TWI525316B - Chip led inspection apparatus - Google Patents

Chip led inspection apparatus Download PDF

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TWI525316B
TWI525316B TW100114700A TW100114700A TWI525316B TW I525316 B TWI525316 B TW I525316B TW 100114700 A TW100114700 A TW 100114700A TW 100114700 A TW100114700 A TW 100114700A TW I525316 B TWI525316 B TW I525316B
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light
type led
support member
illumination
wafer type
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TW201200864A (en
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松田晉也
佐佐木浩一
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第一實業Ｖｉｓｗｉｌｌ股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Led Device Packages (AREA)

Description

晶片型LED檢測設備Wafer type LED inspection equipment

本發明關於一種檢查裝置，可偵測混入晶片式發光二極體(Chip LED)的密封樹脂部或附著於其表面的不透光性異物。The present invention relates to an inspection apparatus capable of detecting a sealing resin portion mixed with a chip type LED or a opaque foreign matter attached to a surface thereof.

過去以來，晶片式LED已知有各種形態，而其中一個如圖12所示。Wafer-type LEDs have been known in various forms in the past, and one of them is shown in FIG.

如同圖12所示般，此晶片式LED50係由：具有透光性的基板51；在該基板51的背面以互相分離的狀態形成的至少兩個不透光性的電極部52、52；配置於前述基板51的表面中央部之發光部53；與被覆基板51的表面，並密封前述發光部53之透光性密封樹脂54所構成。As shown in FIG. 12, the wafer type LED 50 is composed of a substrate 51 having light transmissivity; at least two opaque electrode portions 52, 52 formed in a state of being separated from each other on the back surface of the substrate 51; The light-emitting portion 53 at the central portion of the surface of the substrate 51 is formed of a light-transmitting sealing resin 54 that seals the surface of the substrate 51 with the light-emitting portion 53.

前述密封樹脂54，其被覆發光部53的部分成形為凸曲面狀(在此例中幾乎呈半球狀)，除了密封上述發光部53的功能以外，凸曲面部54a還能發揮集光鏡片的功能而將由發光部53發出的光線集光。In the sealing resin 54, the portion covering the light-emitting portion 53 is formed into a convex curved shape (in the example, almost hemispherical), and the convex curved surface portion 54a can function as a collecting lens in addition to the function of sealing the light-emitting portion 53. The light emitted by the light-emitting portion 53 is collected.

所以，在發揮這些功能的凸曲面部54a有不透光性異物混入或附著於其表面的情況下，會發生由發光部53發出的光線會被此異物遮蔽，由該晶片式LED50照射出來的光線變得不均勻這樣的不正常狀況。Therefore, when the convex curved surface portion 54a exhibiting these functions has a opaque foreign matter mixed in or adhered to the surface thereof, light emitted from the light-emitting portion 53 is blocked by the foreign matter, and is irradiated by the wafer type LED 50. An abnormal condition in which the light becomes uneven.

因此，一直以來都需要一種可偵測混入密封樹脂54(特別是凸曲面部54a)或附著於其表面的前述不透光性異物的檢查裝置。Therefore, there has been a need for an inspection apparatus capable of detecting the aforementioned opaque foreign matter mixed in the sealing resin 54 (particularly, the convex curved surface portion 54a) or attached to the surface thereof.

另一方面，在以往已知有一種檢查裝置，並非以晶片式LED作為檢查對象的裝置，而為檢查半導體封裝配線圖案的裝置，如日本特開2009-288050公報所揭示的檢查裝置。On the other hand, there has been known an inspection apparatus which is not an apparatus for inspecting a wafer type LED, but an apparatus for inspecting a semiconductor package wiring pattern, such as the inspection apparatus disclosed in Japanese Laid-Open Patent Publication No. 2009-288050.

該檢查裝置係藉由間接照明手段照亮被檢體，藉由線性掃描相機拍攝該被檢體並解析其影像，而偵測出缺陷，間接照明手段係具備具有呈穹頂狀的凹曲面狀反射面的本體，由形成於本體開口部側內面的光線射出口對前述反射面照射光線，藉由被該反射面反射的光線照亮下方的被檢體。另外，相機可由形成於前述本體的觀察窗拍攝前述被檢體。The inspection device illuminates the object by indirect illumination, and the subject is imaged by a linear scanning camera and the image is analyzed to detect defects. The indirect illumination device has a concave curved surface having a dome shape. The surface of the surface is irradiated with light by the light exit port formed on the inner surface of the opening portion of the body, and the light reflected by the reflecting surface illuminates the object underneath. In addition, the camera can image the subject by an observation window formed on the body.

然而在晶片式LED具有上述構成的情況，即使將以往的檢查裝置直接適用於檢查該晶片式LED，因為該晶片式LED的構成，而無法正確偵測到存在於該密封樹脂部的不透光性異物。However, in the case where the wafer type LED has the above configuration, even if the conventional inspection apparatus is directly applied to the inspection of the wafer type LED, the opaqueness of the sealing resin portion cannot be accurately detected due to the configuration of the wafer type LED. Sexual foreign body.

使用上述以往的間接照明手段照亮晶片式LED的情況，由相機對其拍攝到的影像會成為明暗影像，如圖13所示般，由平面觀察，前述凸曲面部的外周部分(由基板立起的部分)(符號55)、以及不具有電極的部分(從表面透光至背面的部分)(符號56)為暗部，其他電極部及發光部為亮部。另外，影像中相當於晶片式LED50的部分以外亦會成為暗部。When the wafer type LED is illuminated by the above-described conventional indirect illumination means, the image captured by the camera becomes a light and dark image, and as shown in FIG. 13, the outer peripheral portion of the convex curved surface portion is viewed from the plane (by the substrate The portion (symbol 55) and the portion having no electrode (the portion that transmits light from the surface to the back surface) (symbol 56) are dark portions, and the other electrode portions and the light-emitting portion are bright portions. In addition, the portion of the image corresponding to the wafer type LED 50 also becomes a dark portion.

電極部及發光部可較良好地反射光線，因此穿透密封樹脂及基板的光線會被該電極部反射，然後再度穿透基板及密封樹脂，而入射至相機，因此相同部位會成為亮部，相對於此，在並未形成電極之處，穿透密封樹脂及基板的光線不會被反射，因此會成為暗部。Since the electrode portion and the light-emitting portion reflect light well, the light that penetrates the sealing resin and the substrate is reflected by the electrode portion, and then penetrates the substrate and the sealing resin again, and is incident on the camera, so that the same portion becomes a bright portion. On the other hand, when the electrode is not formed, the light that penetrates the sealing resin and the substrate is not reflected, and therefore becomes a dark portion.

