TWI498059B - Appartus for adhering additional plate to fpc and additional plate separating unit and press unit used in the apparatus - Google Patents
Appartus for adhering additional plate to fpc and additional plate separating unit and press unit used in the apparatus Download PDFInfo
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- TWI498059B TWI498059B TW101133724A TW101133724A TWI498059B TW I498059 B TWI498059 B TW I498059B TW 101133724 A TW101133724 A TW 101133724A TW 101133724 A TW101133724 A TW 101133724A TW I498059 B TWI498059 B TW I498059B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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Description
本發明係有關於一種將附加板黏蓋至軟性電路板之裝置及用於該裝置之附加板分離單元與按壓單元，尤指一種於軟性電路板(FPC，Flexible Printed Circuit Board)製程中，將環氧樹脂(Epoxy)、不鏽鋼(SUS，stainless use steel)、黑色屏蔽材料(black shield)或聚醯亞胺(polyimide)等材質之附加板黏蓋至該軟性電路板之自動化裝置，以及用於該裝置之附加板分離單元與按壓單元。The present invention relates to a device for attaching an additional board to a flexible circuit board, and an additional board separating unit and pressing unit for the device, especially in a flexible printed circuit board (FPC) process. An additional board of epoxy resin (Epoxy), stainless steel (SUS, stainless steel), black shield, or polyimide is attached to the flexible device of the flexible circuit board, and is used for The additional plate separation unit and the pressing unit of the device.
由於軟性電路板厚度薄且具有高可撓性之特性，欲將軟性電路板固定或連接於其他組件時，通常必須於軟性電路板之一預設部分黏貼一具有相對等硬度及一預設厚度之環氧樹脂板。Due to the thin thickness of the flexible circuit board and the high flexibility, when the flexible circuit board is to be fixed or connected to other components, it is usually necessary to adhere to a predetermined portion of the flexible circuit board with a relative hardness and a predetermined thickness. Epoxy board.
此外，就強化及其他目的而言，通常會將一附加板黏蓋於軟性電路板，該附加板之材質可為不鏽鋼或聚醯亞胺。或可將一黑色屏蔽材料黏蓋於軟性電路板以遮蔽電磁波。In addition, for reinforcement and other purposes, an additional board is usually adhered to the flexible circuit board, which may be made of stainless steel or polyimide. Or a black shielding material can be attached to the flexible circuit board to shield electromagnetic waves.
請參閱圖一所示習知一種將附加板黏蓋至軟性電路板之裝置，其係由一輸送帶10之上表面承載並移動一附加板1，以及由一承載板20承載一印刷有複數印刷電路2之軟性電路圖形板3，以及一移動於輸送帶10與承載板20間之一拾取頭30。Referring to FIG. 1 , a device for attaching an additional board to a flexible circuit board is carried out, which is carried by an upper surface of a conveyor belt 10 and moves an additional board 1 , and is carried by a carrier board 20 and printed with a plurality of boards. The flexible circuit pattern board 3 of the printed circuit 2, and a pick-up head 30 that moves between the conveyor belt 10 and the carrier board 20.
拾取頭30係用以由輸送帶10上一一拾取附加板1， 並將每一附加板1對應設置於該承載板20所承載之軟性電路圖形板3之每一印刷電路2上。The pick-up head 30 is used to pick up the additional board 1 one by one on the conveyor belt 10. Each of the additional boards 1 is correspondingly disposed on each of the printed circuits 2 of the flexible circuit pattern board 3 carried by the carrier board 20.
習知該附加板1之底面設有一黏著材料，由拾取頭30垂直施壓於設置於軟性電路圖形板3上之附加板1，以提高附加板1與軟性電路圖形板3間之黏著力。It is known that the bottom surface of the additional board 1 is provided with an adhesive material, and the pick-up head 30 is vertically pressed against the additional board 1 provided on the flexible circuit pattern board 3 to improve the adhesion between the additional board 1 and the flexible circuit pattern board 3.
然而，由於拾取頭30必須對設置於軟性電路圖形板3上之附加板1一一執行上述該施壓之程序，使得該習知將附加板黏蓋至軟性電路板之裝置，必須耗費大量時間方能將所有附加板1黏蓋至軟性電路板。However, since the pick-up head 30 must perform the above-described pressing procedure one by one on the additional board 1 disposed on the flexible circuit pattern board 3, the conventional apparatus for attaching the additional board to the flexible circuit board must take a lot of time. It is possible to glue all the additional boards 1 to the flexible circuit board.
此外，由於附加板1始終係暴露於移動過程中，使得灰塵等外部物質極容易沾染於附加板1，導致軟性電路板成品之不良率提高。Further, since the additional board 1 is always exposed to the moving process, external substances such as dust are extremely likely to be contaminated with the additional board 1, resulting in an increase in the defective rate of the finished flexible circuit board.
此外，若是無法均勻施壓於附加板1表面，則容易於附加板1表面造成刮痕等傷害，也因此會提高軟性電路板成品之不良率。Further, if the surface of the additional plate 1 cannot be uniformly applied, it is easy to cause scratches and the like on the surface of the additional plate 1, and the defective rate of the finished flexible circuit board is also improved.
於是，本發明提出一種將附加板黏蓋至軟性電路板之裝置及用於該裝置之附加板分離單元與按壓單元，可加快完成將附加板黏蓋至軟性電路板之黏著製程，並且可降低軟性電路板成品之不良率。Accordingly, the present invention provides a device for attaching an additional board to a flexible circuit board and an additional board separating unit and pressing unit for the apparatus, which can speed up the adhesion process of attaching the additional board to the flexible circuit board, and can be reduced The defect rate of the finished flexible circuit board.
為達到上述目的，本發明提出一種將附加板黏蓋至軟性電路板之裝置，其包含：一附加板分離單元，其包括一附加板帶體拆捲器提供一附加板帶體捲繞於上並可將該附加板帶體拆捲及送出該附加板帶體拆捲器，該附加板帶體 上設有複數附加板，該複數附加板係排列為一列設置於一底層帶體與一頂層帶體之間，一上層帶體複捲器用以將該上層帶體由該附加板帶體分離並將該上層帶體收回捲繞於該上層帶體複捲器，與該上層帶體分離之該附加板帶體係進入一預定之供應座，一下層帶體複捲器，於該附加板帶體與該上層帶體分離且進入該供應座時，該下層帶體複捲器係用以分離該下層帶體並將該下層帶體收回捲繞於該下層帶體複捲器，一移動機械手臂用以拾取及移動該附加板，並將該附加板設置於該供應座上；一附加板供應單元，係用以依序移動及供應該移動機械手臂所拾取及移動之該附加板；一附加板設置單元，其具有一拾取頭，該拾取頭係用以拾取由該附加板供應單元所供應之該附加板，並將該附加板設置於一預設位置，該拾取頭係由一X軸驅動導軌驅動沿著一X軸移動；一軟性電路圖形板移動單元，其包括一安裝板用以承載至少一軟性電路圖形板，該軟性電路圖形板上印刷有複數印刷電路，該安裝板係提供該拾取頭將該附加板設置於該印刷電路上；一Y軸驅動平台用以驅動該安裝板於一Y軸方向移動，該Y軸方向係垂直於該X軸方向；以及一按壓單元，係用以垂直按壓設置於該Y軸驅動平台之該安裝板上之該軟性電路圖形板之該複數印刷電路，以使得附加板黏蓋於相對應之該印刷電路上。In order to achieve the above object, the present invention provides an apparatus for adhering an additional board to a flexible circuit board, comprising: an additional board separating unit including an additional board strip unwinder to provide an additional strip body wound on And the additional strip body can be unwound and sent out of the additional strip strip unwinder, the additional strip body a plurality of additional plates are arranged, the plurality of additional plates are arranged in a row between an underlying tape body and a top tape body, and an upper tape rewinder is used to separate the upper tape body from the additional tape body and The upper belt is retracted and wound around the upper belt rewinding device, and the additional strip system separated from the upper belt body enters a predetermined supply seat, and the lower layer belt rewinding device is attached to the additional strip body. When the upper layer is separated from the upper belt and enters the supply seat, the lower belt rewinder is used to separate the lower belt and retract the lower belt to the lower belt rewinder, a moving robot For picking up and moving the additional board, and placing the additional board on the supply base; an additional board supply unit for sequentially moving and supplying the additional board picked up and moved by the mobile robot arm; a board setting unit having a pick-up head for picking up the additional board supplied by the additional board supply unit and setting the additional board to a preset position, the pick-up head being by an X-axis Drive rail drive moves along an X axis a flexible circuit graphics board moving unit, comprising a mounting board for carrying at least one flexible circuit graphic board, wherein the flexible circuit graphic board is printed with a plurality of printed circuits, the mounting board providing the picking head to set the additional board a Y-axis driving platform for driving the mounting plate to move in a Y-axis direction, the Y-axis direction is perpendicular to the X-axis direction; and a pressing unit for vertically pressing the Y-axis The plurality of printed circuits of the flexible circuit pattern board on the mounting board of the driving platform are such that the additional board is adhered to the corresponding printed circuit.
依據本發明之一實施例，該上層帶體複捲器與該下層帶體複捲器分別對該上層帶體與該下層帶體產生一拉力，該上層帶體複捲器與該下層帶體複捲器對該上層帶體與該下層帶體所產生之拉力方向相反，該附加板帶體係沿著一 供應路徑朝向該供應座移動，該上層帶體及該下層帶體分別與該供應路徑間具有一特定的夾角。According to an embodiment of the present invention, the upper layer tape rewinding device and the lower layer tape rewinding device respectively generate a pulling force on the upper layer strip body and the lower layer strip body, and the upper layer strip body rewinding device and the lower layer strip body The rewinder reverses the pulling force generated by the upper belt and the lower belt, and the additional belt system is along a The supply path moves toward the supply seat, and the upper layer body and the lower layer body respectively have a specific angle with the supply path.
