TWI488277B - Method for manufacturing wiring substrate and device for arranging pins - Google Patents
Method for manufacturing wiring substrate and device for arranging pins Download PDFInfo
- Publication number
- TWI488277B TWI488277B TW099143401A TW99143401A TWI488277B TW I488277 B TWI488277 B TW I488277B TW 099143401 A TW099143401 A TW 099143401A TW 99143401 A TW99143401 A TW 99143401A TW I488277 B TWI488277 B TW I488277B
- Authority
- TW
- Taiwan
- Prior art keywords
- stitch
- substrate
- stitches
- main surface
- wiring board
- Prior art date
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
本發明係關於配線基板之製造方法及針腳配列裝置。The present invention relates to a method of manufacturing a wiring board and a stitch arrangement device.
在製造PGA(pin grid array)等之配線基板時，係使用針腳立設治具來進行，該針腳立設治具係用於將針腳嵌入配線基板的針腳連接部而加以連接。該針腳立設治具係在板狀構件形成有多數貫通孔且針腳被***此等貫通孔而成的構成。針腳係由前端部與基端部形成，成為針腳的前端部被***貫通孔內且基端部露出外側之構成。When a wiring board such as a PGA (pin grid array) is manufactured, it is performed by using a stitch standing jig for inserting the stitches into the stitch connecting portions of the wiring board and connecting them. The stitching stand is configured such that a plurality of through holes are formed in the plate-like member and the stitches are inserted into the through holes. The stitching is formed by the front end portion and the base end portion, and the tip end portion of the stitch is inserted into the through hole and the base end portion is exposed to the outside.
其後，將上述針腳立設治具與配線基板對位，藉由使自針腳立設治具突出的基端部***連接於配線基板連接部，而製造針腳立設之PGA等配線基板。此外，被***配線基板的針腳，其前端部突出外側，具有作為外部輸出輸入用之針腳端子的功能。Then, the stitching fixture is aligned with the wiring board, and the base end portion protruding from the stitch standing fixture is inserted and connected to the wiring board connecting portion, thereby manufacturing a wiring board such as a PGA in which the stitch is standing. Further, the stitch inserted into the wiring board has a function in which the tip end portion protrudes outside and has a pin terminal for external output input.
在使針腳***針腳立設治具的貫通孔內時，係藉由將貫通孔的針腳***側進行倒角，並使針腳立設治具振動或搖動，同時從與貫通孔之針腳***側相對的一側進行抽吸來實施。然而，在此種方法中，會有針腳的前端部或基端部被***針腳立設治具之貫通孔內的情形，而難以有效率地僅將針腳的前端部***貫通孔內。因此，是導致最後針腳立設配線基板的製造效率亦降低的原因。When the stitch is inserted into the through hole of the jig, the stitch is inserted into the side of the through hole to be chamfered, and the stitch is erected to vibrate or shake, and the stitch insertion side of the through hole is opposite to the stitch insertion side of the through hole. One side is pumped to perform. However, in such a method, the tip end portion or the base end portion of the stitch is inserted into the through hole of the stitch standing upright, and it is difficult to efficiently insert only the tip end portion of the stitch into the through hole. Therefore, the manufacturing efficiency of the wiring substrate at the last stitch is also lowered.
有鑑於此種狀況，專利文獻1中有揭示一種方法，其係將針腳的基端部的最大尺寸作成比針腳的前端部的最大尺寸還大，使針腳的基端部不會被***針腳立設治具的貫通孔內，可高效率地僅使針腳的前端部***貫通孔內。然而，利用此種方法，雖可選擇性地高效率地僅將前端部***針腳立設治具的貫通孔內，但在將針腳的前端部***針腳立設治具的所有貫通孔時，會有與習知構成同樣費時的問題。In view of such a situation, Patent Document 1 discloses a method in which the maximum size of the base end portion of the stitch is made larger than the maximum size of the front end portion of the stitch, so that the base end portion of the stitch is not inserted into the stitch. In the through hole of the jig, only the tip end portion of the stitch can be inserted into the through hole with high efficiency. However, according to this method, the tip end portion can be selectively inserted into the through hole of the leg standing fixture selectively and efficiently, but when the tip end portion of the stitch is inserted into all the through holes of the stitch standing upright, There are issues that are as time consuming as the conventional ones.
又，專利文獻2中有揭示一種方法，其係藉由使載置有針腳的針腳立設治具傾斜而搖動，並抽吸貫通孔，來將針腳***針腳立設治具的貫通孔內。於此情況下，當針腳的基端部被***貫通孔內時，由於隨著針腳立設治具的搖動會容易從貫通孔內脫落，所以藉由反覆進行上述針腳立設治具的搖動，最後針腳的前端部會被***針腳立設治具的所有貫通孔。然而，此方法也同樣會有在將針腳的前端部插針腳立設治具的所有貫通孔時，與習知構成同樣費時的問題。Further, Patent Document 2 discloses a method of inserting a stitch into a through hole of a standing body of a jig by rocking a needle standing on a needle on which a stitch is placed and sucking the through hole. In this case, when the base end portion of the stitch is inserted into the through hole, the needle standing up can be easily detached from the through hole as the standing motion of the needle stands up. At the end of the final stitch, the through hole of the jig is inserted into the stitch. However, in this method as well, when all the through holes of the jig are placed at the distal end portion of the stitch, the same problem as the conventional configuration is time consuming.
結果，上述習知的技術中，無法使PGA等針腳立設配線基板的製造效率充分地提升。As a result, in the above-described conventional technique, the manufacturing efficiency of the wiring substrate on which the PGA or the like is erected cannot be sufficiently improved.
[專利文獻1]日本特開2000-299402號[Patent Document 1] Japanese Patent Laid-Open No. 2000-299402
[專利文獻2]日本特開2000-269400號[Patent Document 2] Japanese Patent Laid-Open No. 2000-269400
本發明之目的在於提供一種可高效率地製造PGA等針腳立設配線基板的方法。An object of the present invention is to provide a method for efficiently manufacturing a stitch standing wiring substrate such as a PGA.
為達成上述目的，本發明係有關一種配向基板的製造方法，其特徵為具備：針腳***基板準備步驟，該***基板係構成在厚度方向從主面側朝背面側貫通形成有複數個針腳***孔，且形成主面側的針腳***口經倒角後而成的開口部；針腳保持步驟，係使上述針腳***基板相對於水平方向傾斜成既定角度，並且藉由保持構件將複數根針腳保持於上述主面上；配列基板製造步驟，係從上述針腳***基板的背面側實施排氣操作以將上述複數個針腳***孔內設成負壓，並且使上述保持構件在上述主面上朝既定方向移動，將上述複數根針腳***上述複數個針腳***孔，而製造針腳配列基板；對位步驟，係將上述針腳配列基板與在主面側或背面側形成有複數個連接部而成的配線基板對位；以及針腳移送步驟，係使從上述針腳配列基板的上述複數個針腳***孔突出的上述複數根針腳的基端部，分別連接於上述配線基板的上述連接部，使上述複數根針腳從上述針腳配列基板的上述複數個針腳***孔移送至上述配線基板的上述複數個連接部。In order to achieve the above object, the present invention provides a method of manufacturing an alignment substrate, comprising: a stitch insertion substrate preparation step of forming a plurality of stitch insertion holes penetrating from a main surface side toward a back surface side in a thickness direction. And forming an opening portion formed by chamfering the stitch insertion opening on the main surface side; the stitch holding step is such that the stitch insertion substrate is inclined at a predetermined angle with respect to the horizontal direction, and the plurality of stitches are held by the holding member The main surface; the substrate manufacturing step of performing an exhaust operation from the back side of the stitch insertion substrate to set a negative pressure in the plurality of stitch insertion holes, and causing the holding member to face in a predetermined direction on the main surface Moving, the plurality of stitches are inserted into the plurality of stitch insertion holes to manufacture a stitching substrate; and the alignment step is a wiring substrate in which the stitching substrate and the plurality of connecting portions are formed on the main surface side or the back side And a stitch transfer step of inserting the plurality of stitches from the stitching substrate into the hole The base end portion of a plurality of root pin, are respectively connected to the connecting portion of the wiring board, so that the plurality of root pins transferred from said plurality of pin insertion hole of the pin array substrate to the above-described plurality of connection portions of the wiring board.
根據本發明，將在厚度方向從主面側朝背面側貫通形成有複數個針腳***孔，且形成主面側的針腳***口經倒角後而成的開口部而構成的針腳***基板，藉由保持構件將複數根針腳保持於上述主面上，進而從上述針腳***基板的背面側實施排氣操作以將上述複數個針腳***孔內設成負壓，並且使上述保持構件在上述主面上朝既定方向移動，將上述複數根針腳***上述複數個針腳***孔，而製造針腳配列基板。According to the present invention, a plurality of stitch insertion holes are formed in the thickness direction from the main surface side toward the back surface side, and the stitches formed by the chamfering of the stitch insertion ports on the main surface side are inserted into the substrate. Holding a plurality of pins on the main surface by the holding member, and performing an exhaust operation from the back side of the stitch insertion substrate to set a negative pressure in the plurality of stitch insertion holes, and the holding member is on the main surface The upper side moves in a predetermined direction, and the plurality of stitches are inserted into the plurality of stitch insertion holes to manufacture a stitching substrate.
