TWI494456B - - Google Patents

Info

Publication number
TWI494456B
TWI494456B TW101151260A TW101151260A TWI494456B TW I494456 B TWI494456 B TW I494456B TW 101151260 A TW101151260 A TW 101151260A TW 101151260 A TW101151260 A TW 101151260A TW I494456 B TWI494456 B TW I494456B
Authority
TW
Taiwan
Application number
TW101151260A
Other versions
TW201350604A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201350604A publication Critical patent/TW201350604A/zh
Application granted granted Critical
Publication of TWI494456B publication Critical patent/TWI494456B/zh

Links

TW101151260A 2012-06-15 2012-12-28 真空處理裝置及控制製程顆粒沉積路徑的方法 TW201350604A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210199548.4A CN103510064B (zh) 2012-06-15 2012-06-15 真空处理装置及控制制程颗粒沉积路径的方法

Publications (2)

Publication Number Publication Date
TW201350604A TW201350604A (zh) 2013-12-16
TWI494456B true TWI494456B (zh) 2015-08-01

Family

ID=49893483

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101151260A TW201350604A (zh) 2012-06-15 2012-12-28 真空處理裝置及控制製程顆粒沉積路徑的方法

Country Status (2)

Country Link
CN (1) CN103510064B (zh)
TW (1) TW201350604A (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5762748A (en) * 1992-08-27 1998-06-09 Applied Materials, Inc Lid and door for a vacuum chamber and pretreatment therefor
WO2009090779A1 (ja) * 2008-01-15 2009-07-23 Haru Miyake 超音波殺菌装置
CN101085446B (zh) * 2006-06-09 2010-11-10 K.C.科技股份有限公司 预涂辊子清洗单元及清洗方法和基板涂敷装置
CN101192014B (zh) * 2006-11-28 2010-11-24 夏普株式会社 电子照相感光体
US8133815B2 (en) * 2007-05-29 2012-03-13 Sumitomo Electric Industries, Ltd. Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0544037A (ja) * 1991-08-07 1993-02-23 Kawasaki Steel Corp 気相成長装置及びそれを用いた半導体装置の製造方法
US6200412B1 (en) * 1996-02-16 2001-03-13 Novellus Systems, Inc. Chemical vapor deposition system including dedicated cleaning gas injection
JP4231417B2 (ja) * 2004-01-07 2009-02-25 パナソニック株式会社 基板処理装置及びそのクリーニング方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5762748A (en) * 1992-08-27 1998-06-09 Applied Materials, Inc Lid and door for a vacuum chamber and pretreatment therefor
CN101085446B (zh) * 2006-06-09 2010-11-10 K.C.科技股份有限公司 预涂辊子清洗单元及清洗方法和基板涂敷装置
CN101192014B (zh) * 2006-11-28 2010-11-24 夏普株式会社 电子照相感光体
US8133815B2 (en) * 2007-05-29 2012-03-13 Sumitomo Electric Industries, Ltd. Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substrate
WO2009090779A1 (ja) * 2008-01-15 2009-07-23 Haru Miyake 超音波殺菌装置

Also Published As

Publication number Publication date
TW201350604A (zh) 2013-12-16
CN103510064A (zh) 2014-01-15
CN103510064B (zh) 2016-06-29

Similar Documents

Publication Publication Date Title
BR112014024153A2 (zh)
BR112014024811A2 (zh)
BR112014025621A2 (zh)
BR112014017635A2 (zh)
BR112014017614A2 (zh)
BR112014017625A2 (zh)
BR112014017659A2 (zh)
BR112014017646A2 (zh)
BR112014017638A2 (zh)
BR112014017607A2 (zh)
BR112014017634A2 (zh)
BR112014019058A2 (zh)
BR112014018208A2 (zh)
BR112014017609A2 (zh)
BR112014017644A2 (zh)
BR112014017647A2 (zh)
BR112014017618A2 (zh)
BR112014019728A2 (zh)
BR112014017630A2 (zh)
BR112014017652A2 (zh)
BR112014019110A2 (zh)
BR112014017621A2 (zh)
BR112014017622A2 (zh)
BR112014017627A2 (zh)
BR112014017623A2 (zh)