TWI507634B - Housing and lighting device having the same - Google Patents

Housing and lighting device having the same Download PDF

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Publication number
TWI507634B
TWI507634B TW102108091A TW102108091A TWI507634B TW I507634 B TWI507634 B TW I507634B TW 102108091 A TW102108091 A TW 102108091A TW 102108091 A TW102108091 A TW 102108091A TW I507634 B TWI507634 B TW I507634B
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TW
Taiwan
Prior art keywords
housing
outer casing
heat
light
light emitting
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TW102108091A
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Chinese (zh)
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TW201339493A (en
Inventor
Shih Chang Wang
Po Chang Li
Ming Chih Lai
Pin Hao Hsu
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Lite On Technology Corp
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Publication of TW201339493A publication Critical patent/TW201339493A/en
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Publication of TWI507634B publication Critical patent/TWI507634B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/0464—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the level of ambient illumination, e.g. dawn or dusk sensors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

殼體及具有其之照明裝置Housing and lighting device therewith

本發明是有關於一種殼體及具有其之照明裝置，且特別是有關於一種具有良好的散熱效能之殼體及具有其之照明裝置The present invention relates to a housing and a lighting device therewith, and more particularly to a housing having good heat dissipation performance and a lighting device therewith

發光二極體(LED)具有許多優點，例如是較長的壽命、較低的耗功率及較小的體積。因此，近年來，照明裝置常用發光二極體來取代傳統的螢光燈泡。一般而言，使用發光二極體的照明裝置需要一個殼體來固定並保護所具有的發光二極體。由於發光二極體在發光過程中會產生較多的熱，使周圍的溫度提高，其可能會使發光二極體受損，因此，在使用發光二極體的照明裝置中，其殼體的散熱效率非常重要。一般來說，使用發光二極體的照明裝置會於放置發光二極體的殼體處配置散熱器，來提升殼體的散熱效能。Light-emitting diodes (LEDs) have many advantages, such as longer life, lower power consumption, and smaller size. Therefore, in recent years, lighting devices have often used light-emitting diodes to replace conventional fluorescent light bulbs. In general, an illumination device using a light-emitting diode requires a housing to fix and protect the light-emitting diodes. Since the light-emitting diode generates more heat during the light-emitting process, the ambient temperature is increased, which may damage the light-emitting diode. Therefore, in the illumination device using the light-emitting diode, the housing thereof Cooling efficiency is very important. In general, a lighting device using a light-emitting diode configures a heat sink at a housing in which the light-emitting diode is placed to improve the heat dissipation performance of the housing.

以使用於街道上的LED照明裝置為例，其係將散熱裝置暴露在外。當設置於LED照明裝置之出光面的高功率發光二極體開始運作時，藉由LED照明裝置所暴露出之散熱裝置，增加殼體散熱的面積，以維持LED照明裝置之出光面處在相對低溫的狀態。然而，此種設計很容易讓灰塵及沙塵沉積於散熱裝置上，使散熱裝置的散熱效果降低。For example, an LED lighting device used on a street is exposed to the heat sink. When the high-power light-emitting diode disposed on the light-emitting surface of the LED lighting device starts to operate, the heat-dissipating device exposed by the LED lighting device increases the heat-dissipating area of the casing to maintain the light-emitting surface of the LED lighting device in relative Low temperature state. However, this design makes it easy to deposit dust and dust on the heat sink, which reduces the heat dissipation of the heat sink.

請參閱第1A~1B圖，第1A~1B圖係繪示另一種習知之LED照明裝置的殼體之示意圖。為了避免散熱裝置暴露在外，另一種習知之LED 照明裝置2利用一現有之照明裝置的殼體20來包覆散熱裝置22，以保護散熱裝置22，使其免於沙塵堆積。此種LED照明裝置係將散熱裝置22放置於照明裝置2的殼體20內。然而，由於環繞於散熱裝置22之大量的熱空氣也被包覆於照明裝置2之殼體20中，這些熱空氣並不利於散熱。因此，此種LED照明裝置2的散熱效能並不理想，且無法達到市場需求。Please refer to FIGS. 1A-1B for a schematic view of another conventional LED lighting device housing. In order to avoid exposure of the heat sink, another conventional LED The lighting device 2 encloses the heat sink 22 with a housing 20 of a conventional lighting device to protect the heat sink 22 from dust accumulation. Such an LED lighting device places the heat sink 22 within the housing 20 of the lighting device 2. However, since a large amount of hot air surrounding the heat sink 22 is also wrapped in the casing 20 of the lighting device 2, the hot air is not conducive to heat dissipation. Therefore, the heat dissipation performance of the LED lighting device 2 is not ideal and cannot meet market demand.

本發明係有關於一種具有良好散熱效果及防塵效果的殼體及具有其之照明裝置。The invention relates to a housing with good heat dissipation effect and dustproof effect and a lighting device therewith.

根據本發明之第一方面，提出一種照明裝置之殼體，殼體包括一第一部分。第一部分用以容置一發光二極體模組。第一部分包括一外殼及至少一導熱結構，外殼形成一空間並具有一散熱側及一出光側，且至少一導熱結構設置於空間內，其中導熱結構連接於外殼之散熱側及出光側之間。According to a first aspect of the invention, a housing for a lighting device is provided, the housing comprising a first portion. The first part is for accommodating a light emitting diode module. The first part comprises a casing and at least one heat conducting structure. The casing forms a space and has a heat dissipating side and a light emitting side, and at least one heat conducting structure is disposed in the space, wherein the heat conducting structure is connected between the heat dissipating side and the light emitting side of the casing.

根據本發明之第二方面，提出一種照明裝置，包括一發光二極體模組及一殼體。發光二極體模組，用以提供光線。發光二極體模組設置於殼體上，殼體包括一第一部分。第一部分包括一外殼及至少一導熱結構。外殼形成一空間並具有一散熱側及一出光側，且至少一導熱結構設置於空間內，其中，導熱結構連接於外殼之散熱側及出光側之間。According to a second aspect of the present invention, a lighting device is provided, comprising a light emitting diode module and a casing. A light emitting diode module for providing light. The LED module is disposed on the housing, and the housing includes a first portion. The first portion includes a housing and at least one thermally conductive structure. The outer casing forms a space and has a heat dissipating side and a light emitting side, and at least one heat conducting structure is disposed in the space, wherein the heat conducting structure is connected between the heat dissipating side and the light emitting side of the outer casing.

為了對本發明之上述及其他方面有更佳的瞭解，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下：In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

2‧‧‧LED照明裝置2‧‧‧LED lighting device

10、20‧‧‧殼體10, 20‧‧‧ shell

100‧‧‧第一部分100‧‧‧Part 1

102‧‧‧凹槽102‧‧‧ Groove

104‧‧‧螺孔104‧‧‧ screw holes

106‧‧‧導熱結構106‧‧‧thermal structure

108‧‧‧外殼108‧‧‧Shell

110‧‧‧蓋體110‧‧‧ cover

110a、110b‧‧‧側110a, 110b‧‧‧ side

120‧‧‧第二部分120‧‧‧Part II

122‧‧‧光線感測元件122‧‧‧Light sensing components

22‧‧‧散熱裝置22‧‧‧ Heat sink

1-1‧‧‧切線1-1‧‧‧ tangent

E‧‧‧空間E‧‧‧ Space

R‧‧‧容納槽R‧‧‧ receiving trough

S1‧‧‧出光側S1‧‧‧ light side

S2‧‧‧散熱側S2‧‧‧heat side

S3‧‧‧側壁S3‧‧‧ side wall

X‧‧‧中心軸X‧‧‧ central axis

θ 1~θ 3‧‧‧角度θ 1~θ 3‧‧‧ angle

第1A~1B圖繪示習知之LED照明裝置及其殼體之示意圖。1A-1B are schematic views showing a conventional LED lighting device and a casing thereof.

