TWI492448B - A packaging structure with an antenna and antenna thereof - Google Patents
A packaging structure with an antenna and antenna thereof Download PDFInfo
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Description
本發明係關於一種具有天線之封裝結構,尤其是一種具有耦合饋入環形天線之積體電路封裝結構。The present invention relates to a package structure having an antenna, and more particularly to an integrated circuit package structure having a coupled feed loop antenna.
隨著無線通訊產品不斷推陳出新,如何使無線通訊產品功能更多,且體積更小乃是產品設計重點。然而,隨著無線通訊產品之通訊頻率提高,電路板上的金屬導線將會產生較大的傳輸損耗,因此,電路單元之間的訊號若能透過無線傳輸,則預期可克服此問題。惟,電路單元之間的無線傳輸勢必要將天線與電路單元置於封裝結構內,使電路單元透過封裝結構內之天線做為訊號收發的元件。因此,逐漸發展出「系統封裝技術」(System in Package,SiP),系統封裝技術可於一封裝體中整合無線通訊系統所需之元件,例如:電路單元、電子元件、天線及連接器等。As wireless communication products continue to evolve, how to make wireless communication products more functional, and smaller size is the focus of product design. However, as the communication frequency of wireless communication products increases, the metal wires on the circuit board will generate large transmission loss. Therefore, if the signals between the circuit units can be transmitted wirelessly, it is expected to overcome this problem. However, the wireless transmission between the circuit units necessarily places the antenna and the circuit unit in the package structure, so that the circuit unit transmits the signal through the antenna in the package structure as a component for transmitting and receiving signals. Therefore, System in Package (SiP) has been gradually developed. System packaging technology can integrate components required for wireless communication systems in a package, such as circuit units, electronic components, antennas, and connectors.
請參閱第1圖所示,中華民國公開第201030864號「有助於半導體封裝技術之天線及其製程」發明專利申請案,揭示一種習知具有天線之封裝結構9,由一多層印刷電路組裝91電性連接一導電構件92,該導電構件92垂直連接一導電構件93,用以饋電至該導電構件93,而使該導電構件93形成該天線,藉此,該多層印刷電路組裝91可以由該天線收發訊號。其中,該導電構件93之表面可以額外連接數個電子組件94,例如:電感器、電容器、開關或可變電容二極體等,而形成一匹配電路,以提供訊號頻率調諧功能或重新配置該導電構件93。Please refer to the invention patent application of "Recommended Antenna and Process for Semiconductor Package Technology" in the Republic of China Publication No. 201030864, which discloses a conventional package structure 9 having an antenna assembled by a multilayer printed circuit. 91 electrically connected to a conductive member 92, the conductive member 92 is perpendicularly connected to a conductive member 93 for feeding to the conductive member 93, and the conductive member 93 is formed to form the antenna, whereby the multilayer printed circuit assembly 91 can The antenna transmits and receives signals. The surface of the conductive member 93 may be additionally connected with a plurality of electronic components 94, such as an inductor, a capacitor, a switch or a variable capacitor diode, etc., to form a matching circuit for providing a signal frequency tuning function or reconfiguring the signal. Conductive member 93.
惟,該導電構件92係位於該多層印刷電路組裝91之外,且垂直連接該導電構件93,而形成該天線,由於該天線必須佔據三維空間,使習知具有天線之封裝結構9之體積無法縮小。再者,該習知具有天線之封裝結構9必須額外連接該匹配電路,才能調諧訊號頻率,因此,若要調諧不同訊號頻率,則必須設計不同匹配電路,而提高該習知具有天線之封裝結構9之結構複雜度。However, the conductive member 92 is located outside the multilayer printed circuit assembly 91 and vertically connected to the conductive member 93 to form the antenna. Since the antenna must occupy a three-dimensional space, the volume of the package structure 9 having the antenna can not be known. Zoom out. Furthermore, the conventional package structure 9 having an antenna must additionally connect the matching circuit to tune the signal frequency. Therefore, if different signal frequencies are to be tuned, different matching circuits must be designed, and the conventional antenna package structure is improved. 9 structural complexity.
綜上所述,有必要提供一種體積小及不需匹配電路的具有天線之封裝結構。In summary, it is necessary to provide a package structure having an antenna that is small in size and does not require a matching circuit.
本發明的目的乃改良上述之缺點,以提供一種具有天線之封裝結構,係將平面天線設於不同介質層之間,而達到體積小之目的者。SUMMARY OF THE INVENTION The object of the present invention is to improve the above-mentioned disadvantages, and to provide a package structure having an antenna, which is to provide a planar antenna between different dielectric layers to achieve a small volume.
本發明之次一目的係提供一種具有天線之封裝結構,由平面天線之幾何變化即可調諧訊號頻率,而達到不需匹配電路之目的者。A second object of the present invention is to provide a package structure having an antenna, and the signal frequency can be tuned by the geometric change of the planar antenna to achieve the purpose of not matching the circuit.
本發明之另一目的係提供一種天線,可以應用於系統封裝結構,使系統封裝結構縮小體積,且不需匹配電路者。Another object of the present invention is to provide an antenna that can be applied to a system package structure to reduce the size of the system package structure without requiring a matching circuit.
一種具有天線之封裝結構,係包含:一載板單元,係包含一基板、一介質體及一載板接地部,該基板設置該介質體及該載板接地部;一天線單元,係於上述載板單元之介質體內設置一饋入導體、一輻射導體及一接地導體,該 饋入導體形成一分岔端,該輻射導體耦合該分岔端,該接地導體電性連接該饋入導體及上述載板單元之載板接地部;及至少一電路單元,係設置於上述載板單元之介質體外,並電性連接上述天線單元之饋入導體及接地導體;該饋入導體由一輸入端設於二饋入接地部之間,該輸入端電性連接該電路單元,該饋入導體之另一端分岔形成該分岔端,並具有一第一分支及一第二分支,該輻射導體由一耦合饋入端設於該第一分支及該第二分支之間,該耦合饋入端連接一輻射部,該輻射部連接一第一彎折部,該第一彎折部連接一第二彎折部,該第二彎折部電性連接一輻射接地部,該接地導體電性連接該饋入導體之饋入接地部、該載板單元之載板接地部及該電路單元。A package structure having an antenna, comprising: a carrier unit comprising a substrate, a dielectric body and a carrier grounding portion, the substrate is provided with the dielectric body and the grounding portion of the carrier; an antenna unit is a feeding conductor, a radiation conductor and a grounding conductor are disposed in the medium body of the carrier unit, The feed conductor is formed with a branch end, the radiation conductor is coupled to the branch end, the ground conductor is electrically connected to the feed conductor and the carrier ground portion of the carrier unit; and at least one circuit unit is disposed on the load The input unit is electrically connected to the circuit unit, and the input end is electrically connected to the circuit unit, and the input terminal is electrically connected to the circuit unit, and the input terminal is electrically connected to the circuit unit. The other end of the feed conductor is branched to form the branch end, and has a first branch and a second branch. The radiation conductor is disposed between the first branch and the second branch by a coupling feed end. The coupling portion is connected to a radiating portion, and the radiating portion is connected to a first bent portion. The first bent portion is connected to a second bent portion. The second bent portion is electrically connected to a radiating ground portion. The conductor is electrically connected to the feed ground portion of the feed conductor, the carrier ground portion of the carrier unit, and the circuit unit.
本發明之天線,係應用於封裝結構,該天線包含:一饋入導體,係由一輸入端設於二饋入接地部之間,該輸入端形成一分岔端;一輻射導體,係由一耦合饋入端耦合上述饋入導體之分岔端,該耦合饋入端連接一輻射部,該輻射部連接一第一彎折部,該第一彎折部連接一第二彎折部,該第二彎折部電性連接一輻射接地部,該接地導體電性連接該饋入導體之饋入接地部;及一接地導體,電性連接該饋入導體之饋入接地部。The antenna of the present invention is applied to a package structure, the antenna includes: a feed conductor disposed between an input end and a feed node, the input end forming a branch end; and a radiation conductor is a coupling feed end is coupled to the branch end of the feed conductor, the coupling feed end is connected to a radiation portion, the radiation portion is connected to a first bending portion, and the first bending portion is connected to a second bending portion. The second bent portion is electrically connected to a radiation ground portion electrically connected to the feed ground portion of the feed conductor; and a ground conductor electrically connected to the feed ground portion of the feed conductor.
其中,該饋入導體之分岔端形成一第一分支及一第二分支,該輻射導體之耦合饋入端設於該第一分支及該第二分支之間。The branching end of the feeding conductor forms a first branch and a second branch, and the coupling feed end of the radiation conductor is disposed between the first branch and the second branch.
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式,作詳細說明如下:本發明全文所述之「系統封裝」,係於一封裝體中整合通訊系統所需之元件,例如:電路單元、電子元件、天線及連接器等,係本發明所屬技術領域中具有通常知識者可以理解。The above and other objects, features and advantages of the present invention will become more <RTIgt; "Package" is a component required to integrate a communication system in a package, such as a circuit unit, an electronic component, an antenna, a connector, etc., as will be understood by those of ordinary skill in the art to which the present invention pertains.
本發明全文所述之「電路單元」,係指將電晶體、電容器、電阻器或其他電子元件及其間之連接線路,集積在半導體材料上或材料中,而具有電子電路功能之成品或半成品,係本發明所屬技術領域中具有通常知識者可以理解。The term "circuit unit" as used throughout the present invention refers to a finished product or a semi-finished product having an electronic circuit function, which is formed by assembling a transistor, a capacitor, a resistor or other electronic components and a connecting line therebetween, on a semiconductor material or in a material. It will be understood by those of ordinary skill in the art to which the present invention pertains.
本發明全文所述之「電子元件」,係指構成電子電路功能之元件,例如:電阻器、電容器、電感器、二極體或電晶體等,係本發明所屬技術領域中具有通常知識者可以理解。The "electronic component" as used throughout the present invention refers to an element constituting the function of an electronic circuit, such as a resistor, a capacitor, an inductor, a diode, or a transistor, etc., which is generally known in the art to which the present invention pertains. understanding.
本發明全文所述之「天線」,係指用以發射或接收無線電波之元件,係本發明所屬技術領域中具有通常知識者可以理解。The "antenna" as used throughout the present invention refers to an element for transmitting or receiving radio waves, as will be understood by those of ordinary skill in the art to which the present invention pertains.
本發明全文所述之「連接器」,係指連接於電路單元、電子元件及天線之間的導體或半導體,使電路單元、電子元件及天線之間可以傳遞電氣訊號,例如:導線架(Lead Frame)等,係本發明所屬技術領域中具有通常知識者可以理解。The term "connector" as used throughout the present invention refers to a conductor or semiconductor connected between a circuit unit, an electronic component, and an antenna, such that an electrical signal can be transmitted between the circuit unit, the electronic component, and the antenna, such as a lead frame (Lead). Frames and the like are understood by those of ordinary skill in the art to which the present invention pertains.
本發明全文所述之「耦合」(Coupling),係指電子元 件之間藉由電場、磁場或兩者混合,而作為能量轉換之方式,係本發明所屬技術領域中具有通常知識者可以理解。Coupling as used throughout the text of the present invention refers to an electron element The manner in which the components are mixed by an electric field, a magnetic field, or both, as an energy conversion, can be understood by those of ordinary skill in the art to which the present invention pertains.
本發明全文所述之「饋入」(Feeding),係指藉由有線或無線的方式提供能量給該電子元件,係本發明所屬技術領域中具有通常知識者可以理解。"Feeding" as used throughout this disclosure refers to the provision of energy to the electronic component by wire or wireless means, as will be understood by those of ordinary skill in the art to which the present invention pertains.
本發明全文所述之「耦合饋入」,係指數個電子元件之導體間,藉由無線傳輸以提供能量轉換,係本發明所屬技術領域中具有通常知識者可以理解。The "coupled feed" described throughout the present invention is an index of electronic components between conductors that are wirelessly transmitted to provide energy conversion, as will be understood by those of ordinary skill in the art to which the present invention pertains.
請參閱第2圖所示,其係本發明之具有天線之封裝結構較佳實施例的組合立體圖,該具有天線之封裝結構係包含一載板單元1、一天線單元2及至少一電路單元3,該天線單元2設置於該載板單元1內,且該天線單元2藉由連接導體(Via)V及導線(Bonding Wire)B電性連接該載板單元1,該電路單元3設置於該載板單元1之表面,且該電路單元3藉由連接導體V電性連接該天線單元2。為方便後續說明,該電路單元3之數量係以一個作為實施態樣,惟不以此為限。Referring to FIG. 2, which is a combined perspective view of a preferred embodiment of the package structure having an antenna according to the present invention, the package structure having the antenna includes a carrier unit 1, an antenna unit 2, and at least one circuit unit 3. The antenna unit 2 is disposed in the carrier unit 1, and the antenna unit 2 is electrically connected to the carrier unit 1 by a connecting conductor (Via) V and a bonding wire B. The circuit unit 3 is disposed on the antenna unit 3 The surface of the carrier unit 1 is electrically connected to the antenna unit 2 via a connecting conductor V. For the convenience of the following description, the number of the circuit unit 3 is one embodiment, but not limited thereto.
請再參閱第2圖所示,其中,該載板單元1係設有一基板11、一介質體12及一載板接地部13,該基板11係用以設置該介質體12及該載板接地部13;該介質體12內用以設置該天線單元2,且該介質體12外用以設置該電路單元3,並由數個連接導體V電性連接載板接地部13、該天線單元2及該電路單元3;該載板接地部13可以電性連接一接地線(圖未繪示),使該載板單元1實質接地。Please refer to FIG. 2 , wherein the carrier unit 1 is provided with a substrate 11 , a dielectric body 12 and a carrier grounding portion 13 for providing the dielectric body 12 and the carrier grounding. The antenna unit 2 is disposed in the dielectric body 12, and the circuit unit 3 is disposed outside the dielectric body 12, and the carrier grounding portion 13, the antenna unit 2, and the connecting unit V are electrically connected The circuit board unit 3 is electrically connected to a grounding wire (not shown) to substantially ground the carrier unit 1.
請參閱第3圖所示,其係本發明之具有天線之封裝結 構較佳實施例的側面剖視圖,該基板11係由陶瓷基板(ceramic board)或層壓板(laminate)或玻璃基板(glass substrate)等構成,用以設置該介質體12及該載板接地部13。其中,該基板11設置該介質體12及該載板接地部13之區域可以相互重疊或鄰接,該二設置區域較佳鄰接於該基板11之一表面111,使該基板11具有較佳接地效果,惟不以此為限。該介質體12係以一第一介質層121依序疊合一第二介質層122及一第三介質層123作為實施態樣說明,用以設置該天線單元2,使該天線單元2設於該第一介質層121、一第二介質層122及一第三介質層123之間,惟不以此為限。詳言之,該第一介質層121係由絕緣材料構成,例如:玻璃材質及二氧化矽(SiO2)等,該第一介質層121具有相對二表面,其中一表面設於該基板11之表面111,另一表面用以承載第二介質層122及該天線單元2之一構件(如第3圖所示之接地導體23),使該第一介質層121位於該基板11及該天線單元2之間,而使該基板11與該天線單元2形成電性絕緣。該第二介質層122係由polyimide(聚亞醯胺)材料構成,該第二介質層122設於該第一介質層121,且覆蓋該天線單元2之接地導體23,使該接地導體23設置於該第二介質層122與該第一介質層121之間;且該第二介質層122用以承載該第三介質層123及該天線單元2之另二構件(如第3圖所示之饋入導體21及輻射導體22)。該第三介質層123係由polyimide(聚亞醯胺)材料構成,該第三介質層123設置於該第二介質層122,且覆蓋該天線單元2之饋入導體21及輻射導體22, 使該饋入導體21及該輻射導體22設置於該第三介質層123與該第一介質層121之間,且該第三介質層123用以承載該電路單元3。Please refer to FIG. 3, which is a package junction of the present invention with an antenna. A side cross-sectional view of a preferred embodiment, the substrate 11 is formed of a ceramic board or a laminate or a glass substrate for arranging the dielectric body 12 and the carrier ground portion 13 . The area of the substrate 11 on which the dielectric body 12 and the carrier ground portion 13 are disposed may overlap or be adjacent to each other. The two disposed regions are preferably adjacent to a surface 111 of the substrate 11, so that the substrate 11 has a better grounding effect. , but not limited to this. The dielectric body 12 is formed by sequentially stacking a second dielectric layer 122 and a third dielectric layer 123 in a first dielectric layer 121 as an embodiment for setting the antenna unit 2 such that the antenna unit 2 is disposed on the antenna unit 2 The first dielectric layer 121, the second dielectric layer 122, and the third dielectric layer 123 are not limited thereto. In detail, the first dielectric layer 121 is made of an insulating material, such as a glass material and cerium oxide (SiO2). The first dielectric layer 121 has opposite surfaces, and a surface is disposed on the surface of the substrate 11. The other surface is used to carry the second dielectric layer 122 and one of the antenna elements 2 (such as the ground conductor 23 shown in FIG. 3 ), so that the first dielectric layer 121 is located on the substrate 11 and the antenna unit 2 . The substrate 11 is electrically insulated from the antenna unit 2 therebetween. The second dielectric layer 122 is made of a polyimide material. The second dielectric layer 122 is disposed on the first dielectric layer 121 and covers the ground conductor 23 of the antenna unit 2, so that the ground conductor 23 is disposed. Between the second dielectric layer 122 and the first dielectric layer 121; and the second dielectric layer 122 is used to carry the third dielectric layer 123 and the other two components of the antenna unit 2 (as shown in FIG. 3) The conductor 21 and the radiation conductor 22) are fed. The third dielectric layer 123 is made of a polyimide material, and the third dielectric layer 123 is disposed on the second dielectric layer 122 and covers the feed conductor 21 and the radiation conductor 22 of the antenna unit 2, The feed conductor 21 and the radiation conductor 22 are disposed between the third dielectric layer 123 and the first dielectric layer 121, and the third dielectric layer 123 is used to carry the circuit unit 3.
請參閱第4圖所示,其係本發明具有天線之封裝結構較佳實施例之連接導體V的示意圖,在此實施例中,該連接導體V係以至少一第一連接導體V1、數個第二連接導體V2及數個第三連接導體V3作為實施態樣說明,惟不以此為限,該第一連接導體V1設置於該第三介質層123,用以電性連接該天線單元2及該電路單元3,供該天線單元2及該電路單元3之間傳遞訊號;該第二連接導體V2設置於該第二介質層122及該第三介質層123,用以電性連接該天線單元2及該電路單元3,使該天線單元2及該電路單元3之接地部位互相連接;請再參閱第2及3圖所示,該第三連接導體V3設置於該第二介質層122及該第三介質層123,用以電性連接該天線單元2及數個導線B,該導線B電性連接該載板接地部13,使該載板單元1、該天線單元2及該電路單元3共同接地。Referring to FIG. 4, it is a schematic diagram of a connecting conductor V of a preferred embodiment of the package structure of the antenna of the present invention. In this embodiment, the connecting conductor V is formed by at least one first connecting conductor V1 and several The second connecting conductor V2 and the plurality of third connecting conductors V3 are described as an embodiment, but the first connecting conductor V1 is disposed on the third dielectric layer 123 for electrically connecting the antenna unit 2 And the circuit unit 3 is configured to transmit a signal between the antenna unit 2 and the circuit unit 3; the second connecting conductor V2 is disposed on the second dielectric layer 122 and the third dielectric layer 123 for electrically connecting the antenna The unit 2 and the circuit unit 3 connect the antenna unit 2 and the grounding portion of the circuit unit 3 to each other; as shown in FIGS. 2 and 3, the third connecting conductor V3 is disposed on the second dielectric layer 122 and The third dielectric layer 123 is electrically connected to the antenna unit 2 and the plurality of wires B. The wire B is electrically connected to the carrier ground portion 13 to enable the carrier unit 1, the antenna unit 2 and the circuit unit. 3 common grounding.
請參閱第2及5圖所示,第5圖係本發明具有天線之封裝結構較佳實施例的部份放大上視圖,其中,該天線單元2係由導體形成一耦合饋入環形天線,包含該饋入導體21、該輻射導體22及該接地導體23,該饋入導體21藉由該第一連接導體V1電性連接該電路單元3(如第4圖所示);該輻射導體22耦合該饋入導體21,使該電路單元3之訊號饋入該輻射導體22,再由該輻射導體22收發無線訊號,且該輻射導體22電性連接該饋入導體21,而形成該 耦合饋入環形天線,其中,該輻射導體22之介電係數值可用以調整該天線單元2之操作頻帶;該接地導體23藉由該第二連接導體V2電性連接該饋入導體21及該電路單元3(如第4圖所示),藉由該第三連接導體V3,使該接地導體23能夠以導線B電性連接該載板單元1之載板接地部13。其中,藉由印刷或蝕刻彎曲圖形技術,可以使該饋入導體21、該輻射導體22及該接地導體23形成於該載板單元1內,且該饋入導體21、該輻射導體22及該接地導體23可設置於同一平面或不同平面。Referring to FIGS. 2 and 5, FIG. 5 is a partially enlarged top plan view of a preferred embodiment of the package structure of the present invention, wherein the antenna unit 2 is formed by a conductor and coupled to a loop antenna, including The feed conductor 21, the radiation conductor 22 and the ground conductor 23, the feed conductor 21 is electrically connected to the circuit unit 3 by the first connection conductor V1 (as shown in FIG. 4); the radiation conductor 22 is coupled The feeding conductor 21 feeds the signal of the circuit unit 3 into the radiation conductor 22, and then the radiation conductor 22 transmits and receives a wireless signal, and the radiation conductor 22 is electrically connected to the feeding conductor 21 to form the conductor Coupling the feed-in loop antenna, wherein the value of the dielectric constant of the radiation conductor 22 can be used to adjust the operating frequency band of the antenna unit 2; the ground conductor 23 is electrically connected to the feed conductor 21 by the second connecting conductor V2 and the The circuit unit 3 (shown in FIG. 4) is configured to electrically connect the ground conductor 23 to the carrier ground portion 13 of the carrier unit 1 by the wire B via the third connecting conductor V3. The feed conductor 21, the radiation conductor 22 and the ground conductor 23 can be formed in the carrier unit 1 by printing or etching a curved pattern technique, and the feed conductor 21, the radiation conductor 22 and the The ground conductors 23 may be disposed on the same plane or in different planes.
在此實施例中,請參閱第5及6圖所示,第6圖係本發明具有天線之封裝結構較佳實施例的天線單元2之部分放大上視圖,其中,該饋入導體21係由一輸入端211設於二饋入接地部212之間,且該輸入端211電性連接該電路單元3,用以傳導該電路單元3之訊號,該饋入導體21另包含一分岔端,該分岔端分岔形成一第一分支213及一第二分支214,其中,該第二分支214之長度L2與該天線單元2之阻抗有關,使該長度L2能夠用於調整該天線單元2之操作頻帶。該輻射導體22係由一耦合饋入端221設置於該饋入導體21之第一分支213及第二分支214之間,該耦合饋入端221分別與該第一分支213及該第二分支214電性隔離,用以使該輻射導體22耦合該饋入導體21,而饋入該電路單元3之訊號,該耦合饋入端221之另一端連接一輻射部222;該輻射部222與該第二分支214之間距G可用於調整該天線單元2之操作頻帶,該間距G需小於16微米,該間距G較佳為15微米,用以提供適當的容抗或 感抗,作為該天線單元2之虛部阻抗的補償,而達到阻抗匹配之功效,且該輻射部222連接一第一彎折部223之一端;該第一彎折部223迂迴彎折而形成一第一折段2231、一第二折段2232及一第三折段2233,該第一折段2231平行該第二折段2232及該第三折段2233,該第一彎折部223之另一端連接一第二彎折部224之一端;該第二彎折部224迂迴彎折而形成一第四折段2241、一第五折段2242及一第六折段2243,該第四折段2241、該第五折段2242及該第六折段2243彎折形成ㄇ形,該第二彎折部224之另一端連接一輻射接地部225;該輻射接地部225電性連接該饋入導體21之饋入接地部212a,而使該天線單元2形成一環形天線。該接地導體23電性連接該饋入接地部212a、該載板單元1之載板接地部13及該電路單元3。舉例而言,若設定該第一分支213之長度L1為2.45毫米(mm),該輻射部222之寬度W1為1.2毫米,該第一折段2231與該輻射部222之寬度W2為2毫米,該第一折段2231之長度L3為2.8毫米,該第一折段2231與該第二折段2232之寬度W3為0.7毫米,該第二折段2232之長度L4為2.3毫米,該第三折段2233之長度L5為3.8毫米,該第四折段2241之長度L6為4.7毫米,該第五折段2242之長度L7為0.6毫米,該第六折段2243之長度L8為1.3毫米,則該天線單元2僅需3.8×4.2平方毫米(mm2 ),即可達成收發無線電波之功能。In this embodiment, referring to FIGS. 5 and 6, FIG. 6 is a partially enlarged top view of the antenna unit 2 of the preferred embodiment of the package structure of the present invention, wherein the feed conductor 21 is composed of An input terminal 211 is disposed between the two feeding portions 212, and the input terminal 211 is electrically connected to the circuit unit 3 for transmitting the signal of the circuit unit 3. The feeding conductor 21 further includes a branching end. The branch end branches form a first branch 213 and a second branch 214, wherein the length L2 of the second branch 214 is related to the impedance of the antenna unit 2, so that the length L2 can be used to adjust the antenna unit 2 Operating band. The radiation conductor 22 is disposed between the first branch 213 and the second branch 214 of the feed conductor 21 by a coupling feed end 221, and the coupling feed end 221 and the first branch 213 and the second branch respectively 214 is electrically isolated for coupling the radiation conductor 22 to the feed conductor 21 and feeding the signal of the circuit unit 3, and the other end of the coupling feed end 221 is connected to a radiation portion 222; the radiation portion 222 and the The distance G between the second branches 214 can be used to adjust the operating frequency band of the antenna unit 2, the spacing G needs to be less than 16 micrometers, and the spacing G is preferably 15 micrometers to provide appropriate capacitive reactance or inductive reactance as the antenna unit. The imaginary part of the impedance is compensated to achieve the effect of the impedance matching, and the radiating portion 222 is connected to one end of the first bent portion 223; the first bent portion 223 is bent back to form a first folded portion 2231. a second folding portion 2232 and a third folding portion 2233. The first folding portion 2231 is parallel to the second folding portion 2232 and the third folding portion 2233. The other end of the first bending portion 223 is connected to a second bending portion. One end of the folded portion 224; the second bent portion 224 is bent back to form a fourth folded portion 2241, a fifth a folding section 2242 and a sixth folding section 2243. The fourth folding section 2241, the fifth folding section 2242 and the sixth folding section 2243 are bent to form a dome shape, and the other end of the second bending part 224 is connected to a radiation. The grounding portion 225 is electrically connected to the feeding ground portion 212a of the feeding conductor 21, so that the antenna unit 2 forms a loop antenna. The ground conductor 23 is electrically connected to the feed ground portion 212a, the carrier ground portion 13 of the carrier unit 1, and the circuit unit 3. For example, if the length L1 of the first branch 213 is set to 2.45 millimeters (mm), the width W1 of the radiating portion 222 is 1.2 mm, and the width W2 of the first folded portion 2231 and the radiating portion 222 is 2 mm. The length L3 of the first folding portion 2231 is 2.8 mm, the width W3 of the first folding portion 2231 and the second folding portion 2232 is 0.7 mm, and the length L4 of the second folding portion 2232 is 2.3 mm. The length L5 of the segment 2233 is 3.8 mm, the length L6 of the fourth folding segment 2241 is 4.7 mm, the length L7 of the fifth folding segment 2242 is 0.6 mm, and the length L8 of the sixth folding segment 2243 is 1.3 mm. The antenna unit 2 only needs 3.8 × 4.2 mm 2 (mm 2 ), and the function of transmitting and receiving radio waves can be achieved.
請再參閱第3及4圖所示,該電路單元3包含一訊號腳位31及數個接地腳位32,該訊號腳位31及該接地腳位 32可以直接設置於該介質體12之第三介質層123,或藉由數個墊片(PAD)P設置於該第三介質層123,該訊號腳位31藉由該第一連接導體V1電性連接該天線單元2之饋入導體21,並傳送訊號至該饋入導體21,使訊號耦合至該天線單元2之輻射導體22;該接地腳位32藉由該第二連接導體V2電性連接該天線單元2之接地導體23。Please refer to FIGS. 3 and 4 again. The circuit unit 3 includes a signal pin 31 and a plurality of ground pins 32. The signal pin 31 and the ground pin are provided. 32 can be directly disposed on the third dielectric layer 123 of the dielectric body 12, or disposed on the third dielectric layer 123 by a plurality of pads (PAD) P, and the signal pin 31 is electrically connected by the first connecting conductor V1 The feed conductor 21 of the antenna unit 2 is connected to the feed conductor 21, and the signal is transmitted to the feed conductor 21 to couple the signal to the radiation conductor 22 of the antenna unit 2; the ground pin 32 is electrically connected by the second connection conductor V2. The ground conductor 23 of the antenna unit 2 is connected.
此外,該具有天線之封裝結構還可以包含一封裝殼(圖未繪示),該封裝殼設置於該載板單元1,使該載板單元1與該封裝殼可以封裝該天線單元2及該電路單元3。In addition, the package structure with the antenna may further include a package shell (not shown), the package shell is disposed on the carrier unit 1, so that the carrier unit 1 and the package shell can encapsulate the antenna unit 2 and the package unit Circuit unit 3.
請再參閱第3、4及5圖所示,本發明之具有天線之封裝結構使用時,係由該電路單元3之訊號腳位31傳送訊號至該天線單元2之饋入導體21,該饋入導體21將訊號耦合至該天線單元2之輻射導體22,並由該輻射導體22形成無線電波傳送出去;或由該輻射導體22接收無線電波,並耦合至該饋入導體21,該電路單元3再由該饋入導體21接收訊號。其中,該饋入導體21及該輻射導體22形成一環形天線,使該天線單元2之電流路徑較集中於該環形天線,而不易對該天線單元2周圍之電子元件運作產生干擾。Referring to FIG. 3, FIG. 4 and FIG. 5, when the package structure with an antenna of the present invention is used, the signal is transmitted from the signal pin 31 of the circuit unit 3 to the feed conductor 21 of the antenna unit 2, and the feed is The incoming conductor 21 couples a signal to the radiating conductor 22 of the antenna unit 2 and is formed by the radiating conductor 22 to form a radio wave; or receives radio waves from the radiating conductor 22 and is coupled to the feed conductor 21, the circuit unit 3 The signal is received by the feed conductor 21. The feed conductor 21 and the radiation conductor 22 form a loop antenna, so that the current path of the antenna unit 2 is concentrated on the loop antenna, and the operation of the electronic components around the antenna unit 2 is not easily interfered.
請參閱第7圖所示,其係本發明具有天線之封裝結構的天線單元2之頻率響應圖,其中,當該饋入導體21之第二分支214之長度L2為0.2毫米、0.7毫米、1.2毫米及1.7毫米時,該天線單元2之頻率響應曲線分別為C1、C2、C3及C4,由頻率響應曲線C1、C2、C3及C4可得知,本發明之天線單元2可適用於IEEE 802.11 b/g,且該天線 單元2之操作頻率可藉由該第二分支214之長度L2進行調整,無需改變該天線單元2之結構,亦不需額外使用匹配電路,因此,可降低該天線單元2之結構複雜度。Referring to FIG. 7, which is a frequency response diagram of the antenna unit 2 having the antenna package structure of the present invention, wherein the length L2 of the second branch 214 of the feed conductor 21 is 0.2 mm, 0.7 mm, 1.2. The millimeter and 1.7 mm, the frequency response curves of the antenna unit 2 are C1, C2, C3 and C4, respectively. It can be known from the frequency response curves C1, C2, C3 and C4 that the antenna unit 2 of the present invention can be applied to IEEE 802.11. b/g, and the antenna The operating frequency of the unit 2 can be adjusted by the length L2 of the second branch 214 without changing the structure of the antenna unit 2, and no additional matching circuit is needed. Therefore, the structural complexity of the antenna unit 2 can be reduced.
請參閱第8圖所示,其係本發明具有天線之封裝結構較佳實施例的天線單元之反射係數圖,其中,S11 參數為-10dB的頻率點F1及F2分別為2.125GHz及2.695GHz,且頻率點F1及F2之間的反射係數值皆小於-10dB。一般而言,該天線單元2的反射係數值越小,代表有較多的功率被該天線單元2所接收,也就是該天線單元2的阻抗匹配越好,其中,S11 小於-10dB代表90%以上功率被接收,故習知天線的反射係數值大部份都以-10dB作為判斷基準,供使用者判斷天線之效能是否良好。,因此,本發明之天線單元2具有反射係數佳及阻抗匹配佳之功效。See Figure 8, which system has a reflection coefficient of the present invention is an antenna unit of FIG package structure of the preferred embodiment of the antenna, wherein, S 11 parameter of frequencies F1 and F2 -10dB respectively 2.125GHz and 2.695GHz And the reflection coefficient values between the frequency points F1 and F2 are all less than -10 dB. In general, the smaller the reflection coefficient value of the antenna unit 2, the more power is received by the antenna unit 2, that is, the impedance matching of the antenna unit 2 is better, wherein S 11 is less than -10 dB representing 90. More than % of the power is received. Therefore, most of the reflection coefficient values of the conventional antenna are based on -10 dB as a criterion for the user to judge whether the performance of the antenna is good. Therefore, the antenna unit 2 of the present invention has the effects of good reflection coefficient and good impedance matching.
請參閱第9圖所示,其係本發明具有天線之封裝結構較佳實施例的天線單元之增益及輻射效率圖,其中,該天線單元2之峰值增益曲線C5顯示本發明之峰值增益值大於1.5dBi,因此,本發明之具有天線之封裝結構具有峰值增益值高之功效。另,由於峰值增益與輻射效率成正比,有較高的峰值增益值會具有較高的輻射效率,由該天線單元2之輻射效率曲線C6顯示本發明之輻射效率約為80%,因此,本發明之具有天線之封裝結構具有輻射效率高之功效。Referring to FIG. 9, which is a gain and radiation efficiency diagram of an antenna unit having a preferred embodiment of the antenna package structure of the present invention, wherein the peak gain curve C5 of the antenna unit 2 indicates that the peak gain value of the present invention is greater than 1.5dBi, therefore, the package structure with an antenna of the present invention has a high peak gain value. In addition, since the peak gain is proportional to the radiation efficiency, a higher peak gain value has a higher radiation efficiency, and the radiation efficiency curve C6 of the antenna unit 2 shows that the radiation efficiency of the present invention is about 80%, therefore, The inventive package structure with an antenna has the effect of high radiation efficiency.
本發明之具有天線之封裝結構,係藉由該天線單元2設置於該介質體12之第一介質層121、第二介質層122及第三介質層123之間,且該天線單元2所需面積僅需 3.8×4.2平方毫米,因此,本發明之具有天線之封裝結構可將該天線單元2設置於該載板單元1內,而達成不佔空間之功效。The antenna structure of the present invention is disposed between the first dielectric layer 121, the second dielectric layer 122, and the third dielectric layer 123 of the dielectric body 12, and the antenna unit 2 is required. Area only needs 3.8 × 4.2 mm 2 , therefore, the package structure with an antenna of the present invention can set the antenna unit 2 in the carrier unit 1 to achieve the effect of not occupying space.
本發明之具有天線之封裝結構,係藉由該饋入導體21之第二分支214之長度L2變化,而調整該天線單元2之操作頻率,並不需要外接匹配電路,即可調諧訊號頻率,因此,本發明之具有天線之封裝結構無需改變該天線單元2之結構,亦不需外加匹配電路,而具有降低結構複雜度之功效。The package structure with the antenna of the present invention adjusts the operating frequency of the antenna unit 2 by changing the length L2 of the second branch 214 of the feed conductor 21, and the signal frequency can be tuned without an external matching circuit. Therefore, the package structure with the antenna of the present invention does not need to change the structure of the antenna unit 2, and does not need to add a matching circuit, but has the effect of reducing the structural complexity.
本發明之具有天線之封裝結構,係藉由該饋入導體21之第二分支214之長度L2變化,及,而調整該天線單元2之操作頻率,並不需要外接匹配電路,即可調諧訊號頻率,因此,本發明之具有天線之封裝結構不需匹配電路,而具有降低結構複雜度之功效。The package structure with the antenna of the present invention is adjusted by the length L2 of the second branch 214 of the feed conductor 21, and the operating frequency of the antenna unit 2 is adjusted, and the external matching circuit is not needed to tune the signal. The frequency, therefore, the package structure with the antenna of the present invention does not require a matching circuit, but has the effect of reducing the structural complexity.
本發明之天線,係由該天線單元2之饋入導體21形成該分岔端(即該第一分支213及該第二分支214),且該輻射導體22之耦合饋入端221耦合該分岔端,而將該電路單元3之訊號饋入該輻射導體22,且可由該第二分支214之長度L2變化,而調整該天線單元2之操作頻率,因此,本發明之天線應用於系統封裝結構時,不僅具有使系統封裝結構縮小體積之功效,並具有不需匹配電路之功效。The antenna of the present invention is formed by the feed conductor 21 of the antenna unit 2 to form the branch end (ie, the first branch 213 and the second branch 214), and the coupling feed end 221 of the radiation conductor 22 couples the branch. At the end, the signal of the circuit unit 3 is fed into the radiation conductor 22, and the operating frequency of the antenna unit 2 can be adjusted by the length L2 of the second branch 214. Therefore, the antenna of the present invention is applied to the system package. The structure not only has the effect of reducing the volume of the system package structure, but also has the effect of not requiring a matching circuit.
雖然本發明已利用上述較佳實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附 之申請專利範圍所界定者為準。While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of protection of the present invention is attached The scope of the patent application is subject to change.
1‧‧‧載板單元1‧‧‧ Carrier Unit
11‧‧‧基板11‧‧‧Substrate
111‧‧‧表面111‧‧‧ surface
12‧‧‧介質體12‧‧‧Media body
121‧‧‧第一介質層121‧‧‧First dielectric layer
122‧‧‧第二介質層122‧‧‧Second dielectric layer
123‧‧‧第三介質層123‧‧‧ third dielectric layer
13‧‧‧載板接地部13‧‧‧ Carrier board grounding
2‧‧‧天線單元2‧‧‧Antenna unit
21‧‧‧饋入導體21‧‧‧Feed conductor
211‧‧‧輸入端211‧‧‧ input
212,212a‧‧‧饋入接地部212, 212a‧‧‧Feed in the grounding
213‧‧‧第一分支213‧‧‧First branch
214‧‧‧第二分支214‧‧‧Second branch
22‧‧‧輻射導體22‧‧‧radiation conductor
221‧‧‧耦合饋入端221‧‧‧coupled feed end
222‧‧‧輻射部222‧‧‧ Radiation Department
223‧‧‧第一彎折部223‧‧‧First bend
2231‧‧‧第一折段2231‧‧‧ first fold
2232‧‧‧第二折段2232‧‧‧second fold
2233‧‧‧第三折段2233‧‧‧ third fold
224‧‧‧第二彎折部224‧‧‧Second bend
2241‧‧‧第四折段2241‧‧‧ fourth fold
2242‧‧‧第五折段2242‧‧‧5th fold
2243‧‧‧第六折段2243‧‧‧6th fold
225‧‧‧輻射接地部225‧‧‧radiation grounding
23‧‧‧接地導體23‧‧‧ Grounding conductor
3‧‧‧電路單元3‧‧‧ circuit unit
31‧‧‧訊號腳位31‧‧‧Signal pin
32‧‧‧接地腳位32‧‧‧ Grounding feet
B‧‧‧導線B‧‧‧Wire
C1至C4‧‧‧頻率響應曲線C1 to C4‧‧‧ frequency response curve
C5‧‧‧峰值增益曲線C5‧‧‧ peak gain curve
C6‧‧‧輻射效率曲線C6‧‧‧radiation efficiency curve
F1‧‧‧頻率點F1‧‧‧ frequency point
F2‧‧‧頻率點F2‧‧‧ frequency point
G‧‧‧間距G‧‧‧ spacing
L1至L7‧‧‧長度L1 to L7‧‧‧ length
P‧‧‧墊片P‧‧‧shims
V‧‧‧連接導體V‧‧‧Connecting conductor
V1‧‧‧第一連接導體V1‧‧‧First connecting conductor
V2‧‧‧第二連接導體V2‧‧‧Second connection conductor
V3‧‧‧第三連接導體V3‧‧‧ third connecting conductor
W1,W2‧‧‧寬度W1, W2‧‧‧ width
9‧‧‧習知具有天線之封裝結構9‧‧‧Issue has an antenna package structure
91‧‧‧多層印刷電路組裝91‧‧‧Multilayer printed circuit assembly
92,93‧‧‧導電構件92,93‧‧‧Electrical components
94‧‧‧電子組件94‧‧‧Electronic components
第1圖:習知具有天線之封裝結構示意圖。Figure 1: Schematic diagram of a package structure with an antenna.
第2圖:本發明具有天線之封裝結構較佳實施例之示意圖。Fig. 2 is a schematic view showing a preferred embodiment of the package structure of the antenna of the present invention.
第3圖:本發明具有天線之封裝結構較佳實施例的側面剖視圖。Figure 3 is a side cross-sectional view showing a preferred embodiment of the package structure of the present invention.
第4圖:本發明具有天線之封裝結構較佳實施例之連接導體的示意圖。Fig. 4 is a schematic view showing a connecting conductor of a preferred embodiment of the package structure of the antenna of the present invention.
第5圖:本發明具有天線之封裝結構較佳實施例的部份放大上視圖。Figure 5 is a partially enlarged top plan view of a preferred embodiment of the package structure of the present invention.
第6圖:本發明具有天線之封裝結構較佳實施例的天線單元之部分放大上視圖。Figure 6 is a partially enlarged top plan view of an antenna unit of the preferred embodiment of the package structure of the present invention.
第7圖:本發明具有天線之封裝結構較佳實施例的天線單元之頻率響應圖。Figure 7 is a diagram showing the frequency response of the antenna unit of the preferred embodiment of the package structure of the antenna of the present invention.
第8圖:本發明具有天線之封裝結構較佳實施例的天線單元之操作頻率的反射係數圖。Figure 8 is a graph showing the reflection coefficient of the operating frequency of the antenna unit of the preferred embodiment of the package structure of the antenna of the present invention.
第9圖:本發明具有天線之封裝結構較佳實施例的天線單元之操作頻率的增益及輻射效率圖。Figure 9 is a graph showing the gain and radiation efficiency of the operating frequency of the antenna unit of the preferred embodiment of the package structure of the antenna of the present invention.
1...載板單元1. . . Carrier unit
11...基板11. . . Substrate
12...介質體12. . . Medium body
13...載板接地部13. . . Carrier grounding
2...天線單元2. . . Antenna unit
21...饋入導體twenty one. . . Feed conductor
22...輻射導體twenty two. . . Radiation conductor
23...接地導體twenty three. . . Grounding conductor
3...電路單元3. . . Circuit unit
B...導線B. . . wire
V...連接導體V. . . Connecting conductor
V1...第一連接導體V1. . . First connecting conductor
V2...第二連接導體V2. . . Second connecting conductor
V3...第三連接導體V3. . . Third connecting conductor
Claims (12)
Priority Applications (1)
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TW100123577A TWI492448B (en) | 2011-07-04 | 2011-07-04 | A packaging structure with an antenna and antenna thereof |
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TW100123577A TWI492448B (en) | 2011-07-04 | 2011-07-04 | A packaging structure with an antenna and antenna thereof |
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TWI492448B true TWI492448B (en) | 2015-07-11 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI257193B (en) * | 2005-08-25 | 2006-06-21 | Compal Communications Inc | An elevated patch antenna |
US20080129630A1 (en) * | 2002-09-10 | 2008-06-05 | Carles Puente Baliarda | Coupled multiband antennas |
US20080159364A1 (en) * | 2006-12-29 | 2008-07-03 | Broadcom Corporation, A California Corporation | IC antenna structures and applications thereof |
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US20080129630A1 (en) * | 2002-09-10 | 2008-06-05 | Carles Puente Baliarda | Coupled multiband antennas |
TWI257193B (en) * | 2005-08-25 | 2006-06-21 | Compal Communications Inc | An elevated patch antenna |
US20080159364A1 (en) * | 2006-12-29 | 2008-07-03 | Broadcom Corporation, A California Corporation | IC antenna structures and applications thereof |
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