TWI518710B - Multilayer conductive wire and manufacturing method thereof - Google Patents
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本發明係有關一種導電線材的製造方法，尤指一種備製多層導電金屬線的製造方法。 The invention relates to a method for manufacturing a conductive wire, in particular to a method for manufacturing a multilayer conductive metal wire.
在電子產品中，其相關訊號或電源的傳遞大多藉由電力或訊號傳導線材等線材，而影響電流感量或訊號品質則在於線材線芯直徑大小及其傳導長度所計算出之阻值而定，就電力傳遞而言，當直流電通過線芯時，於線芯上所通過的電子較為分布均勻，當交流電通過線芯時，因交流電電壓為呈正負半週弦波波形變動，而使線芯受到磁場方向與帶電荷交互的影響，促使帶電荷朝向於該線芯之外圍或表面，更進一步來說，較低的頻率訊號會集中於線芯的圓心，而較高頻率訊號則會集中於線芯表層，稱為集膚效應(Skin Effect)。 In electronic products, the transmission of related signals or power supplies is mostly made by wires such as electric power or signal-conducting wires, and the influence of current inductance or signal quality depends on the resistance calculated by the wire core diameter and its conduction length. As far as the power transmission is concerned, when the direct current passes through the core, the electrons passing through the core are evenly distributed. When the alternating current passes through the core, the alternating current voltage is a positive and negative half-cycle sine wave waveform, and the core is made. Under the influence of the magnetic field direction and the charge interaction, the charge is directed toward the periphery or surface of the core. Further, the lower frequency signal will concentrate on the center of the core, and the higher frequency signal will be concentrated on The core layer is called the Skin Effect.
由於入們對於電子產品具備多功能性的需求日益增加，相對也增加了對於功率的需求，若欲輸送較大的高頻電流，需要採用直徑較大的線芯線來滿足需求，然而，直徑較大的線芯線材將會限制電子產品微型化的可能，且線芯直徑並不代表越大越好、或越小越好，是視其傳導電力或訊號態樣來消除線芯線間的集膚效應到最低。 Due to the increasing demand for versatility of electronic products, the demand for power is relatively increased. If a large high-frequency current is to be transmitted, a larger diameter core wire is needed to meet the demand. However, the diameter is relatively high. Large core wire will limit the possibility of miniaturization of electronic products, and the core diameter does not mean that the bigger the better, or the smaller the better, depending on the conduction power or signal state to eliminate the skin effect between the core wires. To the lowest.
為因應不同電子產品所需線材，目前大多以線芯線材直徑的增加或減少、或者採用多股絞線的方式來達成目的，如我國專利證書第I270087號「電力或訊號傳導線材之線芯」，是揭示一線材中包含有一線芯，其特徵在於該線芯具有一等形幾何段以及連接於該等形幾何段之間的非等形幾何段，該非等形幾何段具有一延伸段向內延伸，因此該 非等形幾何段用於傳導電力或訊號之表面積大於該等形幾何段，前述技術雖突破了以往單純使用圓形導體絞線之技術而加強其導電能力，然而由於製造該非等形幾何段的工序複雜程度明顯遠遠超過習知圓形導體，且不同形態的非等形幾何段具有不同的物理強度，將會導致不同形態之非等形幾何段對壓迫或彎折等外力的承受程度不同，因此，使其增加製造成本及速度而不利於快速、大量的生產製造。 In order to meet the requirements of different electronic products, most of the current wire core wire diameter increase or decrease, or the use of multiple strands to achieve the purpose, such as China Patent Certificate No. I270087 "power or signal transmission wire core" The invention discloses a wire comprising a wire core, wherein the wire core has an equilateral geometric segment and a non-equal geometric segment connected between the geometric segments, the non-equal geometric segment having an extended segment Internal extension, so the The surface area of the non-equivalent geometric section for conducting electric power or signal is larger than the geometrical section. The foregoing technology breaks through the conventional technique of simply using a circular conductor strand to enhance its electrical conductivity. However, due to the manufacture of the non-equal geometric section, The complexity of the process is obviously far more than the conventional circular conductor, and the different forms of the non-equal geometric segments have different physical strengths, which will cause the different types of non-equal geometric segments to withstand different external forces such as compression or bending. Therefore, it increases the manufacturing cost and speed and is not conducive to rapid, large-scale manufacturing.
