TWI525741B - The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the - Google Patents
The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the Download PDFInfo
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本發明係與半導體檢測產業有關，特別是有關於一種包含有一環圈、一撐張於該環圈中之薄膜以及一附著於該薄膜上之晶圓的晶圓載環總成的角度定位方法以及用以實施前述方法之機構。 The present invention relates to the semiconductor testing industry, and more particularly to an angular positioning method for a wafer carrier assembly including a ring, a film stretched in the ring, and a wafer attached to the film. A mechanism for implementing the aforementioned method.
在現行的半導體的檢測作業中，有一種情況係針對一晶圓載環總成上的晶粒進行檢測，前述晶圓載環總成通常包含有一諸如擴張環(expender ring)之類的環圈、一諸如藍膜(blue tape)之類且周緣固定於該環圈以致本身撐張於該環圈中的可透光薄膜、一附著固定在該薄膜上且具有多數個晶粒的晶圓，以及一記載特定資料且黏貼在該薄膜上的條碼標籤。前述晶圓載環總成在遞送至檢測機台進行檢測之前，通常會進行後述之先前步驟：其一是進行條碼的讀取作業，以獲得待檢測晶圓的相關資料，其次係針對晶圓載環總成進行預先定位，使每一個晶圓載環總成可以以其對位基準大致上都朝向一特定方向之方式，被遞送至檢測機台中，以減少檢測機台進行點測作業時所需的精確對位時間，或減少檢測機台之精密對位行程設計。 In the current semiconductor inspection operation, there is a case where the die on a wafer carrier assembly is detected. The wafer carrier assembly usually includes a ring such as an expander ring. a light transmissive film such as a blue tape and having a periphery fixed to the ring so as to be stretched in the ring, a wafer attached to the film and having a plurality of crystal grains, and a wafer A bar code label that records specific information and is attached to the film. Before the wafer carrier assembly is delivered to the inspection machine for testing, the following steps are usually performed: one is to perform barcode reading operation to obtain related data of the wafer to be inspected, and the second is for the wafer carrier ring. The assembly is pre-positioned so that each wafer carrier assembly can be delivered to the inspection machine in such a manner that its alignment reference is generally oriented in a particular direction to reduce the need for the inspection machine to perform the point measurement operation. Precise alignment time, or reduce the precision alignment stroke design of the inspection machine.
傳統上，條碼讀取作業的一般的作法，係利用一取放裝置(pick-and-place device)將晶圓載環總成從儲放的卡匣中取出並遞送至一條碼機之下方，以進行條碼讀取作業，而後，再將晶圓載環總成遞送至檢測機台中進行檢測。此 等作法通常會遇到如後所述的限制：作業人員必須手動轉動該晶圓載環總成，使晶圓載環總成儲放於該卡匣中時，其條碼標籤可以固定朝向某個方位角度，以致該晶圓載環總成被取放裝置取出時，總是可以將條碼標籤適當地放置在條碼機下方之條碼讀取位置。然而，若晶圓載環總成存放在卡匣中之角度略有偏差，則取放裝置將晶圓載環總成遞送至條碼機下方時，條碼標籤與條碼機之條碼讀取位置將相對產生對位偏差，此對位偏差容易造成條碼讀取困難甚至無法讀取。其次，就算晶圓載環總成係以特定的方位角度置放在卡匣中，但儲放在卡匣中且通常呈圓形的環圈在卡匣稍有碰撞或振動時，晶圓載環總成的方位角度可能會產生偏差，進而造成前述後果。 Traditionally, the general practice of bar code reading operations is to use a pick-and-place device to take the wafer carrier assembly from the stored cassette and deliver it underneath a code machine. A bar code reading operation is performed, and then the wafer carrier assembly is delivered to the inspection machine for detection. this The method usually encounters a limitation as described later: the worker must manually rotate the wafer carrier assembly so that when the wafer carrier assembly is stored in the cassette, the barcode label can be fixed toward an azimuth angle. When the wafer carrier assembly is removed by the pick and place device, the bar code label can always be properly placed in the bar code reading position below the bar code machine. However, if the angle of the wafer carrier assembly stored in the cassette is slightly different, when the pick-and-place device delivers the wafer carrier assembly to the underside of the barcode machine, the barcode reading position of the barcode label and the barcode machine will be relatively opposite. Bit deviation, which is easy to cause bar code reading difficult or even impossible to read. Secondly, even if the wafer carrier assembly is placed in the cassette at a specific azimuth angle, the ring that is stored in the cassette and is usually circular is slightly collided or vibrated when the cassette is slightly collided or vibrated. The resulting azimuth angle may be biased, which in turn causes the aforementioned consequences.
為解決上述問題，現行作法係將條碼機架設在一旋轉平台上方的特定位置處，並將晶圓載環總成遞送至該旋轉平台上，而後，利用設置在該旋轉平台上之吸盤將晶圓載環總成吸附固定在該旋轉平台上，藉此，該旋轉平台即可帶動該晶圓載環總成繞其中心自轉，而使條碼標籤可旋轉地通過一形成在該薄膜上的條碼讀取位置而被讀取。而在完成條碼讀取作業之後，該晶圓載環總成將以特定的方位角度被遞送至檢測機台中。此種作法雖可解決上述傳統方法必須將晶圓載環總成以特定方位角度置放於卡匣中的不便，但此種作法通常有可靠度不佳或作業速度較慢之問題，因為若旋轉速度過快，條碼機會有讀取不到的問題，因此，為確保條碼的讀取，該旋轉平台帶動該晶圓載環總 成旋轉的速度必須有一定的限制，故而拉長了整個作業時間。 In order to solve the above problem, the current practice is to set the bar code rack at a specific position above the rotating platform, and deliver the wafer carrier assembly to the rotating platform, and then use the suction cup disposed on the rotating platform to carry the wafer. The ring assembly is adsorbed and fixed on the rotating platform, whereby the rotating platform can drive the wafer carrier assembly to rotate around its center, and the barcode label is rotatably passed through a bar reading position formed on the film. And was read. After the barcode reading operation is completed, the wafer carrier assembly will be delivered to the inspection machine at a particular azimuth angle. Although this method can solve the inconvenience that the above-mentioned conventional method must place the wafer carrier ring assembly in the cassette at a specific azimuth angle, this method usually has the problem of poor reliability or slow operation speed, because if it is rotated The speed is too fast, the barcode opportunity has problems that cannot be read. Therefore, in order to ensure the reading of the barcode, the rotating platform drives the total of the wafer carrier ring. The speed of rotation must be limited, thus lengthening the entire working time.
此外，現行有一種作法係將該晶圓載環總成直接遞送至檢測機台中，利用諸如電荷耦合元件(charge coupled device,CCD)此類的影像擷取裝置辨識待測晶粒的圖像，據此進行晶圓角度校正後，再利用工作平台旋轉該晶圓載環總成，使條碼標籤可位移至一固定位置進行條碼讀取，而後即可就地進行檢測作業。此種方式可以免除事先進行條碼讀取及晶圓載環總成預定位之步驟，然而，此種方式將使得需具備精密定位功能之工作平台，同時必須具備360度旋轉的功能，以致機台設計及建置成本相對較高，而且，若待檢測之晶粒係呈對稱型圖像時，影像辨識容易失敗或耗時。 In addition, there is a current method for directly delivering the wafer carrier assembly to the inspection machine, and using an image capturing device such as a charge coupled device (CCD) to identify an image of the die to be tested. After the wafer angle correction is performed, the wafer carrier assembly is rotated by the working platform, so that the barcode label can be displaced to a fixed position for barcode reading, and then the inspection operation can be performed in situ. This method can eliminate the steps of pre-bar code reading and wafer carrier assembly pre-positioning. However, this method will require a working platform with precise positioning function, and must have 360-degree rotation function, so that the machine design And the construction cost is relatively high, and if the crystal to be detected is a symmetrical image, image recognition is easy to fail or time consuming.
