a light emitting unit 120 , and a frame 130 . The frame 130 fixes the image capturing unit 110 and the light emitting unit 120 , and the frame 130 includes the light receiving hole 132 . And the light exit hole 134. Referring to FIG. 1B , in the embodiment, the light entrance hole 132 is located in front of the image capturing unit 110 , and the image capturing unit 110 captures an external scene through the light entrance hole 132 . More specifically, for example, the light beam L 1 is a light beam from an external scene, and the light beam L 1 enters the image capturing unit 110 via the light entrance hole 132, thereby causing the image capturing unit 110 to capture the above-described external scenery. Referring again to FIG. 1B, in the present embodiment, the aperture 134 is located in front of the light emitting unit 120, and the light emitting unit 120 is adapted to emit a light beam, including, for example, a light beam L 2, L 2 from the light emitting unit beam 120 emitted again through the aperture 134 is passed to the outside world. In this embodiment, the camera unit 110 and the light-emitting unit 120 are fixed by the frame 130, so that the components are integrated into one camera module 100A. With such a design, the camera unit 110 can be assembled separately without being separated. The light-emitting unit 120 also reduces the volume and cost required for each of the imaging unit 110 and the light-emitting unit 120 to be modularized. On the other hand, the frame 130 also fixes the distance between the imaging unit 110 and the light-emitting unit 120 at the same time, which reduces the relative position and relative angle between the imaging unit 110 and the light-emitting unit 120, and thus has a high degree of assembly. The accuracy.

在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。 It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

圖2A是本發明的第一實施例中攝像模組的立體圖,圖2B是根據圖2A中切面線I2I2的截面圖。請參照圖2A及圖2B, 在本實施例中,攝像模組100B更包括一反射單元140,其配置在出光孔134的內壁上。在本實施例中,發光單元120發出的光束中,部份光束會被反射單元140反射。更詳細來說,請參照圖2B,在本實施例中,出光孔134的孔徑例如是自鄰近發光單元120的一側往遠離發光單元120的方向d1逐漸增加,因此反射單元140亦有相同的特性,而發光單元120發出的光束包括例如是光束L3,其被反射單元140反射後再穿出出光孔134,藉此來改變出光角度。簡單來說,本實施例的攝像模組100B藉由反射單元140的設計來集中發光單元120所發出的光束並控制光束的發散角。在本實施例中,反射單元140例如是反射鍍膜,但不限於此。在其他實施例中,反射單元140可以例如是反射片或任何其他適於反射的元件。另外,請參照圖2B,本實施例的出光孔134的內壁例如類似於一圓錐體的側面,但不限於此。在其他實施例中,出光孔可以例如是自鄰近發光單元的一側往遠離發光單元的方向逐漸增加的球面或其他彎曲表面。 2A is a perspective view of a camera module in a first embodiment of the present invention, and FIG. 2B is a cross-sectional view according to a line I 2 I 2 in FIG. 2A. Referring to FIG. 2A and FIG. 2B , in the embodiment, the camera module 100B further includes a reflection unit 140 disposed on the inner wall of the light exit hole 134 . In this embodiment, part of the light beam emitted by the light emitting unit 120 is reflected by the reflecting unit 140. In more detail, referring to FIG. 2B, in the embodiment, the aperture of the light-emitting aperture 134 is gradually increased from the side of the adjacent light-emitting unit 120 to the direction d1 away from the light-emitting unit 120, and thus the reflection unit 140 has the same The light beam emitted by the light emitting unit 120 includes, for example, a light beam L 3 which is reflected by the reflecting unit 140 and then exits the light exit hole 134, thereby changing the light exit angle. In brief, the camera module 100B of the present embodiment concentrates the light beam emitted by the light emitting unit 120 by the design of the reflecting unit 140 and controls the divergence angle of the light beam. In the present embodiment, the reflection unit 140 is, for example, a reflective plating film, but is not limited thereto. In other embodiments, the reflective unit 140 can be, for example, a reflective sheet or any other element suitable for reflection. In addition, referring to FIG. 2B, the inner wall of the light exit hole 134 of the present embodiment is similar to, for example, a side surface of a cone, but is not limited thereto. In other embodiments, the light exit aperture may be, for example, a spherical or other curved surface that gradually increases from one side of the adjacent light emitting unit to a direction away from the light emitting unit.

