TWI517453B - Light emitter - Google Patents

Light emitter Download PDF

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Publication number
TWI517453B
TWI517453B TW098144809A TW98144809A TWI517453B TW I517453 B TWI517453 B TW I517453B TW 098144809 A TW098144809 A TW 098144809A TW 98144809 A TW98144809 A TW 98144809A TW I517453 B TWI517453 B TW I517453B
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Taiwan
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substrate
reflector cover
reflector
emitting diode
light emitting
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TW098144809A
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Chinese (zh)
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TW201031035A (en
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李明易
譚權雅
洪映春
亞恩 伯
李亞飛
翁淑玲
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英迪股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

光發射器Light emitter

一些發光裝置使用發光二極體(LED)或相似裝置作為他們的光源。此等光源係極高效的且用於各種不同的應用中。LED係對熱敏感的且在熱環境中不會良好地運作。然而，許多應用需要亮光，該亮光需要LED汲取大量的電流且產生大量的餘熱。冷卻LED之一方法為定位該等LED於例如一陶瓷基板之一導熱表面上。Some lighting devices use light emitting diodes (LEDs) or similar devices as their light source. These sources are extremely efficient and are used in a variety of different applications. LEDs are heat sensitive and do not function well in a hot environment. However, many applications require bright light that requires the LED to draw a large amount of current and generate a large amount of residual heat. One method of cooling the LEDs is to position the LEDs on a thermally conductive surface such as a ceramic substrate.

陶瓷基板之一問題為他們難以切削。因此，難以切削一足夠深的凹部以形成一LED之一反射器罩於一陶瓷基板中。因此，安裝於陶瓷基板上之LED通常係昂貴的或缺少適當的反射器罩。One of the problems with ceramic substrates is that they are difficult to cut. Therefore, it is difficult to cut a sufficiently deep recess to form one of the LED reflector covers in a ceramic substrate. Therefore, LEDs mounted on ceramic substrates are often expensive or lack proper reflector covers.

圖1中繪示一光發射器100之一實施例。該光發射器100包含兩部分，一反射器罩104及一基板106。圖1中繪示該反射器罩104之一剖視圖。如以下更詳細描述，該反射器罩104係附接至該基板106。此配置使該光發射器100能夠具有一深反射器罩而不必形成一深凹部於該基板106中。One embodiment of a light emitter 100 is illustrated in FIG. The light emitter 100 comprises two parts, a reflector cover 104 and a substrate 106. A cross-sectional view of the reflector cover 104 is illustrated in FIG. The reflector cover 104 is attached to the substrate 106 as described in more detail below. This configuration enables the light emitter 100 to have a deep reflector cover without having to form a deep recess in the substrate 106.

在一些實施例中，該基板106係用導熱之一硬物質製成。可用於該基板106中之此一材料為陶瓷。在習知光發射器中，一深凹部係形成於基板中，其中例如一發光二極體之一發光裝置係定位於該凹部中。該深凹部負擔能夠聚焦由發光二極體所發射之光之一反射器罩。陶瓷及相似材料為相當硬的，其難以形成用於一些發光應用所需之深凹部。此處所描述之該光發射器100藉由附接該反射器罩104至該基板106而克服此等問題。此配置允許該反射器罩104為深的，不需要或幾乎不需要形成凹部於該基板106中。In some embodiments, the substrate 106 is made of one of a thermally conductive material. One such material that can be used in the substrate 106 is ceramic. In a conventional light emitter, a deep recess is formed in the substrate, wherein, for example, a light-emitting device of one of the light-emitting diodes is positioned in the recess. The deep recess bears a reflector cover that can focus on one of the light emitted by the light emitting diode. Ceramics and similar materials are quite stiff, making it difficult to form deep recesses for some lighting applications. The light emitter 100 described herein overcomes such problems by attaching the reflector cover 104 to the substrate 106. This configuration allows the reflector cover 104 to be deep, with no or almost no need to form a recess in the substrate 106.

