TWI536013B - Calibration method for appearance inspection of electronic components - Google Patents
Calibration method for appearance inspection of electronic components Download PDFInfo
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- TWI536013B TWI536013B TW104108182A TW104108182A TWI536013B TW I536013 B TWI536013 B TW I536013B TW 104108182 A TW104108182 A TW 104108182A TW 104108182 A TW104108182 A TW 104108182A TW I536013 B TWI536013 B TW I536013B
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Description
本發明尤指其提供一種應用於取像器對電子元件的外觀檢測,並得以獲得該電子元件的實際外觀影像,藉以正確判斷該電子元件的外觀是否符合標準,進而達到有效提昇電子元件外觀檢測之準確性的取像校準方法。 In particular, the present invention provides an appearance detection of an electronic component applied to an image pickup device, and obtains an actual appearance image of the electronic component, thereby correctly determining whether the appearance of the electronic component conforms to a standard, thereby effectively improving the appearance detection of the electronic component. The accuracy of the image calibration method.
按,現今科技在不斷研發與創新下,以往必需由許多大型電子電路結合才能完成之工作已完全由積體電路(integrated circuit,簡稱IC)所取代,由於IC在生產過程中乃經過多道的加工程序,因此為了確保產品品質,業者於IC製作完成後,除了對內部電路進行電性測試作業外,也會進行外觀檢測作業。業界中常述及所謂5S的外觀檢測,通常是指對電子元件的五個面(除了被取放器吸附移載的頂面外)進行外觀檢測,以檢測電子元件於製程或移載的過程中,其電性接點的間距或長度是否符合標準,或電性接點是否破損、溢膠、沾污等,進而篩選出良好的電子元件,以淘汰出不良品。 According to the current research and development and innovation, the work that must be completed by many large-scale electronic circuits has been completely replaced by integrated circuits (ICs), because ICs are multi-channel in the production process. In order to ensure the quality of the product, the manufacturer will perform the appearance inspection work in addition to the electrical test of the internal circuit after the IC is completed. The appearance detection of the so-called 5S in the industry usually refers to the appearance inspection of the five faces of the electronic component (except the top surface of the pick-and-place device that is adsorbed and transferred) to detect the electronic component in the process of process or transfer. Whether the spacing or length of the electrical contacts meets the standard, or whether the electrical contacts are damaged, spilled, stained, etc., and then screen out good electronic components to eliminate defective products.
請參閱第1圖,習知電子元件的外觀檢測作業,係由取放器10將電子元件11移載至取像裝置20處進行取像,再透過控制器的分析比對,而判斷出是否為良品。其中該取像裝置20係於下方位置設有為CCD的取像器21,而可由下而上對電子元件11的底面進行取像,並透過控制器的分析比對,判斷出電子元件11的底面是否符合標準;另該取像裝置20於取像器21之上方架設有一鏡架22,並於該鏡架22的四個內周側分別裝設有折射取像之菱鏡23,由於該四個內周側之 菱鏡23可以顯現出電子元件11之四個側面的影像,因此當取像器21對該四個菱鏡23聚焦取像時,即可獲得該電子元件11之四個側面的影像,並透過控制器的分析比對,判斷出電子元件11的四個側面是否符合標準,進而篩選出良好的電子元件,以淘汰出不良品。然而這樣的取像方式會產生如下的缺弊: Referring to FIG. 1 , in the appearance inspection operation of the conventional electronic component, the electronic component 11 is transferred to the image capturing device 20 by the pick and place device 10 for image taking, and then analyzed by the controller to determine whether or not it is For good products. The image capturing device 20 is provided with an image pickup device 21 as a CCD at a lower position, and the bottom surface of the electronic component 11 can be imaged from bottom to top, and the analysis of the controller is performed to determine the electronic component 11 Whether the bottom surface meets the standard or not; the image capturing device 20 is provided with a frame 22 above the image capturing device 21, and the refracting mirror 23 is respectively mounted on the four inner circumferential sides of the frame 22, Four inner circumference sides The mirror 23 can display images of the four sides of the electronic component 11, so that when the image capturing device 21 focuses the image of the four prisms 23, the images of the four sides of the electronic component 11 can be obtained and transmitted through The analysis of the controller compares whether the four sides of the electronic component 11 meet the standard, and then screens out good electronic components to eliminate defective products. However, such an image capture method will have the following drawbacks:
1.由於取像器21在組裝架設後,會因組裝公差等因素而無法確保取得精準的垂直度,因此當對電子元件11的底面進行取像時,並不能精準的使取像器21與電子元件11的底面保持在正交方向,導致取像器21所獲得電子元件11之底面的外觀影像產生變形,而無法根據該變形之外觀影像正確判斷出電子元件11的底面是否符合標準,進而降低對電子元件外觀檢測的準確性。 1. Since the image pickup unit 21 cannot be assembled to achieve accurate verticality due to assembly tolerances and the like after assembly and erection, the image pickup 21 and the electronic component cannot be accurately positioned when the bottom surface of the electronic component 11 is imaged. The bottom surface of the substrate 11 is maintained in the orthogonal direction, which causes the appearance image of the bottom surface of the electronic component 11 obtained by the image pickup device 21 to be deformed, and it is impossible to correctly determine whether the bottom surface of the electronic component 11 conforms to the standard according to the deformed appearance image, thereby reducing the pair. The accuracy of the appearance of electronic components.
2.該折射取像之菱鏡23係分別裝設於鏡架22的四個內周側,由於組裝公差等因素而無法確保取得精準的取像角度,因此該折射取像之菱鏡23所顯現出電子元件11之四個側面的影像會產生變形,當取像器21對該四個菱鏡23聚焦取像時,並不能獲得電子元件11之四個側面的正確影像,而無法根據該變形之外觀影像正確判斷出電子元件11的四個側面是否符合標準,進而降低對電子元件外觀檢測的準確性。 2. The refracting image magnifying mirrors 23 are respectively mounted on the four inner peripheral sides of the frame 22, and it is impossible to ensure a precise image capturing angle due to assembly tolerances and the like, and thus the refracting image magnifying mirror 23 appears The image of the four sides of the electronic component 11 is deformed. When the image pickup unit 21 focuses the image on the four prisms 23, the correct image of the four sides of the electronic component 11 cannot be obtained, and the deformation cannot be performed according to the deformation. The appearance image correctly determines whether the four sides of the electronic component 11 conform to the standard, thereby reducing the accuracy of the appearance detection of the electronic component.
有鑑於此,本發明人遂以其多年從事相關行業的研發與製作經驗,針對目前所面臨之問題深入研究,經過長期努力之研究與試作,終究研創出一種可有效提昇電子元件外觀檢測準確性之取像校準方法,以有效改善先前技術之缺點,此即為本發明之設計宗旨。 In view of this, the inventor has been engaged in research and development and production experience of related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term efforts and research, he has finally developed an effective improvement of the appearance detection accuracy of electronic components. The image acquisition method is used to effectively improve the shortcomings of the prior art, which is the design tenet of the present invention.
本發明之目的,係提供一種電子元件外觀檢測之取像校準方法,其係於取像器之上方架設一具有精準水平度之鏡架,並於該鏡架之內周側裝設有至少一菱鏡,另成型一可精準架置於該鏡架之校準 治具,該校準治具並向下凸設有至少一具有精準垂直度之側面以及一具有精準水平度之底面,並於該側面及底面成型有呈陣列排列的取樣圖像,使該取像器可自下方對該底面之取樣圖像取像,並透過控制器的分析,獲得該取像器的取像誤差值,而以該取像誤差值調校取像器,接著再以該調校後之取像器對菱鏡顯現之側面的取樣圖像取像,並透過控制器的分析,獲得該菱鏡的投影誤差值,進而以該菱鏡的投影誤差值作為後續電子元件側面取像的補償值,而獲得該電子元件的實際外觀影像,並得以正確判斷該電子元件的外觀是否符合標準,達到有效提昇電子元件外觀檢測的準確性。 The object of the present invention is to provide an image capturing and calibrating method for visually detecting an appearance of an electronic component, which is provided with a frame having a precise level above the image capturing device, and at least one of the inner peripheral side of the frame is mounted on the inner side of the frame. Mirror, another form of precision can be placed on the frame calibration a fixture, the calibration fixture is provided with at least one side having precise perpendicularity and a bottom surface having a precise level, and a sample image arranged in an array is formed on the side surface and the bottom surface to make the image The image of the bottom surface of the image can be taken from below, and the image capturing error value of the image capturing device is obtained through analysis of the controller, and the image capturing device is adjusted by the image capturing error value, and then the image is adjusted. The post-camera imager takes image of the sampled image on the side of the mirror, and obtains the projection error value of the mirror through the analysis of the controller, and then uses the projection error value of the mirror as the side of the subsequent electronic component. The compensation value of the image is obtained, and the actual appearance image of the electronic component is obtained, and the appearance of the electronic component is correctly judged to conform to the standard, thereby effectively improving the accuracy of the appearance detection of the electronic component.
習知部份: Conventional part:
10‧‧‧取放器 10‧‧‧ picker
11‧‧‧電子元件 11‧‧‧Electronic components
20‧‧‧取像裝置 20‧‧‧Image capture device
21‧‧‧取像器 21‧‧‧Imager
22‧‧‧鏡架 22‧‧‧ frames
23‧‧‧菱鏡 23‧‧‧Ling Mirror
本發明部份: Part of the invention:
30‧‧‧機台 30‧‧‧ machine
31‧‧‧電子元件 31‧‧‧Electronic components
32‧‧‧取放器 32‧‧‧ picker
40‧‧‧取像裝置 40‧‧‧Image capture device
41‧‧‧取像器 41‧‧‧Imager
42‧‧‧鏡架 42‧‧‧ frames
421‧‧‧頂面 421‧‧‧ top surface
43‧‧‧菱鏡 43‧‧‧Ling Mirror
50‧‧‧校準治具 50‧‧‧ calibration fixture
51‧‧‧接抵面 51‧‧‧Contact
52‧‧‧取樣凸塊 52‧‧‧Sampling bumps
521‧‧‧側面 521‧‧‧ side
5211‧‧‧取樣圖像 5211‧‧‧Sampling image
522‧‧‧底面 522‧‧‧ bottom
5221‧‧‧取樣圖像 5221‧‧‧Sampling image
第1圖:習知外觀檢測之架構示意圖。 Figure 1: Schematic diagram of the structure of the conventional appearance inspection.
第2圖:本發明之流程示意圖。 Figure 2: Schematic diagram of the process of the present invention.
第3圖:本發明取像裝置之示意圖。 Figure 3 is a schematic view of the image taking device of the present invention.
第4圖:本發明校準治具之示意圖。 Figure 4: Schematic diagram of the calibration fixture of the present invention.
第5圖:本發明取像裝置對校準治具之底面取像的示意圖。 Fig. 5 is a schematic view showing the image taking of the bottom surface of the calibration jig by the image taking device of the present invention.
第6圖:本發明取像裝置對校準治具之側面取像的示意圖。 Fig. 6 is a schematic view showing the image taking by the image taking device of the present invention on the side of the calibration jig.
第7圖:本發明取像裝置對待測電子元件取像的示意圖。 Fig. 7 is a schematic view showing the image taking of the electronic component to be tested by the image taking device of the present invention.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉較佳實施例並配合圖式,詳述如后:請參閱第2、3圖,本發明電子元件外觀檢測之取像校準方法,首先第一步驟係架設取像裝置40;該取像裝置40係於機台30上設有一可調校之取像器41,於該取像器41之上方則架設一鏡架42,並使該鏡架42之頂面421具有精準的水平度,另於該鏡架42之內周側則裝設有至少一折射取像之菱鏡,於本實施例中, 係於該鏡架42之四個內周側分別裝設有菱鏡43,並使該取像器41可分別對該四個菱鏡43聚焦取像。 In order to make the present invention further understand the present invention, the preferred embodiment and the drawings are described in detail as follows: Please refer to FIGS. 2 and 3, the image capturing method for visual inspection of the electronic component of the present invention, firstly The first step is to set up the image capturing device 40. The image capturing device 40 is provided with an adjustable image capturing device 41 on the machine table 30. Above the image capturing device 41, a frame 42 is mounted. The top surface 421 of the frame 42 has a precise level, and the inner circumference side of the frame 42 is provided with at least one refracting image. In this embodiment, The prisms 43 are respectively attached to the four inner circumference sides of the frame 42, and the image pickup unit 41 can respectively focus and image the four prisms 43.
請參閱第2、4、5圖,接著第二步驟係成型一校準治具50;該校準治具50係概呈T型,並透過嚴謹的加工而成型有一具精準水平度之接抵面51,使該校準治具50可利用該接抵面51精準的架置於該鏡架42之頂面421,另該校準治具50係透過嚴謹的加工向下凸設有取樣凸塊52,而於校準治具50架置於該鏡架42時,使該取樣凸塊52穿置於該鏡架42內,其中,該取樣凸塊52係設有至少一具有精準垂直度之側面521以及一具有精準水平度之底面522,並於該側面521及底面522分別成型有呈陣列排列的取樣圖像5211、5221,於本實施例中,該取樣凸塊52係設有四個具有精準垂直度之側面521,該四個側面521之取樣圖像5211可以為複數個呈陣列排列且具有相同間距及尺寸的凹孔,或其他複數個呈陣列排列且具有相同間距及尺寸之規則形體,該取樣凸塊52之底面522的取樣圖像5221相同的亦可為複數個呈陣列排列且具有相同間距及尺寸的凹孔,或其他複數個呈陣列排列且具有相同間距及尺寸之規則形體。 Please refer to Figures 2, 4, and 5, and then the second step is to form a calibration fixture 50; the calibration fixture 50 is generally T-shaped, and has a precise level of contact surface 51 formed through rigorous processing. The calibration fixture 50 can be accurately placed on the top surface 421 of the frame 42 by using the contact surface 51, and the calibration fixture 50 is provided with a sampling bump 52 protruding downward through strict processing. When the calibration fixture 50 is placed on the frame 42 , the sampling protrusion 52 is placed in the frame 42 , wherein the sampling protrusion 52 is provided with at least one side 521 having precise perpendicularity and a The bottom surface 522 has a precise level, and the sampled images 5211 and 5221 arranged in an array are respectively formed on the side surface 521 and the bottom surface 522. In the embodiment, the sampling bumps 52 are provided with four precision vertical degrees. The side surface 521, the sample image 5211 of the four side surfaces 521 may be a plurality of concave holes arranged in an array and having the same pitch and size, or other plurality of regular shapes arranged in an array and having the same pitch and size, the sampling The sampled image 5221 of the bottom surface 522 of the bump 52 may also be the same One arranged in an array and having the same pitch and size of recesses or a plurality of other and arranged in an array having a regular pitch and the same dimensions of the molded article.
請參閱第2、5圖,接著第三步驟係調校取像裝置40之取像器41;其係將該校準治具50架置於該鏡架42,而由取像裝置40之取像器41對該校準治具50之底面522取像,由於該校準治具50成型有一具精準水平度之接抵面51,以及該鏡架42也具有精準水平度之頂面421,因此當校準治具50以接抵面51架置於鏡架42之頂面421時,仍可使該校準治具50穿置於該鏡架42內之取樣凸塊52的四個側面521保持其精準的垂直度,以及使校準治具50之取樣凸塊52的底面522仍保持其精準的水平度,接著取像器41自下方對該校準治具50之底面522的取樣 圖像5221取像,由於該取樣圖像5221的尺寸及間距等數據資料係已內建於控制器之資料庫,因此該取像器41對底面522之取樣圖像5221的取像影像可以透過控制器的分析比對,而獲得該取像器41對於該底面522之取樣圖像5221的取像誤差值,如前所述,該校準治具50之取樣凸塊52的底面522係保持其精準的水平度,因此該取像誤差值的產生可以歸因於取像器41架設的誤差問題,進而可直接以該取像誤差值調校取像器41,使該取像器41與取樣凸塊52的底面522調校保持在正交方向。 Please refer to FIG. 2 and FIG. 5, and then the third step is to adjust the image pickup device 41 of the image capturing device 40. The calibration fixture 50 is placed on the frame 42 and captured by the image capturing device 40. The camera 41 takes an image of the bottom surface 522 of the calibration fixture 50. Since the calibration fixture 50 is formed with a precise level of the abutting surface 51, and the frame 42 also has a top level 421 of precise level, when calibrating When the fixture 50 is placed on the top surface 421 of the frame 42 , the calibration fixture 50 can still be placed on the four sides 521 of the sampling bumps 52 in the frame 42 to maintain its accuracy. The verticality, and the bottom surface 522 of the sampling bump 52 of the calibration fixture 50, still maintains its precise level, and then the imager 41 samples the bottom surface 522 of the calibration fixture 50 from below. The image 5221 is imaged. Since the data of the size and the spacing of the sampled image 5221 is already built in the database of the controller, the image taken by the image capture device 41 on the sample image 5221 of the bottom surface 522 can be transmitted through the image. The analysis error of the controller is obtained, and the image capturing error value of the image of the image of the bottom surface 522 of the image pickup unit 41 is obtained. As described above, the bottom surface 522 of the sampling bump 52 of the calibration fixture 50 is maintained. Accurate level, so the generation of the image error value can be attributed to the error of the image finder 41, and the image finder 41 can be directly adjusted with the image error value, so that the image finder 41 and the sampler are sampled. The bottom surface 522 of the bump 52 is adjusted to remain in the orthogonal direction.
請參閱第2、6圖,接著第四步驟係計算取像裝置40之菱鏡43的投影誤差值;由於取像裝置40之取像器41已經完成調校,而與取樣凸塊52的底面522保持在正交方向,因此接著以該調校後之取像器41分別對四個菱鏡43取像,由於該四個菱鏡43可以顯現出取樣凸塊52之四個側面521的取樣圖像5211,因此當取像器41分別對該四個菱鏡43聚焦取像時,即可分別獲得該四個側面521之取樣圖像5211的取像影像,且由於該取樣圖像5211的尺寸及間距等數據資料係已內建於控制器之資料庫,因此該取像器41對四個側面521之取樣圖像5211的取像影像,可以透過控制器的分析比對,而分別獲得該四個菱鏡43對於該四個側面521之取樣圖像5211的投影誤差值,如前所述,由於該取像裝置40之取像器41已經完成調校,且該校準治具50之取樣凸塊52的四個側面521係保持其精準的垂直度,因此該投影誤差值的產生可以歸因於菱鏡43架設的誤差問題,但因該菱鏡43無法調校,而必須以補償計算的方式,才能獲得側面的實際外觀影像。 Referring to FIGS. 2 and 6, the fourth step is to calculate the projection error value of the mirror 43 of the image capturing device 40; since the image pickup 41 of the image capturing device 40 has been calibrated, and the bottom surface of the sampling bump 52 The 522 is held in the orthogonal direction, so that the four mirrors 43 are respectively imaged by the adjusted image pickup 41, since the four mirrors 43 can show the sampling of the four side faces 521 of the sampling bumps 52. The image 5211, so that when the image capturing device 41 respectively focuses the image on the four mirrors 43, the image of the image of the four sides 521 is obtained, and the image of the sampled image 5211 is obtained. The data of the size and the spacing are built into the database of the controller. Therefore, the image taken by the image capturing device 41 on the four sides 521 of the sampled image 5211 can be obtained through the analysis and comparison of the controller. The projection error value of the four mirrors 43 for the sampled image 5211 of the four sides 521 is as described above, since the imager 41 of the image capturing device 40 has been calibrated, and the calibration fixture 50 The four sides 521 of the sampling bump 52 maintain their precise perpendicularity, so the projection error Generating an error value may be attributed to problems of erecting prism 43, the prism 43 but can not be adjusted, and must be compensated is calculated in order to obtain the actual appearance of the image side surface.
請參閱第2、7圖,接著第五步驟係將電子元件31移入取像裝置40取像;如前所述,由於取像裝置40之取像器41已經完成調校,因此當取放器32將待檢測之電子元件31移入取像裝置 40取像時,取像器41可直接自下方對該電子元件31之底面取像,而獲得該電子元件31底面的實際外觀影像,由於該電子元件31之底面的標準影像資料係已內建於控制器之資料庫,因此可以透過控制器的分析比對,判斷出電子元件31之底面是否符合標準;接著當取像器41分別對四個菱鏡43聚焦取像時,可以將各菱鏡43所產生的投影誤差值分別補償於電子元件31之四個側面的取像影像,而獲得該電子元件31四個側面的實際外觀影像,由於該電子元件31之四個側面的標準影像資料係已內建於控制器之資料庫,因此可以透過控制器的分析比對,分別判斷出電子元件31之四個側面是否符合標準。 Referring to FIGS. 2 and 7, the fifth step is followed by moving the electronic component 31 into the image capturing device 40 for image capture; as described above, since the image pickup device 41 of the image capturing device 40 has been calibrated, the pick and place device is used. 32 moving the electronic component 31 to be detected into the image capturing device When the image is taken, the image capturing device 41 can directly take the image from the bottom surface of the electronic component 31 to obtain the actual appearance image of the bottom surface of the electronic component 31. Since the standard image data of the bottom surface of the electronic component 31 is built in. In the database of the controller, it is possible to determine whether the bottom surface of the electronic component 31 conforms to the standard through the analysis comparison of the controller; then, when the image capturing device 41 focuses on the four mirrors 43 respectively, each diamond can be The projection error values generated by the mirrors 43 are respectively compensated for the image of the four sides of the electronic component 31, and the actual appearance images of the four sides of the electronic component 31 are obtained, because the standard image data of the four sides of the electronic component 31 are obtained. It is built into the database of the controller, so it can be judged whether the four sides of the electronic component 31 meet the standard through the analysis comparison of the controller.
綜上說明,利用本發明的取像校準方法,顯然是可以獲得電子元件之底面及側面的實際外觀影像,並得以正確判斷該電子元件的外觀是否符合標準,進而達到有效提昇電子元件外觀檢測的準確性;據此,本發明實為一深具實用性及進步性之設計,然未見有相同之產品及刊物公開,從而允符發明專利申請要件,爰依法提出申請。 In summary, with the image capturing calibration method of the present invention, it is apparent that the actual appearance image of the bottom surface and the side surface of the electronic component can be obtained, and it is possible to correctly judge whether the appearance of the electronic component conforms to the standard, thereby effectively improving the appearance detection of the electronic component. Accuracy; accordingly, the present invention is a practical and progressive design, but there is no disclosure of the same product and publication, thereby allowing the invention patent application requirements, and applying according to law.
40‧‧‧取像裝置 40‧‧‧Image capture device
41‧‧‧取像器 41‧‧‧Imager
42‧‧‧鏡架 42‧‧‧ frames
43‧‧‧菱鏡 43‧‧‧Ling Mirror
50‧‧‧校準治具 50‧‧‧ calibration fixture
52‧‧‧取樣凸塊 52‧‧‧Sampling bumps
521‧‧‧側面 521‧‧‧ side
5211‧‧‧取樣圖像 5211‧‧‧Sampling image
522‧‧‧底面 522‧‧‧ bottom
5221‧‧‧取樣圖像 5221‧‧‧Sampling image
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