TWI487439B - Flexible circuit board, display device comprising the same, and fabricating method of the flexible circuit board - Google Patents

Flexible circuit board, display device comprising the same, and fabricating method of the flexible circuit board Download PDF

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Publication number
TWI487439B
TWI487439B TW101143734A TW101143734A TWI487439B TW I487439 B TWI487439 B TW I487439B TW 101143734 A TW101143734 A TW 101143734A TW 101143734 A TW101143734 A TW 101143734A TW I487439 B TWI487439 B TW I487439B
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Taiwan
Prior art keywords
pattern
circuit board
wiring
base film
flexible circuit
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TW101143734A
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Chinese (zh)
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TW201322846A (en
Inventor
Sang Chul Lee
Young Min Yun
Je Young Jeoung
Chang Kyun Yim
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Stemco Co Ltd
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Publication of TW201322846A publication Critical patent/TW201322846A/en
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Publication of TWI487439B publication Critical patent/TWI487439B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)

Description

撓性電路板及包括該撓性電路板的顯示裝置暨撓性電路板的製造方法 Flexible circuit board and display device including the same and manufacturing method of flexible circuit board

本發明有關撓性電路板及包括該撓性電路板的顯示裝置、撓性電路板的製造方法。 The present invention relates to a flexible circuit board, a display device including the same, and a method of manufacturing a flexible circuit board.

最近，液晶顯示裝置(Liquid Crystal Display，LCD)、電漿顯示面板(Plasma Display Panel，PDP)等平板顯示裝置(Flat Panel Display，FPD)受到人們的青睞。 Recently, flat panel displays (FPDs) such as liquid crystal display (LCD) and plasma display panel (PDP) have been favored.

這些平板顯示裝置包括顯示圖像的畫面顯示部和向畫面顯示部傳遞電信號的驅動用印刷電路板。 These flat panel display devices include a screen display portion that displays an image and a driving printed circuit board that transmits an electric signal to the screen display portion.

另外，驅動用印刷電路板和畫面顯示部可通過撓性電路板電連接。但是，根據驅動用印刷電路板和畫面顯示部的位置，撓性電路板需彎曲才能附著於驅動用印刷電路板和畫面顯示部。此時，撓性電路板因要恢復到原來狀態的力，即欲回彈(spring-back)的力的作用，難以將撓性電路板附著於驅動用印刷電路板和畫面顯示部。 Further, the driving printed circuit board and the screen display portion can be electrically connected by a flexible circuit board. However, depending on the position of the driving printed circuit board and the screen display portion, the flexible wiring board needs to be bent to adhere to the driving printed circuit board and the screen display portion. At this time, it is difficult for the flexible wiring board to adhere to the driving printed circuit board and the screen display portion due to the force to be restored to the original state, that is, the force to be spring-backed.

本發明的目的在於提供一種可防止回彈的撓性電路板。 It is an object of the present invention to provide a flexible circuit board that prevents rebound.

本發明的另一目的在於提供包括上述撓性電路板的顯示裝置。 Another object of the present invention is to provide a display device including the above flexible circuit board.

本發明的又一目的在於提供可防止回彈的撓性電路板的製造方法。 It is still another object of the present invention to provide a method of manufacturing a flexible circuit board that can prevent rebound.

本發明目的不限於上述課題，而對於本領域技術人員，未提及的其他課題可通過下面的記載將變得更加明瞭。 The object of the present invention is not limited to the above-described problems, and other problems that are not mentioned by those skilled in the art can be further clarified by the following description.

為達到上述目的，本發明的一個方面(aspect)的撓性電路板，包括：基膜，包含彎曲(bending)區域；配線圖案，形成於上述基膜的一面上並內置驅動晶片；及導電性防回彈(spring-back)圖案，在上述基膜的另一面上並與上述彎曲區域的至少一部分重疊。 To achieve the above object, an aspect of a flexible circuit board includes: a base film including a bending region; a wiring pattern formed on one side of the base film and having a built-in driving wafer; and conductivity A spring-back pattern overlaps at least a portion of the curved region on the other side of the base film.

為達到另一目的，本發明的一個方面的顯示裝置，包括：圖像顯示部；驅動用印刷電路板，內置用於向上述圖像顯示部提供驅動信號的主控制器(main controller)；及撓性電路板，通過彎曲區域的彎曲電連接上述圖像顯示部和上述驅動用印刷電路板。 In order to achieve another object, a display device according to an aspect of the present invention includes: an image display unit; a driving printed circuit board having a main controller for providing a driving signal to the image display unit; The flexible wiring board electrically connects the image display unit and the driving printed circuit board by bending of a curved region.

為達到又一目的，本發明的一個方面的撓性電路板的製造方法包括如下步驟：形成包括彎曲(bending)區域的基膜；在上述基膜的一面上形成配線圖案，並在上述基膜的另一面上形成與上述彎曲區域的至少一部分重疊的導電性防回彈(spring-back)圖案，而且，同時形成上述配線圖案和上述回彈防止圖案。 In order to achieve still another object, a method of manufacturing a flexible circuit board according to an aspect of the present invention includes the steps of: forming a base film including a bending region; forming a wiring pattern on one side of the base film, and on the base film On the other surface, a conductive spring-back pattern overlapping at least a part of the curved region is formed, and the wiring pattern and the rebound preventing pattern are simultaneously formed.

為達到又一目的，本發明的另一個方面的撓性電路板的製造方法包括如下步驟：形成包括彎曲(bending)區域的基膜；在上述 基膜的一面上形成配線圖案，並在上述基膜的另一面上，利用黏接層黏接導電層並用第一阻焊膜層覆蓋上述配線圖案，通過蝕刻上述導電層形成與上述彎曲區域的至少一部分重疊的防回彈(spring-back)圖案。 In order to achieve still another object, a method of manufacturing a flexible circuit board according to another aspect of the present invention includes the steps of: forming a base film including a bending region; a wiring pattern is formed on one surface of the base film, and the conductive layer is adhered by the adhesive layer on the other surface of the base film, and the wiring pattern is covered with the first solder resist film layer, and the conductive layer is formed by etching the conductive layer At least a portion of the overlapping spring-back pattern.

本發明的其他具體事項，將通過下面的詳細說明及附圖變得更加明瞭。 Other details of the present invention will become more apparent from the following detailed description and the appended claims.

1‧‧‧撓性基板 1‧‧‧Flexible substrate

2‧‧‧撓性基板 2‧‧‧Flexible substrate

3‧‧‧撓性基板 3‧‧‧Flexible substrate

4‧‧‧撓性基板 4‧‧‧Flexible substrate

6‧‧‧撓性基板 6‧‧‧Flexible substrate

100‧‧‧基膜 100‧‧‧ base film

105‧‧‧第一導電層 105‧‧‧First conductive layer

130、140、150、160‧‧‧配線圖案 130, 140, 150, 160‧‧‧ wiring patterns

151‧‧‧防氧化膜 151‧‧‧Anti-oxidation film

161‧‧‧防氧化膜 161‧‧‧Anti-oxidation film

170、180‧‧‧保護膜 170, 180‧‧‧ protective film

197‧‧‧貫通配線 197‧‧‧through wiring

198‧‧‧貫通配線 198‧‧‧through wiring

199‧‧‧防回彈圖案 199‧‧‧Anti-rebound pattern

202‧‧‧黏接層 202‧‧‧ adhesive layer

202a‧‧‧黏接層 202a‧‧‧Adhesive layer

205‧‧‧第二導電層 205‧‧‧Second conductive layer

210‧‧‧防回彈圖案 210‧‧‧Anti-rebound pattern

212‧‧‧假圖案 212‧‧‧Fake patterns

300‧‧‧驅動晶片 300‧‧‧Drive chip

400‧‧‧薄膜電晶體基板 400‧‧‧thin film substrate

410‧‧‧驅動用印刷電路板 410‧‧‧Drive PCB

420‧‧‧濾色片 420‧‧‧ color filters

1310‧‧‧第一阻焊膜層 1310‧‧‧First solder mask

1310a‧‧‧第一阻焊膜圖案 1310a‧‧‧First solder mask pattern

1310b‧‧‧第一阻焊膜圖案 1310b‧‧‧First solder mask pattern

1313‧‧‧第一阻焊膜層 1313‧‧‧First solder mask

1320‧‧‧第二阻焊膜層 1320‧‧‧Second solder mask

1320a‧‧‧第二阻焊膜圖案 1320a‧‧‧second solder mask pattern

1323a‧‧‧第二阻焊膜圖案 1323a‧‧‧second solder mask pattern

圖1及圖2為本發明第一實施例的撓性基板的平面圖；圖3為圖1及圖2的沿C-C線切斷的截面圖；圖4為本發明第二實施例的撓性基板的平面圖；圖5為圖4的沿D-D線切斷的截面圖；圖6為本發明第三實施例的撓性基板的平面圖；圖7a為本發明第四實施例的撓性基板的截面圖；圖7b為本發明第五實施例的撓性基板的截面圖；圖7c為本發明第六實施例的撓性基板的截面圖；圖8為本發明幾個實施例的顯示裝置截面圖；圖9至圖12為本發明第二實施例的撓性基板的製造方法的中間步驟示意圖；圖13至圖19為本發明第四實施例的撓性基板的製造方法的中間步驟示意圖。 1 and 2 are plan views of a flexible substrate according to a first embodiment of the present invention; FIG. 3 is a cross-sectional view taken along line CC of FIGS. 1 and 2; and FIG. 4 is a flexible substrate according to a second embodiment of the present invention. Figure 5 is a cross-sectional view taken along line DD of Figure 4; Figure 6 is a plan view of a flexible substrate according to a third embodiment of the present invention; and Figure 7a is a cross-sectional view of a flexible substrate according to a fourth embodiment of the present invention; Figure 7b is a cross-sectional view of a flexible substrate according to a fifth embodiment of the present invention; Figure 7c is a cross-sectional view of a flexible substrate according to a sixth embodiment of the present invention; and Figure 8 is a cross-sectional view of a display device according to several embodiments of the present invention; 9 to FIG. 12 are schematic diagrams showing intermediate steps of a method of manufacturing a flexible substrate according to a second embodiment of the present invention; and FIGS. 13 to 19 are schematic diagrams showing intermediate steps of a method of manufacturing a flexible substrate according to a fourth embodiment of the present invention.

本發明的優點及特徵和上述方法，將結合附圖和將要詳細描述的實施例變得明瞭。但是，本發明不受下述實施例的限制而可通過各種形式實現，本實施例的目的旨在更好地說明本發明，為本發明所屬技術領域的技術人員理解提供幫助，而本發明只受申請專利範圍的限制。在本說明書中，相同的圖式元件符號指相同的元件。 The advantages and features of the present invention and the above-described methods will be apparent from the accompanying drawings and embodiments. However, the present invention is not limited by the following embodiments and can be implemented in various forms. The purpose of the present invention is to better explain the present invention and to provide assistance to those skilled in the art to which the present invention pertains, but the present invention is only Subject to the scope of the patent application. Throughout the specification, the same drawing element symbols refer to the same elements.

說一個元件(elements)與另一個元件“連接(connected to)”或“耦合(coupled to)”是指與其他元件直接連接或耦合的情況或通過中間的其他元件接合的情況。相反，說一個元件與另一個元件“直接連接(directly connected to)”或“直接耦合(directly coupled to)”是指不通過中間的元件直接接合的情況。在本說明書中，相同的附圖標記指相同的要素。“及/或”包括所涉及的各要素及一個以上的所有組合。 It is meant that "elements" and "coupled to" or "coupled to" to another element refer to the condition of being directly connected or coupled to other elements or being joined by other elements in the middle. In contrast, the statement that one element is "directly connected to" or "directly coupled to" to another element means that it is not directly joined through the intermediate element. Throughout the specification, the same reference numerals refer to the same elements. "and/or" includes all of the elements involved and all combinations of one or more.

雖然“第一、第二”等術語為說明各種元件、結構及/或部分所使用，但這些元件、結構及/或部分不受這些術語的限制。這些術語只是用於從其他元件、結構或部分區分一個元件、結構或部分。因此，下述的“第一元件、第二結構或第一部分”，在本發明的技術思想內，也可以是“第二元件、第二結構或第二部分”。 Although the terms "first, second" and the like are used to describe various elements, structures, and/or portions, these elements, structures, and/or portions are not limited by these terms. These terms are only used to distinguish one element, structure, or part. Therefore, the "first element, the second structure, or the first portion" described below may be "the second element, the second structure, or the second portion" within the technical idea of the present invention.

用於本說明書的術語用於說明實施例，而非限制本發明。在本說明書中，在沒有特別說明的情況下，單數也可以指複數。用於說明書的“包括(comprises)”及/或“包括(comprising)”不排除所涉及的結構、步驟、動作及/或元件中包括或添加一個以上的其他結構、步驟、動作及/或組件。 The terminology used in the description is for the purpose of illustration and not limitation. In the present specification, a singular may also mean a plural number unless otherwise specified. The use of "comprises" and / or "comprising" in the specification does not exclude the inclusion of or addition of one or more other structures, steps, acts and/or components in the structures, steps, acts and/or components involved. .

如果沒有其他的定義，用於本說明書的所有術語(技術及科學術語)所指的意思是本領域技術人員通常所理解的意思。另外，一般所使用的定義在詞典中的術語，在沒有明確的其他定義之外，不能過度誇大。 Unless otherwise defined, all terms (technical and scientific terms) used in the specification mean the meaning as commonly understood by one of ordinary skill in the art. In addition, the terms used in the dictionary, which are generally used, are not exaggerated in the absence of explicit other definitions.

圖1及圖2為本發明第一實施例的撓性基板的平面圖。圖3為圖1及圖2的沿C-C線切斷的截面圖。圖1及圖2分別顯示上述撓性電路板的一面和另一面。為了便於說明，在圖3中表示在撓性電路板上內置驅動晶片(請參考300)的狀態。 1 and 2 are plan views of a flexible substrate according to a first embodiment of the present invention. Fig. 3 is a cross-sectional view taken along line C-C of Figs. 1 and 2; 1 and 2 show one side and the other side of the above flexible circuit board, respectively. For convenience of explanation, a state in which a driving wafer (refer to 300) is built in a flexible circuit board is shown in FIG.

如圖1所示，本發明第一實施例的撓性基板1包括基膜100、配線圖案130、140、150、160、防回彈(spring-back)圖案210及保護膜170、180等。 As shown in FIG. 1, a flexible substrate 1 according to a first embodiment of the present invention includes a base film 100, wiring patterns 130, 140, 150, 160, a spring-back pattern 210, protective films 170, 180, and the like.

基膜100可由具備20~100μm厚度的絕緣性物質構成。基膜100可由聚醯亞胺(polyimide)、聚酯(polyester)、聚乙烯對苯二甲酸酯(PET，Polyethylene Terephthalate)等高分子樹脂構成。 The base film 100 can be composed of an insulating material having a thickness of 20 to 100 μm. The base film 100 may be composed of a polymer resin such as polyimide, polyester, or polyethylene terephthalate.

如圖所示，在基膜100上可具備內置驅動晶片300的內置區域A，而且，還可具備可彎曲的彎曲(bending)區域B。 As shown in the figure, the base film 100 may have a built-in area A in which the drive wafer 300 is built in, and may have a bendable area B that is bendable.

配線圖案130、140、150、160形成於基膜100的一面上。如圖所示，配線圖案130、140、150、160可包括相互隔開的第一配線部130、150和第二配線部140、160。例如，第一配線部130、150和第二配線部140、160導電性大的物質，例如金、鋁、銅等金屬構成。雖然未圖示，在第一配線部130、150和第二配線部140、160 的表面，可形成錫(Sn)、鎳、金或鉛等鍍金層。 Wiring patterns 130, 140, 150, 160 are formed on one surface of the base film 100. As shown, the wiring patterns 130, 140, 150, 160 may include first wiring portions 130, 150 and second wiring portions 140, 160 that are spaced apart from each other. For example, the first wiring portions 130 and 150 and the second wiring portions 140 and 160 are highly conductive, and are made of a metal such as gold, aluminum or copper. Although not illustrated, in the first wiring portions 130, 150 and the second wiring portions 140, 160 The surface can form a gold plating layer such as tin (Sn), nickel, gold or lead.

另外，第一配線部130、150和第二配線部140、160可指多個輸入配線和多個輸出配線。第一配線部130、150的內部輸入端子130和第二配線部140、160的內部輸出端子140可各連接於驅動晶片300的一側和另一側。驅動晶片300可以覆晶(flip chip)方式內置於內部輸入端子130及內部輸出端子140。內置區域A中內置驅動晶片300。例如，由驅動用印刷電路板(未圖示)提供的驅動/控制信號通過第一配線部130、150提供至驅動晶片300，而經驅動晶片300處理的驅動/控制信號可通過第二配線部140、160傳遞至圖像顯示部(未圖示)。 In addition, the first wiring portions 130, 150 and the second wiring portions 140, 160 may refer to a plurality of input wirings and a plurality of output wirings. The internal input terminal 130 of the first wiring portions 130, 150 and the internal output terminal 140 of the second wiring portions 140, 160 may be connected to one side and the other side of the driving wafer 300, respectively. The driving wafer 300 can be built in the flip chip type in the internal input terminal 130 and the internal output terminal 140. The drive chip 300 is built in the built-in area A. For example, a driving/control signal supplied from a driving printed circuit board (not shown) is supplied to the driving wafer 300 through the first wiring portions 130, 150, and a driving/control signal processed through the driving wafer 300 may pass through the second wiring portion. 140 and 160 are transmitted to an image display unit (not shown).

如圖1所示，第一配線部130、150和第二配線部140、160，具體而言，內部輸入端子130和內部輸出端子140可相互隔開並形成多個，但非限制。 As shown in FIG. 1, the first wiring portions 130, 150 and the second wiring portions 140, 160, specifically, the internal input terminal 130 and the internal output terminal 140 may be spaced apart from each other and formed in plurality, but are not limited.

另外，為防止配線圖案130、140、150、160的氧化，可圍繞配線圖案130、140、150、160形成防氧化膜151、161。防氧化膜151、161由比配線圖案130、140、150、160更難氧化的物質構成。配線圖案130、140、150、160由銅構成的情況下，防氧化膜151、161可由錫(Sn)或金(Au)構成。另外，防氧化膜151、161起到提高驅動晶片300的突起(bump)和配線圖案130、140、150、160的貼緊力的作用。 Further, in order to prevent oxidation of the wiring patterns 130, 140, 150, 160, the oxidation preventing films 151, 161 may be formed around the wiring patterns 130, 140, 150, 160. The oxidation preventing films 151 and 161 are made of a substance which is more difficult to oxidize than the wiring patterns 130, 140, 150, and 160. When the wiring patterns 130, 140, 150, and 160 are made of copper, the oxidation preventing films 151 and 161 may be made of tin (Sn) or gold (Au). Further, the oxidation preventing films 151 and 161 function to increase the adhesion of the bumps of the driving wafer 300 and the wiring patterns 130, 140, 150, and 160.

保護膜170、180覆蓋第一配線部130、150和第二配線部140、160，而內部輸入端子130、內部輸出端子140露出。保護膜170、180從外部衝擊和腐蝕物質保護第一配線部130、150和第二配線部 140、160。保護膜170、180由阻焊膜(solder resist)構成為宜，但保護膜170、180不限於此。 The protective films 170 and 180 cover the first wiring portions 130 and 150 and the second wiring portions 140 and 160, and the internal input terminal 130 and the internal output terminal 140 are exposed. The protective films 170, 180 protect the first wiring portions 130, 150 and the second wiring portion from external impact and corrosive substances 140, 160. The protective films 170 and 180 are preferably formed of a solder resist, but the protective films 170 and 180 are not limited thereto.

防回彈圖案210形成於基膜100的另一面，而且，與彎曲區域B的至少一部分重疊。防回彈圖案210可由導電性物質構成，但非限制。另外，防回彈圖案210可由與配線圖案130、140、150、160相同的物質構成，但非限制。防回彈圖案210可由金、鋁、銅等金屬構成。如將要說明的內容一樣，防回彈圖案210可與配線圖案130、140、150、160同時形成，或單獨形成。雖然未圖示，但可在防回彈圖案210上可形成防氧化膜。防回彈圖案210由銅構成的情況下，防氧化膜可由錫(Sn)或金(Au)構成。 The anti-rebound pattern 210 is formed on the other side of the base film 100 and overlaps at least a portion of the curved region B. The anti-rebound pattern 210 may be composed of a conductive material, but is not limited. In addition, the anti-rebound pattern 210 may be composed of the same material as the wiring patterns 130, 140, 150, 160, but is not limited. The anti-rebound pattern 210 may be composed of a metal such as gold, aluminum, or copper. As will be described, the anti-rebound pattern 210 may be formed simultaneously with the wiring patterns 130, 140, 150, 160, or separately. Although not shown, an oxidation preventing film may be formed on the anti-rebound pattern 210. When the anti-rebound pattern 210 is made of copper, the oxidation preventing film may be made of tin (Sn) or gold (Au).

防回彈圖案210由金屬構成的情況下，防回彈圖案210可具有塑性。因此，若防回彈圖案210被彎曲，則防回彈圖案210難以恢復到原來的形狀。因此，形成於彎曲區域B的防回彈圖案210可支撐基膜100不回到原來的狀態。 In the case where the anti-rebound pattern 210 is made of metal, the anti-rebound pattern 210 may have plasticity. Therefore, if the anti-rebound pattern 210 is bent, it is difficult for the anti-rebound pattern 210 to return to the original shape. Therefore, the anti-rebound pattern 210 formed in the curved region B can support the base film 100 not to return to the original state.

圖4為本發明第二實施例的撓性基板的平面圖。圖5為圖4的沿D-D線切斷的截面圖。為了便於說明，下面只說明與圖1至圖3不同的部分。 4 is a plan view showing a flexible substrate according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view taken along line D-D of Fig. 4; For the convenience of description, only the parts different from those of Figs. 1 to 3 will be described below.

如圖4及圖5所示，在本發明第二實施例的撓性電路板2中，防回彈圖案210與內置區域A的至少一部分重疊。即，防回彈圖案210與驅動晶片300的至少一部分重疊。在圖4中，防回彈圖案210和整個內置區域A重疊，但非限制。 As shown in FIGS. 4 and 5, in the flexible wiring board 2 of the second embodiment of the present invention, the anti-rebound pattern 210 overlaps at least a part of the built-in area A. That is, the anti-rebound pattern 210 overlaps at least a portion of the drive wafer 300. In FIG. 4, the anti-rebound pattern 210 overlaps with the entire built-in area A, but is not limited.

在驅動晶片300工作時，將產生大量的熱。防回彈圖案210可有效散去從驅動晶片300產生的熱。為了最大限度地提高上述散熱性 ，防回彈圖案210準確地延長形成至驅動晶片300的位置。另外，防回彈圖案210的橫截面積可根據散熱程度調整，以有效散去從驅動晶片300產生的熱。 When the drive wafer 300 is in operation, a large amount of heat will be generated. The anti-rebound pattern 210 can effectively dissipate heat generated from the driving wafer 300. In order to maximize the above heat dissipation The anti-rebound pattern 210 accurately extends the position formed to drive the wafer 300. In addition, the cross-sectional area of the anti-rebound pattern 210 can be adjusted according to the degree of heat dissipation to effectively dissipate heat generated from the driving wafer 300.

圖6為本發明第三實施例的撓性基板的平面圖。為了便於說明，下面只說明與圖1至圖3不同的部分。 Fig. 6 is a plan view showing a flexible substrate according to a third embodiment of the present invention. For the convenience of description, only the parts different from those of Figs. 1 to 3 will be described below.

如圖6所示，在本發明第三實施例的撓性電路板3中，若假設彎曲區域B的長度為L1，則防回彈圖案210的長度為L2。即，防回彈圖案210形成於驅動晶片300整體之上。這樣，防回彈圖案210可完全防止撓性電路板3回彈。 As shown in FIG. 6, in the flexible wiring board 3 of the third embodiment of the present invention, if the length of the curved region B is assumed to be L1, the length of the anti-rebound pattern 210 is L2. That is, the anti-rebound pattern 210 is formed over the entire driving wafer 300. Thus, the anti-rebound pattern 210 can completely prevent the flexible circuit board 3 from rebounding.

圖7a為本發明第四實施例的撓性基板的截面圖。為了便於說明，下面只說明與圖5不同的部分。 Fig. 7a is a cross-sectional view showing a flexible substrate according to a fourth embodiment of the present invention. For the convenience of explanation, only the parts different from FIG. 5 will be described below.

如圖7a所示，在本發明第四實施例的撓性電路板4中，防回彈圖案210可利用黏接層202黏接於基膜100上。黏接層202可包含環氧(epoxy)樹脂等黏接性物質。另外，為了最大限度地提高散熱效果，黏接層202還可包括導熱性物質。 As shown in FIG. 7a, in the flexible circuit board 4 of the fourth embodiment of the present invention, the anti-rebound pattern 210 can be adhered to the base film 100 by the adhesive layer 202. The adhesive layer 202 may contain an adhesive substance such as an epoxy resin. In addition, in order to maximize the heat dissipation effect, the adhesive layer 202 may further include a thermally conductive substance.

圖7b為本發明第五實施例的撓性基板的截面圖。 Figure 7b is a cross-sectional view showing a flexible substrate according to a fifth embodiment of the present invention.

如圖7b所示，撓性電路板6可以是在兩面形成配線圖案130、140、150、160的雙面電路板。即，可在一面(或表面)及另一面(或背面)形成配線圖案130、140、150、160，而形成於雙面的配線圖案130、140、150、160可通過在基膜100上形成貫通配線198電連接。在這樣的雙面電路板6上，在表面或背面的未形成配線圖案130、140、150、160的部分，可形成防回彈圖案210。 As shown in FIG. 7b, the flexible circuit board 6 may be a double-sided circuit board in which wiring patterns 130, 140, 150, 160 are formed on both sides. That is, the wiring patterns 130, 140, 150, 160 may be formed on one surface (or surface) and the other surface (or the back surface), and the wiring patterns 130, 140, 150, 160 formed on both sides may be formed on the base film 100. The through wiring 198 is electrically connected. On such a double-sided circuit board 6, an anti-rebound pattern 210 can be formed on a portion of the front surface or the back surface where the wiring patterns 130, 140, 150, and 160 are not formed.

圖7c為本發明第六實施例的撓性基板的截面圖。 Figure 7c is a cross-sectional view showing a flexible substrate according to a sixth embodiment of the present invention.

如圖7c所示，為提高防回彈圖案210的散熱功能，在基膜100上形成貫通配線197並通過貫通配線197使防回彈圖案210延長至內置驅動晶片300的面。這樣，驅動晶片300所產生的熱可迅速傳遞至防回彈圖案210。 As shown in FIG. 7c, in order to improve the heat dissipation function of the anti-rebound pattern 210, the through wiring 197 is formed on the base film 100, and the anti-rebound pattern 210 is extended to the surface of the built-in driving wafer 300 by the through wiring 197. Thus, the heat generated by the driving wafer 300 can be quickly transferred to the anti-rebound pattern 210.

在此，可使上述防回彈圖案210延長至內置上述驅動晶片300的面而形成假圖案(dummy pattern)212，而上述假圖案212的位置可位於上述配線圖案150、160的週邊或上述配線圖案130、140之間的上述驅動晶片300的內置區域。 Here, the anti-rebound pattern 210 may be extended to a surface on which the driving wafer 300 is built to form a dummy pattern 212, and the position of the dummy pattern 212 may be located at a periphery of the wiring patterns 150, 160 or the wiring. The built-in area of the above-described driving wafer 300 between the patterns 130, 140.

另外，在將上述防回彈圖案210延長至內置上述驅動晶片300的面時，可與上述配線圖案130、140、150、160中的接地圖案。 Further, when the anti-rebound pattern 210 is extended to the surface on which the drive wafer 300 is built, the ground pattern in the wiring patterns 130, 140, 150, and 160 can be used.

圖8為本發明幾個實施例的顯示裝置截面圖。 Figure 8 is a cross-sectional view of a display device in accordance with several embodiments of the present invention.

如圖8所示，本發明幾個實施例的顯示裝置5，可包括：圖像顯示部400、420；驅動用印刷電路板410，內置用於向圖像顯示部400、420提供驅動信號的主控制器(main controller)；及撓性電路板(例如，3)，電連接圖像顯示部400、420和驅動用印刷電路板410。圖像顯示部400、420可包括薄膜電晶體基板400和濾色片420。 As shown in FIG. 8, a display device 5 according to several embodiments of the present invention may include: image display portions 400, 420; a driving printed circuit board 410 having built-in driving signals for providing image signals to the image display portions 400, 420. A main controller (main controller); and a flexible circuit board (for example, 3) electrically connect the image display portions 400 and 420 and the driving printed circuit board 410. The image display portions 400, 420 may include a thin film transistor substrate 400 and a color filter 420.

可利用圖1至圖7c使用上述撓性電路板1~4中的任何一種，但示例性地，顯示在整個彎曲區域B上形成防回彈圖案210的撓性電路板3。通過彎曲彎曲區域B電連接圖像顯示部400、420和驅動用印刷電路板410。因彎曲區域B具有塑性，撓性電路板30不容易變回原來的狀態。 Any of the above-described flexible circuit boards 1 to 4 can be used with FIGS. 1 to 7c, but by way of example, the flexible circuit board 3 in which the anti-rebound pattern 210 is formed over the entire curved region B is shown. The image display portions 400 and 420 and the driving printed circuit board 410 are electrically connected by the curved bending region B. Since the curved region B has plasticity, the flexible circuit board 30 does not easily return to its original state.

另外，驅動晶片300內置於撓性電路板3的配線圖案130、140、150、160，而撓性電路板3可彎曲成“匚”字形或“U”字形。另外，如圖所示，驅動晶片300可安設於“匚”字形或“U”字形的內側或外側。若安設於“匚”字形或“U”字形的內側，則撓性電路板3可從外部的衝擊保護驅動晶片300，而若安設於外側，則可預防與上述圖像顯示部400的直接接觸導致的損傷。 Further, the drive wafer 300 is built in the wiring patterns 130, 140, 150, 160 of the flexible circuit board 3, and the flexible circuit board 3 can be bent into a U shape or a U shape. In addition, as shown, the drive wafer 300 can be mounted on the inside or outside of the "匚" or "U" shape. If it is mounted on the inner side of the U shape or the U shape, the flexible circuit board 3 can drive the wafer 300 from the external impact protection, and if it is installed outside, it can prevent the image display portion 400 from being mounted. Damage caused by direct contact.

下面，將結合圖9至圖12、圖5說明本發明第二實施例的撓性電路板的製造方法。本發明第二實施例的撓性電路板的製造方法，也可適用於本發明第一至第三實施例的撓性電路板的製造方法。圖9至圖12為本發明第二實施例的撓性基板的製造方法的中間步驟示意圖。 Next, a method of manufacturing a flexible wiring board according to a second embodiment of the present invention will be described with reference to Figs. 9 to 12 and Fig. 5. The method of manufacturing the flexible wiring board according to the second embodiment of the present invention is also applicable to the method of manufacturing the flexible wiring board of the first to third embodiments of the present invention. 9 to 12 are schematic views showing intermediate steps of a method of manufacturing a flexible substrate according to a second embodiment of the present invention.

如圖9所示，形成基膜100並在基膜100的一面及另一面各形成第一導電層105及第二導電層205。第一導電層105及第二導電層205的形成順序不受特殊的限制。可將金、鋁、銅等金屬各濺鍍於基膜100的一面及另一面上形成第一導電層105及第二導電層205。第一導電層105及第二導電層205可以約5~35μm左右的厚度形成。或第一導電層105及第二導電層205可通過鑄造方法形成。另外，也可通過層壓法形成。 As shown in FIG. 9, the base film 100 is formed and the first conductive layer 105 and the second conductive layer 205 are formed on one surface and the other surface of the base film 100. The order in which the first conductive layer 105 and the second conductive layer 205 are formed is not particularly limited. The first conductive layer 105 and the second conductive layer 205 may be formed by sputtering a metal such as gold, aluminum or copper on one surface and the other surface of the base film 100. The first conductive layer 105 and the second conductive layer 205 may be formed to a thickness of about 5 to 35 μm. Or the first conductive layer 105 and the second conductive layer 205 may be formed by a casting method. Alternatively, it may be formed by a lamination method.

接著，如圖10所示，在第一導電層105及第二導電層205上各形成第一阻焊膜層1310及第二阻焊膜層1320。 Next, as shown in FIG. 10, a first solder resist layer 1310 and a second solder resist layer 1320 are formed on each of the first conductive layer 105 and the second conductive layer 205.

接著，如圖11所示，利用遮罩(未圖示)對第一阻焊膜層1310和第二阻焊膜層1320進行曝光及顯影，從而形成第一阻焊膜圖案1310a、1310b及第二阻焊膜圖案1320a。第一阻焊膜圖案1310a、 1310b及第二阻焊膜圖案1320a具有與第一配線部130、150及第二配線部140、160相同的形狀。 Next, as shown in FIG. 11, the first solder resist layer 1310 and the second solder resist layer 1320 are exposed and developed by a mask (not shown) to form first solder resist patterns 1310a, 1310b and Two solder mask pattern 1320a. First solder mask pattern 1310a, The 1310b and the second solder resist pattern 1320a have the same shape as the first wiring portions 130 and 150 and the second wiring portions 140 and 160.

接著，如圖11及圖12所示，利用蝕刻遮罩在第一阻焊膜圖案1310a、1310b及第二阻焊膜圖案1320a同時蝕刻形成第一導電層105及第二導電層205。通過此製程形成第一配線部130、150及第二配線部140、160，且還形成防回彈圖案210。 Next, as shown in FIGS. 11 and 12, the first conductive layer 105 and the second conductive layer 205 are simultaneously etched by etching the first solder resist patterns 1310a and 1310b and the second solder resist pattern 1320a. The first wiring portions 130 and 150 and the second wiring portions 140 and 160 are formed by this process, and an anti-rebound pattern 210 is also formed.

因防回彈圖案210通過此製程與第一配線部130、150及第二配線部140、160同時形成，因此，無需用於形成防回彈圖案210的追加製程，節省製程時間。另外，防回彈圖案210是利用蝕刻壓膜通過微影製程在第二阻焊膜1320a上形成，從而可準確控制其大小及位置。因此，防回彈圖案210在與驅動晶片300相對應的位置以相對應的大小形成，從而防止構成防回彈圖案210的物質的浪費，提高散熱效果。 Since the anti-rebound pattern 210 is formed simultaneously with the first wiring portions 130 and 150 and the second wiring portions 140 and 160 by this process, an additional process for forming the anti-rebound pattern 210 is not required, and the process time is saved. In addition, the anti-rebound pattern 210 is formed on the second solder resist film 1320a by a lithography process using an etch film, so that the size and position thereof can be accurately controlled. Therefore, the anti-rebound pattern 210 is formed at a corresponding size at a position corresponding to the driving wafer 300, thereby preventing waste of the substance constituting the anti-rebound pattern 210 and improving the heat dissipation effect.

另外，還可通過蝕刻基膜100去除形成於基膜100上的鎳等雜質。將第一導電層(請參考圖2的105)及第二導電層(請參考圖2的205)濺鍍於基膜100上的情況下，在形成第一配線部130、150及第二配線部140、160之後，包含在第一導電性物質及第二導電性物質的鎳等雜質依然殘留於基膜100上導致不良，因此，在本製程中通過蝕刻基膜100的露出部位去除雜質。 In addition, impurities such as nickel formed on the base film 100 may be removed by etching the base film 100. In the case where the first conductive layer (refer to 105 of FIG. 2) and the second conductive layer (refer to 205 of FIG. 2) are sputtered on the base film 100, the first wiring portions 130, 150 and the second wiring are formed. After the portions 140 and 160, impurities such as nickel contained in the first conductive material and the second conductive material remain on the base film 100, which causes defects. Therefore, impurities are removed by etching the exposed portion of the base film 100 in the present process.

接著，如圖5所示，圍繞第一配線部130、150及第二配線部140、160在第一配線部130、150及第二配線部140、160形成防氧化膜151、161。防氧化膜151、161由比第一配線部130、150及第二配線部140、160更難氧化的物質構成。第一配線部130、150及第二 配線部140、160由銅構成的情況下，防氧化膜151、161可由錫(Sn)或金(Au)構成。防氧化膜151、161可通過無電解鍍金或電鍍(electro plating)方式形成，附加地起到提高驅動晶片300的突起(bump)和第一配線部130、140及第二配線部150、160的貼緊力的作用。進而，在形成上述防氧化膜151、161時，可在防回彈圖案210也形成相同的氧化膜(未圖示)，而在配線圖案130、140、150、160和防回彈圖案210的物質不同時，可用不相同的物質在防回彈圖案210上形成防氧化膜。 Next, as shown in FIG. 5, the oxidation preventing films 151 and 161 are formed in the first wiring portions 130 and 150 and the second wiring portions 140 and 160 around the first wiring portions 130 and 150 and the second wiring portions 140 and 160. The oxidation preventing films 151 and 161 are made of a substance that is more difficult to oxidize than the first wiring portions 130 and 150 and the second wiring portions 140 and 160. First wiring portions 130, 150 and second When the wiring portions 140 and 160 are made of copper, the oxidation preventing films 151 and 161 may be made of tin (Sn) or gold (Au). The oxidation preventing films 151 and 161 may be formed by electroless gold plating or electroplating, and additionally serve to increase the bumps of the driving wafer 300 and the first wiring portions 130 and 140 and the second wiring portions 150 and 160. The effect of the tight force. Further, when the oxidation preventing films 151 and 161 are formed, the same oxide film (not shown) can be formed also in the anti-rebound pattern 210, and in the wiring patterns 130, 140, 150, 160 and the anti-rebound pattern 210. When the substances are different, an anti-oxidation film may be formed on the anti-rebound pattern 210 by using different substances.

接著，可形成露出內部輸入端子130及內部輸出端子140的至少一部分的保護膜170、180。保護膜170、180可利用阻焊膜通過絲網印刷方式形成。 Next, protective films 170 and 180 that expose at least a part of the internal input terminal 130 and the internal output terminal 140 can be formed. The protective films 170, 180 can be formed by screen printing using a solder resist film.

接著，利用突起將驅動晶片300內置於第一配線部130、150及第二配線部140、160。突起可用金構成。 Next, the drive wafer 300 is built in the first wiring portions 130 and 150 and the second wiring portions 140 and 160 by the protrusions. The protrusions can be made of gold.

另外，雖然未圖示，同時形成配線圖案130、140、150、160和防回彈圖案210可通過鍍金法或印刷法完成。 In addition, although not shown, the formation of the wiring patterns 130, 140, 150, 160 and the anti-rebound pattern 210 at the same time can be performed by a gold plating method or a printing method.

下面，將結合圖13至圖19、圖7a說明本發明第四實施例的撓性電路板的製造方法。圖13至圖19為本發明第四實施例的撓性基板的製造方法的中間步驟示意圖。 Next, a method of manufacturing a flexible wiring board according to a fourth embodiment of the present invention will be described with reference to Figs. 13 to 19 and 7a. 13 to 19 are schematic diagrams showing intermediate steps of a method of manufacturing a flexible substrate according to a fourth embodiment of the present invention.

如圖13所示，在基膜100的一面上形成第一導電層105。第一導電層105可用銅等金屬物質通過濺鍍法形成。 As shown in FIG. 13, a first conductive layer 105 is formed on one surface of the base film 100. The first conductive layer 105 can be formed by a sputtering method using a metal substance such as copper.

接著，如圖4所示，在第一導電層105上形成第一阻焊膜層1310。 Next, as shown in FIG. 4, a first solder resist layer 1310 is formed on the first conductive layer 105.

接著，如圖14及圖15所示，將第一阻焊膜層1310上形成第一配線 部130、150及第二配線部140、160的形狀，以形成第一阻焊膜圖案1310a、1310b。 Next, as shown in FIGS. 14 and 15, the first wiring is formed on the first solder resist layer 1310. The portions 130, 150 and the second wiring portions 140, 160 are shaped to form the first solder resist patterns 1310a, 1310b.

接著，如圖15及圖16所示，利用蝕刻遮罩在第一阻焊膜圖案1310a、1310b蝕刻形成第一導電層105，以形成第一配線部130、150及第二配線部140、160。 Next, as shown in FIGS. 15 and 16, the first conductive layer 105 is etched into the first solder resist patterns 1310a and 1310b by an etch mask to form the first wiring portions 130 and 150 and the second wiring portions 140 and 160. .

接著，如圖17所示，在基膜100的另一面上形成第二導電層205。第二導電層205可利用黏接層202黏接於基膜100的另一面上。 Next, as shown in FIG. 17, a second conductive layer 205 is formed on the other surface of the base film 100. The second conductive layer 205 can be adhered to the other surface of the base film 100 by using the adhesive layer 202.

接著，如圖18所示，利用第一配線部130、150及第二配線部140、160覆蓋第一阻焊膜層1313，且利用第二導電層205覆蓋第二阻焊膜層1323。 Next, as shown in FIG. 18, the first solder resist layer 1313 is covered by the first wiring portions 130, 150 and the second wiring portions 140, 160, and the second solder resist layer 1323 is covered with the second conductive layer 205.

接著，如圖18及圖19所示，形成第二阻焊膜層1323以形成第二阻焊膜圖案1323a。接著，在第二阻焊膜圖案1323a上利用蝕刻遮罩蝕刻第二導電層205，以形成防回彈圖案210。這樣，通過微影法形成防回彈圖案210的情況下，可以適合於散熱的大小在準確的位置形成防回彈圖案210。另外，在先形成第一配線部130、150及第二配線部140、160蝕刻防回彈圖案210的情況下，存在第一配線部130、150及第二配線部140、160受損的危險，因此，可通過在用第一阻焊膜層1313覆蓋的狀態下蝕刻第二導電層205來解決。 Next, as shown in FIGS. 18 and 19, a second solder resist layer 1323 is formed to form a second solder resist pattern 1323a. Next, the second conductive layer 205 is etched on the second solder resist pattern 1323a with an etch mask to form the anti-rebound pattern 210. Thus, in the case where the anti-rebound pattern 210 is formed by the lithography method, the anti-rebound pattern 210 can be formed at an accurate position suitable for the size of heat dissipation. Further, when the first wiring portions 130 and 150 and the second wiring portions 140 and 160 are formed to etch the anti-rebound pattern 210, there is a risk that the first wiring portions 130 and 150 and the second wiring portions 140 and 160 are damaged. Therefore, it can be solved by etching the second conductive layer 205 in a state covered with the first solder resist layer 1313.

接著，如圖7a所示，剝除(strip)第一阻焊膜層及第二阻焊膜圖案1323a，以形成覆蓋第一配線部130、150及第二配線部140、160的防氧化膜151、161。進而，在形成上述防氧化膜151、161時，在防回彈圖案210上也可形成相同的防氧化膜(未圖示)。 接著，在第一配線部130、150及第二配線部140、160上形成露出其至少一部分的保護膜170、180。接著，可以連接於內部輸入端子130和內部輸出端子140的方式內置驅動晶片300。 Next, as shown in FIG. 7a, the first solder resist layer and the second solder resist pattern 1323a are stripped to form an anti-oxidation film covering the first wiring portions 130, 150 and the second wiring portions 140, 160. 151, 161. Further, when the oxidation preventing films 151 and 161 are formed, the same anti-oxidation film (not shown) may be formed on the anti-rebound pattern 210. Next, protective films 170 and 180 which expose at least a part of the first wiring portions 130 and 150 and the second wiring portions 140 and 160 are formed. Next, the drive wafer 300 can be built in such a manner that it can be connected to the internal input terminal 130 and the internal output terminal 140.

上述實施例僅用以說明本發明而非限制，本領域的普通技術人員應當理解，可以對本發明進行修改、變形或者等同替換。而在不脫離本發明的精神和範圍內，其均應涵蓋在本發明的申請專利範圍當中。 The above-described embodiments are only intended to illustrate the invention, and are not intended to be limiting, and the invention may be modified, modified or substituted. All of the scope of the invention should be covered by the scope of the invention without departing from the spirit and scope of the invention.

210‧‧‧防回彈圖案 210‧‧‧Anti-rebound pattern

A‧‧‧內置區域 A‧‧‧ Built-in area

B‧‧‧彎曲區域 B‧‧‧Bending area

Claims (18)

一種撓性電路板，包括：一基膜，包含一彎曲(bending)區域；一配線圖案，形成於該基膜的一面上並內置一驅動晶片；及一防回彈(spring-back)圖案，在該基膜的另一面上，與該彎曲區域的至少一部分重疊並由金屬構成，該防回彈圖案係具有塑性。 A flexible circuit board comprising: a base film comprising a bending region; a wiring pattern formed on one side of the base film and having a driving chip built therein; and a spring-back pattern, On the other side of the base film, at least a portion of the curved region is overlapped and made of metal, and the anti-rebound pattern has plasticity. 根據請求項1所述的撓性電路板，其特徵在於：該配線圖案包括形成於該基膜的另一面的配線圖案。 The flexible circuit board according to claim 1, wherein the wiring pattern includes a wiring pattern formed on the other surface of the base film. 根據請求項2所述的撓性電路板，其特徵在於：上述一面上的配線圖案和上述另一面上的背面配線圖案，通過形成於該基膜的貫通配線連接。 The flexible wiring board according to claim 2, wherein the wiring pattern on the one surface and the back wiring pattern on the other surface are connected by a through wiring formed on the base film. 根據請求項1所述的撓性電路板，其特徵在於：該防回彈圖案與該驅動晶片的至少一部分重疊。 The flexible circuit board of claim 1, wherein the anti-rebound pattern overlaps at least a portion of the drive wafer. 根據請求項1所述的撓性電路板，其特徵在於：該防回彈圖案由與該配線圖案相同的物質形成。 The flexible circuit board according to claim 1, wherein the anti-rebound pattern is formed of the same material as the wiring pattern. 根據請求項1所述的撓性電路板，其特徵在於：該防回彈圖案通過形成於該基膜的貫通配線延長至內置該驅動晶片的一面。 The flexible circuit board according to claim 1, wherein the anti-rebound pattern is extended to a side on which the driving wafer is built by a through wiring formed on the base film. 一種顯示裝置，包括：一圖像顯示部；一驅動用印刷電路板，內置用於向該圖像顯示部提供驅動信號的主控制器(main controller)；及 請求項1至5中任意項的撓性電路板，通過彎曲區域的彎曲電連接該圖像顯示部和該驅動用印刷電路板。 A display device comprising: an image display portion; a driving printed circuit board having a main controller for providing a driving signal to the image display portion; and The flexible circuit board of any one of claims 1 to 5 is electrically connected to the image display portion and the driving printed circuit board by bending of a curved region. 根據請求項7所述的顯示裝置，其特徵在於：還包括內置於該撓性電路板的配線圖案的驅動晶片，而該撓性電路板彎曲成“匚”字形或“U”字形。 The display device according to claim 7, characterized by further comprising a driving chip built in a wiring pattern of the flexible circuit board, and the flexible circuit board is bent into a U shape or a U shape. 一種撓性電路板的製造方法，包括如下步驟：形成包括一彎曲(bending)區域的一基膜；在該基膜的一面上形成內置驅動晶片的配線圖案，並在該基膜的另一面上形成與該彎曲區域的至少一部分重疊且由金屬構成的一防回彈(spring-back)圖案，該防回彈圖案係具有塑性，而且，同時形成該配線圖案和該回彈防止圖案。 A method of manufacturing a flexible circuit board, comprising the steps of: forming a base film including a bending region; forming a wiring pattern of a built-in driving wafer on one side of the base film, and on the other side of the base film A spring-back pattern is formed which overlaps with at least a portion of the curved region and is made of metal, the anti-rebound pattern has plasticity, and the wiring pattern and the rebound preventing pattern are simultaneously formed. 根據請求項9所述的撓性電路板的製造方法，其特徵在於：該配線圖案包括形成於該基膜的另一面的配線圖案。 A method of manufacturing a flexible wiring board according to claim 9, wherein the wiring pattern includes a wiring pattern formed on the other surface of the base film. 根據請求項10所述的撓性電路板的製造方法，其特徵在於：上述一面上的配線圖案和上述另一面上的背面配線圖案，通過形成於基膜的貫通配線連接。 The method of manufacturing a flexible wiring board according to claim 10, wherein the wiring pattern on the one surface and the back surface wiring pattern on the other surface are connected by a through wiring formed on the base film. 根據請求項9所述的撓性電路板的製造方法，其特徵在於：該防回彈圖案與該驅動晶片的至少一部分重疊。 A method of manufacturing a flexible circuit board according to claim 9, wherein the anti-rebound pattern overlaps at least a portion of the driving wafer. 根據請求項9所述的撓性電路板的製造方法，其特徵在於：同時形成該配線圖案和該回彈防止圖案的方法是：在該基膜的一面及另一面上各形成一第一導電層及一第二導電層；同時蝕刻該第一導電層及該第二導電層。 The method of manufacturing a flexible circuit board according to claim 9, wherein the wiring pattern and the springback preventing pattern are simultaneously formed by forming a first conductive layer on one side and the other side of the base film. a layer and a second conductive layer; simultaneously etching the first conductive layer and the second conductive layer. 根據請求項13所述的撓性電路板的製造方法，其特徵在於：形成該第一導電層及該第二導電層的方法由濺鍍、鑄造或層壓等方法 。 The method of manufacturing a flexible circuit board according to claim 13, wherein the method of forming the first conductive layer and the second conductive layer is performed by sputtering, casting, or lamination. . 根據請求項9所述的撓性電路板的製造方法，其特徵在於：同時形成該配線圖案和該回彈防止圖案的方法有鍍金法或印刷法。 A method of manufacturing a flexible wiring board according to claim 9, wherein the wiring pattern and the rebound preventing pattern are simultaneously formed by a gold plating method or a printing method. 根據請求項9所述的撓性電路板的製造方法，其特徵在於：該防回彈圖案通過形成於該基膜的貫通配線延長至內置該驅動晶片的一面。 The method of manufacturing a flexible wiring board according to claim 9, wherein the anti-rebound pattern is extended to a side on which the driving wafer is built by a through wiring formed on the base film. 根據請求項9所述的撓性電路板的製造方法，其特徵在於：還包括形成覆蓋該配線圖案和該防回彈圖案中的至少一個的防氧化膜和形成覆蓋該形成防氧化膜的配線圖案的保護膜的步驟。 The method of manufacturing a flexible circuit board according to claim 9, further comprising forming an oxidation preventing film covering at least one of the wiring pattern and the anti-rebound pattern and forming a wiring covering the oxide film. The step of patterning the protective film. 撓性電路板的製造方法，包括如下步驟：形成包括一彎曲(bending)區域的一基膜；在該基膜的一面上形成配線圖案；在該基膜的另一面上形成配線圖案；利用一第一阻焊膜層覆蓋該配線圖案；形成與該彎曲區域的至少一部分重疊的防回彈(spring-back)圖案，該防回彈圖案係具有塑性；及去除該第一阻焊膜層。 A method of manufacturing a flexible circuit board, comprising the steps of: forming a base film including a bending region; forming a wiring pattern on one side of the base film; forming a wiring pattern on the other surface of the base film; The first solder mask layer covers the wiring pattern; forming a spring-back pattern overlapping at least a portion of the curved region, the anti-rebound pattern having plasticity; and removing the first solder resist layer.
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