本發明之主要目的，在於可降低集膚效應、提升導通效率及大量生產的多層導電金屬線及其製造方法。 The main object of the present invention is to reduce the skin effect, improve the conduction efficiency, and mass-produce a multilayer conductive metal wire and a method of manufacturing the same.
為達上述目的，本發明提供一種多層導電金屬線的製造方法，主要是用於製造多層導電金屬線，該方法包含有一備料步驟、一表面包覆步驟、一軋壓包覆步驟、一電性連接步驟及一絕緣包覆步驟，該備料步驟為提供一實心的內導電材，在該表面包覆步驟中，提供一基材，該基材為金屬材料，且該基材的直流阻抗大於該內導電材的直流阻抗，並將該基材包覆於該內導電材上，在該軋壓包覆步驟中則是提供至少一為片狀的外導電材，該外導電材的直流阻抗小於該基材的直流阻抗，將該外導電材包覆於該基材上，並於該外導電材未相連接的二側之間形成有一接縫處，接著，在該電性連接步驟中為利用一焊接製程於該接縫處的二側壁及與該二側壁相連的基材表面形成一電連接點以構成一電氣連結關係。 In order to achieve the above object, the present invention provides a method for manufacturing a multilayer conductive metal wire, which is mainly used for manufacturing a multilayer conductive metal wire, the method comprising a preparation step, a surface coating step, a rolling coating step, and an electrical property. a connecting step and an insulating coating step, the preparing step is to provide a solid inner conductive material, in the surface coating step, providing a substrate, the substrate is a metal material, and the substrate has a DC resistance greater than the a direct current impedance of the inner conductive material, and the substrate is coated on the inner conductive material, in the rolling and coating step, at least one sheet-shaped outer conductive material is provided, and the direct current impedance of the outer conductive material is less than a direct current impedance of the substrate, the outer conductive material is coated on the substrate, and a seam is formed between the two sides of the outer conductive material that are not connected, and then, in the electrical connection step A soldering process is used to form an electrical connection point between the two sidewalls of the joint and the surface of the substrate connected to the sidewalls to form an electrical connection relationship.
於一實施例中，在電性連接步驟及該絕緣包覆步驟之間還包含決定是否再次包覆步驟，若是則回到該表面包覆步驟中，將另一基材包覆於該外導電材，再將另一外導電材包覆於該另一基材，若否，則進入絕緣包覆步驟，最後，在該絕緣包覆步驟中提供一絕緣層，將該絕緣層包覆該外導電材及該電性接點而形成一多層導電金屬線。 In an embodiment, the step of electrically connecting and the step of insulating coating further includes determining whether to re-coat the step, and if so, returning to the surface coating step, coating another substrate on the outer conductive And coating another outer conductive material on the other substrate, if not, entering the insulating coating step, and finally, providing an insulating layer in the insulating coating step, covering the insulating layer The conductive material and the electrical contact form a multilayer conductive metal wire.
於一實施例中，若決定再回到該表面包覆步驟時，重覆步驟之另一外導電材包覆於該另一基材上，令該另一外導電材同樣形成有另一接縫處，並利用該焊接製程於該接縫處的二側壁及與該二側壁相連的另一基材表面形成另一電連接點與該另一基材構成一電氣連結關係。 In one embodiment, if it is determined to return to the surface coating step, another outer conductive material of the repeating step is coated on the other substrate, so that the other outer conductive material is also formed with another connection. And forming another electrical connection point with the other substrate to form an electrical connection relationship between the two side walls of the joint and the other substrate surface connected to the two side walls by the welding process.
於一實施例中，還包括一裁切步驟，以一預定長度裁切該多層導電金屬線。 In an embodiment, the method further includes a cutting step of cutting the plurality of conductive metal wires by a predetermined length.
於一實施例中，在該電性連接步驟與該絕緣包覆步驟之間還包括一裁切步驟，以一預定長度裁切被該外導電材包覆的內導電材。 In an embodiment, a step of cutting is further included between the electrical connecting step and the insulating coating step to cut the inner conductive material covered by the outer conductive material by a predetermined length.
於一實施例中，該些外導電材的電連接點位於相同位置。 In an embodiment, the electrical connection points of the outer conductive materials are at the same position.
於一實施例中，該些外導電材的電連接點位於相異位置。 In an embodiment, the electrical connection points of the outer conductive materials are located at different positions.
於一實施例中，該些外導電材的厚度為相同。 In one embodiment, the thickness of the outer conductive materials is the same.
本發明的多層導電金屬線及其製造方法主要提供一實心的內導電材、一基材及至少一為片狀的外導電層，將該基材包覆於該內導電材上，再將該外導電材包覆於該基材上，並於該外導電材未相連接的二側之間形成有一接縫處，於該接縫處的二側壁及與該二側壁相連的基材表面形成一電連接點以構成一電氣連結關係，最後於該外導電材上包覆一絕緣層而形成一多層導電金屬線。 The multilayer conductive metal wire of the present invention and the manufacturing method thereof mainly provide a solid inner conductive material, a substrate and at least one outer conductive layer in the form of a sheet, and the substrate is coated on the inner conductive material, and then An outer conductive material is coated on the substrate, and a seam is formed between the two sides of the outer conductive material that are not connected, and the two sidewalls at the joint and the surface of the substrate connected to the two sidewalls are formed. An electrical connection point is formed to form an electrical connection relationship, and finally an insulating layer is coated on the outer conductive material to form a plurality of conductive metal wires.
本發明的多層導電金屬線，具有以下優點： The multilayer conductive metal wire of the present invention has the following advantages:
1.藉由不同導體材質包覆而增加不同層次導層，提供在相同材料面積下具有較高的導通面積，以降低集膚效應及提升導通效率。 1. Different layers of conductive layers are coated by coating different conductor materials to provide a higher conduction area under the same material area to reduce the skin effect and improve the conduction efficiency.
2.藉由重覆堆疊並包覆有至少一基材及至少一外導電材，使其增加截面積進而增加其集膚效應的有效面積並可大量生產。 2. By repeatedly stacking and coating at least one substrate and at least one outer conductive material, the cross-sectional area is increased to increase the effective area of the skin effect and can be mass-produced.
3.可依據設計的長度規格裁切不同長度的多層導電金屬線，使其具有可隨時變更規格的優點。 3. Multi-layer conductive metal wires of different lengths can be cut according to the designed length specification, so that it has the advantage of being able to change specifications at any time.
10‧‧‧內導電材 10‧‧‧Internal conductive material
20a‧‧‧表面 20a‧‧‧ surface
20‧‧‧基材 20‧‧‧Substrate
21‧‧‧第一基材 21‧‧‧First substrate
22‧‧‧第二基材 22‧‧‧Second substrate
30‧‧‧外導電材 30‧‧‧External conductive material
31‧‧‧第一外導電材 31‧‧‧First outer conductive material
32‧‧‧第二外導電材 32‧‧‧Second outer conductive material
33‧‧‧接縫處 33‧‧‧ seams
33a‧‧‧側壁 33a‧‧‧ Sidewall
40‧‧‧電連接點 40‧‧‧Electrical connection points
41‧‧‧第一電連接點 41‧‧‧First electrical connection point
42‧‧‧第二電連接點 42‧‧‧second electrical connection point
50‧‧‧絕緣層 50‧‧‧Insulation
60‧‧‧軋壓包覆機 60‧‧‧ Rolling and coating machine
70‧‧‧氬焊機 70‧‧‧argon welder
S1~S6‧‧‧步驟 S1~S6‧‧‧Steps
圖1為本發明的多層導電金屬線及其製造方法的第一實施例流程步驟示意圖。 1 is a schematic view showing the flow of a first embodiment of a multilayer conductive metal wire and a method of manufacturing the same according to the present invention.
圖2-1為本發明的多層導電金屬線及其製造方法的第一實施例製備流程示意圖。 2-1 is a schematic view showing the preparation flow of the first embodiment of the multilayer conductive metal wire of the present invention and a method of manufacturing the same.
圖2-2為本發明的多層導電金屬線結構示意圖。 2-2 is a schematic view showing the structure of a multilayer conductive metal wire of the present invention.
圖3-1至3-2為本發明的多層導電金屬線的第一實施例結構剖面示意圖。 3-1 to 3-2 are schematic cross-sectional views showing the structure of a first embodiment of a multilayer conductive metal wire of the present invention.
圖4為本發明的多層導電金屬線及其製造方法的第二實施例流程步驟示意圖。 4 is a schematic view showing the flow of a second embodiment of a multilayer conductive metal wire and a method of manufacturing the same according to the present invention.