亦即，根據本發明，準備如習知般在厚度方向從主面側朝背面側貫通形成有複數個針腳***孔，且主面側的針腳***口形成經倒角的開口部而構成的針腳***基板，進而從上述針腳***基板的背面側實施排氣操作以將上述複數個針腳***孔內設成負壓，再者，藉由保持構件將複數根針腳保持於上述主面上，使該保持構件朝既定方向移動。In other words, according to the present invention, a plurality of stitch insertion holes are formed to penetrate from the main surface side toward the back surface side in the thickness direction, and the stitch insertion opening on the main surface side forms a chamfered opening. Inserting the substrate, and performing an venting operation from the back side of the stitch insertion substrate to set a negative pressure in the plurality of stitch insertion holes, and further holding the plurality of pins on the main surface by the holding member The holding member moves in a predetermined direction.
因此，由於伴隨上述保持構件的移動，可將上述複數根針腳依序***被配列於上述既定方向的上述針腳***孔，所以可使上述保持構件於上述主面上僅移動1次，故能以極高的效率將上述複數根針腳***上述針腳***孔中。結果，可高效率地製造上述針腳配列基板。Therefore, the plurality of stitches can be sequentially inserted into the stitch insertion holes arranged in the predetermined direction in accordance with the movement of the holding member, so that the holding member can be moved only once on the main surface, so that the plurality of stitches can be moved once. Extremely high efficiency inserts the above plurality of pins into the above-mentioned pin insertion holes. As a result, the above-described stitch arrangement substrate can be manufactured efficiently.
此外，對於僅藉由使保持構件於上述主面上移動1次，仍無法***上述針腳***孔的針腳，可藉由使其再度移動於上述主面上而再度***。因此，將針腳***上述所有的針腳***孔時，會有需要使上述保持構件於上述主面上移動複數次的情形。然而，與如習知構成般不使用保持構件而將針腳載置於針腳***基板上並搖動的情形相比較，藉由上述保持構件的移動可進一步提升針腳的***效率。Further, the stitch that cannot be inserted into the stitch insertion hole only by moving the holding member once on the main surface can be reinserted by being moved again on the main surface. Therefore, when the stitches are inserted into all of the above-described stitch insertion holes, there is a case where the holding member needs to be moved a plurality of times on the main surface. However, the insertion efficiency of the stitches can be further improved by the movement of the holding member as compared with the case where the stitching member is placed on the stitch insertion substrate and shaken without using the holding member as in the conventional configuration.
又，本發明中雖未特別明示，但由習知技術得知，由於針腳的基端部之長度比針腳的前端部之長度還短，所以即使在針腳的基端部被***上述針腳***孔的情況，藉由保持構件的再次移動之際被掃出，針腳會從上述針腳***孔脫落。因此，不會誤將針腳的基端部***針腳***孔。此外，關於從上述針腳***孔脫落的針腳方面，藉由如上所述般再度使保持構件移動，即可使其***既定的針腳***孔中。Further, although not specifically shown in the present invention, it is known from the prior art that since the length of the proximal end portion of the stitch is shorter than the length of the distal end portion of the stitch, even the proximal end portion of the stitch is inserted into the stitch insertion hole. In the case where the holding member is swept out while being moved again, the stitches are detached from the above-mentioned stitch insertion holes. Therefore, the base end portion of the stitch is not mistakenly inserted into the stitch insertion hole. Further, regarding the stitches that have fallen out from the stitch insertion holes, the holding member can be inserted into a predetermined stitch insertion hole by moving the holding member again as described above.
再者，如習知構成般，若將針腳的基端部的(最大)直徑設成比針腳的前端部的(最大)直徑還大，將針腳***孔的大小(直徑)設成僅可供上述針腳的前端部***的大小，則使保持構件移動於針腳***基板的主面上以使針腳***針腳***孔時，便不會有針腳的基端部誤被***的情形。因此，可進一步提升針腳隨著保持構件的移動而***針腳***孔的效率。Further, as in the conventional configuration, if the (maximum) diameter of the base end portion of the stitch is set to be larger than the (maximum) diameter of the front end portion of the stitch, the size (diameter) of the stitch insertion hole is set to be only available. When the front end portion of the stitch is inserted into the main surface of the stitch insertion substrate so that the stitch is inserted into the stitch insertion hole, the base end portion of the stitch is not erroneously inserted. Therefore, the efficiency with which the stitch is inserted into the stitch insertion hole with the movement of the holding member can be further improved.
如上所述，根據本發明，可高效率地製造針腳***針腳***基板的***孔中而構成的針腳配列基板。因此，其後，將針腳配列基板與在主面或背面側形成有複數個連接部而成的配線基板對位，使上述針腳從上述針腳配列基板的複數個針腳***孔移送至上述配線基板的上述複數個連接部，而製造針腳立設配線基板時的製造效率亦得以進一步提升。As described above, according to the present invention, it is possible to efficiently manufacture a stitch arrangement substrate in which a stitch is inserted into an insertion hole of a pin insertion substrate. Therefore, the stitching substrate is aligned with the wiring board on which the plurality of connecting portions are formed on the main surface or the back surface side, and the stitches are transferred from the plurality of stitch insertion holes of the stitching substrate to the wiring board. With the plurality of connection portions described above, the manufacturing efficiency in manufacturing the wiring erected wiring board is further improved.
在本發明的一例中，將上述保持構件作成相對向的一對保持構件，可在上述針腳保持步驟中使上述針腳***基板在其長度方向或寬度方向上以彼此成為逆向的方式交互傾斜，並可將上述複數根針腳保持於上述一對保持構件間。於此情況下，亦可獲得與上述本發明同樣的作用效果。又，此時，在上述配列基板製造步驟中，亦可使上述一對保持構件因應上述針腳***基板的交互傾斜而移動於上述主面上，而將上述複數根針腳***上述複數個針腳***孔。In an example of the present invention, the holding member is formed as a pair of opposing holding members, and the stitch insertion substrate may be obliquely inclined in a direction opposite to each other in the longitudinal direction or the width direction in the stitch holding step, and The plurality of stitches may be held between the pair of holding members. In this case as well, the same effects as the above-described present invention can be obtained. Further, in this step, in the step of manufacturing the array substrate, the pair of holding members may be moved to the main surface in response to the inclination of the stitch insertion substrate, and the plurality of stitches may be inserted into the plurality of stitch insertion holes. .
又，在本發明的一例中，可構成在針腳***基板的主面上設置遮罩構件，將上述複數根針腳經由上述遮罩構件***上述複數個針腳***孔。此時，可選擇性地將針腳僅***上述針腳***基板之與上述遮罩構件的開口部對應的針腳***孔。Further, in an example of the present invention, a mask member may be provided on a main surface of the stitch insertion substrate, and the plurality of stitches may be inserted into the plurality of stitch insertion holes via the mask member. At this time, the stitch can be selectively inserted only into the stitch insertion hole of the stitch insertion substrate corresponding to the opening of the mask member.
再者，在本發明的一例中，用薄板等的閉塞構件覆蓋上述複數個針腳***孔的一部分，可使上述複數根針腳不會被***上述複數個針腳***孔的一部分。因此，與上述同様，可選擇性地僅對上述針腳***基板的既定針腳***孔進行針腳的***。Furthermore, in an example of the present invention, a part of the plurality of stitch insertion holes is covered by a closing member such as a thin plate, so that the plurality of stitches are not inserted into a part of the plurality of stitch insertion holes. Therefore, similarly to the above, the insertion of the stitches can be selectively performed only on the predetermined stitch insertion holes of the above-described stitch insertion substrate.
此外，由於上述遮罩構件及上述閉塞構件具有同樣的作用效果，故亦可對上述遮罩構件賦予上述閉塞構件的功能。Further, since the mask member and the closing member have the same operational effects, the function of the closing member can be imparted to the mask member.
如以上說明所示，根據本發明，可提供一種能高效率地製造PGA等針腳立設配線基板的方法。As described above, according to the present invention, it is possible to provide a method of efficiently manufacturing a stitch standing wiring substrate such as a PGA.
以下，參照圖面，說明本發明的實施形態。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(第1實施形態)(First embodiment)
第1圖～第7圖係表示第1實施形態之配線基板之製造方法之步驟圖。此外，第1圖～第7圖係表示各步驟的組裝之長度方向的剖面。1 to 7 are step diagrams showing a method of manufacturing the wiring board of the first embodiment. In addition, FIGS. 1 to 7 show cross sections in the longitudinal direction of assembly of each step.
