TWI514453B - Method for manufacturing and cleaning a substrate - Google Patents
Method for manufacturing and cleaning a substrate Download PDFInfo
- Publication number
- TWI514453B TWI514453B TW102116595A TW102116595A TWI514453B TW I514453 B TWI514453 B TW I514453B TW 102116595 A TW102116595 A TW 102116595A TW 102116595 A TW102116595 A TW 102116595A TW I514453 B TWI514453 B TW I514453B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- metal layer
- cleaning
- acid
- adhesion
- Prior art date
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
本發明係關於一種基板的製造及清潔方法，尤指一種具有高接著力基板的製造方法。The present invention relates to a method of manufacturing and cleaning a substrate, and more particularly to a method of manufacturing a substrate having a high adhesion.
在半導體產業中，陶瓷基板已廣泛被使用在發光二極體(LED)之應用上，氮化鋁基板的採用更是主流。對於LED產品而言，在氮化鋁基板表面鍍上銅層後製成線路，往往因銅層與氮化鋁基板表面之接著力不佳，造成信賴性不佳的問題。In the semiconductor industry, ceramic substrates have been widely used in the application of light-emitting diodes (LEDs), and the adoption of aluminum nitride substrates is more mainstream. In the case of an LED product, a copper layer is plated on the surface of the aluminum nitride substrate to form a wiring, and the adhesion between the copper layer and the surface of the aluminum nitride substrate is often poor, resulting in poor reliability.
面對此種問題，業者往往不得不購買表面粗糙度較高的氮化鋁基板來提升其表面接著力，因為粗糙的表面作為兩層物體之接著面時，由於接觸面積增大，其接著力亦會相對增大。惟如此一來，氮化鋁基板之購入成本將居高不下。亦有業者購買較低成本但表面粗糙度不足之氮化鋁基板，然後自行利用表面粗化製程來處理此種基板，例如利用鹼性溶液的化學方式，或是利用刷磨等機械方式，來粗化基板之表面，以增加其表面與銅層之接著力。使用粗化製程雖然有其改善成效，不過採用化學粗化製程，需耗用額外電力以升高鹼性溶液的溫度；或是採用機械刷磨方式，除了耗用電力之外，還需增加刷磨材料之成本，這對追求成本降低的製造商及其客戶而言，沒有實際而明顯的效益。Faced with such problems, the industry often has to purchase aluminum nitride substrates with higher surface roughness to enhance the surface adhesion force. Because the rough surface acts as the adhesion surface of the two-layer object, the contact force increases due to the contact area. It will also increase relatively. As a result, the purchase cost of aluminum nitride substrates will remain high. There are also manufacturers who purchase aluminum nitride substrates with lower cost but insufficient surface roughness, and then use the surface roughening process to process such substrates, for example, using chemical methods of alkaline solutions or mechanical means such as brushing. The surface of the substrate is roughened to increase the adhesion of its surface to the copper layer. Although the use of the roughening process has its improvement effect, the chemical roughening process requires additional power to increase the temperature of the alkaline solution, or the mechanical brushing method, in addition to the power consumption, the brush needs to be added. The cost of grinding materials, which has no practical and significant benefits for manufacturers and their customers who are pursuing cost reductions.
爰是之故，申請人有鑑於習知技術之缺失，發明出本案「基板的製造及清潔方法」，用以改善上述缺失。For the sake of this, the applicant invented the "Method of Manufacturing and Cleaning the Substrate" in the light of the lack of the prior art to improve the above-mentioned deficiency.
本發明之一面向係提供一種金屬化基板的製造方法，包含下列步驟：提供一基板，該基板具有一表面；使用一特定酸性水溶液清洗該表面；以及形成一金屬層於該表面上。One aspect of the present invention provides a method of fabricating a metallized substrate comprising the steps of providing a substrate having a surface, cleaning the surface with a particular acidic aqueous solution, and forming a metal layer on the surface.
本發明之另一面向係提供一種基板的清潔方法，包含下列步驟：提供一基板，該基板具有一表面；以及使用一酸類清洗該表面，其中該酸類係選自磷酸、草酸、硼酸或其任意組合。Another aspect of the present invention provides a method of cleaning a substrate, comprising the steps of: providing a substrate having a surface; and cleaning the surface with an acid selected from the group consisting of phosphoric acid, oxalic acid, boric acid or any thereof combination.
本發明之又一面向係提供一種剛清洗完之基板，包括：一基板本體，具有一表面，該表面具一接著力及一接觸角，該接觸角為30度以上，俾當該表面貼附有一金屬層，且該金屬層尺寸為1毫米乘以1毫米面積時，該接著力為7牛頓(N)以上，以及當該金屬層尺寸為2毫米乘以2毫米面積時，該接著力為15牛頓(N)以上。A further aspect of the present invention provides a substrate that has just been cleaned, comprising: a substrate body having a surface having an adhesion force and a contact angle, the contact angle being 30 degrees or more, when the surface is attached When there is a metal layer and the metal layer has a size of 1 mm by 1 mm, the adhesion is 7 Newtons (N) or more, and when the metal layer has a size of 2 mm by 2 mm, the adhesion is 15 Newtons (N) or more.
101~111‧‧‧步驟101~111‧‧‧Steps
200‧‧‧金屬化基板200‧‧‧metallized substrate
201‧‧‧基板201‧‧‧Substrate
202‧‧‧金屬層202‧‧‧metal layer
302‧‧‧水珠302‧‧‧Waterdrops
303‧‧‧切線303‧‧‧ Tangent
θ‧‧‧接觸角Θ‧‧‧contact angle
第1圖：本發明一實施例之基板的製造方法的流程圖。Fig. 1 is a flow chart showing a method of manufacturing a substrate according to an embodiment of the present invention.
第2圖：本發明一實施例之金屬化基板的示意圖。2 is a schematic view of a metallized substrate according to an embodiment of the present invention.
第3圖：本發明一實施例之基板的接觸角量測示意圖。Fig. 3 is a view showing the measurement of the contact angle of the substrate according to an embodiment of the present invention.
本發明之實施例的詳細描述係如下所述，然而，除了該等詳細描述之外，本發明還可以廣泛地以其他的實施例來施行。亦即，本發明的範圍並不受已提出之實施例所限制，而應以本發明提出之申請專利範圍為準。The detailed description of the embodiments of the present invention is set forth below, however, in addition to the detailed description, the invention may be That is, the scope of the present invention is not limited by the embodiments which have been proposed, and the scope of the claims of the present invention shall prevail.
請參閱第一圖，其係本發明一實施例之基板的製造方法的流 程圖，其中該基板可以是一電子元件的散熱基板，例如為一LED散熱基板，而該製造方法之步驟包括：步驟101：提供一基板；步驟102：依設計所需位置，對該基板進行鑽孔；步驟103：使用適當清潔劑對該基板表面進行處理，以獲得清潔之效果；步驟104：於該基板表面及孔壁形成一金屬層，以形成一導電層；步驟105：對該基板進行黃光製程，包括清洗、塗覆光阻膜、烘烤、曝光及顯影等步驟，利用光阻於該金屬層上方形成部分被光阻遮蓋、而部分未被光阻遮蓋的圖案，以利後續製程之進行；步驟106：將覆有光阻圖案之該基板送入電鑄(electro-deposition)製程，對未被光阻覆蓋而使該金屬層裸露的區域進行厚金屬層電鍍，以及通孔之填孔使得基板上兩面導電層可藉由孔壁上之金屬鍍膜層而導通；步驟107：對該基板進行剝膜製程，以將其上的光阻去除；步驟108：對表面金屬層進行蝕刻以形成線路以及焊墊；步驟109：對基板進行刷磨(de-bur)製程，以去除鑽孔時所造成之融渣及凸起；步驟110：對基板表面進行防焊材料(solder mask)之印刷；以及步驟111：對焊墊進行表面處理，以增加後續焊接強度、焊接良率以及焊接信賴性。Please refer to the first figure, which is a flow of a method for manufacturing a substrate according to an embodiment of the present invention. The substrate may be an electronic component heat dissipation substrate, such as an LED heat dissipation substrate, and the manufacturing method includes the following steps: Step 101: providing a substrate; Step 102: performing the substrate according to a desired position of the design Drilling; Step 103: treating the surface of the substrate with a suitable cleaning agent to