依據本發明之一實施例，該拾取頭包括二個或二個以上之吸附元件，該等吸附元件彼此之間係具有一預設間隔地設置；二個或二個以上之垂直驅動元件耦接於一該吸附元件之頂部，每一該垂直驅動元件係用以驅動所耦接之該吸附元件上下移動；一旋轉驅動元件用以驅動該等垂直驅動元件同時水平移動；以及一托架元件用以支撐該旋轉驅動元件，該托架元件係可滑動地耦接於一X軸驅動導軌。According to an embodiment of the present invention, the pickup head includes two or more adsorption elements, and the adsorption elements are disposed at a predetermined interval from each other; two or more vertical drive elements are coupled On the top of the adsorption element, each of the vertical drive elements is configured to drive the coupled adsorption element to move up and down; a rotary drive element for driving the vertical drive elements to move horizontally; and a carrier element To support the rotary drive element, the carrier element is slidably coupled to an X-axis drive rail.
依據本發明之一實施例，該附加板設置單元包括一底視影像擷取裝置，其係設置於相對於該旋轉驅動元件之一較低位置，該底視影像擷取裝置係用以量測該吸附元件於拾取該附加板之位置及旋轉角度；以及一頂視影像擷取裝置，係設置於該托架元件，當該拾取頭移動至該附加板上方時，該頂視影像擷取裝置係用以擷取該附加板所黏蓋之該印刷電路之位置影像，藉以準確地將該附加板設置於該印刷電路上。According to an embodiment of the present invention, the additional board setting unit includes a bottom view image capturing device disposed at a lower position relative to the one of the rotating driving elements, wherein the bottom view image capturing device is configured to measure a position and a rotation angle of the adsorption element for picking up the additional board; and a top view image capturing device disposed on the bracket component, the top view image capturing device when the pickup head moves over the additional board The image of the printed circuit that is adhered to the additional board is used to accurately position the additional board on the printed circuit.
依據本發明之一實施例，該軟性電路圖形板移動單元之該安裝板包括吸附結構，用以將該軟性電路圖形板吸附並定位於該安裝板之上表面；以及加熱裝置，用以對該軟性電路圖形板進行加熱。According to an embodiment of the present invention, the mounting board of the flexible circuit graphics board moving unit includes an adsorption structure for adsorbing and positioning the flexible circuit graphic board on an upper surface of the mounting board, and a heating device for The flexible circuit graphic board is heated.
依據本發明之一實施例，該Y軸驅動平台係與該X軸驅動導軌相互垂直地設置於相對於該X軸驅動導軌之一較低位置，該安裝板係於該X軸驅動導軌之其中一端以及X軸驅動導軌相對之另外一端之間移動，該拾取頭設置該附 加板之作業程序係於該X軸驅動導軌之其中一端進行，而對已設置有該附加板之該軟性電路圖形板所進行之按壓程序，則是於該X軸驅動導軌之另外一端進行。According to an embodiment of the present invention, the Y-axis driving platform is disposed perpendicular to the X-axis driving rail at a lower position relative to the X-axis driving rail, and the mounting board is disposed in the X-axis driving rail. One end and the other end of the X-axis drive rail are moved relative to each other, and the pick-up head is provided with the attachment The working procedure of the adding board is performed on one end of the X-axis driving rail, and the pressing procedure of the flexible circuit pattern board on which the additional board is provided is performed on the other end of the X-axis driving rail.
依據本發明之一實施例，於該軟性電路圖形板移動單元及該按壓單元相對二側對稱設有一對附加板分離單元、一對附加板供應單元，以及一對附加板設置單元。According to an embodiment of the present invention, a pair of additional board separating units, a pair of additional board supplying units, and a pair of additional board setting units are symmetrically disposed on the flexible circuit pattern board moving unit and the pressing unit on opposite sides.
依據本發明之一實施例，該對附加板設置單元係共用一組該X軸驅動導軌，該對附加板設置單元所具有之二拾取頭係可個別移動地耦接於該X軸驅動導軌。According to an embodiment of the present invention, the pair of additional board setting units share a set of the X-axis driving rails, and the pair of pick-up heads of the pair of additional board setting units are movably coupled to the X-axis driving rails.
為達到上述目的，本發明提出一種將附加板黏蓋至軟性電路板之裝置之附加板分離單元，其包含一附加板帶體拆捲器，係提供一附加板帶體捲繞於上並可將該附加板帶體拆捲及送出該附加板帶體拆捲器，該附加板帶體上設有複數附加板，該複數附加板係排列為一列設置於一底層帶體與一頂層帶體之間；一上層帶體複捲器，係用以將該上層帶體由該附加板帶體分離並將該上層帶體收回捲繞於該上層帶體複捲器，與該上層帶體分離之該附加板帶體係進入一預定之供應座；以及一下層帶體複捲器，當與該上層帶體分離之該附加板帶體進入該供應座時，該下層帶體複捲器係用以分離該下層帶體並將該下層帶體收回捲繞於該下層帶體複捲器。In order to achieve the above object, the present invention provides an additional board separating unit for attaching an additional board to a flexible circuit board, which comprises an additional strip strip unwinder, which provides an additional strip body wound thereon. Unloading and feeding the additional strip strip body, the additional strip strip body is provided with a plurality of additional boards arranged in a row arranged on an underlying strip body and a top strip body An upper layered belt rewinding device for separating the upper belt body from the additional belt body and retracting and winding the upper layer belt body to the upper layer belt rewinding device, separating from the upper layer belt body The additional strip system enters a predetermined supply base; and the lower layer rewinder, the lower strip rewinder is used when the additional strip body separated from the upper strip enters the supply seat The lower belt is separated and the lower belt is retracted and wound around the lower belt rewinder.
依據本發明之一實施例，該上層帶體複捲器與該下層帶體複捲器分別對該上層帶體與該下層帶體產生一拉力，該上層帶體複捲器與該下層帶體複捲器對該上層帶體與該下層帶體所產生之拉力方向相反，且該上層帶體及該下層 帶體分別與一供應路徑間具有一特定的夾角，該附加板帶體係沿著該供應路徑朝向該供應座移動。According to an embodiment of the present invention, the upper layer tape rewinding device and the lower layer tape rewinding device respectively generate a pulling force on the upper layer strip body and the lower layer strip body, and the upper layer strip body rewinding device and the lower layer strip body The rewinder reverses the pulling force generated by the upper belt and the lower belt, and the upper belt and the lower layer The belt body has a specific angle with a supply path, and the additional strip system moves along the supply path toward the supply seat.
依據本發明之一實施例，其更包括一驅動馬達，係用以驅動該上層帶體複捲器轉動；一扭力馬達，係用以驅動該下層帶體複捲器以一預設之力矩旋轉；一張力滾軸，係設置於該附加板帶體拆捲器一側，該張力滾軸係根據該下層帶體複捲器之拉力，提供一拉力於該由該附加板帶體拆捲器送出之該附加板帶體；以及一力矩裝置(perma torque)，係用以提供該附加板帶體拆捲器一預定阻力力矩。According to an embodiment of the present invention, the method further includes a driving motor for driving the upper belt rewinding device, and a torque motor for driving the lower belt rewinding device to rotate by a predetermined torque. a force roller is disposed on a side of the additional strip body unwinder, and the tension roller provides a pulling force according to the pulling force of the lower layer belt rewinding device The additional strip body is delivered; and a perma torque is provided to provide the additional strip body unwinder with a predetermined resistance moment.
依據本發明之一實施例，該張力滾軸與該下層帶體複捲器間之拉力，係大於該附加板帶體拆捲器與該張力滾軸間之拉力，同時也大於該張力滾軸與該上層帶體複捲器間之拉力。According to an embodiment of the present invention, the tension between the tension roller and the lower belt rewinder is greater than the tension between the additional strip unwinder and the tension roller, and is greater than the tension roller. The tension between the upper layer and the rewinder.
依據本發明之一實施例，其更包括一磁粉離合器，其係由該驅動馬達提供該磁粉離合器一旋轉驅動力，由該磁粉離合器將該旋轉驅動力傳送至該上層帶體複捲器；一厚度量測機構，係用以量測該上層帶體複捲器所捲繞之該頂層帶體之厚度；以及一控制元件，其係根據該上層帶體複捲器所捲繞之該頂層帶體之厚度，以控制磁粉離合器作用於該張力滾軸與該上層帶體複捲器間之拉力保持於一預定值，且該拉力小於該張力滾軸與該下層帶體複捲器間之拉力。According to an embodiment of the present invention, the method further includes a magnetic powder clutch that provides a rotational driving force of the magnetic powder clutch by the driving motor, and the rotational driving force is transmitted by the magnetic powder clutch to the upper layer belt rewinding device; a thickness measuring mechanism for measuring a thickness of the top tape body wound by the upper tape rewinder; and a control element according to the top tape wound by the upper tape rewinder The thickness of the body is controlled to maintain a tensile force between the tension roller and the upper belt rewinder at a predetermined value, and the tensile force is less than the tension between the tension roller and the lower belt rewinder .
依據本發明之一實施例，該厚度量測機構包括一旋轉軸，其係整合於該上層帶體複捲器並可與該上層帶體複捲 器一併轉動；以及一感測器，其係設置於該上層帶體複捲器外側之該旋轉軸通過之路徑上。According to an embodiment of the present invention, the thickness measuring mechanism includes a rotating shaft integrated into the upper belt rewinder and rewindable with the upper belt The device rotates together; and a sensor is disposed on a path through which the rotating shaft outside the upper tape rewinder passes.
依據本發明之一實施例，該張力滾軸包括一支撐滾軸，係用以垂直按壓於該附加板帶體表面；一摩擦滾軸，係用以垂直按壓於該附加板帶體相對於設有該支撐滾軸之一面；以及一摩擦力調整機構，係提供一軸向力作用於該摩擦滾軸，以調整該摩擦滾軸之旋轉阻力。According to an embodiment of the present invention, the tension roller includes a support roller for pressing vertically on the surface of the additional strip body; and a friction roller for vertically pressing the additional strip body relative to the device There is a surface of the support roller; and a frictional force adjustment mechanism provides an axial force acting on the friction roller to adjust the rotational resistance of the friction roller.
依據本發明之一實施例，其更包括一調整支撐板，該頂層帶體與該附加板帶體分離並通過該張力滾軸時，該調整支撐板係具有一間隙地設置並支撐於該附加板帶體之底面。According to an embodiment of the present invention, the method further includes an adjustment support plate, wherein the adjustment support plate has a gap and is supported by the additional when the upper tape body is separated from the additional plate body and passes through the tension roller. The bottom surface of the strip body.
為達到上述目的，本發明提出一種將附加板黏蓋至軟性電路板之裝置，其係包含該附加板分離單元。In order to achieve the above object, the present invention provides a device for attaching an additional board to a flexible circuit board, which comprises the additional board separating unit.
為達到上述目的，本發明提出一種將附加板黏蓋至軟性電路板之裝置之按壓單元，其包含：一框架，其係水平延伸設置，於該框架底面設有流道出口；一汽缸箱，其係設置於該框架之底面，於該汽缸箱底面設有一密封元件，該密封元件係環繞設置於該汽缸箱底面之週緣；一滑板，其係設置於該框架內，該滑板係可沿著該汽缸箱之一內側壁上下滑動，於該滑板相對於設有該框架之該流道之一上表面設有複數空氣凹槽；一驅動汽缸，其係設置於該框架，該驅動汽缸係用以驅動該滑板向下移動，直到該滑板與該密封元件緊密接觸；一汽缸桿，其係設置於該滑板之底面，該汽缸桿係可沿著該汽缸箱之一開放面之內側壁上下滑動；以及一壓板，其係設置於該滑板之底面。In order to achieve the above object, the present invention provides a pressing unit for a device for attaching an additional board to a flexible circuit board, comprising: a frame extending horizontally, and a flow path outlet on the bottom surface of the frame; a cylinder box, It is disposed on the bottom surface of the frame, and a sealing member is disposed on the bottom surface of the cylinder box, the sealing member is disposed around the periphery of the bottom surface of the cylinder box; a sliding plate is disposed in the frame, and the sliding plate can be along the One of the inner side walls of the cylinder box slides up and down, and a plurality of air grooves are disposed on an upper surface of the flow path of the sliding plate relative to the flow path provided with the frame; a driving cylinder is disposed on the frame, and the driving cylinder is used Driving the sliding plate downward until the sliding plate is in close contact with the sealing member; a cylinder rod is disposed on the bottom surface of the sliding plate, and the cylinder rod is slidable up and down along the inner side wall of one of the open surfaces of the cylinder box And a pressure plate disposed on the bottom surface of the sliding plate.
依據本發明之一實施例，每一該球狀引導裝置包括一突出之球體，該球體係環繞設置且略微突出於該滑板之一垂直之表面，於該汽缸箱內側壁相對於該複數球狀引導裝置之位置設有複數導塊，該等導塊係與該等球體可滑動地相接觸，該複數導塊係可以垂直於該汽缸箱之側壁可調整地略微滑動。According to an embodiment of the present invention, each of the spherical guiding devices includes a protruding ball, and the ball system is disposed around and slightly protrudes from a vertical surface of the sliding plate, and the inner side wall of the cylinder box is opposite to the plurality of spherical shapes. The guiding device is provided with a plurality of guiding blocks which are slidably in contact with the balls, and the plurality of guiding blocks can be slightly slidably adjustable perpendicularly to the side wall of the cylinder box.
依據本發明之一實施例，該汽缸箱內部之底面設有複數彈簧，其係用以提供該滑板一向上之推力。According to an embodiment of the invention, the bottom surface of the interior of the cylinder box is provided with a plurality of springs for providing an upward thrust of the slider.
依據本發明之一實施例，其更包括一橡膠板，其係設置於該壓板之底面。According to an embodiment of the invention, the method further includes a rubber sheet disposed on a bottom surface of the pressure plate.
依據本發明之一實施例，該壓板之底面設有複數流道，該複數流道係朝向該橡膠板，於該壓板之一側設有複數氣孔，該複數流道係連接該複數氣孔。According to an embodiment of the present invention, the bottom surface of the pressure plate is provided with a plurality of flow channels facing the rubber plate, and a plurality of air holes are disposed on one side of the pressure plate, and the plurality of flow channels are connected to the plurality of air holes.
為達到上述目的，本發明提出一種將附加板黏蓋至軟性電路板之裝置，其係包含該按壓單元。In order to achieve the above object, the present invention provides a device for attaching an additional board to a flexible circuit board, which comprises the pressing unit.
依據本發明之實施例，其係於附加板設置於該位於安裝板之軟性電路圖形板之所有印刷電路後，再施以垂直方向之按壓力，相對於習知以拾取頭對附加板一一施壓之程序，本發明可加快整體製程完成。According to an embodiment of the present invention, after the additional board is disposed on all the printed circuits of the flexible circuit pattern board located on the mounting board, the pressing force in the vertical direction is applied, and the picking head is attached to the additional board one by one. The process of applying pressure, the invention can speed up the completion of the overall process.
此外，依據本發明之實施例，附加板係設置於附加板帶體且夾設於一底層帶體與一頂層帶體之間，因此，於供應及移動附加板之過程中，可以避免外物質沾染，可降低軟性電路板成品之不良率。In addition, according to the embodiment of the present invention, the additional plate is disposed on the additional strip body and is sandwiched between an underlying strip body and a top strip body. Therefore, foreign matter can be avoided during the process of supplying and moving the additional board. Contamination can reduce the defect rate of soft circuit board products.
此外，依據本發明之實施例，其整體製程包括移動附加板，以及將附加板黏蓋至軟性電路板，相對於習知技術， 本發明可加快整體製程完成。Moreover, in accordance with an embodiment of the present invention, the overall process includes moving the add-on board and attaching the add-on board to the flexible circuit board, as opposed to conventional techniques. The invention can speed up the completion of the overall process.
此外，依據本發明之實施例，其按壓板之按壓力可均勻分佈於附加板上，因此可將附加板表面可能造成刮痕之傷害最小化，同時可降地軟性電路板成品之不良率。In addition, according to the embodiment of the present invention, the pressing force of the pressing plate can be evenly distributed on the additional board, thereby minimizing the damage of the surface of the additional board which may cause scratches, and at the same time reducing the defective rate of the finished flexible circuit board.
以下將參照隨附之圖式來描述本發明為達成目的所使用的技術手段與功效，而以下圖式所列舉之實施例僅為輔助說明，以利 貴審查委員瞭解，但本案之技術手段並不限於所列舉圖式。The technical means and efficacy of the present invention for achieving the object will be described below with reference to the accompanying drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, and are to be understood by the reviewing committee, but the technical means of the present invention are not Limited to the listed figures.
請參閱圖二A所示，其係於一附加板帶體7上設有複數附加板4，該複數附加板4係排列為一列設置於一底層帶體5與一頂層帶體6之間，該附加板4係用以黏蓋於一軟性電路板(圖中未示出)。Referring to FIG. 2A , a plurality of additional boards 4 are disposed on an additional strip body 7 , and the plurality of additional boards 4 are arranged in a row between an underlying strip body 5 and a top strip body 6 . The additional board 4 is for being attached to a flexible circuit board (not shown).
將下層帶體5及上層帶體6由附加板帶體7分離後，可利用本發明所提供之將附加板黏蓋至軟性電路板之裝置，將附加板4黏蓋至一印刷有複數印刷電路9之軟性電路圖形板8之表面，如圖二B所示。After the lower belt body 5 and the upper belt body 6 are separated from the additional strip body 7, the additional board 4 can be adhered to a plurality of printing by using the device for attaching the additional board to the flexible circuit board provided by the present invention. The surface of the flexible circuit pattern board 8 of the circuit 9 is as shown in Fig. 2B.
請參閱圖三至圖五所示實施例結構，該將附加板黏蓋至軟性電路板之裝置100包含一附加板分離單元110、一附加板供應單元120、一附加板設置單元130、一軟性電路圖形板移動單元140以及一按壓單元150。附加板分離單元110係用以將附加板4由該附加板帶體7(如圖二B所示)分離及用以移動附加板4，附加板供應單元120係用以依序移動及供應附加板4，附加板設置單元130係用以拾取 及移動附加板4，並將附加板4設置於軟性電路圖形板8(如圖二B所示)，軟性電路圖形板移動單元140係用以移動軟性電路圖形板8，按壓單元150係用以施壓於軟性電路圖形板8設置有附加板4之位置。Referring to the structure of the embodiment shown in FIG. 3 to FIG. 5, the device 100 for attaching the additional board to the flexible circuit board comprises an additional board separating unit 110, an additional board supplying unit 120, an additional board setting unit 130, and a soft The circuit graphic board moves the unit 140 and a pressing unit 150. The additional board separating unit 110 is used to separate the additional board 4 from the additional strip body 7 (as shown in FIG. 2B) and to move the additional board 4, and the additional board supply unit 120 is used to sequentially move and supply additional The board 4, the additional board setting unit 130 is used for picking up And moving the additional board 4, and the additional board 4 is disposed on the flexible circuit pattern board 8 (as shown in FIG. 2B), the flexible circuit board moving unit 140 is used to move the flexible circuit pattern board 8, and the pressing unit 150 is used for The pressure is applied to the flexible circuit pattern board 8 where the additional board 4 is placed.
請參閱圖三及圖六所示，附加板分離單元110包含一附加板帶體拆捲器111、一上層帶體複捲器112、一下層帶體複捲器113以及一移動機械手臂114。附加板帶體拆捲器111係提供附加板帶體7捲繞於上並可將附加板帶體7拆捲送出，上層帶體複捲器112係用以將上層帶體6由附加板帶體7分離並將上層帶體6收回捲繞於該上層帶體複捲器，與上層帶體6分離之附加板帶體7係進入一預定之供應座S，下層帶體複捲器113係用以分離下層帶體5並將下層帶體5收回捲繞於該下層帶體複捲器113，移動機械手臂114係用以拾取及移動附加板4，並將附加板4設置於供應座S上。Referring to FIG. 3 and FIG. 6, the additional board separating unit 110 includes an additional strip strip unwinder 111, an upper strip rewinder 112, a lower strip rewinder 113, and a moving robot arm 114. The additional strip body unwinder 111 is provided with an additional strip body 7 wound thereon and the additional strip strip 7 is unwound and fed, and the upper strip rewinder 112 is used to attach the upper strip 6 by an additional strip The body 7 is separated and the upper belt 6 is retracted and wound around the upper belt rewinder, and the additional strip body 7 separated from the upper belt 6 is fed into a predetermined supply seat S, and the lower belt rewinder 113 is attached. For separating the lower belt body 5 and retracting and winding the lower belt body 5 to the lower belt rewinder 113, the moving robot arm 114 is used for picking up and moving the additional board 4, and the additional board 4 is placed on the supply seat S on.
於本實施例中，附加板帶體拆捲器111將附加板帶體7拆捲並送出附加板帶體拆捲器111後，附加板帶體7係沿著一供應路徑L朝向供應座S移動，上層帶體複捲器112與下層帶體複捲器113分別對上層帶體6與下層帶體5產生一拉力，該上層帶體複捲器112與下層帶體複捲器113對上層帶體6與下層帶體5所產生之拉力方向相反，且上層帶體6、下層帶體5分別與供應路徑L間具有一特定的夾角α，藉此可以輕易地將上層帶體6及下層帶體5由附加板帶體7分離及收回。In the present embodiment, after the additional strip strip unwinder 111 unwinds the additional strip strip body 7 and feeds the additional strip strip unwinder 111, the additional strip strip 7 is oriented along a supply path L toward the supply seat S. Moving, the upper tape rewinder 112 and the lower tape rewinder 113 respectively generate a pulling force to the upper tape body 6 and the lower layer tape body 5, and the upper layer tape rewinding device 112 and the lower layer tape rewinding device 113 are opposite to the upper layer. The pulling force generated by the belt body 6 and the lower belt body 5 is opposite, and the upper belt body 6 and the lower belt body 5 respectively have a specific angle α between the supply path L, whereby the upper belt body 6 and the lower layer can be easily disposed. The belt body 5 is separated and retracted by the additional strip body 7.
當上層帶體6及下層帶體5由附加板帶體7分離，且 附加板4被設置於供應座S後，由移動機械手臂114所具有之一手臂元件115拾取附加板4，並沿著一導軌116移動，將附加板4送至附加板供應單元120。When the upper belt body 6 and the lower belt body 5 are separated by the additional strip body 7, and After the additional plate 4 is placed on the supply base S, the additional plate 4 is picked up by one of the arm members 115 of the moving robot arm 114, and moved along a guide rail 116 to feed the additional plate 4 to the additional plate supply unit 120.
附加板供應單元120係一輸送帶形式，其係經由手臂元件115承接該附加板4，並將附加板4依序移送至附加板設置單元130。The additional board supply unit 120 is in the form of a conveyor belt that receives the additional board 4 via the arm member 115 and sequentially transfers the additional board 4 to the additional board setting unit 130.
附加板設置單元130具有一拾取頭131，該拾取頭131係用以拾取由附加板供應單元120所供應之附加板4，並將附加板4設置於一預設位置，該拾取頭131係由一X軸驅動導軌136驅動沿著一X軸方向移動。The additional board setting unit 130 has a pickup head 131 for picking up the additional board 4 supplied by the additional board supply unit 120, and setting the additional board 4 at a preset position, the pickup head 131 being An X-axis drive rail 136 is driven to move in an X-axis direction.
拾取頭131係經由吸附的方式拾取附加板4，拾取頭131沿著X軸驅動導軌136移動至軟性電路圖形板移動單元140，於軟性電路圖形板移動單元140設有軟性電路圖形板8，由拾取頭131將附加板4設置於軟性電路圖形板8上。The pick-up head 131 picks up the additional board 4 by means of adsorption, the pick-up head 131 moves along the X-axis drive rail 136 to the flexible circuit pattern board moving unit 140, and the flexible circuit pattern board moving unit 140 is provided with the flexible circuit pattern board 8, by The pickup head 131 sets the additional board 4 on the flexible circuit pattern board 8.
更具體地，請參閱圖七所示，拾取頭131包含四個吸附元件132、四個垂直驅動元件133、一旋轉驅動元件134以及一托架元件135，該四個吸附元件132彼此之間係具有一預設間隔地環形設置，每一垂直驅動元件133係耦接於一吸附元件132之頂部，每一垂直驅動元件133係用以驅動所耦接之吸附元件132上下移動，旋轉驅動元件134係用以驅動該四個垂直驅動元件133同時水平移動，托架元件135係用以支撐該旋轉驅動元件134，托架元件135係可滑動地耦接於X軸驅動導軌136(如圖三所示)。More specifically, referring to FIG. 7, the pickup head 131 includes four adsorption elements 132, four vertical drive elements 133, a rotary drive element 134, and a carrier element 135. The four adsorption elements 132 are connected to each other. Each of the vertical driving elements 133 is coupled to the top of an adsorption element 132. Each of the vertical driving elements 133 is configured to drive the coupled adsorption element 132 to move up and down. The rotary driving element 134 is disposed. For driving the four vertical driving elements 133 to move horizontally, the bracket member 135 is for supporting the rotary driving element 134, and the bracket member 135 is slidably coupled to the X-axis driving rail 136 (as shown in FIG. Show).
藉此，拾取頭131可拾取四片附加板4，亦即每一吸 附元件132可吸附一片附加板4，於本實施例中，當其中之一吸附元件132吸附一片附加板4之後，由旋轉驅動元件134驅動旋轉90度，如此，可由相鄰之下一吸附元件132由附加板供應單元120拾取另一附加板4。Thereby, the picking head 131 can pick up four additional boards 4, that is, each sucking The attachment member 132 can adsorb an additional plate 4. In this embodiment, after one of the adsorption members 132 adsorbs an additional plate 4, the rotary drive member 134 is driven to rotate by 90 degrees. Thus, the adjacent adsorption member can be adjacent. Another additional board 4 is picked up by the add-on board supply unit 120.
吸附元件132係由垂直驅動元件133驅動上下移動，藉以由附加板供應單元120拾取附加板4，且該吸附元件132可由旋轉驅動元件134驅動旋轉180度，並由一底視影像擷取裝置137(如圖四所示，係附加板設置單元130所包含之一元件)擷取該吸附元件132之影像，該底視影像擷取裝置137係設置於相對於旋轉驅動元件134之一較低位置，該底視影像擷取裝置137係用以量測該吸附元件132於拾取附加板4時於X軸之位置誤差，以及於XY平面之旋轉角度誤差。The adsorption element 132 is driven to move up and down by the vertical drive element 133, whereby the additional plate 4 is picked up by the additional plate supply unit 120, and the adsorption element 132 can be rotated by 180 degrees by the rotary drive element 134, and is supported by a bottom view image capture device 137. (As shown in FIG. 4, an element included in the additional board setting unit 130) captures an image of the adsorption element 132, and the bottom view image capturing device 137 is disposed at a lower position relative to one of the rotational driving elements 134. The bottom view image capturing device 137 is configured to measure the position error of the adsorption element 132 on the X axis when picking up the additional plate 4, and the rotation angle error in the XY plane.
當所有吸附元件132完成拾取附加板4之動作後，拾取頭131可沿著X軸驅動導軌136移動至軟性電路圖形板移動單元140，於軟性電路圖形板移動單元140設有軟性電路圖形板8(請參閱圖三至圖五所示)。After all the adsorption elements 132 complete the action of picking up the additional board 4, the pickup head 131 can be moved along the X-axis drive rail 136 to the flexible circuit pattern board moving unit 140, and the flexible circuit pattern board moving unit 140 is provided with the flexible circuit pattern board 8. (See Figures 3 to 5).
於本實施例中，於拾取頭131之托架元件135一側設有一頂視影像擷取裝置138，當拾取頭131移動至附加板4上方時，可藉由頂視影像擷取裝置138擷取附加板4所黏蓋之軟性電路圖形板8上之印刷電路9之位置影像，以辨識附加板4所設置之位置。In this embodiment, a top view image capturing device 138 is disposed on the side of the carrier member 135 of the pick-up head 131. When the pick-up head 131 is moved over the additional board 4, the top view image capturing device 138 can be used. The position image of the printed circuit 9 on the flexible circuit pattern board 8 adhered by the additional board 4 is taken to identify the position where the additional board 4 is disposed.
藉由一控制元件(圖中未示出)或其他等同的技術手段，將該頂視影像擷取裝置138所擷取該附加板4之設置位置，與該吸附元件132於拾取附加板4時於X軸之位置 誤差以及由旋轉驅動元件134驅動附加板4時之旋轉角度誤差相互比對後，再移動X軸驅動導軌136，如此即可準確地將附加板4依印刷電路9之位置穩固地設置於印刷電路9上。The top view image capturing device 138 captures the set position of the additional board 4 by a control element (not shown) or other equivalent technical means, and the adsorbing element 132 picks up the additional board 4 Position on the X axis The error and the rotation angle error when the additional driving plate 4 is driven by the rotary driving member 134 are compared with each other, and then the X-axis driving rail 136 is moved, so that the position of the additional board 4 according to the position of the printed circuit 9 can be accurately set in the printed circuit. 9 on.
請參閱圖三至圖五所示，軟性電路圖形板移動單元140包括一安裝板141、一Y軸驅動平台146，安裝板141係用以承載軟性電路圖形板8並提供拾取頭131將附加板4設置於印刷電路9上，Y軸驅動平台146係提供該安裝板141設置於其上，並可驅動安裝板141於一Y軸方向移動，該Y軸方向係垂直於X軸方向。Referring to FIG. 3 to FIG. 5, the flexible circuit graphic board moving unit 140 includes a mounting board 141 and a Y-axis driving platform 146. The mounting board 141 is used to carry the flexible circuit graphic board 8 and provide the picking head 131 to add the additional board. 4 is disposed on the printed circuit 9, the Y-axis driving platform 146 is provided on the mounting plate 141, and the driving plate 141 is driven to move in a Y-axis direction perpendicular to the X-axis direction.
請參閱圖八所示，於安裝板141設有複數毛細管142、一加熱器143以及複數加熱線144，該複數毛細管142係垂直陣列設置於該安裝板141內，藉此提供吸附及定位功能，用以將軟性電路圖形板8吸附並定位於安裝板141之上表面，加熱器143係用以對該位於安裝板141上表面之軟性電路圖形板8加熱，複數加熱線144係佈設於安裝板141內。Referring to FIG. 8 , the mounting plate 141 is provided with a plurality of capillaries 142 , a heater 143 , and a plurality of heating wires 144 . The plurality of capillaries 142 are vertically arrayed in the mounting plate 141 , thereby providing adsorption and positioning functions. The soft circuit pattern board 8 is used to adsorb and position the upper surface of the mounting board 141, the heater 143 is used to heat the flexible circuit pattern board 8 on the upper surface of the mounting board 141, and the plurality of heating lines 144 are disposed on the mounting board. Within 141.
於本實施例中，該加熱的手段係與按壓單元150執行按壓的過程同時進行，關於按壓單元150將會詳述於後。In the present embodiment, the heating means is performed simultaneously with the process in which the pressing unit 150 performs the pressing, and the pressing unit 150 will be described later in detail.
請參閱圖三及圖五所示，Y軸驅動平台146係與X軸驅動導軌136相互垂直地設置於相對於X軸驅動導軌136之一較低位置，藉此，安裝板141可於X軸驅動導軌136之其中一端(如圖三及圖五所示該安裝板141之位置)，以及X軸驅動導軌136相對之另外一端(如圖五所示相對應於按壓單元150下方之一端)之間移動。Referring to FIG. 3 and FIG. 5, the Y-axis drive platform 146 and the X-axis drive rail 136 are disposed perpendicular to each other with respect to one of the X-axis drive rails 136, whereby the mounting plate 141 can be on the X-axis. One end of the driving rail 136 (the position of the mounting board 141 shown in FIG. 3 and FIG. 5) and the other end of the X-axis driving rail 136 (corresponding to one end of the pressing unit 150 as shown in FIG. 5) Move between.
藉此，如圖三及圖五所示，拾取頭131設置該附加板4之作業程序係於X軸驅動導軌136之其中一端(如圖三及圖五所示安裝板141之位置)進行，而對已設置有附加板4之軟性電路圖形板8所進行之按壓程序，則是於X軸驅動導軌136相對之另外一端進行。Therefore, as shown in FIG. 3 and FIG. 5, the working procedure of the pickup head 131 for arranging the additional board 4 is performed on one end of the X-axis driving rail 136 (the position of the mounting board 141 shown in FIG. 3 and FIG. 5). The pressing procedure for the flexible circuit pattern board 8 on which the additional board 4 is provided is performed on the other end of the X-axis driving rail 136.
如上所述，按壓單元150係設置於X軸驅動導軌136另外一端，當安裝板141移動至X軸驅動導軌136相對應於按壓單元150下方之一端時，按壓單元150可對設置於安裝板141上之軟性電路圖形板8進行按壓，藉此使附加板4黏蓋於軟性電路圖形板8上。As described above, the pressing unit 150 is disposed at the other end of the X-axis driving rail 136. When the mounting plate 141 is moved to the X-axis driving rail 136 corresponding to one end of the pressing unit 150, the pressing unit 150 can be disposed on the mounting plate 141. The upper flexible circuit pattern board 8 is pressed, whereby the additional board 4 is adhered to the flexible circuit pattern board 8.
如圖九所示，按壓單元150包括一框架151，於框架151設有一壓板152以及一驅動汽缸153，壓板152與汽缸153相連接，驅動汽缸153可帶動壓板152產生一向下突出之按壓力。As shown in FIG. 9, the pressing unit 150 includes a frame 151. The frame 151 is provided with a pressing plate 152 and a driving cylinder 153. The pressing plate 152 is connected to the cylinder 153. The driving cylinder 153 can drive the pressing plate 152 to generate a downward protruding pressing force.
於本實施例中，設置於安裝板141上之軟性電路圖形板8係由上述加熱手段(加熱器143)進行加熱。因此，附加板4與軟性電路圖形板8係藉由加熱及按壓雙重作用相互黏合。In the present embodiment, the flexible circuit pattern board 8 provided on the mounting board 141 is heated by the above heating means (heater 143). Therefore, the additional board 4 and the flexible circuit pattern board 8 are bonded to each other by the double action of heating and pressing.
於本實施中，如圖三至圖五所示，於軟性電路圖形板移動單元140及按壓單元150相對二側對稱設置有一對附加板分離單元110、110’，以及一對附加板供應單元120、120’，以及一對附加板設置單元130(具有一對拾取頭131、131’)。藉此，可由左右二側同時進行黏蓋附加板4之製程，可達到二倍的加工速率。In the present embodiment, as shown in FIG. 3 to FIG. 5, a pair of additional board separating units 110, 110' and a pair of additional board supplying units 120 are symmetrically disposed on opposite sides of the flexible circuit pattern board moving unit 140 and the pressing unit 150. 120', and a pair of additional board setting units 130 (having a pair of pickup heads 131, 131'). Thereby, the process of attaching the additional board 4 can be simultaneously performed by the left and right sides, and the processing rate can be doubled.
於本實施例中，該結構對稱之附加板設置單元130係 共用一組X軸驅動導軌136，拾取頭131、131’可個別移動地耦接於該X軸驅動導軌136。In this embodiment, the structurally symmetrical additional board setting unit 130 is A set of X-axis drive rails 136 are shared, and the pick-up heads 131, 131' are individually movably coupled to the X-axis drive rails 136.
請參閱圖十所示本發明之附加板分離單元110實施例結構，該附加板分離單元110係與上述裝置100黏蓋附加板於軟性電路板之機構分離設置。Referring to FIG. 10, the structure of the embodiment of the additional board separating unit 110 of the present invention is provided. The additional board separating unit 110 is separately provided from the mechanism 100 for attaching the additional board to the flexible circuit board.
如上所述，本發明之附加板分離單元110實施例結構，包含一附加板帶體拆捲器111、一上層帶體複捲器112以及一下層帶體複捲器113。As described above, the embodiment of the additional board separating unit 110 of the present invention comprises an additional strip strip unwinder 111, an upper strip rewinder 112, and a lower strip rewinder 113.
如圖十一所示，其係由一扭力馬達118驅動下層帶體複捲器113以一預設之力矩旋轉。As shown in Fig. 11, it is driven by a torsion motor 118 to drive the lower belt rewinder 113 to rotate at a predetermined torque.
由於下層帶體複捲器113係以一預設的力矩旋轉，因此可對該由附加板帶體拆捲器111所送出之附加板帶體7(如圖六所示)提供一預設的拉力。Since the lower belt rewinding device 113 is rotated by a predetermined torque, the additional strip body 7 (shown in FIG. 6) sent by the additional strip strip unwinder 111 can be provided with a preset. pull.
於附加板帶體拆捲器111一側設有一張力滾軸119，藉此可使得下層帶體複捲器113對附加板帶體7所提供之拉力維持於一固定值。A force roller 119 is provided on the side of the additional strip strip unwinder 111, whereby the pulling force provided by the lower strip rewinder 113 to the additional strip body 7 is maintained at a fixed value.
換言之，張力滾軸119係用以使附加板帶體7與下層帶體複捲器113於相同之拉力值下同時作動，以避免拉力轉移至附加板帶體拆捲器111。In other words, the tension roller 119 is used to simultaneously actuate the additional strip body 7 and the lower belt rewinder 113 at the same tensile force value to avoid the transfer of the pulling force to the additional strip strip unwinder 111.
為達到上述目的，如圖十二所示，張力滾軸119包括一支撐滾軸119a以及一摩擦滾軸119b，附加板帶體7係水平設置於張力滾軸119與支撐滾軸119a之間，支撐滾軸119係垂直向上按壓於附加板帶體7之下表面，摩擦滾軸119b係相對於支撐滾軸119a垂直向下按壓於附加板帶體7 之上表面。To achieve the above objective, as shown in FIG. 12, the tension roller 119 includes a support roller 119a and a friction roller 119b, and the additional strip body 7 is horizontally disposed between the tension roller 119 and the support roller 119a. The support roller 119 is vertically pressed upward against the lower surface of the additional strip body 7, and the friction roller 119b is pressed vertically downward with respect to the support roller 119a to the additional strip body 7. Above the surface.
支撐滾軸119a係藉由一汽缸119f驅動而產生一向上之按壓力，藉此對附加板帶體7施加一預定的抓持力。The support roller 119a is driven by a cylinder 119f to generate an upward pressing force, thereby applying a predetermined gripping force to the additional strip body 7.
摩擦滾軸119係用以接收一摩擦力，其係於摩擦滾軸119b之轉軸耦接一軸承119c，軸承119c之一軸向端部之表面與一按壓元件119e接觸，按壓元件119e之軸向位移具有可調整性，其係藉由一調整旋鈕119d調整該按壓元件119e軸向位移。The friction roller 119 is configured to receive a frictional force. The rotation shaft of the friction roller 119b is coupled to a bearing 119c. The surface of one of the axial ends of the bearing 119c is in contact with a pressing member 119e, and the axial direction of the pressing member 119e. The displacement is adjustable, and the axial displacement of the pressing member 119e is adjusted by an adjustment knob 119d.
因此，可藉由上述摩擦力調整機構調整摩擦滾軸119b之旋轉阻力，以調整附加板帶體7之拉力，同時可避免拉力轉移至附加板帶體拆捲器111。Therefore, the rotational resistance of the friction roller 119b can be adjusted by the above-described frictional force adjusting mechanism to adjust the pulling force of the additional strip body 7, and the pulling force can be prevented from being transferred to the additional strip body unwinder 111.
如圖十一所示，附加板帶體拆捲器111係與一力矩裝置(perma torque)1110相連接，該力矩裝置1110係用以提供該附加板帶體拆捲器111一預定阻力力矩。As shown in FIG. 11, the additional strip body unwinder 111 is coupled to a perma torque 1110 for providing the additional strip unwinder 111 with a predetermined resistance moment.
力矩裝置1110可提供該設置於附加板帶體拆捲器111與張力滾軸119間之該附加板帶體7之拉力保持於一特定值。The torque device 1110 can provide the pulling force of the additional strip body 7 disposed between the additional strip strip unwinder 111 and the tension roller 119 at a specific value.
如圖十一所示，上層帶體複捲器112係藉由一驅動馬達117以及一磁粉離合器1111驅動轉動。As shown in FIG. 11, the upper belt rewinder 112 is driven to rotate by a drive motor 117 and a magnetic powder clutch 1111.
驅動馬達117係一直流電動馬達，由驅動馬達117提供該磁粉離合器1111一旋轉驅動力，並由磁粉離合器1111將一調整傳動力(亦即所接收到之該旋轉驅動力)傳送至上層帶體複捲器112，因此可使得上層帶體複捲器112之拉力保持於一預定值。The drive motor 117 is a continuous electric motor, and the rotational driving force of the magnetic powder clutch 1111 is provided by the driving motor 117, and an adjustment driving force (that is, the received rotational driving force) is transmitted by the magnetic powder clutch 1111 to the upper belt body. The winder 112 can thus maintain the tension of the upper tape rewinder 112 at a predetermined value.
由於上層帶體複捲器112之重量及質量慣性矩會隨著捲繞頂層帶體6(請參閱圖六所示)之厚度而增加，因此，藉由磁粉離合器1111可避免頂層帶體6因其材質因素而撕裂。Since the weight and mass moment of inertia of the upper belt rewinder 112 increase with the thickness of the wound top strip 6 (see FIG. 6), the top layer strip 6 can be avoided by the magnetic powder clutch 1111. It is torn by its material factor.
換言之，用以控制磁粉離合器1111之控制元件(圖中未示出)，係根據上層帶體複捲器112所捲繞之頂層帶體6之厚度，使張力滾軸119與上層帶體複捲器112間之拉力保持於一預定值。In other words, the control element (not shown) for controlling the magnetic powder clutch 1111 rewinds the tension roller 119 and the upper layer according to the thickness of the top tape body 6 wound by the upper tape rewinder 112. The tension between the devices 112 is maintained at a predetermined value.
如圖十一所示，其係藉由一厚度量測機構量測上層帶體複捲器112所捲繞之頂層帶體6之厚度，該厚度量測機構包括一旋轉軸1112以及一感測器1113，旋轉軸1112係整合於上層帶體複捲器112並可與上層帶體複捲器112一併轉動，感測器1113係設置於上層帶體複捲器112外側之該旋轉軸1112旋轉通過之路徑上。As shown in FIG. 11 , the thickness of the top strip 6 wound by the upper tape rewinder 112 is measured by a thickness measuring mechanism, and the thickness measuring mechanism includes a rotating shaft 1112 and a sensing. The rotating shaft 1112 is integrated into the upper belt rewinding device 112 and can be rotated together with the upper belt rewinding device 112. The sensor 1113 is disposed on the rotating shaft 1112 outside the upper belt rewinding unit 112. Rotate through the path.
藉由旋轉軸1112及感測器1113量測上層帶體複捲器112旋轉之次數，因此可得知上層帶體複捲器112所捲繞之頂層帶體6之厚度。The number of rotations of the upper tape rewinder 112 is measured by the rotating shaft 1112 and the sensor 1113, so that the thickness of the top tape body 6 wound by the upper tape rewinder 112 can be known.
請參閱圖六所示，附加板帶體7之拉力大小與下列因素有關，張力滾軸119與下層帶體複捲器113間之拉力，係大於附加板帶體拆捲器111與張力滾軸119間之拉力，同時也大於張力滾軸119與上層帶體複捲器112間之拉力。Referring to FIG. 6, the tension of the additional strip body 7 is related to the following factors. The tension between the tension roller 119 and the lower belt rewinder 113 is greater than the additional strip unwinder 111 and the tension roller. The tensile force of 119 is also greater than the tension between the tension roller 119 and the upper belt rewinder 112.
若是附加板帶體拆捲器111與張力滾軸119間之拉力過大，可能會對附加板帶體7造成撕裂、刮痕等傷害。因此，較理想的情況下，應該使附加板帶體拆捲器111與張力滾軸119間之拉力保持於一最小值。If the tension between the additional strip unwinder 111 and the tension roller 119 is too large, the additional strip body 7 may be damaged by tears, scratches, and the like. Therefore, in a preferred case, the tension between the additional strip unwinder 111 and the tension roller 119 should be kept to a minimum.
此外，若是張力滾軸119與上層帶體複捲器112間之拉力大於張力滾軸119與下層帶體複捲器113間之拉力，可能會導致通過張力滾軸119之附加板帶體7捲繞於上層帶體複捲器112過緊的問題。In addition, if the tensile force between the tension roller 119 and the upper belt rewinder 112 is greater than the tension between the tension roller 119 and the lower belt rewinder 113, the additional strip body 7 passing through the tension roller 119 may be caused to be rolled. The problem of being too tight around the upper tape rewinder 112.
如圖十二所示，於一楔形導板1114之底側設有一調整支撐板1115，當頂層帶體6以一特定角度拉離該附加板帶體7並通過張力滾軸119時，藉由該調整支撐板1115可避免附加板4(請參閱圖二)被頂層帶體6一併帶離。As shown in FIG. 12, an adjustment support plate 1115 is disposed on the bottom side of a wedge guide 1114. When the top tape body 6 is pulled away from the additional tape body 7 at a specific angle and passes through the tension roller 119, The adjustment support plate 1115 can prevent the additional plate 4 (see FIG. 2) from being taken away by the top tape body 6.
於調整支撐板1115設有一調整螺栓1115a，藉由調整該調整螺栓1115a可上下移動一支撐板表面1115b，藉此調整支撐板表面1115b與楔形導板1114底面間之間隙。An adjusting bolt 1115a is disposed on the adjusting support plate 1115. A adjusting plate surface 1115b can be moved up and down by adjusting the adjusting bolt 1115a, thereby adjusting a gap between the supporting plate surface 1115b and the bottom surface of the wedge guiding plate 1114.
藉由上述調整支撐板1115調整間隙之技術手段，可避免頂層帶體6與附加板帶體7分離時一併將附加板4帶離之狀況發生。By the above-mentioned technical means of adjusting the gap of the support plate 1115, it is possible to avoid the situation in which the top tape body 6 is separated from the additional tape body 7 and the additional plate 4 is removed.
如圖十五所示，按壓單元150包括一框架151、一壓板152、一汽缸箱154、一滑板155以及一汽缸桿156，框架151係水平延伸設置，汽缸箱154係設置於框架151之底面，滑板155係設置於框架151內，汽缸桿156及壓板152係依序設置於滑板155之底面。As shown in FIG. 15, the pressing unit 150 includes a frame 151, a pressing plate 152, a cylinder box 154, a sliding plate 155, and a cylinder rod 156. The frame 151 is horizontally extended, and the cylinder box 154 is disposed on the bottom surface of the frame 151. The slide plate 155 is disposed in the frame 151, and the cylinder rod 156 and the pressure plate 152 are sequentially disposed on the bottom surface of the slide plate 155.
如圖十四及圖十五所示，框架151具有一流道151a，該流道151a係垂直貫穿框架151，藉此，外部之高壓縮氣體可流入流道151a，並經由框架151底面所形成之流道151a之出口流出，該高壓縮氣體可提供工作流體之作用。As shown in FIG. 14 and FIG. 15, the frame 151 has a first-class passage 151a which penetrates the frame 151 vertically, whereby the external high-compressed gas can flow into the flow passage 151a and is formed via the bottom surface of the frame 151. The outlet of the flow passage 151a flows out, and the high compression gas can provide a working fluid.
汽缸箱154具有一開放之頂部以及一開放之底面154a，該開放之頂部耦接於框架151底面，該開放之底面 154a係用以導引汽缸桿156滑動。The cylinder box 154 has an open top and an open bottom surface 154a. The open top is coupled to the bottom surface of the frame 151. The 154a is used to guide the cylinder rod 156 to slide.
於汽缸箱154底面設有一密封元件154b，該密封元件154b係環繞設置於汽缸箱154底面之週緣。A sealing member 154b is disposed on the bottom surface of the cylinder box 154, and the sealing member 154b is disposed around the circumference of the bottom surface of the cylinder box 154.
滑板155係設置於汽缸箱154內，滑板155係可沿著汽缸箱154之一內側壁上下滑動。The slider 155 is disposed within the cylinder box 154, and the slider 155 is slidable up and down along one of the inner walls of the cylinder box 154.
藉由設置於汽缸箱154內之底部之複數彈簧154c提供滑板155一向上之推力，可使滑板155經常性地保持於一被抬升之狀態。By providing the upward thrust of the slider 155 by the plurality of springs 154c disposed at the bottom of the cylinder tank 154, the slider 155 can be constantly held in a raised state.
藉由設置於框架151之複數驅動汽缸153，可驅動滑板155向下移動。The drive slide 155 can be driven to move downward by the plurality of drive cylinders 153 provided to the frame 151.
由驅動汽缸153對滑板155施以壓力，直到滑板155之底面與設置於汽缸箱154底面之密封元件154b緊密接觸。The slide plate 155 is pressurized by the drive cylinder 153 until the bottom surface of the slide plate 155 is in close contact with the seal member 154b provided on the bottom surface of the cylinder case 154.
於驅動汽缸153驅動之過程中，滑板155底面之汽缸桿156係沿著汽缸箱154之開放之底面154a向下移動。During actuation of the drive cylinder 153, the cylinder rod 156 on the underside of the slide 155 moves downwardly along the open bottom surface 154a of the cylinder box 154.
該用以進行按壓作業之壓板152係設置於汽缸桿156之底面。The pressure plate 152 for performing the pressing operation is provided on the bottom surface of the cylinder rod 156.
如圖十六所示，當包括上述各構件之按壓單元150開始運作時，係由驅動汽缸153首先開始工作，使滑板155沿著汽缸箱154之內側壁向下移動。As shown in Fig. 16, when the pressing unit 150 including the above-described members starts to operate, the driving cylinder 153 first starts to operate, moving the slider 155 downward along the inner side wall of the cylinder case 154.
於本實施例中，除非左側與右側之驅動汽缸153可精確地同步運作，否則滑板155在向下移動時，可能會因為與汽缸箱154內側壁之間隙而卡住。In the present embodiment, unless the left and right drive cylinders 153 are accurately synchronized, the slide 155 may become stuck due to the gap with the inner side wall of the cylinder case 154 when moving downward.
為避免本實施例產生上述狀況，如圖十六及圖十七所 示，於環繞該滑板155週緣之一垂直之表面鑲嵌有複數球狀引導裝置160，於汽缸箱154內側壁相對於球狀引導裝置160之位置設有導塊170。In order to avoid the above situation in the present embodiment, as shown in FIG. 16 and FIG. A plurality of spherical guiding devices 160 are mounted on a surface perpendicular to one of the circumferences of the sliding plate 155, and a guide block 170 is disposed at a position of the inner side wall of the cylinder case 154 with respect to the spherical guiding device 160.
更具體地，如圖十八所示，球狀引導裝置160包括一球體161，球體161係略微突出於滑板155之外表面，而導塊170之內表面係與球體161可滑動地相接觸。More specifically, as shown in FIG. 18, the spherical guiding device 160 includes a ball 161 that protrudes slightly from the outer surface of the slider 155, and the inner surface of the guiding block 170 is slidably in contact with the ball 161.