圖2繪示該反射器罩104從該基板106分開。參考圖1及圖2二者，該反射器罩104具有一第一側110及一第二側112，其中該第一側110面向該基板106。一孔洞116延伸於該第一側110與該第二側112之間。該孔洞116可為圓錐形的，其中該第一側110上之該孔洞116之部分係小於該第二側112上之該孔洞116之部分。該孔洞116之形狀可經製造以便以如以下所更詳細描述之一預定光束圖案導引光。該孔洞116具有可為反射的或比該基板106之材料更反射的之一內表面120。該反射內表面120使更多的光從該光發射器100反射。FIG. 2 illustrates the reflector cover 104 being separated from the substrate 106. Referring to both FIG. 1 and FIG. 2 , the reflector cover 104 has a first side 110 and a second side 112 , wherein the first side 110 faces the substrate 106 . A hole 116 extends between the first side 110 and the second side 112. The aperture 116 can be conical, with a portion of the aperture 116 on the first side 110 being less than a portion of the aperture 116 on the second side 112. The shape of the aperture 116 can be fabricated to direct light in a predetermined beam pattern as described in more detail below. The aperture 116 has an inner surface 120 that can be reflective or more reflective than the material of the substrate 106. The reflective inner surface 120 reflects more light from the light emitter 100.

在此處所描述之該等實施例中，該基板106係用陶瓷製成。該陶瓷基板106為提供極佳的熱傳遞特性以確保安裝於該基板106上之熱產生組件可耗散它們的熱之一剛性材料。該基板106具有一頂面130，一發光二極體(LED)132係安裝於該頂面130上。在一些實施例中，該LED 132係安裝於該頂面130之一凹部內。該基板106亦具有一側面131，該側面131可實質上垂直於該頂面130。除該LED 132外，該基板106之該頂面130或內部結構具有用於連接該LED 132至一外部電源之電氣連接。如以上所陳述，該陶瓷基板106牽引或傳導來自該LED 132之熱以在運作期間保持該LED 132為冷卻的。In the embodiments described herein, the substrate 106 is made of ceramic. The ceramic substrate 106 is a rigid material that provides excellent heat transfer characteristics to ensure that the heat generating components mounted on the substrate 106 can dissipate their heat. The substrate 106 has a top surface 130 to which a light emitting diode (LED) 132 is mounted. In some embodiments, the LED 132 is mounted within a recess in the top surface 130. The substrate 106 also has a side 131 that can be substantially perpendicular to the top surface 130. In addition to the LED 132, the top surface 130 or internal structure of the substrate 106 has an electrical connection for connecting the LED 132 to an external power source. As stated above, the ceramic substrate 106 draws or conducts heat from the LEDs 132 to keep the LEDs 132 cool during operation.

該LED 132可用例如矽之一封裝材料封裝。該封裝材料可為使用於LED型光發射器中之一習知封裝材料且用於保持該LED 132遠離污染物。該封裝材料亦可含有與由該LED 132所發射之光起反應使得該光發射器100發射與由該LED 132所發射之光不同之波長的光之材料。此等材料可包含(但不限於)不同類型的磷光體。The LED 132 can be packaged with a package material such as germanium. The encapsulating material can be one of the conventional packaging materials used in LED type light emitters and used to keep the LEDs 132 away from contaminants. The encapsulating material may also contain a material that reacts with the light emitted by the LED 132 such that the light emitter 100 emits light of a different wavelength than the light emitted by the LED 132. Such materials may include, but are not limited to, different types of phosphors.

在一些實施例中，該頂面130具有容納該LED 132之一凹部136。該凹部136可為足夠深使得該封裝材料覆蓋該LED 132，但未滲透於該頂面130上。如以上所陳述，該基板106可為一相對硬材料。因此，於該基板106中切削一深孔洞以形成一反射器罩為昂貴的。該凹部136不必為極深的，且因此不是製造極昂貴的。該反射器罩104之該第二側110中之該孔洞116可具有與該基板106之該頂面130之該凹部136之直徑之相同尺寸直徑或略微更大的直徑。In some embodiments, the top surface 130 has a recess 136 that receives the LED 132. The recess 136 can be deep enough that the encapsulating material covers the LED 132 but does not penetrate the top surface 130. As stated above, the substrate 106 can be a relatively hard material. Therefore, it is expensive to cut a deep hole in the substrate 106 to form a reflector cover. This recess 136 does not have to be extremely deep and is therefore not extremely expensive to manufacture. The hole 116 in the second side 110 of the reflector cover 104 can have the same diameter or slightly larger diameter as the diameter of the recess 136 of the top surface 130 of the substrate 106.