另外，關於前述凸曲面部的由基板立起的部分(外周部分)，認為在具備上述構造以往的間接照明手段的情況，有助於照明的前述反射光(照明光)會往下方具有某程度的方向性，因此，在與此照明光線成銳角相交的前述外周部，被該外周部表面正規反射的照明光線多，另外，入射至樹脂內部的照明光線少，所以由該外周部入射至相機的反射光少，因此會成為暗部。In addition, it is considered that the portion (outer peripheral portion) of the convex curved surface portion that rises from the substrate is provided with the indirect illumination means having the above-described structure, and the reflected light (illumination light) that contributes to illumination has a certain degree below. Therefore, the outer peripheral portion intersecting the illumination light at an acute angle has a large amount of illumination light that is regularly reflected by the surface of the outer peripheral portion, and the amount of illumination light incident on the inside of the resin is small, so that the outer peripheral portion is incident on the camera. The reflected light is small, so it will become a dark part.

另一方面，由於光線不會穿透不透光性異物，因此會成為暗部。所以，在不透光性異物在凸曲面部的外周部(符號55)、或並未形成電極的部分(符號56)所對應的位置的情況下，任一者皆會成為暗部，因此極難偵測到該異物(參照圖13，在圖13之中符號57為異物)。On the other hand, since light does not penetrate the opaque foreign matter, it becomes a dark portion. Therefore, in the case where the opaque foreign matter is at the position corresponding to the outer peripheral portion (symbol 55) of the convex curved surface portion or the portion (symbol 56) where the electrode is not formed, either of them becomes a dark portion, and thus it is extremely difficult. The foreign matter is detected (refer to Fig. 13, in Fig. 13, reference numeral 57 is a foreign matter).

另外，晶片式LED除了上述形態以外，還可在基板背面的全面設置不透光性的樹脂或其他構件，然而關於前述密封樹脂的凸曲面外周部會成為暗部這點並沒有不同。Further, in addition to the above-described form, the wafer type LED may be provided with a opaque resin or other member on the back surface of the substrate. However, the outer peripheral portion of the convex curved surface of the sealing resin is not dark.

本發明鑑於以上的實際狀況而完成，其目的為提供一種檢查裝置，可正確偵測存在於晶片式LED的密封樹脂部的不透光性異物，不受其存在位置所限制。The present invention has been made in view of the above circumstances, and an object thereof is to provide an inspection apparatus capable of accurately detecting opaque foreign matter existing in a sealing resin portion of a wafer type LED without being restricted by its position.

為了解決上述課題的本發明，係關於一種晶片式LED檢查裝置，其係偵測混入晶片式LED的密封樹脂或附著其表面的不透光性異物之檢查裝置，該晶片式LED係由：具有透光性的基板；形成於該基板背面的不透光性電極部；配置於前述基板表面中央部的發光部；與被覆前述基板表面而密封前述發光部的透光性密封樹脂所構成，該密封樹脂之至少覆蓋前述發光部的部分形成凸曲面狀，其特徵在於，包括：支持前述晶片式LED的板狀或薄片狀支持構件；配置於前述支持構件的上方，並拍攝載置於該支持構件上的晶片式LED表面側影像之相機；相同地配置於前述支持構件的上方，照亮載置於該支持構件上的晶片式LED的表面之上部照明機構；以及解析由前述相機拍攝到的影像，並判定前述異物的有無之判定部；前述上部照明機構係由；由在下面中心部具備圓形開口部且在頂部具備拍攝用的開口部之穹頂狀本體與配置於該穹頂本體內的複數個光源所構成，前述穹頂本體其內部凹曲面構成反射面，前述光源係在前述穹頂本體內部底面上沿其圓周方向等間隔配置而成並且往前述凹曲面照射光線，被前述凹曲面反射的光線由前述穹頂本體的下面開口部往下方照射的方式構成之第1照明部，與具有呈環狀的本體、與在該環狀本體的下面沿其圓周方向等間隔配置並且往下方照射光線的複數個光源之第2照明部所構成；前述第2照明部，係以該環狀本體與前述第1照明部的穹頂本體成為同軸的方式配置於該第1照明部下方；進一步以前述相機配置於前述第1照明部上方，透過前述穹頂本體的拍攝用開口部拍攝前述晶片式LED的表面影像。The present invention relates to a wafer type LED inspection apparatus which is an inspection apparatus for detecting a sealing resin mixed with a wafer type LED or an opaque foreign matter attached to a surface thereof, the wafer type LED system having: a light-transmissive substrate; an opaque electrode portion formed on a back surface of the substrate; a light-emitting portion disposed at a central portion of the substrate surface; and a light-transmitting sealing resin that covers the surface of the substrate and seals the light-emitting portion The portion of the sealing resin covering at least the light-emitting portion is formed into a convex curved surface, and includes a plate-shaped or sheet-shaped supporting member that supports the wafer-type LED, and is disposed above the supporting member, and is photographed and placed on the support. a camera on the surface of the wafer-type LED on the component; similarly disposed above the support member, illuminating an illumination mechanism above the surface of the wafer-type LED mounted on the support member; and analyzing the image captured by the camera a determination unit for determining the presence or absence of the foreign matter; the upper illumination mechanism is provided; and the circular opening is provided at a lower central portion a dome-shaped body having an opening for imaging on a top portion and a plurality of light sources disposed in the dome body, wherein the dome-shaped main body has a concave curved surface forming a reflecting surface, and the light source is on the inner bottom surface of the dome body. a first illuminating unit that is disposed at equal intervals in the circumferential direction and that illuminates the concave curved surface, and the light reflected by the concave curved surface is irradiated downward from the lower opening of the dome body, and has a ring-shaped body. The second illumination unit is configured by a plurality of light sources arranged at equal intervals in the circumferential direction of the annular body and irradiated with light rays downward; and the second illumination unit is configured by the annular body and the first illumination unit The dome body is disposed coaxially below the first illumination unit, and the camera is disposed above the first illumination unit, and the surface image of the wafer type LED is captured through the imaging opening of the dome body.