第2A圖繪示根據本發明一實施例之照明裝置之殼體的示意圖。2A is a schematic view of a housing of a lighting device in accordance with an embodiment of the present invention.

第2B圖繪示第2A圖之殼體沿切線1-1切割之剖面示意圖。FIG. 2B is a schematic cross-sectional view showing the casing of FIG. 2A cut along a tangential line 1-1.

第2A圖繪示依照本發明一實施例之照明裝置的殼體之示意圖。請參考第2A圖，殼體10包括一第一部分100及一第二部分120。第一部分100用以容置發光二極體(Light Emitting Diode，LED)模組(未繪示出)，並提供一散熱空間。第二部分120用以容置電子元件及LED模組之導線。2A is a schematic view of a housing of a lighting device in accordance with an embodiment of the present invention. Referring to FIG. 2A, the housing 10 includes a first portion 100 and a second portion 120. The first part 100 is used to house a Light Emitting Diode (LED) module (not shown) and provide a heat dissipation space. The second portion 120 is for receiving the wires of the electronic component and the LED module.

在本實施例中，第一部分100具有一第一側110a及相對於第一側110a之一第二側110b。第一側110a連接一蓋體110，且第二側110b連接第二部分120。在一實施例中，殼體10還包含一光線感測元件122，其可以設置於殼體10的第二部分120，用以感測光線。當光線感測元件122偵測到足夠的光線時，可以切換發光二極體至省電模式以達到省電的效果。於一實施例中，第二部分120可以由導熱金屬材料所製成，例如是鋁或銅。In the present embodiment, the first portion 100 has a first side 110a and a second side 110b opposite the first side 110a. The first side 110a is connected to a cover 110, and the second side 110b is connected to the second portion 120. In an embodiment, the housing 10 further includes a light sensing component 122 that can be disposed in the second portion 120 of the housing 10 for sensing light. When the light sensing component 122 detects sufficient light, the light emitting diode can be switched to the power saving mode to achieve power saving effect. In an embodiment, the second portion 120 can be made of a thermally conductive metal material, such as aluminum or copper.

第2B圖繪示第2A圖之殼體10沿切線1-1切割之剖面示意圖。請參考第2A及2B圖，殼體10之第一部分100包括一外殼108及至少一導熱結構106。外殼108環繞形成一空間E並具有一出光側S1、一散熱側S2及二側壁S3。導熱結構106設置於空間E內，且連接於外殼108之出光側S1及散熱側S2之間。外殼108延伸於第一部分100之第一側110a1及第二側110b間。FIG. 2B is a schematic cross-sectional view showing the casing 10 of FIG. 2A cut along a tangential line 1-1. Referring to FIGS. 2A and 2B, the first portion 100 of the housing 10 includes a housing 108 and at least one thermally conductive structure 106. The outer casing 108 surrounds a space E and has a light exiting side S1, a heat dissipating side S2 and two side walls S3. The heat conducting structure 106 is disposed in the space E and is connected between the light emitting side S1 and the heat radiating side S2 of the outer casing 108. The outer casing 108 extends between the first side 110a1 and the second side 110b of the first portion 100.

請參考第2B圖，外殼108為圓頂狀或平板狀，且外殼108之散熱側S2為一弧形。於一實施例中，外殼108、蓋體110(繪示於第2A圖)及第二部分120(繪示於第2A圖)可形成空間E。Referring to FIG. 2B, the outer casing 108 is dome-shaped or flat, and the heat-dissipating side S2 of the outer casing 108 is curved. In one embodiment, the outer casing 108, the cover 110 (shown in FIG. 2A), and the second portion 120 (shown in FIG. 2A) form a space E.

於此實施例中，第一部分100包括至少一導熱結構106及一外殼108。外殼108環繞導熱結構106。導熱結構106及外殼108可以藉由鋁擠成型(preventing aluminum intrusion)的方式一體成型地形成。外殼108具有一容納槽R，容納槽R形成於外殼108之出光側S1，且可以具有圓弧型(circle curve shape)或彎曲型(bended shape)的形狀。容納槽R可於導熱結構106及外殼108形成的同時，由製程模具定義而形成。In this embodiment, the first portion 100 includes at least one thermally conductive structure 106 and a housing 108. The outer casing 108 surrounds the thermally conductive structure 106. The heat conducting structure 106 and the outer casing 108 may be integrally formed by means of preventing aluminum intrusion. The outer casing 108 has a receiving groove R formed on the light exiting side S1 of the outer casing 108, and may have a shape of a circular curve shape or a bent shape. The receiving groove R can be formed by the process die while being formed by the heat conducting structure 106 and the outer casing 108.

LED模組(未繪示出)可以設置於容納槽R中，且鄰設於外殼108之出光側S1。導熱結構106連接設置於外殼108之出光側S1及散熱側S2之間，LED模組所產生的熱可以透過導熱結構106由外殼108之出光側 S1被導向散熱側S2。因此，外殼108之散熱側S2可以將LED模組產生的熱與外界環境作熱交換。外殼108之散熱側S2例如可以為圓弧型，以防止雪和雨的堆積。The LED module (not shown) may be disposed in the receiving slot R and adjacent to the light exiting side S1 of the outer casing 108. The heat conducting structure 106 is connected between the light emitting side S1 and the heat radiating side S2 of the outer casing 108, and the heat generated by the LED module can pass through the heat conducting structure 106 from the light emitting side of the outer casing 108. S1 is guided to the heat dissipation side S2. Therefore, the heat dissipation side S2 of the outer casing 108 can exchange heat generated by the LED module with the external environment. The heat dissipating side S2 of the outer casing 108 may be, for example, a circular arc type to prevent accumulation of snow and rain.

於一實施例中，導熱結構106及外殼108可以由金屬材質(例如是鋁)所形成。導熱結構106連接於外殼108之出光側S1及散熱側S2之間。換句話說，導熱結構106的高度實質上可以為外殼108之出光側S1及散熱側S2之間的距離。此外，導熱結構106的長度實質上可以為第一部分100之第一側110a及第二側110b之間的距離。換句話說，導熱結構106可以延伸於第一部分100之第一側110a及第二側110b間。導熱結構106的剖面可以為平板狀、叉狀或網狀，但不限於此。於第2B圖中，導熱結構106係以平板狀為例。In one embodiment, the thermally conductive structure 106 and the outer casing 108 may be formed of a metallic material such as aluminum. The heat conducting structure 106 is connected between the light emitting side S1 of the outer casing 108 and the heat radiating side S2. In other words, the height of the heat conducting structure 106 can be substantially the distance between the light exiting side S1 of the outer casing 108 and the heat dissipating side S2. Moreover, the length of the thermally conductive structure 106 can be substantially the distance between the first side 110a and the second side 110b of the first portion 100. In other words, the thermally conductive structure 106 can extend between the first side 110a and the second side 110b of the first portion 100. The cross section of the heat conducting structure 106 may be a flat plate shape, a fork shape or a mesh shape, but is not limited thereto. In FIG. 2B, the heat conducting structure 106 is exemplified by a flat plate shape.

於一實施例中，導熱結構106的數量可以根據製程模具及/或製程條件作調整。導熱結構106的數量可以是1~10，包括上限值10及上限值1。外殼108之壁厚可介於1毫米(mm)~10mm，包括上限值10mm及下限值1mm。In one embodiment, the number of thermally conductive structures 106 can be adjusted according to process molds and/or process conditions. The number of the heat conducting structures 106 may be 1 to 10, including the upper limit value 10 and the upper limit value 1. The wall thickness of the outer casing 108 may range from 1 millimeter (mm) to 10 mm, including an upper limit of 10 mm and a lower limit of 1 mm.

此外，於一實施例中，設置於外殼108之出光側S1及散熱側S2之間的複數個導熱結構106彼此不平行，且導熱結構106由外殼108之出光側S1往外殼108的兩側壁S3擴張延伸至散熱側S2。如第2B圖所示，介於導熱結構106及外殼108之出光側S1之間的角度係定義為角度θ 1~θ 3。角度θ 1~θ 3介於45度至90度之間，於一實施例中，此範圍係包括下限值45度及上限值90度。In addition, in an embodiment, the plurality of heat conducting structures 106 disposed between the light emitting side S1 and the heat radiating side S2 of the outer casing 108 are not parallel to each other, and the heat conducting structure 106 is formed by the light emitting side S1 of the outer casing 108 toward the two side walls S3 of the outer casing 108. The expansion extends to the heat dissipating side S2. As shown in FIG. 2B, the angle between the heat conducting structure 106 and the light exiting side S1 of the outer casing 108 is defined as the angle θ 1 to θ 3 . The angle θ 1 θ θ 3 is between 45 degrees and 90 degrees. In one embodiment, the range includes a lower limit of 45 degrees and an upper limit of 90 degrees.

於一實施例中，介於導熱結構106及外殼108之出光側S1之間的角度θ 1~θ 3係由外殼108之中心軸X向外殼108的側壁S3逐漸縮小。外殼108實質上係對稱於中心軸X。換句話說，角度θ 1~θ 3係由外殼108之中心朝向外側逐漸縮小。舉例來說，於一實施例中，角度θ 1實質上為90度，角度θ 2實質上為60度，且角度θ 3實質上為45度。考慮製程公差所造成的影響，所述之角度係可涵蓋到本發明所屬技藝之人所可以理解的誤差範圍。In one embodiment, the angle θ 1 θ θ 3 between the heat conducting structure 106 and the light exiting side S1 of the outer casing 108 is gradually reduced from the central axis X of the outer casing 108 toward the side wall S3 of the outer casing 108. The outer casing 108 is substantially symmetrical about the central axis X. In other words, the angles θ 1 to θ 3 are gradually reduced from the center of the outer casing 108 toward the outer side. For example, in one embodiment, the angle θ 1 is substantially 90 degrees, the angle θ 2 is substantially 60 degrees, and the angle θ 3 is substantially 45 degrees. In view of the effects of process tolerances, the angles described may encompass a range of tolerances as understood by those skilled in the art to which the invention pertains.

如第2B圖所示，在一實施例中，外殼108還包含一凹槽 102，凹槽102係配置於外殼108之出光側S1的外壁上，可用以容置發光二極體(LED)模組的導線。於一實施例中，外殼108之出光側S1可以具有兩個凹槽102，以容置LED模組的導線(未繪示出)。凹槽102的數量並不作限制。於其他實施例中，可以形成更少或更多的凹槽於外殼108之出光側S1。凹槽102的深度可以有關於所欲容置之導線的數量及各個導線的直徑作調整，並不作限制。As shown in FIG. 2B, in an embodiment, the housing 108 further includes a recess 102, the groove 102 is disposed on the outer wall of the light exiting side S1 of the outer casing 108, and can be used to accommodate the wires of the light emitting diode (LED) module. In an embodiment, the light exiting side S1 of the outer casing 108 may have two recesses 102 for receiving wires (not shown) of the LED module. The number of grooves 102 is not limited. In other embodiments, fewer or more grooves may be formed in the light exit side S1 of the outer casing 108. The depth of the groove 102 can be adjusted with respect to the number of wires to be accommodated and the diameter of each wire, and is not limited.

於一實施例中，外殼108還包含具有螺孔104的複數個突出部，其可以設置於導熱結構106及外殼108之間的連接區。固定元件(未繪示出)可以固定蓋體110(繪示於第2A圖)於第一部分100之第一側110a上，固定元件例如是螺絲。蓋體110可以防止昆蟲、雨水、雪及灰塵進入外殼108所形成的空間E。In an embodiment, the outer casing 108 further includes a plurality of protrusions having screw holes 104 that may be disposed in the connection region between the heat conducting structure 106 and the outer casing 108. A fixing member (not shown) can fix the cover 110 (shown in FIG. 2A) on the first side 110a of the first portion 100, such as a screw. The cover 110 can prevent insects, rain, snow, and dust from entering the space E formed by the outer casing 108.

綜上，本發明上述實施例，可利用至少一設置於殼體內之導熱結構，以將LED模組產生的熱與外在環境作熱交換，進而使LED模組產生的熱散失至外在環境中，且本發明上述實施例之殼體同時具有防塵的效果。於一實施例中，可以設計殼體之外殼具有圓弧型之散熱側，以兼具美觀及防止雨水和雪的堆積。In summary, the above embodiment of the present invention can utilize at least one heat conducting structure disposed in the housing to exchange heat between the LED module and the external environment, thereby dissipating the heat generated by the LED module to the external environment. The housing of the above embodiment of the present invention has a dustproof effect at the same time. In one embodiment, the outer casing of the casing can be designed to have a circular arc-shaped heat-dissipating side for both aesthetics and prevention of accumulation of rain and snow.

綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧第一部分100‧‧‧Part 1

102‧‧‧凹槽102‧‧‧ Groove

104‧‧‧螺孔104‧‧‧ screw holes

106‧‧‧導熱結構106‧‧‧thermal structure

108‧‧‧外殼108‧‧‧Shell

E‧‧‧空間E‧‧‧ Space

R‧‧‧容納槽R‧‧‧ receiving trough

S1‧‧‧出光側S1‧‧‧ light side

S2‧‧‧散熱側S2‧‧‧heat side

S3‧‧‧側壁S3‧‧‧ side wall

X‧‧‧中心軸X‧‧‧ central axis

θ 1~θ 3‧‧‧角度θ 1~θ 3‧‧‧ angle

Claims (18)

一種照明裝置之殼體，包括：一第一部分，用以容置一發光二極體模組，該第一部分包括一外殼及複數個導熱結構，該外殼形成一空間並具有一散熱側及一出光側，且該些導熱結構設置於該空間內，其中該些導熱結構連接於該外殼之該散熱側及該出光側之間，且該些導熱結構與該外殼之該出光側之間具有複數個角度，該些角度的值係由該外殼之中心向該外殼之側邊逐漸縮小。 A housing for a lighting device, comprising: a first portion for accommodating a light emitting diode module, the first portion comprising a casing and a plurality of heat conducting structures, the casing forming a space and having a heat dissipating side and a light emitting The heat-conducting structure is disposed between the heat-dissipating side and the light-emitting side of the outer casing, and the plurality of heat-conducting structures and the light-emitting side of the outer casing have a plurality of Angles, the values of the angles are gradually reduced from the center of the outer casing to the sides of the outer casing. 如申請專利範圍第1項所述之殼體，更包括：一第二部分，連接至該第一部分，用以容置該發光二極體模組之電子元件。 The housing of claim 1, further comprising: a second portion connected to the first portion for accommodating the electronic components of the LED module. 如申請專利範圍第2項所述之殼體，其中該第一部分包括一第一側及相對於該第一側之一第二側，該第二部分連接於該第一部分之該第二側，其中，該殼體更包括：一蓋體，用以覆蓋該第一部分之該第一側。 The casing of claim 2, wherein the first portion includes a first side and a second side opposite the first side, the second portion being coupled to the second side of the first portion, The housing further includes a cover for covering the first side of the first portion. 如申請專利範圍第1項所述之殼體，其中該外殼係圓頂狀或平板狀，且該外殼之該散熱側為一弧形。 The casing of claim 1, wherein the outer casing is dome-shaped or flat, and the heat-dissipating side of the outer casing is curved. 如申請專利範圍第1項所述之殼體，其中該出光側之一外壁包括至少一凹槽，用以容置該發光二極體模組之導線。 The housing of claim 1, wherein the outer wall of the light exiting side comprises at least one recess for receiving the wire of the light emitting diode module. 如申請專利範圍第1項所述之殼體，其中該外殼具有一容納槽，該容納槽係形成於該外殼之該出光側，用以容置該發光二極體模組。 The housing of claim 1, wherein the housing has a receiving slot formed on the light exiting side of the housing for receiving the LED module. 如申請專利範圍第1項所述之殼體，更包括：一螺孔，設置於該些導熱結構及該外殼之間之一連接區。 The housing of claim 1, further comprising: a screw hole disposed in the connecting portion between the heat conducting structure and the outer casing. 如申請專利範圍第1項所述之殼體，其中該些導熱結構及該外殼係一體成型。 The housing of claim 1, wherein the thermally conductive structure and the outer casing are integrally formed. 如申請專利範圍第1項所述之殼體，更包括：一光線感測元件，用以偵測光線。 The housing of claim 1, further comprising: a light sensing component for detecting light. 一照明裝置，包括：一發光二極體模組，用以提供光線；及 一殼體，發光二極體模組設置於該殼體上，該殼體包括一第一部分，該第一部分包括一外殼及複數個導熱結構，該外殼形成一空間並具有一散熱側及一出光側，且該些導熱結構係設置於該空間內，其中，該些導熱結構連接於該外殼之該散熱側及該出光側之間，且該些導熱結構與該外殼之該出光側之間具有複數個角度，該些角度的值係由該外殼之中心向該外殼之側邊逐漸縮小。 An illumination device comprising: a light emitting diode module for providing light; and a housing, the LED module is disposed on the housing, the housing includes a first portion, the first portion includes a housing and a plurality of heat conducting structures, the housing forming a space and having a heat dissipation side and a light emitting a side, and the heat conducting structures are disposed in the space, wherein the heat conducting structures are coupled between the heat dissipating side and the light emitting side of the housing, and the heat conducting structures and the light emitting side of the housing have The plurality of angles are gradually reduced from the center of the outer casing to the side of the outer casing. 如申請專利範圍第10項所述之照明裝置，更包括：一第二部分，連接至該第一部分，用以容置該發光二極體模組之電子元件。 The illuminating device of claim 10, further comprising: a second portion connected to the first portion for accommodating the electronic components of the LED module. 如申請專利範圍第11項所述之照明裝置，其中該第一部分包括一第一側及相對於該第一側之一第二側，該第二部分係連接於該第一部分之該第二側，其中，該殼體更包括：一蓋體，用以覆蓋該第一部分之該第一側。 The illuminating device of claim 11, wherein the first portion includes a first side and a second side opposite the first side, the second portion is coupled to the second side of the first portion The housing further includes: a cover for covering the first side of the first portion. 如申請專利範圍第10項所述之照明裝置，其中該外殼係圓頂狀或平板狀，且該外殼之該散熱側為一弧形。 The illuminating device of claim 10, wherein the outer casing is dome-shaped or flat, and the heat-dissipating side of the outer casing is curved. 如申請專利範圍第10項所述之照明裝置，其中該出光側之一外壁包括：至少一凹槽，用以容置該發光二極體模組之導線。 The illuminating device of claim 10, wherein the outer wall of the light exiting side comprises: at least one groove for receiving the wire of the light emitting diode module. 如申請專利範圍第10項所述之照明裝置，其中該外殼具有一容納槽，該容納槽形成於該外殼之該出光側，用以容置該發光二極體模組。 The illuminating device of claim 10, wherein the housing has a receiving slot formed on the light emitting side of the housing for receiving the LED module. 如申請專利範圍第10項所述之照明裝置，更包括：一螺孔，設置於該些導熱結構及該外殼之間之一連接區。 The lighting device of claim 10, further comprising: a screw hole disposed in the connecting region between the heat conducting structure and the outer casing. 如申請專利範圍第10項所述之照明裝置，其中該些導熱結構及該外殼係一體成型。 The illuminating device of claim 10, wherein the heat conducting structures and the outer casing are integrally formed. 如申請專利範圍第10項所述之照明裝置，更包括：一光線感測元件，用以偵測光線。The lighting device of claim 10, further comprising: a light sensing component for detecting light.
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