TWI526325B - Method and device for printing on heated substrates - Google Patents

Method and device for printing on heated substrates Download PDF

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Publication number
TWI526325B
TWI526325B TW099115799A TW99115799A TWI526325B TW I526325 B TWI526325 B TW I526325B TW 099115799 A TW099115799 A TW 099115799A TW 99115799 A TW99115799 A TW 99115799A TW I526325 B TWI526325 B TW I526325B
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Taiwan
Prior art keywords
shield
substrate
printhead
nozzles
heated substrate
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TW099115799A
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Chinese (zh)
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TW201109184A (en
Inventor
伊利亞乎Ｍ 克里奇曼
漢安 高瑟
伊吉爾 羅茲維爾
米爾 迪比
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艾克斯噴射器有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/377—Cooling or ventilating arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/05—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers produced by the application of heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/08—Embodiments of or processes related to ink-jet heads dealing with thermal variations, e.g. cooling

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  • Coating Apparatus (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)

Description

列印在經加熱之基材上的方法及裝置Method and apparatus for printing on a heated substrate

本發明係有關於列印在經加熱之基材上的方法及裝置。This invention relates to methods and apparatus for printing on heated substrates.

發明背景Background of the invention

在可列印式電子件的製造中，係日益利用諸如噴墨列印系統等非接觸沉積列印系統。譬如，對於諸如射頻識別(RFID)、有機發光二極體(OLED)、光伏(PV)太陽能電池及其他可列印式電子件產品等應用，可使用此等系統藉由沉積一電傳導材料(墨料)於不同基材上將層予以金屬化。In the manufacture of printable electronic components, non-contact deposition printing systems such as ink jet printing systems are increasingly utilized. For example, for applications such as radio frequency identification (RFID), organic light-emitting diode (OLED), photovoltaic (PV) solar cells, and other printable electronic products, such systems can be used to deposit an electrically conductive material ( The ink is metallized on different substrates.

在譬如太陽能電池生產期間之矽晶圓的金屬化等部分應用中，希望將材料沉積在一熱基材表面上。熱基材可能不利地加熱噴嘴板並可能負面地影響列印品質。此外，由於煙氣可以小滴形式凝結於噴嘴板上，從配送至經加熱基材上的液體材料所蒸發之煙氣亦可能負面地影響列印頭的操作。In some applications, such as metallization of wafers during solar cell production, it is desirable to deposit materials on the surface of a thermal substrate. Thermal substrates can disadvantageously heat the nozzle plate and can negatively impact print quality. In addition, since the flue gas can condense on the nozzle plate in the form of droplets, the fumes vaporized from the liquid material dispensed onto the heated substrate can also negatively affect the operation of the print head.

依據本發明之一實施例，係特地提出一種用於配送材料於一經加熱基材上之列印裝置，該裝置包含：一列印頭，其具有一或多個噴嘴；及一熱量屏蔽件，其當列印時係部份地遮罩面對該經加熱基材之該列印頭的一側，藉以降低從該基材至該列印頭之熱量轉移，該屏蔽件係包括一對準於該一或多個噴嘴之槽，以使材料能夠從該一或多個噴嘴通至該經加熱基材。In accordance with an embodiment of the present invention, a printing apparatus for dispensing material onto a heated substrate is provided, the apparatus comprising: a row of print heads having one or more nozzles; and a thermal shield When printing, partially covering a side of the print head facing the heated substrate, thereby reducing heat transfer from the substrate to the print head, the shield comprising an alignment A slot of the one or more nozzles to enable material to pass from the one or more nozzles to the heated substrate.

依據本發明之另一實施例，係特地提出一種用於沉積於經加熱基材上之非接觸沉積方法，該方法包含加熱一基材；及自一具有一或多個噴嘴的列印頭將材料沉積於該經加熱基材上，其中該列印頭係由一部份遮罩面對該經加熱基材之該列印頭的一側之熱量屏蔽件所屏蔽，藉以降低從該基材至該列印頭之熱量轉移，其中該屏蔽件包括一對準於該一或多個噴嘴之槽，以使該材料能夠從該一或多個噴嘴通至該經加熱基材。According to another embodiment of the present invention, a non-contact deposition method for depositing on a heated substrate is provided, the method comprising heating a substrate; and from a print head having one or more nozzles Depositing a material on the heated substrate, wherein the printhead is shielded by a portion of the heat shield facing a side of the printhead of the heated substrate to thereby reduce the substrate from the substrate Heat transfer to the printhead, wherein the shield includes a slot aligned with the one or more nozzles to enable the material to pass from the one or more nozzles to the heated substrate.

