TWI498179B - Working machine and method for treating wafer - Google Patents
Working machine and method for treating wafer Download PDFInfo
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- TWI498179B TWI498179B TW102110262A TW102110262A TWI498179B TW I498179 B TWI498179 B TW I498179B TW 102110262 A TW102110262 A TW 102110262A TW 102110262 A TW102110262 A TW 102110262A TW I498179 B TWI498179 B TW I498179B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
本發明是有關於一種工作機台，且特別是有關於一種具有訊號產生器以及偵測器的工作機台。The present invention relates to a working machine, and more particularly to a working machine having a signal generator and a detector.
對晶圓進行研磨時，大都是透過研磨機台以旋轉的方式研磨晶圓。由於無法事先得知研磨機台是否呈現水平態，因此研磨後的晶圓常有品質不一的情形產生，如研磨不均或破片。再者，對晶圓進行切割時，大都是透過雷射切割機台中的雷射頭，將一雷射光照射於一預定切割路徑上’以在晶圓上形成多條交錯的切割線。當在晶圓上切割出多條切割線之後，即在雷射頭相對於初始位置移動過遠的距離之後，會產生甚大的傾斜角度之累積誤差。然而，使用者於進行雷射切割製程之前無法得知雷射頭是否產生傾斜。因此，後續形成於晶圓上的切割線便可能會有偏離原本所預定的切割位置的情況產生。此外，上述之情況亦會直接影響後續沿著切割線進行劈裂(splitting)時，晶片的大小容易出現不一致且其邊緣輪廓不理想，嚴重者，亦會毀損晶片上的元件或 線路進而導致晶片失效。因此，如何在工作前即時得知工作機台(如研磨機台或雷射切割機台)的狀態實為一重要的課題。When the wafer is polished, the wafer is mostly ground by a grinding machine through a grinding machine. Since it is impossible to know in advance whether the polishing machine is in a horizontal state, the polished wafers often have different quality conditions, such as uneven grinding or fragmentation. Moreover, when the wafer is cut, most of the laser light is irradiated onto a predetermined cutting path through a laser head in the laser cutting machine to form a plurality of staggered cutting lines on the wafer. After cutting a plurality of cutting lines on the wafer, that is, after the laser head has moved too far from the initial position, a large cumulative error of the tilt angle is generated. However, the user cannot know whether the laser head is tilted before performing the laser cutting process. Therefore, the subsequent cut line formed on the wafer may be deviated from the originally predetermined cutting position. In addition, the above situation will directly affect the subsequent splitting along the cutting line, the size of the wafer is prone to inconsistency and the edge contour is not ideal. In severe cases, the components on the wafer may be damaged or The line in turn causes the wafer to fail. Therefore, how to know the state of the working machine (such as the grinding machine table or the laser cutting machine) immediately before the work is an important issue.
本發明提供一種工作機台以及一種晶圓的處理方法，可提高工作良率。The invention provides a working machine and a processing method of the wafer, which can improve the working yield.
本發明的工作機台，其包括一工作件、至少一訊號產生器以及一偵測器。訊號產生器配置於工作件旁，且用以發出一訊號。偵測器配置於工作件旁，以偵測訊號產生器所發出的訊號而得知工作件的一位置資料。The working machine of the present invention comprises a working piece, at least one signal generator and a detector. The signal generator is disposed beside the workpiece and is used to emit a signal. The detector is disposed beside the workpiece to detect the signal sent by the signal generator and know the location information of the workpiece.
在本發明的一實施例中，上述的工作件包括一雷射頭或一研磨平台。In an embodiment of the invention, the work piece comprises a laser head or a grinding platform.
在本發明的一實施例中，上述的訊號產生器與偵測器配置於該工作件的同一側。In an embodiment of the invention, the signal generator and the detector are disposed on the same side of the workpiece.
在本發明的一實施例中，上述的偵測器直接配置於工作件上。In an embodiment of the invention, the detector is directly disposed on the workpiece.
在本發明的一實施例中，上述的工作機台更包括至少一導引器，其中訊號產生器、偵測器以及導引器配置於工作件的同一側，而導引器直接配置於工作件上，且導引器引導訊號產生器的訊號至偵測器。In an embodiment of the invention, the working machine further includes at least one guide, wherein the signal generator, the detector and the guide are disposed on the same side of the workpiece, and the guide is directly configured to work. And the director guides the signal generator to the detector.
在本發明的一實施例中，上述的訊號產生器與偵測器分別位於導引器之一法線方向的相對兩側上。In an embodiment of the invention, the signal generator and the detector are respectively located on opposite sides of a normal direction of the guide.
在本發明的一實施例中，上述的導引器包括一反射鏡。In an embodiment of the invention, the introducer includes a mirror.
在本發明的一實施例中，上述的訊號產生器包括一聲波產生器或一光波產生器。In an embodiment of the invention, the signal generator comprises a sound wave generator or a light wave generator.
在本發明的一實施例中，上述的偵測器包括一矩陣式偵測器。In an embodiment of the invention, the detector includes a matrix detector.
在本發明的一實施例中，上述的工作機台，更包括一控制器以及一調整器。控制器連接偵測器以接收位置資料，並產生一調整資料。調整器連接控制器與工作件，其中調整器接收調整資料並依據調整資料調整工作件的位置。In an embodiment of the invention, the working machine further includes a controller and a regulator. The controller is connected to the detector to receive the location data and generate an adjustment data. The adjuster connects the controller and the work piece, wherein the adjuster receives the adjustment data and adjusts the position of the work piece according to the adjustment data.
在本發明的一實施例中，上述的控制器包括一電腦。In an embodiment of the invention, the controller includes a computer.
在本發明的一實施例中，上述的調整器包括一致動器。In an embodiment of the invention, the adjuster described above includes an actuator.
本發明的晶圓的處理方法包括提供一晶圓以及一工作件、依據偵測來自工作件的至少一訊號取得工作件的一位置資料、依據工作件的位置資料產生一調整資料、依據調整資料調整工作件的一位置以及利用經調整資料調整過的工作件處理晶圓。其中，工作件位於晶圓上。The method for processing a wafer of the present invention includes providing a wafer and a workpiece, obtaining a position data of the workpiece according to detecting at least one signal from the workpiece, generating an adjustment data according to the position data of the workpiece, and adjusting the data according to the adjustment data. The position of the work piece is adjusted and the wafer is processed using the adjusted work piece. The work piece is located on the wafer.
在本發明的一實施例中，上述的工作件包括一雷射頭或一研磨平台。In an embodiment of the invention, the work piece comprises a laser head or a grinding platform.
在本發明的一實施例中，上述的處理方法更包括在偵測訊號之前導引訊號。In an embodiment of the invention, the processing method further includes guiding the signal before detecting the signal.
在本發明的一實施例中，上述的訊號是藉由一反射鏡導引。In an embodiment of the invention, the signal is guided by a mirror.
在本發明的一實施例中，上述的訊號包括一聲波或一光波。In an embodiment of the invention, the signal includes an acoustic wave or a light wave.
在本發明的一實施例中，上述的訊號是被一偵測器所偵測，且偵測器包括一矩陣式偵測器。In an embodiment of the invention, the signal is detected by a detector, and the detector includes a matrix detector.
在本發明的一實施例中，上述的調整資料是藉由一控制器所產生，且控制器包括一電腦。In an embodiment of the invention, the adjustment data is generated by a controller, and the controller includes a computer.
在本發明的一實施例中，上述的工作件的位置是透過一調整器調整，且調整器包括一致動器。In an embodiment of the invention, the position of the workpiece is adjusted by a adjuster, and the adjuster includes an actuator.
基於上述，由於本發明的工作機台中具有訊號產生器以及偵測器，因此偵測器可以偵測訊號產生器所發出的訊號而得知工作件的一位置資料。如此一來，在工作件進行工作前，則可即時得知工作件的位置是否產生傾斜，可提高工作機台的工作良率。Based on the above, since the working machine of the present invention has a signal generator and a detector, the detector can detect the signal sent by the signal generator and know a position data of the working piece. In this way, before the work piece is working, it is immediately known whether the position of the work piece is tilted, and the work rate of the work machine can be improved.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
100a、100b、100c、200a、200b、200c‧‧‧工作機台100a, 100b, 100c, 200a, 200b, 200c‧‧‧ work machines
110、210‧‧‧工作件110, 210‧‧‧ work pieces
120、220a、220b‧‧‧導引器120, 220a, 220b‧‧‧ introducer
130、230、230a、230b‧‧‧訊號產生器130, 230, 230a, 230b‧‧‧ signal generator
140a、140b、240a、240b‧‧‧偵測器140a, 140b, 240a, 240b‧‧‧ detectors
150、250‧‧‧控制器150, 250‧‧ ‧ controller
160、260‧‧‧調整器160, 260‧‧‧ adjusters
270‧‧‧上旋轉盤270‧‧‧Upper rotating disk
D‧‧‧切割線D‧‧‧ cutting line
L‧‧‧雷射光束L‧‧‧Laser beam
W‧‧‧晶圓W‧‧‧ wafer
N、N1、N2、N3、n‧‧‧法線方向N, N1, N2, N3, n‧‧‧ normal direction
圖1繪示為本發明之一實施例之一種工作機台的示意圖。FIG. 1 is a schematic diagram of a working machine according to an embodiment of the present invention.
圖2繪示為本發明之另一實施例之一種工作機台的示意圖。2 is a schematic diagram of a working machine according to another embodiment of the present invention.
圖3繪示為本發明之另一實施例之一種工作機台的示意圖。3 is a schematic diagram of a working machine according to another embodiment of the present invention.
圖4繪示為本發明之另一實施例之一種工作機台的示意圖。4 is a schematic diagram of a working machine according to another embodiment of the present invention.
圖5繪示為本發明之另一實施例之一種工作機台的示意圖。FIG. 5 is a schematic diagram of a working machine according to another embodiment of the present invention.
圖6繪示為本發明之另一實施例之一種工作機台的示意圖。FIG. 6 is a schematic diagram of a working machine according to another embodiment of the present invention.
圖7繪示為本發明之另一實施例之一種工作機台的示意圖。FIG. 7 is a schematic diagram of a working machine according to another embodiment of the present invention.
圖1繪示為本發明之一實施例之一種工作機台的示意圖。請參考圖1，在本實施例中，工作機台100a適於切割一晶圓W。工作機台100a包括一工作件110、至少一訊號產生器130(圖1中示意地繪示一個)以及一偵測器140a。詳細來說，工作件110為一雷射頭，用以發出一雷射光束L至晶圓W上。訊號產生器130配置於工作件110旁，且用以發出一訊號。偵測器140a配置於工作件110旁，以偵測訊號產生器130所發出的訊號而得知工作件110的一位置資料。此處，工作機台100a例如是一雷射切割機台。FIG. 1 is a schematic diagram of a working machine according to an embodiment of the present invention. Referring to FIG. 1, in the embodiment, the working machine 100a is adapted to cut a wafer W. The working machine 100a includes a working piece 110, at least one signal generator 130 (one is schematically shown in FIG. 1), and a detector 140a. In detail, the workpiece 110 is a laser head for emitting a laser beam L onto the wafer W. The signal generator 130 is disposed beside the work piece 110 and is configured to emit a signal. The detector 140a is disposed beside the workpiece 110 to detect a signal sent by the signal generator 130 to obtain a location data of the workpiece 110. Here, the work machine 100a is, for example, a laser cutting machine.
更具體來說，在本實施例中，訊號產生器130例如是一聲波產生器或一光波產生器。也就是說，當訊號產生器130為一聲波產生器時，訊號產生器130所發出的訊號為一聲波訊號。另一方面，當訊號產生器130為一光波產生器時，訊號產生器130所發出的訊號為一光波訊號。此外，此處之偵測器140a例如是一矩陣式偵測器，當偵測器140a接收到訊號產生器130所發出的訊號時，可透過矩陣的形式來表達所得知的位置資料。如圖1所示，訊號產生器130與偵測器140a可配置於工作件110的同一側，且偵測器140a直接配置於工作件110上。More specifically, in the present embodiment, the signal generator 130 is, for example, a sound wave generator or a light wave generator. That is to say, when the signal generator 130 is a sound wave generator, the signal generated by the signal generator 130 is a sound wave signal. On the other hand, when the signal generator 130 is a light wave generator, the signal generated by the signal generator 130 is a light wave signal. In addition, the detector 140a is, for example, a matrix detector. When the detector 140a receives the signal from the signal generator 130, the detected location data can be expressed in the form of a matrix. As shown in FIG. 1 , the signal generator 130 and the detector 140 a can be disposed on the same side of the workpiece 110 , and the detector 140 a is directly disposed on the workpiece 110 .
由於本實施例之工作機台100a中具有訊號產生器130以 及偵測器140a，因此偵測器140a可以偵測訊號產生器130所發出的訊號而得知工作件110的一位置資料。如此一來，於切割晶圓W之前，則可即時得知工作件110的位置是否產生傾斜，可提高工作機台100a的工作良率。Since the working machine 100a of the embodiment has the signal generator 130 The detector 140a can detect the signal sent by the signal generator 130 and learn a location data of the workpiece 110. In this way, before the wafer W is cut, it is immediately known whether the position of the workpiece 110 is inclined, and the working yield of the working machine 100a can be improved.
在此必須說明的是，下述實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.
圖2繪示為本發明之另一實施例之一種工作機台的示意圖。請參考圖2，本實施例之工作機台100b與圖1之工作機台100a相似，其不同之處在於：本實施例之工作機台100b更包括至少一導引器120(圖2僅示意地繪示一個)。如圖2所示，訊號產生器130、偵測器140b以及導引器120配置於工作件110的同一側，而導引器120直接配置於工作件110上，且導引器120引導訊號產生器130的訊號至偵測器140b。此處，訊號產生器130與偵測器140b分別位於導引器120之一法線方向N的相對兩側上。2 is a schematic diagram of a working machine according to another embodiment of the present invention. Referring to FIG. 2, the working machine 100b of the present embodiment is similar to the working machine 100a of FIG. 1, except that the working machine 100b of the embodiment further includes at least one guide 120 (FIG. 2 only shows Show one). As shown in FIG. 2, the signal generator 130, the detector 140b, and the guide 120 are disposed on the same side of the workpiece 110, and the introducer 120 is directly disposed on the workpiece 110, and the guide 120 guides the signal generation. The signal of the device 130 is to the detector 140b. Here, the signal generator 130 and the detector 140b are respectively located on opposite sides of one of the normal directions N of the guides 120.
舉例來說，若位置資料與一原先所預定之位置資料相同時，如圖2所示，此時工作件110的位置位於晶圓W的一法線方向n上，而雷射光束L可直接垂直於晶圓W的表面來進行切割線D的刻劃。若位置資料與原先所預定之位置資料不同時，如圖3所示，此時工作機台100b的工作件110的位置偏離晶圓W的法線方向n上，即工作件110產生傾斜，而雷射光束L無法垂直於 晶圓W的表面來進行切割線D的刻劃，故需先調整工作件110的位置才能進行切割線D的刻劃。簡言之，本實施例於進行切割線D的刻劃之前，訊號產生器130所產生的訊號可透過導引器120而引導至偵測器140b，以偵測工作件110的位置，意即可透過偵測器140b即時得知工作件110是否有產生傾斜，而後再進行後續的切割程序。如此一來，可有效提高工作機台100b的工作良率。For example, if the location data is the same as the location data originally scheduled, as shown in FIG. 2, the position of the workpiece 110 is located in a normal direction n of the wafer W, and the laser beam L can be directly The scribe line D is scribed perpendicular to the surface of the wafer W. If the location data is different from the location data originally scheduled, as shown in FIG. 3, the position of the workpiece 110 of the working machine 100b is offset from the normal direction n of the wafer W, that is, the workpiece 110 is tilted. Laser beam L cannot be perpendicular to The surface of the wafer W is used to scribe the cutting line D. Therefore, the position of the workpiece 110 needs to be adjusted before the cutting line D can be scored. In short, before the scribe of the dicing line D, the signal generated by the signal generator 130 can be guided to the detector 140b through the guide 120 to detect the position of the workpiece 110, that is, The detector 140b can instantly know whether the workpiece 110 is tilted, and then perform a subsequent cutting process. In this way, the working yield of the working machine 100b can be effectively improved.
圖4繪示為本發明之另一實施例之一種工作機台的示意圖。請參考圖4’本實施例之工作機台100c與圖2之工作機台100b相似，其不同之處在於：本實施例之工作機台100c更包括一控制器150以及一調整器160。控制器150電性連接偵測器140b以接收位置資料，並產生一調整資料。調整器160電性連接控制器150與工作件110。特別是，調整器160接收調整資料並依據調整資料調整工作件110的位置(如圖4中從實線的工作件110及雷射光束L調整至虛線的工作件110及雷射光束L)，以使雷射光束L於晶圓W上刻劃出切割線D。此處’控制器150例如是一電腦，其可計算出偵測器140b所得知的位置資料而產生調整資料。調整器160例如是一致動器，可依據調整資料而自動調整工作件110的位置，意即將工作件110的位置調整至位於晶圓W的法線方向n上。如此一來，可提升工作機台100c的工作良率，且透過自動化的調整可提高工作機台100c的工作效率。4 is a schematic diagram of a working machine according to another embodiment of the present invention. Referring to FIG. 4', the working machine 100c of the present embodiment is similar to the working machine 100b of FIG. 2, except that the working machine 100c of the embodiment further includes a controller 150 and an adjuster 160. The controller 150 is electrically connected to the detector 140b to receive the location data and generate an adjustment data. The adjuster 160 is electrically connected to the controller 150 and the work piece 110. In particular, the adjuster 160 receives the adjustment data and adjusts the position of the workpiece 110 according to the adjustment data (as shown in FIG. 4 from the solid working member 110 and the laser beam L to the dotted working member 110 and the laser beam L). The laser beam L is caused to scribe the cutting line D on the wafer W. Here, the controller 150 is, for example, a computer that can calculate the location data learned by the detector 140b to generate adjustment data. The adjuster 160 is, for example, an actuator that automatically adjusts the position of the work piece 110 according to the adjustment data, that is, the position of the work piece 110 is adjusted to be in the normal direction n of the wafer W. In this way, the work rate of the work machine 100c can be improved, and the work efficiency of the work machine 100c can be improved through automatic adjustment.
由於本實施例之工作機台100a、100b、100c中具有訊號產生器130以及偵測器140a、140b，因此偵測器140a、140b可以 偵測訊號產生器130所發出的訊號而得知工作件110的一位置資料。當然，訊號產生器130所產生的訊號亦可透過導引器120而引導至偵測器140a、140b，以偵測工作件110的位置。如此一來，於切割晶圓W之前，則可即時得知工作件110的位置是否產生傾斜，可提高工作機台100a、100b、100c的工作良率。此外，本實施例亦可透過設置控制器150與調整器160，以使控制器150接收位置資料而產生調整資料，而調整器160依據調整資料而自動調整工作件110的位置，來提高工作機台100a、100b、100c的工作效率。Since the working machine 100a, 100b, 100c of the embodiment has the signal generator 130 and the detectors 140a, 140b, the detectors 140a, 140b can A signal sent by the signal generator 130 is detected to know a location data of the workpiece 110. Of course, the signal generated by the signal generator 130 can also be guided to the detectors 140a, 140b through the guide 120 to detect the position of the workpiece 110. In this way, before the wafer W is diced, it is immediately known whether the position of the workpiece 110 is inclined, and the working yield of the working machines 100a, 100b, and 100c can be improved. In addition, in this embodiment, the controller 150 and the adjuster 160 can be configured to cause the controller 150 to receive the position data to generate the adjustment data, and the adjuster 160 automatically adjusts the position of the workpiece 110 according to the adjustment data to improve the working machine. The working efficiency of the stations 100a, 100b, 100c.
圖5繪示為本發明之另一實施例之一種工作機台的示意圖。請參考圖5，在本實施例中，工作機台200a包括一工作件210、至少一訊號產生器230(圖5中示意地繪示一個)以及一偵測器240a。詳細來說，工作件210為一研磨平台，工作機台200a更包含一上旋轉盤270，至少一晶圓(未繪示)放置於上旋轉盤270與工作件210之間，工作件210面對晶圓進行研磨程序。訊號產生器230配置於工作件210旁，且用以發出一訊號。偵測器240a配置於工作件210旁，以偵測訊號產生器230所發出的訊號而得知工作件210的一位置資料。此處，工作機台200a例如是一研磨機台。FIG. 5 is a schematic diagram of a working machine according to another embodiment of the present invention. Referring to FIG. 5, in the embodiment, the working machine 200a includes a working member 210, at least one signal generator 230 (one is schematically shown in FIG. 5), and a detector 240a. In detail, the working member 210 is a grinding platform, and the working machine 200a further includes an upper rotating disk 270. At least one wafer (not shown) is placed between the upper rotating disk 270 and the working member 210, and the working member 210 faces. Grinding the wafer. The signal generator 230 is disposed beside the workpiece 210 and is configured to emit a signal. The detector 240a is disposed beside the workpiece 210 to detect a signal sent by the signal generator 230 to obtain a location data of the workpiece 210. Here, the work machine table 200a is, for example, a grinder table.
更具體來說，在本實施例中，訊號產生器230例如是一聲波產生器或一光波產生器。也就是說，當訊號產生器230為一聲波產生器時，訊號產生器230所發出的訊號為一聲波訊號。另一方面，當訊號產生器230為一光波產生器時，訊號產生器230 所發出的訊號為一光波訊號。此外，此處之偵測器240a例如是一矩陣式偵測器，當偵測器240a接收到訊號產生器230所發出的訊號時，可透過矩陣的形式來表達所得知的位置資料。如圖5所示，訊號產生器230與偵測器240a可配置於工作件210的同一側(如下方)，且偵測器240a直接配置於工作件210上。More specifically, in the present embodiment, the signal generator 230 is, for example, a sound wave generator or a light wave generator. That is to say, when the signal generator 230 is a sound wave generator, the signal generated by the signal generator 230 is a sound wave signal. On the other hand, when the signal generator 230 is a light wave generator, the signal generator 230 The signal sent is a light wave signal. In addition, the detector 240a is, for example, a matrix detector. When the detector 240a receives the signal from the signal generator 230, the detected location data can be expressed in the form of a matrix. As shown in FIG. 5, the signal generator 230 and the detector 240a can be disposed on the same side of the workpiece 210 (as follows), and the detector 240a is directly disposed on the workpiece 210.
由於本實施例之工作機台200a中具有訊號產生器230以及偵測器240a，因此偵測器240a可以偵測訊號產生器230所發出的訊號而得知工作件210的一位置資料。如此一來，在進行研磨程序之前，則可即時得知工作件210的位置是否產生傾斜，可提高工作機台200a的工作良率(即研磨良率)。Since the working machine 200a of the embodiment has the signal generator 230 and the detector 240a, the detector 240a can detect the signal sent by the signal generator 230 and learn a position data of the working member 210. In this way, before the grinding process is performed, it is immediately known whether the position of the workpiece 210 is inclined, and the working yield (ie, the polishing yield) of the working machine 200a can be improved.
圖6繪示為本發明之另一實施例之一種工作機台的示意圖。請參考圖6，本實施例之工作機台200b與圖5之工作機台200a相似，其不同之處在於：本實施例之工作機台200b更包括二個導引器220a、220b，且工作機台200b具有兩個訊號產生器230a、230b。如圖6所示，訊號產生器230a、230b、偵測器240b以及導引器220a、220b配置於工作件210的同一側(如下方)，而導引器220a、220b直接配置於工作件210上。導引器220a、220b分別引導訊號產生器230a、230b的訊號至偵測器240b。此處，導引器220a、220b分別位於偵測器240b之一法線方向N1的相對兩側上，而訊號產生器230a與偵測器240b分別位於導引器220a之一法線方向N2的相對兩側上，且訊號產生器230b與偵測器240b分別位於導引器220b之一法線方向N3的相對兩側上。FIG. 6 is a schematic diagram of a working machine according to another embodiment of the present invention. Referring to FIG. 6, the working machine 200b of the present embodiment is similar to the working machine 200a of FIG. 5, except that the working machine 200b of the embodiment further includes two guides 220a, 220b and works. The machine 200b has two signal generators 230a, 230b. As shown in FIG. 6, the signal generators 230a, 230b, the detector 240b, and the guides 220a, 220b are disposed on the same side of the workpiece 210 (as follows), and the introducers 220a, 220b are directly disposed on the workpiece 210. on. The directors 220a, 220b direct the signals of the signal generators 230a, 230b to the detector 240b, respectively. Here, the directors 220a, 220b are respectively located on opposite sides of one of the normal directions N1 of the detector 240b, and the signal generator 230a and the detector 240b are respectively located in a normal direction N2 of the director 220a. On opposite sides, the signal generator 230b and the detector 240b are respectively located on opposite sides of one of the normal directions N3 of the guide 220b.
在進行研磨程序之前，訊號產生器230a、230b所產生的訊號可透過導引器220a、220b而引導至偵測器240b，以偵測工作件210的位置，意即可透過偵測器240b即時得知工作件210是否有產生傾斜，而後再進行後續的研磨程序。如此一來，可有效提高工作機台200b的工作良率(即研磨良率)。Before the grinding process is performed, the signals generated by the signal generators 230a, 230b can be guided to the detector 240b through the guides 220a, 220b to detect the position of the workpiece 210, which can be instantaneously transmitted through the detector 240b. It is known whether the work piece 210 is tilted or not, and then the subsequent grinding process is performed. In this way, the working yield (ie, the polishing yield) of the working machine 200b can be effectively improved.
圖7繪示為本發明之另一實施例之一種工作機台的示意圖。請參考圖7，本實施例之工作機台200c與圖5之工作機台200a相似，其不同之處在於：本實施例之工作機台200c更包括一控制器250以及一調整器260。控制器250電性連接偵測器240a以接收位置資料，並產生一調整資料。調整器260電性連接控制器250與工作件210。特別是，調整器260接收調整資料並依據調整資料調整工作件210的位置，以使工作件210呈現水平態樣。此處，控制器250例如是一電腦，其可計算出偵測器240a所得知的位置資料而產生調整資料。調整器260例如是一致動器，可依據調整資料而自動調整工作件210的位置。如此一來，可提升工作機台200c的工作良率，且透過自動化的調整可提高工作機台200c的工作效率。FIG. 7 is a schematic diagram of a working machine according to another embodiment of the present invention. Referring to FIG. 7, the working machine 200c of the present embodiment is similar to the working machine 200a of FIG. 5, except that the working machine 200c of the embodiment further includes a controller 250 and an adjuster 260. The controller 250 is electrically connected to the detector 240a to receive the location data and generate an adjustment data. The adjuster 260 is electrically connected to the controller 250 and the work piece 210. In particular, the adjuster 260 receives the adjustment data and adjusts the position of the work piece 210 based on the adjustment data to cause the work piece 210 to assume a horizontal orientation. Here, the controller 250 is, for example, a computer that can calculate the location data learned by the detector 240a to generate adjustment data. The adjuster 260 is, for example, an actuator that automatically adjusts the position of the work piece 210 in accordance with the adjustment data. In this way, the work rate of the work machine 200c can be improved, and the work efficiency of the work machine 200c can be improved through the automatic adjustment.
綜上所述，由於本發明的工作機台中具有訊號產生器以及偵測器，因此偵測器可以偵測訊號產生器所發出的訊號而得知工作件的一位置資料。如此一來，在工作件進行工作前(如雷射切割或研磨程序之前)，則可即時得知工作件的位置是否產生傾斜，可提高工作機台的工作良率。In summary, since the working machine of the present invention has a signal generator and a detector, the detector can detect the signal sent by the signal generator and know a position data of the working piece. In this way, before the work piece is worked (such as before the laser cutting or grinding process), it is immediately known whether the position of the work piece is tilted, and the work rate of the working machine can be improved.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100a‧‧‧工作機台100a‧‧‧Working machine
110‧‧‧工作件110‧‧‧Workpieces
130‧‧‧訊號產生器130‧‧‧Signal Generator
140a‧‧‧偵測器140a‧‧‧Detector
L‧‧‧雷射光束L‧‧‧Laser beam
W‧‧‧晶圓W‧‧‧ wafer
N‧‧‧法線方向N‧‧‧ normal direction
Claims (19)
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| Application Number | Priority Date | Filing Date | Title |
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| TW102110262A TWI498179B (en) | 2012-12-19 | 2013-03-22 | Working machine and method for treating wafer |
| CN201310168459.8A CN103878638A (en) | 2012-12-19 | 2013-05-06 | Working machine table |
| US13/917,630 US20140170936A1 (en) | 2012-12-19 | 2013-06-13 | Working machine |
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| TW101148417 | 2012-12-19 | ||
| TW102110262A TWI498179B (en) | 2012-12-19 | 2013-03-22 | Working machine and method for treating wafer |
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| US (1) | US20140170936A1 (en) |
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| TW (1) | TWI498179B (en) |
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| TW201201951A (en) * | 2010-07-09 | 2012-01-16 | Hon Hai Prec Ind Co Ltd | Ultra-precision machining system and machining method |
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| US5623473A (en) * | 1994-06-30 | 1997-04-22 | Nikon Corporation | Method and apparatus for manufacturing a diffraction grating zone plate |
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- 2013-05-06 CN CN201310168459.8A patent/CN103878638A/en active Pending
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| TW475229B (en) * | 2000-03-06 | 2002-02-01 | Shinkawa Kk | Offset measurement method, tool position detection method and bonding device |
| TW201201951A (en) * | 2010-07-09 | 2012-01-16 | Hon Hai Prec Ind Co Ltd | Ultra-precision machining system and machining method |
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| CN103878638A (en) | 2014-06-25 |
| US20140170936A1 (en) | 2014-06-19 |
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