請參照圖2B,在本發明的第一實施例中,攝像單元110包括透鏡組112及影像感測單元114,其中透鏡組112由多個透鏡組成,在本實施例中以透鏡112A、透鏡112B、透鏡112C為例,而來自外界的景物的光依序經由入光孔132、透鏡組112而傳遞至影像感測單元114。具體來說,請參照圖2B,在本實施例中,例如光束L1是來自外界景物的光束,光束L1依序經由入光孔132、透鏡112A、透鏡112B、透鏡112C而傳遞至影像感測單元114, 進而讓攝像單元110拍攝上述的外界之景物。在本實施例中,影像感測單元114例如是電荷耦合元件(Charge-Coupled Device,CCD),但不限於此。在其他實施例中,影像感測單元114可以是其他感光元件。 Referring to FIG. 2B, in the first embodiment of the present invention, the imaging unit 110 includes a lens group 112 and an image sensing unit 114, wherein the lens group 112 is composed of a plurality of lenses, in the embodiment, a lens 112A and a lens 112B. The lens 112C is taken as an example, and the light from the outside scene is sequentially transmitted to the image sensing unit 114 via the light entrance hole 132 and the lens group 112. Specifically, referring to FIG 2B, in the present embodiment, the light beam L 1 is, for example, a light beam from the outside world scene, the light beam L 1 sequentially via the aperture 132, the lens 112A, lens 112B, and lens 112C is transmitted to the image sensor The measuring unit 114 further causes the imaging unit 110 to capture the above-mentioned scenery of the outside world. In the embodiment, the image sensing unit 114 is, for example, a Charge-Coupled Device (CCD), but is not limited thereto. In other embodiments, image sensing unit 114 can be other photosensitive elements.

詳細來說,請參照圖2B,本發明的第一實施例中發光單元120包括承載器122以及發光元件124,其中發光元件124配置在承載器122上,而框架130直接接觸承載器122以及透鏡組112。更具體來說,在本實施例中發光元件124例如是發光二極體(Light Emitting Diode,LED),而承載器122例如是發光二極體的承載基板,但不限於此。進一步來說,本實施例中框架130例如是一體成型框架,其覆蓋發光單元120的邊緣部分及攝像單元110的邊緣部分,且暴露出發光單元120的中央部分及攝像單元110的中央部分。再進一步來說,請參照圖2B,在本實施例中框架130與承載器122直接接觸,而暴露出發光元件124,同時也直接接觸並固定透鏡112A、透鏡112B、透鏡112C,並暴露出透鏡112A的中央部份。具體來說,在本實施例的框架130中,鄰近攝像單元110的部份框架130例如是類似於透鏡架(lens holder)的設計,但不限於此。在本發明的一實施例中,發光單元120例如是閃光燈。 In detail, referring to FIG. 2B, in the first embodiment of the present invention, the light emitting unit 120 includes a carrier 122 and a light emitting element 124, wherein the light emitting element 124 is disposed on the carrier 122, and the frame 130 directly contacts the carrier 122 and the lens. Group 112. More specifically, in the present embodiment, the light-emitting element 124 is, for example, a Light Emitting Diode (LED), and the carrier 122 is, for example, a carrier substrate of the light-emitting diode, but is not limited thereto. Further, the frame 130 in the present embodiment is, for example, an integrally formed frame that covers an edge portion of the light emitting unit 120 and an edge portion of the image capturing unit 110, and exposes a central portion of the light emitting unit 120 and a central portion of the image capturing unit 110. Further, referring to FIG. 2B, in the embodiment, the frame 130 is in direct contact with the carrier 122 to expose the light-emitting element 124, and also directly contacts and fixes the lens 112A, the lens 112B, the lens 112C, and exposes the lens. The central part of 112A. Specifically, in the frame 130 of the present embodiment, the partial frame 130 adjacent to the image pickup unit 110 is, for example, a design similar to a lens holder, but is not limited thereto. In an embodiment of the invention, the lighting unit 120 is, for example, a flash.

請參照圖2A及圖2B,在本發明的第一實施例中,攝像模組100B更包括電路板150,且框架130、發光單元120及攝像單元110均配置於電路板150上,而發光單元120及攝像單元110電性連接電路板150。詳細來說,如圖2B所繪示,在本實施例中, 發光元件124例如透過承載板122電性連接到電路板150,而攝像單元110中的影像感測單元114電性連接到電路板150。在本實施例中,電路板150例如是一主機板。更具體來說,電路板150例如是一行動電話的主機板,因此藉由例如是本實施例的框架130之設計,可以使攝像模組100B直接安裝到行動電話的主機板上,而不需要分開兩次安裝發光單元120及攝像單元110。同時,框架130也一併固定了發光單元120和攝像單元110的位置,且整合成單一模組的設計也免去了各自模組化所需的空間。也就是說,本發明的第一實施例所提供的攝像模組100B藉由將發光單元120與攝像單元110整合在一起,縮短了組裝時間、減少了組裝所需的空間,同時又一併提昇了組裝精度。 Referring to FIG. 2A and FIG. 2B, in the first embodiment of the present invention, the camera module 100B further includes a circuit board 150, and the frame 130, the light emitting unit 120, and the imaging unit 110 are all disposed on the circuit board 150, and the light emitting unit The camera unit 110 is electrically connected to the circuit board 150. In detail, as shown in FIG. 2B, in this embodiment, The light-emitting element 124 is electrically connected to the circuit board 150 through the carrier board 122 , and the image sensing unit 114 in the camera unit 110 is electrically connected to the circuit board 150 . In the present embodiment, the circuit board 150 is, for example, a motherboard. More specifically, the circuit board 150 is, for example, a motherboard of a mobile phone. Therefore, the camera module 100B can be directly mounted on the motherboard of the mobile phone by, for example, the design of the frame 130 of the embodiment. The light emitting unit 120 and the image capturing unit 110 are installed twice separately. At the same time, the frame 130 also fixes the positions of the light-emitting unit 120 and the image-capturing unit 110, and the design integrated into a single module also eliminates the space required for the respective modules. In other words, the camera module 100B provided by the first embodiment of the present invention integrates the light emitting unit 120 and the camera unit 110, thereby shortening the assembly time and reducing the space required for assembly, and simultaneously improving Assembly accuracy.

圖3是本發明的另一實施例中攝像模組的立體圖。請參考圖3,本實施例的攝像模組100C與圖2A的攝像模組100B相似,惟二者主要差異之處在於:本實施例的攝像模組100C的電路板為可撓式印刷電路板152。請參照圖3,本實施例中框架130、發光單元120及攝像單元110均配置於可撓式印刷電路板152上,而發光單元120及攝像單元110電性連接可撓式印刷電路板152,且可撓式印刷電路板152的一端配置有一連接端154,連接端154可直接電性連接到另一電路板例如是一主機板(未繪示)。因此,本實施例的攝像模組100C除了具有上述實施例的功效以外,由於單一模組設計後也可以簡化接線設計,因此更能縮短組裝時間。 3 is a perspective view of a camera module in another embodiment of the present invention. Referring to FIG. 3 , the camera module 100C of the present embodiment is similar to the camera module 100B of FIG. 2A , but the main difference between the two is that the circuit board of the camera module 100C of the embodiment is a flexible printed circuit board. 152. Referring to FIG. 3 , in the embodiment, the frame 130 , the light emitting unit 120 , and the image capturing unit 110 are disposed on the flexible printed circuit board 152 , and the light emitting unit 120 and the image capturing unit 110 are electrically connected to the flexible printed circuit board 152 . One end of the flexible printed circuit board 152 is provided with a connecting end 154. The connecting end 154 can be directly electrically connected to another circuit board, such as a motherboard (not shown). Therefore, in addition to the functions of the above embodiments, the camera module 100C of the present embodiment can simplify the wiring design because of the single module design, thereby shortening the assembly time.

圖4是本發明的另一實施例中攝像模組的俯視圖。請參 考圖4,本實施例的攝像模組100D與圖2A的攝像模組100B相似,惟二者主要差異之處在於:本實施例的發光單元220包括多個發光元件(此處以三個發光元件224A、224B、224C為例),而這些發光元件224A、224B、224C均由框架130與攝像模組(未繪示)整合並固定在一起,因此本實施例的攝像模組100D可以輕易的組裝到電路板150上(這邊僅繪示出局部電路板150)。 4 is a top plan view of a camera module in another embodiment of the present invention. Please refer to Referring to FIG. 4, the camera module 100D of the present embodiment is similar to the camera module 100B of FIG. 2A, but the main difference between the two is that the light-emitting unit 220 of the present embodiment includes a plurality of light-emitting elements (here, three light-emitting elements) 224A, 224B, and 224C are examples, and the light-emitting elements 224A, 224B, and 224C are integrated and fixed by the frame 130 and the camera module (not shown). Therefore, the camera module 100D of the embodiment can be easily assembled. On the circuit board 150 (only the partial circuit board 150 is shown here).

圖5是本發明的另一實施例中電子裝置的方塊圖。請參照圖5,在本實施例中,電子裝置500具有電路板510、處理單元520以及攝像模組530,處理單元520電性連接至電路板510。攝像模組530包括攝像單元532及發光單元534,其中攝像單元532及發光單元534電性連接電路板510。本實施例的攝像模組530之設計例如與上述第一實施例的攝像模組100B之設計相同,因此藉由框架的設計,攝像模組530藉由將發光單元534與攝像單元532整合在一起,縮短了組裝時間、減少了組裝所需的空間,同時又一併提昇了組裝精度。 Figure 5 is a block diagram of an electronic device in another embodiment of the present invention. Referring to FIG. 5 , in the embodiment, the electronic device 500 has a circuit board 510 , a processing unit 520 , and a camera module 530 . The processing unit 520 is electrically connected to the circuit board 510 . The camera module 530 includes an imaging unit 532 and a light-emitting unit 534. The imaging unit 532 and the light-emitting unit 534 are electrically connected to the circuit board 510. The design of the camera module 530 of the present embodiment is the same as that of the camera module 100B of the first embodiment. Therefore, the camera module 530 integrates the light-emitting unit 534 and the camera unit 532 by the design of the frame. The assembly time is shortened, the space required for assembly is reduced, and the assembly precision is further improved.

需說明的是,本實施例的攝像模組530並不限於與上述第一實施例中的攝像模組100B相同,攝像模組530的設計亦可以與上述實施例中的任一攝像模組的設計相同。在本發明的其他實施例中的電子裝置中的攝像模組例如可以與圖3所繪示的攝像模組100C具有相同的設計,其中電路板510則對應到攝像模組100C中可撓式印刷電路板152透過連接端154所欲連接到的另一電路板(未繪示)。簡單來說,本實施例的電子裝置500中攝像模組530 藉由上述框架設計,可以整合兩個以上不同功能的元件,進而簡化攝像模組530的組裝以及電子裝置500的組裝。 It should be noted that the camera module 530 of the present embodiment is not limited to the same as the camera module 100B in the first embodiment, and the design of the camera module 530 can also be combined with any of the camera modules in the above embodiments. The design is the same. The camera module in the electronic device of the other embodiments of the present invention may have the same design as the camera module 100C illustrated in FIG. 3 , wherein the circuit board 510 corresponds to the flexible printing in the camera module 100C. The circuit board 152 is connected to another circuit board (not shown) through which the connection terminal 154 is to be connected. In brief, the camera module 530 in the electronic device 500 of the embodiment With the above frame design, two or more components of different functions can be integrated, thereby simplifying assembly of the camera module 530 and assembly of the electronic device 500.