圖式簡單說明Simple illustration

被視為本發明之標的物係在說明書的結論部分被特別指出且明確地請求。然而，可參照附圖閱讀下文詳細描述而清楚瞭解本發明之組織與操作方式、及其目的、特徵構造與優點，其中：第1圖係為根據本發明的實施例之一示範性列印頭及一屏蔽件的示意橫剖視圖；第2圖為根據本發明的實施例之一具有多重列印頭及一屏蔽結構之示範性列印單元的示意圖；第3圖為根據本發明其他實施例之一示範性列印頭及一屏蔽件的示意圖；第4圖為根據本發明的替代性實施例之一示範性列印頭的示意圖。The subject matter which is regarded as the subject matter of the present invention is particularly pointed out and explicitly claimed in the conclusion of the specification. However, the structure and operation of the present invention, as well as its purpose, features, and advantages, will be apparent from the following detailed description of the embodiments of the invention, wherein: FIG. 1 is an exemplary print head in accordance with an embodiment of the present invention. And a schematic cross-sectional view of a shield; FIG. 2 is a schematic view of an exemplary print unit having multiple print heads and a shield structure in accordance with an embodiment of the present invention; and FIG. 3 is a view of another embodiment in accordance with the present invention. A schematic view of an exemplary printhead and a shield; and FIG. 4 is a schematic illustration of an exemplary printhead in accordance with an alternative embodiment of the present invention.

請瞭解為了顯示簡單與清楚起見，圖中所示的元件未必精確繪製或依實際比例繪製。譬如，部分元件的維度為求清楚可能相對於其他元件被加大。並且，若適當的話，可在圖中重覆編號以代表對應或類似的元件。並且，圖中描繪的部分區塊可合併成單一功能。Please understand that the elements shown in the figures are not necessarily drawn accurately or in actual scale for simplicity and clarity. For example, the dimensions of some of the components may be increased relative to other components for clarity. Also, where appropriate, the numbers may be repeated in the figures to represent corresponding or similar elements. Also, some of the blocks depicted in the figures can be combined into a single function.

較佳實施例之詳細說明Detailed description of the preferred embodiment

下文詳細描述中，提出許多特定細節以供徹底瞭解本發明。然而，一般熟習該技藝者將瞭解，本發明可在不具有這些特定細節情形下實行。其他案例中，尚未詳述熟知的方法、程序、組件、模組、單元及/或電路以免模糊本發明。In the following detailed description, numerous specific details are set forth. However, it will be apparent to those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components, modules, units and/or circuits have not been described in detail to avoid obscuring the invention.

本發明的實施例係有關一方法及一列印裝置，諸如噴墨列印系統或利用一經聚焦氣劑流的粒子之氣劑噴注系統，用以將材料非接觸沉積於一經加熱基材上。根據部分實施例，一屏蔽件或一經冷卻罩幕係可被耦合至系統的列印頭藉以提供經加熱基材與列印頭之間的一屏蔽件。在說明書與申請專利範圍中可交換使用“材料”、“列印流體”及“墨料”用語。Embodiments of the present invention relate to a method and a printing apparatus, such as an ink jet printing system or an air injection system utilizing a focused gas stream of particles for non-contact deposition of a material onto a heated substrate. According to some embodiments, a shield or a cooled mask can be coupled to the printhead of the system to provide a shield between the heated substrate and the printhead. The terms "material", "printing fluid" and "ink" are used interchangeably in the specification and patent application.

根據本發明的實施例之一列印裝置係可操作藉以列印於一經加熱基材上同時屏蔽列印頭。譬如，列印頭係可操作藉以經由裝置的一熱量屏蔽板中之一槽沉積墨料於經加熱基材上。水或另一冷卻劑可流通經過屏蔽框架藉以自屏蔽框架及板移除熱量。因此，屏蔽板可防止列印頭過熱。並且，屏蔽件可抑制從經加熱基材所蒸發的煙氣凝結於列印頭的一噴嘴板上。A printing device in accordance with an embodiment of the present invention is operable to print on a heated substrate while shielding the printhead. For example, the print head can be operated to deposit ink onto the heated substrate via a slot in a thermal shield of the device. Water or another coolant can flow through the shielding frame to remove heat from the shielding frame and the plate. Therefore, the shield prevents the print head from overheating. Also, the shield suppresses condensation of fumes vaporized from the heated substrate to a nozzle plate of the print head.

此外，吸力或壓力可被施加至一空氣導管藉以誘發屏蔽板與列印頭之間、或屏蔽頭與基材之間的空氣流。屏蔽件與列印頭之間的空氣流係可經由槽離開並可從基材推離原本會在列印頭方向經由槽進入之熱空氣。Additionally, suction or pressure can be applied to an air conduit to induce air flow between the shield and the printhead, or between the shield and the substrate. The air flow between the shield and the printhead can exit through the slot and can push away from the substrate hot air that would otherwise enter through the slot in the direction of the printhead.

譬如，可利用列印裝置在太陽能電池生產期間將金屬化施加至矽晶圓。金屬化可提供對於電池之電性接觸以將電池電性連接至一或多個裝置。為此，材料可為一電傳導材料(電傳導墨料及基材可為一半導體晶圓。沉積製程期間，半導體晶圓可被加熱藉以加快列印製程，譬如達到100℃至300℃溫度。根據部分實施例，噴嘴可配置於列印頭的一噴嘴板上之一單列中，藉以列印單一金屬化線於基材上。然而，應瞭解本發明的實施例不限於此應用，且其他非接觸沉積應用亦落在本發明的範圍內。For example, a metallization can be applied to a germanium wafer during solar cell production using a printing device. Metallization can provide electrical contact to the battery to electrically connect the battery to one or more devices. To this end, the material can be an electrically conductive material (the electrically conductive ink and the substrate can be a semiconductor wafer. During the deposition process, the semiconductor wafer can be heated to speed up the printing process, for example, to a temperature of 100 ° C to 300 ° C. In some embodiments, the nozzles can be disposed in a single row on a nozzle plate of the printhead to print a single metallization line on the substrate. However, it should be understood that embodiments of the invention are not limited to this application, and other non- Contact deposition applications are also within the scope of the invention.

現在參照第1圖，其係為根據本發明的實施例之一列印裝置的橫剖視示意圖。一列印裝置10─其可能為一噴墨列印系統的部份─係可包括一列印頭12及一熱量屏蔽件14。列印頭12可被耦合至一墨料供應管38，其可對於列印頭12提供材料(墨料)以經由噴嘴板20的噴嘴射出。Referring now to Figure 1, there is shown a cross-sectional view of a printing device in accordance with one embodiment of the present invention. A printing device 10, which may be part of an inkjet printing system, may include a row of print heads 12 and a heat shield 14. The print head 12 can be coupled to an ink supply tube 38 that can provide material (ink) to the print head 12 for ejection through the nozzles of the nozzle plate 20.

列印頭12可包括一或多列的噴嘴，一列印流體經由其射出(未圖示)。選用性地，列印頭12可包括一噴嘴板20，而在列印頭的一向外側上具有一或多列的噴嘴。本發明的部分實施例中，一列印頭可設有多重噴嘴板。或者，多重列印頭可配置於相對於彼此的固定位置中，如第2圖所示。此等配置可譬如用來同時列印數條線。The print head 12 can include one or more columns of nozzles through which a printing fluid is ejected (not shown). Alternatively, the print head 12 can include a nozzle plate 20 with one or more rows of nozzles on a lateral outer side of the print head. In some embodiments of the invention, a row of printheads can be provided with multiple nozzle plates. Alternatively, multiple printheads can be placed in fixed positions relative to each other, as shown in FIG. These configurations can be used, for example, to print several lines simultaneously.

熱量屏蔽件14可包括一屏蔽板14A，其具有一被定位為與噴嘴列相對之屏蔽槽24，及一屏蔽框架14B。列印頭12可設有不只一列的噴嘴，且槽則可較寬並對準於所有的列。或者，屏蔽板14可包括不只一槽24，其中各槽係對準於一各別列的噴嘴，且各槽使其對應列的噴嘴能夠沉積墨料於一基材上。熟習該技藝者應瞭解一列噴嘴可包括任何數量的噴嘴，包括單一噴嘴。The heat shield 14 can include a shield 14A having a shield slot 24 positioned opposite the nozzle row and a shield frame 14B. The print head 12 can be provided with more than one column of nozzles, and the slots can be wider and aligned to all of the columns. Alternatively, the shield 14 can include more than one slot 24, wherein each slot is aligned with a respective array of nozzles, and each slot has its corresponding array of nozzles capable of depositing ink onto a substrate. Those skilled in the art will appreciate that a row of nozzles can include any number of nozzles, including a single nozzle.

屏蔽框架14B可將屏蔽板14A相對於列印頭12固持在一固定位置。根據部分實施例，屏蔽板14A及屏蔽框架14B可由單件金屬被機械加工。屏蔽件14可包括一或多個冷卻劑導管28，一冷卻劑可經由其流動及流通。屏蔽件14可至少部份地圍繞列印頭12而形成一間隙或空間於列印頭12及屏蔽框架14B之間。該空間可便利空氣流，如第3圖所示，並亦可能能夠使屏蔽件14中之列印頭12作精確調整。間隙可由一密封件36所密封。譬如，密封件36可包括一密封墊片或者一或多條的密封材料。密封材料可包括密封泡綿、橡膠、矽氧、填隙材料、或該技藝習知的任何其他適當密封材料。The shield frame 14B holds the shield plate 14A in a fixed position relative to the print head 12. According to some embodiments, the shield 14A and the shield frame 14B may be machined from a single piece of metal. The shield 14 can include one or more coolant conduits 28 through which a coolant can flow and circulate. The shield 14 can at least partially surround the printhead 12 to form a gap or space between the printhead 12 and the shield frame 14B. This space facilitates air flow, as shown in Figure 3, and may also enable precise adjustment of the print head 12 in the shield 14. The gap can be sealed by a seal 36. For example, the seal 36 can include a gasket or one or more sealing materials. The sealing material may comprise a sealed foam, rubber, silicone, interstitial material, or any other suitable sealing material as is known in the art.

沉積製程期間，一經加熱基材(未圖示)可被定位為與噴嘴相對，處於一適當距離。基材可被安裝在一加熱板(未圖示)上。根據本發明的實施例，屏蔽件14可防止來自經加熱基材的熱量使列印頭12過熱。屏蔽板14A可作為一罩幕，其至少部份地覆蓋或遮罩住列印頭的向外側同時能夠經由槽沉積墨料於基材上。During the deposition process, a heated substrate (not shown) can be positioned opposite the nozzle at an appropriate distance. The substrate can be mounted on a heating plate (not shown). In accordance with an embodiment of the present invention, the shield 14 prevents heat from the heated substrate from overheating the printhead 12. The shield 14A can act as a mask that at least partially covers or masks the outward side of the printhead while depositing ink onto the substrate via the grooves.

