TWI491844B - 3D Morphology Analysis Method - Google Patents
3D Morphology Analysis Method Download PDFInfo
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- TWI491844B TWI491844B TW102137170A TW102137170A TWI491844B TW I491844 B TWI491844 B TW I491844B TW 102137170 A TW102137170 A TW 102137170A TW 102137170 A TW102137170 A TW 102137170A TW I491844 B TWI491844 B TW I491844B
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Description
本發明係有關一種3D形貌分析方法，特別是指一種以2D表面粗度儀進行量測之3D形貌分析方法，其兼具成本低及量測精度高等優點及功效。The invention relates to a 3D shape analysis method, in particular to a 3D shape analysis method which is measured by a 2D surface roughness meter, which has the advantages and effects of low cost and high measurement accuracy.
由於產業發達與產業應用擴大，如何利用線掃瞄(2D)而建構出物體3D表面之需要愈來愈殷切。大者如無人單車對前方障礙物之判定、玩具元件的重製(re-manufacture)，小至微機電元件之形貌設計製造等。Due to the development of the industry and the expansion of industrial applications, the need to construct the 3D surface of objects using line scanning (2D) is becoming more and more demanding. The big ones are unmanned bicycles, the determination of obstacles in front, the re-manufacture of toy components, and the design and manufacture of micro-electromechanical components.
在逆向工程之量測系統部分，較常使用的設備為大家熟知的接觸式三次元量測儀及非接觸式雷射掃描儀，但這樣的設備不但價格較高，且接觸式三次元量測儀之精度為1μm，非接觸式雷射掃描儀則為10~100μm，當需要量測更為精密的3D表面時，則無法達到準確之效果。In the measurement system of reverse engineering, the more commonly used equipment is the well-known contact three-dimensional measuring instrument and non-contact laser scanner, but such equipment is not only expensive, but also contact three-dimensional measurement. The accuracy of the instrument is 1μm, and the non-contact laser scanner is 10~100μm. When it is necessary to measure a more precise 3D surface, the accurate effect cannot be achieved.
因此，有必要研發新產品，以解決上述缺點及問題。Therefore, it is necessary to develop new products to solve the above shortcomings and problems.
本發明之目的在於提供一種3D形貌分析方法，其兼具成本低及量測精度高等優點及功效，用以解決習知裝置技術昂貴且精度較低等問題。The object of the present invention is to provide a 3D topography analysis method, which has the advantages of low cost and high measurement accuracy, and is used to solve the problems of high cost and low precision of conventional device technology.
本發明解決上述問題之技術手段係提供一種3D形貌分析方法，其包括下列步驟： 準備步驟：準備一2D表面粗度儀、一待測試件及一處理裝置；該2D表面粗度儀係連接該處理裝置，且該處理裝置係具有一顯示部、一處理部及一輔助軟體；量測步驟：該2D表面粗度儀以等間距且平行之複數量測路徑對該待測試件進行表面粗度量測，並輸出至該處理裝置；每一量測路徑係可測得一組具有複數個數據點的數據檔，每一個數據點係具有一高度資料；處理步驟：該處理部將複數組數據檔建構成一矩形陣列，並依各數據點之高度資料建構成曲面；形貌模擬步驟：定義每一數據點之平面座標，再由該輔助軟體依每一數據點之高度資料及平面座標，進行刀具模擬切削，得到該待測試件表面形貌之影像，並顯示於該顯示部上。The technical means for solving the above problems of the present invention provides a 3D topography analysis method, which comprises the following steps: Preparing a step of preparing a 2D surface roughness meter, a test piece and a processing device; the 2D surface roughness meter is connected to the processing device, and the processing device has a display portion, a processing portion and an auxiliary software; Measuring step: the 2D surface roughness meter performs surface rough measurement on the object to be tested in an equally spaced and parallel complex quantity measuring path, and outputs the same to the processing device; each measuring path can measure a group a data file having a plurality of data points, each data point having a height data; processing step: the processing unit constructs the complex array data file into a rectangular array, and constructs a curved surface according to the height data of each data point; Simulation step: defining a plane coordinate of each data point, and then performing, by the auxiliary software, the tool simulation cutting according to the height data of each data point and the plane coordinate, obtaining an image of the surface topography of the to-be-tested piece, and displaying the image on the display Ministry.
本發明之上述目的與優點，不難從下述所選用實施例之詳細說明與附圖中，獲得深入瞭解。The above objects and advantages of the present invention will be readily understood from the following detailed description of the preferred embodiments illustrated herein.
茲以下列實施例並配合圖式詳細說明本發明於後：The invention will be described in detail in the following examples in conjunction with the drawings:
10‧‧‧2D表面粗度儀10‧‧‧2D surface roughness meter
11‧‧‧探針部11‧‧‧ Probe Department
12‧‧‧基座12‧‧‧ Pedestal
13‧‧‧試件活動平台13‧‧‧Test piece activity platform
21‧‧‧訊號放大器21‧‧‧Signal Amplifier
22‧‧‧類比/數位轉換器22‧‧‧ Analog/Digital Converter
51‧‧‧準備步驟51‧‧‧Preparation steps
52‧‧‧量測步驟52‧‧‧Measurement steps
53‧‧‧處理步驟53‧‧‧Processing steps
54‧‧‧形貌模擬步驟54‧‧‧ Shape simulation steps
70‧‧‧待測試件70‧‧‧Tested parts
80‧‧‧處理裝置80‧‧‧Processing device
81‧‧‧顯示部81‧‧‧Display Department
82‧‧‧處理部82‧‧‧Processing Department
83‧‧‧輔助軟體83‧‧‧Auxiliary software
X‧‧‧第一軸向X‧‧‧first axial direction
Y‧‧‧第二軸向Y‧‧‧second axial
△Y‧‧‧量測間距△Y‧‧‧measurement spacing
P1‧‧‧第一位置P1‧‧‧ first position
P2‧‧‧第二位置P2‧‧‧ second position
P3‧‧‧第三位置P3‧‧‧ third position
P80‧‧‧第八十位置P80‧‧‧ Eightyth position
S1‧‧‧第一條量測路徑S1‧‧‧ first measurement path
S2‧‧‧第二條量測路徑S2‧‧‧Second measurement path
S80‧‧‧第八十條量測路徑S80‧‧‧Article 80 Measurement Path
第一圖係本發明之3D形貌分析方法之流程示意圖The first figure is a schematic flow chart of the 3D topography analysis method of the present invention.
第二圖係本發明之各設備之示意圖The second figure is a schematic diagram of each device of the present invention
第三圖係本發明之系統方塊圖The third figure is a system block diagram of the present invention.
第四圖係本發明之量測路線之示意圖The fourth figure is a schematic diagram of the measurement route of the present invention.
第五A圖係本發明之量測過程一之示意圖Figure 5A is a schematic diagram of the measurement process of the present invention
第五B圖係第第五A圖之局部放大示意圖The fifth B diagram is a partial enlarged view of the fifth A diagram
第六圖係本發明之量測過程二之示意圖The sixth figure is a schematic diagram of the measurement process 2 of the present invention.
第七圖係本發明之量測過程三之示意圖The seventh figure is a schematic diagram of the third measurement process of the present invention.
第八圖係本發明之曲面建構之示意圖The eighth figure is a schematic diagram of the surface construction of the present invention
第九圖係本發明之模擬表面形貌之示意圖The ninth diagram is a schematic diagram of the simulated surface topography of the present invention.
如第一圖所示，本發明係為一種3D形貌分析方法，其包括下列步驟：As shown in the first figure, the present invention is a 3D topography analysis method, which includes the following steps:
準備步驟51：如第二圖所示，準備一2D表面粗度儀10、一待測試件70及一處理裝置80；該2D表面粗度儀10係連接該處理裝置80，且該處理裝置80係具有一顯示部81、一處理部82及一輔助軟體83。如第三圖所示，該2D表面粗度儀10係具有一探針部11、一基座12及一試件活動平台13；該待測試件70係置於該試件活動平台13上，該探針部11係設於該基座12上，可調整高度並作一第一軸向X之移動，用以量測該待測試件70之表面粗度；該試件活動平台13係設於該基座12上，並可於該基座12上作一第二軸向Y之移動。Preparation step 51: As shown in the second figure, a 2D surface roughness meter 10, a to-be-tested component 70 and a processing device 80 are prepared; the 2D surface roughness meter 10 is connected to the processing device 80, and the processing device 80 There is a display unit 81, a processing unit 82 and an auxiliary software 83. As shown in the third figure, the 2D surface roughness meter 10 has a probe portion 11, a base 12 and a test piece movable platform 13; the test piece 70 is placed on the test piece movable platform 13, The probe portion 11 is disposed on the base 12, and the height can be adjusted and moved in a first axial direction X to measure the surface roughness of the test piece 70. The test piece movable platform 13 is provided. On the base 12, a second axial Y movement can be made on the base 12.
又，該2D表面粗度儀10與該處理裝置80間係具有一訊號放大器21及一類比/數位轉換器22；該2D表面粗度儀10量測該待測試件70得到之電壓訊號，係經由該訊號放大器21放大後，由該類比/數位轉換器22轉換並輸出至該處理裝置80，該處理裝置80係用以顯示並記錄該待測試件70之輪廓曲線。Moreover, the 2D surface roughness meter 10 and the processing device 80 have a signal amplifier 21 and an analog/digital converter 22; the 2D surface roughness meter 10 measures the voltage signal obtained by the device 70 to be tested. After being amplified by the signal amplifier 21, the analog/digital converter 22 converts and outputs to the processing device 80, which is used to display and record the contour curve of the member 70 to be tested.
量測步驟52：該2D表面粗度儀10以等間距且平行之複數量 測路徑對該待測試件70進行表面粗度量測，並輸出至該處理裝置80；每一量測路徑係可測得一組具有複數個數據點的數據檔，每一個數據點係具有一高度資料。如第四圖所示，其係本發明在實際實驗時，該2D表面粗度儀10之該探針部11之複數量測路徑，由此可知，本發明在實際測試之過程中，總計有80條水平量測路徑，每一條水平量測路徑測得之數據檔係具有8000個數據點；量測時，採用由左往右之第一軸向X移動，完成一次量測後，該試件活動平台13係往前移動一量測間距△Y(第二軸向Y移動，該量測間距△Y在實驗中為0.15mm)，再進行下一次的量測工作，直至80條水平量測路徑均完成量測，共計得到80個數據檔(每一量測路徑為10mm，80條量測路徑之間距共為12mm)。Measurement step 52: the 2D surface roughness meter 10 is equally spaced and parallel The measuring path performs surface rough measurement on the device to be tested 70 and outputs to the processing device 80; each measuring path can measure a set of data files having a plurality of data points, each data point having one Height data. As shown in the fourth figure, it is a complex measurement path of the probe portion 11 of the 2D surface roughness meter 10 in the actual experiment, and it can be seen that the present invention has a total of 80 horizontal measurement paths, the data file measured by each horizontal measurement path has 8000 data points; when measuring, the first axial X movement from left to right is used, and after one measurement is completed, the test The movable platform 13 moves forward by a measuring distance ΔY (the second axial Y moves, the measuring distance ΔY is 0.15 mm in the experiment), and then the next measuring work is performed until 80 horizontal levels The measurement paths are all measured, and a total of 80 data files are obtained (each measurement path is 10 mm, and the distance between the 80 measurement paths is 12 mm).
如第五A及第五圖所示，當該試件活動平台13位於一第一位置P1時，該探針部11係由左往右對該待測試件70進行第一條量測路徑S1之量測；如第六圖所示，完成第一條量測路徑S1後，該試件活動平台13係由該第一位置P1移動至一第二位置P2，移動距離為該量測間距△Y，該探針部11繼續由左往右對該待測試件70進行第二條量測路徑S2之量測；重覆上述之方式，直至該試件活動平台13移動至一第八十位置P80，且該探針部11由左往右對該待測試件70進行第八十條量測路徑S80之量測後即結束量測(如第七圖所示)。As shown in the fifth and fifth figures, when the test piece movable platform 13 is located at a first position P1, the probe portion 11 performs the first measurement path S1 from the left to the right to the test piece 70. The measurement; as shown in the sixth figure, after the first measurement path S1 is completed, the test piece movable platform 13 is moved from the first position P1 to a second position P2, and the moving distance is the measurement interval △ Y, the probe portion 11 continues to measure the second measuring path S2 from the left to the right to the test piece 70; repeating the above manner until the test piece movable platform 13 moves to an eighth position P80, and the probe portion 11 performs the measurement of the eighth measurement path S80 from left to right after the measurement of the eighth measurement path S80 (as shown in the seventh figure).
處理步驟53：該處理部82將複數組數據檔建構成一矩形陣列，並依各數據點之高度資料建構成曲面；如第八圖所示，其係本發明建構出之曲面示意圖，複數組數據檔建構成一矩形陣列後，依各數據點之高度變化，即可建構成曲面。Processing step 53: The processing unit 82 constructs a complex array data file into a rectangular array, and constructs a curved surface according to the height data of each data point; as shown in the eighth figure, it is a schematic diagram of the curved surface constructed by the present invention, and a complex array After the data file is constructed into a rectangular array, the surface can be constructed according to the height of each data point.
形貌模擬步驟54：定義每一數據點之平面座標，再由該輔助軟體(例如：Master CAM)83依每一數據點之高度資料及平面座標，進行刀具模擬切削，得到該待測試件70表面形貌之影像，並顯示於該顯示部81上(如第九圖所示，其係該輔助軟體83進行刀具模擬切削後得到之表面形貌影像)。Morphology simulation step 54: Defining the plane coordinates of each data point, and then the auxiliary software (for example, Master CAM) 83 performs tool simulation cutting according to the height data of each data point and the plane coordinates, and obtains the to-be-tested component 70. The image of the surface topography is displayed on the display portion 81 (as shown in the ninth figure, which is the surface topography image obtained by the auxiliary software 83 after the tool simulation cutting).
關於本發明之特點，請參考第一表及以下說明。For the features of the present invention, please refer to the first table and the following description.
由第一表中可知，本發明之方法係利用該2D表面粗度儀10進行量測，不但在價格上低於三次元量測儀及雷射掃描儀，且可達到更好的量測精度，可應用於重複製造(re-manufacture)之運算器內、微元件之設計、製造與工廠之檢測等。As can be seen from the first table, the method of the present invention utilizes the 2D surface roughness meter 10 for measurement, which is not only lower in price than the three-dimensional measuring instrument and the laser scanner, but also achieves better measurement accuracy. It can be applied to re-manufacture operators, micro-component design, manufacturing, and factory inspection.
綜上所述，本發明之優點及功效可歸納為：In summary, the advantages and effects of the present invention can be summarized as follows:
[1]成本低。習知技術進行3D形貌之量測，在設備上較為昂貴；而本發明係以價格較為低廉之2D表面粗度儀進行表面粗度量測，再配合本發明之3D形貌分析方法，即可達到相同之三D量測效果，故具有成本低之優點。[1] The cost is low. The conventional technique performs measurement of 3D topography, which is expensive on equipment; and the present invention performs surface rough measurement with a relatively inexpensive 2D surface roughness meter, and then cooperates with the 3D topography analysis method of the present invention, that is, The same three-D measurement effect can be achieved, so it has the advantage of low cost.
[2]量測精度高。習知技術以三次元量測儀及雷射掃描儀進 行三維量測，其精度係在1μm至100μm之間，而本發明以2D表面粗度儀進行量測，其精度係為0.02μm，在精度上遠高於三次元量測儀及雷射掃描儀，故具有量測精度高之優點。[2] The measurement accuracy is high. The conventional technology uses a three-dimensional measuring instrument and a laser scanner. Three-dimensional measurement, the accuracy is between 1μm and 100μm, and the invention is measured by 2D surface roughness meter, the accuracy is 0.02μm, and the accuracy is much higher than the three-dimensional measuring instrument and laser scanning. Instrument, it has the advantage of high measurement accuracy.
以上僅是藉由較佳實施例詳細說明本發明，對於該實施例所做的任何簡單修改與變化，皆不脫離本發明之精神與範圍。The present invention has been described in detail with reference to the preferred embodiments of the present invention, without departing from the spirit and scope of the invention.
由以上詳細說明，可使熟知本項技藝者明瞭本發明的確可達成前述目的，實已符合專利法之規定，爰提出發明專利申請。From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objects, and the invention has been in accordance with the provisions of the patent law.
51‧‧‧準備步驟51‧‧‧Preparation steps
52‧‧‧量測步驟52‧‧‧Measurement steps
53‧‧‧處理步驟53‧‧‧Processing steps
54‧‧‧形貌模擬步驟54‧‧‧ Shape simulation steps
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5866806A (en) * | 1996-10-11 | 1999-02-02 | Kla-Tencor Corporation | System for locating a feature of a surface |
| TW200606391A (en) * | 2004-05-10 | 2006-02-16 | Koninkl Philips Electronics Nv | Device and method for optical precision measurement |
| TW200842758A (en) * | 2007-02-16 | 2008-11-01 | Qualcomm Inc | Efficient 2-D and 3-D graphics processing |
| TW200929067A (en) * | 2007-12-21 | 2009-07-01 | Ind Tech Res Inst | 3D image detecting, editing and rebuilding system |
| TW201018867A (en) * | 2008-11-14 | 2010-05-16 | Univ Nat Formosa | Method and device for measuring object surface topography and defects using phase-type surface plasma resonance method |
| US7908759B2 (en) * | 2005-04-25 | 2011-03-22 | Renishaw Plc | Method for scanning the surface of a workpiece |
| US20120140243A1 (en) * | 2010-12-03 | 2012-06-07 | Zygo Corporation | Non-contact surface characterization using modulated illumination |
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- 2013-10-15 TW TW102137170A patent/TWI491844B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5866806A (en) * | 1996-10-11 | 1999-02-02 | Kla-Tencor Corporation | System for locating a feature of a surface |
| TW200606391A (en) * | 2004-05-10 | 2006-02-16 | Koninkl Philips Electronics Nv | Device and method for optical precision measurement |
| US7908759B2 (en) * | 2005-04-25 | 2011-03-22 | Renishaw Plc | Method for scanning the surface of a workpiece |
| TW200842758A (en) * | 2007-02-16 | 2008-11-01 | Qualcomm Inc | Efficient 2-D and 3-D graphics processing |
| TW200929067A (en) * | 2007-12-21 | 2009-07-01 | Ind Tech Res Inst | 3D image detecting, editing and rebuilding system |
| TW201018867A (en) * | 2008-11-14 | 2010-05-16 | Univ Nat Formosa | Method and device for measuring object surface topography and defects using phase-type surface plasma resonance method |
| US20120140243A1 (en) * | 2010-12-03 | 2012-06-07 | Zygo Corporation | Non-contact surface characterization using modulated illumination |
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