藉由上述導塊170內表面與球體161可滑動地相接觸之技術手段，可以大幅度減小滑板155與汽缸箱154間之間隙，同時也可以大幅降低滑板155與汽缸箱154接觸及滑動時二者之間之摩擦阻力。By the technical means that the inner surface of the guiding block 170 is slidably contacted with the ball 161, the gap between the sliding plate 155 and the cylinder case 154 can be greatly reduced, and the sliding plate 155 can be greatly reduced in contact with and sliding on the cylinder case 154. The frictional resistance between the two.
於本實施例中，垂直於汽缸箱154之側壁設有一調整凹部171，藉由旋轉調整該調整凹部171，可以使導塊170略微地左右滑動，因此可以使汽缸箱154與滑板155之間具有不同之間隙。In the embodiment, an adjustment recess 171 is disposed perpendicular to the sidewall of the cylinder box 154. By adjusting the adjustment recess 171 by rotation, the guide block 170 can be slightly slid left and right, so that the cylinder box 154 and the slide 155 can be provided between Different gaps.
當驅動汽缸153更進一步操作時，可使滑板155之底面與設置於汽缸箱154內底面之密封元件154b緊密接觸，按壓單元150會形成如圖十九之態樣。When the driving cylinder 153 is further operated, the bottom surface of the sliding plate 155 can be brought into close contact with the sealing member 154b provided on the inner bottom surface of the cylinder case 154, and the pressing unit 150 can be formed as shown in FIG.
當滑板155之底面與密封元件154b緊密接觸時，高壓縮氣體會經由框架151之流道151a流入汽缸箱154所具有之一內部空間S1，藉以按壓滑板155。When the bottom surface of the slide plate 155 is in close contact with the sealing member 154b, the high compressed gas flows into the inner space S1 of the cylinder case 154 via the flow path 151a of the frame 151, thereby pressing the slide plate 155.
於本實施例中，如圖十七及圖十九所示，於滑板155相對於設有框架151之流道151a之一上表面設有複數空氣凹槽155a，因此，填充於該複數空氣凹槽155a內之高壓縮氣體可提供該滑板155底面具有一均勻分佈之下壓力。In the present embodiment, as shown in FIG. 17 and FIG. 19, a plurality of air grooves 155a are formed on the upper surface of the slide plate 155 with respect to the flow path 151a provided with the frame 151, and thus, the plurality of air grooves are filled. The high compression gas in the tank 155a provides a uniform distribution of pressure on the bottom surface of the slide 155.
如圖十九所示之態樣，按壓單元150係透過壓板152進行高壓按壓作業。As shown in FIG. 19, the pressing unit 150 performs a high pressure pressing operation through the pressure plate 152.
此外，於壓板152底面設有一橡膠板180，該橡膠板180係用以使對被按壓物件之傷害降至最低程度。In addition, a rubber plate 180 is disposed on the bottom surface of the pressure plate 152, and the rubber plate 180 is used to minimize damage to the pressed object.
此外，如圖二十所示，於壓板152底面設有相互交錯之複數流道152a，該複數流道152a係朝向該橡膠板180(請參閱圖十九)。Further, as shown in FIG. 20, a plurality of flow passages 152a interlaced with each other are provided on the bottom surface of the pressure plate 152, and the plurality of flow passages 152a are directed toward the rubber sheet 180 (refer to FIG. 19).
此外，如圖二十一所示，於壓板152之一側設有複數氣孔152b，該複數流道152a係連接該複數氣孔152b，壓縮氣體可由氣孔152b流入壓板152內。Further, as shown in FIG. 21, a plurality of air holes 152b are provided on one side of the pressure plate 152, and the plurality of air holes 152a are connected to the plurality of air holes 152b, and the compressed gas can flow into the pressure plate 152 from the air holes 152b.
如前所述，如圖十九所示按壓單元150之操作態樣時，當壓縮氣體流入壓板152與橡膠板180之間，會導致橡膠板180產生些微膨脹，因此可以使得被按壓物件直接與橡膠板180接觸之表面之傷害降至最低程度，並且確保按壓力可均勻分佈作用於被按壓物件。As described above, when the pressing unit 150 is operated as shown in FIG. 19, when the compressed gas flows between the pressing plate 152 and the rubber sheet 180, the rubber sheet 180 is slightly inflated, so that the pressed object can be directly The damage to the surface in contact with the rubber sheet 180 is minimized, and it is ensured that the pressing force can be evenly distributed to the object to be pressed.
綜上所述，更進一步說明按壓單元150之操作過程，如圖二十一所示，當安裝板141上之軟性電路圖形板8(如圖二B所示)因Y軸驅動平台146之作用而位於一較低側時(於本實施例中，附加板4係設置於軟性電路圖形板8之上表面)，按壓單元150係如上所述進行按壓作業，而位於最低位置之橡膠板180(請參閱圖十九)係與軟性電路圖形板8接觸並按壓於軟性電路圖形板8，如圖二十二所示。In summary, the operation process of the pressing unit 150 is further explained. As shown in FIG. 21, when the flexible circuit pattern board 8 on the mounting board 141 (shown in FIG. 2B) is driven by the Y-axis. On the lower side (in the present embodiment, the additional board 4 is disposed on the upper surface of the flexible circuit pattern board 8), the pressing unit 150 performs the pressing operation as described above, and the rubber sheet 180 at the lowest position ( Please refer to FIG. 19), which is in contact with the flexible circuit graphic board 8 and pressed against the flexible circuit graphic board 8, as shown in FIG.
惟以上所述將附加板黏蓋至軟性電路板之裝置100、附加板分離單元110以及按壓單元150，僅為本發明之實施例而已，當不能以之限定本發明所實施之範圍。即大凡 依本發明申請專利範圍所作之均等變化與修飾，皆應仍屬於本發明專利涵蓋之範圍內，謹請 貴審查委員明鑑，並祈惠准，是所至禱。However, the apparatus 100 for attaching the additional board to the flexible circuit board, the additional board separating unit 110, and the pressing unit 150 as described above are only embodiments of the present invention, and the scope of the invention is not limited thereto. That is to say The equal changes and modifications made in accordance with the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention. I would like to ask your review committee to give a clear explanation and pray for it.
1‧‧‧附加板1‧‧‧Addition board
2‧‧‧印刷電路2‧‧‧Printed circuit
3‧‧‧軟性電路圖形板3‧‧‧Soft circuit graphics board
10‧‧‧輸送帶10‧‧‧ conveyor belt
20‧‧‧承載板20‧‧‧Loading board
30‧‧‧拾取頭30‧‧‧ pick up head
4‧‧‧附加板4‧‧‧Addition board
5‧‧‧底層帶體5‧‧‧Bottom belt
6‧‧‧頂層帶體6‧‧‧Top layer body
7‧‧‧附加板帶體7‧‧‧Additional strip body
8‧‧‧軟性電路圖形板8‧‧‧Soft circuit graphics board
9‧‧‧印刷電路9‧‧‧Printed circuit
100‧‧‧將附加板黏蓋至軟性電路板之裝置100‧‧‧A device for attaching an additional board to a flexible circuit board
110、110’‧‧‧附加板分離單元110, 110’‧‧‧Addition plate separation unit
111‧‧‧附加板帶體拆捲器111‧‧‧Additional strip body unwinder
112‧‧‧上層帶體複捲器112‧‧‧Upper belt rewinder
113‧‧‧下層帶體複捲器113‧‧‧Under layer body rewinder
114‧‧‧移動機械手臂114‧‧‧Mobile robot arm
115‧‧‧手臂元件115‧‧‧arm components
116‧‧‧導軌116‧‧‧rail
117‧‧‧驅動馬達117‧‧‧Drive motor
118‧‧‧扭力馬達118‧‧‧Torque motor
119‧‧‧張力滾軸119‧‧‧Tension Roller
119a‧‧‧支撐滾軸119a‧‧‧Support roller
119b‧‧‧摩擦滾軸119b‧‧‧ friction roller
119c‧‧‧軸承119c‧‧‧ bearing
119d‧‧‧調整旋鈕119d‧‧‧Adjustment knob
119e‧‧‧按壓元件119e‧‧‧ Pressing element
119f‧‧‧汽缸119f‧‧‧ cylinder
120、120’‧‧‧附加板供應單元120, 120’‧‧‧Addition board supply unit
130‧‧‧附加板設置單元130‧‧‧Addition board setting unit
131、131’‧‧‧拾取頭131, 131’‧‧‧ Pick up head
132‧‧‧吸附元件132‧‧‧Adsorption elements
133‧‧‧垂直驅動元件133‧‧‧Vertical drive components
134‧‧‧旋轉驅動元件134‧‧‧Rotary drive components
135‧‧‧托架元件135‧‧‧ bracket components
136‧‧‧X軸驅動導軌136‧‧‧X-axis drive rail
137‧‧‧底視影像擷取裝置137‧‧‧ bottom view image capture device
138‧‧‧頂視影像擷取裝置138‧‧‧Top view image capture device
140‧‧‧軟性電路圖形板移動單元140‧‧‧Soft circuit graphics board mobile unit
141‧‧‧安裝板141‧‧‧Installation board
142‧‧‧毛細管142‧‧‧ Capillary
143‧‧‧加熱器143‧‧‧heater
144‧‧‧加熱線144‧‧‧heating line
146‧‧‧Y軸驅動平台146‧‧‧Y-axis drive platform
150‧‧‧按壓單元150‧‧‧ Press unit
151‧‧‧框架151‧‧‧Frame
151a‧‧‧框架之流道151a‧‧‧Frame flow path
152‧‧‧壓板152‧‧‧ pressure plate
152a‧‧‧壓板之流道152a‧‧‧Pipe plate runner
152b‧‧‧氣孔152b‧‧‧ stomata
153‧‧‧驅動汽缸153‧‧‧Drive cylinder
154‧‧‧汽缸箱154‧‧ ‧ cylinder box
154a‧‧‧開放之底面154a‧‧‧ open bottom
154b‧‧‧密封元件154b‧‧‧ sealing element
154c‧‧‧彈簧154c‧‧ ‧ spring
155‧‧‧滑板155‧‧‧ Skateboarding
155a‧‧‧空氣凹槽155a‧‧‧air groove
156‧‧‧汽缸桿156‧‧‧Cylinder rod
160‧‧‧球狀引導裝置160‧‧‧Spherical guiding device
161‧‧‧球體161‧‧‧ sphere
170‧‧‧導塊170‧‧‧ Guide block
171‧‧‧調整凹部171‧‧‧Adjust the recess
180‧‧‧橡膠板180‧‧‧ rubber sheet
1110‧‧‧力矩裝置1110‧‧‧Torque device
1111‧‧‧磁粉離合器1111‧‧‧Magnetic powder clutch
1112‧‧‧旋轉軸1112‧‧‧Rotary axis
1113‧‧‧感測器1113‧‧‧ Sensor
1114‧‧‧楔形導板1114‧‧‧Wedge guide
1115‧‧‧調整支撐板1115‧‧‧Adjustment support plate
1115a‧‧‧調整螺栓1115a‧‧‧Adjustment bolt
1115b‧‧‧支撐板表面1115b‧‧‧Support plate surface
S‧‧‧供應座S‧‧‧Supply
S1‧‧‧內部空間S1‧‧‧ interior space
L‧‧‧供應路徑L‧‧‧Supply path
α‧‧‧夾角‧‧‧‧ angle
圖一係習知將附加板黏蓋至軟性電路板之裝置之結構示意圖。Figure 1 is a schematic view showing the structure of a device for attaching an additional board to a flexible circuit board.
圖二A係實施於本發明之將附加板黏蓋至軟性電路板之裝置之附加板之一實施例結構示意圖。Figure 2A is a block diagram showing an embodiment of an additional plate of the apparatus for attaching an additional board to a flexible circuit board of the present invention.
圖二B係圖二A之附加板實施例黏蓋於軟性電路板之結構示意圖。Figure 2B is a schematic view showing the structure of the additional board embodiment of Figure 2A adhered to the flexible circuit board.
圖三係本發明之將附加板黏蓋至軟性電路板之裝置之一實施例之立體結構圖。Figure 3 is a perspective structural view of one embodiment of the apparatus for adhering an additional board to a flexible circuit board of the present invention.
圖四係圖三之將附加板黏蓋至軟性電路板之裝置實施例之前視結構圖。Figure 4 is a front structural view of an embodiment of the apparatus for attaching an additional board to a flexible circuit board.
圖五係圖三之將附加板黏蓋至軟性電路板之裝置實施例之俯視結構圖。Figure 5 is a top plan view of an embodiment of the apparatus for attaching an additional board to a flexible circuit board.
圖六係圖三之將附加板黏蓋至軟性電路板之裝置實施例之側視結構圖。Figure 6 is a side elevational view of the embodiment of the apparatus for attaching an add-on board to a flexible circuit board.
圖七係圖三之將附加板黏蓋至軟性電路板之裝置之拾取頭實施例之側視結構圖。Figure 7 is a side elevational view of the pickup head embodiment of the apparatus for attaching an add-on board to a flexible circuit board.
圖八係圖三之將附加板黏蓋至軟性電路板之裝置之軟性電路圖形板移動單元實施例之側視結構圖。Figure 8 is a side elevational view of the embodiment of the flexible circuit pattern board moving unit of the device for attaching the additional board to the flexible circuit board.
圖九係圖三之將附加板黏蓋至軟性電路板之裝置之按壓單元實施例之正視及俯視結構圖。Figure 9 is a front and top plan view of the embodiment of the pressing unit of the device for attaching the additional board to the flexible circuit board.
圖十係圖三之將附加板黏蓋至軟性電路板之裝置之附加板分離單元實施例之立體結構圖。Figure 10 is a perspective structural view of an embodiment of an additional plate separation unit of the device for attaching an additional board to a flexible circuit board.
圖十一係圖十之附加板分離單元實施例之側視結構圖。Figure 11 is a side elevational view of the embodiment of the additional plate separation unit of Figure 10.
圖十二係圖十之附加板分離單元之張力輪及調整支撐板實施例之立體結構圖。Figure 12 is a perspective structural view of the tension wheel and the adjustment support plate embodiment of the additional plate separation unit of Figure 10.
圖十三係圖十之附加板分離單元之張力滾軸及調整支撐板實施例之前視結構圖。Figure 13 is a front structural view of the embodiment of the tension roller and the adjustment support plate of the additional plate separation unit of Figure 10.
圖十四係圖三之將附加板黏蓋至軟性電路板之裝置之按壓單元實施例之立體結構圖。Figure 14 is a perspective structural view of the embodiment of the pressing unit of the device for attaching the additional board to the flexible circuit board.
圖十五、圖十六及圖十九係圖十四之按壓單元實施例之前視結構之作動示意圖。FIG. 15 , FIG. 16 and FIG. 19 are schematic diagrams showing the operation of the front view structure of the pressing unit embodiment of FIG. 14 .
圖十七係圖十四之按壓單元之滑板實施例之立體結構圖。Figure 17 is a perspective structural view of the embodiment of the slider of the pressing unit of Figure 14.
圖十八係圖十六方形框區域之透視結構圖。Figure 18 is a perspective structural view of the sixteen square frame area.
圖二十係圖十四之按壓單元之壓板實施例之立體結構圖。Figure 20 is a perspective structural view of a pressure plate embodiment of the pressing unit of Figure 14.
圖二十一及圖二十二係圖十四之按壓單元實施例之作動示意圖。Figure 21 and Figure 22 show the actuation of the embodiment of the pressing unit of Figure 14.
4‧‧‧附加板4‧‧‧Addition board
8‧‧‧軟性電路圖形板8‧‧‧Soft circuit graphics board
100‧‧‧將附加板黏蓋至軟性電路板之裝置100‧‧‧A device for attaching an additional board to a flexible circuit board
110‧‧‧附加板分離單元110‧‧‧Addition plate separation unit
120、120’‧‧‧附加板供應單元120, 120’‧‧‧Addition board supply unit
130‧‧‧附加板設置單元130‧‧‧Addition board setting unit
131、131’‧‧‧拾取頭131, 131’‧‧‧ Pick up head
136‧‧‧X軸驅動導軌136‧‧‧X-axis drive rail
140‧‧‧軟性電路圖形板移動單元140‧‧‧Soft circuit graphics board mobile unit
141‧‧‧安裝板141‧‧‧Installation board
146‧‧‧Y軸驅動平台146‧‧‧Y-axis drive platform
Claims (23)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110093793A KR101257621B1 (en) | 2011-09-19 | 2011-09-19 | Apparatus and method for adhering additional plate to fpc |
| KR1020110093795A KR101257612B1 (en) | 2011-09-19 | 2011-09-19 | Apparatus for adhering additional plate to fpc and press unit used in the apparatus |
| KR1020110093794A KR101257603B1 (en) | 2011-09-19 | 2011-09-19 | Apparatus for adhering additional plate to fpc and additional plate separating unit used in the apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201318486A TW201318486A (en) | 2013-05-01 |
| TWI498059B true TWI498059B (en) | 2015-08-21 |
Family
ID=47914996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101133724A TWI498059B (en) | 2011-09-19 | 2012-09-14 | Appartus for adhering additional plate to fpc and additional plate separating unit and press unit used in the apparatus |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103858532B (en) |
| TW (1) | TWI498059B (en) |
| WO (1) | WO2013042906A2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103224055B (en) * | 2013-04-15 | 2016-02-24 | 奈电软性科技电子(珠海)有限公司 | A kind of FPC steel disc production machine |
| CN103889164B (en) * | 2014-04-06 | 2017-04-19 | 深圳市诚亿自动化科技有限公司 | Constant-pressure leveling mechanism |
| CN103997858B (en) * | 2014-05-30 | 2017-01-18 | 昆山一邦泰汽车零部件制造有限公司 | Movable printed circuit film ring |
| CN106198614B (en) * | 2015-04-30 | 2019-03-01 | 技嘉科技股份有限公司 | Heat-conductive characteristic test device and pressurizing tool |
| CN107018649A (en) * | 2017-04-17 | 2017-08-04 | 苏州市锐翊电子科技有限公司 | One kind punching patch integrated dual-head material note installation |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007129844A1 (en) * | 2006-05-04 | 2007-11-15 | Seho Robot Industries Co., Ltd | System and method for attaching stiffening plate on flexible printed circuit board |
| TW200833500A (en) * | 2006-09-27 | 2008-08-16 | Fujifilm Corp | Apparatus and method for manufacturing photosensitive laminate, photosensitive transfer material, rib and method for forming the same, method for manufacturing laminate, member for display device, color filter for display device, method for manufacturing |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3184371B2 (en) * | 1993-07-21 | 2001-07-09 | ティーディーケイ株式会社 | Single plate type XY table device |
| JPH07245497A (en) * | 1994-03-04 | 1995-09-19 | Sony Corp | Device for supplying and sealing electronic component |
| KR0121152Y1 (en) * | 1994-03-23 | 1998-10-01 | 문정환 | Un-reeling system for semiconductor device |
| KR20020000824A (en) * | 2000-06-28 | 2002-01-05 | 이구택 | Device for attaching vinyl on strip |
| KR100850453B1 (en) * | 2002-01-26 | 2008-08-07 | 삼성테크윈 주식회사 | An apparatus and method for attatching film type lead frame to carrier frame |
| US7306695B2 (en) * | 2003-04-10 | 2007-12-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for picking up semiconductor chip |
| KR100668132B1 (en) * | 2006-05-04 | 2007-01-11 | 세호로보트산업 주식회사 | System and method for attaching stiffening plate on flexible printed circuit board |
-
2012
- 2012-09-14 TW TW101133724A patent/TWI498059B/en not_active IP Right Cessation
- 2012-09-17 WO PCT/KR2012/007397 patent/WO2013042906A2/en active Application Filing
- 2012-09-17 CN CN201280043373.6A patent/CN103858532B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007129844A1 (en) * | 2006-05-04 | 2007-11-15 | Seho Robot Industries Co., Ltd | System and method for attaching stiffening plate on flexible printed circuit board |
| TW200833500A (en) * | 2006-09-27 | 2008-08-16 | Fujifilm Corp | Apparatus and method for manufacturing photosensitive laminate, photosensitive transfer material, rib and method for forming the same, method for manufacturing laminate, member for display device, color filter for display device, method for manufacturing |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013042906A3 (en) | 2013-05-23 |
| TW201318486A (en) | 2013-05-01 |
| CN103858532B (en) | 2016-05-18 |
| WO2013042906A2 (en) | 2013-03-28 |
| CN103858532A (en) | 2014-06-11 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |