TWI535119B

TWI535119B - Pros and cons of two-sided joint of the electronic device and its manufacturing method

Info

Publication number: TWI535119B
Application number: TW100130945A
Authority: TW
Inventors: 蔡周賢
Original assignee: 蔡周賢
Priority date: 2011-03-31
Filing date: 2011-08-29
Publication date: 2016-05-21
Also published as: TW202324851A; TW201939825A; TW201703361A; TWI776289B; TW202139534A; TWI727248B; TWI648920B; TW201242180A

Description

正反雙面接頭之電子裝置及其製造方法 Electronic device for positive and negative double-sided joint and manufacturing method thereof

本發明係有關於一種電連接器，特別係指一種正反雙面接頭之電子裝置及其製造方法。 The present invention relates to an electrical connector, and more particularly to an electronic device for a front and back double-sided joint and a method of manufacturing the same.

現今電腦設備最普及的訊號傳輸規格莫過於通用序列匯流排(Universal Serial Bus，簡稱USB)，以此規格製作的連接器插座及傳輸線可使外接於電腦的周邊設備，如滑鼠、鍵盤、隨身碟等，即時為電腦所測得並立即使用。 The most popular signal transmission specification for today's computer equipment is the Universal Serial Bus (USB). The connector socket and transmission line made by this specification can be connected to the peripheral devices of the computer, such as the mouse, keyboard, and portable body. Dish, etc., instantly measured by the computer and used immediately.

目前USB母座及USB接頭皆為單向電連接，為了確保USB接頭***USB母座時能電連接，兩者在對接上具有防呆設計，即當USB接頭反向***時則無法***，使用者即會再換另一個方向***，方向正確了才能***，如此即可確保***後具有電連接。 At present, the USB female socket and the USB connector are all unidirectional electrical connections. In order to ensure electrical connection when the USB connector is inserted into the USB female socket, the two have a foolproof design on the docking, that is, when the USB connector is inserted in the reverse direction, it cannot be inserted and used. The person will insert another direction and insert it in the correct direction to ensure that there is an electrical connection after insertion.

目前USB有2.0及3.0兩種規格，請參閱圖1及圖2，係為現有之USB2.0規格且具有板片型接頭之碟身碟1，其設有一塑膠座體10及一電路板15，該電路板15後段為該塑膠座體10包覆，該電路板15前段僅一板面露出該塑膠座體10外，該板面設有一排四個接點16。 At present, USB has two specifications, 2.0 and 3.0. Please refer to FIG. 1 and FIG. 2, which is a conventional USB 2.0 specification and has a plate-type connector, which is provided with a plastic body 10 and a circuit board 15. The rear side of the circuit board 15 is covered by the plastic body 10. The front side of the circuit board 15 is only exposed by a board surface, and the board surface is provided with a row of four contacts 16.

請參閱圖3，係為現有之USB2.0規格之電連接母座20，其設有一金屬殼25及一舌片22，該金屬殼25內形成一連接槽21，該舌片22位於連接槽偏上位置，該舌片僅下面設有一排4個接點23，該金屬殼25之頂面及底面各沖壓凸出二個彈片24。 Referring to FIG. 3 , it is an existing USB 2.0 specification electrical connection base 20 , which is provided with a metal shell 25 and a tongue 22 . The metal shell 25 defines a connecting slot 21 , and the tongue 22 is located in the connecting slot. In the upper position, the tongue is only provided with a row of four contacts 23 underneath, and the top surface and the bottom surface of the metal shell 25 are stamped and protruded from the two elastic pieces 24.

請參閱圖4，在使用上，該隨身碟1必需接點16朝上***連接槽21才可與位於該舌片22下面之一排接點23電連接，該四個彈片24係抵緊該碟身碟1；該碟身碟1若是反面***連接槽21則無法電連接，使用者通常是隨機***，故插不進去之機率是1/2，故常常是插兩次，造成使用上之不便。 Referring to FIG. 4, in use, the portable disk 1 must be inserted into the connecting slot 21 upwardly to be electrically connected to a contact point 23 located under the tongue 22, and the four elastic pieces 24 are pressed against the same. The disc body 1; if the disc body 1 is inserted into the connecting slot 21 on the reverse side, it cannot be electrically connected, and the user usually inserts randomly, so the probability of insertion is 1/2, so it is often inserted twice, resulting in use. inconvenient.

為了使用上之方便性，仍需以正反雙向皆可電連接較能符合需求，故申請人研發一種具有雙面電連接功能之正反雙面接頭之電子裝置，為了配合雙面電連接功能，則接頭必需設計二排接點，然而在使用上又恐電連接母座之彈片24抵接另一板面之接點而造成短路，故亦需克服此問題。 In order to be convenient to use, it is still necessary to be electrically connected in both forward and reverse directions to meet the demand. Therefore, the applicant developed an electronic device with a double-sided electrical connection function for the front and back double-sided connectors, in order to cooperate with the double-sided electrical connection function. Therefore, the connector must be designed with two rows of contacts. However, in use, the spring 24 of the female connector is not connected to the contact of the other panel to cause a short circuit, so it is also necessary to overcome this problem.

本發明申請人潛心研究上述產品之雙面插接設計，終於提出克服上述潛在問題之產品改良結構。 The applicant of the present invention has diligently studied the double-sided plug design of the above products, and finally proposed a product improvement structure that overcomes the above potential problems.

本發明之主要目的在於提供一種正反雙面接頭之電子裝置及其製造方法，其中連接板之兩板面皆具有接點，達到使用上之方便性及多元性。 The main object of the present invention is to provide an electronic device for a front and back double-sided joint and a method for manufacturing the same, wherein the two plates of the connecting plate have contacts to achieve convenience and diversity in use.

本發明之次要目的在於提供一種正反雙面接頭之電子裝置及其製造方法，其中連接板之兩板面皆具有接點且可達到製造上之之方便。 A secondary object of the present invention is to provide an electronic device for a front and back double-sided joint and a method of manufacturing the same, wherein the two plates of the connecting plate have contacts and can be manufactured with ease.

本發明之次要目的在於提供一種正反雙面接頭之電子裝置及其製造方法，其中設有電子式或機構式之防短路設計且連接板之兩板面皆具有接點，達到防止連接板其中一板面之接點短路。 A secondary object of the present invention is to provide an electronic device for a front and back double-sided joint and a method for manufacturing the same, wherein an electronic or mechanical short-circuit proof design is provided and both plates of the connecting plate have contacts to prevent the connecting plate One of the board contacts is shorted.

本發明之次要目的在於提供一種正反雙面接頭之電子裝置及其製造方法，其中設有補強構造增強連接板強度，或藉由該補強構造結合該連接板和該電路板並增強該連接板或該電路板之強度。 A secondary object of the present invention is to provide an electronic device for a front and back double-sided joint, and a method of manufacturing the same, wherein a reinforcing structure is provided to enhance the strength of the connecting plate, or the connecting plate and the circuit board are combined by the reinforcing structure and the connection is enhanced The strength of the board or the board.

為達上述目的，本發明提供一種正反雙面接頭之電子裝置，其包括有：一外覆體；一電子單元，至少一部份為該外覆體覆蓋；以及一連接板，定位於該外覆體，該連接板之兩板面露出該外覆體外且各設有一排第一接點，該二排第一接點電連接該電子單元。 To achieve the above objective, the present invention provides an electronic device for a front and back double-sided joint, comprising: an outer cover; an electronic unit, at least a portion of which is covered by the outer cover; and a connecting plate positioned at the The outer cover body, the two plate faces of the connecting plate are exposed outside the outer cover body and each is provided with a row of first contacts, and the two rows of first contacts are electrically connected to the electronic unit.

如所述之正反雙面接頭之電子裝置，其中該連接板為一電路板之前段，該二排第一接點係為該電路板上之電路接點。 The electronic device of the positive and negative double-sided joints, wherein the connecting board is a front section of a circuit board, and the two rows of first contacts are circuit contacts on the circuit board.

如所述之正反雙面接頭之電子裝置，其中該連接板之形狀可正反雙面對接定位於一電連接母座。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is shaped to be positively and reversely double-sidedly butted to an electrical connection base.

如所述之正反雙面接頭之電子裝置，其中該連接板係與該外覆體一體成型，該二排第一接點形成在二排第一端子，該二排第一接點分別平貼於該連接板之兩板面。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is integrally formed with the outer covering, the two rows of first contacts are formed in two rows of first terminals, and the two rows of first contacts are respectively flat Attached to the two sides of the connecting plate.

如所述之正反雙面接頭之電子裝置，其中更設有二排第二接點，該二排第二接點設於該連接板之兩板面，且位於該二排第一接點之後。 The electronic device of the positive and negative double-sided joints is further provided with two rows of second contacts, wherein the two rows of second contacts are disposed on the two plates of the connecting plate, and are located at the first contact of the two rows after that.

如所述之正反雙面接頭之電子裝置，其中該二排第一接點分別平貼於該連接板之兩板面且不可彈動，該二排第二接點形成在二排第二端子，該二排第二接點分別凸出該連接板之兩板面且可上下彈動。 The electronic device of the front and back double-sided joints, wherein the two rows of first contacts are respectively affixed to the two plates of the connecting plate and are not bounceable, and the two rows of second contacts are formed in the second row and the second The terminals, the second rows of the second contacts respectively protrude from the two plates of the connecting plate and can be bounced up and down.

如所述之正反雙面接頭之電子裝置，其中更設有一限位構造，該限位構造較該連接板兩板面之第一接點凸出。 The electronic device of the positive and negative double-sided joints is further provided with a limiting structure, and the limiting structure protrudes from the first contact of the two plate faces of the connecting plate.

如所述之正反雙面接頭之電子裝置，其中該限位構造包括有設於電路板之金屬層。 The electronic device of the positive and negative double-sided joints, wherein the limiting structure comprises a metal layer disposed on the circuit board.

如所述之正反雙面接頭之電子裝置，其中該限位構造與該外覆體一體成型。 The electronic device of the positive and negative double-sided joints, wherein the limiting structure is integrally formed with the outer covering.

如所述之正反雙面接頭之電子裝置，其中該電子單元為一儲存單元，該儲存單元包括至少一記憶體。 The electronic device of the positive and negative double-sided joints, wherein the electronic unit is a storage unit, and the storage unit comprises at least one memory.

如所述之正反雙面接頭之電子裝置，其為一隨身碟，且更設有一電路板，該儲存單元電連接在該電路板上，該二排第一接點電連接該電路板。 The electronic device of the positive and negative double-sided connector is a portable disk, and further comprises a circuit board, the storage unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the circuit board.

如所述之正反雙面接頭之電子裝置，其中該電子單元更包括一控制電路，藉以控制該電子單元之運作。 The electronic device of the positive and negative double-sided joints, wherein the electronic unit further comprises a control circuit for controlling the operation of the electronic unit.

如所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板。 The electronic device of the positive and negative double-sided joints is further provided with a circuit board, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the circuit board.

如所述之正反雙面接頭之電子裝置，其中更設有一電子式防逆流或防短路之電路安全保護手段，如防逆流電子元件或防短路電子元件或蕭基二極體或電路安全保護元件或安全電路設置手段等，藉以達到防短路或防短路之電路安全。 The electronic device of the positive and negative double-sided joints is further provided with an electronic anti-backflow or short circuit protection circuit, such as anti-backflow electronic components or short-circuit proof electronic components or Xiaoji diode or circuit safety protection. Component or safety circuit setting means, etc., to achieve circuit safety against short circuit or short circuit.

如所述之正反雙面接頭之電子裝置，其中該二排第一接點係為相同之連接介面。 The electronic device of the positive and negative double-sided joints, wherein the two rows of first contacts are the same connection interface.

如所述之正反雙面接頭之電子裝置，其中該二排第一接點之電路序號相互為反向排列。 The electronic device of the positive and negative double-sided joints, wherein the circuit numbers of the first rows of the two rows are opposite to each other.

如所述之正反雙面接頭之電子裝置，其中該儲存單元僅設有一記憶體，藉由該二排第一接點可正反雙面電連接於一電連接母座。 The electronic device of the positive and negative double-sided joints, wherein the storage unit is only provided with a memory, and the two rows of first contacts can be electrically connected to an electrical connection base by positive and negative double-sided.

如所述之正反雙面接頭之電子裝置，其中該二排第一接點相同之電路序號者電連接而串接成一組。 The electronic device of the positive and negative double-sided joints as described above, wherein the circuit numbers of the two rows of the first contacts are electrically connected and connected in series.

如所述之正反雙面接頭之電子裝置，其中至少一對相互電連接之二第一接點各自電連接一防逆流電子元件或防短路電子元件或蕭基二極體或電路安全保護元件或安全電路設置手段。 The electronic device of the positive and negative double-sided joints, wherein at least one pair of first contacts electrically connected to each other is electrically connected to a backflow prevention electronic component or a short circuit prevention electronic component or a Schottky diode or a circuit safety protection component. Or a means of setting up a safety circuit.

如所述之正反雙面接頭之電子裝置，其中該二排第一接點上下相互對齊者係相互電連接，且設有一偵測構造偵測電連接之方向。 The electronic device of the front and back double-sided joints, wherein the two rows of first contacts are electrically connected to each other, and a detecting structure is disposed to detect the electrical connection direction.

如所述之正反雙面接頭之電子裝置，其中該連接板係與該外覆體一體成型，該二排第一接點形成在二排第一端子，每一第一端子設有二個第一接點分別平貼於該連接板之兩板面。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is integrally formed with the outer covering, the two rows of first contacts are formed in two rows of first terminals, and each of the first terminals is provided with two The first contacts are respectively affixed to the two plates of the connecting plate.

如所述之正反雙面接頭之電子裝置，其中該二排第一接點係為不同之連接介面。 The electronic device of the positive and negative double-sided joints, wherein the two rows of first contacts are different connection interfaces.

如所述之正反雙面接頭之電子裝置，其為一IC晶片卡，該連接板與該外覆體一體成板片狀，且更設有二排第二接點，該二排第二接點設於該連接板之兩板面且位於該二排第一接點之後，該二排第一接點及二排第二接點皆平貼於該連接板之兩板面。 The electronic device of the positive and negative double-sided joint is an IC wafer card, and the connecting plate is formed into a plate shape with the outer cover, and further has two rows of second contacts, and the second row is second The contacts are disposed on the two boards of the connecting board and are located behind the two rows of first contacts, and the two rows of first contacts and the second row of second contacts are flat on the two board faces of the connecting board.

如所述之正反雙面接頭之電子裝置，其中更包括一控制手段，與該正反雙面接頭之電子裝置相結合，以對該儲存單元進行一資料儲存與控制程序。 The electronic device of the front and back double-sided joints further includes a control means for combining with the electronic device of the front and back double-sided joints to perform a data storage and control procedure for the storage unit.

如所述之正反雙面接頭之電子裝置，其中該儲存單元包括二個記憶體，該連接板一板面之一排第一接點電連接一記憶體，而該連接板另一板面之一排第一接點電連接另一記憶體。 The electronic device of the positive and negative double-sided joints, wherein the storage unit comprises two memory bodies, wherein one of the first contacts of one of the board faces is electrically connected to a memory, and the other side of the connection board One of the first contacts is electrically connected to the other memory.

如所述之正反雙面接頭之電子裝置，其藉由設有一切換開關裝置及一控制電路可達到選擇一記憶體成通路，而另一記憶體成斷路，或該二記憶體皆成通路。 The electronic device of the positive and negative double-sided joints can be configured to select a memory into a path by providing a switch device and a control circuit, and the other memory is disconnected, or the two memories are in a path. .

如所述之正反雙面接頭之電子裝置，其中該儲存單元包括至少二個記憶體，藉由設有一切換開關裝置及一控制電路可達到選擇該二排第一接點只有電連接其中一個記憶體，或該二排第一接點同時電連接該至少二個記憶體。 The electronic device of the positive and negative double-sided joints, wherein the storage unit comprises at least two memories, and the switch is provided with a switch device and a control circuit to select one of the first contacts of the two rows and only one of the electrical connections. The memory, or the first row of the first contacts, electrically connects the at least two memories at the same time.

如所述之正反雙面接頭之電子裝置，其為一電連接線公頭，該電子單元為一組多條電線，或為一無線收發裝置，該電子單元為一無線收發模組。 The electronic device of the positive and negative double-sided connector is an electrical connector male, the electronic unit is a plurality of wires, or a wireless transceiver, and the electronic unit is a wireless transceiver module.

如所述之正反雙面接頭之電子裝置，其中該連接板直接接觸並固定於該外覆體。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is directly in contact with and fixed to the outer covering.

如所述之正反雙面接頭之電子裝置，其中該外覆體為一金屬殼。 The electronic device of the positive and negative double-sided joints, wherein the outer cover is a metal shell.

如所述之正反雙面接頭之電子裝置，其中該外覆體包覆該連接板之周邊，該連接板兩側之外覆體設有一定位構造，當該連接板***一電連接母座時該定位構造可與電連接母座卡定。 The electronic device of the positive and negative double-sided joints, wherein the outer covering covers the periphery of the connecting plate, and the covering body on both sides of the connecting plate is provided with a positioning structure when the connection is The positioning structure can be locked with the electrical connection when the board is inserted into an electrical connection.

如所述之正反雙面接頭之電子裝置，其中該連接板為一塑膠板，該連接板組裝定位於該外覆體前端。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is a plastic plate, and the connecting plate is assembled and positioned at the front end of the outer covering body.

如所述之正反雙面接頭之電子裝置，其中該連接板後端設有一套接槽供該電路板一端***卡定。 The electronic device of the front and back double-sided joints, wherein a rear end of the connecting plate is provided with a set of slots for inserting one end of the circuit board into the locking.

如所述之正反雙面接頭之電子裝置，其中該電路板前段上下二板面分別疊合一上、下電路板，該疊合之上電路板、電路板及下電路板伸出該外覆體前端而形成該連接板，該連接板二板面上之二排第一接點皆藉由導線電連接該電路板。 The electronic device of the front and back double-sided joints, wherein the upper and lower boards of the front section of the circuit board are respectively superposed with an upper and lower circuit board, and the superposed circuit board, the circuit board and the lower circuit board protrude from the outer circuit board. The connecting plate is formed at the front end of the covering body, and the first rows of the first contacts on the two plates of the connecting plate are electrically connected to the circuit board by wires.

如所述之正反雙面接頭之電子裝置，其中該電路板前段下板面疊合一塑膠板及一下電路板，該疊合之電路板、塑膠板及下電路板伸出該外覆體前端而形成該連接板，該連接板二板面上之二排第一接點皆藉由導線電連接該電路板。 The electronic device of the positive and negative double-sided joints, wherein the lower plate of the front side of the circuit board is superposed with a plastic plate and a lower circuit board, and the laminated circuit board, the plastic board and the lower circuit board protrude from the outer cover The connecting plate is formed at the front end, and the first rows of the first contacts on the two boards of the connecting board are electrically connected to the circuit board by wires.

如所述之正反雙面接頭之電子裝置，其中設有二電路板，該二電路板前段疊合一塑膠板並伸出該外覆體前端而形成該連接板，該二電路板前段各設有該一排第一接點。 The electronic device of the positive and negative double-sided joints is provided with two circuit boards, wherein the front side of the two circuit boards is laminated with a plastic plate and protrudes from the front end of the outer cover to form the connecting plate, and the two front plates of the two circuit boards are respectively The first contact of the row is provided.

如所述之正反雙面接頭之電子裝置，其中該連接板之周邊套設包覆有一金屬殼。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is sleeved with a metal shell.

如所述之正反雙面接頭之電子裝置，其中該連接板兩側之金屬殼設有一定位構造，當該連接板***一電連接母座時該定位構造可與電連接母座卡定。 The electronic device of the front and back double-sided joints, wherein the metal shells on both sides of the connecting plate are provided with a positioning structure, and the positioning structure can be locked with the electrical connection base when the connecting board is inserted into an electrical connection base.

如所述之正反雙面接頭之電子裝置，其中該電路板前段上面設有一絕緣座體而形成該連接板，該絕緣座體設有一排第一端子，該連接板一板面之一排第一接點形成在該一排第一端子，該一排第一端子延伸接腳與該電路板焊接，該連接板另一板面之一排第一接點形成在該電路板前段下面且為一排金手指。 An electronic device having a positive and negative double-sided joint as described above, wherein the front side of the circuit board is An insulating body is formed to form the connecting plate, the insulating seat body is provided with a row of first terminals, and a first contact of a row of the connecting plate is formed in the row of first terminals, the row of first terminals The extension pin is soldered to the circuit board, and the first contact of the other board surface of the connection board is formed under the front section of the circuit board and is a row of gold fingers.

如所述之正反雙面接頭之電子裝置，其中該連接板設有一補強構造，藉以增強該連接板強度。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is provided with a reinforcing structure to enhance the strength of the connecting plate.

如項所述之正反雙面接頭之電子裝置，其中該補強構造可為補強板或焊板或套接槽或封膠體。 The electronic device of the positive and negative double-sided joints as described in the above, wherein the reinforcing structure may be a reinforcing plate or a welding plate or a socket or a sealing body.

如所述之正反雙面接頭之電子裝置，其中更設有一電路板，該補強構造為補強板焊接或卡合該電路板且延伸至該電路板後段或該補強構造可為套接槽，該電路板前段套接卡定於該套接槽。 The electronic device of the positive and negative double-sided joints is further provided with a circuit board. The reinforcing structure is a reinforcing plate for soldering or engaging the circuit board and extending to the rear of the circuit board or the reinforcing structure may be a socket groove. The front sleeve of the circuit board is fixed in the socket.

如所述之正反雙面接頭之電子裝置，其中該絕緣座體截面呈ㄇ形狀，使該絕緣座體與電路板前段間呈一空間。 The electronic device of the positive and negative double-sided joints, wherein the insulating base has a cross-section in a shape such that a space is formed between the insulating base and the front portion of the circuit board.

如所述之正反雙面接頭之電子裝置，其中該外覆體與該絕緣座體為一體成型或該外覆體與該絕緣座體分開設置。 The electronic device of the positive and negative double-sided joints, wherein the outer covering body is integrally formed with the insulating seat body or the outer covering body is disposed separately from the insulating seat body.

如所述之正反雙面接頭之電子裝置，其中該電路板前段一面兩側各設有一塑膠塊，該二塑膠塊再疊合一第二電路板而形成該連接板，該第二電路板和該電路板前段間呈一空間，該連接板一板面之一排第一接點形成在該第二電路板且為一排金手指，該連接板另一板面之一排第一接點形成在該電路板前段且為一排金手指。 The electronic device of the front and back double-sided joints, wherein a plastic block is disposed on one side of the front side of the circuit board, and the two plastic blocks are further laminated with a second circuit board to form the connecting board, the second circuit board And a space between the front section of the circuit board, a first contact of one of the board faces is formed on the second circuit board and is a row of gold fingers, and the other board of the connecting board is first connected The dots are formed in the front of the board and are a row of gold fingers.

如所述之正反雙面接頭之電子裝置，其中該外覆體為一封膠體將該電路板一面覆蓋。 The electronic device of the positive and negative double-sided joints, wherein the outer cover is a glue The body covers the board one side.

如所述之正反雙面接頭之電子裝置，其中該電路板前段上面疊合一第二電路板而形成該連接板，該連接板一板面之一排第一接點形成在該第二電路板上面且為一排金手指，該連接板另一板面之一排第一接點形成在該電路板前段下面且為一排金手指。 The electronic device of the front and back double-sided joints, wherein a front surface of the circuit board is superposed on a second circuit board to form the connecting board, and a first contact of the one side of the connecting board is formed in the second A row of gold fingers is arranged on the circuit board, and a first contact of the other board surface of the connection board is formed under the front section of the circuit board and is a row of gold fingers.

本發明再提供一種正反雙面接頭之電子裝置，其包括有：一對接構造，其形狀可正反雙面對接定位於一電連接母座；其中，該對接構造之兩板面各設有一排第一接點；以及一電子單元，設於該對接構造內，且該二排第一接點電連接該電子單元。 The present invention further provides an electronic device for a front and back double-sided joint, comprising: a pair of joint structures, the shape of which can be positioned in a front and back double-sided docking position on an electrical connection base; wherein each of the two sides of the docking structure is provided with a The first contact is arranged; and an electronic unit is disposed in the docking structure, and the two rows of first contacts are electrically connected to the electronic unit.

如所述之正反雙面接頭之電子裝置，其中更設有二排第二接點，該二排第二接點設於該對接構造之兩板面，且位於該二排第一接點之後。 The electronic device of the positive and negative double-sided joints is further provided with two rows of second contacts, wherein the two rows of second contacts are disposed on the two plates of the docking structure, and are located at the first contact of the two rows after that.

如所述之正反雙面接頭之電子裝置，其中該電子單元可為一儲存單元而成一隨身碟，或可為一無線收發單元而成一無線收發裝置，或可為一連接線材而成一電連接線公頭，或可為一轉接電路及一電連接器而成一轉接電連接器，或可為一擴充電路及一組電連接插座而成一擴充插座，或可為一控制單元而成一IC控制器。 The electronic device of the positive and negative double-sided connector, wherein the electronic unit can be a storage unit to form a flash drive, or can be a wireless transceiver unit to form a wireless transceiver device, or can be a connection wire to form an electrical connection. The male connector can be an adapter circuit and an electrical connector to form an adapter electrical connector, or can be an expansion circuit and a set of electrical connection sockets to form an expansion socket, or can be a control unit to form an IC Controller.

如所述之正反雙面接頭之電子裝置，其中更包括一控制手段，與該正反雙面接頭之電子裝置相結合，以對該電子單元進行控制程序。 The electronic device of the front and back double-sided joints further includes a control means for combining the electronic device of the front and back double-sided joints to perform a control program on the electronic unit.

如所述之正反雙面接頭之電子裝置，其中該對接構造設有一補強構造，藉以增強該對接構造強度。 The electronic device of the positive and negative double-sided joints, wherein the docking structure is provided with a reinforcing structure to enhance the strength of the docking structure.

如所述之正反雙面接頭之電子裝置，其中該對接構造為一絕緣座體下方結合一電路板，該絕緣座體設有一排第一端子，該對接構造一板面之一排第一接點形成在該一排第一端子，該一排第一端子延伸接腳與該電路板電連接，該對接構造另一板面之一排第一接點形成在該電路板下面且為一排金手指，絕緣座體與該電路板間呈一空間。 The electronic device of the positive and negative double-sided joints, wherein the docking structure is an insulating seat body coupled with a circuit board, the insulating seat body is provided with a row of first terminals, and the docking structure is first in a row The contact is formed in the first row of the first terminal, the row of the first terminal extending pin is electrically connected to the circuit board, and the first contact of the other row of the other interface is formed under the circuit board and is a The gold-plated finger has a space between the insulating base and the circuit board.

如所述之正反雙面接頭之電子裝置，其中更設有一限位構造，該限位構造較該對接構造兩板面之第一接點凸出。 The electronic device of the positive and negative double-sided joints is further provided with a limiting structure, and the limiting structure protrudes from the first contact of the two plate faces of the docking structure.

本發明再提供一種正反雙面接頭之電子裝置，其包括有：一電路板，其設有一電子式防逆流或防短路之電路安全保護手段，如防逆流電子元件或防短路電子元件或蕭基二極體或電路安全保護元件或安全電路設置手段等；一電子單元，設於該電路板上；一連接板，其兩板面各設有一排第一接點，該二排第一接點電連接該電路板及該電子單元，該二排第一接點係為相同之連接介面且電路序號相互為反向排列；以及一補強構造，其設於該連接板或電路板，藉由該補強構造結合該連接板和該電路板並增強該連接板或該電路板之強度。 The invention further provides an electronic device for positive and negative double-sided joints, comprising: a circuit board provided with an electronic anti-backflow or short circuit protection circuit protection means, such as anti-backflow electronic components or short-circuit proof electronic components or Xiao a base diode or a circuit safety protection component or a safety circuit setting means; an electronic unit is disposed on the circuit board; and a connecting plate has a row of first contacts on each of the two plates, the first row of the two rows Pointly electrically connecting the circuit board and the electronic unit, wherein the two rows of first contacts are the same connection interface and the circuit numbers are opposite to each other; and a reinforcing structure is disposed on the connection board or the circuit board by The reinforcing structure combines the connecting plate and the circuit board and enhances the strength of the connecting plate or the circuit board.

如所述之正反雙面接頭之電子裝置，其中該連接板包括電路板之前段，該電路板之前段下面設有該一排第一接點，該電路板之一排第一接點為電路接點，該電路板之前段上設有一絕緣座體而形成該連接板，該絕緣座體上面設有該一排第一接點，該絕緣座體上之一排第一接點係形成在一排第一端子，該一排第一端子設有接腳電連接或焊接在該電路板，或者該電路板之前段上直接或間接設有一第二電路板而形成該連接板，該第二電路板上面設有該一排第一接點，該電路板之一排第一接點為電路接點。 An electronic device as described above, wherein the connecting plate comprises a circuit In the front section of the board, the first contact of the row is disposed under the front section of the circuit board, and the first contact of the one of the circuit boards is a circuit contact, and an insulating body is formed on the front section of the circuit board to form the connection. a row of first contacts is disposed on the insulating base, and the first contacts of the one row of the insulating bases are formed in a row of first terminals, and the first terminals of the row are electrically connected by pins Or soldering to the circuit board, or directly or indirectly forming a second circuit board on the front side of the circuit board to form the connection board, the second circuit board is provided with the first row of first contacts, one of the circuit boards The first contact is the circuit contact.

如所述之正反雙面接頭之電子裝置，其中該連接板為一絕緣座體，其兩面各設有該一排第一接點，該二排第一接點係形成在二排第一端子，該第一端子設有接腳電連接或焊接在該電路板。 The electronic device of the positive and negative double-sided joints, wherein the connecting plate is an insulating seat, and the first contact of the row is disposed on each of the two sides, and the first contact of the two rows is formed in the first row of the second row. a terminal, the first terminal is provided with a pin electrically connected or soldered to the circuit board.

如所述之正反雙面接頭之電子裝置，其中該補強構造為設於該連接板之套接槽，該電路板前段套接卡定於該套接槽。 The electronic device of the positive and negative double-sided joints, wherein the reinforcing structure is a socket provided in the connecting plate, and the front portion of the circuit board is sleeved in the socket.

如所述之正反雙面接頭之電子裝置，其中該補強構造為該絕緣座體一體向後延伸之補強板，該補強板套合或卡合或黏合該電路板。 The electronic device of the positive and negative double-sided joints, wherein the reinforcing structure is a reinforcing plate integrally extending rearward of the insulating seat, and the reinforcing plate fits or snaps or bonds the circuit board.

如所述之正反雙面接頭之電子裝置，其中該補強構造為補強板套合或焊接該電路板，該補強板之截面形狀可為、、、、等形狀或該補強構造為焊板焊接該電路板。 The electronic device of the positive and negative double-sided joints, wherein the reinforcing structure is a reinforcing plate for fitting or welding the circuit board, and the cross-sectional shape of the reinforcing plate may be , , , , The shape or the reinforcement structure is welded to the board.

如所述之正反雙面接頭之電子裝置，其中更設有一外覆體覆蓋於該電路板一面並將該電子單元覆蓋。 The electronic device of the positive and negative double-sided joints is further provided with an outer cover covering one side of the circuit board and covering the electronic unit.

如所述之正反雙面接頭之電子裝置，其中該補強構造為金屬材質或非金屬材質。 The electronic device of the positive and negative double-sided joints, wherein the reinforcing structure is made of metal or non-metal.

如所述之正反雙面接頭之電子裝置，其中該電路板前段上下面分別設有一絕緣座體而形成該連接板，該二絕緣座體各設有該一排第一接點，該二排第一接點係形成在二排第一端子，該二排第一端子設有接腳電連接或焊接在該電路板。 The electronic device of the front and back double-sided joints, wherein the upper and lower sides of the front panel of the circuit board are respectively provided with an insulating base body to form the connecting plate, and the two insulating base bodies are respectively provided with the first row of the first joint, the two The first contact is formed in two rows of first terminals, and the two rows of first terminals are provided with pins electrically connected or soldered to the circuit board.

本發明再提供一種正反雙面接頭之電子裝置的製造方法，其包括以下步驟：提供一電路板，該電路板設有2組依序反向排列連接介面的串接電路、至少一組連接介面的接點、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、及一電子單元的電路及接點，該2組依序反向排列連接介面的串接電路與該電子單元的電路電連接；提供一絕緣座體，該絕緣座體設有至少一組端子結構的連接介面，該端子設有接腳；提供防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置；提供一電子單元；提供焊接材料塗抹於該電路板之接點；將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置、電子單元、及絕緣座體分別排列貼放於該電路板的接點；及將分別貼放於該電路板上的元件，進行迴焊焊板加工，完成該簡易板片式雙面連接介面電子裝置的加工製程。 The present invention further provides a method for manufacturing an electronic device for a front and back double-sided joint, comprising the steps of: providing a circuit board having two sets of serially connected circuits of serially connected interfaces, at least one set of connections Interfaces, anti-backflow or anti-short circuit or other electronic circuit protection device circuits and contacts, and an electronic unit circuit and contacts, the two groups of reversely arranged serial connection interface and the serial connection circuit Electrical connection of the electronic unit; providing an insulating seat body, the insulating seat body is provided with a connection interface of at least one set of terminal structures, the terminal is provided with a pin; providing anti-backflow electronic components or short-circuit proof electronic components or Xiaoji two poles Body or other electronic circuit protection device; Providing an electronic unit; providing a solder material coated on the circuit board; the anti-backflow electronic component or short-circuit proof electronic component or the Xiaoji diode or other electronic circuit safety device, the electronic unit, and the insulating body The components attached to the circuit board are arranged separately; and the components respectively attached to the circuit board are processed by the reflow soldering plate to complete the processing process of the simple plate-type double-sided interface electronic device.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板一體延伸一面設有一組連接介面。 The method for manufacturing an electronic device of the positive and negative double-sided joints, wherein the circuit board is integrally extended with a set of connection interfaces.

如所述之具板片型接頭之電子裝置的製造方法，其中該電路板一體延伸一面設有一組連接介面，其另一面設有電子元件之電路及接點。 The method for manufacturing an electronic device with a plate-type connector, wherein the circuit board is integrally provided with a set of connection interfaces on one side, and the other side is provided with circuits and contacts of the electronic components.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板一體延伸一面設有一組連接介面，該電路板之2組依序反向排列連接介面的串接電路係為2組依序反向排列USB 2.0連接介面的串接電路。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the circuit board is integrally extended with a set of connection interfaces, and the two sets of the circuit boards are sequentially arranged in reverse. The serial connection circuit of the USB 2.0 connection interface is arranged in reverse.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣座體設有2組不彈動端子結構的連接介面，該端子設有接腳。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the insulating base body is provided with two sets of connection interfaces that do not have a spring-like terminal structure, and the terminals are provided with pins.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣座體下方與電路板間成一空間，藉由該空間可排列電子元件。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein a space is formed between the lower portion of the insulating base and the circuit board, and the electronic component can be arranged by the space.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板之2組依序反向排列連接介面的串接電路及接點的後方更設有另2組依序反向排列的連接介面的串接電路及接點。 The manufacturing method of the electronic device of the positive and negative double-sided joints as described above, wherein the two sets of the circuit board are arranged in reverse with the serial connection circuit of the connection interface and the rear of the contact point. The other two groups are connected in series and in parallel with the serial connection circuit and the contacts.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣座體設有另2組彈動端子結構的連接介面，該端子設有接腳。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the insulating base body is provided with a connection interface of another two sets of spring terminal structures, and the terminal is provided with a pin.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板設有供該彈動端子連接介面彈動的透空槽。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the circuit board is provided with a through-hole for the elastic terminal connection interface to spring.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板上的元件進行迴焊焊板加工後，可進行再灌膠或再封裝的再加工製程而形成一外覆體，以完全COB(Chip On Board簡稱COB)該絕緣座體下方空間或覆蓋該電路板後段排放電子元件的區域，並加強整體強度。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein after the components on the circuit board are processed by the reflow soldering plate, the reworking process of refilling or repackaging can be performed to form an outer cover. The COB (Chip On Board referred to as COB) space under the insulating base or covers the area where the electronic components are discharged in the rear of the circuit board, and strengthens the overall strength.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣座體可一體或分段延伸座體長度而形成一外覆體，使完全蓋合該電路板上排放電子元件的區域。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the insulating base body can integrally or segmentally extend the length of the base body to form an outer cover body, so as to completely cover the area on the circuit board for discharging electronic components. .

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板或該絕緣座體設有防短路凸出連接介面之限位構造。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the circuit board or the insulating base body is provided with a limit structure for preventing a short-circuiting protruding connection interface.

如所述之具板片型接頭之電子裝置的製造方法，其中該絕緣座體設有一補強構造，該補強構造為補強板或焊板。 The method for manufacturing an electronic device with a plate type joint according to the invention, wherein the insulating base body is provided with a reinforcing structure, and the reinforcing structure is a reinforcing plate or a welded plate.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板設有補強板或焊板的焊接區。 A method of manufacturing an electronic device of the positive and negative double-sided joints, wherein the circuit board is provided with a soldering zone of a reinforcing plate or a soldering plate.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電路板之2組連接介面的串接電路至少一對相互電連接之電路各自電連接該一防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the circuit of the two sets of connection interfaces of the circuit board is electrically connected to at least one pair of mutually electrically connected circuits, the anti-backflow electronic component or the short-circuit proof electronic Component or Xiaoji diode or other Electronic circuit safety protection device.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣座體設有一補強構造，該補強構造為為該絕緣座體一體向後延伸之補強板，該補強板套合或卡合或粘合該電路板，或者該補強構造為設於該絕緣座體之套接槽，該電路板前段套接卡定於該套接槽。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the insulating base body is provided with a reinforcing structure, and the reinforcing structure is a reinforcing plate for integrally extending the insulating seat body backward, and the reinforcing plate is fitted or engaged. Or bonding the circuit board, or the reinforcing structure is disposed in the socket of the insulating base, and the front portion of the circuit board is sleeved in the socket.

如所述之正反雙面接頭之電子裝置的製造方法，其中該電子單元可為一儲存單元而成一隨身碟，或可為一無線收發單元而成一無線收發裝置，或可為一連接線材而成一電連接線公頭，或可為一轉接電路及一電連接器而成一轉接電連接器，或可為一擴充電路及一組電連接插座而成一擴充插座，或可為一控制單元而成一IC控制器。 The method of manufacturing the electronic device of the positive and negative double-sided connector, wherein the electronic unit can be a storage unit to form a flash drive, or can be a wireless transceiver unit to form a wireless transceiver, or can be a connecting wire. The electrical connector may be a male connector, or may be an adapter circuit and an electrical connector to form an adapter electrical connector, or may be an expansion circuit and a set of electrical connection sockets to form an expansion socket, or may be a control unit Become an IC controller.

本發明再提供一種正反雙面接頭之電子裝置的製造方法，其包括以下步驟：提供一電路板，該電路板設有2組導電接點、該2組導電接點依序反向排列的串接電路、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、及一電子單元的電路及接點，該串接電路與該電子單元的電路電連接，該2組導電接點分別設於該電路板不同面；提供一絕緣體，該絕緣體設有一組連接介面；提供防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置；提供一電子單元及外加之一組導電接點；提供焊接材料，塗抹於該電路板一面之接點；將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置及電子單元分別排列貼放於該電路板上對應之接點，該外加之一組導電接點貼放於電路板該面之一組導電接點；將分別貼放於該電路板上的元件，進行迴焊焊板加工；將該焊接有上述元件之電路板一面進行封膠而形成一外覆體，並使該電路板和外覆體結合成一封裝體，且使該外加之一組導電接點露出該封裝體之外覆體上表面，且該電路板另一面之一組導電接點露出該封裝體之電路板一面；提供焊接材料塗抹於該封裝體之外覆體上表面之一組導電接點或該電路板一面之一組導電接點；以及將該絕緣體疊合於該封裝體前段，該絕緣體之一組連接介面的焊接點連接塗抹有焊接材料之一組導電接點，並進行迴焊焊板加工。 The invention further provides a method for manufacturing an electronic device with a positive and negative double-sided joint, comprising the steps of: providing a circuit board, wherein the circuit board is provided with two sets of conductive contacts, and the two sets of conductive contacts are sequentially arranged in reverse a circuit, a contact circuit, a circuit and a contact of an electronic circuit protection device, and an electronic unit circuit and a connection, the series circuit is electrically connected to a circuit of the electronic unit, the two groups of conductive The contacts are respectively disposed on different sides of the circuit board; an insulator is provided, and the insulator is provided with a set of connection interfaces; and provides anti-backflow electronic components or short-circuit prevention electronic components or Xiaoji diodes or other electronic circuit safety protection devices; Providing an electronic unit and an additional set of conductive contacts; providing a soldering material to the contacts on one side of the circuit board; and securing the anti-backflow electronic component or short-circuit proof electronic component or the Xiaoji diode or other electronic circuit The protection device and the electronic unit are respectively arranged and placed on the corresponding contacts on the circuit board, and the one set of the conductive contacts is placed on one of the conductive contacts on the surface of the circuit board; respectively, the circuit board is respectively placed on the circuit board The component is processed by reflow soldering; the circuit board soldered with the above component is sealed on one side to form an outer covering, and the circuit board and the outer covering are combined into a package, and one of the external components is added The conductive contact exposes the upper surface of the outer cover of the package, and one set of conductive contacts on the other side of the circuit board exposes one side of the circuit board of the package; and the solder material is applied to the upper surface of the cover outside the package a set of conductive contacts or a set of conductive contacts on one side of the circuit board; and superposing the insulator on the front portion of the package, the solder joint of one of the sets of interconnecting interfaces of the insulator is coated with a group of solder materials Electrical contacts, and reflow soldering board processing.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣體為一第二電路板。 A method of manufacturing an electronic device of the positive and negative double-sided joints, wherein the insulator is a second circuit board.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣體為一塑膠成型之絕緣座體，該絕緣座體之一組連接介面為一組端子之接點，該一組端子設有接腳。 The manufacturing method of the electronic device of the positive and negative double-sided joints, wherein the insulator is a plastic molded insulating seat, and one of the insulating bases is a joint of a set of terminals, and the set of terminals is set. There are pins.

如所述之正反雙面接頭之電子裝置的製造方法，其中該絕緣座體設有限位構造凸出該一組連接介面及相對於該一組連接介面之一組導電接點。 A method of manufacturing an electronic device of the positive and negative double-sided joints, wherein the insulation The base body is provided with a limiting structure protruding from the set of connection interfaces and a set of conductive contacts relative to the set of connection interfaces.

本發明之上述及其他目的、優點和特色由以較佳實施例之詳細說明中並參考圖式當可更加明白。 The above and other objects, advantages and features of the present invention will become more apparent from

請參閱圖5、圖6、及圖7，係為本發明第一實施例，其係為一USB2.0規格之隨身碟，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50，其中：該外覆體30為一塑膠材質，其設有一下座31及一上蓋32，該下座31設有一容室33。 Please refer to FIG. 5 , FIG. 6 , and FIG. 7 , which are the USB flash drive of the USB 2.0 specification, which can be electrically connected to the mother and the female, which includes a front and back double-sided electrical connection. The outer cover 30, a circuit board 40, a connecting board 55, an electronic unit 4 and a limiting structure 50, wherein the outer covering 30 is made of a plastic material, and is provided with a lower seat 31 and an upper cover 32. The lower seat 31 is provided with a chamber 33.

該電路板40置於該外覆體30之容室33，該電路板40之後段為該外覆體30所包覆，該電路板40之前段露出該外覆體30外，即為該連接板55，故該連接板55係直接接觸並固定於該外覆體30，該連接板55之兩板面(上下板面)各設有一排第一接點41，該二排第一接點41係為電路板40上形成之電路接點，該二排第一接點41皆為4個，可分別傳送VCC、USB D-、USB D+及GND等訊號，該二排第一接點41係為相同之連接介面且電路序號相互為反向排列，如圖7所示，該連接板55上板面之一排第一接點41之電路序號由右至左為a1，a2，a3，a4，該連接板55下板面之一排第一接點41之電路序號由右至左為b4，b3，b2，b1。另外，該連接板55之形狀正反面對稱，故可正反雙面對接定位於一電連接母座。 The circuit board 40 is placed in the chamber 33 of the outer cover 30. The rear portion of the circuit board 40 is covered by the outer cover 30. The front portion of the circuit board 40 is exposed outside the outer cover 30, that is, the connection The connecting plate 55 is directly contacted and fixed to the outer covering 30. The two plate faces (upper and lower plate faces) of the connecting plate 55 are respectively provided with a row of first contacts 41, and the first row of the first contacts 41 is a circuit contact formed on the circuit board 40. The two first rows of the first contact 41 are four, and can respectively transmit signals such as VCC, USB D-, USB D+ and GND, and the first row of the first contact 41 The same connection interface and the circuit numbers are arranged in opposite directions. As shown in FIG. 7, the circuit number of the first contact 41 of one of the upper surfaces of the connecting plate 55 is a1, a2, a3 from right to left. A4, the circuit number of the first contact 41 of one of the lower plates of the connecting plate 55 is from right to left, b4, b3, b2, b1. In addition, the shape of the connecting plate 55 is positive and negative. The surface is symmetrical, so that the front and back double-sided docking can be positioned on an electrical connection base.

該外覆體30及連接板55結合成一對接構造，下述第二實施例至第六十五實施例皆同為外覆體30及連接板55結合成一對接構造，即連接板55為對接構造之一部份。 The outer cover 30 and the connecting plate 55 are combined into a one-to-one connection structure. The second embodiment to the sixty-fifth embodiment are the same as the outer cover 30 and the connecting plate 55 combined into a one-to-one connection structure, that is, the connecting plate 55 is abutting structure. One part.

請參閱圖8，該二排第一接點41相同之電路序號者電連接而串接成一組，即a1和b1電連接，a2和b2電連接，a3和b3電連接，a4和b4電連接，其中a1和b1係為電源接點，絕不可造成短路，故a1和b1皆先經一蕭基二極體46再相互電連接，該蕭基二極體46之作用主要是防止電流逆流，如此可達到防短路效果。 Referring to FIG. 8, the same circuit numbers of the first rows of the first contacts 41 are electrically connected and connected in series, that is, a1 and b1 are electrically connected, a2 and b2 are electrically connected, a3 and b3 are electrically connected, and a4 and b4 are electrically connected. A1 and b1 are power contacts, and must not cause a short circuit. Therefore, a1 and b1 are first electrically connected to each other via a Schottky diode 46. The function of the Schottky diode 46 is mainly to prevent current from flowing backward. This can achieve the short circuit prevention effect.

上述使用蕭基二極體防短路係為一種電子式防逆流或防短路之電路安全保護手段的一種方式，然而亦有多種方式如設置防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段，藉以達到電路安全保護效果。 The above-mentioned use of the Xiaoji diode anti-short circuit is a way of electronic circuit protection against electronic backflow or short circuit, but there are also various ways such as providing anti-backflow electronic components or short-circuit proof electronic components or circuit safety protection components or Safety circuit setting means to achieve circuit safety protection.

該電子單元4為一儲存單元，其電連接於該電路板40上且為該外覆體30所包覆，其包括一記憶體43及一控制電路45，該記憶體43可為但不限於快閃記憶體(flash memory)或唯讀記憶體(ROM)，該記憶體43之容量大小不限，該控制電路45係控制該電子單元之記憶體43之運作，該二排第一接點41電連接該電子單元4。 The electronic unit 4 is a storage unit electrically connected to the circuit board 40 and covered by the outer cover 30. The memory unit 43 includes a memory 43 and a control circuit 45. The memory unit 43 can be, but is not limited to, a flash memory or a read-only memory (ROM), the size of the memory 43 is not limited, the control circuit 45 controls the operation of the memory 43 of the electronic unit, and the first row of the first contacts 41 is electrically connected to the electronic unit 4.

該限位構造50與該外覆體30一體成型，該限位構造50於該連接板55兩板面分別形成四條前後方向之凸肋，該限位構造50較該連接板55兩板面之第一接點41凸出藉以保護該二排第一接點41及防止短路，該連接板55上設有二貫穿孔42配合該限位構造50中間之二條凸肋。The limiting structure 50 is integrally formed with the outer covering body 30. The limiting structure 50 forms four ribs in the front-rear direction on the two plate surfaces of the connecting plate 55, and the limiting structure 50 is opposite to the connecting plate 55. The first contact 41 protrudes to protect the two rows of first contacts 41 and prevent short circuit. The connecting plate 55 is provided with two through holes 42 for engaging two ribs in the middle of the limiting structure 50.

請參閱圖9，藉由以上構造，本實施例之隨身碟3***一電連接母座20時，由於該連接板之形狀可正反雙面對接定位於該電連接母座20且該連接板兩板面設有相同之連接介面且電路序號相互為反向排列之二排第一接點41，故使用者採任一板面***電連接母座20之連接槽21均可定位並電連接，如圖所示，當一排第一接點a1、a2、a3、a4與電連接母座20之一排接點23電連接時，電連接母座20之彈片24係抵到另一板面之限位構造50而不致碰觸該第一接點b1、b4造成短路。再者由於該第一接點b1係電連接該蕭基二極體46，故電流不會逆流至第一接點b1，故更可確保該電源接點即第一接點b1不會短路。Referring to FIG. 9 , with the above configuration, when the flash drive 3 of the embodiment is inserted into an electrical connection base 20 , the shape of the connection plate can be directly and anti-double-sidedly butted to the electrical connection base 20 and the connection plate The two boards are provided with the same connection interface and the circuit numbers are opposite to each other in the two rows of first contacts 41. Therefore, the user can take any board surface into the connection slot 21 of the electrical connection base 20 to be positioned and electrically connected. As shown, when a row of first contacts a1, a2, a3, a4 is electrically connected to one of the contact points 23 of the electrical connection base 20, the spring 24 of the electrical connection base 20 is tied to the other board. The surface stop structure 50 does not touch the first contacts b1, b4 to cause a short circuit. Moreover, since the first contact b1 is electrically connected to the Schottky diode 46, the current does not flow back to the first contact b1, so that the power contact, that is, the first contact b1, can be ensured that the first contact b1 is not short-circuited.

另外，本實施例更可包括一控制手段與該USB2.0規格之隨身碟相結合，以對該儲存單元進行一資料儲存與控制程序。In addition, the embodiment further includes a control means combined with the USB2.0 specification flash drive to perform a data storage and control procedure for the storage unit.

上述實施例之外覆體30為一塑膠殼體，該電子單元4係焊接於該電路板，該外覆體30將該電路板40及電子單元4包覆，然而為了使整體隨身碟較為輕薄，該電子單元4之記憶體及控制電路亦可採晶片直接封裝方式(Chip On Board，簡稱COB)封裝於電路板40上，如此該電子單元4同樣電連接於電路板且為一外覆體封裝包覆，採COB方式者仍屬本發明之範圍。The cover 30 is a plastic case, and the electronic unit 4 is soldered to the circuit board. The outer cover 30 covers the circuit board 40 and the electronic unit 4, but the overall flash drive is thin and light. The memory and control circuit of the electronic unit 4 can also be packaged on the circuit board 40 by using a Chip On Board (COB), so that the electronic unit 4 is also electrically connected to the circuit board and is an outer cover. Package coating, COB method is still within the scope of the present invention.

請參閱圖10及圖11，係本發明第二實施例，其大致與第一實施例相同，其差異在於本實施例之限位構造50為一金屬層，係以電鍍方式鍍在該連接板55兩板面之兩側。Referring to FIG. 10 and FIG. 11 , it is a second embodiment of the present invention, which is substantially the same as the first embodiment. The difference is that the limiting structure 50 of the embodiment is a metal layer plated on the connecting plate by electroplating. 55 on both sides of the board.

請參閱圖12及圖13，係本發明第三實施例，其大致與第二實施例相同，其差異在於本實施例之連接板55兩板面完全沒有設限位構造，為了確保不短路，一排第一接點a1、a2、a3、a4及一排第一接點b1、b2、b3、b4皆各自電連接一蕭基二極體46，防止電流逆流，達到防短路效果。Referring to FIG. 12 and FIG. 13 , it is a third embodiment of the present invention, which is substantially the same as the second embodiment. The difference is that the two plates of the connecting plate 55 of the present embodiment have no limit structure at all, in order to ensure no short circuit. A row of first contacts a1, a2, a3, a4 and a row of first contacts b1, b2, b3, b4 are each electrically connected to a Schottky diode 46 to prevent current from flowing back to achieve a short circuit prevention effect.

請參閱圖14及圖15，係本發明第四實施例，其大致與第一實施例相同，本實施例同樣設有一外覆體30、一電路板40、一連接板55及一電子單元及一限位構造50，其差異在於該連接板55與該外覆體30一體成型，其設有一排四個第一端子60及一偵測構造80，每一第一端子60設有第一接點62、63分別平貼於該連接板55之兩板面，該偵測構造80固定於外覆體30，其設有二可動端子81、82及一固定端子83，該二可動端子81、82位於該固定端子83之上、下方且皆設有一凸點85分別凸出該連接板55上、下板面，當本實施例之隨身碟正面***電連接母座電連接時，若是該一排第一接點62電連接該電連接母座時，該可動端子81被觸壓而與固定端子83導通完成偵測，如此控制電路可知得是該一排第一接點62電連接而採用對應之電路訊號傳輸；反之，隨身碟反面***電連接母座電連接時，則是該一排第一接點63電連接該電連接母座時，該可動端子82被觸壓而與固定端子83導通完成偵測，如此控制電路可知是該一排第一接點63電連接而可作與前述相反電路訊號傳輸。Referring to FIG. 14 and FIG. 15 , a fourth embodiment of the present invention is substantially the same as the first embodiment. The present embodiment is also provided with an outer cover 30 , a circuit board 40 , a connecting plate 55 , and an electronic unit . A limiting structure 50 is different in that the connecting plate 55 is integrally formed with the outer covering 30, and is provided with a row of four first terminals 60 and a detecting structure 80, and each of the first terminals 60 is provided with a first connection. The detection structures 80 are fixed to the outer cover 30, and are provided with two movable terminals 81, 82 and a fixed terminal 83. The two movable terminals 81 are respectively disposed on the two sides of the connecting plate 55. 82 is located above and below the fixed terminal 83 and is provided with a bump 85 respectively protruding from the upper and lower surface of the connecting plate 55. When the front surface of the portable disk of the embodiment is electrically connected to the electrical connection socket, if the one is When the first contact 62 is electrically connected to the electrical connection base, the movable terminal 81 is pressed and electrically connected to the fixed terminal 83 to complete the detection, so that the control circuit can know that the first contact 62 of the row is electrically connected. Corresponding circuit signal transmission; otherwise, when the opposite side of the flash drive is plugged into the electrical connection of the female socket, then When the first connection 63 of the row is electrically connected to the electrical connection base, the movable terminal 82 is pressed and electrically connected to the fixed terminal 83 to complete the detection. Thus, the control circuit knows that the first connection 63 of the row is electrically connected. It can be transmitted as the opposite circuit signal as described above.

請參閱圖16，係本發明第五實施例，其係為一USB3.0規格之隨身碟，其大致與第一實施例相同，本實施例同樣設有一外覆體30、一電路板40、一連接板55及一電子單元及一限位構造50，其差異在於本實施增設有二排各五個第二端子70，該第二端子70設有一可彈動之延伸部71，該延伸部71一端延伸至該連接板55並設有一凸出之第二接點72，該延伸部另一端設有接腳焊接於該電路板40而與該電子單元電連接，該二排第二接點72分別凸出該連接板55之兩板面且位於該二排第一接點41之後，該第二接點72可隨該延伸部71上下彈動。Referring to FIG. 16, a fifth embodiment of the present invention is a USB3.0-compliant flash drive, which is substantially the same as the first embodiment. The present embodiment is also provided with an outer cover 30 and a circuit board 40. A connecting plate 55 and an electronic unit and a limiting structure 50 are different in that the present embodiment is provided with two rows of five second terminals 70, and the second terminal 70 is provided with a springable extending portion 71, the extending portion The first end of the extending portion is extended to the connecting plate 55 and is provided with a protruding second contact 72. The other end of the extending portion is provided with a pin soldered to the circuit board 40 to be electrically connected to the electronic unit, and the second row of the second contact 72 protrudes from the two plate faces of the connecting plate 55 and is located behind the two rows of first contacts 41. The second contacts 72 can be bounced up and down with the extending portion 71.

請參閱圖17及圖18，係為本發明第六實施例，其係為一USB3.0規格之隨身碟，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電路板40、一連接板55、一電子單元4、二排第一端子60及二排第二端子70，其中：該外覆體30為一塑膠材質，其設有一下座31及一上蓋32，該下座31設有一容室33。Referring to FIG. 17 and FIG. 18, it is a sixth embodiment of the present invention, which is a USB3.0 specification flash drive, which can be electrically connected to the mother and the female, and includes an outer cover 30. a circuit board 40, a connecting board 55, an electronic unit 4, two rows of first terminals 60 and two rows of second terminals 70, wherein: the outer covering 30 is a plastic material, and is provided with a lower seat 31 and a The upper cover 32 is provided with a chamber 33.

該電路板40置於該外覆體30之容室33，該電路板40為該外覆體30所包覆該連接板55一體成型設於該外覆體30前端，該連接板55之形狀可正反雙面對接定位於該電連接母座，該連接板55上下板面皆設有一排四個凹面57且該凹面57之後設有一排5個穿孔56。The circuit board 40 is disposed in the chamber 33 of the outer cover 30. The circuit board 40 is integrally formed on the front end of the outer cover 30 by the outer cover 30. The shape of the connecting plate 55 The front and back sides of the connecting plate 55 are respectively provided with a row of four concave surfaces 57 and the concave surface 57 is provided with a row of five through holes 56.

該電子單元4為一儲存單元，其電連接於該電路板40上且為該外覆體30所包覆，其包括一記憶體43及一控制電路45，該記憶體43之容量大小不限，該控制電路45係控制該電子單元之記憶體43之運作。The electronic unit 4 is a storage unit electrically connected to the circuit board 40 and covered by the outer cover 30. The memory unit 43 includes a memory 43 and a control circuit 45. The size of the memory 43 is not limited. The control circuit 45 controls the operation of the memory 43 of the electronic unit.

該二排第一端子60各自為4個，該第一端子60設有不可彈動之延伸部61，該延伸部61一端延伸至該連接板55並設有一第一接點62平貼於該凹面57，該延伸部61另一端設有接腳焊接於該電路板40而與該電子單元4電連接，該二排第一接點62分別平貼該連接板55兩板面之凹面57。Each of the two rows of first terminals 60 is four, and the first terminal 60 is provided with a non-bounceable extension portion 61. One end of the extension portion 61 extends to the connecting plate 55 and is provided with a first contact 62. The concave surface 57, the other end of the extending portion 61 is soldered to the circuit board 40 and electrically connected to the electronic unit 4, and the two rows of first contacts 62 respectively lie on the concave surface 57 of the two plate faces of the connecting plate 55.

該二排第二端子70各自為5個，該第二端子70設有一可彈動之延伸部71，該延伸部一端延伸至該連接板55並設有一凸出之第二接點72，該延伸部另一端設有接腳焊接於該電路板40而與該電子單元4電連接，該二排第二接點72分別凸出該連接板55之兩板面且位於該二排第一接點62之後，該第二接點72可隨該延伸部71上下彈動。Each of the two rows of second terminals 70 is five. The second terminal 70 is provided with a spring-extending portion 71. The extension portion extends to the connecting plate 55 at one end and is provided with a protruding second contact 72. The other end of the extending portion is soldered to the circuit board 40 and electrically connected to the electronic unit 4, and the two rows of second contacts 72 respectively protrude from the two boards of the connecting board 55 and are located in the first row of the two rows. After the point 62, the second contact 72 can spring up and down with the extension 71.

本實施之二排第一接點62及二排第二接點72皆係為相同之連接介面且電路序號相互為反向排列，本實施雖未設有限位構造，然而可設置電子式防逆流或防短路之電路安全保護手段的一種方式，然而亦有多種方式如設置蕭基二極體或防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段，藉以達到電路安全保護效果。In the present embodiment, the first row of the second node 62 and the second row of the second node 72 are the same connection interface and the circuit numbers are arranged in opposite directions. Although the implementation does not have a limit structure, the electronic anti-backflow can be set. Or a method of circuit protection for short circuit protection, however, there are also various ways to achieve circuit safety protection by setting up a Xiaoji diode or anti-backflow electronic component or short-circuit proof electronic component or circuit safety protection component or safety circuit setting means. effect.

請參閱圖19，係本發明第七實施例，其大致與第六實施例相同，其差異在於本實施例設有凸出該連接板55兩板面之限位構造50。Referring to FIG. 19, it is a seventh embodiment of the present invention, which is substantially the same as the sixth embodiment, except that the present embodiment is provided with a limiting structure 50 for projecting the two plates of the connecting plate 55.

請參閱圖20及圖21，係本發明第八實施例，其大致與第五實施例相同，其差異在於本實施例之電子單元更設有一記憶體44，連接板55一板面之連接介面係電連接該記憶體43，其與第五實施例為相同介面，皆為USB3.0之連接介面，而連接板55另一板面係設有一排9個第一接點41，其係為miCard之連接介面，該一排9個第一接點41電連接該記憶體44。Referring to FIG. 20 and FIG. 21, it is an eighth embodiment of the present invention, which is substantially the same as the fifth embodiment. The difference is that the electronic unit of the embodiment further includes a memory 44, and a connection interface of the connecting board 55. The memory 43 is electrically connected to the same interface as the fifth embodiment, which is a connection interface of USB 3.0, and the other board surface of the connection board 55 is provided with a row of 9 first contacts 41, which is The connection interface of the miCard, the nine first contacts 41 of the row are electrically connected to the memory 44.

請參閱圖22，係本發明第九實施例，其係為一USB3.0規格之隨身碟，其大致與第七實施例相同，本實施例同樣設有一外覆體30、一電路板40、一連接板55及一電子單元4、二排第一端子60及二排第二端子70及一限位構造，其差異在於本實施例增設有一偵測構造，該偵測構造包括有二可動端子及二接點，該二可動端子分別為二排第二端子70中之一端子，該二接點分別為設於該電路板40兩板面之接點417、418，該接點417、418電連接控制電路45，該電子單元4之控制電路45包括有安全電路設置手段，在使用上，當隨身碟正面***電連接母座，當連接板55上板面之一排第一端子60及一排第二端子70電連接該電連接母座時，該其中一第二端子70與該接點417導通而完成偵測，如此控制電路45可知是連接板55上板面之一排第一端子60及一排第二端子70電連接該電連接母座，而可作適當之電路安全保護，防止連接板55下板面之一排第一端子60及一排第二端子70造成短路；反之，當隨身碟反面***電連接母座，當連接板55下板面之一排第一端子60及一排第二端子70電連接該電連接母座時，該其中一第二端子70與該接點418導通而完成偵測，如此控制電路45可知是連接板55下板面之一排第一端子60及一排第二端子70電連接該電連接母座，而可作適當之電路安全保護，防止連接板55上板面之一排第一端子60及一排第二端子70造成短路。Referring to FIG. 22, a ninth embodiment of the present invention is a USB3.0 standard flash drive, which is substantially the same as the seventh embodiment. The present embodiment is also provided with an outer cover 30 and a circuit board 40. A connecting plate 55 and an electronic unit 4, two rows of first terminals 60 and two rows of second terminals 70 and a limiting structure are different in that the detecting structure includes a detecting structure, and the detecting structure includes two movable terminals. And the two contacts, the two movable terminals are respectively one of the two rows of the second terminals 70, and the two contacts are respectively connected to the two surfaces of the circuit board 40, 417, 418, the contacts 417, 418 Electrically connected to the control circuit 45, the control circuit 45 of the electronic unit 4 includes a safety circuit setting means. In use, when the front side of the portable disk is inserted into the electrical connection base, when the first plate 60 of the upper surface of the connecting plate 55 is arranged, When the second terminal 70 is electrically connected to the electrical connection base, the second terminal 70 is electrically connected to the contact 417 to complete the detection. Thus, the control circuit 45 is configured to be the first row of the upper surface of the connecting plate 55. The terminal 60 and the second row of terminals 70 are electrically connected to the electrical connection base, and can be adapted The circuit safety protection prevents the first terminal 60 and the second terminal 70 of one of the lower plates of the connecting plate 55 from causing a short circuit; conversely, when the opposite side of the portable disk is inserted into the electrical connection, one of the lower surfaces of the connecting plate 55 When the first terminal 60 and the second terminal 70 are electrically connected to the electrical connection, the second terminal 70 is electrically connected to the contact 418 to complete the detection. Thus, the control circuit 45 is configured to be the lower plate of the connecting plate 55. The first terminal 60 of the row and the second terminal 70 of the row are electrically connected to the electrical connection base, and the circuit protection can be appropriately protected to prevent the first terminal 60 and the row of the first row 60 and the row of the upper surface of the connecting plate 55. The two terminals 70 cause a short circuit.

請參閱圖23，係本發明第十實施例，其係為一USB3.0規格之隨身碟，其大致與第九實施例相同，其差異在於本實施僅設有一排第一端子60，每一第一端子60設有第一接點62、63分別平貼於該連接板55之兩板面。Referring to FIG. 23, it is a tenth embodiment of the present invention, which is a USB3.0 specification flash drive, which is substantially the same as the ninth embodiment, except that the present embodiment only has a row of first terminals 60, each of which is provided. The first terminal 60 is provided with first contacts 62, 63 respectively affixed to the two plate faces of the connecting plate 55.

請參閱圖24，係本發明第十一實施例，其係為一USB3.0規格之隨身碟，其大致與第九實施例相同，其差異在於本實施例電子單元4除了包括有一記憶體43及一控制電路45外更包括有另一記憶體44，該連接板55一板面之一排第一端子60之第一接點及一排第二端子70之第二接點電連接該記憶體43，而該連接板另一板面之一排第一端子60之第一接點及一排第二端子70之第二接點電連接該記憶體44。Referring to FIG. 24, it is an eleventh embodiment of the present invention, which is a USB3.0 specification flash drive, which is substantially the same as the ninth embodiment, except that the electronic unit 4 of the present embodiment includes a memory 43. And a control circuit 45 further includes another memory 44. The first contact of the first terminal 60 and the second contact of the second terminal 70 of the first and second rows of the board 55 are electrically connected to the memory. The body 43 is electrically connected to the memory 44 by a first contact of the first terminal 60 and a second contact of the second terminal 70 of one of the other plates of the connecting plate.

請參閱圖25、圖26及圖27，係本發明第十二實施例，其係為一USB2.0規格之隨身碟，其大致與第一、二實施例相同，其差異在於本實施例之電子單元4除了包括有一記憶體43(A)及一控制電路45外更包括有另一記憶體44(B)，另外設有一切換開關裝置90，該切換開關裝置90係於該外覆體30上設有一滑動鈕91及一滑槽92，該滑動鈕91可於該滑槽92滑動作A、B及C之切換，如圖28所示，該滑動鈕91內面設有二排導電部93，該二排導電部93各為四個，該控制電路45設有一IC控制晶片47，該二排第一接點41係為相同連接介面且電路序號相互為反向排列，兩者相同之電路序號者電連接而串接成一組後與該IC控制晶片47電連接，該IC控制晶片47分別各藉由四條電路49電連接該記憶體A及記憶體B，每該條電路49各設有一對分開之接點48，該四條電連接該記憶體A之電路之4對接點48成一排，該四條電連接該記憶體B之電路之4對接點48亦成一排，該滑動鈕91之二排導電部93可單一導接該四條電連接該記憶體A之電路之4對接點48或單一導接該四條電連接該記憶體B之電路之4對接點48或同時導接該四條電連接該記憶體A之電路之4對接點48和該四條電連接該記憶體B之電路之4對接點48。Referring to FIG. 25, FIG. 26 and FIG. 27, it is a twelfth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the first and second embodiments, and the difference lies in the embodiment. The electronic unit 4 includes a memory 43 (A) and a control circuit 45, and further includes a memory 44 (B), and a switching device 90 is provided. The switching device 90 is attached to the outer cover 30. There is a slide button 91 and a sliding slot 92. The sliding button 91 can switch between the sliding movements A, B and C of the sliding slot 92. As shown in FIG. 28, the sliding button 91 has two rows of conductive portions on the inner surface thereof. 93. The two rows of conductive portions 93 are each four. The control circuit 45 is provided with an IC control chip 47. The two rows of first contacts 41 are the same connection interface and the circuit numbers are arranged in opposite directions. The circuit numbers are electrically connected and connected in series to be electrically connected to the IC control chip 47. The IC control chip 47 is electrically connected to the memory A and the memory B by four circuits 49, and each of the circuits 49 is provided. There is a pair of separate contacts 48, which are electrically connected to the 4 pairs of contacts 48 of the circuit of the memory A in a row, the four The four pairs of contacts 48 connecting the circuits of the memory B are also in a row. The two rows of conductive portions 93 of the sliding button 91 can directly connect the four pairs of contacts 48 electrically connected to the circuit of the memory A or a single guide. The four docking points 48 electrically connecting the circuits of the memory B or the four docking points 48 of the four circuits electrically connecting the memory A and the four docking points 48 of the four circuits electrically connecting the memory B.

請參閱圖28，當滑動鈕91切換至A位置時，該滑動鈕91之一排導電部93係單一導接該四條電連接該記憶體A之電路之4對接點48，此時該記憶體A可雙面作電連接，該控制電路45僅對記憶體A運作，而該記憶體B此時成斷路狀態而可防讀寫；請參閱圖29，當滑動鈕91切換至B位置時，該滑動鈕91之一排導電部93係單一導接該四條電連接該記憶體B之電路之4對接點48，此時該記憶體B可雙面作電連接，該控制電路45僅對記憶體B運作，而該記憶體A此時成斷路狀態而可防讀寫；請參閱圖30，當滑動鈕91切換至C位置時，該滑動鈕91之二排導電部93係同時導接該四條電連接該記憶體A之電路之4對接點48和該四條電連接該記憶體B之電路之4對接點48，此時該記憶體A及B均可雙面作電連接，該控制電路45同時對記憶體A及B運作。Referring to FIG. 28, when the sliding button 91 is switched to the A position, the row of conductive portions 93 of the sliding button 91 is connected to the four docking points 48 of the four circuits electrically connected to the memory A. A can be electrically connected on both sides, the control circuit 45 only operates on the memory A, and the memory B is in an open state to prevent reading and writing; referring to FIG. 29, when the slide button 91 is switched to the B position, The row of conductive portions 93 of the sliding button 91 is connected to the four docking points 48 of the four circuits electrically connected to the memory B. At this time, the memory B can be electrically connected on both sides, and the control circuit 45 only memorizes the memory. The body B operates, and the memory A is in an open state to prevent reading and writing; referring to FIG. 30, when the sliding button 91 is switched to the C position, the two rows of conductive portions 93 of the sliding button 91 are simultaneously connected. Four pairs of contacts 48 electrically connected to the circuit of the memory A and four pairs of contacts 48 electrically connected to the circuit of the memory B, at this time, the memory A and B can be electrically connected on both sides, the control circuit 45 operates on both memory A and B.

請參閱圖31，係本發明第十三實施例，其係為一USB2.0規格之隨身碟，其大致與第十二實施例相同，其差異在於本實施例之控制電路45設有二IC控制晶片47，一IC控制晶片47電連接該記憶體A及一排第一接點a1、a2、a3、a4，另一IC控制晶片47電連接該記憶體B及一排第一接點b1、b2、b3、b4。Referring to FIG. 31, it is a thirteenth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the twelfth embodiment, and the difference is that the control circuit 45 of the embodiment is provided with two ICs. Control chip 47, an IC control chip 47 is electrically connected to the memory A and a row of first contacts a1, a2, a3, a4, and another IC control chip 47 is electrically connected to the memory B and a row of first contacts b1 , b2, b3, b4.

請參閱圖32，係本發明第十四實施例，其係為一USB2.0規格之隨身碟，其大致與第十二實施例相同，其差異在於本實施例之控制電路45設有二IC控制晶片47，一IC控制晶片47電連接該記憶體A，另一IC控制晶片47電連接該記憶體B。Referring to FIG. 32, it is a fourteenth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the twelfth embodiment, and the difference is that the control circuit 45 of the embodiment is provided with two ICs. The control chip 47, an IC control chip 47 is electrically connected to the memory A, and the other IC control chip 47 is electrically connected to the memory B.

請參閱圖33及圖34，係為本發明第十五實施例，其係為一安全數碼卡(Secure Digital Card簡稱SDC)，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電路板40、一連接板55、一限位構造50及一電子單元4，其中：該外覆體30為一塑膠材質。Referring to FIG. 33 and FIG. 34, it is a fifteenth embodiment of the present invention, which is a Secure Digital Card (SDC), which can be electrically connected to the mother and the female, including a front and back double-sided electrical connection. The outer cover 30, a circuit board 40, a connecting plate 55, a limiting structure 50 and an electronic unit 4, wherein the outer covering 30 is made of a plastic material.

該連接板55一體成型設於該外覆體30前端，該連接板55之形狀左右對稱，故可正反雙面對接定位於該電連接母座。The connecting plate 55 is integrally formed on the front end of the outer covering body 30. The shape of the connecting plate 55 is bilaterally symmetrical, so that the front and back double-sided docking can be positioned on the electrical connecting female seat.

該電路板40為該外覆體30所包覆，該電路板40之前段延伸至該連接板55，該電路板40之前段兩板面各設有一排第一接點41，以網狀線所示，該二排第一接點41露出該連接板55兩板面，該二排第一接點41皆為9個係為相同之連接介面且電路序號相互為反向排列，另外，該連接板55之形狀正反面對稱，故可正反雙面對接定位於一電連接母座。The circuit board 40 is covered by the outer cover 30. The circuit board 40 extends to the connecting board 55 in the previous stage. The front side of the circuit board 40 is provided with a row of first contacts 41, which are mesh lines. As shown, the two rows of first contacts 41 expose the two plates of the connecting plate 55, and the two rows of first contacts 41 are all nine identical connecting interfaces and the circuit numbers are opposite to each other. The shape of the connecting plate 55 is symmetrical on the front and back sides, so that the front and back double-sided docking can be positioned on an electrical connection base.

該電子單元4為一儲存單元，其電連接於該電路板40上且為該外覆體30所包覆，該二排第一接點41電連接該電子單元4。The electronic unit 4 is a storage unit electrically connected to the circuit board 40 and covered by the outer cover 30. The two rows of first contacts 41 are electrically connected to the electronic unit 4.

該限位構造50亦與該外覆體30和連接板55一體成型，該限位構造50設於該連接板55兩板面且較該二排第一接點41為凸出，藉以防止二排第一接點41刮傷及短路。The limiting structure 50 is also integrally formed with the outer covering 30 and the connecting plate 55. The limiting structure 50 is disposed on the two plates of the connecting plate 55 and protrudes from the two rows of first contacts 41, thereby preventing two The first contact 41 is scratched and shorted.

藉由以上構造，該SDC正反雙面***一電連接母座之連接槽均可定位並電連接。With the above configuration, the SDC can be positioned and electrically connected to the connection slot of the electrical connection base.

另外，有關miCard、micro SDC、mini SDC、記憶條卡(Memory Stick Card簡稱MSC)、記憶條小卡(Memory Stick Dou Card簡稱MS-Dou C)....等等其他記憶卡皆可如第十五實施例般實施。In addition, other memory cards such as miCard, micro SDC, mini SDC, Memory Stick Card (MSC), Memory Stick Dou Card (MS-Dou C), etc. can be used as the first Fifteen embodiments are implemented.

請參閱圖35，係本發明第十六實施例，其大致與第七實施例相同，其差異在於本實施例之連接板55兩板面之二排第一接點62係為不同連接介面，且連接板55兩板面之限位構造50亦上下錯開。Referring to FIG. 35, it is a sixteenth embodiment of the present invention, which is substantially the same as the seventh embodiment. The difference is that the two rows of first contacts 62 of the two sides of the connecting plate 55 of the embodiment are different connection interfaces. Moreover, the limit structure 50 of the two plate faces of the connecting plate 55 is also shifted up and down.

請參閱圖36及圖37，係為本發明第十七實施例，其係為一IC晶片卡(簡稱智慧卡)，其可正反雙面電連接一電連接母座，其包括一外覆體、一連接板及一電子單元4，其中：該外覆體及連接板係為塑膠材質一體成型呈板片狀之對接構造58，該對接構造58前段為連接板55，其形狀可正反雙面對接定位於一電連接母座，該連接板55之兩板面各平貼設有相同連接介面且電路序號相互為反向排列之一排第一接點62及一排第二接點72，該二排第二接點72位於該二排第一接點62之後。Referring to FIG. 36 and FIG. 37, it is a seventeenth embodiment of the present invention, which is an IC chip card (referred to as a smart card), which can be electrically connected to the mother and the female, and includes an outer cover. The body, a connecting plate and an electronic unit 4, wherein the outer covering and the connecting plate are a mating structure 58 integrally formed of a plastic material in a sheet shape, and the front portion of the mating structure 58 is a connecting plate 55, and the shape thereof can be positive and negative. The double-faced connection is positioned on an electrical connection base, and the two boards of the connection board 55 are respectively provided with the same connection interface, and the circuit numbers are arranged in opposite directions, one row of the first contact 62 and one row of the second contact. 72. The second row of second contacts 72 are located behind the second row of first contacts 62.

該電子單元4為一IC晶片，其設於該對接構造58內，且該二排第一接點62及二排第二接點72電連接該電子單元4。The electronic unit 4 is an IC chip disposed in the docking structure 58 , and the two rows of first contacts 62 and the second row of second contacts 72 are electrically connected to the electronic unit 4 .

藉由以上構造，該IC晶片卡正反雙面***一電連接母座之連接槽均可定位並電連接。With the above configuration, the IC chip card can be positioned and electrically connected to the connecting groove of the electrical connection base.

請參閱圖38、圖39及圖39A，係為本發明第十八實施例，其係為一USB2.0規格之電連接線，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電子單元4、一連接板55及二排第一端子60及一電子單元4，其中：該外覆體30為一塑膠材質。Referring to FIG. 38, FIG. 39 and FIG. 39A, it is an eighteenth embodiment of the present invention, which is a USB2.0 specification electrical connection line, which can be electrically connected to the front and back double-sided electrical connection, including An outer cover 30, an electronic unit 4, a connecting plate 55, and two rows of first terminals 60 and an electronic unit 4, wherein the outer cover 30 is made of a plastic material.

該連接板55一體成型於該外覆體30前端。The connecting plate 55 is integrally formed on the front end of the outer cover 30.

該電子單元4為一組4條電線419，其為該外覆體30所包覆。The electronic unit 4 is a set of four wires 419 which are covered by the outer cover 30.

該二排第一端子60固定於該外覆體30，該二排第一端子60各自為4個，可分別傳送VCC、USB D-、USB D+及GND等訊號，該第一端子60設有不可彈動之延伸部，該延伸部一端延伸至該連接板55並設有一第一接點62平貼於該連接板55一板面，該延伸部另一端與該電子單元4之一電線電連接，該二排第一接點62分別平貼該連接板55兩板面，該二排第一接點62係為相同之連接介面且電路序號相互為反向排列，如圖39A所示，正面之電路序號由右至左為1，2，3，4，而反面之電路序號由右至左則為4，3，2，1，二排第一接點62相同電路序號者電連接該電子單元4之同一電線。The two rows of first terminals 60 are fixed to the outer covering body 30. The two rows of first terminals 60 are respectively four, and can respectively transmit signals such as VCC, USB D-, USB D+ and GND, and the first terminal 60 is provided. An inextensible extension portion, the extension portion extending to the connecting plate 55 at one end and a first contact 62 is disposed on a plate surface of the connecting plate 55, and the other end of the extending portion is electrically connected to one of the electronic units 4 Connecting, the two rows of first contacts 62 are respectively flat on the two plate faces of the connecting plate 55, the two rows of first contacts 62 are the same connection interface and the circuit numbers are arranged in opposite directions, as shown in FIG. 39A. The circuit number on the front side is 1, 2, 3, 4 from right to left, and the circuit number on the reverse side is 4, 3, 2, 1 from right to left, and the same circuit number of the second row of the first contact 62 is electrically connected. The same wire of the electronic unit 4.

藉由以上構造，該電連接線正反雙面***一電連接母座之連接槽均可定位並電連接，而該電連接線的另一端可電連接如鍵盤、滑鼠、LED燈、風扇、轉接器...等等各種電子裝置。According to the above configuration, the connection slot of the electrical connection line inserted into the electrical connection base can be positioned and electrically connected, and the other end of the electrical connection can be electrically connected, such as a keyboard, a mouse, an LED lamp, or a fan. , adapters, etc., and other electronic devices.

請參閱圖40及圖41，係為本發明第十九實施例，其係為一USB2.0規格之無線收發裝置，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電路板40、一電子單元4、一連接板55、及一限位構造50，其中：該外覆體30為一塑膠材質。Referring to FIG. 40 and FIG. 41, it is a nineteenth embodiment of the present invention, which is a wireless transceiver device of USB2.0 specification, which can be electrically connected to an electrical connection mating body, which includes an outer cover. The body 30, a circuit board 40, an electronic unit 4, a connecting plate 55, and a limiting structure 50, wherein the outer covering 30 is made of a plastic material.

該電路板40之後段為該外覆體30所包覆，該電路板40之前段露出該外覆體30外，即為該連接板55，該連接板55之兩板面設有二排第一接點41，該二排第一接點41係為電路板40上形成之電路接點，該二排第一接點41皆為4個係為相同之連接介面且電路序號相互為反向排列。The rear panel of the circuit board 40 is covered by the outer covering 30. The front panel of the circuit board 40 is exposed outside the outer covering 30, that is, the connecting board 55. The two sides of the connecting board 55 are provided with two rows. a contact 41, the two rows of first contacts 41 are circuit contacts formed on the circuit board 40, the two rows of first contacts 41 are all four identical connection interfaces and the circuit numbers are reversed from each other. arrangement.

該電子單元4為一無線收發模組，其電連接於該電路板40上且為該外覆體30所包覆，其可將電子訊號作無線收發，該二排第一接點41電連接該電子單元4。The electronic unit 4 is a wireless transceiver module electrically connected to the circuit board 40 and covered by the outer cover 30. The electronic signal can be wirelessly transmitted and received, and the two rows of first contacts 41 are electrically connected. The electronic unit 4.

該限位構造50為一金屬層，係以電鍍方式鍍在該連接板55兩板面之兩側，該限位構造50藉以保護該連接板55上之二排第一接點41，避免受到刮傷。The limiting structure 50 is a metal layer which is plated on both sides of the two sides of the connecting plate 55. The limiting structure 50 protects the two rows of first contacts 41 on the connecting plate 55 to avoid being affected. Scratch.

藉由以上構造，該無線收發裝置正反雙面***一電連接母座之連接槽均可定位並電連接。With the above configuration, the connecting slot of the wireless transceiver device that is inserted into the front and back sides of an electrical connection base can be positioned and electrically connected.

本實施例之無線收發裝置可為無線網卡、藍牙接收器、2.4G無線傳輸接收器(如無線滑鼠之收發器)...等等電子裝置。The wireless transceiver device of this embodiment may be a wireless network card, a Bluetooth receiver, a 2.4G wireless transmission receiver (such as a wireless mouse transceiver), and the like.

請參閱圖42，係為本發明第二十實施例，其係為一USB3.0規格之轉接電連接器，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電子單元4、一連接板55、一電路板40、二排第一端子60及二排第二端子60，其中：該外覆體30為一塑膠材質。Referring to FIG. 42 , it is a twentieth embodiment of the present invention, which is a USB3.0 specification adapter electrical connector, which can be electrically connected to the front and back sides and electrically connected to the female seat, and includes an outer cover. 30. An electronic unit 4, a connecting board 55, a circuit board 40, two rows of first terminals 60 and two rows of second terminals 60, wherein: the outer covering 30 is made of a plastic material.

該連接板55為一塑膠板，其結合固定於該外覆體30前端，其後端一體成型一固定座59固定於該外覆體30內，該連接板55露出該外覆體30外。The connecting plate 55 is a plastic plate which is fixedly coupled to the front end of the outer covering body 30. The rear end of the connecting plate 55 is integrally formed with a fixing seat 59 fixed in the outer covering body 30. The connecting plate 55 is exposed outside the outer covering body 30.

電路板40設於該外覆體30內。The circuit board 40 is disposed in the outer cover 30.

該電子單元4為一USB3.0規格之電連接公頭及一轉接電路，其部份為該外覆體30所包覆，其電連接於該電路板40。The electronic unit 4 is a USB3.0 electrical connection male connector and a switching circuit. The electronic unit 4 is partially covered by the outer covering 30 and electrically connected to the circuit board 40.

該二排第一端子60固定於該外覆體30，該二排第一端子60各自為4個，該第一端子60設有不可彈動之延伸部，該延伸部一端延伸至該連接板55並設有一第一接點62平貼於該連接板55一板面，該延伸部另一端與該電路板40焊接而與該電子單元4電連接，該二排第一接點62分別平貼該連接板55兩板面。The two rows of first terminals 60 are fixed to the outer cover 30, and the two rows of first terminals 60 are each four. The first terminal 60 is provided with an unbounceable extension portion, and one end of the extension portion extends to the connecting plate. And a first contact 62 is disposed on the board surface of the connecting board 55. The other end of the extending portion is soldered to the circuit board 40 to be electrically connected to the electronic unit 4, and the two rows of first contacts 62 are respectively flat. The two plates of the connecting plate 55 are attached.

該二排第二端子70各自為5個，該第二端子70設有一可彈動之延伸部，該延伸部一端延伸至該連接板55並設有一凸出之第二接點72，該延伸部另一端設焊接於該電路板40而與該電子單元4電連接，該二排第二接點72分別凸出該連接板55之兩板面且位於該二排第一接點62之後，該第二接點72可隨該延伸部71上下彈動。Each of the two rows of second terminals 70 is five. The second terminal 70 is provided with a springable extension. The extension extends to the connecting plate 55 at one end and is provided with a protruding second contact 72. The extension The other end of the portion is soldered to the circuit board 40 and electrically connected to the electronic unit 4, and the two rows of second contacts 72 respectively protrude from the two boards of the connecting board 55 and are located behind the two rows of first contacts 62. The second contact 72 can be bounced up and down with the extension 71.

本實施之二排第一接點62及二排第二接點72皆係為相同之連接介面且電路序號相互為反向排列。The first row of the second node 62 and the second row of the second node 72 of the second row of the present embodiment are all the same connection interface and the circuit numbers are arranged in opposite directions.

藉由以上構造，該轉接電連接器以該連接板55正反雙面***一電連接母座之連接槽均可定位並電連接。With the above configuration, the adapter electrical connector can be positioned and electrically connected by connecting the connecting plate 55 to the connecting slot of the electrical connection base.

請參閱圖43及圖44，係為本發明第二十一實施例，其係為一具有雙連接介面之轉接電連接器，其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50，其中：該外覆體30為一塑膠材質。Referring to FIG. 43 and FIG. 44, it is a twenty-first embodiment of the present invention, which is an adapter electrical connector having a dual connection interface, which comprises an outer cover 30, a circuit board 40, and a connection board. 55. An electronic unit 4 and a limiting structure 50, wherein the outer covering 30 is made of a plastic material.

該電路板40之後段固定於該外覆體30內，該電路板40之前段露出該外覆體30外，即為該連接板55，該連接板55之兩板面設有二排第一接點41，該二排第一接點41係為電路板40上形成之電路接點，該二排第一接點41係為不同之連接介面。另外，該連接板55之形狀正反面對稱，故可正反雙面對接定位於一電連接母座。The rear portion of the circuit board 40 is fixed in the outer cover 30. The front portion of the circuit board 40 is exposed outside the outer cover 30, that is, the connecting plate 55. The two sides of the connecting plate 55 are provided with two rows of first The contact point 41, the two rows of first contacts 41 are circuit contacts formed on the circuit board 40, and the two rows of first contacts 41 are different connection interfaces. In addition, the shape of the connecting plate 55 is symmetrical on the front and back sides, so that the front and back double-sided docking can be positioned on an electrical connection base.

該電子單元4為一USB2.0規格之電連接母座及一轉接電路，其設於該外覆體30內，其電連接於該電路板40，該二排第一接點41電連接該電子單元4。The electronic unit 4 is a USB2.0-type electrical connection base and a switching circuit disposed in the outer cover 30, electrically connected to the circuit board 40, and the two rows of first contacts 41 are electrically connected. The electronic unit 4.

藉由以上構造，該轉接電連接器以該連接板55正反雙面***不同連接介面之電連接母座之連接槽作電連接。With the above configuration, the adapter electrical connector is electrically connected by connecting the connecting plate 55 to the connection slots of the electrical connection matings of different connection interfaces.

請參閱圖45及圖46，係本發明第二十二實施例，其係為一USB2.0規格之轉接電連接器，其大致與第二十一實施例相同，其差異在於本實施之二排第一接點41皆為4個係為相同之連接介面且電路序號相互為反向排列，該電子單元4為一雙連接介面之電連接母座及一轉接電路，如圖46所示，該電子單元4之舌片413兩板面分別設有一排第一接點411，該二排第一接點411係為不同之連接介面，該電子單元4設於該外覆體30內，其電連接於該電路板40，該二排第一接點41電連接該電子單元4。Referring to FIG. 45 and FIG. 46, it is a twenty-second embodiment of the present invention, which is a USB2.0 specification adapter electrical connector, which is substantially the same as the twenty-first embodiment, and the difference lies in the implementation. The two rows of first contacts 41 are all four identical connection interfaces and the circuit numbers are arranged in opposite directions. The electronic unit 4 is a double connection interface electrical connection base and a switching circuit, as shown in FIG. It is shown that the two sides of the tongue 413 of the electronic unit 4 are respectively provided with a row of first contacts 411, the two rows of first contacts 411 are different connection interfaces, and the electronic unit 4 is disposed in the outer cover 30 It is electrically connected to the circuit board 40, and the two rows of first contacts 41 are electrically connected to the electronic unit 4.

請參閱圖47及圖48，係本發明第二十三實施例，其係為一USB3.0規格之轉接電連接器，其大致與第二十實施例相同，其差異在於本實施之電子單元4為一雙面電連接之電連接公頭及一轉接電路，該電子單元4之連接槽410之頂面及底面皆設有一排第一接點411及一排第二接點412，該頂面之一排第一接點411及一排第二接點412和底面之一排第一接點411及一排第二接點412係為相同之連接介面且電路序號相互為反向排列；另外該連接板55之上下板面皆設有凸出之限位構造50。Referring to FIG. 47 and FIG. 48, it is a twenty-third embodiment of the present invention, which is a USB3.0 standard adapter electrical connector, which is substantially the same as the twentieth embodiment, and the difference is that the electronic device of the present embodiment The unit 4 is a double-sided electrical connection male connector and a switching circuit. The top and bottom surfaces of the connecting slot 410 of the electronic unit 4 are provided with a row of first contacts 411 and a row of second contacts 412. The first contact 411 and the second contact 412 of the top surface and the first contact 411 and the second contact 412 of the bottom of the row are the same connection interface and the circuit numbers are reversed from each other. Arranged; in addition, the lower plate surface of the connecting plate 55 is provided with a protruding limiting structure 50.

請參閱圖49，係本發明第二十四實施例，其係為一USB2.0規格之隨身碟，其大致與第一實施例相同，其差異在於本實施之連接板55和限位構造50為塑膠一體成型，該連接板55之上下板面各平貼設有一排4個第一接點62，該二排第一接點62形成在二排第一端子60，該二排第一接點62為相同連接介面且電路序號相互反向排列，該外覆體30為一金屬殼，該外覆體30包覆該連接板55之周邊只令上下板面露出，該連接板55兩側之外覆體30設有一定位凹槽35，當該隨身碟***一母座時可藉由該定位凹槽35與母座卡定。Referring to FIG. 49, it is a twenty-fourth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the first embodiment, and the difference lies in the connection plate 55 and the limit structure 50 of the present embodiment. For the plastic molding, the lower plate surface of the connecting plate 55 is flatly disposed with a row of four first contacts 62. The two rows of first contacts 62 are formed in the second row of first terminals 60, and the two rows are connected first. Point 62 is the same connection interface and the circuit numbers are arranged opposite to each other. The outer cover 30 is a metal shell, and the outer cover 30 covers the periphery of the connecting plate 55 to expose only the upper and lower plates, and both sides of the connecting plate 55 The outer cover 30 is provided with a positioning groove 35 which can be locked with the female seat by the positioning groove 35 when the portable disk is inserted into a female seat.

其中該二排第一端子60可採埋入射出定位於該連接板55或是採組裝方式定位於該連接板55。The two rows of the first terminals 60 can be buried and positioned on the connecting plate 55 or assembled in the connecting plate 55.

請參閱圖50，係本發明第二十五實施例，其係為一USB2.0規格之隨身碟，其大致與第二十四實施例相同，其差異在於本實施之定位凹槽35略為不同。Referring to FIG. 50, it is a twenty-fifth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the twenty-fourth embodiment, except that the positioning groove 35 of the present embodiment is slightly different. .

請參閱圖51，係本發明第二十六實施例，其係為一USB2.0規格之隨身碟，其大致與第二十四實施例相同，其差異在於本實施之連接板55兩側之外覆體30設有一定位彈片36，當該隨身碟***一母座時可藉由該定位彈片36與母座卡定。Referring to FIG. 51, it is a twenty-sixth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the twenty-fourth embodiment, and the difference lies in the two sides of the connecting plate 55 of the present embodiment. The outer cover 30 is provided with a positioning elastic piece 36. When the portable disk is inserted into a female seat, the positioning elastic piece 36 can be locked with the female seat.

請參閱圖52，係本發明第二十七實施例，其係為一USB2.0規格之隨身碟，其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50，其大致與第一實施例相同，其差異在於本實施之連接板55和限位構造50為塑膠一體成型，該電路板40較薄，該連接板55後端設有一套接槽52供該電路板40一端***卡定，該連接板55之上下板面各平貼設有一排4個第一接點62，該二排第一接點62形成在二排第一端子60，該二排第一接點62為相同連接介面且電路序號相互反向排列，該二排第一接點62皆電連接該電路板40，該電子單元4為一儲存單元，其電連接於該電路板40上且為該外覆體30所包覆，其包括一記憶體43及一控制電路45，該控制電路45係控制該電子單元之記憶體43之運作，該二排第一接點62電連接該電子單元4。Referring to FIG. 52, a twenty-seventh embodiment of the present invention is a USB2.0 specification flash drive including an outer cover 30, a circuit board 40, a connecting board 55, an electronic unit 4, and A limiting structure 50 is substantially the same as the first embodiment, except that the connecting plate 55 and the limiting structure 50 of the present embodiment are integrally formed of plastic, the circuit board 40 is thin, and a set of the rear end of the connecting plate 55 is provided. The connecting slot 52 is inserted into one end of the circuit board 40. The lower board surface of the connecting board 55 is flatly disposed with a row of four first contacts 62, and the two rows of first contacts 62 are formed in the second row of the first terminals. 60, the first row of the first two contacts 62 are the same connection interface and the circuit numbers are opposite to each other. The two rows of first contacts 62 are electrically connected to the circuit board 40. The electronic unit 4 is a storage unit and is electrically connected. The circuit board 40 is covered by the outer cover 30, and includes a memory 43 and a control circuit 45. The control circuit 45 controls the operation of the memory unit 43 of the electronic unit. Contact 62 is electrically coupled to the electronic unit 4.

藉由以上構造，該電路板40可採用較薄板體，當該外覆體30之厚度大致與連接板55之厚度相同時，位於該外覆體30內之電路板40上尚有足夠空間設置該電子單元4。With the above configuration, the circuit board 40 can adopt a thin plate body. When the thickness of the outer cover 30 is substantially the same as the thickness of the connecting plate 55, the circuit board 40 located in the outer cover 30 has sufficient space. The electronic unit 4.

請參閱圖53，係本發明第二十八實施例，其係為一USB2.0規格之隨身碟，其包括一外覆體30、一電路板40、一連接板55、一電子單元4及一限位構造50，其大致與第一實施例相同，其差異在於本實施之電路板40較薄，該電路板40前段上下二板面分別疊合一上、下電路板422、423，該疊合之上電路板422、電路板40及下電路板422伸出該外覆體30前端而形成該連接板55，該上、下電路板422、423各設有一排4個第一接點41，該二排第一接點41為相同連接介面且電路序號相互反向排列，該二排第一接點41藉由貫穿連接板55之導電部420皆電連接該電路板40，該導電部420係採鑽孔再填錫而成，該電子單元4為一儲存單元，其電連接於該電路板40上且為該外覆體30所包覆，其包括一記憶體43及一控制電路45，該控制電路45係控制該電子單元之記憶體43之運作，該二排第一接點41電連接該電子單元4。Referring to FIG. 53, a twenty-eighth embodiment of the present invention is a USB2.0 specification flash drive including an outer cover 30, a circuit board 40, a connecting board 55, an electronic unit 4, and A limiting structure 50 is substantially the same as the first embodiment, except that the circuit board 40 of the present embodiment is thinner, and the upper and lower boards of the front panel of the circuit board 40 are respectively superposed with an upper and lower circuit boards 422 and 423. The upper circuit board 422, the circuit board 40 and the lower circuit board 422 are extended from the front end of the outer cover 30 to form the connecting board 55. The upper and lower circuit boards 422 and 423 are respectively provided with a row of four first contacts. 41. The two rows of first contacts 41 are the same connection interface and the circuit numbers are opposite to each other. The two rows of first contacts 41 are electrically connected to the circuit board 40 through the conductive portions 420 penetrating the connection plate 55. The portion 420 is formed by drilling and refilling the tin. The electronic unit 4 is a storage unit electrically connected to the circuit board 40 and covered by the outer cover 30. The memory unit 43 includes a memory 43 and a control unit. a circuit 45, the control circuit 45 controls the operation of the memory 43 of the electronic unit, and the two rows of first contacts 41 electrically connect the electricity 4 unit.

請參閱圖54，相係本發明第二十九實施例，其係為一USB2.0規格之隨身碟，其大致與第二十八實施例相同，其差異在於本實施之電路板40前段下板面疊合一塑膠板37及一下電路板423，該疊合之電路板40、塑膠板37及下電路板422伸出該外覆體30前端而形成該連接板55，另外，該導電部420係採鑽孔再***一端子焊接而成。Referring to FIG. 54, a twenty-ninth embodiment of the present invention is a USB2.0 specification flash drive, which is substantially the same as the twenty-eighth embodiment, and the difference is that the circuit board 40 of the present embodiment is under the front section. A plastic plate 37 and a lower circuit board 423 are stacked on the board surface. The laminated circuit board 40, the plastic board 37 and the lower circuit board 422 extend from the front end of the outer cover 30 to form the connecting board 55. In addition, the conductive part The 420 series is drilled and then inserted into a terminal for welding.

請參閱圖55，係本發明第三十實施例，其係為一雙介面之隨身碟，其大致與第二十九實施例相同，其差異在於本實施設有二電路板40及一電子單元4，該二電路板40前段疊合一塑膠板37並伸出該外覆體30前端而形成該連接板55，該連接板55之上下板面各設有一排第一接點41，該二排第一接點41為不同之連接介面，該電子單元為一儲存單元且為該外覆體30所包覆，該電子單元4包括一記憶體43、一記憶體44及二控制電路45，該二控制電路45分別控制該記憶體43、44之運作，其中一電路板40設有該記憶體43及一控制電路45，該記憶體43及一控制電路45電連接其上之一排第一接點41，另一電路板40設有該記憶體44及另一控制電路45，該記憶體44及另一控制電路45電連接其上之一排第一接點41。 Referring to FIG. 55, a thirtieth embodiment of the present invention is a dual interface flash disk, which is substantially the same as the twenty-ninth embodiment, except that the present embodiment is provided with two circuit boards 40 and an electronic unit. 4. The front panel of the two circuit boards 40 is superposed on a plastic plate 37 and protrudes from the front end of the outer cover 30 to form the connecting plate 55. The lower plate surface of the connecting plate 55 is respectively provided with a row of first contacts 41. The first contact 41 is a different connection interface, and the electronic unit is a storage unit and is covered by the outer cover 30. The electronic unit 4 includes a memory 43 , a memory 44 and two control circuits 45 . The two control circuits 45 respectively control the operation of the memory 43, 44. One of the circuit boards 40 is provided with the memory 43 and a control circuit 45. The memory 43 and a control circuit 45 are electrically connected to one of the rows. One contact 41, the other circuit board 40 is provided with the memory 44 and another control circuit 45. The memory 44 and the other control circuit 45 are electrically connected to one of the first contacts 41 on the first row.

請參閱圖56及圖57，係本發明第三十一實施例，其係為一USB2.0規格之電連接線，其大致與第十八實施例相同，其差異在於本實施之連接板55兩板面皆一體成型設有凸出之限位構造50，藉以防止第一接點62短路，另外連接板55兩板面電路序號為1(傳送VCC)之第一接點62皆各自電連接一蕭基二極體46，再電連接至電連接線之一電線，藉由該蕭基二極體46可防止電流逆流，達到確保傳送VCC之第一接點62不會短路，除了使用蕭基二極體防短路外，亦可採用其他防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段，藉以達到電路安全保護效果。 Referring to FIG. 56 and FIG. 57, it is a thirty-first embodiment of the present invention, which is a USB2.0 standard electrical connection line, which is substantially the same as the eighteenth embodiment, and the difference lies in the connection board 55 of the present embodiment. The two plates are integrally formed with a protruding limit structure 50 to prevent the first contact 62 from being short-circuited, and the first contacts 62 of the connecting plate 55 having the circuit board number 1 (transport VCC) are electrically connected. A Xiaoji diode 46 is electrically connected to one of the wires of the electrical connection line, and the Schottky diode 46 prevents current from flowing back, so as to ensure that the first contact 62 of the VCC is not short-circuited, except for using Xiao In addition to the short circuit of the base diode, other anti-backflow electronic components or short-circuit proof electronic components or circuit safety protection components or safety circuit setting means may be used to achieve the circuit safety protection effect.

本實施例之連接板55之前邊、二側邊及後段套設包覆有一金屬殼38，該金屬殼38兩側各設有一定位凹槽35，當該電連接線***一母座時可藉由該定位凹槽35與母座卡定。 The front side, the two side edges and the rear side of the connecting plate 55 of the embodiment are sleeved with a metal shell 38. The metal shell 38 is provided with a positioning groove 35 on each side of the connecting rod 55. When the electric connecting line is inserted into a female seat, the socket can be borrowed. The positioning groove 35 is locked with the female seat.

請參閱圖58，係本發明第三十二實施例，其係為一USB2.0規格之電連接線，其大致與第三十一實施例相同，其差異在於本實施之連接板55內更設有一金屬材質之補強板59，藉以分隔二排第一端子60和二排第一接點62。 Referring to FIG. 58, a thirty-second embodiment of the present invention is a USB2.0 standard electrical connection line, which is substantially the same as the thirty-first embodiment, and the difference is that the connection board 55 of the present embodiment further A metal reinforcing plate 59 is provided to partition the second row of first terminals 60 and the second row of first contacts 62.

請參閱圖59，係本發明第三十三實施例，其係為一USB2.0規格之電連接線，其大致與第三十二實施例相同，該連接板55內亦設有一金屬材質之補強板59，其差異在於本實施不設有金屬殼。 Please refer to FIG. 59, which is a thirty-third embodiment of the present invention, which is a USB 2.0 gauge. The electrical connection of the grid is substantially the same as that of the thirty-second embodiment. The connecting plate 55 is also provided with a reinforcing plate 59 made of metal. The difference is that the metal shell is not provided in the present embodiment.

本發明之連接板直接接觸並固定於該外覆體，與顯示卡上之封裝之電子元件透過接腳固定於電路板不同，在此特別聲明區別。 The connecting board of the present invention is directly in contact with and fixed to the outer covering, and is different from the electronic component of the package on the display card through the pins fixed to the circuit board, and the difference is specifically stated herein.

請參閱圖60、圖61、圖62、及圖63，係為本發明第三十四實施例，其係為一USB2.0規格之隨身碟，其可正反雙面電連接一電連接母座，其包括一外覆體30、一電路板40、一連接板55、一電子單元4、一限位構造50及一排第一端子60，其中：該電路板40前段上面設有一絕緣座體34而形成該連接板55，本實施之連接板55為一對接構造，該絕緣座體34設有該一排4個第一端子60，每一第一端子60設有一第一接點62平貼於該連接板55上板面且延伸一接腳64與該電路板55焊接，該接腳64係由該連接板55前端彎折向下至該電路板40上面以SMT方式焊接，如此不佔用該電路板40後段上面區域，有利於該電路板40後段上面之利用，該電路板40前段下面設有一排四個金手指之第一接點41，該一排第一接點41形成該連接板55下板面之連接介面，該絕緣座體34截面呈ㄇ形狀，使該絕緣座體34與電路板40前段間呈一空間39，如此電路板40前段上面仍可配置電子元件430，該電路板40為薄板，約為0.3mm至0.5mm。 Please refer to FIG. 60, FIG. 61, FIG. 62, and FIG. 63, which are a thirty-fourth embodiment of the present invention, which is a USB2.0 specification flash drive, which can be electrically connected to the front and back sides. The base includes an outer cover 30, a circuit board 40, a connecting plate 55, an electronic unit 4, a limiting structure 50 and a row of first terminals 60. The circuit board 40 is provided with an insulating seat on the front side of the circuit board 40. The connecting plate 55 is formed by the body 34. The connecting plate 55 of the present embodiment is a pair of connected structures. The insulating base 34 is provided with the row of four first terminals 60, and each of the first terminals 60 is provided with a first contact 62. Flattened on the upper surface of the connecting plate 55 and extending a pin 64 to be soldered to the circuit board 55. The pin 64 is bent from the front end of the connecting plate 55 downward to the upper surface of the circuit board 40 by SMT welding. The upper area of the rear section of the circuit board 40 is not occupied, which is beneficial to the use of the rear section of the circuit board 40. The first contact point 41 of a row of four gold fingers is arranged under the front section of the circuit board 40, and the first row of the first contact 41 is formed. a connecting interface of the lower surface of the connecting plate 55, the insulating base 34 has a cross-sectional shape, so that the insulating base 34 and the circuit board 40 Segment in a space 39 between, so the circuit board 40 is still above the pre-stage configuration of electronic components 430, the circuit board 40 is a thin, approximately 0.3mm to 0.5mm.

該二排第一接點62、41皆為USB2.0連接介面，係可分別傳送VCC、USB D-、USB D+及GND等訊號，該二排第一接點41係為相同之連接介面且電路序號相互為反向排列，如圖62所示，該連接板55上板面之一排第一接點62之電路序號由右至左為a1，a2，a3，a4，該連接板55下板面之一排第一接點41之電路序號由右至左為b4，b3，b2，b1。另外，該連接板55之形狀正反面對稱，故可正反雙面對接定位於一電連接母座。The first row of contacts 62 and 41 of the second row are USB2.0 connection interfaces, and the signals of VCC, USB D-, USB D+ and GND can be respectively transmitted, and the first contacts 41 of the two rows are the same connection interface and The circuit numbers are arranged in opposite directions to each other. As shown in FIG. 62, the circuit number of the first contact 62 of one of the upper surfaces of the connecting plate 55 is a1, a2, a3, a4 from right to left, and the connecting plate 55 is under The circuit number of the first contact 41 of one row of the board faces is b4, b3, b2, b1 from right to left. In addition, the shape of the connecting plate 55 is symmetrical on the front and back sides, so that the front and back double-sided docking can be positioned on an electrical connection base.

該二排第一接點62、41相同之電路序號者電連接而串接成一組，即a1和b1電連接，a2和b2電連接，a3和b3電連接，a4和b4電連接，其中a1和b1係為電源接點，絕不可造成短路，故a1和b1皆先經一蕭基二極體46再相互電連接，該蕭基二極體46之作用主要是防止電流逆流，如此可達到防短路效果。The same circuit numbers of the first rows of the first contacts 62, 41 are electrically connected and connected in series, that is, a1 and b1 are electrically connected, a2 and b2 are electrically connected, a3 and b3 are electrically connected, and a4 and b4 are electrically connected, wherein a1 And b1 is a power contact, and must not cause a short circuit, so a1 and b1 are first electrically connected to each other via a Schottky diode 46, and the function of the Schottky diode 46 is mainly to prevent current from flowing backward, so that Short-circuit proof effect.

上述使用蕭基二極體防短路係為一種電子式防逆流或防短路之電路安全保護手段的一種方式，然而亦有多種方式如設置防逆流電子元件或防短路電子元件或電路安全保護元件或安全電路設置手段，藉以達到電路安全保護效果。The above-mentioned use of the Xiaoji diode anti-short circuit is a way of electronic circuit protection against electronic backflow or short circuit, but there are also various ways such as providing anti-backflow electronic components or short-circuit proof electronic components or circuit safety protection components or Safety circuit setting means to achieve circuit safety protection.

該外覆體30及連接板55結合成一對接構造，該外覆體30與該絕緣座體34為塑膠一體射出成型，該外覆體30覆蓋該電路板40後段上面，該外覆體30截面亦呈ㄇ形狀，使該外覆體30與電路板40後段間亦呈一空間39。The outer cover 30 and the connecting plate 55 are combined into a pair of joint structures. The outer cover 30 and the insulating base 34 are integrally molded by plastic. The outer cover 30 covers the rear surface of the circuit board 40. The outer cover 30 has a cross section. The shape of the crucible is also such that a space 39 is formed between the outer cover 30 and the rear portion of the circuit board 40.

該電子單元4為一儲存單元，其電連接於該電路板40後段上面且為該外覆體30所覆蓋，其包括一記憶體及一控制電路，該記憶體可為但不限於快閃記憶體(flash memory)或唯讀記憶體(ROM)，該記憶體之容量大小不限，該控制電路係控制該電子單元之記憶體之運作，該二排第一接點62、41電連接該電子單元4。The electronic unit 4 is a storage unit electrically connected to the rear portion of the circuit board 40 and covered by the outer cover 30. The memory unit includes a memory and a control circuit. The memory can be, but not limited to, flash memory. a flash memory or a read-only memory (ROM), the size of the memory is not limited, the control circuit controls the operation of the memory of the electronic unit, and the two rows of first contacts 62, 41 are electrically connected to the Electronic unit 4.

該限位構造50與該絕緣座體34一體成型，該限位構造50於該連接板55兩板面二側各形成一條前後方向之凸肋，該限位構造50較該連接板55兩板面之第一接點62、41凸出藉以保護該二排第一接點41。The limiting structure 50 is integrally formed with the insulating seat body 34. The limiting structure 50 forms a rib in the front-rear direction on both sides of the connecting plate 55. The limiting structure 50 is opposite to the connecting plate 55. The first contacts 62, 41 of the face protrude to protect the two rows of first contacts 41.

該補強板59為金屬材質且截面呈ㄈ形狀，其設於該絕緣座體34之二側，該補強板59由連接板55延伸至該電路板40後段且設有焊板591與該電路板40焊接固定。The reinforcing plate 59 is made of a metal material and has a cross-section in a meandering shape. The reinforcing plate 59 is disposed on two sides of the insulating base 34. The reinforcing plate 59 extends from the connecting plate 55 to the rear portion of the circuit board 40 and is provided with a soldering plate 591 and the circuit board. 40 welded fixed.

另外，在實施上該絕緣座體34亦可直接均設有多個小面積之焊板，藉由該焊板與電路板焊接亦可達到補強效果。In addition, in the implementation, the insulating base 34 can also be directly provided with a plurality of small-area soldering plates, and the soldering plate and the circuit board can also be welded to achieve the reinforcing effect.

藉由以上構造，本實施例更具有以下優點：With the above configuration, the embodiment has the following advantages:

1.連接板55內形成空間39可使電路板40前段上面仍可配置電子元件430。1. Forming a space 39 in the connecting plate 55 allows the electronic component 430 to be disposed on the front side of the circuit board 40.

2.該外覆體30與該絕緣座體34為塑膠一體射出成型，如此製造上甚為簡易。2. The outer cover 30 and the insulating base 34 are integrally molded by plastic, which is simple in manufacturing.

3.同時設計電子式防短路之蕭基二極體46及機構式防刮傷及防短路之限位構造50，可確保雙面插接之電路安全。3. Simultaneously design the electronic short circuit-proof Xiaoji diode 46 and the mechanical scratch-proof and short-circuit proof limit structure 50 to ensure the safety of the double-sided plugged circuit.

本實施例之製造方法包括以下步驟：The manufacturing method of this embodiment includes the following steps:

一、提供一電路板，該電路板一面設有2組依序反向排列USB2.0連接介面的串接電路、一組USB2.0連接介面的接點、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、一電子單元的電路及接點、及補強板的焊接區，該2組依序反向排列連接介面的串接電路與該電子單元的電路電連接，該電路板另一面設有一組USB2.0連接介面，其為金手指；1. Providing a circuit board with two sets of serially connected circuits of USB2.0 connection interface, a set of contacts of USB2.0 connection interface, anti-backflow or short circuit prevention or other electronic type a circuit and a contact of the circuit safety protection device, a circuit and a contact of the electronic unit, and a soldering area of the reinforcing plate, wherein the two sets of serially connected circuits of the connection interface are electrically connected to the circuit of the electronic unit, The other side of the circuit board is provided with a set of USB2.0 connection interfaces, which are golden fingers;

二、提供一絕緣座體，該絕緣座體為一塑膠座體且設有一組端子結構的USB2.0連接介面，該端子設有接腳，絕緣座體下方與電路板間成一空間，藉由該空間可排列電子元件，該絕緣座體設有補強板，該絕緣座體一體延伸座體長度而形成一外覆體，該絕緣座體和該電路前後齊平，使完全蓋合該電路板上排放電子元件的區域；2. Providing an insulating base body, the insulating base body is a plastic seat body and is provided with a USB2.0 connection interface of a terminal structure, the terminal is provided with a pin, and a space is formed between the underside of the insulating base and the circuit board, by The space can be arranged with an electronic component, the insulating seat is provided with a reinforcing plate, the insulating seat body integrally extends the length of the seat body to form an outer covering body, and the insulating seat body and the circuit are flush with each other to completely cover the circuit board. The area on which the electronic components are discharged;

三、提供防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置；3. Provide anti-backflow electronic components or short-circuit proof electronic components or Xiaoji diodes or other electronic circuit safety protection devices;

四、提供一電子單元，該電子單元為一儲存單元，包括有記憶體及控制電路；4. Providing an electronic unit, wherein the electronic unit is a storage unit, including a memory and a control circuit;

五、提供焊接材料塗抹於該電路板之接點及補強板的焊接區；5. Providing a welding material to be applied to the joint of the circuit board and the welding zone of the reinforcing plate;

六、將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置、電子單元、及絕緣座體分別排列貼放於該電路板的接點，該絕緣座體完全蓋合該電路板上排放電子元件的區域；以及6. Aligning the anti-backflow electronic component or the short-circuit prevention electronic component or the Xiaoji diode or other electronic circuit safety protection device, the electronic unit, and the insulating base body on the joint of the circuit board, the insulating seat The body completely covers the area where the electronic components are discharged on the circuit board;

七、將分別貼放於該電路板上的元件，進行迴焊焊板加工，完成該簡易板片式雙面連接介面電子裝置的加工製程。7. The components respectively placed on the circuit board are processed by the reflow soldering plate to complete the processing process of the simple plate-type double-sided interface electronic device.

上述製造方法中，該電路板之2組USB2,0連接介面的串接電路，其中電路序號1之電路各自電連接該一防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置，另外該絕緣座體設有防短路凸出二組USB2.0連接介面之限位構造。In the above manufacturing method, two sets of USB2,0 connection interface serial circuits of the circuit board, wherein the circuit of circuit number 1 is electrically connected to the anti-backflow electronic component or the short-circuit prevention electronic component or the Xiaoji diode or other electronic The circuit safety protection device, in addition, the insulating base body is provided with a limit structure for preventing short circuit and protruding two sets of USB2.0 connection interfaces.

另外，該電子單元可為一無線收發單元而成一無線收發裝置，或可為一連接線材而成一電連接線公頭，或可為一轉接電路及一電連接器而成一轉接電連接器，或可為一擴充電路及一組電連接插座而成一擴充插座，或可為一控制單元而成一IC控制器。。In addition, the electronic unit can be a wireless transceiver unit to form a wireless transceiver device, or can be a connecting wire to form an electrical connector male connector, or can be a switching circuit and an electrical connector to form a switching electrical connector. Alternatively, it may be an expansion socket and an electrical connection socket to form an expansion socket, or may be a control unit to form an IC controller. .

本發明之相關製造方法，在其他實施例中亦有揭露說明。The related manufacturing method of the present invention is also disclosed in other embodiments.

請參閱圖63A，該第三十四實施例之外覆體30之上面及二側面和該絕緣座體34之兩側面皆可設置透空孔301，如此在外覆體30和絕緣座體34熱封於電路板40或迴焊焊板加工時具有空氣對流，而有較佳之熱封效果或較佳迴焊焊板加工。Referring to FIG. 63A, the upper surface and the two sides of the outer cover 30 and the two sides of the insulating base 34 of the thirty-fourth embodiment may be provided with a through hole 301, so that the outer cover 30 and the insulating base 34 are hot. The sealing on the circuit board 40 or the reflow soldering plate has air convection, and has better heat sealing effect or better reflow soldering plate processing.

請參閱圖64，係本發明第三十五實施例，其係為一USB2.0規格之隨身碟，其大致與第三十四實施例相同，其差異在於本實施例之電路板40較厚，約為0.8mm至1.1mm。Referring to FIG. 64, it is a thirty-fifth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-fourth embodiment, and the difference is that the circuit board 40 of the embodiment is thicker. , about 0.8mm to 1.1mm.

請參閱圖65，係本發明第三十六實施例，其係為一USB2.0規格之隨身碟，其大致與第三十四實施例相同，其差異在於本實施例之一排第一端子60之接腳64係由該連接板55後端彎折向下至該電路板後段上面以SMT方式焊接。Referring to FIG. 65, it is a thirty-sixth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-fourth embodiment, and the difference is that the first terminal of the first embodiment of the present embodiment The pin 64 of the 60 is bent by the rear end of the connecting plate 55 down to the rear of the circuit board and soldered in an SMT manner.

請參閱圖66，係本發明第三十七實施例，其係為一USB2.0規格之隨身碟，其大致與第三十六實施例相同，其差異在於本實施例之一排第一端子60之接腳64係穿過該電路板作焊接，且該外覆體30係為封膠體，其以封膠方式覆蓋該電路板40上面，同時將連接板55之絕緣座體與電路板40之空間補滿以增加強度，此亦為補強手段之一種方式。Referring to FIG. 66, it is a thirty-seventh embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-sixth embodiment, and the difference is that the first terminal of the first embodiment of the present embodiment The pin 64 of the 60 is soldered through the circuit board, and the outer cover 30 is a sealant, which covers the upper surface of the circuit board 40 in a sealing manner, and simultaneously insulates the insulating body of the connecting plate 55 with the circuit board 40. The space is filled up to increase the intensity, which is also a way to reinforce.

請參閱圖67及圖68，係本發明第三十八實施例，其係為一USB2.0規格之隨身碟，其大致與第三十七實施例相同，其差異在於本實施例之電路板40前段上面疊合一第二電路板422而形成該連接板55，該連接板上板面之一排第一接點41形成在該第二電路板上面且為一排金手指，該連接板下板面之一排第一接點41形成在該電路板40前段下面且為一排金手指，另外，該限位構造50為二絕緣座體，其分別凸出該連接板55之上下面且在二排第一接點之電路序號1,2之間及電路序號3,4之間。Referring to FIG. 67 and FIG. 68, it is a thirty-eighth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-seventh embodiment, and the difference lies in the circuit board of the embodiment. The first circuit board 422 is superposed on the front side of the 40 to form the connecting board 55. The first contact 41 of the board surface of the connecting board is formed on the second circuit board and is a row of gold fingers. The connecting board A row of first contacts 41 of the lower plate surface is formed under the front section of the circuit board 40 and is a row of gold fingers. In addition, the limiting structure 50 is a second insulating seat body respectively protruding above and below the connecting plate 55. And between the circuit numbers 1, 2 of the first row of the second row and between the circuit numbers 3, 4.

請參閱圖69、圖70及圖71，係本發明第三十九實施例，其係為一USB2.0規格之隨身碟，其大致與第三十七實施例相同，其差異在於本實施例之連接板55之絕緣座體與該外覆體30皆為封膠體，其以封膠方式覆蓋該電路板40上面，該一排第一端子60係前後端皆向下彎折接腳64至該電路板上面以SMT方式焊接，另外在封膠時直接形成該限位構造50，該限位構造50位置則與第三十八實施例相同。Referring to FIG. 69, FIG. 70 and FIG. 71, it is a thirty-ninth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-seventh embodiment, and the difference lies in this embodiment. The insulating body of the connecting plate 55 and the outer covering 30 are both a sealing body, which covers the upper surface of the circuit board 40 in a sealing manner. The first and second terminals of the row of the first terminal 60 are bent downwardly to the feet 64 to The circuit board is soldered by SMT, and the limiting structure 50 is directly formed during sealing. The position of the limiting structure 50 is the same as that of the thirty-eighth embodiment.

請參閱圖72、圖73及圖74，係本發明第四十實施例，其係為一USB2.0規格之隨身碟，其大致與第三十七實施例相同，其差異在於本實施例之電路板40為厚板，約為1.0mm，該連接板55之絕緣座體37與電路板40前段間沒有空間。Referring to FIG. 72, FIG. 73 and FIG. 74, it is a 40th embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-seventh embodiment, and the difference lies in the embodiment. The circuit board 40 is a thick plate of about 1.0 mm, and there is no space between the insulating base 37 of the connecting plate 55 and the front portion of the circuit board 40.

請參閱圖75、圖76及圖77，係本發明第四十一實施例，其係為一USB2.0規格之隨身碟，其大致與第二十七實施例相同，其差異在於本實施之該二排第一端子60埋入該連接板55中射出成型，該外覆體30係為封膠體，其以封膠方式覆蓋該電路板40上面，另外該連接板55兩側各設有一補強板59，補強板59為金屬材質且截面呈凹字形，該補強板59由連接板55延伸至該電路板40，該補強板59與該電路板40夾合固定。Referring to FIG. 75, FIG. 76 and FIG. 77, a forty-one embodiment of the present invention is a USB2.0 specification flash drive, which is substantially the same as the twenty-seventh embodiment, and the difference lies in the implementation. The two rows of the first terminals 60 are embedded in the connecting plate 55, and the outer covering body 30 is a sealing body, which covers the upper surface of the circuit board 40 in a sealing manner, and a reinforcing member is disposed on each side of the connecting plate 55. The reinforcing plate 59 is made of a metal material and has a concave cross section. The reinforcing plate 59 extends from the connecting plate 55 to the circuit board 40. The reinforcing plate 59 is fixed to the circuit board 40.

請參閱圖78，係本發明第四十二實施例，其係為一USB2.0規格之隨身碟，其大致與第四十一實施例相同，其差異在於本實施之二排第一端子60之接腳64皆焊接於該電路板40上面。Referring to FIG. 78, it is a forty-second embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the forty-first embodiment, and the difference is that the first row of the first terminal 60 of the present embodiment The pins 64 are soldered to the circuit board 40.

請參閱圖79，係本發明第四十三實施例，其係為一USB2.0規格之隨身碟，其大致與第四十一實施例相同，其差異在於本實施例之連接板不設卡槽卡定該電路板40。Referring to FIG. 79, it is a forty-third embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the forty-first embodiment, and the difference is that the connection board of the embodiment does not have a card. The slot locks the board 40.

請參閱圖80，係本發明第四十四實施例，其係為一USB2.0規格之隨身碟，其大致與第四十二實施例相同，其差異在於本實施例之二排第一端子60之接腳64皆焊接於該電路板40下面。Referring to FIG. 80, it is a forty-fourth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the forty-second embodiment, and the difference is that the first row of the first terminal of the embodiment The pins 64 of the 60 are soldered under the circuit board 40.

請參閱圖81、圖82及圖83，係本發明第四十五實施例，其係為一USB2.0規格之隨身碟，其大致與第三十四實施例相同，其差異在於本實施例之電路板40前段下面兩側各設有一塑膠塊312，該二塑膠塊312再疊合一第二電路板424而形成該連接板55，該第二電路板424和該電路板40間呈一空間且兩者前後對齊，該連接板55一板面之一排第一接點41形成在該第二電路板424外面且為一排金手指，該連接板55另一板面之一排第一接點41形成在該電路板40前段外面且為一排金手指。Referring to FIG. 81, FIG. 82 and FIG. 83, it is a forty-fifth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-fourth embodiment, and the difference lies in the embodiment. A plastic block 312 is disposed on each of the two sides of the front side of the circuit board 40. The two plastic blocks 312 are further laminated with a second circuit board 424 to form the connecting board 55. The second circuit board 424 and the circuit board 40 are formed. The space and the front and rear alignment of the two sides of the board 55 are formed on the outer side of the second circuit board 424 and are a row of gold fingers, and the other side of the board 55 is in a row. A contact 41 is formed outside the front section of the circuit board 40 and is a row of gold fingers.

該第二電路板424和該電路板40藉由插梢425與該二塑膠塊312結合固定，另外該二塑膠塊312一體成型有該限位構造50，該外覆體30係為封膠體，其以封膠方式覆蓋該電路板40和該第二電路板425之內面。The second circuit board 424 and the circuit board 40 are fixedly coupled to the two plastic blocks 312 by the insertion end 425. The two plastic blocks 312 are integrally formed with the limiting structure 50, and the outer covering body 30 is a sealing body. It covers the inner surface of the circuit board 40 and the second circuit board 425 in an encapsulation manner.

請參閱圖84及圖85，係本發明第四十六實施例，其係為一USB2.0規格之電子裝置，其大致與第三十六實施例相同，其差異在於本實施之外覆體30係為一高度較連接板55大之塑膠盒體，如此該電路板40在外覆體30內中間，該電路板40兩面與外覆體30均有足夠空間可配置相關之電子元件。Referring to FIG. 84 and FIG. 85, it is a forty-sixth embodiment of the present invention, which is a USB2.0 standard electronic device, which is substantially the same as the thirty-sixth embodiment, and the difference lies in the cover of the present embodiment. The 30 series is a plastic case having a height greater than that of the connecting plate 55. Thus, the circuit board 40 is intermediate in the outer cover 30. Both sides of the circuit board 40 and the outer cover 30 have sufficient space for arranging related electronic components.

請參閱圖86，係本發明第四十七實施例，其係為一USB2.0規格之電子裝置，其大致與第三十實施例相同，其差異在於本實施之外覆體30係為一高度較連接板55大之塑膠盒體，且該二電路板40皆為約0.3mm之薄板，如此該二電路板40在外覆體30內中間，該二電路板40兩面均有足夠空間可配置相關之電子元件，可縮短整個電子裝置之長度。86 is a USB device of the present invention, which is substantially the same as the thirtieth embodiment, and the difference is that the cover 30 is one of the embodiments. a plastic case having a height greater than that of the connecting plate 55, and the two circuit boards 40 are each a thin plate of about 0.3 mm, so that the two circuit boards 40 are in the middle of the outer cover 30, and the two circuit boards 40 have sufficient space on both sides for arranging. Related electronic components can shorten the length of the entire electronic device.

請參閱圖87及圖88，係本發明第四十八實施例，其係為一迷你型USB2.0規格之電子裝置，其大致與第三十四實施例相同，其差異在於本實施之連接板55為一對接構造，該對接構造為一塑膠材質之絕緣座體34下方結合一電路板40，該絕緣座體設有一排第一端子60，該對接構造一板面之一排第一接點62形成在該一排第一端子60，該一排第一端子60延伸接腳與該電路板40電連接，該對接構造另一板面之一排第一接點41形成在該電路板40下面且為一排金手指，絕緣座體34與該電路板40間呈一空間，該電子單元4設於該連接板55內且電連接於該電路板40上。Referring to FIG. 87 and FIG. 88, it is a forty-eighth embodiment of the present invention, which is an electronic device of a mini USB 2.0 specification, which is substantially the same as the thirty-fourth embodiment, and the difference lies in the connection of the present embodiment. The board 55 is a pair of connected structures. The mating structure is a plastic material. The insulating base 34 is coupled to a circuit board 40. The insulating base is provided with a row of first terminals 60. The mating structure is first connected to one of the boards. A pair of first terminals 60 are formed in the row of first terminals 60. The row of first terminals 60 are electrically connected to the circuit board 40. The butt structure is formed on the circuit board by a row of first contacts 41. There is a space between the insulating base 34 and the circuit board 40, and the electronic unit 4 is disposed in the connecting board 55 and electrically connected to the circuit board 40.

上述第三十四實施例至第四十八實施例中之電子單元4除了可為一儲存單元而成一隨身碟外，或可為一無線收發單元而成一無線收發裝置，或可為一連接線材而成一電連接線公頭，或可為一轉接電路及一電連接器而成一轉接電連接器，或可為一擴充電路及一組電連接插座而成一擴充插座，或可為一控制單元而成一IC控制器。The electronic unit 4 in the above-mentioned thirty-fourth to forty-eighth embodiments may be a storage unit or a wireless transceiver unit, or may be a connecting wire. Forming an electrical connector male, or an adapter circuit and an electrical connector to form an adapter electrical connector, or an expansion circuit and a set of electrical connection sockets to form an expansion socket, or can be a control The unit is an IC controller.

在第三十四實施例中所述之製造方法中，其中該電路板之2組依序反向排列USB2.0連接介面的串接電路及接點的後方更設有另2組依序反向排列的連接介面的串接電路及焊墊；該絕緣座體設有另2組彈動端子結構的USB3.0連接介面，該彈動端子設有接腳，USB3.0連接介面在USB2.0連接介面在之後；該電路板設有供該彈動端子連接介面彈動的透空槽；如此即可製造一USB3.0規格之電子產品。In the manufacturing method described in the thirty-fourth embodiment, wherein the two groups of the circuit board are arranged in reverse order, the serial connection circuit of the USB2.0 connection interface and the rear of the contact point are further provided with another two groups. The serial connection circuit and the bonding pad of the arranged connection interface; the insulating base body is provided with two sets of USB3.0 connection interfaces of the spring terminal structure, the spring terminal is provided with the pin, and the USB3.0 connection interface is on the USB2. The 0 connection interface is behind; the circuit board is provided with a through slot for the spring terminal connection interface to be springed; thus, a USB3.0 specification electronic product can be manufactured.

另外，在製造上該絕緣座體亦可直接均設有多個小面積之焊板，藉由該焊板與電路板焊接亦可達到補強效果，該絕緣座體亦可分開延伸座體長度而形成一外覆體完全蓋合該電路板上排放電子元件的區域。In addition, in the manufacturing, the insulating base body can also be directly provided with a plurality of small-area welding plates, and the welding plate can be welded to the circuit board to achieve the reinforcing effect, and the insulating seat body can also extend the length of the seat body separately. Forming an outer cover completely covers the area of the circuit board that discharges electronic components.

請參閱圖89及圖90，係本發明第四十九實施例，其係為一USB2.0規格之隨身碟，其大致與第四十一實施例相同，本實施同樣是該連接板55與該二排第一端子60以埋入方式塑膠射出成型，該連接板55兩側各設有一補強板59，補強板59為金屬材質且截面呈字形，該補強板59由連接板55延伸至該電路板40，該補強板59與該電路板40夾合固定，本實施之差異在於暫時未設有封膠體覆蓋該電路板40上面並將該電子單元4覆蓋。Referring to FIG. 89 and FIG. 90, it is a 49th embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the forty-first embodiment. The present embodiment is also the connection board 55 and The two rows of first terminals 60 are plastically injection molded in a buried manner, and a reinforcing plate 59 is disposed on each side of the connecting plate 55. The reinforcing plate 59 is made of metal and has a cross section. The reinforcing plate 59 extends from the connecting plate 55 to the circuit board 40. The reinforcing plate 59 is fixed to the circuit board 40. The difference in this embodiment is that the sealing body is not temporarily covered on the circuit board 40 and the The electronic unit 4 is covered.

另外，該二排第一接點62、41皆為USB2.0連接介面，係可分別傳送VCC、USB D-、USB D+及GND等訊號，該二排第一接點41係為相同之連接介面且電路序號相互為反向排列，如圖62所示，該連接板55上板面之一排第一接點62之電路序號由右至左為a1，a2，a3，a4，該連接板55下板面之一排第一接點41之電路序號由右至左為b4，b3，b2，b1。另外，該連接板55之形狀正反面對稱，故可正反雙面對接定位於一電連接母座。In addition, the two rows of first contacts 62, 41 are USB2.0 connection interfaces, which can respectively transmit signals such as VCC, USB D-, USB D+ and GND, and the first rows of the first contacts 41 are the same connection. The interface and the circuit numbers are arranged in opposite directions to each other. As shown in FIG. 62, the circuit number of the first contact 62 of one of the upper surfaces of the connecting plate 55 is a1, a2, a3, a4 from right to left, and the connecting plate The circuit number of the first contact 41 of one of the lower plates of 55 is from right to left as b4, b3, b2, b1. In addition, the shape of the connecting plate 55 is symmetrical on the front and back sides, so that the front and back double-sided docking can be positioned on an electrical connection base.

請參閱圖91，係本發明第五十實施例，其大致與第四十九實施例相同，其差異在於本實施之補強板59截面呈形。Referring to FIG. 91, it is a fiftieth embodiment of the present invention, which is substantially the same as the forty-ninth embodiment, and the difference is that the reinforcing plate 59 of the present embodiment has a cross section. shape.

請參閱圖92，係本發明第五十一實施例，其大致與第四十九實施例相同，其差異在於本實施之補強板59截面呈形。Referring to FIG. 92, it is a fifty-first embodiment of the present invention, which is substantially the same as the forty-ninth embodiment, and the difference is that the reinforcing plate 59 of the present embodiment has a cross section. shape.

請參閱圖93，係本發明第五十二實施例，其大致與第四十九實施例相同，其差異在於本實施之補強板59截面亦呈形，然並未卡合電路板40。Referring to FIG. 93, it is a fifty-second embodiment of the present invention, which is substantially the same as the forty-ninth embodiment, and the difference is that the cross section of the reinforcing plate 59 of the present embodiment is also However, the circuit board 40 is not engaged.

請參閱圖94及圖95，係本發明第五十三實施例，其係為一USB2.0規格之隨身碟，其大致與第四十九實施例相同，本實施之差異在於該補強板59與該連接板55為塑膠一體成型，該補強板59一體連接於該連接板55後端二側向後延伸，該補強板59截面亦呈凹字形套合該電路板40兩側。Referring to FIG. 94 and FIG. 95, it is a fifty-third embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the forty-ninth embodiment. The difference in this embodiment lies in the reinforcing plate 59. The connecting plate 55 is integrally formed with a plastic. The reinforcing plate 59 is integrally connected to the rear side of the connecting plate 55 and extends rearward. The reinforcing plate 59 also has a concave cross section on both sides of the circuit board 40.

另外，該補強板59之截面可為其他形狀，以套合或卡合或粘合該電路板兩側。In addition, the reinforcing plate 59 may have other shapes in cross section to fit or snap or bond the sides of the circuit board.

請參閱圖96及圖97，係本發明第五十四實施例，其係為一USB2.0規格之隨身碟，其大致與第四十九實施例相同，本實施之差異在於該補強構造為設於該連接板55之套接槽52，該電路板40前段套接卡定於該套接槽52，套接槽52位於連接板55厚度中間。Referring to FIG. 96 and FIG. 97, it is a fifty-fourth embodiment of the present invention, which is a USB2.0 standard flash drive, which is substantially the same as the forty-ninth embodiment. The difference in this embodiment is that the reinforcing structure is The socket 40 is disposed on the sleeve groove 52 of the connecting plate 55. The front portion of the circuit board 40 is sleeved in the socket groove 52, and the socket groove 52 is located in the middle of the thickness of the connecting plate 55.

請參閱圖98及圖99，係本發明第五十五實施例，其係為一USB2.0規格之隨身碟，其大致與第四十實施例及第四十九實施例相同，本實施同樣是該連接板55包括一絕緣座體34及該電路板40之前段，該絕緣座體34設於該電路板40之前段上，該絕緣座體34上面設有該一排第一接點62，該絕緣座體上之一排第一接點62係形成在一排第一端子60，該第一端子60設有接腳64電連接或焊接在該電路板40，該電路板40之前段下面設有該一排第一接點41，該電路板之一排第一接點41為電路接點，該絕緣座體34兩側各設有一補強板59，該補強板59及一排第一端子60與該絕緣座體34係為埋入塑膠射出成型，補強板59為金屬材質且截面呈形，該補強板59延伸至該電路板40後段且焊接該電路板40，本實施之差異在於暫時未設有封膠體覆蓋該電路板40上面並將該電子單元4覆蓋。Referring to FIG. 98 and FIG. 99, it is a fifty-fifth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the fortieth embodiment and the forty-ninth embodiment. The connecting plate 55 includes an insulating base 34 and a front portion of the circuit board 40. The insulating base 34 is disposed on a front portion of the circuit board 40. The insulating base 34 is provided with the first contact 62 of the row. The first contact 62 of the row of the insulating base is formed in a row of first terminals 60. The first terminal 60 is provided with pins 64 electrically connected or soldered to the circuit board 40, and the circuit board 40 is in front of the circuit board 40. The first contact 41 of the row is disposed, and the first contact 41 of the circuit board is a circuit contact, and a reinforcing plate 59 is disposed on each side of the insulating base 34, the reinforcing plate 59 and the row of the first A terminal 60 and the insulating base 34 are embedded in plastic injection molding, and the reinforcing plate 59 is made of metal and has a cross section. The reinforcing plate 59 extends to the rear of the circuit board 40 and solders the circuit board 40. The difference in this embodiment is that the sealing body is not provided to cover the circuit board 40 and the electronic unit 4 is covered.

請參閱圖100，係本發明第五十六實施例，其大致與第五十五實施例相同，其差異在於本實施之補強板59截面呈形。Referring to FIG. 100, it is a fifty-sixth embodiment of the present invention, which is substantially the same as the fifty-fifth embodiment, and the difference is that the reinforcing plate 59 of the present embodiment has a cross section. shape.

請參閱圖101，係本發明第五十七實施例，其大致與第五十五實施例相同，其差異在於本實施之補強板59截面呈形。Referring to FIG. 101, it is a fifty-seventh embodiment of the present invention, which is substantially the same as the fifty-fifth embodiment, and the difference is that the reinforcing plate 59 of the present embodiment has a cross section. shape.

請參閱圖102，係本發明第五十八實施例，其大致與第五十五實施例相同，其差異在於本實施之補強板59截面呈形。Referring to FIG. 102, it is a fifty-eighth embodiment of the present invention, which is substantially the same as the fifty-fifth embodiment, and the difference is that the reinforcing plate 59 of the present embodiment has a cross section. shape.

請參閱圖103，係本發明第五十九實施例，其大致與第五十五實施例相同，其差異在於本實施之補強板59截面呈形。Referring to FIG. 103, it is a fifty-ninth embodiment of the present invention, which is substantially the same as the fifty-fifth embodiment, and the difference is that the reinforcing plate 59 of the present embodiment has a cross section. shape.

請參閱圖104、圖105、圖106及圖107，係本發明第六十實施例，其係為一USB2.0規格之隨身碟，其大致與第三十九實施例相同，本實施之差異在於設有一電路板40及一第二電路板424，該電路板40下面前段設有一排四個第一接點41，該電路板40上面係先焊接一電子單元4、二側焊接二前後延伸之補強板59及前段焊上四個呈ㄈ形之導電片593後，再以封膠方式形成一外覆體30覆蓋該電路板40上面及電子單元4，同時使該二補強板59及四個導電片593上端露出，如圖107所示，該第二電路板424上面係設有一排四個第一接點41且下面設有對應該二補強板59及四個導電片593之焊墊，上面之一排四個第一接點41係呈反向排列藉由導電部420電連接至下面之焊墊，該第二電路板424疊合於該外覆體30前段且下面之焊墊焊接於該二補強板59及四個導電片593上端而形成一連接板55，如此該連接板55上下面即各形成一排電路序號依序反向排列之第一接點。Referring to FIG. 104, FIG. 105, FIG. 106 and FIG. 107, it is a sixtyth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-ninth embodiment, and the difference of the present embodiment. The circuit board 40 is provided with a circuit board 40 and a second circuit board 424. The front panel of the circuit board 40 is provided with a row of four first contacts 41. The circuit board 40 is first soldered to an electronic unit 4, and the two sides are soldered to the front and rear. After the reinforcing plate 59 and the front section are soldered to the four conductive strips 593, an outer covering 30 is formed on the upper surface of the circuit board 40 and the electronic unit 4, and the two reinforcing plates 59 and four are simultaneously formed. The upper end of the conductive strip 593 is exposed. As shown in FIG. 107, the second circuit board 424 is provided with a row of four first contacts 41 and a solder pad corresponding to the two reinforcing plates 59 and the four conductive sheets 593. One of the four first contacts 41 in the upper row is reversely arranged by the conductive portion 420 electrically connected to the underlying pad, and the second circuit board 424 is superposed on the front and lower pads of the outer cover 30. Soldering the upper end of the two reinforcing plates 59 and the four conductive sheets 593 to form a connecting plate 55, such that the connecting plate 55 I.e., is formed below each of the first contacts arranged in a row sequentially reverse line number.

本實施例之製造方法，包括以下步驟：The manufacturing method of this embodiment includes the following steps:

一、提供一電路板40,該電路板40設有2組導電接點、該2組導電接點依序反向排列的串接電路、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、一電子單元4的電路及接點、及補強板59的接點，該2組導電接點依序反向排列的串接電路與該電子單元4的電路電連接，該2組導電接點分別設於該電路板不同面，該電路板40前段相對於設有該電子單元4的接點之另一面之1組導電接點為一組連接介面，即一排4個第一接點41，其為USB2.0之連接介面；1. Providing a circuit board 40, the circuit board 40 is provided with two sets of conductive contacts, the two sets of conductive contacts are sequentially arranged in reverse, the reverse circuit or the anti-short circuit or other electronic circuit safety protection device. a circuit and a contact, a circuit and a contact of the electronic unit 4, and a contact of the reinforcing plate 59, wherein the two sets of conductive contacts are sequentially arranged in reverse series and electrically connected to the circuit of the electronic unit 4, wherein The set of conductive contacts are respectively disposed on different faces of the circuit board, and a set of conductive contacts of the front side of the circuit board 40 with respect to the other side of the contact provided with the electronic unit 4 is a set of connection interfaces, that is, one row of four a contact 41, which is a connection interface of USB2.0;

二、提供一絕緣體，該絕緣體為一第二電路板424，其上設有該另一組連接介面，即一排第一接點41，其為USB2.0之連接介面；2, providing an insulator, the insulator is a second circuit board 424, which is provided with the other set of connection interfaces, that is, a row of first contacts 41, which is a connection interface of USB2.0;

三、提供防逆流電子元件或防短路電子元件或蕭基二極體46或其他電子式電路安全保護裝置；3. Provide anti-backflow electronic components or short-circuit proof electronic components or Xiaoji diode 46 or other electronic circuit safety protection devices;

四、提供一電子單元4、外加之一組導電接點及補強板59，該外加之一組導電接點為一組導電片593；4, providing an electronic unit 4, plus a set of conductive contacts and a reinforcing plate 59, the external set of conductive contacts is a set of conductive sheets 593;

五、提供焊接材料塗抹於該電路板40之接點；5. Providing a solder material to be applied to the contact of the circuit board 40;

六、將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置、電子單元4、及二補強板59分別排列貼放於該電路板40對應的接點，該一組導電片593貼放於電路板該面之一組導電接點；6. The anti-backflow electronic component or the short-circuit prevention electronic component or the Xiaoji diode or other electronic circuit safety protection device, the electronic unit 4, and the second reinforcing plate 59 are respectively arranged and placed on the corresponding contacts of the circuit board 40. The set of conductive sheets 593 are placed on a set of conductive contacts on the surface of the circuit board;

七、將分別貼放於該電路板40上的元件，進行迴焊焊板加工；7. The components respectively placed on the circuit board 40 are processed for reflow soldering;

八、將該焊接有上述元件之電路板40一面進行封裝而形成一外覆體30，並使並使該電路板40和外覆體30結合成一封裝體，且使該一組導電片593及二補強板59露出外覆體30上表面，且該電路板另一面之一組連接介面，即一排4個第一接點41露出該封裝體之電路板一面；8. The circuit board 40 soldered with the above components is packaged to form an outer cover 30, and the circuit board 40 and the outer cover 30 are combined into a package, and the set of conductive sheets 593 and The second reinforcing plate 59 exposes the upper surface of the outer covering 30, and one of the other sides of the circuit board is connected to the interface, that is, a row of four first contacts 41 exposes one side of the circuit board of the package;

九、提供焊接材料塗抹於該外覆體上表面之一組導電片593及補強板59；以及IX. providing a conductive material 593 and a reinforcing plate 59 coated on the upper surface of the outer covering;

十、將該第二電路板424疊合於該外覆體30上表面前段，該第二電路板424之一組連接介面的焊接點連接該一組導電片593且第二電路板424設有焊接點連接該二補強板59，最後再進行迴焊焊板加工。10. The second circuit board 424 is superposed on the front surface of the upper surface of the outer cover 30. The solder joint of the connection interface of the second circuit board 424 is connected to the set of conductive sheets 593 and the second circuit board 424 is provided. The welding points are connected to the two reinforcing plates 59, and finally the reflowed welding plates are processed.

上述之補強構造係採用補強板59，然亦可採用焊板，該第二電路板424可以超音波或高週波方式結合於該外覆體30上。The reinforcing structure described above employs a reinforcing plate 59, but a welding plate may be used, and the second circuit board 424 may be coupled to the outer covering 30 in an ultrasonic or high-frequency manner.

請參閱圖108，係本發明第六十一實施例，其大致與第六十實施例相同，其差異在於本實施之外覆體30更包覆該電路板40兩側面。Referring to FIG. 108, it is a sixty-first embodiment of the present invention, which is substantially the same as the sixtyth embodiment, except that the cover 30 further covers both sides of the circuit board 40.

請參閱圖109，係本發明第六十二實施例，其大致與第六十實施例相同，其差異在於本實施之外覆體30上係疊合一絕緣座體34，該絕緣座體34上面設有該一排第一接點62，該一排第一接點62係形成在一排第一端子60，該絕緣座體34與該一排第一端子60係採埋入塑膠射出成型方式，該第一端子60設有接腳焊接在該外覆體30前段上面之四個導電片上端，該絕緣座體34可以超音波或高週波方式結合該外覆體30上。Referring to FIG. 109, it is a sixty-second embodiment of the present invention, which is substantially the same as the sixtyth embodiment, except that the insulating body 34 is laminated on the covering 30, and the insulating base 34 is laminated on the covering 30. The row of first contacts 62 is formed on the first row of the first terminals 60. The insulative housing 34 and the row of first terminals 60 are embedded in plastic injection molding. In one embodiment, the first terminal 60 is provided with upper ends of four conductive sheets soldered to the upper portion of the outer cover 30. The insulating base 34 can be coupled to the outer cover 30 in an ultrasonic or high-frequency manner.

請參閱圖110，係本發明第六十三實施例，其大致與第三十四實施例相同，其差異在於本實施之外覆體30與絕緣座體34係分開設置而非一體成型，該外覆體30與絕緣座體34可以超音波或高週波方式結合於該電路板40上。Referring to FIG. 110, it is a sixty-third embodiment of the present invention, which is substantially the same as the thirty-fourth embodiment, except that the cover 30 and the insulating base 34 are separately disposed instead of being integrally formed. The outer cover 30 and the insulating base 34 can be coupled to the circuit board 40 in an ultrasonic or high-frequency manner.

請參閱圖111、圖112、圖113及圖114，係本發明第六十四實施例，其係為一USB2.0規格之隨身碟，其大致與第三十四實施例相同，本實施包括有一電路板40、二絕緣座體34、34’、一電子單元4、及一外覆體30，其中：該電路板40上下面皆設有一組導電接點430且前端各設有二焊接區432，另電路板40下面二側各設有一前後延伸之焊接區434。Referring to FIG. 111, FIG. 112, FIG. 113 and FIG. 114, it is a sixty-fourth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the thirty-fourth embodiment, and the present embodiment includes There is a circuit board 40, two insulating bases 34, 34', an electronic unit 4, and an outer cover 30, wherein: the circuit board 40 is provided with a set of conductive contacts 430 on the upper and lower sides and two solder joints at the front ends. 432. The second side of the circuit board 40 is provided with a soldering area 434 extending forward and backward.

該二絕緣座體34、34’上各設有一組導電接點，該一組導電接點係為一排四個第一接點62，其為USB2.0之連接介面，該二排第一接點62係形成在二排第一端子60，該二絕緣座體34、34’與該二排第一端子60係分別採埋入塑膠射出成型方式，該二排第一端子60設有接腳64分別焊接於該電路板40上下面之一組導電接點430，該二排第一端子60之前端66焊接於該電路板40上下面之焊接區432，該二絕緣座體34、34’前端對應該焊接區432各設有二缺口342，藉由該缺口342可補焊，另外該絕緣座體34較大，其兩側邊大致與電路板40齊平，其兩側各設有一前後延伸之補強板59，該補強板59焊接該焊接區434。Each of the two insulating bases 34, 34' is provided with a set of conductive contacts, and the set of conductive contacts is a row of four first contacts 62, which are USB 2.0 connection interfaces, and the second row is first The contact 62 is formed in the second row of the first terminals 60, and the two insulating bases 34, 34' and the two rows of the first terminals 60 are respectively embedded in a plastic injection molding manner, and the two rows of the first terminals 60 are connected The legs 64 are respectively soldered to a lower set of conductive contacts 430 on the circuit board 40. The front ends 66 of the two rows of first terminals 60 are soldered to the solder pads 432 on the lower surface of the circuit board 40. The two insulating blocks 34 and 34 are respectively soldered. The front end corresponding welding zone 432 is provided with two notches 342, which can be repaired by the notch 342, and the insulating seat body 34 is larger, and the two sides thereof are substantially flush with the circuit board 40, and one side of each of the two sides is provided with one A reinforcing plate 59 extending forward and backward, the reinforcing plate 59 welding the welding zone 434.

該電子單元4為一儲存單元，其包括有相關之電子元件及控制電路，該電子單元4電連接於該電路板40上面。The electronic unit 4 is a storage unit that includes associated electronic components and control circuitry. The electronic unit 4 is electrically coupled to the circuit board 40.

該外覆體30為一絕緣之封膠體，其將該電路板40焊接有電子單元4及絕緣座體34’之一面封膠覆蓋，只令該絕緣座體34’上一排第一接點62露出該外覆體30上表面。The outer cover 30 is an insulating sealant, and the circuit board 40 is soldered with a cover of the electronic unit 4 and the insulating base 34', so that only one row of the first contact is arranged on the insulating base 34'. 62 exposes the upper surface of the outer cover 30.

藉由以上構造，該電路板40前段上下面分別設有一絕緣座體而形成該連接板55，該該連接板55兩面各有一組連接介面，即該一排第一接點62。With the above configuration, the upper and lower sides of the front panel of the circuit board 40 are respectively provided with an insulating base body to form the connecting board 55. The connecting board 55 has a plurality of connecting interfaces on both sides, that is, the row of first contacts 62.

一、提供一電路板40，該電路板設有2組導電接點430、該2組導電接點依序反向排列的串接電路、防逆流或防短路或其他電子式電路安全保護裝置的電路及接點、一電子單元的電路及接點及補強板59的焊接區434，該串接電路與該電子單元的電路電連接，該2組導電接點430分別設於該電路板40不同面；1. Providing a circuit board 40, the circuit board is provided with two sets of conductive contacts 430, the two sets of conductive contacts are arranged in reverse in series, the anti-backflow or anti-short circuit or other electronic circuit safety protection device a circuit and a contact, a circuit of the electronic unit, and a soldering area 434 of the reinforcing board 59. The series circuit is electrically connected to the circuit of the electronic unit. The two sets of conductive contacts 430 are respectively disposed on the circuit board 40. surface;

二、提供一絕緣體，該絕緣體為一絕緣座體34，其上設有一組USB2.0之連接介面及補強板59，其為一排4個第一接點62，該一排第一接點62係形成在一排第一端子60，該絕緣座體34’與該一排第一端子60係採埋入塑膠射出成型方式；2. Providing an insulator, the insulator is an insulating base 34, and is provided with a set of USB2.0 connection interface and reinforcing plate 59, which is a row of four first contacts 62, and the first contact of the row The 62 series is formed in a row of first terminals 60, and the insulating base 34' and the row of first terminals 60 are embedded in a plastic injection molding manner;

四、提供一電子單元4及外加之一組導電接點，該外加之一組導電接點係設在一絕緣座體34’上，其為一組USB2.0之連接介面，其為一排4個第一接點62，該一排第一接點62係形成在一排第一端子60，該絕緣座體34’與該一排第一端子60係採埋入塑膠射出成型方式；4. Providing an electronic unit 4 and an additional set of conductive contacts, the external set of conductive contacts being disposed on an insulating base 34', which is a set of USB2.0 connection interfaces, which is a row 4 rows of first contacts 62, the row of first contacts 62 are formed in a row of first terminals 60, and the insulative housing 34' and the row of first terminals 60 are embedded in a plastic injection molding manner;

五、提供焊接材料塗抹於該電路板40一面之接點及焊接區432；5, providing solder joints on the side of the circuit board 40 and the soldering area 432;

六、將該防逆流電子元件或防短路電子元件或蕭基二極體或其他電子式電路安全保護裝置及電子單元4分別排列貼放於該電路板40上對應之接點，該外加之一組導電接點，即該絕緣座體34’之一排第一端子60之接腳64貼放於電路板該面之一組導電接點430，其中兩第一端子60之前端66連接該焊接區432；6. The anti-backflow electronic component or the short-circuit prevention electronic component or the Xiaoji diode or other electronic circuit safety protection device and the electronic unit 4 are respectively arranged and placed on the corresponding contacts on the circuit board 40, and the external one is added. The conductive contacts, that is, the pins 64 of the first terminal 60 of the one of the insulating bases 34 ′ are placed on a set of conductive contacts 430 on the surface of the circuit board, wherein the front ends 66 of the two first terminals 60 are connected to the soldering Area 432;

八、將該焊接有上述元件之電路板一面進行封裝而形成一外覆體30，並使該電路板40和外覆體30結合成一封裝體，且使該外加之一組導電接點，即該一排第一端子60之第一接點62露出該封裝體之外覆體30上表面，且該電路板另一面之一組導電接點露出該封裝體之電路板一面；8. The circuit board with the above components is packaged to form an outer cover 30, and the circuit board 40 and the outer cover 30 are combined into a package, and the one set of conductive contacts is added. The first contact 62 of the first row of the first terminal 60 exposes the upper surface of the outer cover 30 of the package body, and a set of conductive contacts on the other side of the circuit board exposes one side of the circuit board of the package;

九、提供焊接材料塗抹於該電路板一面之一組導電接點430、焊接區432及補強板之焊接區434；以及IX. Providing a soldering material applied to one of the conductive contacts 430, the soldering region 432 and the soldering region 434 of the reinforcing plate on one side of the circuit board;

十、將該絕緣座體34疊合於該封裝體之電路板40前段，該絕緣座體34之一排第一端子60之接腳64連接於該塗抹有焊接材料之一組導電接點430，其中兩第一端子60之前端66連接該焊接區432，該補強板59連接於該焊接區434，並進行迴焊焊板加工。10. The insulating base 34 is superposed on the front portion of the circuit board 40 of the package. The pin 64 of the first terminal 60 of the insulating base 34 is connected to the conductive contact 430 of the solder material. The front end 66 of the two first terminals 60 is connected to the welding zone 432. The reinforcing plate 59 is connected to the welding zone 434 and is processed by reflow soldering.

本實施例之電路板40前段上面之絕緣座體係採較小的絕緣座體34’封膠結合成與電路板40兩側齊平之絕緣座體，該絕緣座體34’主要係用以先結合該一排第一端子60以達到製造上之簡便，然而亦可將該一排第一端子60直接焊在該電路板40上再封膠直接形成一絕緣座體。The insulating seat system on the front side of the circuit board 40 of the present embodiment adopts a smaller insulating base 34' to be sealed and integrated into an insulating seat flush with both sides of the circuit board 40. The insulating base 34' is mainly used for first bonding. The row of first terminals 60 is simple to manufacture, but the row of first terminals 60 can be directly soldered to the circuit board 40 to form an insulating body.

上述之補強構造係採用補強板59，然亦可採用焊板，該絕緣座體34亦可以超音波或高週波方式結合於該電路板40。The reinforcing structure described above is a reinforcing plate 59, but a welding plate may be used, and the insulating base 34 may be coupled to the circuit board 40 in an ultrasonic or high-frequency manner.

請參閱圖115及圖116，係本發明第六十五實施例，其係為一USB2.0規格之隨身碟，其大致與第六十四實施例相同，其差異在於本實施之絕緣座體34二側一體設有限位構造50凸出該一組連接介面及相對於該一組連接介面之一組導電接點，即該限位構造50凸出該連接板55兩面之一排第一接點62。Referring to FIG. 115 and FIG. 116, it is a sixty-fifth embodiment of the present invention, which is a USB2.0 specification flash drive, which is substantially the same as the sixty-fourth embodiment, and the difference lies in the insulating seat of the present embodiment. The two sides are integrally provided with a limiting structure 50 for projecting the set of connecting interfaces and a set of conductive contacts relative to the set of connecting interfaces, that is, the limiting structure 50 protrudes from the first row of the two sides of the connecting plate 55. Point 62.

上述第四十九實施例至第六十五實施例中之電子單元4除了可為一儲存單元而成一隨身碟外，或可為一無線收發單元而成一無線收發裝置，或可為一連接線材而成一電連接線公頭，或可為一轉接電路及一電連接器而成一轉接電連接器，或可為一擴充電路及一組電連接插座而成一擴充插座，或可為一控制單元而成一IC控制器。The electronic unit 4 of the above-mentioned forty-sixth to sixty-fifth embodiments may be a storage unit or a wireless transceiver unit, or may be a connecting wire. Forming an electrical connector male, or an adapter circuit and an electrical connector to form an adapter electrical connector, or an expansion circuit and a set of electrical connection sockets to form an expansion socket, or can be a control The unit is an IC controller.

在較佳實施例之詳細說明中所提出之具體的實施例僅為了易於說明本發明之技術內容，而並非將本發明狹義地限制於該實施例，在不超出本發明之精神及以下申請專利範圍之情況，可作種種變化實施。The specific embodiments of the present invention are set forth in the detailed description of the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, The scope of the situation can be implemented in various changes.

1．．．隨身碟1. . . Flash drive

3．．．隨身碟3. . . Flash drive

10．．．塑膠座體10. . . Plastic seat

15．．．電路板15. . . Circuit board

16．．．接點16. . . contact

20．．．電連接母座20. . . Electrical connection

21．．．連接槽twenty one. . . Connection slot

22．．．舌片twenty two. . . Tab

23．．．接點twenty three. . . contact

25．．．金屬殼25. . . Metal shell

24．．．彈片twenty four. . . shrapnel

30．．．外覆體30. . . Overlay

31．．．下座31. . . Lower seat

32．．．上蓋32. . . Upper cover

33．．．容室33. . . Room

34．．．絕緣座體34. . . Insulated body

35．．．定位凹槽35. . . Positioning groove

36．．．定位彈片36. . . Positioning shrapnel

37．．．塑膠板37. . . Plastic plate

38．．．金屬殼38. . . Metal shell

39．．．空間39. . . space

312．．．塑膠塊312. . . Plastic block

301．．．透空孔301. . . Through hole

4．．．電子單元4. . . Electronic unit

40．．．電路板40. . . Circuit board

41．．．第一接點41. . . First contact

42．．．貫穿孔42. . . Through hole

43．．．記憶體43. . . Memory

44．．．記憶體44. . . Memory

45．．．控制電路45. . . Control circuit

46．．．蕭基二極體46. . . Xiao Ji diode

47．．．IC控制晶片47. . . IC control chip

48．．．接點48. . . contact

49．．．電路49. . . Circuit

410．．．連接槽410. . . Connection slot

411．．．第一接點411. . . First contact

412．．．第二接點412. . . Second contact

413．．．舌片413. . . Tab

417．．．接點417. . . contact

418．．．接點418. . . contact

419．．．電線419. . . wire

420．．．導電部420. . . Conductive part

422．．．上電路板422. . . Upper circuit board

423．．．下電路板423. . . Lower board

424．．．第二電路板424. . . Second circuit board

425．．．插梢425. . . Pin

430．．．導電接點430. . . Conductive contact

432．．．焊接區432. . . Weld zone

434．．．焊接區434. . . Weld zone

52．．．卡槽52. . . Card slot

50．．．限位構造50. . . Limit structure

55．．．連接板55. . . Connection plate

56．．．穿孔56. . . perforation

57．．．凹面57. . . Concave surface

58．．．對接構造58. . . Docking structure

59．．．補強板59. . . Reinforcing plate

591．．．焊板591. . . Welding plate

593．．．導電片593. . . Conductive sheet

60．．．第一端子60. . . First terminal

61．．．延伸部61. . . Extension

62．．．第一接點62. . . First contact

63．．．第一接點63. . . First contact

64．．．接腳64. . . Pin

66．．．前端66. . . front end

70．．．第二端子70. . . Second terminal

71．．．延伸部71. . . Extension

72．．．第二接點72. . . Second contact

80．．．偵測構造80. . . Detection structure

81．．．可動端子81. . . Movable terminal

82．．．可動端子82. . . Movable terminal

83．．．固定端子83. . . Fixed terminal

85．．．凸點85. . . Bump

90．．．切換開關裝置90. . . Switching device

91．．．滑動鈕91. . . Slide button

92．．．滑槽92. . . Chute

93．．．導電部93. . . Conductive part

圖1係習知之隨身碟之立體圖。Figure 1 is a perspective view of a conventional flash drive.

圖2係習知之隨身碟之前視剖面圖。Figure 2 is a front cross-sectional view of a conventional flash drive.

圖3係習知之電連接母座前視圖。Figure 3 is a front elevational view of a conventional electrical connection female seat.

圖4係習知之隨身碟***電連接母座前視圖。Figure 4 is a front view of a conventional plug-in electrical connection female socket.

圖5係本發明第一實施例之立體分解圖。Figure 5 is a perspective exploded view of the first embodiment of the present invention.

圖6係本發明第一實施例之立體組合圖。Figure 6 is a perspective assembled view of a first embodiment of the present invention.

圖7係本發明第一實施例之前視剖面圖。Figure 7 is a front cross-sectional view showing a first embodiment of the present invention.

圖8係本發明第一實施例之二排第一接點串接示意圖。Figure 8 is a schematic view showing the first connection of two rows of the first embodiment of the present invention.

圖9係本發明第一實施例之使用狀態圖。Figure 9 is a view showing the state of use of the first embodiment of the present invention.

圖10係本發明第二實施例之立體組合圖。Figure 10 is a perspective assembled view of a second embodiment of the present invention.

圖11係本發明第二實施例之前視剖面圖。Figure 11 is a front cross-sectional view showing a second embodiment of the present invention.

圖12係本發明第三實施例之立體組合圖。Figure 12 is a perspective assembled view of a third embodiment of the present invention.

圖13係本發明第三實施例之二排第一接點串接示意圖。Figure 13 is a schematic view showing the tandem connection of the first rows of the second row of the third embodiment of the present invention.

圖14係本發明第四實施例之側視剖面圖。Figure 14 is a side cross-sectional view showing a fourth embodiment of the present invention.

圖15係本發明第四實施例之前視圖。Figure 15 is a front elevational view of a fourth embodiment of the present invention.

圖16係本發明第五實施例之立體組合圖。Figure 16 is a perspective assembled view of a fifth embodiment of the present invention.

圖17係本發明第六實施例之立體分解圖。Figure 17 is a perspective exploded view of a sixth embodiment of the present invention.

圖18係本發明第六實施例之立體組合圖。Figure 18 is a perspective assembled view of a sixth embodiment of the present invention.

圖19係本發明第七實施例之立體組合圖。Figure 19 is a perspective assembled view of a seventh embodiment of the present invention.

圖20係本發明第八實施例正面之立體組合圖。Figure 20 is a perspective assembled view of the front side of the eighth embodiment of the present invention.

圖21係本發明第八實施例反面之立體組合圖。Figure 21 is a perspective assembled view of the reverse side of the eighth embodiment of the present invention.

圖22係本發明第九實施例之側視剖面圖。Figure 22 is a side cross-sectional view showing a ninth embodiment of the present invention.

圖23係本發明第十實施例之側視剖面圖。Figure 23 is a side sectional view showing a tenth embodiment of the present invention.

圖24係本發明第十一實施例之側視剖面圖。Figure 24 is a side cross-sectional view showing an eleventh embodiment of the present invention.

圖25係本發明第十二實施例之立體組合圖。Figure 25 is a perspective assembled view of a twelfth embodiment of the present invention.

圖26係本發明第十二實施例之前視剖面圖。Figure 26 is a front cross-sectional view showing a twelfth embodiment of the present invention.

圖27係本發明第十二實施例之側視剖面圖。Figure 27 is a side cross-sectional view showing a twelfth embodiment of the present invention.

圖28係本發明第十二實施例之切換開關裝置及控制電路示意圖。Figure 28 is a diagram showing a switch device and a control circuit of a twelfth embodiment of the present invention.

圖29係本發明第十二實施例之切換開關裝置及控制電路示意圖。Figure 29 is a diagram showing a switch device and a control circuit of a twelfth embodiment of the present invention.

圖30係本發明第十二實施例之切換開關裝置及控制電路示意圖。Figure 30 is a schematic diagram of a diverter switch device and a control circuit in accordance with a twelfth embodiment of the present invention.

圖31係本發明第十三實施例之切換開關裝置及控制電路示意圖。Figure 31 is a schematic diagram of a diverter switch device and a control circuit of a thirteenth embodiment of the present invention.

圖32係本發明第十四實施例之切換開關裝置及控制電路示意圖。Figure 32 is a block diagram showing a switch device and a control circuit of a fourteenth embodiment of the present invention.

圖33係本發明第十五實施例之正面平面圖。Figure 33 is a front plan view showing a fifteenth embodiment of the present invention.

圖34係本發明第十五實施例之反面平面圖。Figure 34 is a plan view showing the reverse side of the fifteenth embodiment of the present invention.

圖35係本發明第十六實施例之前視剖面圖。Figure 35 is a front cross-sectional view showing a sixteenth embodiment of the present invention.

圖36係本發明第十七實施例之正面平面圖。Figure 36 is a front plan view showing a seventeenth embodiment of the present invention.

圖37係本發明第十七實施例之反面平面圖。Figure 37 is a plan view showing the reverse side of the seventeenth embodiment of the present invention.

圖38係本發明第十八實施例之上視圖。Figure 38 is a top plan view of an eighteenth embodiment of the present invention.

圖39係本發明第十八實施例之側視剖面圖。Figure 39 is a side cross-sectional view showing an eighteenth embodiment of the present invention.

圖39A係本發明第十八實施例之前視剖面圖。Figure 39A is a front cross-sectional view showing an eighteenth embodiment of the present invention.

圖40係本發明第十九實施例之立體組合圖。Figure 40 is a perspective assembled view of a nineteenth embodiment of the present invention.

圖41係本發明第十九實施例之側視剖面圖。Figure 41 is a side sectional view showing a nineteenth embodiment of the present invention.

圖42係本發明第二十實施例之側視剖面圖。Figure 42 is a side cross-sectional view showing a twentieth embodiment of the present invention.

圖43係本發明第二十一實施例之側視剖面圖。Figure 43 is a side cross-sectional view showing a twenty-first embodiment of the present invention.

圖44係本發明第二十一實施例之前視剖面圖。Figure 44 is a front cross-sectional view showing a twenty-first embodiment of the present invention.

圖45係本發明第二十二實施例之側視剖面圖。Figure 45 is a side cross-sectional view showing a twenty-second embodiment of the present invention.

圖46係本發明第二十二實施例之前視圖。Figure 46 is a front elevational view of a twenty-second embodiment of the present invention.

圖47係本發明第二十三實施例之側視剖面圖。Figure 47 is a side cross-sectional view showing a twenty-third embodiment of the present invention.

圖48係本發明第二十三實施例之連接板立體圖。Figure 48 is a perspective view of a connecting plate of a twenty-third embodiment of the present invention.

圖49係本發明第二十四實施例之立體組合圖。Figure 49 is a perspective assembled view of a twenty-fourth embodiment of the present invention.

圖50係本發明第二十五實施例之立體組合圖。Figure 50 is a perspective assembled view of a twenty-fifth embodiment of the present invention.

圖51係本發明第二十六實施例之立體組合圖。Figure 51 is a perspective assembled view of a twenty-sixth embodiment of the present invention.

圖52係本發明第二十七實施例之側視剖面圖。Figure 52 is a side cross-sectional view showing a twenty-seventh embodiment of the present invention.

圖53係本發明第二十八實施例之側視剖面圖。Figure 53 is a side cross-sectional view showing a twenty-eighth embodiment of the present invention.

圖54係本發明第二十九實施例之側視剖面圖。Figure 54 is a side sectional view showing a twenty-ninth embodiment of the present invention.

圖55係本發明第三十實施例之側視剖面圖。Figure 55 is a side sectional view showing a thirtieth embodiment of the present invention.

圖56係本發明第三十一實施例之立體組合圖。Figure 56 is a perspective assembled view of a thirty-first embodiment of the present invention.

圖57係本發明第三十一實施例之前視剖面圖。Figure 57 is a front cross-sectional view showing a thirty-first embodiment of the present invention.

圖58係本發明第三十二實施例之立體組合圖。Figure 58 is a perspective assembled view of a thirty-second embodiment of the present invention.

圖59係本發明第三十三實施例之立體組合圖。Figure 59 is a perspective assembled view of a thirty-third embodiment of the present invention.

圖60係本發明第三十四實施例之上視圖。Figure 60 is a top plan view of a thirty-fourth embodiment of the present invention.

圖61係本發明第三十四實施例之側視剖面圖。Figure 61 is a side cross-sectional view showing a thirty-fourth embodiment of the present invention.

圖62係本發明第三十四實施例之前視剖面圖。Figure 62 is a front cross-sectional view showing a thirty-fourth embodiment of the present invention.

圖63係本發明第三十四實施例之立體圖。Figure 63 is a perspective view showing a thirty-fourth embodiment of the present invention.

圖63A係本發明第三十四實施例之另一立體圖。Figure 63A is another perspective view of a thirty-fourth embodiment of the present invention.

圖64係本發明第三十五實施例之立體圖。Figure 64 is a perspective view of a thirty-fifth embodiment of the present invention.

圖65係本發明第三十六實施例之側視剖面圖。Figure 65 is a side cross-sectional view showing a thirty-sixth embodiment of the present invention.

圖66係本發明第三十七實施例之側視剖面圖。Figure 66 is a side sectional view showing the thirty-seventh embodiment of the present invention.

圖67係本發明第三十八實施例之側視剖面圖。Figure 67 is a side sectional view showing the thirty-eighth embodiment of the present invention.

圖68係本發明第三十八實施例之前視剖面圖。Figure 68 is a front cross-sectional view showing a thirty-eighth embodiment of the present invention.

圖69係本發明第三十九實施例之上視圖。Figure 69 is a top plan view of a thirty-ninth embodiment of the present invention.

圖70係本發明第三十九實施例之側視剖面圖。Figure 70 is a side cross-sectional view showing a thirty-ninth embodiment of the present invention.

圖71係本發明第三十九實施例之前視剖面圖。Figure 71 is a front cross-sectional view showing a thirty-ninth embodiment of the present invention.

圖72係本發明第四十實施例之上視圖。Figure 72 is a top plan view of a fortieth embodiment of the present invention.

圖73係本發明第四十實施例之側視剖面圖。Figure 73 is a side sectional view showing a fortieth embodiment of the present invention.

圖74係本發明第四十實施例之前視剖面圖。Figure 74 is a front cross-sectional view showing a fortieth embodiment of the present invention.

圖75係本發明第四十一實施例之上視圖。Figure 75 is a top plan view of a forty-first embodiment of the present invention.

圖76係本發明第四十一實施例之側視剖面圖。Figure 76 is a side cross-sectional view showing a forty-first embodiment of the present invention.

圖77係本發明第四十一實施例之前視圖。Figure 77 is a front elevational view of a forty-first embodiment of the present invention.

圖78係本發明第四十二實施例之側視剖面圖。Figure 78 is a side cross-sectional view showing a forty-second embodiment of the present invention.

圖79係本發明第四十三實施例之側視剖面圖。Figure 79 is a side cross-sectional view showing a forty-third embodiment of the present invention.

圖80係本發明第四十四實施例之側視剖面圖。Figure 80 is a side cross-sectional view showing a forty-fourth embodiment of the present invention.

圖81係本發明第四十五實施例之上視圖。Figure 81 is a top plan view showing a forty-fifth embodiment of the present invention.

圖82係本發明第四十五實施例之側視剖面圖。Figure 82 is a side cross-sectional view showing a forty-fifth embodiment of the present invention.

圖83係本發明第四十五實施例之前視剖面圖。Figure 83 is a front cross-sectional view showing a forty-fifth embodiment of the present invention.

圖84係本發明第四十六實施例之立體圖(外覆體取下)。Figure 84 is a perspective view of the forty-sixth embodiment of the present invention (the outer cover is removed).

圖85係本發明第四十六實施例之立體圖。Figure 85 is a perspective view showing a forty-sixth embodiment of the present invention.

圖86係本發明第四十七實施例之側視剖面圖。Figure 86 is a side sectional view showing the forty-seventh embodiment of the present invention.

圖87係本發明第四十八實施例之立體圖。Figure 87 is a perspective view showing a forty-eighth embodiment of the present invention.

圖88係本發明第四十八實施例之側視剖面圖。Figure 88 is a side sectional view showing the forty-eighth embodiment of the present invention.

圖89係本發明第四十九實施例之側視剖面圖。Figure 89 is a side cross-sectional view showing a forty-ninth embodiment of the present invention.

圖90係本發明第四十九實施例之後視剖面圖。Figure 90 is a rear cross-sectional view showing a forty-ninth embodiment of the present invention.

圖91係本發明第五十實施例之後視圖。Figure 91 is a rear elevational view of the fiftieth embodiment of the present invention.

圖92係本發明第五十一實施例之後視圖。Figure 92 is a rear elevational view of the fifty-first embodiment of the present invention.

圖93係本發明第五十二實施例之後視圖。Figure 93 is a rear elevational view of the fifty-second embodiment of the present invention.

圖94係本發明第五十三實施例之側視剖面圖。Figure 94 is a side cross-sectional view showing a fifty-third embodiment of the present invention.

圖95係本發明第五十三實施例之後視圖。Figure 95 is a rear elevational view of the fifty-third embodiment of the present invention.

圖96係本發明第五十四實施例之側視剖面圖。Figure 96 is a side cross-sectional view showing a fifty-fourth embodiment of the present invention.

圖97係本發明第五十四實施例之後視圖。Figure 97 is a rear elevational view of the fifty-fourth embodiment of the present invention.

圖98係本發明第五十五實施例之側視剖面圖。Figure 98 is a side cross-sectional view showing a fifty-fifth embodiment of the present invention.

圖99係本發明第五十五實施例之後視圖。Figure 99 is a rear elevational view of the fifty-fifth embodiment of the present invention.

圖100係本發明第五十六實施例之後視圖。Figure 100 is a rear elevational view of a fifty-sixth embodiment of the present invention.

圖101係本發明第五十七實施例之後視圖。Figure 101 is a rear elevational view of the fifty-seventh embodiment of the present invention.

圖102係本發明第五十八實施例之後視圖。Figure 102 is a rear elevational view of the fifty-eighth embodiment of the present invention.

圖103係本發明第五十九實施例之後視圖。Figure 103 is a rear elevational view of the fifty-ninth embodiment of the present invention.

圖104係本發明第六十實施例之側視剖面圖。Figure 104 is a side cross-sectional view showing a sixtieth embodiment of the present invention.

圖105係本發明第六十實施例之前視剖面圖。Figure 105 is a front cross-sectional view showing a sixtieth embodiment of the present invention.

圖106係本發明第六十實施例之立體組合圖。Figure 106 is a perspective assembled view of a sixtieth embodiment of the present invention.

圖107係本發明第六十實施例之底層立體圖。Figure 107 is a bottom perspective view of a sixtieth embodiment of the present invention.

圖108係本發明第六十一實施例之立體組合圖。Figure 108 is a perspective assembled view of a sixty-first embodiment of the present invention.

圖109係本發明第六十二實施例之立體組合圖。Figure 109 is a perspective assembled view of a sixty-second embodiment of the present invention.

圖110係本發明第六十三實施例之立體分解圖。Figure 110 is a perspective exploded view of a sixty-third embodiment of the present invention.

圖111係本發明第六十四實施例之正面立體分解圖。Figure 111 is a front perspective exploded view of a sixty-fourth embodiment of the present invention.

圖111係本發明第六十四實施例之反面立體分解圖。Figure 111 is a perspective exploded view of the reverse side of the sixty-fourth embodiment of the present invention.

圖113係本發明第六十四實施例封膠後之正面立體分解圖。Figure 113 is a front perspective exploded view of the sixty-fourth embodiment of the present invention after sealing.

圖114係本發明第六十四實施例封膠後之正面立體組合圖。Figure 114 is a front perspective assembled view of the sixty-fourth embodiment of the present invention after sealing.

圖115係本發明第六十五實施例封膠後之正面立體分解圖。Figure 115 is a front perspective exploded view of the sixty-fifth embodiment of the present invention after sealing.

圖116係本發明第六十五實施例封膠後之正面立體組合圖。Figure 116 is a front perspective assembled view of the sixty-fifth embodiment of the present invention after sealing.

30‧‧‧外覆體 30‧‧‧Overlay

31‧‧‧下座 31‧‧‧The lower seat

32‧‧‧上蓋 32‧‧‧Upper cover

33‧‧‧容室 33‧‧ ‧ room

4‧‧‧電子單元 4‧‧‧Electronic unit

40‧‧‧電路板 40‧‧‧ boards

41‧‧‧第一接點 41‧‧‧ first joint

42‧‧‧貫穿孔 42‧‧‧through holes

43‧‧‧記憶體 43‧‧‧ memory

45‧‧‧控制電路 45‧‧‧Control circuit

46‧‧‧蕭基二極體 46‧‧‧Xiaoji diode

50‧‧‧限位構造 50‧‧‧Limited construction

55‧‧‧連接板 55‧‧‧Connecting plate

Claims

一種正反雙面接頭之電子裝置，其包括有：一外覆體；一電子單元，至少一部份為該外覆體覆蓋；以及一連接板，其定位於該外覆體，該連接板之兩板面露出該外覆體外且各設有一排第一接點，該連接板之形狀可正反雙面對接定位於一電連接母座，該連接板的周邊套設包覆有一金屬殼，藉以增強該連接板強度，該連接板兩側的金屬殼設有一卡定構造，當該連接板***一電連接母座時該卡定構造可與該電連接母座卡定，其中該二排第一接點相同之電路序號者電連接而串接成一組，該二排第一接點電連接該電子單元。 An electronic device for positive and negative double-sided joints, comprising: an outer cover; an electronic unit, at least a portion of which is covered by the outer cover; and a connecting plate positioned at the outer cover, the connecting plate The two plates are exposed outside the outer cover and each is provided with a row of first contacts. The shape of the connecting plate can be positioned in a front and back double-sided docking position on an electrical connection socket, and the periphery of the connecting plate is covered with a metal shell. In order to enhance the strength of the connecting plate, the metal shells on both sides of the connecting plate are provided with a locking structure, and the locking structure can be locked with the electrical connecting base when the connecting plate is inserted into an electrical connecting base, wherein the two The circuit numbers of the same row of the first contacts are electrically connected and connected in series, and the two rows of first contacts are electrically connected to the electronic unit.

一種正反雙面接頭之電子裝置，其包括有：一外覆體；一電子單元，至少一部份為該外覆體覆蓋；一電路板，該電子單元電連接在該電路板上；以及一連接板，其定位於該外覆體，該連接板之兩板面露出該外覆體外且各設有一排第一接點，該連接板之形狀可正反雙面對接定位於一電連接母座，該電路板前段上下面分別設有一絕緣座體而形成該連接板，該二絕緣座體各設有該一排第一接點，該二排第一接點係形成在二排第一端子，該二排第一端子設有接腳電連接或焊接在該電路板藉以電連接該電子單元，且二排第一接點相同之電路序號者電連接而串接成一組。 An electronic device for positive and negative double-sided joints, comprising: an outer cover; an electronic unit, at least a portion of which is covered by the outer cover; and a circuit board, the electronic unit is electrically connected to the circuit board; a connecting plate, which is positioned on the outer covering body, the two plate faces of the connecting plate are exposed outside the outer covering body and each is provided with a row of first contacts, and the shape of the connecting plate can be positioned on the front and back double-sided docking to be electrically connected The mother seat, the upper and lower sides of the front panel of the circuit board are respectively provided with an insulating base body to form the connecting plate, and the two insulating base bodies are respectively provided with the first row of the first contact points, and the two rows of the first contact points are formed in the second row a terminal, the first row of the first terminal is provided with a pin electrically connected or soldered on the circuit board to electrically connect the electronic unit, and the circuit numbers of the two rows of the first contacts are electrically connected and connected in series.

一種正反雙面接頭之電子裝置，其包括有：一外覆體；一電子單元，至少一部份為該外覆體覆蓋；一電路板，該電子單元電連接在該電路板上；以及一連接板，其為一塑膠板且組裝定位於該外覆體前端，該連接板之兩板面露出該外覆體外且各設有一排第一接點，該連接板後端設有一套接槽供該電路板一端***卡定，該連接板之形狀可正反雙面對接定位於一電連接母座，該二排第一接點相同之電路序號者電連接而串接成一組，該二排第一接點電連接該電子單元及該電路板。 An electronic device for positive and negative double-sided joints, comprising: an outer cover; an electronic unit, at least a portion of which is covered by the outer cover; and a circuit board, the electronic unit is electrically connected to the circuit board; a connecting plate, which is a plastic plate and is assembled and positioned at the front end of the outer covering body. The two plate faces of the connecting plate are exposed outside the outer covering body and each is provided with a row of first contacts, and the connecting plate has a set of rear ends. The slot is inserted into one end of the circuit board, and the shape of the connecting board can be positioned on the front and back sides of the circuit board to be electrically connected to the female base. The two circuit numbers of the first circuit of the first contact are electrically connected and connected in series. The second row of first contacts electrically connects the electronic unit and the circuit board.

一種正反雙面接頭之電子裝置，其包括有：一外覆體；一電子單元，至少一部份為該外覆體覆蓋；一連接板，其定位於該外覆體，該連接板之兩板面露出該外覆體外且各設有一排第一接點，該連接板之形狀可正反雙面對接定位於一電連接母座，該二排第一接點相同之電路序號者電連接而串接成一組，該二排第一接點電連接該電子單元及該電路板；以及一補強構造，其設於該連接板，藉以增強該連接板之強度。 An electronic device for a front and back double-sided joint includes: an outer cover; an electronic unit, at least a portion of which is covered by the outer cover; and a connecting plate positioned at the outer cover, the connecting plate The two plates are exposed outside the outer cover and each is provided with a row of first contacts. The shape of the connecting plate can be directly and anti-double-sidedly butted to an electrical connection base. The two first rows of the first contacts are the same. Connected and connected in series, the two rows of first contacts electrically connect the electronic unit and the circuit board; and a reinforcing structure disposed on the connecting plate to enhance the strength of the connecting plate.

一種正反雙面接頭之電子裝置，其包括有：一對接構造，其形狀可正反雙面對接定位於一電連接母座，其中，該對接構造之上下兩板面各露出設有一排第一接點，該對接構造的周邊套設包覆有一金屬殼，該對接構造左右兩側設有一卡定構造，當該對接構造***一電連接母座時該卡定構造可與該電連接母座卡定，該二排第一接點相同電路序號者相互為反向排列，該二排第一接點形成在二排第一端子；以及一電子單元，其至少一部份設於該對接構造內，且該二排第一接點電連接該電子單元。 An electronic device for positive and negative double-sided joints, comprising: a pair of joint structures, wherein the shape can be positively and reversely double-sidedly butted and positioned on an electrical connection base, wherein the upper and lower surfaces of the docking structure are exposed and provided with a row a joint, the peripheral sleeve of the docking structure is covered with a metal shell, and the right and left sides are provided with a locking structure, and the locking structure can be connected with the electrical connection when the mating structure is inserted into an electrical connection socket Seat locking, the first circuit of the two rows of the same circuit number are arranged in opposite directions to each other, and the two rows of first contacts are formed in the second row of the first terminals; An electronic unit, at least a portion of which is disposed in the docking structure, and the two rows of first contacts are electrically connected to the electronic unit.

一種正反雙面接頭之電子裝置，其包括有：一對接構造，其形狀可正反雙面對接定位於一電連接母座，其中，該對接構造之上下兩板面各露出設有一排第一接點，該二排第一接點相同電路序號者相互為反向排列，該二排第一接點形成在二排第一端子；一電路板，設於該對接構造；以及一電子單元，其至少一部份設於該對接構造內且電連接該電路板，該二排第一接點電連接該電子單元；該電路板前段上下面分別設有一絕緣座體而分別形成該對接構造之上下兩板面，該二絕緣座體各固定設有該一排第一端子且該二絕緣座體之一板面上各形成該一排第一接點，該二絕緣座體之二排第一端子設有接腳電連接或焊接在該電路板。 An electronic device for positive and negative double-sided joints, comprising: a pair of joint structures, wherein the shape can be positively and reversely double-sidedly butted and positioned on an electrical connection base, wherein the upper and lower surfaces of the docking structure are exposed and provided with a row a contact point, the first circuit of the second row of the same circuit serial number are opposite to each other, the two rows of first contacts are formed in the second row of the first terminal; a circuit board, disposed in the docking structure; and an electronic unit At least a portion of the circuit board is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the electronic unit. The upper and lower sides of the front panel of the circuit board are respectively provided with an insulating base body to respectively form the docking structure. The first two terminals are fixedly disposed on the upper and lower surfaces of the two insulating bases, and one row of the first contacts is formed on one of the two insulating bases, and the two rows of the two insulating seats are The first terminal is provided with a pin electrically connected or soldered to the circuit board.

一種正反雙面接頭之電子裝置，其包括有：一對接構造，其形狀可正反雙面對接定位於一電連接母座，其中，該對接構造之上下兩板面各露出設有一排第一接點，該二排第一接點相同電路序號者相互為反向排列，該二排第一接點形成在二排第一端子；一電路板，設於該對接構造；以及一電子單元，其至少一部份設於該對接構造內且電連接該電路板，該二排第一接點電連接該電子單元；該對接構造包括一絕緣座體，該絕緣座體前段設有該兩板面且後段設有一套接槽，該電路板前段套接卡定于該套接槽，該二排第一端子設有接腳電連接或焊接在該電路板。 An electronic device for positive and negative double-sided joints, comprising: a pair of joint structures, wherein the shape can be positively and reversely double-sidedly butted and positioned on an electrical connection base, wherein the upper and lower surfaces of the docking structure are exposed and provided with a row a contact point, the first circuit of the second row of the same circuit serial number are opposite to each other, the two rows of first contacts are formed in the second row of the first terminal; a circuit board, disposed in the docking structure; and an electronic unit At least a portion thereof is disposed in the docking structure and electrically connected to the a circuit board, the first row of the first contact is electrically connected to the electronic unit; the docking structure comprises an insulating seat, the front side of the insulating seat is provided with the two plates, and the rear section is provided with a set of slots, and the front part of the circuit board is sleeved The card is fixed to the socket, and the two rows of first terminals are provided with pins electrically connected or soldered to the circuit board.

一種正反雙面接頭之電子裝置，其包括有：一對接構造，其形狀可正反雙面對接定位於一電連接母座，其中，該對接構造之上下兩板面各露出設有一排第一接點，該二排第一接點相同電路序號者相互為反向排列，該二排第一接點形成在二排第一端子；一電子單元，其至少一部份設於該對接構造內，且該二排第一接點電連接該電子單元；以及一補強構造，其設於該對接構造，藉以增強該對接構造強度。 An electronic device for positive and negative double-sided joints, comprising: a pair of joint structures, wherein the shape can be positively and reversely double-sidedly butted and positioned on an electrical connection base, wherein the upper and lower surfaces of the docking structure are exposed and provided with a row a contact point, the first circuit of the second row of the same circuit serial number is opposite to each other, the two rows of first contacts are formed in the second row of the first terminal; an electronic unit, at least a portion of which is disposed in the docking structure And the two rows of first contacts are electrically connected to the electronic unit; and a reinforcing structure is disposed on the docking structure to enhance the strength of the docking structure.

如申請專利範圍第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中更設有二排第二接點，該二排第二接點分別設於該兩板面。 For example, the electronic device of the front and back double-sided joints mentioned in the first or second or third item or the fourth or fifth item or the sixth or the seventh or the seventh or the eighth item of the patent application is further provided. There are two rows of second contacts, and the second rows of second contacts are respectively disposed on the two plates.

如申請專利範圍第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該電子單元為一儲存單元，該儲存單元包括至少一記憶體。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 wherein the electronic The unit is a storage unit, and the storage unit includes at least one memory.

如申請專利範圍第10項所述之正反雙面接頭之電子裝置，其為一隨身碟，且設有一電路板，該儲存單元電連接在該電路板上，該二排第一接點電連接該電路板。 The electronic device of the positive and negative double-sided connector according to claim 10, which is a portable disk, and is provided with a circuit board, the storage unit is electrically connected to the circuit board, and the first row of the two contacts is electrically connected. Connect the board.

如申請專利範圍第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該電子單元更包括一控制電路，藉以控制該電子單元之運作。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 wherein the electronic The unit further includes a control circuit for controlling the operation of the electronic unit.

如申請專利範圍第1項或第4項或第5項或第8項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 4 or 5 or 8, wherein a circuit board is further provided, and the electronic unit is electrically connected to the circuit board, The second row of first contacts electrically connects the circuit board.

如申請專利範圍第2項或第3項或第6項或第7項所述之正反雙面接頭之電子裝置，其中更設有一電子式防逆流或防短路之電路安全保護手段，如防逆流電子元件或防短路電子元件或蕭基二極體或電路安全保護元件或安全電路設置手段等，藉以達到防逆流或防短路之電路安全。 For example, the electronic device of the positive and negative double-sided joints described in claim 2 or 3 or 6 or 7 is further provided with an electronic anti-backflow or short-circuit proof circuit protection means, such as Countercurrent electronic components or short-circuit proof electronic components or Xiaoji diodes or circuit safety protection components or safety circuit setting means, etc., in order to achieve circuit safety against backflow or short circuit.

如申請專利範圍第13項所述之正反雙面接頭之電子裝置，其中更設有一電子式防逆流或防短路之電路安全保護手段，如防逆流電子元件或防短路電子元件或蕭基二極體或電路安全保護元件或安全電路設置手段等，藉以達到防逆流或防短路之電路安全。 The electronic device of the positive and negative double-sided joints described in claim 13 is further provided with an electronic anti-backflow or short circuit protection circuit, such as anti-backflow electronic components or short-circuit proof electronic components or Xiao Jier A pole or circuit safety protection component or a safety circuit setting means, etc., thereby achieving circuit safety against backflow or short circuit.

如申請專利範圍第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該二排第一接點係為相同之連接介面。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 The first contact is the same connection interface.

如申請專利範圍第1項或第2項或第3項或第4項所述之正反雙面接頭之電子裝置，其中該二排第一接點之相同電路序號者相互為反向排列。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 3 or 4, wherein the same circuit numbers of the first rows of the two rows are arranged in opposite directions to each other.

如申請專利範圍第17項所述之正反雙面接頭之電子裝置，其中該二排第一接點係為相同之連接介面。 The electronic device of the positive and negative double-sided joints of claim 17, wherein the two rows of first contacts are the same connection interface.

如申請專利範圍第10項所述之正反雙面接頭之電子裝置，其中該儲存單元僅設有一記憶體，該二排第一接點係為相同之連接介面，藉由該二排第一接點可正反雙面電連接於一電連接母座。 The electronic device of the positive and negative double-sided connector according to claim 10, wherein the storage unit is only provided with a memory, and the two rows of first contacts are the same connection interface, and the second row is first The contacts can be electrically connected to the electrical connection base.

如申請專利範圍16項所述之正反雙面接頭之電子裝置，其中該二排第一接點相同之電路序號者電連接而串接成一組。 The electronic device of the positive and negative double-sided joints as claimed in claim 16 , wherein the circuit numbers of the two rows of the first contacts are electrically connected and connected in series.

如申請專利範圍第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該二排第一接點相同之電路序號者電連接而串接成一組。 The electronic device of the positive and negative double-sided joints as claimed in claim 5 or 6 or 7 or 8 wherein the circuit numbers of the first row of the first contacts are electrically connected and connected in series group.

如申請專利範圍第第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中至少一對相互電連接之二第一接點各自電連接一防逆流電子元件或防短路電子元件或蕭基二極體或電路安全保護元件或安全電路設置手段。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 A pair of first contacts electrically connected to each other are electrically connected to a backflow prevention electronic component or a short circuit prevention electronic component or a Schottky diode or a circuit safety protection component or a safety circuit setting means.

如申請專利範圍第第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該二排第一接點上下相互對齊者係相互電連接，且設有一偵測構造偵測電連接之方向。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 The two rows of first contacts are electrically connected to each other and are arranged to detect the electrical connection.

如申請專利範圍第1項或第2項或第3項或第4項或第5項或第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其為一電連接線公頭，該電子單元為一組多條電線，或為一無線收發裝置，該電子單元為一無線收發模組，或為一轉接電連接器，該電子單元為一轉接電路及一電連接器，或為一擴充插座，該電子單元為一擴充電路及一組電連接插座，或為一IC控制器，該電子單元為一控制單元。 An electronic device as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 8 The electronic unit is a set of a plurality of wires, or a wireless transceiver device, and the electronic unit is a wireless transceiver module or a transit electrical connector, and the electronic unit is a switching circuit. And an electrical connector, or an expansion socket, the electronic unit is an expansion circuit and a set of electrical connection sockets, or an IC controller, the electronic unit is a control unit.

如申請專利範圍第2項或第3項或第4項所述之正反雙面接頭之電子裝置，其中該連接板的周邊套設包覆有一金屬殼，藉以增強該連接板強度，該連接板兩側的金屬殼設有一卡定構造，當該連接板***一電連接母座時該卡定構造可與該電連接母座卡定。 The electronic device of the front and back double-sided joints of claim 2, wherein the peripheral edge of the connecting plate is covered with a metal shell to enhance the strength of the connecting plate. The metal shells on both sides of the board are provided with a locking structure, and the locking structure can be locked with the electrical connection base when the connecting board is inserted into an electrical connection base.

如申請專利範圍第6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該對接構造的周邊套設包覆有一金屬殼，藉以增強該對接構造強度，該對接構造左右兩側設有一卡定構造，當該對接構造***一電連接母座時該卡定構造可與該電連接母座卡定。 The electronic device of the front and back double-sided joints of claim 6 or 7 or 8, wherein the peripheral sleeve of the docking structure is covered with a metal shell to enhance the strength of the docking structure, the docking A locking structure is disposed on the left and right sides of the structure, and the locking structure can be locked with the electrical connection base when the docking structure is inserted into an electrical connection base.

如申請專利範圍第1項或第2項或第4項所述之正反雙面接頭之電子裝置，其中該連接板為一塑膠板，該連接板組裝定位於該外覆體前端。 The electronic device of the positive and negative double-sided joints as claimed in claim 1 or 2 or 4, wherein the connecting plate is a plastic plate, and the connecting plate is assembled and positioned at the front end of the outer covering body.

如申請專利範圍第1項或第4項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該連接板為一塑膠板，該連接板組裝定位於該外覆體前端，該連接板後端設有一套接槽供該電路板一端***卡定。 The electronic device of the front and back double-sided joints of claim 1 or 4, further comprising a circuit board electrically connected to the circuit board, wherein the two rows of first contacts are electrically connected In the circuit board, the connecting board is a plastic board, and the connecting board is assembled and positioned at the front end of the outer covering body, and a set of the rear end of the connecting board is provided The slot is inserted into the card at one end of the board.

如申請專利範圍第5項或第8項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該對接構造包括一絕緣座體，該絕緣座體前段設有該上下兩板面且後段設有一套接槽，該電路板前段套接卡定於該套接槽，該二排第一端子設有接腳電連接或焊接在該電路板。 The electronic device of the front and back double-sided joints of claim 5 or claim 8, wherein a circuit board is further disposed, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected. In the circuit board, the docking structure includes an insulating seat body, the front and the bottom of the insulating seat are provided with the upper and lower plates, and the rear portion is provided with a set of slots, and the front plate of the circuit board is sleeved in the socket, the two rows The first terminal is provided with a pin electrically connected or soldered to the circuit board.

如申請專利範圍第1項或第2項或第3項項所述之正反雙面接頭之電子裝置，其中該連接板設有一補強構造，藉以增強該連接板強度。 The electronic device of the front and back double-sided joints as claimed in claim 1 or 2 or 3, wherein the connecting plate is provided with a reinforcing structure to enhance the strength of the connecting plate.

如申請專利範圍第5項或第6項或第7項所述之正反雙面接頭之電子裝置，其中該對接構造設有一補強構造，藉以增強該對接構造強度。 The electronic device of the positive and negative double-sided joint according to claim 5, wherein the docking structure is provided with a reinforcing structure to enhance the strength of the docking structure.

如申請專利範圍第4項或第8項所述之正反雙面接頭之電子裝置，其中該補強構造可為補強板或焊板或套接槽或封膠體。 The electronic device of the front and back double-sided joints of claim 4, wherein the reinforcing structure is a reinforcing plate or a welding plate or a socket or a sealing body.

如申請專利範圍第4項或第8項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該補強構造可為補強板焊接或卡合該電路板且延伸至該電路板後段，或該補強構造可為套接槽，該電路板前段套接卡定於該套接槽。 The electronic device of the front and back double-sided joints of claim 4, wherein the electronic device is further provided with a circuit board, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected. In the circuit board, the reinforcing plate may be a reinforcing plate for soldering or engaging the circuit board and extending to the rear portion of the circuit board, or the reinforcing structure may be a socket groove, and the front portion of the circuit board is sleeved in the socket.

如申請專利範圍第1項或第5項所述之正反雙面接頭之電子裝置，其中更設有一電路板及一補強構造，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該補強構造可為補強板焊接或卡合該電路板且延伸至該電路板後段，或該補強構造可為套接槽，該電路板前段套接卡定於該套接槽。 The electronic device of the positive and negative double-sided joints described in claim 1 or 5, further comprising a circuit board and a reinforcing structure, wherein the electronic unit is electrically connected Connected to the circuit board, the two rows of first contacts are electrically connected to the circuit board, and the reinforcing structure may be a reinforcing plate for soldering or snapping the circuit board and extending to a rear portion of the circuit board, or the reinforcing structure may be a socket The slot, the front sleeve of the circuit board is fixed in the socket.

如申請專利範圍第2項或第3項或第6項或第7項所述之正反雙面接頭之電子裝置，其中更設有一補強構造可為補強板焊接或卡合該電路板且延伸至該電路板後段，或該補強構造可為套接槽，該電路板前段套接卡定於該套接槽。 The electronic device of the positive and negative double-sided joints described in claim 2 or 3 or 6 or 7 further includes a reinforcing structure for welding or engaging the reinforcing plate and extending To the rear of the circuit board, or the reinforcing structure may be a socket slot, the front panel of the circuit board is sleeved in the socket.

如申請專利範圍第13項所述之正反雙面接頭之電子裝置，其中該電路板前段上下面分別設有一絕緣座體而形成該二板面，該二絕緣座體各設有該一排第一接點，該二排第一接點係形成在二排第一端子，該二排第一端子設有接腳電連接或焊接在該電路板。 The electronic device of the front and back double-sided joints of claim 13 , wherein an upper surface of the front panel of the circuit board is respectively provided with an insulating base body to form the two board faces, and the two insulating base bodies are respectively provided with the row The first contact, the two rows of first contacts are formed in two rows of first terminals, and the two rows of first terminals are provided with pins electrically connected or soldered to the circuit board.

如申請專利範圍第1項所述之正反雙面接頭之電子裝置，其中該連接板的前邊、二側邊及後段套設包覆有該金屬殼。 The electronic device of the front and back double-sided joints of claim 1, wherein the front side, the two side edges and the rear side of the connecting plate are covered with the metal shell.

如申請專利範圍第25項所述之正反雙面接頭之電子裝置，其中該連接板的前邊、二側邊及後段套設包覆有該金屬殼。 The electronic device of the front and back double-sided joints of claim 25, wherein the front side, the two side edges and the rear side of the connecting plate are sheathed with the metal shell.

如申請專利範圍第4項所述之正反雙面接頭之電子裝置，其中該二排第一接點形成在二排第一端子，該補強構造為設於該連接板中間之一金屬材質之補強板，藉以分隔二排第一端子。 The electronic device of the front and back double-sided joints of claim 4, wherein the two rows of first contacts are formed in two rows of first terminals, and the reinforcing structure is disposed in a metal material in the middle of the connecting plate. The reinforcing plate is used to separate the first terminals of the second row.

如申請專利範圍第4項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該補強構造設於該連接板或電路板，藉由該補強構造結合該連接板和該電路板並增強該連接板或該電路板之強度。 The electronic device of the positive and negative double-sided joints of claim 4, further comprising a circuit board, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the circuit board, The reinforcing structure is disposed on the connecting board or the circuit board, and the connecting board and the circuit board are combined by the reinforcing structure and the strength of the connecting board or the circuit board is enhanced.

如申請專利範圍第30項所述之正反雙面接頭之電子裝置，其中該該二排第一接點形成在二排第一端子，補強構造為設於該連接板中間之一金屬材質之補強板，藉以分隔該二排第一端子。 An electronic device for a positive and negative double-sided joint according to claim 30 of the patent application, The first row of the first row of the second row is formed in the second row of the first terminal, and the reinforcing structure is a reinforcing plate of a metal material disposed in the middle of the connecting plate, thereby separating the two rows of the first terminals.

如申請專利範圍第30項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該補強構造設於該連接板或電路板，藉由該補強構造結合該連接板和該電路板並增強該連接板或該電路板之強度。 The electronic device of the positive and negative double-sided joints of claim 30, further comprising a circuit board, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the circuit board, The reinforcing structure is disposed on the connecting board or the circuit board, and the connecting board and the circuit board are combined by the reinforcing structure and the strength of the connecting board or the circuit board is enhanced.

如申請專利範圍第8項所述之正反雙面接頭之電子裝置，其中該補強構造為設於該對接構造之絕緣座體中間之一金屬材質之補強板，藉以分隔該二排第一端子。 The electronic device of the positive and negative double-sided joints of claim 8, wherein the reinforcing structure is a reinforcing plate of a metal material disposed in the middle of the insulating seat of the butting structure, thereby separating the two rows of first terminals .

如申請專利範圍第8項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該補強構造設於該對接構造或電路板，藉由該補強構造結合該對接構造和該電路板並增強該連接板或該電路板之強度。 The electronic device of the positive and negative double-sided joints of claim 8, wherein a circuit board is further disposed, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the circuit board. The reinforcing structure is disposed on the docking structure or the circuit board, and the reinforcing structure combines the docking structure and the circuit board and enhances the strength of the connecting board or the circuit board.

如申請專利範圍第31項所述之正反雙面接頭之電子裝置，其中該補強構造為設於該對接構造之絕緣座體中間之一金屬材質之補強板，藉以分隔該二排第一端子。 The electronic device of the positive and negative double-sided joints of claim 31, wherein the reinforcing structure is a reinforcing plate of a metal material disposed in the middle of the insulating seat of the butting structure, thereby separating the two rows of first terminals .

如申請專利範圍第31項所述之正反雙面接頭之電子裝置，其中更設有一電路板，該電子單元電連接在該電路板上，該二排第一接點電連接該電路板，該補強構造設於該對接構造或電路板，藉由該補強構造結合該對接構造和該電路板並增強該對接構造或該電路板之強度。 The electronic device of the positive and negative double-sided joints of claim 31, further comprising a circuit board, the electronic unit is electrically connected to the circuit board, and the two rows of first contacts are electrically connected to the circuit board, The reinforcing structure is disposed on the docking structure or the circuit board, and the reinforcing structure combines the docking structure and the circuit board and enhances the strength of the docking structure or the circuit board.

如申請專利範圍第2項或第3項或第6項或第7項所述之正反雙面接頭之電子裝置，其中該電路板設有至少兩組獨立電路接點。 An electronic device as claimed in claim 2, wherein the circuit board is provided with at least two sets of independent circuit contacts.

如申請專利範圍第13項所述之正反雙面接頭之電子裝置，其中該電路板設有至少兩組獨立電路接點。 The electronic device of the positive and negative double-sided joint according to claim 13, wherein the circuit board is provided with at least two sets of independent circuit contacts.

如申請專利範圍第1項或第2項或第3項或第4項或第5項或第 6項或第7項或第8項所述之正反雙面接頭之電子裝置，其中該兩板面皆分別各設有一排凹面及一排穿孔。 If you apply for patent scope 1 or 2 or 3 or 4 or 5 or The electronic device of the positive or negative double-sided joint according to Item 6 or Item 8, wherein the two plates are respectively provided with a row of concave surfaces and a row of perforations.

如申請專利範圍第2項或第6項所述之正反雙面接頭之電子裝置，其中該二絕緣座體與該二排第一端子是分別採埋入塑膠射出成型結構。 The electronic device of the positive and negative double-sided joints of claim 2, wherein the two insulating bases and the two rows of first terminals are respectively embedded in a plastic injection molding structure.

如申請專利範圍第36項所述之正反雙面接頭之電子裝置，其中該二絕緣座體與該二排第一端子是分別採埋入塑膠射出成型結構。 The electronic device of the positive and negative double-sided joints of claim 36, wherein the two insulating bases and the two rows of first terminals are respectively embedded in a plastic injection molding structure.

如申請專利範圍第2項或第3項或第6項或第7項所述之正反雙面接頭之電子裝置，其中該電路板設有2组導電接點，該2组導電接點為依序反向排列的電路且分別設於該電路板不同面。 The electronic device of the positive and negative double-sided joints described in claim 2 or 3 or 6 or 7 wherein the circuit board is provided with two sets of conductive contacts, and the two sets of conductive contacts are The circuits arranged in reverse order are respectively disposed on different sides of the circuit board.

如申請專利範圍第36項所述之正反雙面接頭之電子裝置，其中該電路板設有2组導電接點，該2组導電接點為依序反向排列的電路且分別設於該電路板不同面。 The electronic device of the positive and negative double-sided joints described in claim 36, wherein the circuit board is provided with two sets of conductive contacts, and the two sets of conductive contacts are sequentially arranged in reverse order and are respectively disposed on the circuit Different sides of the board.

如申請專利範圍第1項所述之正反雙面接頭之電子裝置，其中該金屬殼包覆該連接板只令上下板面露出。 The electronic device of the front and back double-sided joint according to claim 1, wherein the metal shell covers the connecting plate to expose only the upper and lower plates.