TWI514526B - Carrier member and method for fixing electronic component by using the carrier member - Google Patents
Carrier member and method for fixing electronic component by using the carrier member Download PDFInfo
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- TWI514526B TWI514526B TW102146034A TW102146034A TWI514526B TW I514526 B TWI514526 B TW I514526B TW 102146034 A TW102146034 A TW 102146034A TW 102146034 A TW102146034 A TW 102146034A TW I514526 B TWI514526 B TW I514526B
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Description
本發明係有關一種承載件及用該承載件固定電子元件之方法,尤指一種吸附固定電子元件之方法。The present invention relates to a carrier and a method of fixing an electronic component using the carrier, and more particularly to a method of adsorbing and fixing an electronic component.
隨著半導體技術的演進,半導體封裝件已開發出許多不同的封裝型態,而為了追求半導體封裝件之輕薄短小,因而發展出一種晶片尺寸封裝件(chip scale package,CSP),其特徵在於此種晶片尺寸封裝件僅具有與晶片尺寸相等或略大的尺寸。With the evolution of semiconductor technology, semiconductor packages have been developed in many different package types, and in order to pursue the thinness and thinness of semiconductor packages, a chip scale package (CSP) has been developed, which is characterized by The wafer size package only has dimensions that are equal or slightly larger than the wafer size.
在習知半導體封裝件之製程中,係先將電子元件黏貼於一膠膜上,再以封裝膠體進行封裝模壓製程,以包覆住電子元件之非作用面及側面,再加熱移除該膠膜,以外露出該電子元件之作用面,最後於該電子元件之作用面與封裝膠體上形成線路重佈(RDL)結構,並進行切割作業。In the process of the conventional semiconductor package, the electronic component is first adhered to a film, and then encapsulated by a package gel to cover the non-active surface and side of the electronic component, and then the glue is removed by heating. The film exposes the active surface of the electronic component, and finally forms a line repeating (RDL) structure on the active surface of the electronic component and the encapsulant, and performs a cutting operation.
請參閱第1A至1C圖所示之習知半導體封裝件之製法,係包括:藉由黏著層11將該電子元件12固定於承載板10上;於該黏著層11上形成封裝膠體13,使該電子元件12嵌埋於該封裝膠體13中;以及移除該承載板10及黏著層11,進行後續製程(如,切單作業)。Referring to the conventional semiconductor package shown in FIGS. 1A to 1C, the electronic component 12 is fixed on the carrier 10 by the adhesive layer 11; and the encapsulant 13 is formed on the adhesive layer 11. The electronic component 12 is embedded in the encapsulant 13; and the carrier 10 and the adhesive layer 11 are removed for subsequent processing (eg, singulation).
然而,一般如半導體封裝件結構(上圖以此為例)或晶圓接置於承載件上所用之黏著層材料通常係以熱感性黏著材或感光性黏著材。並利用熱感性黏著膠材加熱則會失去黏性,感光性黏著膠材照光(如,UV光)則會失去黏性(如,承載板10為透光性板材者)之特點,將接置其上之電子元件自承載件上分離。然而,如第1C圖所示,於半導體封裝件或晶圓與黏著層之接著面通常會有殘膠11’,若不去除會有後續製程可靠度問題發生問題,因此通常會以浸泡清除劑之方式去除半導體封裝件或晶圓上殘留之殘膠,如此不僅製作流程時間長,且利用清除劑去除殘膠,亦會造成製作成本上升。However, generally, the adhesive layer material used for the semiconductor package structure (the above figure is taken as an example) or the wafer is attached to the carrier is usually a heat sensitive adhesive or a photosensitive adhesive. And heating with a heat-sensitive adhesive material will lose the viscosity, and the photosensitive adhesive material will lose its viscosity when it is illuminated (for example, UV light) (for example, the carrier plate 10 is a light-transmissive plate), and will be connected. The electronic components thereon are separated from the carrier. However, as shown in FIG. 1C, there is usually a residual adhesive 11' on the surface of the semiconductor package or the wafer and the adhesive layer. If the problem of subsequent process reliability is not removed, the immersion remover is usually used. In this way, the residual resin remaining on the semiconductor package or the wafer is removed, so that not only the production process is long, but also the removal of the residual glue by the scavenger, and the manufacturing cost is also increased.
