TWI489934B - Electronic device - Google Patents
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- TWI489934B TWI489934B TW101143139A TW101143139A TWI489934B TW I489934 B TWI489934 B TW I489934B TW 101143139 A TW101143139 A TW 101143139A TW 101143139 A TW101143139 A TW 101143139A TW I489934 B TWI489934 B TW I489934B
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Description
本發明是有關於一種電子裝置，且特別是有關於一種伺服器。The present invention relates to an electronic device, and more particularly to a server.
近年來，隨著科技的快速發展，電子裝置的運作速度不斷地提高。此外，隨著電子裝置的效能提高，電子裝置的電子零件的發熱功率也不斷地攀升。為了預防電子零件過熱而發生暫時性或永久性的失效，電子裝置必須提供電子零件足夠的散熱效能。因此，對於高發熱功率之電子零件，例如中央處理單元或是繪圖晶片等等，通常會加裝散熱模組例如是散熱鰭片來降低這些電子零件的溫度。此外，電子零件通常位在電子裝置的機殼內。為了讓散熱模組所吸收的熱量能夠充份地散出機殼外，機殼內的熱對流效率也是值得關注的問題之一。In recent years, with the rapid development of technology, the operation speed of electronic devices has been continuously improved. In addition, as the performance of electronic devices increases, the heating power of electronic components of electronic devices continues to rise. In order to prevent temporary or permanent failure of electronic components from overheating, electronic devices must provide sufficient heat dissipation for electronic components. Therefore, for high-heat-power electronic components, such as central processing units or graphics wafers, heat-dissipating modules such as heat-dissipating fins are usually added to reduce the temperature of these electronic components. In addition, electronic components are typically located within the housing of the electronic device. In order to allow the heat absorbed by the heat dissipation module to be fully discharged outside the casing, the heat convection efficiency in the casing is also one of the concerns.
以伺服器(Server)而言，由於伺服器必須具備足夠的穩定度與可靠度，才能夠避免所提供的服務中斷。因此，在伺服器的機殼內通常還會配置有輔助散熱的導流結構，以增加熱對流的效率。舉例來說，伺服器可將風扇配置於主機板的一側，並將導風罩配置於風扇與主機板上，以使導風罩連通風扇與主機板上的電子零件。因此，風扇所吹出的氣流能經過導風罩的引導而將主機板上電子零件的產熱散逸出機殼之外，進而降低伺服器的溫度而穩定其運作。In the case of a server, since the server must have sufficient stability and reliability, the service interruption provided can be avoided. Therefore, a flow guiding structure for assisting heat dissipation is usually disposed in the casing of the server to increase the efficiency of heat convection. For example, the server can arrange the fan on one side of the motherboard and the air hood on the fan and the motherboard so that the air hood communicates the fan and the electronic components on the motherboard. Therefore, the airflow blown by the fan can be guided by the air hood to dissipate the heat generated by the electronic components on the main board out of the casing, thereby lowering the temperature of the server and stabilizing its operation.
由於導風罩遮蔽了部份的電子零件，當這些電子零件需進行拆裝或維修時，導風罩也需頻繁地進行拆裝以露出這些電子零件。因此，導風罩通常是設計成免工具拆裝的形式，亦即導風罩不需經由拆裝工具即可簡單地組裝與拆卸。因此，以往的導風罩通常是直接放置在伺服器的內部，組裝人員無法確認導風罩是否準確地安裝至定位，且導風罩也沒有固定在伺服器的內部。因此，伺服器在運送過程中，導風罩容易相對於其他零件移動而撞壞其他零件。Since the air hood shields part of the electronic components, when the electronic components need to be disassembled or repaired, the air hood also needs to be frequently disassembled to expose the electronic components. Therefore, the air hood is usually designed to be tool-free, that is, the air hood can be easily assembled and disassembled without the need of a disassembly tool. Therefore, the conventional air hood is usually placed directly inside the server, and the assembler cannot confirm whether the air hood is accurately mounted to the positioning, and the air hood is not fixed inside the server. Therefore, during the transportation of the servo, the air hood easily moves relative to other parts and crashes other parts.
本發明提供一種電子裝置，能提高免工具拆裝之導風罩的穩固性。The invention provides an electronic device, which can improve the stability of the windshield without tool disassembly.
本發明提出一種電子裝置，包括一主機板、至少一散熱模組、一風扇模組以及一導風罩。散熱模組設置於主機板上並具有一第一定位部。風扇模組設置於主機板的一側並朝向散熱模組。導風罩具有與第一定位部相對應的一第二定位部。導風罩藉由第一定位部與第二定位部的配合而固定於散熱模組上，其中導風罩連通風扇模組與散熱模組，以使風扇模組所提供的氣流能流經散熱模組。The present invention provides an electronic device including a motherboard, at least one heat dissipation module, a fan module, and an air hood. The heat dissipation module is disposed on the motherboard and has a first positioning portion. The fan module is disposed on one side of the motherboard and faces the heat dissipation module. The air guiding hood has a second positioning portion corresponding to the first positioning portion. The air guiding cover is fixed to the heat dissipation module by the cooperation of the first positioning portion and the second positioning portion, wherein the air guiding cover communicates with the fan module and the heat dissipation module, so that the airflow provided by the fan module can flow through the heat dissipation. Module.
在本發明之一實施例中，上述之散熱模組包括一散熱元件與一散熱外殼，散熱元件設置於散熱外殼內。第二定位部為設於導風罩上的一卡合件，卡合件具有一卡合勾部。第一定位部為設於散熱外殼的一卡合凸部。導風罩經由將卡合勾部對應地卡合至卡合凸部而固定至散熱模組。In an embodiment of the invention, the heat dissipation module includes a heat dissipation component and a heat dissipation component, and the heat dissipation component is disposed in the heat dissipation housing. The second positioning portion is a snap member disposed on the air guiding cover, and the engaging member has a locking hook portion. The first positioning portion is an engaging convex portion provided on the heat dissipation housing. The air guiding cover is fixed to the heat dissipation module by correspondingly engaging the engaging hook portion to the engaging convex portion.
在本發明之一實施例中，上述之卡合件具有一按壓部，按壓部凸出於導風罩上方。導風罩經由按壓按壓部而解除卡合勾部與卡合凸部的卡合關係。In an embodiment of the invention, the engaging member has a pressing portion, and the pressing portion protrudes above the air guiding cover. The air guide cover releases the engagement relationship between the engagement hook portion and the engagement convex portion by pressing the pressing portion.
在本發明之一實施例中，上述之風扇模組更具有一第三定位部，導風罩更具有與第三定位部相對應的第四定位部。導風罩藉由第三定位部與第四定位部的配合而固定於風扇模組上。In an embodiment of the invention, the fan module further has a third positioning portion, and the air guiding cover further has a fourth positioning portion corresponding to the third positioning portion. The air guiding cover is fixed to the fan module by the cooperation of the third positioning portion and the fourth positioning portion.
在本發明之一實施例中，上述之風扇模組包括一風扇架與多個風扇。風扇架設置於主機板的一側，風扇設置於風扇架內。In an embodiment of the invention, the fan module includes a fan frame and a plurality of fans. The fan frame is disposed on one side of the motherboard, and the fan is disposed in the fan frame.
在本發明之一實施例中，上述之第四定位部為設於導風罩上的至少一定位柱，第三定位部為設於風扇架上的至少一定位孔。導風罩經由將定位柱對應地穿入定位孔而組裝至風扇模組。In an embodiment of the present invention, the fourth positioning portion is at least one positioning post disposed on the air guiding cover, and the third positioning portion is at least one positioning hole disposed on the fan frame. The air guiding hood is assembled to the fan module by correspondingly penetrating the positioning post into the positioning hole.
在本發明之一實施例中，上述之導風罩包括一入風口以及至少一第一出風口。入風口對應於風扇模組而位於導風罩的一第一側，第一出風口對應於散熱模組而位於導風罩相對於第一側的一第二側，以使風扇模組所提供的氣流能從入風口經由第一出風口流經散熱模組。第三定位部和第四定位部位於入風口，第一定位部和第二定位部位於第一出風口。In an embodiment of the invention, the air hood includes an air inlet and at least one first air outlet. The air inlet is located on a first side of the air guiding cover corresponding to the fan module, and the first air outlet corresponds to the heat dissipation module and is located on a second side of the air guiding cover relative to the first side, so that the fan module provides The airflow can flow from the air inlet through the first air outlet through the heat dissipation module. The third positioning portion and the fourth positioning portion are located at the air inlet, and the first positioning portion and the second positioning portion are located at the first air outlet.
在本發明之一實施例中，上述之電子裝置更包括至少一記憶體模組，設置於主機板上且位於散熱模組的一側，其中導風罩更包括至少一第二出風口，第二出風口對應於 記憶體模組而位於導風罩的第二側並鄰近第一出風口，以使風扇模組所提供的氣流能從入風口經由第二出風口流經記憶體模組。In an embodiment of the present invention, the electronic device further includes at least one memory module disposed on the motherboard and located at one side of the heat dissipation module, wherein the air hood further includes at least one second air outlet, Two outlets correspond to The memory module is located on the second side of the air hood and adjacent to the first air outlet, so that the airflow provided by the fan module can flow through the memory module from the air inlet through the second air outlet.
在本發明之一實施例中，上述之散熱模組與記憶體模組的數量分別為兩個且彼此交錯排列而設置於主機板上，第一出風口與第二出風口的數量分別為兩個且彼此交錯排列而位於第二側，以使第一出風口與第二出風口分別對應於散熱模組與記憶體模組。In one embodiment of the present invention, the number of the heat dissipation module and the memory module are two and are staggered and arranged on the motherboard, and the number of the first air outlet and the second air outlet are respectively two. And being staggered to each other and located on the second side, so that the first air outlet and the second air outlet respectively correspond to the heat dissipation module and the memory module.
在本發明之一實施例中，上述之電子裝置更包括至少一發熱元件，設置於主機板上，其中散熱模組熱接觸於發熱元件，而風扇模組所提供的氣流能從入風口經由第一出風口流經發熱元件。In an embodiment of the present invention, the electronic device further includes at least one heat generating component disposed on the motherboard, wherein the heat dissipation module is in thermal contact with the heat generating component, and the airflow provided by the fan module can pass through the air inlet. An air outlet flows through the heating element.