obtain a cleaning effect; Step 104: forming a metal layer on the surface of the substrate and the hole wall to form a conductive layer; Step 105: The substrate Performing a yellow light process, including steps of cleaning, coating a photoresist film, baking, exposing, and developing, using a photoresist to form a pattern partially covered by the photoresist and partially blocked by the photoresist, to facilitate the use of the photoresist The subsequent process is carried out; Step 106: The substrate coated with the photoresist pattern is sent to an electro-deposition process, and a thick metal layer is plated and exposed to a region not exposed by the photoresist to expose the metal layer. The hole filling hole enables the two conductive layers on the substrate to be turned on by the metal plating layer on the hole wall; Step 107: performing a stripping process on the substrate to remove the photoresist thereon; Step 108 Etching the surface metal layer to form a line and a pad; Step 109: performing a de-bur process on the substrate to remove the slag and protrusion caused by the drilling; Step 110: preventing the surface of the substrate Printing of a solder mask; and step 111: surface treating the pad to increase subsequent solder strength, solder yield, and solder reliability.
請參閱第2圖，其係本發明一實施例之金屬化基板200的示意圖。該金屬化基板200之製造方法之步驟包含：提供一基板201；對該基板201進行鑽孔(圖中未示)；使用適當清潔劑(圖中未示)對該基板201表面進行處理，以獲得清潔之效果；以及於該基板201表面沉積一金屬層202，以形成一導電層。Please refer to FIG. 2, which is a schematic diagram of a metallized substrate 200 according to an embodiment of the present invention. The step of manufacturing the metallized substrate 200 includes: providing a substrate 201; drilling the substrate 201 (not shown); and processing the surface of the substrate 201 with a suitable cleaning agent (not shown) to A cleaning effect is obtained; and a metal layer 202 is deposited on the surface of the substrate 201 to form a conductive layer.
本發明所使用的基板201可以為陶瓷基板、玻璃基板、金屬基板(例如鋁芯電路板(Metal Core PCB，MCPCB)所用之鋁基板)、FR4基板等，可依產品需要作選擇。若選用陶瓷基板，可以為氮化鋁或是氧化鋁基板。本發明採用之鑽孔方式通常是雷射或是機械鑽孔方式。基板201表面所沉積的金屬層202可以為銅層或鋁層，依產品需要作選擇。形成金屬層 202的方式可以是真空濺鍍、離子鍍膜、或是直接貼合。在電鑄製程之前，可增加一化學鍍銅製程，以增加孔壁內金屬鍍膜的完整性。The substrate 201 used in the present invention may be a ceramic substrate, a glass substrate, a metal substrate (for example, an aluminum substrate used for an aluminum core circuit board (MCPCB)), an FR4 substrate, or the like, and may be selected according to product requirements. If a ceramic substrate is used, it may be an aluminum nitride or an aluminum oxide substrate. The drilling method used in the present invention is usually a laser or mechanical drilling method. The metal layer 202 deposited on the surface of the substrate 201 may be a copper layer or an aluminum layer, which is selected according to the needs of the product. Forming a metal layer The method of 202 can be vacuum sputtering, ion plating, or direct bonding. Prior to the electroforming process, an electroless copper plating process can be added to increase the integrity of the metallization in the walls of the holes.
為了確認基板表面與金屬層間之接著力是否足夠，會進行一項拉力測試，先將基板固定後，將預先設計好並已於基板表面成形的測試用金屬線路，焊上一條金屬線(例如銅線)，線之另一端由拉力計所夾住，線與所焊的金屬線路表面成垂直方向，啟動拉力計便會逐漸增大拉力，並垂直拉動金屬線路。當金屬層被拉離基板表面時，即可觀察拉力計當時記錄之數值，以作為該接著力之量測數據。為使各次量測數據可相互比較，且每次量測都在相同的條件下進行，通常該測試用金屬線路會以一定尺寸來設計，例如設計成1毫米乘以1毫米(1mm x 1mm)或是2毫米乘以2毫米(2mm x 2mm)的方形焊墊。In order to confirm whether the adhesion between the surface of the substrate and the metal layer is sufficient, a tensile test is performed. After the substrate is fixed, a test metal line which is pre-designed and formed on the surface of the substrate is soldered with a metal wire (for example, copper). Line), the other end of the line is clamped by the tension meter, the line is perpendicular to the surface of the welded metal line, and the tension meter will gradually increase the pulling force and pull the metal line vertically. When the metal layer is pulled away from the surface of the substrate, the value recorded by the dynamometer at that time can be observed as the measured data of the adhesion. In order for each measurement data to be compared with each other and each measurement is performed under the same conditions, the test metal line is usually designed in a certain size, for example, designed to be 1 mm by 1 mm (1 mm x 1 mm). ) or 2 mm by 2 mm (2 mm x 2 mm) square pads.
根據本發明之一實施例，係採用氮化鋁材料之陶瓷基板，其表面中心線平均粗糙度(Ra )只需為0.15μm以下即可，無需使用粗糙度更高但價格昂貴的陶瓷基板，且無須額外的粗化製程來增加其與金屬層間的接著力。當然，在未考慮製造成本的情況下，表面粗糙度更高之基板當然仍可應用於本發明。According to an embodiment of the present invention, a ceramic substrate made of an aluminum nitride material has a surface center line average roughness (R a ) of only 0.15 μm or less, and does not require a ceramic substrate having a higher roughness but an expensive price. And no additional roughening process is required to increase the adhesion between the metal layer and the metal layer. Of course, a substrate having a higher surface roughness can of course be applied to the present invention without considering the manufacturing cost.
該粗糙度可以使用市面上所販售的粗糙度量測儀器來量測。粗糙度量測儀器具有一針尖(stylus)，依其操作方式，順著一基板表面之一線性方向，輕劃過該基板表面並記錄其表面起伏曲線及數據。粗糙度有各種不同計算方式之定義，例如Ra 、Rz 、Rmax 等等，計算出各種粗糙度之數值結果，該數值之單位通常為μm。本發明係使用此領域中最常用之Ra 作為粗糙度之定義，其計算式可以表示為Ra =1/n Σ | yi |，其中yi 為該起伏曲線之數據與所計算出之中心線平均值之間的距離。This roughness can be measured using a roughness measuring instrument that is commercially available. The roughness measuring instrument has a stylus which, according to its operation, glides through the surface of the substrate in a linear direction along a surface of a substrate and records its surface undulations and data. Roughness is defined by various calculation methods, such as R a , R z , R max , etc., and numerical results of various roughnesses are calculated, and the unit of the numerical value is usually μm. The present invention uses the most commonly used R a in the field as the definition of roughness, and the calculation formula can be expressed as R a =1/n Σ | y i |, where y i is the data of the undulation curve and the calculated The distance between the centerline averages.
該基板先依設計進行雷射鑽孔，並進行水洗以去除因鑽孔所造成之污染，必要時可於水洗前先經過一刷磨製程，將鑽孔所產生的融渣及凸起部分先行去除。The substrate is first subjected to laser drilling according to the design, and is washed with water to remove the pollution caused by the drilling. If necessary, the brushing process can be performed before the water washing, and the slag and the convex portion generated by the drilling are advanced. Remove.
接著，取得由選自磷酸、草酸、硼酸或其混合所組成之一的清潔劑，於常溫下(例如30℃以下)將基板浸泡其中，或是將該清潔劑噴灑於該基板表面，或是用超音波震盪清潔，或上述清潔方式的任意組合，使 該基板表面經過該清潔劑之清潔。經過該清潔劑之處理後，該基板表面上之接觸角數值亦會提高。Next, obtaining a cleaning agent consisting of one selected from the group consisting of phosphoric acid, oxalic acid, boric acid, or a mixture thereof, immersing the substrate therein at normal temperature (for example, 30 ° C or lower), or spraying the cleaning agent on the surface of the substrate, or Use ultrasonic oscillating cleaning, or any combination of the above cleaning methods, so that The surface of the substrate is cleaned by the cleaning agent. After the cleaning agent is treated, the contact angle value on the surface of the substrate is also increased.
本發明所使用的清潔劑，若單獨使用磷酸、草酸或硼酸其中一種酸性水溶液時，其個別之重量百分比分別可以為：磷酸約為5%~30%、草酸約為5%~30%、以及硼酸約為5%~30%。若是將三種溶液任意取其中兩種或三種互相組合時，其掺混之重量百分比分別可以為：磷酸約為2%~10%、草酸約為2%~10%、以及硼酸約為2%~10%，其餘為水。When the cleaning agent used in the present invention uses an acidic aqueous solution of phosphoric acid, oxalic acid or boric acid alone, the individual weight percentages thereof may be: about 5% to 30% of phosphoric acid, about 5% to 30% of oxalic acid, and Boric acid is about 5% to 30%. If three or three kinds of three kinds of solutions are combined with each other, the weight percentage of the blending may be: about 2% to 10% of phosphoric acid, about 2% to 10% of oxalic acid, and about 2% of boric acid. 10%, the rest is water.
基板201之表面經使用清潔劑作清洗處理後，可以量測該基板201表面上之接觸角θ。接觸角θ的量測是利用一接觸角計所配置之針頭，將一定量之去離子水滴於該基板201表面上，以形成一水珠302。從側視方向觀察，由於該水珠302具有表面張力，故會因該基板201之表面之潔淨狀態之不同而與該基板201之表面形成一夾角，如第3圖所示。該夾角係取自該基板201表面與該水珠302之表面與靠近該基板201表面處所形成的一切線303所形成之夾角，即稱之為接觸角θ。相關量測數據請參閱表1。由表1可知，使用本發明之方法後，基板201表面上之接觸角θ可達到高於30度以上，遠高於習知技術所使用的一般清潔劑處理者。After the surface of the substrate 201 is cleaned by using a cleaning agent, the contact angle θ on the surface of the substrate 201 can be measured. The measurement of the contact angle θ is performed by using a needle disposed on a contact angle meter to deposit a certain amount of deionized water on the surface of the substrate 201 to form a water droplet 302. As viewed from the side view, since the water ball 302 has a surface tension, it forms an angle with the surface of the substrate 201 due to the clean state of the surface of the substrate 201, as shown in FIG. The angle is taken from the surface formed by the surface of the substrate 201 and the surface of the water droplet 302 and the line 303 formed near the surface of the substrate 201, which is called the contact angle θ. See Table 1 for related measurement data. As can be seen from Table 1, after the method of the present invention, the contact angle θ on the surface of the substrate 201 can be higher than 30 degrees, which is much higher than that of the conventional detergent processor used in the prior art.
接者，經表面清潔之基板，依產品需要，於其單面或雙面之基板表面上，例如以真空濺鍍方式鍍上一層金屬層，該金屬層常為銅層，依需要亦可改為鋁層。此金屬鍍膜可以是全面鍍膜，亦可以是使用遮罩(shadow mask)而於基板表面形成部分鍍膜。The surface-cleaned substrate is coated with a metal layer on the surface of the substrate on one or both sides, for example, by vacuum sputtering, which is often a copper layer, which may be modified as needed. It is an aluminum layer. The metal plating film may be a full-coating film, or a partial mask may be formed on the surface of the substrate by using a shadow mask.
為了在前述銅層所需要的部位將其厚度增厚，可先採用一般黃光製程，使用乾膜貼合(dry film lamination)或是濕膜塗佈(wet film coating)方式，將光阻覆於基板上銅層之表面，經過曝光及顯影，將想要鍍厚銅的銅層位置曝露出來，再經過電鑄製程，便可於曝露之銅層上再以電鍍方式鍍上較厚之銅層。若是曝露之位置有鑽孔所形成的貫孔(through hole)並於孔壁中已鍍上銅層，亦可於孔壁上電鍍形成較厚之銅層，形成具有更低電阻值的導通孔(plated through hole，PTH)，使得基板兩面之銅層電連接。之後，進行剝膜(stripping)製程，將塗覆於基板上之光阻去除。In order to thicken the thickness of the copper layer, a general yellow light process may be used, and the film may be cured by dry film lamination or wet film coating. After exposing and developing on the surface of the copper layer on the substrate, the copper layer to be plated with thick copper is exposed, and then electroforming is performed to deposit thick copper on the exposed copper layer by electroplating. Floor. If the exposed hole has a through hole formed by drilling and a copper layer is plated in the hole wall, a thick copper layer may be formed on the hole wall to form a via hole having a lower resistance value (plated). Through hole (PTH), the copper layers on both sides of the substrate are electrically connected. Thereafter, a stripping process is performed to remove the photoresist applied to the substrate.
然後，對銅層鍍厚之基板進行蝕刻製程，將不需要的銅層去除，以形成所需要的線路、焊墊以及所需要的圖案。此時視需要可再進行刷磨製程，以去除前述之融渣及凸起，以及鍍銅後可能形成的凸起。之後，進行防焊材料之塗佈，其可以採用印刷方式完成。最後，對焊墊進行表面處理，例如對其作化學鍍金、化學鍍銀、化學鍍鎳金、化學鍍鎳鈀金等之覆蓋成膜。The copper-plated substrate is then etched to remove unwanted copper layers to form the desired traces, pads, and desired patterns. At this time, the brushing process may be further performed as needed to remove the aforementioned slag and protrusions, and protrusions which may be formed after copper plating. Thereafter, coating of the solder resist material is performed, which can be accomplished by printing. Finally, the pad is surface-treated, for example, by chemical gold plating, electroless silver plating, electroless nickel plating, electroless nickel-plated palladium, or the like.
採用不同供應商之陶瓷基板，採取前述之方法所製造出來的產品，經由拉力測試以量測其接著力，其量測數據亦如表1所示。與習知技術僅使用一般清潔劑處理者相比較，當使用1mm x 1mm之焊墊測試，本發明之樣品之接著力可高達7牛頓(N)以上，若於2mm x 2mm之焊墊測試，其接著力可達15牛頓(N)以上。然而，當使用習知技術時，其接著力均小於1牛頓(1N)。由上可知，本發明所製造的基板之接著力遠優於習用技術所製造者。The products manufactured by the above methods were measured by a tensile test using ceramic substrates of different suppliers, and the measured data were also shown in Table 1. The adhesion of the sample of the present invention can be as high as 7 Newtons (N) or more when tested using a 1 mm x 1 mm pad as compared to conventional techniques using only a general cleaner processor. If a 2 mm x 2 mm pad test, Its subsequent force can reach 15 Newtons (N) or more. However, when using conventional techniques, the adhesion force is less than 1 Newton (1 N). From the above, it can be seen that the adhesion of the substrate produced by the present invention is far superior to those of the conventional art.
綜上所述，本發明的優點除了提供一種有效改善基板與其表 面金屬層之間接著力的方法之外，所使用的清潔劑無需加熱，在常溫環境下便能使用，因此就無需耗費額外電力來加熱。當然，亦可在清潔劑加熱之條件下對基板進行清洗。此外，由於本發明能有效改善接著力，業者不必再行購買表面粗糙度較高但是價格昂貴的基板來提升其表面接著力，也無須額外的基板粗化製程，這使得基板之購入成本或製程成本有效降低。整體而言，購入基板的成本降低、生產過程中的能源節省、生產良率提升、以及零客訴的達成，這對於追求成本降低的製造商及其客戶而言，實具有實質又明顯的效益。In summary, the advantages of the present invention provide an effective improvement of the substrate and its surface. In addition to the method of adhesion between the metal layers, the cleaning agent used does not require heating and can be used in a normal temperature environment, so that no extra power is required for heating. Of course, the substrate can also be cleaned under the condition that the detergent is heated. In addition, since the present invention can effectively improve the adhesion, the manufacturer does not have to purchase a substrate having a high surface roughness but is expensive to increase the surface adhesion force, and does not require an additional substrate roughening process, which makes the substrate purchase cost or process. The cost is effectively reduced. Overall, the cost of purchasing substrates, the energy savings in the production process, the improvement in production yield, and the achievement of zero customer complaints have substantial and significant benefits for manufacturers and their customers who are pursuing cost reduction. .
本發明以較佳之實施例說明如上，僅用於藉以幫助了解本發明之實施，非用以限定本發明之精神，而熟悉此領域技藝者於領悟本發明之精神後，在不脫離本發明之精神範圍內，當可作些許更動潤飾及等同之變化替換，其專利保護範圍當視後附之申請專利範圍及其等同領域而定。The present invention has been described above with reference to the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and those skilled in the art can understand the spirit of the present invention without departing from the invention. Within the scope of the spirit, when there are some changes and replacements, the scope of patent protection depends on the scope of the patent application and its equivalent.
1.一種金屬化基板的製造方法，包含下列步驟：提供一基板，該基板具有一表面；使用一酸類清洗該表面，其中該酸類係選自磷酸、草酸、硼酸或其任意組合；以及形成一金屬層於該表面上。A method of producing a metallized substrate, comprising the steps of: providing a substrate having a surface; cleaning the surface with an acid, wherein the acid is selected from the group consisting of phosphoric acid, oxalic acid, boric acid, or any combination thereof; and forming a A metal layer is on the surface.
2.如實施例1所述之方法，其中該基板係為一氮化鋁基板或一氧化鋁基板。2. The method of embodiment 1, wherein the substrate is an aluminum nitride substrate or an aluminum oxide substrate.
3.如實施例1~2所述所述之方法，其中該表面之粗糙度為0.15μm以下。3. The method of any of embodiments 1 to 2, wherein the surface has a roughness of 0.15 μm or less.
4.如實施例1~3所述之方法，其中該金屬層之材質係為銅或鋁。4. The method of any of embodiments 1-3, wherein the metal layer is made of copper or aluminum.
5.一種基板的清潔方法，包含下列步驟：提供一基板，該基板具有一表面；以及使用一酸類清洗該表面， 其中該酸類係選自磷酸、草酸、硼酸或其任意組合。A method of cleaning a substrate, comprising the steps of: providing a substrate having a surface; and cleaning the surface with an acid, Wherein the acid is selected from the group consisting of phosphoric acid, oxalic acid, boric acid or any combination thereof.
6.如實施例5所述之方法，其中清洗後之該表面具有一接觸角，該接觸角為30度以上。6. The method of embodiment 5 wherein the surface after cleaning has a contact angle of 30 degrees or more.
7.一種剛清洗完之基板，包括：一基板本體，具有一表面，該表面具一接著力及一接觸角，該接觸角為30度以上，俾當該表面貼附有一金屬層，且該金屬層尺寸為1毫米乘以1毫米面積時，該接著力為7牛頓(N)以上，以及當該金屬層尺寸為2毫米乘以2毫米面積時，該接著力為15牛頓(N)以上。7. A substrate that has just been cleaned, comprising: a substrate body having a surface having an adhesion force and a contact angle of 30 degrees or more, wherein the surface is attached with a metal layer, and the surface When the metal layer has a size of 1 mm by 1 mm, the adhesion is 7 Newtons (N) or more, and when the metal layer has a size of 2 mm by 2 mm, the adhesion is 15 Newtons (N) or more. .
8.如實施例7所述之基板，其中該金屬層之材質係為銅或鋁。8. The substrate of embodiment 7, wherein the metal layer is made of copper or aluminum.
9.如實施例7~8所述之基板，其中該基板本體係為一陶瓷基板、一玻璃基板、一金屬基板、或一FR4基板。9. The substrate of any of embodiments 7-8, wherein the substrate is a ceramic substrate, a glass substrate, a metal substrate, or an FR4 substrate.
10.如實施例7~9所述之基板，其中該表面之粗糙度為0.15μm以下。10. The substrate of any of embodiments 7-9, wherein the surface has a roughness of 0.15 μm or less.
200‧‧‧金屬化基板200‧‧‧metallized substrate
201‧‧‧基板201‧‧‧Substrate
202‧‧‧金屬層202‧‧‧metal layer
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102116595A TWI514453B (en) | 2013-05-09 | 2013-05-09 | Method for manufacturing and cleaning a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102116595A TWI514453B (en) | 2013-05-09 | 2013-05-09 | Method for manufacturing and cleaning a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201443985A TW201443985A (en) | 2014-11-16 |
| TWI514453B true TWI514453B (en) | 2015-12-21 |
Family
ID=52423407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102116595A TWI514453B (en) | 2013-05-09 | 2013-05-09 | Method for manufacturing and cleaning a substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI514453B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI626209B (en) | 2016-08-09 | 2018-06-11 | 綠點高新科技股份有限公司 | Method for making a microfluidic chip and the product thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200801243A (en) * | 2006-05-26 | 2008-01-01 | Cabot Microelectronics Corp | Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates |
| TW201101512A (en) * | 2009-05-02 | 2011-01-01 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| TW201129692A (en) * | 2009-09-11 | 2011-09-01 | Dongwoo Fine Chem Co Ltd | Cleaning composition of substrate for manufacturing flat panel display device |
-
2013
- 2013-05-09 TW TW102116595A patent/TWI514453B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200801243A (en) * | 2006-05-26 | 2008-01-01 | Cabot Microelectronics Corp | Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates |
| TW201101512A (en) * | 2009-05-02 | 2011-01-01 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| TW201129692A (en) * | 2009-09-11 | 2011-09-01 | Dongwoo Fine Chem Co Ltd | Cleaning composition of substrate for manufacturing flat panel display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201443985A (en) | 2014-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI521618B (en) | Wiring substrate and method for manufacturing wiring substrate | |
| US6370768B1 (en) | Circuit board, a method for manufacturing same, and a method of electroless plating | |
| US20110079814A1 (en) | Light emitted diode substrate and method for producing the same | |
| JP2001144393A (en) | Printed circuit board | |
| TWI606765B (en) | Printed circuit board and method for manufacturing same | |
| TWI397358B (en) | Wire bonding substrate and fabrication thereof | |
| JP2009259315A (en) | Suspension board with circuit and production method thereof | |
| JP2012209367A (en) | Lead frame substrate for led element | |
| TWI514453B (en) | Method for manufacturing and cleaning a substrate | |
| TWM521177U (en) | Ultra-fine pitch testing interposer | |
| JP6233973B2 (en) | Metal-ceramic circuit board manufacturing method | |
| TWI521102B (en) | Aluminum plate metallization method | |
| TWI668821B (en) | Electronic component module and manufacturing method thereof | |
| JP7207867B2 (en) | wiring board | |
| TWI507108B (en) | Flexible circuit board and method for manufacturing same | |
| TWI496226B (en) | Printed circuit board structure and method for protecting metal pad from being scraped | |
| WO2024070320A1 (en) | Glass substrate, multilayer wiring substrate, and glass substrate manufacturing method | |
| WO2024070321A1 (en) | Glass substrate, multilayer wiring substrate, and method for producing glass substrate | |
| JP2011082269A (en) | Light emitting diode substrate and method of manufacturing the same | |
| TWI531282B (en) | Circuit board and method for manufacturing the same | |
| JP2000091743A (en) | Build-up multilayered substrate and its manufacture | |
| JP2006308413A (en) | Probe card | |
| JP2010114289A (en) | Method of manufacturing wiring substrate | |
| KR20100033304A (en) | Method of manufacturing a printed circuit board | |
| CN118076001A (en) | DPC ceramic circuit board and preparation method thereof |