屏蔽板14A的厚度可能受限於噴嘴與基材之間的距離。譬如，為了能夠以一所需要品質作列印，噴嘴可放置在對於基材表面之一相對較小距離內。屏蔽板的厚度則應夠小以不增加噴嘴與基材表面之間的距離。譬如，若噴嘴與基材表面之間所需要的距離約為1mm，則屏蔽板的厚度可譬如受限為0.2至0.5mm。根據本發明的實施例，屏蔽板14A可能夠厚而能夠具有構造強度及從屏蔽板至經冷卻屏蔽框架所需要的熱傳導兩者。The thickness of the shield 14A may be limited by the distance between the nozzle and the substrate. For example, to be able to print on a desired quality, the nozzle can be placed within a relatively small distance to one of the substrates surface. The thickness of the shield should be small enough not to increase the distance between the nozzle and the surface of the substrate. For example, if the required distance between the nozzle and the surface of the substrate is about 1 mm, the thickness of the shield may be limited to, for example, 0.2 to 0.5 mm. In accordance with embodiments of the present invention, the shield 14A can be thick enough to have both structural strength and thermal conduction required from the shield to the cooled shield frame.

屏蔽板14A中的槽24可製成狹窄狀藉以盡量加大列印頭對於熱量─通常係為被基材加熱之空氣導致的對流熱量─的屏蔽作用。此外，一狹窄開縫可屏蔽住列印頭不受到從經加熱基材蒸發且能夠凝結在列印頭上之煙氣。譬如，槽的寬度可小於0.5mm。根據部分實施例，為了妥當地屏蔽，槽寬度可為屏蔽板厚度之一比例部分。譬如，槽寬度可小於屏蔽板厚度的一半。譬如，一狹窄的槽可抑制不良氣體自由流經該槽。另一方面，其他考量因素可能將槽寬度限制為比一最小值更寬之一寬度。譬如，可根據一不使槽與列印頭沉積墨料至基材上的作用產生干擾之要求來決定槽的最小值寬度。譬如，槽的寬度可製成比噴嘴直徑更大3至20倍。譬如，一槽寬度可為約0.1mm至0.2mm。The grooves 24 in the shield 14A can be made narrow to maximize the shielding of the printhead from heat, typically convective heat caused by the heated air of the substrate. In addition, a narrow slit can shield the printhead from fumes that evaporate from the heated substrate and that can condense on the printhead. For example, the width of the groove can be less than 0.5 mm. According to some embodiments, the groove width may be a proportional portion of the thickness of the shield plate for proper shielding. For example, the groove width can be less than half the thickness of the shield. For example, a narrow groove can prevent free gas from flowing freely through the groove. On the other hand, other considerations may limit the slot width to one width wider than a minimum. For example, the minimum width of the groove can be determined based on a requirement that interference is not caused by the effect of the ink on the substrate and the deposition head onto the substrate. For example, the width of the groove can be made 3 to 20 times larger than the diameter of the nozzle. For example, a groove width can be from about 0.1 mm to 0.2 mm.

屏蔽件14可構成包括有一具熱傳導性的材料。譬如，一適當材料可包括一諸如鋁或銅等金屬，或任何其他適當的熱傳導塑料或陶瓷。可以在屏蔽板14A與屏蔽框架14B之間提供良好熱性接觸的方式使屏蔽板連接至屏蔽框架。譬如，屏蔽框架及屏蔽板可由單件材料作機械加工。或者，屏蔽板可利用適當的熱傳導連接材料被螺栓、熔接、銲接、膠接、或以其他方式附裝至屏蔽框架。屏蔽框架14B可提供對於屏蔽板14A之機械性支撐。此外，屏蔽框架可提供熱質量(thermal mass)藉以形成一供從屏蔽板傳導離開的熱量所用之排熱器。譬如，屏蔽框架的壁可製成充分夠厚藉以提供一適當熱質量，亦具充分機械強度。提供厚壁亦可利於從與屏蔽板的接頭至被雕刻或連接到屏蔽框架的冷卻傳導區位之良好熱傳導。The shield 14 can be constructed to include a material that is thermally conductive. For example, a suitable material may include a metal such as aluminum or copper, or any other suitable thermally conductive plastic or ceramic. The shield can be attached to the shield frame in a manner that provides good thermal contact between the shield 14A and the shield frame 14B. For example, the shield frame and the shield can be machined from a single piece of material. Alternatively, the shield can be bolted, welded, welded, glued, or otherwise attached to the shield frame using a suitable thermally conductive joining material. The shield frame 14B can provide mechanical support for the shield 14A. In addition, the shield frame can provide a thermal mass to form a heat sink for the heat conducted away from the shield. For example, the walls of the shielding frame can be made sufficiently thick to provide a suitable thermal mass and also have sufficient mechanical strength. Providing a thick wall may also facilitate good heat transfer from the joint with the shield to the cooled conductive location that is engraved or connected to the shield frame.

可供一冷卻劑流過及流通之一或多個冷卻劑導管28係可以任何可能的構造被定位於屏蔽件14內，譬如，導管可圍繞列印頭12的壁。導管可被雕刻於屏蔽框架14B中。根據部分實施例，屏蔽框架可包括一或多個孔徑，一冷卻劑流體可經由其流動或流通。譬如，水可作為一適當的冷卻劑流體。流通的冷卻劑可傳送熱量離開屏蔽框架14B及經附接的屏蔽板14A到達一貯器，或到達一熱交換裝置而在其中從冷卻劑移除熱量。One or more coolant conduits 28 are available for a coolant to flow through and circulate, and may be positioned within the shield 14 in any possible configuration, such as a conduit surrounding the wall of the printhead 12. The catheter can be engraved in the shield frame 14B. According to some embodiments, the shielding frame may include one or more apertures through which a coolant fluid may flow or circulate. For example, water can act as a suitable coolant fluid. The circulating coolant can transfer heat away from the shield frame 14B and the attached shield plate 14A to a receptacle or to a heat exchange device where heat is removed from the coolant.

屏蔽板14A的一或多個表面可由低發射率材料塗覆或構成，其可抑制列印頭受到經加熱基材之輻射性加熱。譬如，屏蔽板14A的一向外表面─亦即背離列印頭且朝向經加熱基材之屏蔽板的一表面─係可反射基材所發射之熱輻射。譬如，若基材被加熱至200℃到300℃的一溫度，屏蔽板14A的向外表面可設計成反射熱紅外輻射。譬如，該表面或屏蔽板可由經拋光裸鋁構成。此外，屏蔽板的一向內表面可設計成具有低發射率藉以防止列印頭12受到屏蔽板14A之輻射性加熱。One or more surfaces of the shield 14A may be coated or constructed of a low emissivity material that inhibits the printhead from being subjected to radiant heating of the heated substrate. For example, an outward surface of the shield 14A, that is, a surface facing away from the printhead and facing the shield of the heated substrate, can reflect the thermal radiation emitted by the substrate. For example, if the substrate is heated to a temperature of 200 ° C to 300 ° C, the outer surface of the shield 14A can be designed to reflect thermal infrared radiation. For example, the surface or shield may be constructed of polished bare aluminum. In addition, the inwardly facing surface of the shield can be designed to have a low emissivity to prevent the printhead 12 from being subjected to the radiant heating of the shield 14A.

屏蔽件14可設計成抑制或防止墨料滴或粒子的困陷或累積。譬如，若無此設計，從一經加熱基材蒸發之含有墨料組份的煙氣係可能凝結在屏蔽板14A上，屏蔽板24的一槽中，列印頭12的一噴嘴板20上，或屏蔽板14A與噴嘴板20之間的間隙中。類似地，諸如列印頭12的一噴嘴所發射之一霧、噴霧、或小滴等漫射墨料係可能聚集於屏蔽板上，屏蔽板的一槽中，列印頭的一噴嘴板上，或屏蔽板與噴嘴板之間的間隙中。The shield 14 can be designed to inhibit or prevent trapping or accumulation of ink droplets or particles. For example, without this design, the flue gas containing the ink component evaporating from the heated substrate may be condensed on the shield plate 14A, in a slot of the shield plate 24, on a nozzle plate 20 of the print head 12, Or in the gap between the shield plate 14A and the nozzle plate 20. Similarly, a diffuse ink such as a mist, spray, or droplet emitted by a nozzle such as the print head 12 may be collected on the shield plate, in a slot of the shield plate, on a nozzle plate of the print head. , or in the gap between the shield plate and the nozzle plate.

屏蔽板14A可包括一或多個非濕潤表面藉以抑制墨料聚集於那些表面上。一非濕潤表面可抑制一諸如墨料等液體黏著至表面。譬如，屏蔽板14A的一或多個表面可塗覆有鐵氟龍(Teflon)。譬如，屏蔽板的一向內表面可為一非濕潤表面。屏蔽板14A的向內非濕潤表面可抑制流體累積於屏蔽板與列印頭之間(列印頭的噴嘴板20之一向外表面上的一非濕潤表面係可類似地抑制流體累積於噴嘴板與屏蔽板之間)。類似地，屏蔽板中之一槽的壁可選用性地製成非濕潤表面。譬如，非濕潤槽壁可抑制流體累積於槽內。屏蔽板14A的一向外表面可選用性地身為一非濕潤表面。或者，屏蔽板14A的一向內表面(且可能包括槽壁)係可為非濕潤性，而屏蔽板的一向外表面則為濕潤性。在此例中，流體可從向內表面被抽取至向外表面。這可用來使屏蔽板14A與列印頭12之間的間隙保持無流體。在此例中，可能偶而需對於向外表面清理墨料或流體。Shielding plate 14A can include one or more non-wetting surfaces to inhibit ink build-up on those surfaces. A non-wetting surface inhibits adhesion of a liquid such as ink to the surface. For example, one or more surfaces of the shield 14A may be coated with Teflon. For example, the inwardly facing surface of the shield can be a non-wetting surface. The inward non-wetting surface of the shield 14A inhibits fluid build-up between the shield and the printhead (a non-wetting surface on one of the outwardly facing surfaces of the nozzle plate 20 of the printhead can similarly inhibit fluid build up in the nozzle plate Between the shield and the shield). Similarly, the walls of one of the slots in the shield are optionally formed as a non-wetting surface. For example, the non-wetting groove wall inhibits the accumulation of fluid in the tank. An outward surface of the shield 14A is optionally a non-wetting surface. Alternatively, the inwardly facing surface (and possibly the groove wall) of the shield 14A may be non-wetting, while an outwardly facing surface of the shield is wet. In this case, fluid can be drawn from the inward surface to the outward surface. This can be used to keep the gap between the shield 14A and the printhead 12 fluid free. In this case, it may occasionally be necessary to clean the ink or fluid to the outer surface.

現在參照第2圖，其係為根據本發明的實施例之一具有多重列印頭之列印單元的示範圖。這些實施例中，單一屏蔽件115可設計成容納多重列印頭12A-12F。屏蔽件115可包括一其中具有複數個槽24A-24F之屏蔽板，各槽被定位為與列印頭12A-12F一者的一對應噴嘴或噴嘴列呈現相對。即便示範性實施例包括6個列印頭，熟習該技藝者應瞭解本發明的實施例不在此限，且其他實施例可有關任何數量的列印頭。屏蔽件115可包括一或多個冷卻劑導管28，其彼此獨立或耦合。Reference is now made to Fig. 2, which is an illustration of a printing unit having multiple print heads in accordance with one embodiment of the present invention. In these embodiments, a single shield 115 can be designed to accommodate multiple printheads 12A-12F. The shield 115 can include a shield having a plurality of slots 24A-24F therein, each slot being positioned opposite a corresponding nozzle or nozzle row of one of the printheads 12A-12F. Even though the exemplary embodiment includes six printheads, those skilled in the art will appreciate that embodiments of the invention are not limited thereto, and that other embodiments may be directed to any number of printheads. The shield 115 can include one or more coolant conduits 28 that are independent or coupled to one another.

現在參照第3圖，其為根據本發明的其他實施例被連接至一經加壓空氣或氣體源之一示範性列印頭及一屏蔽件的示意圖。除了一(或多)個冷卻劑導管28外，一列印裝置300─其可能身為一噴墨列印系統的部份─係可包括一或多個空氣導管30以在列印頭12與屏蔽件14之間的間隙內產生空氣流。此空氣流可輔助冷卻列印裝置。空氣流亦可輔助列印裝置的空間維持沒有流體累積。譬如，導管30可連接至屏蔽框架與列印頭12壁之間的間隙。空氣導管30的另一端可被連接至一壓力源或裝置(未圖示)，諸如一鼓風機至，壓縮機，或經加壓空氣或氣體的貯槽。壓力源的操作可迫使空氣流出屏蔽板中的槽24外。往外空氣流可用來防止熱空氣及/或煙氣經由槽進入。Reference is now made to Fig. 3, which is a schematic illustration of an exemplary printhead and a shield attached to a pressurized air or gas source in accordance with other embodiments of the present invention. In addition to one (or more) coolant conduits 28, a printing device 300, which may be part of an inkjet printing system, may include one or more air conduits 30 for printing heads 12 and shielding Air flow is created in the gap between the pieces 14. This air flow assists in cooling the printing device. The air flow also assists the space of the printing device to maintain no fluid accumulation. For example, the conduit 30 can be coupled to the gap between the shield frame and the wall of the printhead 12. The other end of the air duct 30 can be connected to a pressure source or device (not shown), such as a blower to, a compressor, or a sump of pressurized air or gas. Operation of the pressure source can force air out of the slots 24 in the shield. The outward air flow can be used to prevent hot air and/or fumes from entering through the slots.

根據部分實施例，在間隙內所誘發之空氣流可具有一夠慢的空氣流速率而不與從噴嘴所發射的墨料沉積至基材上之作用產生干擾。或者，來自空氣導管30的空氣流可與列印操作同步化藉以不與墨料沉積產生干擾。譬如，可能只在沒有墨料從噴嘴發射時，才誘發空氣流。空氣導管30可將列印頭12與屏蔽件14之間的間隙連接至一用於誘發經過間隙的空氣(或另一氣體)流之裝置。According to some embodiments, the air flow induced within the gap may have a slower air flow rate without interfering with the effect of depositing ink ejected from the nozzle onto the substrate. Alternatively, the air flow from air duct 30 can be synchronized with the printing operation so as not to interfere with ink deposition. For example, air flow may only be induced when no ink is emitted from the nozzle. The air duct 30 can connect the gap between the print head 12 and the shield 14 to a means for inducing a flow of air (or another gas) through the gap.

若不將空氣流誘發至間隙內，一空氣導管30亦可從間隙吸取空氣，而當列印裝置未處於使用時造成空氣經由屏蔽件中的槽進入並遠離熱基材。譬如，一冷涼房間中的空氣可流過槽24以幫助冷卻位於列印頭23之噴嘴。If air flow is not induced into the gap, an air duct 30 can also draw air from the gap, and when the printing device is not in use, air is allowed to enter through the slots in the shield and away from the thermal substrate. For example, air in a cool room can flow through the slots 24 to help cool the nozzles located at the printhead 23.

現在參照第4圖，其顯示根據本發明的其他實施例被連接至一空氣吸取單元之一示範性列印頭及一屏蔽件的示意圖。對於一(或多)個冷卻劑導管28以添加或取代方式，一列印裝置400─其可能為一噴墨列印系統的部份─係可包括一空氣吸取單元50以收集來自一經加熱基材的煙氣。空氣吸取單元50可被定位成耦合至屏蔽板14A的一向外表面上之一空氣開口40。譬如，若吸力被施加至空氣吸取單元50，位居屏蔽板14A與經加熱基材(未圖示)之間的煙氣可被抽往空氣開口40，而誘發一遠離屏蔽槽24之空氣流。空氣流可防止流體累積於噴嘴及/或屏蔽槽24中或近處。多重空氣開口可設置於屏蔽板14A的向外表面上之不同區位。多重空氣開口可能能夠具有一較大空氣流速率或一對稱性空氣流圖案。Referring now to Figure 4, there is shown a schematic diagram of an exemplary printhead and a shield attached to an air suction unit in accordance with other embodiments of the present invention. For one or more coolant conduits 28 in an additive or replacement manner, a printing device 400, which may be part of an inkjet printing system, may include an air suction unit 50 for collecting from a heated substrate. Smoke. The air suction unit 50 can be positioned to couple to one of the air openings 40 on an outward surface of the shield plate 14A. For example, if suction is applied to the air suction unit 50, the flue gas between the shield plate 14A and the heated substrate (not shown) can be drawn to the air opening 40 to induce an air flow away from the shielding groove 24. . The air flow prevents fluid from accumulating in or near the nozzle and/or shielding groove 24. Multiple air openings may be provided at different locations on the outward surface of the shield 14A. Multiple air openings may be capable of having a larger air flow rate or a symmetrical air flow pattern.

面對噴嘴之屏蔽板14A的表面係可塗覆有一非濕潤塗覆物，或另被設計成非濕潤性。非濕潤塗覆物可抑制流體累積於噴嘴及屏蔽槽24附近。The surface of the shield plate 14A facing the nozzle may be coated with a non-wetting coating or otherwise designed to be non-wetting. The non-wetting coating inhibits fluid accumulation in the vicinity of the nozzle and the shielding groove 24.

根據本發明的實施例，一用於確保噴嘴對準於屏蔽槽24之機構係可包括一螺絲36及一彈簧38。螺絲36及彈簧38將反制力施加至列印頭12，而使列印頭12固持在相對於屏蔽框架14B之一給定位置。螺絲36的旋轉係可調整螺絲36從屏蔽框架14B往內延伸之距離。藉由改變螺絲36從屏蔽框架14B往內延伸之距離係可改變列印頭12相對於屏蔽框架14B之位置。列印頭12相對於屏蔽框架14B之位置及對準可被調整，直到噴嘴列對準於屏蔽槽24以及譬如噴嘴陣列相對於掃描方向的方向等其他機具要求為止。In accordance with an embodiment of the present invention, a mechanism for ensuring that the nozzles are aligned with the shielding slots 24 can include a screw 36 and a spring 38. The screw 36 and the spring 38 apply a counter force to the print head 12 to hold the print head 12 in a given position relative to one of the shield frames 14B. The rotation of the screw 36 adjusts the distance by which the screw 36 extends inwardly from the shield frame 14B. The position of the print head 12 relative to the shield frame 14B can be varied by varying the distance that the screw 36 extends inwardly from the shield frame 14B. The position and alignment of the print head 12 relative to the shield frame 14B can be adjusted until the nozzle rows are aligned with the shield slots 24 and other implement requirements such as the direction of the nozzle array relative to the scan direction.

此處已經顯示及描述本發明的特定特徵構造，一般熟習該技藝者可得知許多修改、替代、改變及均等物。因此，請瞭解申請專利範圍係預定涵蓋落在本發明的真實範圍內之所有此等修改及變化。The specific features of the present invention are shown and described herein, and many modifications, substitutions, changes and equivalents are known to those skilled in the art. Therefore, it is to be understood that the scope of the invention is intended to cover all such modifications and variations that fall within the true scope of the invention.

10,300,400．．．列印裝置10,300,400. . . Printing device

115．．．屏蔽件115. . . Shield

12,12A-12F,23．．．列印頭12,12A-12F, 23. . . Print head

14．．．熱量屏蔽件14. . . Thermal shield

14A．．．屏蔽板14A. . . Shield

14B．．．屏蔽框架14B. . . Shielding frame

20．．．噴嘴板20. . . Nozzle plate

24．．．屏蔽槽twenty four. . . Shielding slot

24A-24F．．．槽24A-24F. . . groove

28．．．冷卻劑導管28. . . Coolant conduit

30．．．空氣導管30. . . Air duct

36．．．密封件(第1圖)，螺絲(第4圖)36. . . Seal (Fig. 1), screw (Fig. 4)

38．．．墨料供應管(第1圖)，彈簧(第4圖)38. . . Ink supply tube (Fig. 1), spring (Fig. 4)

40．．．空氣開口40. . . Air opening

50．．．空氣吸取單元50. . . Air suction unit

第1圖係為根據本發明的實施例之一示範性列印頭及一屏蔽件的示意橫剖視圖；1 is a schematic cross-sectional view of an exemplary print head and a shield in accordance with an embodiment of the present invention;

第2圖為根據本發明的實施例之一具有多重列印頭及一屏蔽結構之示範性列印單元的示意圖；2 is a schematic diagram of an exemplary printing unit having multiple print heads and a shield structure in accordance with an embodiment of the present invention;

第3圖為根據本發明其他實施例之一示範性列印頭及一屏蔽件的示意圖；3 is a schematic view of an exemplary print head and a shield according to other embodiments of the present invention;

第4圖為根據本發明的替代性實施例之一示範性列印頭的示意圖。Figure 4 is a schematic illustration of an exemplary printhead in accordance with an alternative embodiment of the present invention.

10．．．列印裝置10. . . Printing device

12．．．列印頭12. . . Print head

14．．．熱量屏蔽件14. . . Thermal shield

14A．．．屏蔽板14A. . . Shield

14B．．．屏蔽框架14B. . . Shielding frame

20．．．噴嘴板20. . . Nozzle plate

24．．．屏蔽槽twenty four. . . Shielding slot

36．．．密封件36. . . Seals

38．．．墨料供應管38. . . Ink supply tube

Claims (14)

一種用於配送材料於經加熱基材上之列印裝置，該裝置包含：一列印頭，其具有一或多個噴嘴；及一熱量屏蔽件，其當列印時係部份地遮罩該列印頭中之面對該經加熱基材的一側，藉以降低從該基材至該列印頭之熱量轉移，其中一間隙係形成在該屏蔽件及該列印頭之間，該屏蔽件係包括一對準於該一或多個噴嘴之槽，以使材料能夠從該一或多個噴嘴通至該經加熱基材。 A printing device for dispensing material onto a heated substrate, the device comprising: a row of print heads having one or more nozzles; and a thermal shield that partially masks the print when printed a side of the printing head facing the heated substrate to reduce heat transfer from the substrate to the print head, wherein a gap is formed between the shield and the print head, the shield The workpiece includes a slot aligned with the one or more nozzles to enable material to pass from the one or more nozzles to the heated substrate. 如申請專利範圍第1項之裝置，其中該屏蔽件包含一導管，以傳導一液體冷卻劑。 The device of claim 1, wherein the shield comprises a conduit for conducting a liquid coolant. 如申請專利範圍第1項之裝置，其中該屏蔽件的一往外表面係對於熱紅外線輻射具反射性。 The device of claim 1, wherein an outwardly facing surface of the shield is reflective to thermal infrared radiation. 如申請專利範圍第1項之裝置，其中該屏蔽件包含一熱傳導材料。 The device of claim 1, wherein the shield comprises a thermally conductive material. 如申請專利範圍第1項之裝置，其中該屏蔽件包含鋁或銅。 The device of claim 1, wherein the shield comprises aluminum or copper. 如申請專利範圍第1項之裝置，其中該屏蔽件中之面對該列印頭的一往內表面係塗覆有一非濕潤塗覆物。 The device of claim 1, wherein an inner surface of the shield facing the print head is coated with a non-wetting coating. 如申請專利範圍第1項之裝置，包含一空氣導管而其被連接至該屏蔽件與該列印頭之間的該間隙，以誘發該屏蔽件與該列印頭之間的空氣運動。 The device of claim 1, comprising an air conduit connected to the gap between the shield and the printhead to induce air movement between the shield and the printhead. 如申請專利範圍第1項之裝置，進一步包含： 一空氣吸取單元，其耦合至該屏蔽件中之當列印時面對該經加熱基材的一側中之一空氣開口。 For example, the device of claim 1 of the patent scope further includes: An air suction unit coupled to one of the air openings in the shield facing one side of the heated substrate when printing. 一種用於沉積於經加熱基材上之非接觸沉積方法，該方法包含下列步驟：加熱一基材；及自一具有一或多個噴嘴的列印頭將材料沉積於該經加熱基材上，其中該列印頭係由一熱量屏蔽件所屏蔽，而該屏蔽件係部份遮罩該列印頭中之面對該經加熱基材的一側，使得一間隙係形成在該屏蔽件及該列印頭之間，藉以降低從該基材至該列印頭之熱量轉移，其中該屏蔽件包括一對準於該一或多個噴嘴之槽，以使該材料能夠從該一或多個噴嘴通至該經加熱基材。 A non-contact deposition method for depositing on a heated substrate, the method comprising the steps of: heating a substrate; and depositing material on the heated substrate from a printhead having one or more nozzles Wherein the print head is shielded by a heat shield, and the shield partially covers a side of the print head facing the heated substrate such that a gap is formed in the shield And between the printheads to reduce heat transfer from the substrate to the printhead, wherein the shield includes a slot aligned with the one or more nozzles to enable the material to be removed from the A plurality of nozzles are passed to the heated substrate. 如申請專利範圍第9項之方法，包含：使一液體冷卻劑流通經過該屏蔽件的一導管。 The method of claim 9, comprising: a conduit for passing a liquid coolant through the shield. 如申請專利範圍第9項之方法，其中該材料係為一電傳導性且該基材為一半導體晶圓。 The method of claim 9, wherein the material is electrically conductive and the substrate is a semiconductor wafer. 如申請專利範圍第9項之方法，包含：誘發該屏蔽件與該列印頭之間的該間隙中之一氣體流。 The method of claim 9, comprising: inducing a flow of gas in the gap between the shield and the printhead. 如申請專利範圍第9項之方法，包含：操作一空氣吸取裝置，以從該經加熱基材與該屏蔽件之間的一區域收集氣體煙氣。 The method of claim 9, comprising: operating an air suction device to collect gas fumes from a region between the heated substrate and the shield. 如申請專利範圍第11項之方法，其中加熱該基材之步驟係包含：加熱該基材至100℃到300℃的一溫度。 The method of claim 11, wherein the step of heating the substrate comprises: heating the substrate to a temperature of from 100 ° C to 300 ° C.
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