基於上述，本發明的電子裝置的散熱模組具有第一定位部，而導風罩具有第二定位部，使得導風罩藉由第一定位部與第二定位部的配合而固定於散熱模組上。因此，電子裝置可省略使用額外的固定元件即可將導風罩與電子裝置的其他零件產生穩固的結合，進而避免導風罩在運送過程中產生移位而撞擊並損毀電子裝置的其他零件。據此，電子裝置能提高免工具拆裝之導風罩的穩固性。Based on the above, the heat dissipation module of the electronic device of the present invention has a first positioning portion, and the air guiding cover has a second positioning portion, so that the air guiding cover is fixed to the heat dissipation module by the cooperation of the first positioning portion and the second positioning portion. On the group. Therefore, the electronic device can omit the use of an additional fixing element to firmly bond the air hood to other parts of the electronic device, thereby preventing the air hood from being displaced during transportation to impact and damage other parts of the electronic device. Accordingly, the electronic device can improve the stability of the windshield that is free from tool disassembly.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1是本發明一實施例之電子裝置的示意圖。請參考 圖1，在本實施例中，電子裝置100包括主機板110、兩散熱模組120、風扇模組130、兩記憶體模組140以及導風罩150。電子裝置100例如是伺服器(server)，但本發明不限制電子裝置100的種類。1 is a schematic diagram of an electronic device according to an embodiment of the present invention. Please refer to 1 , in the embodiment, the electronic device 100 includes a motherboard 110 , two heat dissipation modules 120 , a fan module 130 , two memory modules 140 , and an air hood 150 . The electronic device 100 is, for example, a server, but the present invention does not limit the type of the electronic device 100.
散熱模組120設置於主機板110上，記憶體模組140設置於主機板110上且位於散熱模組120的一側。風扇模組130設置於主機板110的一側並朝向散熱模組120與記憶體模組140。由於散熱模組120與記憶體模組140的數量分別為兩個，因此本實施例之散熱模組120與記憶體模組140呈現彼此交錯排列而設置於主機板110上。然而，在其他實施例中，電子裝置可依據需求調整散熱模組120與記憶體模組140的數量與位置，本發明並不以此為限制。The heat dissipation module 120 is disposed on the motherboard 110 , and the memory module 140 is disposed on the motherboard 110 and located on one side of the heat dissipation module 120 . The fan module 130 is disposed on one side of the motherboard 110 and faces the heat dissipation module 120 and the memory module 140. Since the number of the heat dissipation module 120 and the memory module 140 are respectively two, the heat dissipation module 120 and the memory module 140 of the present embodiment are arranged on the motherboard 110 in a staggered manner. However, in other embodiments, the electronic device can adjust the number and position of the heat dissipation module 120 and the memory module 140 according to requirements, and the invention is not limited thereto.
此外，在本實施例中，電子裝置100更包括發熱元件160，設置於主機板110上。發熱元件160例如是中央處理器或其他在運作時會散發熱量的元件，本發明並不限制發熱元件的種類，亦不限制發熱元件的數量。本實施例是以兩個發熱元件160為例，以使兩個散熱模組120對應地熱接觸於發熱元件160。因此，發熱元件160能藉由散熱模組120進行散熱。In addition, in the embodiment, the electronic device 100 further includes a heating element 160 disposed on the motherboard 110. The heating element 160 is, for example, a central processing unit or other element that dissipates heat during operation. The present invention does not limit the type of the heating element or the number of the heating elements. In this embodiment, the two heat generating components 160 are taken as an example, so that the two heat dissipation modules 120 are in thermal contact with the heat generating component 160 correspondingly. Therefore, the heat generating component 160 can be dissipated by the heat dissipation module 120.
在本實施例中，散熱模組120具有第一定位部120a，而導風罩150具有與第一定位部120a相對應的第二定位部150a。此外，風扇模組130更具有第三定位部130a，導風罩150更具有與第三定位部130a相對應的第四定位部150b。因此，導風罩150藉由第一定位部120a與第二定位 部150a的配合而固定於散熱模組120上，並藉由第三定位部130a與第四定位部150b的配合而固定於風扇模組130上，其中導風罩150連通風扇模組130、散熱模組120與記憶體模組140，以使風扇模組130所提供的氣流能流經散熱模組120與記憶體模組140。以下將藉由文字搭配圖式進行詳細說明。In this embodiment, the heat dissipation module 120 has a first positioning portion 120a, and the air guiding cover 150 has a second positioning portion 150a corresponding to the first positioning portion 120a. In addition, the fan module 130 further has a third positioning portion 130a, and the air guiding cover 150 further has a fourth positioning portion 150b corresponding to the third positioning portion 130a. Therefore, the air guiding cover 150 is separated from the second positioning portion by the first positioning portion 120a. The portion 150a is fixed to the heat dissipation module 120, and is fixed to the fan module 130 by the cooperation of the third positioning portion 130a and the fourth positioning portion 150b. The air guiding cover 150 communicates with the fan module 130 and dissipates heat. The module 120 and the memory module 140 enable the airflow provided by the fan module 130 to flow through the heat dissipation module 120 and the memory module 140. The following will be explained in detail by the text matching diagram.
