TWI505579B - Electrical connector system - Google Patents
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Description
本發明涉及一種用於安裝至一基板上之電氣連接器系統。The present invention relates to an electrical connector system for mounting to a substrate.
底板連接器系統一般係用於以平行或垂直關係而連接一第一基板(例如一印刷電路板)與一第二基板(例如另一印刷電路板)。由於電子元件之尺寸的縮小且電子元件一般變得更為複雜，所以通常需要將更多的元件裝配在電路板或其他基板上的較小空間中；因此，現已需要縮小底板連接器系統中電氣端子之間的間隔，並增加容置於底板連接器系統中電氣端子的數量。縮小電氣端子間之間隔會增加該等電氣端子之間的電氣雜訊或串擾，特別是當該電氣連接器系統中的訊號速度增加時。The backplane connector system is typically used to connect a first substrate (e.g., a printed circuit board) and a second substrate (e.g., another printed circuit board) in a parallel or perpendicular relationship. As electronic components shrink in size and electronic components generally become more complex, it is often necessary to mount more components in a smaller space on a circuit board or other substrate; therefore, it is now necessary to shrink the backplane connector system. The spacing between the electrical terminals and the number of electrical terminals housed in the backplane connector system. Reducing the spacing between electrical terminals increases electrical noise or crosstalk between the electrical terminals, particularly as the signal speed in the electrical connector system increases.
需要一種電氣連接器系統，其在容置較多數量的電氣端子下仍能以較高速度運作。There is a need for an electrical connector system that can operate at higher speeds while accommodating a greater number of electrical terminals.
根據本發明，一電氣連接器系統包含配置以接合一基板之一第一薄片組件以及配置以接合該基板之一第二薄片組件。一接地片係耦接於該第一薄片組件與該第二薄片組件。該接地片係配置以接合該基板，並於該第一薄片組件、該第二薄片組件與該基板之間提供一共同接地電位。In accordance with the present invention, an electrical connector system includes a first sheet assembly configured to engage a substrate and a second sheet assembly configured to engage the substrate. A grounding strip is coupled to the first sheet assembly and the second sheet assembly. The ground strip is configured to engage the substrate and provide a common ground potential between the first wafer assembly, the second wafer assembly and the substrate.
本發明與連接於一或多個基板之底板連接器系統有關。該等底板連接器系統能以高速(例如可達至少約25 Gbps)運作，同時在某些實作例中也提供了高接腳密度(例如每英吋至少約有50對電氣連接器)。在一實作例中，如第一圖所示，底板連接器系統102係用於以平行或垂直關係而將一第一基板104(例如一印刷電路板)連接於一第二基板106(例如另一印刷電路板)。如下文將進一步詳細說明，所揭露之連接器系統的實作例可包含接地片、接地遮蔽及/或其他接地結構，其實質上以三維方式包覆了分佈在底板覆蓋區(backplane footprint)上、底板連接器上及/或子卡覆蓋區(daughtercard footprint)上的電氣連接器對(其可為差動電氣連接器對)。在該等高速底板連接器系統的運作期間，這些包覆接地片、接地遮蔽及/或接地結構可與環繞該等電氣連接器對本身之該等差動空腔的介電填充劑一起避免不需要之非橫向、縱向與較高階模式之傳遞。The invention relates to a backplane connector system coupled to one or more substrates. The backplane connector systems are capable of operating at high speeds (e.g., up to at least about 25 Gbps) while also providing high pin densities (e.g., at least about 50 pairs of electrical connectors per inch) in some embodiments. In one embodiment, as shown in the first figure, the backplane connector system 102 is used to connect a first substrate 104 (eg, a printed circuit board) to a second substrate 106 in a parallel or vertical relationship (eg, another a printed circuit board). As will be described in further detail below, embodiments of the disclosed connector system can include a ground plane, ground shield, and/or other grounding structure that is substantially three-dimensionally wrapped over the backplane footprint, Electrical connector pairs on the backplane connector and/or on the daughter card footprint (which may be differential electrical connector pairs). During operation of the high speed backplane connector systems, the covered ground strips, ground shields and/or ground structures may be avoided with dielectric fillers surrounding the differential cavities of the electrical connectors themselves The transmission of non-horizontal, vertical and higher-order modes is required.
第二A圖為用於連接多個基板之電氣連接器系統202的透視圖。在一實作例中，電氣連接器系統202具有連接於一第一基板(例如第一圖之基板104)之一安裝端204以及連接於一第二基板(例如第一圖之基板106)之一匹配端206。在與電氣連接器系統202接合時，該第一與第二基板係以實質上垂直的關係排列。電氣連接器系統202包含一薄片殼體208、一或多個薄片組件210以及一或多個接地片212。The second A is a perspective view of an electrical connector system 202 for connecting a plurality of substrates. In one embodiment, the electrical connector system 202 has one of the mounting ends 204 connected to a first substrate (eg, the substrate 104 of the first figure) and one of the second substrates (eg, the substrate 106 of the first figure). Matching terminal 206. The first and second substrates are arranged in a substantially perpendicular relationship when engaged with the electrical connector system 202. The electrical connector system 202 includes a foil housing 208, one or more wafer assemblies 210, and one or more ground lugs 212.
薄片殼體208用於容置與定位在電氣連接器系統202內彼此相鄰的多個薄片組件210。在一實作例中，薄片殼體208於各薄片組件210的匹配端206處接合薄片組件210，在薄片殼體208中的一或多個孔洞之大小係使自薄片組件210延伸的匹配連接器得以通過薄片殼體208，因此該等匹配連接器係連接於與基板或另一匹配裝置(如美國專利申請號12/474,568中所說明的該等頂蓋模組)相關之對應匹配連接器。The foil housing 208 is for receiving and positioning a plurality of wafer assemblies 210 adjacent one another within the electrical connector system 202. In one embodiment, the foil housing 208 engages the wafer assembly 210 at the mating end 206 of each foil assembly 210, the size of one or more of the apertures in the foil housing 208 being such that the mating connector extends from the foil assembly 210 The mating connector is operative so that the mating connectors are coupled to corresponding mating connectors associated with the substrate or another mating device, such as the cap modules illustrated in U.S. Patent Application Serial No. 12/474,568.
薄片組件210用以於多個基板間提供電氣路徑陣列。該等電氣路徑可為訊號路徑、電力傳輸路徑、或接地電位路徑。在第二A圖所示之實作例中，各薄片組件210包含一第一殼體214、一第一電氣接點陣列216(也稱為第一引線框組件)、一第二電氣接點陣列218(也稱為第二引線框組件)以及一第二殼體220。第二B圖繪示了第二A圖之電氣連接器系統202的部分分解圖，第二B圖也繪示了一接地遮蔽602與一組織器1112，其將於下文中配合其他圖式說明。第二A圖與第二B圖例示由兩個外部殼體所形成之各薄片組件210，在其他實作例中，薄片組件210係各包含一中央殼體(例如具有形成於該中央殼體之每一側上之該等兩接點陣列之溝槽)、多個外部殼體、一具有多個外部殼體之中央殼體或其他殼體配置方式。The wafer assembly 210 is used to provide an array of electrical paths between a plurality of substrates. The electrical paths can be signal paths, power transmission paths, or ground potential paths. In the embodiment shown in FIG. A, each of the sheet assemblies 210 includes a first housing 214, a first electrical contact array 216 (also referred to as a first lead frame assembly), and a second electrical contact array. 218 (also referred to as a second lead frame assembly) and a second housing 220. 2B is a partially exploded view of the electrical connector system 202 of FIG. 2A, and FIG. 2B is also a ground shield 602 and an organizer 1112, which will be described below with other drawings. . 2A and 2B illustrate various sheet assemblies 210 formed by two outer casings. In other embodiments, the sheet assemblies 210 each include a central casing (eg, having a central casing formed therein) The two-contact array of grooves on each side), a plurality of outer casings, a central casing having a plurality of outer casings, or other casing arrangements.
在第二A圖與第二B圖之實作例中，薄片組件210的第一殼體214包含一導電表面，其界定大小足以容置第一電氣接點陣列216的複數個溝槽222。在此實作例中，第二殼體220也包含一導電表面，其界定大小足以容置第二電氣接點陣列218的複數個溝槽。第二殼體220的該等溝槽實質上與第二B圖中所例示之溝槽222類似。在某些實作例中，該等溝槽係與絕緣層(例如包覆成型之塑膠介電質)齊平，使得當第一與第二電氣接點陣列216、218實質上位於其個別溝槽內時，該絕緣層係使該等電氣接點與第一與第二殼體214、220的導電表面電性隔離。在其他實作例中，該絕緣層係直接施加於電氣接點陣列216、218上；在電氣接點陣列216、218已經定位於殼體元件214、220之後，殼體214、220係接合在一起以形成薄片組件210。In the second and second B-figure embodiments, the first housing 214 of the wafer assembly 210 includes a conductive surface that defines a plurality of grooves 222 that are sized to receive the first electrical contact array 216. In this embodiment, the second housing 220 also includes a conductive surface that defines a plurality of trenches sized to receive the second electrical contact array 218. The grooves of the second housing 220 are substantially similar to the grooves 222 illustrated in the second Figure B. In some embodiments, the trenches are flush with the insulating layer (eg, overmolded plastic dielectric) such that when the first and second electrical contact arrays 216, 218 are substantially in their individual trenches The insulating layer electrically isolates the electrical contacts from the conductive surfaces of the first and second housings 214, 220. In other implementations, the insulating layer is applied directly to the electrical contact arrays 216, 218; after the electrical contact arrays 216, 218 have been positioned at the housing components 214, 220, the housings 214, 220 are bonded together. To form the sheet assembly 210.
薄片組件210之電氣接點陣列216、218包含一系列的基板接合元件，例如第二B圖中所示之電氣接點安裝接腳224。在一實作例中，該等基板接合元件係為使薄片組件210與基板機械及電氣耦接之訊號接點。當第一與第二電氣接點陣列216、218位於殼體元件214、220的該等溝槽內時，該等基板接合元件會從薄片組件210的安裝端204延伸而出以耦接於一第一基板。同樣的，第一與第二電氣接點陣列216、218的匹配連接器226也會從薄片組件210的匹配端206延伸而出以耦接於一第二基板或另一匹配裝置(例如頂蓋模組)。匹配連接器226係呈封閉帶狀、三樑形、雙樑形、圓形、公型、母型、無極性、或另一匹配連接器類型。The electrical contact arrays 216, 218 of the wafer assembly 210 include a series of substrate bonding components, such as the electrical contact mounting pins 224 shown in FIG. In one embodiment, the substrate bonding components are signal contacts that mechanically and electrically couple the wafer assembly 210 to the substrate. When the first and second electrical contact arrays 216, 218 are located in the trenches of the housing components 214, 220, the substrate bonding components extend from the mounting end 204 of the wafer assembly 210 to couple to one The first substrate. Similarly, the mating connectors 226 of the first and second electrical contact arrays 216, 218 also extend from the mating end 206 of the wafer assembly 210 to couple to a second substrate or another matching device (eg, a top cover) Module). The mating connector 226 is in the form of a closed band, a three beam, a double beam, a circle, a male, a female, a non-polar, or another mating connector type.
當第一電氣接點陣列216實質位於第一殼體214的複數個溝槽222內，且第二電氣接點陣列218實質位於第二殼體220的該等溝槽內時，第一電氣接點陣列216的各電氣接點係與第二電氣接點陣列218的電氣接點相鄰。在某些實作例中，第一與第二電氣接點陣列216、218係位於該等溝槽內，使得在整個薄片組件210中相鄰電氣接點之間的距離係實質相等。第一與第二電氣接點陣列216、218的該等相鄰電氣接點共同形成一系列的電氣接點對。在某些實作例中，該等電氣接點對係電氣接點之差動對。舉例而言，該等電氣接點對係用於差動發訊。When the first electrical contact array 216 is substantially located in the plurality of trenches 222 of the first housing 214, and the second electrical contact array 218 is substantially located in the trenches of the second housing 220, the first electrical connection Each electrical contact of the array of dots 216 is adjacent to an electrical contact of the second electrical contact array 218. In some implementations, the first and second electrical contact arrays 216, 218 are positioned within the trenches such that the distance between adjacent electrical contacts in the entire wafer assembly 210 is substantially equal. The adjacent electrical contacts of the first and second electrical contact arrays 216, 218 together form a series of electrical contact pairs. In some implementations, the electrical contacts are differential pairs of electrical contacts. For example, the pairs of electrical contacts are used for differential signaling.
在某些實作例中，就各電氣接點對而言，第一電氣接點陣列216的該電氣接點映照第二電氣接點陣列218的該相鄰電氣接點；映照該電氣接點對之該等電氣接點可提供製造上的優勢以及高速電氣性能之列對列一致性，同時又提供兩列成對之獨特結構。In some implementations, for each electrical contact pair, the electrical contacts of the first electrical contact array 216 map the adjacent electrical contacts of the second electrical contact array 218; These electrical contacts provide manufacturing advantages as well as high-speed electrical performance column alignment while providing two columns of unique structures.
薄片組件210的第一與第二殼體214、220係形成為具有一導電表面。舉例而言，第一與第二殼體214、220係形成為鍍製之塑膠接地殼之殼體。在某些實作例中，第一與第二殼體214、220之每一者包含一鍍製塑膠或壓鑄(diecast)接地薄片，例如鍍鎳(Ni)上覆錫(Sn)或鋅(Zn)壓鑄。在其他實作例中，第一與第二殼體214、220可包含鋁(Al)壓鑄、導電性聚合物、金屬射出成型、或任何其他類型之金屬。The first and second housings 214, 220 of the wafer assembly 210 are formed to have a conductive surface. For example, the first and second housings 214, 220 are formed as a housing of a plated plastic grounded housing. In some embodiments, each of the first and second housings 214, 220 includes a plated plastic or diecast ground foil, such as nickel (Ni) coated with tin (Sn) or zinc (Zn). ) Die casting. In other embodiments, the first and second housings 214, 220 may comprise aluminum (Al) die cast, conductive polymer, metal injection molding, or any other type of metal.
薄片組件210的第一與第二電氣接點陣列216、218係由導電材料所形成。在某些實作例中，第一與第二電氣接點陣列216、218包含磷青銅以及鍍鎳(Ni)上覆金(Au)或錫(Sn)。在其他實作例中，第一與第二電氣接點陣列216、218係包含銅(Cu)合金材料。該等鍍層可為任何貴重金屬(例如鈀Pd)或合金(例如鈀-鎳或該接點區域中之塗金的鈀、該安裝區域中之錫(Sn)或鎳(Ni)以及於下層鍍製或基底鍍製之鎳(Ni))。The first and second electrical contact arrays 216, 218 of the wafer assembly 210 are formed from a conductive material. In some embodiments, the first and second electrical contact arrays 216, 218 comprise phosphor bronze and nickel (Ni) coated gold (Au) or tin (Sn). In other implementations, the first and second electrical contact arrays 216, 218 comprise a copper (Cu) alloy material. The plating may be any precious metal (e.g., palladium Pd) or alloy (e.g., palladium-nickel or gold coated palladium in the joint region, tin (Sn) or nickel (Ni) in the mounting region, and underlying plating) Nickel (Ni) coated or substrate.
如第二A圖所示，複數個接地片212係定位以於電氣連接器系統202的安裝端204處連接複數個薄片組件210。各接地片212係橫跨於複數個薄片組件210而定位，使得接地片212接合薄片組件210之每一者。在其他實作例中，接地片可僅接合薄片組件210的子集合。As shown in FIG. 2A, a plurality of ground lugs 212 are positioned to connect a plurality of wafer assemblies 210 at the mounting end 204 of the electrical connector system 202. Each ground strip 212 is positioned across a plurality of sheet assemblies 210 such that the ground strip 212 engages each of the sheet assemblies 210. In other implementations, the ground lug may only engage a subset of the sheet assemblies 210.
接地片212與基板接合，並於多個薄片組件210與該基板之間提供一共同接地電位。在某些實作例中，薄片組件210的殼體214、220可導電；舉例而言，殼體214和220係形成為具有一導電表面，例如在塑膠殼體結構上的一導電性鍍層。因此，當接地片212與多個薄片組件210及基板接合時，接地片212的導電材料可用以於各薄片組件210的該等殼體與該基板間提供一共同接地電位。當接地片212與多個薄片組件210接合時，該接地片係電氣與機械連接於多個薄片組件210之每一者。The ground strip 212 is bonded to the substrate and provides a common ground potential between the plurality of wafer assemblies 210 and the substrate. In some embodiments, the housings 214, 220 of the wafer assembly 210 can be electrically conductive; for example, the housings 214 and 220 are formed to have a conductive surface, such as a conductive coating on the plastic housing structure. Therefore, when the grounding piece 212 is bonded to the plurality of sheet assemblies 210 and the substrate, the conductive material of the grounding strip 212 can be used to provide a common ground potential between the housings of the sheet assemblies 210 and the substrate. When the ground lug 212 is engaged with the plurality of wafer assemblies 210, the ground lugs are electrically and mechanically coupled to each of the plurality of wafer assemblies 210.
第三圖為接地片212的透視圖。第三圖之接地片212包含基板接合元件302、肩部部分304、基部部分306與固持元件308。基板接合元件302係為安裝接點，例如接地安裝接腳，其於電氣連接器系統202安裝至基板時，機械與電氣耦接接地片212與基板。The third view is a perspective view of the grounding strip 212. The ground strip 212 of the third diagram includes a substrate engaging element 302, a shoulder portion 304, a base portion 306, and a retaining member 308. The substrate bonding component 302 is a mounting contact, such as a ground mounting pin, that mechanically and electrically couples the ground pad 212 to the substrate when the electrical connector system 202 is mounted to the substrate.
第四圖例示了與複數個薄片組件210接合之數個接地片212及即將接合於複數個薄片組件210之一接地片212。第五圖例示了與複數個薄片組件210接合之複數個接地片212的側視圖。當多個接地片212與薄片組件210接合時，各接地片212係以實質平行關對齊於其他的接地片212。The fourth figure illustrates a plurality of ground strips 212 that are joined to a plurality of wafer assemblies 210 and a ground strip 212 that is to be joined to a plurality of wafer assemblies 210. The fifth figure illustrates a side view of a plurality of ground lugs 212 joined to a plurality of wafer assemblies 210. When the plurality of grounding lugs 212 are engaged with the wafer assembly 210, the grounding lugs 212 are aligned in substantially parallel alignment with the other grounding lugs 212.
如第四圖與第五圖所示，薄片組件210的每一殼體係形成為具有一狹槽402。第一薄片組件210的殼體中之狹槽402係與相鄰薄片組件210的殼體中之狹槽402對齊，使得一接地片212可接合多個薄片組件210的該等殼體中之多個狹槽402。當接地片212與一或多個薄片組件210接合時，接地片212的基部部分306裝配於薄片組件210的狹槽402內。當接地片212放置至狹槽402中時，固持元件308會對狹槽402之內表面產生壓合(press fit)或干涉配合(interference fit)。舉例而言，狹槽402的寬度大小係足以接受及固持接地片212的固持元件308，固持元件308係凸飾以漣漪狀介面或其他形成於接地片212的基部部分306之表面上的突出部，該等突出部係從接地片212的一側面或兩側面延伸出去。在其他實作例中，接地片212係藉由另一連接機構而連接於薄片組件210的該等殼體。As shown in the fourth and fifth figures, each of the housings of the sheet assembly 210 is formed to have a slot 402. The slots 402 in the housing of the first sheet assembly 210 are aligned with the slots 402 in the housing of the adjacent sheet assembly 210 such that a ground tab 212 can engage as many of the plurality of sheets assembly 210 Slots 402. When the ground lug 212 is engaged with the one or more wafer assemblies 210, the base portion 306 of the ground lug 212 fits within the slot 402 of the wafer assembly 210. When the ground lug 212 is placed into the slot 402, the retaining element 308 will produce a press fit or interference fit to the inner surface of the slot 402. For example, the slot 402 is sized to receive and hold the retaining member 308 of the ground lug 212. The retaining member 308 is embossed with a serpentine interface or other projection formed on the surface of the base portion 306 of the ground lug 212. The protrusions extend from one side or both sides of the grounding piece 212. In other implementations, the ground lug 212 is coupled to the housings of the wafer assembly 210 by another attachment mechanism.
參照第五圖，某些接地片212會至少部分阻擋薄片組件210的訊號接點之間的視線。舉例而言，一部分的接地片212會至少部分阻擋相鄰訊號接點之間的直線路徑。藉由至少部分阻擋兩訊號接點之間的直線路徑，接地片212可輔助減少該等兩訊號接點之間的干擾傳遞。舉例而言，接地片212可減少相鄰訊號接點之間的串擾；當沿著一第一訊號接腳運行的訊號干擾沿一第二訊號接腳運行之訊號時，便會發生串擾。Referring to the fifth diagram, some of the grounding strips 212 will at least partially block the line of sight between the signal contacts of the sheet assembly 210. For example, a portion of the ground strap 212 will at least partially block a straight path between adjacent signal contacts. The ground strap 212 can assist in reducing interference transmission between the two signal contacts by at least partially blocking a linear path between the two signal contacts. For example, the ground strap 212 can reduce crosstalk between adjacent signal contacts; crosstalk occurs when a signal running along a first signal pin interferes with a signal that runs along a second signal pin.
在第五圖之實作例中，一薄片組件210包含自薄片組件210延伸之複數個訊號接點。舉例而言，一薄片組件包含訊號接點502、504、506及508；在一實作例中，訊號接點502、504係一電氣接點陣列的一部分，而訊號接點506、508是另一電氣接點陣列的一部分。在第五圖中，接地片212的其中之一係經定位以使某些電氣接點至少部分彼此隔離。舉例而言，接地片212的基板接合元件510(及其相關肩部部分512)阻擋訊號接點502和訊號接點504之間的視線(例如阻擋一直接干擾傳遞路徑)，接地片212的基板接合元件514(及其相關肩部部分516)係經定位以阻擋訊號接點506與訊號接點508之間的視線。In the fifth embodiment, a sheet assembly 210 includes a plurality of signal contacts extending from the sheet assembly 210. For example, a thin plate assembly includes signal contacts 502, 504, 506, and 508; in one embodiment, signal contacts 502, 504 are part of an electrical contact array, and signal contacts 506, 508 are another Part of an electrical contact array. In the fifth figure, one of the grounding lugs 212 is positioned to isolate certain electrical contacts from each other at least partially. For example, the substrate bonding component 510 (and its associated shoulder portion 512) of the ground strap 212 blocks the line of sight between the signal contact 502 and the signal contact 504 (eg, blocks a direct interference transmission path), the substrate of the ground strip 212 Engagement element 514 (and its associated shoulder portion 516) are positioned to block the line of sight between signal contact 506 and signal contact 508.
如第五圖所示，包含基板接合元件510、514之接地片212也包含其他的基板接合元件。那些其他基板接合元件(及其相關肩部部分)係用於阻擋在其他薄片組件的其他相鄰訊號接點間的各種視線。另外，包含訊號接點502、504、506及508之該薄片組件可包含其他訊號接點，如第五圖所示。電氣連接器系統202可包含額外接地片以阻擋那些訊號接點之間的各種視線。舉例而言，第五圖繪示了阻擋訊號接點504、508與訊號接點504、508左邊的該等相鄰訊號接點間之視線的額外接地片212。As shown in the fifth figure, the ground strip 212 including the substrate bonding elements 510, 514 also includes other substrate bonding elements. Those other substrate-engaging elements (and their associated shoulder portions) are used to block various lines of sight between other adjacent signal contacts of other sheet assemblies. Additionally, the sheet assembly including signal contacts 502, 504, 506, and 508 can include other signal contacts, as shown in FIG. Electrical connector system 202 can include additional ground lugs to block various lines of sight between those signal contacts. For example, the fifth figure depicts an additional ground plane 212 that blocks the line of sight between the signal contacts 504, 508 and the adjacent signal contacts to the left of the signal contacts 504, 508.
除了接地片212之外，電氣連接器系統202的某些實作例還包含其他接地遮蔽結構。第六圖為包含一接地遮蔽602之電氣連接系統202的透視圖，如第六圖所示，接地遮蔽602與薄片組件210其中之一的一側面接合，與所例示之接地遮蔽602類似或相同的額外接地遮蔽係位於薄片組件210之間。這些額外接地遮蔽中之二者係標示為604與606，雖然第六圖中僅可見這些接地遮蔽中各一小端部部分。接地遮蔽602係置於第一薄片組件的第一側上，而接地遮蔽604係置於該第一薄片組件與第二薄片組件之間的該第一薄片組件的第二側上。接地遮蔽606接著係置於該第二薄片組件的另一側上。In addition to the ground strap 212, some implementations of the electrical connector system 202 include other ground shield structures. The sixth diagram is a perspective view of an electrical connection system 202 including a ground shield 602. As shown in the sixth diagram, the ground shield 602 engages a side of one of the sheet assemblies 210, similar or identical to the illustrated ground shield 602. The additional ground shield is located between the sheet assemblies 210. These two additional ground shields are labeled 604 and 606, although only a small end portion of each of these ground shields is visible in the sixth figure. A ground shield 602 is placed on a first side of the first sheet assembly and a ground shield 604 is placed on a second side of the first sheet assembly between the first sheet assembly and the second sheet assembly. A ground shield 606 is then placed on the other side of the second wafer assembly.
第七圖係接地遮蔽602之一實作例的透視圖。接地遮蔽602係包含一或多個基板接合元件702、一或多個接地匹配舌片704以及一或多個連接插座706。基板接合元件702(例如基板安裝接腳)係配置以電氣及機械連接接地遮蔽602與一基板。The seventh figure is a perspective view of one embodiment of the ground shield 602. The ground shield 602 includes one or more substrate bond elements 702, one or more ground mating tabs 704, and one or more connection sockets 706. The substrate bonding component 702 (eg, substrate mounting pins) is configured to electrically and mechanically connect the ground shield 602 to a substrate.
當接地遮蔽602接合於薄片組件210時，接地匹配舌片704會從薄片組件210的匹配端206延伸而出。舉例而言，接地舌片704通過薄片殼體208中對應的孔洞。在某些實作例中，接地匹配舌片704的其中之一係位於與薄片組件210相關之一對匹配連接器上方，而另一接地匹配舌片704係位於該對匹配連接器下方。舉例而言，接地舌片704係彼此分隔，因此一對匹配連接器可裝配至相鄰的匹配舌片704之間的空間708中。在某些實作例中，接地匹配舌片704包含一或多個匹配肋部710。當接地遮蔽602接合於一薄片組件210時，匹配肋部710係與薄片組件210的殼體產生接觸，使得接地舌片704可電氣連接於薄片組件210的導電殼體。When the ground shield 602 is bonded to the wafer assembly 210, the ground mating tab 704 will extend from the mating end 206 of the wafer assembly 210. For example, the grounding tabs 704 pass through corresponding holes in the sheet housing 208. In some embodiments, one of the ground mating tabs 704 is positioned over a pair of mating connectors associated with the sheet assembly 210, and another ground mating tab 704 is located below the pair of mating connectors. For example, the grounding tabs 704 are spaced apart from one another such that a pair of mating connectors can fit into the space 708 between adjacent mating tabs 704. In some implementations, the ground mating tab 704 includes one or more matching ribs 710. When the ground shield 602 is bonded to a sheet assembly 210, the mating ribs 710 are in contact with the housing of the sheet assembly 210 such that the ground tabs 704 can be electrically connected to the conductive housing of the sheet assembly 210.
接地遮蔽602的連接插座706係用以連接於一或多個接地片212，如第八圖所示。接地遮蔽602係耦接於多個接地片212與一基板，以於多個接地片212與該基板之間提供一共同接地電位。當接地遮蔽602與多個接地片212接合時，接地片212係實質上彼此平行，且實質上垂直於接地遮蔽602的主要表面部分。The connection socket 706 of the ground shield 602 is used to connect to one or more grounding strips 212, as shown in the eighth figure. The grounding shield 602 is coupled to the plurality of grounding strips 212 and a substrate to provide a common ground potential between the plurality of grounding strips 212 and the substrate. When the ground shield 602 is engaged with the plurality of ground lugs 212, the ground lugs 212 are substantially parallel to each other and substantially perpendicular to the major surface portions of the ground shield 602.
接地遮蔽602的連接插座706的大小係適於對接地片212進行壓合或干涉配合。在一實作例中，連接插座706包含一狹槽802，其係由第一材料片804、第二材料片806、以及在第一與第二材料片804、806之相對表面上之一對突出物808所界定。第一材料片804於接地遮蔽602中界定一第一空洞810；同樣的，第二材料片806於接地遮蔽602中界定一第二空洞812。當接地片212被放置在狹槽802中時，接地片212會迫使一部分的第一材料片804進入第一空洞810中、迫使一部分的第二材料片806進入第二空洞812中或兩者皆然。接地片212可能會與狹槽802中的該對突出物808產生接觸。當接地片212接合於狹槽802時，狹槽802與突出物808的大小係可對接地片212產生壓合或干涉配合。在其他實作例中，接地片212係藉由另一連接機構而連接於接地遮蔽602。The connection socket 706 of the ground shield 602 is sized to be press-fitted or interference fitted to the ground lug 212. In one embodiment, the connector socket 706 includes a slot 802 that is protruded from the first sheet of material 804, the second sheet of material 806, and one of the opposing surfaces of the first and second sheets of material 804, 806. 808 is defined. The first material piece 804 defines a first cavity 810 in the grounding shield 602. Similarly, the second material piece 806 defines a second cavity 812 in the grounding shield 602. When the ground lug 212 is placed in the slot 802, the ground lug 212 forces a portion of the first sheet of material 804 into the first void 810, forcing a portion of the second sheet of material 806 into the second void 812 or both Of course. The ground lug 212 may come into contact with the pair of protrusions 808 in the slot 802. When the ground lug 212 is engaged with the slot 802, the slot 802 and the protrusion 808 are sized to create a press fit or interference fit to the ground lug 212. In other implementations, the ground lug 212 is coupled to the ground shield 602 by another connection mechanism.
參照第九圖與第十圖，接地遮蔽602包含一或多個連接器元件902與904，以耦接接地遮蔽602與薄片組件210的殼體。薄片組件210的殼體包含對應的元件，以容置連接器元件902及904。舉例而言，薄片組件210的殼體係包含一或多個互補開口，以容置連接器元件902並產生壓合或干涉配合。薄片組件210的殼體也包含一或多個狹槽以容置該接地遮蔽的連接器元件904。其他實作例係使用不同的接合機構來連接接地遮蔽602與薄片組件210。Referring to the ninth and tenth figures, the ground shield 602 includes one or more connector elements 902 and 904 to couple the ground shield 602 to the housing of the wafer assembly 210. The housing of the sheet assembly 210 includes corresponding components to receive the connector elements 902 and 904. For example, the housing of the sheet assembly 210 includes one or more complementary openings to receive the connector element 902 and create a press fit or interference fit. The housing of the wafer assembly 210 also includes one or more slots to receive the grounded shielded connector component 904. Other embodiments use different engagement mechanisms to connect the ground shield 602 to the sheet assembly 210.
參照第十一圖，電氣連接器系統202的安裝端204包含多個接地片212與多個接地遮蔽602，其係定位以實質封裝或遮蔽薄片組件210的該等電氣連接器對。一電氣連接器對係標示為1102，且其被繪示為由接地片212與接地遮蔽602包圍於各側上。一接地片212的接地安裝接腳1104係置於電氣連接器對1102的第一側(例如第十一圖之視圖中的頂側)上，藉此為電氣連接器對1102的該第一側提供一接地隔離屏障。另一接地片212的接地安裝接腳1106係置於電氣連接器對1102的一第二側(例如第十一圖之視圖的底側)上，藉此為電氣連接器對1102的該第二側提供一接地隔離屏障。一接地遮蔽602的接地安裝接腳1108係置於電氣連接器對1102的一第三側(例如第十一圖之視圖的左側)上，藉此為電氣連接器對1102的該第三側提供一接地隔離屏障。最後，另一接地遮蔽602的接地安裝接腳1110係置於電氣連接器對1102的一第四側(例如第十一圖之視圖的右側)上，藉此為電氣連接器對1102的該第四側提供一接地隔離屏障。接地安裝接腳1104、1106、1108及1110所產生的該等接地隔離屏障可於電氣連接器系統202的運作期間避免串擾、干擾、或其他不需要的非橫向、縱向與較高階模式之傳遞。其他訊號接點對也由接地片212與接地遮蔽602進行類似的隔離，如第十一圖所示。Referring to FIG. 11, the mounting end 204 of the electrical connector system 202 includes a plurality of ground lugs 212 and a plurality of ground shields 602 that are positioned to substantially encapsulate or shield the pairs of electrical connectors of the wafer assembly 210. An electrical connector pair is designated 1102 and is depicted as being surrounded by ground lug 212 and ground shield 602 on each side. A ground mounting pin 1104 of a ground lug 212 is placed on a first side of the electrical connector pair 1102 (eg, the top side in the view of FIG. 11), thereby being the first side of the electrical connector pair 1102 Provide a ground isolation barrier. The grounding mounting pin 1106 of the other grounding strip 212 is placed on a second side of the electrical connector pair 1102 (eg, the bottom side of the view of FIG. 11), thereby being the second of the electrical connector pair 1102. A ground isolation barrier is provided on the side. A ground mounting pin 1108 of a ground shield 602 is placed on a third side of the electrical connector pair 1102 (eg, to the left of the view of FIG. 11), thereby providing the third side of the electrical connector pair 1102 A grounded isolation barrier. Finally, the ground mounting pin 1110 of the other ground shield 602 is placed on a fourth side of the electrical connector pair 1102 (eg, to the right of the view of FIG. 11), thereby being the first of the electrical connector pair 1102. A grounded isolation barrier is provided on all four sides. The grounded isolation barriers created by grounding mounting pins 1104, 1106, 1108, and 1110 can avoid crosstalk, interference, or other unwanted non-transverse, longitudinal, and higher order modes of operation during operation of electrical connector system 202. Other signal contact pairs are also similarly isolated from ground shield 212 by ground shield 212, as shown in FIG.
第十一圖繪示了包含組織器1112之電氣連接器系統202，組織器1112係位於複數個薄片組件210的安裝端204處。組織器1112包含孔洞，其大小可使電氣接點安裝接腳(例如薄片組件210的電氣連接器對1102)通過該組織器並與一基板連接。組織器1112也包含其大小可使接地片212的接地安裝接腳1104、1106、1108及1110與接地遮蔽602通過組織器1112並與該基板連接之孔洞。An eleventh diagram depicts an electrical connector system 202 including an organizer 1112 that is located at a mounting end 204 of a plurality of wafer assemblies 210. The organizer 1112 includes a hole sized to allow electrical contact mounting pins (e.g., electrical connector pairs 1102 of the sheet assembly 210) to pass through the organizer and to a substrate. The organizer 1112 also includes a hole sized to allow the ground mounting pins 1104, 1106, 1108, and 1110 of the ground lug 212 to pass through the organizer 1112 and to the substrate.
第十二圖與第十三圖繪示了即將與基板1202連接之電氣連接器系統202。在某些實作例中，基板1202包含一印刷電路板，其具有多個訊號貫孔(例如貫孔1302)與多個接地貫孔(例如貫孔1304)。該等訊號貫孔係機械與電氣連接於薄片組件210的該等訊號接點，以使薄片組件210與基板1202耦接。電氣訊號接著經由該等訊號接點而通過基板1202和薄片組件210之間。該等接地貫孔係機械與電氣連接於接地片212和接地遮蔽602的接地接點，以使接地片212與接地遮蔽602耦接於基板1202，然後在基板1202、接地片212與接地遮蔽602之間共享一共同接地電位。第十四圖例示了在與基板1202接合之後的電氣連接器系統202。Twelfth and thirteenth views illustrate an electrical connector system 202 that is to be coupled to substrate 1202. In some implementations, the substrate 1202 includes a printed circuit board having a plurality of signal vias (eg, vias 1302) and a plurality of ground vias (eg, vias 1304). The signal vias are mechanically and electrically connected to the signal contacts of the wafer assembly 210 to couple the wafer assembly 210 to the substrate 1202. The electrical signals are then passed between the substrate 1202 and the sheet assembly 210 via the signal contacts. The grounding vias are mechanically and electrically connected to the grounding contacts of the grounding strip 212 and the grounding shield 602, so that the grounding strip 212 and the grounding shield 602 are coupled to the substrate 1202, and then the substrate 1202, the grounding strip 212 and the grounding shield 602. A common ground potential is shared between them. The fourteenth illustration illustrates the electrical connector system 202 after engagement with the substrate 1202.
102．．．底板連接器系統102. . . Backplane connector system
104．．．第一基板104. . . First substrate
106．．．第二基板106. . . Second substrate
202．．．電氣連接器系統202. . . Electrical connector system
204．．．安裝端204. . . Installation side
206．．．匹配端206. . . Matching end
208．．．薄片殼體208. . . Sheet shell
210．．．薄片組件210. . . Sheet assembly
212．．．接地片212. . . Grounding piece
214．．．殼體214. . . case
216．．．第一電氣接點陣列216. . . First electrical contact array
218．．．第二電氣接點陣列218. . . Second electrical contact array
220．．．殼體220. . . case
222．．．溝槽222. . . Trench
224．．．電氣接點安裝接腳224. . . Electrical contact mounting pin
226．．．匹配連接器226. . . Matching connector
302．．．基板接合元件302. . . Substrate bonding component
304．．．肩部部分304. . . Shoulder part
306．．．基部部分306. . . Base part
308．．．固持元件308. . . Holding element
402．．．狹槽402. . . Slot
502．．．訊號接點502. . . Signal contact
504．．．訊號接點504. . . Signal contact
506．．．訊號接點506. . . Signal contact
508．．．訊號接點508. . . Signal contact
510．．．基板接合元件510. . . Substrate bonding component
512．．．肩部部分512. . . Shoulder part
514．．．基板接合元件514. . . Substrate bonding component
516．．．肩部部分516. . . Shoulder part
602．．．接地遮蔽602. . . Ground shading
604．．．接地遮蔽604. . . Ground shading
606．．．接地遮蔽606. . . Ground shading
702．．．基板接合元件702. . . Substrate bonding component
704．．．接地匹配舌片704. . . Ground matching tongue
706．．．連接插座706. . . Connection socket
708．．．空間708. . . space
710．．．匹配肋部710. . . Matching ribs
802．．．狹槽802. . . Slot
804．．．第一材料片804. . . First piece of material
806．．．第二材料片806. . . Second piece of material
808．．．突出物808. . . obstructive
810．．．第一空洞810. . . First hole
812．．．第二空洞812. . . Second hole
902．．．連接器元件902. . . Connector component
904．．．連接器元件904. . . Connector component
1102．．．電氣連接器對1102. . . Electrical connector pair
1104．．．接地安裝接腳1104. . . Grounding mounting pin
1106．．．接地安裝接腳1106. . . Grounding mounting pin
1108．．．接地安裝接腳1108. . . Grounding mounting pin
1110．．．接地安裝接腳1110. . . Grounding mounting pin
1112．．．組織器1112. . . Organizer
1202．．．基板1202. . . Substrate
1302．．．貫孔1302. . . Through hole
1304．．．貫孔1304. . . Through hole
第一圖為連接一第一基板與一第二基板之底板連接器系統圖。The first figure is a system diagram of a backplane connector connecting a first substrate and a second substrate.
第二A圖為包含接地片之電氣連接器系統的透視圖。Figure 2A is a perspective view of an electrical connector system including a ground lug.
第二B圖為第二A圖之該電氣連接器系統的部分分解圖。Figure B is a partially exploded view of the electrical connector system of Figure A.
第三圖為接地片之一實作例的透視圖。The third figure is a perspective view of one of the examples of the grounding piece.
第四圖為一部分的第二A圖之該電氣連接器系統的放大圖。The fourth figure is an enlarged view of a portion of the second connector A of the electrical connector system.
第五圖為一部分的第二A圖之該電氣連接器系統的另一視圖。The fifth figure is another view of the electrical connector system of a portion of the second A diagram.
第六圖為包含接地遮蔽之電氣連接器系統的透視圖。Figure 6 is a perspective view of an electrical connector system including grounded shields.
第七圖為接地遮蔽之一實作例的透視圖。The seventh figure is a perspective view of one of the examples of grounding shielding.
第八圖為一部分的第六圖之該電氣連接器系統的放大圖。Figure 8 is an enlarged view of a portion of the sixth connector of the electrical connector system.
第九圖為一部分的第六圖之該電氣連接器系統的另一視圖。The ninth view is another view of the electrical connector system of a portion of the sixth diagram.
第十圖為第七圖之該接地遮蔽的另一透視圖。The tenth figure is another perspective view of the ground shield of the seventh figure.
第十一圖為包含組織器之電氣連接器系統的透視圖。Figure 11 is a perspective view of an electrical connector system including an organizer.
第十二圖為即將與基板接合之電氣連接器系統的透視圖。Figure 12 is a perspective view of the electrical connector system to be bonded to the substrate.
第十三圖為一部分的第十二圖之該電氣連接器系統的放大圖。Figure 13 is an enlarged view of a portion of the electrical connector system of the twelfth figure.
第十四圖為第十二圖之該電氣連接器系統在與該基板接合後的透視圖。Figure 14 is a perspective view of the electrical connector system of Figure 12 after engagement with the substrate.
202．．．電氣連接器系統202. . . Electrical connector system
204．．．安裝端204. . . Installation side
206．．．匹配端206. . . Matching end
208．．．薄片殼體208. . . Sheet shell
210．．．薄片組件210. . . Sheet assembly
212．．．接地片212. . . Grounding piece
214．．．殼體214. . . case
216．．．第一電氣接點陣列216. . . First electrical contact array
218．．．第二電氣接點陣列218. . . Second electrical contact array
220．．．殼體220. . . case
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/641,904 US7967637B2 (en) | 2008-12-05 | 2009-12-18 | Electrical connector system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201126835A TW201126835A (en) | 2011-08-01 |
| TWI505579B true TWI505579B (en) | 2015-10-21 |
Family
ID=44571325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099144163A TWI505579B (en) | 2009-12-18 | 2010-12-16 | Electrical connector system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102185223B (en) |
| TW (1) | TWI505579B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969618A (en) * | 2012-12-17 | 2013-03-13 | 深圳格力浦电子有限公司 | Female end plug of high-speed connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004521446A (en) * | 2001-01-22 | 2004-07-15 | モレックス インコーポレーテッド | Shielded electrical connector |
| US20090111298A1 (en) * | 2007-10-30 | 2009-04-30 | Fci Americas Technology, Inc. | Retention Member |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3909769B2 (en) * | 2004-01-09 | 2007-04-25 | 日本航空電子工業株式会社 | connector |
| DE202005020474U1 (en) * | 2005-12-31 | 2006-02-23 | Erni Elektroapparate Gmbh | Connectors |
| US7503804B2 (en) * | 2006-12-19 | 2009-03-17 | Fci Americas Technology Inc. | Backplane connector |
| CN101471515B (en) * | 2007-12-29 | 2011-06-15 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
-
2010
- 2010-12-16 TW TW099144163A patent/TWI505579B/en active
- 2010-12-20 CN CN201010625226.2A patent/CN102185223B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004521446A (en) * | 2001-01-22 | 2004-07-15 | モレックス インコーポレーテッド | Shielded electrical connector |
| US20090111298A1 (en) * | 2007-10-30 | 2009-04-30 | Fci Americas Technology, Inc. | Retention Member |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201126835A (en) | 2011-08-01 |
| CN102185223A (en) | 2011-09-14 |
| CN102185223B (en) | 2015-08-26 |
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