首先，如第1圖所示，準備針腳***基板11。針腳***基板11係採用在厚度方向從主面11A側朝背面11B側貫通形成有複數個針腳***孔11C的構成。此外，在針腳***孔11C之主面11A側的針腳***口進行倒角，而形成朝外側擴大的傾斜面11D。針腳***口的倒角係以之後應***的複數根針腳能容易***針腳***孔11C的方式實施。First, as shown in Fig. 1, the stitches are inserted into the substrate 11. The stitch insertion substrate 11 has a configuration in which a plurality of stitch insertion holes 11C are formed to penetrate from the main surface 11A side toward the back surface 11B side in the thickness direction. Further, the stitch insertion opening on the main surface 11A side of the stitch insertion hole 11C is chamfered to form an inclined surface 11D that expands outward. The chamfering of the stitch insertion opening is performed in such a manner that a plurality of stitches to be inserted later can be easily inserted into the stitch insertion hole 11C.
又，針腳15係由前端部151及基端部152構成，基端部152的直徑(外徑)係構成比前端部151的直徑(外徑)還大。Further, the stitch 15 is composed of the distal end portion 151 and the proximal end portion 152, and the diameter (outer diameter) of the proximal end portion 152 is larger than the diameter (outer diameter) of the distal end portion 151.
再者，針腳***孔11C的內徑係比針腳15的前端部的直徑(外徑)大，且比針腳15的基端部的直徑(外徑)小，在製造後述的針腳配列用基板時，成為只有針腳15的前端部151被***針腳***孔11C內。Further, the inner diameter of the stitch insertion hole 11C is larger than the diameter (outer diameter) of the distal end portion of the stitch 15 and smaller than the diameter (outer diameter) of the proximal end portion of the stitch 15, and when the substrate for the stitch arrangement described later is manufactured The front end portion 151 of only the stitch 15 is inserted into the stitch insertion hole 11C.
其次，如第2圖所示，以使開口部13A與針腳***孔11C一致的方式在針腳***基板11的主面11A上配置具有開口部13A的遮罩構件13。然後，使針腳***基板11從水平方向傾斜角度θ，並且在針腳***基板11的主面11A上，配置應經由遮罩構件13***的複數根針腳15。此外，複數根針腳15係由作為保持構件的刷子17所保持。Next, as shown in FIG. 2, the mask member 13 having the opening 13A is placed on the main surface 11A of the stitch insertion substrate 11 so that the opening 13A and the stitch insertion hole 11C are aligned. Then, the stitch insertion substrate 11 is inclined by an angle θ from the horizontal direction, and on the main surface 11A of the stitch insertion substrate 11, a plurality of stitches 15 to be inserted through the mask member 13 are disposed. Further, the plurality of stitches 15 are held by the brush 17 as a holding member.
接著，從針腳***基板11的背面11B側，利用未圖示的泵等實施排氣操作，將針腳***孔11C的內部設成負壓，並且使刷子17朝下方移動於針腳***基板11的主面11A上。於是，針腳15會依據刷子17的移動方向，從傾斜之主面11A的上側朝下側經由遮罩構件13的開口部13A依序***針腳***孔11C內。Then, from the side of the back surface 11B of the substrate 11 inserted into the substrate 11, an exhaust operation is performed by a pump or the like (not shown), a negative pressure is applied to the inside of the stitch insertion hole 11C, and the brush 17 is moved downward to the main body of the stitch insertion substrate 11. On face 11A. Then, the stitches 15 are sequentially inserted into the stitch insertion holes 11C from the upper side toward the lower side of the inclined main surface 11A via the opening portion 13A of the mask member 13 in accordance with the moving direction of the brush 17.
刷子17可藉由例如未圖示的刷子移動機構如上所述般地移動。The brush 17 can be moved as described above by, for example, a brush moving mechanism not shown.
如此一來，由於伴隨刷子17的移動可將複數根針腳15依序***針腳***孔11C，所以例如藉由使刷子17於針腳***基板11的主面11A上僅移動1次，即能以極高的效率將複數根針腳15***針腳***孔11C中。In this manner, since the plurality of stitches 15 can be sequentially inserted into the stitch insertion holes 11C with the movement of the brush 17, the brush 17 can be moved only once by inserting the brush 17 into the main surface 11A of the substrate 11 once. High efficiency inserts a plurality of pins 15 into the pin insertion holes 11C.
此外，一般來說，僅使刷子17在主面11A上移動1次，並無法將所有的針腳15***針腳***孔11C內，所以藉由如第3圖所示般使刷子17再度於針腳***基板11的主面11A上例如從下側朝上側移動，便可對尚未***針腳15的針腳***孔11C***針腳15。Further, generally, only the brush 17 is moved once on the main surface 11A, and all the stitches 15 cannot be inserted into the stitch insertion holes 11C, so that the brush 17 is again inserted into the stitches as shown in Fig. 3. The main surface 11A of the substrate 11 is moved from the lower side to the upper side, for example, and the stitch 15 can be inserted into the stitch insertion hole 11C into which the stitch 15 has not been inserted.
此時，如第3圖所示，當針腳15的基端部152的一部分被***針腳***孔11C時，在針腳***基板11傾斜及/或刷子17再度移動時會被掃出，上述那裡狀態的針腳15容易從針腳***孔15C脫落。因此，針腳15的基端部152不會誤***針腳***孔11C。At this time, as shown in Fig. 3, when a part of the base end portion 152 of the stitch 15 is inserted into the stitch insertion hole 11C, it is swept out when the stitch insertion substrate 11 is tilted and/or the brush 17 is moved again, the above state The stitch 15 is easily detached from the stitch insertion hole 15C. Therefore, the base end portion 152 of the stitch 15 is not erroneously inserted into the stitch insertion hole 11C.
此外，關於從針腳***孔11C脫落的針腳15，如第4圖所示般，藉由使刷子17再度從上側往下側移動，可使其***既定的針腳***孔11C中。Further, as shown in FIG. 4, the stitch 15 which is detached from the stitch insertion hole 11C can be inserted into the predetermined stitch insertion hole 11C by moving the brush 17 from the upper side to the lower side again.
透過反覆進行以上的操作，可藉由遮罩構件13將針腳15***經選擇的所有的針腳***孔11C，而可製造針腳配列基板。By performing the above operations in reverse, the stitches 15 can be inserted into all of the selected stitch insertion holes 11C by the mask member 13, whereby the stitch array substrate can be manufactured.
本實施形態中，有關將針腳15***針腳***孔11C內這方面，係使刷子17在針腳***基板11的主面11A上移動複數次，與如習知技術般未使用保持構件而僅將針腳載置於針腳***基板上並搖動的情況相比較，可進一步提升針腳的***效率。因此，可高效率地製造上述針腳配列基板。In the present embodiment, in order to insert the stitch 15 into the stitch insertion hole 11C, the brush 17 is moved a plurality of times on the main surface 11A of the stitch insertion substrate 11, and the holding member is not used as in the prior art, and only the stitch is used. The insertion efficiency of the stitches can be further improved as compared with the case where the pins are placed on the substrate and shaken. Therefore, the above-described stitch arrangement substrate can be manufactured efficiently.
此外，角度θ係以設定在20度～30度的範圍為佳。藉此，可增加刷子17每次移動時針腳15***針腳***孔11C內的效率，並可提升在針腳15的基端部152的一部分誤***針腳***孔11C內時被刷子17掃出的效率。Further, the angle θ is preferably set in the range of 20 to 30 degrees. Thereby, the efficiency of the insertion of the stitch 15 into the stitch insertion hole 11C every time the brush 17 is moved can be increased, and the efficiency of being swept out by the brush 17 when a part of the base end portion 152 of the stitch 15 is erroneously inserted into the stitch insertion hole 11C can be improved. .
本實施形態中係作成在針腳***基板11的主面11A上配置遮罩構件13，並選擇性地將針腳15***針腳***孔11C，惟亦可作成不配置遮罩構件13而選擇性地將針腳15***針腳***基板11之所有的針腳***孔11C。In the present embodiment, the mask member 13 is disposed on the main surface 11A of the stitch insertion substrate 11, and the stitch 15 is selectively inserted into the stitch insertion hole 11C. Alternatively, the mask member 13 may be selectively disposed without disposing the mask member 13 The stitches 15 are inserted into all of the stitch insertion holes 11C of the stitch insertion substrate 11.
又，選擇性地將針腳15***針腳***孔11C時，在取代遮罩構件13方面，可利用薄板的閉塞構件來閉塞既定的針腳***孔，或者亦可同時利用遮罩構件13與薄板的閉塞構件來閉塞既定的針腳***孔11C。Further, when the stitch 15 is selectively inserted into the stitch insertion hole 11C, the predetermined stitch insertion hole can be closed by the closing member of the thin plate instead of the mask member 13, or the occlusion of the mask member 13 and the thin plate can be simultaneously utilized. The member blocks the predetermined stitch insertion hole 11C.
其次，如第5圖所示，將以上述方式製造的針腳配列基板19、和形成有複數個連接部21A而成的配線基板21，以使***有針腳配列基板19之針腳***孔11C內的針腳15和配線基板21的連接部21A呈一致之對位的狀態下對向配置。Next, as shown in FIG. 5, the stitching substrate 19 manufactured in the above-described manner and the wiring board 21 in which a plurality of connecting portions 21A are formed are inserted into the stitch insertion holes 11C of the stitching substrate 19. The pin 15 and the connection portion 21A of the wiring board 21 are arranged to face each other in a aligned position.
然後，如第6圖所示，藉由使針腳***基板19與配線基板21接觸，將針腳配列基板19的針腳15的連接於配線基板21的連接部21A。連接部21A形成凹部狀，其大小比針腳15的基端部152的直徑(外徑)稍微狹小，所以針腳15在其基端部152與連接部21A嵌合。Then, as shown in FIG. 6, the pin insertion board 19 is brought into contact with the wiring board 21, and the stitch 15 of the stitch arrangement substrate 19 is connected to the connection portion 21A of the wiring board 21. The connecting portion 21A is formed in a concave shape and has a size slightly smaller than the diameter (outer diameter) of the proximal end portion 152 of the stitch 15, so that the stitch 15 is fitted to the connecting portion 21A at the proximal end portion 152 thereof.
因此，如上所述，將針腳配列基板19的針腳15連接於配線基板21連接部21A後，如第7圖所示，藉由使針腳配列基板19自配線基板21分離，***針腳配列基板19內的針腳15會被移送到配線基板21的連接部21A，可得到針腳15的前端部151從連接部21A突出之如PGA等之針腳立設配線基板21。Therefore, as described above, after the stitch 15 of the stitching board 19 is connected to the wiring board 21 connecting portion 21A, as shown in FIG. 7, the stitching board 19 is separated from the wiring board 21, and inserted into the stitching board 19 The stitches 15 are transferred to the connecting portion 21A of the wiring board 21, and the front end portion 151 of the stitch 15 protrudes from the connecting portion 21A, and the wiring board 21 is standing upright such as a PGA.
此外，配線基板21的配線構造等並無特別限定，可作成例如在芯層的至少一主面上分別至少層積有一層導體層與樹脂絶緣層而成之所謂的樹脂製配線基板。In addition, the wiring structure and the like of the wiring board 21 are not particularly limited, and a so-called resin wiring board in which at least one conductor layer and a resin insulating layer are laminated on at least one main surface of the core layer can be used.
第8圖表示針腳***基板11的傾斜角度θ與針腳15對針腳***孔11C的***率之關係的曲線圖。此外，使角度θ在10度、15度、20度、25度、30度、35度及40度的範圍變化，在各角度實施5次的針腳***實驗。又，針腳***基板11為鋁製，針腳***孔11C的內徑為(Φ 0.33±0.03mm)，針腳***孔11C的數量為22560個。再者，針腳15為Φ 0.3±0.025mm，長度為2.07±0.04mm。又，刷子17是使用馬毛的刷子，刷子17在針腳***基板11之主面11A上的移動次數為10次。Fig. 8 is a graph showing the relationship between the inclination angle θ of the stitch insertion substrate 11 and the insertion ratio of the stitch 15 to the stitch insertion hole 11C. Further, the angle θ was changed in the range of 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, and 40 degrees, and the stitch insertion experiment was performed five times at each angle. Further, the stitch insertion substrate 11 is made of aluminum, the inner diameter of the stitch insertion hole 11C is ( Φ 0.33 ± 0.03 mm), and the number of the stitch insertion holes 11C is 22560. Further, pin 15 is Φ 0.3 ± 0.025mm, a length of 2.07 ± 0.04mm. Further, the brush 17 is a brush using horse hair, and the number of movements of the brush 17 on the main surface 11A of the stitch insertion substrate 11 is 10 times.
由第8圖得知，在針腳***基板11的傾斜角度θ為20度～30度的範圍，針腳15對針腳***孔11C的***率高達約接近100%。因此，如上所述，藉由將針腳***基板11的傾斜角度θ設定為20度～30度來進行針腳15對針腳***孔11C的***，可實現極高的***效率。As is apparent from Fig. 8, in the range where the inclination angle θ of the stitch insertion substrate 11 is 20 to 30 degrees, the insertion rate of the stitch 15 to the stitch insertion hole 11C is as high as approximately 100%. Therefore, as described above, the insertion of the stitch 15 into the stitch insertion hole 11C is performed by setting the inclination angle θ of the stitch insertion substrate 11 to 20 to 30 degrees, and an extremely high insertion efficiency can be realized.
(第2實施形態)(Second embodiment)
第9圖～第11圖係表示第2實施形態之配線基板之製造方法之步驟圖。又，第9圖～第11圖表示各步驟的組裝之長度方向的剖面圖。9 to 11 are step diagrams showing a method of manufacturing the wiring board of the second embodiment. Further, the ninth to eleventh drawings show cross-sectional views in the longitudinal direction of the assembly of each step.
此外，由於本實施形態中，只有針腳配線基板之製造方法不同，其他步驟方面係與第1實施形態相同，所以本實施形態中主要說明針腳配線基板之製造方法。又，關於類似或相同的構成要素，係使用相同的參考數字來表示。Further, in the present embodiment, only the manufacturing method of the stitch wiring substrate is different, and the other steps are the same as those of the first embodiment. Therefore, in the present embodiment, the manufacturing method of the stitch wiring substrate will be mainly described. Also, similar or identical constituent elements are denoted by the same reference numerals.
首先，與第1實施形態同様，準備針腳***基板11。其次，如第9圖所示，在針腳***基板11的主面11A上，以使開口部13A與針腳***孔11C呈一致的方式配置具有開口部13A的遮罩構件13。又，在針腳***基板11的主面11A上，配置作為一對保持構件的一對刷子17-1及17-2，同時在此一對刷子17-1及17-2間配置複數根針腳15。First, in the same manner as in the first embodiment, the stitch insertion substrate 11 is prepared. Then, as shown in FIG. 9, the mask member 13 having the opening 13A is disposed on the main surface 11A of the stitch insertion substrate 11 so that the opening 13A and the stitch insertion hole 11C are aligned. Further, a pair of brushes 17-1 and 17-2 as a pair of holding members are disposed on the main surface 11A of the stitch insertion substrate 11, and a plurality of stitches 15 are disposed between the pair of brushes 17-1 and 17-2. .
又，在本實施形態中，一對刷子17-1及17-2係藉由例如未圖示的治具固定著。藉此，一對刷子17-1及17-2係沿垂直方向配置。Further, in the present embodiment, the pair of brushes 17-1 and 17-2 are fixed by, for example, a jig (not shown). Thereby, the pair of brushes 17-1 and 17-2 are arranged in the vertical direction.
接著，從針腳***基板11的背面11B側，利用未圖示的泵等實施排氣操作，將針腳***孔11C的內部設成負壓。然後，使針腳***基板11從水平方向傾斜角度θ，使針腳***基板11的左端抬升。此外，本實施形態中，將此種傾斜定義為右方傾斜。Then, from the side of the back surface 11B of the substrate 11 inserted into the substrate 11, the exhaust operation is performed by a pump or the like (not shown), and the inside of the stitch insertion hole 11C is set to a negative pressure. Then, the stitch insertion substrate 11 is inclined by an angle θ from the horizontal direction, and the stitch is inserted into the left end of the substrate 11 to be lifted. Further, in the present embodiment, such a tilt is defined as a right tilt.
如上所述，將針腳***基板11從水平方向傾斜角度θ時，一對刷子17-1及17-2會相對地向右方移動於針腳***基板11的主面11A上。此時，由於應經由遮罩構件13***的複數根針腳15，係在針腳***基板11的主面11A上保持於一對刷子17-1及17-2間，所以針腳15會在一對刷子17-1及17-2的移動方向上經由遮罩構件13的開口部13A依序被***針腳***孔11C內。As described above, when the stitch insertion substrate 11 is inclined by the angle θ from the horizontal direction, the pair of brushes 17-1 and 17-2 are relatively moved to the right on the main surface 11A of the stitch insertion substrate 11. At this time, since the plurality of pins 15 to be inserted through the mask member 13 are held between the pair of brushes 17-1 and 17-2 on the main surface 11A of the stitch insertion substrate 11, the stitches 15 are in a pair of brushes. In the moving direction of 17-1 and 17-2, the opening portion 13A of the mask member 13 is sequentially inserted into the stitch insertion hole 11C.
本實施形態中，也可藉由使針腳***基板11向右方傾斜，而伴隨一對刷子17-1及17-2在相對的一方向(長度方向)移動，將保持於一對刷子17-1及17-2間的複數根針腳15依序***針腳***孔11C。因此，藉由使一對刷子17-1及17-2在針腳***基板11的主面11A上僅相對移動1次，即能以極高的效率將複數根針腳15***針腳***孔11C中。In the present embodiment, the stitches can be inserted into the substrate 11 to the right, and the pair of brushes 17-1 and 17-2 can be held in the opposite direction (longitudinal direction) to be held by the pair of brushes 17- The plurality of stitches 15 between 1 and 17-2 are sequentially inserted into the stitch insertion holes 11C. Therefore, by relatively moving the pair of brushes 17-1 and 17-2 on the main surface 11A of the stitch insertion substrate 11, the plurality of stitches 15 can be inserted into the stitch insertion holes 11C with extremely high efficiency.
與第1實施形態同様地，通常使一對刷子17-1及17-2在主面11A上僅相對移動1次，並無法將所有的針腳15***針腳***孔11C內。因此，如第10圖所示，將針腳***基板11暫時成為水平狀態後，再如第11圖所示，使針腳***基板11的右端從水平方向抬升地傾斜角度θ。此外，本實施形態中，將此種傾斜定義為左方傾斜。In the same manner as in the first embodiment, the pair of brushes 17-1 and 17-2 are normally moved only once on the main surface 11A, and it is not possible to insert all of the stitches 15 into the stitch insertion holes 11C. Therefore, as shown in Fig. 10, after the stitch insertion substrate 11 is temporarily brought into a horizontal state, as shown in Fig. 11, the right end of the stitch insertion substrate 11 is tilted by an angle θ from the horizontal direction. Further, in the present embodiment, such inclination is defined as the left inclination.
於此情況下，一對刷子17-1及17-2會隨著針腳***基板11向左方傾斜，而在針腳***基板11的主面11A上相對地向左方移動。因此，藉由前面的一對刷子17-1及17-2相對地向左方移動，可對尚未***針腳15的針腳***孔11C***針腳15。In this case, the pair of brushes 17-1 and 17-2 are inclined to the left as the stitch insertion substrate 11, and relatively moved to the left on the main surface 11A of the stitch insertion substrate 11. Therefore, the first pair of brushes 17-1 and 17-2 are relatively moved to the left, and the stitch 15 can be inserted into the stitch insertion hole 11C into which the stitch 15 has not been inserted.
又，由於針腳15的基端部152的直徑(外徑)比針腳***孔11C的內徑大，所以如第9圖所示般，當針腳15基端部152的一部分***針腳***孔11C時，藉由如第10圖所示般使針腳***基板11向左方傾斜，可藉針腳***基板11傾斜及/或一對刷子17-1及17-2相對地向左方移動時被掃出，藉此，基端部152***針腳***孔11C的插腳15可容易從針腳***孔11C脫落。因此，針腳15的基端部152不會誤***針腳***孔11C。Further, since the diameter (outer diameter) of the base end portion 152 of the stitch 15 is larger than the inner diameter of the stitch insertion hole 11C, as shown in Fig. 9, when a part of the base end portion 152 of the stitch 15 is inserted into the stitch insertion hole 11C, By tilting the stitch insertion substrate 11 to the left as shown in Fig. 10, it can be swept out by the insertion of the stitch insertion substrate 11 and/or when the pair of brushes 17-1 and 17-2 are relatively moved to the left. Thereby, the pin 15 into which the proximal end portion 152 is inserted into the stitch insertion hole 11C can be easily detached from the stitch insertion hole 11C. Therefore, the base end portion 152 of the stitch 15 is not erroneously inserted into the stitch insertion hole 11C.
然後，又如第10圖所示，將針腳***基板11設成水平方向後，藉由如第9圖所示般向右方傾斜，一對刷子17-1及17-2會相對地向右方移動於針腳***基板11的主面11A上。因此，如上述所示，在此移動方向上，包含從針腳***孔11C脫落的針腳15在內，可將應***針腳***孔11C的針腳15再度依序***針腳***孔11C內。Then, as shown in Fig. 10, after the stitch insertion substrate 11 is set to the horizontal direction, the pair of brushes 17-1 and 17-2 are relatively rightward by tilting to the right as shown in Fig. 9. The square is moved on the main surface 11A of the stitch insertion substrate 11. Therefore, as described above, in the moving direction, the stitches 15 to be inserted into the stitch insertion holes 11C can be inserted into the stitch insertion holes 11C in order, including the stitches 15 which are detached from the stitch insertion holes 11C.
如上所述，藉由使針腳***基板11以朝右方傾斜及左方傾斜的方式彼此逆向地交互傾斜，可利用遮罩構件13將針腳15***所選擇的所有針腳***孔11C，而可製造針腳配列基板。As described above, by inserting the stitches into the substrate 11 obliquely obliquely opposite to each other in a tilted manner to the right and to the left, the stitches 15 can be inserted into all of the selected stitch insertion holes 11C by the mask member 13, and can be manufactured. The pins are arranged on the substrate.
本實施形態中，在有關於將針腳15***針腳***孔11C內這方面，係藉由使針腳***基板11彼此逆向地傾斜，而讓一對刷子17-1及17-2在針腳***基板11的主面11A上相對地移動複數次，與如習知技術般未使用保持構件而將針腳放置於針腳***基板上並搖動的情況相比較，可進一步提升針腳的***效率。因此，可高效率地製造上述針腳配列基板。In the present embodiment, in order to insert the stitches 15 into the stitch insertion holes 11C, the pair of brushes 17-1 and 17-2 are inserted into the substrate 11 by stitching the stitch insertion substrate 11 in opposite directions. The main surface 11A is relatively moved a plurality of times, and the insertion efficiency of the stitches can be further improved as compared with the case where the stitching member is placed on the substrate and the substrate is shaken without using the holding member as in the prior art. Therefore, the above-described stitch arrangement substrate can be manufactured efficiently.
此外，角度θ係以設定在20度～30度的範圍為佳。藉此，可增加一對刷子17-1及17-2每次移動時針腳15***針腳***孔11C內的效率，並可提升針腳15的基端部152的一部分誤***針腳***孔11C內時被一對刷子17-1及17-2掃出的效率。Further, the angle θ is preferably set in the range of 20 to 30 degrees. Thereby, the efficiency of the insertion of the stitches 15 into the stitch insertion holes 11C each time the pair of brushes 17-1 and 17-2 are moved can be increased, and when a part of the base end portion 152 of the stitch 15 is erroneously inserted into the stitch insertion hole 11C The efficiency of being swept by a pair of brushes 17-1 and 17-2.
本實施形態雖未顯示針腳***基板11的傾斜角度θ與針腳15對針腳***孔11C內的***率之具體的資料，但可獲得與第1實施形態之第8圖相同的結果。In the present embodiment, the specific information of the inclination angle θ of the stitch insertion substrate 11 and the insertion ratio of the stitch 15 to the stitch insertion hole 11C is not shown. However, the same results as those of the eighth embodiment of the first embodiment can be obtained.
本實施形態中，雖使針腳***基板11在長度方向以彼此逆向的方式交互地傾斜，惟亦可在寬度方向交互地傾斜來實施。In the present embodiment, the stitch insertion substrate 11 is alternately inclined in the longitudinal direction so as to be opposite to each other, but may be implemented by alternately tilting in the width direction.
又，本實施形態中，一對刷子17-1及17-2係利用例如未圖示的治具固定著，惟亦可與第1實施形態同様，使用刷子移動機構在針腳***基板11的主面11A上積極地相對移動。Further, in the present embodiment, the pair of brushes 17-1 and 17-2 are fixed by, for example, a jig (not shown), but the main body of the first embodiment is similar to the first embodiment, and the main body of the substrate 11 is inserted into the substrate by using the brush moving mechanism. The face 11A actively moves relatively.
本實施形態中亦作成在針腳***基板11的主面11A上配置遮罩構件13，並選擇性地將針腳15***針腳***孔11C，惟亦可作成不配置遮罩構件13而選擇性地將針腳15***針腳***基板11之所有的針腳***孔11C。In the present embodiment, the mask member 13 is disposed on the main surface 11A of the stitch insertion substrate 11, and the stitch 15 is selectively inserted into the stitch insertion hole 11C. Alternatively, the mask member 13 may be selectively disposed. The stitches 15 are inserted into all of the stitch insertion holes 11C of the stitch insertion substrate 11.
又，在選擇性地將針腳15***針腳***孔11C時，在取代遮罩構件13方面，可利用薄板的閉塞構件來閉塞既定的針腳***孔，或者亦可同時利用遮罩構件13與薄板的閉塞構件來閉塞既定的針腳***孔11C。Further, when the stitch 15 is selectively inserted into the stitch insertion hole 11C, in place of the mask member 13, the predetermined pin insertion hole can be closed by the blocking member of the thin plate, or the mask member 13 and the thin plate can be simultaneously used. The blocking member is occluded to occlude the predetermined stitch insertion hole 11C.
然後，如第1實施形態所示，使配線基板21的接合部21A與以上述方式獲得的針腳配列基板接觸，使***針腳配列基板之針腳15的基端部152與配線基板21的接合部21A接合，將針腳15移送至配線基板21，可獲得所欲之PGA等之針腳立設配線基板21。Then, as shown in the first embodiment, the joint portion 21A of the wiring board 21 is brought into contact with the stitch array substrate obtained as described above, and the joint portion 21A of the stitch end substrate 152 of the stitching substrate 15 and the wiring board 21 is inserted. In the bonding, the stitches 15 are transferred to the wiring board 21, and the stitch standing wiring board 21 such as a PGA or the like can be obtained.
(第3實施形態)(Third embodiment)
第12圖～第14圖係表示第3實施形態之配線基板之製造方法之步驟圖。12 to 14 are step diagrams showing a method of manufacturing the wiring board of the third embodiment.
又，第12圖～第14圖係表示各步驟的組裝之長度方向的剖面圖。Further, Fig. 12 to Fig. 14 are cross-sectional views showing the longitudinal direction of assembly of each step.
此外，由於本實施形態中，針腳配列基板與配線基板的連接方法不同，針腳配線基板之製造方法與第1實施形態或第2實施形態相同，故本實施形態主要針對針腳配線基板與配線基板的連接方法來作說明。又，關於類似或相同的構成要素，係使用相同的參考數字來表示。In the present embodiment, the method of manufacturing the stitch wiring substrate is different from that of the first embodiment or the second embodiment in the method of connecting the stitching substrate and the wiring substrate. Therefore, the present embodiment mainly relates to the stitch wiring substrate and the wiring substrate. The connection method is used for explanation. Also, similar or identical constituent elements are denoted by the same reference numerals.
依據第1實施形態又第2實施形態，製造針腳配列基板19後，如第12圖所示，將針腳配列基板19與形成有複數個連接部21A而成的配線基板21，以使***針腳配列基板19之針腳***孔11C內的針腳15與配線基板21的連接部21A呈一致的方式在對位的狀態下對向配置。According to the first embodiment In the second embodiment, after the stitching substrate 19 is manufactured, as shown in Fig. 12, the stitching substrate 19 and the wiring board 21 in which the plurality of connecting portions 21A are formed are arranged so that the stitch insertion holes of the insertion stitching substrate 19 are inserted. The stitches 15 in the 11C are arranged to face each other in the aligned state in such a manner that the connecting portions 21A of the wiring board 21 coincide with each other.
此外，配線基板21的連接部21A形成為凹部狀，其底面塗佈有銲劑糊22。此外，不同於第1實施形態，配線基板21的連接部21A的大小係設定成比針腳配列基板19之針腳15的基端部152的直徑(外徑)還大。再者，於第1實施形態中，針腳15的前端部151的端部位於針腳***孔11C內，但在本實施形態中，針腳15的前端部151的端部比針腳***孔11C更朝外側突出。Further, the connection portion 21A of the wiring board 21 is formed in a concave shape, and the solder paste 22 is applied to the bottom surface thereof. Further, unlike the first embodiment, the size of the connection portion 21A of the wiring board 21 is set to be larger than the diameter (outer diameter) of the base end portion 152 of the stitch 15 of the stitch arrangement substrate 19. In the first embodiment, the end portion of the distal end portion 151 of the stitch 15 is located in the stitch insertion hole 11C. However, in the present embodiment, the end portion of the distal end portion 151 of the stitch 15 is further outward than the stitch insertion hole 11C. protruding.
其次，如第13圖所示，藉由將配線基板21設置於基板定位框32內，並且至少固定其兩端部，來固定配線基板21相對於針腳配列基板19的相對位置。另一方面，藉由在針腳配列基板19的下方配置支持板32，同時用支持板32將從針腳配列基板19的針腳***孔11C突出之針腳15的端部往上推，將其基端部152從針腳***孔11C往上方推出，並***配線基板21的連接部21A內而與銲劑糊22接觸。Next, as shown in FIG. 13, the wiring substrate 21 is placed in the substrate positioning frame 32, and at least both end portions thereof are fixed, whereby the relative position of the wiring substrate 21 with respect to the stitch arrangement substrate 19 is fixed. On the other hand, by arranging the support plate 32 under the stitch arrangement substrate 19, the support plate 32 pushes up the end portion of the stitch 15 protruding from the stitch insertion hole 11C of the stitch arrangement substrate 19, and the base end portion thereof is pushed up. The 152 is pushed out from the stitch insertion hole 11C, and inserted into the connection portion 21A of the wiring board 21 to come into contact with the solder paste 22.
然後，藉由使銲劑糊22迴銲，將針腳15的基端部152連接於配線基板21的連接部21A內，如第14圖所示，可得到針腳立設配線基板21。Then, by soldering the solder paste 22, the base end portion 152 of the stitch 15 is connected to the connection portion 21A of the wiring board 21, and as shown in Fig. 14, the stitch standing wiring board 21 can be obtained.
由上述說明說明得知，在第1實施形態中使連接部21A的大小稍微小於針腳15的基端部152的直徑(外徑)，以使針腳15在該基端部152與連接部21A嵌合，而製得所欲之針腳立設配線基板21，而實施形態中，使連接部21A的大小比針腳15的基端部152的直徑(外徑)大，使形成於連接部21A銲劑糊22迴銲以連接針腳15與連接部21A，而獲得所欲之針腳立設配線基板21。As described above, in the first embodiment, the size of the connecting portion 21A is slightly smaller than the diameter (outer diameter) of the proximal end portion 152 of the stitch 15 so that the stitch 15 is fitted to the connecting portion 21A at the base end portion 152. In the embodiment, the size of the connecting portion 21A is made larger than the diameter (outer diameter) of the proximal end portion 152 of the stitch 15 to form a solder paste formed on the connecting portion 21A. 22 reflowing is performed to connect the stitch 15 and the connecting portion 21A to obtain the desired stitch standing wiring substrate 21.
雖然任一種情況，針腳15都可牢固地接合於配線基板21，但在本實施形態的針腳立設配線基板21中，由於針腳15與連接部21A，亦即針腳15與配線基板21的連接係使用銲劑糊22，故與第1實施形態的針腳立設配線基板21相比較，可確實地確保針腳1對配線基板21的電性接觸。In either case, the stitches 15 can be firmly bonded to the wiring board 21, but in the stitch standing wiring board 21 of the present embodiment, the stitches 15 and the connecting portion 21A, that is, the connection between the stitches 15 and the wiring board 21 are Since the solder paste 22 is used, the electrical contact of the stitch 1 with the wiring substrate 21 can be surely ensured as compared with the stitch standing wiring board 21 of the first embodiment.
(第4實施形態)(Fourth embodiment)
接著，說明實施形態的針腳配列裝置。本實施形態中，主要係針對第2實施形態中說明之針腳配列基板的製造方法所使用之針腳配列裝置作說明。因此，關於類似或相同的構成要素，係使用相同的參考數字來表示。Next, a stitch arrangement device according to the embodiment will be described. In the present embodiment, the stitch arrangement device used in the method of manufacturing the stitch arrangement substrate described in the second embodiment will be mainly described. Therefore, similar or identical constituent elements are denoted by the same reference numerals.
本實施形態的針腳配列裝置40具有：真空容器41，係將主面上設有遮罩構件13而成的針腳***基板11予以氣密地保持；及負壓配管42，係設置於該真空容器41的下部。此外，真空容器41、負壓配管42及未圖示的泵係構成本實施形態的排氣機構。The stitch arrangement device 40 of the present embodiment includes a vacuum container 41 in which a stitch insertion member 11 having a mask member 13 provided on a main surface thereof is airtightly held, and a negative pressure pipe 42 is provided in the vacuum container. The lower part of 41. Further, the vacuum container 41, the negative pressure pipe 42, and a pump system (not shown) constitute the exhaust mechanism of the present embodiment.
又，真空容器41係與構成設置於針腳飛散防止蓋45下部之針腳滑行面45A的下面連接。Moreover, the vacuum container 41 is connected to the lower surface of the stitch sliding surface 45A which is provided in the lower part of the stitch scattering prevention cover 45.
如上所述，在針腳飛散防止蓋45內配置有作為保持構件的一對刷子17-1及17-2，其中該保持構係用來保持複數根針腳15，並將此等複數根針腳15經由遮罩構件13***針腳***基板11的針腳***孔11C內。刷子17-1及17-2係安裝於刷子往復機構46，刷子往復機構46係以嵌入設於針腳飛散防止蓋45上面的引導溝(未圖示)之方式裝設。因此，藉由刷子往復機構46往復移動於引導溝內，可使刷子17-1及17-2亦往復移動於針腳飛散防止蓋45內，亦(即往復移動於針腳***基板11上)。As described above, the pair of brushes 17-1 and 17-2 as holding members are disposed in the stitch scattering preventing cover 45, wherein the holding mechanism is for holding the plurality of stitches 15, and the plurality of stitches 15 are passed through The mask member 13 is inserted into the stitch insertion hole 11C of the stitch insertion substrate 11. The brushes 17-1 and 17-2 are attached to the brush reciprocating mechanism 46, and the brush reciprocating mechanism 46 is attached to a guide groove (not shown) provided on the upper surface of the stitch scattering preventing cover 45. Therefore, the brush reciprocating mechanism 46 reciprocates in the guide groove, so that the brushes 17-1 and 17-2 can also reciprocate in the stitch scattering preventing cover 45, that is, reciprocally move on the stitch insertion substrate 11.
此外，遮罩構件13的主面13A與針腳滑行面45A係構成為同一平面程度，當刷子17-1及17-2於此等構成之間移動時，可抑制因形成於此等構成之間的階差所造成之移動受阻，或因刷子17-1及17-2的跳起所造成之針腳15的***效率降低。Further, the main surface 13A of the mask member 13 and the stitch sliding surface 45A are formed to have the same plane, and when the brushes 17-1 and 17-2 are moved between the configurations, it is possible to suppress the formation between the brushes and the like. The movement caused by the step is hindered, or the insertion efficiency of the stitch 15 due to the jump of the brushes 17-1 and 17-2 is lowered.
又，針腳配列裝置40包含未圖示的傾斜機構，其使針腳***基板11(本實施形態中為裝置整體)以旋轉軸43為中心從水平方向傾斜既定角度。Further, the stitch arrangement device 40 includes a tilt mechanism (not shown) that inclines the stitch insertion substrate 11 (the entire device in the present embodiment) from the horizontal direction by a predetermined angle around the rotation axis 43.
因此，藉由使用第15圖所示之本實施形態的針腳配列裝置40，可實施第2實施形態所示之針腳配列基板的製造方法。與第2實施形態相關連地簡單說明如下。Therefore, by using the stitch arranging device 40 of the present embodiment shown in Fig. 15, the method of manufacturing the stitching substrate shown in the second embodiment can be carried out. The following description will be briefly described in connection with the second embodiment.
在第15圖所示的針腳配列裝置40中，利用未圖示的泵從氣密配置於真空容器41內之針腳***基板11的背面11B側經由負壓配管42實施排氣操作，以將針腳***孔11C的內部設成負壓。其後，利用上述傾斜機構使針腳***基板11(針腳配列裝置40)從水平方向以角度θ傾斜，以使針腳***基板11的左端抬升，並使一對刷子17-1及17-2藉由刷子往復機構46相對地向右方移動於針腳***基板11的主面11A上。此時，由於在針腳***基板11的主面11A上，應經由遮罩構件13***的複數根針腳15係保持於一對刷子17-1及17-2間，故針腳15可在一對刷子17-1及17-2的移動方向上經由遮罩構件13的開口部13A依序***針腳***孔11C內。In the stitch arranging device 40 shown in FIG. 15 , the venting operation is performed via the negative pressure pipe 42 from the side of the back surface 11B of the stitch insertion substrate 11 which is airtightly disposed in the vacuum container 41 by a pump (not shown). The inside of the insertion hole 11C is set to a negative pressure. Thereafter, the above-described tilting mechanism causes the stitch insertion substrate 11 (the stitch arrangement device 40) to be inclined at an angle θ from the horizontal direction so that the stitch is inserted into the left end of the substrate 11 to be lifted, and the pair of brushes 17-1 and 17-2 are caused by The brush reciprocating mechanism 46 is relatively moved to the right on the main surface 11A of the stitch insertion substrate 11. At this time, since the plurality of stitches 15 to be inserted through the mask member 13 are held between the pair of brushes 17-1 and 17-2 on the main surface 11A of the stitch insertion substrate 11, the stitches 15 can be in a pair of brushes. In the moving direction of 17-1 and 17-2, the opening portion 13A of the mask member 13 is sequentially inserted into the stitch insertion hole 11C.
其次，將針腳***基板11暫時設成水平狀態後，同樣利用傾斜機構將針腳***基板11的右端從水平方向抬升而傾斜角度θ。此時，隨著針腳***基板11向左方傾斜，一對刷子17-1及17-2會藉由刷子往復機構46相對地向左方移動於針腳***基板11的主面11A上。因此，藉由先前的一對刷子17-1及17-2相對地向左方移動，可將針腳15***尚未有針腳15***的針腳***孔11C。Next, after the stitch insertion substrate 11 is temporarily set to the horizontal state, the right end of the stitch insertion mechanism 11 is also lifted from the horizontal direction by the tilt mechanism to incline the angle θ. At this time, as the stitch insertion substrate 11 is inclined to the left, the pair of brushes 17-1 and 17-2 are relatively moved leftward by the brush reciprocating mechanism 46 to the main surface 11A of the stitch insertion substrate 11. Therefore, by relatively moving the pair of brushes 17-1 and 17-2 to the left side, the stitch 15 can be inserted into the stitch insertion hole 11C into which the stitch 15 has not been inserted.
如上所述，使針腳***基板11以朝右方傾斜及左方傾斜的方式彼此逆向地交互傾斜，可利用遮罩構件13將針腳15***所選擇的所有針腳***孔11C，而可製造針腳配列基板。As described above, the pins are inserted into the substrate 11 so as to be inclined obliquely to the right and obliquely to the left, and the stitches 15 can be inserted into the selected pin insertion holes 11C by the mask member 13, and the stitches can be manufactured. Substrate.
此外，由於本實施形態的針腳配列裝置40中，除了作為保持構件的一對刷子17-1及17-2外，還設有針腳飛散防止蓋45，所以在上述針腳配列基板的製造方法中，可更有效地防止應***針腳***基板11之針腳15的飛散。Further, in the stitch arrangement device 40 of the present embodiment, in addition to the pair of brushes 17-1 and 17-2 as the holding members, the stitch scattering preventing cover 45 is provided. Therefore, in the method of manufacturing the stitching substrate, The scattering of the pins 15 to which the pins are inserted into the substrate 11 can be more effectively prevented.
此外，由於針腳配列基板之製造方法的詳細條件係如第2實施形態所述，故本實施形態中省略記載。In addition, since the detailed conditions of the manufacturing method of the stitching substrate are as described in the second embodiment, the description is omitted in the present embodiment.
以上，一邊列舉具體例，一邊詳細說明本發明，惟本發明未限定於上述內容，只要不悖離本發明的範圍，即可作各種的變形或變化。The present invention has been described in detail above with reference to the specific embodiments. However, the invention is not limited thereto, and various modifications and changes can be made without departing from the scope of the invention.
例如第4實施形態中，係針對第2實施形態中與針腳配列基板的製造方法相關的針腳配列裝置來作說明，然而，當然也可實現與第1實施形態之針腳配列基板的製造方法相關的針腳配列裝置。具體而言，只要去除刷子17-1及17-2之其中一者，即可實施第1實施形態之針腳配列基板的製造方法。For example, in the fourth embodiment, the stitch arrangement device relating to the method of manufacturing the stitching substrate in the second embodiment will be described. However, it is needless to say that the method of manufacturing the stitching substrate according to the first embodiment can be realized. Pin arrangement device. Specifically, the method of manufacturing the stitching substrate of the first embodiment can be carried out by removing one of the brushes 17-1 and 17-2.
再者，第4實施形態中係說明使用遮罩構件13的情況，然而，在未使用遮罩構件13的情況亦同樣，只要將針腳***基板11的主面的針腳滑行面45A構成為同一平面程度，即與第4實施形態同樣可獲得針腳的飛散防止效果。In the fourth embodiment, the case where the mask member 13 is used will be described. However, in the case where the mask member 13 is not used, the stitch sliding surface 45A of the main surface of the substrate 11 is inserted into the same plane. The degree of scattering prevention effect of the stitches can be obtained in the same manner as in the fourth embodiment.
11．．．針腳***基板11. . . Pin insertion into the substrate
11A．．．針腳***基板的主面11A. . . The pin is inserted into the main surface of the substrate
11B．．．針腳***基板的背面11B. . . The pins are inserted into the back of the substrate
11C．．．針腳***孔11C. . . Pin insertion hole
11D．．．傾斜面11D. . . Inclined surface
13．．．遮罩構件13. . . Mask member
13A．．．開口部13A. . . Opening
15．．．針腳15. . . stitch
151．．．針腳的前端部151. . . Front end of the stitch
152．．．針腳的基端部152. . . Base end of the stitch
17．．．刷子17. . . brush
17-1、17-2．．．一對刷子17-1, 17-2. . . a pair of brushes
10、19．．．針腳配列基板10, 19. . . Pin arrangement substrate
21．．．配線基板twenty one. . . Wiring substrate
21A．．．配線基板的連接部21A. . . Wiring board connection portion
31．．．基板定位框31. . . Substrate positioning frame
32．．．支持板32. . . Support board
40．．．針腳配列裝置40. . . Pin arrangement
41．．．真空容器41. . . Vacuum container
42．．．負壓配管42. . . Negative pressure piping
43．．．旋轉軸43. . . Rotary axis
45．．．針腳飛散防止蓋45. . . Pin fly prevention cover
45A．．．針腳滑行面45A. . . Pin sliding surface
46．．．刷子往復機構46. . . Brush reciprocating mechanism
第1圖係第1實施形態之配線基板之製造方法的一步驟圖。Fig. 1 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第2圖同樣為第1實施形態之配線基板之製造方法的一步驟圖。Fig. 2 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第3圖同樣為第1實施形態之配線基板之製造方法的一步驟圖。Fig. 3 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第4圖同樣為第1實施形態之配線基板之製造方法的一步驟圖。Fig. 4 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第5圖同樣為第1實施形態之配線基板之製造方法的一步驟圖。Fig. 5 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第6圖同樣為第1實施形態之配線基板之製造方法的一步驟圖。Fig. 6 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第7圖同樣為第1實施形態之配線基板之製造方法的一步驟圖。Fig. 7 is a step view showing a method of manufacturing the wiring board of the first embodiment.
第8圖係表示針腳***基板的傾斜角度、與針腳對針腳***孔的***率的關係之曲線圖。Fig. 8 is a graph showing the relationship between the inclination angle of the stitch insertion substrate and the insertion rate of the stitches to the stitch insertion holes.
第9圖係第2實施形態之配線基板之製造方法的一步驟圖。Fig. 9 is a step view showing a method of manufacturing the wiring board of the second embodiment.
第10圖同樣為第2實施形態之配線基板之製造方法的一步驟圖。Fig. 10 is a step view showing a method of manufacturing the wiring board of the second embodiment.
第11圖同樣為第2實施形態之配線基板之製造方法的一步驟圖。Fig. 11 is a step view showing a method of manufacturing the wiring board of the second embodiment.
第12圖係第3實施形態之配線基板之製造方法的步驟圖。Fig. 12 is a process chart showing a method of manufacturing the wiring board of the third embodiment.
第13圖同樣為第3實施形態之配線基板之製造方法的步驟圖。Fig. 13 is a step diagram similar to the method of manufacturing the wiring board of the third embodiment.
第14圖同樣為第3實施形態之配線基板之製造方法的步驟圖。Fig. 14 is a step diagram similar to the method of manufacturing the wiring board of the third embodiment.
第15圖係實施型態之針腳配列裝置的示意構成圖。Fig. 15 is a schematic configuration diagram of a stitching device of an embodiment.
11．．．針腳***基板11. . . Pin insertion into the substrate
11A．．．針腳***基板的主面11A. . . The pin is inserted into the main surface of the substrate
11B．．．針腳***基板的背面11B. . . The pins are inserted into the back of the substrate
11C．．．針腳***孔11C. . . Pin insertion hole
11D．．．傾斜面11D. . . Inclined surface
13．．．遮罩構件13. . . Mask member
13A．．．開口部13A. . . Opening
15．．．針腳15. . . stitch
17．．．刷子17. . . brush
151．．．針腳的前端部151. . . Front end of the stitch
152．．．針腳的基端部152. . . Base end of the stitch
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009283141 | 2009-12-14 | ||
| JP2010186688A JP5468495B2 (en) | 2009-12-14 | 2010-08-23 | Wiring board manufacturing method and pin array device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201131725A TW201131725A (en) | 2011-09-16 |
| TWI488277B true TWI488277B (en) | 2015-06-11 |
Family
ID=44461224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099143401A TWI488277B (en) | 2009-12-14 | 2010-12-13 | Method for manufacturing wiring substrate and device for arranging pins |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5468495B2 (en) |
| TW (1) | TWI488277B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201432080A (en) * | 2013-02-01 | 2014-08-16 | Chiuan Yan Technology Co Ltd | Negative pressure dust-free alignment mechanism |
| JP6927541B1 (en) * | 2020-10-06 | 2021-09-01 | 公立大学法人 富山県立大学 | Pin arrayer, array for pin array and pin array method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040070084A1 (en) * | 2002-08-02 | 2004-04-15 | Takeo Kuramoto | Solder ball assembly, a method for its manufacture, and a method of forming solder bumps |
| TW200849427A (en) * | 2007-06-13 | 2008-12-16 | Phoenix Prec Technology Corp | Package substrate pinning method |
| TW200905822A (en) * | 2007-07-16 | 2009-02-01 | Phoenix Prec Technology Corp | Method of fabricating pin grid array package substrate |
| TW200919602A (en) * | 2007-10-26 | 2009-05-01 | Ase Electronics Inc | Pins planting process of pin grid array |
| TW200919614A (en) * | 2007-10-26 | 2009-05-01 | Ase Electronics Inc | Pins aligning method and pin up tray thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634368B2 (en) * | 1986-08-20 | 1994-05-02 | イビデン株式会社 | Pin insertion device |
| JPH06252591A (en) * | 1993-02-25 | 1994-09-09 | Matsushita Electric Works Ltd | Arraying method for pin |
| JP3212964B2 (en) * | 1999-03-19 | 2001-09-25 | 日本特殊陶業株式会社 | Pin Standing Jig and Pin Standing Board Manufacturing Method |
| JP3715137B2 (en) * | 1999-06-08 | 2005-11-09 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
| JP4552347B2 (en) * | 2001-04-18 | 2010-09-29 | イビデン株式会社 | Conductor pin joining method using insertion guide jig |
-
2010
- 2010-08-23 JP JP2010186688A patent/JP5468495B2/en not_active Expired - Fee Related
- 2010-12-13 TW TW099143401A patent/TWI488277B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040070084A1 (en) * | 2002-08-02 | 2004-04-15 | Takeo Kuramoto | Solder ball assembly, a method for its manufacture, and a method of forming solder bumps |
| TW200849427A (en) * | 2007-06-13 | 2008-12-16 | Phoenix Prec Technology Corp | Package substrate pinning method |
| TW200905822A (en) * | 2007-07-16 | 2009-02-01 | Phoenix Prec Technology Corp | Method of fabricating pin grid array package substrate |
| TW200919602A (en) * | 2007-10-26 | 2009-05-01 | Ase Electronics Inc | Pins planting process of pin grid array |
| TW200919614A (en) * | 2007-10-26 | 2009-05-01 | Ase Electronics Inc | Pins aligning method and pin up tray thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201131725A (en) | 2011-09-16 |
| JP2011146677A (en) | 2011-07-28 |
| JP5468495B2 (en) | 2014-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3871486B2 (en) | Semiconductor device | |
| TWI488277B (en) | Method for manufacturing wiring substrate and device for arranging pins | |
| US20130161823A1 (en) | Semiconductor Device and Method of Manufacturing the Same | |
| US8836106B2 (en) | Semiconductor device | |
| KR20080022452A (en) | Pop package and method of producing the same | |
| US20020063319A1 (en) | Direct-downset flip-chip package assembly and method of fabricating the same | |
| TWI241697B (en) | Semiconductor package and fabrication method thereof | |
| TW200423390A (en) | Solid-state photographing apparatus and its manufacturing method | |
| JP3418385B2 (en) | Method of forming semiconductor integrated circuit package and method of manufacturing the same | |
| JP2009520341A (en) | Electronic components with high density and low cost wearability | |
| EP1688992A1 (en) | Column suction head and column mounting method | |
| KR101851818B1 (en) | Light-emitting device, and method for manufacturing circuit board | |
| CN106104791B (en) | The manufacturing method of attachment structure, installation fixture, the manufacturing device of attachment structure, photographic device and endoscope apparatus | |
| EP1933377A3 (en) | Semiconductor device and method for manufacturing the same | |
| US11437340B2 (en) | Electronic module, method of manufacturing connector, and method of manufacturing electronic module | |
| KR20180092719A (en) | micro LED module and method for fabricating the same | |
| US20100323538A1 (en) | Connector assembly having alignment members for holding a module | |
| JP6179843B2 (en) | Mounting apparatus and mounting method | |
| JP4910831B2 (en) | Thermocompression bonding head, component mounting apparatus and component mounting method | |
| JP6644352B2 (en) | Semiconductor device and manufacturing method thereof | |
| JP2012069780A (en) | Method for manufacturing resin seal type semiconductor device, resin seal type semiconductor device and lead frame for the same | |
| JP2020155703A (en) | Pickup device | |
| CN210806060U (en) | Gold needle and circuit board assembly | |
| KR20230127458A (en) | Vertical alignment assembly of light emitting device and method of vertically aligning light emitting device | |
| JP2004095796A (en) | Circuit board suction pad and method of cutting the board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |