TWI500457B - Method for processing of radiation coating layer - Google Patents
Method for processing of radiation coating layer Download PDFInfo
- Publication number
- TWI500457B TWI500457B TW101148712A TW101148712A TWI500457B TW I500457 B TWI500457 B TW I500457B TW 101148712 A TW101148712 A TW 101148712A TW 101148712 A TW101148712 A TW 101148712A TW I500457 B TWI500457 B TW I500457B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating
- dissipating material
- minutes
- sheet
- Prior art date
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明係有關於一種散熱塗層加工方法，尤指一種以噴佈方式將散熱材均勻佈設於板材上之散熱塗層加工方法。 The invention relates to a heat-dissipating coating processing method, in particular to a heat-dissipating coating processing method for uniformly disposing a heat-dissipating material on a board by spraying.
按，電器裝置在運轉時，係會電能的傳送與轉換過程中產生熱能，該產生的熱能係可經由元件間的熱傳導或空氣對流，以使熱能消散在大氣中，進而維持電器裝置的正常運轉，當電器裝置散熱能力不足時，則熱能會累積在電器裝置中，若溫度升高至影響電器裝置運轉功能，甚至損壞電器裝置，則表示散熱速度太慢，必須重新設置散熱元件以加速散熱，確保電器裝置正常運轉。 According to the electrical device, during the operation, the heat energy is generated during the transmission and conversion of electric energy, and the generated thermal energy can be convected by heat conduction or air between the components, so that the heat energy is dissipated in the atmosphere, thereby maintaining the normal operation of the electrical device. When the heat dissipation capability of the electrical device is insufficient, the heat energy may accumulate in the electrical device. If the temperature rises to affect the operation function of the electrical device or even damage the electrical device, the heat dissipation speed is too slow, and the heat dissipation component must be reset to accelerate the heat dissipation. Make sure the electrical device is working properly.
現有電器裝置，例如發光二極體燈具等，其內部皆會設有一基板，以供發光二極體等電子元件組裝其上，為了提高產品的功能及使用壽命，現今電器裝置之基板皆朝可耐高電壓及耐高溫方向設計，為了加強基板之散熱效能，目前大多採用於基板上增加散熱孔、 鍍金屬薄膜，或於基板背面加裝金屬片，或直接塗覆散熱膏．．等方式來進行散熱，其中，該散熱膏之使用，由於係採塗覆方式塗佈於基板上，故其塗佈的量極難掌握，若塗佈的量過少，則造成散熱效果不佳，導致裝設於基板上之發光二極體等電子元件容易因過熱而燒毀損壞，反之若散熱膏塗佈的量過多，又會造成散熱膏的浪費且使製造成本大幅增加，另若散熱膏塗佈的不均勻，致使基板上部分區域散熱膏量過少，而部分區域散熱膏量過多，則會造成裝設於基板上之電子元件既易過熱損壞，又有散熱膏不當浪費等缺失。 Existing electrical devices, such as light-emitting diode lamps, etc., are internally provided with a substrate for assembling electronic components such as light-emitting diodes. In order to improve the function and service life of the products, the substrates of the current electrical devices are all facing Designed to withstand high voltage and high temperature resistance, in order to enhance the heat dissipation performance of the substrate, most of the current methods are to add heat dissipation holes on the substrate. Metallized film, or metal sheet on the back of the substrate, or directly coated with thermal grease. . The heat dissipation paste is used for heat dissipation. The use of the thermal grease is applied to the substrate by coating, so the amount of coating is extremely difficult to grasp. If the amount of coating is too small, the heat dissipation effect is poor. The electronic components such as the light-emitting diodes mounted on the substrate are easily burned and damaged by overheating. On the other hand, if the amount of the thermal grease is too much, the waste of the thermal grease is lost and the manufacturing cost is greatly increased. The unevenness of the cloth causes the amount of the thermal grease in the partial area on the substrate to be too small, and the excessive amount of the thermal grease in the partial area causes the electronic components mounted on the substrate to be easily damaged by overheating, and the thermal grease is improperly wasted.
緣是，本發明人有鑑於現有電器裝置於基板上之散熱膏等散熱塗層採取的塗佈方式，易發生散熱塗層塗佈的量過少、過多或塗佈不均等，而造成散熱功效不佳或散熱塗層的不當耗用等弊失，乃藉其多年於相關領域的製造及設計經驗和知識的輔佐，並經多方巧思，針對現有散熱塗層附著於基板的方式進行更新的研發改良，而研創出本發明。 Therefore, the present inventors have in view of the coating method adopted by the heat-dissipating coating such as the thermal grease on the substrate of the prior art device, and the amount of the heat-dissipating coating is likely to be too small, excessive or unevenly coated, and the heat dissipation effect is not The improper use of good or heat-dissipating coatings, etc., is supported by many years of manufacturing and design experience and knowledge in related fields, and through various ingenuity, the research and development of existing heat-dissipating coatings on the substrate is updated. Improvement, and research and development of the present invention.
本發明係有關於一種散熱塗層加工方法，其主要目的係為了提供一種以噴佈方式將散熱材均勻佈設於板材上之散熱塗層加工方法。 The invention relates to a heat-dissipating coating processing method, and the main object thereof is to provide a heat-dissipating coating processing method for uniformly disposing a heat-dissipating material on a plate material by spraying.
為了達到上述實施目的，本發明人乃研擬如下散熱塗層加工方法，其實施步驟係包含如下： A.備置板材；B.備置散熱材：該散熱材係由導熱微粒、黏著劑及溶劑混合而成，該導熱微粒、黏著劑及溶劑之混合比例為1：0.2：0.5；C.噴佈散熱材：將散熱材均勻噴佈於板材上，該散熱材一次噴佈之厚度為100微米±50微米；D.烘烤定型：將已噴佈有散熱材之板材進行烘烤，該烘烤定型步驟中係將已噴佈有散熱材之板材置入已先加熱至25±5℃之烘烤環境中，於第0分鐘至第20±5分鐘將環境溫度由25±5℃漸進加熱至75±5℃，於第20±5分鐘至第40±5分鐘使環境溫度維持75±5℃，另於第40±5分鐘至第60±5分鐘使環境溫度由75±5℃遞減降溫至25±5℃，使散熱材硬化固定於板材上。 In order to achieve the above-mentioned implementation objectives, the inventors have developed the following heat-dissipation coating processing method, and the implementation steps thereof are as follows: A. Preparing the plate; B. Preparing the heat sink: The heat sink is made of heat conductive particles, adhesive and solvent. The mixing ratio of the heat conductive particles, adhesive and solvent is 1:0.2:0.5; C. Material: The heat dissipating material is uniformly sprayed on the plate, and the thickness of the heat dissipating material is 100 μm ± 50 μm at one time; D. Baking stereotype: baking the plate which has been sprayed with the heat dissipating material, the baking setting In the step, the sheet which has been sprayed with the heat dissipating material is placed in a baking environment which has been heated to 25±5° C., and the ambient temperature is gradually heated from 25±5° C. to 75 minutes from 0 minutes to 20±5 minutes. ±5°C, the ambient temperature is maintained at 75±5°C from 20±5 minutes to 40±5 minutes, and the ambient temperature is decreased from 75±5°C to 25±5 minutes to 60±5 minutes. ±5 ° C, the heat sink is hardened and fixed on the board.
如上所述之散熱塗層加工方法，其中，該噴佈散熱材及烘烤定型之步驟係以一次噴佈散熱材後接續一次烘烤定型之步驟順序重複數次。 The heat-dissipating coating processing method as described above, wherein the step of spraying the heat-dissipating material and baking and setting is repeated several times in the order of one-time drying of the heat-dissipating material and then one-time baking and setting.
如上所述之散熱塗層加工方法，其中，該板材供散熱材噴佈處係成型為粗糙面。 The heat-dissipating coating processing method as described above, wherein the sheet material is formed into a rough surface for the heat-dissipating material spray.
如上所述之散熱塗層加工方法，其中，該導熱微粒係至少包含氧化銅粉、氧化鋁粉及氮化鋁粉其中之一。 The heat-dissipating coating processing method as described above, wherein the thermally conductive particles comprise at least one of copper oxide powder, aluminum oxide powder and aluminum nitride powder.
如上所述之散熱塗層加工方法，其中，該黏著劑係為樹脂。 The heat-dissipating coating processing method as described above, wherein the adhesive is a resin.
如上所述之散熱塗層加工方法，其中，該溶劑係為松香水。 The heat-dissipating coating processing method as described above, wherein the solvent is a pine perfume.
藉此，本發明之散熱塗層加工方法係利用噴佈方式，以將散熱材均勻噴佈於板材上，故可有效防止散熱材厚度不均及量過少、過多等情形，而達到良好的散熱功效者。 Therefore, the heat-dissipating coating processing method of the present invention utilizes a spraying method to evenly spray the heat-dissipating material on the board material, so that the thickness of the heat-dissipating material can be effectively prevented from being uneven, the amount is too small, too much, etc., and good heat dissipation is achieved. Efficacy.
又本發明之散熱塗層加工方法係藉由噴佈方式，以將散熱材噴佈於板材上，故可確實控制散熱材之均勻度及厚度等參數，以避免散熱材的浪費，及造成製造成本不當增加等情形者。 The method for processing the heat-dissipating coating of the present invention is to spray the heat-dissipating material on the board by means of spraying, so that the parameters such as the uniformity and thickness of the heat-dissipating material can be surely controlled to avoid waste of the heat-dissipating material and cause manufacturing. If the cost is improperly increased, etc.
另本發明之散熱塗層加工方法係將板材提供散熱材之一面成型為粗糙面，以增加板材與散熱材間之摩擦力及密合度，以使散熱材穩固地附著於板材上，達到有效防止散熱材不當由板材剝落之效益者。 In addition, the heat-dissipating coating processing method of the present invention forms a surface of the heat-dissipating material of the sheet material into a rough surface to increase the frictional force and the adhesion between the sheet material and the heat-dissipating material, so that the heat-dissipating material is firmly attached to the sheet material, thereby effectively preventing The heat sink is not suitable for the benefit of peeling off the sheet.
復本發明之散熱塗層加工方法係將散熱材以漸次噴佈、烘乾定型的方式附著於板材，以避免一次噴佈過厚之散熱材，造成散熱材內部未充分硬化乾燥而發生變質等影響其導熱性之情況者。 The heat-dissipating coating processing method of the present invention attaches the heat-dissipating material to the board in a manner of gradually spraying, drying and shaping, so as to avoid the heat-dissipating material which is excessively thick at one time, and the interior of the heat-dissipating material is not sufficiently hardened and dried to be deteriorated. A person who affects its thermal conductivity.
(1)‧‧‧板材 (1)‧‧‧ plates
(11)‧‧‧粗糙面 (11)‧‧‧Rough surface
(2)‧‧‧散熱材 (2) ‧‧‧ Heat sink
(21)‧‧‧導熱微粒 (21) ‧‧‧thermal particles
(22)‧‧‧黏著劑 (22) ‧‧‧Adhesive
(23)‧‧‧溶劑 (23) ‧‧‧Solvent
第一圖：本發明之流程圖 First Figure: Flow chart of the present invention
第二圖：本發明之剖視圖 Second Figure: Cutaway view of the present invention
第三圖：本發明之散熱材組成圖 The third figure: the composition of the heat sink of the present invention
第四圖：本發明之烘烤溫度-時間圖 Figure 4: Baking temperature-time diagram of the present invention
而為令本發明之技術手段及其所能達成之效果，能夠有更完整且清楚的揭露，茲詳細說明如下，請一併參閱揭露之圖式及圖號：首先，請參閱第一圖所示，為本發明之散熱塗層加工方法，其實施步驟係包含如下：A.備置板材：該板材(1)係為鋁合金板，且使該板材(1)一面成型為粗糙面(11)【如第二圖所示】；B.備置散熱材：請一併參閱第三圖所示，該散熱材(2)係由導熱微粒(21)、黏著劑(22)及溶劑(23)混合而成，該導熱微粒(21)係可為氧化銅〔Cu2O〕粉、氧化鋁〔Al2O3〕粉及氮化鋁〔AlN〕粉等，以氮化鋁粉為最佳，其導熱微粒(21)可使用氧化銅粉、氧化鋁粉及氮化鋁粉其中一，或將氧化銅粉、氧化鋁粉及氮化鋁粉混合使用，又該黏著劑(22)則可為樹脂，另該溶劑(23)則可為香蕉油或松香水等，該導熱微粒(21)、黏著劑(22)及溶劑(23)之最佳混合比例為1：0.2：0.5；C.噴佈散熱材：乃將散熱材(2)以噴槍均勻噴佈於板材(1)之粗糙面(11)上，其一層噴佈之厚度約為100微米〔um〕 ±50微米〔um〕；D.烘烤定型：請一併參閱第四圖所示，繼將已噴佈有散熱材(2)之板材(1)置入烤箱中進行烘烤硬化，其烘烤時間約為1小時，乃先將烘烤環境加熱至25±5℃，再將已噴佈有散熱材(2)之板材(1)置入烤箱中，由第0分鐘至第20±5分鐘將烤箱溫度由25±5℃漸進加熱至75±5℃，而於第20±5分鐘至第40±5分鐘內維持75±5℃溫度，另於第40±5分鐘至第60±5分鐘則使烤箱溫度由75±5℃漸行降溫至25±5℃，續將該其上散熱材(2)已硬化定型之板材(1)由烤箱取出；E.重複噴佈及烘烤：重複C步驟之噴佈散熱材及D步驟之烘烤定型，以將該已具散熱材(2)之板材(1)，於其已硬化定型之散熱材(2)上再均勻噴佈上第二層散熱材(2)，其厚度約為100微米〔um〕±50微米〔um〕，續將該噴佈有第二層散熱材(2)之板材(1)置入烤箱中，依上述加熱時間及溫度，同樣烘烤約為1小時後取出，以於板材(1)上具有第二層硬化之散熱材(2)，再於該第二層硬化之散熱材(2)上均勻噴佈上第三層散熱材(2)，其厚度同樣約為100微米〔um〕±50微米〔um〕，續將該噴佈有第三層散熱材(2)之板材(1)置入烤箱中，依上述加熱時間及溫度，烘烤約1小時後取出；F.完成散熱塗層加工：依此至少重複三次散熱材(2)之噴佈及烘烤硬化，即可完成本發明之散熱塗層的加工程序，而獲得 一其上均勻佈設有約300微米〔um〕±50微米〔um〕厚度散熱材(2)之板材(1)構造。 In order to make the technical means of the present invention and the effects thereof can be more completely and clearly disclosed, the details are as follows. Please refer to the disclosed drawings and drawings: First, please refer to the first figure. The method for processing the heat-dissipating coating of the present invention comprises the following steps: A. preparing the sheet: the sheet (1) is an aluminum alloy sheet, and the sheet (1) is formed into a rough surface (11). [As shown in the second figure]; B. Preparing the heat sink: Please refer to the third figure, the heat sink (2) is mixed with the heat conductive particles (21), the adhesive (22) and the solvent (23). The thermally conductive fine particles (21) may be copper oxide [Cu 2 O] powder, aluminum oxide [Al 2 O 3 ] powder, aluminum nitride [AlN] powder or the like, and aluminum nitride powder is preferred. The thermally conductive particles (21) may be one of copper oxide powder, aluminum oxide powder and aluminum nitride powder, or a mixture of copper oxide powder, aluminum oxide powder and aluminum nitride powder, and the adhesive (22) may be a resin. The solvent (23) may be a banana oil or a pine perfume, and the optimal mixing ratio of the heat conductive particles (21), the adhesive (22) and the solvent (23) is 1:0.2:0.5; The heat dissipating material is: the heat dissipating material (2) is evenly sprayed on the rough surface (11) of the plate (1) by a spray gun, and the thickness of one layer of the spray cloth is about 100 μm [um] ± 50 μm [um]; Baking stereotype: Please refer to the fourth figure together. After the sheet (1) which has been sprayed with the heat dissipating material (2) is placed in the oven for bake hardening, the baking time is about 1 hour. Firstly, the baking environment is heated to 25±5°C, and then the plate (1) which has been sprayed with the heat dissipating material (2) is placed in the oven, and the oven temperature is from 25±5 from 0 minutes to 20±5 minutes. °C is gradually heated to 75±5°C, and the temperature is maintained at 75±5°C from 20±5 minutes to 40±5 minutes, and the oven temperature is 75± from 40±5 minutes to 60±5 minutes. 5 ° C gradually cool down to 25 ± 5 ° C, continue to the upper heat sink (2) hardened and shaped sheet (1) removed from the oven; E. repeated spray and baking: repeat the C step of the spray heat sink And the baking step of the D step, in which the sheet (1) having the heat dissipating material (2) is evenly sprayed on the heat-dissipating material (2) which has been hardened and shaped, and the second layer of the heat dissipating material (2) is evenly sprayed. Its thickness is about 100 microns [um] ± 50 microns [um], continue to The plate (1) with the second layer of heat dissipating material (2) is placed in the oven, and is also baked for about 1 hour according to the above heating time and temperature, so as to have a second layer of hardening on the plate (1). The heat dissipating material (2) is evenly sprayed on the second layer of the hardened heat dissipating material (2) with a third layer of heat dissipating material (2), and the thickness thereof is also about 100 μm [um] ± 50 μm [um]. Continue to place the sheet (1) of the third layer of heat dissipating material (2) in the oven, and take it out after about 1 hour according to the above heating time and temperature; F. Complete the heat-dissipation coating processing: Repeating the spraying of the heat dissipating material (2) and bake hardening to complete the processing procedure of the heat dissipating coating of the present invention, and obtaining a uniform heat dissipation of about 300 μm [um] ± 50 μm [um] Sheet (1) of material (2).
據此，當使用實施時，係可將本發明之散熱塗層加工方法所獲得之具有適當且均勻厚度散熱材(2)之板材(1)實施於作為基板使用，以於其上裝設發光二極體等電子元件後，可將該發光二極體等電子元件作動時產生之熱能，經由該厚度適當且均勻佈設之散熱材(2)快速發散而出，達到有效防止發光二極體等電子元件因使用過程產生的高溫，而燒毀損壞之情形者。 Accordingly, when used, the sheet (1) having the appropriate and uniform thickness heat dissipation material (2) obtained by the heat dissipation coating processing method of the present invention can be used as a substrate to mount the light thereon. After the electronic components such as the diodes are used, the heat energy generated when the electronic components such as the light-emitting diodes are activated can be quickly dissipated through the heat-dissipating material (2) which is appropriately and uniformly disposed, thereby effectively preventing the light-emitting diodes and the like. The electronic component burns the damaged condition due to the high temperature generated by the use process.
由於本發明之散熱塗層加工方法係將板材(1)提供散熱材(2)噴佈之表面成型為粗糙面(11)，故可使散熱材(2)穩固地附著結合於板材(1)上，又使散熱材(2)以漸次噴佈、烘乾定型的方式附著於板材(1)，如此，即可避免一次噴佈過厚之散熱材(2)，造成散熱材(2)內部因未充分硬化乾燥而發生變質等瑕疵；再者，由於本發明之散熱塗層加工方法係可使散熱材(2)均勻地噴佈於板材(1)上，因此，不會有散熱材(2)於板材(1)部分區域量過多或部分區域量過少的狀況，且由於噴佈厚度量可有效控制，故確實防止散熱材(2)因厚度不足，造成散熱不佳，致使裝設其上之發光二極體等電子元件因過熱燒毀損壞，或散熱材(2)厚度過厚，導致散熱材(2)浪費及使製造成本不當增加等弊失，藉此，可製造出厚度適當且均勻佈設散熱塗層之加工方法，俾有助於其產業競爭力提升等效益者。 Since the heat-dissipating coating processing method of the present invention forms the surface of the sheet (1) providing the heat-dissipating material (2) into a rough surface (11), the heat-dissipating material (2) can be firmly attached to the sheet (1). On the top, the heat dissipating material (2) is attached to the plate (1) by means of progressive spraying, drying and setting, so that the heat-dissipating material (2) which is too thick to be sprayed at one time can be avoided, resulting in the inside of the heat-dissipating material (2). Further, since the heat-dissipating coating processing method of the present invention allows the heat-dissipating material (2) to be uniformly sprayed on the sheet (1), there is no heat-dissipating material ( 2) In the case where the amount of the partial portion of the sheet (1) is too large or the amount of the partial portion is too small, and since the thickness of the sprayed cloth can be effectively controlled, it is surely prevented from being insufficient in heat dissipation due to insufficient thickness of the heat-dissipating material (2), thereby causing the heat-dissipating material to be dissipated. The electronic components such as the light-emitting diodes are damaged by overheating, or the thickness of the heat-dissipating material (2) is too thick, resulting in waste of the heat-dissipating material (2) and an increase in manufacturing cost, thereby making it possible to manufacture an appropriate thickness. The processing method of evenly disposing the heat-dissipating coating, which contributes to the improvement of its industrial competitiveness and other benefits.
由上述結構及實施方式可知，本發明係具有如下優點： As can be seen from the above structures and embodiments, the present invention has the following advantages:
1.本發明之散熱塗層加工方法係利用噴佈方式，以將散熱材均勻噴佈於板材上，故可有效防止散熱材厚度不均及量過少、過多等情形，而達到良好的散熱功效者。 1. The heat-dissipating coating processing method of the invention utilizes a spraying method to evenly spray the heat-dissipating material on the board, so that the thickness of the heat-dissipating material can be effectively prevented from being uneven, and the amount of the heat-dissipating material is too small and too much, thereby achieving good heat dissipation. By.
2.本發明之散熱塗層加工方法係藉由噴佈方式，以將散熱材噴佈於板材上，故可確實控制散熱材之均勻度及厚度等參數，以避免散熱材的浪費，及造成製造成本不當增加等情形者。 2. The heat-dissipating coating processing method of the present invention is to spray the heat-dissipating material on the board by means of spraying, so that the parameters such as the uniformity and thickness of the heat-dissipating material can be surely controlled to avoid waste of the heat-dissipating material and cause If the manufacturing cost is improperly increased, etc.
3.本發明之散熱塗層加工方法係將板材提供散熱材之一面成型為粗糙面，以增加板材與散熱材間之摩擦力及密合度，以使散熱材穩固地附著於板材上，達到有效防止散熱材不當由板材剝落之效益者。 3. The heat-dissipating coating processing method of the present invention forms a surface of the heat-dissipating material of the sheet material into a rough surface to increase the frictional force and the adhesion between the sheet material and the heat-dissipating material, so that the heat-dissipating material is firmly attached to the sheet material, thereby achieving effective It is beneficial to prevent the heat sink from being peeled off by the sheet.
4.本發明之散熱塗層加工方法係將散熱材以漸次噴佈、烘乾定型的方式附著於板材，以避免一次噴佈過厚之散熱材，造成散熱材內部未充分硬化乾燥而發生變質等影響其導熱性之情況者。 4. The heat-dissipating coating processing method of the present invention attaches the heat-dissipating material to the board in a manner of gradually spraying, drying and shaping, so as to avoid the excessively heat-dissipating the heat-dissipating material in one time, and the interior of the heat-dissipating material is not sufficiently hardened and dried and deteriorated. Such as affecting the thermal conductivity of the situation.
綜上所述，本發明實施例確能達到所預期功效，又其所揭露之具體構造，不僅未曾見諸於同類產品中，亦未曾公開於申請前，誠已完全符合專利法之規定與要求，爰依法提出發明專利之申請，懇請惠予審查，並賜准專利，則實感德便。 In summary, the embodiments of the present invention can achieve the expected functions, and the specific structures disclosed therein have not been seen in similar products, nor have they been disclosed before the application, and have fully complied with the requirements and requirements of the Patent Law. If you apply for an invention patent in accordance with the law, you are welcome to review it and grant a patent.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101148712A TWI500457B (en) | 2012-12-20 | 2012-12-20 | Method for processing of radiation coating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101148712A TWI500457B (en) | 2012-12-20 | 2012-12-20 | Method for processing of radiation coating layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201424863A TW201424863A (en) | 2014-07-01 |
| TWI500457B true TWI500457B (en) | 2015-09-21 |
Family
ID=51725091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101148712A TWI500457B (en) | 2012-12-20 | 2012-12-20 | Method for processing of radiation coating layer |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI500457B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1847337A (en) * | 2005-03-31 | 2006-10-18 | 株式会社神户制钢所 | Coating metal with excellent heat diffusion character |
| TWI286494B (en) * | 2006-01-20 | 2007-09-11 | Nano Tech Chemical & System Lt | A fabrication method for air conditioner heat exchanger fins that have high heat transfer efficiency for long period of time |
| TW201119754A (en) * | 2009-12-11 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | Method for spraying coating |
-
2012
- 2012-12-20 TW TW101148712A patent/TWI500457B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1847337A (en) * | 2005-03-31 | 2006-10-18 | 株式会社神户制钢所 | Coating metal with excellent heat diffusion character |
| TWI286494B (en) * | 2006-01-20 | 2007-09-11 | Nano Tech Chemical & System Lt | A fabrication method for air conditioner heat exchanger fins that have high heat transfer efficiency for long period of time |
| TW201119754A (en) * | 2009-12-11 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | Method for spraying coating |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201424863A (en) | 2014-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5582553B1 (en) | High thermal conductivity heat dissipation sheet and method for manufacturing the same | |
| TW200810154A (en) | Method of arranging powder layer on substrate and layer structure with at least one powder layer on substrate | |
| US20150201530A1 (en) | Heat Spreading Packaging Apparatus | |
| US20170251571A1 (en) | Curable thermal interface material and cooling device, and cooling device manufacturing method thereof | |
| JP6226350B2 (en) | Solder preform flux coating process | |
| TW201344852A (en) | Flexible ceramic substrate | |
| WO2013139058A1 (en) | Thermal dissipation substrate and manufacturing method therefor | |
| JP2015076445A (en) | Radiator and manufacturing method of the same | |
| TWI500457B (en) | Method for processing of radiation coating layer | |
| TW201705556A (en) | Heat dissipating substrate, device, and manufacturing method of heat dissipating substrate | |
| JP2017028018A (en) | Heat dissipation substrate, device and manufacturing method for heat dissipation substrate | |
| CN104617213B (en) | A kind of method that aluminium nitride film is generated on aluminium sheet | |
| WO2012136007A1 (en) | Light emitting device with high conductive heat dissipation and manufacturing method thereof | |
| JP2018032716A (en) | Method for manufacturing heat sink | |
| KR101432530B1 (en) | natural graphite and composite graphite stacked thermal diffusion sheet and manufacturing method thereof | |
| TWI299341B (en) | ||
| JP3152088U (en) | Electrical circuit composite radiator | |
| JP3154837U (en) | Heat dissipation fins for ceramic LED lighting fixtures | |
| TW201012372A (en) | Thermal conductive insulation material capable of manufacturing composite heat dissipater with electrical circuit | |
| TWM542254U (en) | Radiator with screen printing or spraying circuit | |
| JP7054738B2 (en) | How to manufacture a heat insulating structure | |
| CN101321429A (en) | High cooling circuit board and preparation thereof | |
| JP3207268U (en) | Semiconductor module heat dissipation structure and LED lighting device provided with the heat dissipation structure | |
| TW201420742A (en) | Thermal conductive material | |
| CN219400920U (en) | Adsorptive hot plate for thick film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |