TWI484668B - Manufacturing method of light emitting diodes - Google Patents
Manufacturing method of light emitting diodes Download PDFInfo
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- TWI484668B TWI484668B TW101107859A TW101107859A TWI484668B TW I484668 B TWI484668 B TW I484668B TW 101107859 A TW101107859 A TW 101107859A TW 101107859 A TW101107859 A TW 101107859A TW I484668 B TWI484668 B TW I484668B
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本發明係有關一種應用於照明器具、顯示器、行動電話之背光源、動態圖像照明輔助光源、其他之普通民用光源等中所使用的發光二極體之製造方法。The present invention relates to a method of manufacturing a light-emitting diode used in a lighting fixture, a display, a backlight of a mobile phone, a moving image illumination auxiliary light source, and other common civilian light sources.
發光二極體(light-emitting diodes，LED)具有壽命長、省電、尺寸小等優點，故可廣泛應用於各式電子裝置的光源。此外，近來發光二極體朝向全彩與高亮度發展，可被應用於大尺寸的顯示器與將交通號誌上。於發光二極體封裝技術中，發光效率與發光二極體封裝體的散熱性為重要的課題。Light-emitting diodes (LEDs) have the advantages of long life, power saving, and small size, so they can be widely used in light sources of various electronic devices. In addition, recently, the light-emitting diodes have developed toward full color and high brightness, and can be applied to large-sized displays and traffic signs. In the light-emitting diode package technology, the light-emitting efficiency and the heat dissipation of the light-emitting diode package are important issues.
習知之表面黏著型發光二極體(Surface Mount Device，SMD)，一般來說，乃係將發光二極體晶片固接於表面黏著型之二極體支架內，再經打線及封膠等之後續製程作業，從而構成一表面黏著型發光二極體。其中，該二極體支架係具有一膠座，其一端面具有內凹的功能區，以及二間隔設置的金屬接腳，其分別與膠座固接，且係由功能區中向外延伸至膠座外部。A conventional surface mount device (SMD) is generally a method in which a light-emitting diode chip is fixed in a surface-adhesive diode holder, and then a wire is attached and sealed. Subsequent process operations to form a surface-adhesive light-emitting diode. Wherein, the diode support has a rubber seat, a concave functional area on one end surface thereof, and two spaced metal pins respectively fixed to the rubber seat and extending outward from the functional area to The outside of the plastic seat.
上述習知的發光二極體之成型方式，可如第一圖所示，乃係先將一金屬基板10沖壓成型有金屬接腳11，之後置入一模具之中，並把沖壓成型之金屬接腳11置於模具所具有之模穴中，再利用高分子原料進行射出成形，使其凝固以成型膠座12，如第二圖(A)、(B)所示，以便於該膠座12內容置發光晶片14，並進行後續之打線製程。惟，在進行射出成形時，大多是利用一熱塑性樹脂(例如尼龍PA6T、尼龍PA9T等)射出成型，此種熱塑性樹脂所成型之殼體因較不能耐高溫，所以成型後之殼體，若應用於需高瓦數之產品，容易因高溫而發黃或發黑，進而造成光衰之缺點。The above-mentioned conventional LED forming method can be as shown in the first figure, in which a metal substrate 10 is first stamped and formed with a metal pin 11, and then placed in a mold, and the metal formed by stamping is formed. The pin 11 is placed in a cavity of the mold, and then is formed by injection molding using a polymer material to solidify to form the rubber seat 12, as shown in the second figures (A) and (B), so as to facilitate the rubber seat. 12 is placed on the illuminating wafer 14 and the subsequent wire bonding process is performed. However, in the case of injection molding, a thermoplastic resin (for example, nylon PA6T, nylon PA9T, etc.) is often used for injection molding. The molded body of the thermoplastic resin is less resistant to high temperatures, so the molded casing is applied. For products requiring high wattage, it is easy to yellow or black due to high temperature, which causes the shortcomings of light decay.
而有另種習知製造方法，如本國專利公開號第201021252號，專利名稱「發光裝置、樹脂封裝體、樹脂成形體及此等之製造方法」，其雖揭露一種製造方法係包括如下步驟：由上模與下模夾持設置有切口部之引線框架；於由上模與下模夾持之模具內，轉注成形含有光反射性物質之熱硬化性樹脂，於引線框架上形成樹脂成形體；及沿切口部切斷樹脂成形體與引線框架，可令引線框架與熱硬化性樹脂組合物之密接性較高、於短時間內製造多個發光裝置。There is another conventional manufacturing method, such as the national patent publication No. 201021252, the patent name "light-emitting device, resin package, resin molded body, and the manufacturing method thereof", although it is disclosed that the manufacturing method includes the following steps: a lead frame provided with a notch portion is sandwiched between the upper mold and the lower mold; and a thermosetting resin containing a light-reflective substance is transferred into a mold sandwiched between the upper mold and the lower mold to form a resin molded body on the lead frame And cutting the resin molded body and the lead frame along the notch portion, and the adhesion between the lead frame and the thermosetting resin composition is high, and a plurality of light-emitting devices can be manufactured in a short time.
惟，此種製造方法中，其引線框架上之樹脂成形體係為一矩陣區塊排列的方式，矩陣區塊排列的方式，成品封裝後要經過高精的切割設備做切割才可下料，此一切割設備費用高昂，且切割效率慢，切割精度難度高，不良率高，其樹脂成形體之切邊處也容易形成迸裂。However, in this manufacturing method, the resin forming system on the lead frame is a matrix block arrangement manner, and the matrix blocks are arranged in a manner that after the finished package is subjected to high-precision cutting equipment for cutting, the material can be cut. A cutting device is expensive, has a slow cutting efficiency, is difficult to cut, has a high defect rate, and is easily cleaved at the cut edge of the resin molded body.
有鑑於此，本發明即在提供一種於於支架部上，透過熱固性樹脂利用壓出成型為殼體，且支架部上每一個殼體係各自獨立，最後只要透過下料沖壓動作就可快速的切斷而形成單顆發光二極體，並可改善殼體迸裂缺失之製造方法，並藉由熱固性樹脂所成型之殼體，具有耐高溫不易光衰、抗UV、反射率較佳等優點，可以改善習有利用熱塑性樹脂射出成型之缺失，為其主要目的者。In view of the above, the present invention provides a housing for being extruded through a thermosetting resin into a housing, and each housing on the bracket portion is independent, and finally can be quickly cut by a blanking action. The method of manufacturing a single light-emitting diode and improving the cracking of the shell, and the shell formed by the thermosetting resin has the advantages of high temperature resistance, no light decay, high UV resistance, good reflectivity, etc. Improving the use of thermoplastic resin injection molding is the main purpose.
為達上揭目的，本發明之製造方法至少包含有：於沖壓金屬基板形成支架部時，該支架部設有至少一供殼體成型之成型區域，以及與該成型區域接觸之第一、第二預插端，其中該第一、第二預插端端面之上表面形成有至少一凹槽，再壓出成型有熱固性樹脂，於成型區域形成殼體，並同時溢流至該凹槽，並進行發光二極體晶片之封裝；最後沿該殼體邊緣及該第一、第二預插端切斷該金屬基板，而完成單顆之發光二極體。In order to achieve the above, the manufacturing method of the present invention includes at least: when the stamped metal substrate is formed into a bracket portion, the bracket portion is provided with at least one molding region for molding the shell, and the first and the first contact with the molding region a pre-inserted end, wherein at least one groove is formed on an upper surface of the first and second pre-inserted end faces, and a thermosetting resin is extruded and formed into a casing in the molding region, and simultaneously overflows to the groove. And encapsulating the LED chip; finally cutting the metal substrate along the edge of the casing and the first and second pre-insertion ends to complete a single LED.
依據上述主要結構特徵，所述沖壓成型複數支架部之後，進一步包含有電鍍步驟，係於該金屬基板表面電鍍形成有至少一金屬層。According to the above main structural features, the stamping and molding the plurality of bracket portions further includes a plating step of forming at least one metal layer on the surface of the metal substrate.
上述之金屬層可以為金層或銀層，以提高該金屬基板表面之抗氧化與銲錫性、導電性等。The metal layer may be a gold layer or a silver layer to improve oxidation resistance, solderability, conductivity, and the like on the surface of the metal substrate.
依據上述主要結構特徵，所述之電鍍步驟後，進一步包含有切片步驟，該切片步驟係將該金屬基板切片形成片狀，之後再進行以模具壓出成型殼體之步驟。According to the above main structural features, after the electroplating step, further comprising a slicing step of slicing the metal substrate into a sheet shape, and then performing the step of extruding the molded shell by a mold.
