TWI541132B - Bonding apparatus and manufacturing method for bonding substrates - Google Patents

Description

貼合裝置以及貼合基板的製造方法 Bonding device and manufacturing method of bonded substrate

本發明是有關於例如為了將構成顯示裝置的工件(workpiece)予以貼合，將黏接劑供給至工件的技術進行改良所得的貼合裝置以及貼合基板的製造方法。 The present invention relates to a bonding apparatus and a method of manufacturing a bonded substrate, for example, in order to bond a workpiece constituting a display device and attaching an adhesive to a workpiece.

一般而言，對液晶模組(module)、操作用的觸控面板(touch panel)、以及保護表面的保護面板(覆蓋面板(cover panel))等進行積層，藉此來構成液晶顯示器(display)。上述液晶模組、觸控面板、以及保護面板等(以下稱為工件)裝入至液晶顯示器的框體。 In general, a liquid crystal display (module), a touch panel for operation, and a protective panel (cover panel) for protecting a surface are laminated to form a liquid crystal display (display). . The liquid crystal module, the touch panel, the protective panel, and the like (hereinafter referred to as a workpiece) are loaded into the casing of the liquid crystal display.

為了將上述工件予以貼合，已有使用黏接片(sheet)的方法與使用樹脂黏接劑的方法。黏接片與黏接劑相比較，價格較高，且需要剝離紙的剝離等的程序。因此，根據近年來的削減成本的要求等，使用黏接劑來進行的貼合則成為主流。 In order to attach the above-mentioned workpiece, there have been a method of using a sheet and a method of using a resin binder. The adhesive sheet is expensive compared to the adhesive, and a procedure such as peeling of the release paper is required. Therefore, according to the demand for cost reduction in recent years, the bonding using an adhesive agent has become the mainstream.

又，若空氣層進入至積層的各工件之間，則液晶的顯示面的視認性會因外光反射而下降。為了應付上述情形，當將各工件予以貼合時，藉由黏接劑來將各工件之間(間隙(gap))予以填埋，藉此，形成黏接層。 Further, when the air layer enters between the respective workpieces of the laminate, the visibility of the display surface of the liquid crystal is lowered by the external light reflection. In order to cope with the above, when the workpieces are bonded together, the gaps between the workpieces (gap) are filled by an adhesive, thereby forming an adhesive layer.

上述黏接層作為各工件之間的間隔件(spacer)，具有保護工件的功能。又，由於液晶顯示器的大型化等，工件的面積亦變大，且容易產生變形。因此，為了將變形予以吸收而保護工件，黏接層所需的厚度存在增加的傾向。例 如需要數百微米(μm)的厚度。 The adhesive layer serves as a spacer between the workpieces and has a function of protecting the workpiece. Moreover, the size of the workpiece is also increased due to the increase in size of the liquid crystal display, and the deformation is likely to occur. Therefore, in order to protect the workpiece by absorbing the deformation, the thickness required for the adhesive layer tends to increase. example If a thickness of several hundred micrometers (μm) is required.

若確保上述厚度，則必需的黏接劑的量會增加。如此，供給至工件的黏接劑會流動，從而容易自工件溢出。為了應付此情形，存在如下的密封(seal)方式，此密封(seal)方式是預先藉由高黏度的樹脂(resin)、假硬化樹脂等，於對塗佈區域進行規定的外周形成密封件(參照專利文獻1)。 If the above thickness is ensured, the amount of the necessary adhesive will increase. Thus, the adhesive supplied to the workpiece flows, so that it is easy to overflow from the workpiece. In order to cope with this, there is a seal method in which a seal is formed in advance on a predetermined outer circumference of a coating region by a resin having a high viscosity, a pseudo-hardening resin or the like. Refer to Patent Document 1).

呈框狀地將樹脂的黏接劑塗佈至工件，使黏接劑假硬化，藉此來形成密封件，將樹脂的黏接劑填充至內側，將工件予以貼合。對於上述密封方式而言，由於在外周存在密封件，因此，可防止由貼合時的黏接劑的流動引起的溢出。 The resin adhesive is applied to the workpiece in a frame shape, and the adhesive is pseudo-hardened to form a seal, and the resin adhesive is filled inside to bond the workpiece. In the sealing method described above, since the seal is present on the outer circumference, it is possible to prevent the overflow due to the flow of the adhesive at the time of bonding.

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2010-66711號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-66711

然而，在上述密封方式所形成的密封件、與填充至內部的黏接劑之間，有可能會殘留有邊界。例如，對於液晶顯示器等的顯示裝置而言，若先硬化的密封件、與內部的黏接劑的邊界進入至使用者(user)的視野範圍內，則有礙於畫面的視認性。然而，根據畫面的大型化的要求、與構件本身的小型化的要求，難以於工件的視野範圍外，充分地確保用於密封件的空間。 However, there is a possibility that a boundary remains between the seal formed by the above sealing method and the adhesive filled into the inside. For example, in a display device such as a liquid crystal display, if the boundary between the first hardened seal and the internal adhesive enters the field of view of the user, the visibility of the screen is hindered. However, depending on the requirements for the enlargement of the screen and the miniaturization of the member itself, it is difficult to sufficiently secure the space for the seal outside the field of view of the workpiece.

又，例如若過分地促進密封件的黏接劑的硬化，則黏接劑會失去緩衝性或黏著性。如此，當進行貼合時，存在 如下的可能性，即，上下的工件不匹配，貼合厚度的均一性受損。 Further, for example, if the curing of the adhesive of the sealing member is excessively promoted, the adhesive may lose cushioning properties or adhesion. So when there is a fit, there is There is a possibility that the upper and lower workpieces do not match and the uniformity of the thickness of the fit is impaired.

本發明是為了解決如上所述的先前技術的問題點而提出，本發明的目的在於提供一種貼合裝置以及貼合基板的製造方法，可防止黏接劑的流動，從而確保均一的貼合厚度。 The present invention has been made to solve the problems of the prior art as described above, and an object of the present invention is to provide a bonding apparatus and a method of manufacturing a bonded substrate, which can prevent the flow of the adhesive, thereby ensuring a uniform bonding thickness. .

為了實現上述目的，本發明是一種貼合裝置，此貼合裝置經由因電磁波的照射而硬化的黏接劑，將構成顯示裝置的一對工件予以貼合，上述貼合裝置的特徵在於包括：供給部，以遍及僅其中一個工件的整個單面的方式，供給上述黏接劑；照射部，於進行貼合之前，在大氣中，對遍及上述其中一個工件的整個單面的黏接劑的全部照射電磁波，藉此，使上述黏接劑假硬化；貼合部，經由假硬化狀態的上述黏接劑將上述其中一個工件與另一個工件貼合；放置部，將在上述貼合部所貼合且上述黏接劑為假硬化狀態的上述一對工件放置於大氣中；以及硬化部，對放置於上述大氣中的上述一對工件照射電磁波，來使上述黏接劑真硬化。 In order to achieve the above object, the present invention is a bonding apparatus which bonds a pair of workpieces constituting a display device via an adhesive which is hardened by irradiation of electromagnetic waves, and the bonding apparatus is characterized by comprising: The supply unit supplies the adhesive to the entire single surface of only one of the workpieces; and the illuminating unit applies the adhesive to the entire single surface of the one of the workpieces in the atmosphere before bonding. All of the electromagnetic waves are irradiated, whereby the adhesive is pseudo-hardened; and the bonding portion is bonded to the other workpiece via the adhesive in a pseudo-hardened state; the placing portion is placed in the bonding portion The pair of workpieces in which the adhesive is in a pseudo-hardened state are placed in the atmosphere, and the hardened portion irradiates the pair of workpieces placed in the atmosphere with electromagnetic waves to cause the adhesive to be hardened.

其他形態的特徵在於：上述照射部包括照射出紫外線的照射裝置。 In another aspect, the irradiation unit includes an irradiation device that emits ultraviolet rays.

於如上所述的發明中，在大氣中，對遍及工件的整個單面的黏接劑照射電磁波，因此，黏接劑因氧抑制等而假硬化。因此，貼合之前的黏接劑的流動受到抑制，可防止 塗佈形狀走樣，或可防止上述黏接劑朝工件外溢出。由於藉由假硬化而維持著緩衝性，因此，當藉由貼合部來進行貼合時，可確保均一的貼合厚度。又，由於在黏接劑中不存在邊界，因此，顯示裝置中的視野範圍的視認性不會受損。而且，無需在裝備用於密封件的單元之後，分別準備且供給用以製成密封件的黏接劑與內部填充用的黏接劑，因此，可縮短製程時間(tact time)，亦可節約成本。此外，在放置部中，藉由在放置部中將工件放置於大氣中，可使工件變得穩定，並且可消滅殘留於黏接劑中的氣泡。 In the above-described invention, in the atmosphere, electromagnetic waves are applied to the entire one-sided adhesive agent of the workpiece, and therefore, the adhesive is pseudo-hardened by oxygen suppression or the like. Therefore, the flow of the adhesive before the bonding is suppressed and can be prevented The coating shape is aliased, or the above-mentioned adhesive can be prevented from overflowing outside the workpiece. Since the cushioning property is maintained by the pseudo hardening, when the bonding is performed by the bonding portion, a uniform bonding thickness can be ensured. Moreover, since there is no boundary in the adhesive, the visibility of the field of view in the display device is not impaired. Moreover, it is not necessary to separately prepare and supply the adhesive for forming the sealing member and the adhesive for internal filling after the unit for the sealing member is provided, thereby shortening the tact time and saving cost. Further, in the placement portion, by placing the workpiece in the atmosphere in the placement portion, the workpiece can be stabilized, and bubbles remaining in the adhesive can be eliminated.

其他形態的特徵在於：上述貼合部包括真空室，此真空室能夠對貼合時的一對工件的周圍進行抽真空。 In another aspect, the bonding portion includes a vacuum chamber capable of evacuating a circumference of a pair of workpieces at the time of bonding.

於如上所述的形態中，當在真空中進行貼合時，由於黏接劑已假硬化，因此，可使逸出氣體(outgas)的產生減少。因此，可使抽真空的時間縮短。 In the above-described form, when the bonding is performed in a vacuum, since the adhesive is pseudo-hardened, the generation of the outgas can be reduced. Therefore, the time for vacuuming can be shortened.

再者，亦可掌握上述各形態作為貼合基板的製造方法的發明。 Furthermore, it is also possible to grasp the above-described respective aspects as an invention of a method of manufacturing a bonded substrate.

以上，如說明所述，根據本發明，可提供一種貼合裝置以及貼合基板的製造方法，其可防止由黏接劑的流動引起的溢出，從而確保均一的貼合厚度。 As described above, according to the present invention, it is possible to provide a bonding apparatus and a method of manufacturing a bonded substrate which can prevent overflow due to the flow of the adhesive, thereby ensuring a uniform bonding thickness.

參照圖式，具體地對本發明的實施的形態(以下稱為實施形態)進行說明。 The embodiment (hereinafter referred to as an embodiment) of the present invention will be specifically described with reference to the drawings.

[A.構成] [A. Composition]

首先，對本實施形態的貼合裝置(以下稱為主裝置)的構成進行說明。如圖1(A)~圖1(D)、圖2(A)、以及圖2(B)所示，主裝置包括：黏接劑供給部1、貼合部2等。作為貼合對象的工件S1是設計為可藉由搬送部3而於上述黏接劑供給部1及貼合部2之間移動。 First, the configuration of the bonding apparatus (hereinafter referred to as a main apparatus) of the present embodiment will be described. As shown in FIGS. 1(A) to 1(D), 2(A), and 2(B), the main device includes an adhesive supply unit 1, a bonding unit 2, and the like. The workpiece S1 to be bonded is designed to be movable between the adhesive supply unit 1 and the bonding unit 2 by the conveying unit 3.

作為本實施形態中所使用的黏接劑，例如可考慮使用紫外線(Ultraviolet，UV)硬化樹脂。如圖1(A)~圖1(D)所示，黏接劑供給部1包括：供給部10、照射部11等。供給部10例如包括分配器(dispenser)，此分配器使收容於儲槽(tank)T的黏接劑R經由配管而滴下至工件S1。分配器例如可藉由掃描裝置(未圖示)而移動。 As the adhesive used in the present embodiment, for example, an ultraviolet (UV) hardening resin can be considered. As shown in FIGS. 1(A) to 1(D), the adhesive supply unit 1 includes a supply unit 10, an irradiation unit 11, and the like. The supply unit 10 includes, for example, a dispenser that drops the adhesive R accommodated in the tank T to the workpiece S1 via a pipe. The dispenser can be moved, for example, by a scanning device (not shown).

照射部11例如包括照射裝置，此照射裝置將來自UV光源的UV光照射至黏接劑R的整個面。再者，上述照射部11於大氣中進行照射，以利用氧抑制(oxygen inhibition)等來使黏接劑R的硬化達到假硬化(廣泛地包含殘留有半硬化等的未硬化部分的狀態)。亦可將照射部11的照射強度設為假硬化用的弱照射強度。 The illuminating unit 11 includes, for example, an illuminating device that irradiates UV light from a UV light source to the entire surface of the adhesive R. In addition, the irradiation unit 11 is irradiated in the atmosphere to cause the curing of the adhesive R to be pseudo-hardened by oxygen inhibition or the like (a state in which an unhardened portion such as semi-hardening remains) is widely included. The irradiation intensity of the irradiation unit 11 can also be set as the weak irradiation intensity for the pseudo hardening.

如圖2(A)、圖2(B)所示，貼合部2包括貼合裝置20，此貼合裝置20將工件S2貼合於工件S1的黏接劑R。例如，貼合裝置20包括真空腔室(chamber)21、按壓裝置22等。 As shown in FIGS. 2(A) and 2(B), the bonding unit 2 includes a bonding apparatus 20 that bonds the workpiece S2 to the bonding agent R of the workpiece S1. For example, the bonding device 20 includes a vacuum chamber 21, a pressing device 22, and the like.

真空腔室21為藉由將被貼合的工件S1、S2的周圍予以覆蓋，且將與搬送部3之間的部分予以密閉，而構成真空室的腔室。作為真空源(減壓裝置)的減壓泵(pump) (未圖示)經由配管而連接於真空腔室21。又，真空腔室21是設置為可藉由未圖示的升降機構而升降。 The vacuum chamber 21 is a chamber in which a vacuum chamber is formed by covering the periphery of the workpieces S1 and S2 to be bonded and sealing the portion between the portions to be transported. a vacuum pump (pump) as a vacuum source (pressure reducing device) (not shown) is connected to the vacuum chamber 21 via a pipe. Moreover, the vacuum chamber 21 is provided so as to be movable up and down by a lifting mechanism (not shown).

按壓裝置22為藉由對工件S2進行按壓而將工件S2貼合於工件S1的裝置。例如，此按壓裝置22包含保持著工件S2的保持部、使保持部升降的升降機構等。 The pressing device 22 is a device that bonds the workpiece S2 to the workpiece S1 by pressing the workpiece S2. For example, the pressing device 22 includes a holding portion that holds the workpiece S2, a lifting mechanism that raises and lowers the holding portion, and the like.

搬送部3包括搬送裝置30，此搬送裝置30將工件S1自黏接劑供給部1搬送至貼合部2。作為搬送裝置30，例如可考慮：轉盤(turntable)、輸送帶(conveyor)等及其驅動機構。然而，只要是能夠於上述各部分之間搬送工件S1的裝置，則亦可為任何裝置。上述搬送裝置30是以載置於載置部31的狀態來搬送工件S1。 The conveyance unit 3 includes a conveyance device 30 that conveys the workpiece S1 from the adhesive supply unit 1 to the bonding unit 2 . As the conveying device 30, for example, a turntable, a conveyor, and the like, and a drive mechanism thereof can be considered. However, any device may be used as long as it can transport the workpiece S1 between the respective portions. The conveyance device 30 conveys the workpiece S1 in a state of being placed on the placing unit 31.

再者，如下所述，搬送部3具有如下的功能，即，將黏接劑R已假硬化之後的工件S1、S2搬送至下一個程序(例如硬化部等)。於相關的搬送區間中，搬送部3作為放置部而發揮功能，此放置部將工件S1、S2放置於大氣中。 Further, as described below, the conveying unit 3 has a function of transporting the workpieces S1 and S2 after the adhesive R has been pseudo-hardened to the next program (for example, a curing portion or the like). In the related transport section, the transport unit 3 functions as a placement unit that places the workpieces S1 and S2 in the atmosphere.

[B.作用] [B. Function]

參照圖1(A)~圖1(D)至圖4(A)、圖4(B)，對具有如上所述的構成的本實施形態的作用進行說明。 The operation of this embodiment having the above configuration will be described with reference to Figs. 1(A) to 1(D) to 4(A) and 4(B).

首先，如圖1(A)~圖1(D)所示，搬送裝置30是自前一個程序，將載置於載置部31的工件S1搬送至黏接劑供給部1。於黏接劑供給部1中，如圖1(A)及圖1(B)所示，供給部10將黏接劑R供給至工件S1的整個面(整個單面)。 First, as shown in FIGS. 1(A) to 1(D), the transport device 30 transports the workpiece S1 placed on the mounting portion 31 to the adhesive supply unit 1 from the previous program. In the adhesive supply unit 1, as shown in FIGS. 1(A) and 1(B), the supply unit 10 supplies the adhesive R to the entire surface (the entire surface) of the workpiece S1.

例如，自分配器的噴嘴(nozzle)滴下黏接劑R至工 件S1。利用掃描裝置來使上述分配器進行掃描，藉此，以遍及工件S1的整個面的方式，逐步供給黏接劑R。再者，如下所述，亦可將黏接劑R供給至工件S1的一部分之後，使黏接劑R擴散至整個工件S1。 For example, dropping the adhesive R from the nozzle of the dispenser to the work Piece S1. The dispenser is scanned by a scanning device, whereby the adhesive R is gradually supplied over the entire surface of the workpiece S1. Further, as described below, after the adhesive R is supplied to a part of the workpiece S1, the adhesive R may be diffused to the entire workpiece S1.

接著，如圖1(C)所示，藉由照射部11來將UV光照射至黏接劑R的整個面。於大氣中照射UV光，或者以上述方式來對此UV光的照射強度進行設定。因此，如圖1(D)、圖3(A)所示，藉由氧抑制等而獲得適度的假硬化狀態。 Next, as shown in FIG. 1(C), UV light is applied to the entire surface of the adhesive R by the irradiation portion 11. The UV light is irradiated in the atmosphere, or the irradiation intensity of the UV light is set as described above. Therefore, as shown in FIG. 1(D) and FIG. 3(A), a moderate pseudo-hardening state is obtained by oxygen suppression or the like.

然後，搬送裝置30將供給有黏接劑R的工件S1搬送至貼合部2。於貼合部2中，如圖2(A)所示，將工件S2保持於按壓裝置22的真空腔室21並下降，而工件S1、S2的周圍密閉。接著，藉由減壓泵進行作動，開始對真空腔室21內進行減壓(排氣)。 Then, the conveying device 30 conveys the workpiece S1 to which the adhesive R is supplied to the bonding unit 2. In the bonding unit 2, as shown in FIG. 2(A), the workpiece S2 is held by the vacuum chamber 21 of the pressing device 22 and lowered, and the periphery of the workpieces S1 and S2 is sealed. Next, the operation of the pressure reducing pump starts to depressurize (exhaust) the inside of the vacuum chamber 21.

完成抽真空之後，將按壓裝置22下降，藉此，將工件S2擠壓於工件S1(圖2(B))。此時，黏接劑R處於假硬化的狀態，因此，由擠壓引起的流動及溢出受到抑制。另一方面，由於處於假硬化狀態，而維持黏接劑R的緩衝性。因此，貼合時的應變等被吸收，從而可實現貼合厚度的均一性。而且，於假硬化的狀態下，由於氧抑制等，表面不會進一步硬化，而維持著表面的黏著性，因此，對於工件S2的黏接性無問題。 After the evacuation is completed, the pressing device 22 is lowered, whereby the workpiece S2 is pressed against the workpiece S1 (Fig. 2(B)). At this time, the adhesive R is in a state of pseudo-hardening, and therefore, the flow and overflow caused by the pressing are suppressed. On the other hand, since it is in a pseudo-hardened state, the cushioning property of the adhesive R is maintained. Therefore, the strain or the like at the time of bonding is absorbed, so that the uniformity of the thickness of the bonding can be achieved. Further, in the state of the pseudo-hardening, the surface is not further hardened by oxygen suppression or the like, and the adhesion of the surface is maintained. Therefore, there is no problem in the adhesion to the workpiece S2.

然後，藉由排氣路徑的開放等來破壞真空，真空腔室21上升，藉此，已貼合的工件S1、S2處於大氣中。而且， 搬送裝置30將工件S1、S2自貼合部2搬出至下一程序。例如，搬送裝置30使工件S1、S2移動至硬化部，此硬化部藉由電磁波的照射來使黏接劑R真硬化。 Then, the vacuum is broken by the opening of the exhaust path or the like, and the vacuum chamber 21 is raised, whereby the bonded workpieces S1 and S2 are in the atmosphere. and, The conveying device 30 carries the workpieces S1 and S2 from the bonding unit 2 to the next program. For example, the conveying device 30 moves the workpieces S1 and S2 to the curing portion, and the curing portion is caused to be hardened by the electromagnetic wave.

如此，在藉由搬送裝置30來使工件S1、S2移動至硬化部的過程中，將工件S1、S2放置於大氣中(除了支持著工件S1的構件以外，不發生接觸)。用以將工件S1、S2放置於大氣中的放置時間設為如下的時間，即，足以利用大氣壓來對工件S2進行按壓而使工件S2變得穩定，並且足以使殘留於黏接劑R的氣泡減少的時間。此時，由於黏接劑R處於假硬化狀態，因此，可防止由流出引起的溢出。 As described above, in the process of moving the workpieces S1 and S2 to the hardened portion by the transport device 30, the workpieces S1 and S2 are placed in the atmosphere (no contact is made except for the member supporting the workpiece S1). The standing time for placing the workpieces S1, S2 in the atmosphere is set to a time sufficient to press the workpiece S2 with atmospheric pressure to stabilize the workpiece S2 and to sufficiently trap the bubbles remaining in the adhesive R Reduced time. At this time, since the adhesive R is in a pseudo-hardened state, overflow due to the outflow can be prevented.

[C.效果] [C. Effect]

根據如上所述的本實施形態，可獲得如下所述的效果。亦即，由於使黏接劑R的整個面假硬化，因此，貼合之前的黏接劑R的流動受到抑制，可防止塗佈形狀走樣，或可防止上述黏接劑R朝工件外溢出。又，黏接劑R因假硬化而維持著緩衝性，因此，貼合時的應變等被吸收，可形成均一的黏接層。當進行貼合時，由於黏接劑R的表面亦維持著黏著性，因此，黏接性無問題。 According to the embodiment described above, the following effects can be obtained. That is, since the entire surface of the adhesive R is pseudo-hardened, the flow of the adhesive R before the bonding is suppressed, the coating shape can be prevented from being aliased, or the above-described adhesive R can be prevented from overflowing outside the workpiece. Further, since the adhesive R maintains the cushioning property due to the pseudo-hardening, the strain or the like at the time of bonding is absorbed, and a uniform adhesive layer can be formed. When the bonding is performed, since the surface of the adhesive R is also maintained in adhesion, the adhesion is not problematic.

將相同的黏接劑R供給至整個面之後，對整個面進行UV照射而使上述黏接劑R假硬化，因此，例如，如圖4(A)所示，邊界不會殘留於使用者的視野範圍W內，不會對畫面的視認性產生影響。尤其當將工件S1、S2中的任一個工件設為顯示裝置的保護面板時，由於不包括避免黏接劑R的附著的零件或區域等，因此，適合於利用供給 至廣泛的區域(例如整個面)的黏接劑來進行貼合。 After the same adhesive R is supplied to the entire surface, the entire surface is subjected to UV irradiation to cause the adhesive R to be pseudo-hardened. Therefore, for example, as shown in FIG. 4(A), the boundary does not remain in the user. Within the field of view W, there is no influence on the visibility of the screen. In particular, when any one of the workpieces S1 and S2 is used as a protective panel of the display device, it is suitable for use of the supply because it does not include a part or region that avoids adhesion of the adhesive R. Adhesives are applied to a wide range of areas (for example, the entire surface).

又，為了使黏接劑R遍及整個面，若利用黏度比較低的黏接劑R，則流動性佳，且可均一且大面積地進行塗佈。然而，另一方面，若直至貼合、硬化為止耗費時間，則上述黏接劑R容易自工件S1溢出。因此，對自塗佈至貼合為止的時間控制、對貼合時的按壓力的控制等將變得困難。另一方面，於本實施形態中，使黏接劑R遍及整個面之後，使黏接劑R假硬化，因此，可回避上述時間控制、按壓力控制的困難性。 Further, in order to spread the adhesive R over the entire surface, if the adhesive R having a relatively low viscosity is used, the fluidity is good, and the coating can be performed uniformly and over a large area. On the other hand, however, it takes time for the adhesive R to overflow from the workpiece S1 until it takes time to bond and harden. Therefore, it is difficult to control the time from application to bonding, control of the pressing force at the time of bonding, and the like. On the other hand, in the present embodiment, since the adhesive R is pseudo-hardened after the entire surface of the adhesive R is applied, the difficulty in controlling the time and pressure can be avoided.

又，無需在裝備用於密封件的單元之後，分別準備且供給用以製成密封件的黏接劑與內部填充用的黏接劑，因此，可縮短製程時間，亦可節約成本。而且，在假硬化之後且在真硬化之前，將工件S1、S2放置於大氣中，因此，利用大氣壓來對工件S1、S2進行按壓而使工件S1、S2變得穩定，並且減少殘留於黏接劑R的氣泡。 Further, it is not necessary to separately prepare and supply the adhesive for forming the seal and the adhesive for internal filling after the unit for the seal is provided, so that the process time can be shortened and the cost can be saved. Further, after the pseudo hardening and before the true hardening, the workpieces S1 and S2 are placed in the atmosphere, and therefore, the workpieces S1 and S2 are pressed by the atmospheric pressure to stabilize the workpieces S1 and S2, and the residual residue is reduced. Bubble of agent R.

此外，例如，一般當進行真空貼合時，存在如下的情形，即，由於未硬化的黏接劑R所產生的逸出氣體而導致抽真空的速度下降。然而，於本實施形態中，由於使黏接劑R假硬化，因此，可抑制逸出氣體的產生，從而可防止抽真空的速度下降。 Further, for example, generally, when vacuum bonding is performed, there is a case where the speed of evacuation is lowered due to the escape gas generated by the uncured adhesive R. However, in the present embodiment, since the adhesive R is pseudo-hardened, generation of the escape gas can be suppressed, and the speed of evacuation can be prevented from being lowered.

[D.其他實施形態] [D. Other embodiments]

本發明並不限定於如上所述的實施形態。例如，如圖5(A)、圖5(B)所示，亦可在將黏接劑R塗佈至工件S1的整個面之後，以僅使邊緣露出的方式，藉由光罩 (mask)M(遮蔽部)來將上方予以覆蓋，自配置於上方的電磁波的照射裝置，在大氣中，將電磁波照射至整個工件S1。藉此，如圖3(B)所示，僅於邊緣形成假硬化部H，從而可獲得與上述相同的效果。 The present invention is not limited to the embodiments described above. For example, as shown in FIG. 5(A) and FIG. 5(B), after the adhesive R is applied to the entire surface of the workpiece S1, the mask may be exposed only by exposing the edge. (mask) M (shielding portion) covers the upper portion, and the electromagnetic wave irradiation device disposed above is irradiated with electromagnetic waves to the entire workpiece S1 in the atmosphere. Thereby, as shown in FIG. 3(B), the pseudo hardened portion H is formed only at the edge, and the same effects as described above can be obtained.

又，如圖6所示，亦可將照射部11構成如下：此照射部將電磁波照射至比較狹窄的區域(無論是否聚光)，且照射部11可藉由掃描裝置而移動。若如上述構成，則如圖3(B)所示，可以僅於外緣形成假硬化部H的方式，一面藉由掃描裝置來使照射部11進行掃描，一面照射出電磁波。 Further, as shown in FIG. 6, the illuminating unit 11 may be configured such that the illuminating unit irradiates electromagnetic waves to a relatively narrow region (whether or not condensed light), and the illuminating unit 11 can be moved by the scanning device. According to the above configuration, as shown in FIG. 3(B), the electromagnetic wave can be radiated while the irradiation unit 11 is scanned by the scanning device so that only the outer edge forms the pseudo hardened portion H.

即便於上述情形時，亦是使遍及整個面的相同的黏接劑R的一部分假硬化，因此，邊界幾乎不會殘留於使用者的視野範圍W內，而不會對畫面的視認性產生影響。再者，藉由電磁波的照射而形成假硬化部H的區域可藉由遮蔽部、或者點狀或細線狀的照射而設為非常狹窄的範圍。藉此，藉由使假硬化部H與未硬化部的邊界處於圖4(A)、圖4(B)所示的視野範圍W之外，可更確實地防止對於視認性的影響。 That is, in the case of the above, even if a part of the same adhesive R is hardened over the entire surface, the boundary hardly remains in the user's field of view W, and the visibility of the screen is not affected. . Further, the region in which the pseudo-hardened portion H is formed by the irradiation of electromagnetic waves can be set to a very narrow range by the shielding portion or the dot-shaped or thin-line irradiation. Thereby, by making the boundary between the pseudo hardened portion H and the uncured portion outside the visual field range W shown in FIGS. 4(A) and 4(B), the influence on the visibility can be more reliably prevented.

而且，藉由電磁波的照射而假硬化的部位並不限於黏接劑的外緣。亦可使塗佈至整個面的黏接劑假硬化為方形、圓形、橢圓形、其他多邊形、以及曲線圓形等特定的形狀，或離散地使上述黏接劑假硬化。假硬化的區域不一定必須構成封閉的區域。亦可為直線狀、彎摺線狀、以及曲線狀。 Further, the portion which is pseudo-hardened by the irradiation of electromagnetic waves is not limited to the outer edge of the adhesive. The adhesive applied to the entire surface may also be pseudo-hardened into a specific shape such as a square, a circle, an ellipse, other polygons, and a curved circle, or may be discretely hardened by the above-mentioned adhesive. The area of false hardening does not necessarily have to form a closed area. It can also be linear, curved, and curved.

又，對於黏接劑的供給部的構成、供給方法而言，只要能夠以遍及工件的整個單面的方式進行塗佈即可。再者，於本發明中，所謂黏接劑「遍及」工件的「整個」面，不一定必須使黏接劑完全到達面的邊緣。即便存在黏接劑稍微未到達邊緣的部分，亦可稱為黏接劑遍及上述工件的整個面。例如，即便當如圖4(A)的工件S2側般，黏接劑R稍微未到達面的邊緣時，亦包含於「遍及整體」這一概念中。亦即，例如，即便供給至工件S1的黏接劑R的端部，處於如圖4(A)的工件S2的邊緣與黏接劑R的端部的關係之類的狀態，亦可稱為「遍及整體」。 Moreover, the configuration and supply method of the supply portion of the adhesive may be applied so as to extend over the entire single surface of the workpiece. Further, in the present invention, the "overall" surface of the workpiece "over the workpiece" does not necessarily have to completely reach the edge of the surface of the adhesive. Even if there is a portion where the adhesive does not slightly reach the edge, it may be referred to as an adhesive throughout the entire surface of the workpiece. For example, even when the adhesive R does not slightly reach the edge of the surface as in the side of the workpiece S2 of Fig. 4(A), it is included in the concept of "overall". That is, for example, even if the end portion of the adhesive R supplied to the workpiece S1 is in a state such as the relationship between the edge of the workpiece S2 and the end portion of the adhesive R as shown in FIG. 4(A), it may be called "All over the whole."

當使供給部進行掃描而呈線狀地進行塗佈時，自由地以任何方式進行移動，例如上下地移動、前後左右地移動、旋轉地移動。如圖7所示，供給部10亦可呈多條線狀地塗佈黏接劑R。於此情形，亦可使多個獨立的分配器相連。 When the supply unit is scanned and applied in a line shape, it is freely moved in any manner, for example, moving up and down, moving forward and backward, and moving rotationally. As shown in FIG. 7, the supply part 10 may apply the adhesive agent R in a plurality of lines. In this case, a plurality of independent dispensers can also be connected.

如圖8所示，供給部10亦可呈面狀地塗佈黏接劑R，藉此，能夠在短時間內均一地進行塗佈。此外，可應用藉由輥(roller)來進行塗佈的裝置、藉由刮刀(squeegee)來進行塗佈的裝置、以及進行旋轉(spin)塗佈的裝置等各種裝置。亦可重複多次地將黏接劑塗佈至整個面。於此情形時，可在每次塗佈中進行假硬化，亦可在多次塗佈中進行假硬化。 As shown in FIG. 8, the supply part 10 can apply the adhesive agent R in planar form, and can apply uniformly in a short time. Further, various devices such as a device for coating by a roller, a device for coating by a squeegee, and a device for performing spin coating can be applied. The adhesive can also be applied to the entire surface repeatedly. In this case, the pseudo hardening may be performed in each coating, or the pseudo hardening may be performed in the multiple coating.

使用的黏接劑的種類並不限定於紫外線硬化樹脂。亦可應用其他因電磁波而硬化的樹脂。於此情形時，便根據黏接劑的種類來改變應用的照射部。 The type of the adhesive to be used is not limited to the ultraviolet curable resin. Other resins that are hardened by electromagnetic waves can also be applied. In this case, the applied illuminating portion is changed depending on the type of the adhesive.

又，關於貼合部、搬送部，亦可應用目前或將來能夠利用的所有的方法、裝置。例如，關於貼合部，保持著工件的構造例如亦可為機械夾盤(mechanical chuck)、靜電夾盤、真空夾盤、以及黏著夾盤等的任何構造。進行真空貼合的空間可為由下側的構件升降而進行密閉、開放的構造，亦可為僅使工件的通路開閉的構造。而且，不一定採用真空貼合裝置，亦可採用在大氣中進行貼合的裝置。 Further, all the methods and devices that can be utilized currently or in the future can be applied to the bonding unit and the transport unit. For example, regarding the bonding portion, the configuration in which the workpiece is held may be, for example, any configuration of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and an adhesive chuck. The space in which the vacuum bonding is performed may be a structure in which the lower member is lifted and lowered to be closed and opened, or a structure in which only the passage of the workpiece is opened and closed. Further, a vacuum bonding device is not necessarily used, and a device for bonding in the atmosphere may be used.

又，於上述實施形態中，與黏接劑供給部成一體地構成照射部。然而，亦可與貼合部成一體地構成照射部。例如，如圖9(A)~圖9(C)所示，亦可於藉由貼合裝置20來進行貼合之前，由照射部11進行對於整個面的照射(圖9(A))、移動照射(圖9(B))、以及利用光罩的局部照射(圖9(C))等。於照射之後，照射部11回退，藉由貼合裝置20來進行貼合。貼合之後的真硬化可於相同的照射部11中進行，亦可於其他部位進行。 Further, in the above embodiment, the irradiation portion is integrally formed with the adhesive supply portion. However, the illuminating unit may be configured integrally with the bonding portion. For example, as shown in FIGS. 9(A) to 9(C), the entire surface may be irradiated by the irradiation unit 11 before being bonded by the bonding apparatus 20 (FIG. 9(A)). Moving illumination (Fig. 9(B)), and partial illumination using a mask (Fig. 9(C)). After the irradiation, the irradiation unit 11 is retracted and bonded by the bonding device 20. The true hardening after bonding can be performed in the same irradiation part 11, and can also be performed in other parts.

而且，不一定必須與黏接劑供給部、貼合部一體地構成照射部。亦可將照射部(假硬化部)設置於黏接劑供給部的後方，於照射部中，藉由電磁波的照射，使由搬送部自黏接劑供給部搬送而來的工件假硬化。 Further, it is not always necessary to integrally configure the irradiation portion with the adhesive supply portion and the bonding portion. The irradiation portion (false curing portion) may be provided behind the adhesive supply portion, and the workpiece conveyed from the adhesive supply portion by the conveying portion may be pseudo-cured by the electromagnetic wave irradiation in the irradiation portion.

例如，如圖10(A)所示，亦可將黏接劑供給部1與假硬化部4設置於搬送裝置30的不同的位置(position)，上述假硬化部4進行用於假硬化的照射。又，如圖10(B)所示，亦可將假硬化部4a及真硬化部4b設置於與黏接劑供給部1、貼合部2不同的位置。而且，如圖10(C)所 示，亦可將在大氣壓下放置的放置部5設置於貼合部2與真硬化部4b之間。再者，如下所述，圖10(A)~圖10(C)為例示，且搬送裝置30並不限於轉盤。 For example, as shown in FIG. 10(A), the adhesive supply unit 1 and the dummy hardened portion 4 may be provided at different positions of the transport device 30, and the pseudo hardened portion 4 may be irradiated for pseudo hardening. . Further, as shown in FIG. 10(B), the pseudo-hardened portion 4a and the true hardened portion 4b may be provided at positions different from the adhesive supply portion 1 and the bonding portion 2. Moreover, as shown in Figure 10(C) It is also possible to provide the placing portion 5 placed under atmospheric pressure between the bonding portion 2 and the true hardened portion 4b. Further, as described below, FIGS. 10(A) to 10(C) are exemplified, and the conveying device 30 is not limited to the turntable.

搬送裝置例如亦可為轉盤、輸送帶、進給機構等的任何構造。載置部例如可考慮採用基座(susceptor)等，但只要作為可對工件進行支持的支持體而發揮功能，則亦可為任何材質、形狀。並不限於在水平方向上進行支持。工件的搬送方法亦並不限定於載置於載置部的情形。亦可直接載置於移動台上。 The conveying device may be, for example, any structure such as a turntable, a conveyor belt, a feeding mechanism, or the like. For example, a susceptor or the like may be used as the mounting portion. However, any material or shape may be used as long as it functions as a support that can support the workpiece. It is not limited to support in the horizontal direction. The method of transferring the workpiece is not limited to the case of being placed on the placing portion. It can also be placed directly on the mobile station.

此外，亦可考慮如下的方法，即，手動地進行上述作業中的一部分。例如，亦可由作業者使用用於塗佈、滴下等的用具來供給黏接劑。亦可由作業者利用手動作業來使工件移動。 Further, a method of manually performing a part of the above operation may be considered. For example, an adhesive for applying, dripping, or the like may be used by an operator to supply an adhesive. Manual work can also be used by the operator to move the workpiece.

又，作為貼合對象的工件只要是如保護面板與液晶模組般構成顯示裝置，且將黏接劑塗佈於整個單面來進行貼合的工件，則不論其大小、形狀、及材質等如何。如圖4(B)所示，工件S1與工件S2的大小亦可不同。不僅可適用於將黏接劑供給至一個工件的情形，而且亦可適用於將黏接劑供給至兩個工件的情形。於此情形下，當將黏接劑供給至兩個工件時，可僅使一個工件的黏接劑假硬化，亦可使兩個工件的黏接劑均假硬化。 In addition, as long as the workpiece to be bonded is a display device such as a protective panel and a liquid crystal module, and the adhesive is applied to the entire surface to bond the workpiece, regardless of the size, shape, material, etc. how is it. As shown in FIG. 4(B), the sizes of the workpiece S1 and the workpiece S2 may be different. It can be applied not only to the case where the adhesive is supplied to one workpiece but also to the case where the adhesive is supplied to two workpieces. In this case, when the adhesive is supplied to the two workpieces, only the adhesive of one workpiece may be pseudo-hardened, and the adhesive of both workpieces may be pseudo-hardened.

1‧‧‧黏接劑供給部 1‧‧‧Adhesive Supply Department

2‧‧‧貼合部 2‧‧‧Fitting Department

3‧‧‧搬送部 3‧‧‧Transportation Department

4、4a、H‧‧‧假硬化部 4, 4a, H‧‧ ‧ false hardening department

4b‧‧‧真硬化部 4b‧‧‧ Real Hardening Department

5‧‧‧放置部 5‧‧‧Placement Department

10‧‧‧供給部 10‧‧‧Supply Department

11‧‧‧照射部 11‧‧‧ Department of Irradiation

20‧‧‧貼合裝置 20‧‧‧Fitting device

21‧‧‧真空腔室 21‧‧‧vacuum chamber

22‧‧‧按壓裝置 22‧‧‧ Pressing device

30‧‧‧搬送裝置 30‧‧‧Transporting device

31‧‧‧載置部 31‧‧‧Loading Department

M‧‧‧光罩 M‧‧‧Photo Mask

R‧‧‧黏接劑 R‧‧‧Adhesive

S1、S2‧‧‧工件 S1, S2‧‧‧ workpiece

T‧‧‧儲槽 T‧‧‧ storage tank

W‧‧‧視野範圍 W‧‧ Scope of view

圖1(A)是表示本發明的一個實施形態中的黏接劑供給開始時的說明圖，圖1(B)是表示黏接劑供給結束時的 說明圖，圖1(C)是表示UV照射時的說明圖，圖1(D)是表示黏接劑假硬化時的說明圖。 Fig. 1(A) is an explanatory view showing the start of supply of the adhesive in the embodiment of the present invention, and Fig. 1(B) is a view showing the end of the supply of the adhesive. 1(C) is an explanatory view showing a state of UV irradiation, and FIG. 1(D) is an explanatory view showing a state in which the adhesive is pseudo-cured.

圖2(A)及圖2(B)是表示圖1(A)~圖1(D)的實施形態中的貼合部的說明圖，圖2(A)表示抽真空時，圖2(B)表示貼合時。 2(A) and 2(B) are explanatory views showing a bonding portion in the embodiment of Figs. 1(A) to 1(D), and Fig. 2(A) shows a vacuuming operation, Fig. 2 (B) ) indicates when fitting.

圖3(A)是表示黏接劑的整個面已假硬化的工件的平面圖，圖3(B)是表示外緣已假硬化的工件的平面圖。 Fig. 3(A) is a plan view showing a workpiece which has been pseudo-hardened over the entire surface of the adhesive, and Fig. 3(B) is a plan view showing the workpiece whose outer edge has been pseudo-hardened.

圖4(A)及圖4(B)是表示圖1(A)~圖1(D)的實施形態中的黏接劑與視野範圍的關係的圖，圖4(A)表示大小相同的一對工件的剖面圖，圖4(B)表示大小不同的一對工件的剖面圖。 4(A) and 4(B) are diagrams showing the relationship between the adhesive and the field of view in the embodiment of Figs. 1(A) to 1(D), and Fig. 4(A) shows the same size. Fig. 4(B) shows a cross-sectional view of a pair of workpieces having different sizes.

圖5(A)是表示利用光罩的硬化處理的一例的平面圖，圖5(B)是表示該硬化處理的一例的剖面圖。 FIG. 5(A) is a plan view showing an example of curing treatment by a photomask, and FIG. 5(B) is a cross-sectional view showing an example of the curing treatment.

圖6是表示設為一面使照射部移動，一面進行照射的形態的一例的說明圖。 FIG. 6 is an explanatory view showing an example of a form in which the irradiation unit is moved while moving the irradiation unit.

圖7是表示利用分配器來將黏接劑塗佈至整個面的一例的斜視圖。 Fig. 7 is a perspective view showing an example in which an adhesive is applied to the entire surface by a dispenser.

圖8是表示利用分配器來將黏接劑塗佈至整個面的一例的斜視圖。 Fig. 8 is a perspective view showing an example in which an adhesive is applied to the entire surface by a dispenser.

圖9(A)是表示當在貼合部中進行假硬化的照射時，對整個面進行照射的例子的說明圖，圖9(B)是表示一面移動，一面進行照射的例子的說明圖，圖9(C)是表示利用光罩來進行照射的例子的說明圖。 (A) of FIG. 9 is an explanatory view showing an example in which the entire surface is irradiated when the bonding portion is irradiated with the pseudo-hardening, and FIG. 9B is an explanatory view showing an example in which the surface is irradiated while being irradiated. FIG. 9(C) is an explanatory view showing an example of irradiation using a photomask.

圖10(A)是表示於搬送部中，在與供給部及貼合部 不同的位置進行假硬化的情形的說明圖，圖10(B)是表示在貼合之後進行真硬化的情形的說明圖，圖10(C)是表示將放置部設置於貼合部與真硬化部之間的情形的說明圖。 FIG. 10(A) shows the supply unit and the bonding unit in the transport unit. FIG. 10(B) is an explanatory view showing a state in which true hardening is performed after bonding, and FIG. 10(C) is a view showing that the placing portion is placed on the bonding portion and the true hardening is performed. An illustration of the situation between the ministries.

1‧‧‧黏接劑供給部 1‧‧‧Adhesive Supply Department

3‧‧‧搬送部 3‧‧‧Transportation Department

10‧‧‧供給部 10‧‧‧Supply Department

11‧‧‧照射部 11‧‧‧ Department of Irradiation

30‧‧‧搬送裝置 30‧‧‧Transporting device

31‧‧‧載置部 31‧‧‧Loading Department

R‧‧‧黏接劑 R‧‧‧Adhesive

S1‧‧‧工件 S1‧‧‧ workpiece

T‧‧‧儲槽 T‧‧‧ storage tank

Claims (6)

一種貼合裝置，經由因電磁波的照射而硬化的黏接劑，將構成顯示裝置的一對工件予以貼合，上述貼合裝置的特徵在於包括：供給部，以遍及僅其中一個工件的整個單面的方式，供給上述黏接劑；照射部，於進行貼合之前，在大氣中，對遍及上述其中一個工件的整個單面的上述黏接劑的全部照射電磁波，藉此，使上述黏接劑假硬化；貼合部，經由假硬化狀態的上述黏接劑將上述其中一個工件與另一個工件貼合；放置部，將在上述貼合部所貼合且上述黏接劑為假硬化狀態的上述一對工件放置於大氣中；以及硬化部，對放置於上述大氣中的上述一對工件照射電磁波，來使上述黏接劑真硬化。 A bonding apparatus for bonding a pair of workpieces constituting a display device via an adhesive which is hardened by irradiation of electromagnetic waves, the bonding apparatus comprising: a supply portion for spreading the entire single sheet of only one of the workpieces The surface of the adhesive is supplied to the illuminating unit; and the illuminating unit applies electromagnetic waves to all of the adhesive agent covering the entire one surface of the one of the workpieces in the atmosphere before bonding, thereby making the bonding a pseudo-hardening; a bonding portion that bonds one of the workpieces to another workpiece via the adhesive in a pseudo-hardened state; the placement portion is bonded to the bonding portion and the adhesive is in a pseudo-hardened state The pair of workpieces are placed in the atmosphere; and the hardened portion irradiates the pair of workpieces placed in the atmosphere with electromagnetic waves to cause the adhesive to be hardened. 如申請專利範圍第1項所述之貼合裝置，其中上述照射部包括照射出紫外線的照射裝置。 The bonding apparatus according to claim 1, wherein the illuminating unit includes an illuminating device that emits ultraviolet ray. 如申請專利範圍第1項或第2項所述之貼合裝置，其中上述放置部為搬送裝置，上述搬送裝置將已貼合的上述一對工件自上述貼合部搬出至上述硬化部。 The bonding apparatus according to claim 1 or 2, wherein the placing portion is a conveying device, and the conveying device carries the pair of the bonded workpieces from the bonding portion to the curing portion. 如申請專利範圍第1項或第2項所述之貼合裝置，其中上述貼合部包括：真空室，能夠對貼合時的上述一對工件的周圍進行抽真空。 The bonding apparatus according to claim 1 or 2, wherein the bonding portion includes a vacuum chamber capable of evacuating a periphery of the pair of workpieces at the time of bonding. 一種貼合基板的製造方法，經由因電磁波的照射而硬化的黏接劑，將構成顯示裝置的一對工件予以貼合，上述貼合方法的特徵在於：以遍及僅其中一個工件的整個單面的方式，供給上述黏接劑；於進行貼合之前，在大氣中，對遍及上述其中一個工件的整個單面的上述黏接劑的全部照射電磁波，藉此，使上述黏接劑假硬化；經由假硬化狀態的上述黏接劑將上述其中一個工件與另一個工件貼合；以及將所貼合且上述黏接劑為假硬化狀態的上述一對工件放置於大氣中後，對上述一對工件照射電磁波，來使上述黏接劑真硬化。 A method for manufacturing a bonded substrate, wherein a pair of workpieces constituting a display device are bonded together by an adhesive which is cured by irradiation of electromagnetic waves, and the bonding method is characterized in that the entire bonding method is performed over one entire surface of only one of the workpieces Providing the adhesive agent; and applying electromagnetic waves to all of the adhesive agent covering the entire single surface of one of the workpieces in the atmosphere before bonding, thereby causing the adhesive to be pseudo-hardened; And bonding the one of the workpieces to the other workpiece via the adhesive in a pseudo-hardened state; and placing the pair of workpieces in the pseudo-hardened state after the adhesive is placed in the atmosphere The workpiece is irradiated with electromagnetic waves to cause the above-mentioned adhesive to be hardened. 如申請專利範圍第5項所述之貼合基板的製造方法，其中上述電磁波為紫外線。 The method for producing a bonded substrate according to claim 5, wherein the electromagnetic wave is ultraviolet light.