TWI513840B - Production method of multilayer film - Google Patents

Production method of multilayer film Download PDF

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TWI513840B
TWI513840B TW103145499A TW103145499A TWI513840B TW I513840 B TWI513840 B TW I513840B TW 103145499 A TW103145499 A TW 103145499A TW 103145499 A TW103145499 A TW 103145499A TW I513840 B TWI513840 B TW I513840B
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coating
carrier
buffer
buffers
plated
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TW201623663A (en
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Description

多層膜的量產方法Mass production method of multilayer film

本發明是有關於一種薄膜的量產方法,特別是指一種多層膜的量產方法。The present invention relates to a method for mass production of a film, and more particularly to a method for mass production of a multilayer film.

在薄膜製程中,一般用以在待鍍物表面鍍覆多層膜的量產設備,多半是以一鍍膜生產線來完成。該鍍膜生產線是沿一排列方向依序配置有在同一真空腔體內的一前緩衝區間、多數個各含有不同靶材的鍍膜區間,及一個後緩衝區間,且該鍍膜生產線還包含一個載具。前述量產設備之鍍膜生產線在執行一整批次之待鍍物之多層膜的量產方法時,是由該載具將該等待鍍物依序送入該鍍膜生產線內,以分別依序通過該前緩衝區間與該等鍍膜區間內執行各鍍膜製程,而分別在完成每一鍍膜區間的鍍膜製程以在各待鍍物上形成有一總厚度約達數十奈米(nm)至數十微米(μm)的多層膜後,自該鍍膜生產線的後緩衝區間離開,即可得到一整批次之鍍覆有各多層膜的完成品。In the thin film process, the mass production equipment generally used for plating a multilayer film on the surface of the object to be plated is mostly completed by a coating production line. The coating production line is arranged in a sequence along a front buffer zone in the same vacuum chamber, a plurality of coating zones containing different targets, and a rear buffer zone, and the coating production line further comprises a carrier. When the coating production line of the mass production equipment performs a mass production method of a batch of the multilayer film to be plated, the waiting plate is sequentially sent into the coating production line by the carrier to sequentially pass through the coating production line. The coating process is performed between the front buffer regions and the coating sections, and the coating process of each coating section is completed to form a total thickness of about several tens of nanometers (nm) to several tens of micrometers on each of the objects to be plated. After the (μm) multilayer film is removed from the back buffer zone of the coating line, a complete batch of finished products coated with the respective multilayer films can be obtained.

目前上述多層膜的量產方法雖然能夠量產出整批次之多層膜的完成品。但需說明的是,在量產過程中,為均勻地鍍製出該等多層膜,該等待鍍物於各鍍膜區間執 行各鍍膜製程時需分別於各鍍膜區間的靶材下方位移多次。然而,由於各鍍膜區間之靶材下方位置處是屬於一電漿區;因此,在進行各厚度達數十奈米至數十微米之多層膜的鍍膜製程中,該等待鍍物將因長時間暴露在各電漿區而衍生出過熱問題。一旦該等待鍍物是由不耐熱的材質所構成時,該等待鍍物也將因前述過熱問題而產生變形,以致於降低該等完成品的鍍膜品質。At present, the mass production method of the above multilayer film can produce a finished product of the entire batch of the multilayer film. However, it should be noted that in the mass production process, in order to uniformly plate the multilayer films, the waiting plating is carried out in each coating interval. Each coating process needs to be displaced multiple times under the target of each coating section. However, since the position below the target of each coating section belongs to a plasma zone; therefore, in the coating process for each multilayer film having a thickness of several tens of nanometers to several tens of micrometers, the waiting plating material will be long Exposure to each plasma zone gives rise to overheating problems. Once the waiting plating material is composed of a heat-resistant material, the waiting plating material is also deformed by the aforementioned overheating problem, so that the coating quality of the finished product is lowered.

再者,上述鍍膜生產線也礙於該量產設備的限制,該載具只能令該整批待鍍物中的單一個待鍍物在完成每一鍍膜區間的鍍膜製程以產生其完成品後,才能再重新載放下一個待鍍物。因此,導致未執行鍍膜製程的鍍膜區間閒置,並造成量產效率不彰且提高時間成本的困擾。Moreover, the above coating production line is also hindered by the limitation of the mass production equipment, and the carrier can only make a single object to be plated in the batch to be plated after the coating process of each coating section is completed to produce the finished product. In order to reload the next object to be plated. Therefore, the coating section where the coating process is not performed is left idle, and the mass production efficiency is ineffective and the time cost is increased.

經上述說明可知,在解決待鍍物過熱等問題的前提下,找出如何更有效率地利用每一鍍膜區間以提升量產效率,是此技術領域的相關技術人員所待突破的難題According to the above description, under the premise of solving the problem of overheating of the object to be plated, it is a difficult problem for the relevant technical personnel in the technical field to find out how to use each coating section more efficiently to improve the mass production efficiency.

因此,本發明之目的,即在提供一種多層膜的量產方法。Accordingly, it is an object of the present invention to provide a method of mass production of a multilayer film.

於是,本發明一種多層膜的量產方法,是用以將多數待鍍物進行多道鍍膜程序,其依序包含以下步驟:一步驟(a)、一步驟(b)、一步驟(c)、一步驟(d),及一步驟(e)。Therefore, the mass production method of the multilayer film of the present invention is to carry out a multi-coating process for a plurality of materials to be plated, which comprises the following steps in sequence: one step (a), one step (b), one step (c) , a step (d), and a step (e).

該步驟(a)是提供一具有(n+1)個緩衝區間、n個鍍膜區間與多個載具的鍍膜生產線,該等緩衝區間與該等鍍膜區間是沿一排列方向依序輪流設置於一真空腔體內,n ≧2且是正整數。The step (a) is to provide a coating production line having (n+1) buffer zones, n coating zones and a plurality of carriers, wherein the buffer zones and the coating zones are arranged in turn along an arrangement direction. a vacuum chamber, n ≧ 2 is a positive integer.

該步驟(b)是於該鍍膜生產線的第一個緩衝區間或第二個緩衝區間載入放置有第一個待鍍物的第一個載具。In the step (b), the first carrier placed with the first object to be plated is loaded between the first buffer or the second buffer of the coating line.

該步驟(c)是令第一個載具於第一個鍍膜區間執行第一道鍍膜程序以於第一個待鍍物上形成一第一膜層時,是於該第一、二個緩衝區間兩者間位移至少一次。The step (c) is to perform the first coating process in the first coating zone to form a first film layer on the first object to be plated, in the first and second buffers. The interval is shifted at least once between the two.

該步驟(d)是令第一個載具位於第二個緩衝區間或第三個緩衝區間,且同時於該鍍膜生產線的第一個緩衝區間或第二個緩衝區間載入放置有第二個待鍍物的第二個載具,但有條件的是,當第二個載具位於第二個緩衝區間時,第一個載具是位於第三個緩衝區間。The step (d) is to place the first carrier between the second buffer or the third buffer, and simultaneously load the second buffer between the first buffer or the second buffer of the coating line. The second carrier to be plated, but conditionally, when the second carrier is located between the second buffer, the first carrier is located between the third buffer.

