TWI511017B - Capacitance touch panel - Google Patents
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- TWI511017B TWI511017B TW103100856A TW103100856A TWI511017B TW I511017 B TWI511017 B TW I511017B TW 103100856 A TW103100856 A TW 103100856A TW 103100856 A TW103100856 A TW 103100856A TW I511017 B TWI511017 B TW I511017B
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Description
本發明是有關於一種觸控面板,且特別是有關於一種電容式觸控面板。The present invention relates to a touch panel, and more particularly to a capacitive touch panel.
近年來,由於觸控技術的突破,機械式的按鈕面板逐漸被觸控螢幕所取代,相關的消費性電子產品也被開發出來,因應市場需求,觸控技術已廣泛地應用於智慧型手機或是平板電腦等行動裝置。In recent years, due to the breakthrough of touch technology, mechanical button panels have gradually been replaced by touch screens, and related consumer electronic products have also been developed. In response to market demand, touch technology has been widely used in smart phones or It is a mobile device such as a tablet computer.
目前在智慧型手機或是平板電腦主流的觸控方式為電容式觸控。而電容式觸控在面板架構上可由雙玻璃貼合(Glass/Glass;GG type)、雙薄膜貼合(Glass/Film/Film;GFF type)及一體化觸控(One Glass Solution;OGS)來實現。以雙薄膜貼合的架構為例,其包含將連續性的電極感應膜基材裁切成適合的區域後黏貼至基板上,最後再透過軟性電路板連接而達到訊號傳遞的目的。At present, the mainstream touch mode of smart phones or tablets is capacitive touch. The capacitive touch panel can be made of double glass bonding (Glass/Glass; GG type), double film bonding (Glass/Film/Film; GFF type) and integrated touch (One Glass Solution; OGS). achieve. For example, the double-film-bonded structure includes cutting a continuous electrode-sensing film substrate into a suitable region, sticking it to the substrate, and finally connecting through a flexible circuit board to achieve signal transmission.
本發明提供一種具有L形軟性電路板的電容式觸控面板,以達到減少軟性電路板使用量之目的,以及便於 進行組裝。The invention provides a capacitive touch panel with an L-shaped flexible circuit board, so as to reduce the usage of the flexible circuit board and facilitate Assemble.
本發明係提供一種電容式觸控面板,包含一基板、一第一感應膜、一第二感應膜、一軟性電路板。第一感應膜設置於基板上,包含一第一膜材以及設置於第一膜材上之複數個第一電極,其中第一電極沿一第一方向平行排列。第二感應膜設置於第一感應膜上,包含一第二膜材以及設置於第二膜材上之複數個第二電極,其中第二電極沿一第二方向平行排列,第二方向正交於第一方向。軟性電路板包含一長條形基材,長條形基材經由兩次彎折後構成一L形基材,L形基材具有與第一感應膜連接之一第一連接部、與第二感應膜連接之一第二連接部,以及連接該一連接部與第二連接部的一彎折部。The present invention provides a capacitive touch panel comprising a substrate, a first sensing film, a second sensing film, and a flexible circuit board. The first sensing film is disposed on the substrate, and includes a first film and a plurality of first electrodes disposed on the first film, wherein the first electrodes are arranged in parallel along a first direction. The second sensing film is disposed on the first sensing film, and includes a second film and a plurality of second electrodes disposed on the second film, wherein the second electrodes are arranged in parallel along a second direction, and the second direction is orthogonal In the first direction. The flexible circuit board comprises an elongated substrate, and the elongated substrate is bent twice to form an L-shaped substrate, and the L-shaped substrate has a first connecting portion and a second connecting with the first sensing film. The sensing film is connected to one of the second connecting portions, and a bent portion connecting the connecting portion and the second connecting portion.
本發明係提供一種電容式觸控面板的製作方法,包含提供基板、裁切感應膜基材、二次彎折長條形軟性電路板。裁切感應膜基材,以得到第一感應膜與第二感應膜。將第一感應膜與第二感應膜疊置於基板上,其中第一感應膜之電極走向正交於第二感應膜之電極走向。二次彎折長條形軟性電路板,以得到一L形軟性電路板。最後L形軟性電路板對第一感應膜和第二感應膜作連接。The invention provides a method for manufacturing a capacitive touch panel, comprising providing a substrate, a cutting sensing film substrate, and a secondary bending strip flexible circuit board. The sensing film substrate is cut to obtain a first sensing film and a second sensing film. The first sensing film and the second sensing film are stacked on the substrate, wherein the electrode of the first sensing film runs orthogonal to the electrode of the second sensing film. The strip-shaped flexible circuit board is bent twice to obtain an L-shaped flexible circuit board. Finally, the L-shaped flexible circuit board connects the first sensing film and the second sensing film.
100‧‧‧電容式觸控面板100‧‧‧Capacitive touch panel
102‧‧‧基板102‧‧‧Substrate
110‧‧‧第一感應膜110‧‧‧First sensing film
112‧‧‧第一膜材112‧‧‧First film
114‧‧‧第一電極114‧‧‧First electrode
116‧‧‧第一方向116‧‧‧First direction
120‧‧‧第二感應膜120‧‧‧Second sensor film
122‧‧‧第二膜材122‧‧‧Second film
124‧‧‧第二電極124‧‧‧second electrode
126‧‧‧第二方向126‧‧‧second direction
130‧‧‧軟性電路板130‧‧‧Soft circuit board
131‧‧‧長條形基材131‧‧‧Long strip substrate
132‧‧‧第一摺線132‧‧‧First fold line
133‧‧‧第二摺線133‧‧‧ second fold line
134‧‧‧L形基材134‧‧‧L-shaped substrate
136‧‧‧第一連接部136‧‧‧First connection
138‧‧‧第二連接部138‧‧‧Second connection
140‧‧‧彎折部140‧‧‧Bend
142‧‧‧延伸部142‧‧‧Extension
144‧‧‧第一端子144‧‧‧First terminal
146‧‧‧第二端子146‧‧‧second terminal
148‧‧‧第三端子148‧‧‧ third terminal
149‧‧‧導線149‧‧‧Wire
150‧‧‧控制電路板150‧‧‧Control circuit board
152‧‧‧保護膜152‧‧‧Protective film
154‧‧‧絕緣膠帶154‧‧‧Insulation tape
S10-S40‧‧‧步驟S10-S40‧‧‧Steps
第1圖繪示本發明之電容式觸控面板中的軟性電路板一實施例的示意圖。FIG. 1 is a schematic view showing an embodiment of a flexible circuit board in a capacitive touch panel of the present invention.
第2A圖為第1圖中之長條形基材第一次彎折的示意圖。Fig. 2A is a schematic view showing the first bending of the elongated substrate in Fig. 1.
第2B圖為第1圖中之長條形基材第二次彎折的示意圖。Fig. 2B is a schematic view showing the second bending of the elongated substrate in Fig. 1.
第3圖繪示本發明之電容式觸控面板一實施例的***圖。FIG. 3 is an exploded view of an embodiment of a capacitive touch panel of the present invention.
第4圖繪示本發明之電容式觸控面板一實施例的示意圖。FIG. 4 is a schematic view showing an embodiment of a capacitive touch panel of the present invention.
第5圖為本發明之電容式觸控面板製作方法一實施例的流程圖。FIG. 5 is a flow chart of an embodiment of a method for fabricating a capacitive touch panel of the present invention.
以下將以圖式及詳細說明清楚說明本發明之精神,任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後,當可由本發明所教示之技術,加以改變及修飾,其並不脫離本發明之精神與範圍。The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the invention. The spirit and scope of the invention are not departed.
鑒於習知雙薄膜貼合電容式觸控面板在架構上,需以軟性電路板負責傳遞訊號,且由於雙薄膜貼合電容式觸控面板需要雙向同時灌入走線訊號(Tx),因此需要兩條軟性電路板提供走線訊號,一條軟性電路板用以接收接收(Rx)訊號,共需要三條軟性電路板用作訊號傳遞,不利於系統組裝以及需要較高的成本。因此,本發明提出了一種L形軟性電路板架構,以減少軟性電路板的用量並且改善其系統組裝性。In view of the conventional dual-film-fit capacitive touch panel, it is necessary to use a flexible circuit board to transmit signals, and since the dual-film-fit capacitive touch panel requires two-way simultaneous injection of a trace signal (Tx), it is required Two flexible boards provide trace signals, and a flexible board receives receive (Rx) signals. A total of three flexible boards are required for signal transmission, which is not conducive to system assembly and requires high cost. Accordingly, the present invention proposes an L-shaped flexible circuit board architecture to reduce the amount of flexible circuit boards and improve their system assembly.
請參照第1圖,其為本發明之電容式觸控面板中的軟性電路板一實施例的示意圖。需要注意的是,第1圖係主要表示構成軟性電路板材料之一的長條形基材,而非軟性電路板整體,即軟性電路板上之端子以及導線等結構未繪示於本圖。長條形基材131材料可以是塑膠或其他絕緣體。長條形基材131包含第一摺線132和第二摺線133,且第一摺線132和第二摺線133大致夾一45度角。第一摺線132為長條形基材131在進行第一次彎折時所對準之摺線。第二摺線133為長條形基材131在進行第二次彎折時所對準之摺線。Please refer to FIG. 1 , which is a schematic diagram of an embodiment of a flexible circuit board in a capacitive touch panel of the present invention. It should be noted that the first figure mainly shows an elongated substrate constituting one of the flexible circuit board materials, and the non-flexible circuit board as a whole, that is, the terminals on the flexible circuit board and the wires and the like are not shown in the figure. The elongated substrate 131 material may be a plastic or other insulator. The elongated substrate 131 includes a first fold line 132 and a second fold line 133, and the first fold line 132 and the second fold line 133 are substantially at an angle of 45 degrees. The first fold line 132 is a fold line in which the elongated substrate 131 is aligned when the first bend is made. The second fold line 133 is a fold line in which the elongated substrate 131 is aligned when the second bend is made.
本發明便藉由彎折此長條形基材131以得到所提之L形軟性電路板,以下將配合圖式具體說明。The present invention obtains the L-shaped flexible circuit board by bending the elongated substrate 131, which will be specifically described below with reference to the drawings.
請同時參照第1圖和第2A圖,其中第2A圖為第1圖中之長條形基材第一次彎折示意圖。從第2A圖中可見,長條形基材131沿第一摺線132彎折後,由於第一摺線132和第二摺線133夾角為45度角,因此彎折後可見長條形基材131具有直角的轉折部。Please refer to FIG. 1 and FIG. 2A at the same time, wherein FIG. 2A is a first bending diagram of the elongated substrate in FIG. 1 . It can be seen from FIG. 2A that after the elongated substrate 131 is bent along the first fold line 132, since the angle between the first fold line 132 and the second fold line 133 is 45 degrees, the elongated substrate 131 can be seen after the bending. Right angle turn.
請再同時參照第2A圖和第2B圖,其中第2B圖為第2A圖中之長條型基材第二次彎折示意圖。將第2A圖中具有直角之轉折部的長條形基材131再沿第二摺線133作第二次彎折,即可構成第2B圖中之L形基材134。Please refer to FIG. 2A and FIG. 2B at the same time, wherein FIG. 2B is a second bending diagram of the elongated substrate in FIG. 2A. The L-shaped base material 134 in FIG. 2B is formed by bending the elongated base material 131 having the right-angled turning portion in FIG. 2A along the second fold line 133 for the second time.