請參照圖5,在本實施例中的電子裝置500更包括揚聲器540、麥克風550、無線訊號收發模組560、使用者介面模組570以及螢幕580,其中揚聲器540、麥克風550、無線訊號收發模組560、使用者介面模組570以及螢幕580均電性連接到處理單元520。更具體來說,本實施例的電子裝置500例如是具有拍照功能的行動電話,但不限於此。在其他實施例中,電子裝置也可以是醫療偵查裝置、攝像系統或其他具有攝像功能的手持式裝置。 Referring to FIG. 5, the electronic device 500 in this embodiment further includes a speaker 540, a microphone 550, a wireless signal transceiver module 560, a user interface module 570, and a screen 580, wherein the speaker 540, the microphone 550, and the wireless signal transceiving module The group 560, the user interface module 570, and the screen 580 are all electrically connected to the processing unit 520. More specifically, the electronic device 500 of the present embodiment is, for example, a mobile phone having a photographing function, but is not limited thereto. In other embodiments, the electronic device may also be a medical detection device, a camera system, or other handheld device having an imaging function.

綜上所述,本發明的實施例之攝像模組藉由框架的設計可以使例如是發光單元和攝像單元等不同功能的元件整合在一起,而藉由此設計可以節省組裝攝像模組所需的時間及成本,同時也提昇組裝的精確度。本發明的實施例之電子裝置因為具有上述將不同功能的元件整合在一起的設計,也可以節省組裝所需的時間及成本,同時也提昇組裝的精確度並進而縮小組裝所需的體積。 In summary, the camera module of the embodiment of the present invention can integrate components of different functions, such as a light-emitting unit and a camera unit, by using a frame design, thereby saving the need for assembling the camera module. Time and cost, but also improve the accuracy of the assembly. The electronic device of the embodiment of the present invention can save the time and cost required for assembly because it has the above-mentioned design of integrating different functional components, and also improves the assembly precision and thus reduces the volume required for assembly.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

d1‧‧‧方向 D1‧‧‧ direction

L1、L3‧‧‧光束 L 1 , L 3 ‧‧‧ beams

100B‧‧‧攝像模組 100B‧‧‧ camera module

110‧‧‧攝像單元 110‧‧‧ camera unit

112‧‧‧透鏡組 112‧‧‧ lens group

112A、112B、112C‧‧‧透鏡 112A, 112B, 112C‧‧ lens

114‧‧‧影像感測單元 114‧‧‧Image sensing unit

120‧‧‧發光單元 120‧‧‧Lighting unit

122‧‧‧承載器 122‧‧‧Carrier

124‧‧‧發光元件 124‧‧‧Lighting elements

130‧‧‧框架 130‧‧‧Frame

132‧‧‧入光孔 132‧‧‧Into the light hole

134‧‧‧出光孔 134‧‧‧Lighting hole

140‧‧‧反射單元 140‧‧‧Reflective unit

150‧‧‧電路板 150‧‧‧ boards

Claims (16)

一種攝像模組,包括:一攝像單元;一發光單元,適於發出一光束;以及一框架,固定該攝像單元及該發光單元,該框架具有:一入光孔,位於該攝像單元的前方,其中該攝像單元經由該入光孔拍攝外界的景物;一出光孔,位於該發光單元的前方,其中來自該發光單元的該光束經由該出光孔傳遞至該外界;以及一反射單元,配置於該出光孔的內壁上,且該出光孔的孔徑自鄰近該發光單元的一側往遠離該發光單元的方向逐漸增加。 A camera module includes: a camera unit; an illumination unit adapted to emit a light beam; and a frame for fixing the camera unit and the illumination unit, the frame having: an optical aperture, located in front of the camera unit The image capturing unit is configured to capture an external scene through the light entrance hole; a light exiting hole is located in front of the light emitting unit, wherein the light beam from the light emitting unit is transmitted to the outside through the light emitting hole; and a reflecting unit is disposed in the The inner wall of the light exiting hole, and the aperture of the light exiting hole gradually increases from a side adjacent to the light emitting unit to a direction away from the light emitting unit. 如申請專利範圍第1項所述的攝像模組,其中該反射單元為反射鍍膜或反射片。 The camera module of claim 1, wherein the reflecting unit is a reflective coating or a reflective sheet. 如申請專利範圍第1項所述的攝像模組,其中該發光單元包括多個發光元件,且該出光孔位於該些發光元件前方。 The camera module of claim 1, wherein the light emitting unit comprises a plurality of light emitting elements, and the light exiting holes are located in front of the light emitting elements. 如申請專利範圍第1項所述的攝像模組,其中該攝像單元包括一透鏡組及一影像感測單元,來自該外界的該景物的光依序經由該入光孔及該透鏡組而傳遞至該影像感測單元。 The camera module of claim 1, wherein the camera unit comprises a lens group and an image sensing unit, and the light from the outside scene is sequentially transmitted through the light entrance hole and the lens group. To the image sensing unit. 如申請專利範圍第4項所述的攝像模組,其中該發光單元包括:一承載器;以及 一發光元件,配置於該承載器上,其中該框架直接接觸該承載器及該透鏡組。 The camera module of claim 4, wherein the light emitting unit comprises: a carrier; A light-emitting element is disposed on the carrier, wherein the frame directly contacts the carrier and the lens group. 如申請專利範圍第1項所述的攝像模組,更包括一電路板,其中該框架、該發光單元及該攝像單元配置於該電路板上,其中該發光單元及該攝像單元電性連接該電路板。 The camera module of claim 1, further comprising a circuit board, wherein the frame, the light emitting unit and the image capturing unit are disposed on the circuit board, wherein the light emitting unit and the image capturing unit are electrically connected to the Circuit board. 如申請專利範圍第6項所述的攝像模組,其中該電路板為一主機板或一可撓式印刷電路板。 The camera module of claim 6, wherein the circuit board is a motherboard or a flexible printed circuit board. 如申請專利範圍第1項所述的攝像模組,其中該框架為一體成型框架,該框架覆蓋該發光單元的邊緣部分及該攝像單元的邊緣部分,且暴露出該發光單元的中央部分及該攝像單元的中央部分。 The camera module of claim 1, wherein the frame is an integrally formed frame that covers an edge portion of the light emitting unit and an edge portion of the image capturing unit, and exposes a central portion of the light emitting unit and the The central part of the camera unit. 一種電子裝置,包括:一電路板;一處理單元,電性連接至該電路板;以及一攝像模組,包括:一攝像單元;一發光單元,適於發出一光束,其中該攝像單元及該發光單元電性連接該電路板;以及一框架,固定該攝像單元及該發光單元,該框架包括:一入光孔,位於該攝像單元的前方,其中該攝像單元經由該入光孔拍攝外界的景物;一出光孔,位於該發光單元的前方,其中來自該發 光單元的該光束經由該出光孔傳遞至該外界;以及一反射單元,配置於該出光孔的內壁上,該出光孔的孔徑自鄰近該發光單元的一側往遠離該發光單元的方向逐漸增加。 An electronic device comprising: a circuit board; a processing unit electrically connected to the circuit board; and a camera module comprising: an imaging unit; an illumination unit adapted to emit a light beam, wherein the camera unit and the The light-emitting unit is electrically connected to the circuit board; and a frame is fixed to the image-capturing unit and the light-emitting unit. The frame includes: a light-injecting hole located in front of the image capturing unit, wherein the image capturing unit photographs the outside through the light-incident hole a light hole located in front of the light unit, wherein the light is from the The light beam of the light unit is transmitted to the outside through the light exit hole; and a reflective unit is disposed on the inner wall of the light exit hole, and the aperture of the light exit hole gradually changes from a side adjacent to the light emitting unit to a direction away from the light emitting unit. increase. 如申請專利範圍第9項所述的電子裝置,其中該反射單元為反射鍍膜或反射片。 The electronic device of claim 9, wherein the reflecting unit is a reflective coating or a reflective sheet. 如申請專利範圍第9項所述的電子裝置,其中該發光單元包括多個發光元件,且該出光孔位於該些發光元件前方。 The electronic device of claim 9, wherein the light emitting unit comprises a plurality of light emitting elements, and the light exiting holes are located in front of the light emitting elements. 如申請專利範圍第9項所述的電子裝置,其中該攝像單元包括一透鏡組及一影像感測單元,來自該外界的該景物的光依序經由該入光孔及該透鏡組而傳遞至該影像感測單元。 The electronic device of claim 9, wherein the camera unit comprises a lens group and an image sensing unit, and the light from the outside is sequentially transmitted to the object through the light entrance hole and the lens group. The image sensing unit. 如申請專利範圍第12項所述的電子裝置,其中該發光單元包括:一承載器;以及一發光元件,配置於該承載器上,其中該框架直接接觸該承載器及該透鏡組。 The electronic device of claim 12, wherein the light emitting unit comprises: a carrier; and a light emitting element disposed on the carrier, wherein the frame directly contacts the carrier and the lens group. 如申請專利範圍第9項所述的電子裝置,更包括一可撓式印刷電路板,配置於該框架下,其中該發光單元及該攝像單元透過該可撓式印刷電路板電性連接該電路板。 The electronic device of claim 9, further comprising a flexible printed circuit board disposed under the frame, wherein the light emitting unit and the image capturing unit are electrically connected to the circuit through the flexible printed circuit board board. 如申請專利範圍第9項所述的電子裝置,其中該框架為一體成型框架,該框架覆蓋該發光單元的邊緣部分及該攝像單元的邊緣部分,且暴露出該發光單元的中央部分及該攝像單元的中 央部分。 The electronic device of claim 9, wherein the frame is an integrally formed frame, the frame covers an edge portion of the light emitting unit and an edge portion of the image capturing unit, and exposes a central portion of the light emitting unit and the camera In the middle of the unit Central part. 如申請專利範圍第9項所述的電子裝置,更包括:一揚聲器,電性連接至該處理單元;一麥克風,電性連接至該處理單元;以及一無線訊號收發模組,電性連接至該處理單元。 The electronic device of claim 9, further comprising: a speaker electrically connected to the processing unit; a microphone electrically connected to the processing unit; and a wireless signal transceiver module electrically connected to The processing unit.
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Citations (4)

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TW567714B (en) * 2001-07-09 2003-12-21 Nippon Sheet Glass Co Ltd Light-emitting unit and illumination device and image reading device using light-emitting unit
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CN103257427A (en) * 2012-02-16 2013-08-21 奥林巴斯映像株式会社 Photographic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW567714B (en) * 2001-07-09 2003-12-21 Nippon Sheet Glass Co Ltd Light-emitting unit and illumination device and image reading device using light-emitting unit
TW201109828A (en) * 2009-09-04 2011-03-16 Fih Hong Kong Ltd Viewing window and portable electronic device using the same
CN203071220U (en) * 2012-01-04 2013-07-17 苹果公司 An electronic device and an antenna
CN103257427A (en) * 2012-02-16 2013-08-21 奥林巴斯映像株式会社 Photographic device

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