有鑑於此，本發明之目的之一在於提供一種晶圓載環總成之角度定位方法，可快速且容易地完成該晶圓載環總成之定位，以利後續檢測作業進行，且可避免上述習用技術之缺失者。 In view of the above, one of the objects of the present invention is to provide an angle positioning method for a wafer carrier ring assembly, which can quickly and easily complete the positioning of the wafer carrier ring assembly, so as to facilitate subsequent inspection operations and avoid the above-mentioned conventional use. The missing of technology.
為達成上述目的，本發明所提供之一種晶圓載環總成之角度定位方法，係用以將一包含有一環圈、一撐張於該環圈中之可透光薄膜以及一附著於該可透光薄膜上之晶圓的晶圓載環總成旋轉至一特定的角度方位，該角度定位方法包含有下列步驟：a)在該可透光薄膜上設置一非透明之定位標籤；b)使該晶圓載環總成繞一旋轉中心旋轉，用以 使該定位標籤可旋轉地通過一光感測器的感測位置；以及c)在該光感測器偵知該定位標籤通過該光感測器之感測位置之後，使該晶圓載環總成再旋轉一預定角度α後停止，俾使該定位標籤到達一離開該光感測器之感測位置的目標位置。 In order to achieve the above object, an angle positioning method for a wafer carrier assembly is provided for attaching a ring, a light transmissive film extending in the ring, and attaching to the The wafer carrier assembly of the wafer on the light transmissive film is rotated to a specific angular orientation. The angular positioning method comprises the steps of: a) providing a non-transparent positioning label on the light transmissive film; b) The wafer carrier assembly is rotated about a center of rotation for Having the positioning tag rotatably pass the sensing position of a light sensor; and c) after the light sensor detects the positioning position of the positioning tag through the light sensor, the wafer carrier is always After being rotated by a predetermined angle α, the positioning is stopped, so that the positioning tag reaches a target position away from the sensing position of the photo sensor.
由於定位標籤設置在可透光薄膜上時，即可得知該定位標籤與該晶圓之一對位基準(例如晶圓之缺口(notch)或平切邊(flat cut))的位置關係，而該光感測器之感測位置係屬於該光感測器設定時便可得知之參數，因此，只要一得知該光感測器偵測到該定位標籤，即表示該定位標籤已經隨著該晶圓載環總成旋轉到該光感測器之感測位置，之後，再使該晶圓載環總成旋轉一預先設定之角度α後停止，即可而確保該定位標籤係停定在該目標位置處，換言之，即可確保該晶圓之對位基準係朝向一特定的方位，而完成該晶圓載環總成之角度定位，以利進行後續的點測或其他作業。 Since the positioning label is disposed on the light transmissive film, the positional relationship between the positioning label and one of the wafer alignment standards (for example, a notch or a flat cut of the wafer) is known. The sensing position of the photo sensor is a parameter that can be known when the photo sensor is set. Therefore, once the photo sensor detects the positioning tag, it indicates that the positioning tag has been The wafer carrier assembly is rotated to the sensing position of the photo sensor, and then the wafer carrier assembly is rotated by a predetermined angle α to stop, thereby ensuring that the positioning tag is stopped at At the target location, in other words, it is ensured that the alignment reference of the wafer is oriented toward a specific orientation, and the angular positioning of the wafer carrier assembly is completed to facilitate subsequent spotting or other operations.
如前所述，本發明所提供之角度定位方法係藉助光感測器來偵測定位標籤而完成定位，由於該光感測器係藉由所發出之感測光線的遮蔽與否來偵測該定位標籤，因此，縱使該晶圓載環總成係快速地旋轉，該光感測器仍可正確地偵測到該定位標籤是否通過其感測位置，故本發明所提供之角度定位方法與習用技術比較起來具有定位快速且準確之優點，而且整個角度定位方法可謂十分簡單，相當容易施行。其次，只要在現有的定位設備中加上一光感測器 來檢知定位標籤，並配合系統控制，即可將本發明所提供之角度定位方法付諸實現，因此，本發明所提供之角度定位方法適用性十足，相當具有經濟價值。 As described above, the angle positioning method provided by the present invention detects the positioning tag by using the light sensor to complete the positioning, because the light sensor detects by detecting whether the light is blocked or not. The positioning tag, therefore, even if the wafer carrier assembly rotates rapidly, the photo sensor can correctly detect whether the positioning tag passes the sensing position thereof, so the angle positioning method provided by the present invention Compared with the conventional technology, the conventional technology has the advantages of quick and accurate positioning, and the entire angular positioning method is very simple and relatively easy to implement. Second, just add a light sensor to the existing positioning device. The angle positioning method provided by the present invention can be implemented by detecting the positioning label and matching with the system control. Therefore, the angle positioning method provided by the present invention is highly applicable and has considerable economic value.
在上述步驟c)中，係在該定位標籤從一靜止位置旋轉到被該光感測器偵知時，計算出該定位標籤之旋轉角度θ，之後使該晶圓載環總成再旋轉該預定角度α後停止，如此，該定位標籤到達該目標位置時，該目標位置相對該定位標籤之靜止位置之角度，將等於前述旋轉角度θ加上該預定角度α。 In the above step c), when the positioning tag is rotated from a rest position to being detected by the photo sensor, the rotation angle θ of the positioning tag is calculated, and then the wafer carrier ring assembly is rotated again. After the angle α is stopped, when the positioning tag reaches the target position, the angle of the target position relative to the rest position of the positioning tag will be equal to the aforementioned rotation angle θ plus the predetermined angle α.
最好，係以該定位標籤從該靜止位置旋轉到該定位標籤之一前緣、一後緣或者一中心位置通過該光感測器之感測位置時之旋轉角度θ1、θ2或者θ3，來作為該旋轉角度θ。其中該旋轉角度θ3係以後述方式求得：i)利用前述旋轉角度θ1與θ2計算而得，亦即，該旋轉角度θ3=(θ1+θ2)/2；或者ii)利用該定位標籤從該靜止位置旋轉到該定位標籤之一側邊的一第一位置與一第二位置被該光感測器偵知時之旋轉角度θ4與θ5計算而得，亦即，該旋轉角度θ3=(θ4+θ5)/2；或者iii)利用前述旋轉角度θ1、θ4、θ5以及θ2計算而得，亦即，該旋轉角度θ3=(θ1+θ2+θ4+θ5)/4。 Preferably, the rotation angle θ 1 , θ 2 or θ when the positioning label is rotated from the rest position to a leading edge, a trailing edge or a center position of the positioning tag through the sensing position of the photo sensor 3 , as the rotation angle θ. The rotation angle θ 3 is obtained by the following method: i) calculated by using the aforementioned rotation angles θ 1 and θ 2 , that is, the rotation angle θ 3 = (θ 1 + θ 2 )/2; or ii) Calculating, by the rotation position θ 4 and θ 5 when the positioning position is rotated from the rest position to a first position of a side of the positioning tag and a second position is detected by the photo sensor, that is, The rotation angle θ 3 = (θ 4 + θ 5 )/2; or iii) is calculated by using the aforementioned rotation angles θ 1 , θ 4 , θ 5 , and θ 2 , that is, the rotation angle θ 3 = (θ 1 + θ 2 + θ 4 + θ 5 ) / 4.
最好，係以前述旋轉角度θ3來作為旋轉角度θ，藉以獲得較為精確的定位結果。 Preferably, the aforementioned rotation angle θ 3 is used as the rotation angle θ to obtain a more accurate positioning result.
至於前述定位標籤，可以是獨立於一晶圓條碼標籤之外的一個貼附在該可透光薄膜上的定位標籤。然而，以利用一般晶圓載環總成上既有的條碼標籤來作為本案所述之 定位標籤為最佳方案，如此，不需額外再設置一個單獨的定位標籤。換言之，而在前述條件下，該定位標籤除了具有非透明的特徵之外，其上更具有條碼；然而，本發明所述之定位標籤並不以具有條碼為限。 As for the aforementioned positioning label, it may be a positioning label attached to the light transmissive film independently of a wafer barcode label. However, the existing bar code label on the general wafer carrier assembly is used as the case described in the present case. Positioning the label is the best solution, so there is no need to set a separate positioning label. In other words, under the foregoing conditions, the positioning tag has a bar code thereon in addition to the non-transparent feature; however, the positioning tag of the present invention is not limited to having a bar code.