L形基材134包含第一連接部136、第二連接部138以及連接第一連接部136和第二連接部138的彎折部140。且第一連接部136與第二連接部138之間存在一正交關係。The L-shaped base material 134 includes a first connecting portion 136, a second connecting portion 138, and a bent portion 140 that connects the first connecting portion 136 and the second connecting portion 138. There is an orthogonal relationship between the first connecting portion 136 and the second connecting portion 138.
如前面所提,本發明所提出之L形軟性電路板係由長條形的軟性電路板經過2次彎折後而得。因此,在軟性電路板的製程上面,由於原始形狀為長條形,因此製作時的排版利用率獲得提升。As mentioned above, the L-shaped flexible circuit board proposed by the present invention is obtained by bending a long flexible circuit board twice. Therefore, on the manufacturing process of the flexible circuit board, since the original shape is a long strip shape, the layout utilization rate at the time of production is improved.
請參照第3圖,其為本發明之電容式觸控面板一實施例的***圖。電容式觸控面板100包含基板102、第一感應膜110、第二感應膜120、軟性電路板130。更具體地來說,第一感應膜110置於基板102之上,第二感應膜120置於第一感應膜110之上。軟性電路板130置於第一感應膜110和第二感應膜120之上,且軟性電路板130中的第一連接部136與第一感應膜110連接,軟性電路板130中的第二連接部138與第二感應膜120連接。Please refer to FIG. 3, which is an exploded view of an embodiment of a capacitive touch panel of the present invention. The capacitive touch panel 100 includes a substrate 102 , a first sensing film 110 , a second sensing film 120 , and a flexible circuit board 130 . More specifically, the first sensing film 110 is placed on the substrate 102, and the second sensing film 120 is placed on the first sensing film 110. The flexible circuit board 130 is disposed on the first sensing film 110 and the second sensing film 120, and the first connection portion 136 of the flexible circuit board 130 is connected to the first sensing film 110, and the second connection portion of the flexible circuit board 130 138 is connected to the second sensing film 120.
第一感應膜110和第二感應膜120之目的為作為觸控時的感測區域。第一感應膜110包含第一膜材112以及複數個第一電極114,其中第一電極114排列方向平行於一第一方向116。第二感應膜120包含第二膜材122以及複數個第二電極124,其中第二電極124排列方向平行於一第二方向126,其中第一方向116和第二方向126互為正交,第一電極114與第二電極124的排列方向也互為正交。The purpose of the first sensing film 110 and the second sensing film 120 is to serve as a sensing area for touch. The first sensing film 110 includes a first film 112 and a plurality of first electrodes 114, wherein the first electrodes 114 are arranged in a direction parallel to a first direction 116. The second sensing film 120 includes a second film 122 and a plurality of second electrodes 124, wherein the second electrodes 124 are arranged in a direction parallel to a second direction 126, wherein the first direction 116 and the second direction 126 are orthogonal to each other, The arrangement direction of the one electrode 114 and the second electrode 124 is also orthogonal to each other.
第一膜材112和第二膜材122的材料可以為玻璃或是塑膠,第一電極114和第二電極124的材料可以為透明導電材料如銦錫氧化物(Indium Tin Oxide;ITO)、或是線寬極細的金屬圖案。基板102可以為玻璃或是塑膠,保護膜152的材料可以為聚乙烯對苯二甲酸酯(Polyethylene Terephthalate;PET)膜。The material of the first film 112 and the second film 122 may be glass or plastic, and the material of the first electrode 114 and the second electrode 124 may be a transparent conductive material such as Indium Tin Oxide (ITO), or It is a metal pattern with a very thin line width. The substrate 102 may be glass or plastic, and the material of the protective film 152 may be polyethylene terephthalate (Polyethylene). Terephthalate; PET) film.
電容式觸控面板100更包含保護膜152,其可作為保護整體架構之防護層,並覆蓋於第二感應膜120上方,並與軟性電路板130相切或維持一間隙。The capacitive touch panel 100 further includes a protective film 152 as a protective layer for protecting the overall structure and covering the second sensing film 120 and tangential to the flexible circuit board 130 or maintaining a gap.
請再參照第4圖,其為本發明之電容式觸控面板一實施例的示意圖。Please refer to FIG. 4 again, which is a schematic diagram of an embodiment of a capacitive touch panel of the present invention.
圖中的第一電極114為橫向電極,第二電極124為縱向電極。走線訊號通過軟性電路板130的第一連接部136通過第一電極114,而在第一電極114和第二電極124之間構成一均勻電場,而當使用觸控方式操作時,由於有導體(手指)的接觸,將會造成觸控感測區域的電容變化,第二電極124再將對應的接收訊號傳遞出去。The first electrode 114 in the figure is a lateral electrode, and the second electrode 124 is a longitudinal electrode. The trace signal passes through the first connection portion 136 of the flexible circuit board 130 through the first electrode 114 to form a uniform electric field between the first electrode 114 and the second electrode 124, and when operated by using the touch method, due to the conductor The contact of the (finger) will cause a change in the capacitance of the touch sensing area, and the second electrode 124 transmits the corresponding received signal.
第一感應膜110沿第一方向116的長度大於第二感應膜120沿第一方向116的長度,使得第二感應膜120無法完全覆蓋住第一感應膜110。也就是說,第一感應膜110上之第一電極114的相對兩端皆不會完全被第二感應膜120覆蓋。在第二感應膜120覆蓋在第一感應膜110後,整體形狀大致為左右對稱。The length of the first sensing film 110 in the first direction 116 is greater than the length of the second sensing film 120 in the first direction 116 such that the second sensing film 120 cannot completely cover the first sensing film 110. That is to say, the opposite ends of the first electrode 114 on the first sensing film 110 are not completely covered by the second sensing film 120. After the second sensing film 120 covers the first sensing film 110, the overall shape is substantially bilaterally symmetrical.
軟性電路板130的第一連接部136為連接至第一感應膜110外露於第二感應膜120的部分,軟性電路板130的第二連接部138則是連接至第二感應膜120。The first connecting portion 136 of the flexible circuit board 130 is connected to the portion of the first sensing film 110 exposed to the second sensing film 120, and the second connecting portion 138 of the flexible circuit board 130 is connected to the second sensing film 120.
軟性電路板130之用途為溝通訊號。軟性電路板130包含L形基材134、延伸部142、複數個第一端子144、複數個第二端子146、複數個第三端子148。第一端子144 設置於第一連接部136,第二端子146設置於第二連接部138,第三端子148設置於延伸部142。且第一端子144、第二端子146以及第三端子148位於L形基材134同一表面,使得將軟性電路板130覆蓋在連接第一感應膜110和第二感應膜120上後,第一端子144和第二端子146可以分別接觸到第一電極114和第二電極124作連接。The purpose of the flexible circuit board 130 is the channel communication number. The flexible circuit board 130 includes an L-shaped substrate 134, an extension portion 142, a plurality of first terminals 144, a plurality of second terminals 146, and a plurality of third terminals 148. First terminal 144 The second terminal 146 is disposed on the second connecting portion 138 , and the third terminal 148 is disposed on the extending portion 142 . The first terminal 144, the second terminal 146, and the third terminal 148 are located on the same surface of the L-shaped substrate 134, so that the flexible circuit board 130 is covered on the first sensing film 110 and the second sensing film 120, and the first terminal is The 144 and the second terminal 146 may be in contact with the first electrode 114 and the second electrode 124, respectively.
軟性電路板130更包含複數條導線149,作為訊號傳遞之通道。導線149將第一端子144、第二端子146以及第三端子148互相連接。須注意於第4圖中所標示之第一電極114、第二電極124、第一端子144、第二端子146以及導線149僅用以表示連結關係,而非實際數量。The flexible circuit board 130 further includes a plurality of wires 149 as a channel for signal transmission. The wire 149 connects the first terminal 144, the second terminal 146, and the third terminal 148 to each other. It should be noted that the first electrode 114, the second electrode 124, the first terminal 144, the second terminal 146, and the wire 149 indicated in FIG. 4 are only used to indicate the connection relationship, not the actual number.
電容式觸控面板100更包含控制電路板150,以處理觸控訊號並與外界連結。控制電路板150和軟性電路板130中的第三端子148互相連接。藉由L形的軟性電路板130,可以將軟性電路板130中用以與控制電路板150連接的延伸部142彙整於基板102的同一側,使得組裝更為便利。The capacitive touch panel 100 further includes a control circuit board 150 for processing touch signals and connecting with the outside world. The control circuit board 150 and the third terminal 148 in the flexible circuit board 130 are connected to each other. The L-shaped flexible circuit board 130 allows the extensions 142 of the flexible circuit board 130 to be connected to the control circuit board 150 to be integrated on the same side of the substrate 102, thereby facilitating assembly.
電容式觸控面板100更包含絕緣膠帶154,可以將軟性電路板130固定且受到保護。將絕緣膠帶154置於軟性電路板130的彎折部140上,並使其固定在基板102上,同時也成為一防護措施以避免彎折部140因反覆彎折導致材料疲勞而斷裂。The capacitive touch panel 100 further includes an insulating tape 154 that can fix and protect the flexible circuit board 130. The insulating tape 154 is placed on the bent portion 140 of the flexible circuit board 130 and fixed on the substrate 102, and is also a protective measure to prevent the bent portion 140 from being broken due to material fatigue caused by repeated bending.
參照第5圖,其為本發明之電容式觸控面板製作方法一實施例的流程圖。步驟S10包含提供一基板,再裁 切一感應膜基材,得到第一感應膜與第二感應膜。步驟S20為先將第一感應膜置於基板上,再將第二感應膜疊置於第一感應膜上,其中第一感應膜之電極走向正交於第二感應膜之電極走向。步驟S30二次彎折為長條形之軟性電路板,以得到一L形軟性電路板。步驟S40將從步驟S30得到的L形軟性電路板分別與第一感應膜和第二感應膜作連接。Referring to FIG. 5, it is a flowchart of an embodiment of a method for fabricating a capacitive touch panel of the present invention. Step S10 includes providing a substrate and then cutting A sensing film substrate is cut to obtain a first sensing film and a second sensing film. Step S20 is to first place the first sensing film on the substrate, and then stack the second sensing film on the first sensing film, wherein the electrode of the first sensing film runs orthogonal to the electrode of the second sensing film. Step S30 is secondly bent into a strip-shaped flexible circuit board to obtain an L-shaped flexible circuit board. In step S40, the L-shaped flexible circuit boards obtained in step S30 are respectively connected to the first sensing film and the second sensing film.
從以上實施例可以得知,本發明所提出之L形軟性電路板係由長條形的軟性電路板經過2次彎折後而得。因此,在軟性電路板的製程上面,由於原始形狀為長條形,製作時的排版利用率獲得提升。透過L形軟性電路板架構,突破習知雙薄膜貼合電容式觸控面板的軟性電路板用量限制,減少軟性電路板的用量並且改善其系統組裝性。It can be seen from the above embodiments that the L-shaped flexible circuit board proposed by the present invention is obtained by bending a long flexible circuit board twice. Therefore, on the manufacturing process of the flexible circuit board, since the original shape is a long strip shape, the typesetting utilization rate at the time of production is improved. Through the L-shaped flexible circuit board architecture, the flexible circuit board usage limit of the conventional double film-bonded capacitive touch panel is broken, the amount of the flexible circuit board is reduced, and the system assembly property is improved.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧電容式觸控面板100‧‧‧Capacitive touch panel
102‧‧‧基板102‧‧‧Substrate
110‧‧‧第一感應膜110‧‧‧First sensing film
114‧‧‧第一電極114‧‧‧First electrode
116‧‧‧第一方向116‧‧‧First direction
120‧‧‧第二感應膜120‧‧‧Second sensor film
124‧‧‧第二電極124‧‧‧second electrode
130‧‧‧軟性電路板130‧‧‧Soft circuit board
134‧‧‧L形基材134‧‧‧L-shaped substrate
136‧‧‧第一連接部136‧‧‧First connection
138‧‧‧第二連接部138‧‧‧Second connection
140‧‧‧彎折部140‧‧‧Bend
142‧‧‧延伸部142‧‧‧Extension
144‧‧‧第一端子144‧‧‧First terminal
146‧‧‧第二端子146‧‧‧second terminal
148‧‧‧第三端子148‧‧‧ third terminal
149‧‧‧導線149‧‧‧Wire
150‧‧‧控制電路板150‧‧‧Control circuit board
154‧‧‧絕緣膠帶154‧‧‧Insulation tape
Claims (9)
Priority Applications (2)
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TW103100856A TWI511017B (en) | 2014-01-09 | 2014-01-09 | Capacitance touch panel |
CN201410026243.2A CN104777949A (en) | 2014-01-09 | 2014-01-21 | Capacitive touch panel |
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TW103100856A TWI511017B (en) | 2014-01-09 | 2014-01-09 | Capacitance touch panel |
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TW201528093A TW201528093A (en) | 2015-07-16 |
TWI511017B true TWI511017B (en) | 2015-12-01 |
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CN105700747B (en) * | 2016-01-08 | 2017-03-22 | 宸美(厦门)光电有限公司 | Jointing method of curved touch panel and flexible circuit board |
CN109375807B (en) * | 2018-10-26 | 2022-05-10 | 业成科技(成都)有限公司 | Manufacturing method of touch panel and touch panel |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM356177U (en) * | 2008-11-03 | 2009-05-01 | Emerging Display Tech Corp | Dual board capacitive touch panel |
TW201029022A (en) * | 2009-01-23 | 2010-08-01 | Transtouch Technology Inc | Injection molded touch panel |
TWM399404U (en) * | 2010-10-04 | 2011-03-01 | Ultrachip Inc | Driving module of touch-controlled panel |
TW201333797A (en) * | 2012-02-15 | 2013-08-16 | Chih-Chung Lin | Capacitive touch device |
CN103425318A (en) * | 2012-05-23 | 2013-12-04 | Lg电子株式会社 | Touch panel and display device having the same |
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CN101692193B (en) * | 2009-09-07 | 2012-03-28 | 苏州超联光电有限公司 | Manufacturing method of capacitive touch screen |
CN202102394U (en) * | 2010-12-27 | 2012-01-04 | 升达科技股份有限公司 | Flexible circuit-board connecting structure for touch-control panel |
JP5480193B2 (en) * | 2011-03-31 | 2014-04-23 | 株式会社ジャパンディスプレイ | Touch panel and display device with touch panel |
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- 2014-01-09 TW TW103100856A patent/TWI511017B/en not_active IP Right Cessation
- 2014-01-21 CN CN201410026243.2A patent/CN104777949A/en active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM356177U (en) * | 2008-11-03 | 2009-05-01 | Emerging Display Tech Corp | Dual board capacitive touch panel |
TW201029022A (en) * | 2009-01-23 | 2010-08-01 | Transtouch Technology Inc | Injection molded touch panel |
TWM399404U (en) * | 2010-10-04 | 2011-03-01 | Ultrachip Inc | Driving module of touch-controlled panel |
TW201333797A (en) * | 2012-02-15 | 2013-08-16 | Chih-Chung Lin | Capacitive touch device |
CN103425318A (en) * | 2012-05-23 | 2013-12-04 | Lg电子株式会社 | Touch panel and display device having the same |
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TW201528093A (en) | 2015-07-16 |
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