TWI536030B - Electronic component testing classifier - Google Patents
Electronic component testing classifier Download PDFInfo
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- TWI536030B TWI536030B TW104109988A TW104109988A TWI536030B TW I536030 B TWI536030 B TW I536030B TW 104109988 A TW104109988 A TW 104109988A TW 104109988 A TW104109988 A TW 104109988A TW I536030 B TWI536030 B TW I536030B
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Description
本發明係提供一種該搬移裝置利用承載器之治具載送待測電子元件至測試裝置處，並以升降器頂升具待測電子元件之治具，使待測電子元件與測試裝置作電性連接而執行測試作業，以有效簡化輸送路徑及輸送用元件，進而節省成本及提高生產效能之電子元件測試分類機。 The invention provides a moving device for carrying the electronic component to be tested to the testing device by using the fixture of the carrier, and lifting the fixture of the electronic component to be tested with the lifting device, so that the electronic component to be tested and the testing device are powered An electronic component test sorter that performs a test operation to effectively simplify the transport path and the transport components, thereby saving cost and improving production efficiency.
在現今，電子元件於生產過程中係歷經多道加工製程，為了確保產品品質，業者於電子元件製作完成後，均會進行電性測試作業，以淘汰出不良品電子元件；請參閱第1圖，係為本申請人先前申請之台灣發明第I 468329號『電子元件拾料單元及其應用之測試設備』專利案，其測試設備係於機台10上配置有供料裝置11、收料裝置12、測試裝置13及輸送裝置14，該供料裝置11係容納複數個電性接點朝下之待測電子元件，該收料裝置12係容納複數個不同等級之已測電子元件，該測試裝置13係設有複數個測試座131，以對電性接點朝下之電子元件執行測試作業，該輸送裝置14係設有作第一、二、三方向(如X、Y、Z方向)位移之入料移載臂141及出料移載臂142，而分別移載供料裝置11之待測電子元件，以及將已測電子元件移載至收料裝置12分類放置，另該輸送裝置14係於測試裝置13之一側設有作X方向位移之第一入料載台143及第一出料載台144，於測試裝置13之另一側設有作X方向位移之第二入料載台145及第二出料載台146，該第一入料載台143及第二入料載台145係承置該入料移載臂141由供料裝置11處移載之待測電子元件，該第一出料載台144及第二出料載台146係供該出料移載臂142將已測電子元件移載至收料裝置12分類放置，為了將第一入料載台143之待測電子元件移入至測試裝置13，以及將測試裝 置13之已測電子元件移出至第一出料載台144，該輸送裝置14係設有作Y-Z方向位移之第一下壓臂147，以於第一入、出料載台143、144及測試裝置13間移載電性接點朝下之待測/已測電子元件，又為了將第二入料載台145之待測電子元件移入至測試裝置13，以及將測試裝置13之已測電子元件移出至第二出料載台146，該輸送裝置14並設有作Y-Z方向位移之第二下壓臂148，以於第二入、出料載台145、146及測試裝置13間移載電性接點朝下之待測/已測電子元件；惟於使用上具有如下缺失： In today's production process, electronic components are subjected to multiple processing processes. In order to ensure product quality, the manufacturer will perform electrical testing after the electronic components are manufactured to eliminate defective electronic components; see Figure 1. It is the patent application of Taiwan Invention Invention No. I 468329 "Testing Device for Electronic Component Pickup Unit and Its Application" which is previously applied by the applicant. The test equipment is equipped with a feeding device 11 and a receiving device on the machine table 10. 12. The testing device 13 and the conveying device 14 are configured to accommodate a plurality of electronic components to be tested with the electrical contacts facing downward, and the receiving device 12 is configured to accommodate a plurality of different tested electronic components of different levels. The device 13 is provided with a plurality of test sockets 131 for performing test operations on electronic components with electrical contacts facing downwards. The transport device 14 is provided for the first, second, and third directions (eg, X, Y, and Z directions). Displacement of the loading transfer arm 141 and the discharge transfer arm 142 to respectively transfer the electronic components to be tested of the feeding device 11 and transfer the measured electronic components to the receiving device 12 for sorting, and the conveying device 14 series in test equipment a first loading stage 143 and a first discharging stage 144 for shifting in the X direction are provided on one side of the test unit 13, and a second loading stage 145 for shifting in the X direction is disposed on the other side of the testing device 13 and a second discharge stage 146, the first loading stage 143 and the second loading stage 145 are mounted on the electronic component to be tested that is transferred from the feeding device 11 by the feeding device 141. A discharge stage 144 and a second discharge stage 146 are provided for the discharge transfer arm 142 to transfer the measured electronic components to the receiving device 12 for sorting, in order to test the first loading stage 143 The electronic component is moved into the test device 13, and the test device is loaded The measured electronic component of the 13 is removed to the first discharge stage 144, and the conveying device 14 is provided with a first lower pressing arm 147 for the YZ direction displacement, for the first inlet and outlet loading stations 143, 144 and The test device 13 transfers the electronic component to be tested/tested with the electrical contact point downward, and the electronic component to be tested of the second loading stage 145 is moved into the test device 13, and the tested device 13 is tested. The electronic component is moved out to the second discharge stage 146, and the conveying device 14 is provided with a second lower pressing arm 148 for shifting in the YZ direction to move between the second inlet and outlet loading platforms 145, 146 and the testing device 13. The electronic component to be tested/tested with the contact point facing down; however, it has the following defects in use:
1．該輸送裝置14必須設有二可作Y-Z方向位移之第一下壓臂147及第二下壓臂148，不僅機構較為複雜，且必須透過第一下壓臂147及第二下壓臂148作Y-Z方向位移輸送路徑，方可移載待測/已測之電子元件，而增加輸送路徑的複雜度及增加設備成本。 1. The conveying device 14 must be provided with a first lower pressing arm 147 and a second lower pressing arm 148 which can be displaced in the YZ direction. The mechanism is complicated, and must be transmitted through the first lower pressing arm 147 and the second lower pressing arm 148. The YZ direction shifts the transport path to transfer the electronic components to be tested/measured, increasing the complexity of the transport path and increasing equipment costs.
2．該輸送裝置14之第一入料載台143及第一出料載台144必需透過第一下壓臂147作Y-Z方向位移的移載，方可於第一入、出料載台143、144及測試裝置13間移載電性接點朝下的待測/已測之電子元件，以及第二入料載台145及第二出料載台146必需透過第二下壓臂148作Y-Z方向位移的移載，方可於第二入、出料載台145、146及測試裝置13間移載電性接點朝下的待測/已測之電子元件，因此不僅交換移載的次數較多，且造成交換移載的時間過長，而影響測試的產能。 2. The first loading stage 143 and the first discharging stage 144 of the conveying device 14 must be transferred by the first lower pressing arm 147 for displacement in the YZ direction, so as to be at the first inlet and outlet loading stages 143, 144. And the electronic component to be tested/measured with the electrical contact point facing down, and the second loading stage 145 and the second discharging stage 146 must pass through the second lower pressing arm 148 for the YZ direction. The shifting of the displacement can transfer the electronic components to be tested/tested with the electrical contacts facing down between the second loading and discharging stations 145, 146 and the testing device 13, so that not only the number of exchanges is compared More, and the exchange transfer time is too long, which affects the test capacity.
本發明之目的一，係提供一種電子元件測試分類機，其係於機台上配置有供料裝置、收料裝置、測試裝置、搬移裝置及中央控制裝置，該供料裝置係容納至少一電性接點朝上之待測電子元件，該收料裝置係容納至少一已測電子元件，該測試裝置係設有至少一對電子元件執行測試作業之測試器，該搬移裝置係以拾取器將供料裝置之待測電子元件移載於一承載器上，該承載器係設有作至少一方向位移之載具，並以載具載送一承置待測電子元件之治具至測試裝置處，該搬移裝置另設有至少一升降器，該升降器係帶動治具上升脫離載具，並使待測電子元件之電性接點與測試 裝置之測試器電性連接而執行測試作業，於測試完畢後，升降器則帶動治具下降置放於載具上，以供拾取器將治具上之已測電子元件移載至收料裝置處收置；藉此，可利用搬移裝置之承載器搭配升降器的移載及測試方式，使電性接點朝上之待測電子元件與測試裝置電性連接測試，毋需配置複數個作Y-Z方向位移之第一下壓臂及第二下壓臂，進而可簡化搬移裝置之元件及輸送路徑，達到節省成本之實用效益。 An object of the present invention is to provide an electronic component test sorting machine, which is provided with a feeding device, a receiving device, a testing device, a moving device and a central control device, and the feeding device is configured to accommodate at least one electric power. The electronic component to be tested with the contact point facing up, the receiving device is for accommodating at least one tested electronic component, and the testing device is provided with a test device for performing a test operation by at least one pair of electronic components, and the moving device is to be picked up by the picker The electronic component to be tested of the feeding device is transferred to a carrier, and the carrier is provided with a carrier for at least one direction displacement, and the carrier carries a fixture for mounting the electronic component to be tested to the testing device. Wherein, the moving device is further provided with at least one lifter, which drives the jig to rise off the carrier and electrically contact and test the electronic component to be tested. The tester of the device is electrically connected to perform the test operation. After the test is completed, the lifter drives the jig to be lowered and placed on the carrier, so that the picker can transfer the tested electronic component on the jig to the receiving device. At the same time, the carrier of the moving device can be used with the transfer and test mode of the lifter to electrically connect the electronic component to be tested with the electrical contact point up and the test device, and it is not necessary to configure a plurality of The first lower pressing arm and the second lower pressing arm in the YZ direction can simplify the components and conveying paths of the moving device, thereby achieving practical benefits of cost saving.
本發明之目的二，係提供一種電子元件測試分類機，其中，該搬移裝置之承載器係以載具將承置待測電子元件之治具載送對應於測試裝置，再利用升降器頂升具待測電子元件之治具脫離載具，使待測電子元件之電性接點與測試裝置電性連接而執行測試作業，於測試完畢後，升降器僅需將具已測電子元件之治具置放於載具，毋需透過複數個作Y-Z方向位移之第一下壓臂及第二下壓臂於承載器及測試裝置間轉送移載電子元件，以有效縮減搬移裝置之移載次數及作業時間，達到提升測試產能之實用效益。 A second object of the present invention is to provide an electronic component test sorting machine, wherein the carrier of the moving device carries a jig carrying the electronic component to be tested corresponding to the test device, and then lifts the lifter by using the lifter. The fixture with the electronic component to be tested is separated from the carrier, and the electrical contact of the electronic component to be tested is electrically connected to the test device to perform the test operation. After the test is completed, the lifter only needs to be treated with the tested electronic component. With the carrier placed, it is not necessary to transfer the transfer electronic components between the carrier and the test device through a plurality of first lower pressing arms and second lower pressing arms for YZ displacement, so as to effectively reduce the number of transfer times of the moving device. And working time, to achieve the practical benefits of improving test capacity.
10‧‧‧機台 10‧‧‧ machine
11‧‧‧供料裝置 11‧‧‧Feeding device
12‧‧‧收料裝置 12‧‧‧ Receiving device
13‧‧‧測試裝置 13‧‧‧Testing device
131‧‧‧測試座 131‧‧‧ test seat
14‧‧‧輸送裝置 14‧‧‧Conveyor
141‧‧‧入料移載臂 141‧‧‧Feed transfer arm
142‧‧‧出料移載臂 142‧‧‧Drawing transfer arm
143‧‧‧第一入料載台 143‧‧‧First feeding platform
144‧‧‧第一出料載台 144‧‧‧First discharge stage
145‧‧‧第二入料載台 145‧‧‧Second feeding platform
146‧‧‧第二出料載台 146‧‧‧Second discharge platform
147‧‧‧第一下壓臂 147‧‧‧First lower arm
148‧‧‧第二下壓臂 148‧‧‧Second lower arm
20‧‧‧機台 20‧‧‧ machine
201‧‧‧第一通孔 201‧‧‧ first through hole
202‧‧‧第二通孔 202‧‧‧Second through hole
30‧‧‧供料裝置 30‧‧‧Feeding device
31‧‧‧供料承置器 31‧‧‧Feeder
40‧‧‧收料裝置 40‧‧‧Receiving device
41‧‧‧收料承置器 41‧‧‧Receipt receiver
50‧‧‧測試裝置 50‧‧‧Testing device
51‧‧‧第一測試電路板 51‧‧‧First test board
52‧‧‧第一傳輸件 52‧‧‧First transmission
53‧‧‧第二測試電路板 53‧‧‧Second test circuit board
54‧‧‧第二傳輸件 54‧‧‧second transmission
60‧‧‧空匣裝置 60‧‧‧air equipment
70‧‧‧搬移裝置 70‧‧‧moving device
71‧‧‧第一拾取器 71‧‧‧First picker
72‧‧‧第二拾取器 72‧‧‧Second Picker
73‧‧‧第一承載器 73‧‧‧First carrier
731‧‧‧第一驅動源 731‧‧‧First drive source
732‧‧‧第一載具 732‧‧‧First Vehicle
7321‧‧‧第一定位件 7321‧‧‧First positioning piece
733‧‧‧第一治具 733‧‧‧First fixture
7331‧‧‧第一容置槽 7331‧‧‧First accommodating slot
7332‧‧‧第一定位孔 7332‧‧‧First positioning hole
7333‧‧‧第一卡抵孔 7333‧‧‧The first card is in the hole
74‧‧‧第一升降器 74‧‧‧First lifter
741‧‧‧第二驅動源 741‧‧‧Second drive source
742‧‧‧第一承板 742‧‧‧First board
743‧‧‧第一頂移件 743‧‧‧First top moving piece
7431‧‧‧第一頂掣部 7431‧‧‧The first top part
75‧‧‧移盤器 75‧‧‧Shifter
76‧‧‧第二承載器 76‧‧‧Second carrier
761‧‧‧第三驅動源 761‧‧‧ third drive source
762‧‧‧第二載具 762‧‧‧second vehicle
7621‧‧‧第二定位件 7621‧‧‧Second positioning parts
763‧‧‧第二治具 763‧‧‧Second fixture
7631‧‧‧第二容置槽 7631‧‧‧Second accommodating slot
7632‧‧‧第二定位孔 7632‧‧‧Second positioning hole
7633‧‧‧第二卡抵孔 7633‧‧‧Second card hole
77‧‧‧第二升降器 77‧‧‧Second lifter
771‧‧‧第四驅動源 771‧‧‧fourth drive source
772‧‧‧第二承板 772‧‧‧Second board
773‧‧‧第二頂移件 773‧‧‧Second top piece
7731‧‧‧第二頂掣部 7731‧‧‧Second top
81、82、83‧‧‧電子元件 81, 82, 83‧‧‧ Electronic components
第1圖：習知台灣發明第I 468329號專利案之測試設備的示意圖。 Fig. 1: Schematic diagram of a test apparatus of the Japanese Patent No. I 468329.
第2圖：本發明電子元件測試分類機第一實施例之架構示意圖。 Fig. 2 is a schematic view showing the structure of the first embodiment of the electronic component test sorting machine of the present invention.
第3圖：係第一實施例測試裝置及搬移裝置之局部示意圖。 Fig. 3 is a partial schematic view showing the test device and the transfer device of the first embodiment.
第4圖：本發明第一實施例之作動示意圖(一)。 Fig. 4 is a schematic view (1) of the operation of the first embodiment of the present invention.
第5圖：本發明第一實施例之作動示意圖(二)。 Fig. 5 is a schematic view showing the operation of the first embodiment of the present invention (2).
第6圖：本發明第一實施例之作動示意圖(三)。 Figure 6 is a schematic view (3) of the operation of the first embodiment of the present invention.
第7圖：本發明第一實施例之作動示意圖(四)。 Fig. 7 is a schematic view showing the operation of the first embodiment of the present invention (4).
第8圖：本發明第一實施例之作動示意圖(五)。 Fig. 8 is a schematic view showing the operation of the first embodiment of the present invention (5).
第9圖：本發明電子元件測試分類機第二實施例之架構示意圖。 Figure 9 is a block diagram showing the structure of the second embodiment of the electronic component test sorting machine of the present invention.
第10圖：係第二實施例測試裝置及搬移裝置之局部示意圖。 Fig. 10 is a partial schematic view showing the test device and the transfer device of the second embodiment.
第11圖：本發明第二實施例之作動示意圖(一)。 Figure 11 is a schematic view (1) of the operation of the second embodiment of the present invention.
第12圖：本發明第二實施例之作動示意圖(二)。 Fig. 12 is a schematic view showing the operation of the second embodiment of the present invention (2).
第13圖：本發明第二實施例之作動示意圖(三)。 Figure 13 is a schematic view (3) of the operation of the second embodiment of the present invention.
第14圖：本發明第二實施例之作動示意圖(四)。 Figure 14 is a schematic view showing the operation of the second embodiment of the present invention (4).
第15圖：本發明第二實施例之作動示意圖(五)。 Figure 15 is a schematic view showing the operation of the second embodiment of the present invention (5).
第16圖：本發明第二實施例之作動示意圖(六)。 Figure 16 is a schematic view showing the operation of the second embodiment of the present invention (6).
第17圖：本發明第二實施例之作動示意圖(七)。 Figure 17 is a schematic view showing the operation of the second embodiment of the present invention (7).
第18圖：本發明第二實施例之作動示意圖(八)。 Figure 18 is a schematic view showing the operation of the second embodiment of the present invention (VIII).
第19圖：本發明第二實施例之作動示意圖(九)。 Figure 19 is a schematic view showing the operation of the second embodiment of the present invention (9).
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如後： In order to make the reviewer further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, as follows:
請參閱第2、3圖，係本發明第一實施例之測試分類機，其係於機台20上配置有供料裝置30、收料裝置40、測試裝置50、空匣裝置60、搬移裝置70及中央控制裝置(圖未示出)，該供料裝置30係設有至少一供料承置器31，用以容納至少一電性接點朝上之待測電子元件，於本實施例中，該供料承置器31係為料盤，以容納複數個電性接點朝上之待測電子元件；該收料裝置40係設有至少一收料承置器41，用以容納至少一已測之電子元件，於本實施例中，該收料承置器41係為料盤，以容納複數個已測之電子元件；該測試裝置50係設有至少一測試器，並以測試器對電性接點朝上之電子元件執行測試作業，於本實施例中，該測試器係具有第一測試電路板51及複數個為探針之第一傳輸件52，以對電性接點朝上之電子元件執行測試作業；該空匣裝置60係用以收納至少一空的料盤，並將空的料盤補置於收料裝置40處，於本實施例中，係接收該供料裝置30處的空料盤，並將空料盤補置於收料裝置40處；該搬移裝置70係設有至少一拾取器、至少一承載器及至少一升降器，該至少一拾取器係用以移載電子元件，於本實施例中，搬移裝置70係設有第一拾取器71及第二拾取器72，該第一拾取器71係作第一、二、三方向(如X、Y、Z方向)位移，用以移出供料裝置30處電性接點朝上之待測電子元件，該第二拾取器72係作X-Y-Z方向位移，用以將已測之電子元件移入收料裝置40，又該至少一承載器係設有作至少一方向位移之載具，該載具上裝配有至少一承置電子元件之治具，該治具係設有 吸嘴或容置槽而承置電子元件，於本實施例中，搬移裝置70係於機台20上設有第一承載器73，第一承載器73係設有作X方向配置之第一驅動源731，該第一驅動源731係帶動一第一載具732作X方向位移，第一載具732上裝配有具複數個第一容置槽7331之第一治具733，各第一容置槽7331係承置電性接點朝上之電子元件，另於第一治具733與第一載具732間係設有第一定位結構，該第一定位結構係設有至少一定位件，用以將第一治具733定位於第一載具732上，於本實施例中，第一定位結構係於第一載具732上凸設有複數個為定位梢之第一定位件7321，並於第一治具733上設有供第一定位件7321嵌入之第一定位孔7332，以防止第一治具733於第一載具732上任意位移，使第一載具732帶動第一治具733作X方向位移，第一治具733可供第一拾取器71移入電性接點朝上之待測電子元件，並供第二拾取器72取出電性接點朝上之已測電子元件，該至少一升降器係用以帶動承載器之治具上升，使治具上待測之電子元件與測試裝置50電性連接而執行測試作業，於測試完畢後，升降器係帶動治具下降且置放於載具上，其中，該搬移裝置70係於機台20開設有至少一第一通孔201，於本實施例中，係於機台20開設有複數個第一通孔201，並於機台20之下方配置有第一升降器74，該第一升降器74係設有第二驅動源741，以帶動一第一承板742作Z方向位移，該第一承板742上相對應第一通孔201之位置設有至少一第一頂移件743，於本實施例中，該第一承板742上相對應複數個第一通孔201之位置設有複數個第一頂移件743，第一頂移件743係設有呈錐狀之第一頂掣部7431，另於第一治具733上開設有至少一第一卡抵孔7333，以供第一頂移件743頂抵而帶動作Z方向位移，於本實施例中，第一治具733上開設有複數個第一卡抵孔7333，另該搬移裝置70係設有至少一移盤器75，用以將供料裝置30處的空料盤移載至空匣裝置60，並將空匣裝置60處之空料盤補置於收料裝置40。 Referring to Figures 2 and 3, a test sorting machine according to a first embodiment of the present invention is provided with a feeding device 30, a receiving device 40, a testing device 50, an open device 60, and a moving device. And a central control device (not shown), the feeding device 30 is provided with at least one feeding device 31 for accommodating at least one electronic component to be tested with the electrical contact facing upward, in this embodiment The feeding device 31 is a tray for accommodating a plurality of electronic components to be tested with the electrical contacts facing upward; the receiving device 40 is provided with at least one receiving device 41 for receiving In the present embodiment, the receiving device 41 is a tray for accommodating a plurality of tested electronic components; the testing device 50 is provided with at least one tester, and The tester performs a test operation on the electronic component with the electrical contacts facing upwards. In this embodiment, the tester has a first test circuit board 51 and a plurality of first transmission members 52 as probes to electrically Performing a test operation on the electronic component with the contact point upward; the open device 60 is for accommodating at least one empty tray, and The empty tray is replenished at the receiving device 40. In the present embodiment, the empty tray at the feeding device 30 is received, and the empty tray is replenished at the receiving device 40; the moving device 70 At least one picker, at least one carrier and at least one lifter are provided, wherein the at least one picker is used for transferring electronic components. In the embodiment, the transfer device 70 is provided with a first picker 71 and a The second picker 72 is configured to be displaced in the first, second, and third directions (eg, X, Y, and Z directions) for removing the electronic component to be tested with the electrical contact point of the feeding device 30 facing upward. The second picker 72 is configured to be displaced in the XYZ direction for moving the measured electronic component into the receiving device 40, and the at least one carrier is provided with a carrier for at least one direction displacement, and the carrier is assembled There is at least one fixture for mounting electronic components, and the fixture is provided In the present embodiment, the transfer device 70 is provided with a first carrier 73 on the machine table 20, and the first carrier 73 is provided with the first configuration in the X direction. a driving source 731, the first driving source 731 drives a first carrier 732 for X-direction displacement, and the first carrier 732 is equipped with a first fixture 733 having a plurality of first receiving slots 7331, each first The accommodating slot 7331 is configured to receive an electronic component with an electrical contact upward, and a first positioning structure is disposed between the first jig 733 and the first carrier 732, and the first positioning structure is provided with at least one positioning. The first positioning structure is embossed on the first carrier 732 by a plurality of first positioning members for positioning the protrusions. And a first positioning hole 7332 for the first positioning member 7321 to be embedded on the first fixture 733 to prevent the first fixture 733 from being arbitrarily displaced on the first carrier 732, so that the first carrier 732 is driven. The first jig 733 is displaced in the X direction, and the first jig 733 is adapted to move the first picker 71 into the electronic component to be tested with the electrical contact facing upward, and for the second picking 72. The electronic component with the electrical contact point upward is taken out, and the at least one lifter is used to drive the fixture of the carrier to rise, so that the electronic component to be tested on the fixture is electrically connected to the testing device 50 to perform the test operation. After the test is completed, the lifter lowers the fixture and places it on the carrier. The shifting device 70 is provided with at least one first through hole 201 in the machine 20, which is in this embodiment The machine 20 is provided with a plurality of first through holes 201, and a first lifter 74 is disposed below the machine 20, and the first lifter 74 is provided with a second drive source 741 for driving a first carrier. 742 is a Z-direction displacement, and the first carrier 742 is provided with at least one first displacement member 743 at a position corresponding to the first through hole 201. In this embodiment, the first carrier 742 has a plurality of corresponding ones. The first through hole 201 is provided with a plurality of first top moving members 743. The first top moving member 743 is provided with a first top ram portion 7431 which is tapered, and at least one of the first jig 733 is opened. The first card abuts the hole 7333 so that the first top moving member 743 abuts and the belt moves in the Z direction. In this embodiment, the first jig 733 A plurality of first card abutting holes 7333 are provided in the upper opening, and the moving device 70 is provided with at least one shifting device 75 for transferring the empty tray at the feeding device 30 to the open device 60, and is empty. The empty tray at the crucible device 60 is replenished to the receiving device 40.
請參閱第4圖，該第一實施例之測試分類機於作動時，該搬移裝置70之第一拾取器71係作X-Y-Z方向位移至供料裝置30 處，並於供料承置器31內取出電性接點朝上之待測電子元件81，由於第一承載器73之第一驅動源731已帶動第一載具732及第一治具733作X方向位移至入料位置，該第一拾取器71係將電性接點朝上之待測電子元件81移載至第一承載器73處，並置入於第一治具733之第一容置槽7331。 Referring to FIG. 4, when the test sorter of the first embodiment is actuated, the first picker 71 of the transporting device 70 is displaced in the X-Y-Z direction to the feeding device 30. And the electronic component 81 to be tested with the electrical contact point facing upward is taken out in the feeding and receiving device 31, and the first driving source 731 of the first carrier 73 has driven the first carrier 732 and the first jig 733. The X-direction is displaced to the feeding position, and the first pick-up 71 transfers the electronic component 81 with the electrical contact point upward to the first carrier 73, and is placed in the first fixture 733. A receiving slot 7331.
請參閱第5、6圖，於第一治具733承載電性接點朝上之待測電子元件81後，第一承載器73之第一驅動源731係帶動第一載具732及第一治具733作X方向位移至升降位置，令第一治具733位於測試裝置50與第一升降器74之間，使待測電子元件81之電性接點對應於測試裝置50之第一傳輸件52，以及使第一治具733之第一卡抵孔7333對應於第一升降器74之第一頂移件743，接著該第一升降器74係以第二驅動源741帶動第一承板742及第一頂移件743作Z方向上升位移，第一頂移件743係穿伸出機台20之第一通孔201，由於第一頂移件743之第一頂掣部7431係大於第一治具733之第一卡抵孔7333，第一升降器74即可利用第一頂移件743之第一頂掣部7431頂抵於第一治具733之第一卡抵孔7333，而帶動具電性接點朝上待測電子元件81之第一治具733作Z方向上升位移，並脫離第一載具732，令第一治具733上之待測電子元件81以電性接點朝上的方式與測試裝置50之第一傳輸件52電性連接而執行測試作業，測試裝置50之第一測試電路板51係將測試資料傳輸至中央控制裝置，中央控制裝置係依據測試資料判斷電子元件之品質。 Referring to FIG. 5 and FIG. 6 , after the first jig 733 carries the electronic component 81 to be tested with the electrical contact point upward, the first driving source 731 of the first carrier 73 drives the first carrier 732 and the first The jig 733 is displaced to the lifting position in the X direction, so that the first jig 733 is located between the testing device 50 and the first lifter 74, so that the electrical contact of the electronic component 81 to be tested corresponds to the first transmission of the testing device 50. The member 52, and the first card abutment hole 7333 of the first jig 733 corresponds to the first top member 743 of the first lifter 74, and then the first lifter 74 drives the first bearing with the second drive source 741 The plate 742 and the first top moving member 743 are up-displaced in the Z direction, and the first top moving member 743 is threaded through the first through hole 201 of the extending table 20, because the first top portion 7431 of the first top moving member 743 is The first card lift hole 7333 is larger than the first card abutment hole 7333 of the first jig 733, and the first top lifter 741 can be used to abut the first card abutment hole 7333 of the first jig 733. And driving the first fixture 733 with the electrical contact point up to the electronic component 81 to be tested for the Z-direction upward displacement, and disengaging from the first carrier 732, so that the electronic device to be tested on the first jig 733 The component 81 is electrically connected to the first transmission member 52 of the testing device 50 to perform a test operation. The first test circuit board 51 of the testing device 50 transmits the test data to the central control device. The control device determines the quality of the electronic component based on the test data.
請參閱第7圖，於測試完畢後，該第一升降器74係以第二驅動源741帶動第一承板742及第一頂移件743作Z方向下降位移，第一頂移件743即頂置具已測電子元件81之第一治具733下降位移，並將第一治具733置放於第一載具732上，第一載具732係利用第一定位件7321***於第一治具733之第一定位孔7332，而將第一治具733定位，接著第一升降器74之第二驅動源741持續帶動第一承板742及第一頂移件743作Z方向下降位移復位，令第一頂移件743脫離第一治具733之第一卡抵孔7333，以利第一治具 733作X方向位移。 Referring to FIG. 7 , after the test is completed, the first lifter 74 drives the first carrier 742 and the first displacement member 743 to be displaced in the Z direction by the second driving source 741, and the first displacement member 743 is The first jig 733 with the measured electronic component 81 is placed at a lower displacement, and the first jig 733 is placed on the first carrier 732. The first carrier 732 is inserted into the first device by using the first positioning member 7321. The first positioning hole 733 of the jig 733 is positioned, and the first jig 733 is positioned, and then the second driving source 741 of the first lifting device 74 continues to drive the first bearing plate 742 and the first lifting member 743 to perform a Z-direction downward displacement. Resetting, the first top moving member 743 is disengaged from the first card abutting hole 7333 of the first jig 733 to facilitate the first jig 733 is displaced in the X direction.
請參閱第8圖，該第一承載器73之第一驅動源731係帶動第一載具732及第一治具733作X方向位移至出料位置，使第一治具733輸出電性接點朝上之已測電子元件81，該第二拾取器72係作X-Y-Z方向位移至第一承載器73處，並於第一承載器73之第一治具733內取出電性接點朝上之已測電子元件81，並依測試結果，將已測之電子元件81移載收料裝置40處，並置入於收料承置器41而分類收置。 Referring to FIG. 8 , the first driving source 731 of the first carrier 73 drives the first carrier 732 and the first jig 733 to be displaced in the X direction to the discharging position, so that the first jig 733 outputs electrical connection. The measured electronic component 81 is turned up, and the second picker 72 is displaced in the XYZ direction to the first carrier 73, and the electrical contact is taken up in the first jig 733 of the first carrier 73. According to the test result, the tested electronic component 81 is transferred to the receiving device 40, and placed in the receiving device 41 for sorting and storage.
請參閱第9、10圖，係本發明第二實施例之測試分類機，其係於機台20上配置有供料裝置30、收料裝置40、測試裝置50、空匣裝置60、搬移裝置70及中央控制裝置(圖未示出)，由於供料裝置30、收料裝置40及空匣裝置60係相同於第一實施例，故不予贅述，該第二實施例之測試裝置50除具有相同於第一實施例第一測試器之第一測試電路板51及第一傳輸件52外，並增設有第二測試器，該第二測試器具有第二測試電路板53及複數個為探針之第二傳輸件54，以對電性接點朝上之電子元件執行測試作業，另該搬移裝置70除具有相同於第一實施例之第一拾取器71、第二拾取器72、第一承載器73、第一升降器74及移盤器75外，並增設有第二承載器76及第二升降器77，第二承載器76係設有作X方向配置之第三驅動源761，該第三驅動源761係帶動一第二載具762作X方向位移，第二載具762上裝配有具複數個第二容置槽7631之第二治具763，各第二容置槽7631係承置電性接點朝上之電子元件，另於第二治具763與第二載具762間係設有第二定位結構，該第二定位結構係於第二載具762上凸設有複數個第二定位件7621，並於第二治具763相對應第二定位件7621之位置設有相互配合之第二定位孔7632，該搬移裝置70係於機台20開設有複數個第二通孔202，並於機台20之下方配置有第二升降器77，該第二升降器77係設有第四驅動源771，以帶動一第二承板772作Z方向位移，該第二承板772上相對應第二通孔202之位置設有第二頂移件773，第二頂移件773係設有呈錐狀之第二頂掣部77 31，另於第二治具763上開設有第二卡抵孔7633，以供第二頂移件773頂抵而帶動作Z方向位移。 Referring to Figures 9 and 10, a test sorting machine according to a second embodiment of the present invention is provided with a feeding device 30, a receiving device 40, a testing device 50, an open device 60, and a moving device. 70 and the central control device (not shown), since the feeding device 30, the receiving device 40 and the open device 60 are the same as in the first embodiment, the description is not repeated, and the testing device 50 of the second embodiment is The first test circuit board 51 and the first transmission member 52 are identical to the first tester of the first embodiment, and a second tester is provided. The second tester has a second test circuit board 53 and a plurality of The second transmitting member 54 of the probe performs a testing operation on the electronic component with the electrical contacts facing upward, and the moving device 70 has the same first picker 71 and second picker 72 as the first embodiment. The first carrier 73, the first lifter 74 and the shifter 75 are externally provided with a second carrier 76 and a second lifter 77. The second carrier 76 is provided with a third drive source configured in the X direction. 761, the third driving source 761 drives a second carrier 762 for X-direction displacement, and the second carrier 762 is loaded with There is a second jig 763 having a plurality of second accommodating grooves 7631. Each of the second accommodating grooves 7631 is an electronic component with an electrical contact upward, and a second jig 763 and a second carrier 762. The second positioning structure is provided with a plurality of second positioning members 7621 protruding from the second carrier 762, and is disposed at a position corresponding to the second positioning member 7621 of the second jig 763. There is a second positioning hole 7632 that cooperates with each other. The moving device 70 is provided with a plurality of second through holes 202 in the machine table 20, and a second lifter 77 is disposed below the machine table 20. The second lifter 77 is disposed. A fourth driving source 771 is disposed to drive a second carrier 772 for displacement in the Z direction, and a second displacement member 773 is disposed on the second carrier 772 corresponding to the second through hole 202. The moving member 773 is provided with a second top portion 77 having a tapered shape. 31. A second card abutting hole 7633 is further disposed on the second jig 763 for the second top moving member 773 to abut against the belt Z in the Z direction.
請參閱第11圖，該第二實施例之測試分類機於作動時，該搬移裝置70之第一拾取器71係作X-Y-Z方向位移至供料裝置30處，並於供料承置器31內取出電性接點朝上之待測電子元件81，由於第一承載器73之第一驅動源731已帶動第一載具732及第一治具733作X方向位移至入料位置，該第一拾取器71係將電性接點朝上之待測電子元件81移載至第一承載器73處，並置入於第一治具733之第一容置槽7331。 Referring to FIG. 11 , when the test sorting machine of the second embodiment is actuated, the first picker 71 of the moving device 70 is displaced to the feeding device 30 in the XYZ direction and is in the feeding device 31 . The electronic component 81 to be tested with the electrical contact point upward is taken out. Since the first driving source 731 of the first carrier 73 has driven the first carrier 732 and the first jig 733 to be displaced in the X direction to the feeding position, the first A pick-up device 71 transfers the electronic component 81 to be tested with the electrical contact point upward to the first carrier 73, and is placed in the first receiving groove 7331 of the first jig 733.
請參閱第12、13圖，於第一治具733承載電性接點朝上之待測電子元件81後，第一承載器73係以第一驅動源731帶動第一載具732及第一治具733作X方向位移至升降位置，使第一治具733位於測試裝置50之第一傳輸件52及第一升降器74之間，該第一升降器74係以第二驅動源741帶動第一承板742及第一頂移件743作Z方向上升位移，第一頂移件743係穿伸出機台20之第一通孔201，並利用第一頂移件743之第一頂掣部7431頂抵於第一治具733之第一卡抵孔7333，而帶動具電性接點朝上待測電子元件81之第一治具733作Z方向上升位移，使第一治具733脫離第一載具732，並令第一治具733上之待測電子元件81以電性接點朝上的方式與測試裝置50之第一傳輸件52電性連接而執行測試作業，測試裝置50之第一測試電路板51係將測試資料傳輸至中央控制裝置，中央控制裝置係依據測試資料判斷電子元件之品質；此時，該搬移裝置70之第一拾取器71係作X-Y-Z方向位移於供料裝置30處取出下一電性接點朝上之待測電子元件82，並將下一待測之電子元件82移載至第二承載器76處，且置入於第二治具763之第二容置槽7631。 Referring to FIG. 12 and FIG. 13 , after the first jig 733 carries the electronic component 81 to be tested with the electrical contact point upward, the first carrier 73 drives the first carrier 732 and the first by the first driving source 731 . The jig 733 is displaced to the lifting position in the X direction, so that the first jig 733 is located between the first transporting member 52 of the testing device 50 and the first lifter 74, and the first lifter 74 is driven by the second driving source 741. The first bearing plate 742 and the first lifting member 743 are up-displaced in the Z direction, and the first lifting member 743 is threaded through the first through hole 201 of the extending table 20, and the first top of the first lifting member 743 is utilized. The top portion 7431 is abutted against the first card abutment hole 7333 of the first jig 733, and the first jig 733 with the electrical contact point facing the electronic component 81 to be tested is moved upward in the Z direction to make the first jig The 733 is separated from the first carrier 732, and the electronic component 81 to be tested on the first jig 733 is electrically connected to the first transmission member 52 of the testing device 50 to perform a test operation, and the test is performed. The first test circuit board 51 of the device 50 transmits the test data to the central control device, and the central control device determines the electronic component based on the test data. At this time, the first picker 71 of the moving device 70 is displaced in the XYZ direction at the feeding device 30 to take out the electronic component 82 to be tested with the next electrical contact facing upward, and the next electronic component to be tested The component 82 is transferred to the second carrier 76 and placed in the second receiving slot 7631 of the second jig 763.
請參閱第14、15、16圖，於電子元件81測試完畢後，該第一升降器74係以第二驅動源741帶動第一承板742及第一頂移件743作Z方向下降位移，令第一頂移件743頂置第一治具733置放於第一載具732上，第一頂移件743再脫離第一治具733之第一 卡抵孔7333；接著該第一承載器73之第一驅動源731係帶動第一載具732及第一治具733作X方向位移至出料位置，使第一治具733輸出電性接點朝上之已測電子元件81，該第二拾取器72係作X-Y-Z方向位移至第一承載器73處，並於第一承載器73之第一治具733內取出電性接點朝上之已測電子元件81，此時，該第二承載器76之第三驅動源761係帶動第二載具762及第二治具763作X方向位移至升降位置，使第二治具763位於測試裝置50之第二傳輸件54及第二升降器77之間，該第二升降器77係以第四驅動源771帶動第二承板772及第二頂移件773作Z方向上升位移，第二頂移件773係穿伸出機台20之第二通孔202，並利用第二頂移件773之第二頂掣部7731頂抵於第二治具763之第二卡抵孔7633，而帶動具電性接點朝上待測電子元件82之第二治具763作Z方向上升位移，使第二治具763脫離第二載具762，並令第二治具763上之待測電子元件82以電性接點朝上的方式與測試裝置50之第二傳輸件54電性連接而執行測試作業，測試裝置50之第二測試電路板53係將測試資料傳輸至中央控制裝置，中央控制裝置係依據測試資料判斷電子元件之品質。 Referring to Figures 14, 15, and 16, after the electronic component 81 is tested, the first lifter 74 drives the first carrier 742 and the first displacement member 743 to perform a Z-direction downward displacement by the second driving source 741. The first top moving member 743 is placed on the first carrier 732, and the first top moving member 743 is further separated from the first jig 733. The first fixture 731 of the first carrier 73 drives the first carrier 732 and the first fixture 733 to be displaced in the X direction to the discharge position, so that the first fixture 733 is electrically connected. The measured electronic component 81 is turned up, and the second picker 72 is displaced in the XYZ direction to the first carrier 73, and the electrical contact is taken up in the first jig 733 of the first carrier 73. The measured electronic component 81, at this time, the third driving source 761 of the second carrier 76 drives the second carrier 762 and the second jig 763 to be displaced in the X direction to the lifting position, so that the second jig 763 is located. Between the second transmission member 54 and the second elevator 77 of the testing device 50, the second elevator 77 drives the second carrier 772 and the second displacement member 773 to move up in the Z direction. The second movement member 773 is inserted through the second through hole 202 of the second table 773, and the second top portion 7731 of the second movement member 773 is used to abut the second card hole 7363 of the second jig 763. And driving the second fixture 763 with the electrical contact point up to the electronic component 82 to be tested for the Z-direction upward displacement, so that the second fixture 763 is separated from the second carrier 762, and the second The electronic component 82 to be tested on the 763 is electrically connected to the second transmission member 54 of the testing device 50 to perform a test operation, and the second test circuit board 53 of the testing device 50 is to test the data. It is transmitted to the central control unit, which determines the quality of the electronic components based on the test data.
請參閱第17圖，該第二拾取器72於第一承載器73之第一治具733內取出電性接點朝上之已測電子元件81後，係依測試結果，將已測之電子元件81移載收料裝置40處，並置入於收料承置器41而分類收置，該第一承載器73之第一治具733再作X方向位移至入料位置，以供第一拾取器71移入另一電性接點朝上之待測電子元件83。 Referring to FIG. 17, after the second picker 72 takes out the electronic component 81 with the electrical contact point upward in the first jig 733 of the first carrier 73, the measured electronic component is tested according to the test result. The component 81 is transferred to the receiving device 40 and placed in the receiving and receiving device 41 for sorting and accommodating. The first jig 733 of the first carrier 73 is further displaced in the X direction to the feeding position for the first A pickup 71 is moved into the electronic component 83 to be tested with the other electrical contact facing upward.
請參閱第18、19圖，於電子元件82測試完畢後，該第二升降器77係以第四驅動源771帶動第二承板772及第二頂移件773作Z方向下降位移，令第二頂移件773頂置第二治具763置放於第二載具762上，第二頂移件773再脫離第二治具763之第二卡抵孔7633，接著該第二承載器76之第三驅動源761係帶動第二載具762及第二治具763作X方向位移至出料位置，使第二治具763輸出電性接點朝上之已測電子元件82，以供第二拾取器72取料，第二拾取器72並依測試結果，將已測之電子元件82移載收料裝置40處分類 收置，此時，第一承載器73係載送另一電性接點朝上之待測電子元件83至測試裝置50處之第二測試器執行測試作業。 Referring to FIGS. 18 and 19, after the electronic component 82 is tested, the second lifter 77 drives the second carrier 772 and the second displacement member 773 to move in the Z direction by the fourth driving source 771. The second lifting member 773 is placed on the second carrier 762, and the second lifting member 773 is further separated from the second locking hole 7633 of the second jig 763, and then the second carrier 76 The third driving source 761 drives the second carrier 762 and the second jig 763 to be displaced in the X direction to the discharging position, so that the second jig 763 outputs the measured electronic component 82 with the electrical contact facing upwards. The second picker 72 takes the material, and the second picker 72 sorts the measured electronic components 82 from the receiving device 40 according to the test result. At the same time, the first carrier 73 carries the electronic device 83 with the other electrical contact point up to the second tester at the test device 50 to perform the test operation.
20‧‧‧機台 20‧‧‧ machine
201‧‧‧第一通孔 201‧‧‧ first through hole
50‧‧‧測試裝置 50‧‧‧Testing device
51‧‧‧第一測試電路板 51‧‧‧First test board
52‧‧‧第一傳輸件 52‧‧‧First transmission
73‧‧‧第一承載器 73‧‧‧First carrier
731‧‧‧第一驅動源 731‧‧‧First drive source
732‧‧‧第一載具 732‧‧‧First Vehicle
7321‧‧‧第一定位件 7321‧‧‧First positioning piece
733‧‧‧第一治具 733‧‧‧First fixture
7331‧‧‧第一容置槽 7331‧‧‧First accommodating slot
7332‧‧‧第一定位孔 7332‧‧‧First positioning hole
7333‧‧‧第一卡抵孔 7333‧‧‧The first card is in the hole
74‧‧‧第一升降器 74‧‧‧First lifter
741‧‧‧第二驅動源 741‧‧‧Second drive source
742‧‧‧第一承板 742‧‧‧First board
743‧‧‧第一頂移件 743‧‧‧First top moving piece
7431‧‧‧第一頂掣部 7431‧‧‧The first top part
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