在本發明所關聯之檢查裝置中，首先，使檢查對象的晶片式LED位於支持構件上的檢查區域(前述相機的拍攝視野區域)內。另外，搬運晶片式LED的機構，除了例如藉由適當的搬運手段搬運晶片式LED，並載置於前述支持構件上的檢查區域內以外，還可在支持構件上藉由適當的搬運手段搬運晶片式LED，並以適當的搬運速度使其通過前述檢查區域內，或可在載置晶片式LED的狀態下使支持構件移動，並以適當的搬運速度使該晶片式LED通過前述檢查區域內。In the inspection apparatus according to the present invention, first, the wafer type LED to be inspected is placed in an inspection area (the imaging field of view of the camera) on the support member. Further, the mechanism for transporting the wafer type LED can transport the wafer on the support member by an appropriate transport means, except that the wafer type LED is transported by an appropriate transport means and placed in the inspection area on the support member. The LED is passed through the inspection region at an appropriate conveyance speed, or the support member is moved while the wafer type LED is placed, and the wafer type LED is passed through the inspection region at an appropriate conveyance speed.

在支持構件上的檢查區域中，藉由上部照明機構照亮晶片式LED的表面，透過形成於第1照明部的穹頂本體的拍攝用開口部，藉由相機拍攝晶片式LED的表面側的影像。In the inspection area on the support member, the surface of the wafer type LED is illuminated by the upper illumination means, and the image of the surface side of the wafer type LED is imaged by the camera through the imaging opening formed in the dome body of the first illumination unit. .

前述上部照明機構具有第1照明部與第2照明部，藉由該等兩個照明部照亮晶片式LED的表面，藉此，在由前述相機拍攝的晶片式LED影像中，相當於其電極部及發光部的部分以及相當於凸曲面部的部分會成為亮部。The upper illumination unit includes a first illumination unit and a second illumination unit, and the two illumination units illuminate the surface of the chip LED, thereby corresponding to the electrode of the wafer type LED image captured by the camera. The portion of the portion and the light-emitting portion and the portion corresponding to the convex curved portion become bright portions.

在第1照明部中，從穹頂本體的內部底面上沿其圓周方向等間隔配置的各個光源往穹頂本體內面的凹曲面照射光線，被此凹曲面反射的反射光會由下面開口部往下方照射，藉由此反射光照亮晶片式LED全部表面。亦即，可藉由第1照明部間接照亮晶片式LED其全部表面。In the first illumination unit, each of the light sources arranged at equal intervals in the circumferential direction from the inner bottom surface of the dome main body illuminates the concave curved surface of the dome inner surface, and the reflected light reflected by the concave curved surface is downward from the lower opening portion. Irradiation, thereby illuminating the entire surface of the wafer-type LED by means of reflected light. That is, the entire surface of the wafer type LED can be indirectly illuminated by the first illumination unit.

然後，從第1照明部照射出來的光線會穿透密封樹脂及基板，電極部及發光部可較良好地反射光線，因此穿透的光線會被該電極部及發光部反射，然後再度穿透基板及密封樹脂，而入射至相機。因此，電極部及相當於發光部的部分會成為亮部。Then, the light irradiated from the first illumination portion penetrates the sealing resin and the substrate, and the electrode portion and the light-emitting portion can reflect the light relatively well, so that the transmitted light is reflected by the electrode portion and the light-emitting portion, and then penetrates again. The substrate and the sealing resin are incident on the camera. Therefore, the electrode portion and the portion corresponding to the light-emitting portion become bright portions.

另一方面，在第2照明部中，從環狀本體的下面沿其圓周方向等間隔配置的複數個各個光源對於以其正下方位置為中心的平面視圓形區域內照射光線，複數個光源全體主要照亮下方環狀區域而使其成為高照度區域。On the other hand, in the second illumination unit, a plurality of light sources arranged at equal intervals in the circumferential direction from the lower surface of the annular body illuminate the light in a circular circular area centered on the position directly below the plurality of light sources, and a plurality of light sources All of them mainly illuminate the lower annular region to make it a high-illumination region.

由此第2照明部照射出的光線中，主要藉由內側斜往下方照射出的光線照亮晶片式LED的表面。前述第1照明部係利用被穹頂本體內面的凹曲面反射的反射光之間接照明，與前述以往的間接照明手段同樣地，會往下方具有某程度的方向性，因此僅藉著此第1照明部，與此照明光線成銳角相交的前述凸曲面部的外周部(由基板立起的部分)會成為暗部，而前述第2照明部係從其外方的斜上方照亮此凸曲面部，所以也能以充足光量照亮該凸曲面部的外周部，因此，被相同部位反射或穿透相同部位的光線會以充足光量入射至相機。所以，藉由此第2照明部的照明，可使前述凸曲面部的外周部成為亮部。In the light emitted from the second illumination unit, the surface of the wafer-type LED is mainly illuminated by the light irradiated downward from the inside. The first illumination unit is illuminating by the reflected light reflected by the concave curved surface of the inner surface of the dome, and similarly to the conventional indirect illumination means, there is a certain degree of directivity downward. Therefore, only the first one is used. The illumination unit has an outer peripheral portion (portion rising from the substrate) of the convex curved surface portion that intersects the illumination light at an acute angle, and the second illumination portion illuminates the convex curved surface portion obliquely from the outer side. Therefore, the outer peripheral portion of the convex curved portion can also be illuminated with a sufficient amount of light, and therefore, light that is reflected or penetrated by the same portion at the same portion is incident on the camera with a sufficient amount of light. Therefore, the outer peripheral portion of the convex curved surface portion can be made bright by the illumination of the second illumination portion.

如此一來，藉由前述第1照明部及第2照明部而照明，並藉由前述相機所拍攝到的晶片式LED影像其全體為亮部。In this way, the first illumination unit and the second illumination unit are illuminated, and the entire wafer-type LED image captured by the camera is a bright portion.

所以，在不透光性異物混入密封樹脂中或者附著於其表面的情況下，由前述相機拍攝的影像僅該異物成為暗部，因此在前述判定部解析該影像並判定異物的有無時，可容易且正確地進行。Therefore, when the opaque foreign matter is mixed in or adhered to the surface of the sealing resin, the image captured by the camera is only a dark portion. Therefore, when the determination unit analyzes the image and determines the presence or absence of foreign matter, it is easy. And proceed correctly.

另外在本發明中，前述第2照明部還可具備配置於此光源下方的環狀擴散透光膜。Further, in the invention, the second illumination unit may further include an annular diffusion light-transmissive film disposed under the light source.

此外，在基板背面以互相分離的狀態形成有至少兩個不透光性電極部的晶片式LED等，在晶片式LED具備從表面透光至背面的部分的情況下，若僅藉由前述上部照明機構對其進行照明，則在該具有透光性的部分，穿透密封樹脂部及基板的光線不會被反射，因此所能得到的影像中相當於此的部分會成為暗部。所以，在具有此透光性的部分所對應的部分有異物存在的情況下，無法正確地偵測。Further, a wafer type LED or the like in which at least two opaque electrode portions are formed in a state in which the back surface of the substrate is separated from each other, and when the wafer type LED has a portion that transmits light from the surface to the back surface, only the upper portion is used. When the illumination unit illuminates the light, the light that penetrates the sealing resin portion and the substrate is not reflected by the light transmissive portion. Therefore, the portion corresponding to the image that can be obtained becomes a dark portion. Therefore, in the case where a foreign matter exists in a portion corresponding to the portion having such light transmittance, it cannot be detected correctly.

為了解決這樣的問題，在本發明中可採用的形態為：由透明構件構成前述支持構件，進一步在前述支持構件下方設置下部照明機構，透過該支持構件照明晶片式LED的背面。In order to solve such a problem, in the aspect of the invention, the support member may be formed of a transparent member, and a lower illumination mechanism may be provided below the support member, and the back surface of the chip LED may be illuminated through the support member.

如前述般，僅藉由上部照明機構進行照明的情況下，在從表面透光至背面的部分，穿透密封樹脂部及基板的光線不會被反射而成為暗部，然而藉由下部照明機構照亮晶片式LED的背面，穿透支持構件的光線進一步會穿透前述透光部分而入射至相機，因此可得到前述透光部分為亮部的影像。As described above, when illumination is performed only by the upper illumination means, light that penetrates the sealing resin portion and the substrate is not reflected and becomes a dark portion in a portion that transmits light from the surface to the back surface, but is illuminated by the lower illumination mechanism. On the back side of the bright chip type LED, the light penetrating the supporting member further penetrates the light transmitting portion and is incident on the camera, so that the image in which the light transmitting portion is bright is obtained.

所以，即使在異物存在於前述透光部分的情況下，藉由此下部照明機構照亮晶片式LED的背面，可正確地偵測。Therefore, even in the case where foreign matter is present in the light-transmitting portion, the back surface of the wafer-type LED can be illuminated by the lower illumination mechanism, and can be correctly detected.

另外，前述下部照明機構並不特別需要具備光源，亦可由配置於前述支持構件的下方並與該支持構件平行，與該支持構件呈對向的一面為反射面的反射板所構成。Further, the lower illumination means is not particularly required to have a light source, and may be constituted by a reflection plate disposed below the support member and parallel to the support member, and having a reflection surface on a side opposite to the support member.

如上述所述般，藉由前述上部照明機構照亮晶片式LED的表面側。因此，由前述上部照明機構發出的光線會穿透前述透光部，進一步穿透支持構件到達反射板的反射面並被此反射面反射，然後再度穿透支持構件並穿透前述透光部，而入射至相機。所以，即使使用該反射板，仍然可得到前述透光部成為亮部的影像。另外，在此情況下，反射板的反射面係以呈白色為佳。另外還可由呈白色的材料構成支持構件，在此情況下不需要前述下部照明機構。As described above, the surface side of the wafer type LED is illuminated by the aforementioned upper illumination mechanism. Therefore, the light emitted by the upper illumination mechanism penetrates the light transmitting portion, further penetrates the support member to reach the reflective surface of the reflector, and is reflected by the reflective surface, and then penetrates the support member again and penetrates the light transmitting portion. And incident on the camera. Therefore, even if the reflecting plate is used, an image in which the light transmitting portion becomes a bright portion can be obtained. Further, in this case, the reflecting surface of the reflecting plate is preferably white. It is also possible to form the support member from a white material, in which case the aforementioned lower illumination mechanism is not required.

另外，作為檢查對象的晶片式LED，係由：具有透光性的基板；形成於該基板背面的不透光性電極部；配置於前述基板表面中央部的發光部；與被覆前述基板表面而密封前述發光部的透光性密封樹脂所構成，而該密封樹脂之至少覆蓋前述發光部的部分形成凸曲面狀，關於凸曲面部的形狀完全不受限定。Further, the wafer type LED to be inspected includes: a substrate having light transmissivity; an opaque electrode portion formed on the back surface of the substrate; a light emitting portion disposed at a central portion of the surface of the substrate; and a surface of the substrate The translucent sealing resin that seals the light-emitting portion is formed, and at least a portion of the sealing resin that covers the light-emitting portion has a convex curved shape, and the shape of the convex curved portion is not limited.

如以上所述般，依據本發明可使由相機拍攝的晶片式LED影像其全體成為亮部，其結果，在前述密封樹脂部有異物存在的情況下可得到僅該異物成為暗部的影像，因此在解析所得到的影像並判定異物的有無時，可容易且正確地進行。As described above, according to the present invention, the entire wafer-type LED image captured by the camera can be made into a bright portion. As a result, when foreign matter is present in the sealing resin portion, an image in which only the foreign matter becomes a dark portion can be obtained. When the obtained image is analyzed and the presence or absence of foreign matter is determined, it can be easily and accurately performed.

以下針對本發明其中一個具體實施形態，以圖式為基礎進行說明。Hereinafter, one of the specific embodiments of the present invention will be described based on the drawings.

如圖1所示般，本例之檢查裝置1係具備：載置有檢查對象的晶片式LED50之透明板狀支持構件5；配置於此支持構件5的上方，並拍攝載置於該支持構件5上的晶片式LED50表面側影像之相機6；配置於支持構件5的上方、相機6的正下方之上部照明機構10；夾住支持構件5，與上部照明機構10呈對向的方式配置於支持構件5下方之下部照明機構7；與解析由相機拍攝到的影像，並對於拍攝到的晶片式LED50判定好壞之判定部8。As shown in Fig. 1, the inspection apparatus 1 of the present embodiment includes a transparent plate-shaped support member 5 on which a wafer type LED 50 to be inspected is placed, and is disposed above the support member 5, and is photographed and placed on the support member. a camera 6 on the surface side image of the wafer type LED 50 on the fifth surface; an illumination mechanism 10 disposed above the support member 5 and directly above the camera 6; and the support member 5 is sandwiched and disposed opposite to the upper illumination mechanism 10 Support member 5 below lower illumination mechanism 7; and parsing by camera The captured image is judged by the determination unit 8 for the captured wafer type LED 50.

另外，本例中作為檢查對象的晶片式LED50，係具有如前述圖12所示的形態。In addition, the wafer type LED 50 to be inspected in this example has the form as shown in FIG.

前述支持構件5只要是玻璃等不會使光線歪斜而穿透的物質，則其材質並無限制，另外，其形態除了剛性高的板材以外，還可為具有可撓性的薄片材。The support member 5 is not limited as long as it is made of glass or the like without penetrating the light. The form of the support member 5 may be a flexible sheet material in addition to a highly rigid sheet material.

前述上部照明機構10如圖1及2所示般，具備第1照明部11，與連接於其下方的第2照明部20。As shown in FIGS. 1 and 2, the upper illumination unit 10 includes a first illumination unit 11 and a second illumination unit 20 connected to the lower side.

第1照明部11如圖2、圖4及5所示般，係由：呈碗狀的上本體13；及由連接在該上本體13的下面並與其同軸的環狀下本體15所構成的穹頂狀本體部12；配置於本體部12內部並作為光源之複數個LED燈19所構成。As shown in Figs. 2, 4 and 5, the first illumination unit 11 is composed of a bowl-shaped upper body 13 and an annular lower body 15 connected to the lower surface of the upper body 13 and coaxial therewith. The dome-shaped main body portion 12 is configured by a plurality of LED lamps 19 disposed inside the main body portion 12 as a light source.

前述上本體13其內面(凹曲面)13a成為反射面，在頂部形成有拍攝用的開口14。另外，在前述下本體15的上面形成有環狀凹溝16，前述LED燈19係在前述凹溝16內的底面沿著其圓周方向等間隔配置，而且其照射方向往上。The inner surface (concave curved surface) 13a of the upper body 13 serves as a reflecting surface, and an opening 14 for photographing is formed at the top. Further, an annular groove 16 is formed in the upper surface of the lower body 15, and the LED lamps 19 are arranged at equal intervals in the circumferential direction of the bottom surface of the recessed grooves 16, and the irradiation direction thereof is upward.

如此一來，藉由此第1照明部11，則從各LED燈19往上方照射的光線，會被上本體13的凹曲面13a反射，透過下本體15的開口部17，照亮配置於其下方的晶片式LED50表面全體。另外，由此第1照明部11進行的照明，係往下方具有某程度的方向性的間接照明，該第1照明部11會照亮其下方的圓形區域。In this way, the light that is irradiated upward from each of the LED lamps 19 by the first illumination unit 11 is reflected by the concave curved surface 13a of the upper body 13, passes through the opening 17 of the lower body 15, and is illuminatingly disposed therein. The surface of the wafer-type LED 50 below is the entire surface. Further, the illumination by the first illumination unit 11 is indirect illumination having a certain degree of directivity downward, and the first illumination unit 11 illuminates the circular area below.

前述第2照明部20，如圖2及圖6所示般，係由：在上面及下面具備開口部，連接在前述下本體15的下面並與其同軸之環狀本體21；設置於該本體21並作為光源之複數個LED燈23；與設置於本體21下面之環狀擴散透光膜24所構成。As shown in FIGS. 2 and 6, the second illumination unit 20 includes an opening portion that is provided on the upper surface and the lower surface, and is connected to the lower surface of the lower body 15 so as to be coaxial with the annular body 21; And a plurality of LED lamps 23 as a light source; and an annular diffusion transparent film 24 disposed under the body 21.

前述本體21的下面開口部的內徑大於上面開口部的內徑，在該呈環狀的內部上面沿著圓周方向等間隔配置有前述LED燈23，而其照射方向往下。The inner diameter of the lower opening of the main body 21 is larger than the inner diameter of the upper opening, and the LED lamps 23 are arranged at equal intervals in the circumferential direction on the inner surface of the annular inner surface, and the irradiation direction thereof is downward.

如此一來，藉由此第2照明部20，則由配置成環狀的各LED燈23對於以其正下方位置為中心的平面視圓形區域內照射光線，複數個LED燈23全體主要照亮下方的環狀區域使其成為高照度區域。然後，所照射出的光線中，主要藉由內側斜往下方照射的光線照亮配置於其下方的晶片式LED50其表面，並至少照亮凸曲面部54a的外周部以及包含其外側的晶片式LED50的環狀區域。在圖8中，以灰色所表示的環狀區域係該第2照明部20的照明區域，藉由調整上部照明機構10的高度位置，前述凸曲面部54a的外周部會被包含於照明區域。In this way, by the second illumination unit 20, the LED lamps 23 arranged in a ring shape are irradiated with light in a circular circular area centered on the position directly below, and the plurality of LED lamps 23 are mainly illuminated. The annular area below the light makes it a high illumination area. Then, among the illuminating rays, the surface of the wafer type LED 50 disposed under the illuminating light mainly illuminates downward by the inner side, and illuminates at least the outer peripheral portion of the convex curved surface portion 54a and the wafer type including the outer side thereof The annular region of the LED 50. In FIG. 8, the annular region indicated by gray is the illumination region of the second illumination unit 20, and by adjusting the height position of the upper illumination mechanism 10, the outer peripheral portion of the convex curved portion 54a is included in the illumination region.

另外，前述擴散透光膜24，係用於使由LED燈23照射出來的光線分散地透過，因此不會產生斑紋，幾乎以均等的照度照亮前述環狀區域內。Further, the diffused light-transmissive film 24 is used to dispersely transmit the light emitted from the LED lamp 23, so that no streaks are generated, and the inside of the annular region is illuminated with almost uniform illuminance.

另外，本體21的上面開口部的內徑及擴散透光膜24的內徑，任一者皆大於前述下本體15的開口部17的內徑，而不會對前述第1照明部11的照明造成障礙。Further, the inner diameter of the upper opening portion of the main body 21 and the inner diameter of the diffused transparent film 24 are larger than the inner diameter of the opening portion 17 of the lower body 15, and the illumination of the first illumination portion 11 is not performed. Caused obstacles.

前述下部照明機構7係由配置於前述支持構件5的下方且與該支持構件5平行，與該支持構件5呈對向的一面為白色反射面的板狀構件所構成。此下部照明機構7藉著前述反射面，反射由上部照明機構10照射出來而且直接穿透支持構件5的光線、以及穿透支持構件5上的晶片式LED50與支持構件5的光線，而照亮前述晶片式LED50的背面。The lower illuminating mechanism 7 is composed of a plate-like member that is disposed below the support member 5 and that is parallel to the support member 5 and that faces the support member 5 and has a white reflecting surface. The lower illumination mechanism 7 illuminates the light that is irradiated by the upper illumination mechanism 10 and directly penetrates the support member 5, and the light that penetrates the wafer type LED 50 on the support member 5 and the support member 5 by the aforementioned reflecting surface. The back surface of the aforementioned wafer type LED 50.

前述相機6可由前述上本體11的開口14拍攝其下方的晶片式LED50的影像，只要是可拍攝影像的任何器材皆可，可採用例如區域感測攝相機或線性感測攝相機。但是，在使用線性感測攝相機的情況下，有必要以既定速度使晶片式LED50移動。The camera 6 can capture an image of the wafer-type LED 50 underneath the opening 14 of the upper body 11 as long as it is any device capable of capturing an image. For example, an area sensing camera or a line-sensing camera can be used. However, in the case of using a line-sensing camera, it is necessary to move the wafer-type LED 50 at a predetermined speed.

另外，前述下部照明機構7具有至少大於前述晶片式LED50的大小。Further, the lower illumination mechanism 7 has a size at least larger than that of the above-described wafer type LED 50.

前述判定部8可解析由相機6拍攝到的影像，例如對拍攝影像實行二值化處理，而判別在晶片式LED50的密封樹脂54部位是否有異物存在。The determination unit 8 can analyze the image captured by the camera 6, and performs binarization processing on the captured image, for example, and determines whether or not foreign matter is present in the portion of the sealing resin 54 of the wafer type LED 50.

若藉由具備以上構成的本例之檢查裝置1，則可如以下所述方式檢查晶片式LED50。According to the inspection apparatus 1 of the present embodiment having the above configuration, the wafer type LED 50 can be inspected as described below.

首先藉由適當的搬運手段，將作為檢查對象的晶片式LED50搬運至前述支持構件5上的檢查區域，亦即，使其位於前述相機的拍攝視野區域內。First, the wafer type LED 50 to be inspected is transported to the inspection area on the support member 5 by an appropriate conveyance means, that is, in the imaging field of view of the camera.

在前述支持構件5上的前述檢查區域中，藉由上部照明機構10照亮晶片式LED50的表面側，同時藉由下部照明機構7照亮該晶片式LED50的背面側，在此狀態下，可藉由相機6拍攝該晶片式LED50表面側的影像。In the aforementioned inspection region on the support member 5, the surface side of the wafer type LED 50 is illuminated by the upper illumination mechanism 10 while the back side of the wafer type LED 50 is illuminated by the lower illumination mechanism 7, in this state, An image of the surface side of the wafer type LED 50 is imaged by the camera 6.

如上述般，上部照明機構10的第1照明部11會照亮晶片式LED50的表面全體，第2照明部會照亮晶片式LED50之凸曲面部54a的外周部以及包含其外側的晶片式LED50的環狀區域，在不使用下部照明機構7而僅使用此上部照明機構10進行照明的情況下，晶片式LED50的拍攝影像如圖9所示。As described above, the first illumination unit 11 of the upper illumination unit 10 illuminates the entire surface of the wafer type LED 50, and the second illumination unit illuminates the outer peripheral portion of the convex curved surface portion 54a of the wafer type LED 50 and the wafer type LED 50 including the outer side thereof. In the case where the lower illumination unit 7 is used and illumination is performed using only the upper illumination unit 10, the captured image of the wafer type LED 50 is as shown in FIG.

亦即，電極部52及發光部53可較良好地反射光線，因此由第1照明部11照射出來並穿透密封樹脂部54及基板51的光線，會被該電極部52及發光部53反射，然後再度穿透基板51及密封樹脂54，而入射至相機6，因此相同部位會成為亮部，電極52不存在的部分會成為暗部。In other words, since the electrode portion 52 and the light-emitting portion 53 can reflect light well, the light that is irradiated by the first illumination portion 11 and penetrates the sealing resin portion 54 and the substrate 51 is reflected by the electrode portion 52 and the light-emitting portion 53. Then, the substrate 51 and the sealing resin 54 are again penetrated and incident on the camera 6, so that the same portion becomes a bright portion, and a portion where the electrode 52 does not exist becomes a dark portion.

另外，在凸曲面部54a的外周部(由基板51立起的部分)，藉由第2照明部20從其外方的斜上方照亮該凸曲面部54a，所以也能以充足光量照亮該凸曲面部54a的外周部，因此，被相同部位反射或穿透相同部位的光線會以充足光量入射至相機6，該凸曲面部54a的外周部會成為亮部。Further, in the outer peripheral portion of the convex curved surface portion 54a (the portion rising from the substrate 51), the convex portion 24a is illuminated from the outer oblique portion of the second illuminating portion 20, so that it can be illuminated with a sufficient amount of light. Since the outer peripheral portion of the convex curved portion 54a is reflected by the same portion or transmitted through the same portion, the light is incident on the camera 6 with a sufficient amount of light, and the outer peripheral portion of the convex curved portion 54a becomes a bright portion.

另一方面，由前述上部照明機構10照射出來並通過前述晶片式LED50的電極部52、52之間的光線，會被下部照明機構7的反射面反射，然後再度穿透基板51及密封樹脂54，而入射至相機6。所以如圖10所示般，由該相機6拍攝的晶片式LED50的電極部52、52之間的影像亦會成為亮部。另外在圖10的圖示中，為了強調此下部照明機構7的作用而進行說明，忽視了由上部照明機構10對晶片式LED50表面的照明效果。On the other hand, the light irradiated by the upper illumination mechanism 10 and passing through the electrode portions 52, 52 of the wafer type LED 50 is reflected by the reflection surface of the lower illumination mechanism 7, and then penetrates the substrate 51 and the sealing resin 54 again. And incident on the camera 6. Therefore, as shown in FIG. 10, the image between the electrode portions 52, 52 of the wafer type LED 50 imaged by the camera 6 also becomes a bright portion. Further, in the illustration of Fig. 10, in order to emphasize the action of the lower illumination mechanism 7, the illumination effect of the surface of the wafer type LED 50 by the upper illumination mechanism 10 is ignored.

如此一來，藉由前述上部照明機構10及下部照明機構7進行照明，並由相機6拍攝到的晶片式LED50影像，係將圖9及圖10所示的影像重疊而且晶片式LED50的全部表面成為亮部的影像(參照圖11)。In this manner, the upper-type illumination unit 10 and the lower illumination unit 7 illuminate, and the wafer-type LED 50 image captured by the camera 6 superimposes the images shown in FIGS. 9 and 10 and the entire surface of the wafer-type LED 50. It becomes an image of a bright part (refer to FIG. 11).

所以，在晶片式LED50的密封樹脂54部位有不透光性異物存在的情況，如圖11所示般，由前述相機6拍攝的影像中，僅該異物57成為暗部。Therefore, in the case where the sealing resin 54 of the wafer type LED 50 has opaque foreign matter, as shown in FIG. 11, only the foreign matter 57 becomes a dark portion in the image captured by the camera 6.

由相機6拍攝到的這些影像會被傳送至前述判定部8，所傳送的影像會被該判定部8解析，並判定前述異物57的有無。此時由相機6拍攝的影像中僅異物57成為暗部，因此可容易且正確地偵測該異物57。These images captured by the camera 6 are transmitted to the determination unit 8, and the transmitted image is analyzed by the determination unit 8, and the presence or absence of the foreign matter 57 is determined. At this time, only the foreign matter 57 in the image captured by the camera 6 becomes a dark portion, so that the foreign matter 57 can be easily and accurately detected.

以後，將載置於支持構件5上的晶片式LED依序交換為新的，藉著進行上述一連串的檢查，可針對多個晶片式LED連續進行異物檢查。Thereafter, the wafer type LEDs placed on the support member 5 are sequentially exchanged as new ones, and by performing the above-described series of inspections, the foreign matter inspection can be continuously performed for the plurality of wafer type LEDs.

以上針對本發明其中一個實施形態進行說明，而本發明可採用的具體形態完全不受其限定，可在不脫離本發明旨趣的範圍採用其他形態。The embodiments of the present invention have been described above, and the specific embodiments that can be employed in the present invention are not limited thereto, and other forms can be employed without departing from the scope of the present invention.

例如下部照明機構7係由反射面為白色的反射板所構成，然而並不受此限，亦可為採用LED燈等光源的照明機構。在此情況下，以隔著擴散透光膜等，藉由擴散的光線進行照明為佳。For example, the lower illumination mechanism 7 is constituted by a reflection plate whose reflection surface is white, but is not limited thereto, and may be an illumination mechanism using a light source such as an LED lamp. In this case, it is preferable to illuminate by diffused light through a diffusion light-transmitting film or the like.

另外，作為檢查對象的晶片式LED的形態並未受到上例所限定，藉由本發明所關連之檢查裝置，可對於具有呈凸曲面狀的密封樹脂正確地檢查異物的有無，關於凸曲面部的形狀亦完全不受限定。In addition, the form of the wafer type LED to be inspected is not limited to the above example, and the inspection apparatus according to the present invention can accurately check the presence or absence of foreign matter with respect to the sealing resin having a convex curved surface, and the convex curved surface portion. The shape is also completely unrestricted.

另外，只要由呈現白色的材料構成支持構件5，則電極部52，52之間等，可從表面透光至背面的部分亦成為亮部，因此在此情況中不需要前述下部照明機構7。另外，在基板51的全面形成有電極部52等，而不存在可從表面透光至背面的部分的情況下，亦不需要前述下部照明機構7。Further, if the support member 5 is made of a material which exhibits white color, the portion which can be transmitted from the surface to the back surface between the electrode portions 52, 52 and the like also becomes a bright portion. Therefore, the lower illumination mechanism 7 is not required in this case. Further, in the case where the electrode portion 52 or the like is formed over the entire surface of the substrate 51, and there is no portion that can transmit light from the surface to the back surface, the lower illumination mechanism 7 is not required.

另外，在上例中是將前述支持構件5固定住，然而亦可在載置有晶片式LED50的狀態下使支持構件5移動，以適當的搬運速度使該晶片式LED50通過前述檢查區域內。Further, in the above example, the support member 5 is fixed. However, the support member 5 may be moved while the wafer type LED 50 is placed, and the wafer type LED 50 may pass through the inspection region at an appropriate conveyance speed.

1．．．檢查裝置1. . . Inspection device

5．．．支持構件5. . . Support component

6．．．相機6. . . camera

7．．．下部照明機構7. . . Lower lighting mechanism

8．．．判定部8. . . Judgment department

10．．．上部照明機構10. . . Upper lighting mechanism

11．．．第1照明部11. . . First lighting department

12．．．本體部12. . . Body part

13．．．上本體13. . . Upper body

15．．．下本體15. . . Lower body

19．．．LED燈19. . . LED light

20．．．第2照明部20. . . Second lighting department

21．．．本體twenty one. . . Ontology

23．．．LED燈twenty three. . . LED light

24．．．擴散透光膜twenty four. . . Diffusion transparent film

50．．．晶片式LED50. . . Wafer type LED

51．．．基板51. . . Substrate

52．．．電極52. . . electrode

53．．．發光部53. . . Light department

54．．．密封樹脂54. . . Sealing resin

56．．．異物56. . . foreign matter

圖1係表示本發明其中一個實施形態所關連之檢查裝置之正面圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing an inspection apparatus associated with one embodiment of the present invention.

圖2係表示本實施形態所關連之上部照明機構之縱剖面圖。Fig. 2 is a longitudinal sectional view showing the upper illumination unit in the embodiment.

圖3係將本實施形態所關連之上部照明機構的第1照明部與第2照明部分開表示之正面圖。Fig. 3 is a front elevational view showing the first illumination unit and the second illumination unit of the upper illumination unit in the embodiment;

圖4係圖3中延A-A方向之剖面圖。Figure 4 is a cross-sectional view taken along line A-A of Figure 3.

圖5係圖3中延B方向之底面圖。Figure 5 is a bottom plan view of the extension B direction of Figure 3.

圖6係圖3中延C-C方向之底面圖。Figure 6 is a bottom plan view of the extended C-C direction of Figure 3.

圖7係圖3中延D方向之底面圖。Figure 7 is a bottom plan view of the extended D direction of Figure 3.

圖8係表示本實施形態所關連之第1照明部的照明區域與第2照明部的照明區域之說明圖。Fig. 8 is an explanatory view showing an illumination area of the first illumination unit and an illumination area of the second illumination unit in the embodiment.

圖9係表示在本實施形態中，使用上部照明機構照明時，晶片式LED的拍攝影像之說明圖。Fig. 9 is an explanatory view showing a captured image of the wafer type LED when the upper illumination unit is used for illumination in the embodiment.

圖10係表示在本實施形態中，使用下部照明機構照明時，晶片式LED的拍攝影像之說明圖。Fig. 10 is an explanatory view showing a captured image of the wafer type LED when the lower illumination unit is used for illumination in the embodiment.

圖11係表示在本實施形態中，使用上部照明機構及下部照明機構照明時，晶片或LED的拍攝影像之說明圖。Fig. 11 is an explanatory view showing a captured image of a wafer or an LED when the upper illumination unit and the lower illumination unit are used for illumination in the embodiment.

圖12係用於說明晶片式LED的形態之說明圖。Fig. 12 is an explanatory view for explaining a form of a wafer type LED.

圖13係表示藉由以往的檢查裝置所得到的拍攝影像之說明圖。Fig. 13 is an explanatory view showing a captured image obtained by a conventional inspection device.

1．．．檢查裝置1. . . Inspection device

5．．．支持構件5. . . Support component

6．．．相機6. . . camera

7．．．下部照明機構7. . . Lower lighting mechanism

8．．．判定部8. . . Judgment department

10．．．上部照明機構10. . . Upper lighting mechanism

11．．．第1照明部11. . . First lighting department

20．．．第2照明部20. . . Second lighting department

50．．．晶片式LED50. . . Wafer type LED

Claims (5)

一種晶片式LED檢查裝置，其係對於由具有透光性的基板、形成於該基板背面之不透光性的電極部、配置於前述基板的表面中央部之發光部、與被覆前述基板表面，並密封前述發光部之透光性的密封樹脂所構成，而該密封樹脂之至少覆蓋前述發光部的部分形成凸曲面狀之晶片式LED，偵測混入前述密封樹脂或附著於其表面的不透光性異物之檢查裝置，其特徵在於，包括：支持前述晶片式LED之板狀或薄片狀支持構件；配置於前述支持構件的上方，拍攝載置於該支持構件上的晶片式LED表面側影像之相機；相同地配置於前述支持構件的上方，照亮載置於該支持構件上的晶片式LED表面之上部照明機構；以及解析由前述相機拍攝到的影像，並判定前述異物的有無之判定部；前述上部照明機構係由：由在下面中心部具備圓形開口部且在頂部具備拍攝用的開口部之穹頂狀本體與配置於該穹頂本體內的複數個光源所構成，前述穹頂本體其內部凹曲面構成反射面，前述光源係在前述穹頂本體內部底面上沿其圓周方向等間隔配置而成並且往前述凹曲面照射光線，被前述凹曲面反射的光線由前述穹頂本體的下面開口部往下方照射的方式構成之第1照明部，與具有呈環狀的本體、與在該環狀本體的下面沿其圓周方 向等間隔配置並且往下方照射光線的複數個光源，照亮下方環狀區域而使其成為高照度區域之第2照明部所構成；前述第1照明部係間接照亮前述晶片式LED全部表面；前述第2照明部係以其環狀本體與前述第1照明部的穹頂本體成為同軸的方式配置於該第1照明部下方，而從其外方的斜上方至少照亮前述凸曲面部的外周部及包含其較外側之區域的環狀區域；前述相機配置於前述第1照明部的上方，透過前述穹頂本體的拍攝用開口部拍攝前述晶片式LED的表面影像。 A wafer type LED inspection device for a light-transmitting substrate, an opaque electrode portion formed on a back surface of the substrate, a light-emitting portion disposed at a central portion of a surface of the substrate, and a surface of the substrate And sealing the light-transmitting sealing resin of the light-emitting portion, and the portion of the sealing resin covering at least the light-emitting portion forms a convex-shaped wafer-shaped LED, and detecting that the sealing resin is mixed or adhered to the surface thereof The optical foreign matter inspection device includes: a plate-shaped or sheet-shaped support member that supports the wafer-type LED; and is disposed above the support member to image a wafer-type LED surface side image mounted on the support member a camera disposed similarly above the support member, illuminating an upper illumination mechanism of the wafer type LED surface mounted on the support member; and analyzing an image captured by the camera and determining whether the foreign object is present or not The upper illumination mechanism includes a circular opening at a center portion of the lower surface and an opening for imaging at the top. The body is formed by a plurality of light sources disposed in the dome body, wherein the dome body has a concave curved surface to form a reflecting surface, and the light source is disposed on the bottom surface of the dome body at equal intervals in the circumferential direction thereof. a concave portion is irradiated with light, and the light reflected by the concave curved surface is irradiated downward by the lower opening portion of the dome body, and has a body having an annular shape and a lower surface of the annular body. Circumferential side a plurality of light sources arranged at equal intervals and radiating light downward, illuminating the lower annular region to form a second illumination portion of the high illumination region; and the first illumination portion indirectly illuminating the entire surface of the wafer type LED The second illuminating unit is disposed below the first illuminating unit such that the annular body is coaxial with the dome main body of the first illuminating unit, and illuminates at least the convex curved surface portion obliquely from the outer side. The outer peripheral portion and the annular region including the outer side region; the camera is disposed above the first illumination portion, and the surface image of the wafer type LED is captured through the imaging opening of the dome body. 如申請專利範圍第1項所述之晶片式LED檢查裝置，其中前述第2照明部具備配置於其光源下方的環狀擴散透光膜。 The wafer type LED inspection device according to the first aspect of the invention, wherein the second illumination unit includes an annular diffusion light-transmissive film disposed under the light source. 如申請專利範圍第1或2項所述之晶片式LED檢查裝置，其中前述支持構件係由透明構件所構成，前述晶片式LED檢查裝置進一步具有配置於前述支持構件的下方，透過該支持構件照亮載置於該支持構件上的晶片式LED背面之下部照明機構。 The wafer type LED inspection device according to claim 1 or 2, wherein the support member is formed of a transparent member, and the wafer type LED inspection device further includes a support member disposed under the support member, and the support member is irradiated The illumination mechanism on the lower surface of the wafer type LED is placed on the support member. 如申請專利範圍第3項所述之晶片式LED檢查裝置，其中前述下部照明機構，係由配置於前述支持構件下方並與該支持構件平行，與該支持構件呈對向的一面為反射面的反射板所構成。 The wafer type LED inspection device according to claim 3, wherein the lower illumination mechanism is disposed below the support member and parallel to the support member, and a side opposite to the support member is a reflection surface. The reflector is composed of a reflector. 如申請專利範圍第4項所述之晶片式LED檢查裝置，其中前述反射板的反射面呈白色。The wafer type LED inspection apparatus according to claim 4, wherein the reflecting surface of the reflecting plate is white.
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TW201200864A (en) 2012-01-01
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CN102313750A (en) 2012-01-11
KR20120002429A (en) 2012-01-05

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