TWI491894B - A inter-stage test structure for a wireless communication apparatus - Google Patents
A inter-stage test structure for a wireless communication apparatus Download PDFInfo
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Description
本發明提供一種級間測試裝置，且特別是關於一種無線通訊裝置的級間測試裝置，用於測試無線通訊裝置中元件的狀況之級間測試裝置。The present invention provides an inter-stage test apparatus, and more particularly to an inter-stage test apparatus for a wireless communication apparatus for testing an inter-stage test apparatus for the condition of components in a wireless communication apparatus.
無線通訊(wireless communication)就目前的技術而言已成為了一種行動化產品的設計趨勢。無線通訊元件一般為設置於系統晶片(System on Chip，簡稱SoC)中，使得系統晶片可以將無線通訊元件的電路加以微型化和模組化，並整合所需的功能元件於單顆晶片中，而形成無線通訊裝置，以符合現今行動化產品的需求。Wireless communication has become a design trend for mobile products in terms of current technology. The wireless communication component is generally disposed in a system on chip (SoC), so that the system chip can miniaturize and modularize the circuit of the wireless communication component, and integrate the required functional components into a single chip. The wireless communication device is formed to meet the needs of today's mobile products.
然而，由於無線通訊裝置中的功能元件眾多，若無線通訊裝置中有某個功能元件有瑕疵，一般檢測儀器不容易偵測到哪個功能元件有瑕疵。為了確保無線通訊裝置的功能正常，習知若發現無線通訊裝置效能不佳或某個功能元件有瑕疵時，即丟棄整個系統晶片，實屬浪費。However, due to the large number of functional components in the wireless communication device, if a certain functional component is defective in the wireless communication device, it is generally not easy for the detection device to detect which functional component is defective. In order to ensure the function of the wireless communication device is normal, it is a waste to discard the entire system chip if it is found that the wireless communication device is not performing well or a certain functional component is defective.
有鑒於此，本發明提供一種無線通訊裝置的級間測試裝置。所述級間測試裝置可偵測到無線通訊裝置中元件的狀況，並在級 間測試裝置偵測到有瑕疵或毀損的元件時作更換。藉此，使用者僅需更換無線通訊裝置中有瑕疵或毀損的元件而不需要丟棄整個無線通訊裝置，將可使製造成本大幅的降低。In view of this, the present invention provides an inter-stage test apparatus for a wireless communication device. The inter-stage test device can detect the condition of components in the wireless communication device and is at the level The inter-test device is replaced when it detects a defective or damaged component. Thereby, the user only needs to replace the defective or damaged components in the wireless communication device without discarding the entire wireless communication device, which will greatly reduce the manufacturing cost.
本發明實施例提供一種無線通訊裝置的級間測試裝置。無線通訊裝置上設有一待測元件、一上接地線、一信號線、一下接地線、以及一下級元件。待測元件是分別透過上接地線、信號線、下接地線電連接下級元件。級間測試裝置包含上板、下板、以及中介層。下板之第一接地極透過上接地線電連接待測元件之第一接地端及下級元件之第三接地端。下板之下板信號極透過信號線電連接待測元件之待測信號端及下級元件之下級信號端。以及下板之第二接地極透過下接地線電連接待測元件之第二接地端及下級元件之第四接地端。中介層設於上板以及下板之間。中介層包含第一區塊以及第二區塊，且第一區塊為鄰近第二區塊。第一區塊具有空氣腔，且空氣腔係接觸下板，以產生固定的空氣阻抗。而第二區塊則具有阻抗調節腔，且阻抗調節腔係接觸下板。其中，阻抗調節腔中具有導電膠、接地板、基板層、以及金屬板。導電膠設於下板上，用以將接地板電連接第一接地極以及第二接地極。導電膠上依序疊設有接地板、基板層、以及金屬板。基板層具有一預定厚度，以根據預定厚度產生調節阻抗。Embodiments of the present invention provide an inter-stage test apparatus for a wireless communication device. The wireless communication device is provided with a component to be tested, an upper grounding wire, a signal wire, a lower grounding wire, and a lower-level component. The components to be tested are electrically connected to the lower-level components through the upper grounding wire, the signal wire, and the lower grounding wire, respectively. The interstage test device includes an upper plate, a lower plate, and an interposer. The first grounding pole of the lower board is electrically connected to the first grounding end of the device to be tested and the third grounding end of the lower component through the upper grounding wire. The signal signal of the lower board is electrically connected to the signal end of the device to be tested and the signal signal of the lower level of the lower element through the signal line. And the second grounding pole of the lower board is electrically connected to the second grounding end of the device to be tested and the fourth grounding end of the lower component through the lower grounding wire. The interposer is disposed between the upper plate and the lower plate. The interposer includes a first block and a second block, and the first block is adjacent to the second block. The first block has an air cavity and the air cavity contacts the lower plate to create a fixed air impedance. The second block has an impedance adjustment cavity, and the impedance adjustment cavity contacts the lower plate. The impedance adjustment cavity has a conductive paste, a ground plate, a substrate layer, and a metal plate. The conductive paste is disposed on the lower plate to electrically connect the ground plate to the first ground electrode and the second ground electrode. A grounding plate, a substrate layer, and a metal plate are sequentially stacked on the conductive paste. The substrate layer has a predetermined thickness to produce an adjusted impedance according to a predetermined thickness.
綜合以上所述，本發明實施例所提供的無線通訊裝置的級間測試裝置可根據空氣阻抗以及調節阻抗之間的阻抗比來偵測無線通訊裝置中待測元件的狀況。In summary, the inter-stage test device of the wireless communication device provided by the embodiment of the present invention can detect the condition of the device to be tested in the wireless communication device according to the impedance ratio between the air impedance and the adjusted impedance.
為使能更進一步瞭解本創作之特徵及技術內容，請參閱以下有關本創作之詳細說明與附圖，但是此等說明與所附圖式僅係用來說明本創作，而非對本創作的權利範圍作任何的限制。In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of this creation, but these descriptions and drawings are only used to illustrate this creation, not the right to this creation. The scope is subject to any restrictions.
10‧‧‧無線通訊裝置10‧‧‧Wireless communication device
20‧‧‧待測元件20‧‧‧Device under test
30‧‧‧下級元件30‧‧‧Subordinate components
38‧‧‧上接地線38‧‧‧Upper grounding wire
40‧‧‧信號線40‧‧‧ signal line
42‧‧‧下接地線42‧‧‧Under the grounding wire
50‧‧‧量測裝置50‧‧‧Measurement device
55‧‧‧探測元件55‧‧‧Detecting components
55a‧‧‧上接地探針55a‧‧‧ Grounding probe
55b‧‧‧信號探針55b‧‧‧Signal probe
55c‧‧‧下接地探針55c‧‧‧ Grounding probe
100、200‧‧‧級間測試裝置100, 200‧‧‧ inter-level test device
110、210‧‧‧上板110, 210‧‧‧ board
120、220‧‧‧中介層120, 220‧‧‧Intermediary
122、222‧‧‧導電膠122, 222‧‧‧ conductive adhesive
123‧‧‧凸部123‧‧‧ convex
124、224‧‧‧接地板124, 224‧‧‧ Grounding plate
126、226‧‧‧基板層126, 226‧‧‧ substrate layer
128、228‧‧‧金屬板128, 228‧‧‧Metal plates
130、230‧‧‧下板130, 230‧‧‧ Lower board
ACT‧‧‧空氣腔ACT‧‧ Air chamber
CL‧‧‧下連接柱CL‧‧‧ lower connecting column
CS‧‧‧信號連接柱CS‧‧‧Signal connection column
CU‧‧‧上連接柱CU‧‧‧Upper connecting column
PG1‧‧‧第一接地極PG1‧‧‧first grounding pole
PG2‧‧‧第二接地極PG2‧‧‧Second grounding pole
PG3‧‧‧第三接地極PG3‧‧‧ third grounding pole
PG4‧‧‧第四接地極PG4‧‧‧fourth grounding pole
PLS‧‧‧下板信號極PLS‧‧‧ lower board signal pole
PUS‧‧‧上板信號極PUS‧‧‧ board signal pole
R1、R11‧‧‧第一區塊R1, R11‧‧‧ first block
R2、R22‧‧‧第二區塊R2, R22‧‧‧ second block
TG1‧‧‧第一接地端TG1‧‧‧first ground
TG2‧‧‧第二接地端TG2‧‧‧second ground
TG3‧‧‧第三接地端TG3‧‧‧ third ground
TG4‧‧‧第四接地端TG4‧‧‧fourth ground
TNS‧‧‧下級信號端TNS‧‧‧lower signal terminal
TTS‧‧‧待測信號端TTS‧‧‧ signal end to be tested
HL‧‧‧下貫孔HL‧‧‧ lower hole
HS‧‧‧信號貫孔HS‧‧‧ signal through hole
HU‧‧‧上貫孔HU‧‧‧Upper hole
Z1‧‧‧空氣阻抗Z1‧‧‧air impedance
Z2‧‧‧調節阻抗Z2‧‧‧ Adjusting impedance
ZCT‧‧‧阻抗調節腔ZCT‧‧‧ Impedance adjustment chamber
Zt‧‧‧測試阻抗Zt‧‧‧ test impedance
圖1A是本發明一實施例之無線通訊裝置的示意圖。1A is a schematic diagram of a wireless communication device according to an embodiment of the present invention.
圖1B是本發明一實施例之級間測試裝置測試無線通訊裝置中的待測元件的示意圖。1B is a schematic diagram of an inter-stage test apparatus for testing an element to be tested in a wireless communication apparatus according to an embodiment of the present invention.
圖2A是本發明一實施例之級間測試裝置的分解圖。2A is an exploded view of an inter-stage test apparatus according to an embodiment of the present invention.
圖2B是本發明一實施例之中介層的分解圖。2B is an exploded view of an interposer in accordance with an embodiment of the present invention.
圖3A是本發明另一實施例之級間測試裝置的分解圖。Figure 3A is an exploded view of an inter-stage test apparatus in accordance with another embodiment of the present invention.
圖3B是本發明另一實施例之級間測試裝置的側視圖。Figure 3B is a side elevational view of an interstage test apparatus in accordance with another embodiment of the present invention.
圖4A是本發明另一實施例之探測元件未電性接觸級間測試裝置的等效電路圖。4A is an equivalent circuit diagram of an inter-level test device for a non-electrical contact of a detecting element according to another embodiment of the present invention.
圖4B是本發明另一實施例之探測元件電性接觸級間測試裝置的等效電路圖。4B is an equivalent circuit diagram of a test device for electrical contact between stages of a detecting element according to another embodiment of the present invention.
在下文中，將藉由圖式說明本發明之各種例示實施例來詳細描述本發明。然而，本發明概念可能以許多不同形式來體現，且不應解釋為限於本文中所闡述之例示性實施例。此外，圖式中相同參考數字可用以表示類似的元件。In the following, the invention will be described in detail by way of illustration of various exemplary embodiments of the invention. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments set forth herein. In addition, the same reference numerals may be used in the drawings to indicate similar elements.
首先，請參考圖1A及圖1B，圖1A是本發明一實施例之無線通訊裝置的示意圖。圖1B是本發明一實施例之級間測試裝置測試無線通訊裝置中的待測元件的示意圖。First, please refer to FIG. 1A and FIG. 1B. FIG. 1A is a schematic diagram of a wireless communication device according to an embodiment of the present invention. 1B is a schematic diagram of an inter-stage test apparatus for testing an element to be tested in a wireless communication apparatus according to an embodiment of the present invention.
如圖1A及圖1B所示，無線通訊裝置10具有待測元件20、下級元件30、上接地線38、信號線40、以及下接地線42。待測元件20係分別透過上接地線38、信號線40、及下接地線42電連接到下級元件30。在本實施例中，待測元件20為無線通訊裝置中的某個元件，且電連接有前一級元件(未繪於圖式中)。而下級元件30則為待測元件20的下一級元件。若使用者欲偵測待測元件20的狀況，使用者可將本實施例的級間測試裝置100設置在待測元件20以及下級元件30之間(即將級間測試裝置100設置在上接地線38、信號線40、及下接地線42上)，如圖1B所示。 當然，若使用者欲偵測下級元件30的狀況，使用者可將本實施例的級間測試裝置100設置在下級元件30以及其下一級元件之間。為了方便說明，接下來將以級間測試裝置100設置在待測元件20以及下級元件30之間，並偵測待測元件20的狀況來作說明。As shown in FIGS. 1A and 1B, the wireless communication device 10 has an element 20 to be tested, a lower element 30, an upper ground line 38, a signal line 40, and a lower ground line 42. The device under test 20 is electrically connected to the lower element 30 through the upper ground line 38, the signal line 40, and the lower ground line 42, respectively. In this embodiment, the device under test 20 is an element in the wireless communication device, and is electrically connected to the previous level element (not shown in the drawings). The lower element 30 is the next level element of the element 20 to be tested. If the user wants to detect the condition of the device under test 20, the user can set the inter-stage testing device 100 of the present embodiment between the device under test 20 and the lower device 30 (ie, the inter-stage test device 100 is placed on the upper ground line). 38, the signal line 40, and the lower ground line 42), as shown in Figure 1B. Of course, if the user wants to detect the condition of the lower-level component 30, the user can set the inter-stage testing device 100 of the present embodiment between the lower-level component 30 and the next-level component. For convenience of explanation, the inter-stage test apparatus 100 will be disposed between the device under test 20 and the lower-level component 30, and the condition of the device under test 20 will be detected for explanation.
接著，請同時參考圖2A，圖2A是本發明一實施例之級間測試裝置的分解圖。如圖2A所示，待測元件20分別透過上接地線38、信號線40、及下接地線42電連接下級元件30。級間測試裝置100包含上板110、中介層120、以及下板130。下板130之第一接地極PG1為透過上接地線38電連接待測元件20之第一接地端TG1及下級元件30之第三接地端TG3。下板130之下板信號極PLS透過信號線40電連接待測元件20之待測信號端TTS及下級元件30之下級信號端TNS。而下板130之第二接地極PG2則透過下接地線42電連接待測元件20之第二接地端TG2及下級元件30之第四接地端TG4。而中介層120則設於上板110及下板130之間。使得級間測試裝置100形成雙埠接地-訊號-接地(Ground-Signal-Ground，簡稱GSG)的級間測試結構。在本實施例中，第一接地極PG1、下板信號極PLS、及第二接地極PG2可設置在下板130內，以分別與上接地線38、信號線40、及下接地線42電連接，如圖2A所示。又或者第一接地極PG1、下板信號極PLS、及第二接地極PG2可設置且暴露在下板130的底部，以方便與上接地線38、信號線40、及下接地線42電性接觸(未繪於圖2A)。而第一接地極PG1、下板信號極PLS、第二接地極PG2與上接地線38、信號線40、及下接地線42的設置關係亦可依實際的情況作設計，本發明並不對此作限制。Next, please refer to FIG. 2A at the same time. FIG. 2A is an exploded view of the inter-stage test apparatus according to an embodiment of the present invention. As shown in FIG. 2A, the device under test 20 is electrically connected to the lower element 30 through the upper ground line 38, the signal line 40, and the lower ground line 42, respectively. The interstage test apparatus 100 includes an upper plate 110, an interposer 120, and a lower plate 130. The first grounding pole PG1 of the lower board 130 is electrically connected to the first grounding end TG1 of the device under test 20 and the third grounding end TG3 of the lower-level component 30 through the upper grounding wire 38. The lower board signal PLS of the lower board 130 is electrically connected to the signal terminal TTS of the device under test 20 and the signal terminal TNS of the lower stage component 30 through the signal line 40. The second grounding pole PG2 of the lower board 130 is electrically connected to the second grounding end TG2 of the device under test 20 and the fourth grounding end TG4 of the lower-level component 30 through the lower grounding wire 42. The interposer 120 is disposed between the upper board 110 and the lower board 130. The inter-stage test apparatus 100 is configured to form an inter-stage test structure of a Ground-Signal-Ground (GSG). In this embodiment, the first grounding pole PG1, the lower board signal pole PLS, and the second grounding pole PG2 may be disposed in the lower board 130 to be electrically connected to the upper grounding line 38, the signal line 40, and the lower grounding line 42, respectively. , as shown in Figure 2A. Or the first grounding pole PG1, the lower board signal pole PLS, and the second grounding pole PG2 may be disposed and exposed at the bottom of the lower board 130 to facilitate electrical contact with the upper grounding wire 38, the signal wire 40, and the lower grounding wire 42. (Not shown in Figure 2A). The arrangement relationship between the first grounding pole PG1, the lower board signal pole PLS, the second grounding pole PG2 and the upper grounding line 38, the signal line 40, and the lower grounding line 42 can also be designed according to actual conditions, and the present invention does not Make a restriction.
因此，使用者可利用外接的測試裝置電連接級間測試裝置100來量測待測元件20目前的狀況。例如，外部測試裝置電連接至下板130之第一接地極PG1、下板信號極PLS、以及第二接 地極PG2來量測待測元件20是否有瑕疵或毀損(未繪於圖2A中)。又例如，上板110具有三個接觸極，且三個接觸極分別電連接至第一接地極PG1、下板信號極PLS、以及第二接地極PG2，使得外部測試裝置可接觸上板110的三個接觸極來量測待測元件20是否有瑕疵或毀損(未繪於圖2A中)，本發明並不對此作限制。此外，在本實施例中，上板110以及下板130為印刷電路板(printed circuit board，簡稱PCB)。中介層120為絕緣材質，且較佳為塑膠材質，本發明並不對此作限制。Therefore, the user can electrically connect the inter-stage test device 100 with an external test device to measure the current condition of the device under test 20. For example, the external test device is electrically connected to the first ground pole PG1, the lower board signal pole PLS, and the second interface of the lower board 130. The ground pole PG2 measures whether the element under test 20 is defective or damaged (not depicted in Figure 2A). For another example, the upper board 110 has three contact poles, and the three contact poles are electrically connected to the first ground pole PG1, the lower board signal pole PLS, and the second ground pole PG2, respectively, so that the external test device can contact the upper board 110. The three contact poles measure whether the device under test 20 is defective or damaged (not shown in FIG. 2A), and the present invention is not limited thereto. In addition, in the embodiment, the upper board 110 and the lower board 130 are printed circuit boards (PCBs). The interposer 120 is made of an insulating material, and is preferably made of a plastic material, which is not limited by the present invention.
再來，請同時參考圖2B，中介層120包含第一區塊R1以及第二區塊R2，且第一區塊R1鄰近第二區塊R2。在本實施例中，第一區塊R1以及第二區塊R2的面積相等，以避免不必要的雜散電容產生而影響級間測試裝置100的偵測結果。而若雜散電容過小到可以忽略，則不需考慮雜散電容的影響，使得第一區塊R1以及第二區塊R2的面積不需要相等，本發明並不對此作限制。Referring to FIG. 2B at the same time, the interposer 120 includes the first block R1 and the second block R2, and the first block R1 is adjacent to the second block R2. In this embodiment, the areas of the first block R1 and the second block R2 are equal to avoid unnecessary stray capacitance generation and affect the detection result of the inter-stage test apparatus 100. If the stray capacitance is too small to be negligible, the influence of the stray capacitance is not considered, so that the areas of the first block R1 and the second block R2 do not need to be equal, and the present invention does not limit this.
第一區塊R1具有空氣腔ACT，且空氣腔ACT接觸下板130以產生空氣阻抗。在本實施例中，空氣阻抗設定為50歐姆，使得級間測試裝置100中的信號較不易互相影響。當然，空氣阻抗亦可設定為其他的固定值，本發明在此不作限制。第二區塊R2具有阻抗調節腔ZCT，且阻抗調節腔ZCT接觸下板130。阻抗調節腔ZCT中具有導電膠122、接地板124、基板層126、及金屬板128。導電膠122設於下板130上，用以將接地板124電連接第一接地極PG1以及第二接地極PG2。而導電膠122上則依序疊設有接地板124、基板層126、及金屬板128。基板層126為具有一預定厚度的基板，以根據預定厚度產生調節阻抗。因此，級間測試裝置100將可根據固定的空氣阻抗以及調節阻抗形成一等效阻抗。The first block R1 has an air cavity ACT, and the air cavity ACT contacts the lower plate 130 to generate an air impedance. In the present embodiment, the air impedance is set to 50 ohms, so that the signals in the inter-stage test apparatus 100 are less likely to affect each other. Of course, the air impedance can also be set to other fixed values, and the invention is not limited herein. The second block R2 has an impedance adjustment cavity ZCT, and the impedance adjustment cavity ZCT contacts the lower plate 130. The impedance adjusting cavity ZCT has a conductive paste 122, a ground plate 124, a substrate layer 126, and a metal plate 128. The conductive paste 122 is disposed on the lower plate 130 for electrically connecting the ground plate 124 to the first ground electrode PG1 and the second ground electrode PG2. The conductive paste 122 is sequentially provided with a ground plate 124, a substrate layer 126, and a metal plate 128. The substrate layer 126 is a substrate having a predetermined thickness to produce an adjusted impedance according to a predetermined thickness. Therefore, the interstage test apparatus 100 will form an equivalent impedance based on the fixed air impedance and the adjusted impedance.
在本實施例中，導電膠122為設置在第二區塊R2之周圍， 且不設置於鄰近第一區塊R1之處，如圖2B所示的「ㄈ」字形。而接地板124與導電膠122的形狀相同(即接地板124與導電膠122的形狀皆為「ㄈ」字形)，且導電膠222為將接地板124電連接到第一接地極PG1以及第二接地極PG2，但不會將接地板124電連接到下板信號極PLS，以降低接地板124以及導電膠122影響電連接在下板信號極PLS的信號線40。當然，接地板124以及導電膠122的形狀亦可為其他種型式，本發明並不對此作限制。In this embodiment, the conductive paste 122 is disposed around the second block R2. It is not disposed adjacent to the first block R1, as shown in FIG. 2B. The grounding plate 124 and the conductive adhesive 122 have the same shape (that is, the grounding plate 124 and the conductive adhesive 122 are all in the shape of a U-shape), and the conductive adhesive 222 is electrically connected to the grounding plate 124 to the first grounding pole PG1 and the second. The grounding pole PG2 does not electrically connect the grounding plate 124 to the lower-plate signal pole PLS to reduce the grounding plate 124 and the conductive adhesive 122 from affecting the signal line 40 electrically connected to the lower-plate signal pole PLS. Of course, the shape of the grounding plate 124 and the conductive adhesive 122 may be other types, and the invention is not limited thereto.
在此，第一接地極PG1以及第二接地極PG2可設計為與下板信號極PLS在下板130的不同平面，使得接地板124可電連接到第一接地極PG1以及第二接地極PG2時，但不會電連接到下板信號極PLS。又或者導電膠122的形狀可設置為接觸不到下板信號極PLS(如，導電膠122的「ㄈ」字形的凸部123設計為超出下板130的下板信號極PLS設置的範圍)，本發明並不對此作限制。下板130、導電膠122、接地板124、基板層126、金屬板128、中介層120、及上板210之間則可利用晶片黏著劑接合，而所屬技術領域具通常知識者應知晶片黏著劑的材質與運用方式，故在此不再贅述。Here, the first grounding pole PG1 and the second grounding pole PG2 may be designed to be different from the lower board signal pole PLS in the lower plane of the lower board 130 such that the grounding plate 124 can be electrically connected to the first grounding pole PG1 and the second grounding pole PG2. , but will not be electrically connected to the lower board signal pole PLS. Alternatively, the conductive paste 122 may be shaped to be in contact with the lower plate signal pole PLS (eg, the U-shaped convex portion 123 of the conductive paste 122 is designed to extend beyond the lower plate signal pole PLS of the lower plate 130). The invention is not limited thereto. The lower plate 130, the conductive paste 122, the ground plate 124, the substrate layer 126, the metal plate 128, the interposer 120, and the upper plate 210 may be bonded by a wafer adhesive, and those skilled in the art should know that the wafer is adhered. The material and application of the agent, so will not repeat them here.
此外，在本實施例中，接地板124與金屬板128為平行設置，使得接地板124、基板層126、以及金屬板128之間形成電容量，並據此產生調節阻抗。由於電容量與阻抗成反比。因此，若基板層126的預定厚度越厚，調節阻抗將越大。同樣地，若基板層126的預定厚度越薄，調節阻抗將越小。當然，調節阻抗亦可利用改變基板層126的材質來作調整。在本實施例中，基板層126為玻璃纖維材質(簡稱FR4)，亦可為其他材質，本發明並不對此作限制。Further, in the present embodiment, the ground plate 124 and the metal plate 128 are disposed in parallel such that a capacitance is formed between the ground plate 124, the substrate layer 126, and the metal plate 128, and accordingly the adjustment impedance is generated. Since the capacitance is inversely proportional to the impedance. Therefore, if the predetermined thickness of the substrate layer 126 is thicker, the adjustment impedance will be larger. Likewise, if the predetermined thickness of the substrate layer 126 is thinner, the adjustment impedance will be smaller. Of course, the adjustment impedance can also be adjusted by changing the material of the substrate layer 126. In this embodiment, the substrate layer 126 is made of fiberglass material (FR4 for short), and may be other materials, and the invention is not limited thereto.
因此，使用者可根據待測元件20的工作頻帶設計基板層126的預定厚度以產生調節阻抗，使得級間測試裝置100根據固定的 空氣阻抗以及設計後的調節阻抗形成符合待測元件20的工作頻帶的等效阻抗。進而可提供使用者利用外部的測試裝置電連接級間測試裝置100來量測待測元件20目前的狀況。Therefore, the user can design a predetermined thickness of the substrate layer 126 according to the operating frequency band of the device under test 20 to generate an adjusted impedance, so that the inter-stage test apparatus 100 is fixed according to The air impedance and the adjusted impedance after design form an equivalent impedance that corresponds to the operating frequency band of the component under test 20. Further, the user can be provided to electrically connect the inter-stage test device 100 with an external test device to measure the current condition of the device under test 20.
接下來，請同時參考圖3A及圖3B。圖3A是本發明另一實施例之級間測試裝置的分解圖。圖3B是本發明另一實施例之級間測試裝置的側視圖。如圖3A及圖3B所示，級間測試裝置200包含上板210、中介層220、下板230、上連接柱CU、信號連接柱CS、以及下連接柱CL。而級間測試裝置200有關上板210、中介層220、以及下板230的結構與連結關係與級間測試裝置100有關上板110、中介層120、以及下板130的結構與連結關係大致相同。Next, please refer to FIG. 3A and FIG. 3B at the same time. Figure 3A is an exploded view of an inter-stage test apparatus in accordance with another embodiment of the present invention. Figure 3B is a side elevational view of an interstage test apparatus in accordance with another embodiment of the present invention. As shown in FIGS. 3A and 3B, the interstage test apparatus 200 includes an upper plate 210, an interposer 220, a lower plate 230, an upper connection post CU, a signal connection post CS, and a lower connection post CL. The structure and connection relationship between the upper board 210, the interposer 220, and the lower board 230 of the inter-stage test apparatus 200 are substantially the same as those of the inter-stage test apparatus 100 regarding the upper board 110, the interposer 120, and the lower board 130. .
不同的地方在於，上板210具有第三接地極PG3、上板信號極PUS、以及第四接地極PG4。下板230具有第一接地極PG1、下板信號極PLS、以及第二接地極PG2。以及中介層220更具有上貫孔HU、信號貫孔HS、及下貫孔HL，以分別貫穿中介層220。第三接地極PG3透過上貫孔HU與第一接地極PG1對應設置，且上連接柱CU***上貫孔HU以電連接第三接地極PG3以及第一接地極PG1。上板信號極PUS透過信號貫孔HS與下板信號極PLS對應設置，且信號連接柱CS***信號貫孔HS以電連接上板信號極PUS以及下板信號極PLS。第四接地極PG4透過下貫孔HL與第二接地極PG2對應設置，且下連接柱CL***下貫孔HL以電連接第四接地極PG4以及第二接地極PG2。The difference is that the upper board 210 has a third grounding pole PG3, an upper board signal pole PUS, and a fourth grounding pole PG4. The lower plate 230 has a first ground electrode PG1, a lower plate signal PLS, and a second ground electrode PG2. The interposer 220 further has an upper through hole HU, a signal through hole HS, and a lower through hole HL to penetrate the interposer 220, respectively. The third grounding pole PG3 is disposed corresponding to the first grounding pole PG1 through the upper through hole HU, and the upper connecting pillar CU is inserted into the upper through hole HU to electrically connect the third grounding pole PG3 and the first grounding pole PG1. The upper board signal pole PUS is disposed corresponding to the lower board signal pole PLS through the signal through hole HS, and the signal connection post CS is inserted into the signal through hole HS to electrically connect the upper board signal pole PUS and the lower board signal pole PLS. The fourth ground electrode PG4 is disposed corresponding to the second ground electrode PG2 through the lower through hole HL, and the lower connection post CL is inserted into the lower through hole HL to electrically connect the fourth ground electrode PG4 and the second ground electrode PG2.
在本實施例中，中介層220的上貫孔HU、信號貫孔HS、及下貫孔HL為設置在第一區塊R11中。中介層220的第二區塊R22設置有導電膠222、接地板224、基板層226、以及金屬板228。而有關第一區塊R11與第二區塊R22之間的對應關係大致上與第一區塊R1與第二區塊R2之間的對應關係相同。另外，導電膠222、接地板224、基板層226、以及金屬板228的結構 與連結關亦大致上與導電膠122、接地板124、基板層126、以及金屬板128的結構與連結關係相同。故在此不再作贅述。In the present embodiment, the upper through hole HU, the signal through hole HS, and the lower through hole HL of the interposer 220 are disposed in the first block R11. The second block R22 of the interposer 220 is provided with a conductive paste 222, a ground plate 224, a substrate layer 226, and a metal plate 228. The correspondence between the first block R11 and the second block R22 is substantially the same as the correspondence between the first block R1 and the second block R2. In addition, the structure of the conductive paste 222, the ground plate 224, the substrate layer 226, and the metal plate 228 The structure and connection relationship of the conductive paste 122, the ground plate 124, the substrate layer 126, and the metal plate 128 are also substantially the same as the connection. Therefore, it will not be repeated here.
接下來，使用者可利用探測元件55電性接觸級間測試裝置200的第三接地極PG3、上板信號極PUS、及第四接地極PG4，並將探測元件55電連接到量測裝置50，以進一步量測待測元件20目前的狀況，如圖3B所示。在本實施例中，探測元件55可為一探針，且探測元件55具有上接地探針55a、信號探針55b、以及下接地探針55c(即一個探針對應到三個探針)。上接地探針55a電性接觸第三接地極PG3。信號探針55b電性接觸上板信號極PUS。下接地探針55c電性接觸第四接地極PG4。使得使用者可以利用量測裝置50上的探測元件55電連接至級間測試裝置200，並以GSG的級間測試結構來量測待測元件20的狀況。而探測元件55亦可依照實際需要量測待測元件20的項目作變更，本發明並不對此作限制。Next, the user can electrically contact the third grounding pole PG3, the upper board signal pole PUS, and the fourth grounding pole PG4 of the interstage testing device 200 by using the detecting component 55, and electrically connect the detecting component 55 to the measuring device 50. To further measure the current condition of the device under test 20, as shown in FIG. 3B. In the present embodiment, the detecting element 55 can be a probe, and the detecting element 55 has an upper grounding probe 55a, a signal probe 55b, and a lower grounding probe 55c (ie, one probe corresponding to three probes). The upper grounding probe 55a electrically contacts the third grounding pole PG3. The signal probe 55b electrically contacts the upper signal pole PUS. The lower grounding probe 55c electrically contacts the fourth grounding pole PG4. The user can be electrically connected to the interstage test device 200 using the detecting element 55 on the measuring device 50, and the condition of the device under test 20 can be measured by the inter-stage test structure of the GSG. The detecting component 55 can also measure the item of the component to be tested 20 according to actual needs, and the present invention does not limit this.
另外，若級間測試裝置200沒有上連接柱CU、信號連接柱CS、以及下連接柱CL。使得第三接地極PG3透過上貫孔HU與第一接地極PG1對應設置，但第三接地極PG3並未電連接第一接地極PG1。上板信號極PUS透過信號貫孔HS與下板信號極PLS對應設置，但上板信號極PUS並未電連接下板信號極PLS。以及第四接地極PG4透過下貫孔HL與第二接地極PG2對應設置，但第四接地極PG4並未電連接第二接地極PG2(未繪於圖3A-3B)。In addition, if the interstage test apparatus 200 does not have the upper connection post CU, the signal connection post CS, and the lower connection post CL. The third grounding pole PG3 is disposed corresponding to the first grounding pole PG1 through the upper through hole HU, but the third grounding pole PG3 is not electrically connected to the first grounding pole PG1. The upper board signal pole PUS is disposed corresponding to the lower board signal pole PLS through the signal through hole HS, but the upper board signal pole PUS is not electrically connected to the lower board signal pole PLS. The fourth grounding pole PG4 is disposed corresponding to the second grounding pole PG2 through the lower through hole HL, but the fourth grounding pole PG4 is not electrically connected to the second grounding pole PG2 (not shown in FIGS. 3A-3B).
使用者亦可利用上接地探針55a由第三接地極PG3***上貫孔HU至第一接地極PG1，使得第三接地極PG3電連接第一接地極PG1。信號探針55b由上板信號極PUS***信號貫孔HS至下板信號極PLS，使得上板信號極PUS電連接下板信號極PLS。以及下接地探針55c由第四接地極PG4***下貫孔HL至第二接地極PG2，使得第四接地極PG4電連接第二接地極PG2。 藉此，使用者遂可以利用量測裝置50上的探測元件55電連接至級間測試裝置200，並以GSG的級間測試結構來量測待測元件20的狀況(未繪於圖3A-3B)。The user can also insert the upper grounding hole HU into the first grounding pole PG1 by the third grounding pole PG3 by the grounding probe 55a, so that the third grounding pole PG3 is electrically connected to the first grounding pole PG1. The signal probe 55b is inserted into the signal through hole HS from the upper signal pole PUS to the lower signal terminal PLS such that the upper signal pole PUS is electrically connected to the lower signal pole PLS. And the lower grounding probe 55c is inserted into the lower grounding hole HL2 from the fourth grounding pole PG4 to the second grounding pole PG2, so that the fourth grounding pole PG4 is electrically connected to the second grounding pole PG2. Thereby, the user can electrically connect to the interstage test device 200 by using the detecting element 55 on the measuring device 50, and measure the condition of the device under test 20 with the inter-stage test structure of the GSG (not shown in FIG. 3A). 3B).
為了方便說明使用者如何利用級間測試裝置200來量測待測元件20的狀況，以下以量測裝置50的探測元件55未電性接觸級間測試裝置200時，級間測試裝置200中的空氣阻抗以及調節阻抗設計為50歐姆；以及量測裝置50的探測元件55電性接觸級間測試裝置200時，級間測試裝置200中的空氣阻抗設計為50歐姆以及調節阻抗設計為24歐姆來作說明。因此，量測裝置50將可進一步量測工作在2.4Ghz/5Ghz ISM頻段的待測元件20的狀況。In order to facilitate the description of how the user uses the inter-stage test apparatus 200 to measure the condition of the device under test 20, the detector element 55 of the measuring device 50 is not electrically contacted with the inter-stage testing device 200, and the inter-stage testing device 200 The air impedance and the adjusted impedance are designed to be 50 ohms; and when the detecting element 55 of the measuring device 50 electrically contacts the inter-stage testing device 200, the air impedance in the inter-stage testing device 200 is designed to be 50 ohms and the adjusted impedance is designed to be 24 ohms. Give instructions. Therefore, the measuring device 50 will further measure the condition of the device under test 20 operating in the 2.4 Ghz/5Ghz ISM band.
如圖4A及4B所示，圖4A是本發明另一實施例之探測元件未電性接觸級間測試裝置的等效電路圖。圖4B是本發明另一實施例之探測元件電性接觸級間測試裝置的等效電路圖。當使用者未將探測元件55電性接觸至級間測試裝置200時，級間測試裝置200的等效電路圖將為空氣阻抗Z1之一端電連接調節阻抗Z2之一端，且空氣阻抗Z1之另一端電連接待測信號端TTS(即電連接到待測元件20)，而調節阻抗Z2之另一端則電連接到下級信號端TNS(即電連接到下級元件30)。空氣阻抗Z1以及調節阻抗Z2皆為50歐姆(即整個級間測試裝置200的等效阻抗為50歐姆)，如圖4A所示。4A and 4B, FIG. 4A is an equivalent circuit diagram of an inter-level test device for a non-electrical contact of a detecting element according to another embodiment of the present invention. 4B is an equivalent circuit diagram of a test device for electrical contact between stages of a detecting element according to another embodiment of the present invention. When the user does not electrically contact the detecting element 55 to the inter-stage testing device 200, the equivalent circuit diagram of the inter-stage testing device 200 will be one end of the air impedance Z1 electrically connected to one end of the adjusting impedance Z2, and the other end of the air impedance Z1 The signal to be tested TTS is electrically connected (ie, electrically connected to the device under test 20), and the other end of the adjustment impedance Z2 is electrically connected to the lower signal terminal TNS (ie, electrically connected to the lower element 30). Both the air impedance Z1 and the adjustment impedance Z2 are 50 ohms (i.e., the equivalent impedance of the entire interstage test apparatus 200 is 50 ohms) as shown in Fig. 4A.
而當使用者將探測元件55電性接觸至級間測試裝置200，並提供測試阻抗Zt為50歐姆(即與空氣阻抗Z1相同)時，上接地探針55a透過第三接地極PG3電連接第一接地極PG1，信號探針55b透過上板信號極PUS電連接下板信號極PLS，以及下接地探針55c透過第四接地極PG4電連接第二接地極PG2(未繪於圖4B)。When the user electrically contacts the detecting component 55 to the inter-stage testing device 200 and provides the test impedance Zt to 50 ohms (ie, the same as the air impedance Z1), the upper grounding probe 55a is electrically connected through the third grounding pole PG3. A grounding pole PG1, the signal probe 55b is electrically connected to the lower board signal pole PLS through the upper board signal pole PUS, and the lower grounding probe 55c is electrically connected to the second grounding pole PG2 through the fourth grounding pole PG4 (not shown in FIG. 4B).
此時，級間測試裝置200的等效電路圖為空氣阻抗Z1之一 端電連接調節阻抗Z2之一端。空氣阻抗Z1之另一端電連接待測信號端TTS(即電連接到待測元件20)以及測試阻抗Zt的一端。測試阻抗Zt的另一端電連接到上板信號極PUS，以透過探測元件55電連接到外部的量測裝置50。而調節阻抗Z2的另一端則接地(即調節阻抗Z2與下級元件30之間等效為開路)。此時，空氣阻抗仍為50歐姆，但調節阻抗將由50歐姆改變為24歐姆(即整個級間測試裝置200的等效阻抗為24/50歐姆)，如圖4B所示。At this time, the equivalent circuit diagram of the inter-stage test device 200 is one of the air impedances Z1. The terminal electrical connection adjusts one end of the impedance Z2. The other end of the air impedance Z1 is electrically connected to the signal terminal TTS to be tested (ie, electrically connected to the device under test 20) and the end of the test impedance Zt. The other end of the test impedance Zt is electrically connected to the upper board signal pole PUS to be electrically connected to the external measuring device 50 through the detecting element 55. The other end of the adjustment impedance Z2 is grounded (ie, the equivalent impedance between the adjustment impedance Z2 and the lower element 30 is an open circuit). At this time, the air impedance is still 50 ohms, but the adjustment impedance will be changed from 50 ohms to 24 ohms (i.e., the equivalent impedance of the entire interstage test apparatus 200 is 24/50 ohms) as shown in Fig. 4B.
接著，量測裝置50遂可量測待測元件20所輸出的信號目前的狀況。舉例來說，在正常情況下待測元件20應輸出15dBm的訊號。若量測裝置50量測到15dBm的訊號，代表待測元件20為正常運作的元件。而若量測裝置50量測到10dBm的訊號，則代表待測元件20為瑕疵或毀損的元件。此時，使用者遂可將有問題的待測元件20更換為可正常運作的待測元件20。Next, the measuring device 50 遂 can measure the current condition of the signal output by the device under test 20 . For example, under normal conditions, the component under test 20 should output a signal of 15 dBm. If the measuring device 50 measures a signal of 15 dBm, it means that the component under test 20 is a functioning component. If the measuring device 50 measures a signal of 10 dBm, it means that the component to be tested 20 is a defective or damaged component. At this time, the user can replace the problematic component 20 to be tested with the device 20 to be tested.
綜上所述，本發明實施例所提供的級間測試裝置可偵測到無線通訊裝置中元件的狀況，並在級間測試裝置偵測到有瑕疵或毀損的元件時作更換。藉此，使用者僅需更換無線通訊裝置中有瑕疵或毀損的元件而不需要丟棄整個無線通訊裝置，將可使製造成本大幅的降低。In summary, the inter-stage test apparatus provided by the embodiment of the present invention can detect the condition of components in the wireless communication device and replace when the inter-stage test device detects a defective or damaged component. Thereby, the user only needs to replace the defective or damaged components in the wireless communication device without discarding the entire wireless communication device, which will greatly reduce the manufacturing cost.
以上所述僅為本發明之實施例，其並非用以侷限本發明之專利範圍。The above description is only an embodiment of the present invention, and is not intended to limit the scope of the invention.
20‧‧‧待測元件20‧‧‧Device under test
30‧‧‧下級元件30‧‧‧Subordinate components
38‧‧‧上接地線38‧‧‧Upper grounding wire
40‧‧‧信號線40‧‧‧ signal line
42‧‧‧下接地線42‧‧‧Under the grounding wire
100‧‧‧級間測試裝置100‧‧ ‧ inter-level test set
110‧‧‧上板110‧‧‧Upper board
120‧‧‧中介層120‧‧‧Intermediary
130‧‧‧下板130‧‧‧ Lower board
PG1‧‧‧第一接地極PG1‧‧‧first grounding pole
PLS‧‧‧下板信號極PLS‧‧‧ lower board signal pole
PG2‧‧‧第二接地極PG2‧‧‧Second grounding pole
TG1‧‧‧第一接地端TG1‧‧‧first ground
TG2‧‧‧第二接地端TG2‧‧‧second ground
TG3‧‧‧第三接地端TG3‧‧‧ third ground
TG4‧‧‧第四接地端TG4‧‧‧fourth ground
TNS‧‧‧下級信號端TNS‧‧‧lower signal terminal
TTS‧‧‧待測信號端TTS‧‧‧ signal end to be tested
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059880A (en) * | 2005-07-08 | 2007-03-08 | Kovio Inc | Method for manufacturing rfid tag, and mechanism formed by using rfid tag |
| US20120299798A1 (en) * | 2011-05-24 | 2012-11-29 | Sarantel Limited | Dielectrically Loaded Antenna |
| TW201323896A (en) * | 2011-07-22 | 2013-06-16 | Nvidia Corp | Systems and methods for component analysis |
| TW201327699A (en) * | 2011-12-26 | 2013-07-01 | Zycube Co Ltd | Semiconductor chip and semiconductor module carrying the same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059880A (en) * | 2005-07-08 | 2007-03-08 | Kovio Inc | Method for manufacturing rfid tag, and mechanism formed by using rfid tag |
| US20120299798A1 (en) * | 2011-05-24 | 2012-11-29 | Sarantel Limited | Dielectrically Loaded Antenna |
| TW201323896A (en) * | 2011-07-22 | 2013-06-16 | Nvidia Corp | Systems and methods for component analysis |
| TW201327699A (en) * | 2011-12-26 | 2013-07-01 | Zycube Co Ltd | Semiconductor chip and semiconductor module carrying the same |
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