該步驟(e)是同時令第二個載具與第一個載具分別於第一個鍍膜區間與第二個鍍膜區間內執行第一道鍍膜程序與第二道鍍膜程序,以分別於第二個待鍍物上與第一個待鍍物之上形成該第一膜層與一第二膜層時,是同時分別於第一、二個緩衝區間兩者間與第二、三個緩衝區間兩者間位移至少一次,但有條件的是,當第二個載具位於第二個緩衝區間時,第一個載具是位於第三個緩衝區間。The step (e) is to simultaneously perform the first coating process and the second coating process in the first coating zone and the second coating zone respectively for the second carrier and the first carrier, respectively. When the first film layer and the second film layer are formed on the two objects to be plated and the first object to be plated, respectively, the first and second buffers are respectively separated from the second and third buffers. The interval is shifted at least once, but conditionally, when the second carrier is located between the second buffer, the first carrier is located between the third buffer.

本發明之功效在於:利用該鍍膜生產線之依序輪流配置的緩衝區間與鍍膜區間,並配合該等載具同時進入相對應的各鍍膜區間內執行各道鍍膜程序時,是於各鍍膜區間之兩相鄰緩衝區間位移,使各鍍膜區間內是同時執行各道鍍膜程序且未呈現出閒置狀態,以有效地利用各鍍 膜區間並提高鍍膜生產線的利用率,進而提高產能。The effect of the invention is that the buffer zone and the coating zone arranged in turn in the coating production line are combined with the carriers to simultaneously enter the corresponding coating zones to perform each coating process, which is in each coating zone. The displacement between the two adjacent buffers enables each coating process to be performed simultaneously in each coating section and does not exhibit an idle state, so as to effectively utilize each plating. The membrane section improves the utilization rate of the coating line and increases the production capacity.

1‧‧‧真空腔體1‧‧‧vacuum chamber

2‧‧‧入口閥門2‧‧‧ inlet valve

3‧‧‧出口閥門3‧‧‧Export valve

41‧‧‧第一個緩衝區間41‧‧‧The first buffer zone

42‧‧‧第二個緩衝區間42‧‧‧Between the second buffer zone

43‧‧‧第三個緩衝區間43‧‧‧The third buffer zone

44‧‧‧第四個緩衝區間44‧‧‧The fourth buffer zone

51‧‧‧第一個鍍膜區間51‧‧‧First coating interval

52‧‧‧第二個鍍膜區間52‧‧‧Second coating interval

53‧‧‧第三個鍍膜區間53‧‧‧The third coating interval

61‧‧‧第一個載具61‧‧‧First vehicle

62‧‧‧第二個載具62‧‧‧Second vehicle

63‧‧‧第三個載具63‧‧‧ third vehicle

64‧‧‧第四個載具64‧‧‧fourth vehicle

7‧‧‧傳輸機構7‧‧‧Transportation agency

71‧‧‧滾輪組71‧‧‧Roller set

72‧‧‧伺服馬達72‧‧‧Servo motor

8‧‧‧自動回流單元8‧‧‧Automatic reflow unit

81‧‧‧載出腔81‧‧‧Loading the cavity

82‧‧‧載入腔82‧‧‧Loading cavity

83‧‧‧回送機構83‧‧‧Return agency

831‧‧‧沉降段831‧‧‧Settlement

832‧‧‧舉升段832‧‧‧lifting section

833‧‧‧中繼段833‧‧‧ hop

X‧‧‧排列方向X‧‧‧Orientation

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一示意圖,說明本發明多層膜的量產方法之一實施例的一步驟(c)的第一個載具在一鍍膜生產線之第一、二個緩衝區間兩者間位移以進行第一道鍍膜程序;圖2是一示意圖,說明該實施例的一步驟(e)之第二個與第一個載具分別在第一、二個與第二、三個緩衝區間兩者間位移以分別進行第一與第二道鍍膜程序;圖3是一示意圖,說明該實施例之一步驟(g)的第三個、第二個與第一個載具分別在第一、二個、第二、三個與第三、四個緩衝區間兩者間位移以分別進行第一、第二與第三道鍍膜程序;圖4是一示意圖,說明該實施例的第一個載具在完成各道鍍膜程序後以透過一自動回流單元中的一回送機構傳送至該鍍膜生產線的一入口閥門處。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a schematic diagram illustrating a step (c) of an embodiment of the method for mass production of the multilayer film of the present invention. The first carrier is displaced between the first and second buffers of the coating line for performing the first coating process; FIG. 2 is a schematic diagram illustrating the second of the step (e) of the embodiment. The first carrier is respectively displaced between the first, second and second and third buffers to perform the first and second coating processes respectively; FIG. 3 is a schematic diagram illustrating one of the steps of the embodiment ( g) The third, second and first carriers are respectively displaced between the first, second, second, third and third and fourth buffers to perform the first and second respectively The third coating process; FIG. 4 is a schematic view showing that the first carrier of the embodiment is transferred to an inlet valve of the coating production line through a returning mechanism in an automatic reflow unit after completing each coating process. .

在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

參閱圖1、圖2、圖3與圖4,本發明多層膜的量產方法的一實施例,是用以將多數待鍍物(圖未示)進行多道鍍膜程序,並量產出各待鍍物上鍍覆有一多層膜(圖未示) 的完成品。前述完成品可以是例如,表面鍍覆有光學鍍膜的光學鏡片或表面鍍覆有金屬鍍膜的半導體封裝晶片等。本發明該實施例包含以下步驟:一步驟(a)、一步驟(b)、一步驟(c)、一步驟(d)、一步驟(e)、一步驟(f),及一步驟(g)。Referring to FIG. 1, FIG. 2, FIG. 3 and FIG. 4, an embodiment of the mass production method of the multilayer film of the present invention is used for performing a plurality of coating processes for a plurality of materials to be plated (not shown), and The plating object is plated with a multilayer film (not shown) Finished product. The finished product may be, for example, an optical lens whose surface is plated with an optical coating or a semiconductor package wafer whose surface is plated with a metal plating. The embodiment of the present invention comprises the following steps: a step (a), a step (b), a step (c), a step (d), a step (e), a step (f), and a step (g). ).

該步驟(a)是提供一如圖1所示之鍍膜生產線。詳細而言,該鍍膜生產線具有(n+1)個緩衝區間41、42、43、44、n個鍍膜區間51、52、53,與多個載具61、62、63、64。該等緩衝區間41、42、43、44與該等鍍膜區間51、52、53是沿一排列方向X依序輪流設置於一真空腔體1內,n≧2且是正整數。This step (a) is to provide a coating line as shown in FIG. Specifically, the coating line has (n+1) buffer zones 41, 42, 43, 44, n coating sections 51, 52, 53 and a plurality of carriers 61, 62, 63, 64. The buffer zones 41, 42, 43, 44 and the coating sections 51, 52, and 53 are sequentially disposed in a vacuum chamber 1 in an array direction X, n ≧ 2 and are positive integers.

