TWI519777B - Processing device, processing system and coordinate correction method - Google Patents
Processing device, processing system and coordinate correction method Download PDFInfo
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- TWI519777B TWI519777B TW100113161A TW100113161A TWI519777B TW I519777 B TWI519777 B TW I519777B TW 100113161 A TW100113161 A TW 100113161A TW 100113161 A TW100113161 A TW 100113161A TW I519777 B TWI519777 B TW I519777B
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- G—PHYSICS
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- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Description
本發明係有關於處理裝置、處理系統及座標補正方法。The present invention relates to a processing apparatus, a processing system, and a coordinate correction method.
習知，在對諸如玻璃基板等具有大處理對象面之基板進行檢查或測定等處理之處理裝置中，檢查/測定處理對象面之特定位置之際，依據登記於配方(recipe)之座標，移動可載置基板之台或檢查/測定單元。惟，登記於配方之對象圖形之座標與台上之實際之對象圖形之座標未必一致。是故，在如以下所示之專利文獻1中，將按照載置有基板之檢查台自台原點起之移動量的移動補正量預先記憶於基板移動時之配方，關於同一品種之基板，根據對所指定之座標資料加上移動補正量之座標資料，使基板移動。In a processing apparatus that performs processing such as inspection or measurement on a substrate having a large processing target surface such as a glass substrate, when a specific position of the processing target surface is inspected/measured, it is moved according to coordinates registered in a recipe. A table or an inspection/measurement unit on which the substrate can be placed. However, the coordinates of the object graph registered in the recipe may not coincide with the coordinates of the actual object graph on the stage. In the case of the patent document 1 shown below, the movement correction amount of the movement amount from the origin of the inspection table on which the substrate is placed is stored in advance in the recipe for moving the substrate, and the substrate of the same type is used. The coordinate data of the movement correction amount is added to the specified coordinate data to move the substrate.
專利文獻1 日本專利公開公報2002-107137號Patent Document 1 Japanese Patent Laid-Open Publication No. 2002-107137
然而，在上述習知之技術中，當登記於配方之對象圖形之座標從實際之對象圖形之座標偏離時，必須以手動界定實際之座標，以求出移動補正量。因此，習知之技術有易產生處理製程之增大及繁雜化，處理裝置之生產量易降低之問題。However, in the above-described conventional technique, when the coordinates of the object pattern registered in the recipe are deviated from the coordinates of the actual object pattern, the actual coordinates must be manually defined to obtain the movement correction amount. Therefore, the conventional technology has an problem that the processing process is prone to increase and complexity, and the throughput of the processing device is easily reduced.
是故，本發明係鑑於上述問題而發明者，其目的係提供可減低生產量之降低，並且自動地補正登記於配方之座標與實際座標之偏差之處理裝置、處理系統及座標補正方法。Accordingly, the present invention has been made in view of the above problems, and an object of the invention is to provide a processing apparatus, a processing system, and a coordinate correction method which can reduce the deviation of the throughput and automatically correct the deviation between the coordinates of the recipe and the actual coordinates.
為達成此目的，本發明之處理裝置係依據記憶有基板之處理對象之座標的配方，對載置於台上之前述基板之前述處理對象執行預定處理者，其特徵在於包含有實際座標界定機構及實際座標登記機構，該實際座標界定機構係界定載置於前述台上之前述基板之前述處理對象的實際座標者；該實際座標登記機構係將業經以前述實際座標界定機構界定之前述實際座標登記於前述配方者。In order to achieve the object, the processing apparatus of the present invention performs predetermined processing on the aforementioned processing object of the substrate placed on the stage according to the formulation of the coordinates of the object to be processed by the substrate, and is characterized in that the actual coordinate defining mechanism is included. And an actual coordinate registration mechanism that defines an actual coordinate of the aforementioned processing object of the aforementioned substrate placed on the stage; the actual coordinate registration mechanism is the actual coordinate defined by the actual coordinate defining mechanism Registered in the aforementioned formulator.
又，本發明之處理系統特徵在於包含有處理裝置及網路，該處理裝置係依據記憶有基板之處理對象之座標的配方，對載置於台上之前述基板之前述處理對象執行預定處理者；該網路係連接有複數個前述處理裝置者；前述處理裝置具有實際座標界定機構、實際座標登記機構及通信部，該實際座標界定機構係界定載置於前述台上之前述基板之前述處理對象的實際座標者；該實際座標登記機構係將業經以前述實際座標界定機構界定之前述實際座標登記於前述配方者；該通信部係將業經以前述實際座標登記機構登記前述實際座標之前述配方送出至網路者。Further, the processing system of the present invention is characterized in that it includes a processing device and a network, and the processing device executes a predetermined processor on the processing object of the substrate placed on the stage in accordance with a recipe in which the coordinates of the processing target of the substrate are stored. The network is connected to a plurality of the foregoing processing devices; the processing device has an actual coordinate defining mechanism, an actual coordinate registration mechanism, and a communication portion, the actual coordinate defining mechanism defining the foregoing processing of the substrate placed on the stage The actual coordinate object of the object; the actual coordinate registration mechanism registers the actual coordinates defined by the actual coordinate defining mechanism in the foregoing formulator; the communication department will register the aforementioned formula of the actual coordinate with the actual coordinate registration agency Send to the network.
又，本發明之座標補正方法係補正下述座標者，前述座標係登記在對載置於台上之基板之處理對象執行預定處理時使用之配方的前述處理對象之前述基板上之座標，該座標補正方法特徵在於具有實際座標界定步驟及實際座標登記步驟，該實際座標界定步驟係界定載置於前述台上之前述基板之前述處理對象的實際座標者；該實際座標登記步驟係將業經以前述實際座標界定步驟界定之前述實際座標登記於前述配方者。Further, in the coordinate correction method of the present invention, the coordinate is obtained by registering a coordinate on the substrate on the processing target of the recipe used for performing predetermined processing on the processing target of the substrate placed on the stage. The coordinate correction method is characterized by having an actual coordinate defining step and an actual coordinate registration step, the actual coordinate defining step defining an actual coordinate of the aforementioned processing object of the aforementioned substrate placed on the stage; the actual coordinate registration step is to The aforementioned actual coordinates defined by the aforementioned actual coordinate defining step are registered in the aforementioned formulator.
根據本發明，由於界定載置於台上之基板之處理對象之實際座標，且將此實際座標登記於配方，故可實現可減低生產量之降低，並且自動地補正登記於配方之座標與實際座標之偏差的處理裝置、處理系統及座標補正方法。According to the present invention, since the actual coordinates of the processing object of the substrate placed on the stage are defined, and the actual coordinates are registered in the recipe, it is possible to reduce the decrease in the throughput and automatically correct the coordinates and the actual registration in the recipe. Processing device, processing system, and coordinate correction method for coordinate deviation.
第1圖係顯示實施形態之基板檢查‧測定系統之概略結構的示意圖。Fig. 1 is a schematic view showing a schematic configuration of a substrate inspection and measurement system according to an embodiment.