此外,由於熱感性黏著材或感光性黏著材價格昂貴,未避免製作成本之增加,目前常係將該半導體封裝件或晶圓直接黏附於一般黏著材上,並以化學藥液浸泡去除黏著材。然而,此方法更會因為藥液無法順利進入半導體封裝件或晶圓與承載板間狹縫或中間區域位置,而導致無法順利分離兩者。In addition, since the heat-sensitive adhesive material or the photosensitive adhesive material is expensive, and the manufacturing cost is not avoided, the semiconductor package or the wafer is often directly adhered to the general adhesive material, and the adhesive material is immersed in the chemical liquid to remove the adhesive material. . However, this method is more likely that the liquid cannot smoothly enter the semiconductor package or the position of the slit or the intermediate portion between the wafer and the carrier, so that the two cannot be separated smoothly.
因此,如何提供一種能避免殘膠問題的固定電子元件之方法及承載件,在保有產品良率之情況下又能降低製程成本實為目前業界所急需解決之問題。Therefore, how to provide a method and a carrier for fixing electronic components that can avoid the problem of residual glue can reduce the process cost while maintaining the yield of the product, which is an urgent problem to be solved in the industry.
鑑於上述習知技術之缺失,本發明提供一種承載件,係包括:具有相對之第一表面及第二表面的本體,且該第一表面定義有承載區;形成於該本體中之氣流道結構,且該氣流道結構係連通至該第一表面之承載區內;以及形成於該本體中之抽氣孔,具有連通於該氣流道結構之連接端及連通至該本體外的抽氣端。In view of the above-mentioned deficiencies of the prior art, the present invention provides a carrier comprising: a body having a first surface and a second surface opposite to each other, wherein the first surface defines a load bearing area; and an air flow path structure formed in the body And the air channel structure is connected to the bearing area of the first surface; and the air vent formed in the body has a connecting end connected to the air channel structure and a pumping end connected to the body.
於本發明之承載件中,該氣流道結構係以平行於該第一表面之方向延伸形成於該本體中,且該氣流道結構係於該第一表面之承載區內構成吸附面。於具體實施例中,該吸附面為網狀、複數環狀、複數條狀或交織狀吸附面。In the carrier of the present invention, the airflow path structure is formed in the body in a direction parallel to the first surface, and the airflow path structure forms an adsorption surface in the bearing area of the first surface. In a specific embodiment, the adsorption surface is a mesh, a plurality of rings, a plurality of strips or a cross-shaped adsorption surface.
於本發明之承載件中,該氣流道結構外露於該第一表面之輪廓係與定義於該第一表面的承載區之形狀相同或不相同。In the carrier of the present invention, the profile of the airflow path structure exposed to the first surface is the same or different from the shape of the load-bearing zone defined on the first surface.
於本發明之承載件的一實施例中,該氣流道結構係包括:複數溝槽,係形成於該本體中,並連通至該第一表面之承載區內;以及至少一連接通道,係形成於該本體中,且連通任二該溝槽,其中,該連接通道係外露或不外露於該第一表面。於一實施例中,該氣流道結構係自該承載區的中心位置向外形成由小至大的環狀溝槽,亦即該複數溝槽係為環狀且以同心方式形成於該本體中,且該連接通道係為複數,以連通各該溝槽。In an embodiment of the carrier of the present invention, the airflow channel structure includes: a plurality of trenches formed in the body and communicating with the bearing area of the first surface; and at least one connecting channel formed In the body, and communicating with any of the trenches, wherein the connecting channel is exposed or not exposed to the first surface. In an embodiment, the airflow channel structure forms a small to large annular groove outward from a central position of the bearing zone, that is, the plurality of trenches are annular and are formed in the body in a concentric manner. And the connecting channel is plural to connect each of the trenches.
於本發明之承載件中,該氣流道結構為一溝槽,係形成於該本體中,且外露於該第一表面之承載區內。In the carrier of the present invention, the airflow path structure is a groove formed in the body and exposed in the bearing area of the first surface.
於本發明之承載件的一實施例中,該氣流道結構為一形成於該本體中的螺狀溝槽,且該螺狀溝槽係外露於該第一表面之承載區內。In an embodiment of the carrier of the present invention, the airflow path structure is a spiral groove formed in the body, and the spiral groove is exposed in the bearing area of the first surface.
於本發明之承載件之一實施例中,該本體係具有連接該第一表面及第二表面之側面,該抽氣孔之抽氣端係連通至該側面。In an embodiment of the carrier of the present invention, the system has a side connecting the first surface and the second surface, and the suction end of the air vent is connected to the side.
本發明之承載件之另一實施例中,該抽氣孔之抽氣端係連通至該第一表面或第二表面。In another embodiment of the carrier of the present invention, the pumping end of the air vent is connected to the first surface or the second surface.
於本發明之承載件中,復包括止流閥,係可動式嵌設於該本體中,亦即該抽氣孔中,當止流閥嵌插於該抽氣孔中即隔絕該連 接端及抽氣端。In the carrier of the present invention, the stop valve is further included in the body, that is, in the air venting hole, when the check valve is inserted in the air venting hole, the connection is isolated. Terminal and pumping end.
本發明復提供一種固定電子元件之方法係包括:將電子元件置於本發明之承載件的承載區上;以及藉由該抽氣孔將該氣流道內之空氣排出,使該電子元件吸附於該承載區。The invention provides a method for fixing an electronic component, comprising: placing an electronic component on a bearing area of a carrier of the invention; and discharging the air in the airflow path by the air venting hole, so that the electronic component is attracted to the electronic component Carrying area.
例如,使用抽氣裝置藉由該抽氣孔將該氣流道結構內之空氣排出。For example, the air in the air passage structure is discharged by the air suction means using an air suction means.
如上所述,本發明利用真空吸附方式使電子元件接置於承載件上,不需要使用如黏著材等間接材料,可避免殘膠問題,不僅降低成本,更提升生產效率。As described above, the present invention utilizes a vacuum adsorption method to attach an electronic component to a carrier member, and does not require the use of an indirect material such as an adhesive material, thereby avoiding the problem of residual glue, thereby reducing cost and improving production efficiency.
2、2’、2”、3、4、5‧‧‧承載件2, 2', 2", 3, 4, 5‧‧‧ carrier
6‧‧‧電子元件6‧‧‧Electronic components
10‧‧‧承載板10‧‧‧Bearing board
11‧‧‧黏著層11‧‧‧Adhesive layer
11’‧‧‧殘膠11’‧‧‧ Residual glue
12‧‧‧電子元件12‧‧‧Electronic components
13‧‧‧封裝膠體13‧‧‧Package colloid
20‧‧‧本體20‧‧‧ body
20a‧‧‧第一表面20a‧‧‧ first surface
20b‧‧‧第二表面20b‧‧‧second surface
20c‧‧‧承載區20c‧‧‧bearing area
21、31、41‧‧‧氣流道結構21, 31, 41‧‧ ‧ air channel structure
210、410‧‧‧溝槽210, 410‧‧‧ trench
211、211’、411‧‧‧連接通道211, 211', 411‧‧‧ connecting channels
22、22'‧‧‧抽氣孔22, 22'‧‧‧ Venting holes
22a、22a'‧‧‧連接端22a, 22a'‧‧‧ connection
22b、22b'‧‧‧抽氣端22b, 22b'‧‧‧ pumping end
50‧‧‧止流閥50‧‧‧ stop valve
2B-2B‧‧‧切割線2B-2B‧‧‧ cutting line
20d‧‧‧側面20d‧‧‧ side
第1A至1C圖係為習知半導體封裝件之製法剖面示意圖;第2A至2B”圖係為本發明一實施例之承載件之俯視圖,其中,第2B圖係沿著第2A圖之2B-2B切割線之剖面示意圖,第2B’圖係本發明另一實施例之承載件之剖面示意圖,第2B”圖係本發明又一實施例之承載件之剖面示意圖;第3圖係顯示本發明具有螺狀溝槽之承載件之俯視圖;第4圖係顯示本發明具有另一氣流道結構之承載件之俯視圖;第5A及5B圖係本發明承載件具有止流閥之實施例的剖面示意圖,其中,第5B圖係顯示止流閥嵌設於該抽氣孔之示意圖;以及第6A至6C圖係本發明固定電子元件之方法的示意圖。1A to 1C are schematic cross-sectional views showing a conventional semiconductor package; and FIGS. 2A to 2B are a plan view of a carrier according to an embodiment of the present invention, wherein FIG. 2B is along 2B of FIG. 2A- 2B' is a schematic cross-sectional view of a carrier member according to another embodiment of the present invention, and FIG. 2B is a schematic cross-sectional view of a carrier member according to still another embodiment of the present invention; FIG. 3 is a cross-sectional view showing the present invention. A plan view of a carrier having a spiral groove; FIG. 4 is a plan view showing a carrier having another air passage structure of the present invention; and FIGS. 5A and 5B are schematic cross-sectional views showing an embodiment of the carrier of the present invention having a stop valve; 5B is a schematic view showing that the check valve is embedded in the air vent; and FIGS. 6A to 6C are schematic views showing a method of fixing the electronic component of the present invention.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此 技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The embodiments of the present invention are described below by way of specific embodiments, and are familiar with this. Other advantages and effects of the present invention will be readily apparent to those skilled in the art from this disclosure.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。本文所使用之術語「中心位置」並非意指限於該承載件或基板正中心位置。本文所使用之術語「承載區」僅係一虛擬之區域,意指用以承載電子元件之區域。本文所使用之術語「環狀」並非限定為圓形,亦可為其他外型之環狀,同時,本說明書中所引用之如「上」、「內」、「外」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. The term "central position" as used herein is not intended to be limited to the true center position of the carrier or substrate. The term "bearing area" as used herein is merely a virtual area, meaning the area used to carry electronic components. The term "ring" as used herein is not limited to a circular shape, but may be a ring of other shapes. At the same time, references to "upper", "inside", "outside" and "one" are used in this specification. The terminology is used for the purpose of describing the invention, and is not intended to limit the scope of the invention. The changes or adjustments of the relative relationship are also considered to be within the scope of the invention.
請參閱第2A至2B”圖係本發明之承載件之示意圖。Please refer to Figures 2A to 2B for a schematic view of the carrier of the present invention.
如第2A及2B圖所示,本發明之承載件2係包括:本體20,係具有相對之第一表面20a及第二表面20b,且該第一表面20a定義有承載區20c;氣流道結構21,係形成於該本體20中,並連通至該第一表面20a的承載區20c內;以及抽氣孔22,係形成於該本體20中,具有連接端22a及相對之抽氣端22b,且該連接端22a係連通於該氣流道結構21,該抽氣端22b則供該抽氣孔22連通至該本體20外。As shown in Figures 2A and 2B, the carrier 2 of the present invention comprises: a body 20 having an opposite first surface 20a and a second surface 20b, and the first surface 20a defines a load-bearing area 20c; 21, formed in the body 20, and connected to the bearing area 20c of the first surface 20a; and an air vent 22 formed in the body 20, having a connecting end 22a and an opposite pumping end 22b, and The connecting end 22a is connected to the air flow path structure 21, and the air suction end 22b is connected to the air exhausting hole 22 to the outside of the body 20.
如第2A圖所示之本實施例中,由上俯視,該氣流道結構21係以平行於該第一表面20a之方向延伸形成於該本體20中,且該氣流道結構21係於該第一表面20a之承載區20c內構成吸附面。本實施例中,該吸附面係為複數環狀,在其他實施例中,根據氣流道結構,該吸附面亦可為網狀、複數條狀或交織狀。In the embodiment shown in FIG. 2A, the airflow path structure 21 is formed in the body 20 in a direction parallel to the first surface 20a, and the airflow path structure 21 is attached to the first An adsorption surface is formed in the bearing area 20c of a surface 20a. In this embodiment, the adsorption surface is a plurality of rings. In other embodiments, the adsorption surface may be a mesh shape, a plurality of strips, or a woven shape according to the air flow path structure.
再者,本實施例中,該氣流道結構21外露於該第一表面20a之輪廓係與定義於該第一表面20a的承載區20c之形狀相同。當然,該氣流道結構21外露於該第一表面20a之輪廓亦可與定義於該第一表面20a的承載區20c之形狀不相同,例如,承載區為矩形,以承載封裝件,但氣流道結構外露於該第一表面之輪廓可為圓形。Moreover, in this embodiment, the contour of the airflow path structure 21 exposed on the first surface 20a is the same as the shape of the load-bearing area 20c defined on the first surface 20a. Of course, the contour of the air channel structure 21 exposed on the first surface 20a may also be different from the shape of the bearing area 20c defined on the first surface 20a. For example, the carrying area is rectangular to carry the package, but the airflow path The contour of the structure exposed to the first surface may be circular.
此外,本實施例中,該氣流道結構21係包括複數溝槽210及複數連接通道211,以連通任二該溝槽210。In addition, in this embodiment, the air channel structure 21 includes a plurality of trenches 210 and a plurality of connecting channels 211 to communicate with any of the trenches 210.
具體而言,該氣流道結構21係由複數溝槽210自該承載區20c的中心位置向外形成由小至大形成於該本體20中,並連通至該第一表面20a,亦即該溝槽210為環狀,且各該溝槽210間係由該連接通道211所連通,以連通任二該溝槽210。本實施例中,該連接通道211係外露於該第一表面20a,此外,請參閱第2B’圖,本發明之承載件2’中的連接通道211’亦可不外露於該第一表面20a。Specifically, the air channel structure 21 is formed in the body 20 from the center position of the load-bearing area 20c by a plurality of grooves 210, and is connected to the first surface 20a, that is, the groove. The slots 210 are annular, and each of the trenches 210 is connected by the connecting channel 211 to communicate with any of the trenches 210. In this embodiment, the connecting passage 211 is exposed on the first surface 20a. Further, referring to FIG. 2B', the connecting passage 211' in the carrier 2' of the present invention may not be exposed on the first surface 20a.
於第2B及2B’圖所示之實施例,該本體20係具有連接該第一表面20a及第二表面20b之側面20d,且該抽氣孔22係以水平方向形成於該本體20中,例如,該抽氣孔22之抽氣端22b係連通至該側面20d,並以該連接端22a連通該氣流道結構21。In the embodiment shown in FIGS. 2B and 2B', the body 20 has a side surface 20d connecting the first surface 20a and the second surface 20b, and the air vent 22 is formed in the body 20 in a horizontal direction, for example. The suction end 22b of the air vent 22 is connected to the side surface 20d, and the air flow path structure 21 is communicated by the connection end 22a.
於第2B”圖所示之實施例,本發明承載件2”之該抽氣孔22'之抽氣端22b’亦可以垂直方向直接形成於該本體20中,並連通該第二表面20b與該氣流道結構21之底部,換言之,該當該抽氣孔22'係形成於該溝槽210之下方,則該溝槽210與抽氣孔22'及形成一垂直貫穿該本體20之貫孔,而該連接端22a'係連通該溝槽210之底部,且該抽氣端22b’係外露於該本體20之第二表面20b”。In the embodiment shown in FIG. 2B", the suction end 22b' of the air vent 22' of the carrier 2" of the present invention may also be directly formed in the body 20 in a vertical direction, and communicate with the second surface 20b. The bottom of the airflow path structure 21, in other words, when the air venting hole 22' is formed below the groove 210, the groove 210 and the air venting hole 22' form a through hole penetrating through the body 20 perpendicularly, and the connection The end 22a' is connected to the bottom of the groove 210, and the suction end 22b' is exposed to the second surface 20b" of the body 20.
請參閱第3圖,係本發明承載件之另一實施例的俯視圖。於本實施例中,該承載件3的氣流道結構31係由單一形成於該本體20中之螺狀溝槽所構成,且該螺狀溝槽係外露於該第一表面20a。Referring to Figure 3, there is shown a top plan view of another embodiment of the carrier of the present invention. In this embodiment, the airflow path structure 31 of the carrier 3 is formed by a single spiral groove formed in the body 20, and the spiral groove is exposed on the first surface 20a.
請參閱第4圖,係本發明承載件之另一實施例的俯視圖。於該實施例中,該承載件4同樣係由複數溝槽410與連接通道411所構成之氣流道結構41,差別僅在於形狀不同。Referring to Figure 4, there is shown a top plan view of another embodiment of the carrier of the present invention. In this embodiment, the carrier member 4 is also formed by the air channel structure 41 formed by the plurality of grooves 410 and the connecting passage 411, only in the difference in shape.
於本發明之承載件2,3,4中,該氣流道結構21,31,41皆係以平行於該第一表面20a之方向延伸形成於該本體20中,且該氣流道結構21,31,41係於該第一表面20a之承載區內構成吸附面,且對於該吸附面之形狀並未有特殊的限制,依該溝槽及連接通道之配置而定,該吸附面可為網狀、複數環狀、複數條狀或交織狀吸附面。In the carrier members 2, 3, and 4 of the present invention, the air channel structures 21, 31, 41 are formed in the body 20 in a direction parallel to the first surface 20a, and the air channel structure 21, 31 The 41 is an adsorption surface in the bearing area of the first surface 20a, and the shape of the adsorption surface is not particularly limited. According to the configuration of the groove and the connecting channel, the adsorption surface may be a mesh. , a plurality of rings, a plurality of strips or interlaced adsorption surfaces.
請參閱第5A及5B圖,係本發明承載件具有止流閥之實施例的剖面示意圖。於該實施例中,該承載件5復具有可動式嵌設於該本體20,亦即抽氣孔22中的止流閥50,且該止流閥50可用作為整該承載件5之氣流道結構21之開關,如第5A圖所示,該止流閥50尚未嵌插於該抽氣孔22中時,係令氣流通道開通;當該 止流閥50嵌插於該抽氣孔22中即隔絕該抽氣孔22之連接端22a及抽氣端22b。Referring to Figures 5A and 5B, there are shown cross-sectional views of an embodiment of the carrier of the present invention having a stop valve. In this embodiment, the carrier member 5 has a stop valve 50 movably embedded in the body 20, that is, in the air suction hole 22, and the check valve 50 can be used as the air passage structure of the carrier member 5. The switch of 21, as shown in FIG. 5A, when the stop valve 50 is not inserted into the air vent 22, the air flow passage is opened; The check valve 50 is inserted into the air suction hole 22, that is, the connection end 22a and the suction end 22b of the air suction hole 22 are isolated.
第6A至6C圖係為本發明固定電子元件之方法的剖面示意圖。6A to 6C are schematic cross-sectional views showing a method of fixing an electronic component of the present invention.
如第6A圖所示,將電子元件6置於本發明之承載件5的承載區20c上,該電子元件6可為例如半導體晶片、晶圓、封裝件或其他電子元件,接著藉由抽氣裝置透過該抽氣孔22將該氣流道結構21內之空氣排出,並將該止流閥50嵌插於該抽氣孔22中以隔絕該連接端22a及抽氣端22b,以維持該氣流道結構21中之真空狀態,並吸附該電子元件6,藉以達到固定之目的,如第6B圖所示。As shown in FIG. 6A, the electronic component 6 is placed on the carrying area 20c of the carrier 5 of the present invention, which may be, for example, a semiconductor wafer, wafer, package or other electronic component, followed by pumping The device discharges the air in the air channel structure 21 through the air venting hole 22, and inserts the check valve 50 into the air venting hole 22 to isolate the connecting end 22a and the pumping end 22b to maintain the air channel structure. The vacuum state in 21, and the electronic component 6 is adsorbed, thereby achieving the purpose of fixing, as shown in Fig. 6B.
於本實施例中,係將藉由設置於該抽氣孔22的抽氣端22a之抽氣裝置(未圖示)對該氣流道結構21抽氣,使該電子元件6與該氣流道結構21間藉由真空吸合。In the present embodiment, the air flow path structure 21 is evacuated by an air suction device (not shown) provided at the suction end 22a of the air suction hole 22, so that the electronic component 6 and the air flow path structure 21 are By vacuum suction.
此外,在沒有止流閥之承載件的實施例中,可藉由該抽氣裝置,在停止抽氣後不洩壓,藉以維持氣流道結構內的真空狀態。Further, in the embodiment of the carrier without the stop valve, the suction means can be used to maintain the vacuum state in the air passage structure after the pumping is stopped without releasing pressure.
如第6C圖所示,當欲卸下該電子元件6時,僅需將止流閥50開啟導入空氣破除真空,即可卸下該電子元件6。As shown in Fig. 6C, when the electronic component 6 is to be unloaded, the electronic component 6 can be removed by simply opening the check valve 50 and introducing the air to break the vacuum.
綜上所述,本發明之承載件及用該承載件固定電子元件之方法係利用真空吸附方式達到固定,不需要間接材料(如,黏膠或離型膜),進而降低成本,亦不會有習知方法中藉由黏著層將電子元件固定於承載板,在剝離兩者後,電子元件表面留有殘膠之缺點,能提高產品良率,遂提升整體的生產效能。In summary, the carrier of the present invention and the method for fixing the electronic component by the carrier are fixed by vacuum adsorption, and no indirect material (for example, a glue or a release film) is required, thereby reducing the cost and not In the conventional method, the electronic component is fixed to the carrier by the adhesive layer. After the two are peeled off, the surface of the electronic component has the defect of residual glue, which can improve the product yield and improve the overall production efficiency.
此外,本發明之承載件能用以固定晶圓、經封裝之元件(如, 晶圓級封裝件及晶片尺寸封裝件)或半導體晶片等,應用範圍廣泛,能適用於各種製程。In addition, the carrier of the present invention can be used to fix wafers, packaged components (eg, Wafer-level packages and wafer-size packages) or semiconductor wafers, for a wide range of applications, can be applied to a variety of processes.
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.
2‧‧‧承載件2‧‧‧Carrier
20‧‧‧本體20‧‧‧ body
20c‧‧‧承載區20c‧‧‧bearing area
21‧‧‧氣流道結構21‧‧‧ air passage structure
210‧‧‧溝槽210‧‧‧ trench
211‧‧‧連接通道211‧‧‧Connection channel
22‧‧‧抽氣孔22‧‧‧Pumping holes
2B-2B‧‧‧切割線2B-2B‧‧‧ cutting line
Claims (13)
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TW102146034A TWI514526B (en) | 2013-12-13 | 2013-12-13 | Carrier member and method for fixing electronic component by using the carrier member |
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Citations (5)
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US20090311003A1 (en) * | 2008-06-13 | 2009-12-17 | Konica Minolta Business Technologies, Inc. | Cleaning roller for cleaning image bearing member |
US20120042587A1 (en) * | 2009-05-15 | 2012-02-23 | David Michael Reid | Load bearing member |
CN102586759A (en) * | 2011-01-11 | 2012-07-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas delivery system and semiconductor processing equipment applying same |
TW201318132A (en) * | 2011-10-24 | 2013-05-01 | 矽品精密工業股份有限公司 | Semiconductor package and fabrication method thereof |
CN103214177A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Glass fixing method for multifunctional glass support platform |
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- 2013-12-13 TW TW102146034A patent/TWI514526B/en active
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US20090311003A1 (en) * | 2008-06-13 | 2009-12-17 | Konica Minolta Business Technologies, Inc. | Cleaning roller for cleaning image bearing member |
US20120042587A1 (en) * | 2009-05-15 | 2012-02-23 | David Michael Reid | Load bearing member |
CN102586759A (en) * | 2011-01-11 | 2012-07-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas delivery system and semiconductor processing equipment applying same |
TW201318132A (en) * | 2011-10-24 | 2013-05-01 | 矽品精密工業股份有限公司 | Semiconductor package and fabrication method thereof |
CN103214177A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Glass fixing method for multifunctional glass support platform |
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