該鍍膜生產線還具有分別設置於該真空腔體1之相反兩端的一入口閥門2、一出口閥門3、一連續地設置於該等緩衝區間41、42、43、44和該等鍍膜區間51、52、53內且用以傳輸該等載具61、62、63、64的傳輸機構7,及一供該等載具61、62、63、64自該出口閥門3回流至該入口閥門2的自動回流單元8。該自動回流單元8包括一銜接該出口閥門3的載出腔81、一銜接該入口閥門2的載入腔82,及一銜接於該載出腔81與該載入腔82之間的回送機構83。該回送機構83具有一對應該載出腔81設置的沉降段831、一對應該載入腔82設置的舉升段832,及一連接該沉降段831與該舉升段832的中繼段833。在本發明該實施例中,n=3;該等載具61、62、63、64的數量是四個以上。The coating production line further has an inlet valve 2, an outlet valve 3 respectively disposed at opposite ends of the vacuum chamber 1, and a continuous arrangement in the buffer zones 41, 42, 43, 44 and the coating sections 51, 52, 53 and a transport mechanism 7 for transporting the carriers 61, 62, 63, 64, and a return of the carriers 61, 62, 63, 64 from the outlet valve 3 to the inlet valve 2 Automatic reflow unit 8. The automatic reflow unit 8 includes a loading chamber 81 that connects the outlet valve 3, a loading chamber 82 that engages the inlet valve 2, and a return mechanism that is coupled between the loading chamber 81 and the loading chamber 82. 83. The return mechanism 83 has a pair of settling sections 831 to be provided by the loading chamber 81, a pair of lifting sections 832 to be placed in the loading chamber 82, and a hop section 833 connecting the settling section 831 and the lifting section 832. . In this embodiment of the invention, n = 3; the number of the carriers 61, 62, 63, 64 is four or more.

以下為便利說明起見,自該入口閥門2沿該排 列方向X至該出口閥門3,擬將該等緩衝區間41、42、43、44與該等鍍膜區間51、52、53分別命名為,第一個緩衝區間41、第一個鍍膜區間51、第二個緩衝區間42、第二個鍍膜區間52、第三個緩衝區間43、第三個鍍膜區間53,及第四個緩衝區間44,且該等載具61、62、63、64是依順序命名為第一個載具61、第二個載具62、第三個載具63,和第四個載具64。The following is for convenience of explanation, along the row from the inlet valve 2 Column direction X to the outlet valve 3, it is intended to name the buffer zones 41, 42, 43, 44 and the coating zones 51, 52, 53 respectively, the first buffer zone 41, the first coating zone 51, a second buffer zone 42, a second coating zone 52, a third buffer zone 43, a third coating zone 53, and a fourth buffer zone 44, and the carriers 61, 62, 63, 64 are The order is named as the first carrier 61, the second carrier 62, the third carrier 63, and the fourth carrier 64.

該步驟(a)之每一個鍍膜區間51、52、53包括至少一鍍膜段,且該等鍍膜段是分別以一靶材來執行各鍍膜程序,該等靶材是由不同材質或相同材質所構成。在本發明該實施例中,第一、第二與第三個鍍膜區間51、52、53之鍍膜段的數量分別是兩個、一個與兩個;此外,第一個鍍膜區間51之該兩鍍膜段(以下稱前鍍膜段與後鍍膜段)的靶材沿該排列方向X依序是由不銹鋼(stainless steel;SUS)與銅(Cu)所構成,第二個鍍膜區間52之鍍膜段的靶材是由銅所構成,且第三個鍍膜區間53之該兩鍍膜段(以下稱前鍍膜段與後鍍膜段)的靶材沿該排列方向X則是由銅與不銹鋼所構成。Each of the coating sections 51, 52, and 53 of the step (a) includes at least one coating section, and the coating sections respectively perform a coating process by using a target material, which is made of different materials or the same material. Composition. In this embodiment of the invention, the number of coating sections of the first, second and third coating sections 51, 52, 53 is two, one and two, respectively; in addition, the two of the first coating section 51 The target of the coating section (hereinafter referred to as the front coating section and the rear coating section) is sequentially composed of stainless steel (SUS) and copper (Cu) along the alignment direction X, and the coating section of the second coating section 52 is The target is made of copper, and the targets of the two coating sections (hereinafter referred to as the front coating section and the rear coating section) of the third coating section 53 are made of copper and stainless steel along the alignment direction X.

再參閱圖1,該步驟(b)是於該鍍膜生產線的第一個緩衝區間41或第二個緩衝區間42載入放置有第一個待鍍物的第一個載具61。該步驟(c)是於該步驟(b)後,令第一個載具61於第一個鍍膜區間51執行第一道鍍膜程序以於第一個待鍍物上形成一第一膜層時,是於該第一、二個緩衝區間41、42兩者間位移至少一次。在本發明該實施例 中,該步驟(b)是於該鍍膜生產線的第一個緩衝區間42載入放置有第一個待鍍物的第一個載具61;該步驟(c)則是先開啟第一個鍍膜區間51之前鍍膜段的靶材(SUS)電源,令第一個載具61於第一、二個緩衝區間41、42兩者間位移5次後,並關閉第一個鍍膜區間51之前鍍膜段的靶材(SUS)電源且開啟後鍍膜段之靶材(Cu)電源,以令第一個載具61於第一、二個緩衝區間41、42兩者間繼續位移20次,從而完成該步驟(c)之第一道鍍膜程序。詳細地來說,該步驟(c)之第一個載具61於第一個鍍膜區間51執行第一道鍍膜程序時,是在第一、二個緩衝區間41、42兩者間位移25次,且前述位移次數所指的是令第一個載具61自第一個緩衝區間41出發至第二個緩衝區間定義為位移第一次,自第二個緩衝區間42回到第一個緩衝區間41稱為位移第二次,並以此類推。Referring again to Figure 1, step (b) is to load the first carrier 61 in which the first object to be plated is placed in the first buffer zone 41 or the second buffer zone 42 of the coating line. The step (c) is after the step (b), the first carrier 61 is subjected to the first coating process in the first coating section 51 to form a first film layer on the first object to be plated. Is displaced at least once between the first and second buffers 41, 42. This embodiment of the invention In the step (b), the first buffer zone 42 in which the first object to be plated is placed is loaded in the first buffer zone 42 of the coating line; in the step (c), the first coating film is first opened. The target (SUS) power supply of the coating section before the interval 51 causes the first carrier 61 to be displaced 5 times between the first and second buffer zones 41, 42 and closes the coating section before the first coating section 51. The target (SUS) power supply and the target (Cu) power supply of the post-coating section is turned on, so that the first carrier 61 continues to be displaced 20 times between the first and second buffer zones 41, 42 to complete the The first coating procedure of step (c). In detail, the first carrier 61 of the step (c) is displaced 25 times between the first and second buffer zones 41 and 42 when the first coating process is performed in the first coating section 51. And the foregoing number of shifts refers to the first carrier 61 being defined as the displacement for the first time from the first buffer 41 to the second buffer, and returning to the first buffer from the second buffer 42 The interval 41 is called the displacement for the second time, and so on.

參閱圖2,該步驟(d)是於該步驟(c)後,令第一個載具61位於第二個緩衝區間42或第三個緩衝區間43,且同時於該鍍膜生產線的第一個緩衝區間41或第二個緩衝區間42載入放置有第二個待鍍物的第二個載具62;但有條件的是,當第二個載具62位於第二個緩衝區間42時,第一個載具61是位於第三個緩衝區間43。Referring to FIG. 2, the step (d) is after the step (c), the first carrier 61 is located between the second buffer zone 42 or the third buffer zone 43 and simultaneously at the first of the coating production line. The buffer zone 41 or the second buffer zone 42 loads the second carrier 62 on which the second object to be plated is placed; but conditionally, when the second carrier 62 is located between the second buffer zone 42, The first carrier 61 is located between the third buffer zone 43.

再參閱圖2,該步驟(e)是於該步驟(d)後,同時令第二個載具62與第一個載具61分別於第一個鍍膜區間51與第二個鍍膜區間52內執行第一道鍍膜程序與第二道鍍膜程序,以分別於第二個待鍍物上與第一個待鍍物之上 形成該第一膜層與一第二膜層時,是同時分別於第一、二個緩衝區間41、42兩者間與第二、三個緩衝區間42、43兩者間位移至少一次;但有條件的是,當第二個載具62位於第二個緩衝區間42時,第一個載具61是位於第三個緩衝區間43。Referring to FIG. 2, the step (e) is after the step (d), and the second carrier 62 and the first carrier 61 are respectively disposed in the first coating section 51 and the second coating section 52. Performing a first coating process and a second coating process to respectively be on the second object to be plated and the first object to be plated When the first film layer and the second film layer are formed, they are displaced at least once between the first and second buffer zones 41, 42 and the second and third buffer zones 42, 43 respectively; Conditionally, when the second carrier 62 is located between the second buffers 42, the first carrier 61 is located between the third buffers 43.

在本發明該實施例中,該步驟(d)是令第一個載具61位於第二個緩衝區間42,且同時於該鍍膜生產線的第一個緩衝區間41載入放置有第二個待鍍物的第二個載具62;該步驟(e)則是在同時開啟第一個鍍膜區間51之前鍍膜段的靶材(SUS)電源與該第二個鍍膜區間52之鍍膜段的靶材(Cu)電源後,分別令第二個載具62與第一個載具61於第一、二個緩衝區間41、42兩者間與第二、三個緩衝區間42、43兩者間位移5次後,關閉第一個鍍膜區間51之前鍍膜段的靶材(SUS)電源並開啟其後鍍膜段之靶材(Cu)電源,繼續令第二個載具62與第一個載具61分別於第一、二個緩衝區間41、42兩者間與第二、三個緩衝區間42、43兩者間位移20次,以分別完成該步驟(e)之第一道鍍膜程序與第二道鍍膜程序;此外,該步驟(e)之第二個載具62與第一個載具61分別於第一個鍍膜區間51與第二個鍍膜區間52內執行第一道鍍膜程序與第二道鍍膜程序時所耗費的時間相同,所位移的次數相同(皆為25次),且所位移的速率相同。In this embodiment of the invention, the step (d) is such that the first carrier 61 is located between the second buffers 42 and simultaneously loaded with the second buffer 41 in the first buffer of the coating line. a second carrier 62 of the plating; the step (e) is a target (SUS) power supply of the coating section and a coating section of the coating section of the second coating section 52 before the first coating section 51 is simultaneously opened. After the (Cu) power supply, the second carrier 62 and the first carrier 61 are respectively displaced between the first and second buffer zones 41, 42 and the second and third buffer zones 42, 43 respectively. After 5 times, the target (SUS) power supply of the coating section before the first coating section 51 is turned off and the target (Cu) power supply of the subsequent coating section is turned on, and the second carrier 62 and the first carrier 61 are continued. Displacement between the first and second buffers 41, 42 and the second and third buffers 42 and 43 respectively to complete the first coating process and the second step of the step (e), respectively. In addition, the second carrier 62 and the first carrier 61 of the step (e) perform the first in the first coating section 51 and the second coating section 52, respectively. The coating process is the same as the second coating process, with the same number of shifts (25 times) and the same rate of displacement.

參閱圖3,該步驟(f)是於該步驟(e)後,令第一個載具61位於第三個緩衝區間43或第四個緩衝區間44, 且同時令第二個載具62位於第二個緩衝區間42或第三個緩衝區間43,並同時於該鍍膜生產線的第一個緩衝區間41或第二個緩衝區間42載入放置有第三個待鍍物的第三個載具63;但有條件的是,當第三個載具63位於第二個緩衝區間42時,第二個載具62是位於第三個緩衝區間43,且第一個載具61是位於第四個緩衝區間44。Referring to FIG. 3, the step (f) is after the step (e), the first carrier 61 is placed between the third buffer zone 43 or the fourth buffer zone 44. At the same time, the second carrier 62 is located between the second buffer zone 42 or the third buffer zone 43 and simultaneously loaded in the first buffer zone 41 or the second buffer zone 42 of the coating production line. a third carrier 63 to be plated; but conditionally, when the third carrier 63 is located between the second buffers 42, the second carrier 62 is located between the third buffers 43 and The first carrier 61 is located between the fourth buffer zone 44.

再參閱圖3,該步驟(g)是於該步驟(f)後,同時令第三個載具63、第二個載具62與第一個載具61分別於第一個鍍膜區間51、第二個鍍膜區間52與第三個鍍膜區間53內執行第一道鍍膜程序、第二道鍍膜程序與第三道鍍膜程序,以分別於第三個待鍍物上、第二個待鍍物之上與第一個待鍍物之上形成該第一膜層、該第二膜層與一第三層膜時,是同時分別於第一、二個緩衝區間41、42兩者間、第二、三個緩衝區間42、43兩者間與第三、四個緩衝區間43、44兩者間位移至少一次;但有條件的是,當第三個載具63位於第二個緩衝區間42時,第二個載具62是位於第三個緩衝區間43且第一個載具61是位於第四個緩衝區間44。Referring to FIG. 3 again, the step (g) is after the step (f), and the third carrier 63, the second carrier 62 and the first carrier 61 are respectively in the first coating section 51, The first coating section 52 and the third coating section 53 perform the first coating process, the second coating process and the third coating process to respectively be on the third object to be plated, and the second object to be plated When the first film layer, the second film layer and the third layer film are formed on the first object to be plated, the film is simultaneously between the first and second buffer zones 41 and 42 respectively. 2. The displacement between the three buffers 42 and 43 and the third and fourth buffers 43 and 44 is at least once; but conditionally, when the third carrier 63 is located between the second buffers 42 The second carrier 62 is located between the third buffer zone 43 and the first carrier 61 is located between the fourth buffer zone 44.

在本發明該實施例中,該步驟(f)是令第一個載具61位於第三個緩衝區間43,且同時令第二個載具62位於第二個緩衝區間42,並同時於該鍍膜生產線的第一個緩衝區間41載入放置有第三個待鍍物的第三個載具63;該步驟(g)則是在同時開啟第一個鍍膜區間51之前鍍膜段的靶材(SUS)電源、該第二個鍍膜區間52之鍍膜段的靶材(Cu) 電源與第三個鍍膜區間53之前鍍膜段的靶材(Cu)電源後,分別令第三個載具63、第二個載具62與第一個載具61於第一、二個緩衝區間41、42兩者間、第二、三個緩衝區間42、43兩者間與第三、四個緩衝區間43、44兩者間位移5次後,同時關閉第一個鍍膜區間51之前鍍膜段的靶材(SUS)電源與第三個鍍膜區間53之前鍍膜段的靶材(Cu)電源並開啟第一個鍍膜區間51之後鍍膜段的靶材(Cu)電源與第三個鍍膜區間53之後鍍膜段的靶材(SUS)電源,繼續令第三個載具63、第二個載具62與第一個載具61分別於第一、二個緩衝區間41、42兩者間、第二、三個緩衝區間42、43兩者間與第三、四個緩衝區間43、44兩者間位移20次,以分別完成該步驟(g)之第一道鍍膜程序、第二道鍍膜程序與第三道鍍膜程序;此外,該步驟(g)之第三個載具63、第二個載具62與第一個載具61分別於第一個鍍膜區間51、第二個鍍膜區間52與第三個鍍膜區間53內執行第一道鍍膜程序、第二道鍍膜程序與第三道鍍膜程序時所耗費的時間相同,所位移的次數相同(皆為25次),且所位移的速率相同。In this embodiment of the invention, the step (f) is such that the first carrier 61 is located in the third buffer zone 43, and at the same time the second carrier 62 is located in the second buffer zone 42, and at the same time The first buffer zone 41 of the coating line is loaded with the third carrier 63 on which the third object to be plated is placed; this step (g) is the target of the coating section before the first coating zone 51 is simultaneously opened ( SUS) power supply, target of the coating section of the second coating section 52 (Cu) After the power source and the target (Cu) power supply of the coating section before the third coating section 53, the third carrier 63, the second carrier 62 and the first carrier 61 are respectively disposed between the first and second buffers. After 41, 42 between the second and third buffer zones 42, 43 and the third and fourth buffer zones 43 and 44, the coating section is closed before the first coating section 51 is closed. The target (Cu) power supply and the target (Cu) power supply of the coating section before the third coating section 53 and after the first coating section 51 is opened, the target (Cu) power supply of the coating section and the third coating section 53 are The target (SUS) power supply of the coating section continues to cause the third carrier 63, the second carrier 62 and the first carrier 61 to be respectively between the first and second buffer zones 41, 42 and the second And shifting between the three buffers 42 and 43 and the third and fourth buffers 43 and 44 to complete the first coating process and the second coating process of the step (g), respectively. a third coating process; further, the third carrier 63, the second carrier 62 and the first carrier 61 of the step (g) are respectively in the first coating section 51, the second The coating time 52 and the third coating section 53 are the same in the first coating process, the second coating process and the third coating process, and the number of displacements is the same (25 times), and The rate of displacement is the same.

經上幾段的說明可知,放置在該第一個載具61上的第一個待鍍物依序結束第一道、第二道與第三道鍍膜程序後,即成為位移75次之鍍覆有第一膜層、第二膜層與第三膜層的第一個完成品。As can be seen from the above paragraphs, the first object to be plated placed on the first carrier 61 sequentially finishes the first, second and third coating processes, and then becomes plated 75 times. The first finished product covered with the first film layer, the second film layer and the third film layer.

如圖4所示,以相同於前述各步驟之執行條件,同時令第四個載具64、第三個載具63與第二個載具62分 別於第一個鍍膜區間51、第二個鍍膜區間52與第三個鍍膜區間53內,執行第一道鍍膜程序、第二道鍍膜程序與第三道鍍膜程序,以分別於第四個待鍍物上、第三個待鍍物之上與第二個待鍍物之上形成該第一膜層、該第二膜層與該第三層膜時,是同時分別於第一、二個緩衝區間41、42兩者間、第二、三個緩衝區間42、43兩者間與第三、四個緩衝區間43、44兩者間位移25次,其分別在執行第一、第二與第三道鍍膜程序時所耗費的時間相同,且所位移的速率相同。依此類推,當放置在該第二個載具62上的第二個待鍍物依序結束第一道、第二道與第三道鍍膜程序後,即成為位移75次之鍍覆有第一膜層、第二膜層與第三膜層的第二個完成品。As shown in FIG. 4, the fourth carrier 64, the third carrier 63, and the second carrier 62 are simultaneously divided by the same execution conditions as the foregoing steps. Except in the first coating section 51, the second coating section 52 and the third coating section 53, the first coating procedure, the second coating procedure and the third coating procedure are performed to respectively treat the fourth coating Forming the first film layer, the second film layer and the third layer film on the plating object, the third object to be plated and the second object to be plated, respectively, at the same time as the first and the second Between the buffers 41, 42 and between the second and third buffers 42, 43 and the third and fourth buffers 43 and 44 are shifted 25 times, respectively, which are executed in the first and second The third coating process takes the same amount of time and the rate of displacement is the same. And so on, when the second object to be plated placed on the second carrier 62 sequentially ends the first, second, and third coating processes, the plate is displaced 75 times. A second finished product of a film layer, a second film layer and a third film layer.

此處需說明的是(再參閱圖4),放置在第一個載具61上的第一個完成品是經過該出口閥門3進入該載出腔81,再透過一機械手臂或人工方式拿出第一個完成品。此時,設置於該載出腔81的一壓縮式升降單元(圖未示)會帶動未放置有任何待鍍物的第一個載具61下降到該沉降段831,以透過該回送機構83的作動令未放置有任何待鍍物的第一個載具61通過該中繼段833回流到該舉升段822後,再透過設置於該舉升段832的一壓縮式升降單元(圖未示)帶動未放置有任何待鍍物的第一個載具61上升至該載入腔82,以繼續透過一機械手臂或人工方式放置第五個待鍍物於第一個載具61上。It should be noted here (see FIG. 4 again) that the first finished product placed on the first carrier 61 enters the loading chamber 81 through the outlet valve 3, and is then taken through a mechanical arm or manually. The first finished product. At this time, a compression type lifting unit (not shown) disposed in the loading chamber 81 causes the first carrier 61 not placed with any object to be plated to descend to the settling section 831 to pass through the returning mechanism 83. The first carrier 61, which is not placed with any object to be plated, is returned to the lift section 822 through the hop section 833, and then passes through a compression type lifting unit disposed in the lift section 832 (not shown). The first carrier 61, which is not placed with any object to be plated, is raised to the loading chamber 82 to continue to place the fifth object to be plated on the first carrier 61 through a robotic arm or manually.

類似的過程不斷地重複進行,放有待鍍物的該 第一個載具61、第二個載具62、第三個載具63,及第四個載具64不斷地同步且同時分別進入預定進入的鍍膜區間中,由各載具63、62、61承載各待鍍物同時完成各道鍍膜程序,並在執行完各道鍍膜程序後,令各載具64、63、62在執行下一道鍍膜程序前是預先進入緩衝區間41、42、43等候下一道鍍膜程序,以進一步地同時接續各待鍍物的下一道鍍膜程序。因此,可在整條鍍膜生產線完全沒有閒置的狀況下,正確地批次量產出膜厚相同的完成品。A similar process is repeated continuously, with the object to be plated The first carrier 61, the second carrier 62, the third carrier 63, and the fourth carrier 64 are continuously synchronized and simultaneously enter the predetermined entering coating sections, respectively, by the respective carriers 63, 62, 61 carrying each of the materials to be plated while completing each coating process, and after performing each coating process, the carriers 64, 63, 62 are pre-entered into the buffer zone 41, 42, 43 before performing the next coating process. The next coating process is used to further continue the next coating process for each object to be plated. Therefore, it is possible to produce a finished product having the same film thickness in the correct batch amount without completely idling the entire coating production line.

值得補充說明的是,在本發明該實施例中,該傳輸單元7包括七組分別對應該等緩衝區間41、42、43、44與該等鍍膜區間51、52、53設置的滾輪組71,及七個分別獨立驅動該等滾輪組71的伺服馬達72。於具體實施時,第三、第二與第一個載具63、62、61是相對應地置放於第一、第二與第三個緩衝區間41、42、43內的該等滾輪組71上,同時控制該等伺服馬達72的驅動速度與轉動方向,以帶動該等滾輪組71滾動並帶動該等載具63、62、61往復地移動。It should be noted that, in this embodiment of the present invention, the transmission unit 7 includes seven sets of roller sets 71 respectively corresponding to the buffer zones 41, 42, 43, 44 and the coating sections 51, 52, 53. And seven servo motors 72 that independently drive the roller sets 71. In a specific implementation, the third, second and first carriers 63, 62, 61 are correspondingly arranged in the first, second and third buffer zones 41, 42, 43 At 71, the driving speed and the direction of rotation of the servomotors 72 are simultaneously controlled to drive the roller sets 71 to roll and drive the carriers 63, 62, 61 to reciprocately move.

由上述說明可知,本發明多層膜的量產方法是透過該等鍍膜區間51、52、53與該等緩衝區間41、42、43、44的配置關係,同時配合該等載具61、62、63、64、該傳輸機構7與該自動回流單元8的運作關係,以藉此讓第三、第二與第一個載具63、62、61連續地於各鍍膜區間51、52、53內執行各道鍍膜程序時,是同時分別於該等緩衝區間41、42、43、44往復位移。一方面可避免掉先前技術在鍍膜製 程中,該等待鍍物因長時間暴露在各鍍膜區間之靶材下方處的電漿區所致的過熱問題;另一方面,藉該等緩衝區間41、42、43、44與該等鍍膜區間51、52、53的配置關係,配合該等載具64、63、62、61、該傳輸機構7與自動回流單元8的機構設計,讓各載放有待鍍物的載具64、63、62可同步且同時在各鍍膜區間51、52、53內執行各道鍍膜程序,而使得整體的鍍膜生產形成一流暢且不間斷的循環生產線,沒有任何一個鍍膜區間51、52、53閒置,而將產能效益發揮到最大。As can be seen from the above description, the mass production method of the multilayer film of the present invention is through the arrangement relationship of the coating zones 51, 52, 53 and the buffer zones 41, 42, 43, 44, and the vehicles 61, 62, 63, 64, the operating relationship of the transport mechanism 7 and the automatic reflow unit 8, whereby the third, second and first carriers 63, 62, 61 are continuously in the respective coating sections 51, 52, 53 When each coating process is executed, it is reciprocally displaced in the buffer zones 41, 42, 43, and 44, respectively. On the one hand, it can avoid the prior art in the coating system. In the process, the waiting for the plating material is exposed to the overheating problem caused by the plasma region under the target of each coating zone for a long time; on the other hand, the buffer zones 41, 42, 43, 44 and the coating are used. The arrangement relationship of the sections 51, 52, and 53 is matched with the design of the carriers 64, 63, 62, 61, the transmission mechanism 7, and the automatic reflow unit 8, so that the carriers 64, 63 carrying the objects to be plated, 62 can simultaneously and simultaneously perform each coating process in each coating section 51, 52, 53, so that the overall coating production can form a smooth and uninterrupted circulation production line, and no coating section 51, 52, 53 is idle, and Maximize capacity benefits.

此處要特別說明的是,上述該實施例所演示的鍍膜生產線僅以4個緩衝區間41、42、43、44與3個鍍膜區間51、52、53為例做說明。但實質上,本發明多層膜的量產方法之鍍膜生產線中的緩衝區間與鍍膜區間的數量是可以向上擴充。簡單地來說,本發明於執行多層膜的量產方法時所使用之鍍膜生產線的鍍膜區間的數量、緩衝區間的數量與載具的數量分別是(n+1)個、n個與(n+1)個以上。依據本發明上述該實施例的詳細說明可知,當鍍膜區間的數量擴充至4個時,就必須配合足夠數量的載具才可避免鍍膜區間閒置;因此,此時載具的數量必須是4個或4個以上。It should be particularly noted that the coating production line demonstrated in the above embodiment is described by taking only four buffer zones 41, 42, 43, 44 and three coating sections 51, 52, and 53 as an example. However, in essence, the number of buffer zones and coating zones in the coating line of the mass production method of the multilayer film of the present invention can be expanded upward. Briefly, the number of coating zones, the number of buffers, and the number of carriers used in the coating line used in the mass production method of the present invention are (n+1), n and (n, respectively. +1) or more. According to the detailed description of the above embodiment of the present invention, when the number of coating sections is expanded to four, it is necessary to match a sufficient number of carriers to avoid the coating section being idle; therefore, the number of carriers must be four at this time. Or more than four.

又,此處需進一步補充說明的是,本發明該實施例之詳細說明,是在各載具61、62、63位移次數、位移時間與位移速率最單純(皆相同)的條件下來執行。當然,只要適當調整每一載具63、62、61在執行各道鍍膜程序時所 位移的次數、調整各鍍膜區間51、52、53之靶材的輸出功率,或考慮各載具63、62、61在各緩衝區間41、42、43的等待時間,即便是各載具63、62、61在每個鍍膜區間51、52、53執行各道鍍膜程序時的位移次數不相同的情況下,也能使得該等載具63、62、61同時且同步地執行下一道鍍膜程序,而讓該鍍膜生產線充分運作,不會產生鍍膜區間閒置與資源浪費等問題。Further, it should be further added here that the detailed description of the embodiment of the present invention is performed under the condition that the number of displacements, the displacement time, and the displacement rate of the respective carriers 61, 62, 63 are the simplest (all the same). Of course, as long as each carrier 63, 62, 61 is properly adjusted to perform each coating process The number of displacements, the output power of the target of each of the coating sections 51, 52, and 53 are adjusted, or the waiting time of each of the carriers 63, 62, and 61 between the buffer zones 41, 42, and 43 is considered, even for each carrier 63, 62, 61 can also cause the carriers 63, 62, 61 to simultaneously and synchronously execute the next coating process in the case where the number of displacements is different when each coating section 51, 52, 53 performs each coating process. And let the coating production line fully operate, there will be no problems such as idleness of the coating zone and waste of resources.

綜上所述,本發明多層膜的量產方法,一方面可避免先前技術在鍍膜製程中,該等待鍍物因長時間暴露在各電漿區所致的過熱問題;另一方面,各載放有待鍍物的載具63、62、61可同步且同時在各鍍膜區間51、52、53內執行各道鍍膜程序,令該鍍膜生產形成一流暢且不間斷的循環生產線,沒有任何一個鍍膜區間51、52、53閒置從而將產能效益發揮到最大,故確實能達成本發明之目的。In summary, the mass production method of the multilayer film of the present invention can avoid the overheating problem caused by the prior art in the coating process due to prolonged exposure to the respective plasma regions in the coating process; The carriers 63, 62, and 61 on which the objects to be plated are placed can simultaneously and simultaneously perform the coating processes in the respective coating sections 51, 52, and 53 to form a smooth and uninterrupted cycle production line without any coating. Since the sections 51, 52, and 53 are idle to maximize the productivity benefit, the object of the present invention can be achieved.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

1‧‧‧真空腔體1‧‧‧vacuum chamber

2‧‧‧入口閥門2‧‧‧ inlet valve

3‧‧‧出口閥門3‧‧‧Export valve

41‧‧‧第一個緩衝區間41‧‧‧The first buffer zone

42‧‧‧第二個緩衝區間42‧‧‧Between the second buffer zone

43‧‧‧第三個緩衝區間43‧‧‧The third buffer zone

44‧‧‧第四個緩衝區間44‧‧‧The fourth buffer zone

51‧‧‧第一個鍍膜區間51‧‧‧First coating interval

52‧‧‧第二個鍍膜區間52‧‧‧Second coating interval

53‧‧‧第三個鍍膜區間53‧‧‧The third coating interval

61‧‧‧第一個載具61‧‧‧First vehicle

62‧‧‧第二個載具62‧‧‧Second vehicle

63‧‧‧第三個載具63‧‧‧ third vehicle

64‧‧‧第四個載具64‧‧‧fourth vehicle

7‧‧‧傳輸機構7‧‧‧Transportation agency

71‧‧‧滾輪組71‧‧‧Roller set

72‧‧‧伺服馬達72‧‧‧Servo motor

8‧‧‧自動回流單元8‧‧‧Automatic reflow unit

81‧‧‧載出腔81‧‧‧Loading the cavity

82‧‧‧載入腔82‧‧‧Loading cavity

83‧‧‧回送機構83‧‧‧Return agency

831‧‧‧沉降段831‧‧‧Settlement

832‧‧‧舉升段832‧‧‧lifting section

833‧‧‧中繼段833‧‧‧ hop

X‧‧‧排列方向X‧‧‧Orientation

Claims (10)

一種多層膜的量產方法,是用以將多數待鍍物進行多道鍍膜程序,其包含以下步驟:一步驟(a),提供一具有(n+1)個緩衝區間、n個鍍膜區間與多個載具的鍍膜生產線,該等緩衝區間與該等鍍膜區間是沿一排列方向依序輪流設置於一真空腔體內,n≧2且是正整數;一步驟(b),於該鍍膜生產線的第一個緩衝區間或第二個緩衝區間載入放置有第一個待鍍物的第一個載具;一步驟(c),於該步驟(b)後,令第一個載具於第一個鍍膜區間執行第一道鍍膜程序以於第一個待鍍物上形成一第一膜層時,是於該第一、二個緩衝區間兩者間位移至少一次;一步驟(d),於該步驟(c)後,令第一個載具位於第二個緩衝區間或第三個緩衝區間,且同時於該鍍膜生產線的第一個緩衝區間或第二個緩衝區間載入放置有第二個待鍍物的第二個載具,但有條件的是,當第二個載具位於第二個緩衝區間時,第一個載具是位於第三個緩衝區間;及一步驟(e),於該步驟(d)後,同時令第二個載具與第一個載具分別於第一個鍍膜區間與第二個鍍膜區間內執行第一道鍍膜程序與第二道鍍膜程序,以分別於第二個待鍍物上與第一個待鍍物之上形成該第一膜層與一 第二膜層時,是同時分別於第一、二個緩衝區間兩者間與第二、三個緩衝區間兩者間位移至少一次,但有條件的是,當第二個載具位於第二個緩衝區間時,第一個載具是位於第三個緩衝區間。A method for mass production of a multilayer film is to perform a plurality of coating processes for a plurality of materials to be plated, comprising the following steps: a step (a), providing a (n+1) buffer zone, n coating zones and a coating production line of a plurality of carriers, wherein the buffer zones and the coating sections are sequentially arranged in a vacuum direction in an arrangement direction, n≧2 and being a positive integer; a step (b) in the coating production line Loading the first carrier with the first object to be plated between the first buffer or the second buffer; in step (c), after the step (b), the first carrier is in the first Performing a first coating process in a coating section to form a first film layer on the first object to be plated, at least once between the first and second buffer zones; a step (d), After the step (c), the first carrier is placed between the second buffer or the third buffer, and is loaded between the first buffer or the second buffer of the coating line. Two second carriers to be plated, but conditionally, when the second carrier is in the second In the interval, the first carrier is located between the third buffer; and a step (e), after the step (d), the second carrier and the first carrier are respectively in the first Performing a first coating process and a second coating process in the coating section and the second coating section to form the first film layer and the first coating object on the second object to be plated The second film layer is displaced at least once between the first and second buffers and between the second and third buffers, respectively, but conditionally, when the second carrier is located in the second When there is a buffer, the first carrier is located between the third buffer. 如請求項1所述的多層膜的量產方法,還包含一步驟(f)及一步驟(g),且n=3,其中,該步驟(f),於該步驟(e)後,令第一個載具位於第三個緩衝區間或第四個緩衝區間,且同時令第二個載具位於第二個緩衝區間或第三個緩衝區間,並同時於該鍍膜生產線的第一個緩衝區間或第二個緩衝區間載入放置有第三個待鍍物的第三個載具,但有條件的是,當第三個載具位於第二個緩衝區間時,第二個載具是位於第三個緩衝區間,且第一個載具是位於第四個緩衝區間;及該步驟(g),於該步驟(f)後,同時令第三個載具、第二個載具與第一個載具分別於第一個鍍膜區間、第二個鍍膜區間與第三個鍍膜區間內執行第一道鍍膜程序、第二道鍍膜程序與第三道鍍膜程序,以分別於第三個待鍍物上、第二個待鍍物之上與第一個待鍍物之上形成該第一膜層、該第二膜層與一第三層膜時,是同時分別於第一、二個緩衝區間兩者間、第二、三個緩衝區間兩者間與第三、四個緩衝區間兩者間位移至少一次,但有條件的是,當第三個載具位於第二個緩衝區間時,第二個載具是位於第三個緩衝區間且第一個載具是位於第四個緩衝區間。The method for mass production of the multilayer film according to claim 1, further comprising a step (f) and a step (g), wherein n=3, wherein the step (f), after the step (e), The first carrier is located between the third buffer or the fourth buffer, and at the same time the second carrier is located between the second buffer or the third buffer, and at the same time the first buffer of the coating line The third carrier placed with the third object to be plated is loaded between the interval or the second buffer, but conditionally, when the third carrier is located between the second buffer, the second carrier is Located between the third buffer, and the first carrier is located between the fourth buffer; and the step (g), after the step (f), the third carrier and the second carrier are simultaneously The first carrier performs the first coating process, the second coating process and the third coating process in the first coating zone, the second coating zone and the third coating zone, respectively, to respectively be in the third Forming the first film layer, the second film layer and a third layer film on the object to be plated, on the second object to be plated and on the first object to be plated At the same time, it is displaced at least once between the first and second buffers, between the second and third buffers, and between the third and fourth buffers, but conditionally, when When the three carriers are in the second buffer, the second carrier is located between the third buffer and the first carrier is located between the fourth buffer. 如請求項2所述的多層膜的量產方法,其中,該步驟(b)是於該鍍膜生產線的第一個緩衝區間載入放置有第一個待鍍物的第一個載具;該步驟(d)是令第一個載具位於第二個緩衝區間,且同時於該鍍膜生產線的第一個緩衝區間載入放置有第二個待鍍物的第二個載具。The method for mass production of a multilayer film according to claim 2, wherein the step (b) is to load a first carrier placed with the first object to be plated between the first buffers of the coating line; In the step (d), the first carrier is placed between the second buffers, and a second carrier placed with the second object to be plated is loaded between the first buffers of the coating line. 如請求項3所述的多層膜的量產方法,其中,該步驟(f)是令第一個載具位於第三個緩衝區間,且同時令第二個載具位於第二個緩衝區間,並同時於該鍍膜生產線的第一個緩衝區間載入放置有第三個待鍍物的第三個載具。The method for mass production of a multilayer film according to claim 3, wherein the step (f) is such that the first carrier is located between the third buffers and the second carrier is located between the second buffers. At the same time, a third carrier placed with the third object to be plated is loaded between the first buffers of the coating line. 如請求項1所述的多層膜的量產方法,其中,該步驟(e)之第二個載具與第一個載具分別於第一個鍍膜區間與第二個鍍膜區間內執行第一道鍍膜程序與第二道鍍膜程序時所耗費的時間相同。The method for mass production of a multilayer film according to claim 1, wherein the second carrier and the first carrier of the step (e) perform the first in the first coating interval and the second coating interval, respectively. The coating process is the same as the time required for the second coating process. 如請求項5所述的多層膜的量產方法,其中,該步驟(e)之第二個載具與第一個載具,分別於第一、二個緩衝區間兩者間與第二、三個緩衝區間兩者間所位移的次數相同,且所位移的速率相同。The mass production method of the multilayer film according to claim 5, wherein the second carrier and the first carrier of the step (e) are respectively between the first and the second buffers and the second The number of shifts between the three buffers is the same, and the rate of displacement is the same. 如請求項2所述的多層膜的量產方法,其中,該步驟(g)之第三個載具、第二個載具與第一個載具分別於第一個鍍膜區間、第二個鍍膜區間與第三個鍍膜區間內執行第一道鍍膜程序、第二道鍍膜程序與第三道鍍膜程序時所耗費的時間相同。The method for mass production of a multilayer film according to claim 2, wherein the third carrier, the second carrier and the first carrier of the step (g) are respectively in the first coating zone and the second The time taken to perform the first coating process, the second coating process, and the third coating process in the coating zone and the third coating zone is the same. 如請求項7所述的多層膜的量產方法,其中,該步驟(g) 之第三個載具、第二個載具與第一個載具,分別於第一、二個緩衝區間兩者間、第二、三個緩衝區間兩者與第三、四個緩衝區間兩者間所位移的次數相同,且所位移的速率相同。The method for mass production of a multilayer film according to claim 7, wherein the step (g) The third carrier, the second carrier and the first carrier are respectively between the first and second buffers, between the second and third buffers, and between the third and fourth buffers. The number of displacements is the same, and the rate of displacement is the same. 如請求項1至8任一請求項所述的多層膜的量產方法,其中,該步驟(a)之每一個鍍膜區間包括至少一鍍膜段,且該等鍍膜段是分別以一靶材來執行各鍍膜程序,該等靶材是由不同材質所構成或由相同材質所構成。The method for mass production of a multilayer film according to any one of claims 1 to 8, wherein each of the coating sections of the step (a) comprises at least one coating section, and the coating sections are respectively a target. Each coating process is performed, and the targets are composed of different materials or the same material. 如請求項1至8任一請求項所述的多層膜的量產方法,其中,該步驟(a)之該鍍膜生產線還具有一分別設置於該真空腔體之相反兩端的一入口閥門、一出口閥門、一連續地設置於該等緩衝區間和該等鍍膜區間內用以傳輸該等載具的傳輸機構,及一供該等載具自該出口閥門回流至該入口閥門的自動回流單元,該自動回流單元包括一銜接該出口閥門的載出腔、一銜接該入口閥門的載入腔,及一銜接於該載出腔與該載入腔之間的回送機構,該回送機構具有一對應載出腔設置的沉降段、一對應該載入腔設置的舉升段,及一連接該沉降段與該舉升段的中繼段。The method for mass production of a multilayer film according to any one of claims 1 to 8, wherein the coating production line of the step (a) further has an inlet valve disposed at opposite ends of the vacuum chamber, An outlet valve, a transport mechanism continuously disposed between the buffer zones and the coating zones for transporting the carriers, and an automatic reflow unit for returning the carriers from the outlet valve to the inlet valve, The automatic reflow unit includes a loading chamber that connects the outlet valve, a loading chamber that engages the inlet valve, and a return mechanism that is coupled between the loading chamber and the loading chamber. The returning mechanism has a corresponding A settling section provided by the loading chamber, a pair of lifting sections to be loaded into the chamber, and a hop connecting the settling section and the lifting section.
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Citations (6)

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Publication number Priority date Publication date Assignee Title
US5308461A (en) * 1992-01-14 1994-05-03 Honeywell Inc. Method to deposit multilayer films
US6497799B1 (en) * 2000-04-14 2002-12-24 Seagate Technology Llc Method and apparatus for sputter deposition of multilayer films
US20070119700A1 (en) * 2005-11-25 2007-05-31 Hon Hai Precision Industry Co., Ltd. Apparatus and method for manufacturing a multilayer film
TWI287045B (en) * 2005-05-13 2007-09-21 Applied Vacuum Coating Technol Method for sputter-coating multilayer film on sheet work-piece at low temperature
TW201135817A (en) * 2010-04-09 2011-10-16 Hon Hai Prec Ind Co Ltd Colourful multi-layer film structure and the method manufacturing the same
TWI409351B (en) * 2007-01-09 2013-09-21 Ulvac Inc Method and apparatus for forming multilayer film

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308461A (en) * 1992-01-14 1994-05-03 Honeywell Inc. Method to deposit multilayer films
US6497799B1 (en) * 2000-04-14 2002-12-24 Seagate Technology Llc Method and apparatus for sputter deposition of multilayer films
TWI287045B (en) * 2005-05-13 2007-09-21 Applied Vacuum Coating Technol Method for sputter-coating multilayer film on sheet work-piece at low temperature
US20070119700A1 (en) * 2005-11-25 2007-05-31 Hon Hai Precision Industry Co., Ltd. Apparatus and method for manufacturing a multilayer film
TWI409351B (en) * 2007-01-09 2013-09-21 Ulvac Inc Method and apparatus for forming multilayer film
TW201135817A (en) * 2010-04-09 2011-10-16 Hon Hai Prec Ind Co Ltd Colourful multi-layer film structure and the method manufacturing the same

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