圖5-1至5-2為本發明的多層導電金屬線的第二實施例結構剖面示意圖。 5-1 to 5-2 are schematic cross-sectional views showing the structure of a second embodiment of the multilayer conductive metal wire of the present invention.
圖6為本發明的多層導電金屬線及其製造方法的第三實施例流程步驟示意圖。 Fig. 6 is a schematic view showing the flow of a third embodiment of the multilayer conductive metal wire of the present invention and a method of manufacturing the same.
圖7為本發明的多層導電金屬線及其製造方法的第四實施例流程步驟示意圖。 Fig. 7 is a flow chart showing the fourth embodiment of the multilayer conductive metal wire of the present invention and a method of manufacturing the same.
有關本發明之詳細說明及技術內容，現就配合圖式說明如下： The detailed description and technical contents of the present invention will now be described as follows:
請參閱『圖1至3-2』，為本發明的多層導電金屬線及其製造方法的第一實施例流程步驟示意圖、第一實施例備製流程示意圖、多層導電金屬線結構示意圖及其第一實施例結構剖面示意圖，如圖所示：該製造方法包含有一備料步驟S1、一表面包覆步驟S2、一軋壓包覆步驟S3、一電性連接步驟S4及一絕緣包覆步驟S6，該備料步驟S1主要提供一材料為銅且為實心的內導電材10，該表面包覆步驟S2提供一基材20，將該基材20貼附於該內導電材10表面上而使該基材20包覆於該內導電 材10上，且該基材20之材質為金屬材料(如鋁、錫或鋅等)，該基材20可藉由塗佈或電鍍等方式形成於該內導電材10表面上並包覆該內導電材10，該軋壓包覆步驟S3為提供至少一外導電材30，該外導電材30可以由一整片導電銅片(圖中未示)鋪設或黏貼於一絕緣層(圖中未示)上所構成片狀導電材，利用一軋壓包覆機60將該外導電材30之絕緣層朝該基材20表面貼附，而使該外導電材30包覆於該基材20上，以於該外導電材30未相連接的二側之間形成有一接縫處33，其中，該基材20的直流阻抗(DC Resistance，DCR)大於該內導電材10或該外導電材30的直流阻抗。而在該電性連接步驟S4中利用一氬焊機70進行焊接製程(如氬焊製程)於該接縫處33的二側壁33a及與該二側壁33a相連的基材20表面20a形成一電連接點40以構成一電氣連結關係，其中，該接縫處33之寬度越小，於該接縫處33形成該電連接點40時可使該外導電材30的包覆越為緊密，接著，在該絕緣包覆步驟S6中將一絕緣層50完整包覆該外導電材30及該電連接點40而形成一多層導電金屬線，該絕緣層50可為塗料或套管，其材料為環氧樹脂、壓克力樹脂、矽利康樹脂或聚胺酯樹脂。該多層導電金屬線藉由不同導體材質包覆而增加不同層次導層，且由於該基材20的直流阻抗大於該內導電材10及該外導電材30的直流阻抗(DC Resistance，DCR)，於本實施例中，該內導電材10及該外導電材30的材質皆為銅，而該基材20的材質則為錫或鋁，以供在高頻環境時直流阻抗較高的基材20將會讓電子通過直流阻抗較低的內導電材10或外導電材30，提供在相同材料面積下具有較高的導通面積，達到降低集膚效應及提升導通效率等目的。 Referring to FIG. 1 to FIG. 3-2, FIG. 1 is a schematic diagram showing a flow chart of a first embodiment of a multilayer conductive metal wire and a manufacturing method thereof, a schematic diagram of a preparation flow of the first embodiment, a schematic diagram of a multilayer conductive metal wire structure, and a first embodiment thereof. A cross-sectional view of an embodiment is shown in the figure. The manufacturing method includes a preparation step S1, a surface coating step S2, a rolling coating step S3, an electrical connection step S4, and an insulation coating step S6. The preparation step S1 mainly provides a solid inner conductive material 10 made of copper. The surface coating step S2 provides a substrate 20, and the substrate 20 is attached to the surface of the inner conductive material 10 to make the base. Material 20 is coated on the inner conductive The material of the substrate 20 is a metal material (such as aluminum, tin or zinc), and the substrate 20 can be formed on the surface of the inner conductive material 10 by coating or plating or the like. The inner conductive material 10, the rolling coating step S3 is to provide at least one outer conductive material 30, the outer conductive material 30 may be laid or adhered to an insulating layer by a whole piece of conductive copper sheet (not shown) (in the figure) The sheet-like conductive material formed on the substrate is attached to the surface of the substrate 20 by a roll coater 60, and the outer conductive member 30 is coated on the substrate. 20, a seam 33 is formed between the two sides of the outer conductive material 30 that are not connected, wherein the substrate 20 has a DC resistance (DCR) greater than the inner conductive material 10 or the outer conductive portion. The DC resistance of the material 30. In the electrical connection step S4, an argon welder 70 performs a soldering process (such as an argon soldering process) to form an electric current on the two side walls 33a of the joint 33 and the surface 20a of the substrate 20 connected to the two side walls 33a. The connection point 40 is formed to form an electrical connection relationship, wherein the smaller the width of the seam 33, the tighter the cladding of the outer conductive material 30 is formed when the electrical connection point 40 is formed at the joint 33, and then In the insulating coating step S6, an insulating layer 50 is completely wrapped around the outer conductive material 30 and the electrical connection point 40 to form a multi-layer conductive metal wire. The insulating layer 50 can be a coating or a sleeve, and the material thereof It is an epoxy resin, an acrylic resin, a lycoconen resin or a polyurethane resin. The multilayer conductive metal wire is covered by different conductor materials to increase different levels of the conductive layer, and since the DC resistance of the substrate 20 is greater than the DC resistance (DCR) of the inner conductive material 10 and the outer conductive material 30, In this embodiment, the inner conductive material 10 and the outer conductive material 30 are made of copper, and the substrate 20 is made of tin or aluminum for a high DC resistance substrate in a high frequency environment. 20 will allow the electrons to pass through the inner conductive material 10 or the outer conductive material 30 with a lower DC impedance, thereby providing a higher conduction area under the same material area, thereby achieving the purpose of reducing the skin effect and improving the conduction efficiency.
復請參閱『圖4至5-2』，為本發明的多層導電金屬線及其製造方法的第二實施例流程步驟示意圖及其第二實施例結構剖面示意圖，如圖所示：在該電性連接步驟S4與該絕緣包覆步驟S6之間還可以包含有決定是否再次包覆步驟S41，若是，即再回到該表面包覆步驟S2時， 於該外導電材30上包覆有另一基材20，再提供另一厚度與前一該外導電材30相同的外導電材30，將該另一外導電材30包覆於該另一基材20上，令該另一外導電材30同樣形成有另一接縫處，並利用該焊接製程於該另一接縫處的二側壁及與該二側壁相連的另一基材20表面形成另一電連接點40與該另一基材20構成一電氣連結關係；若否，直接執行該絕緣包覆步驟S6。 Referring to FIG. 4 to FIG. 5-2, FIG. 4 is a schematic diagram showing the process steps of the second embodiment of the multilayer conductive metal wire and the manufacturing method thereof, and a structural cross-sectional view of the second embodiment, as shown in the figure: The step S4 and the insulating coating step S6 may further include determining whether to recoat the step S41, and if yes, returning to the surface coating step S2, The outer conductive material 30 is coated with another substrate 20, and another outer conductive material 30 having the same thickness as the previous outer conductive material 30 is provided, and the other outer conductive material 30 is coated on the other outer conductive material 30. On the substrate 20, the other outer conductive material 30 is also formed with another seam, and the two side walls of the other seam and the surface of another substrate 20 connected to the two side walls are processed by the soldering process. Another electrical connection point 40 is formed to form an electrical connection relationship with the other substrate 20; if not, the insulation coating step S6 is directly performed.
更詳言之，在表面包覆步驟S2中，於該內導電材10表面上包覆有一第一基材21，該軋壓包覆步驟S3提供一第一外導電材31，利用一軋壓包覆機60將該第一外導電材31包覆於該第一基材21上，以於該第一外導電材31未相連接的二側之間形成有一第一接縫處(如圖3-1的接縫處33)，接著，在該電性連接步驟S4中利用一氬焊機70進行氬焊製程於該接縫處33的二側壁33a及與該二側壁33a相連的第一基材21表面(如圖3-1中的基材20表面20a)形成一第一電連接點41，再決定是否再次包覆一第二基材22及一第二外導電材32(即為決定是否再次包覆步驟S41)，若是則回到該表面包覆步驟S2中，將該第二基材22包覆於該第一外導電材31上，接著，再將該第二外導電材32包覆於該第二基材22上，並於該第二外導電材32未相連接的二側形成有一第二接縫處，接著，再重複該電性連接步驟S4，以於該第二接縫處的二側壁及與該二側壁相連的第二基材22表面形成第二電連接點42。另外，多層重複執行之外導電材30之電連接點40位於相同位置，亦即，該第一電連接點41及該第一電連接點42之設置位置可為相互垂直方向設置，或者，多層重複執行之外導電材30之電連接點40位於相異位置，亦即，該第一電連接點41及該第二電連接點42之設置位置可為交錯方向設置(如圖5-2)。 More specifically, in the surface coating step S2, a surface of the inner conductive material 10 is coated with a first substrate 21, and the rolling coating step S3 provides a first outer conductive material 31, using a rolling The coating machine 60 covers the first outer conductive material 31 on the first substrate 21 to form a first seam between the two sides of the first outer conductive material 31 that are not connected (as shown in the figure). a seam 3-1 of 3-1, and then, in the electrical connection step S4, an argon welding machine 70 performs an argon welding process on the two side walls 33a of the joint 33 and the first side connected to the two side walls 33a. The surface of the substrate 21 (the surface 20a of the substrate 20 in FIG. 3-1) forms a first electrical connection point 41, and then determines whether to cover a second substrate 22 and a second outer conductive material 32 again. Determining whether to cover step S41) again, and if so, returning to the surface coating step S2, coating the second substrate 22 on the first outer conductive material 31, and then, the second outer conductive material 32 is coated on the second substrate 22, and a second seam is formed on the two sides of the second outer conductive material 32 that are not connected, and then the electrical connection step S4 is repeated for the first Two sidewalls 22 and the surface of the second substrate connected to the two second sidewall seam formed electrical connection point 42. In addition, the electrical connection points 40 of the conductive material 30 are in the same position, that is, the first electrical connection points 41 and the first electrical connection points 42 may be disposed in a mutually perpendicular direction, or multiple layers. The electrical connection points 40 of the conductive material 30 are located at different positions, that is, the positions of the first electrical connection point 41 and the second electrical connection point 42 can be set in a staggered direction (as shown in FIG. 5-2). .
因此，透過前述製法，本發明亦揭露一多層導電金屬線，包含有一內導電材10；一基材20，包覆於該內導電材10上；一外導電 材30，包覆於該基材20上，且該外導電材30未相連接的二側形成有一接縫處33；一電連接點40，設於該接縫處33中；以及一絕緣層50，包覆於該外導電材30及該電連接點40。 Therefore, the present invention also discloses a multilayer conductive metal wire comprising an inner conductive material 10; a substrate 20 coated on the inner conductive material 10; an external conductive The material 30 is coated on the substrate 20, and the two sides of the outer conductive material 30 are not connected to each other to form a seam 33; an electrical connection point 40 is disposed in the joint 33; and an insulating layer 50, covering the outer conductive material 30 and the electrical connection point 40.
更詳言之，本發明更可揭露一多層導電金屬線，包含有一內導電材10；一第一基材21，包覆於該內導電材10上；一第一外導電材31，包覆於該第一基材21上，且該第一外導電材31未相連接的二側形成有一第一接縫處；一第一電連接點41，設於該第一接縫處中；一第二基材22，包覆於該第一外導電材31上；一第二外導電材32，包覆於該第二基材22上，且該第二外導電材32未相連接的二側形成有一第二接縫處；一第二電連接點42，設於該第二接縫處；以及一絕緣層50，包覆於該第二外導電材32及該第二電連接點42。應注意的是，本發明之基材20及外導電材30的包覆層數可為依據實際使用情況而增減，於以上之實施例中所應用之形狀僅為例示性說明者，亦非用以限制本發明。 More specifically, the present invention further discloses a multilayer conductive metal wire comprising an inner conductive material 10; a first substrate 21 coated on the inner conductive material 10; and a first outer conductive material 31, a first seam is formed on the first substrate 21, and the first outer conductive material 31 is not connected; a first electrical connection point 41 is disposed in the first seam; a second substrate 22 is coated on the first outer conductive material 31; a second outer conductive material 32 is coated on the second substrate 22, and the second outer conductive member 32 is not connected a second joint is formed on the two sides; a second electrical connection point 42 is disposed at the second joint; and an insulating layer 50 is wrapped around the second outer conductive material 32 and the second electrical connection point 42. It should be noted that the number of coating layers of the substrate 20 and the outer conductive material 30 of the present invention may be increased or decreased according to actual use, and the shapes applied in the above embodiments are merely illustrative and not It is used to limit the invention.
請參閱圖6，為本發明的多層導電金屬線及其製造方法的第三實施例流程步驟示意圖，本實施例之多層導電金屬線及其製造方法與第一實施例大致相同，惟其主要差異在於在該電性連接步驟S4與該絕緣包覆步驟S6之間還包括一裁切步驟S5，以一預定長度裁切已被該外導電材30所包覆的內導電材10，亦即，可依據設計的長度規格裁切該內導電材10，且由於裁切後的內導電材10上外導電材30是完全外露的，因此該裁切步驟S5後可施作該絕緣包覆步驟S6。 6 is a schematic diagram of a flow chart of a third embodiment of a multilayer conductive metal wire and a manufacturing method thereof. The multilayer conductive metal wire of the present embodiment and a manufacturing method thereof are substantially the same as those of the first embodiment, but the main difference is Between the electrical connection step S4 and the insulating coating step S6, a cutting step S5 is further included, and the inner conductive material 10 that has been covered by the outer conductive material 30 is cut by a predetermined length, that is, The inner conductive material 10 is cut according to the designed length specification, and since the outer conductive material 30 on the inner conductive material 10 after the cutting is completely exposed, the insulating coating step S6 can be applied after the cutting step S5.
請參閱圖7，為本發明的多層導電金屬線及其製造方法的第四實施例流程步驟示意圖，本實施例之多層導電金屬線及其製造方法與第一實施例大致相同，惟其主要差異在於該絕緣包覆步驟S6之後還包括一裁切步驟S5，以一預定長度裁切該多層導電金屬線，亦即，可依據設計的長度規格裁切不同長度的多層導電金屬線，使其具有可隨時變更規格的優點。 7 is a schematic diagram showing the flow of a fourth embodiment of a multilayer conductive metal wire and a method of manufacturing the same according to the present invention. The multilayer conductive metal wire of the present embodiment and the manufacturing method thereof are substantially the same as those of the first embodiment, but the main difference is The insulating coating step S6 further includes a cutting step S5 of cutting the plurality of conductive metal wires by a predetermined length, that is, cutting the plurality of conductive metal wires of different lengths according to the designed length specification to have a Change the advantages of the specifications at any time.
綜上所述，本發明的多層導電金屬線及其製造方法主要提供一實心的內導電材、一基材及至少一外導電材，將該基材包覆於該內導電材上，並該基材上再包覆該外導電材，且於該外導電材未相連接的二側之間形成有一接縫處，利用一焊接製程於該接縫處的二側壁及與該二側壁相連的基材表面形成一電連接點，藉由不同導體材質包覆而增加不同層次導層，以提供在相同材料面積下具有較高的導通面積，達到降低集膚效應及提升導通效率等目的，且可藉由重覆於該外導電材上依序堆疊並包覆有至少一基材及至少一外導電材而得一多層導電金屬線，使其增加截面積進而增加其集膚效應的有效面積，並具有可大量生產及可隨時變更規格等優點。 In summary, the multilayer conductive metal wire of the present invention and the manufacturing method thereof mainly provide a solid inner conductive material, a substrate and at least one outer conductive material, and the substrate is coated on the inner conductive material, and The outer conductive material is further coated on the substrate, and a seam is formed between the two sides of the outer conductive material that are not connected, and a sidewall of the joint is connected to the two sidewalls by a soldering process. The surface of the substrate forms an electrical connection point, and different layers of the conductive layer are coated by different conductor materials to provide a high conduction area under the same material area, thereby reducing the skin effect and improving the conduction efficiency. The multilayer conductive metal wire can be obtained by sequentially stacking and coating at least one substrate and at least one external conductive material on the outer conductive material to increase the cross-sectional area and thereby increase the skin effect. The area has the advantages of being mass-produced and changing specifications at any time.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之一較佳實施例而已，當不能以此限定本發明實施之範圍，即凡依本發明申請專利範圍所作之均等變化與修飾，皆應仍屬本發明之專利涵蓋範圍內。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Variations and modifications are still within the scope of the patents of the present invention.
S1~S6‧‧‧步驟 S1~S6‧‧‧Steps
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