第2圖係顯示實施形態之基板檢查‧測定裝置之概略結構的外觀圖。Fig. 2 is an external view showing a schematic configuration of a substrate inspection/measurement apparatus of the embodiment.
第3圖係顯示實施形態之搬送台上之基板與檢查‧測定單元之關係的概略示意圖。Fig. 3 is a schematic view showing the relationship between the substrate on the transfer table and the inspection/measurement unit in the embodiment.
第4圖係顯示實施形態之基板檢查‧測定裝置之配方作成動作之概略的流程圖。Fig. 4 is a flow chart showing the outline of the recipe preparation operation of the substrate inspection and measurement apparatus of the embodiment.
第5圖係用以說明實施形態之校準補正之概略圖。Fig. 5 is a schematic view for explaining calibration correction of the embodiment.
第6圖係顯示實施形態之樣品搜尋處理之具體例的流程圖。Fig. 6 is a flow chart showing a specific example of the sample search processing of the embodiment.
第7圖係顯示實施形態之周邊搜索處理之具體例的流程圖。Fig. 7 is a flow chart showing a specific example of the peripheral search processing of the embodiment.
第8(a)圖、第8(b)圖係用以說明實施形態之樣品拉入處理之圖。Fig. 8(a) and Fig. 8(b) are diagrams for explaining the sample drawing process of the embodiment.
第9圖係顯示實施形態之基板檢查‧測定系統之概略結構的示意圖。Fig. 9 is a schematic view showing a schematic configuration of a substrate inspection/measurement system of the embodiment.
第10圖係顯示實施形態之檢查‧測定動作之概略的流程圖。Fig. 10 is a flow chart showing the outline of the inspection and the measurement operation of the embodiment.
以下，將用以實施本發明之形態與圖式一同詳細說明。此外，在以下之說明中，各圖僅將形狀、大小、及位置關係概略地顯示至可理解本發明之內容之程度，因而，本發明非僅限於在各圖所例示之形狀、大小、及位置之關係者。又，後述例示之數值僅為本發明較佳之例，本發明非以例示之數值為限者。Hereinafter, the form for carrying out the invention will be described in detail together with the drawings. In addition, in the following description, each figure only schematically shows the shape, size, and positional relationship to the extent that the content of the present invention can be understood. Therefore, the present invention is not limited to the shapes, sizes, and The relationship of the location. Further, the numerical values exemplified below are merely preferred examples of the present invention, and the present invention is not limited by the numerical values exemplified.
首先，參照圖式，詳細說明本發明一實施形態之處理裝置、處理系統、座標補正方法及座標補正程式。此外，在以下之說明中，處理裝置可舉檢查‧測定玻璃基板等基板之基板檢查‧測定裝置為例。惟，不限於此，可適用以雷射照射等修復基板之缺陷處之所謂修正裝置等執行對基板之處理之各種處理裝置。First, a processing apparatus, a processing system, a coordinate correction method, and a coordinate correction program according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, in the following description, the processing apparatus can be exemplified by the inspection of the substrate and the measurement of the substrate such as the glass substrate. However, the present invention is not limited thereto, and various processing apparatuses that perform processing on the substrate by a so-called correction device that repairs defects of the substrate such as laser irradiation can be applied.
第1圖係顯示本實施形態之基板檢查‧測定系統之概略結構的示意圖。如第1圖所示，基板檢查‧測定系統包含有1個以上之基板檢查‧測定裝置10A、10B、...(以下，令不需區別時之基板檢查‧測定裝置之標號為10)、對基板檢查及測定裝置10A、10B、...搬入搬出基板之基板搬入搬出部15A、15B、...(以下，令不需區別時之基板搬入搬出部之標號為15)、連接有1個以上之基板檢查‧測定裝置10及以1個以上之基板搬入搬出部15之網路110、連接於網路110之主電腦(PC)100。此外，網路110可適用區域網路(LAN)、網際網路或專線等各種網路。Fig. 1 is a schematic view showing a schematic configuration of a substrate inspection/measurement system of the present embodiment. As shown in Fig. 1, the substrate inspection ‧ measurement system includes one or more substrate inspections ‧ measurement devices 10A, 10B, ... (hereinafter, the substrate inspection when no distinction is required, the measurement device is 10) The substrate loading/unloading units 15A, 15B, ... for the substrate inspection and measurement devices 10A, 10B, ... are carried in and out of the substrate (hereinafter, the substrate loading/unloading portion is 15 when there is no need to distinguish), and the connection is 1 More than one substrate inspection ‧ the measuring device 10 and the network 110 in which one or more substrates are carried in and out of the substrate 15 and the host computer (PC) 100 connected to the network 110. In addition, the network 110 can be applied to various networks such as a local area network (LAN), an internet, or a dedicated line.
各基板檢查及測定裝置10具有搬送檢查‧測定對象之基板之搬送台13、控制搬送台13之台控制器12、在特定位置檢查‧測定搬送台13上之基板之檢查‧測定單元14、控制台控制器12及檢查‧測定單元14之控制電腦(PC)11。控制PC11具有處理以檢查‧測定單元14所取得之檢查‧測定結果(例如圖像)之處理部11b、記憶圖像資料、配方或各種程式及參數等之記憶部11c、擔負與其他基板檢查‧測定裝置10、基板搬入搬出部15及主PC100之通信之通信部11d、執行控制PC11內之各部之動作及各種處理之控制部11a。Each of the substrate inspection and measurement apparatuses 10 includes a conveyance inspection ‧ a substrate transfer table 13 to be measured, a table controller 12 that controls the transfer table 13 , a check at a specific position ‧ a test of the substrate on the measurement transfer table 13 , a measurement unit 14 , and control The controller 12 and the control computer (PC) 11 of the inspection unit 14 are inspected. The control PC 11 has a memory unit 11c that processes the processing unit 11b, the memory image data, the recipe, various programs, and parameters, etc., which are inspected by the measurement unit 14 and the measurement result (for example, an image), and performs inspection with other substrates. The measuring device 10, the communication unit 11d for communicating between the substrate loading/unloading unit 15 and the host PC 100, and the control unit 11a for controlling the operation of each unit in the PC 11 and various processes.
顯示檢查‧測定對象(樣品)相對於基板之位置的座標(以下稱為檢查‧測定座標)、或配方登記時之拍攝之光量及倍率等資訊作為檢查‧測定時之參數來登記於配方。此配方從主PC100或其他基板檢查‧測定裝置10藉由網路110，發送至各基板‧測定裝置10。即，在複數個基板檢查‧測定裝置10共有配方。各基板檢查‧測定裝置10將所接收或所取得之配方保持於記憶部11c內，並依需要讀取。The display inspection ‧ the coordinates of the position of the measurement target (sample) with respect to the substrate (hereinafter referred to as inspection ‧ measurement coordinates), or the amount of light and the magnification of the image at the time of registration of the recipe are registered as a parameter in the inspection and measurement. This recipe is inspected from the main PC 100 or other substrate. The measuring device 10 is sent to each substrate ‧ measuring device 10 via the network 110. That is, in a plurality of substrate inspections, the measurement device 10 has a recipe. Each substrate inspection ‧ The measuring device 10 holds the received or acquired recipe in the memory unit 11c and reads it as needed.
在此，使用圖式，來詳細地說明基板檢查‧測定裝置10之概略結構。第2圖係顯示本實施形態之基板檢查‧測定裝置之概略結構的外觀圖。如第2圖所示，在基板檢查‧測定裝置10，搬送台13固定於架台16。架台16可以組合有鋼材之框架等構成。但亦可使用塊狀大理石等。又，於架台16固定用以將如顯微鏡等檢查‧測定單元14以可沿著檢查‧測定線L13移動之狀態保持之高架台(gantry stage)14a。亦可於架台16與設置面(例如地板)間設以彈簧或油壓阻尼器等構成之振動吸收設備17。藉此結構，可抑制搬送台13及檢查‧測定單元14之振動。此種基板檢查‧測定裝置10收容於以外層18及風扇過濾器單元(FFU：Fan Filter Unit)19形成之無塵室內。Here, the schematic configuration of the substrate inspection ‧ measuring device 10 will be described in detail using a drawing. Fig. 2 is an external view showing a schematic configuration of a substrate inspection/measurement apparatus of the present embodiment. As shown in FIG. 2, in the substrate inspection ‧ the measuring device 10, the transfer table 13 is fixed to the gantry 16. The gantry 16 can be constructed by combining a frame of steel or the like. However, block marble or the like can also be used. Further, a gantry stage 14a for holding the inspection unit 14 such as a microscope and holding it in a state of being movable along the inspection/measurement line L13 is fixed to the gantry 16. A vibration absorbing device 17 composed of a spring or a hydraulic damper or the like may be provided between the gantry 16 and the installation surface (for example, the floor). With this configuration, the vibration of the transfer table 13 and the inspection/measurement unit 14 can be suppressed. Such a substrate inspection ‧ the measuring device 10 is housed in a clean room formed by the outer layer 18 and the fan filter unit (FFU: Fan Filter Unit) 19.
接著，使用圖式，來詳細地說明搬送台13上之基板W與檢查‧測定單元14之關係。第3圖係顯示本實施形態之搬送台上之基板與檢查‧測定單元之關係的概略示意圖。惟，在第3圖中，將搬送台13簡化顯示。Next, the relationship between the substrate W on the transfer table 13 and the inspection/measurement unit 14 will be described in detail using a drawing. Fig. 3 is a schematic view showing the relationship between the substrate on the transfer table and the inspection/measurement unit of the embodiment. However, in the third drawing, the conveyance table 13 is simplified in display.
如第3圖所示，搬送台13上之基板W沿著搬入搬出方向D1在搬送台13上移動。於搬送台13之上面設有無數之孔。藉從此孔吹出空氣，可使搬送台13之基板W在不直接接觸搬送台13下移動(浮起搬送)。在搬送台13上之基板W之移動可以在來自控制PC11之控制下動作之台控制器12控制。舉例言之，台控制器12具有與搬送台13旁邊相鄰配置，在來自控制PC11之控制下，往搬入搬出方向D1移動之移送單元(圖中未示)。基板W藉端部或中央部(重心位置)等至少1處支承於移送單元，而可根據控制PC11之控制，在搬送台13上沿著搬入搬出方向D1移動。又，除此之外，亦可構造成於搬送台13上面設複數個驅動輥或活輥，藉此輥使搬送台13上之基板W在不直接接觸搬送台13下移動。As shown in FIG. 3, the substrate W on the transfer table 13 moves on the transfer table 13 in the loading/unloading direction D1. There are numerous holes on the top of the transfer table 13. By blowing air from the hole, the substrate W of the transfer table 13 can be moved (floating and transporting) without directly contacting the transfer table 13. The movement of the substrate W on the transfer table 13 can be controlled by the table controller 12 that operates under the control of the control PC 11. For example, the stage controller 12 has a transfer unit (not shown) that is disposed adjacent to the side of the transfer table 13 and that moves in the carry-in/out direction D1 under the control of the control PC 11. The substrate W is supported by the transfer unit by at least one of the end portion or the center portion (center of gravity), and can be moved along the carry-in/out direction D1 on the transfer table 13 under the control of the control PC 11. Further, in addition to this, a plurality of driving rollers or a movable roller may be disposed on the conveying table 13, whereby the roller moves the substrate W on the conveying table 13 without directly contacting the conveying table 13.
另一方面，檢查‧測定單元14一面沿著配置成長向D2相對於搬入搬出方向D1垂直之高架台14a的長向D2移動，一面檢查‧測定搬送台13上之基板W。因而，檢查‧測定單元14在檢查‧測定線L13上之某位置檢查‧測定基板W。檢查‧測定單元14之移動可以安裝於高架台14a之線性馬達驅動設備、或安裝於檢查‧測定單元14之自走設備實現。線性馬達驅動設備或自走設備之驅動可以控制PC11控制。此外，高架台14a自身亦可構造成相對於基板W於搬入搬出方向D1及/或長向D2移動。此時，使高架台14a移動之線性馬達設備或自走設備等移動設備可以控制PC11控制。On the other hand, the inspection unit ‧ measures the substrate W on the transfer table 13 while moving along the longitudinal direction D2 of the elevated stage 14a perpendicular to the loading/unloading direction D1. Therefore, the inspection/measurement unit 14 checks the ‧ measurement substrate W at a certain position on the inspection ‧ measurement line L13 Inspection ‧ The movement of the measuring unit 14 can be carried out by a linear motor driving device mounted on the overhead table 14a or a self-propelled device mounted on the inspection unit ‧ The drive of the linear motor drive or self-propelled device can control the PC11 control. Further, the overhead platform 14a itself may be configured to move in the loading/unloading direction D1 and/or the longitudinal direction D2 with respect to the substrate W. At this time, the mobile device such as a linear motor device or a self-propelled device that moves the overhead stage 14a can control the PC 11 control.
在此，可登記於配方之檢查‧測定座標有依據基板設計資訊之座標(以下稱為設計座標)及基板W上之實際之座標(以下稱為實際座標)至少2種。設計座標係以基板W之設上之某一位置(例如校準標記位置)為原點之設計階段之座標。另一方面，實際座標係以實際之基板W之某一位置(例如校準標記位置)為原點而測定的座標。惟，藉將實際座標相對於設計座標之偏差量(例如後述之樣品拉入處理或周邊搜索處理之基板及檢查‧測定單元14之移動量、或設計座標與實際座標之差等)作為補正量而預先登記於配方來取代直接包含實際座標，實質上亦可獲得與登記實際座標時相同之結構。Here, it can be registered in the inspection of the recipe. The measurement coordinates include at least two types of coordinates (hereinafter referred to as design coordinates) based on the substrate design information and actual coordinates (hereinafter referred to as actual coordinates) on the substrate W. The design coordinates are the coordinates of the design stage of the origin with a certain position on the substrate W (for example, the position of the calibration mark). On the other hand, the actual coordinates are coordinates measured with the actual position of the substrate W (for example, the position of the calibration mark) as the origin. However, the amount of deviation of the actual coordinates with respect to the design coordinates (for example, the substrate and inspection of the sample pull-in process or the peripheral search process described later, the movement amount of the measurement unit 14 or the difference between the design coordinates and the actual coordinates) is used as the correction amount. Pre-registered in the recipe instead of directly including the actual coordinates, substantially the same structure as when the actual coordinates are registered.
接著，就本實施形態之基板檢查‧測定裝置10之動作，使用圖式，來詳細地說明。本實施形態之動作包含作成配方之動作(配方作成動作)、使用配方，檢查‧測定基板之動作(檢查‧測定動作)。Next, the operation of the substrate inspection/measurement apparatus 10 of the present embodiment will be described in detail using a drawing. The operation of the present embodiment includes the operation of formulating a recipe (recipe creation operation), the use of a recipe, and the operation of the measurement substrate (inspection ‧ measurement operation).
第4圖係顯示本實施形態之基板檢查‧測定裝置之配方作成動作之概略的流程圖。此外，顯示檢查‧測定對象(樣品)之基板上之位置的座標(設計座標)作為檢查‧測定座標而預先登記於在配方作成動作所作成之配方。在以下之說明中，著眼於基板檢查‧測定裝置10之控制PC11之控制部11a的動作。Fig. 4 is a flow chart showing the outline of the recipe creation operation of the substrate inspection/measurement apparatus of the present embodiment. Further, the coordinates (design coordinates) indicating the position on the substrate of the measurement target (sample) are displayed as a test ‧ measurement coordinate, and are registered in advance in the recipe creation operation. In the following description, attention is paid to the substrate inspection ‧ the operation of the control unit 11 a of the control device 10 of the control device 10 .
如第4圖所示，在本實施形態之配方作成動作，控制部11a首先依據從外部電腦等所輸入之基板設計資訊，將作為檢查‧測定對象之樣品之設計上的座標作為檢查‧測定座標(設計座標)而登記於配方(步驟S101)。此外，此檢查‧測定座標(設計座標)之登記可為自動登記，亦可為用戶操作之手動登記。又，配方可為預先作成之檔案(包含空檔案)，亦可為在此步驟新作成之檔案。As shown in Fig. 4, in the recipe creation operation of the present embodiment, the control unit 11a first determines the coordinates of the design of the sample to be inspected and measured based on the substrate design information input from an external computer or the like. (Design coordinates) are registered in the recipe (step S101). In addition, this check ‧ the registration of the coordinates (design coordinates) can be automatically registered, or can be manually registered by the user. In addition, the recipe can be a pre-made file (including an empty file), or a newly created file at this step.
接著，控制部11a根據來自主PC100之指示，從基板搬入搬出部15將基板W搬入至搬送台13上(步驟S102)，將此所搬入之基板W以機械方式定位(校準基板)(步驟S103)。藉此，可粗略調整基板W相對於台控制器12之移送單元之位置。然後，控制部11a將檢查‧測定單元14之光量及倍率切換成進行用以補正基板W之對搬送台13之位置偏差的校準補正之際之光量及倍率(步驟S104)，然後，藉驅動台控制器12，將基板W移動至搬送台13上之預定位置(校準標記位置)(步驟S105)。接著，藉控制部11a適當驅動台控制器12及檢查‧測定單元14，而測定形成於基板W之校準標記，從以此測定所得之校準標記之位置，算出移動後基板W之實際之位置相對於應有基板W之位置之偏差量，依據此偏差量，補正相對於基板W之座標系(校準補正)(步驟S106)。Next, the control unit 11a carries the substrate W from the substrate loading/unloading unit 15 to the transfer table 13 in accordance with an instruction from the host PC 100 (step S102), and mechanically positions (aligns the substrate) the loaded substrate W (step S103). ). Thereby, the position of the substrate W relative to the transfer unit of the stage controller 12 can be roughly adjusted. Then, the control unit 11a switches the light amount and the magnification of the inspection/measurement unit 14 to the amount of light and the magnification at the time of correcting the calibration for correcting the positional deviation of the substrate W to the transfer table 13 (step S104), and then borrows the drive table. The controller 12 moves the substrate W to a predetermined position (calibration mark position) on the transfer table 13 (step S105). Next, the control unit 11a appropriately drives the stage controller 12 and the inspection unit ‧ the measurement unit 14 to measure the calibration mark formed on the substrate W, and calculates the actual position of the substrate W after the movement from the position of the calibration mark obtained by the measurement. Based on the amount of deviation of the position of the substrate W, the coordinate system (calibration correction) with respect to the substrate W is corrected based on the amount of deviation (step S106).
基板W之座標系之偏差因載置基板W時之定位精確度、台控制器12之移動之精確度、在製造過程中，相對於基板W自身所產生之設計尺寸之偏差或基板檢查‧測定裝置10自身具有之變形(X-Y軸之垂直相交性、旋轉度、各軸之伸縮、凹痕、偏轉等)等而產生。因而，在步驟S106之校準補正，可補正載置於搬送台13上之基板W自身之座標系相對於控制PC11之控制之座標系的偏差。使用第5圖所示之例，來說明具體之例。第5圖係用以說明本實施形態之校準補正之概略圖。在第5圖所示之例中，於位於基板W之對角之角落附近的預定位置形成有2個校準標記(M1、M2)。當令存在於移動後應有基板W之位置時之基板為基板Wi，令移動後之實際之基板W為基板Wr時，控制部11a算出基板Wr之校準標記M1r相對於基板Wi之校準標記M1i之偏差量(△x1,△y1)，同時，算出基板Wr之校準標記M2r相對於基板Wi之校準標記M2i之偏差量(△x2,△y2)。然後，控制部11a從各校準標記(M1、M2)之偏差量(△x1,△y1)及(△x2,△y2)，算出實際之基板Wr相對於理想位置(基板Wi之位置)之x方向之偏差量(△x)、y方向之偏差量(△y)及旋轉量(θ)，依據此值(△x,△y,θ)，補正實際之基板Wr之座標系。藉此，可補正因校準錯誤而產生為偏位之基板W自身之位置偏差。此外，即使藉步驟S105之移動，仍無法以檢查‧測定單元14拍攝校準標記時，亦可藉進行後述之周邊搜索處理(參照第7圖)，搜尋校準標記。The deviation of the coordinate system of the substrate W is determined by the positioning accuracy when the substrate W is placed, the accuracy of the movement of the stage controller 12, the deviation of the design size with respect to the substrate W itself during the manufacturing process, or the substrate inspection. The device 10 itself is deformed (vertical intersection of the XY axes, degree of rotation, expansion and contraction of each axis, dents, deflection, etc.). Therefore, in the calibration correction in step S106, the deviation of the coordinate system of the substrate W itself placed on the transfer table 13 with respect to the coordinate system controlled by the control PC 11 can be corrected. A specific example will be described using the example shown in FIG. Fig. 5 is a schematic view for explaining calibration correction in the embodiment. In the example shown in Fig. 5, two alignment marks (M1, M2) are formed at predetermined positions near the corners of the opposite corners of the substrate W. When the substrate which is present at the position where the substrate W is moved after the movement is the substrate Wi, and the actual substrate W after the movement is the substrate Wr, the control portion 11a calculates the calibration mark M1r of the substrate Wr with respect to the calibration mark M1i of the substrate Wi. The amount of deviation (Δx1, Δy1) is calculated, and the amount of deviation (Δx2, Δy2) between the calibration mark M2r of the substrate Wr and the calibration mark M2i of the substrate Wi is calculated. Then, the control unit 11a calculates the actual substrate Wr from the ideal position (the position of the substrate Wi) from the deviation amounts (Δx1, Δy1) and (Δx2, Δy2) of the respective calibration marks (M1, M2). The amount of deviation (Δx) in the x direction, the amount of deviation (Δy) in the y direction, and the amount of rotation (θ), based on this value (Δx, Δy, θ), correct the coordinate system of the actual substrate Wr. Thereby, the positional deviation of the substrate W itself which is displaced due to the calibration error can be corrected. Further, even if the calibration unit is not able to perform the inspection by the movement of the step S105, the measurement unit 14 may search for the calibration mark by performing a peripheral search process (see FIG. 7) which will be described later.
回到第4圖來說明。當如以上補正基板W之座標系時，接著控制部11a判定用戶是否已藉由圖中未示之輸入部輸入自動補正登記於配方之檢查‧測定座標的指示(步驟S107)，於未輸入時(步驟S107之否)，便逕自結束本動作。另一方面，於輸入了自動補正之指示時(步驟S107之是)，控制部11a將檢查‧測定單元14之光量及倍率切換成檢查‧測定時之光量及倍率(步驟S108)。接著，控制部11a在登記於配方之檢查‧測定座標(設計座標)中選擇1個(步驟S109)，然後，藉驅動台控制器12及檢查‧測定單元14，使所選擇之檢查‧測定座標(設計座標)移動至檢查‧測定區域之諸如中央(步驟S110)。Go back to Figure 4 to illustrate. When the coordinate system of the substrate W is corrected as described above, the control unit 11a determines whether or not the user has input an automatic registration correction test registered in the recipe and an instruction to measure the coordinates (step S107) by the input unit (not shown). (No in step S107), the operation ends. On the other hand, when the instruction of the automatic correction is input (YES in step S107), the control unit 11a switches the amount of light and the magnification of the inspection/measurement unit 14 to the amount of light and the magnification at the time of measurement and measurement (step S108). Next, the control unit 11a selects one of the inspection ‧ measurement coordinates (design coordinates) registered in the recipe (step S109), and then, by the drive table controller 12 and the inspection ‧ measurement unit 14, the selected inspection ‧ the measurement coordinates (Design coordinates) Move to the inspection ‧ the measurement area such as the center (step S110).
之後，控制部11a執行搜尋檢查‧測定對象之圖形(樣品)之樣品搜尋處理(步驟S111)。於第6圖顯示此樣品搜尋處理之具體例。如第6圖所示，在樣品搜尋處理中，控制部11a首先驅動檢查‧測定單元14，來拍攝基板W之檢查‧測定區域(步驟S201)。此時，檢查‧測定單元14以與檢查‧測定時之光量及倍率相同之光量及倍率測定基板W。然後，控制部11a藉以處理部11b解析在步驟S201所得之圖像，可搜尋此圖像是否含有樣品之圖形(步驟S202)。步驟S202之搜尋圖形之結果，於圖像含有對象樣品之圖形時(步驟S203之是)，控制部11a返回至第4圖所示之動作，另一方面，於圖像未含有對象樣品之圖形時(步驟S203之否)，控制部11a執行在與包含選擇中之檢查‧測定座標之檢查‧測定區域相鄰之周邊區域搜尋樣品之周邊搜索處理(步驟S204)。Thereafter, the control unit 11a performs a sample search process of the search (inspection) and the pattern (sample) of the measurement target (step S111). A specific example of this sample search processing is shown in Fig. 6. As shown in Fig. 6, in the sample search processing, the control unit 11a first drives the inspection/measurement unit 14 to take an inspection of the substrate W and the measurement area (step S201). At this time, the inspection unit ‧ the measurement unit 14 measures the substrate W by the same amount of light and the magnification as the amount of light and the magnification at the time of the measurement. Then, the control unit 11a analyzes the image obtained in step S201 by the processing unit 11b, and can search for whether or not the image contains the pattern of the sample (step S202). As a result of the search pattern in step S202, when the image contains the pattern of the target sample (YES in step S203), the control unit 11a returns to the operation shown in Fig. 4, and on the other hand, the image does not contain the image of the target sample. When the control unit 11a executes the peripheral search processing for searching for a sample in the peripheral region adjacent to the inspection ‧ measurement region including the selected inspection ‧ measurement coordinates (step S204)
在此，於第7圖顯示此周邊搜索處理之具體例。如第7圖所示，在周邊搜索處理中，控制部11a首先在相鄰成包圍包含選擇中之檢查‧測定座標之檢查‧測定區域的8個周邊區域中，依據預先決定之順序，選擇其中任一個，為映照此所選擇之區域，而驅動台控制器12及檢查‧測定單元14，移動至所選擇之周邊區域(步驟S301)。然後，控制部11a驅動檢查‧測定單元14，以拍攝基板W之目前之檢查‧測定區域(步驟S302)。此時，檢查‧測定單元14以與檢查‧測定時之光量及倍率相同之光量及倍率，測定基板W。接著，控制部11a藉以處理部11b解析在步驟S302所得之圖像，搜尋此圖像是否含有樣品之圖形(步驟S303)。步驟S303之搜尋圖形之結果，於圖像含有對象樣圖之圖形時(步驟S304之是)，控制部11a返回第6圖所示之動作。另一方面，圖像未含有對象樣之圖形時(步驟S304之否)，控制部11a判定是否搜尋完所有之周邊區域(步驟S305)，於未搜尋完畢時(步驟S305之否)，返回至步驟S301，根據預先決定之順序，選擇下個周邊區域。另一方面，當選擇完所有之周邊區域時(步驟S305之是)，控制部11a返回至第6圖所示之動作。Here, a specific example of this peripheral search processing is shown in FIG. As shown in Fig. 7, in the peripheral search processing, the control unit 11a first selects among the eight surrounding areas adjacent to the inspection ‧ measurement area including the selected check ‧ measurement coordinates, in accordance with a predetermined order In either case, in order to reflect the selected area, the drive table controller 12 and the inspection/measurement unit 14 are moved to the selected peripheral area (step S301). Then, the control unit 11a drives the inspection/measurement unit 14 to take a picture of the current inspection ‧ measurement area of the substrate W (step S302). At this time, the inspection unit ‧ the measurement unit 14 measures the substrate W by the same amount of light and the magnification as the amount of light and the magnification at the time of the measurement. Next, the control unit 11a analyzes the image obtained in step S302 by the processing unit 11b, and searches for whether or not the image contains a pattern of the sample (step S303). As a result of the search pattern in step S303, when the image contains the pattern of the target image (YES in step S304), the control unit 11a returns to the operation shown in Fig. 6. On the other hand, when the image does not contain the target pattern (NO in step S304), the control unit 11a determines whether or not all the surrounding areas have been searched (step S305), and when the search is not completed (NO in step S305), returns to In step S301, the next surrounding area is selected according to a predetermined order. On the other hand, when all the peripheral areas have been selected (YES in step S305), the control unit 11a returns to the operation shown in Fig. 6.
回到第6圖說明。如以上進行，當界定對應於選擇中之檢查‧測定座標之樣品時，控制部11a返回至第4圖所示之動作。接著回到第4圖來說明。在步驟S111，當搜尋處理完畢時，接著，控制部11a執行將檢查及測定區域內所映出之樣品拉入至此檢查‧測定區域之中央之樣品拉入處理(步驟S112)。具體言之，如第8圖所示之例，控制部11a驅動台控制器12及檢查‧測定單元14，俾使圖像所含之特定樣品MD(參照第8(a)圖)，位於檢查‧測定區域IG之中央(參照第8(b)圖)。此外，第8圖係用以說明本實施形態之樣品拉入處理之圖。在第8圖中，BL係形成於基板W之位元線，WL係形成於基板W之字線。因而，在此例中，令連接位元線BL與字線WL之節點部份之圖形為檢查‧測定對象的樣品。Go back to Figure 6 for illustration. As described above, when the sample corresponding to the inspection ‧ measurement coordinate selected is selected, the control unit 11 a returns to the operation shown in FIG. 4 . Then return to Figure 4 to illustrate. In step S111, when the search processing is completed, the control unit 11a then performs a sample pull-in process of pulling the sample reflected in the inspection and measurement area into the center of the inspection/measurement area (step S112). Specifically, as shown in Fig. 8, the control unit 11a drives the stage controller 12 and the inspection/measurement unit 14, and causes the specific sample MD included in the image (see Fig. 8(a)) to be inspected. ‧The center of the measurement area IG (see Figure 8(b)). Further, Fig. 8 is a view for explaining the sample drawing process of the present embodiment. In Fig. 8, BL is formed on the bit line of the substrate W, and WL is formed on the word line of the substrate W. Therefore, in this example, the pattern of the node portion connecting the bit line BL and the word line WL is a sample for checking the object to be measured.
回到第4圖來說明。如使用第8圖所說明，當將對象樣品拉入至檢查‧測定區域IG之中央時，接著控制部11a以處理部11b解析拉入後以檢查‧測定單元14所拍攝之圖像，而測定圖像之圖形之線寬或重疊(步驟S113)，並且，界定拉入後之樣品之實際座標，且將此實際座標作為檢查‧測定座標而登記於配方(步驟S114：實際座標界定機構/步驟/處理、實際座標登記機構/步驟/處理)。即，第1圖之控制部11a具有作為界定拉入後之樣品之實際座標，且將此實際座標作為檢查‧測定座標而登記於配方之實際座標界定機構以及實際座標登記機構之功能。此時，亦可將以解析所得之線寬或重疊一併登記於配方。接著，控制部11a判定對登記於配方之所有檢查‧測定座標之補正是否完畢(步驟S115)，於完畢時(步驟S115之是)，結束本動作。另一方面，於未完畢時(步驟S115之否)，控制部11a返回至步驟S109，之後，執行同樣之動作。Go back to Figure 4 to illustrate. As described with reference to Fig. 8, when the target sample is pulled into the center of the inspection ‧ measurement area IG, the control unit 11a analyzes the image taken by the measurement unit 14 after analyzing the pull-in by the processing unit 11b, and measures The line width or overlap of the graphics of the image (step S113), and the actual coordinates of the sample after the drawing is defined, and the actual coordinates are registered as the inspection ‧ measurement coordinates in the recipe (step S114: actual coordinate defining mechanism / step / Processing, actual coordinate registration mechanism / step / processing). That is, the control unit 11a of Fig. 1 has a function of defining the actual coordinates of the sample after the drawing, and registering the actual coordinates as the inspection ‧ measurement coordinates in the actual coordinate defining mechanism of the recipe and the actual coordinate registration mechanism. At this time, the line width or the overlap obtained by the analysis may be registered in the recipe. Next, the control unit 11a determines whether or not the correction of all the inspection ‧ measurement coordinates registered in the recipe is completed (step S115), and when it is completed (YES in step S115), the operation is terminated. On the other hand, when it is not completed (NO in step S115), the control unit 11a returns to step S109, and thereafter performs the same operation.
如以上進行而作成之配方Rcp如第9圖所示，藉由網路110送至其他之基板檢查‧測定裝置10來共有。此時，如在第9圖以虛線所示，配方Rcp亦可藉由連接於網路110之主PC100配送至其他基板檢查‧測定裝置10。此外，第9圖係顯示本實施形態之基板檢查‧測定系統之概略結構的示意圖。The recipe Rcp prepared as described above is sent to the other substrate inspection and measurement device 10 by the network 110 as shown in Fig. 9. At this time, as shown by a broken line in FIG. 9, the recipe Rcp can also be distributed to the other substrate inspection apparatus 10 by the host PC 100 connected to the network 110. In addition, Fig. 9 is a schematic view showing a schematic configuration of a substrate inspection/measurement system of the present embodiment.
接著，就使用以其他基板‧測定裝置10所作成之格1，檢查‧測定基板W時之基板檢查及測定裝置10的動作，使用圖式，來詳細地說明。第10圖係顯示本實施形態之檢查‧測定動作之概略的流程圖。此外，各基板檢查‧測定裝置10係保持有在任一基板檢查‧測定裝置10所作成之配方者。Next, the operation of the substrate inspection and measurement device 10 when the substrate W is measured by using the other substrate ‧ the measurement device 10 is examined in detail, and will be described in detail using a drawing. Fig. 10 is a flow chart showing the outline of the inspection and measurement operation of the present embodiment. In addition, each substrate inspection ‧ the measuring device 10 holds a recipe prepared by any one of the substrate inspections and the measurement device 10 .
如第10圖所示，在本實施形態之檢查‧測定動作，控制部11a藉執行與第4圖之步驟S102~S106相同之動作，進行從基板搬入搬出部15搬入之基板W之校準補正(步驟S401~S405)。接著，控制部11a藉執行與第4圖之步驟S108~S115相同之動作，對登記於配方之所有檢查‧測定座標之補正完畢(步驟S406~S413)。惟，在步驟S407所示之動作中，於配方登記有2種檢查‧測定座標(設計座標及實際座標)時，控制部11a選擇實際座標。又，步驟S411所示之動作亦可省略。再者，在步驟S412，不將拉入後之樣品之檢查‧測定座標(實際座標)登記於配方，而暫時記憶於記憶部11c(參照第1圖)等記憶體。As shown in Fig. 10, in the inspection/measurement operation of the present embodiment, the control unit 11a performs calibration correction of the substrate W carried in from the substrate loading/unloading unit 15 by performing the same operations as steps S102 to S106 of Fig. 4 ( Steps S401 to S405). Next, the control unit 11a performs the same operations as those of steps S108 to S115 in Fig. 4, and completes the correction of all the inspections ‧ registered coordinates registered in the recipe (steps S406 to S413). However, in the operation shown in step S407, when two kinds of inspections ‧ measurement coordinates (design coordinates and actual coordinates) are registered in the recipe, the control unit 11a selects the actual coordinates. Further, the operation shown in step S411 may be omitted. Further, in step S412, the test ‧ measurement coordinates (actual coordinates) of the sample after the pull-in is not registered in the recipe, and the memory is temporarily stored in the memory portion 11c (see FIG. 1).
如以上，當對登記於配方之所有檢查‧測定座標，補正完畢時，接著，控制部11a在對登記於配方之所有檢查‧測定座標之處理中，判定是否未產生無法搜尋樣品等錯誤(步驟S414)，於錯誤不存在時(步驟S414之是)，將在步驟S412暫時記憶之檢查‧測定座標(實際座標)登記於配方(步驟S415)，之後，結束本動作。另一方面，在對任一檢查‧測定座標之處理中，產生錯誤時(步驟S414之否)，控制部11a放棄在步驟S412中暫時記憶於記憶體等之檢查‧測定座標(實際座標)(步驟S416)，之後，結束本動作。如此，藉以在對所有檢查‧測定座標之處理未產生錯誤為條件，將重新實測之檢查‧測定座標(實際座標)登記於配方，可防止包含錯誤之檢查‧測定座標登記於配方。此外，步驟S416之動作亦可省略。As described above, when all the inspections and the measurement coordinates registered in the recipe are completed and the correction is completed, the control unit 11a determines whether or not the sample cannot be searched for errors in the process of measuring all the coordinates registered in the recipe. In S414), when the error does not exist (YES in step S414), the test ‧ the measurement coordinate (actual coordinate) temporarily memorized in step S412 is registered in the recipe (step S415), and thereafter, the operation is terminated. On the other hand, when an error occurs in the process of measuring the coordinates of any of the inspections ‧ (No in step S414), the control unit 11a discards the test ‧ measured coordinates (actual coordinates) temporarily stored in the memory or the like in step S412 ( Step S416), after that, the action is ended. In this way, it is possible to register the re-measurement test ‧ the measurement coordinates (actual coordinates) in the recipe, and to prevent the inclusion of the error check ‧ the measurement coordinates are registered in the recipe, on the condition that no error is generated in the processing of all the inspections and the measurement coordinates. Further, the action of step S416 can also be omitted.
如以上，在本實施形態中，由於自動地界定載置於搬送台13上之基板W之樣品之實際座標，且將此實際座標登記於配方，故可減低生產量之降低，並且，可自動地補正登記於配方之座標與實際座標之偏差。As described above, in the present embodiment, since the actual coordinates of the sample of the substrate W placed on the transfer table 13 are automatically defined, and the actual coordinates are registered in the recipe, the reduction in the throughput can be reduced, and the automatic reduction can be performed automatically. The correction is applied to the deviation between the coordinates of the formula and the actual coordinates.
又，由於在複數個基板檢查及處理裝置10共有如以上所作成/補正之配方，可省略各基板檢查‧測定裝置10之更新處理(檢查‧測定座標之補正/更新)，故可更減低生產量之降低，並且，可自動地補正登記於配方之座標與實際座標之偏差。Further, since the plurality of substrate inspection and processing apparatuses 10 have the recipes prepared or corrected as described above, the update processing of each substrate inspection ‧ the measuring apparatus 10 (inspection ‧ the correction/update of the measured coordinates) can be omitted, so that the production can be further reduced The amount is reduced, and the deviation between the coordinates registered in the recipe and the actual coordinates can be automatically corrected.
又，在上述實施形態中，用以補正下述座標之座標補正程式可藉以個人電腦或工作站等電腦系統執行來實現，前述座標係將登記於預先準備，對載置於台上之基板之處理對象執行預定處理時使用之配方的前述處理對象之前述基板上之座標。在實施形態中，可藉讀取記錄於預定記錄媒體之座標補正程式來執行，而實現基板檢查‧測定系統。在此，預定記錄媒體係除了軟碟、CD-ROM、MO碟片、DVD碟片、光磁碟片、IC卡等「可攜式實體媒體」外，也包含裝設於電腦系統內外之硬碟驅動器、RAM、ROM等「固定式實體媒體」、還有如藉由數據機連接之公眾網路、連接其他電腦系統以及伺服器之LAN/WAN等，在發送程式之際，可短期保持程式之「通信媒體」等…記錄可以基板檢查‧測定系統讀取之座標補正程式之所有記錄媒體者。Further, in the above embodiment, the coordinate correction program for correcting the coordinates described below can be realized by a computer system such as a personal computer or a workstation, and the coordinates are registered in advance for processing the substrate placed on the stage. The object on the aforementioned substrate on the substrate of the processing object used for the predetermined processing. In the embodiment, the substrate inspection and measurement system can be realized by reading the coordinate correction program recorded on the predetermined recording medium. Here, the predetermined recording medium is a hard disk, a CD-ROM, a MO disk, a DVD disk, a magneto-optical disk, an IC card, and the like, and includes a hard disk installed inside and outside the computer system. "Fixed physical media" such as disk drive, RAM, ROM, etc., as well as a public network connected by a data machine, a LAN/WAN connected to other computer systems, and a server, etc. "Communication media", etc. Record all the recording media that can be checked by the substrate and the coordinate correction program read by the measurement system.
此外，上述實施形態僅為用以實施本發明之例，本發明非限於該等者，按規格等進行各種變形係在本發明之範圍內，再者，從上述記載可清楚明白在本發明之範圍內可進行其他各種實施形態。Further, the above-described embodiments are merely examples for carrying out the present invention, and the present invention is not limited to the above, and various modifications are possible within the scope of the present invention, and the present invention can be clearly understood from the above description. Various other embodiments are possible within the scope.
10，10A-10D…．．．基板檢查‧測定裝置10,10A-10D.... . . Substrate inspection ‧ assay device
11．．．控制電腦(PC)11. . . Control computer (PC)
11a．．．控制部11a. . . Control department
11b．．．處理部11b. . . Processing department
11c．．．記憶部11c. . . Memory department
11d．．．通信部11d. . . Communication department
12．．．台控制器12. . . Controller
13．．．搬送台13. . . Transfer station
14．．．檢查‧測定單元14. . . Inspection ‧ assay unit
14a‧‧‧高架台 14a‧‧‧Highstand
15，15A，15B，…‧‧‧基板搬入搬出部 15,15A,15B,...‧‧‧Substrate loading and unloading
16‧‧‧架台 16‧‧‧ 台台
17‧‧‧振動吸收設備 17‧‧‧Vibration absorption equipment
18‧‧‧外層 18‧‧‧ outer layer
19‧‧‧風扇過濾器單元 19‧‧‧Fan filter unit
100‧‧‧主電腦(PC) 100‧‧‧Main computer (PC)
110‧‧‧網路 110‧‧‧Network
BL‧‧‧位元線 BL‧‧‧ bit line
D1‧‧‧搬入搬出方向 D1‧‧‧ Moving in and out
D2‧‧‧長向 D2‧‧‧Long
IG‧‧‧檢查．測定區域 IG‧‧‧ inspection. Measuring area
L13‧‧‧檢查．測定線 L13‧‧‧Check. Measuring line
M1i，M1r，M2i，M2r‧‧‧校準標記 M1i, M1r, M2i, M2r‧‧‧ calibration mark
MD‧‧‧樣品 MD‧‧‧ sample
Rcp‧‧‧配方 Rcp‧‧‧ recipe
S101-S115，S201-S204‧‧‧步驟 S101-S115, S201-S204‧‧‧ steps
S301-S305，S401-S416‧‧‧步驟 S301-S305, S401-S416‧‧‧ steps
W，Wi，Wr‧‧‧基板 W, Wi, Wr‧‧‧ substrate
WL‧‧‧字線 WL‧‧‧ word line
△x1，△y1，△x2，△y2‧‧‧偏差量△x1, △y1, △x2, △y2‧‧‧ deviation
第1圖係顯示實施形態之基板檢查‧測定系統之概略結構的示意圖。Fig. 1 is a schematic view showing a schematic configuration of a substrate inspection and measurement system according to an embodiment.
第2圖係顯示實施形態之基板檢查‧測定裝置之概略結構的外觀圖。Fig. 2 is an external view showing a schematic configuration of a substrate inspection/measurement apparatus of the embodiment.
第3圖係顯示實施形態之搬送台上之基板與檢查‧測定單元之關係的概略示意圖。Fig. 3 is a schematic view showing the relationship between the substrate on the transfer table and the inspection/measurement unit in the embodiment.
第4圖係顯示實施形態之基板檢查‧測定裝置之配方作成動作之概略的流程圖。Fig. 4 is a flow chart showing the outline of the recipe preparation operation of the substrate inspection and measurement apparatus of the embodiment.
第5圖係用以說明實施形態之校準補正之概略圖。Fig. 5 is a schematic view for explaining calibration correction of the embodiment.
第6圖係顯示實施形態之樣品搜尋處理之具體例的流程圖。Fig. 6 is a flow chart showing a specific example of the sample search processing of the embodiment.
第7圖係顯示實施形態之周邊搜索處理之具體例的流程圖。Fig. 7 is a flow chart showing a specific example of the peripheral search processing of the embodiment.
第8(a)圖、第8(b)圖係用以說明實施形態之樣品拉入處理之圖。Fig. 8(a) and Fig. 8(b) are diagrams for explaining the sample drawing process of the embodiment.
第9圖係顯示實施形態之基板檢查‧測定系統之概略結構的示意圖。Fig. 9 is a schematic view showing a schematic configuration of a substrate inspection/measurement system of the embodiment.
第10圖係顯示實施形態之檢查‧測定動作之概略的流程圖。Fig. 10 is a flow chart showing the outline of the inspection and the measurement operation of the embodiment.
S101-S115．．．步驟S101-S115. . . step
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| JP2010105475A JP5663192B2 (en) | 2010-04-30 | 2010-04-30 | Processing apparatus, coordinate correction method, and coordinate correction program |
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| KR (1) | KR20110121571A (en) |
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| US9080865B2 (en) | 2012-12-27 | 2015-07-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Orthogonality compensation method for length measurement device and length measurement device using same |
| CN103075970B (en) * | 2012-12-27 | 2015-07-01 | 深圳市华星光电技术有限公司 | Method of compensating orthogonal degree of length measuring device and length measuring device using the same |
| CN103292709B (en) * | 2013-05-24 | 2015-09-09 | 深圳市华星光电技术有限公司 | Gauging machine routine testing and automatic compensation method |
| JP5808454B1 (en) | 2014-04-25 | 2015-11-10 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, program, and recording medium |
| CN105047581A (en) * | 2014-04-25 | 2015-11-11 | 株式会社日立国际电气 | Lining bottom processing apparatus and manufacturing method for semiconductors |
| CN106814307B (en) * | 2017-01-10 | 2020-05-12 | 深圳鼎缘电子科技有限公司 | Automatic debugging method and system for cavity filter |
| CN108226179B (en) * | 2018-01-10 | 2021-01-22 | 京东方科技集团股份有限公司 | Calibration method and automatic repair system of automatic optical detection equipment |
| CN110111383B (en) * | 2018-05-08 | 2022-03-18 | 广东聚华印刷显示技术有限公司 | Glass substrate offset correction method, device and system |
| CN112666164B (en) * | 2020-11-23 | 2023-06-16 | 上海新时达机器人有限公司 | Robot vision detection method for multi-class mixed line production control cabinet |
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| JP2002107137A (en) * | 2000-09-29 | 2002-04-10 | Toshiba Corp | Method for controlling inspection stage |
| US7127098B2 (en) * | 2001-09-13 | 2006-10-24 | Hitachi, Ltd. | Image detection method and its apparatus and defect detection method and its apparatus |
| JP3903889B2 (en) * | 2001-09-13 | 2007-04-11 | 株式会社日立製作所 | Defect inspection method and apparatus, and imaging method and apparatus |
| JP4207689B2 (en) * | 2003-07-15 | 2009-01-14 | 株式会社ニコン | Misalignment measuring device |
| JP2005310833A (en) * | 2004-04-16 | 2005-11-04 | Olympus Corp | Substrate-testing apparatus and method |
| CN100547757C (en) * | 2006-11-07 | 2009-10-07 | 中芯国际集成电路制造(上海)有限公司 | A kind of novel crystal round locating bias correcting method |
| JP2009300230A (en) * | 2008-06-12 | 2009-12-24 | Olympus Corp | Device, method and program for performing alignment, and device, method, and program for making standard model |
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| TW201207382A (en) | 2012-02-16 |
| JP5663192B2 (en) | 2015-02-04 |
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