圖2是圖1之導風罩的示意圖。請同時參考圖1與圖2，在本實施例中，導風罩150包括入風口152、兩第一出風口154以及兩第二出風口156。入風口152對應於風扇模組130而位於導風罩150的第一側S1。第一出風口154對應於散熱模組120而位於導風罩150相對於第一側S1的第二側S2，而第二出風口156對應於記憶體模組140而位於導風罩150的第二側S2並鄰近第一出風口154。2 is a schematic view of the air hood of FIG. 1. Referring to FIG. 1 and FIG. 2 simultaneously, in the embodiment, the air guiding cover 150 includes an air inlet 152, two first air outlets 154, and two second air outlets 156. The air inlet 152 is located on the first side S1 of the air guiding cover 150 corresponding to the fan module 130. The first air outlet 154 is located on the second side S2 of the air guiding cover 150 relative to the first side S1 corresponding to the heat dissipation module 120 , and the second air outlet 156 is located in the air guiding cover 150 corresponding to the memory module 140 . The two sides S2 are adjacent to the first air outlet 154.
在本實施例中，第一出風口154與第二出風口156的數量分別為兩個，且呈現彼此交錯排列而位於第二側S2，使得第一出風口154與第二出風口156分別對應於散熱模組120與記憶體模組140。據此，風扇模組130所提供的氣流能從入風口152經由第一出風口154流經散熱模組120並經由第二出風口156流經記憶體模組140。In this embodiment, the number of the first air outlet 154 and the second air outlet 156 are respectively two, and are arranged in a staggered manner on the second side S2, so that the first air outlet 154 and the second air outlet 156 respectively correspond to each other. The heat dissipation module 120 and the memory module 140. Accordingly, the airflow provided by the fan module 130 can flow from the air inlet 152 through the first air outlet 154 through the heat dissipation module 120 and through the second air outlet 156 through the memory module 140.
此外，導風罩150的第一出風口154也對應於發熱元件160，因此風扇模組130所提供的氣流能從入風口152經由第一出風口154流經發熱元件160，以提高散熱模組120的散熱效率。然而，在其他實施例中，電子裝置可依據散熱模組120與記憶體模組140的數量與位置而調整第 一出風口154與第二出風口156的數量與位置，本發明並不以此為限制。In addition, the first air outlet 154 of the air hood 150 also corresponds to the heat generating component 160. Therefore, the airflow provided by the fan module 130 can flow through the heat generating component 160 from the air inlet 152 through the first air outlet 154 to improve the heat dissipation module. 120 heat dissipation efficiency. However, in other embodiments, the electronic device can be adjusted according to the number and position of the heat dissipation module 120 and the memory module 140. The number and position of the air outlet 154 and the second air outlet 156 are not limited by the present invention.
另一方面，在本實施例中，第一出風口154與第二出風口156為非封閉性的出口。在風扇模組130所提供的氣流從入風口152經由第一出風口154流經散熱模組120並經由第二出風口156流經記憶體模組140之後，氣流能流出第一出風口154與第二出風口156而流向主機板110上的其他未繪示的電子元件，例如是電源模組、硬碟或是擴展卡，以提供電子裝置100良好的散熱效率。此外，這些電子元件也可額外設置對應的導風罩，以協助氣流流向這些電子裝置而提高散熱效率。On the other hand, in the present embodiment, the first air outlet 154 and the second air outlet 156 are non-closed outlets. After the airflow provided by the fan module 130 flows from the air inlet 152 through the first air outlet 154 through the heat dissipation module 120 and through the second air outlet 156 through the memory module 140, the airflow can flow out of the first air outlet 154 and The second air outlet 156 flows to other unillustrated electronic components on the motherboard 110, such as a power module, a hard disk, or an expansion card, to provide good heat dissipation efficiency of the electronic device 100. In addition, these electronic components can also be additionally provided with corresponding air hoods to assist the flow of air to these electronic devices to improve heat dissipation efficiency.
當導風罩150藉由第一定位部120a與第二定位部150a的配合而固定於散熱模組120上，並藉由第三定位部130a與第四定位部150b的配合而固定於風扇模組130上時，第三定位部130a和第四定位部150b位於入風口152，而第一定位部120a和第二定位部150a位於各第一出風口154。據此，導風罩150能穩固地固定在散熱模組120與風扇模組130上。The air hood 150 is fixed to the heat dissipation module 120 by the cooperation of the first positioning portion 120a and the second positioning portion 150a, and is fixed to the fan module by the cooperation of the third positioning portion 130a and the fourth positioning portion 150b. In the group 130, the third positioning portion 130a and the fourth positioning portion 150b are located at the air inlet 152, and the first positioning portion 120a and the second positioning portion 150a are located at the respective first air outlets 154. Accordingly, the air hood 150 can be firmly fixed to the heat dissipation module 120 and the fan module 130.
請參考圖2，在本實施例中，位於導風罩150的入風口152的第四定位部150b為設於導風罩150的入風口152的定位柱152a，而位於導風罩150的各第一出風口154的第二定位部150a為設於各第一出風口154的卡合件154a。導風罩150能藉由定位柱152a與卡合件154a固定在風扇模組130與散熱模組120上。因此，導風罩150可 省略使用額外的固定元件而與電子裝置100的其他零件產生穩固的結合。以下將進行更具體的說明。Referring to FIG. 2 , in the embodiment, the fourth positioning portion 150 b of the air inlet 152 of the air guiding cover 150 is a positioning post 152 a disposed at the air inlet 152 of the air guiding cover 150 , and is located at each of the air guiding cover 150 . The second positioning portion 150a of the first air outlet 154 is an engaging member 154a provided at each of the first air outlets 154. The air guiding cover 150 can be fixed to the fan module 130 and the heat dissipation module 120 by the positioning post 152a and the engaging member 154a. Therefore, the air hood 150 can The use of additional fixing elements omits a strong bond with other parts of the electronic device 100. More specific explanation will be given below.
圖3是圖1之風扇模組的示意圖。請參考圖1與圖3，在本實施例中，風扇模組130包括風扇架132與多個風扇134。風扇架132設置於主機板110的一側，風扇134設置於風扇架132內。在本實施例中，風扇模組130是以具有六個風扇134作為說明，但電子裝置可依據需求調整風扇模組之風扇的數量，本發明不以此為限制。3 is a schematic view of the fan module of FIG. 1. Referring to FIG. 1 and FIG. 3 , in the embodiment, the fan module 130 includes a fan frame 132 and a plurality of fans 134 . The fan frame 132 is disposed on one side of the motherboard 110, and the fan 134 is disposed in the fan frame 132. In the embodiment, the fan module 130 has six fans 134 as an illustration, but the number of fans of the fan module can be adjusted according to requirements, and the invention is not limited thereto.
風扇134在風扇架132內排成一排並面向設置於主機板110上的散熱模組120與記憶體模組140，以使風扇模組130所提供的氣流能吹向散熱模組120與記憶體模組140而提供散熱功能。第三定位部130a為設於風扇架132上的定位孔132a，其中定位孔132a位在風扇架132的上緣，而風扇架132的上緣對應於導風罩150的入風口152的上緣。導風罩150經由第三定位部130a與第四定位部150b的配合而組裝至風扇模組130而使入風口152對應於風扇模組130，以讓氣流更為集中的吹向散熱模組120與記憶體模組140而提高散熱效率。The fan 134 is arranged in a row in the fan frame 132 and faces the heat dissipation module 120 and the memory module 140 disposed on the motherboard 110 so that the airflow provided by the fan module 130 can be blown to the heat dissipation module 120 and the memory. The body module 140 provides a heat dissipation function. The third positioning portion 130a is a positioning hole 132a disposed on the fan frame 132, wherein the positioning hole 132a is located at the upper edge of the fan frame 132, and the upper edge of the fan frame 132 corresponds to the upper edge of the air inlet 152 of the air guiding cover 150. . The air hood 150 is assembled to the fan module 130 via the cooperation of the third positioning portion 130a and the fourth positioning portion 150b, so that the air inlet 152 corresponds to the fan module 130, so that the airflow is more concentrated to the heat dissipation module 120. The heat dissipation efficiency is improved with the memory module 140.
圖4是圖1之電子裝置的局部放大剖視圖。請參考圖2至圖4，在本實施例中，導風罩150的入風口152具有三個定位柱152a，而風扇架132具有三個定位孔132a。定位柱152a從入風口152的上緣沿組裝方向D延伸，使得導風罩150能經由將定位柱152a對應地沿組裝方向D穿入定位孔132a而組裝至風扇模組130。因此，導風罩150的 入風口152準確地對應於風扇模組130的風扇134，以提高氣流集中度並避免導風罩150產生移位。4 is a partial enlarged cross-sectional view of the electronic device of FIG. 1. Referring to FIG. 2 to FIG. 4, in the present embodiment, the air inlet 152 of the air guiding cover 150 has three positioning posts 152a, and the fan frame 132 has three positioning holes 132a. The positioning post 152a extends from the upper edge of the air inlet 152 in the assembly direction D, so that the air guiding cover 150 can be assembled to the fan module 130 by penetrating the positioning post 152a correspondingly into the positioning hole 132a along the assembly direction D. Therefore, the air hood 150 The air inlet 152 accurately corresponds to the fan 134 of the fan module 130 to increase the concentration of the airflow and to prevent displacement of the air hood 150.
此外，在本實施例中，導風罩150是以具有三個定位柱152a作為說明，而風扇架132對應導風罩150而具有三個定位孔132a。然而，在其他實施例中，電子裝置可依據需求調整導風罩之定位柱的數量，並對照定位柱的數量而調整定位孔的數量，本發明並不以此為限。另外，在其他實施例中，第三定位部與第四定位部亦可以其他形式作為配合，本發明並不限制第三定位部與第四定位部為定位柱與定位孔的組合。Further, in the present embodiment, the air guiding hood 150 has three positioning posts 152a as an illustration, and the fan frame 132 has three positioning holes 132a corresponding to the air guiding hood 150. However, in other embodiments, the electronic device can adjust the number of positioning posts of the air hood according to requirements, and adjust the number of positioning holes according to the number of positioning posts, which is not limited thereto. In addition, in other embodiments, the third positioning portion and the fourth positioning portion may also be combined in other forms, and the present invention does not limit the combination of the positioning portion and the positioning hole in the third positioning portion and the fourth positioning portion.
圖5是圖2之第一出風口的局部放大示意圖。請參考圖2與圖5，在本實施例中，位於導風罩150的各第一出風口154的第二定位部150a為設於各第一出風口154的卡合件154a。具體而言，卡合件154a具有卡合勾部154b與按壓部154c。卡合勾部154b位在第一出風口154內，而按壓部154c突出於導風罩150上方而位在第一出風口154的外側。Figure 5 is a partially enlarged schematic view of the first air outlet of Figure 2; Referring to FIG. 2 and FIG. 5 , in the embodiment, the second positioning portion 150 a of each of the first air outlets 154 of the air guiding cover 150 is an engaging member 154 a disposed at each of the first air outlets 154 . Specifically, the engaging member 154a has an engaging hook portion 154b and a pressing portion 154c. The engaging hook portion 154b is located in the first air outlet 154, and the pressing portion 154c protrudes above the air guiding cover 150 and is located outside the first air outlet 154.
具體而言，卡合勾部154b從第一出風口154的上緣沿組裝方向D往第一出風口154內延伸，而按壓部154c從第一出風口154的上緣沿組裝方向D的反向突出於第一出風口154。因此，導風罩150能藉由卡合件154a沿組裝方向D組裝至散熱模組120而固定在散熱模組120上。Specifically, the engaging hook portion 154b extends from the upper edge of the first air outlet 154 in the assembly direction D toward the first air outlet 154, and the pressing portion 154c is reversed from the upper edge of the first air outlet 154 in the assembly direction D. The protrusion protrudes from the first air outlet 154. Therefore, the air guiding cover 150 can be fixed to the heat dissipation module 120 by the engaging member 154a being assembled to the heat dissipation module 120 along the assembly direction D.
圖6是圖1之電子裝置的局部放大剖視圖。請參考圖6，在本實施例中，散熱模組120包括散熱元件122與散熱 外殼124，散熱元件122設置於散熱外殼124內。散熱元件122例如是散熱鰭片組，而散熱外殼124例如是鈑金外殼，但本發明不限制散熱元件與散熱外殼的種類與材質。此外，記憶體模組140例如是記憶卡組，但本發明不限制記憶體模組的種類。Fig. 6 is a partially enlarged cross-sectional view showing the electronic device of Fig. 1; Please refer to FIG. 6 . In this embodiment, the heat dissipation module 120 includes a heat dissipation component 122 and heat dissipation. The outer casing 124 and the heat dissipating component 122 are disposed in the heat dissipation outer casing 124. The heat dissipating component 122 is, for example, a heat dissipating fin set, and the heat dissipating outer casing 124 is, for example, a sheet metal outer casing. However, the present invention does not limit the type and material of the heat dissipating component and the heat dissipating casing. Further, the memory module 140 is, for example, a memory card group, but the present invention does not limit the type of the memory module.
請參考圖6，第一定位部120a為設於散熱外殼124的卡合凸部124a。導風罩150經由將卡合勾部154b對應地沿組裝方向D卡合至卡合凸部124a而固定至散熱模組120。具體而言，當導風罩150沿組裝方向D而組裝至散熱模組120時，導風罩150的卡合勾部154b先經由卡合凸部124a的推擠而使導風罩150順利沿組裝方向D移動，並在卡合勾部154b越過卡合凸部124a之後藉由材料的恢復力而卡合至卡合凸部124a的下緣，使得導風罩150固定於散熱模組120上以避免導風罩150產生移位。Referring to FIG. 6 , the first positioning portion 120 a is an engaging convex portion 124 a provided on the heat dissipation housing 124 . The air guiding cover 150 is fixed to the heat dissipation module 120 by engaging the engagement hook portion 154b in the assembly direction D correspondingly to the engagement convex portion 124a. Specifically, when the air guiding cover 150 is assembled to the heat dissipation module 120 along the assembly direction D, the engaging hook portion 154b of the air guiding cover 150 firstly passes the engaging convex portion 124a to smoothly guide the air guiding cover 150. The assembly direction D is moved, and after the engaging hook portion 154b passes over the engaging convex portion 124a, it is engaged with the lower edge of the engaging convex portion 124a by the restoring force of the material, so that the air guiding cover 150 is fixed to the heat dissipation module 120. To avoid displacement of the air hood 150.
比較定位柱152a與定位孔132a的組合以及卡合勾部154b與卡合凸部124a的組合。定位柱152a與定位孔132a具有定位功能，但定位柱152a仍可沿組裝方向D的反向移出定位孔132a。換言之，定位柱152a與定位孔132a的組合僅能使導風罩150在組裝方向D與其反向之外的方向上不產生移位。The combination of the positioning post 152a and the positioning hole 132a and the combination of the engaging hook portion 154b and the engaging convex portion 124a are compared. The positioning post 152a and the positioning hole 132a have a positioning function, but the positioning post 152a can still be moved out of the positioning hole 132a in the reverse direction of the assembly direction D. In other words, the combination of the positioning post 152a and the positioning hole 132a can only cause the air deflector 150 to be displaced in a direction other than the reverse direction of the assembly direction D.
相反地，在卡合勾部154b卡合至卡合凸部124a之後，卡合勾部154b與卡合凸部124a的形狀互相干涉，使得導風罩150完全固定於散熱模組120上，亦即導風罩150在組裝方向D與其反向上也不產生移位。據此，導風罩150 能穩固地固定於散熱模組120上。On the contrary, after the engaging hook portion 154b is engaged with the engaging convex portion 124a, the shape of the engaging hook portion 154b and the engaging convex portion 124a interfere with each other, so that the air guiding cover 150 is completely fixed to the heat dissipation module 120. That is, the air hood 150 does not shift in the assembly direction D and its reverse direction. Accordingly, the air hood 150 It can be firmly fixed to the heat dissipation module 120.
然而，導風罩150並非無法拆卸。當風扇模組130、散熱模組120或者記憶體模組140需進行拆裝或維修時，導風罩150能經由按壓卡合件154a的按壓部154c而沿組裝方向D的反向解除卡合勾部154b與卡合凸部124a的卡合關係，進而解除導風罩150與風扇模組130以及散熱模組120的固定關係，以將導風罩150移除而露出風扇模組130、散熱模組120與記憶體模組140。However, the air hood 150 is not incapable of being detached. When the fan module 130, the heat dissipation module 120, or the memory module 140 needs to be disassembled or repaired, the air guiding cover 150 can be disengaged in the reverse direction of the assembly direction D by pressing the pressing portion 154c of the engaging member 154a. The engagement relationship between the hook portion 154b and the engaging convex portion 124a further releases the fixing relationship between the air guiding cover 150 and the fan module 130 and the heat dissipation module 120 to remove the air guiding cover 150 to expose the fan module 130 and dissipate heat. The module 120 and the memory module 140.
具體而言，以繪示於圖6的卡合件154為例。當導風罩150組裝至散熱模組120時，導風罩150的卡合勾部154b先經由卡合凸部124a往圖6的左方推擠而使卡合勾部154b越過卡合凸部124a，而卡合勾部154b在越過卡合凸部124a之後往圖6的右方卡合至卡合凸部124a的下緣。Specifically, the engaging member 154 shown in FIG. 6 is taken as an example. When the air guiding cover 150 is assembled to the heat dissipation module 120, the engaging hook portion 154b of the air guiding cover 150 is first pushed to the left of FIG. 6 via the engaging convex portion 124a, and the engaging hook portion 154b is passed over the engaging convex portion. 124a, and the engaging hook portion 154b is engaged to the lower edge of the engaging convex portion 124a toward the right side of FIG. 6 after passing over the engaging convex portion 124a.
當導風罩150欲從散熱模組120上拆卸時，導風罩150經由往圖6的右方按壓按壓部154c，以使卡合勾部154b對應於按壓部154c而往圖6的左方移出卡合凸部124a，進而解除卡合勾部154b與卡合凸部124a的卡合關係而使導風罩150能沿組裝方向D的反向移除。When the air hood 150 is to be detached from the heat dissipation module 120, the air hood 150 presses the pressing portion 154c to the right of FIG. 6 so that the engagement hook portion 154b corresponds to the pressing portion 154c to the left of FIG. The engagement convex portion 124a is removed, and the engagement relationship between the engagement hook portion 154b and the engagement convex portion 124a is released, and the air guide cover 150 can be removed in the reverse direction of the assembly direction D.
同樣地，當導風罩150欲再次組裝至散熱模組120與風扇模組130上時，只需將導風罩150的定位柱152a對應地穿入定位孔132a並將卡合凸部124a卡合至卡合凸部124a，即可再次將導風罩150固定於散熱模組120與風扇模組130上。然而，在其他實施例中，第一定位部與第二定位部亦可以其他形式作為配合，本發明並不限制第一定 位部與第二定位部必為卡合勾部與卡合凸部的組合。據此，導風罩150與電子裝置100的其他零件產生穩固的結合，亦有助於電子裝置100的其他零件的拆裝與維修。Similarly, when the air guiding cover 150 is to be assembled to the heat dissipation module 120 and the fan module 130, the positioning post 152a of the air guiding cover 150 is correspondingly inserted into the positioning hole 132a and the engaging convex portion 124a is inserted. When the engaging convex portion 124a is engaged, the air guiding cover 150 can be fixed to the heat dissipation module 120 and the fan module 130 again. However, in other embodiments, the first positioning portion and the second positioning portion may also cooperate in other forms, and the present invention does not limit the first setting. The position portion and the second positioning portion are necessarily a combination of the engaging hook portion and the engaging convex portion. Accordingly, the air hood 150 and the other components of the electronic device 100 are firmly coupled, and also contribute to the disassembly and maintenance of other parts of the electronic device 100.
綜上所述，本發明的電子裝置的散熱模組具有第一定位部，而導風罩具有第二定位部，使得導風罩藉由第一定位部與第二定位部的配合而固定於散熱模組上。此外，風扇模組具有第三定位部，而導風罩具有第四定位部，使得導風罩藉由第三定位部與第四定位部的配合而固定於風扇模組上。因此，電子裝置可省略使用額外的固定元件即可將導風罩與電子裝置的其他零件產生穩固的結合，進而避免導風罩在運送過程中產生移位而撞擊並損毀電子裝置的其他零件。據此，電子裝置能提高免工具拆裝之導風罩的穩固性。In summary, the heat dissipation module of the electronic device of the present invention has a first positioning portion, and the air guiding cover has a second positioning portion, so that the air guiding cover is fixed by the cooperation of the first positioning portion and the second positioning portion. On the cooling module. In addition, the fan module has a third positioning portion, and the air guiding cover has a fourth positioning portion, so that the air guiding cover is fixed to the fan module by the cooperation of the third positioning portion and the fourth positioning portion. Therefore, the electronic device can omit the use of an additional fixing element to firmly bond the air hood to other parts of the electronic device, thereby preventing the air hood from being displaced during transportation to impact and damage other parts of the electronic device. Accordingly, the electronic device can improve the stability of the windshield that is free from tool disassembly.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧電子裝置100‧‧‧Electronic devices
110‧‧‧主機板110‧‧‧ motherboard
120‧‧‧散熱模組120‧‧‧ Thermal Module
120a‧‧‧第一定位部120a‧‧‧First Positioning Department
122‧‧‧散熱元件122‧‧‧Heat components
124‧‧‧散熱外殼124‧‧‧heating enclosure
124a‧‧‧卡合凸部124a‧‧‧Snap convex
130‧‧‧風扇模組130‧‧‧Fan module
130a‧‧‧第三定位部130a‧‧‧The third positioning department
132‧‧‧風扇架132‧‧‧Fan rack
132a‧‧‧定位孔132a‧‧‧Positioning holes
134‧‧‧風扇134‧‧‧fan
140‧‧‧記憶體模組140‧‧‧ memory module
150‧‧‧導風罩150‧‧‧wind hood
150a‧‧‧第二定位部150a‧‧‧Second Positioning Department
150b‧‧‧第四定位部150b‧‧‧Four Positioning Department
152‧‧‧入風口152‧‧‧Air inlet
152a‧‧‧定位柱152a‧‧‧Positioning column
154‧‧‧第一出風口154‧‧‧First air outlet
154a‧‧‧卡合件154a‧‧‧Clamps
154b‧‧‧卡合勾部154b‧‧‧Clock hook
154c‧‧‧按壓部154c‧‧‧ Pressing Department
156‧‧‧第二出風口156‧‧‧second air outlet
160‧‧‧發熱元件160‧‧‧heating components
D‧‧‧組裝方向D‧‧‧ Assembly direction
S1‧‧‧第一側S1‧‧‧ first side
S2‧‧‧第二側S2‧‧‧ second side
圖1是本發明一實施例之電子裝置的示意圖。1 is a schematic diagram of an electronic device according to an embodiment of the present invention.
圖2是圖1之導風罩的示意圖。2 is a schematic view of the air hood of FIG. 1.
圖3是圖1之風扇模組的示意圖。3 is a schematic view of the fan module of FIG. 1.
圖4是圖1之電子裝置的局部放大剖視圖。4 is a partial enlarged cross-sectional view of the electronic device of FIG. 1.
圖5是圖2之第一出風口的局部放大示意圖。Figure 5 is a partially enlarged schematic view of the first air outlet of Figure 2;
圖6是圖1之電子裝置的局部放大剖視圖。Fig. 6 is a partially enlarged cross-sectional view showing the electronic device of Fig. 1;
100‧‧‧電子裝置100‧‧‧Electronic devices
110‧‧‧主機板110‧‧‧ motherboard
120‧‧‧散熱模組120‧‧‧ Thermal Module
120a‧‧‧第一定位部120a‧‧‧First Positioning Department
130‧‧‧風扇模組130‧‧‧Fan module
130a‧‧‧第三定位部130a‧‧‧The third positioning department
140‧‧‧記憶體模組140‧‧‧ memory module
150‧‧‧導風罩150‧‧‧wind hood
150a‧‧‧第二定位部150a‧‧‧Second Positioning Department
150b‧‧‧第四定位部150b‧‧‧Four Positioning Department
152‧‧‧入風口152‧‧‧Air inlet
154‧‧‧第一出風口154‧‧‧First air outlet
156‧‧‧第二出風口156‧‧‧second air outlet
160‧‧‧發熱元件160‧‧‧heating components
D‧‧‧組裝方向D‧‧‧ Assembly direction
S1‧‧‧第一側S1‧‧‧ first side
S2‧‧‧第二側S2‧‧‧ second side
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101143139A TWI489934B (en) | 2012-11-19 | 2012-11-19 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101143139A TWI489934B (en) | 2012-11-19 | 2012-11-19 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201422125A TW201422125A (en) | 2014-06-01 |
| TWI489934B true TWI489934B (en) | 2015-06-21 |
Family
ID=51393663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101143139A TWI489934B (en) | 2012-11-19 | 2012-11-19 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI489934B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115556A (en) | 2020-01-09 | 2021-07-13 | 宏达国际电子股份有限公司 | Electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM317734U (en) * | 2007-03-26 | 2007-08-21 | Hon Hai Prec Ind Co Ltd | Computer enclosure with airflow guiding shield |
| TW201206327A (en) * | 2010-07-27 | 2012-02-01 | Hon Hai Prec Ind Co Ltd | Air duct |
| TW201226836A (en) * | 2010-12-31 | 2012-07-01 | Hon Hai Prec Ind Co Ltd | Electronic device |
-
2012
- 2012-11-19 TW TW101143139A patent/TWI489934B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM317734U (en) * | 2007-03-26 | 2007-08-21 | Hon Hai Prec Ind Co Ltd | Computer enclosure with airflow guiding shield |
| TW201206327A (en) * | 2010-07-27 | 2012-02-01 | Hon Hai Prec Ind Co Ltd | Air duct |
| TW201226836A (en) * | 2010-12-31 | 2012-07-01 | Hon Hai Prec Ind Co Ltd | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201422125A (en) | 2014-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |