TWI538593B - Touch device and cover module thereof - Google Patents
Touch device and cover module thereof Download PDFInfo
- Publication number
- TWI538593B TWI538593B TW103123227A TW103123227A TWI538593B TW I538593 B TWI538593 B TW I538593B TW 103123227 A TW103123227 A TW 103123227A TW 103123227 A TW103123227 A TW 103123227A TW I538593 B TWI538593 B TW I538593B
- Authority
- TW
- Taiwan
- Prior art keywords
- touch
- area
- touch sensing
- cover
- module
- Prior art date
Links
Landscapes
- Position Input By Displaying (AREA)
Description
本發明是有關於一種觸控裝置，尤其是有關於一種在周圍區設有觸控鍵的觸控裝置及其覆蓋模組。 The present invention relates to a touch device, and more particularly to a touch device having a touch key in a surrounding area and a cover module thereof.
現有之觸控裝置主要為雙玻璃結構，其中觸控感測陣列設置在一片玻璃基板上，其上再覆蓋一片保護玻璃。而在雙玻璃結構中，習知技術有兩種方式使觸控裝置中設置於周圍區的圖示可作為觸控鍵：一種為將觸控感測陣列延伸至周圍區的圖示下方，使設置於周圍區的圖示亦具有觸控功能；另一種為利用軟性電路板，將觸控感測器設置於軟性電路板上，再利用光學膠(optical clear adhesive,OCA)將軟性電路板的觸控感測器貼合於周圍區的圖示下方，以使圖示具有觸控功能。 The existing touch device is mainly a double glass structure, wherein the touch sensing array is disposed on a piece of glass substrate, and a cover glass is covered thereon. In the double glass structure, the prior art has two ways to make the icon of the touch device disposed in the surrounding area as a touch key: one is to extend the touch sensing array below the icon of the surrounding area, so that The icon set in the surrounding area also has a touch function; the other is to use a flexible circuit board to set the touch sensor on a flexible circuit board, and then use an optical clear adhesive (OCA) to turn the flexible circuit board. The touch sensor is attached to the bottom of the icon in the surrounding area to make the icon have a touch function.
然而，將觸控感測陣列延伸至周圍區，會增加觸控感測區的面積，此不利於觸控感測陣列製程中所使用的光罩排版，並會增加較多生產成本。此外，利用軟性電路板使圖示具有觸控功能的方式中，在將軟性電路板貼合於玻璃基板的周圍區時，軟性電路板的可撓性容易使觸控感測器與圖示之間產生氣泡或空隙，而影響感測功能。 However, extending the touch sensing array to the surrounding area increases the area of the touch sensing area, which is disadvantageous for the typesetting of the mask used in the touch sensing array process, and increases the production cost. In addition, in the manner in which the flexible circuit board is provided with the touch function, when the flexible circuit board is attached to the peripheral area of the glass substrate, the flexibility of the flexible circuit board is easy to make the touch sensor and the figure Bubbles or voids are created to affect the sensing function.
本發明提供一種觸控裝置，具有提升周圍區之感測靈敏度以及節省成本的優點。 The invention provides a touch device, which has the advantages of improving the sensing sensitivity of the surrounding area and saving cost.
本發明另提供一種觸控裝置的覆蓋模組，以提升觸控裝置周圍區之感測靈敏度以及節省成本。 The invention further provides a cover module of the touch device, which improves the sensing sensitivity and the cost saving of the area around the touch device.
本發明所提供的觸控裝置包括觸控模組、蓋板、遮蔽層以及至少一觸控感測元件，其中觸控模組具有觸控感測陣列，而蓋板覆蓋觸控模組。蓋板具有透光區以及周圍區，其中透光區對應觸控感測陣列，周圍區位於透光區之至少一側。遮蔽層設置於蓋板之面對觸控模組的表面，並且位於周圍區，用以於周圍區部分鏤空以界定出至少一圖案區。而至少一觸控感測元件設置於表面並對應覆蓋至少一圖案區。 The touch device of the present invention comprises a touch module, a cover, an obscuration layer and at least one touch sensing component, wherein the touch module has a touch sensing array, and the cover covers the touch module. The cover plate has a light transmitting area and a surrounding area, wherein the light transmitting area corresponds to the touch sensing array, and the surrounding area is located on at least one side of the light transmitting area. The shielding layer is disposed on the surface of the cover facing the touch module, and is located in the surrounding area for partially hollowing out the surrounding area to define at least one pattern area. The at least one touch sensing component is disposed on the surface and correspondingly covers at least one of the pattern regions.
在本發明的一實施例中，上述之觸控裝置更包括軟性電路板，分別電性連接觸控感測元件及觸控感測陣列。 In an embodiment of the invention, the touch device further includes a flexible circuit board electrically connected to the touch sensing component and the touch sensing array.
在本發明的一實施例中，上述之軟性電路板具有接合區和至少一搭接導線，其中接合區設有多個第一接合墊和至少一第二接合墊，第一接合墊用以電性連接觸控感測陣列。至少一搭接導線用以電性連接第二接合墊，且電性連接至觸控感測元件的延伸部。 In an embodiment of the invention, the flexible circuit board has a bonding area and at least one strapping wire, wherein the bonding zone is provided with a plurality of first bonding pads and at least one second bonding pad, and the first bonding pad is used for electricity Connect the touch sensing array. The at least one lap wire is electrically connected to the second bonding pad and electrically connected to the extension of the touch sensing component.
在本發明的一實施例中，上述之軟性電路板更具有至少一第三接合墊，而搭接導線透過第三接合墊電性連接至延伸部。 In an embodiment of the invention, the flexible circuit board further has at least one third bonding pad, and the lap wire is electrically connected to the extension through the third bonding pad.
在本發明的一實施例中，上述之圖案區位在觸控模組正投影於蓋板的範圍外。 In an embodiment of the invention, the pattern location is outside the range in which the touch module is projected onto the cover.
在本發明的一實施例中，上述之觸控裝置更包括 黏合層，連接於蓋板與觸控模組之間。 In an embodiment of the invention, the touch device further includes The adhesive layer is connected between the cover and the touch module.
在本發明的一實施例中，上述之觸控裝置更包括至少一彩色光阻覆蓋至少一圖案區，而觸控感測元件覆蓋彩色光阻，彩色光阻與圖案化遮蔽層的顏色不同。 In an embodiment of the invention, the touch device further includes at least one color photoresist covering at least one pattern region, and the touch sensing component covers the color photoresist, and the color photoresist has a different color from the patterned shielding layer.
在本發明的一實施例中，上述之觸控裝置更包括顯示面板，而觸控模組位於顯示面板與蓋板之間，且顯示面板的可視區對應該蓋板的透光區。 In an embodiment of the invention, the touch device further includes a display panel, and the touch module is located between the display panel and the cover, and the visible area of the display panel corresponds to the light transmissive area of the cover.
本發明另提供一種觸控裝置的覆蓋模組，包括蓋板、遮蔽層以及至少一觸控感測元件，其中蓋板具有透光區以及周圍區，且周圍區位於透光區之至少一側。遮蔽層設置於蓋板之表面，並位於周圍區，且遮蔽層用以於周圍區部分鏤空以界定出至少一圖案區。至少一觸控感測元件設置於蓋板之表面並對應覆蓋至少一圖案區。 The invention further provides a cover module for a touch device, comprising a cover plate, a shielding layer and at least one touch sensing component, wherein the cover plate has a light transmitting area and a surrounding area, and the surrounding area is located on at least one side of the light transmitting area . The shielding layer is disposed on the surface of the cover plate and located in the surrounding area, and the shielding layer is used for partially hollowing out the surrounding area to define at least one pattern area. At least one touch sensing component is disposed on a surface of the cover plate and correspondingly covers at least one pattern area.
本發明之觸控裝置及其覆蓋模組是直接將觸控感測元件覆蓋於位在蓋板周圍區的圖案區，由於不需將觸控感測陣列延伸到周圍區，所以能降低成本。而且，因圖案區與觸控感測元件之間並非藉由光學膠貼合，所以能避免貼合缺陷導致觸控感測元件感測靈敏度不佳的問題。 The touch device and the cover module of the present invention directly cover the touch sensing component in the pattern area located around the cover plate, and the cost can be reduced because the touch sensing array is not required to extend to the surrounding area. Moreover, since the pattern area and the touch sensing element are not bonded by the optical glue, the problem that the touch sensing element is not sensitive to the sensing sensitivity can be avoided.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 The above and other objects, features and advantages of the present invention will become more <RTIgt;
100‧‧‧觸控裝置 100‧‧‧ touch device
110‧‧‧觸控模組 110‧‧‧Touch Module
111‧‧‧觸控感測陣列 111‧‧‧Touch Sensing Array
112‧‧‧基板 112‧‧‧Substrate
113‧‧‧導線 113‧‧‧Wire
114‧‧‧第四接合墊 114‧‧‧4th joint pad
120‧‧‧蓋板 120‧‧‧ cover
121a‧‧‧透光區 121a‧‧‧Light transmission area
121b‧‧‧周圍區 121b‧‧‧ surrounding area
122‧‧‧表面 122‧‧‧ surface
125‧‧‧彩色光阻 125‧‧‧Color resist
130‧‧‧遮蔽層 130‧‧‧Shielding layer
133‧‧‧圖案區 133‧‧‧pattern area
140‧‧‧觸控感測元件 140‧‧‧Touch sensing components
141‧‧‧延伸部 141‧‧‧Extension
150‧‧‧軟性電路板 150‧‧‧Soft circuit board
151a‧‧‧第一接合墊 151a‧‧‧First joint pad
151b‧‧‧第二接合墊 151b‧‧‧Second joint pad
151c‧‧‧第三接合墊 151c‧‧‧ third joint pad
152‧‧‧搭接導線 152‧‧‧ lap wire
160‧‧‧覆蓋模組 160‧‧‧Overlay module
170‧‧‧黏合層 170‧‧‧Adhesive layer
180‧‧‧顯示面板 180‧‧‧ display panel
B1、B2、B3、B4‧‧‧邊界 B1, B2, B3, B4‧‧‧ borders
VA‧‧‧可視區 VA‧‧ visible area
圖1是本發明一實施例之觸控裝置的示意圖。 1 is a schematic diagram of a touch device according to an embodiment of the invention.
圖2是本發明一實施例之觸控裝置的局部俯視示意圖。 2 is a partial top plan view of a touch device according to an embodiment of the invention.
圖3是本發明另一實施例之觸控裝置的示意圖。 3 is a schematic diagram of a touch device according to another embodiment of the present invention.
圖4是本發明另一實施例之觸控裝置的示意圖。 4 is a schematic diagram of a touch device according to another embodiment of the present invention.
圖1是本發明一實施例之觸控裝置的示意圖。請參照圖1，本實施例之觸控裝置100包括觸控模組110及覆蓋模組160，其中覆蓋模組160覆蓋於觸控模組110。使用者可在覆蓋模組160上進行操控動作。覆蓋模組160包括蓋板120、遮蔽層130以及至少一觸控感測元件140。蓋板120覆蓋觸控模組110。蓋板120具有透光區121a以及周圍區121b，圖1的虛線為透光區121a及周圍區121b的分界線。透光區121a對應觸控感測陣列111，而周圍區121b位於透光區121a之至少一側。遮蔽層130設置於蓋板120之面對觸控模組110的表面122，並且位於周圍區121b，用以於周圍區121b部分鏤空以界定出至少一圖案區133。觸控感測元件140設置於表面122並對應覆蓋圖案區133，使圖案區133具有觸控功能。 1 is a schematic diagram of a touch device according to an embodiment of the invention. Referring to FIG. 1 , the touch device 100 of the present embodiment includes a touch module 110 and a cover module 160 , wherein the cover module 160 covers the touch module 110 . The user can perform a manipulation action on the overlay module 160. The cover module 160 includes a cover 120 , a shielding layer 130 , and at least one touch sensing component 140 . The cover 120 covers the touch module 110. The cover plate 120 has a light transmitting area 121a and a peripheral area 121b, and the broken line of FIG. 1 is a boundary line between the light transmitting area 121a and the surrounding area 121b. The light transmitting area 121a corresponds to the touch sensing array 111, and the surrounding area 121b is located on at least one side of the light transmitting area 121a. The shielding layer 130 is disposed on the surface 122 of the cover 120 facing the touch module 110 and located in the surrounding area 121b for partially hollowing out the surrounding area 121b to define at least one pattern area 133. The touch sensing component 140 is disposed on the surface 122 and corresponding to the cover pattern area 133, so that the pattern area 133 has a touch function.
圖2是本發明一實施例之觸控裝置的局部俯視示意圖。如圖2所示，本實施例中，觸控模組110進一步包括基板112，如玻璃基板或塑膠基板等。觸控感測陣列111配置於基板112上，並位於基板112與蓋板120之間。需說明的是，遮蔽層130的邊界B1與基板112的邊界B2之間的區域為遮蔽層130之與觸控模組110的重疊的區域。為了清楚表達各元件，圖2係以實線繪示出被基板112所遮蓋的元件，如觸控感測陣列111及遮蔽層130之與觸控模組110重疊的區域。此外，觸控感測陣列111的邊界B3與基板112的邊界B2之間存有一段距離。在某些實施例中，觸控感測陣列111的部分邊界B3部分可 與基板112的部分邊界B2重疊。另外，基板112的邊界B2與蓋板120的邊界B4之間存有一段距離。在某些實施例中，基板112的部分邊界B2可與蓋板120的部分邊界B4重疊。 2 is a partial top plan view of a touch device according to an embodiment of the invention. As shown in FIG. 2 , in the embodiment, the touch module 110 further includes a substrate 112 , such as a glass substrate or a plastic substrate. The touch sensing array 111 is disposed on the substrate 112 and located between the substrate 112 and the cover 120. It should be noted that the area between the boundary B1 of the shielding layer 130 and the boundary B2 of the substrate 112 is an area of the shielding layer 130 overlapping with the touch module 110. In order to clearly express the components, FIG. 2 is a solid line showing the components covered by the substrate 112, such as the touch sensing array 111 and the area of the shielding layer 130 overlapping the touch module 110. In addition, there is a distance between the boundary B3 of the touch sensing array 111 and the boundary B2 of the substrate 112. In some embodiments, part of the boundary B3 of the touch sensing array 111 can be It overlaps with a partial boundary B2 of the substrate 112. In addition, there is a distance between the boundary B2 of the substrate 112 and the boundary B4 of the cover 120. In some embodiments, a portion of the boundary B2 of the substrate 112 can overlap a portion of the boundary B4 of the cover plate 120.
上述之觸控感測陣列111可為電容式觸控感測陣列、電阻式觸控感測陣列等，但本發明並不以此為限。在本實施例中，圖案區133位在觸控模組110正投影於蓋板120的範圍外，但本發明並不以此為限。更詳細地說，本實施例中，蓋板120的尺寸大於基板112的尺寸，所以部分蓋板120超出基板112的範圍外而未與觸控模組110重疊，上述之圖案區133即未與觸控模組110重疊。另外，在本實施例中，遮蔽層130的顏色為黑色，其可利用油墨網印方式製作於蓋板120的表面122，但本發明並不限定遮蔽層130的顏色及製作方法。位於周圍區121b的圖案區133(以虛線繪示的區域)即為觸控鍵的位置。圖2是以四個圖案區133為例，這些圖案區133具有不同的圖案，其代表不同的功能鍵，但圖案區133的數量也可為一個或多個，本發明並不限制。觸控感測元件140的數量對應於圖案區133的數量，而形成於圖案區133的觸控感測元件140可由印刷導電材料的方式製成，但本發明並不限定觸控感測元件140的形成方式。 The touch sensing array 111 can be a capacitive touch sensing array, a resistive touch sensing array, etc., but the invention is not limited thereto. In the present embodiment, the pattern area 133 is outside the range in which the touch module 110 is projected onto the cover 120, but the invention is not limited thereto. In more detail, in the embodiment, the size of the cover 120 is larger than the size of the substrate 112. Therefore, the partial cover 120 is beyond the range of the substrate 112 and does not overlap with the touch module 110. The touch modules 110 overlap. In addition, in the present embodiment, the color of the shielding layer 130 is black, which can be formed on the surface 122 of the cover 120 by ink screen printing. However, the present invention does not limit the color of the shielding layer 130 and the manufacturing method thereof. The pattern area 133 (the area shown by the dotted line) located in the surrounding area 121b is the position of the touch key. 2 is an example of four pattern areas 133 having different patterns, which represent different functional keys, but the number of pattern areas 133 may also be one or more, and the invention is not limited thereto. The number of the touch sensing elements 140 corresponds to the number of the pattern regions 133, and the touch sensing elements 140 formed in the pattern regions 133 can be made by printing conductive materials, but the present invention does not limit the touch sensing elements 140. The way of formation.
在某些實施例中，觸控裝置100可更包括軟性電路板150，其電性連接觸控感測元件140及觸控感測陣列111。需說明的是，為了清楚表達各元件，圖2係以實線繪示出被軟性電路板150所遮蓋的元件。此外，軟性電路板150具有可撓性，可依設計需求彎折，其位置並不限於圖2所示。軟性電路板150具有接合區151以及至少一搭接導線152。在某些實施例中，軟性電路板150可更具有至少一第三接合墊 151c。接合區151設有多個第一接合墊151a和至少一第二接合墊151b，而搭接導線152及第二接合墊151b的數量對應圖案區133的數量。搭接導線152用以電性連接第二接合墊151b。在某些實施例中，觸控感測元件140具有延伸部141，以電性連接至搭接導線152。第三接合墊151c的數量對應於搭接導線152的數量，且第三接合墊151c連接於搭接導線152的末端，以使搭接導線152透過第三接合墊151c電性連接至延伸部141。此外，第一接合墊151a用以電性連接觸控感測陣列111。在某些實施例中，觸控感測陣列111還包括多條導線113及連接於這些導線113的多個第四接合墊114，並且透過這些導線113及第四接合墊114而電性連接至這些第一接合墊151a。 In some embodiments, the touch device 100 further includes a flexible circuit board 150 electrically connected to the touch sensing component 140 and the touch sensing array 111. It should be noted that, in order to clearly express the components, FIG. 2 shows the components covered by the flexible circuit board 150 in solid lines. In addition, the flexible circuit board 150 has flexibility and can be bent according to design requirements, and its position is not limited to that shown in FIG. 2. The flexible circuit board 150 has a land 151 and at least one strap 152. In some embodiments, the flexible circuit board 150 can further have at least one third bonding pad. 151c. The bonding region 151 is provided with a plurality of first bonding pads 151a and at least one second bonding pads 151b, and the number of the bonding wires 152 and the second bonding pads 151b corresponds to the number of the pattern regions 133. The lap wire 152 is used to electrically connect the second bonding pad 151b. In some embodiments, the touch sensing component 140 has an extension 141 for electrically connecting to the strap wires 152. The number of the third bonding pads 151c corresponds to the number of the overlapping wires 152, and the third bonding pads 151c are connected to the ends of the overlapping wires 152, so that the overlapping wires 152 are electrically connected to the extending portion 141 through the third bonding pads 151c. . In addition, the first bonding pad 151 a is used to electrically connect the touch sensing array 111 . In some embodiments, the touch sensing array 111 further includes a plurality of wires 113 and a plurality of fourth bonding pads 114 connected to the wires 113, and is electrically connected to the wires 113 and the fourth bonding pads 114. These first bonding pads 151a.
相較於習知將觸控感測陣列延伸到周圍區的結構，本實施例之觸控裝置100因直接將觸控感測元件140覆蓋於位在蓋板120周圍區121b的圖案區133，不需將觸控感測陣列111延伸到周圍區121b即可使圖案區133具有觸控功能，所以能降低成本。而且，相較於習知將觸控感測元件製作於軟性電路板的結構，本實施例因圖案區133與觸控感測元件140之間並非藉由光學膠貼合，所以能避免貼合缺陷導致觸控感測元件140感測不佳的問題。 The touch device 100 of the present embodiment directly covers the touch sensing element 140 in the pattern area 133 of the area 121b around the cover 120, as compared with the conventional structure of extending the touch sensing array to the surrounding area. The pattern area 133 has a touch function without extending the touch sensing array 111 to the surrounding area 121b, so that the cost can be reduced. Moreover, compared with the conventional structure in which the touch sensing element is fabricated on the flexible circuit board, in this embodiment, since the pattern area 133 and the touch sensing element 140 are not bonded by optical glue, the bonding can be avoided. The defect causes a problem that the touch sensing element 140 is not well sensed.
圖3是本發明另一實施例之觸控裝置的示意圖。請參照圖3，其與圖1相似，差異處在於本實施例的觸控裝置更包括至少一彩色光阻125，其覆蓋圖案區133，其中彩色光阻125的數量對應於圖案區的數量。觸控感測元件140覆蓋彩色光阻125。在本實施例中，彩色光阻125的顏色與遮蔽層130的顏色不同，使彩色光阻125所覆蓋的圖案區133可表現 出不同顏色，本發明並未限定彩色光阻125與遮蔽層130的顏色。 3 is a schematic diagram of a touch device according to another embodiment of the present invention. Please refer to FIG. 3 , which is similar to FIG. 1 . The difference is that the touch device of the embodiment further includes at least one color photoresist 125 covering the pattern region 133 , wherein the number of the color photoresists 125 corresponds to the number of pattern regions. The touch sensing component 140 covers the color photoresist 125. In this embodiment, the color of the color photoresist 125 is different from the color of the shielding layer 130, so that the pattern area 133 covered by the color photoresist 125 can be expressed. Different colors, the color of the color photoresist 125 and the shielding layer 130 are not limited by the present invention.
圖4是本發明又一實施例之觸控裝置的示意圖。請參照圖4，在某些實施例中，觸控裝置還可包括黏合層170。在某些實施例中，觸控裝置還可包括顯示面板180。黏合層170連接於蓋板120與觸控模組110之間，以使覆蓋模組160與觸控模組110藉由黏合層170而彼此結合。黏合層170可為光學膠層，但本發明不以此為限。此外，觸控模組110位於顯示面板180與蓋板120之間。顯示面板180可為液晶顯示面板、有機發光二極體顯示面板或其他種類的顯示面板。觸控模組110的觸控感測陣列111對應顯示面板180的可視區VA，而上述之透光區121a除了對應觸控感測陣列111外，亦對應顯示面板180的可視區VA。 4 is a schematic diagram of a touch device according to still another embodiment of the present invention. Referring to FIG. 4 , in some embodiments, the touch device may further include an adhesive layer 170 . In some embodiments, the touch device can further include a display panel 180. The adhesive layer 170 is connected between the cover 120 and the touch module 110 such that the cover module 160 and the touch module 110 are bonded to each other by the adhesive layer 170. The adhesive layer 170 can be an optical adhesive layer, but the invention is not limited thereto. In addition, the touch module 110 is located between the display panel 180 and the cover 120. The display panel 180 can be a liquid crystal display panel, an organic light emitting diode display panel, or other kinds of display panels. The touch sensing array 111 of the touch panel 110 corresponds to the visible area VA of the display panel 180 , and the transparent area 121 a corresponds to the visible area VA of the display panel 180 in addition to the touch sensing array 111 .
綜上所述，本發明之觸控裝置是直接將觸控感測元件覆蓋於位在蓋板周圍區的圖案區，由於不需將觸控感測陣列延伸到周圍區，所以能降低成本。而且，因圖案區與觸控感測元件之間並非藉由光學膠貼合，所以能避免貼合缺陷導致觸控感測元件感測不佳的問題。 In summary, the touch device of the present invention directly covers the touch sensing component in the pattern area located around the cover plate, and the cost can be reduced because the touch sensing array is not required to extend to the surrounding area. Moreover, since the pattern area and the touch sensing element are not bonded by the optical adhesive, the problem that the touch sensing element is not well sensed by the bonding defect can be avoided.
雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
100‧‧‧觸控裝置 100‧‧‧ touch device
110‧‧‧觸控模組 110‧‧‧Touch Module
111‧‧‧觸控感測陣列 111‧‧‧Touch Sensing Array
120‧‧‧蓋板 120‧‧‧ cover
121a‧‧‧透光區 121a‧‧‧Light transmission area
121b‧‧‧周圍區 121b‧‧‧ surrounding area
122‧‧‧表面 122‧‧‧ surface
130‧‧‧遮蔽層 130‧‧‧Shielding layer
133‧‧‧圖案區 133‧‧‧pattern area
140‧‧‧觸控感測元件 140‧‧‧Touch sensing components
160‧‧‧覆蓋模組 160‧‧‧Overlay module
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185862.6A CN105094397B (en) | 2014-05-05 | 2014-05-05 | Touch device and its overlay module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201543980A TW201543980A (en) | 2015-11-16 |
| TWI538593B true TWI538593B (en) | 2016-06-11 |
Family
ID=52109559
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103211986U TWM488683U (en) | 2014-05-05 | 2014-07-04 | Touch device and cover module thereof |
| TW103123227A TWI538593B (en) | 2014-05-05 | 2014-07-04 | Touch device and cover module thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103211986U TWM488683U (en) | 2014-05-05 | 2014-07-04 | Touch device and cover module thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105094397B (en) |
| TW (2) | TWM488683U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105607791A (en) | 2014-11-13 | 2016-05-25 | 财团法人工业技术研究院 | Lead structure and sensing element |
| TWI574187B (en) * | 2014-11-13 | 2017-03-11 | 財團法人工業技術研究院 | Conductive line structure and sensing device using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103176641A (en) * | 2011-12-25 | 2013-06-26 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| KR20130127655A (en) * | 2012-05-15 | 2013-11-25 | 엘지이노텍 주식회사 | Touch window and manufacturing method thereof |
| CN203133785U (en) * | 2013-01-28 | 2013-08-14 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN203909768U (en) * | 2014-05-05 | 2014-10-29 | 宸鸿科技(厦门)有限公司 | Touch device and covering module thereof |
-
2014
- 2014-05-05 CN CN201410185862.6A patent/CN105094397B/en active Active
- 2014-07-04 TW TW103211986U patent/TWM488683U/en unknown
- 2014-07-04 TW TW103123227A patent/TWI538593B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105094397A (en) | 2015-11-25 |
| TW201543980A (en) | 2015-11-16 |
| TWM488683U (en) | 2014-10-21 |
| CN105094397B (en) | 2019-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6111352B2 (en) | Touch device | |
| TWI476656B (en) | Touch panel and manufacturing method thereof | |
| KR102386654B1 (en) | Cover window, method for manufacturing the same and display device comprising the same | |
| TWI489336B (en) | Touch panel and touch display module thereof | |
| TWI526890B (en) | Touch panels and fabrication methods thereof | |
| US8531415B2 (en) | Flat panel display integrated with touch screen panel | |
| KR101496884B1 (en) | Touch panel and manufacturing method thereof | |
| US20150316806A1 (en) | Touch screen display device | |
| US20140132861A1 (en) | Touch panel and touch-sensitive display device | |
| TWI492122B (en) | Touch sensing device and manufacturing method thereof | |
| TW201445399A (en) | Touch panel | |
| WO2020052498A1 (en) | Display module, manufacturing method therefor and display device | |
| US20140022743A1 (en) | Touch-sensing substrate, display panel, and patterned light-shielding layer | |
| TWI538593B (en) | Touch device and cover module thereof | |
| TWI438666B (en) | Touch panel and touch-sensing display apparatus | |
| TWM472241U (en) | Touch panel and touch display device | |
| KR102052749B1 (en) | Touch sensor integrated type display device | |
| TWI584166B (en) | Touch panel and fabrication method thereof | |
| TWI571784B (en) | Touch panel and method for fabricating the same | |
| TW201504872A (en) | Touch panel and touch display device | |
| TWI416397B (en) | Touch panel, formation method thereof and display device containing the same | |
| TW201539269A (en) | Touch panel and touch display device | |
| TWM500923U (en) | Touch panel module | |
| TWI571782B (en) | Touch panels and fabrication methods thereof | |
| KR101471868B1 (en) | Touchscreen panel module |