在利用既有的條碼標籤作為定位標籤的情形下，本發明所提供之晶圓載環總成之角度定位方法可與讀取條碼的程序整合，使得該晶圓載環總成在進行定位時可一併進行條碼讀取之動作。為達前述目的，可將一條碼讀取機之讀取位置設置在該目標位置上，亦即，在步驟c)中，當該定位標籤到達該目標位置時，具有條碼之定位標籤係剛好座落在一條碼讀取機之讀取位置上，以利條碼讀取作業之進行。 In the case of using the existing barcode label as the positioning label, the angle positioning method of the wafer carrier assembly provided by the present invention can be integrated with the program for reading the barcode, so that the wafer carrier assembly can be positioned during positioning. And the bar code reading action. For the above purpose, the reading position of a code reader can be set at the target position, that is, in step c), when the positioning tag reaches the target position, the positioning tag with the bar code is just seated. It falls on the reading position of a code reader to facilitate the bar code reading operation.
最好，在步驟b)中，該晶圓載環總成係被固定於一旋轉台上，藉此，該旋轉台可以帶動該晶圓載環總成繞該旋轉中心旋轉。 Preferably, in step b), the wafer carrier assembly is fixed to a rotating table, whereby the rotating table can drive the wafer carrier assembly to rotate about the center of rotation.
最好，在步驟b)中，該晶圓載環總成係沿一遞送路徑被遞送至該旋轉台上，且在步驟c)中，當該定位標籤到達該目標位置時，該定位標籤係座落在該遞送路徑上。 Preferably, in step b), the wafer carrier assembly is delivered to the rotary table along a delivery path, and in step c), when the positioning tag reaches the target position, the positioning tag base Fall on the delivery path.
在本發明所提供之一實施例中，在步驟c)之後，更包含有一個將該晶圓載環總成沿著該遞送路徑移出該旋轉平台之步驟。 In an embodiment provided by the present invention, after step c), there is further included a step of moving the wafer carrier assembly along the delivery path out of the rotating platform.
最好，該光感測器係位於該旋轉台之外部且相對於該旋轉台之下方，使該光感測器所發出之感測光線，係自該晶圓載環總成之可透光薄膜的一底面往該可透光薄膜的一 頂面穿過該可透光薄膜，而於該可透光薄膜上建立出該光感測器之感測位置。 Preferably, the light sensor is located outside the rotating table and opposite to the rotating table, so that the sensing light emitted by the light sensor is from the light transmissive film of the wafer carrier assembly. a bottom surface of the light transmissive film The top surface passes through the light transmissive film, and the sensing position of the photo sensor is established on the light transmissive film.
本發明之又一目的在於提供一種用以實施前述角度定位方法之機構，該機構主要包含有：一旋轉台以及一光感測器。該旋轉台係用以承置該晶圓載環總成，並受一馬達之驅動而帶動該晶圓載環總成旋轉。該光感測器係位於該旋轉台之外部，用以於該晶圓載環總成之可透光薄膜上建立出該感測位置。 Another object of the present invention is to provide a mechanism for implementing the foregoing angular positioning method, the mechanism mainly comprising: a rotating table and a light sensor. The rotating table is configured to receive the wafer carrier assembly and is driven by a motor to drive the wafer carrier assembly to rotate. The photo sensor is located outside the rotating table to establish the sensing position on the light transmissive film of the wafer carrier assembly.
最好，所述機構更包含有一條碼讀取機，該條碼讀取機位於該旋轉台之外部，用以於該晶圓載環總成之可透光薄膜上建立一條碼讀取位置。 Preferably, the mechanism further comprises a code reader, the bar code reader being located outside the rotating table for establishing a code reading position on the light transmissive film of the wafer carrier assembly.
最好，該光感測器之位置係低於該旋轉台，而該條碼讀取機之位置係高於該旋轉台。亦即，該光感測器與該條碼讀取機最好分別位於該旋轉台之下方與上方，使該機構具有較佳之元件空間配置。 Preferably, the position of the light sensor is lower than the rotary table, and the position of the barcode reader is higher than the rotary table. That is, the photo sensor and the bar code reader are preferably located below and above the rotating table, respectively, so that the mechanism has a better component space configuration.
有關本發明所提供之晶圓載環總成之角度定位方法以及實施前述方法之機構的詳細內容及特點，將於後續的實施方式詳細說明中予以描述。然而，在技術領域中具有通常知識者應能瞭解，該等詳細說明以及實施本發明所列舉的特定實施例，僅係用於說明本發明，並非用以限制本發明之專利申請範圍。 The details and features of the method for positioning the wafer carrier ring assembly provided by the present invention and the mechanism for implementing the foregoing method will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited to the scope of the invention.
首先，必須說明的是，在以下所揭露之實施例以及隨附之圖式中，相同之標號代表相同或類似的元件。 In the following, the same reference numerals are used to refer to the same or similar elements in the embodiments and the accompanying drawings.
請參閱第一圖。第一圖顯示有一適用於本發明一較佳實施例所提供之晶圓載環總成之角度定位方法的晶圓載環總成10，該晶圓載環總成10係由一呈圓形的塑膠製環圈12、一諸如藍膜(blue tape)之類的可透光薄膜14、一貼附於該可透光薄膜14上且經過切割(dicing)的晶圓16，以及一貼附於該可透光薄膜14上之非透明之定位標籤18所構成。其中，該可透光薄膜14之周緣係固定於該環圈12上且本身係以一定之張力被撐張於該環圈12中心。其次，該晶圓16具有一可作為對位基準之平切邊(flat cut)16a，當然，該晶圓16亦可為具有一缺口(notch)之晶圓。 Please refer to the first figure. The first figure shows a wafer carrier assembly 10 for an angular positioning method of a wafer carrier assembly according to a preferred embodiment of the present invention. The wafer carrier assembly 10 is made of a round plastic. a ring 12, a light transmissive film 14 such as a blue tape, a dicing wafer 16 attached to the light transmissive film 14, and a sticker attached thereto The non-transparent positioning tag 18 on the light transmissive film 14 is formed. The periphery of the light transmissive film 14 is fixed to the ring 12 and is stretched at the center of the ring 12 with a certain tension. Next, the wafer 16 has a flat cut 16a that can serve as a reference for the alignment. Of course, the wafer 16 can also be a wafer having a notch.
在本實施例中，前述環圈12係為塑膠製成且外形呈圓形，然而該環圈12之材質與外形並不以此為限，例如，金屬製之方形環圈或八角形環圈皆可適用。其次，在本實施例中，係以記錄有該晶圓16之特定資料的條碼標籤，來作為該定位標籤18，然而，該定位標籤18可以以一單獨設置的非透明標籤來實現，並不以使用前述條碼標籤為限。此外，該定位標籤18貼附於該薄膜14上之位置，與該晶圓16具有一特定的關係。如第一圖所示，該定位標籤18係以實質上對正該平切邊之中心且平行該平切邊之方式設置於該可透光薄膜14上。然而，該定位標籤18與前述晶圓16之位置關係並不以此為限，例如，該定位標籤可以以實質上垂直於該平切邊之延伸線的方式設置於該可透光薄膜上，或者，如第二圖所示，以該定位標籤之中心位置的延伸線與該平切邊16a之中心位置之延伸線呈九十度相交 之方式設置。如此一來，該定位標籤18隨著該晶圓載環總成10旋轉至一特定位置時，該晶圓16之平切邊16a將朝向特定之方位，進而完成該晶圓載環總成10之角度定位。 In this embodiment, the ring 12 is made of plastic and has a circular shape. However, the material and shape of the ring 12 are not limited thereto, for example, a metal ring or an octagonal ring. Can be applied. Secondly, in the embodiment, the barcode label recorded with the specific material of the wafer 16 is used as the positioning label 18. However, the positioning label 18 can be implemented by a separately arranged non-transparent label, and To the extent that the aforementioned barcode label is used. In addition, the positioning tag 18 is attached to the film 14 in a specific relationship with the wafer 16. As shown in the first figure, the positioning label 18 is disposed on the light transmissive film 14 in such a manner as to substantially align the center of the flat cut edge and parallel the flat cut edge. However, the positional relationship between the positioning tag 18 and the wafer 16 is not limited thereto. For example, the positioning tag may be disposed on the light transmissive film in a manner substantially perpendicular to an extension line of the flat cutting edge. Or, as shown in the second figure, the extension line of the center position of the positioning label intersects the extension line of the center position of the flat cutting edge 16a at ninety degrees. The way it is set. As a result, when the positioning tag 18 is rotated to a specific position, the flat edge 16a of the wafer 16 will be oriented toward a specific orientation, thereby completing the angle of the wafer carrier assembly 10. Positioning.
為達上述目的，本發明一較佳實施例所提供之晶圓載環總成之角度定位方法，主要包含有以下步驟：a)在該可透光薄膜上提供一非透明之定位標籤；b)使該晶圓載環總成繞一旋轉中心旋轉，並使該定位標籤可旋轉地通過一光感測器的感測位置；以及c)在該光感測器偵知該定位標籤通過該光感測器之感測位置之後，使該晶圓載環總成再旋轉一預定角度α後停止，俾使該定位標籤到達一離開該光感測器之感測位置的目標位置。以下將配合第三圖至第七圖，詳加說明前述步驟。 In order to achieve the above object, a method for angularly positioning a wafer carrier assembly according to a preferred embodiment of the present invention includes the following steps: a) providing a non-transparent positioning label on the light transmissive film; b) Rotating the wafer carrier assembly about a center of rotation and rotatably passing the positioning tag through a sensing position of a light sensor; and c) detecting, by the light sensor, the positioning tag through the light sensation After the sensing position of the detector, the wafer carrier assembly is further rotated by a predetermined angle α to stop, so that the positioning tag reaches a target position away from the sensing position of the photo sensor. The foregoing steps will be described in detail in conjunction with the third to seventh figures.
如前所述，可以利用一般晶圓載環總成既有之條碼標籤來作為步驟a)中之定位標籤18。貼附好定位標籤18之晶圓載環總成10係被置入一卡匣(圖中未示)中，以便被遞送至所需之位置。 As previously mentioned, the existing bar code label of the conventional wafer carrier assembly can be utilized as the positioning tag 18 in step a). The wafer carrier assembly 10 to which the positioning tag 18 is attached is placed in a cassette (not shown) for delivery to the desired location.
在步驟b)中，該晶圓載環總成10係被一取放裝置(圖中未示)從卡匣中取出，而後沿著一直線路徑P(如第六圖A所示)被遞送至一角度定位機構20之旋轉台22上，之後，該晶圓載環總成10將被吸附固定於該旋轉台22之頂面，如此，該旋轉台22將可帶動該晶圓載環總成10繞其一旋轉中心C旋轉(如第六圖C所示)。以下將進一步詳細說明該角度定位機構20之結構。 In step b), the wafer carrier assembly 10 is taken out of the cassette by a pick-and-place device (not shown) and then delivered to the line along a straight path P (as shown in Figure 6A). On the rotating table 22 of the angular positioning mechanism 20, afterwards, the wafer carrier assembly 10 will be adsorbed and fixed on the top surface of the rotating table 22, so that the rotating table 22 will drive the wafer carrier assembly 10 around it. A center of rotation C rotates (as shown in Figure 6C). The structure of the angular positioning mechanism 20 will be described in further detail below.
請先參閱第三圖，第三圖係為該角度定位機構20的立 體圖。該角度定位機構20主要包含有一底板24、一架設於該底板24上且具有前述旋轉台22之升降旋轉單元26，以及一藉由支架而可調整其位置地設置於該底板24上方之光感測器28(請參閱第四圖)。 Please refer to the third figure first, and the third figure is the stand of the angle positioning mechanism 20. Body map. The angle positioning mechanism 20 mainly includes a bottom plate 24, a lifting and rotating unit 26 mounted on the bottom plate 24 and having the rotating table 22, and a light sensation disposed on the bottom plate 24 by adjusting the position of the bracket 24 Detector 28 (see the fourth figure).
如第四圖所示，該底板24之上方藉由支架架設有一第一導引件30、一與該第一導引件30平行且間隔相對之第二導引件31，以及一位於該第一與第二導引件30、31之間且偏移該第一與第二導引件30、31之側邊一預定距離的第三導引件32，藉此，該晶圓載環總成10被遞送至該角度定位機構20中時，可受各該導引件30~32之導引並停定於各該導引件30~32上，而位於該旋轉台22之正上方(如第六圖B所示)。此外，該底板24上垂直固定有若干導桿34。 As shown in the fourth figure, a first guiding member 30, a second guiding member 31 parallel to the first guiding member 30 and spaced apart from each other, and a second guiding member 31 are disposed on the bottom of the bottom plate 24. a third guiding member 32 between the second guiding member 30, 31 and offset from a side of the first and second guiding members 30, 31 by a predetermined distance, whereby the wafer carrier assembly When being delivered to the angle positioning mechanism 20, the guide member 30-32 can be guided by each of the guide members 30-32 and positioned on the guide members 30-32, and located directly above the rotary table 22 (eg, Figure 6B)). In addition, a plurality of guide rods 34 are vertically fixed to the bottom plate 24.
請參閱第五圖，第五圖係為該升降旋轉單元26之立體圖。該升降旋轉單元26主要具有一固定於該底板24上之氣壓缸40、一藉由若干線性襯套42而可滑移地套設於該等導桿34上並與該氣壓缸40之作動桿固接之升降平台44、可轉動地設置於該升降平台44上之前述旋轉台22，以及一透過一皮帶46而可驅動該旋轉台22旋轉之馬達48。其中該旋轉台22之頂面係為一真空吸盤22a。如此一來，藉由該氣壓缸40之作動，可以將該升降平台44頂升，過程中，該真空吸盤22a將接觸該晶圓載環總成10的底面並進一步吸附住該晶圓載環總成10，如此，該晶圓載環總成10將可被頂離各該導引件30~32(如第六圖C所示)， 而且，由於此時該晶圓載環總成10係被吸附固定於該旋轉台22上，因此，該馬達48可透過該皮帶46以及該旋轉台22而驅動該晶圓載環總成10繞其中心(亦即旋轉中心C)旋轉(如第六圖C至第六圖D所示)。 Please refer to the fifth figure, which is a perspective view of the lifting and rotating unit 26. The lifting and rotating unit 26 mainly has a pneumatic cylinder 40 fixed to the bottom plate 24, and a sliding sleeve sleeved on the guiding rod 34 by a plurality of linear bushes 42 and acting as a moving rod of the pneumatic cylinder 40. The fixed lifting platform 44, the rotating table 22 rotatably disposed on the lifting platform 44, and a motor 48 that can drive the rotating table 22 to rotate through a belt 46. The top surface of the rotating table 22 is a vacuum chuck 22a. In this way, the lifting platform 44 can be lifted by the action of the pneumatic cylinder 40. During the process, the vacuum chuck 22a will contact the bottom surface of the wafer carrier assembly 10 and further adsorb the wafer carrier assembly. 10, as such, the wafer carrier assembly 10 will be able to be lifted away from each of the guide members 30-32 (as shown in Figure 6C). Moreover, since the wafer carrier assembly 10 is adsorbed and fixed on the rotating table 22, the motor 48 can drive the wafer carrier assembly 10 around the center thereof through the belt 46 and the rotating table 22. (ie, the center of rotation C) is rotated (as shown in FIG. 6C to FIG. 6D).
而該光感測器28，係可利用(但不限於)一反射型光電開關來實現。如第三及四圖所示，該光感測器28之設置位置，係位於該旋轉台22之外部，且相對於該旋轉台22之下方，使該光感測器28所發出之感測光線，可自該晶圓載環總成10之可透光薄膜14的底面方向，往該可透光薄膜14的頂面方向，穿過該可透光薄膜14，而在該可透光透過薄膜14上建立出一定置之感測位置S(如第六圖C所示)，而且，該感測位置S係剛好座落該定位標籤18之旋轉位移路徑上(如第六圖D所示)。必須說明的是，該光感測器28之位置亦可設置於該旋轉台28之上方或其他適當位置，只要該光感測器28之所發出之感測光線可通過該定位標籤18之旋轉位移路徑即可。 The photo sensor 28 can be implemented by, but not limited to, a reflective photoelectric switch. As shown in the third and fourth figures, the position of the photo sensor 28 is located outside the rotating table 22, and the sensing light emitted by the photo sensor 28 is emitted below the rotating table 22. a line from the bottom surface of the light transmissive film 14 of the wafer carrier assembly 10 to the top surface of the light transmissive film 14 through the light transmissive film 14 and the light transmissive film A certain sensing position S is established on the 14 (as shown in FIG. 6C), and the sensing position S is just located on the rotational displacement path of the positioning tag 18 (as shown in FIG. 6D). . It should be noted that the position of the photo sensor 28 can also be disposed above the rotating table 28 or other suitable position, as long as the sensing light emitted by the photo sensor 28 can be rotated by the positioning tag 18 The displacement path is sufficient.
以下將藉助第六圖C至D以及第七圖，進一步詳細說明本發明之步驟c)。 Step c) of the present invention will be further described in detail below with reference to Figures 6 to D and seventh.
如第六圖C所示，當該晶圓載環總成10處於尚未旋轉之靜止狀態時，由於該光感測器28所發出的感測光線係可穿過該可透光薄膜14而未被遮蔽，此時該光感測器28係處於一斷開(open)之不導通狀態(所送出之電訊號為OFF)。當該晶圓載環總成10開始轉動，且該定位標籤18到達該光感測器28之感測位置S而遮蔽並反射該光感測器 28之感測光線時，將觸發該光感測器28由斷開狀態切換到閉合(close)之導通狀態，此時，該光感測器28將送出ON之電訊號至一控制器(圖中未示)，該控制器接到此訊號之後將控制該馬達48，使該馬達48驅動該晶圓載環總成10再旋轉一預先設定之角度α(例如九十度)之後，停止該晶圓載環總成10，如此一來，該晶圓載環總成10之定位標籤18將停定於一離開該光感測器28之感測位置S的目標位置T(如第六圖F所示)。換言之，在步驟c)中，在該定位標籤18從如第六圖C所示之一靜止位置開始旋轉到被該光感測器28偵知時，假設該定位標籤18在此期間之旋轉角度為θ，則該定位標籤18停定於該目標位置T時，該定位標籤18相對於其初始停止位置，係轉動了該旋轉角度θ加上該預定角度α。 As shown in FIG. 6C, when the wafer carrier assembly 10 is in a stationary state that has not been rotated, the sensed light emitted by the light sensor 28 can pass through the light transmissive film 14 without being Masking, at this time, the photo sensor 28 is in an open non-conducting state (the transmitted electrical signal is OFF). When the wafer carrier assembly 10 begins to rotate, and the positioning tag 18 reaches the sensing position S of the photo sensor 28, the photo sensor is shielded and reflected. When the light is sensed by 28, the light sensor 28 is triggered to be turned from the off state to the closed state. At this time, the photo sensor 28 will send the ON signal to a controller (Fig. The controller will control the motor 48 after receiving the signal, and after the motor 48 drives the wafer carrier assembly 10 to rotate a predetermined angle α (for example, ninety degrees), the crystal is stopped. The circular carrier ring assembly 10, such that the positioning tag 18 of the wafer carrier assembly 10 will be stopped at a target position T away from the sensing position S of the photo sensor 28 (as shown in FIG. 6F) ). In other words, in step c), when the positioning tag 18 is rotated from a rest position as shown in FIG. 6C to being detected by the photo sensor 28, the rotation angle of the positioning tag 18 during this period is assumed. When it is θ, when the positioning tag 18 is stopped at the target position T, the positioning tag 18 is rotated relative to its initial stop position by the rotation angle θ plus the predetermined angle α.
請參閱第七圖，實際作業時，可以以該定位標籤18從該靜止位置旋轉到其前緣18a通過該感測位置S而被該光感測器28偵知時(如第六圖D所示)之旋轉角度θ1，來作為上述旋轉角度θ；其中，當該光感測器28由常態下之OFF訊號輸出狀態切換到ON之狀態時(亦即第一次切換狀態時)，即代表該定位標籤18之前緣18a被該光感測器28偵知。或者，以該定位標籤18從該靜止位置旋轉到其後緣18b通過該感測位置S而被該光感測器28偵知時(如第六圖E所示)之旋轉角度θ2，來作為上述旋轉角度θ，此時，因該光感測器28之感測光線可再次穿過該可透光薄膜14而不被遮蔽，故該光感測器28將從閉合狀態切 換至斷開狀態而再次輸出OFF之電訊號至控制器；亦即，該光感測器28第二次切換狀態時，即代表該定位標籤18之後緣18b被該光感測器28所偵知。或者，最好以該定位標籤18之中心位置18c通過該感測位置S時之旋轉角度θ3，來作為該旋轉角度θ。由於前述旋轉角度θ1與θ2可以藉由該光感測器28之ON/OFF訊號切換，配合馬達48之編碼器(encoder)或其他旋轉角度感測方式而得知，因此，該旋轉角度θ3可以經由前述旋轉角度θ1與θ2計算得知，亦即，θ3=(θ1+θ2)/2，如此，可以確認該定位標籤18之中心位置18c，並使該中心位置18c停定於該目標位置T，而達到較為準確的對位效果。 Referring to the seventh figure, in actual operation, when the positioning tag 18 is rotated from the rest position to the leading edge 18a thereof, the photo sensor 28 is detected by the sensing position S (as shown in FIG. 6D). The rotation angle θ 1 is shown as the rotation angle θ; wherein when the photo sensor 28 is switched from the OFF signal output state in the normal state to the ON state (that is, when the state is switched for the first time), The front edge 18a representing the positioning tag 18 is detected by the light sensor 28. Alternatively, when the positioning tag 18 is rotated from the rest position to the rear edge 18b thereof by the sensing position S, the rotation angle θ 2 of the photo sensor 28 (as shown in FIG. 6E) is As the above-mentioned rotation angle θ, at this time, since the sensing light of the photo sensor 28 can pass through the light transmissive film 14 again without being shielded, the photo sensor 28 will be switched from the closed state to the disconnected state. In the state, the OFF signal is output to the controller again; that is, when the photo sensor 28 is switched for the second time, it means that the trailing edge 18b of the positioning tag 18 is detected by the photo sensor 28. Alternatively, it is preferable that the rotation angle θ 3 at which the center position 18c of the positioning tag 18 passes the sensing position S as the rotation angle θ. Since the rotation angles θ 1 and θ 2 can be switched by the ON/OFF signal of the photo sensor 28, the encoder or other rotation angle sensing method of the motor 48 is known, and therefore, the rotation angle is θ 3 can be calculated from the aforementioned rotation angles θ 1 and θ 2 , that is, θ 3 = (θ 1 + θ 2 )/2, so that the center position 18c of the positioning tag 18 can be confirmed and the center position can be confirmed. 18c is stopped at the target position T to achieve a more accurate alignment effect.
必須說明的是，在上述實施例中，係以該光感測器28第一次訊號切換(偵知該定位標籤18之前緣18a)以及第二次訊號切換(偵知該定位標籤18之後緣18b)時該定位標籤18之旋轉角度θ1與θ2，計算出該定位標籤18之中心位置18c通過該感測位置S時之旋轉角度θ3，來確認該定位標籤18之中心位置18c。然而，前述方法僅在於舉例說明一種確認該定位標籤18之中心位置18c的可行方法，並不以此方法為限。例如，以下將介紹其他種可確認該定位標籤18之中心位置18c之方法。 It should be noted that, in the above embodiment, the first sensor switching of the photo sensor 28 (detecting the leading edge 18a of the positioning tag 18) and the second signal switching (detecting the trailing edge of the positioning tag 18) 18b) The rotation angles θ 1 and θ 2 of the positioning tag 18 are calculated, and the center position 18c of the positioning tag 18 is confirmed by calculating the rotation angle θ 3 when the center position 18c of the positioning tag 18 passes the sensing position S. However, the foregoing method is merely illustrative of a possible method of confirming the center position 18c of the positioning tag 18, and is not limited to this method. For example, other methods of confirming the center position 18c of the positioning tag 18 will be described below.
請參閱第八圖，第八圖顯示有另一種較長型態之定位標籤18與該光感測器之感測位置S之間的相互關係。當所使用之定位標籤18具有較長之長度，或者定位標籤18設置在該可透光薄膜14上之位置偏移該感測位置S所座落之 圓形路徑一定距離時，該定位標籤18通過該感測位置S而造成該光感測器28訊號切換之次數將可能變為四次，而非僅有二次。詳而言之，如第八圖所示，該光感測器28第一次訊號切換時，係為該定位標籤18之前緣18a被該光感測器28偵知時，第二次訊號切換時，係為該定位標籤18之側邊的一第一位置18d被該光感測器28偵知時，第三次訊號切換時，係為該定位標籤18之側邊的一第二位置18e被該光感測器28偵知時，而第四次訊號切換時，係為該定位標籤18之後緣18b被該光感測器28偵知時。在此等情況下，該定位標籤18從靜止位置旋轉到其中心位置18c通過該光感測器28之感測位置S時之旋轉角度θ3，可以以下列方式計算： Referring to the eighth figure, the eighth figure shows the relationship between the positioning tag 18 of another longer type and the sensing position S of the photo sensor. When the positioning tag 18 used has a long length, or the position of the positioning tag 18 on the light transmissive film 14 is offset by a circular path of the sensing position S, the positioning tag 18 The number of times the photo sensor 28 signal is switched by the sensing position S may become four times instead of only two. In detail, as shown in the eighth figure, when the first sensor signal is switched, the light sensor 28 is detected by the light sensor 28 when the leading edge 18a of the positioning tag 18 is detected. When a first position 18d of the side of the positioning tag 18 is detected by the photo sensor 28, when the third signal is switched, it is a second position 18e of the side of the positioning tag 18. When the photo sensor 28 is detected, and the fourth signal is switched, the trailing edge 18b of the positioning tag 18 is detected by the photo sensor 28. In such a case, the rotation angle θ 3 of the positioning tag 18 rotated from the rest position to its center position 18c through the sensing position S of the light sensor 28 can be calculated in the following manner:
1.利用第一次及第四次訊號切換時，該定位標籤18之旋轉角度θ1與θ2計算而得。亦即，旋轉角度θ3=(θ1+θ2)/2。 1. Using the first and fourth signal switching, the rotation angles θ 1 and θ 2 of the positioning tag 18 are calculated. That is, the rotation angle θ 3 = (θ 1 + θ 2 )/2.
2.利用第二次及第三次訊號切換時，該定位標籤18之旋轉角度θ4與θ5計算而得。亦即，旋轉角度θ3=(θ4+θ5)/2。 2. When the second and third signal switching is performed, the rotation angles θ 4 and θ 5 of the positioning tag 18 are calculated. That is, the rotation angle θ 3 = (θ 4 + θ 5 )/2.
3.利用所有訊號切換時，該定位標籤18之旋轉角度θ1、θ4、θ5以及θ2計算而得。亦即，旋轉角度θ3=(θ1+θ2+θ4+θ5)/4。 3. When all signal switching is used, the rotation angles θ 1 , θ 4 , θ 5 , and θ 2 of the positioning tag 18 are calculated. That is, the rotation angle θ 3 = (θ 1 + θ 2 + θ 4 + θ 5 ) / 4.
藉由以上方式計算出旋轉角度θ3，即可確認該定位標籤18之中心位置18c，並使該中心位置18c停定於該目標位置T。藉此，不管每批次晶圓載環總成10所使用之定位 標籤18之長度是否一致以及定位標籤18所黏貼的位置是否有稍微偏差，都可以確保每個晶圓載環總成10可以得到準確的對位效果。 By calculating the rotation angle θ 3 in the above manner, the center position 18c of the positioning tag 18 can be confirmed, and the center position 18c can be stopped at the target position T. Thereby, regardless of whether the length of the positioning tag 18 used in each batch of the wafer carrier assembly 10 is consistent and whether the position of the positioning tag 18 is slightly offset, it can ensure that each wafer carrier assembly 10 can be accurately obtained. The effect of the alignment.
由以上陳述可知，不論各個晶圓載環總成10係以何種角度方位被遞送至該角度定位機構20中，各個晶圓載環總成10之定位標籤18將總是被旋轉並停止於該目標位置T，而確保各個晶圓載環總成10之晶圓16的對位基準總是可以朝向相同的一特定角度方位。 From the above statement, regardless of the angular orientation of the individual wafer carrier assemblies 10 being delivered to the angular positioning mechanism 20, the positioning tags 18 of the respective wafer carrier assembly 10 will always be rotated and stopped at the target. Position T, while ensuring that the alignment reference of wafer 16 of each wafer carrier assembly 10 can always be oriented toward the same particular angular orientation.
完成角度定位之後的晶圓載環總成10，將被取放裝置沿著原有之遞送路徑P移出該角度定位機構20。之後，該晶圓載環總成10將被遞送至檢測機中進行點測作業。 After the angular positioning is completed, the wafer carrier assembly 10 is moved out of the angular positioning mechanism 20 along the original delivery path P by the pick and place device. Thereafter, the wafer carrier assembly 10 will be delivered to the inspection machine for spot testing.
在上述之實施例中，係利用一般晶圓載環總成既有的條碼標籤來作為定位標籤18，利用此方式，可將讀取條碼的程序整合於本發明之晶圓載環總成之角度定位方法中，使得該晶圓載環總成10在進行定位之時，可一併進行條碼讀取之動作。為達成前述目的，如第三圖所示，可在該角度定位機構20中額外設置一條碼讀取機50。該條碼讀取機50係藉由支架而設置於該底板24上方，並位於該旋轉台22之外部且相對於該旋轉台22之上方，使得該條碼讀取機50可在該可透光薄膜14之頂面上建立一條碼讀取位置R(如第六圖C所示)。如第六圖C與第七圖所示，該讀取位置R最好係重疊於該目標位置T，使得在步驟c)中，當該定位標籤18到達該目標位置T時，該定位標籤18剛好座落在該條碼讀取機50之讀取位置R上，如此一來， 在該晶圓載環總成10完成角度定位之後，即可進行條碼讀取作業。等條碼讀取完成之後，即可將該晶圓載環總成10沿著該路徑P遞送出該角度定位機構20，以利後續作業進行。 In the above embodiments, the existing bar code label of the general wafer carrier assembly is used as the positioning tag 18, and in this way, the program for reading the bar code can be integrated into the angle of the wafer carrier assembly of the present invention. In the method, when the wafer carrier assembly 10 is positioned, the bar code reading operation can be performed together. To achieve the foregoing object, as shown in the third figure, a code reader 50 can be additionally provided in the angle positioning mechanism 20. The barcode reader 50 is disposed above the bottom plate 24 by a bracket, and is located outside the rotating table 22 and above the rotating table 22, so that the barcode reader 50 can be in the light transmissive film. A code reading position R is created on the top surface of 14 (as shown in Figure 6C). As shown in FIG. 6C and FIG. 7 , the reading position R preferably overlaps the target position T such that in step c), when the positioning tag 18 reaches the target position T, the positioning tag 18 Just sitting at the reading position R of the barcode reader 50, thus, After the wafer carrier assembly 10 completes the angular positioning, the barcode reading operation can be performed. After the bar code reading is completed, the wafer carrier assembly 10 can be delivered along the path P to the angular positioning mechanism 20 for subsequent operations.
藉由本發明所揭露之技術特徵，本發明可同時提供一種晶圓載環總成之條碼讀取方法，可以直接應用於如第一或二圖所示之現有規格之晶圓載環總成10上，以快速且準確地進行條碼讀取。前述條碼讀取方法包含有以下步驟： According to the technical features disclosed in the present invention, the present invention can simultaneously provide a barcode reading method for a wafer carrier ring assembly, which can be directly applied to the wafer carrier assembly 10 of the existing specification as shown in the first or second figure. Bar code reading is done quickly and accurately. The foregoing barcode reading method includes the following steps:
a)使該晶圓載環總成10繞一旋轉中心C旋轉，用以使該條碼標籤(以下同樣使用標號18)可旋轉地通過一光感測器28的感測位置S。詳而言之，如第六圖A至C所示，該晶圓載環總成10係沿一遞送路徑P被遞送並固定於該旋轉台22上，藉此，該旋轉台22可帶動該晶圓載環總成10繞該旋轉中心C旋轉。該光感測器28與該條碼讀取機50之設置位置，係與前述實施例中所揭露者相同，因此，有關此步驟之詳細內容，請參酌前述有關角度定位方法之步驟b)的說明，當可清楚地瞭解。 a) rotating the wafer carrier assembly 10 about a center of rotation C for rotatably passing the bar code label (hereinafter also reference numeral 18) through the sensing position S of a light sensor 28. In detail, as shown in the sixth FIGS. A to C, the wafer carrier assembly 10 is delivered and fixed on the rotating table 22 along a delivery path P, whereby the rotating table 22 can drive the crystal The circular carrier ring assembly 10 rotates about the center of rotation C. The position of the photo sensor 28 and the bar code reader 50 is the same as that disclosed in the foregoing embodiment. Therefore, for the details of this step, please refer to the description of step b) of the above-mentioned angular positioning method. When can be clearly understood.
b)利用該條碼標籤18通過該光感測器28之感測位置S而被偵知時，確認該條碼標籤之中心位置18c。如本發明說明中有關角度定位方法之步驟c)的內容陳述，以及上述有關第八圖之相關說明，在本步驟中，利用該條碼標籤18之前緣18a及後緣18b通過該感測位置S時之旋轉角度θ1及θ2，或者該條碼標籤18之側邊的第一位置18d及第二位置18e通過該感測位置S時之旋轉角度θ4及θ5可以計算出 該條碼標籤18之中心位置18c通過該感測位置S時之旋轉角度θ3，亦即θ3=(θ1+θ2)/2、θ3=(θ4+θ5)/2或者θ3=(θ1+θ2+θ4+θ5)/4，藉此可以確認該條碼標籤18之中心位置18c。 b) When the bar code label 18 is detected by the sensing position S of the photo sensor 28, the center position 18c of the bar code label is confirmed. In the description of the present invention, the content statement of the step c) of the angle positioning method, and the related description of the eighth figure, in this step, the front edge 18a and the trailing edge 18b of the barcode label 18 are passed through the sensing position S. The bar code label 18 can be calculated by the rotation angles θ 1 and θ 2 of the time , or the rotation angles θ 4 and θ 5 of the first position 18d and the second position 18e of the side of the bar code label 18 through the sensing position S. The center position 18c passes through the rotation angle θ 3 when the position S is sensed, that is, θ 3 = (θ 1 + θ 2 )/2, θ 3 = (θ 4 + θ 5 )/2 or θ 3 = (θ 1 + θ 2 + θ 4 + θ 5 ) / 4, whereby the center position 18c of the barcode label 18 can be confirmed.
c)最後，在確認該條碼標籤之中心位置18c之後，將條碼標籤之中心位置18c旋轉至一條碼讀取機50之讀取位置R，亦即，在該光感測器28偵知該條碼標籤18通過其感測位置S之後，使該晶圓載環總成10旋轉至其條碼標籤18相對該條碼標籤之靜止位置為該旋轉角度θ3加上一預定角度α之位置處，藉此，該條碼標籤18將停止於預先設定之條碼讀取機的讀取位置R上，使該條碼讀取機50可以對該條碼標籤18上之條碼進行讀取。 c) Finally, after confirming the center position 18c of the bar code label, the center position 18c of the bar code label is rotated to the reading position R of a code reader 50, that is, the bar code is detected at the photo sensor 28. after the tag 18 through its sensing position S, so that the wafer carrier 10 rotates at the ring assembly to its rest position relative to the bar code label 18 of the bar code label for the rotational angle θ 3 of adding a predetermined angle α position, whereby, The bar code label 18 will stop at the reading position R of the pre-set bar code reader so that the bar code reader 50 can read the bar code on the bar code tag 18.
在本發明所提供之實施例中，該條碼讀取機50之讀取位置R係被建立在該遞送路徑P上，藉此，在上述步驟c)之後，可以利用遞送該晶圓載環總成10之取放裝置(圖中未示)，沿著該遞送路徑P小幅度地往復移動該晶圓載環總成10，使該條碼標籤18可於該讀取位置R作小範圍的往復位移，以確保該條碼標籤18上之條碼可以確實被該條碼讀取機50所讀取。而在讀取條碼之後，取放裝置可將該晶圓載環總成10遞送出該角度定位機構20，以進行後續作業。 In the embodiment provided by the present invention, the reading position R of the barcode reader 50 is established on the delivery path P, whereby after the step c), the wafer carrier assembly can be delivered. a pick-and-place device (not shown) of 10, reciprocally moving the wafer carrier assembly 10 along the delivery path P, so that the barcode label 18 can be reciprocally displaced in a small range at the reading position R. To ensure that the bar code on the bar code label 18 can indeed be read by the bar code reader 50. After reading the barcode, the pick and place device can deliver the wafer carrier assembly 10 out of the angular positioning mechanism 20 for subsequent operations.
綜上所陳，本發明所提供之晶圓載環總成之角度定位方法，係利用該光感測器28偵測到該定位標籤18之後，使該晶圓載環總成10再旋轉一預定角度而完成定位。與習 用技術比較起來，本發明所提供之方法具有定位快速且準確之優點。而且，使用現有晶圓載環總成上既有的條碼標籤作為定位標籤時，可在對該晶圓載環總成進行角度定位時一併進行條碼讀取作業，以縮短二者分別作業之時間。此外，本發明亦可提供一種快速且準確的晶圓載環總成之條碼讀取方法，可以直接應用於現有規格之晶圓載環總成之條碼讀取作業。 In summary, the method for locating the wafer carrier assembly of the present invention is to rotate the wafer carrier assembly 10 by a predetermined angle after the positioning sensor 18 is detected by the optical sensor 28. And complete the positioning. And Xi Compared with the technology, the method provided by the invention has the advantages of quick and accurate positioning. Moreover, when the existing barcode label on the existing wafer carrier assembly is used as the positioning label, the barcode reading operation can be performed together when the wafer carrier assembly is angularly positioned to shorten the time for the two to operate separately. In addition, the present invention can also provide a fast and accurate bar code reading method for the wafer carrier assembly, which can be directly applied to the bar code reading operation of the wafer bearing ring assembly of the existing specification.
最後，必須說明的是，前述實施例中所揭露之角度定位機構20，僅在於舉例說明本發明所提供之晶圓載環總成之角度定位方法及條碼讀取方法的一種可行的實施方式，並非用以限制本發明的技術內容。 Finally, it should be noted that the angular positioning mechanism 20 disclosed in the foregoing embodiment is only a feasible implementation manner for illustrating the angular positioning method and the barcode reading method of the wafer carrier assembly provided by the present invention, and is not It is used to limit the technical content of the present invention.
10‧‧‧晶圓載環總成 10‧‧‧ wafer carrier assembly
12‧‧‧環圈 12‧‧‧ ring
14‧‧‧可透光薄膜 14‧‧‧Transmissive film
16‧‧‧晶圓 16‧‧‧ Wafer
16a‧‧‧平切邊 16a‧‧‧cut edges
18‧‧‧定位標籤(條碼標籤) 18‧‧‧ Positioning Label (Barcode Label)
18a‧‧‧前緣 18a‧‧‧ leading edge
18b‧‧‧後緣 18b‧‧‧ trailing edge
18c‧‧‧中心位置 18c‧‧‧central location
18d‧‧‧第一位置 18d‧‧‧ first position
18e‧‧‧第二位置 18e‧‧‧second position
20‧‧‧角度定位機構 20‧‧‧Angle positioning mechanism
22‧‧‧旋轉台 22‧‧‧Rotating table
22a‧‧‧真空吸盤 22a‧‧‧vacuum suction cup
24‧‧‧底板 24‧‧‧floor
26‧‧‧升降旋轉單元 26‧‧‧ Lifting and rotating unit
28‧‧‧光感測器 28‧‧‧Light sensor
30‧‧‧第一導引件 30‧‧‧First guide
31‧‧‧第二導引件 31‧‧‧Second guide
32‧‧‧第三導引件 32‧‧‧ Third guide
34‧‧‧導桿 34‧‧‧guides
40‧‧‧氣壓缸 40‧‧‧ pneumatic cylinder
42‧‧‧線性襯套 42‧‧‧Linear bushing
44‧‧‧升降平台 44‧‧‧ Lifting platform
46‧‧‧皮帶 46‧‧‧Land
48‧‧‧馬達 48‧‧‧Motor
50‧‧‧條碼讀取機 50‧‧‧Barcode reader
C‧‧‧旋轉中心 C‧‧‧ Rotation Center
P‧‧‧路徑 P‧‧‧ Path
R‧‧‧讀取位置 R‧‧‧Read position
S‧‧‧感測位置 S‧‧‧Sensing position
T‧‧‧目標位置 T‧‧‧ target location
α‧‧‧預定角度 α‧‧‧Predetermined angle
θ‧‧‧旋轉角度 θ‧‧‧Rotation angle
θ1‧‧‧旋轉角度 θ 1 ‧‧‧Rotation angle
θ2‧‧‧旋轉角度 θ 2 ‧‧‧Rotation angle
θ3‧‧‧旋轉角度 θ 3 ‧‧‧Rotation angle
θ4‧‧‧旋轉角度 θ 4 ‧‧‧Rotation angle
θ5‧‧‧旋轉角度 θ 5 ‧‧‧Rotation angle
第一圖係為一用於本發明一較佳實施例所提供之角度定位方法中之晶圓載環總成之示意圖；第二圖係類同第一圖，惟顯示定位標籤設置於不同之位置；第三圖係為一用以實施本發明一較佳實施例所提供之晶圓載環總成之角度定位方法之角度定位機構的立體圖；第四圖係為前述角度定位機構之另一立體圖，其中若干構件係被移除，以便於說明該角度定位機構之結構；第五圖係為前述定位機構之升降旋轉單元之立體圖；第六圖A至F係為利用前述角度定位機構進行本發明所提供之晶圓載環總成之角度定位方法的動作流程示意圖；為便於說明起見，圖中並未顯示晶圓；第七圖係為一示意圖，用以說明定位標籤與光感測器之感測位置以及目標位置之間的關係；為便於說明，圖中並未顯示晶圓；以及第八圖係為一示意圖，用以說明另一種態樣之定位標籤與光感測器之感測位置之間的關係。 The first figure is a schematic diagram of a wafer carrier assembly used in the angular positioning method provided by a preferred embodiment of the present invention; the second figure is similar to the first figure, but the positioning label is displayed at different positions. The third figure is a perspective view of an angular positioning mechanism for implementing the angular positioning method of the wafer carrier assembly provided by a preferred embodiment of the present invention; and the fourth figure is another perspective view of the angular positioning mechanism. Some of the components are removed to facilitate the description of the structure of the angular positioning mechanism; the fifth figure is a perspective view of the lifting and rotating unit of the positioning mechanism; and the sixth figures A to F are the present invention by using the aforementioned angular positioning mechanism. Schematic diagram of the operation of the angular positioning method of the wafer carrier assembly; for convenience of explanation, the wafer is not shown in the figure; the seventh diagram is a schematic diagram for explaining the sense of the positioning label and the light sensor The relationship between the measured position and the target position; for convenience of explanation, the wafer is not shown in the figure; and the eighth figure is a schematic diagram for explaining the positioning label and the light feeling of another aspect The relationship between the position sensing device.
18‧‧‧定位標籤(條碼標籤) 18‧‧‧ Positioning Label (Barcode Label)
18a‧‧‧前緣 18a‧‧‧ leading edge
18b‧‧‧後緣 18b‧‧‧ trailing edge
18c‧‧‧中心位置 18c‧‧‧central location
C‧‧‧旋轉中心 C‧‧‧ Rotation Center
P‧‧‧路徑 P‧‧‧ Path
R‧‧‧讀取位置 R‧‧‧Read position
S‧‧‧感測位置 S‧‧‧Sensing position
T‧‧‧目標位置 T‧‧‧ target location
α‧‧‧預定角度 α‧‧‧Predetermined angle
θ1‧‧‧旋轉角度 θ 1 ‧‧‧Rotation angle
θ2‧‧‧旋轉角度 θ 2 ‧‧‧Rotation angle
θ3‧‧‧旋轉角度 θ 3 ‧‧‧Rotation angle
Claims (13)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101118346A TWI525741B (en) | 2012-05-23 | 2012-05-23 | The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the |
| CN201210414786.2A CN103426786B (en) | 2012-05-23 | 2012-10-26 | Method for angularly positioning a wafer carrier ring assembly and mechanism for implementing the method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101118346A TWI525741B (en) | 2012-05-23 | 2012-05-23 | The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the |
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| Publication Number | Publication Date |
|---|---|
| TW201349380A TW201349380A (en) | 2013-12-01 |
| TWI525741B true TWI525741B (en) | 2016-03-11 |
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| TW101118346A TWI525741B (en) | 2012-05-23 | 2012-05-23 | The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the |
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| TW (1) | TWI525741B (en) |
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| CN110459497B (en) * | 2018-05-08 | 2022-04-22 | 北京北方华创微电子装备有限公司 | Wafer pre-positioning method |
| US20220005721A1 (en) * | 2020-07-02 | 2022-01-06 | Mpi Corporation | Method of aligning wafer |
| CN112509960B (en) * | 2020-11-09 | 2024-04-09 | 太极半导体（苏州）有限公司 | Positioning method for 3D wafer ring after cutting |
| CN115372135B (en) * | 2022-08-10 | 2023-06-16 | 国标（北京）检验认证有限公司 | Method for measuring rotation angle of high-temperature alloy crystal grain |
| CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN116798923B (en) * | 2023-06-09 | 2024-04-16 | 乐孜芯创半导体设备(上海)有限公司 | Centering and orienting device for wafer carrier ring |
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| US7569932B2 (en) * | 2005-11-18 | 2009-08-04 | Checkpoint Systems, Inc. | Rotary chip attach |
| CN100547757C (en) * | 2006-11-07 | 2009-10-07 | 中芯国际集成电路制造(上海)有限公司 | A kind of novel crystal round locating bias correcting method |
| JP5174432B2 (en) * | 2007-11-12 | 2013-04-03 | Ｊｕｋｉ株式会社 | Parts supply device |
| CN201178089Y (en) * | 2008-03-21 | 2009-01-07 | 北京德鑫泉科技发展有限公司 | Chip applicable intelligent label and flip chip module production apparatus |
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| CN103426786A (en) | 2013-12-04 |
| TW201349380A (en) | 2013-12-01 |
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