依據上述主要結構特徵，所述模具壓出成型殼體之後，進一步包含有去除廢料步驟，去除固化成型後之熱固性樹脂所形成之廢料。According to the above main structural features, after the mold is extruded from the molded casing, a step of removing the waste material is further included, and the waste formed by the thermosetting resin after the solidification molding is removed.
依據上述主要結構特徵，所述去除廢料步驟之後，進一步包含有切腳步驟，其係經過切腳設備，將該第一、第二導接端進行切割，而形成焊腳。According to the above main structural features, after the step of removing waste, further comprising a step of cutting the foot, which is cut through the cutting device to cut the first and second guiding ends to form a solder fillet.
依據上述主要結構特徵，所述模具壓出成型殼體之後，進一步包含有去除廢料步驟，去除固化成型後之熱固性樹脂所形成之廢料，之後再進行切片以及切腳步驟，係將該金屬基板同時切片形成片狀，以及將該第一、第二導接端進行切割，而形成焊腳。According to the above main structural features, after the mold is extruded from the molded casing, the step of removing the waste material is further included, and the waste formed by the thermosetting resin after the solidification molding is removed, and then the chipping and the cutting step are performed, and the metal substrate is simultaneously The slices are formed into a sheet shape, and the first and second leading ends are cut to form a solder fillet.
依據上述主要結構特徵，所述支架部之凹槽一側設有貫穿上述支架之穿孔。According to the above main structural features, the side of the groove of the bracket portion is provided with a through hole penetrating the bracket.
依據上述主要結構特徵，所述穿孔之開口大小係由上方朝下方漸擴。According to the above main structural features, the opening size of the perforation is gradually expanded from the upper side toward the lower side.
依據上述主要結構特徵，所述凹槽之壁面可形成有突出或凹入於該凹槽壁面之倒鉤結構體。According to the above main structural features, the wall surface of the groove may be formed with a barb structure protruding or recessed in the wall surface of the groove.
依據上述主要結構特徵，所述之熱固性樹脂可以為環氧樹脂。According to the above main structural features, the thermosetting resin may be an epoxy resin.
本發明之特點，可參閱本案圖式及實施例之詳細說明而獲得清楚地瞭解。The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments.
本發明中發光二極體之製造方法，其至少包含下列步驟：The method for manufacturing a light-emitting diode according to the present invention comprises at least the following steps:
提供一金屬基板20，如第三圖所示，該金屬基板20係為捲裝，且經沖壓設備31沖壓該金屬基板20以成型有複數支架部21，如第四圖所示，該支架部21設有至少一供殼體成型之成型區域211，該支架部21並設有二個伸入該成型區域211內且相互間隔之第一、第二導接端212、213，以及與該成型區域211接觸之第一、第二預插端214、215，其中該第一、第二預插端214、215端面之上表面形成有至少一凹槽216。A metal substrate 20 is provided. As shown in the third figure, the metal substrate 20 is packaged, and the metal substrate 20 is stamped by a punching device 31 to form a plurality of bracket portions 21, as shown in the fourth figure. 21 is provided with at least one molding region 211 for molding the casing, and the bracket portion 21 is provided with two first and second guiding ends 212, 213 extending into the molding region 211 and spaced apart from each other, and the molding The first and second pre-inserted ends 214 and 215 are in contact with the first and second pre-inserted ends 214 and 215. The upper surface of the first and second pre-inserted ends 214 and 215 are formed with at least one recess 216.
進行電鍍步驟，如第五圖所示，藉由一電鍍設備32於該金屬基板表面電鍍形成有至少一金屬層(圖未示)，例如可以為金層或銀層，以提高該金屬基板表面之抗氧化與銲錫性、導電性等。The electroplating step is performed. As shown in FIG. 5, at least one metal layer (not shown) is formed on the surface of the metal substrate by a plating apparatus 32, for example, a gold layer or a silver layer to improve the surface of the metal substrate. Anti-oxidation and solderability, conductivity and the like.
進行切片步驟，如第六圖所示，該切片步驟係藉由一切片設備33之上、下模具331、332將該金屬基板20切片形成片狀。The slicing step is performed. As shown in the sixth figure, the slicing step is to slice the metal substrate 20 into a sheet shape by the upper and lower molds 331, 332 of a slicing device 33.
提供一成型設備34，如第七圖所示，其係具有上、下模具341、342合模後形成有預定形狀之模穴(圖未示)，於每一成型區域分別經熱固性樹脂(例如：可以為環氧樹脂)壓出成型有殼體22且固接於該支架部21，請同時參閱第八圖所示，而該熱固性樹脂並同時溢流至該凹槽216；其中，壓出成型時是使用錠狀結構之熱固性樹脂，經過高壓將錠狀結構擠入上、下模具之內流道343，而擠入成形膠體，因此過程中設備加壓、壓力大，另外亦因熱固性樹脂流動性好，所以固化成型後於支架部21處會留有塑膠毛頭217。A molding apparatus 34 is provided, as shown in the seventh figure, which has mold holes (not shown) formed by molding the upper and lower molds 341 and 342 in a predetermined shape, and is respectively thermosetting resin in each molding region (for example, The housing 22 can be molded and fixed to the bracket portion 21, as shown in the eighth figure, and the thermosetting resin simultaneously overflows to the recess 216; When molding, the thermosetting resin is used in the ingot structure, and the ingot structure is extruded into the inner flow passage 343 of the upper and lower molds by high pressure, and is extruded into the forming colloid, so that the equipment is pressurized and pressurized during the process, and the thermosetting resin is also used. The fluidity is good, so that the plastic hair 217 is left at the bracket portion 21 after solidification molding.
去除廢料步驟，去除固化成型後之熱固性樹脂所形成之廢料，如第九圖所示，先經由一除料頭設備35，將內流道343去除，再由一去毛頭設備36，如第十圖及第十一圖所示，將上述之塑膠毛頭去除。The step of removing the waste, removing the waste formed by the solidified thermosetting resin, as shown in the ninth figure, first removing the inner flow passage 343 via a removal head device 35, and then removing the inner flow passage 366 by a deburring device 36, such as the tenth As shown in the figure and the eleventh figure, the above-mentioned plastic hairs are removed.
進行切腳步驟，如第十二圖及第十三圖所示，其係經過一切腳設備37，將該第一、第二導接端212、213進行切割，而形成焊腳218。The cutting step is performed. As shown in the twelfth and thirteenth drawings, the first and second guiding ends 212, 213 are cut through the foot device 37 to form the solder fillet 218.
進行封裝，經由一封裝設備38，將每一支架部21分別固接有發光二極體晶片23，如第十四圖及第十五圖所示，並進行打金線以及封膠的作業。The package is mounted, and each of the bracket portions 21 is fixed to the LED chip 23 via a package device 38, as shown in FIG. 14 and FIG. 15 , and the gold wire and the sealing operation are performed.
完成單顆成品下料，如第十六圖及第十七圖所示，經一下料設備39之沖壓，請同時參閱第十八圖所示，沿該殼體22邊緣及該第一、第二預插端214、215切斷該金屬基板20，而完成單顆之發光二極體24；且因熱固性樹脂溢流至該凹槽216處，當進行沖壓時，可防止該殼體22因沖壓之應力而產生迸裂，以維持殼體22外觀之完整，而提升產品良率。Finishing a single finished product, as shown in Figures 16 and 17, after stamping by the blanking device 39, please also refer to Figure 18, along the edge of the housing 22 and the first and the first The second pre-insertion ends 214, 215 cut the metal substrate 20 to complete a single light-emitting diode 24; and because the thermosetting resin overflows to the recess 216, when the stamping is performed, the housing 22 can be prevented from being The stress of the stamping causes cracking to maintain the integrity of the appearance of the casing 22, thereby improving product yield.
如上所述之實施例中，其發光二極體之製造方法可如第十九圖所示之流程：沖壓→ 電鍍→ 切片→ 壓出成型→ 去除廢料→ 切腳→ 封裝→ 單顆成品下料，以及如第二十圖所示，將捲狀金屬基板20進行沖壓，以成型有支架部21，其設有第一、第二預插端214、215，其中該第一、第二預插214、215端端面之上表面形成有至少一凹槽216，進行電鍍驟後則進行切片，將捲狀金屬基板切成片狀，再以熱固性樹脂壓出成型有殼體22，並同時溢流至該凹槽216；再依序進行去除廢料以及切腳步驟；及封裝該發光二極體晶片23後，沿該殼體22邊緣及該第一、第二預插端214、215切斷該金屬基板20，而完成單顆之發光二極體。In the embodiment described above, the manufacturing method of the light-emitting diode can be as shown in the nineteenth diagram: stamping → electroplating → slicing → extrusion molding → removing waste → cutting foot → packaging → single finished product blanking And as shown in the twentieth diagram, the rolled metal substrate 20 is stamped to form a bracket portion 21 provided with first and second pre-inserted ends 214, 215, wherein the first and second pre-insertion At least one groove 216 is formed on the surface of the end surface of the end surface of the 214 and 215. After the plating step, the film is sliced, the rolled metal substrate is cut into a sheet shape, and the shell 22 is molded by the thermosetting resin, and simultaneously overflows. And the step of removing the scrap and the cutting step; and after encapsulating the LED chip 23, cutting the edge along the edge of the casing 22 and the first and second pre-inserted ends 214, 215 The metal substrate 20 is completed, and a single light-emitting diode is completed.
亦可如第二十一圖之另一實施例所示之流程：沖壓→ 電鍍→ 壓出成型→ 去除廢料→ 切片以及切腳→ 封裝→ 單顆成品下料，由捲狀金屬基板經沖壓、電鍍、壓出成型以及去除廢料後，再同時進行切片以及切腳步驟，係將該金屬基板同時切片形成片狀，以及將該第一、第二導接端進行切割，而形成焊腳，之後再依序進行後續步驟，同樣可完成單顆之發光二極體。The flow can also be as shown in another embodiment of the twenty-first embodiment: stamping → electroplating → extrusion molding → removing waste → slicing and cutting the foot → packaging → single finished product blanking, stamping from the rolled metal substrate, After electroplating, extrusion molding, and scrap removal, the slicing and cutting step are simultaneously performed, and the metal substrate is simultaneously sliced into a sheet shape, and the first and second guiding ends are cut to form a solder fillet, and then The subsequent steps are performed in sequence, and a single light-emitting diode can also be completed.
另外，該支架部中凹槽216之壁面可形成有突出於該凹槽216壁面之倒鉤結構體219，如第二十二圖及第二十三圖所示，當進行壓出成型後，可加強溢流於該凹槽內之熱固性樹脂與該金屬基板20之連結，並可防止該殼體因沖壓之應力而產生迸裂；當然，該亦可形成有凹入於該凹槽壁面之倒鉤結構體。In addition, the wall surface of the groove 216 in the bracket portion may be formed with a barb structure body 219 protruding from the wall surface of the groove 216, as shown in the 22nd and 23rd drawings, after the extrusion molding, The connection between the thermosetting resin overflowing in the groove and the metal substrate 20 can be strengthened, and the shell can be prevented from being cracked due to the stress of the stamping; of course, the recess can be formed on the wall surface of the recess. Hook structure.
再者，該凹槽216一側可設有貫穿上述金屬基板20之穿孔25，而該穿孔25之開口大小係由上方朝下方漸擴，可於進行壓出成型時，熱固性樹脂流入該凹槽216以及該穿孔25，可加強與該支架部21之連結，以當進行沖壓後，溢流於該凹槽內之熱固性樹脂不會輕易脫落，並可防止該殼體因沖壓之應力而產生迸裂。Further, the side of the recess 216 may be provided with a through hole 25 penetrating through the metal substrate 20, and the opening of the through hole 25 is gradually expanded from the upper side toward the lower side, and the thermosetting resin may flow into the groove during the extrusion molding. 216 and the through hole 25, the connection with the bracket portion 21 can be strengthened, so that the thermosetting resin overflowing in the groove does not easily fall off after punching, and the shell can be prevented from being split due to the stress of stamping. .
值得一提的是，本發明相較於習有製造方法係具有下列優點：It is worth mentioning that the present invention has the following advantages over the conventional manufacturing method:
1、以熱固性樹脂成形之殼體，相對於傳統熱塑性樹脂之殼體，可較耐高溫、抗UV、反射率佳，因此對於製作成的發光二極體可具有抗高溫之優點，因此用於需高瓦數之產品，殼體不會黃化，成品光衰慢，幸賴性佳。1. The shell formed by the thermosetting resin can be more resistant to high temperature, UV, and reflectance than the shell of the conventional thermoplastic resin, so that the fabricated LED can have the advantage of resisting high temperature, so it is used for For products requiring high wattage, the casing will not yellow, and the finished product will slow down slowly. Fortunately, it is good.
2、本發明係於支架部上每一個殼體係各自獨立，最後只要透過下料沖壓動作就可快速的切斷而形成單顆發光二極體，並可改善殼體迸裂缺失。2. The present invention is independent of each of the housings on the bracket portion, and finally can be quickly cut by the blanking punching action to form a single light-emitting diode, and the housing cracking loss can be improved.
綜上所述，本發明提供發光二極體一較佳可行之製造方法，爰依法提呈發明專利之申請；本發明之技術內容及技術特點巳揭示如上，然而熟悉本項技術之人士仍可能基於本發明之揭示而作各種不背離本案發明精神之替換及修飾。因此，本發明之保護範圍應不限於實施例所揭示者，而應包括各種不背離本發明之替換及修飾，並為以下之申請專利範圍所涵蓋。In summary, the present invention provides a preferred manufacturing method for a light-emitting diode, and an application for an invention patent according to the law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still The various alternatives and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims
10．．．金屬基板10. . . Metal substrate
11．．．金屬接腳11. . . Metal pin
12．．．膠座12. . . Plastic seat
13．．．迸裂13. . . burst
14．．．發光晶片14. . . Light emitting chip
20．．．金屬基板20. . . Metal substrate
21．．．支架部twenty one. . . Bracket
211．．．成型區域211. . . Molding area
212．．．第一導接端212. . . First guiding end
213．．．第二導接端213. . . Second guiding end
214．．．第一預插端214. . . First pre-interpolation
215．．．第二預插端215. . . Second pre-interpolation
216．．．凹槽216. . . Groove
217．．．塑膠毛頭217. . . Plastic hair
218．．．焊腳218. . . Solder foot
219．．．倒鉤結構體219. . . Barb structure
22．．．殼體twenty two. . . case
23．．．發光二極體晶片twenty three. . . Light-emitting diode chip
24．．．發光二極體twenty four. . . Light-emitting diode
25．．．穿孔25. . . perforation
31．．．沖壓設備31. . . Stamping equipment
32．．．電鍍設備32. . . Plating equipment
33．．．切片設備33. . . Slicing equipment
331．．．上模具331. . . Upper mold
332．．．下模具332. . . Lower mold
34．．．成型設備34. . . Molding equipment
341．．．上模具341. . . Upper mold
342．．．下模具342. . . Lower mold
343．．．內流道343. . . Inner flow channel
35．．．除料頭設備35. . . Head removal equipment
36．．．去毛頭設備36. . . Deburring equipment
37．．．切腳設備37. . . Cutting device
38．．．封裝設備38. . . Packaging equipment
39．．．下料設備39. . . Cutting equipment
第一圖係為習有支架之結構示意圖。The first figure is a schematic diagram of the structure of the conventional stent.
第二圖(A)、(B)係為習有支架與殼體之結構立體圖。The second figures (A) and (B) are perspective views of the structure of the bracket and the housing.
第二圖(C)係為習有沖壓後殼體形成迸裂之示意圖。The second figure (C) is a schematic view of the formation of a splitting of the shell after stamping.
第三圖係為本發明中金屬基板進行沖壓之結構立體圖。The third figure is a perspective view of the structure in which the metal substrate is stamped in the present invention.
第四圖係為本發明中沖壓成型後之金屬基板結構立體圖。The fourth figure is a perspective view of the metal substrate structure after press forming in the present invention.
第五圖係為本發明中金屬基板進行電鍍之結構立體圖。The fifth drawing is a perspective view of the structure in which the metal substrate is electroplated in the present invention.
第六圖係為本發明中金屬基板進行切片之結構立體圖。The sixth drawing is a perspective view showing the structure of the metal substrate in the present invention.
第七圖係為本發明中金屬基板進行壓出成型之結構立體圖。The seventh drawing is a perspective view of the structure in which the metal substrate is extrusion molded in the present invention.
第八圖係為本發明中壓出成型後之金屬基板及殼體之結構立體圖。The eighth drawing is a perspective view showing the structure of the metal substrate and the casing after extrusion molding in the present invention.
第九圖係為本發明中進行去除廢料之除料頭結構立體圖。The ninth drawing is a perspective view of the structure of the removing head for removing waste in the present invention.
第十圖係為本發明中進行去除廢料之去毛頭結構立體圖。The tenth figure is a perspective view of the deburring structure for removing waste in the present invention.
第十一圖係為本發明中去除廢料後之金屬基板及殼體之結構示意圖。The eleventh figure is a schematic structural view of a metal substrate and a casing after the waste is removed in the present invention.
第十二圖係為本發明中進行切腳之結構立體圖。The twelfth figure is a perspective view showing the structure of the cut foot in the present invention.
第十三圖係為本發明中進行切腳後之金屬基板及殼體之結構示意圖。The thirteenth drawing is a schematic view showing the structure of the metal substrate and the casing after the cutting of the foot in the present invention.
第十四圖係為本發明中進行封裝之結構立體圖。Fig. 14 is a perspective view showing the structure of the package in the present invention.
第十五圖係為本發明中進行封裝後之金屬基板及殼體之結構示意圖。The fifteenth figure is a schematic structural view of a metal substrate and a case after being packaged in the present invention.
第十六圖係為本發明中進行單顆成品下料之結構立體圖。Figure 16 is a perspective view showing the structure of a single finished product in the present invention.
第十七圖係為本發明中完成單顆發光二極體之結構立體圖。Figure 17 is a perspective view showing the structure of a single light-emitting diode in the present invention.
第十八圖係為本發明中進行單顆成品下料之結構剖視圖。Figure 18 is a cross-sectional view showing the structure of a single finished product in the present invention.
第十九圖係為本發明中製造方法第一實施例之流程示意圖。The nineteenth drawing is a schematic flow chart of the first embodiment of the manufacturing method in the present invention.
第二十圖係為本發明中製造方法之概略剖視圖。Fig. 20 is a schematic cross-sectional view showing the manufacturing method of the present invention.
第二十一圖係為本發明中製造方法第二實施例之流程示意圖。The twenty-first embodiment is a schematic flow chart of the second embodiment of the manufacturing method in the present invention.
第二十二圖係為本發明中沖壓成型後之金屬基板另一結構立體圖。The twenty-second figure is another perspective view of the metal substrate after press forming in the present invention.
第二十三圖係為本發明中沖壓成型後之金屬基板另一結構剖視圖。The twenty-third figure is a cross-sectional view showing another structure of the metal substrate after press forming in the present invention.
20．．．金屬基板20. . . Metal substrate
21．．．支架部twenty one. . . Bracket
212．．．第一導接端212. . . First guiding end
213．．．第二導接端213. . . Second guiding end
214．．．第一預插端214. . . First pre-interpolation
215．．．第二預插端215. . . Second pre-interpolation
216．．．凹槽216. . . Groove
22．．．殼體twenty two. . . case
23．．．發光二極體晶片twenty three. . . Light-emitting diode chip
Claims (11)
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| TW101107859A TWI484668B (en) | 2012-03-08 | 2012-03-08 | Manufacturing method of light emitting diodes |
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| TW201616675A (en) * | 2014-10-23 | 2016-05-01 | Edison Opto Corp | LED light core structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200847478A (en) * | 2007-05-30 | 2008-12-01 | I Chiun Precision Ind Co Ltd | Light-emitting diode lead frame and manufacture method thereof |
| TW200905912A (en) * | 2007-07-23 | 2009-02-01 | Chi Mei Lighting Tech Corp | Light emitting diode packaging structure and manufacturing method thereof |
| TW201203629A (en) * | 2010-12-08 | 2012-01-16 | Greenled Technology Co Ltd | Method for manufacturing SMD dual color lead frame of LED |
| TWM423359U (en) * | 2010-10-22 | 2012-02-21 | Panasonic Elec Works Co Ltd | Surface mounting type light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200847478A (en) * | 2007-05-30 | 2008-12-01 | I Chiun Precision Ind Co Ltd | Light-emitting diode lead frame and manufacture method thereof |
| TW200905912A (en) * | 2007-07-23 | 2009-02-01 | Chi Mei Lighting Tech Corp | Light emitting diode packaging structure and manufacturing method thereof |
| TWM423359U (en) * | 2010-10-22 | 2012-02-21 | Panasonic Elec Works Co Ltd | Surface mounting type light emitting device |
| TW201203629A (en) * | 2010-12-08 | 2012-01-16 | Greenled Technology Co Ltd | Method for manufacturing SMD dual color lead frame of LED |
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