如圖1中所繪示，該反射器罩104係在完成該基板106之後附接至該基板106。更特定言之，該反射器罩104之該第二側110係附接至該基板106之該表面130及/或該側面131。如以下所更詳細地描述，可使用附接該反射器罩104至該基板106之許多不同的組態。在一些實施例中，該反射器罩104係在測試該LED 132之後附接至該基板106。As shown in FIG. 1, the reflector cover 104 is attached to the substrate 106 after completion of the substrate 106. More specifically, the second side 110 of the reflector cover 104 is attached to the surface 130 and/or the side surface 131 of the substrate 106. As described in more detail below, many different configurations of attaching the reflector cover 104 to the substrate 106 can be used. In some embodiments, the reflector cover 104 is attached to the substrate 106 after testing the LED 132.

在一些實施例中，該反射器罩104之該第二側110具有一凸緣140，該凸緣140係用於固定且對準該反射器罩104至該基板106。該凸緣140具有可實質上互相垂直之一凸緣第一表面142及一凸緣第二表面144。該凸緣第一表面142接觸該基板106之該頂面130。該凸緣第二表面144可經成形以容納該基板106，其中該基板106之該側面131係接近該凸緣第二表面144。該凸緣140的使用使該LED 132與該反射器罩104之間能夠正確對準。更特定言之，該反射器罩140係依靠該凸緣140而定位於相對於該基板106之一預定位置中。該對準使該光發射器100能夠具有一預定光圖案。該凸緣140之任一部分可附接至該基板之該頂面130或側面131。In some embodiments, the second side 110 of the reflector cover 104 has a flange 140 for securing and aligning the reflector cover 104 to the substrate 106. The flange 140 has a flange first surface 142 and a flange second surface 144 that are substantially perpendicular to each other. The flange first surface 142 contacts the top surface 130 of the substrate 106. The flange second surface 144 can be shaped to receive the substrate 106, wherein the side surface 131 of the substrate 106 is proximate to the flange second surface 144. The use of the flange 140 enables proper alignment between the LED 132 and the reflector cover 104. More specifically, the reflector cover 140 is positioned in a predetermined position relative to the substrate 106 by virtue of the flange 140. This alignment enables the light emitter 100 to have a predetermined light pattern. Any portion of the flange 140 can be attached to the top surface 130 or side 131 of the substrate.

圖3之流程圖中繪示製造該光發射器100之一方法之一實施例。除圖3中所繪示之該方法外，將描述其他方法。該製程以形成基板在步驟160開始。以上所描述之該光發射器100為一單獨裝置；然而，在製造期間，複數個基板106可從被切削之一單獨較大基板或類似物形成。在步驟162中，凹部136係形成於該等基板106中。當形成該等基板106時可形成該等凹部136，或在形成該等基板106之後該等凹部136可切入該等基板106內。在步驟164，該等電氣連接可添加至該基板106。One embodiment of a method of fabricating the light emitter 100 is illustrated in the flow chart of FIG. Other methods will be described in addition to the method illustrated in FIG. The process begins with forming a substrate at step 160. The light emitter 100 described above is a separate device; however, during fabrication, the plurality of substrates 106 can be formed from a single larger substrate or the like being cut. In step 162, recesses 136 are formed in the substrates 106. The recesses 136 may be formed when the substrates 106 are formed, or the recesses 136 may be cut into the substrates 106 after the substrates 106 are formed. At step 164, the electrical connections can be added to the substrate 106.

在步驟166，該等LED 132可連接至該等基板106。在步驟168，封裝該等LED 132。在此時之該製造製程中，每步驟170可測試該等光發射器100。若該較大基板上之所有該等光發射器100正確地起作用或一預定數量的光發射器100正確地起作用，則該等個別基板106可從該較大基板分開。藉由在該反射器罩104被附接至該等基板106之前測試該等LED 132，有缺陷的基板106不連接至反射器罩104。此製程減少該等反射器罩104之浪費。At step 166, the LEDs 132 can be coupled to the substrates 106. At step 168, the LEDs 132 are packaged. In the manufacturing process at this time, the light emitters 100 can be tested every step 170. If all of the light emitters 100 on the larger substrate function properly or a predetermined number of light emitters 100 function properly, the individual substrates 106 can be separated from the larger substrate. The defective substrate 106 is not connected to the reflector cover 104 by testing the LEDs 132 before the reflector cover 104 is attached to the substrates 106. This process reduces the waste of the reflector covers 104.

製造該等基板106的同時，每步驟172可製造該等反射器罩104。接著每步驟174，該等基板106可附接至該等反射器罩104。如圖1中所繪示且如以上所描述，該等反射器罩104中之該凸緣140使該等反射器罩104能夠與該等基板106及安裝於該等基板106上之該等LED 132正確地對準。該對準減少該等光發射器100之生產成本。附接該等反射器罩104至該等基板106亦使該等孔洞116能夠為深的且具有引起該等光發射器100發射預定光束之形狀。The reflector covers 104 can be fabricated every step 172 while the substrates 106 are being fabricated. Following each step 174, the substrates 106 can be attached to the reflector covers 104. As shown in FIG. 1 and as described above, the flanges 140 of the reflector covers 104 enable the reflector covers 104 to be associated with the substrates 106 and the LEDs mounted on the substrates 106 132 is correctly aligned. This alignment reduces the production cost of the optical transmitters 100. Attaching the reflector covers 104 to the substrates 106 also enables the holes 116 to be deep and have a shape that causes the light emitters 100 to emit a predetermined beam of light.

100．．．光發射器100. . . Light emitter

104．．．反射器罩104. . . Reflector cover

106．．．基板106. . . Substrate

110．．．反射器罩第一側110. . . Reflector cover first side

112．．．反射器罩第二側112. . . Reflector cover second side

116．．．孔洞116. . . Hole

120．．．孔洞內表面120. . . Inner surface of the hole

130．．．基板頂面130. . . Top surface of the substrate

131．．．基板側面131. . . Side of the substrate

132．．．LED132. . . led

136．．．凹部136. . . Concave

140．．．凸緣140. . . Flange

142．．．凸緣第一表面142. . . Flange first surface

144．．．凸緣第二表面144. . . Flange second surface

圖1係一光發射器裝置之剖面俯視透視圖；Figure 1 is a cross-sectional perspective view of a light emitter device;

圖2係繪示個別組件之圖1之該反射器罩之一俯視透視圖；Figure 2 is a top perspective view of the reflector cover of Figure 1 of the individual components;

圖3係用於製造圖1之該反射器罩之一實施例之一流程圖。3 is a flow chart of one embodiment of the reflector cover of FIG. 1.

104．．．反射器罩104. . . Reflector cover

106．．．基板106. . . Substrate

110．．．反射器罩第一側110. . . Reflector cover first side

112．．．反射器罩第二側112. . . Reflector cover second side

116．．．孔洞116. . . Hole

120．．．孔洞內表面120. . . Inner surface of the hole

130．．．基板頂面130. . . Top surface of the substrate

131．．．基板側面131. . . Side of the substrate

132．．．LED132. . . led

136．．．凹部136. . . Concave

Claims (13)

一種光發射器，其包括：具有一基板表面及至少一側表面之一基板；定位於該基板表面上之一發光二極體(LED)；封裝該發光二極體之一封裝材料；及基板表面之一凹部，其中該凹部經組態以容納該發光二極體及該封裝材料以使得該封裝材料在該凹部中包覆該發光二極體；附接至該基板之一反射器罩，該反射器罩具有一反射器罩第一側及一反射器罩第二側，且一孔洞延伸於該反射器罩第一側與該反射器罩第二側之間，其中該反射器罩第一側係附接至該基板表面使得該基板表面及該至少一側表面之全部被該反射器罩包覆並接觸該反射器罩。 A light emitter comprising: a substrate having a substrate surface and at least one surface; a light emitting diode (LED) positioned on the surface of the substrate; a package material encapsulating the light emitting diode; and a substrate a recess of the surface, wherein the recess is configured to receive the light emitting diode and the encapsulating material such that the encapsulating material encapsulates the light emitting diode in the recess; attached to one of the reflector covers of the substrate, The reflector cover has a reflector cover first side and a reflector cover second side, and a hole extends between the first side of the reflector cover and the second side of the reflector cover, wherein the reflector cover A side is attached to the surface of the substrate such that all of the substrate surface and the at least one side surface are covered by the reflector cover and contact the reflector cover. 如請求項1之光發射器，其中該基板係由至少一陶瓷材料組成。 The light emitter of claim 1, wherein the substrate is comprised of at least one ceramic material. 如請求項1之光發射器，其中該反射器罩第一側中之該孔洞包圍該凹部。 The light emitter of claim 1, wherein the aperture in the first side of the reflector cover surrounds the recess. 如請求項1之光發射器，其中該孔洞為圓錐形狀且其中在該反射器罩第一側中之該孔洞係小於該反射器罩第二側上之該孔洞。 The light emitter of claim 1, wherein the aperture is conical in shape and wherein the aperture in the first side of the reflector cover is smaller than the aperture on the second side of the reflector cover. 如請求項1之光發射器，其中該反射器罩第一側具有一對準結構，該對準結構具有形成於其中的第一表面及第二表面，且其中該對準結構經組態以接納該基板，使得該基板被包圍在該對準結構中，而該對準結構的該第一 表面接近該基板表面且該對準結構之該第二表面接近該基板之該至少一側表面。 The light emitter of claim 1, wherein the first side of the reflector cover has an alignment structure having a first surface and a second surface formed therein, and wherein the alignment structure is configured Receiving the substrate such that the substrate is enclosed in the alignment structure, and the first of the alignment structures The surface is adjacent to the surface of the substrate and the second surface of the alignment structure is adjacent to the at least one side surface of the substrate. 如請求項5之光發射器，其中當該基板係被接納於該對準結構中時，該LED係定位於相對於該反射器罩之一預定位置中。 The light emitter of claim 5, wherein the LED is positioned in a predetermined position relative to the reflector cover when the substrate is received in the alignment structure. 如請求項1之光發射器，其中該反射器罩係安裝於相對於該LED之一預定位置中。 The light emitter of claim 1, wherein the reflector cover is mounted in a predetermined position relative to one of the LEDs. 一種製造光發射器之方法，該方法包括：提供具有一基板表面、至少一側表面及電氣連接之一基板，其中該基板包含一凹部；連接一發光二極體至該等電氣連接；以一封裝材料封裝該發光二極體，使得該封裝材料係在該凹部中；測試該發光二極體；及若該測試之結果指示該發光二極體為起作用，則連接一反射器罩至該基板表面，該反射器罩具有一反射器罩第一側及一反射器罩第二側，且一孔洞延伸於該反射器罩第一側與該反射器罩第二側之間，其中該反射器罩第一側係附接至該基板表面使得該基板表面及該至少一側表面之全部被該反射器罩包覆並接觸該反射器罩。 A method of fabricating a light emitter, the method comprising: providing a substrate having a substrate surface, at least one side surface, and an electrical connection, wherein the substrate comprises a recess; connecting a light emitting diode to the electrical connections; Encapsulating material encapsulating the light emitting diode such that the packaging material is in the recess; testing the light emitting diode; and if the result of the test indicates that the light emitting diode is active, connecting a reflector cover to the a surface of the substrate, the reflector cover having a first side of the reflector cover and a second side of the reflector cover, and a hole extending between the first side of the reflector cover and the second side of the reflector cover, wherein the reflection A first side of the cover is attached to the surface of the substrate such that all of the substrate surface and the at least one side surface are covered by the reflector cover and contact the reflector cover. 如請求項8之方法，其中該連接一發光二極體至該等電氣連接包括於該凹部內定位該發光二極體。 The method of claim 8, wherein the attaching a light emitting diode to the electrical connections comprises positioning the light emitting diode within the recess. 如請求項8之方法，其中該測試包括施加電至該等電氣連接。 The method of claim 8, wherein the testing comprises applying electricity to the electrical connections. 如請求項8之方法，其中該反射器罩第一側具有一對準結構，該對準結構具有形成於其中的第一表面及第二表面，該對準結構經組態以在該對準結構中接納該基板，使得該第一表面接近該基板表面且該第二表面接近該基板之該至少一側表面，且其中該連接一反射器罩至該基板表面包含在該對準結構中定位該基板。 The method of claim 8, wherein the first side of the reflector cover has an alignment structure having a first surface and a second surface formed therein, the alignment structure being configured to be aligned Receiving the substrate in the structure such that the first surface is adjacent to the substrate surface and the second surface is adjacent to the at least one side surface of the substrate, and wherein connecting the reflector cover to the substrate surface comprises positioning in the alignment structure The substrate. 如請求項11之方法，其中該定位導致該基板為在相對於該反射器罩之一預定固定位置中。 The method of claim 11, wherein the positioning causes the substrate to be in a predetermined fixed position relative to one of the reflector covers. 如請求項8之方法，其中該反射器罩係一起製造之複數個反射器罩之一者。The method of claim 8, wherein the reflector cover is one of a plurality of reflector covers fabricated together.
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