TWI547315B - 光觸媒基材之製作方法及製作機台 - Google Patents
光觸媒基材之製作方法及製作機台 Download PDFInfo
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- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
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- B01J37/0215—Coating
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- B01J21/00—Catalysts comprising the elements, oxides, or hydroxides of magnesium, boron, aluminium, carbon, silicon, titanium, zirconium, or hafnium
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- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
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Description
本發明有關於一種奈米顆粒溶膠噴鍍技術,且特別是有關於一種光觸媒基材之製作方法及製作機台。
光觸媒是經過光的照射,可以促進化學反應的物質。目前可用來作為光觸媒的物質有二氧化鈦及硫化鎘,其中二氧化鈦因為具有較佳的氧化還原能力,高化學穩定度及無毒的特性,常被使用來做為光觸媒的物質。光觸媒擅長於處理空氣中極低濃度的有害化學物質,且本身不會釋出有害物質,因此是極優異的環境淨化用觸媒。光觸媒可以產生消臭、殺菌、抗菌、防汚和除去有害物質等功能。
二氧化鈦的結晶構造有正方晶系的高溫金紅石(rutile)型、低溫銳鈦礦(anatase)型及屬於斜方晶系的板鈦礦(brookite)型三種。其中只有銳鈦礦結構具光觸媒的效果。光催化處理程序之光分解機制是藉由紫外光或太陽光激發光觸媒,使光觸媒產生電子以及電洞,藉以氧化表面吸附之物質,進而將表面吸附之物質裂化為小分子。以二氧化鈦為例,二氧化鈦反應從照388nm之光波長開始反應(因為二氧化鈦之能階差約為3.2eV,而388nm之光波長大約可提供3.2eV之能量),二氧化鈦吸收光能量產生電子(e-)及電洞(h+),此電洞具有相當強之氧化力,可以直接將吸附在物質表面之汚染物分子直接氧化使其分解,或者將吸附於物質表面之水分子
氧化為氫氧自由基。原本大分子之汚染物,經由光觸媒照光反應將大分子裂解為小分子,達到汚染物清除之目的。
雖然光觸媒已廣泛的應用於各樣產品,但目前仍沒有可有效率且以較低的成本製作光觸媒基材(特別是紙材)之方法及相關機台。業界需要一可製作光觸媒基材之方法及自動化裝置,進行光觸媒基材的量產。
本發明實施例提供之光觸媒基材之製作方法和製作機台,可更有效益的量產光觸媒基材。
本發明一實施例提供一種光觸媒基材之製作方法,包括:提供一基材;將基材放置於一傳送裝置上,傳送該基材;當基材傳送至一噴塗裝置下,以噴塗裝置於基材之一表面形成一光觸媒層;以及當基材傳送至一加熱裝置下,以加熱裝置使基材之表面上的光觸媒層固化。
本發明一實施例提供一種光觸媒基材之製作機台,包括:一傳送裝置;一噴塗裝置,設置於傳送裝置上方;以及一加熱裝置,設置於傳送裝置上方,且與噴塗裝置相隔一距離。
本發明的有益效果在於,以相對較低成本和相對較快的速度製作光觸媒基材,更有效益的製作光觸媒基材,達到大量生產的目的。
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。
S10‧‧‧步驟
S20‧‧‧步驟
S30‧‧‧步驟
S40‧‧‧步驟
200‧‧‧基材
202‧‧‧滾筒
204‧‧‧傳送裝置
206‧‧‧帶狀體
208‧‧‧噴塗裝置
210‧‧‧感應裝置
212‧‧‧加熱裝置
圖1顯示本發明一實施例光觸媒基材之製作方法的方塊圖。
圖2顯示本發明一實施例光觸媒基材之製作機台的示意圖。
圖3顯示本發明一實施例製作之光觸媒基材進行X光繞射光譜分析圖。
圖4顯示本發明一範例製作之光觸媒基材光催化降解乙醛的測試曲線圖。
圖5顯示本發明另一範例製作之光觸媒基材光催化降解乙醛的測試曲線圖。
以下是藉由特定的具體實例來說明本發明所揭露有關“光觸媒基材之製作方法”的實施方式,以下的實施方式將進一步詳細說明本發明的相關技術內容,但所揭示的內容並非用以限制本發明的技術範疇。
〔第一實施例〕
請參閱圖1和圖2所示,圖1為本實施例光觸媒基材之製作方法的方塊圖,圖2為本實施例光觸媒基材之製作機台的示意圖。以下搭配圖1和圖2一併說明之,首先,進行步驟S10,選擇一基材200,在本實施例以下的說明中是以紙材作為說明範例,但本發明不限於此,基材200可以為其他材料組成,例如基材200另可以為布、塑膠、木材或金屬。後續,將基材200放置於一傳送裝置204上,經由傳送裝置204傳送基材200。雖然在此的描述中為了簡化說明僅描述一個基材200,但在實際進行量產時,會依序將數個基材放置在傳送裝置上,基材的數量依實際的需要決定,本發明不特別限定進行量產之基材的數量。
接下來,進行步驟S20,製備一光觸媒溶膠,將二氧化鈦、氧化鋅、二氧化錫或上述之混合物與溶劑混合,製備光觸媒溶膠。在本實施例中,溶劑為水。光觸媒溶膠中光觸媒的含量可以為0.01wt%~50wt%,較佳為1wt%~10wt%。值得注意的是,本發明不限定於上述材料,可以其他的光觸媒材料與溶劑混合,且溶劑也不限定為水。在本實施例中,光觸媒材料較佳為二氧化鈦,且二氧化鈦較佳為銳鈦礦型態。更詳細來說,本實施例採用化學共沈澱-解膠法來製備二氧化鈦溶膠,使用烷氧化鈦及四氯化鈦為前驅
物原料,經過水解縮合程序,將其轉換為氫氧化鈦,之後以酸進行解膠。後續在60℃~100℃間以回流程序進行結晶步驟,製備出具銳鈦礦晶相的二氧化鈦溶膠。但本發明不限定此法所備製光觸媒水性溶膠,其餘光觸媒水性溶膠液亦可使用於本噴塗裝置。需要時,可加入排風系統。
接著進行步驟S30,將製備好的光觸媒溶膠輸送至一噴塗裝置208,當基材200傳送至噴塗裝置208下,以噴塗裝置208於基材200之一表面噴塗一光觸媒層。如圖2所示,傳送裝置204和噴塗裝置208配置為一邊進行傳送基材200,並同時塗佈基材200。噴塗裝置208可以為一自動噴槍,且本發明另可設置一感應裝置210,鄰近噴塗裝置208,使得當感應裝置210偵測到基材200傳送至噴塗裝置208下,經由一控制裝置(未繪示),啟動噴塗裝置208,對基材200進行噴塗步驟。在本實施例中,噴塗步驟的參數可如下:噴塗的壓力為1.0bar~2.5bar,噴塗量為50ml/min~100ml/min,然而,噴塗步驟的參數可隨著製程的需要或產品的規格改變,例如當基材更換為塑膠時,噴塗步驟的參數需一併作調整,或者,當基材仍為紙材,但尺寸增加,也需要改變噴塗參數。本發明不特別限定於特定的噴塗步驟的參數。
此外,本發明也可改良傳送裝置204的動線,並增加一翻轉裝置,使得基材200可進行翻面,對基材200尚未進行噴塗之表面上進行噴塗。另外,本發明不限定於對基材的同一表面噴塗一次,可依產品的規格或製程的需求噴塗數次,例如2-10次。
另外,本發明可調整控制裝置對於傳送裝置204的控制,使得傳送裝置204在傳送基材200時,當基材200傳送至噴塗裝置204下時,傳送裝置204停止傳送一段時間,待噴塗裝置208完成噴塗作業後,再傳送基材200。
後續,繼續傳送基材200,當基材200傳送至一加熱裝置212下,進行步驟S40,以加熱裝置212使基材200表面上的光觸媒層
乾燥固化。加熱裝置212可以包括一風扇和一加熱器,使加熱裝置212可發出熱風,乾燥固化光觸媒層。加熱裝置212不限定於上述,在其他的實施例中,加熱裝置可以為其他種類,例如,包括但不限定於:電熱絲、電熱管、燈泡或高頻加熱設備。加熱步驟的溫度可以為20℃~100℃,時間可以為1分鐘~50分鐘,加熱步驟的溫度可以較佳為30℃~65℃,時間較佳為2分鐘~15分鐘。此外,本實施例加熱裝置212另可以為隧道式烘箱,其中隧道式烘箱的長度可以為約250公分,而傳送速度可以為15~35公分/分鐘,溫度範圍可以為25℃~85℃。
根據上述,在固化光觸媒層後完成本實施例完成本實施例光觸媒基材之製作。
將完成之光觸媒基材以X光繞射光譜儀進行分析,圖3顯示2θ與相對密度的關係圖,請參照圖3,光觸媒的粒徑小於20nm。在本發明一實施例中,光觸媒的粒徑介於3nm至1μm之間。光觸媒的粒徑較佳介於10nm至30nm之間。
以下根據圖4和圖5說明本實施例製作之光觸媒基材光催化降解乙醛的測試結果。如圖4所示,當紙片上二氧化鈦的量為138mg之低光觸媒載量紙材時,在180分鐘打開紫外燈,可明顯的觀察到在180分鐘之後,乙醛快速被降解,且在約450分鐘之後,乙醛的量低於20ppm。如圖5所示,當紙片上二氧化鈦的量為430mg之高光觸媒載量紙材時,在160分鐘打開紫外燈,可明顯的觀察到在160分鐘之後,乙醛更快速得被降解,且在約200分鐘之後,乙醛的量低於20ppm。
根據上述測試結果,以本發明實施例製作之光觸媒基材的確可達到清除環境中汚染物的效果。
以下根據圖2描述本發明實施例光觸媒基材之製作機台。如圖2所示,此機台包括一傳送裝置204。傳送裝置204可包括數個滾筒202,其外包覆以一帶狀體206,藉由電能驅動滾筒202的滾
動,進而帶動帶狀體206的捲動,使得帶狀體206上的物件可進行傳送。一噴塗裝置208設置於傳送裝置204上方。噴塗裝置208可以為一自動噴槍,其可經由一管線(未繪示)與裝有光觸媒溶膠之儲存裝置(未繪示)連接。一加熱裝置212設置於傳送裝置204上方,且與噴塗裝置208相隔一距離。加熱裝置212可包括電熱絲、電熱管、燈泡或高頻加熱設備,也可包括一風扇,以增加熱的傳遞。加熱裝置212可為隧道式烘箱。
一控制裝置(未繪示)經由數個訊號線分別連接傳送裝置204、噴塗裝置208和加熱裝置212。藉由控制裝置可控制自動噴槍每次噴射的量,噴射的範圍及/或噴射的速率。此外,控制裝置亦可控制加熱裝置212的加熱溫度、時間及/或升溫和降溫的速率。又另外,控制裝置可以控制傳送裝置204的傳送速度,且更甚者可使得傳送裝置204在其上基材200在使用噴塗裝置進行噴塗及/或使用加熱裝置加熱步驟時,傳送裝置204停止運作一段時間。
一感應裝置210鄰近於噴塗裝置208設置,且經由一訊號線連接控制裝置。感應裝置210的作用為當偵測到基材200,可傳遞一訊號至控制裝置,使得控制裝置啟動噴塗裝置208,對基材200進行噴塗光觸媒溶膠的步驟。在一實施例中,感應裝置210可裝設在噴塗裝置208的側邊,或者與噴塗裝置208相隔一固定距離,並計算一時間差,使得在此時間差後,噴塗裝置208啟動噴塗作動。在本實施例中,感應裝置210為一光感測器,但本發明不限於此,感應裝置210可以為其他感測的設備。
〔實施例的可能功效〕
綜上所述,本發明的有益效果可以在於,本發明實施例揭示一種光觸媒基材之製作方法及相關製作機台此方法不僅製作成本低,且可以相對較快的速度製作光觸媒基材,更有效益的製作光觸媒基材,達到大量生產的目的。
以上所述僅為本發明的較佳可行實施例,非因此侷限本發明
的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。
200‧‧‧基材
202‧‧‧滾筒
204‧‧‧傳送裝置
206‧‧‧帶狀體
208‧‧‧噴塗裝置
210‧‧‧感應裝置
212‧‧‧加熱裝置
Claims (12)
- 一種光觸媒基材之製作方法,包括:提供一基材,其中該基材為紙材;將該基材放置於一傳送裝置上,傳送該基材,該傳送裝置包括數個滾筒,該些滾筒外包覆一帶狀體;當該基材傳送至一噴塗裝置下,以該噴塗裝置於該基材之一表面形成一光觸媒層;以及當該基材傳送至一加熱裝置下,以該加熱裝置使該基材之該表面上的光觸媒層固化,其中該傳送裝置和該噴塗裝置配置為一邊進行傳送該基材,並同時塗佈該基材。
- 如請求項1之光觸媒基材之製作方法,其中以該噴塗裝置於該基材之表面形成光觸媒層之步驟包括:製備一水性光觸媒溶膠;以及將該水性光觸媒溶膠以該噴塗裝置噴塗於該基材之表面。
- 如請求項2之光觸媒基材之製作方法,其中該水性光觸媒溶膠包括二氧化鈦、氧化鋅、二氧化錫或上述之混合物。
- 如請求項2之光觸媒基材之製作方法,其中該水性光觸媒溶膠中光觸媒的含量為0.01wt%~50wt%。
- 如請求項2之光觸媒基材之製作方法,其中該水性光觸媒溶膠之溶劑為水。
- 如請求項2之光觸媒基材之製作方法,其中該水性光觸媒溶膠中光觸媒的粒徑為3nm~1μm。
- 一種光觸媒基材之製作機台,包括:一傳送裝置,其中該傳送裝置包括數個滾筒,該些滾筒外包覆一帶狀體;一噴塗裝置,設置於該傳送裝置上方;以及一加熱裝置,設置於該傳送裝置上方,且與該噴塗裝置相隔一 距離,其中該傳送裝置和該噴塗裝置配置為一邊進行傳送該基材,並同時塗佈該基材。
- 如請求項7之光觸媒基材之製作機台,其中該噴塗裝置為一自動噴槍。
- 如請求項7之光觸媒基材之製作機台,更包括一感應裝置,鄰近該噴塗裝置。
- 如請求項7之光觸媒基材之製作機台,其中該加熱裝置為隧道式烘箱。
- 如請求項7之光觸媒基材之製作機台,更包括一裝有光觸媒溶膠之儲存裝置經由一管線連接該噴塗裝置。
- 如請求項7之光觸媒基材之製作機台,更包括一控制裝置,經由數條訊號線,分別連接該噴塗裝置和該加熱裝置。
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TW201002641A (en) * | 2008-04-10 | 2010-01-16 | Corning Inc | Protective coating for glass manufacturing and processing into articles |
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TW201002641A (en) * | 2008-04-10 | 2010-01-16 | Corning Inc | Protective coating for glass manufacturing and processing into articles |
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